JP2023056475A - Positive resist material and pattern forming process - Google Patents

Abstract

To provide a positive resist material that has better resolution than those of the conventional positive resist materials, and has reduced LWR, improved CDU, and a good pattern profile after exposure, and a pattern forming process.SOLUTION: A positive resist material comprises a base polymer comprising repeat units (a) having two triple bonds and repeat units (b) adapted to increase solubility in an alkaline developer under the action of acid.SELECTED DRAWING: None

Description

The present invention relates to a positive resist material and a pattern forming method.

Along with the increase in the integration density and speed of LSIs, pattern rules are rapidly becoming finer. This is because the high-speed communication of 5G and the spread of artificial intelligence (AI) are progressing, and high-performance devices are required to process them. As a state-of-the-art miniaturization technology, 5 nm node devices are mass-produced by extreme ultraviolet (EUV) lithography with a wavelength of 13.5 nm. Furthermore, next-generation 3-nm node devices and next-generation 2-nm node devices are also being studied using EUV lithography.

Image blurring due to diffusion of acid has become a problem as miniaturization progresses. In order to ensure the resolution of fine patterns with a dimension size of 45 nm or more, it has been proposed that not only the conventionally proposed improvement in dissolution contrast but also the control of acid diffusion is important (Non-Patent Document 1). However, chemically amplified resist materials increase sensitivity and contrast by acid diffusion. and the contrast is significantly reduced.

A triangle trade-off relationship of sensitivity, resolution and edge roughness (LWR) is shown. In order to improve resolution, it is necessary to suppress acid diffusion.

It is effective to add an acid generator that generates bulky acid to suppress acid diffusion. Therefore, it has been proposed to incorporate a repeating unit derived from an onium salt having a polymerizable unsaturated bond into the polymer. At this time, the polymer also functions as an acid generator (polymer-bound acid generator). Patent Document 1 proposes a sulfonium salt or an iodonium salt having a polymerizable unsaturated bond that generates a specific sulfonic acid. Patent Document 2 proposes a sulfonium salt in which a sulfonic acid is directly linked to the main chain.

A resist material using a polymer containing a repeating unit derived from a methacrylate ester having a primary or secondary triple bond that is not acid-labile has been proposed (Patent Document 3). Here a positive resist material is shown in combination with an adhesion group containing a lactone ring. The triple bond is acidic and improves the alkali affinity. However, when there is one triple bond, the alkali affinity and solubility in an alkaline developer are not as high as those of phenol.

JP 2006-045311 A JP 2006-178317 A JP 2009-86445 A

SPIE Vol.3331 p531 (1998)

The present invention has been made in view of the above circumstances, and provides a positive resist material having a resolution higher than that of conventional positive resist materials, a small LWR, good dimensional uniformity (CDU), and a good pattern shape after exposure. An object of the present invention is to provide a mold resist material and a pattern forming method.

The inventors of the present invention have made intensive studies to obtain a positive resist material with high resolution, which has been demanded in recent years, and small edge roughness and dimensional variation. That is, it is necessary to suppress swelling in an alkaline developer, and it was discovered that introducing a repeating unit having two triple bonds into the base polymer improves the alkali solubility, thereby reducing swelling. However, they found that it is extremely effective when used as a base polymer for a chemically amplified positive resist material.

Furthermore, in order to improve the dissolution contrast, by introducing into the base polymer repeating units in which the hydrogen atoms of the carboxy group or phenolic hydroxy group are substituted with acid-labile groups, the alkali dissolution rate contrast before and after exposure is greatly improved. It is highly effective in suppressing acid diffusion, has high resolution, and has good pattern shape, LWR and CDU after exposure. The inventors have found that a resist material can be obtained, and completed the present invention.

（式中、Ｒ^Aは、水素原子又はメチル基である。
Ｘ¹は、エステル結合又はフェニレン基である。
Ｘ²は、単結合、フェニレン基又は炭素数１～１０の脂肪族ヒドロカルビレン基であり、前記脂肪族ヒドロカルビレン基を構成する－ＣＨ₂－の一部が、エーテル結合、エステル結合又はスルホン酸エステル結合で置換されていてもよい。
Ｘ³は、単結合、エーテル結合、エステル結合、カーボネート結合又はウレタン結合である。
Ｒ¹及びＲ²は、それぞれ独立に、水素原子、炭素数１～４のアルキル基又はフェニル基である。）
３．繰り返し単位ｂが、カルボキシ基の水素原子が酸不安定基で置換された繰り返し単位ｂ１又はフェノール性ヒドロキシ基の水素原子が酸不安定基で置換された繰り返し単位ｂ２である１又は２のポジ型レジスト材料。
４．繰り返し単位ｂ１が下記式（ｂ１）で表されるものであり、繰り返し単位ｂ２が下記式（ｂ２）で表されるものである３のポジ型レジスト材料。

（式中、Ｒ^Aは、それぞれ独立に、水素原子又はメチル基である。
Ｙ¹は、単結合、フェニレン基若しくはナフチレン基、又はエステル結合、エーテル結合若しくはラクトン環を含む炭素数１～１２の連結基である。
Ｙ²は、単結合、エステル結合又はアミド結合である。
Ｙ³は、単結合、エーテル結合又はエステル結合である。
Ｒ¹¹及びＲ¹²は、それぞれ独立に、酸不安定基である。
Ｒ¹³は、フッ素原子、トリフルオロメチル基、シアノ基又は炭素数１～６の飽和ヒドロカルビル基である。
Ｒ¹⁴は、単結合又は炭素数１～６のアルカンジイル基であり、該アルカンジイル基は、エーテル結合又はエステル結合を含んでいてもよい。
ａは、１又は２である。ｂは、０～４の整数である。ただし、１≦ａ＋ｂ≦５である。）
５．前記ベースポリマーが、更に、ヒドロキシ基、カルボキシ基、ラクトン環、カーボネート結合、チオカーボネート結合、カルボニル基、環状アセタール基、エーテル結合、エステル結合、スルホン酸エステル結合、シアノ基、アミド結合、－Ｏ－Ｃ(＝Ｏ)－Ｓ－及び－Ｏ－Ｃ(＝Ｏ)－ＮＨ－から選ばれる密着性基を含む繰り返し単位ｃを含むものである１～４のいずれかのポジ型レジスト材料。
６．前記ベースポリマーが、更に、下記式（ｄ１）～（ｄ３）のいずれかで表される繰り返し単位を含むものである１～５のいずれかのポジ型レジスト材料。

（式中、Ｒ^Aは、それぞれ独立に、水素原子又はメチル基である。
Ｚ¹は、単結合、炭素数１～６の脂肪族ヒドロカルビレン基、フェニレン基、ナフチレン基若しくはこれらを組み合わせて得られる炭素数７～１８の基、又は－Ｏ－Ｚ¹¹－、－Ｃ(＝Ｏ)－Ｏ－Ｚ¹¹－若しくは－Ｃ(＝Ｏ)－ＮＨ－Ｚ¹¹－である。Ｚ¹¹は、炭素数１～６の脂肪族ヒドロカルビレン基、フェニレン基、ナフチレン基又はこれらを組み合わせて得られる炭素数７～１８の基であり、カルボニル基、エステル結合、エーテル結合又はヒドロキシ基を含んでいてもよい。
Ｚ²は、単結合又はエステル結合である。
Ｚ³は、単結合、－Ｚ³¹－Ｃ(＝Ｏ)－Ｏ－、－Ｚ³¹－Ｏ－又は－Ｚ³¹－Ｏ－Ｃ(＝Ｏ)－である。Ｚ³¹は、炭素数１～１２の脂肪族ヒドロカルビレン基、フェニレン基又はこれらを組み合わせて得られる炭素数７～１８の基であり、カルボニル基、エステル結合、エーテル結合、臭素原子又はヨウ素原子を含んでいてもよい。
Ｚ⁴は、メチレン基、２,２,２－トリフルオロ－１,１－エタンジイル基又はカルボニル基である。
Ｚ⁵は、単結合、メチレン基、エチレン基、フェニレン基、フッ素化フェニレン基、トリフルオロメチル基で置換されたフェニレン基、－Ｏ－Ｚ⁵¹－、－Ｃ(＝Ｏ)－Ｏ－Ｚ⁵¹－又は－Ｃ(＝Ｏ)－ＮＨ－Ｚ⁵¹－である。Ｚ⁵¹は、炭素数１～６の脂肪族ヒドロカルビレン基、フェニレン基、フッ素化フェニレン基又はトリフルオロメチル基で置換されたフェニレン基であり、カルボニル基、エステル結合、エーテル結合、ハロゲン原子又はヒドロキシ基を含んでいてもよい。
Ｒ²¹～Ｒ²⁸は、それぞれ独立に、ハロゲン原子、又はヘテロ原子を含んでいてもよい炭素数１～２０のヒドロカルビル基である。また、Ｒ²³及びＲ²⁴又はＲ²⁶及びＲ²⁷が、互いに結合してこれらが結合する硫黄原子と共に環を形成してもよい。
Ｍ^-は、非求核性対向イオンである。）
７．更に、酸発生剤を含む１～６のいずれかのポジ型レジスト材料。
８．更に、有機溶剤を含む１～７のいずれかのポジ型レジスト材料。
９．更に、クエンチャーを含む１～８のいずれかのポジ型レジスト材料。
１０．更に、界面活性剤を含む１～９のいずれかのポジ型レジスト材料。
１１．１～１０のいずれかのポジ型レジスト材料を用いて基板上にレジスト膜を形成する工程と、前記レジスト膜を高エネルギー線で露光する工程と、前記露光したレジスト膜を、現像液を用いて現像する工程とを含むパターン形成方法。
１２．前記高エネルギー線が、ｉ線、ＫｒＦエキシマレーザー光、ＡｒＦエキシマレーザー光、電子線（ＥＢ）又は波長３～１５ｎｍのＥＵＶである１１のパターン形成方法。 That is, the present invention provides the following positive resist material and pattern forming method.
1. A positive resist material comprising a base polymer containing a repeating unit a having two triple bonds and a repeating unit b whose solubility in an alkaline developer is improved by acid.
2. 1. A positive resist material according to 1, wherein the repeating unit a is represented by the following formula (a).

(In the formula, ^RA is a hydrogen atom or a methyl group.
X ¹ is an ester bond or a phenylene group.
X ² is a single bond, a phenylene group or an aliphatic hydrocarbylene group having 1 to 10 carbon atoms, and part of —CH ₂ — constituting the aliphatic hydrocarbylene group is an ether bond, an ester bond or It may be substituted with a sulfonate ester bond.
^X3 is a single bond, ether bond, ester bond, carbonate bond or urethane bond.
R ¹ and R ² are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl group. )
3. Positive type of 1 or 2, wherein the repeating unit b is a repeating unit b1 in which the hydrogen atom of the carboxy group is substituted with an acid-labile group or a repeating unit b2 in which the hydrogen atom of the phenolic hydroxy group is substituted with an acid-labile group. resist material.
4. The positive resist material of 3, wherein the repeating unit b1 is represented by the following formula (b1) and the repeating unit b2 is represented by the following formula (b2).

(In the formula, each ^RA is independently a hydrogen atom or a methyl group.
Y ¹ is a single bond, a phenylene group or a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond, an ether bond or a lactone ring.
Y ² is a single bond, an ester bond or an amide bond.
Y ³ is a single bond, an ether bond or an ester bond.
R ¹¹ and R ¹² are each independently an acid labile group.
R ¹³ is a fluorine atom, a trifluoromethyl group, a cyano group or a saturated hydrocarbyl group having 1 to 6 carbon atoms.
R ¹⁴ is a single bond or an alkanediyl group having 1 to 6 carbon atoms, and the alkanediyl group may contain an ether bond or an ester bond.
a is 1 or 2; b is an integer from 0 to 4; However, 1≤a+b≤5. )
5. The base polymer further contains a hydroxy group, a carboxyl group, a lactone ring, a carbonate bond, a thiocarbonate bond, a carbonyl group, a cyclic acetal group, an ether bond, an ester bond, a sulfonate ester bond, a cyano group, an amide bond, -O- 4. The positive resist material according to any one of 1 to 4, which contains a repeating unit c containing an adhesive group selected from C(=O)-S- and -OC(=O)-NH-.
6. 6. The positive resist material according to any one of 1 to 5, wherein the base polymer further contains a repeating unit represented by any one of the following formulas (d1) to (d3).

(In the formula, each ^RA is independently a hydrogen atom or a methyl group.
Z ¹ is a single bond, an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a naphthylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, or —O—Z ¹¹ —, —C (=O)-OZ ¹¹ - or -C(=O)-NH-Z ¹¹ -. Z ¹¹ is an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a naphthylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, and is a carbonyl group, an ester bond, an ether bond or a hydroxy group; may contain
Z ² is a single bond or an ester bond.
Z ³ is a single bond, -Z ³¹ -C(=O)-O-, -Z ³¹ -O- or -Z ³¹ -OC(=O)-. Z ³¹ is an aliphatic hydrocarbylene group having 1 to 12 carbon atoms, a phenylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, a carbonyl group, an ester bond, an ether bond, a bromine atom or an iodine atom; may contain
Z ⁴ is a methylene group, a 2,2,2-trifluoro-1,1-ethanediyl group or a carbonyl group.
Z ⁵ is a single bond, a methylene group, an ethylene group, a phenylene group, a fluorinated phenylene group, a phenylene group substituted with a trifluoromethyl group, -O-Z ⁵¹ -, -C(=O)-O-Z ⁵¹ - or -C(=O)-NH-Z ⁵¹ -. Z ⁵¹ is an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a fluorinated phenylene group or a phenylene group substituted with a trifluoromethyl group, a carbonyl group, an ester bond, an ether bond, a halogen atom or It may contain a hydroxy group.
R ²¹ to R ²⁸ are each independently a halogen atom or a hydrocarbyl group having 1 to 20 carbon atoms which may contain a heteroatom. Also, R ²³ and R ²⁴ or R ²⁶ and R ²⁷ may combine with each other to form a ring together with the sulfur atom to which they are bonded.
M ⁻ is the non-nucleophilic counterion. )
7. The positive resist material of any one of 1 to 6, further comprising an acid generator.
8. Furthermore, the positive resist material of any one of 1 to 7 containing an organic solvent.
9. The positive resist material of any one of 1 to 8, further comprising a quencher.
10. The positive resist material of any one of 1 to 9, further comprising a surfactant.
11. A step of forming a resist film on a substrate using the positive resist material of any one of 1 to 10, a step of exposing the resist film to high-energy rays, and a step of developing using the pattern forming method.
12. 11. The pattern forming method according to 11, wherein the high-energy beam is i-ray, KrF excimer laser beam, ArF excimer laser beam, electron beam (EB), or EUV with a wavelength of 3 to 15 nm.

The positive resist material of the present invention has a high effect of suppressing the diffusion of acid, has a high contrast of alkali dissolution before and after exposure when formed into a resist film, has high resolution, and has a pattern shape, edge roughness, CDU after exposure. is good. Therefore, due to these excellent properties, it is highly practical, and is particularly useful as a fine pattern forming material for ultra-LSI manufacturing, photomasks by EB lithography, and pattern forming material for EB or EUV exposure. The positive resist material of the present invention can be applied not only to lithography in the formation of semiconductor circuits, but also to the formation of mask circuit patterns, micromachines, and thin-film magnetic head circuits.

[Base polymer]
The positive resist material of the present invention is characterized by containing a base polymer containing a repeating unit a having two triple bonds and a repeating unit b whose solubility in an alkaline developer is improved by acid.

As the repeating unit a, those represented by the following formula (a) are preferable.

In formula (a), ^RA is a hydrogen atom or a methyl group.

In formula (a), X ¹ is an ester bond or a phenylene group.

In formula (a), X ² is a single bond, a phenylene group or an aliphatic hydrocarbylene group having 1 to 10 carbon atoms, and the aliphatic hydrocarbylene group may be saturated or unsaturated. Examples thereof include alkanediyl groups having 1 to 10 carbon atoms such as methanediyl, ethane-1,2-diyl, propane-1,3-diyl and butane-1,4-diyl; cyclopentanediyl and cyclohexane; Cyclic saturated hydrocarbylene groups having 3 to 10 carbon atoms such as diyl group, norbornanediyl group and adamantanediyl group; carbon numbers such as vinylene group, propene-1,3-diyl group and butene-1,4-diyl group Alkenediyl groups having 2 to 10 carbon atoms; alkynediyl groups having 2 to 10 carbon atoms such as ethyne-1,2-diyl group, propyne-1,3-diyl group and butyne-1,4-diyl group; Also, a portion of —CH ₂ — constituting the aliphatic hydrocarbylene group may be substituted with an ether bond, an ester bond or a sulfonate ester bond. A lactone ring or sultone ring may be formed by partially substituting --CH ₂ -- constituting the cyclic saturated hydrocarbylene group.

In formula (a), ^X3 is a single bond, ether bond, ester bond, carbonate bond or urethane bond.

In formula (a), R ¹ and R ² are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl group. Examples of the alkyl group having 1 to 4 carbon atoms include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group and tert-butyl group. Among these, R ¹ and R ² are preferably a hydrogen atom, a methyl group, an ethyl group and a phenyl group, more preferably a hydrogen atom.

Monomers that provide the repeating unit a include, but are not limited to, those shown below.

The compound having two triple bonds can be synthesized, for example, by an esterification reaction between an alcohol having two triple bonds and methacrylic acid chloride.

The repeating unit a has two triple bonds, and has two weakly acidic triple bonds, so that it has moderate alkali solubility. Alkali-soluble phenol groups aggregate due to hydrogen bonding, but triple bonds do not have cohesiveness due to hydrogen bonding, so aggregation between polymers can be suppressed, and the microscopic distance of acid diffusion is uniform. The size of the pattern after development becomes uniform.

As the repeating unit b, the repeating unit b1 in which the hydrogen atom of the carboxy group is substituted with an acid-labile group or the repeating unit b2 in which the hydrogen atom of the phenolic hydroxy group is substituted with an acid-labile group is preferable.

Examples of repeating units b1 and b2 include those represented by the following formulas (b1) and (b2), respectively.

In formulas (b1) and (b2), R ^A is each independently a hydrogen atom or a methyl group. Y ¹ is a single bond, a phenylene group or a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond, an ether bond or a lactone ring. Y ² is a single bond, an ester bond or an amide bond. Y ³ is a single bond, an ether bond or an ester bond. R ¹¹ and R ¹² are each independently an acid labile group. R ¹³ is a fluorine atom, a trifluoromethyl group, a cyano group or a saturated hydrocarbyl group having 1 to 6 carbon atoms. R ¹⁴ is a single bond or an alkanediyl group having 1 to 6 carbon atoms, and the alkanediyl group may contain an ether bond or an ester bond. a is 1 or 2; b is an integer from 0 to 4; However, 1≤a+b≤5.

Monomers that provide the repeating unit b1 include, but are not limited to, those shown below. In the formula below, R ^A and R ¹¹ are the same as above.

Monomers that provide the repeating unit b2 include, but are not limited to, those shown below. In the formula below, R ^A and R ¹² are the same as above.

（式中、破線は、結合手である。） Various acid-labile groups represented by R ¹¹ or R ¹² are selected, and examples thereof include those represented by the following formulas (AL-1) to (AL-3).

(In the formula, the dashed line is a bond.)

In formula (AL-1), c is an integer of 0-6. R ^L1 is a tertiary hydrocarbyl group having 4 to 20 carbon atoms, preferably 4 to 15 carbon atoms, a trihydrocarbylsilyl group in which each hydrocarbyl group is a saturated hydrocarbyl group having 1 to 6 carbon atoms, a carbonyl group, an ether bond or an ester It is a saturated hydrocarbyl group having 4 to 20 carbon atoms containing a bond, or a group represented by formula (AL-3). In addition, a tertiary hydrocarbyl group means a group obtained by elimination of a hydrogen atom from a tertiary carbon atom of a hydrocarbon.

Tertiary hydrocarbyl groups represented by R ^L1 may be saturated or unsaturated, branched or cyclic. Specific examples thereof include a tert-butyl group, a tert-pentyl group, a 1,1-diethylpropyl group, a 1-ethylcyclopentyl group, a 1-butylcyclopentyl group, a 1-ethylcyclohexyl group, a 1-butylcyclohexyl group, a 1- ethyl-2-cyclopentenyl group, 1-ethyl-2-cyclohexenyl group, 2-methyl-2-adamantyl group and the like. Examples of the trihydrocarbylsilyl group include trimethylsilyl group, triethylsilyl group and dimethyl-tert-butylsilyl group. The saturated hydrocarbyl group containing a carbonyl group, an ether bond, or an ester bond may be linear, branched, or cyclic, but cyclic ones are preferred. -methyl-2-oxoxan-4-yl group, 5-methyl-2-oxoxolan-5-yl group, 2-tetrahydropyranyl group, 2-tetrahydrofuranyl group and the like.

Examples of the acid-labile group represented by formula (AL-1) include a tert-butoxycarbonyl group, a tert-butoxycarbonylmethyl group, a tert-pentyloxycarbonyl group, a tert-pentyloxycarbonylmethyl group, and 1,1-diethyl. propyloxycarbonyl group, 1,1-diethylpropyloxycarbonylmethyl group, 1-ethylcyclopentyloxycarbonyl group, 1-ethylcyclopentyloxycarbonylmethyl group, 1-ethyl-2-cyclopentenyloxycarbonyl group, 1-ethyl-2 -cyclopentenyloxycarbonylmethyl group, 1-ethoxyethoxycarbonylmethyl group, 2-tetrahydropyranyloxycarbonylmethyl group, 2-tetrahydrofuranyloxycarbonylmethyl group and the like.

（式中、破線は、結合手である。） Furthermore, the acid-labile group represented by formula (AL-1) also includes groups represented by formulas (AL-1)-1 to (AL-1)-10 below.

(In the formula, the dashed line is a bond.)

In formulas (AL-1)-1 to (AL-1)-10, c is the same as above. Each R ^L8 is independently a saturated hydrocarbyl group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms. R ^L9 is a hydrogen atom or a saturated hydrocarbyl group having 1 to 10 carbon atoms. R ^L10 is a saturated hydrocarbyl group having 2 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms. The saturated hydrocarbyl groups may be linear, branched or cyclic.

In formula (AL-2), R ^L2 and R ^L3 are each independently a hydrogen atom or a saturated hydrocarbyl group having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms. The saturated hydrocarbyl group may be linear, branched, or cyclic, and specific examples thereof include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and sec-butyl. group, tert-butyl group, cyclopentyl group, cyclohexyl group, 2-ethylhexyl group, n-octyl group and the like.

（式中、破線は、結合手である。） In formula (AL-2), R ^L4 is a hydrocarbyl group having 1 to 18, preferably 1 to 10 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Examples of the hydrocarbyl group include saturated hydrocarbyl groups having 1 to 18 carbon atoms, and some of these hydrogen atoms are substituted with a hydroxy group, an alkoxy group, an oxo group, an amino group, an alkylamino group, or the like. good too. Such substituted saturated hydrocarbyl groups include those shown below.

(In the formula, the dashed line is a bond.)

R ^L2 and R ^L3 , R ^L2 and R ^L4 , or R ^L3 and R ^L4 may be bonded to each other to form a ring together with the carbon atom or the carbon atom and the oxygen atom to which they are bonded, In this case, R ^L2 and R ^L3 , R ^L2 and R ^L4 , or R ^L3 and R ^L4 involved in ring formation are each independently an alkanediyl group having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms. . The number of carbon atoms in the ring obtained by combining these is preferably 3-10, more preferably 4-10.

Among the acid labile groups represented by the formula (AL-2), linear or branched groups are represented by the following formulas (AL-2)-1 to (AL-2)-69. include, but are not limited to. In addition, in the following formula, the dashed line indicates a bond.

Among the acid labile groups represented by formula (AL-2), cyclic ones include tetrahydrofuran-2-yl group, 2-methyltetrahydrofuran-2-yl group, tetrahydropyran-2-yl group, 2- and a methyltetrahydropyran-2-yl group.

（式中、破線は、結合手である。） Further, the acid labile group includes groups represented by the following formula (AL-2a) or (AL-2b). The acid labile groups may crosslink the base polymer intermolecularly or intramolecularly.

(In the formula, the dashed line is a bond.)

In formula (AL-2a) or (AL-2b), R ^L11 and R ^L12 are each independently a hydrogen atom or a saturated hydrocarbyl group having 1 to 8 carbon atoms. The saturated hydrocarbyl groups may be linear, branched or cyclic. R ^L11 and R ^L12 may be bonded to each other to form a ring together with the carbon atoms to which they are bonded, and in this case, R ^L11 and R ^L12 are each independently an alkane having 1 to 8 carbon atoms. It is a diyl group. Each R ^L13 is independently a saturated hydrocarbylene group having 1 to 10 carbon atoms. The saturated hydrocarbylene group may be linear, branched or cyclic. d and e are each independently an integer of 0 to 10, preferably 0 to 5; f is an integer of 1 to 7, preferably 1 to 3;

In formula (AL-2a) or (AL-2b), L ^A is an (f+1)-valent saturated aliphatic hydrocarbon group having 1 to 50 carbon atoms, or an (f+1)-valent alicyclic group having 3 to 50 carbon atoms It is a saturated hydrocarbon group, an (f+1) valent aromatic hydrocarbon group having 6 to 50 carbon atoms or an (f+1) valent heterocyclic group having 3 to 50 carbon atoms. In addition, a portion of —CH ₂ — in these groups may be substituted with a group containing a hetero atom, and a portion of the hydrogen atoms in these groups may be replaced with a hydroxy group, carboxy group, acyl group or fluorine atom. may be substituted. L ^A is preferably a saturated hydrocarbon group such as a saturated hydrocarbylene group having 1 to 20 carbon atoms, a trivalent saturated hydrocarbon group or a tetravalent saturated hydrocarbon group, an arylene group having 6 to 30 carbon atoms, or the like. The saturated hydrocarbon group may be linear, branched or cyclic. L ^B is -C(=O)-O-, -NH-C(=O)-O- or -NH-C(=O)-NH-.

（式中、破線は、結合手である。） Examples of the crosslinked acetal group represented by the formula (AL-2a) or (AL-2b) include groups represented by the following formulas (AL-2)-70 to (AL-2)-77.

(In the formula, the dashed line is a bond.)

In formula (AL-3), R ^L5 , R ^L6 and R ^L7 are each independently a hydrocarbyl group having 1 to 20 carbon atoms and containing a heteroatom such as an oxygen atom, a sulfur atom, a nitrogen atom or a fluorine atom. You can stay. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples thereof include alkyl groups having 1 to 20 carbon atoms, saturated cyclic hydrocarbyl groups having 3 to 20 carbon atoms, alkenyl groups having 2 to 20 carbon atoms, unsaturated cyclic hydrocarbyl groups having 3 to 20 carbon atoms, carbon Aryl groups of numbers 6 to 10 and the like can be mentioned. R ^L5 and R ^L6 , R ^L5 and R ^L7 , or R ^L6 and R ^L7 may be bonded to each other to form an alicyclic ring having 3 to 20 carbon atoms together with the carbon atoms to which they are bonded. .

Groups represented by formula (AL-3) include tert-butyl group, 1,1-diethylpropyl group, 1-ethylnorbornyl group, 1-methylcyclopentyl group, 1-ethylcyclopentyl group, 1-isopropylcyclopentyl group, 1-methylcyclohexyl group, 2-(2-methyl)adamantyl group, 2-(2-ethyl)adamantyl group, tert-pentyl group and the like.

（式中、破線は、結合手である。） The group represented by formula (AL-3) also includes groups represented by formulas (AL-3)-1 to (AL-3)-19 below.

(In the formula, the dashed line is a bond.)

In formulas (AL-3)-1 to (AL-3)-19, R ^L14 is each independently a saturated hydrocarbyl group having 1 to 8 carbon atoms or an aryl group having 6 to 20 carbon atoms. R ^L15 and R ^L17 are each independently a hydrogen atom or a saturated hydrocarbyl group having 1 to 20 carbon atoms. R ^L16 is an aryl group having 6 to 20 carbon atoms. The saturated hydrocarbyl groups may be linear, branched or cyclic. Moreover, as said aryl group, a phenyl group etc. are preferable. R ^F is a fluorine atom or a trifluoromethyl group. g is an integer from 1 to 5;

（式中、破線は、結合手である。） Further examples of acid labile groups include groups represented by the following formula (AL-3)-20 or (AL-3)-21. The polymer may be intramolecularly or intermolecularly crosslinked by the acid labile groups.

(In the formula, the dashed line is a bond.)

In formulas (AL-3)-20 and (AL-3)-21, R ^L14 is the same as above. R ^L18 is an (h+1)-valent saturated hydrocarbylene group having 1 to 20 carbon atoms or an (h+1)-valent arylene group having 6 to 20 carbon atoms, and includes a heteroatom such as an oxygen atom, a sulfur atom, or a nitrogen atom. may contain. The saturated hydrocarbylene group may be linear, branched or cyclic. h is an integer of 1-3.

Examples of monomers that give repeating units containing an acid-labile group represented by formula (AL-3) include (meth)acrylic acid esters containing an exo structure represented by the following formula (AL-3)-22. be done.

In formula (AL-3)-22, R ^A is the same as above. R ^Lc1 is a C 1-8 saturated hydrocarbyl group or an optionally substituted C 6-20 aryl group. The saturated hydrocarbyl groups may be linear, branched or cyclic. R ^Lc2 to R ^Lc11 are each independently a hydrogen atom or a hydrocarbyl group having 1 to 15 carbon atoms which may contain a heteroatom. An oxygen atom etc. are mentioned as said hetero atom. Examples of the hydrocarbyl group include alkyl groups having 1 to 15 carbon atoms and aryl groups having 6 to 15 carbon atoms. R ^Lc2 and R ^Lc3 , R ^Lc4 and R ^Lc6 , R ^Lc4 and R ^Lc7 , R ^Lc5 and R ^Lc7 , R ^Lc5 and R ^Lc11 , R ^Lc6 and R ^Lc10 , R ^Lc8 and R ^Lc9 , or R ^Lc9 and R ^Lc10 may bond with each other to form a ring together with the carbon atoms to which they bond, in which case the group participating in the bond may contain a heteroatom having 1 to 15 carbon atoms. It is a hydrocarbylene group. In addition, R ^Lc2 and R ^Lc11 , R ^Lc8 and R ^Lc11 , or R ^Lc4 and R ^Lc6 are bonded to adjacent carbon atoms without any intervention to form a double bond. good too. This formula also represents enantiomers.

Examples of the monomer represented by formula (AL-3)-22 include those described in JP-A-2000-327633. Specific examples include, but are not limited to, the following. In addition, in the following formula, ^RA is the same as described above.

Examples of the monomer that gives the repeating unit containing an acid-labile group represented by formula (AL-3) include a furandyl group, a tetrahydrofurandiyl group, or an oxanorbornanediyl group represented by the following formula (AL-3)-23. (Meth)acrylic acid esters containing

In formula (AL-3)-23, R ^A is the same as above. R ^Lc12 and R ^Lc13 are each independently a hydrocarbyl group having 1 to 10 carbon atoms. R ^Lc12 and R ^Lc13 may bond with each other to form an alicyclic ring together with the carbon atoms to which they are bonded. R ^Lc14 is a furandiyl group, a tetrahydrofurandiyl group or an oxanorbornanediyl group. R ^Lc15 is a hydrocarbyl group having 1 to 10 carbon atoms which may contain a hydrogen atom or a heteroatom. The hydrocarbyl groups may be linear, branched or cyclic. Specific examples thereof include saturated hydrocarbyl groups having 1 to 10 carbon atoms.

Monomers represented by formula (AL-3)-23 include, but are not limited to, those shown below. In the formula below, ^RA is the same as above, Ac is an acetyl group, and Me is a methyl group.

In addition to the acid labile groups, acid labile groups containing aromatic groups described in Japanese Patent No. 5565293, Japanese Patent No. 5434983, Japanese Patent No. 5407941, Japanese Patent No. 5655756 and Japanese Patent No. 5655755 can also be used.

The base polymer further includes a hydroxy group, a carboxy group, a lactone ring, a carbonate bond, a thiocarbonate bond, a carbonyl group, a cyclic acetal group, an ether bond, an ester bond, a sulfonate bond, a cyano group, an amide bond, and -O- A repeating unit c containing an adhesive group selected from C(=O)-S- and -OC(=O)-NH- may be included.

Monomers that provide the repeating unit c include, but are not limited to, those shown below. In addition, in the following formula, ^RA is the same as described above.

The base polymer further includes repeating units represented by the following formula (d1) (hereinafter also referred to as repeating units d1) and repeating units represented by the following formula (d2) (hereinafter also referred to as repeating units d2). and at least one selected from repeating units represented by the following formula (d3) (hereinafter also referred to as repeating unit d3).

In formulas (d1) to (d3), R ^A is each independently a hydrogen atom or a methyl group. Z ¹ is a single bond, an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a naphthylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, or —O—Z ¹¹ —, —C (=O)-OZ ¹¹ - or -C(=O)-NH-Z ¹¹ -. Z ¹¹ is an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a naphthylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, and is a carbonyl group, an ester bond, an ether bond or a hydroxy group; may contain Z ² is a single bond or an ester bond. Z ³ is a single bond, -Z ³¹ -C(=O)-O-, -Z ³¹ -O- or -Z ³¹ -OC(=O)-. Z ³¹ is an aliphatic hydrocarbylene group having 1 to 12 carbon atoms, a phenylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, a carbonyl group, an ester bond, an ether bond, a bromine atom or an iodine atom; may contain Z ⁴ is a methylene group, a 2,2,2-trifluoro-1,1-ethanediyl group or a carbonyl group. Z ⁵ is a single bond, a methylene group, an ethylene group, a phenylene group, a fluorinated phenylene group, a phenylene group substituted with a trifluoromethyl group, -O-Z ⁵¹ -, -C(=O)-O-Z ⁵¹ - or -C(=O)-NH-Z ⁵¹ -. Z ⁵¹ is an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a fluorinated phenylene group or a phenylene group substituted with a trifluoromethyl group, a carbonyl group, an ester bond, an ether bond, a halogen atom or It may contain a hydroxy group. The aliphatic hydrocarbylene groups represented by Z ¹ , Z ¹¹ , Z ³¹ and Z ⁵¹ may be saturated or unsaturated, linear, branched or cyclic.

In formulas (d1) to (d3), R ²¹ to R ²⁸ are each independently a halogen atom or a hydrocarbyl group having 1 to 20 carbon atoms which may contain a heteroatom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples thereof include those similar to those exemplified in the description of R ¹⁰¹ to R ¹⁰⁵ in formulas (1-1) and (1-2) below.

Also, R ²³ and R ²⁴ or R ²⁶ and R ²⁷ may combine with each other to form a ring together with the sulfur atom to which they are bonded. At this time, the ring is the same as the ring that can be formed by combining R ¹⁰¹ and R ¹⁰² together with the sulfur atom to which R 101 and R 102 are bonded in the explanation of formula (1-1) described later. mentioned.

In formula (d1), M ⁻ is a non-nucleophilic counterion. Examples of the non-nucleophilic counter ion include halide ions such as chloride ion and bromide ion, triflate ion, fluoroalkylsulfonate ion such as 1,1,1-trifluoroethanesulfonate ion and nonafluorobutanesulfonate ion Tosylate ion, benzenesulfonate ion, 4-fluorobenzenesulfonate ion, arylsulfonate ion such as 1,2,3,4,5-pentafluorobenzenesulfonate ion, mesylate ion, alkylsulfonate ion such as butanesulfonate ion, bis Imido ions such as (trifluoromethylsulfonyl)imide ion, bis(perfluoroethylsulfonyl)imide ion, and bis(perfluorobutylsulfonyl)imide ion, and methide ions such as tris(trifluoromethylsulfonyl)methide ion and tris(perfluoroethylsulfonyl)methide ion mentioned.

The non-nucleophilic counter ion further includes a sulfonate ion in which the α-position is substituted with a fluorine atom represented by the following formula (d1-1), and the α-position represented by the following formula (d1-2) is Examples thereof include sulfonate ions substituted with a fluorine atom and substituted with a trifluoromethyl group at the β-position.

In formula (d1-1), R ³¹ is a hydrogen atom or a hydrocarbyl group having 1 to 20 carbon atoms, and the hydrocarbyl group may contain an ether bond, an ester bond, a carbonyl group, a lactone ring or a fluorine atom. good. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples thereof include the same hydrocarbyl groups as exemplified as hydrocarbyl groups represented by R ¹¹¹ in formula (1A′) described later.

In formula (d1-2), R ³² is a hydrogen atom, a hydrocarbyl group having 1 to 30 carbon atoms or a hydrocarbylcarbonyl group having 2 to 30 carbon atoms, and the hydrocarbyl and hydrocarbylcarbonyl groups are ether bonds or ester bonds. , a carbonyl group or a lactone ring. The hydrocarbyl moieties of the hydrocarbyl groups and hydrocarbylcarbonyl groups may be saturated or unsaturated, linear, branched or cyclic. Specific examples thereof include the same hydrocarbyl groups as exemplified as hydrocarbyl groups represented by R ¹¹¹ in formula (1A′) described later.

Examples of the cation of the monomer that provides the repeating unit d1 include, but are not limited to, those shown below. In addition, in the following formula, ^RA is the same as described above.

Specific examples of the cation of the monomer that provides the repeating unit d2 or d3 include the same as those exemplified as the cation of the sulfonium salt represented by formula (1-1) described later.

Examples of the anion of the monomer that provides the repeating unit d2 include, but are not limited to, those shown below. In addition, in the following formula, ^RA is the same as described above.

Examples of the anion of the monomer that provides the repeating unit d3 include, but are not limited to, those shown below. In addition, in the following formula, ^RA is the same as described above.

Repeating units d1 to d3 function as acid generators. By binding an acid generator to the main chain of the polymer, acid diffusion can be reduced, and deterioration of resolution due to blurring due to acid diffusion can be prevented. Further, LWR and CDU are improved by uniformly dispersing the acid generator. When a base polymer containing repeating units d1 to d3 (that is, a polymer-bound acid generator) is used, the addition of an additive-type acid generator, which will be described later, may be omitted.

The base polymer may contain a repeating unit e containing an iodine atom. Monomers that provide the repeating unit e include, but are not limited to, those shown below. In addition, in the following formula, ^RA is the same as described above.

The base polymer may contain repeating units f other than the repeating units described above. Examples of the repeating unit f include those derived from styrene, vinylnaphthalene, indene, acenaphthylene, coumarin, cumarone, and the like.

In the base polymer, the content ratio of repeating units a, b1, b2, c, d1, d2, d3, e and f is 0<a<1.0, 0≤b1≤0.9, 0≤b2≤0 .9, 0.1≤b1+b2≤0.9, 0≤c≤0.9, 0≤d1≤0.5, 0≤d2≤0.5, 0≤d3≤0.5, 0≤d1+d2+d3≤0 .5, 0≤e≤0.5 and 0≤f≤0.5 are preferred, 0.01≤a≤0.8, 0≤b1≤0.8, 0≤b2≤0.8, 0.2 ≤ b1 + b2 ≤ 0.8, 0 ≤ c ≤ 0.8, 0 ≤ d1 ≤ 0.4, 0 ≤ d2 ≤ 0.4, 0 ≤ d3 ≤ 0.4, 0 ≤ d1 + d2 + d3 ≤ 0.4, 0 ≤ e ≤0.4 and 0≤f≤0.4 are more preferred, and 0.02≤a≤0.7, 0≤b1≤0.7, 0≤b2≤0.7, 0.25≤b1+b2≤0. 7, 0≤c≤0.7, 0≤d1≤0.3, 0≤d2≤0.3, 0≤d3≤0.3, 0≤d1+d2+d3≤0.3, 0≤e≤0.3 and 0≦f≦0.3 is more preferable. However, a+b1+b2+c+d1+d2+d3+e+f=1.0.

In order to synthesize the base polymer, for example, a radical polymerization initiator is added to the above-described monomers that provide repeating units in an organic solvent, followed by heating to carry out polymerization.

Organic solvents used in polymerization include toluene, benzene, tetrahydrofuran (THF), diethyl ether, dioxane and the like. As the polymerization initiator, 2,2'-azobisisobutyronitrile (AIBN), 2,2'-azobis(2,4-dimethylvaleronitrile), dimethyl 2,2-azobis(2-methylpropionate ), benzoyl peroxide, lauroyl peroxide and the like. The temperature during polymerization is preferably 50 to 80°C. The reaction time is preferably 2 to 100 hours, more preferably 5 to 20 hours.

When a monomer containing a hydroxy group is copolymerized, the hydroxy group may be substituted with an acetal group that can be easily deprotected by an acid such as an ethoxyethoxy group during polymerization, and deprotection may be performed with a weak acid and water after polymerization. It may be substituted with an acetyl group, a formyl group, a pivaloyl group, or the like, and subjected to alkaline hydrolysis after polymerization.

When hydroxystyrene or hydroxyvinylnaphthalene is copolymerized, acetoxystyrene or acetoxyvinylnaphthalene is used instead of hydroxystyrene or hydroxyvinylnaphthalene. Naphthalene may be used.

Ammonia water, triethylamine, or the like can be used as a base for alkaline hydrolysis. The reaction temperature is preferably -20 to 100°C, more preferably 0 to 60°C. The reaction time is preferably 0.2 to 100 hours, more preferably 0.5 to 20 hours.

The base polymer preferably has a polystyrene equivalent weight average molecular weight (Mw) of 1,000 to 500,000, more preferably 2,000 to 30, as determined by gel permeation chromatography (GPC) using THF as a solvent. ,000. If the Mw is too small, the resist material will be inferior in heat resistance, and if it is too large, the alkali solubility will be lowered, and footing tends to occur after pattern formation.

Further, when the base polymer has a wide molecular weight distribution (Mw/Mn), the presence of low molecular weight and high molecular weight polymers may cause foreign matter to be seen on the pattern after exposure, or the shape of the pattern may be deteriorated. There is a risk of As the pattern rule becomes finer, the influence of Mw and Mw/Mn tends to increase. Therefore, in order to obtain a resist material suitable for fine pattern dimensions, Mw/Mn of the base polymer should be 1.0. A narrow dispersion of up to 2.0, particularly 1.0 to 1.5 is preferred.

The base polymer may contain two or more polymers having different composition ratios, Mw and Mw/Mn. Further, polymers containing different repeating units a may be blended together, or a polymer containing repeating units a and a polymer not containing repeating units a may be blended.

[Acid generator]
The positive resist material of the present invention may contain an acid generator that generates a strong acid (hereinafter also referred to as an additive-type acid generator). A strong acid as used herein means a compound having sufficient acidity to cause a deprotection reaction of the acid-labile groups of the base polymer.

Examples of the acid generator include compounds (photoacid generators) that generate an acid in response to actinic rays or radiation. As the photoacid generator, any compound that generates an acid upon irradiation with high-energy rays may be used, but those that generate sulfonic acid, imidic acid, or methide acid are preferred. Suitable photoacid generators include sulfonium salts, iodonium salts, sulfonyldiazomethanes, N-sulfonyloxyimides, oxime-O-sulfonate type acid generators, and the like. Specific examples of the photoacid generator include those described in paragraphs [0122] to [0142] of JP-A-2008-111103.

Also, as the photoacid generator, a sulfonium salt represented by the following formula (1-1) and an iodonium salt represented by the following formula (1-2) can be suitably used.

In formulas (1-1) and (1-2), R ¹⁰¹ to R ¹⁰⁵ are each independently a halogen atom or a hydrocarbyl group having 1 to 20 carbon atoms which may contain a heteroatom.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

The hydrocarbyl groups having 1 to 20 carbon atoms represented by R ¹⁰¹ to R ¹⁰⁵ may be saturated or unsaturated, and may be linear, branched or cyclic. Specific examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, n-hexyl group, n- octyl group, n-nonyl group, n-decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, heptadecyl group, octadecyl group, nonadecyl group, icosyl group and other alkyl groups having 1 to 20 carbon atoms; Cyclic saturated hydrocarbyl groups having 3 to 20 carbon atoms such as cyclopropyl, cyclopentyl, cyclohexyl, cyclopropylmethyl, 4-methylcyclohexyl, cyclohexylmethyl, norbornyl, and adamantyl groups; vinyl groups, propenyl groups, alkenyl groups having 2 to 20 carbon atoms such as butenyl group and hexenyl group; alkynyl groups having 2 to 20 carbon atoms such as ethynyl group, propynyl group and butynyl group; rings having 3 to 20 carbon atoms such as cyclohexenyl group and norbornenyl group formula unsaturated aliphatic hydrocarbyl group; phenyl group, methylphenyl group, ethylphenyl group, n-propylphenyl group, isopropylphenyl group, n-butylphenyl group, isobutylphenyl group, sec-butylphenyl group, tert-butylphenyl group , naphthyl group, methylnaphthyl group, ethylnaphthyl group, n-propylnaphthyl group, isopropylnaphthyl group, n-butylnaphthyl group, isobutylnaphthyl group, sec-butylnaphthyl group, tert-butylnaphthyl group, etc., having 6 to 20 carbon atoms aryl group; aralkyl group having 7 to 20 carbon atoms such as benzyl group and phenethyl group; and groups obtained by combining these.

In addition, some or all of the hydrogen atoms in these groups may be substituted with groups containing heteroatoms such as _oxygen , sulfur, nitrogen and halogen atoms. A part may be substituted with a group containing a heteroatom such as an oxygen atom, a sulfur atom, a nitrogen atom, etc., resulting in a hydroxy group, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group. , a carbonyl group, an ether bond, an ester bond, a sulfonate ester bond, a carbonate bond, a lactone ring, a sultone ring, a carboxylic acid anhydride, a haloalkyl group, and the like.

（式中、破線は、Ｒ¹⁰³との結合手である。） Also, R ¹⁰¹ and R ¹⁰² may bond with each other to form a ring together with the sulfur atom to which they bond. At this time, the ring preferably has the structure shown below.

(In the formula, the dashed line is a bond with R ^103. )

The cations of the sulfonium salt represented by formula (1-1) include, but are not limited to, those shown below.

The cations of the iodonium salt represented by formula (1-2) include, but are not limited to, those shown below.

In formulas (1-1) and (1-2), Xa ⁻ is an anion selected from formulas (1A) to (1D) below.

In formula (1A), R ^fa is a fluorine atom or a hydrocarbyl group having 1 to 40 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples thereof include the same hydrocarbyl groups as exemplified as hydrocarbyl groups represented by R ¹¹¹ in formula (1A′) described later.

As the anion represented by the formula (1A), an anion represented by the following formula (1A') is preferable.

In formula (1A'), R ^HF is a hydrogen atom or a trifluoromethyl group, preferably a trifluoromethyl group. R ¹¹¹ is a hydrocarbyl group having 1 to 38 carbon atoms which may contain heteroatoms. The heteroatom is preferably an oxygen atom, a nitrogen atom, a sulfur atom, a halogen atom or the like, more preferably an oxygen atom. The hydrocarbyl group preferably has 6 to 30 carbon atoms in order to obtain high resolution in fine pattern formation.

The hydrocarbyl group represented by R ¹¹¹ may be saturated or unsaturated, linear, branched or cyclic. Specific examples include a methyl group, ethyl group, n-propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, 2- C1-C38 alkyl groups such as ethylhexyl group, nonyl group, undecyl group, tridecyl group, pentadecyl group, heptadecyl group and icosyl group; cyclopentyl group, cyclohexyl group, 1-adamantyl group, 2-adamantyl group, 1-adamantyl cyclic saturated hydrocarbyl groups having 3 to 38 carbon atoms such as methyl group, norbornyl group, norbornylmethyl group, tricyclodecanyl group, tetracyclododecanyl group, tetracyclododecanylmethyl group, dicyclohexylmethyl group; allyl group , an unsaturated aliphatic hydrocarbyl group having 2 to 38 carbon atoms such as a 3-cyclohexenyl group; an aryl group having 6 to 38 carbon atoms such as a phenyl group, a 1-naphthyl group and a 2-naphthyl group; aralkyl groups having 7 to 38 carbon atoms such as; groups obtained by combining these groups;

In addition, some or all of the hydrogen atoms in these groups may be substituted with groups containing heteroatoms such as _oxygen , sulfur, nitrogen and halogen atoms. A part may be substituted with a group containing a heteroatom such as an oxygen atom, a sulfur atom, a nitrogen atom, etc., resulting in a hydroxy group, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group. , a carbonyl group, an ether bond, an ester bond, a sulfonate ester bond, a carbonate bond, a lactone ring, a sultone ring, a carboxylic acid anhydride, a haloalkyl group, and the like. Hydrocarbyl groups containing heteroatoms include tetrahydrofuryl, methoxymethyl, ethoxymethyl, methylthiomethyl, acetamidomethyl, trifluoroethyl, (2-methoxyethoxy)methyl, acetoxymethyl, 2-carboxy -1-cyclohexyl group, 2-oxopropyl group, 4-oxo-1-adamantyl group, 3-oxocyclohexyl group and the like.

Regarding the synthesis of a sulfonium salt containing an anion represented by formula (1A'), JP-A-2007-145797, JP-A-2008-106045, JP-A-2009-7327, JP-A-2009-258695 etc. In addition, sulfonium salts described in JP-A-2010-215608, JP-A-2012-41320, JP-A-2012-106986, JP-A-2012-153644, etc. are also preferably used.

Examples of the anion represented by formula (1A) include those exemplified as the anion represented by formula (1A) in JP-A-2018-197853.

In formula (1B), R ^fb1 and R ^fb2 are each independently a fluorine atom or a hydrocarbyl group having 1 to 40 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples are the same as those exemplified as the hydrocarbyl group represented by R ¹¹¹ in formula (1A′). R ^fb1 and R ^fb2 are preferably a fluorine atom or a linear fluorinated alkyl group having 1 to 4 carbon atoms. R ^fb1 and R ^fb2 may be bonded to each other to form a ring together with the group to which they are bonded (--CF ₂ --SO ₂ ^--N --SO ₂ --CF ₂ --). The group obtained by bonding ^fb1 and R ^fb2 together is preferably a fluorinated ethylene group or a fluorinated propylene group.

In formula (1C), R ^fc1 , R ^fc2 and R ^fc3 are each independently a fluorine atom or a hydrocarbyl group having 1 to 40 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples are the same as those exemplified as the hydrocarbyl group represented by R ¹¹¹ in formula (1A′). R ^fc1 , R ^fc2 and R ^fc3 are preferably a fluorine atom or a linear fluorinated alkyl group having 1 to 4 carbon atoms. In addition, R ^fc1 and R ^fc2 may be bonded to each other to form a ring together with the group (--CF ₂ --SO ₂ ^--C --SO ₂ --CF ₂ --) to which they are bonded. The group obtained by combining ^fc1 and ^Rfc2 is preferably a fluorinated ethylene group or a fluorinated propylene group.

In formula (1D), R ^fd is a hydrocarbyl group having 1 to 40 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples are the same as those exemplified as the hydrocarbyl group represented by R ¹¹¹ in formula (1A′).

The synthesis of the sulfonium salt containing the anion represented by formula (1D) is detailed in JP-A-2010-215608 and JP-A-2014-133723.

Examples of the anion represented by the formula (1D) include those exemplified as the anion represented by the formula (1D) in JP-A-2018-197853.

Note that the photoacid generator containing an anion represented by formula (1D) does not have a fluorine atom at the α-position of the sulfo group, but has two trifluoromethyl groups at the β-position. As such, it has sufficient acidity to cleave the acid-labile groups in the base polymer. Therefore, it can be used as a photoacid generator.

As the photoacid generator, one represented by the following formula (2) can also be used favorably.

In formula (2), R ²⁰¹ and R ²⁰² are each independently a halogen atom or a hydrocarbyl group having 1 to 30 carbon atoms which may contain a heteroatom. R ²⁰³ is a hydrocarbylene group having 1 to 30 carbon atoms which may contain a heteroatom. Also, any two of R ²⁰¹ , R ²⁰² and R ²⁰³ may bond with each other to form a ring together with the sulfur atom to which they bond. At this time, examples of the ring include the same as those exemplified as the ring that can be formed by combining R ¹⁰¹ and R ¹⁰² together with the sulfur atom to which they are bonded in the explanation of formula (1-1). .

The hydrocarbyl groups represented by R ²⁰¹ and R ²⁰² may be saturated or unsaturated, linear, branched or cyclic. Specific examples include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, tert-pentyl group, n- Alkyl groups having 1 to 30 carbon atoms such as hexyl group, n-octyl group, 2-ethylhexyl group, n-nonyl group and n-decyl group; cyclopentyl group, cyclohexyl group, cyclopentylmethyl group, cyclopentylethyl group, cyclopentylbutyl group , a cyclohexylmethyl group, a cyclohexylethyl group, a cyclohexylbutyl group, a norbornyl group, a tricyclo[5.2.1.0 ^2,6 ]decanyl group, an adamantyl group, and a cyclic saturated hydrocarbyl group having 3 to 30 carbon atoms; a phenyl group; , methylphenyl group, ethylphenyl group, n-propylphenyl group, isopropylphenyl group, n-butylphenyl group, isobutylphenyl group, sec-butylphenyl group, tert-butylphenyl group, naphthyl group, methylnaphthyl group, ethylnaphthyl aryl groups having 6 to 30 carbon atoms such as groups, n-propylnaphthyl groups, isopropylnaphthyl groups, n-butylnaphthyl groups, isobutylnaphthyl groups, sec-butylnaphthyl groups, tert-butylnaphthyl groups, anthracenyl groups; and the like obtained by. In addition, some or all of the hydrogen atoms in these groups may be substituted with groups containing heteroatoms such as oxygen, sulfur, nitrogen and _halogen atoms. A part may be substituted with a group containing a heteroatom such as an oxygen atom, a sulfur atom, a nitrogen atom, etc., resulting in a hydroxy group, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group. , a carbonyl group, an ether bond, an ester bond, a sulfonate ester bond, a carbonate bond, a lactone ring, a sultone ring, a carboxylic acid anhydride, a haloalkyl group, and the like.

The hydrocarbylene group represented by R ²⁰³ may be saturated or unsaturated, and may be linear, branched or cyclic. Specific examples include a methanediyl group, an ethane-1,1-diyl group, an ethane-1,2-diyl group, a propane-1,3-diyl group, a butane-1,4-diyl group, and a pentane-1,5 -diyl group, hexane-1,6-diyl group, heptane-1,7-diyl group, octane-1,8-diyl group, nonane-1,9-diyl group, decane-1,10-diyl group, undecane -1,11-diyl group, dodecane-1,12-diyl group, tridecane-1,13-diyl group, tetradecane-1,14-diyl group, pentadecane-1,15-diyl group, hexadecane-1,16- C1-30 alkanediyl groups such as diyl group and heptadecane-1,17-diyl group; C3-30 saturated cyclic groups such as cyclopentanediyl group, cyclohexanediyl group, norbornanediyl group and adamantanediyl group; Hydrocarbylene group; phenylene group, methylphenylene group, ethylphenylene group, n-propylphenylene group, isopropylphenylene group, n-butylphenylene group, isobutylphenylene group, sec-butylphenylene group, tert-butylphenylene group, naphthylene group arylene groups having 6 to 30 carbon atoms such as , methylnaphthylene group, ethylnaphthylene group, n-propylnaphthylene group, isopropylnaphthylene group, n-butylnaphthylene group, isobutylnaphthylene group, sec-butylnaphthylene group, tert-butylnaphthylene group, etc. ; groups obtained by combining these, and the like. In addition, some or all of the hydrogen atoms in these groups may be substituted with groups containing heteroatoms such as oxygen, sulfur, nitrogen and _halogen atoms. A part may be substituted with a group containing a heteroatom such as an oxygen atom, a sulfur atom, a nitrogen atom, etc., resulting in a hydroxy group, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group. , a carbonyl group, an ether bond, an ester bond, a sulfonate ester bond, a carbonate bond, a lactone ring, a sultone ring, a carboxylic acid anhydride, a haloalkyl group, and the like. As said hetero atom, an oxygen atom is preferable.

In formula (2), L ^C is a single bond, an ether bond, or a hydrocarbylene group having 1 to 20 carbon atoms which may contain a heteroatom. The hydrocarbylene group may be saturated or unsaturated, and may be linear, branched or cyclic. Specific examples are the same as those exemplified as the hydrocarbylene group represented by R ²⁰³ .

In formula (2), X ^A , X ^B , X ^C and X ^D each independently represent a hydrogen atom, a fluorine atom or a trifluoromethyl group. However, at least one of X ^A , X ^B , X ^C and X ^D is a fluorine atom or a trifluoromethyl group.

In formula (2), t is an integer of 0-3.

As the photoacid generator represented by formula (2), one represented by the following formula (2') is preferable.

In formula (2′), L ^C is the same as above. ^RHF is a hydrogen atom or a trifluoromethyl group, preferably a trifluoromethyl group. R ³⁰¹ , R ³⁰² and R ³⁰³ are each independently a hydrogen atom or a hydrocarbyl group having 1 to 20 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples are the same as those exemplified as the hydrocarbyl group represented by R ¹¹¹ in formula (1A′). x and y are each independently an integer of 0-5, and z is an integer of 0-4.

Examples of the photoacid generator represented by formula (2) include those exemplified as the photoacid generator represented by formula (2) in JP-A-2017-026980.

Among the photoacid generators, those containing an anion represented by the formula (1A′) or (1D) are particularly preferred because of their low acid diffusion and excellent solubility in solvents. Moreover, the compound represented by the formula (2') is particularly preferred because of its extremely low acid diffusion.

A sulfonium salt or iodonium salt containing an anion having an aromatic ring substituted with an iodine atom or a bromine atom can also be used as the photoacid generator. Such salts include those represented by the following formula (3-1) or (3-2).

In formulas (3-1) and (3-2), p is an integer satisfying 1≦p≦3. q and r are integers satisfying 1≤q≤5, 0≤r≤3 and 1≤q+r≤5. q is preferably an integer that satisfies 1≤q≤3, more preferably 2 or 3. r is preferably an integer that satisfies 0≦r≦2.

In formulas (3-1) and (3-2), X ^BI is an iodine atom or a bromine atom, and when p and/or q are 2 or more, they may be the same or different.

In formulas (3-1) and (3-2), L ¹ is a single bond, an ether bond or an ester bond, or a saturated hydrocarbylene group having 1 to 6 carbon atoms which may contain an ether bond or an ester bond. is. The saturated hydrocarbylene group may be linear, branched or cyclic.

In formulas (3-1) and (3-2), L ² is a single bond or a divalent linking group having 1 to 20 carbon atoms when p is 1, and carbon when p is 2 or 3. It is a (p+1)-valent linking group of numbers 1 to 20, which may contain an oxygen atom, a sulfur atom or a nitrogen atom.

In formulas (3-1) and (3-2), R ⁴⁰¹ is a hydroxy group, a carboxy group, a fluorine atom, a chlorine atom, a bromine atom or an amino group, or a fluorine atom, a chlorine atom, a bromine atom, a hydroxy group, an amino a hydrocarbyl group having 1 to 20 carbon atoms, a hydrocarbyloxy group having 1 to 20 carbon atoms, a hydrocarbylcarbonyl group having 2 to 20 carbon atoms, and a hydrocarbyloxycarbonyl group having 2 to 20 carbon atoms, which may contain a group or an ether bond , a hydrocarbylcarbonyloxy group having 2 to 20 carbon atoms or a hydrocarbylsulfonyloxy group having 1 to 20 carbon atoms, or -N(R ^401A )(R ^401B ), -N(R ^401C )-C(=O)-R ^401D or -N(R ^401C )-C(=O)-OR ^401D . R ^401A and R ^401B are each independently a hydrogen atom or a saturated hydrocarbyl group having 1 to 6 carbon atoms. R ^401C is a hydrogen atom or a C 1-6 saturated hydrocarbyl group, a halogen atom, a hydroxy group, a C 1-6 saturated hydrocarbyloxy group, a C 2-6 saturated hydrocarbylcarbonyl group, or a C 2 It may contain ˜6 saturated hydrocarbylcarbonyloxy groups. R ^401D is an aliphatic hydrocarbyl group having 1 to 16 carbon atoms, an aryl group having 6 to 12 carbon atoms or an aralkyl group having 7 to 15 carbon atoms, and is a halogen atom, a hydroxy group, or a saturated hydrocarbyloxy group having 1 to 6 carbon atoms. groups, saturated hydrocarbylcarbonyl groups of 2 to 6 carbon atoms or saturated hydrocarbylcarbonyloxy groups of 2 to 6 carbon atoms. The aliphatic hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. The hydrocarbyl group, hydrocarbyloxy group, hydrocarbylcarbonyl group, hydrocarbyloxycarbonyl group, hydrocarbylcarbonyloxy group and hydrocarbylsulfonyloxy group may be linear, branched or cyclic. When p and/or r is 2 or more, each R ⁴⁰¹ may be the same or different.

Among these, R ⁴⁰¹ includes a hydroxy group, -N(R ^401C )-C(=O)-R ^401D , -N(R ^401C )-C(=O)-OR ^401D , fluorine atom, chlorine Atoms, bromine atoms, methyl groups, methoxy groups and the like are preferred.

In formulas (3-1) and (3-2), Rf ¹ to Rf ⁴ are each independently a hydrogen atom, a fluorine atom or a trifluoromethyl group, and at least one of these is a fluorine atom or a trifluoromethyl group. It is a fluoromethyl group. Also, Rf ¹ and Rf ² may combine to form a carbonyl group. In particular, both Rf ³ and Rf ⁴ are preferably fluorine atoms.

In formulas (3-1) and (3-2), R ⁴⁰² to R ⁴⁰⁶ are each independently a halogen atom or a hydrocarbyl group having 1 to 20 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples are the same as those exemplified as the hydrocarbyl groups represented by R ¹⁰¹ to R ¹⁰⁵ in the description of formulas (1-1) and (1-2). Also, some or all of the hydrogen atoms in these groups may be substituted with a hydroxy group, a carboxy group, a halogen atom, a cyano group, a nitro group, a mercapto group, a sultone group, a sulfone group, or a sulfonium salt-containing group. , a portion of —CH ₂ — of these groups may be replaced with an ether bond, an ester bond, a carbonyl group, an amide bond, a carbonate bond or a sulfonate bond. Also, R ⁴⁰² and R ⁴⁰³ may combine with each other to form a ring together with the sulfur atom to which they are bonded. At this time, examples of the ring include those exemplified as the rings that can be formed by combining R ¹⁰¹ and R ¹⁰² together with the sulfur atom to which they are bonded in the explanation of formula (1-1).

Examples of the cation of the sulfonium salt represented by formula (3-1) include the same cations as those exemplified as the cation of the sulfonium salt represented by formula (1-1). Moreover, examples of the cation of the iodonium salt represented by formula (3-2) include the same cations as the cations of the iodonium salt represented by formula (1-2).

The anions of the onium salt represented by formula (3-1) or (3-2) include, but are not limited to, those shown below. In addition, in the following formula, X ^BI is the same as described above.

When the positive resist material of the present invention contains an additive-type acid generator, the content thereof is preferably 0.1 to 50 parts by mass, more preferably 1 to 40 parts by mass, per 100 parts by mass of the base polymer. The additive-type acid generators may be used singly or in combination of two or more. By including repeating units d1 to d3 in the base polymer and/or by including an additive-type acid generator, the positive resist material of the present invention can function as a chemically amplified positive resist material.

[Organic solvent]
The positive resist material of the invention may contain an organic solvent. The organic solvent is not particularly limited as long as it can dissolve each component described above and each component described later. As the organic solvent, ketones such as cyclohexanone, cyclopentanone, methyl-2-n-pentyl ketone, and 2-heptanone described in paragraphs [0144] to [0145] of JP-A-2008-111103;3 -Methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, diacetone alcohols; propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol mono Ethers such as ethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethyl lactate (L form), ethyl lactate (D form), ethyl lactate ( DL form) Esters such as ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, propylene glycol mono-tert-butyl ether acetate; γ-butyrolactone lactones such as

The content of the organic solvent in the positive resist material of the present invention is preferably 100 to 10,000 parts by mass, more preferably 200 to 8,000 parts by mass, per 100 parts by mass of the base polymer. The organic solvent may be used singly or in combination of two or more.

[Quencher]
The positive resist material of the present invention may contain a quencher. The quencher means a compound capable of trapping the acid generated by the acid generator in the resist material and thereby preventing the acid from diffusing into the unexposed area.

The quencher includes conventional basic compounds. Conventional basic compounds include primary, secondary, and tertiary aliphatic amines, mixed amines, aromatic amines, heterocyclic amines, nitrogen-containing compounds having carboxy groups, sulfonyl groups, , nitrogen-containing compounds having a hydroxy group, nitrogen-containing compounds having a hydroxyphenyl group, alcoholic nitrogen-containing compounds, amides, imides, carbamates, and the like. In particular, primary, secondary, and tertiary amine compounds described in paragraphs [0146] to [0164] of JP-A-2008-111103, particularly hydroxy groups, ether bonds, ester bonds, lactone rings, An amine compound having a cyano group or a sulfonate ester bond, or a compound having a carbamate group described in Japanese Patent No. 3790649 is preferred. By adding such a basic compound, the diffusion rate of acid in the resist film can be further suppressed and the shape can be corrected.

Examples of the quencher include onium salts such as sulfonium salts, iodonium salts and ammonium salts of sulfonic acids and carboxylic acids in which the α-position is not fluorinated, as described in JP-A-2008-158339. α-fluorinated sulfonic acids, imidic acids or methide acids are necessary for deprotecting the acid-labile groups of carboxylic acid esters, but salt exchange with non-α-fluorinated onium salts releases a sulfonic acid or carboxylic acid that is not fluorinated at the α-position. Sulfonic acids and carboxylic acids not fluorinated at the α-position function as quenchers because they do not undergo a deprotection reaction.

Such quenchers include, for example, a compound represented by the following formula (4) (a sulfonic acid onium salt in which the α-position is not fluorinated) and a compound represented by the following formula (5) (a carboxylic acid onium salts).

In formula (4), R ⁵⁰¹ is a hydrogen atom or a hydrocarbyl group having 1 to 40 carbon atoms which may contain a heteroatom, and the hydrogen atom bonded to the α-position carbon atom of the sulfo group is a fluorine atom. Or those substituted with a fluoroalkyl group are excluded.

Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, tert-pentyl group, n-pentyl group, n- Alkyl groups having 1 to 40 carbon atoms such as hexyl group, n-octyl group, 2-ethylhexyl group, n-nonyl group and n-decyl group; cyclopentyl group, cyclohexyl group, cyclopentylmethyl group, cyclopentylethyl group, cyclopentylbutyl group , cyclohexylmethyl group, cyclohexylethyl group, cyclohexylbutyl group, norbornyl group, tricyclo[5.2.1.0 ^2,6 ]decanyl group, adamantyl group, adamantylmethyl group, etc. group; alkenyl group having 2 to 40 carbon atoms such as vinyl group, allyl group, propenyl group, butenyl group and hexenyl group; cyclic unsaturated aliphatic hydrocarbyl group having 3 to 40 carbon atoms such as cyclohexenyl group; naphthyl group, alkylphenyl group (2-methylphenyl group, 3-methylphenyl group, 4-methylphenyl group, 4-ethylphenyl group, 4-tert-butylphenyl group, 4-n-butylphenyl group, etc.), dialkyl Phenyl group (2,4-dimethylphenyl group, 2,4,6-triisopropylphenyl group, etc.), alkylnaphthyl group (methylnaphthyl group, ethylnaphthyl group, etc.), dialkylnaphthyl group (dimethylnaphthyl group, diethylnaphthyl group, etc.) ) and other C6-40 aryl groups; and C7-40 aralkyl groups such as benzyl, 1-phenylethyl and 2-phenylethyl groups.

In addition, some of the hydrogen atoms in these groups may be substituted with groups containing heteroatoms such as oxygen, sulfur, nitrogen and halogen atoms, and some of -CH ₂ - in these groups may be substituted with a group containing a heteroatom such as an oxygen atom, a sulfur atom, or a nitrogen atom, resulting in a hydroxy group, a cyano group, a carbonyl group, an ether bond, an ester bond, a sulfonate ester bond, a carbonate bond , a lactone ring, a sultone ring, a carboxylic acid anhydride, a haloalkyl group, and the like. Hydrocarbyl groups containing heteroatoms include heteroaryl groups such as thienyl and indolyl groups; 4-hydroxyphenyl, 4-methoxyphenyl, 3-methoxyphenyl, 2-methoxyphenyl, 4-ethoxyphenyl, Alkoxyphenyl groups such as 4-tert-butoxyphenyl group and 3-tert-butoxyphenyl group; Alkoxynaphthyl groups such as methoxynaphthyl group, ethoxynaphthyl group, n-propoxynaphthyl group and n-butoxynaphthyl group; dialkoxynaphthyl group such as diethoxynaphthyl group; aryloxoalkyl groups such as -2-oxoethyl group;

In formula (5), R ⁵⁰² is a hydrocarbyl group having 1 to 40 carbon atoms which may contain a heteroatom. The hydrocarbyl group represented by R ⁵⁰² includes the same hydrocarbyl groups exemplified as the hydrocarbyl group represented by R ⁵⁰¹ . Further, as other specific examples, a trifluoromethyl group, a trifluoroethyl group, a 2,2,2-trifluoro-1-methyl-1-hydroxyethyl group, a 2,2,2-trifluoro-1-(trifluoromethyl fluorine-containing alkyl groups such as fluoromethyl)-1-hydroxyethyl group; and fluorine-containing aryl groups such as pentafluorophenyl group and 4-trifluoromethylphenyl group.

In formulas (4) and (5), Mq ⁺ is an onium cation. The onium cation is preferably a sulfonium cation, an iodonium cation or an ammonium cation, more preferably a sulfonium cation or an iodonium cation. Examples of the sulfonium cation include those exemplified as the cation of the sulfonium salt represented by formula (1-1). Examples of the iodonium cation include those exemplified as the cation of the iodonium salt represented by formula (1-2).

As a quencher, a sulfonium salt of an iodinated benzene ring-containing carboxylic acid represented by the following formula (6) can also be suitably used.

In formula (6), R ⁶⁰¹ is a hydroxy group, a fluorine atom, a chlorine atom, a bromine atom, an amino group, a nitro group, a cyano group, or some or all of the hydrogen atoms may be substituted with halogen atoms; a saturated hydrocarbyl group having 1 to 6 carbon atoms, a saturated hydrocarbyloxy group having 1 to 6 carbon atoms, a saturated hydrocarbylcarbonyloxy group having 2 to 6 carbon atoms or a saturated hydrocarbylsulfonyloxy group having 1 to 4 carbon atoms, or -N(R ^601A )-C(=O)-R ^601B or -N(R ^601A )-C(=O)-OR ^601B . R ^601A is a hydrogen atom or a saturated hydrocarbyl group having 1 to 6 carbon atoms. R ^601B is a C 1-6 saturated hydrocarbyl group or a C 2-8 unsaturated aliphatic hydrocarbyl group.

In formula (6), x' is an integer of 1-5. y' is an integer from 0 to 3; z' is an integer of 1-3. L ¹¹ is a single bond or a (z'+1)-valent linking group having 1 to 20 carbon atoms, such as an ether bond, a carbonyl group, an ester bond, an amide bond, a sultone ring, a lactam ring, a carbonate bond, a halogen atom, a hydroxy It may contain at least one selected from groups and carboxy groups. The saturated hydrocarbyl group, saturated hydrocarbyloxy group, saturated hydrocarbylcarbonyloxy group and saturated hydrocarbylsulfonyloxy group may be linear, branched or cyclic. When y' and/or z' are 2 or more, each R ⁶⁰¹ may be the same or different.

In formula (6), R ⁶⁰² , R ⁶⁰³ and R ⁶⁰⁴ are each independently a halogen atom or a hydrocarbyl group having 1 to 20 carbon atoms which may contain a heteroatom. Said hydrocarbyl groups may be saturated or unsaturated and may be linear, branched or cyclic. Specific examples thereof include the same hydrocarbyl groups as exemplified by R ¹⁰¹ to R ¹⁰⁵ in formulas (1-1) and (1-2). Also, some or all of the hydrogen atoms in these groups may be substituted with a hydroxy group, a carboxy group, a halogen atom, an oxo group, a cyano group, a nitro group, a sultone group, a sulfone group, or a sulfonium salt-containing group. , a portion of —CH ₂ — of these groups may be replaced with an ether bond, an ester bond, a carbonyl group, an amide bond, a carbonate bond or a sulfonate bond. In addition, R ⁶⁰² and R ⁶⁰³ may bond with each other to form a ring together with the sulfur atom to which they bond.

Specific examples of the compound represented by formula (6) include those described in JP-A-2017-219836.

Another example of the quencher is a polymer-type quencher described in JP-A-2008-239918. This enhances the rectangularity of the resist pattern by orienting it to the resist film surface. The polymer-type quencher also has the effect of preventing pattern film thinning and pattern top rounding when a protective film for immersion exposure is applied.

When the positive resist material of the present invention contains the quencher, its content is preferably 0 to 5 parts by mass, more preferably 0 to 4 parts by mass, relative to 100 parts by mass of the base polymer. The quenchers may be used singly or in combination of two or more.

[Other ingredients]
The positive resist material of the present invention may contain surfactants, dissolution inhibitors, water repellency improvers, acetylene alcohols and the like in addition to the components described above.

Examples of the surfactant include those described in paragraphs [0165] to [0166] of JP-A-2008-111103. By adding a surfactant, the coatability of the resist material can be further improved or controlled. When the positive resist material of the present invention contains the surfactant, the content thereof is preferably 0.0001 to 10 parts by mass with respect to 100 parts by mass of the base polymer. The said surfactant may be used individually by 1 type, and may be used in combination of 2 or more type.

By adding a dissolution inhibitor to the positive resist material of the present invention, the dissolution rate difference between the exposed area and the unexposed area can be further increased, and the resolution can be further improved. As the dissolution inhibitor, a compound having a molecular weight of preferably 100 to 1,000, more preferably 150 to 800 and containing two or more phenolic hydroxy groups in the molecule has an acid Compounds substituted with labile groups at a ratio of 0 to 100 mol% as a whole, or compounds containing a carboxy group in the molecule, hydrogen atoms of said carboxy groups are substituted with acid labile groups at an average ratio of 50 to 100 mol% as a whole. and substituted compounds. Specific examples include bisphenol A, trisphenol, phenolphthalein, cresol novolac, naphthalenecarboxylic acid, adamantanecarboxylic acid, and compounds in which the hydrogen atoms of the hydroxy group and carboxy group of cholic acid are substituted with acid labile groups. , for example, in paragraphs [0155] to [0178] of JP-A-2008-122932.

When the positive resist material of the present invention contains the dissolution inhibitor, the content thereof is preferably 0 to 50 parts by mass, more preferably 5 to 40 parts by mass, based on 100 parts by mass of the base polymer. The dissolution inhibitors may be used singly or in combination of two or more.

The water repellency improver improves the water repellency of the resist film surface, and can be used in liquid immersion lithography that does not use a topcoat. As the water repellency improver, a polymer containing a fluorinated alkyl group, a polymer containing a 1,1,1,3,3,3-hexafluoro-2-propanol residue with a specific structure, and the like are preferable. More preferred are those exemplified in JP-A-297590, JP-A-2008-111103, and the like. The water repellency improver must be dissolved in an alkaline developer or an organic solvent developer. The aforementioned specific water repellency improver having a 1,1,1,3,3,3-hexafluoro-2-propanol residue has good solubility in a developer. As a water repellency improver, a polymer containing a repeating unit containing an amino group or an amine salt is highly effective in preventing evaporation of the acid in the PEB and preventing poor opening of the hole pattern after development. When the positive resist material of the present invention contains a water repellency improver, the content thereof is preferably 0 to 20 parts by mass, more preferably 0.5 to 10 parts by mass, per 100 parts by mass of the base polymer. The water repellency improver may be used alone or in combination of two or more.

Examples of the acetylene alcohols include those described in paragraphs [0179] to [0182] of JP-A-2008-122932. When the positive resist material of the present invention contains acetylene alcohols, the content thereof is preferably 0 to 5 parts by mass with respect to 100 parts by mass of the base polymer. The acetylene alcohols may be used singly or in combination of two or more.

[Pattern formation method]
When using the positive resist material of the present invention for manufacturing various integrated circuits, known lithography techniques can be applied. For example, the pattern forming method includes the steps of forming a resist film on a substrate using the positive resist material described above, exposing the resist film to high-energy rays, and exposing the exposed resist film to a developing solution. and developing with.

First, the positive resist material of the present invention is applied to a substrate for manufacturing integrated circuits (Si, SiO ₂ , SiN, SiON, TiN, WSi, BPSG, SOG, organic antireflection film, etc.) or a substrate for manufacturing mask circuits (Cr , CrO, CrON, MoSi ₂ , SiO _{2 ,} etc.) by an appropriate coating method such as spin coating, roll coating, flow coating, dip coating, spray coating, doctor coating, etc. so that the coating film thickness is 0.01 to 2 μm. Apply to This is prebaked on a hot plate, preferably at 60 to 150° C. for 10 seconds to 30 minutes, more preferably at 80 to 120° C. for 30 seconds to 20 minutes, to form a resist film.

Then, the resist film is exposed using high energy rays. Examples of the high-energy rays include ultraviolet rays, deep ultraviolet rays, EB, EUV with a wavelength of 3 to 15 nm, i-rays, X-rays, soft X-rays, excimer laser light, γ-rays, synchrotron radiation, and the like. When using ultraviolet rays, deep ultraviolet rays, EUV, X-rays, soft X-rays, excimer laser light, γ-rays, synchrotron radiation, etc. as the high-energy rays, directly or using a mask for forming the desired pattern, Irradiation is performed so that the exposure amount is preferably about 1 to 200 mJ/cm ² , more preferably about 10 to 100 mJ/cm ² . When EB is used as the high-energy beam, the exposure dose is preferably about 0.1 to 100 μC/cm ² , more preferably about 0.5 to 50 μC/cm ² directly or a mask for forming the desired pattern. to draw. In addition, the positive resist material of the present invention is particularly suitable for fine patterning by KrF excimer laser light, ArF excimer laser light, EB, EUV, i-ray, X-ray, soft X-ray, γ-ray, and synchrotron radiation among high-energy rays. , and particularly suitable for fine patterning by EB or EUV.

After exposure, PEB may be performed on a hot plate or in an oven, preferably at 50 to 150° C. for 10 seconds to 30 minutes, more preferably at 60 to 120° C. for 30 seconds to 20 minutes.

Tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), preferably 0.1 to 10% by weight, more preferably 2 to 5% by weight, after exposure or PEB , Using an alkaline aqueous developer such as tetrabutylammonium hydroxide (TBAH), dip method, puddle method, spray method for 3 seconds to 3 minutes, preferably 5 seconds to 2 minutes By developing the exposed resist film by a conventional method such as the above, the light-irradiated portion dissolves in the developer and the unexposed portion does not dissolve, forming the intended positive pattern on the substrate.

A negative pattern can also be obtained by organic solvent development using the positive resist material. The developer used at this time includes 2-octanone, 2-nonanone, 2-heptanone, 3-heptanone, 4-heptanone, 2-hexanone, 3-hexanone, diisobutyl ketone, methylcyclohexanone, acetophenone, methylacetophenone, and propyl acetate. , butyl acetate, isobutyl acetate, pentyl acetate, butenyl acetate, isopentyl acetate, propyl formate, butyl formate, isobutyl formate, pentyl formate, isopentyl formate, methyl valerate, methyl pentenoate, methyl crotonate, ethyl crotonate, methyl propionate , ethyl propionate, ethyl 3-ethoxypropionate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, isobutyl lactate, pentyl lactate, isopentyl lactate, methyl 2-hydroxyisobutyrate, ethyl 2-hydroxyisobutyrate, methyl benzoate , ethyl benzoate, phenyl acetate, benzyl acetate, methyl phenylacetate, benzyl formate, phenylethyl formate, methyl 3-phenylpropionate, benzyl propionate, ethyl phenylacetate, 2-phenylethyl acetate and the like. These organic solvents may be used singly or in combination of two or more.

Rinsing is performed at the end of development. As the rinsing liquid, a solvent that is mixed with the developer and does not dissolve the resist film is preferable. As such solvents, alcohols having 3 to 10 carbon atoms, ether compounds having 8 to 12 carbon atoms, alkanes, alkenes, alkynes and aromatic solvents having 6 to 12 carbon atoms are preferably used.

Specifically, alcohols having 3 to 10 carbon atoms include n-propyl alcohol, isopropyl alcohol, 1-butyl alcohol, 2-butyl alcohol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, tert-pentyl alcohol, neopentyl alcohol, 2-methyl-1-butanol, 3-methyl-1-butanol, 3-methyl-3-pentanol, cyclopentanol, 1-hexanol, 2-hexanol , 3-hexanol, 2,3-dimethyl-2-butanol, 3,3-dimethyl-1-butanol, 3,3-dimethyl-2-butanol, 2-ethyl-1-butanol, 2-methyl-1-pentane Tanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol, 3-methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl -1-pentanol, 4-methyl-2-pentanol, 4-methyl-3-pentanol, cyclohexanol, 1-octanol and the like.

Examples of ether compounds having 8 to 12 carbon atoms include di-n-butyl ether, diisobutyl ether, di-sec-butyl ether, di-n-pentyl ether, diisopentyl ether, di-sec-pentyl ether and di-tert-pentyl. ether, di-n-hexyl ether and the like.

Examples of alkanes having 6 to 12 carbon atoms include hexane, heptane, octane, nonane, decane, undecane, dodecane, methylcyclopentane, dimethylcyclopentane, cyclohexane, methylcyclohexane, dimethylcyclohexane, cycloheptane, cyclooctane, cyclononane, and the like. be done. Alkenes having 6 to 12 carbon atoms include hexene, heptene, octene, cyclohexene, methylcyclohexene, dimethylcyclohexene, cycloheptene and cyclooctene. Alkynes having 6 to 12 carbon atoms include hexyne, heptine, octyne and the like.

Examples of aromatic solvents include toluene, xylene, ethylbenzene, isopropylbenzene, tert-butylbenzene, and mesitylene.

By performing rinsing, it is possible to reduce the collapse of the resist pattern and the occurrence of defects. Also, rinsing is not always essential, and by not rinsing, the amount of solvent used can be reduced.

The hole pattern and trench pattern after development can also be shrunk by thermal flow, RELACS technology, or DSA technology. A shrinking agent is applied onto the hole pattern, and the shrinking agent crosslinks on the surface of the resist film due to the diffusion of the acid catalyst from the resist film during baking, and the shrinking agent adheres to the sidewalls of the hole pattern. The baking temperature is preferably 70 to 180° C., more preferably 80 to 170° C., and the baking time is preferably 10 to 300 seconds to remove excess shrink agent and shrink the hole pattern.

EXAMPLES The present invention will be specifically described below with reference to Synthesis Examples, Examples and Comparative Examples, but the present invention is not limited to the following Examples.

[1] Synthesis of Monomer [Synthesis Example 1-1] Synthesis of Monomer M-1 In a reaction vessel, 8.0 g of 1,4-pentadiyn-3-ol, 8.60 g of triethylamine and 0.61 g of 4-dimethylaminopyridine was dissolved in 25 mL of acetonitrile, to which 11.0 g of methacrylic acid chloride was added dropwise while maintaining an internal temperature of 40-60°C. After the dropwise addition, the mixture was stirred at an internal temperature of 60° C. for 19 hours, then the reaction solution was cooled, and 20 mL of saturated aqueous sodium bicarbonate was added to stop the reaction. After extraction with a mixed solvent of 25 mL of toluene, 15 mL of hexane and 15 mL of ethyl acetate, normal aqueous work-up was performed, the solvent was distilled off, and vacuum distillation was performed to obtain a colorless and transparent monomer M-1. 14.2 g of oil was obtained.

[Synthesis Example 1-2] Synthesis of Monomer M-2 Monomer M-2 was prepared in the same manner as in Synthesis Example 1-1, except that 11.0 g of methacrylic acid chloride was changed to 13.9 g of styrene-4-carboxylic acid chloride. got

[2] Synthesis of base polymer Monomers M-1, M-2, cM-1, PM-1 to PM-4 and AM-1 to AM-11, FM-1 and FM-2 used for synthesis of base polymer are as follows: Further, the Mw of the polymer is a polystyrene-equivalent measured value by GPC using THF as a solvent.

[Synthesis Example 2-1] Synthesis of Polymer P-1 In a 2 L flask, 3.0 g of monomer M-1, 9.8 g of 1-isopropyl-1-cyclopentyl methacrylate, 3.6 g of 4-hydroxystyrene, And 40 g of THF was added as a solvent. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The resulting white solid was dried under reduced pressure at 60° C. to obtain polymer P-1. The composition of polymer P-1 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-2] Synthesis of Polymer P-2 In a 2 L flask, 3.0 g of monomer M-1, 7.8 g of 1-isopropyl-1-cyclopentyl methacrylate, 3.0 g of 4-hydroxystyrene, 11.0 g of monomer PM-2 and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The resulting white solid was dried under reduced pressure at 60° C. to obtain polymer P-2. The composition of polymer P-2 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-3] Synthesis of Polymer P-3 In a 2 L flask, 3.0 g of monomer M-1, 8.4 g of 1-methyl-1-cyclopentyl methacrylate, 1.8 g of 3-hydroxystyrene, 11.9 g of monomer PM-1 and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain Polymer P-3. The composition of polymer P-3 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-4] Synthesis of polymer P-4 In a 2 L flask, 3.0 g of monomer M-1, 8.4 g of 1-methyl-1-cyclopentyl methacrylate, 2.4 g of 3-hydroxystyrene, monomer PM 8.9 g of -3 and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The resulting white solid was dried under reduced pressure at 60° C. to obtain polymer P-4. The composition of polymer P-4 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-5] Synthesis of polymer P-5 In a 2 L flask, 3.7 g of monomer M-1, 8.9 g of monomer AM-1, 3.6 g of 3-hydroxystyrene, and monomer PM-2 were added. 11.0 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain Polymer P-5. The composition of polymer P-5 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-6] Synthesis of polymer P-6 In a 2 L flask, 3.0 g of monomer M-1, 4.6 g of monomer AM-2, 4.0 g of monomer AM-3, and 3-hydroxystyrene were added. 3.0 g, 11.0 g of monomer PM-2, and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain polymer P-6. The composition of polymer P-6 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-7] Synthesis of polymer P-7 In a 2 L flask, 4.4 g of monomer M-1, 6.6 g of monomer AM-4, 3.0 g of 3-hydroxystyrene, and monomer PM-2 were added. 11.0 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain polymer P-7. The composition of polymer P-7 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-8] Synthesis of polymer P-8 In a 2 L flask, 3.0 g of monomer M-1, 7.2 g of monomer AM-5, 3.0 g of 3-hydroxystyrene, and monomer PM-2 were added. 11.0 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain polymer P-8. The composition of polymer P-8 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-9] Synthesis of polymer P-9 In a 2 L flask, 3.0 g of monomer M-1, 7.1 g of monomer AM-6, 3.0 g of 3-hydroxystyrene, and monomer PM-2 were added. 11.0 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The resulting white solid was dried under reduced pressure at 60° C. to obtain polymer P-9. The composition of polymer P-9 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-10] Synthesis of polymer P-10 In a 2 L flask, 2.1 g of monomer M-2, 7.2 g of monomer AM-7, 4.2 g of 3-hydroxystyrene, and monomer PM-2 were added. 11.0 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain polymer P-10. The composition of polymer P-10 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-11] Synthesis of polymer P-11 In a 2 L flask, 3.0 g of monomer M-1, 7.1 g of monomer AM-6, 8.0 g of monomer FM-1, and monomer PM-2 were added. 11.0 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain polymer P-11. The composition of polymer P-11 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-12] Synthesis of polymer P-12 Into a 2 L flask, 3.0 g of monomer M-1, 7.1 g of monomer AM-6, 6.8 g of monomer FM-2, and monomer PM-2 were added. 8.0 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain polymer P-12. The composition of polymer P-12 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-13] Synthesis of polymer P-13 In a 2 L flask, 3.0 g of monomer M-1, 8.9 g of monomer AM-1, 3.0 g of 3-hydroxystyrene, and monomer PM-4 were added. 10.5 g and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The resulting white solid was dried under reduced pressure at 60° C. to obtain Polymer P-13. The composition of polymer P-13 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-14] Synthesis of polymer P-14 In a 2 L flask, 3.0 g of monomer M-1, 6.7 g of monomer AM-8, 3.8 g of monomer AM-9, and 3-hydroxystyrene were added. 3.0 g, 11.0 g of monomer PM-2, and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain polymer P-14. The composition of polymer P-14 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Synthesis Example 2-15] Synthesis of polymer P-15 In a 2 L flask, 3.0 g of monomer M-1, 5.6 g of monomer AM-10, 2.9 g of monomer AM-11, and 3-hydroxystyrene were added. 3.0 g, 11.0 g of monomer PM-2, and 40 g of THF as solvent were added. The reactor was cooled to -70°C under a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN was added as a polymerization initiator, the temperature was raised to 60° C., and the reaction was allowed to proceed for 15 hours. This reaction solution was added to 1 L of isopropyl alcohol, and the precipitated white solid was separated by filtration. The obtained white solid was dried under reduced pressure at 60° C. to obtain Polymer P-15. The composition of polymer P-15 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Comparative Synthesis Example 1] Synthesis of Comparative Polymer cP-1 A comparative polymer cP-1 was obtained in the same manner as in Synthesis Example 2-1, except that the monomer M-1 was not used. The composition of Comparative Polymer cP-1 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Comparative Synthesis Example 2] Synthesis of Comparative Polymer cP-2 Comparative polymer cP-2 was obtained in the same manner as in Synthesis Example 2-1, except that monomer cM-1 was used instead of monomer M-1. The composition of Comparative Polymer cP-2 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[Comparative Synthesis Example 3] Synthesis of Comparative Polymer cP-3 A comparative polymer cP-3 was obtained in the same manner as in Synthesis Example 2-2, except that the monomer M-1 was not used. The composition of Comparative Polymer cP-3 was confirmed by ¹³ C-NMR and ¹ H-NMR, and Mw and Mw/Mn by GPC.

[3] Preparation of positive resist material and its evaluation [Examples 1 to 16, Comparative Examples 1 to 3]
(1) Preparation of positive resist material As a surfactant, a solution of each component with the composition shown in Table 1 was dissolved in a solvent in which 50 ppm of the surfactant PolyFox PF-636 manufactured by Omnova Co., Ltd. was dissolved. A positive resist material was prepared by filtering through a high density polyethylene filter.

In Table 1, each component is as follows.
・Organic solvent: PGMEA (propylene glycol monomethyl ether acetate)
DAA (diacetone alcohol)
EL (L-ethyl lactate)

・Acid generator: PAG-1, PAG-2

・Quencher: Q-1, Q-2

(2) EUV lithography evaluation For each positive resist material shown in Table 1, a silicon-containing spin-on hard mask SHB-A940 (silicon content: 43% by mass) manufactured by Shin-Etsu Chemical Co., Ltd. was formed with a film thickness of 20 nm. It was spin-coated on the substrate and pre-baked at 105° C. for 60 seconds using a hot plate to prepare a resist film with a thickness of 60 nm. The resist film is exposed using ASML's EUV scanner NXE3400 (NA 0.33, σ 0.9/0.6, quadruple pole illumination, wafer dimension pitch 46 nm, +20% bias hole pattern mask), and on a hot plate PEB was performed at the temperature shown in Table 1 for 60 seconds, and development was performed with a 2.38% by mass TMAH aqueous solution for 30 seconds to obtain a hole pattern with a dimension of 23 nm.
The sensitivity was obtained by measuring the amount of exposure when each hole was formed with a size of 23 nm. Also, the dimensions of 50 holes were measured using a critical dimension SEM (CG6300) manufactured by Hitachi High-Tech Co., Ltd., and the triple value (3σ) of the standard deviation (σ) calculated from the results was obtained as CDU. The results are also shown in Table 1.

From the results shown in Table 1, the positive resist material of the present invention using a base polymer containing a repeating unit having two triple bonds and a repeating unit whose solubility in an alkaline developer is improved by an acid exhibits good CDU. there were.

Claims (12)

A positive resist material comprising a base polymer containing a repeating unit a having two triple bonds and a repeating unit b whose solubility in an alkaline developer is improved by acid. 2. The positive resist material according to claim 1, wherein the repeating unit a is represented by the following formula (a).

(In the formula, ^RA is a hydrogen atom or a methyl group.
X ¹ is an ester bond or a phenylene group.
X ² is a single bond, a phenylene group or an aliphatic hydrocarbylene group having 1 to 10 carbon atoms, and part of —CH ₂ — constituting the aliphatic hydrocarbylene group is an ether bond, an ester bond or It may be substituted with a sulfonate ester bond.
^X3 is a single bond, ether bond, ester bond, carbonate bond or urethane bond.
R ¹ and R ² are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a phenyl group. ) 3. The repeating unit b according to claim 1, wherein the repeating unit b is a repeating unit b1 in which the hydrogen atom of the carboxy group is substituted with an acid-labile group, or a repeating unit b2 in which the hydrogen atom of the phenolic hydroxy group is substituted with an acid-labile group. of positive resist materials. 4. The positive resist material according to claim 3, wherein the repeating unit b1 is represented by the following formula (b1) and the repeating unit b2 is represented by the following formula (b2).

(In the formula, each ^RA is independently a hydrogen atom or a methyl group.
Y ¹ is a single bond, a phenylene group or a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond, an ether bond or a lactone ring.
Y ² is a single bond, an ester bond or an amide bond.
Y ³ is a single bond, an ether bond or an ester bond.
R ¹¹ and R ¹² are each independently an acid labile group.
R ¹³ is a fluorine atom, a trifluoromethyl group, a cyano group or a saturated hydrocarbyl group having 1 to 6 carbon atoms.
R ¹⁴ is a single bond or an alkanediyl group having 1 to 6 carbon atoms, and the alkanediyl group may contain an ether bond or an ester bond.
a is 1 or 2; b is an integer from 0 to 4; However, 1≤a+b≤5. ) The base polymer further contains a hydroxy group, a carboxyl group, a lactone ring, a carbonate bond, a thiocarbonate bond, a carbonyl group, a cyclic acetal group, an ether bond, an ester bond, a sulfonate ester bond, a cyano group, an amide bond, -O- The positive resist material according to any one of claims 1 to 4, which contains a repeating unit c containing an adhesive group selected from C(=O)-S- and -O-C(=O)-NH-. . The positive resist material according to any one of claims 1 to 5, wherein the base polymer further contains a repeating unit represented by any one of the following formulas (d1) to (d3).

(In the formula, each ^RA is independently a hydrogen atom or a methyl group.
Z ¹ is a single bond, an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a naphthylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, or —O—Z ¹¹ —, —C (=O)-OZ ¹¹ - or -C(=O)-NH-Z ¹¹ -. Z ¹¹ is an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a naphthylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, and is a carbonyl group, an ester bond, an ether bond or a hydroxy group; may contain
Z ² is a single bond or an ester bond.
Z ³ is a single bond, -Z ³¹ -C(=O)-O-, -Z ³¹ -O- or -Z ³¹ -OC(=O)-. Z ³¹ is an aliphatic hydrocarbylene group having 1 to 12 carbon atoms, a phenylene group, or a group having 7 to 18 carbon atoms obtained by combining these groups, a carbonyl group, an ester bond, an ether bond, a bromine atom or an iodine atom; may contain
Z ⁴ is a methylene group, a 2,2,2-trifluoro-1,1-ethanediyl group or a carbonyl group.
Z ⁵ is a single bond, a methylene group, an ethylene group, a phenylene group, a fluorinated phenylene group, a phenylene group substituted with a trifluoromethyl group, -O-Z ⁵¹ -, -C(=O)-O-Z ⁵¹ - or -C(=O)-NH-Z ⁵¹ -. Z ⁵¹ is an aliphatic hydrocarbylene group having 1 to 6 carbon atoms, a phenylene group, a fluorinated phenylene group or a phenylene group substituted with a trifluoromethyl group, a carbonyl group, an ester bond, an ether bond, a halogen atom or It may contain a hydroxy group.
R ²¹ to R ²⁸ are each independently a halogen atom or a hydrocarbyl group having 1 to 20 carbon atoms which may contain a heteroatom. Also, R ²³ and R ²⁴ or R ²⁶ and R ²⁷ may combine with each other to form a ring together with the sulfur atom to which they are bonded.
M ⁻ is the non-nucleophilic counterion. ) 7. The positive resist material according to any one of claims 1 to 6, further comprising an acid generator. The positive resist material according to any one of claims 1 to 7, further comprising an organic solvent. The positive resist material according to any one of claims 1 to 8, further comprising a quencher. 10. The positive resist material according to any one of claims 1 to 9, further comprising a surfactant. forming a resist film on a substrate using the positive resist material according to any one of claims 1 to 10; exposing the resist film to high-energy radiation; and a step of developing with a developer. 12. The pattern forming method according to claim 11, wherein the high-energy beam is i-ray, KrF excimer laser beam, ArF excimer laser beam, electron beam, or extreme ultraviolet rays having a wavelength of 3 to 15 nm.