JP2023078955A - Polishing pad, substrate polishing device, and manufacturing method of polishing pad - Google Patents

Abstract

To improve detection accuracy of an optical sensor in a substrate polishing device including the optical sensor for detecting a state of a substrate surface.SOLUTION: Proposed is a polishing pad for a substrate polishing device including an optical sensor. The polishing pad includes: a pad body having a surface forming a polishing surface, the pad body being formed with a through hole; and a window member through which sensing light of the optical sensor passes, the window member being accommodated in the through hole. The pad body includes a surrounding recess surrounding an edge portion defining the through hole and recessed with respect to the polishing surface as compared to the edge portion. The surrounding recess communicates with a groove extending in an outer circumferential surface of the polishing pad.SELECTED DRAWING: Figure 4

Description

The present invention relates to a polishing pad, a substrate polishing apparatus, and a method for manufacturing a polishing pad.

Conventionally, chemical mechanical polishing (CMP), for example, has been performed in order to planarize an inorganic insulating film formed on a substrate (see Patent Documents 1 to 3, for example). A polishing apparatus used for such polishing includes a polishing table that holds and rotates a polishing pad, and a substrate holding member that holds a substrate and rotates while pressing a film of the substrate against the polishing pad. This polishing apparatus polishes the film by rotating the polishing table and the substrate holding member in the presence of the slurry.

Conventionally, a film thickness measuring device is known that optically measures data on film thickness during polishing of a film by a polishing device (see, for example, Patent Documents 1 to 3). Specifically, such a film thickness measuring apparatus emits incident light toward a substrate during polishing by a polishing apparatus, and obtains data on the film thickness based on the intensity of reflected light reflected from the substrate. are measuring. This polishing apparatus performs polishing while measuring data relating to the film thickness of the substrate plate surface using a film thickness measuring device, and determines that the polishing end point has been reached when the film thickness reaches a predetermined value. is terminated.

Also, conventionally, a film including a plurality of wiring patterns is known as a film formed on a substrate (see, for example, Patent Document 4). A film made of an organic compound (that is, an organic insulating film) is known as a film including such a wiring pattern. CMP is also performed for planarization of such an organic insulating film (see, for example, Patent Document 5).

Japanese Patent Application Laid-Open No. 2010-23210 Japanese Patent Application Laid-Open No. 2001-235311 JP-A-10-229060 Japanese Patent Application Laid-Open No. 2001-21317 Japanese Patent No. 6606309

However, when the substrate is polished while detecting the state of the substrate surface using the optical sensor as described above, detection by the optical sensor sometimes fails during the polishing process of the substrate. For example, in a polishing apparatus, a substrate is polished by rotating a polishing table and a substrate holding member in the presence of slurry. there was a case. Further, in the case where the polishing pad is provided with a window member for passing the sensing light of the optical sensor, the wear of the polishing pad along with the polishing process changes the distance between the window member and the substrate surface, resulting in an optical In some cases, the detection accuracy of the sensor is degraded.

SUMMARY OF THE INVENTION It is an object of the present invention to improve the detection accuracy of the optical sensor in a substrate polishing apparatus having an optical sensor for detecting the state of the substrate surface.

According to one aspect of the invention, a polishing pad for a substrate polishing apparatus comprising an optical sensor is proposed. Such a polishing pad includes a pad body having a polishing surface, a pad body having a through hole formed therein, and a window member for passing sensing light from the optical sensor, the through hole having a a window member to be accommodated, wherein the pad body has a surrounding recess that surrounds an edge defining the through hole and is recessed from the edge with respect to the polishing surface, and the surrounding recess is , in communication with grooves extending on the outer peripheral surface of the polishing pad.

According to another aspect of the present invention, there is provided a polishing pad, a polishing table for attaching the polishing pad, a polishing head provided to face the polishing table for holding a substrate, and the polishing. A substrate polishing apparatus is proposed that includes an optical sensor provided on a table for measuring the progress of polishing of the substrate. The polishing pad includes a pad body having a polishing surface, and a pad body having through holes formed therein, and a window member for passing sensing light from the optical sensor, wherein the through holes have It has a window member to be accommodated, and a holding member that holds the window member movably in the penetrating direction of the through hole with respect to the pad body. The polishing table has a support surface for supporting the back surface of the pad body, and the support surface is formed with an opening into which the window member can enter.

1 is a configuration diagram schematically showing the main configuration of a polishing apparatus according to Embodiment 1; FIG. 2 is a cross-sectional view near A1 in FIG. 1; FIG. 3 is a cross-sectional view showing a state in which the substrate holding member and the polishing table in FIG. 2 are separated; FIG. It is a figure which shows an example of the polishing pad in this embodiment from the direction of a polishing surface. FIG. 5 is an end view of the A5-A5 area in FIG. 4; FIG. 6 is a view corresponding to FIG. 5 in a polishing pad of a modified example; FIG. 6 is a view corresponding to FIG. 5 in a polishing pad of a modified example; FIG. 6 is a view corresponding to FIG. 5 in a polishing pad of a modified example; FIG. 6 is a view corresponding to FIG. 5 in a polishing pad of a modified example; FIG. 5 is a view corresponding to FIG. 4 showing an example of a polishing pad of a modified example; FIG. 5 is a view corresponding to FIG. 4 showing an example of a polishing pad of a modified example; It is a perspective view showing an example of a pad block of this embodiment. FIG. 4 is a diagram showing an example of a pad block with holes; It is a figure which shows an example of the cutting process of a pad block. It is a figure which shows an example of the attachment process of a window member. It is a figure which shows an example of a pad block and a window block. It is a figure which shows an example of the cutting process of a pad block and a window block. It is the figure which looked at an example of the 1st layer in the pad main body which has two layers from the polishing surface side. FIG. 4 is a diagram of an example of a second layer in a pad body having two layers, viewed from the polishing surface side; FIG. 20 is an end view of the polishing pad with the first layer and the second layer superimposed, taken at area A20-A20 of FIGS. 18 and 19; FIG. 21 is a view corresponding to FIG. 20 showing an example of a polishing pad of a modified example; It is the figure which looked at an example of the 1st layer in the pad main body of the modification which has two layers from the polishing surface side. It is the figure which looked at an example of the 2nd layer in the pad main body of the modification which has two layers from the polishing surface side. FIG. 24 is an end view of the modified polishing pad in which the first layer and the second layer are superimposed, taken along the line A24-A24 of FIGS. 22 and 23; It is a figure for demonstrating the manufacturing method of the polishing pad of a modification, and is a figure for demonstrating an example of the preparation process of a 2nd layer. It is a figure for demonstrating the manufacturing method of the polishing pad of a modification, and is a figure for demonstrating an example of the preparation process of a 2nd layer. It is a figure for demonstrating the manufacturing method of the polishing pad of a modification, and is a figure for demonstrating an example of the preparation process of a 2nd layer. It is a figure for demonstrating the manufacturing method of the polishing pad of a modification, and is a figure for demonstrating an example of the preparation process of a 1st layer. It is a figure for demonstrating the manufacturing method of the polishing pad of a modification, and is a figure for demonstrating an example of the preparation process of a 1st layer. It is a figure for demonstrating the manufacturing method of the polishing pad of a modification, and is a figure which shows an example of the laminated body of a 1st layer and a 2nd layer. It is a figure for demonstrating the manufacturing method of the polishing pad of a modification, and is a figure which shows an example of the polishing pad with which the window member was attached. FIG. 4 is a diagram showing an example of a polishing pad in which a window member is held movably in the penetrating direction of a through hole with respect to the pad body; FIG. 4 is a diagram showing an example of a polishing pad in which a window member is held movably in the penetrating direction of a through hole with respect to the pad body; FIG. 4 is a diagram showing an example of a polishing pad in which a window member is held movably in the penetrating direction of a through hole with respect to the pad body;

A polishing pad, a substrate polishing apparatus (polishing apparatus), and a method for manufacturing a polishing pad according to embodiments of the present invention will be described below with reference to the drawings. The drawings of the present application are schematically illustrated to facilitate understanding of the features of the present embodiment, and the dimensional ratios and the like of each component are not necessarily the same as the actual ones. Also, in the drawings of the present application, XYZ orthogonal coordinates are illustrated for reference. Of these orthogonal coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

FIG. 1 is a configuration diagram schematically showing the main configuration of a polishing apparatus 10 according to this embodiment. A polishing apparatus 10 according to this embodiment is a polishing apparatus capable of performing chemical mechanical polishing (CMP). Specifically, the polishing apparatus 10 exemplified in FIG. and

The polishing table 11 is a polishing table configured to hold the polishing pad 70 and rotate. Specifically, the polishing table 11 according to this embodiment is configured by a disk-shaped member, and a polishing pad 70 is attached to the upper surface of the polishing table 11 . The upper surface (surface) of the polishing pad 70 corresponds to a polishing surface 71 for polishing the film of the substrate. The specific type of the polishing pad 70 is not particularly limited, and various polishing pads such as a hard foam type polishing pad, a non-woven fabric type polishing pad, and a suede type polishing pad can be used. The polishing pad 70 is appropriately set according to the type of film on the substrate to be polished.

A polishing table 11 is connected to a rotating shaft 12 . The rotary shaft 12 is rotationally driven by a drive mechanism (for example, a motor or the like). A joint 12a is provided at the end of the rotating shaft 12 opposite to the polishing table 11 side. This joint 12a has a rotary joint and a rotary connector. A polishing controller 20 controls the rotation of the polishing table 11 .

The substrate holding member 13 is arranged on the polishing surface 71 of the polishing table 11 during polishing. A substrate (not shown in FIG. 1) is attached to the lower surface of the substrate holding member 13 . The substrate holding member 13 is configured to hold the substrate and rotate while pressing the film of the substrate against the polishing surface 71 of the polishing pad 70 . In addition, this substrate holding member 13 is generally called a "top ring", a "polishing head", or the like in some cases.

The slurry supply nozzle 14 is a nozzle that supplies slurry (specifically, polishing slurry) to the polishing surface 71 . The slurry is, for example, a solution containing abrasive grains such as silicon oxide, aluminum oxide, and cerium oxide. The specific type of this slurry is not particularly limited, and may be appropriately set according to the type of film on the substrate. The slurry may be supplied from the lower portion of the polishing surface 71 instead of the upper portion, or may be supplied from both the upper portion and the lower portion of the polishing surface 71 . For example, when slurry is supplied from the bottom, a channel (not shown) extending vertically from a portion near the center of rotation at the bottom of the polishing table 11 and an opening in the polishing pad 70 (polishing surface 71) communicating with the channel (not shown) are provided. (not shown) to supply the slurry.

The polishing control device 20 is a control device that controls the operation of the polishing device 10 . Specifically, the polishing control device 20 according to this embodiment includes a computer. This computer includes a CPU (Central Processing Unit) 20a as a processor, a storage device 20b, and the like. The storage device 20b is configured by storage media such as ROM (Read Only Memory) and RAM (Random Access Memory). In the polishing control device 20, the CPU 20a as a processor controls the rotation of the polishing table 11, the slurry supply operation from the slurry supply nozzle 14, etc. based on the program stored in the storage device 20b. It controls the operation of the polishing apparatus 10 .

The film thickness measuring device 30 is an optical film thickness measuring device having an optical sensor for optically measuring data relating to the thickness (film thickness) of the film of the substrate. Further, the film thickness measurement device 30 according to the present embodiment measures data regarding film thickness during polishing by the polishing device 10 .

Specifically, the film thickness measurement apparatus 30 according to this embodiment includes a sensor module 40 , a light source/spectroscopic module 50 , and a data processing system 60 . The light source/spectroscopic module 50 , the data processing system 60 , and the polishing control device 20 are electrically connected via wiring 15 . In this embodiment, the sensor module 40 and the light source/spectroscopic module 50 are arranged on the polishing table 11 . The sensor module 40 and the light source/spectroscopic module 50 rotate together with the polishing table 11 when the polishing table 11 rotates.

FIG. 2 is a cross-sectional view around A1 in FIG. FIG. 3 is a sectional view showing a state in which the substrate holding member 13 and the polishing table 11 of FIG. 2 are separated. As shown in FIGS. 2 and 3, part of the polishing pad 70 according to the present embodiment has a window member 72 through which the incident light L1 and the reflected light L2 (sensing light) from the film thickness measuring device 30 can pass. are placed. In the present embodiment, the window member 72 is made of a light transmissive material, specifically a transparent material (for example, transparent plastic or transparent glass). The window member 72 is positioned so that at least a portion of the film 202 of the substrate 200 passes over the window member 72 when the polishing table 11 rotates and the polishing pad 70 rotates. position) is set.

The window member 72 may be provided with a scattering suppression layer 72f (see FIG. 3) for suppressing scattering of sensing light. The scattering suppression layer 72f is preferably provided on the lower surface of the window member 72. As shown in FIG. However, instead of or in addition to this, a scattering suppression layer may be provided on the upper surface of the window member 72 (the surface on the substrate 200 side). Here, the optical thickness of the anti-scattering layer is preferably smaller than the wavelength of light incident on the anti-scattering layer (the wavelength of sensing light from the film thickness measuring device 30). It is preferably one-fold. Moreover, the refractive index of the scattering suppression layer is preferably smaller than the refractive index of the substance (film 202, jig 42, window member 72) adjacent to the scattering suppression layer. When provided on the lower surface of the window member 72 , the refractive index of the scattering suppression layer is preferably, for example, the half power (square root) of (refractive index of air×refractive index of window member). Further, when provided on the upper surface of the window member 72, the refractive index of the scattering suppression layer is preferably, for example, (the refractive index of the window member×the refractive index of the slurry) to the 1/2 power. The scattering suppression layer may be provided on the window member 72 by a known method, and for example, roll coating, gravure coating, spin coating, spraying, vacuum deposition, sputtering, or CVD is employed to form a film. can be

Moreover, as shown in FIGS. 2 and 3, the sensor module 40 of the film thickness measuring device 30 includes a sensor head 41 and a tubular jig 42 . A jig 42 is a jig for attaching the sensor head 41 to the polishing table 11 . The jig 42 is connected to the polishing table 11 so that the incident light L1 and the reflected light L2 pass through the interior of the jig 42 . Specifically, as an example, the jig 42 according to the present embodiment is fitted in a cylindrical hole provided in the polishing table 11 . Further, the upper end surface of the jig 42 according to this embodiment is connected to the lower surface of the glass plate 46 arranged on the lower surface of the light transmitting member 72 . The incident light L1 and the reflected light L2 pass through the inside of the jig 42 (inside the cylinder).

Specifically, the glass plate 46 according to the present embodiment is configured by a plate member made of glass that transmits light, and is connected to the lower surface of the light transmitting member 72 . The upper end surface of the jig 42 according to this embodiment (the open upper end surface of the tubular jig 42 ) is connected to the lower surface of the glass plate 46 . The glass plate 46 effectively prevents foreign matter such as slurry from entering the inside of the jig 42 (inside the cylinder). It is preferable that the jig 42 is in close contact with the lower surface of the glass plate 46 so that no gap is formed between the jig 42 and the glass plate 46 . However, the invention is not limited to such an example, and a gap may be provided between the jig 42 and the glass plate 46 . Moreover, the sensor module 40 is not limited to having the glass plate 46 and may not have the glass plate 46 .

The sensor head 41 is configured to project the incident light L1 toward the film 202 while the film 202 is being polished by the polishing apparatus 10 . Incident light L1 from the sensor head 41 passes through the window member 72 of the polishing pad 70 and then enters the film 202 . The type of light source in the sensor head 41 is not particularly limited, and a halogen lamp, a laser light emitting device, or the like can be used. In this embodiment, a laser light emitting device is used as an example of the light source. Further, in this embodiment, the light emitted by the light source has a wavelength in the infrared region (specifically, a wavelength longer than 780 nm). That is, the incident light L1 according to this embodiment is laser light having a wavelength in the infrared region.

Reflected light L2 reflected from the film 202 is received by the sensor head 41 after passing through the window member 72 . The sensor head 41 converts the received reflected light L2 into a digital signal and transmits the digital signal to the data processing system 60 (FIG. 1) via the wiring 15 . The data processing system 60 is a system that measures data regarding the film thickness of the film 202 based on the intensity of the reflected light L2 received by the sensor head 41 . Specifically, the intensity of the reflected light L2 received by the sensor head 41 has a correlation with the film thickness. Therefore, the data processing system 60 measures data regarding the film thickness of the film 202 based on the intensity of the received reflected light L2. As a specific example, the reflected light L2 received by the sensor head 41 is spectroscopically separated by the light source/spectroscopy module 50, and the resulting spectral wave is frequency-analyzed to measure film pressure data. In the present embodiment, the "data relating to the film thickness" may be data having a correlation with the film thickness (μm). (for example, the amount of change in film thickness, etc.) may be used.

Specifically, as shown in FIG. 1, a data processing system 60 according to this embodiment includes a first data processing device 61 and a second data processing device 62 .

The first data processing device 61 has a computer, and this computer has a CPU 61a as a processor, a storage device 61b, and the like. The storage device 61b is composed of storage media such as ROM and RAM. The first data processing device 61 executes data processing for indexing the reflection intensity based on the data transmitted from the light source/spectroscopic module 50 by the CPU 61a operating based on the program stored in the storage device 61b. do.

The data processed by the first data processing device 61 is transmitted to the second data processing device 62 . The second data processing device 62 has a computer, and this computer has a CPU 62a as a processor, a storage device 62b, and the like. The storage device 62b is composed of storage media such as ROM and RAM. The second data processing device 62 executes noise removal processing of the time waveform of the indexed data by the operation of the CPU 62a based on the program stored in the storage device 62b, and the noise removal processing is executed. After that, the waveform is analyzed to detect reflection intensity and feature points (feature points such as maximum and minimum values of differential values and threshold values). This detected value (detected value) has a correlation with the film thickness. Therefore, the second data processing unit 62 calculates and acquires data regarding the film thickness based on this detected value. As described above, the data processing system 60 according to the present embodiment measures data on film thickness.

Further, the second data processing device 62 according to the present embodiment determines whether the film thickness has reached a preset polishing end point (that is, the polishing end point of polishing) based on the data measured as described above. ). When determining that the film thickness has reached the polishing end point, the second data processing device 62 transmits a signal (polishing end point signal) to the effect that the polishing end point has been reached to the polishing control device 20 . Upon receiving this polishing end point signal, the polishing control device 20 stops the driving mechanism (for example, the motor) of the polishing device 10 to end the polishing by the polishing device 10 .

The data processing algorithm by the data processing system 60 described above (that is, the data processing algorithm for measuring the data related to the film thickness based on the intensity of the reflected light) is disclosed in the above-mentioned Patent Document 1 and Patent Document 2. It is the same as a data processing device used in a known film thickness measuring device such as the one described above, and these techniques can be applied. Therefore, a more detailed description of this data processing is omitted.

2 and 3 described above show an example of the mounting manner of the sensor head 41 to the polishing table 11, and the mounting manner of the sensor head 41 to the polishing table 11 is illustrated in FIGS. It is not limited to the mode.

The polishing apparatus 10 as described above polishes the film of the substrate held by the substrate holding member 13 to a desired flat surface by rotating the polishing table 11 and the substrate holding member 13 in the presence of slurry. During polishing, the film thickness of the film 202 on the substrate 200 can be measured by the film thickness measuring device 30, and the polishing device 10 determines the time when the film thickness of the substrate reaches a preset value as the polishing end point ( That is, it is referred to as "polishing end point"). The specific value of the polishing end point is not particularly limited. For example, the polishing end point may be a value equal to or less than the film thickness at which a wiring pattern (not shown) buried in the film is exposed on the surface of the film before polishing. Alternatively, a value larger than the film thickness at which the wiring pattern is exposed on the surface of the film (that is, a value within a range in which the wiring pattern is not exposed on the surface of the film) may be set as the polishing end point.

Next, the polishing pad in this embodiment will be described in detail. FIG. 4 is a view showing an example of the polishing pad in this embodiment from the direction of the polishing surface, and FIG. 5 is an end view of the A5-A5 area in FIG. As shown in FIGS. 4 and 5, the polishing pad 70 of the present embodiment includes a pad body 702 having a polishing surface 71, a window member 72 for transmitting sensing light from the film thickness measuring device 30, and an adhesive layer 74 attached to the back surface of the pad body 702 . In the example shown in FIG. 5 , the adhesive layer 74 functions as a holding mechanism for holding the polishing pad 70 on the polishing table 11 . As the adhesive layer 74, a double-sided tape or an adhesive (for example, a hot melt adhesive or a UV curable adhesive) can be used. As the double-sided tape, for example, an airtight PET (polyethylene terephthalate) film-like base material coated with an adhesive on both sides is preferable.

A through hole 708 for accommodating the window member 72 is formed in the pad body 702 . The through-hole 708 preferably has a shape corresponding to the window member 72 when viewed from the polished surface 71 , and has the same size as the window member 72 or a slightly larger size so that there is a gap between the through hole 708 and the window member 72 . is preferred. Also, the through hole 708 preferably has a depth smaller than the height of the window member 72 or the same depth as the height of the window member 72 . In other words, it is preferable that the pad body 702 and the window member 72 have the same height, or the height of the window member 72 is slightly larger than the height of the pad body 702 . By making the height of the window member 72 slightly larger than the height of the pad main body 702, it is possible to prevent the window member 72 from recessing from the surface of the pad main body 702 due to manufacturing variations or the like. Thereby, it is possible to suppress the slurry from remaining on the surface of the window member 72 .

The window member 72 may be formed, for example, by filling the through hole 708 of the pad body 702 with a fluid material. Alternatively, the window member 72 may be attached to the pad body 702 with an adhesive layer. In the example shown in FIG. 5 , the window member 72 is attached to the pad body 702 by an adhesive layer 74 that is applied to the back surface of the pad body 702 and holds the polishing pad 70 to the polishing table 11 . In the example shown in FIG. 5, an adhesive layer 74 is applied over the entire back surface of the window member 72 (the surface opposite to the polished surface 71 side). However, it is not limited to such an example, and as shown in the modified example of FIG. An opening may be formed in the adhesive layer 74 . In this case, as shown in FIG. 6, the window member 72 may be attached to the pad main body 702 by attaching an adhesive layer 74 to the edge of the window member 72 on the outer peripheral side of the translucent region.

Further, the window member 72 is attached to the pad body 702 by the adhesive layer 74 attached to the back surface of the pad body 702. It may be attached to the pad body 702 by an adhesive layer 76 interposed between the pad body 702 and the through holes 708 . In the example shown in FIG. 7, illustration of the adhesive layer 74 attached to the back surface of the pad body 702 is omitted.

The window member 72 is formed so as to contact the wall surface (edge portion 706) defining the through hole 708 of the pad body 702, that is, so that a gap is not formed between the pad body 702 and the window member 72. may be accommodated in Also, as described above, the through-hole 708 may have a size larger than the window member 72 so as to have a gap (for example, several millimeters) with the window member 72 . FIG. 8 is a diagram showing an example of a modified polishing pad. As shown in FIG. 8, the permissible range of dimensional tolerance of the window member 72 is increased by making the through hole 708 larger than the window member 72 so that a gap 712 is formed between the through hole 708 and the window member 72 . You can make it bigger. Also, the window member 72 can be easily accommodated in the through hole 708 and attached to the pad body 702 . Thereby, even after the pad main body 702 is attached to the polishing table 11 , the window member 72 can be easily attached in the through hole 708 . In the example shown in FIG. 8, the adhesive layer 74 is applied over the entire rear surface of the window member 72. However, as in the example shown in FIG. Additionally, an opening may be formed in the adhesive layer 74 .

Further, in the examples shown in FIGS. 4 to 8, the window member 72 has a cylindrical shape. However, the window member 72 is not limited to such an example, and may have a polygonal shape, an elliptical shape, or the like when viewed from the direction perpendicular to the polishing surface 71 . Also, the window member 72 may have an attachment edge 72a for attachment to the pad body 702, as shown in the modified example of FIG. The attachment edge portion 72 a is an edge portion that protrudes from the outer periphery of the window member 72 , and may be provided over the entire outer periphery of the window member 72 or only part of the outer periphery of the window member 72 . The through hole 708 of the pad body 702 is preferably formed to have a stepped portion on which the mounting edge portion 72a is placed. Further, as an example, an adhesive layer 78 may be provided between the lower surface of the attachment edge portion 72 a and the stepped portion of the through hole 708 .

Referring again to FIGS. 4 and 5, pad body 702 is formed with a surrounding recess 704 surrounding edge 706 defining through hole 708 . Surrounding recess 704 is recessed from polishing surface 71 relative to edge 706 . In the example shown in FIGS. 4 and 5, the edge 706 has the same height as the polishing surface 71, and the surrounding recess 704 is a recess with a height lower than that of the polishing surface 71. As shown in FIG. Also, the surrounding recess 704 communicates with a groove 710 extending on the outer peripheral surface of the polishing pad 70 . In the example shown in FIGS. 4 and 5, two grooves 710 communicate with the surrounding recess 704 . These two grooves 710 are grooves that are open to the polishing surface 71 and extend so as to connect the surrounding recess 704 and the outer periphery of the pad body 702 . In addition, the surrounding recess 704 or the groove 710 can have a width of several millimeters or several tens of millimeters, for example. Also, the surrounding recess 704 or the groove 710 can have a depth of several millimeters or several tens of millimeters, for example. 4 and 5, the surrounding recess 704 and the groove 710 have the same width and depth. However, not limited to such an example, for example, groove 710 may have a greater depth than surrounding recess 704 . It should be noted that the groove 710 is not limited to the example shown in FIG.

According to such a polishing pad 70, the polishing slurry supplied to the polishing surface 71 during polishing is discharged from the surrounding recess 704 through the grooves 710, thereby suppressing the slurry from going to the surface of the window member 72. be able to. As a result, it is possible to prevent the sensing light from the film thickness measuring device 30 from being blocked by the polishing slurry adhering to the surface of the window member 72 and lowering the measurement accuracy of the film thickness measuring device 30 . Therefore, it is possible to improve the detection accuracy of the film thickness of the substrate 200 by the film thickness measuring device 30 having the optical sensor.

As shown in FIG. 8, when there is a gap between the through-hole 708 and the window member 72, the polishing slurry flows into the gap between the through-hole 708 and the window member 72, so that the surface of the window member 72 is It is possible to suppress the slurry from going to. Therefore, if there is a gap between the through hole 708 and the window member 72, the polishing pad 70 may not have the surrounding recess 704 and the groove 710 described above.

FIG. 10 is a diagram corresponding to FIG. 4 showing an example of a polishing pad of a modification. The polishing pad 70 shown in FIG. 4 has two grooves 710 . On the other hand, the polishing pad 70A (pad main body 702A) shown in FIG. Grid-shaped grooves 710A extend to the outer peripheral surface of polishing pad 70A. Further, the pad main body 702A is formed with a through hole 708 for accommodating the window member 72 in the same manner as the polishing pad 70 described above, and is surrounded by an edge portion 706A defining the through hole 708. A recess 704A is formed. The groove 710A and the surrounding recess 704A are in communication. The grid-shaped grooves 710A and the surrounding recesses 704A may have the same depth, or the grid-shaped grooves 710A may have a greater or lesser depth than the surrounding recesses 704A. Also in the polishing pad 70A of this modification, the surrounding recess 704A communicates with the grid-like grooves 710A extending on the outer peripheral surface of the polishing pad 70A, and the same effect as the polishing pad 70 described above can be achieved.

FIG. 11 is a view corresponding to FIG. 4 showing an example of a polishing pad of a modification. A plurality of radial grooves 710B extending from the center of the polishing surface 71 toward the outer periphery are formed in the polishing pad 70B (pad main body 702B) shown in FIG. Further, the pad main body 702B is formed with a through hole 708 for accommodating the window member 72 in the same manner as the polishing pads 70 and 70A described above. is formed with a surrounding recess 704B. The groove 710B and the surrounding recess 704B are in communication. The radial grooves 710B and the surrounding recesses 704B may have the same depth, or the radial grooves 710B may have a greater or lesser depth than the surrounding recesses 704B. Also in the polishing pad 70B of this modification, the surrounding recess 704B communicates with the grid-like grooves 710B extending on the outer peripheral surface of the polishing pad 70B, and the same effects as those of the polishing pads 70 and 70A can be obtained. can. In the example shown in FIG. 11, radial grooves 710B extending linearly from the center of the polishing surface 71 toward the outer periphery are formed. or a plurality of concentric circular grooves having different radii with respect to the center of rotation of the polishing surface 71 (or a certain position in the vicinity thereof), or the grooves are formed with each other. may be appropriately combined so as to communicate with each other.

Next, an example of a manufacturing method for manufacturing the polishing pad described above will be described. The method for manufacturing the polishing pad described below can be applied to any of the polishing pads described above unless there is a particular contradiction. Hereinafter, a method for manufacturing the polishing pad 70 will be described as a representative. In order to manufacture the polishing pad 70, first, the pad body 702 is prepared. The pad body 702 is formed, for example, from the pad block 130 as the material of the plurality of pad bodies 702 . FIG. 12 is a perspective view showing an example of the pad block 130 of this embodiment. The pad block 130 has a generally columnar shape and is cut into a plurality of pad bodies 702 . In other words, the pad block 130 corresponds to a stack of a plurality of pad bodies 702 .

Subsequently, holes 138 are formed in the pad block 130 to define the through holes 708 of the polishing pad 70 . FIG. 13 shows an example of a pad block 130 having holes 138 formed therein. As shown in FIG. 13, a hole 138 is formed in the direction perpendicular to the surface 131 forming the polishing surface 71 of the pad body 702 in the pad block 130 (vertical direction in FIGS. 12 and 13). Holes 138 may be formed by known methods.

14A and 14B are views showing an example of a pad block cutting process, and FIGS. 15A and 15B are views showing an example of a window member mounting process. As shown in FIG. 14, by cutting the pad block 130, the pads 140 that form the base of the pad body 702 are formed. Holes 138 formed in pad block 130 define through holes 708 for receiving window members 72 in cut pads 140 . Then, as shown in FIG. 15, the polishing pad 70 is manufactured by attaching the window member 72 to the pad 140 and forming the surrounding recess 704 and the groove 710 in the pad 140 (not shown in FIG. 15). Note that the surrounding recess 704 and the groove 710 may be formed in the pad block 130 before cutting the pad block 130, or the window member 72 may be formed.
may be formed in the pad 140 before attaching the window member 72 or may be formed in the pad 140 after the window member 72 is attached. Further, in the example shown in FIGS. 13 to 15, the hole 138 is formed in the pad block 130, but the present invention is not limited to such an example, and the through hole 708 is formed in the pad 140 separated from the pad block 130. may be formed.

As described above, the window member 72 may be a pre-formed window member 72 attached to the through holes 708 of the pad 140, or may be constructed by filling the through holes 708 with a fluid material. may When the through-hole 708 is filled with a fluid material, a mold whose surface roughness is controlled may be used. In this way, the manufacturing roughness of the window member 72 to be manufactured can be controlled, and the detection accuracy of the film thickness measuring device 30 in the polishing apparatus can be improved. Further, the window member 72 may be subjected to surface roughness improvement treatment before or after being attached to the through hole 708 of the pad 140 . As an example, the window member 72 may be subjected to surface roughness improvement treatment by cutting or polishing the surface. In particular, it is preferable that the window member 72 has a lower surface (a surface farther from the substrate 200) processed to have a predetermined surface roughness or less. This is based on the fact that the lower surface of the window member 72 is unlikely to be worn or damaged by the polishing process by the polishing apparatus 10 and the dressing of the polishing pad 70 . The lower surface of the window member 72 is preferably subjected to a surface roughness improvement treatment so as to have a PV (maximum valley depth: JIS B 0601) of 0.5 μm or less, for example. It is more preferable that surface roughness improvement treatment is applied so as to have the following PV.

14 and 15, the window member 72 is attached to the pad 140 separated from the pad block 130. As shown in FIG. However, the invention is not limited to such an example, and as an example, a window block 132 constituting a plurality of window members 72 is arranged in a hole 138 of the pad block 130, and the pad block 130 and the window block 132 are cut to form a pad 140. and a window member 72 may be formed. FIG. 16 is a diagram showing an example of a pad block and a window block, and FIG. 17 is a diagram showing an example of a cutting process of the pad block and the window block. Even in such a case, the window block 132 may be a pre-formed window block 132 attached to the hole 138 of the pad block 130 or constructed by filling the hole 138 with a fluid material. good too.

In addition, in the example shown in FIGS. 12 to 17, the pad block 130 constituting the plurality of pad bodies 702 is prepared, but the present invention is not limited to such an example. As an example, the pad 140 constituting one pad body 702 is molded, and the pad 140 is formed with the through hole 708, the surrounding recess 704, and the groove 710, and the window member 72 is provided in the through hole 708. Thus, the polishing pad 70 may be manufactured. As another example, the pad 140 having at least one of the through hole 708, the surrounding recess 704, and the groove 710 formed in advance may be molded, and the polishing pad 70 may be manufactured using the pad 140.

In the polishing pad 70 and the like described above, the pad body 702 is formed of a single layer. However, it is not limited to such an example, and the pad body 702 of the polishing pad 70 may be formed of multiple layers. As an example, the pad body 702 of the polishing pad 70 described above includes a pad layer in which through holes are formed that define the side surfaces of the surrounding recess 704 and the groove 710, and a pad layer that defines the bottom surface of the surrounding recess 704 and the groove 710. and may be laminated. Further, when the pad body 702 is composed of a plurality of layers, the pad body 702 may be composed of a plurality of layers formed of the same material, or may be composed of a plurality of layers of different materials. The pad body 702 may be configured by stacking.

FIG. 18 is a view of an example of a first layer in a pad body having two layers viewed from the polishing surface side, and FIG. 19 is a view of an example of a second layer in a pad body having two layers viewed from the polishing surface side. It is a view. Also, FIG. 20 is an end view of the polishing pad in which the first layer and the second layer are superimposed, taken along the line A20-A20 of FIGS. 18 and 19. FIG. The polishing pad 170 shown in FIGS. 18-20 has a first layer (first pad layer) 171 and a second layer (second pad layer) 172 . The first layer 171 constitutes a polishing surface 173 whose surface contacts the substrate 200 . The second layer 172 is laminated on the back surface of the first layer 171 (the surface opposite to the polished surface 173). Although the polishing pad 170 has two layers, the first layer 171 and the second layer 172, the present invention is not limited to this example, and as an example, at least one of the first layer 171 and the second layer 172 may be composed of multiple layers.

In the example shown in FIGS. 18-20, the second layer 172 of the polishing pad 170 is formed with a through hole 1728 in which a portion of the window member 72 is accommodated. A through hole 1718 is formed in the first layer 171 of the polishing pad 170 to accommodate a portion of the window member 72 . Here, the through-hole 1718 of the first layer 171 preferably has a dimension larger than that of the through-hole 1728 of the second layer 172 . Also, the through-hole 1718 of the first layer 171 preferably has the same size as the surrounding recessed portion 1724 of the second layer 172 described later, or has a larger size than the surrounding recessed portion 1724 .

Further, grooves 1710 are formed in the polishing surface 173 of the first layer 171 . The grooves 1710 are mainly provided so that the polishing slurry is evenly supplied to the polishing surface 173 . Note that in the example shown in FIG. 18, the grooves 1710 are provided in a grid pattern over the entire polishing surface 173 . However, the first layer 171 is not limited to such an example, and the first layer 171 may be provided with, for example, radial grooves as shown in FIG. or a plurality of concentric circular grooves having different radii with respect to the center of rotation of the polishing surface 173 (or a certain position in the vicinity thereof), or the grooves are formed with each other. may be appropriately combined so as to communicate with each other, or such grooves may not be formed.

A surrounding recess 1724 is formed in the second layer 172 to surround an edge 1726 defining a through hole 1728 . Surrounding recess 1724 is recessed relative to polishing surface 173 relative to edge 1726 . In the example shown in FIGS. 18 to 20, the edge portion 1726 has the same height as the surface of the second layer 172 that contacts the back surface of the first layer 171, and the surrounding recess 1724 has the same height as the back surface of the first layer 171. The height of the concave portion is lower than that of the concave portion. A groove 1729 is formed in the second layer 172 to communicate with the surrounding recess 1724 and extend to the outer peripheral surface of the polishing pad 170 . In addition, in the example shown in FIG. 19 , two grooves 1729 communicate with the surrounding recess 1724 . However, the groove 1729 is not limited to the example shown in FIG. 19 as long as the groove 1729 communicates between the surrounding recess 1724 and the outer peripheral surface of the polishing pad 170 . Further, in the example shown in FIGS. 18 to 20, no through holes are formed in the first layer 171 at the positions of the grooves 1729 in the second layer 172 . Therefore, in the polishing pad 170 in which the first layer 171 and the second layer 172 are laminated, the grooves 1729 of the second layer 172 are covered with the first layer 171 .

As shown in FIG. 20 , in the polishing pad 170 , as an example, the through hole 1718 of the first layer 171 is sized larger than the surrounding recess 1724 of the second layer 172 . Also, the through hole 1728 of the second layer 172 is formed to have a dimension larger than that of the window member 72 so that a gap is formed between the through hole 1728 and the window member 72 . However, the through hole 1728 of the second layer 172 may have the same dimensions as the window member 72 when viewed from the direction perpendicular to the polishing surface 173 . Moreover, in the example shown in FIG. 20, as an example, the window member 72 has substantially the same height as the combined height of the first layer 171 and the second layer 172 . However, the window member 72 may have a height slightly greater than the combined height of the first layer 171 and the second layer 172 . 18 to 20, an adhesive layer 174 for bonding the first layer 171 and the second layer 172 is formed on the back surface of the first layer 171. In the example shown in FIGS.

In such a polishing pad 170 as well, the polishing slurry supplied to the polishing surface 173 during polishing is discharged from the surrounding recesses 1724 of the second layer 172 through the grooves 1729, so that the slurry is directed to the surface of the window member 72. can be suppressed. As a result, it is possible to prevent the sensing light from the film thickness measuring device 30 from being blocked by the polishing slurry adhering to the surface of the window member 72 and lowering the measurement accuracy of the film thickness measuring device 30 . Therefore, it is possible to improve the detection accuracy of the film thickness of the substrate 200 by the film thickness measuring device 30 having the optical sensor.

In the example shown in FIG. 20, an adhesive layer 174 for bonding the first layer 171 and the second layer 172 together is provided on the back surface of the first layer 171 . However, without being limited to such an example, the adhesive layer 174 may be provided on the upper surface of the second layer 172 . FIG. 21 is a diagram corresponding to FIG. 20 showing an example of a polishing pad 170A of a modified example. When the adhesive layer 174 is formed on the top surface of the second layer 172 as shown in FIG. The window member 72 and the second layer 172 may be fixed using the adhesive layer 174 on the upper surface of the edge portion 1726 . As an example, the window member 72 may have a mounting edge 72 a and the window member 72 may be secured to the second layer 172 by resting the mounting edge 72 a on top of the edge 1726 .

FIG. 22 is a diagram of an example of the first layer in a modification of the pad body having two layers, viewed from the polishing surface side, and FIG. 23 is a diagram of the second layer in the modification of the pad body having two layers. It is the figure which looked at an example from the polishing surface side. FIG. 24 is an end view of the modified polishing pad in which the first layer and the second layer are superimposed, taken along the line A24-A24 of FIGS. 22 and 23. FIG. A polishing pad 170A shown in FIGS. 22-24 has a first layer 171A and a second layer 172. As shown in FIG. The surface of the first layer 171A constitutes a polished surface 173A. The second layer 172 is laminated on the back surface of the first layer 171 (the surface opposite to the polished surface 173) via an adhesive layer 174A. The second layer 172 is the same as the second layer 172 shown in FIG.

The first layer 171A shown in FIG. 22 is substantially the same as the first layer 171 shown in FIG. 18, and the same components as those of the first layer 171 shown in FIG. omitted. As shown in FIGS. 22 and 24 , the first layer 171</b>A of the modified example is provided with an edge portion 1716 corresponding to the edge portion 1726 of the second layer 172 . The edge 1716 of the first layer 171A is separated from the through hole 1718 of the first layer 171A.

Also in the polishing pad 170A of such a modified example, the same effect as the polishing pad 170 described above can be obtained.

Next, an example of a manufacturing method for manufacturing a polishing pad having two layers will be described. As a representative example, the manufacturing method of the polishing pad 170A (see FIGS. 22 to 24) will be described below. First, the process of preparing the second layer 172 for manufacturing the polishing pad 170A will be described. 25 to 27 are diagrams for explaining an example of the preparation process of the second layer. First, as shown in FIG. 25, a pad 182 as a material for the second layer 172 is prepared. As an example, the pads 182 may be prepared by cutting a pad block, such as the pad block 130 described above, that constitutes a plurality of second layers 172, or the pads 182 that constitute a single second layer 172 may be prepared. may be prepared by molding.

As shown in FIG. 26, an adhesive layer 174A is provided on the upper surface of the prepared pad 182 (the surface that contacts the first layer 171A). As the adhesive layer 174A, for example, a double-sided tape or an adhesive (eg, hot melt adhesive, UV curing adhesive) can be used. 27, a surrounding recess 1724 is formed on the upper surface of the pad 182.
The second layer 172 is prepared by forming the grooves 1729 . Note that the surrounding recess 1724 and the groove 1729 may be formed by a known processing method. Also, before providing the adhesive layer 174A on the pad 182, the surface of the pad 182 may be masked where the surrounding recess 1724 and the groove 1729 are to be formed. Alternatively, the adhesive layer 174A may be marked or notched where the surrounding recesses 1724 and grooves 1729 are to be formed. This facilitates formation of the surrounding recess 1724 and the groove 1729 in the pad 182 .

Next, a process of preparing the first layer 171A for manufacturing the polishing pad 170A will be described. 28 and 29 are diagrams for explaining an example of the preparation process of the first layer. For convenience of explanation, the preparation process of the first layer 171A will be described after the preparation process of the second layer 172, but the second layer 172 may be prepared after the first layer 171A is prepared, At least part of the preparation process of the layer 171A and the preparation process of the second layer 172 may be performed in parallel. As shown in FIG. 28, a pad 181 is prepared as a material for the first layer 171A. The pad 181 may be prepared by cutting a pad block, similarly to the pad 182 as the material of the second layer 172, or may be prepared by molding one pad. Then, as shown in FIG. 29, a first layer 171A is prepared by forming a cut 181a in the pad 181 to define a through hole 1718 and an edge 1716. As shown in FIG. In the example shown in FIG. 29, the pad 181 is physically divided into a plurality of parts by the formed cuts 181a, but the parts where the cuts 181a are formed are not removed and left as they are.

FIG. 30 shows an example of a laminate of the second layer shown in FIG. 27 and the first layer shown in FIG. As shown in FIG. 30, the prepared first layer 171A and second layer 172 are laminated and adhered by an adhesive layer 174A. In the example shown in FIG. 30, a through hole 1718 is formed in the first layer 171A by removing the portion separated by the cut 181a that defines the through hole 1718 and the edge 1716 in this state. Thereby, the edge 1716 provided inside the through-hole 1718 of the first layer 171A and the edge 1726 of the second layer 172 can be easily aligned.

Then, as shown in FIG. 31, a through-hole 1728 is formed in the laminate of the first layer 171A and the second layer 172, and a window member 72 is attached to the formed through-hole 1728, thereby having two layers. A polishing pad 170A is manufactured. The through hole 1728 is a hole penetrating the first layer 171A and the second layer 172, and may be formed by a known processing method. In this way, after laminating the first layer 171A and the second layer 172, the through-hole 1728 that penetrates the first layer 171A and the second layer 172 is formed. can be easily formed. Note that the attachment of the window member 72 to the through-hole 1728 may be performed by attaching a previously formed window member 72 to the through-hole 1728 in the same manner as described in the manufacturing method of the single-layer polishing pad 70 . , the through-hole 1728 may be filled with a fluid material. If the window member 72 has the mounting edge 72a, the pad 140 may be provided with a step corresponding to the mounting edge 72a.

In the polishing pad having the two layers described above, the first layer (171, etc.) that is the upper layer including the polishing layer having the polishing surface 173 and the second layer (172, etc.) that is the lower layer including the support layer are made of the same material. but can be different. In order to achieve polishing with higher flatness, the first layer may be set harder than the second layer depending on the material of the substrate 200 and the quality of the film to be polished.

In the polishing pads of the embodiment and modification described above, the window member 72 is fixed to the pad body 702 by the adhesive layer so as to be substantially immovable. However, the window member 72 may be held movably with respect to the pad body 702 without being limited to such an example. As an example, the window member 72 may be configured to be movable in the penetrating direction of the through hole 708 with respect to the pad body 702 .

32 to 34 are diagrams showing an example of a polishing pad in which a window member is held movably in the penetrating direction of the through hole with respect to the pad body. 32 to 34 show the polishing pad 70C placed on the polishing table 11. FIG. In the polishing pad 70C, the adhesive layer 74C adhered to the pad main body 702 and the window member 72 has flexibility, and the window member 72 is attached to the pad main body 702 in the penetrating direction of the through hole 708 (vertical direction in the drawing). It is assumed to be the same as the polishing pad 70 described above, except that it can be moved to. However, polishing pad 70C is not limited to having the same shape as polishing pad 70, and may not have surrounding recess 704 or groove 710, or other grooves may be formed in polishing surface 71. . In addition, in the example shown in FIGS. 32 to 34, the adhesive layer 74C is provided on the back surface of the polishing pad 70C (the surface opposite to the polishing surface 71). It may be provided so as to be interposed between the member 72 and the through hole 708 of the pad body 702 . The adhesive layer 74C corresponds to an example of a holding member for movably holding the window member 72 on the pad body 702. As shown in FIG. However, the polishing pad 70C may include another holding member that movably holds the window member 72 with respect to the pad body 702 instead of or in addition to the adhesive layer 74C. As the adhesive layer 74C, for example, a double-sided tape in which an adhesive is applied to both sides of an airtight PET (polyethylene terephthalate) film base material can be used, but the adhesive layer 74C is not limited to such an example.

In this embodiment, the polishing table 11 is formed with an opening 11a into which the window member 72 can enter. That is, the polishing table 11 has a support surface 11b for supporting the back surface (lower surface) of the pad body 702, and the opening 11a is formed in the support surface 11b. Here, the opening 11a preferably has a shape corresponding to the shape of the window member 72 (shape in a plane parallel to the polishing surface of the polishing pad 70C). It is preferable to have a shape larger than the window member 72 by a predetermined dimension so as to have a gap. In the example shown in FIGS. 32 to 34, the opening 11a is not provided with the glass plate 46 shown in FIGS. The glass plate 46 may be installed (below the support surface 11b) so as to provide a gap between the lower surface of the window member 72 and the glass plate 46 so that they do not come into contact with each other. Further, the polishing pad 70C is not a single-layer polishing pad, and a laminated polishing pad having two or more layers as described above provided with an adhesive layer 74C may be applied.

In this embodiment, the heights of the window member 72 and the pad body 702 are substantially the same. Therefore, when the polishing pad 70C is newly provided on the polishing table 11, as shown in FIG. 32, the polishing surface 71 and the upper surface of the window member 72 are substantially flush (constitute the same plane). When the polishing pad 70C is used in the polishing process, it can be assumed that the pad main body 702 is consumed and the height of the pad main body 702 is reduced as shown in FIG. Even in such a case, as shown in FIG. 34, the substrate 200 held by the substrate holding member 13 is pressed against the polishing pad 70C during polishing, so that the window member 72 is pressed and the opening 11a of the polishing table 11 is closed. By entering inside, the height relationship between the polishing surface 71 of the pad body 702 and the upper surface of the window member 72 can be maintained. As a result, damage to the substrate 200 due to contact between the window member 72 and the substrate 200 can be suppressed, and damage to the window member 72 can be suppressed to improve the detection accuracy of the film thickness of the substrate 200 by the film thickness measuring device 30. can be done. However, the window member 72 is not limited to being configured to have approximately the same height as the pad main body 702, and may be configured to have a height slightly greater than the height of the pad main body 702. . 34, the substrate 200 held by the substrate holding member 13 is pressed against the polishing pad 70C during polishing, so that the window member 72 is pressed and the polishing table 11 is moved. By entering the opening 11a, the height relationship between the polishing surface 71 of the pad body 702 and the upper surface of the window member 72 can be maintained.

The present invention can also be described as the following forms.
[Mode 1] According to mode 1, there is proposed a polishing pad for a substrate polishing apparatus equipped with an optical sensor. and a window member for passing the sensing light of the optical sensor, the window member being accommodated in the through hole, wherein the pad main body has an edge defining the through hole. It has a surrounding recess that is recessed relative to the polishing surface relative to the edge, and the surrounding recess communicates with a groove extending to the outer peripheral surface of the polishing pad.
According to the first aspect, it is possible to improve the detection accuracy of the optical sensor in the substrate polishing apparatus including the optical sensor for detecting the state of the substrate surface.

[Mode 2] According to Mode 2, in Mode 1, the surrounding recess and the groove have the same depth.

[Mode 3] According to Mode 3, in Mode 1 or 2, the grooves are formed in a grid pattern in the pad body.

[Mode 4] According to Mode 4, in Modes 1 to 3, the grooves are formed radially, concentrically, or spirally in the pad body.

[Mode 5] According to Mode 5, in Modes 1 to 4, the pad body has a first pad layer having the polishing surface and a second pad layer laminated on the first pad layer. , the groove is formed in the second pad layer.

[Mode 6] According to mode 6, in modes 1 to 5, the window member is accommodated in the through hole so as to be in contact with the edge defining the through hole. In other words, the window member is accommodated in the through hole so that no gap is formed between the window member and the pad body.

[Mode 7] According to Mode 7, in Modes 1 to 5, the window member is accommodated in the through hole so that a gap is formed between the window member and the pad body.

[Mode 8] According to Mode 8, in Modes 1 to 7, the pad body and the window member have the same thickness, or the window member has a greater thickness than the pad body.

[Mode 9] According to Mode 9, in Modes 1 to 8, the window member is provided with a scattering suppression layer for suppressing scattering of the sensing light.

[Mode 10] According to Mode 10, in Modes 1 to 9, the surface of the pad body opposite to the polishing surface of the window member is subjected to surface roughness improvement treatment.

[Mode 11] According to Mode 11, there is proposed a substrate polishing apparatus comprising the polishing pad according to any one of Modes 1 to 10, a polishing table for mounting the polishing pad, A polishing head for holding a substrate is provided to face the polishing table, and an optical sensor is provided on the polishing table for measuring progress of polishing of the substrate.
According to the eleventh aspect, it is possible to improve the detection accuracy of the optical sensor in the substrate polishing apparatus.

[Mode 12] According to Mode 12, a method for manufacturing the polishing pads of Modes 1 to 10 is proposed. forming a hole in the pad block that defines the through hole; cutting the pad block to form a pad body; and opening the through hole in the formed polishing pad. and attaching the member.

[Mode 13] According to Mode 13, a method for manufacturing the polishing pads of Modes 1 to 10 is proposed. forming a hole in the pad block that defines the through hole; placing a window block in the hole formed in the pad block; and combining the pad block and the window block. cutting to form a pad body and a window member.

[Mode 14] According to mode 14, there is provided a polishing pad, a polishing table for attaching the polishing pad, a polishing head for holding a substrate provided so as to face the polishing table, and the polishing table. and an optical sensor for measuring the progress of polishing of the substrate. The polishing pad includes a pad body having a polishing surface, and a pad body having through holes formed therein, and a window member for passing sensing light from the optical sensor, wherein the through holes have It has a window member to be accommodated, and a holding member that holds the window member movably in the penetrating direction of the through hole with respect to the pad body. The polishing table has a support surface for supporting the back surface of the pad body, and the support surface is formed with an opening into which the window member can enter.
According to Mode 14, in the substrate polishing apparatus including the optical sensor for detecting the state of the substrate surface, damage to the substrate due to contact between the window member and the substrate can be suppressed, and damage to the window member can be suppressed. Therefore, it is possible to improve the detection accuracy of the optical sensor.

[Mode 15] According to Mode 15, in Mode 14, the polishing pad is attached to the support surface of the polishing table with an adhesive layer.

[Mode 16] According to Mode 16, in Mode 15, the holding member is the adhesive layer.

[Mode 17] According to Mode 17, in Modes 14 to 16, the holding member is an airtight double-faced tape.

Although the embodiment of the present invention has been described above, the above-described embodiment of the present invention is for facilitating understanding of the present invention, and does not limit the present invention. The present invention may be modified and improved without departing from its spirit, and the present invention includes equivalents thereof. In addition, any combination of the embodiments and modifications is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects, and is described in the scope of claims and the specification. Any combination or omission of each component is possible.

REFERENCE SIGNS LIST 10 polishing device 11 polishing table 13 substrate holding member 20 polishing control device 30 film thickness measuring device 40 sensor module 41 sensor head 42 jig 60 data processing system 70, 70A, 70B, 70C polishing pad 71 polishing surface 72 window member 72f scattering suppression Layers 74, 74C Adhesive layer 702 Pad body 704, 704A, 704B Surrounding recesses 708, 708A, 708B Through holes 710, 710A, 710B Grooves 712 Gap 170, 170A Polishing pad 171 First layer (first pad layer)
172 second layer (second pad layer)
173, 173A polished surface 1724 surrounding recess 1728 through hole 1729 groove 200 substrate 202 film L1 incident light L2 reflected light

Claims (17)

A polishing pad for a substrate polishing apparatus comprising an optical sensor, comprising:
a pad body having a polishing surface and a through hole formed therein;
a window member for passing sensing light from the optical sensor, the window member being accommodated in the through hole;
with
The pad body has a surrounding recess that surrounds an edge defining the through hole and is recessed from the edge with respect to the polishing surface, and the surrounding recess is a groove extending to the outer peripheral surface of the polishing pad. is in communication with
polishing pad. 2. The polishing pad of claim 1, wherein said surrounding recess and said groove have the same depth. 3. The polishing pad according to claim 1, wherein said grooves are formed in a grid pattern in said pad body. The polishing pad according to any one of claims 1 to 3, wherein the grooves are radially, concentrically, or spirally formed in the pad body. The pad body has a first pad layer having the polishing surface and a second pad layer laminated on the first pad layer,
the groove is formed in the second pad layer;
The polishing pad according to any one of claims 1 to 4. 6. The polishing pad of any one of claims 1 to 5, wherein the window member is received in the through hole so as to contact the edge defining the through hole. 6. The polishing pad according to any one of claims 1 to 5, wherein said window member is accommodated in said through-hole such that a gap is formed between said window member and said pad body. The polishing pad according to any one of claims 1 to 7, wherein the pad body and the window member have the same thickness, or the window member has a greater thickness than the pad body. The polishing pad according to any one of claims 1 to 8, wherein the window member is provided with a scattering suppression layer for suppressing scattering of the sensing light. 10. The polishing pad according to any one of claims 1 to 9, wherein said window member has a surface opposite to said polishing surface of said pad body subjected to surface roughness improvement treatment. A polishing pad according to any one of claims 1 to 10;
a polishing table for mounting the polishing pad;
a polishing head for holding a substrate provided to face the polishing table;
an optical sensor provided on the polishing table for measuring progress of polishing of the substrate;
A substrate polishing apparatus comprising: A method for manufacturing a polishing pad according to any one of claims 1 to 10, comprising:
preparing a pad block that becomes a plurality of pad bodies by being cut;
forming a hole in the pad block that defines the through hole;
cutting the pad block to form a pad body;
attaching a window member to the formed through-hole of the polishing pad;
A method of manufacturing a polishing pad comprising: A method for manufacturing a polishing pad according to any one of claims 1 to 10, comprising:
preparing a pad block that becomes a plurality of pad bodies by being cut;
forming a hole in the pad block that defines the through hole;
placing a window block in the hole formed in the pad block;
cutting the pad block and the window block to form a pad body and a window member;
A method of manufacturing a polishing pad comprising: a polishing pad;
a polishing table for mounting the polishing pad;
a polishing head for holding a substrate provided to face the polishing table;
an optical sensor provided on the polishing table for measuring progress of polishing of the substrate;
with
The polishing pad is
a pad body having a polishing surface and a through hole formed therein;
a window member for passing sensing light from the optical sensor, the window member being accommodated in the through hole;
a holding member that holds the window member movably in the penetrating direction of the through hole with respect to the pad body;
has
The polishing table has a support surface for supporting the back surface of the pad body, and the support surface is formed with an opening into which the window member can enter.
Substrate polishing equipment. 15. The substrate polishing apparatus of claim 14, wherein the polishing pad is attached to the support surface of the polishing table by an adhesive layer. 16. The substrate polishing apparatus according to claim 15, wherein said holding member is said adhesive layer. 17. The substrate polishing apparatus according to claim 14, wherein said holding member is an airtight double-faced tape.

Images