JP2023058272A - Method for manufacturing patterned substrate - Google Patents

Abstract

To provide a method for manufacturing a patterned substrate capable of inexpensively manufacturing a patterned substrate having a highly accurate pattern.SOLUTION: A method for manufacturing a patterned substrate includes: a step S1 of forming a resin pattern by printing curable resin on a substrate; a step S2 of curing the resin pattern; and a step S3 of trimming an edge portion of the resin pattern after curing by irradiation of laser.SELECTED DRAWING: Figure 1

Description

The present invention relates to a patterned substrate manufacturing method.

Photolithography is widely used as a technique for forming a pattern having a certain thickness on the surface of a substrate with a resin composition. Photolithography forms a photosensitive material layer on a substrate by a method such as coating, and selectively exposing the photosensitive material to create a difference in solubility between the exposed and unexposed areas. In this technique, only a portion of the photosensitive material layer having low solubility is removed by a developing solution. Photolithography is relatively costly due to the complex steps described above.

As a method of forming patterns at relatively low cost, the use of printing technology is also under consideration. Inkjet printing can be used to form a thin film pattern, but screen printing can be used to form a relatively thick pattern (see, for example, Patent Document 1). A relatively thick pattern can be efficiently formed by screen printing using a paste-like paint.

JP 2004-71827 A

In screen printing, the manufacturing cost can be reduced, but there is a problem that the shape is slightly blurred because the paint on the shoulder portion of the outer periphery of the pattern (the edge of the coating film surface) spreads outward so as to collapse. Therefore, an object of the present invention is to provide a patterned substrate manufacturing method capable of manufacturing a patterned substrate having a highly accurate pattern at low cost.

A method for manufacturing a patterned substrate according to one aspect of the present invention includes the steps of forming a resin pattern by printing a curable resin on a substrate, curing the resin pattern, and irradiating a laser to irradiate a resin after curing. and trimming the edge of the resin pattern.

In the above method for manufacturing a patterned substrate, the printing of the curable resin may be performed by screen printing.

In the method for manufacturing a patterned substrate described above, the thickness of the curable resin may be 30 μm or more.

In the method for manufacturing a patterned substrate described above, the wavelength of the laser may be 8000 nm or more and 15000 nm or less.

In the method of manufacturing a patterned substrate described above, the laser may be radiated with a certain angle in the direction normal to the edge of the resin pattern.

In the method for manufacturing a patterned substrate described above, the curing of the resin pattern before the laser irradiation is semi-curing that does not cause the curable resin to lose fluidity and adhesiveness, and the trimming is performed. The method may further comprise a step of laminating a functional member on the resin pattern, and a step of bonding the functional member by further curing the curable resin.

According to the present invention, a patterned substrate having a highly accurate pattern can be manufactured at low cost.

4 is a flow chart showing the steps of a patterned substrate manufacturing method according to an embodiment of the present invention. 2 is a schematic cross-sectional view of a patterned substrate manufactured by the patterned substrate manufacturing method of FIG. 1. FIG. 1. It is a schematic cross section explaining the printing process of FIG. 1. It is a schematic cross section explaining the trimming process of FIG. It is a schematic cross section explaining the test of a trimming process.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a flow chart showing the steps of a patterned substrate manufacturing method according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the patterned substrate 1 manufactured by the patterned substrate manufacturing method of FIG.

A method for manufacturing a patterned substrate according to an embodiment of the present invention includes, as shown in FIG. 1, a step of forming a resin pattern 20 by printing a curable resin on a substrate 10 (step S1: printing step); A step of curing the curable resin (Step S2: first curing step), and an edge portion of the resin pattern 20 by irradiating the cured curable resin with a laser (boundary between the pattern region and the non-pattern region in plan view). is trimmed (step S3: trimming step), a step of laminating the functional member 30 on the trimmed resin pattern 20 (step S4: lamination step), and the functional member 30 is formed by further curing the curable resin. and a step of bonding (step S5: second curing step).

As shown in FIG. 2, the patterned substrate 1 manufactured by the patterned substrate manufacturing method of FIG. and a functional member 30 laminated on the surface of the resin pattern 20 opposite to the substrate 10 . The patterned substrate 1 can be an optical component, an electronic component, a mechanical component, or the like using the resin pattern 20. Specifically, it is a MEMS sensor such as an image sensor, an acceleration sensor, a pressure sensor, or the like.

The substrate 10 is a structural member of the patterned substrate 1 and holds the resin pattern 20 and thus the functional member 30 . Also, the substrate 10 protects the resin pattern 20 and the functional member 30 . The substrate 10 is preferably a transparent substrate that transmits light, typically a glass substrate. The thickness of the substrate 10 can be, for example, 0.2 mm or more and 2.0 mm or less, typically 0.5 mm or more and 1.5 mm or less.

The substrate 10 may have a transparent film having a function such as antireflection on both sides or one side. Examples of transparent films include inorganic films formed of silica (SiO ₂ ), titania (TiO ₂ ), alumina (Al ₂ O ₃ ), magnesium fluoride (MgF ₂ ), niobium oxide (Nb ₂ O ₅ ), and the like. can be

The resin pattern 20 provides, for example, an optical function, an electronic function, a mechanical function, etc., and typically constitutes a lens, a diffraction grating, or the like. For this reason, the pattern shape of the resin pattern 20 is appropriately designed according to the function to be obtained. The upper limit of the width is preferably 300 μm, more preferably 200 μm. When the width of the resin pattern 20 is equal to or greater than the lower limit, the resin pattern 20 having sufficient accuracy can be formed by printing in the patterned substrate manufacturing method according to the present invention. Further, when the width of the resin pattern 20 is equal to or less than the upper limit, the effect of trimming the shape of the end surface becomes remarkable.

The lower limit of the thickness of the resin pattern 20 is preferably 30 μm, more preferably 50 μm. On the other hand, the upper limit of the thickness of the resin pattern 20 is, for example, preferably 200 μm, more preferably 150 μm, and more preferably 100 μm. The thickness of the resin pattern 20 is selected according to its function. Since the pattern 20 can be formed, the effect of improving the performance becomes remarkable. Further, if the thickness of the resin pattern 20 is equal to or less than the upper limit, the trimming can be accurately performed, so that the dimensional accuracy is significantly improved.

The functional member 30 is a member that performs a function using the resin pattern 20, and can typically be composed of a semiconductor substrate or a semiconductor chip. Functionally, the functional member 30 can be, for example, a light source that emits light through the resin pattern 20, an imaging device that converts an optical image formed by the resin pattern 20 into an electrical signal, or the like.

In the patterned substrate manufacturing method of FIG. 1, a plurality of resin patterns 20 may be formed on a single substrate 10, and functional members 30 may be individually bonded to the respective resin patterns 20. , and a single functional member 30 may be adhered to cover the plurality of resin patterns 20 . A patterned substrate 1 having a plurality of resin patterns 20 may be divided into individual pieces each independently used as a functional component.

(Printing process)
In the printing process of step S<b>1 , a resin pattern 20 is formed by printing a curable resin on the substrate 10 . The printing of the curable resin is preferably performed by screen printing, as shown in FIG. In screen printing, a screen plate 40 having a mesh 41 that allows curable resin to permeate, and an emulsion 42 that is disposed over the entire non-printing region of the mesh 41 and holds the mesh 41 at a constant distance from the substrate 10. is used to adhere the curable resin to the substrate 10 through the screen plate 40 with the squeegee 50 . Thereby, the resin pattern 20 having a desired thickness can be easily formed. In consideration of the trimming process, the opening of the screen plate 40 can be formed slightly larger than the desired resin pattern 20 shape.

Specific examples of the curable resin printed on the substrate 10 include a resin containing at least one of a glycidyl group and an alicyclic epoxy group, a resin containing a polysiloxane compound, and the like. It is relatively easy to adjust these resins to have physical properties that enable the formation of a thick resin pattern 20 by printing. Moreover, it is preferable that the curable resin forming the resin pattern 20 contains a photoacid generator, that is, is a photocurable resin. The use of a photocurable resin facilitates the subsequent first curing step.

(First curing step)
In the first curing step of step S2, the printed resin pattern 20 is cured. Examples of a method for curing the resin pattern 20 include heating, exposure, and the like, and exposure, which is relatively easy to perform continuously with the steps before and after, can be suitably employed. As a light source for photocuring (exposure), a light source that emits light at the absorption wavelength of the polymerization initiator and sensitizer used may be used, and usually includes a wavelength in the range of 200 nm to 450 nm (e.g., high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, high power metal halide lamps, xenon lamps, carbon arc lamps, light emitting diodes, etc.) can be used.

The curing of the resin pattern 20 in the first curing step can be semi-curing that does not cause the fluidity of the curable resin to be lost and the adhesiveness to be maintained. In this way, by setting the curable resin forming the resin pattern 20 to a so-called B-stage state, it is possible to adjust the shape of the end surface of the resin pattern 20 in the next trimming process, and to adjust the shape of the resin pattern 20 in the second curing process. It can also function as an adhesive for adhering 20 to functional member 30 .

(trimming process)
In the trimming process of step S3, as shown in FIG. 4, the edge of the resin pattern 20 is trimmed by irradiation with the laser L, that is, the curable resin that flows and spreads outward after printing is removed, thereby removing the resin pattern. The end face of 20 can be any desired sheer shape.

In the trimming process, the laser L is preferably irradiated along the edge of the resin pattern 20 in as few passes as possible, particularly preferably in one pass. By reducing the number of irradiation passes of the laser L, the edge shape in cross-sectional view of the end surface of the resin pattern 20 after trimming can be made linear. However, if the trimming is performed by irradiating the laser L in multiple passes, damage to the substrate 10 can be easily suppressed. We can make it big. In addition, it is preferable that the laser L is linearly irradiated along the edge of the resin pattern 20 without being irradiated by scanning in plan view. By not repeatedly irradiating the same portion of the scanning line with the laser L, it is possible to suppress damage to the substrate 10 . Moreover, since the time and energy required for irradiation with the laser L can be suppressed, the patterned substrate 1 can be efficiently produced.

It is preferable to irradiate the laser L on a region where the surface of the resin pattern 20 is slanted because the shape of the edge of the resin pattern 20 is destroyed. The laser L is refracted inward. As a result, even if the laser L removes the curable resin from the surface of the resin pattern 20 toward the deeper part, the effective diameter of the laser L becomes smaller as the depth increases, but the refraction of the laser L causes The rise angle of the end surface of the resin pattern 20 is suppressed from becoming small.

Further, in order to more accurately adjust the angle of the end surface of the resin pattern 20, the laser L may be irradiated at a certain angle from the direction perpendicular to the substrate 10 to the normal direction of the edge of the resin pattern 20. good. As for the "fixed angle", for example, irradiation may be performed at an angle of 0 to 50 degrees with respect to the normal direction, or may be at an angle of more than 0 to 45 degrees. The angle is preferably that the processing angle (the angle of the pattern end surface after irradiation with respect to the pattern surface) is perpendicular, that is, close to 90 degrees, and can be appropriately set depending on the irradiation conditions, etc., but the laser incident angle is preferably 0 degrees or more and 45 degrees or less. , more preferably 5 degrees or more and 45 degrees or less, and particularly preferably 10 degrees or more and 40 degrees or less. By obliquely irradiating the laser L, the end surface of the resin pattern 20 can be intentionally angled. The angle of inclination of the laser L may be positive or negative, and may be inclined toward the inside of the resin pattern 20 or outward from the vertical.

The lower limit of the wavelength of the laser L is preferably 8000 nm, more preferably 9000 nm. On the other hand, the upper limit of the wavelength of the laser L is preferably 15000 nm, more preferably 12000 nm. Therefore, as the laser L, a carbon dioxide gas laser (wavelength 9300 nm to 10600 nm) can be preferably used. By using the laser L having such a wavelength, the curable resin can be efficiently removed while suppressing damage to the substrate 10, and excessive refraction is not caused. can be relatively easily controlled.

(Lamination process)
In the lamination process of step S4, the functional member 30 is laminated on the trimmed resin pattern 20. Next, as shown in FIG.

(Second curing step)
In the second curing process of step S5, the functional member 30 is adhered by further curing the curable resin forming the resin pattern 20. FIG. Curing of the curable resin in the second curing step may be performed by irradiation with light, but may be performed by heating because the photoacid generator of the photocurable resin is also activated by heating. The resin pattern 20 and the functional member 30 can be reliably adhered to each other by completely curing the resin pattern 20 with pressure contact between the resin pattern 20 and the functional member 30 by a method such as hot pressing.

According to the patterned substrate manufacturing method including the above steps, the resin pattern 20 having a precise end surface edge can be formed by efficiently laminating the curable resin by printing and trimming with the laser L. Therefore, the patterned substrate manufacturing method according to the present embodiment can inexpensively manufacture a patterned substrate having a highly accurate pattern.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various changes and modifications are possible. For example, the method of manufacturing a patterned substrate according to the present invention may manufacture a patterned substrate having only a substrate and a resin pattern without a functional member. That is, the patterned substrate manufacturing method according to the present invention may not include the lamination step and the second curing step.

EXAMPLES The present invention will be specifically described below based on examples, but the present invention is not limited to the following examples.

A photocurable resin containing a glycidyl group and an alicyclic epoxy group was screen-printed on a 100 mm × 100 mm glass substrate (manufactured by D263 Teco SCHOTT) using a screen printer (DP-320 manufactured by Newlong Seimitsu Kogyo Co., Ltd.). A pattern with a width of 250 μm and a height of 50 μm was formed. The screen plate used had a mesh number of 250 lines/inch, a wire diameter of 30 μm, and an emulsion thickness of 10 μm. After pattern formation, exposure was performed with an integrated light amount of 3000 mJ/cm ² .

Tests 1 to 6 were performed in which the edge portions of the pattern formed as described above were removed by irradiating laser under different conditions. As a laser light source, a CO2 laser (wavelength 9600 nm, Coherent Diamond Cx-10 LQSCO2 laser) or a UV laser (wavelength 355 nm, Spectra Physics, Inc., Explorer One HP-355-4) was used. As other laser conditions, the incident angle (outward inclination angle with respect to the normal to the glass substrate) α [°] (see FIG. 5), the scanning speed [mm/s], and the number of scanning times [number of times] were varied. .

In the above tests, the processing angle β, which is the angle of the pattern end surface formed by laser irradiation with respect to the pattern surface, was measured using a 3D measurement laser microscope (LEXT OLS4000, manufactured by Olympus Corporation). Observations were also made using the same 3D measurement laser microscope in a 50x bright field to confirm the presence or absence of debris (scattered objects from the pattern due to laser irradiation). , and those in which debris was found were evaluated as “×”. These results are shown in Table 1 below together with laser irradiation conditions. The angle corresponding to the processing angle of the end surface of the pattern before laser irradiation was 155°.

As shown in Table 1, it was confirmed that by using a CO2 laser and inclining the incident direction of the laser outward, a patterned substrate with a small pattern processing angle β and no debris could be obtained.

1 patterned substrate 10 substrate 20 resin pattern 30 functional member 40 screen plate 41 mesh 42 emulsion 50 squeegee L laser S1 printing process S2 first curing process S3 trimming process S4 lamination process S5 second curing process α incident angle β processing angle

Claims (6)

forming a resin pattern by printing a curable resin on the substrate;
a step of curing the resin pattern;
and trimming the edge of the cured resin pattern by laser irradiation. 2. The method of manufacturing a patterned substrate according to claim 1, wherein the printing of the curable resin is performed by screen printing. 3. The method of manufacturing a patterned substrate according to claim 1, wherein the curable resin has a thickness of 30 [mu]m or more. 4. The method of manufacturing a patterned substrate according to claim 1, wherein the laser has a wavelength of 8000 nm or more and 15000 nm or less. 5. The method of manufacturing a patterned substrate according to claim 1, wherein the laser is irradiated with a certain angle in the normal direction of the edge of the resin pattern. The curing of the resin pattern before the laser irradiation is semi-curing that does not cause the curable resin to lose fluidity and adhesiveness,
a step of laminating a functional member on the trimmed resin pattern;
a step of bonding the functional member by further curing the curable resin;
The method for manufacturing a patterned substrate according to any one of claims 1 to 5, further comprising:

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