JP2023035855A - Electrostatic chuck and processing apparatus - Google Patents

Abstract

To provide an electrostatic chuck and a processing apparatus capable of maintaining an effect of suppressing arc discharge for a long period of time.SOLUTION: An electrostatic chuck comprises: a bonding part provided between a substrate and a base plate; a gas introduction path having a first hole part located on the substrate, a second hole part located on the base plate, and a third hole part located on the bonding part; a counterbore part provided on the first hole part; a porous part, provided on the counterbore part, which has a first surface on the third hole part side and a second surface on the opposite side to the first surface; and an elastic body which is provided so as to face an end of the bonding part on the third hole part side. A lateral surface of the porous part has a first lateral part on the first surface side. In a region of the first lateral part making contact at least with the first surface, there is provided a first inclination part which is inclined. The first surface overlaps the bonding part and the elastic body. The porous part comes into contact with the elastic body at the first inclination part.SELECTED DRAWING: Figure 2

Description

Aspects of the present invention relate to electrostatic chucks and processing apparatus.

An electrostatic chuck having a ceramic dielectric substrate such as alumina and an electrode applies electrostatic chucking power to the electrode to chuck a substrate such as a silicon wafer by electrostatic force. In such an electrostatic chuck, an inert gas such as helium (He) is flowed between the front surface of the ceramic dielectric substrate and the back surface of the substrate to be attracted, and the temperature of the substrate to be attracted is changed. is controlling

2. Description of the Related Art For example, some apparatuses for processing a substrate, such as a CVD (Chemical Vapor Deposition) apparatus, a sputtering apparatus, an ion implantation apparatus, and an etching apparatus, accompany a temperature rise of the substrate during the processing. In an electrostatic chuck used in such an apparatus, an inert gas such as He is caused to flow between a ceramic dielectric substrate and a substrate to be adsorbed, and the substrate is brought into contact with the inert gas to raise the temperature of the substrate. is suppressed.

In an electrostatic chuck that controls the substrate temperature using an inert gas such as He, a hole for introducing an inert gas such as He (gas introduction path) is provided in a ceramic dielectric substrate and a base plate that supports the ceramic dielectric substrate. ) is provided. Also, the ceramic dielectric substrate is provided with a through-hole communicating with the gas introduction path of the base plate. Thereby, the inert gas introduced from the gas introduction path of the base plate is led to the back surface of the substrate through the through holes of the ceramic dielectric substrate.

Here, when a substrate is processed in the apparatus, discharge (arc discharge) may occur from the plasma in the apparatus toward the metal base plate. The gas introduction path of the base plate and the through hole of the ceramic dielectric substrate are likely to serve as discharge paths. Therefore, there is a technique of improving resistance to arc discharge (dielectric strength voltage, etc.) by providing a porous portion in the gas introduction path of the base plate or the through hole of the ceramic dielectric substrate. For example, in Patent Document 1, a sintered ceramic porous body is provided in the gas introduction path, and the structure and membrane pores of the sintered ceramic porous body are used as the gas flow path to improve the insulation in the gas introduction path. An electrostatic chuck is disclosed. Further, Patent Document 2 discloses an electrostatic chuck in which a ceramic porous body is arranged in a gas introduction path of a base plate and through holes of a ceramic dielectric substrate. Further, in Patent Document 3, a ceramic porous body is arranged in a gas introduction path of a base plate or a through hole of a ceramic dielectric substrate, and an adhesive layer for bonding the base plate and the ceramic dielectric substrate includes a gas introduction path. and/or disposing a protective material at a portion exposed to the through-hole to suppress erosion of the adhesive.
In such an electrostatic chuck, it is desired to maintain the effect of suppressing arc discharge for a long period of time.

JP 2010-123712 A US2017/0352568 Japanese Patent Application Laid-Open No. 2021-057468

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electrostatic chuck and a processing apparatus capable of maintaining the effect of reducing arc discharge for a long period of time.

A first invention comprises a ceramic dielectric substrate having a first main surface on which an object to be attracted is placed and a second main surface opposite to the first main surface, and the ceramic dielectric substrate. a base plate that supports and has an upper surface on the side of the ceramic dielectric substrate and a lower surface on the opposite side to the surface; a junction provided between the ceramic dielectric substrate and the base plate; a gas introduction passage penetrating through the substrate, the base plate and the joint, the first hole located in the ceramic dielectric substrate, the second hole located in the base plate, and the joint located in the joint a gas introduction path having a third hole, a counterbored portion provided in the first hole, a first surface on the side of the third hole, and a second surface opposite to the first surface. and a ceramic porous portion provided in the counterbored portion, and an elastic body provided facing an end portion of the joint portion on the third hole side, The material further has a side surface connecting the first surface and the second surface, the side surface comprising a first side portion on the side of the first surface, a second side portion on the side of the second surface, and a third side portion between the first side portion and the second side portion, wherein a direction from the base plate toward the ceramic dielectric substrate is defined as a first direction and substantially orthogonal to the first direction. A first inclined portion that is inclined with respect to the first direction is provided in a region of the first side portion that is in contact with at least the first surface, and the second direction is the direction in which the In view, the electrostatic chuck is configured such that the first surface overlaps the joint portion and the elastic body, and the ceramic porous portion is configured to contact the elastic body at the first inclined portion.

During use, the electrostatic chuck may be exposed to large temperature changes causing thermal expansion or contraction of the ceramic dielectric substrate and/or base plate. At this time, thermal stress is also applied to the ceramic porous portion arranged in the first hole portion of the gas introduction passage, and the porous portion may expand and deform toward the third hole portion. According to this electrostatic chuck, the elastic body is provided, and the elastic body is connected to the first inclined portion provided in the region in contact with the first surface in the first side portion on the first surface side of the ceramic porous portion. configured to touch. Therefore, by absorbing the deformation of the ceramic porous portion by the first inclined portion and the elastic body, it is possible to suppress breakage of the ceramic porous portion. Therefore, the effect of suppressing arc discharge can be maintained for a long period of time. In addition, since the elastic body is arranged in the third hole so as to face the end of the joint, it is possible to suppress the generation of particles due to plasma corrosion of the end when the electrostatic chuck is used. In addition, since the first surface overlaps the joint portion and the elastic body when viewed in the second direction, arcing resistance can be enhanced.

A second invention is based on the first invention, wherein the ceramic porous portion has a gas-permeable porous portion and a dense portion denser than the porous portion, and the dense portion is the porous portion. and the first inclined portion is provided in the dense portion.

According to this electrostatic chuck, since the strength of the slant portion in contact with the elastic body is increased, damage to the ceramic porous portion can be effectively suppressed, and the effect of reducing arc discharge can be maintained for a long period of time.

A third invention is the electrostatic chuck according to the first or second invention, wherein the first side portion comprises the first inclined portion.

According to this electrostatic chuck, breakage of the ceramic porous portion can be effectively suppressed, and the effect of reducing arc discharge can be maintained for a long period of time.

A fourth invention is the third invention, further comprising a second inclined portion which is at least part of the third side portion and which is continuous with the first inclined portion,
In the electrostatic chuck, a fixing portion for fixing the ceramic porous portion to the counterbored portion is provided between the counterbore portion and the second inclined portion.

According to this electrostatic chuck, since the fixed portion can be arranged at a position away from the plasma, erosion of the fixed portion by the plasma can be suppressed, and the effect of suppressing arc discharge can be maintained for a long period of time.

A fifth invention is the electrostatic chuck according to the fourth invention, wherein the length of the second side portion along the second direction is approximately the same as the length of the counterbore portion along the second direction. .

According to this electrostatic chuck, since there is almost no gap between the second side portion of the ceramic porous portion that is closest to the plasma and the counterbore portion, the effect of suppressing arc discharge reduction can be maintained for a long period of time. .

In a sixth invention, in the first or second invention, the length of a portion of the elastic body in contact with the first inclined portion along the first direction is along the first direction of the joint portion. Larger than length, electrostatic chuck.

According to this electrostatic chuck, the elastic body acts as a physical barrier between the edge of the joint and the ceramic porous part, so even if the joint is corroded by plasma and particles are generated, , it is possible to suppress the decrease in gas flow rate over time due to the particles penetrating into the ceramic porous portion. Therefore, the effect of suppressing arc discharge can be maintained for a long time.

A seventh invention is the electrostatic chuck according to the first or second invention, wherein the elastic body is annular, and the first surface is surrounded by the elastic body when viewed from the first direction.

According to this electrostatic chuck, the positioning of the elastic body is facilitated, and the effect of suppressing breakage of the ceramic porous portion by the elastic body can be more reliably received.

An eighth invention is the electrostatic chuck according to the first or second invention, wherein the elastic body includes at least one of polytetrafluoroethylene and polyimide.

According to this electrostatic chuck, damage to the ceramic porous portion can be effectively suppressed, and the effect of suppressing arc discharge reduction can be maintained for a long period of time.

A ninth aspect of the present invention is a processing apparatus comprising any one of the electrostatic chucks described above and a supply unit capable of supplying a gas to a gas introduction path provided in the electrostatic chuck. . According to this processing apparatus, arc discharge can be reduced.

A tenth aspect of the invention provides a ceramic dielectric substrate having a first principal surface on which an object to be attracted is placed and a second principal surface opposite to the first principal surface, and the ceramic dielectric substrate. a base plate that supports and has an upper surface on the side of the ceramic dielectric substrate and a lower surface on the opposite side to the upper surface; a junction provided between the ceramic dielectric substrate and the base plate; A gas introduction path penetrating through a dielectric substrate, the base plate and the junction, the first hole located in the ceramic dielectric substrate, the second hole located in the base plate, and the junction located in the junction. a gas introduction path having a third hole, a counterbored portion provided in the first hole or the second hole, a first surface on the side of the third hole, and the first surface and a second surface on the opposite side, a ceramic porous portion provided in the counterbored portion, and an elastic body provided to face the end portion of the joint portion on the third hole side. , wherein a direction from the base plate to the ceramic dielectric substrate is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, the ceramic porous portion is configured to extend along the first surface. a first ceramic portion having said second surface; and a third ceramic portion located between said first ceramic portion and said second ceramic portion in said first direction; The length of the first ceramic portion along the second direction is shorter than the length of the third ceramic portion along the second direction. overlapping the elastic body, at least a portion of the elastic body overlapping the third ceramic portion in the first direction, the elastic body being in contact with at least one of the first ceramic portion and the third ceramic portion; It is an electrostatic chuck.

According to this electrostatic chuck, deformation of the ceramic porous portion due to heat is absorbed by the elastic body, thereby suppressing breakage of the ceramic porous portion. Therefore, the effect of suppressing arc discharge can be maintained for a long period of time.

In an eleventh aspect based on the tenth aspect, the ceramic porous portion has a side surface connecting the first surface and the second surface, and the side surface is a first side portion on the first surface side. and a second side on the second face side and a third side between the first side and the second side, wherein at least the first side of the first side A first inclined portion inclined with respect to the first direction is provided in a region in contact with the first surface, and the ceramic porous portion is an electrostatic chuck in contact with the elastic body at the first inclined portion.

According to this electrostatic chuck, deformation of the ceramic porous portion due to heat is absorbed by the elastic body, thereby suppressing breakage of the ceramic porous portion.

In a twelfth aspect based on the tenth aspect, the electrostatic chuck of the tenth aspect is characterized in that the third ceramic portion has an extension surface extending along the second direction, and the elastic body is in contact with the extension surface. is.

According to this electrostatic chuck, deformation of the ceramic porous portion due to heat is absorbed by the elastic body, thereby suppressing breakage of the ceramic porous portion.

In a thirteenth invention, in any one of the tenth to twelfth inventions, the ceramic porous portion has a porous portion having gas permeability and a dense portion denser than the porous portion, The dense portion is arranged so as to cover the outer periphery of the porous portion, and the elastic body is an electrostatic chuck that is in contact with the dense portion.

According to this electrostatic chuck, since the strength of the portion in contact with the elastic body is increased, damage to the ceramic porous portion can be effectively suppressed, and the effect of reducing arc discharge can be maintained for a long period of time.

In a fourteenth aspect based on any one of the tenth to twelfth aspects, the length of the second ceramic portion along the second direction is substantially the same as the length of the counterbored portion along the second direction. There is an electrostatic chuck.

According to this electrostatic chuck, since the gap between the ceramic porous portion and the counterbore portion can be suppressed, the effect of suppressing arc discharge reduction can be maintained for a long period of time.

A fifteenth invention is the electrostatic chuck according to any one of the tenth to twelfth inventions, wherein the elastic body is compressed and deformed in the first direction.

According to this electrostatic chuck, even if particles are generated from the joint portion, it is possible to prevent the particles from reaching the ceramic porous portion.

A sixteenth invention is the electrostatic chuck according to any one of the tenth to twelfth inventions, wherein the elastic body is annular, and the first surface is surrounded by the elastic body when viewed from the first direction. .

According to this electrostatic chuck, the positioning of the elastic body is facilitated, and the effect of suppressing breakage of the ceramic porous portion by the elastic body can be more reliably received.

A seventeenth invention is the electrostatic chuck according to any one of the tenth to twelfth inventions, wherein the elastic body includes at least one of polytetrafluoroethylene and polyimide.

According to this electrostatic chuck, damage to the ceramic porous portion can be effectively suppressed, and the effect of suppressing arc discharge reduction can be maintained for a long period of time.

An eighteenth invention comprises the electrostatic chuck according to any one of claims 10 to 12, and a supply unit capable of supplying gas to a gas introduction path provided in the electrostatic chuck. A processing device characterized by:
According to this processing apparatus, arc discharge can be reduced.

An aspect of the present invention provides an electrostatic chuck and a processing apparatus capable of maintaining the effect of reducing arc discharge for a long period of time.

1 is a schematic cross-sectional view illustrating an electrostatic chuck according to this embodiment; FIG. 1 is a schematic diagram illustrating an electrostatic chuck according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating a ceramic porous portion according to an embodiment; FIG. FIG. 10 is a schematic diagram illustrating an electrostatic chuck according to another embodiment; 1 is a schematic diagram illustrating a processing apparatus according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to this embodiment; FIG. 1 is a schematic diagram illustrating a processing apparatus according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to an embodiment; FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to an embodiment; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the same reference numerals are given to the same constituent elements, and detailed description thereof will be omitted as appropriate.
In each figure, the direction from the base plate 50 to the ceramic dielectric substrate 11 is the Z direction (corresponding to an example of the first direction), and one of the directions substantially perpendicular to the Z direction is the Y direction (second direction). A direction substantially orthogonal to the Z direction and the Y direction is defined as an X direction (corresponding to an example of a second direction).

(electrostatic chuck)
FIG. 1 is a schematic cross-sectional view illustrating an electrostatic chuck according to this embodiment.
As shown in FIG. 1, an electrostatic chuck 110 according to this embodiment includes a ceramic dielectric substrate 11, a base plate 50, and a porous portion 90. As shown in FIG. In this example, electrostatic chuck 110 further includes porous portion 70 .

The ceramic dielectric substrate 11 is, for example, a plate-like substrate made of sintered ceramic. For example, _the ceramic dielectric substrate 11 contains aluminum oxide ( _Al2O3 ). For example, the ceramic dielectric substrate 11 is made of high-purity aluminum oxide. The concentration of aluminum oxide in the ceramic dielectric substrate 11 is, for example, 99 atomic percent (atomic %) or more and 100 atomic % or less. By using high-purity aluminum oxide, the plasma resistance of the ceramic dielectric substrate 11 can be improved. The ceramic dielectric substrate 11 has a first principal surface 11a on which an object W (object to be attracted) is placed, and a second principal surface 11b opposite to the first principal surface 11a. The object W is, for example, a semiconductor substrate such as a silicon wafer.

Electrodes 12 are provided on the ceramic dielectric substrate 11 . Electrode 12 is provided between first main surface 11 a and second main surface 11 b of ceramic dielectric substrate 11 . Electrode 12 is formed to be inserted into ceramic dielectric substrate 11 . A power source 210 is electrically connected to the electrode 12 via a connection portion 20 and a wiring 211 . By applying a voltage for attracting and holding to the electrode 12 from the power supply 210, electric charge is generated on the first main surface 11a side of the electrode 12, and the object W can be attracted and held by electrostatic force.

The shape of the electrode 12 is a thin film along the first main surface 11 a and the second main surface 11 b of the ceramic dielectric substrate 11 . The electrode 12 is an attraction electrode for attracting and holding the object W. As shown in FIG. Electrode 12 may be monopolar or bipolar. The electrode 12 illustrated in FIG. 1 is of a bipolar type, and two electrodes 12 are provided on the same plane. In addition to the electrode 12, the ceramic dielectric substrate 11 may be provided with an electrode for applying high frequency and a heater electrode.

The electrode 12 is provided with a connecting portion 20 extending toward the second main surface 11 b of the ceramic dielectric substrate 11 . The connecting portion 20 is, for example, a via (solid type) or a via hole (hollow type) electrically connected to the electrode 12 . Connections 20 may be metal terminals connected by a suitable method such as brazing.

The base plate 50 is a member that supports the ceramic dielectric substrate 11 . The base plate 50 has an upper surface 50u on the ceramic dielectric substrate 11 side and a lower surface 50d opposite to the upper surface 50u. The ceramic dielectric substrate 11 is fixed on the base plate 50 by the joints 60 illustrated in FIG. 2(a). The joint 60 can be, for example, a cured silicone adhesive. In this example, the upper surface 50 u of the base plate 50 and the second main surface 11 b of the ceramic dielectric substrate 11 are configured to be in contact with the joint portion 60 .

The base plate 50 is made of metal, for example. The base plate 50 is divided into, for example, an aluminum upper portion 50a and a lower portion 50b, and a communicating passage 55 is provided between the upper portion 50a and the lower portion 50b. One end side of the communication path 55 is connected to the input path 51 , and the other end side of the communication path 55 is connected to the output path 52 . The base plate 50 may have a sprayed portion (not shown) at the end on the second main surface 11b side. The sprayed portion is formed by, for example, thermal spraying. The sprayed portion may constitute the end surface (upper surface 50u) of the base plate 50 on the second main surface 11b side. The thermal spraying part is provided as required and can be omitted.

The base plate 50 also serves to adjust the temperature of the electrostatic chuck 110 . For example, when cooling the electrostatic chuck 110 , the cooling medium is introduced from the input path 51 , passed through the communication path 55 , and discharged from the output path 52 . Thereby, the heat of the base plate 50 can be absorbed by the cooling medium, and the ceramic dielectric substrate 11 attached thereon can be cooled. On the other hand, when the electrostatic chuck 110 is to be kept warm, it is also possible to put a heat retaining medium in the communicating path 55 . It is also possible to incorporate a heating element in the ceramic dielectric substrate 11 or the base plate 50 . By adjusting the temperature of the base plate 50 and the ceramic dielectric substrate 11, the temperature of the object W attracted and held by the electrostatic chuck 110 can be adjusted.

Dots 13 are provided on the first main surface 11a side of the ceramic dielectric substrate 11 as necessary, and grooves 14 are provided between the dots 13 . That is, the first main surface 11a is an uneven surface and has concave portions and convex portions. The convex portions of the first main surface 11 a correspond to the dots 13 , and the concave portions of the first main surface 11 a correspond to the grooves 14 . The groove 14 can extend continuously within the XY plane, for example. Thereby, a gas such as He can be distributed over the entire first main surface 11a. A space is formed between the back surface of the object W placed on the electrostatic chuck 110 and the first main surface 11 a including the grooves 14 .

By appropriately selecting the height of the dots 13, the depth of the grooves 14, the area ratio of the dots 13 and the grooves 14, the shape, etc., the temperature of the object W and the particles adhering to the object W can be controlled in a preferable state. can be done.

A gas introduction path 53 is provided so as to penetrate ceramic dielectric substrate 11 , base plate 50 and joint portion 60 . The gas introduction path 53 has a first hole 53 a positioned in the ceramic dielectric substrate 11 , a second hole 53 b positioned in the base plate 50 , and a third hole 53 c positioned in the joint 60 . The second hole portion 53b is provided so as to penetrate the base plate 50, for example. The second hole portion 53b may pass through the base plate 50 linearly, or may branch in the middle. The gas introduction paths 53 may be provided at multiple locations on the base plate 50 .

The first hole portion 53a is connected to the groove 14, for example. The first hole portion 53a is provided from the second main surface 11b to the first main surface 11a. That is, the first hole portion 53a extends in the Z direction from the second main surface 11b to the first main surface 11a and penetrates the ceramic dielectric substrate 11. As shown in FIG.

The second hole portion 53b communicates with the first hole portion 53a through the third hole portion 53c. The gas (such as helium (He)) that has flowed into the second hole portion 53b passes through the second hole portion 53b, passes through the third hole portion 53c, and then flows into the first hole portion 53a.

The gas that has flowed into the first hole portion 53a flows into the space provided between the object W and the first main surface 11a including the groove 14 after passing through the first hole portion 53a. This allows the object W to be directly cooled by the gas.

A counterbored portion 53s is provided in at least one of the first hole portion 53a and the second hole portion 53b. The porous portion 90 and/or the porous portion 70 are arranged in the counterbored portion 53s.
The first hole portion 53a has a first portion 53aa including the first main surface 11a and a second portion 53ab including the second main surface 11b. A further portion may be provided between the first portion 53aa and the second portion 53ab. The counterbored portion 53s is provided, for example, in the second portion 53ab.
The second hole portion 53b has a third portion 53bu including the upper surface 50u and a fourth portion 53bd including the lower surface 50d. A further portion may be provided between the third portion 53bu and the fourth portion 53bd. The counterbored portion 53s is provided, for example, in the third portion 53bu.

The porous portion 90 and/or the porous portion 70 are provided in the counterbored portion 53s. The porous portion 90 has a first surface 90a on the side of the third hole portion 53c and a second surface 90b opposite to the first surface 90a. The porous portion 70 has a third surface 70a on the side of the third hole portion 53c and a fourth surface 70b opposite to the third surface 70a. In this specification, the case where the porous portion is arranged inside the ceramic dielectric substrate 11 (the first hole portion 53a) is the case where the porous portion 90 is arranged inside the base plate 50 (the second hole portion 53b). is the porous portion 70 .

In the gas introduction path 53, the cooling gas such as helium flows through the second hole portion 53b, the third hole portion 53c, and the first hole portion 53a in this order. 11a side. When using an electrostatic chuck, the plasma is positioned on the first main surface 11a side. Therefore, when the ceramic porous portion 90 is arranged in the first hole portion 53a and the ceramic porous portion 70 is arranged in the second hole portion 53b, respectively, the arcing of the ceramic porous portion 90 arranged closer to the plasma It is desirable to have higher resistance than the ceramic porous portion 70 . As an example, the pore diameter of the first porous portion 91 (details will be described later) of the porous portion 90 is made smaller than the pore diameter of the second porous portion 71 of the porous portion 70, and the porosity of the first porous portion 91 is set to the second porosity. For example, the porosity of the portion 71 is made smaller than that of the portion 71 . In this case, since the gas permeability of the porous portion 70 positioned upstream of the gas flow can be made higher than the gas permeability of the porous portion 90 positioned downstream of the gas flow, gas flow rate control can be improved. It is also preferable from the point of view. Note that the porous portion 70 may not be provided.

FIG. 2 is a schematic diagram illustrating the electrostatic chuck according to the embodiment.
FIG. 3 is a schematic cross-sectional view illustrating the ceramic porous portion according to the embodiment.
FIG. 2 is a schematic cross-sectional view illustrating the periphery of the porous portion 90 and the porous portion 70, and corresponds to an enlarged view of the area A shown in FIG.

To avoid complication, the dots 13 (see, for example, FIG. 1) are omitted in FIG.

As shown in FIG. 2, in this example, the porous portion 90 is arranged in the counterbore portion 53s provided in the first hole portion 53a, and the porous portion 70 is arranged in the counterbore portion 53s provided in the second hole portion 53b. It is A first surface 90a of the porous portion 90 is an exposed surface exposed to the third hole portion 53c. The first surface 90a and the second main surface 11b of the ceramic dielectric substrate 11 are substantially coplanar. A third surface 70a of the porous portion 70 is an exposed surface exposed to the third hole portion 53c. The third surface 70a and the upper surface 50u of the base plate 50 are substantially coplanar.

In this example, the length ts along the X or Y direction of the counterbored portion 53s provided in the first hole portion 53a is equal to or smaller than the length tc along the X or Y direction of the third hole portion 53c. . The length t1 along the X or Y direction of the porous portion 90 is equal to or smaller than the length ts of the counterbored portion. Therefore, the arcing suppression effect can be enhanced.

If the width (length t1) of the porous portion 90 is the same as the width (length ts) of the counterbored portion 53s, the side surfaces of the porous portion 90 (surfaces perpendicular to the first surface 90a and the second surface 90b) ) and the counterbored portion 53s. For example, by integrating the ceramic dielectric substrate 11 and the porous portion 90 by sintering, the length t1 and the length ts can be made the same. Fixing of the porous portion 90 will be described later.

As shown in FIG. 3, the porous portion 90 has a side surface 90s connecting the first surface 90a and the second surface 90b. The side surface 90 s is the outer peripheral surface of the porous portion 90 . When the porous portion 90 has a columnar shape, the side surface 90s is annular. The side surface 90s includes a first side portion 90s1 on the side of the first surface 90a, a second side portion 90s2 on the side of the second surface 90b, and a third side portion 90s3 between the first side portion 90s1 and the second side portion 90s2. have For example, the lower end of the first side portion 90s1 is connected to the first surface 90a, and the first side portion 90s1 contacts the first surface 90a. For example, the upper end of the second side portion 90s2 is connected to the second surface 90b, and the second side portion 90s2 contacts the second surface 90b. Of these, the first side portion 90s1 has a first inclined portion S1 in a region located closest to the joint portion 60 and in contact with the first surface 90a. The side surface 90s of the first inclined portion S1 is inclined with respect to the Z direction. The length (horizontal width) of the first surface 90a as viewed in the X or Y direction is smaller than the length of the second surface 90b as viewed in the X or Y direction.
As shown in FIG. 2, the first surface 90a of the porous portion 90 overlaps the joint portion 60 when viewed in the X or Y direction. The first surface 90a is located in the third hole portion 53c. Since the insulating ceramic porous portion 90 is arranged in the third hole portion 53c (space), arcing resistance can be enhanced.

The electrostatic chuck 110 has an elastic body 30 . The elastic body 30 is provided so as to face the end portion 60 e of the joint portion 60 . Although FIG. 2 shows an example in which the elastic body 30 and the joint 60 are in contact with each other in the X or Y direction, the elastic body 30 and the joint 60 may be separated from each other. The first surface 90a also overlaps an elastic body 30, which will be described later, when viewed in the X or Y direction.
The elastic body 30 is sandwiched between the ceramic porous portion 90 and the base plate 50 in the Z direction. In this example, the porous portion 70 is provided in the second hole portion 53b of the base plate 50, and the elastic body 30 is sandwiched between the ceramic porous portion 90 and the porous portion 70 in the Z direction. At this time, the elastic body 30 is in contact with the porous portion 90 at the first inclined portion S1.
During use, the electrostatic chuck may be exposed to large temperature changes, causing the ceramic dielectric substrate 11 and/or the base plate 50 to expand or contract due to heat. At this time, the ceramic porous portion 90 disposed in the first hole portion 53a of the gas introduction path is also subjected to thermal stress, and the porous portion 90 may expand and deform toward the third hole portion 53c. be. According to this electrostatic chuck 110, the elastic body 30 is provided, and this elastic body 30 is located in the region of the ceramic porous portion 90 that is in contact with the first surface 90a on the first side portion 90s1 on the side of the first surface 90a. It is configured to be in contact with the provided first inclined portion S1. Therefore, by absorbing the deformation of the ceramic porous portion 90 by the first inclined portion S1 and the elastic body 30, damage to the ceramic porous portion 90 can be suppressed. Therefore, the effect of suppressing arc discharge can be maintained for a long period of time. In addition, since the elastic body 30 is arranged in the third hole 53c so as to face the end 60e of the joint 60, the generation of particles due to plasma corrosion of the end 60e when the electrostatic chuck is used is suppressed. can.

The elastic body 30 is made of a material having insulating properties and plasma resistance. The elastic body 30 has elasticity (flexibility) to the extent that it can absorb displacement of the porous portion 90, for example. The elastic body is made of resin. Examples of the resin include fluororesin such as polytetrafluoroethylene (PTFE), polyimide, and the like. If the shape of the elastic body is annular, it is easy to position, which is preferable in terms of manufacturing.

As shown in FIG. 3, the porous portion 90 has a porous portion (first porous portion 91) and a dense portion (first dense portion 93). The first porous portion 91 has gas permeability. The first dense portion 93 is denser than the first porous portion 91 . The porosity of the first porous portion 91 is higher than that of the first dense portion 93 . The first porous portion 91 has a plurality of holes. Preferably, the plurality of holes are straight holes having a hole diameter within a predetermined range. In this case, the pore size is, for example, 1 um to 30 um. The plurality of holes may be arranged randomly while communicating with each other. The first dense portion 93 does not have to be substantially gas permeable. The first dense portion 93 is arranged so as to cover the outer periphery of the first porous portion 91 . By providing the first dense portion 93, the rigidity of the porous portion 90 can be increased. For example, when an adhesive is placed between the side surface 90s of the porous portion 90 and the counterbored portion 53s, the provision of the first dense portion 93 causes the adhesive to enter the porous portion 90 and deteriorate the gas permeability. can be suppressed.

In the side surface 90s, the first inclined portion S1 is provided in the dense portion (first dense portion 93). Therefore, the strength of the first inclined portion S1 in contact with the elastic body 30 can be further increased, and breakage of the ceramic porous portion 90 can be effectively suppressed, and the effect of reducing arc discharge can be maintained for a long period of time. In this example, the length of the portion of the elastic body 30 in contact with the first inclined portion along the Z direction is longer than the length of the joint portion 60 along the Z direction. Therefore, since the elastic body 30 acts as a physical barrier between the end portion 60e of the joint 60 and the ceramic porous portion 90, even if the joint 60 is corroded by plasma and particles are generated, It is possible to prevent the particles from penetrating into the ceramic porous portion 90 and reducing the gas flow rate over time. Therefore, the effect of suppressing arc discharge reduction can be maintained for a long time.
It is also preferable that the first side portion 90s1 is formed of the first inclined portion S1, that is, that the entire first side portion 90s1 constitutes the first inclined portion S1 from the viewpoint of suppressing breakage of the ceramic porous portion.

It is also preferable that the length of the elastic body 30 along the X or Y direction is smaller than the length of the first dense portion 93 arranged on the outer periphery of the first porous portion 91 along the X or Y direction. In this case, damage to the porous portion 90 can be effectively suppressed. Moreover, it is possible to prevent the elastic body 30 from overlapping the first porous portion 91 in the Z-direction view and reducing the gas flow rate of the porous portion 90 .
When the elastic body 30 is annular, the length along the X or Y direction refers to the width of the ring. The length of the first dense portion 93 along the X or Y direction refers to the width of the ring covering the first porous portion 91 .

Similarly, in the example shown in FIG. 2 , the porous portion 70 has a second porous portion 71 and a second dense portion 73 . The second porous portion 71 has gas permeability. The second dense portion 73 is denser than the second porous portion 71 . The porosity of the second porous portion 71 is higher than that of the second dense portion 73 . The second dense portion 73 does not have to be substantially gas permeable. The second dense portion 73 is arranged so as to cover the outer periphery of the second porous portion 71 . In addition, in the second porous portion 71 , if the plurality of holes are linear holes having a hole diameter within a predetermined range, the hole diameter may be larger than that of the first porous portion 91 . When electrostatic chuck 110 includes porous portion 70 arranged in second hole portion 53 b , elastic body 30 is in contact with third surface 70 a of porous portion 70 . When porous portion 70 has second porous portion 71 and second dense portion 73 , elastic body 30 preferably contacts second dense portion 73 . The elastic body 30 may be in contact with part of the second porous portion 71 .

In addition to the portion covering the outer periphery of the first dense portion 93 , the porous portion 90 may have another portion as the first porous portion 91 . An example of the other portion is, for example, a first central dense portion that is located near the center of the first dense portion 93 and overlaps the first portion 53aa of the first hole portion 53a as viewed in the Z direction. The porous portion 70 may also have another portion as the second porous portion 71 in addition to the portion covering the outer periphery of the second dense portion 73 . Other portions include a portion overlapping the first portion 53aa of the first hole portion 53a when viewed in the Z direction, and a portion surrounding a portion of the first dense portion 93 disposed near the center when viewed in the Z direction. Includes the central compact part.
For details of the first central dense portion and the second central dense portion, the contents of JP-A-2020-072261 and JP-A-2020-150257 are incorporated as part of the present specification.
For example, the density of the first porous portion 91 is lower than the density of the first dense portion 93 . For example, the gas permeability of the first porous portion 91 is higher than the gas permeability of the first dense portion 93 . For example, the first porous portion 91 has a cylindrical shape. The first dense portion 93 is in contact with the outer peripheral side surface of the first porous portion 91 . The first dense portion 93 is annular (tubular) surrounding the outer peripheral side surface of the first porous portion 91 .
For example, the density of the second porous portion 71 is lower than the density of the second dense portion 73 . For example, the gas permeability of the second porous portion 71 is higher than the gas permeability of the second dense portion 73 . For example, the second porous portion 71 has a cylindrical shape. The second dense portion 73 is in contact with the outer peripheral side surface of the second porous portion 71 . The second dense portion 73 is annular (tubular) surrounding the outer peripheral side surface of the second porous portion 71 .

FIG. 4 is a schematic diagram illustrating an electrostatic chuck according to another embodiment.
In the example shown in FIG. 4, in the porous portion 90, at least a portion of the third side portion 90s3 has the second inclined portion S2. In this example, the first side portion 90s1 consists of the first inclined portion S1, and the second inclined portion S2 is continuous with the first inclined portion S1. In other words, the first inclined portion S1 and the second inclined portion S2 are continuously arranged from the first surface 90a side of the porous portion 90 . A fixing portion 65 is provided between the second inclined portion S2 and the counterbored portion 53s. Therefore, since the fixed portion 65 can be arranged at a position spaced apart from the plasma, the erosion of the fixed portion 65 by the plasma can be suppressed, and the effect of suppressing arc discharge reduction can be maintained for a long period of time.
The fixing portion 65 can be similar to the joint portion 60, and can be, for example, a hardened silicone adhesive. In this example, the angle θ1 of the first inclined portion S1 with respect to the first surface 90a is the same as the angle θ2 of the second inclined portion S2 with respect to the first surface 90a. When the angle θ1 is larger than the angle θ2, the space between the second inclined portion S2 and the counterbore portion 53s becomes smaller, and the space between the first inclined portion S1 and the counterbore portion 53s or the joint portion 60 becomes larger. . Therefore, breakage of the porous portion 90 can be effectively suppressed while enhancing arcing resistance. Further, when the angle θ1 is made smaller than the angle θ2, the space between the second inclined portion S2 and the counterbored portion 53s becomes larger. Therefore, the fixing portion 65 can fix the porous portion 90 more firmly. θ1 and θ2 are, for example, 15° to 50°. The maximum distance in the Z direction from the first surface 90a of the first inclined portion S1 is, for example, 30% or less of the distance (height) of the porous portion 90 in the Z direction. The maximum distance in the Z direction from the first surface 90a of the second inclined portion S2 is, for example, 60% or less of the distance (height) of the porous portion 90 in the Z direction.

As shown in FIG. 4, the length along the X or Y direction of the second side portion 90s2 of the porous portion 90 may be substantially the same as the length along the X or Y direction of the counterbored portion 53s. In other words, there is almost no gap along the X or Y direction between the second side portion 90s2 and the counterbored portion 53s. Therefore, arcing resistance can be improved. It is also preferable that there is no fixing portion between the second side portion 90s2 and the counterbored portion 53s. In this case, it is possible to suppress deterioration in arcing resistance over time due to erosion of the fixed portion by plasma during use.

An insulating arc suppressor (not shown) may be arranged in the third hole 53c. The arcing resistance can be enhanced by substantially filling the space of the third hole 53c with the arcing suppressing portion. The arcing suppressor is configured to allow gas to pass therethrough. The arcing suppressor may have elasticity. The arcing suppressor may be made of polyimide, fluororesin such as polytetrafluoroethylene (PTFE), epoxy resin, or the like. The arc suppressor may be made of ceramic. The gas permeability of the arcing suppressing portion is preferably higher than that of the porous portion 90 .
The porosity of the porous portion 90 may be smaller than the porosity of the porous portion 70 . By relatively reducing the porosity of the porous portion 90 disposed in the portion closer to the plasma atmosphere in the gas introduction path 53, the arcing resistance can be further enhanced.
2 and 3, an example of an electrostatic chuck having two porous portions (porous portion 90 and porous portion 70) has been described, but the present invention is not limited to this and can be modified according to the purpose. Only the textured portion 90 may be used.

The width (ts) of the counterbored portion 53s is, for example, 1 mm to 5 mm. In the first hole portion 53a, the length t1a along the X or Y direction of the first portion 53aa is, for example, 0.05 millimeters (mm) or more and 0.5 mm or less.

When the first portion 53aa of the first hole portion 53a opens into the groove 14, the width (t1a) of the first portion 53aa is the width of the portion of the first portion 53aa in contact with the groove. Both the width (t1) of the porous portion 90 and the width (length t2) of the porous portion 70 are the dimensions of the largest portion. It is preferred that 50% or more, preferably 70% or more, more preferably 90% or more of the porous portion have this dimension.

The height (length h2) of the joint 60 is, for example, 100 μm to 1000 μm, preferably 200 μm to 600 μm. The length of the joint portion 60 along the Z direction is the same as the length of the third hole portion 53c along the Z direction.

In this example, the second surface 90b of the porous portion 90 is positioned inside the first hole portion 53a. That is, the second surface 90b and the first major surface 11a of the ceramic dielectric substrate 11 do not form the same plane. The fourth surface 70b of the porous portion 70 is located inside the second hole portion 53b. That is, the fourth surface 70b and the lower surface 50d of the base plate 50 do not form the same plane.

Insulating ceramic is used as the material of the porous portion 90 and the porous portion 70 . The porous portion 90 (each of a first _porous portion 91 and _a first dense portion 93, which will be described later) is made of at least one of aluminum oxide ( _Al2O3 ), titanium oxide ( _TiO2 ), and yttrium oxide ( _Y2O3 ). including As a result, high withstand voltage and high rigidity of the porous portion 90 can be obtained.

For example, the porous portion 90 is mainly composed of any one of aluminum oxide, titanium oxide, and yttrium oxide.
In this case, the purity of the aluminum oxide of the ceramic dielectric substrate 11 can be made higher than the purity of the aluminum oxide of the porous portion 90 . In this way, performance such as plasma resistance of the electrostatic chuck 110 can be ensured, and the mechanical strength of the porous portion 90 can be ensured. As an example, by including a small amount of additive in the porous portion 90, sintering of the porous portion 90 is promoted, and it becomes possible to control pores and ensure mechanical strength.

For details of the porous portion 90 and the porous portion 70, the content of Japanese Patent No. 6489277 is incorporated as a part of this specification.

In this specification, the purity of ceramics such as aluminum oxide of the ceramic dielectric substrate 11 is measured by fluorescent X-ray analysis, ICP-AES method (Inductively Coupled Plasma-Atomic Emission Spectrometry), or the like. be able to.

In the porous portion, for example, the material of the porous portions (the first porous portion 91 and the second porous portion 71) and the material of the dense portions (the first dense portion 93 and the second dense portion 73) are the same. However, the material of the porous portion may be different from the material of the dense portion. The composition of the material in the porous section may differ from the composition of the material in the dense section.

The porosities of the ceramic dielectric substrate 11 and the porous portion 70 are calculated, for example, by image analysis of images obtained by a scanning electron microscope. Density is measured based on JIS C 2141 5.4.3.

(Production method)
A method of manufacturing the electrostatic chuck according to the embodiment described above will be described below.
The ceramic dielectric substrate 11 having the porous portion 90 arranged in the first hole portion 53a and the base plate 50 having the porous portion 70 arranged in the second hole portion 53b are prepared. As the porous portion 90, a side surface 90s having a first inclined portion S1 is used. An adhesive that will become the joint 60 is placed on the second main surface 11 b of the ceramic dielectric substrate 11 or the upper surface 50 u of the base plate 50 . Also, the elastic body 30 is arranged at a predetermined position on the base plate 50 or the ceramic dielectric substrate 11 . Then, the base plate 50 and the ceramic dielectric substrate 11 are joined so that the first hole portion 53a and the second hole portion 53b face each other while the first inclined portion S1 and the elastic body 30 are in contact with each other, thereby forming the joint portion 60. Form.

(Processing device)
FIG. 5 is a schematic diagram illustrating the processing apparatus 200 according to this embodiment.
As shown in FIG. 5, processing apparatus 200 may include electrostatic chuck 110 , power supply 210 , media supply 220 , and supply 230 .
The power supply 210 is electrically connected to the electrodes 12 provided on the electrostatic chuck 110 . Power supply 210 may be, for example, a DC power supply. A power supply 210 applies a predetermined voltage to the electrodes 12 . Further, the power source 210 may be provided with a switch for switching between application of voltage and stop of application of voltage.

The medium supply section 220 is connected to the input path 51 and the output path 52 . The medium supply unit 220 can supply, for example, a liquid that serves as a cooling medium or a heat retaining medium.
The medium supply unit 220 has, for example, a storage unit 221, a control valve 222, and a discharge unit 223.

The storage unit 221 can be, for example, a tank for storing liquid, a factory pipe, or the like. Moreover, the storage unit 221 can be provided with a cooling device or a heating device for controlling the temperature of the liquid. The storage unit 221 can also be equipped with a pump or the like for delivering the liquid.

The control valve 222 is connected between the input path 51 and the housing portion 221 . Control valve 222 can control the flow rate and/or pressure of the liquid. Also, the control valve 222 may switch between supplying and stopping the supply of the liquid.

The discharge part 223 is connected to the output path 52 . The discharge part 223 can be a tank for collecting the liquid discharged from the output path 52, a drain pipe, or the like. Note that the discharge portion 223 is not necessarily required, and the liquid discharged from the output path 52 may be supplied to the storage portion 221 . In this way, the cooling medium or the heat insulating medium can be circulated, so resource saving can be achieved.

The supply section 230 has a gas supply section 231 and a gas control section 232 .
The gas supply unit 231 can be a high-pressure cylinder containing a gas such as helium, factory piping, or the like. Although the case where one gas supply unit 231 is provided is illustrated, a plurality of gas supply units 231 may be provided.

The gas control section 232 is connected between the plurality of gas introduction paths 53 and the gas supply section 231 . The gas control unit 232 can control at least one of gas flow rate and pressure. The gas control unit 232 may further have a function of switching between gas supply and gas supply stoppage. The gas controller 232 can be, for example, a mass flow controller, a mass flow meter, or the like.

As shown in FIG. 5, a plurality of gas control units 232 can be provided. For example, the gas control unit 232 can be provided for each of multiple regions of the first main surface 11a. By doing so, the gas to be supplied can be controlled for each of the plurality of regions. In this case, a gas controller 232 may be provided for each of the plurality of gas introduction paths 53 . By doing so, it is possible to more precisely control the gas in the plurality of regions. Although a case in which a plurality of gas control units 232 are provided has been exemplified, there may be only one gas control unit 232 as long as the gas control unit 232 can independently control gas supply in a plurality of supply systems.

Here, means for holding the object W include a vacuum chuck, a mechanical chuck, and the like. However, the vacuum chuck cannot be used in an environment with pressure reduced below atmospheric pressure. Moreover, if a mechanical chuck is used, the object W may be damaged or particles may be generated. For this reason, for example, electrostatic chucks are used in processing apparatuses used in semiconductor manufacturing processes.

In such a processing apparatus, it is necessary to isolate the processing space from the external environment. As such, processing apparatus 200 may further comprise chamber 240 . The chamber 240 can have, for example, an airtight structure capable of maintaining an atmosphere that is reduced in pressure below atmospheric pressure.
The processing device 200 can also include a plurality of lift pins and a drive for raising and lowering the plurality of lift pins. When receiving the object W from the transport device or transferring the object W to the transport device, the lift pins are lifted by the driving device and protrude from the first main surface 11a. When the object W received from the conveying device is placed on the first main surface 11 a , the lift pins are lowered by the driving device and housed inside the ceramic dielectric substrate 11 .

Further, the processing device 200 can be provided with various devices according to the content of the processing. For example, a vacuum pump or the like for evacuating the interior of the chamber 240 can be provided. A plasma generator may be provided to generate a plasma inside the chamber 240 . A process gas supply may be provided to supply process gas to the interior of the chamber 240 . A heater for heating the object W and the process gas can also be provided inside the chamber 240 . Note that the devices provided in the processing device 200 are not limited to those illustrated. A known technology can be applied to the devices provided in the processing device 200, so detailed description thereof will be omitted.

FIG. 6 is a schematic cross-sectional view illustrating an electrostatic chuck according to this embodiment.
FIG. 7 is a schematic diagram illustrating a processing apparatus according to this embodiment.
FIG. 6 corresponds to the electrostatic chuck shown in FIG. FIG. 7 corresponds to the processing device shown in FIG.
As shown in FIG. 7, in this example, an electrostatic chuck 110a (an example of the electrostatic chuck 110) and a ceramic dielectric substrate 11c (an example of the ceramic dielectric substrate 11) are provided.

FIG. 8 is a schematic cross-sectional view illustrating the electrostatic chuck according to the embodiment.
FIG. 8 is a schematic cross-sectional view illustrating the periphery of the porous portion 90 and the porous portion 70, and corresponds to FIG. In the description of the embodiments, the direction from the base plate 50 to the ceramic dielectric substrate 11 may be called "up", and the direction from the ceramic dielectric substrate 11 to the base plate 50 may be called "down". Also, the ceramic porous portion 90 may be called the porous portion 90 and the ceramic porous portion 70 may be called the porous portion 70 .

The first hole portion 53a is aligned with the ceramic dielectric substrate 11 in the second direction (one direction within the XY plane). The XY plane is a plane perpendicular to the Z direction. For example, the first hole portion 53 a is formed by at least part of a hole provided in the ceramic dielectric substrate 11 . The second hole portion 53b is aligned with the base plate 50 in the second direction. For example, the second hole portion 53b is formed by at least part of a hole provided in the base plate 50. As shown in FIG. The third hole portion 53c penetrates the joint portion 60 and is aligned with the joint portion 60 in the second direction. For example, the third hole portion 53 c is formed by at least part of the space (hole) surrounded by the joint portion 60 .

For example, the shape in the XY plane of each outer periphery of the first hole portion 53a, the second hole portion 53b, and the third hole portion 53c is circular. The circular shape may include not only a perfect circle (perfect circle) but also a shape in which a perfect circle is distorted, such as an ellipse or a flattened circle. A columnar shape is a columnar shape having a circular cross-sectional shape.

The first hole portion 53a includes a first portion 53aa, a second portion 53ab, and an intermediate portion 53ac. The intermediate portion 53ac is positioned between the first portion 53aa and the second portion 53ab. The intermediate portion 53ac includes, for example, the space between the second surface 90b of the porous portion 90 and the ceramic dielectric substrate 11 (counterbore surface 53ah).

The second portion 53ab includes a counterbored portion 53s. For example, the outer peripheries of the first portion 53aa, the second portion 53ab, the intermediate portion 53ac, and the counterbored portion 53s have circular shapes in the XY plane. The length ts along the second direction of the counterbored portion 53s is longer than the length t1a along the second direction of the first portion 53aa. The length ts is, for example, the diameter of the counterbore portion 53s and the maximum width of the planar shape of the counterbore portion 53s. The maximum width of the planar shape is the maximum value of the lengths along the directions within the XY plane. The length t1a is, for example, the diameter of the first portion 53aa and the maximum width of the planar shape of the first portion 53aa. For example, the counterbored portion 53s is at least a part of the portion of the first hole portion 53a whose diameter is enlarged from the first portion 53aa. For example, in the XY plane, the center position of the counterbore portion 53s is substantially the same as the center position of the first portion 53aa.

For example, the length ts along the second direction of the counterbored portion 53s is less than or equal to the length tc along the second direction of the third hole portion 53c. Note that the length tc is, for example, the diameter of the third hole 53c and the maximum width of the planar shape of the third hole 53c.
For example, the length t1 along the second direction of the porous portion 90 is less than or equal to the length ts of the counterbored portion 53s. Note that the length t1 is, for example, the diameter of the porous portion 90 and the maximum width of the planar shape of the porous portion 90 .

The upper end of the first portion 53aa is provided on the first main surface 11a of the ceramic dielectric substrate 11 and is continuous with the groove 14 on the first main surface 11a. The first portion 53aa is directly connected to the groove 14 of the first major surface 11a. The lower end of the second portion 53ab is provided on the second major surface 11b of the ceramic dielectric substrate 11. As shown in FIG. A lower end of the counterbored portion 53 s is provided on the second main surface 11 b of the ceramic dielectric substrate 11 .

The ceramic dielectric substrate 11 has a counterbore surface 53ah that intersects with the inner peripheral side surface 53as of the first hole portion 53a. The counterbore surface 53ah extends, for example, in the second direction and faces downward. The lower end of the first portion 53aa is provided on the counterbore surface 53ah.

The first surface 90a of the porous portion 90 is the lower surface on the side of the base plate 50, and the second surface 90b is the upper surface. Each of the first surface 90a and the second surface 90b extends, for example, along the XY plane and is substantially planar. A space is formed between the first surface 90a and the porous portion 70 (or the base plate 50).

The elastic body 30 is aligned with the joint portion 60 and the first surface 90a in the second direction. The elastic body 30 is located between the first surface 90 a and the end of the joint 60 . For example, the joint portion 60 is separated from the space between the first surface 90a and the porous portion 70 (or the base plate 50) by the elastic body 30. As shown in FIG. As a result, exposure of the joint 60 to plasma or gas is suppressed and protected. For example, the elastic body 30 is arranged so that the joint portion 60 does not come into direct contact with the gas-passable space of the gas introduction path 53 .

The porous portion 90 may include a first ceramic portion 901 , a second ceramic portion 902 and a third ceramic portion 903 . The first ceramic portion 901 is the lower portion of the porous portion 90 and has a first surface 90a. The second ceramic portion 902 is the upper portion of the porous portion 90 and has a second surface 90b. The third ceramic portion 903 is a portion located between the first ceramic portion 901 and the second ceramic portion 902 in the Z direction. That is, the Z-direction position of the third ceramic portion 903 is between the Z-direction position of the first ceramic portion 901 and the Z-direction position of the second ceramic portion 902 .

A length t901 of the first ceramic portion 901 along the second direction is shorter than a length t902 of the second ceramic portion 902 along the second direction. A length t901 of the first ceramic portion 901 along the second direction is shorter than a length t903 of the third ceramic portion 903 along the second direction. Note that the length t901 is, for example, the diameter of the first ceramic portion 901 and the maximum width of the planar shape of the first ceramic portion 901 . The length t902 is, for example, the diameter of the second ceramic portion 902 and the maximum width of the planar shape of the second ceramic portion 902. As shown in FIG. The length t903 is, for example, the diameter of the third ceramic portion 903 and is the maximum width of the planar shape of the third ceramic portion 903 .

For example, the side surface of the first ceramic portion 901 (peripheral surface intersecting the XY plane) is inclined with respect to the Z direction. In this case, the length t901 of the first ceramic portion 901 varies along the Z direction and monotonically shortens downward. For example, the side surfaces of the second ceramic portion 902 extend along the Z direction. In this case, the length t902 of the second ceramic portion 902 is constant along the Z direction. Also, for example, the side surface of the third ceramic portion 903 is inclined with respect to the Z direction. In this case, the length t903 of the third ceramic portion 903 varies along the Z direction, and monotonically shortens downward.

In this example, the first ceramic portion 901 and the third ceramic portion 903 are frustoconical and the second ceramic portion 902 is cylindrical. For example, the center position of the first ceramic portion 901 is substantially the same as the center position of the second ceramic portion 902 in the XY plane.

The side surface of the first ceramic portion 901 is, for example, the first side portion 90s1 described above. The side surface of the second ceramic portion 902 is, for example, the second side portion 90s2. The side surface of the third ceramic portion 903 is, for example, the third side portion 90s3.

At least part of the elastic body 30 overlaps the third ceramic portion 903 in the Z direction. In other words, at least part of the elastic body 30 is aligned with the third ceramic portion 903 in the Z direction. In this example, the inner peripheral portion of the annular elastic body 30 overlaps the first ceramic portion 901, the second ceramic portion 902 and the third ceramic portion 903 in the Z direction. The outer peripheral portion of the annular elastic body 30 does not overlap the porous portion 90 in the Z direction. However, the entire elastic body 30 may overlap the porous portion 90 in the Z direction.

The elastic body 30 contacts at least one of the first ceramic portion 901 and the third ceramic portion 903 . In this example, the elastic body 30 is in contact with the slanted side surfaces of the first ceramic portion 901 .

For example, the length t902 along the second direction of the second ceramic portion 902 is substantially the same as the length ts along the second direction of the counterbored portion 53s. Specifically, one end of the second ceramic portion 902 in the second direction and the other end of the second ceramic portion 902 in the second direction are the counterbored portion 53s (the ceramic dielectric substrate forming the counterbore portion 53s). 11). For example, the outer diameter (length t902) of the second ceramic portion 902 is substantially the same as the inner diameter (length ts) of the counterbored portion 53s. As a result, there is almost no gap between the second ceramic portion 902 closest to the plasma in the ceramic porous portion 90 and the counterbored portion 53s, so the effect of suppressing arc discharge reduction can be maintained for a long period of time. . In addition, "substantially the same" or "same" is not limited to being strictly the same, for example, the range due to manufacturing variation, or manufacturing play (for example, placing a porous portion in a counterbore) It may also include differences in the range of small gaps, such as to do.

FIG. 9 is a schematic cross-sectional view illustrating the electrostatic chuck according to the embodiment.
FIG. 9 is a cross section taken along line CC shown in FIG. Note that FIG. 8 corresponds to a cross section taken along line DD in FIG. The DD line passes through the center of the planar shape of the porous portion 90 .
For example, the first porous portion 91 has a cylindrical shape. The first dense portion 93 is in contact with the outer peripheral side surface 91 s of the first porous portion 91 . The first dense portion 93 is annular (tubular) surrounding the outer peripheral side surface 91 s of the first porous portion 91 .

As shown in FIG. 9, the inner peripheral side of the annular elastic body 30 may be in contact with the first inclined portion S1 over the entire annular circumference. Further, the outer peripheral side of the annular elastic body 30 may be in contact with the end portion 60e of the joint portion 60 over the entire circumference of the annular shape.

FIG. 10 is a schematic cross-sectional view illustrating an electrostatic chuck according to the embodiment;
FIG. 10 is a schematic cross-sectional view illustrating part of the electrostatic chuck similar to FIG. However, this example differs from the above example in the shape of the porous portion 90 and the like. Also in this example, a gas introduction path 53 having a first hole portion 53a, a second hole portion 53b, and a third hole portion 53c is provided. The first hole portion 53a has a counterbored portion 53s. A portion of the porous portion 90 is arranged within the counterbored portion 53s. The elastic body 30 faces the end portion of the joint portion 60 on the side of the third hole portion 53c. The elastic body 30 is aligned with the joint portion 60 in the second direction.

As shown in FIG. 10, the porous portion 90 has a first ceramic portion 901, a second ceramic portion 902 and a third ceramic portion 903. As shown in FIG. Also in this example, the length t901 of the first ceramic portion 901 along the second direction is shorter than the length t902 of the second ceramic portion 902 along the second direction. A length t901 of the first ceramic portion 901 along the second direction is shorter than a length t903 of the third ceramic portion 903 along the second direction.

The porous portion 90 has side surfaces 90f. The side surface 90f is an outer peripheral surface that intersects the XY plane. The side 90f has a side 901f of the first ceramic portion 901, a side 902f of the second ceramic portion 902, and a side 903f of the third ceramic portion 903. The side surface 901f faces a direction intersecting the Z direction (for example, a direction perpendicular to the Z direction) and extends, for example, along the Z direction. The side surface 902f faces a direction crossing the Z direction. The side surface 903f faces a direction intersecting the Z direction (for example, a direction perpendicular to the Z direction) and extends, for example, along the Z direction. Each of side 901f, side 902f, and side 903f may be parallel to the Z direction. Each of the side surface 901f, the side surface 902f, and the side surface 903f may be inclined with respect to the Z direction.

In this example, the porous portion 90 has a step provided between the side surface 901f of the first ceramic portion 901 and the side surface 903f of the third ceramic portion 903 . Specifically, the third ceramic portion 903 has an extension surface 903h extending along the second direction. The extension surface 903h is parallel to the XY plane, for example. The extension surface 903h connects the side surface 901f and the side surface 903f. The extension surface 903h is the lower surface of the third ceramic portion 903 and faces downward. The first ceramic portion 901 is a convex portion protruding downward from the central portion of the lower surface (extending surface 903h) of the third ceramic portion 903 . For example, each of the first ceramic portion 901, the second ceramic portion 902 and the third ceramic portion 903 is cylindrical. The second ceramic portion 902 may be frusto-conical.

The first surface 90a of the porous portion 90 is aligned with the elastic body 30 and the joint portion 60 when viewed in the second direction. In other words, the elastic body 30 is aligned with the joint portion 60 and the first surface 90a in the second direction.

At least part of the elastic body 30 overlaps the third ceramic portion 903 in the Z direction. In this example, the entire annular elastic body 30 overlaps the third ceramic portion 903 in the Z direction.

The elastic body 30 contacts at least one of the first ceramic portion 901 and the third ceramic portion 903 . In the example of FIG. 10, the upper surface (upper end) of the elastic body 30 is in contact with the extension surface 903h of the third ceramic portion 903. In the example of FIG. A side surface (inner peripheral surface) of the elastic body 30 may be in contact with the side surface 901f of the first ceramic portion 901 . Also, the lower surface (lower end) of the elastic body 30 contacts, for example, the porous portion 70 (or the base plate 50).

Thus, in the embodiment, at least a portion of the elastic body 30 overlaps the third ceramic portion 903 in the Z direction, and the elastic body 30 is in contact with at least one of the first ceramic portion 901 and the third ceramic portion 903 . As a result, deformation of the ceramic porous portion 90 due to heat is absorbed by the elastic body 30 , thereby suppressing breakage of the ceramic porous portion 90 . Therefore, the effect of suppressing arc discharge can be maintained for a long period of time.
In addition, the first surface 90a overlaps the joint portion 60 and the elastic body 30 when viewed in the second direction. That is, part of the first ceramic portion 901 is arranged in the third hole portion 53c. Thereby, arcing resistance can be improved. In addition, since the elastic body 30 is arranged in the third hole 53c so as to face the end 60e of the joint 60, the generation of particles due to plasma corrosion of the end 60e when the electrostatic chuck is used is suppressed. can.

The length 30t of the elastic body 30 along the Z direction is, for example, the same as the length h2 of the joint portion 60 along the Z direction. As a result, for example, even if particles are generated from the joint portion 60 , it is possible to prevent the particles from reaching the porous portion 90 . Length 30t may be longer than length h2.

FIG. 11 is a schematic cross-sectional view illustrating an electrostatic chuck according to the embodiment;
FIG. 11 is a cross section taken along line AA shown in FIG. 10 corresponds to the cross section taken along line BB of FIG. Line BB passes through the center of the planar shape of porous portion 90 .
The porous portion 90 has a first porous portion 91 and a first dense portion 93 .

The first porous portion 91 is, for example, cylindrical. The first dense portion 93 is in contact with the outer peripheral side surface 91 s of the first porous portion 91 . The first dense portion 93 is annular (tubular) surrounding the outer peripheral side surface 91 s of the first porous portion 91 .

The elastic body 30 is in contact with the first dense portion 93 . For example, the extension surface 903 h of the third ceramic portion 903 is provided in the first dense portion 93 . The side surface 901 f of the first ceramic portion 901 is provided in the first porous portion 91 in this example, but may be provided in the first dense portion 93 . As a result, since the strength of at least one of the first ceramic portion 901 and the third ceramic portion 903 in contact with the elastic body is further increased, breakage of the ceramic porous portion is effectively suppressed, and the effect of reducing arc discharge is prolonged. It can be maintained for a period of time.

The upper surface of the annular elastic body 30 may be in contact with the extension surface 903h of the third ceramic portion 903 over the entire annular circumference. The inner peripheral side surface of the annular elastic body 30 may be in contact with the side surface 901f of the first ceramic portion 901 over the entire annular circumference.

FIG. 12 is a schematic cross-sectional view illustrating an electrostatic chuck according to the embodiment;
FIG. 12 is a schematic cross-sectional view illustrating a part of the electrostatic chuck similar to FIG. 1. FIG. However, this example differs from the above example in the shape of the porous portion 70 and its periphery.

FIG. 12 is, for example, a cross section parallel to the Z direction and passing through the center of the planar shape of the porous portion 70 . As shown in FIG. 12, a gas introduction path 53 is provided that penetrates the ceramic dielectric substrate 11, the base plate 50, and the joint 60. As shown in FIG. The gas introduction path 53 has a first hole portion 53a, a second hole portion 53b and a third hole portion 53c.

The first hole portion 53a has a plurality of pores 16 arranged in the second direction. Each pore 16 extends in the Z direction from the third hole portion 53c to the groove 14. As shown in FIG.

The second hole portion 53b has a third portion 53bu and a fourth portion 53bd. In this example, the third portion 53bu includes a counterbored portion 53s. That is, in this example, the counterbored portion 53s is provided in the second hole portion 53b. The counterbored portion 53s may not be provided in the first hole portion 53a. The upper end of the third portion 53bu is provided on the upper surface 50u of the base plate 50 . The upper end of the counterbored portion 53s is provided on the upper surface 50u. For example, the fourth portion 53bd is connected to the lower end of the counterbored portion 53s. A lower end of the fourth portion 53 bd is provided on the lower surface 50 d of the base plate 50 .

For example, the outer peripheries of the third portion 53bu, the fourth portion 53bd, and the counterbored portion 53s each have a circular shape in the XY plane. The length ts of the counterbored portion 53s along the second direction is longer than the length of the fourth portion 53bd along the second direction. The length of the fourth portion 53bd along the second direction is, for example, the diameter of the fourth portion 53bd and the maximum width of the planar shape of the fourth portion 53bd. For example, the counterbored portion 53s is at least part of a portion of the second hole portion 53b whose diameter is enlarged from the lower portion (for example, the fourth portion 53bd). For example, in the XY plane, the center position of the counterbore portion 53s is substantially the same as the center position of the fourth portion 53bd.

A portion of the porous portion 70 is provided in the counterbored portion 53s. The porous portion 70 has a first surface 70c (for example, a third surface 70a) on the side of the third hole portion 53c and a second surface 70d (for example, a fourth surface 70b) opposite to the first surface 70c. . The first surface 70c of the porous portion 70 is the upper surface on the ceramic dielectric substrate 11 side, and the second surface 70d is the lower surface. Each of the first surface 70c and the second surface 70d extends, for example, along the XY plane and is substantially flat. A space is formed between the first surface 70 c and the ceramic dielectric substrate 11 .

The elastic body 30 is provided to face the end portion 60e of the joint portion 60 on the side of the third hole portion 53c. In this example, the elastic body 30 is in contact with the end 60e. The elastic body 30 is aligned with the joint portion 60 and the first surface 70c in the second direction. In other words, the first surface 70c overlaps the joint portion 60 and the elastic body 30 when viewed in the second direction. The elastic body 30 is positioned between the first surface 70c and the end portion 60e of the joint portion 60 . As a result, exposure of the joint 60 to plasma or gas is suppressed and protected. For example, the joint 60 is isolated from the space between the first surface 70 c and the ceramic dielectric substrate 11 by the elastic body 30 . For example, the elastic body 30 is arranged so that the joint portion 60 does not come into direct contact with the gas-passable space of the gas introduction path 53 .

The porous portion 70 has side surfaces 70s. The side surface 70s is an outer peripheral surface that intersects the XY plane. The side surface 70s connects the first surface 70c and the second surface 70d. The side surface 70s includes a first side portion 70s1 on the first surface 70c side, a second side portion 70s2 on the second surface 70d side, and a third side portion 70s3 between the first side portion 70s1 and the second side portion 70s2. and have A first inclined portion S11 inclined with respect to the Z direction is provided in a region of the first side portion 70s1 that is in contact with at least the first surface 70c. In this example, the first side portion 70s1 consists of the first inclined portion S11. That is, the first inclined portion S11 is in contact with the first surface 70c and inclined with respect to the Z direction. Further, the third side portion 70s3 has a second inclined portion S12 inclined with respect to the Z direction. For example, the second slope S12 is continuous with the first slope S11. In other words, the first inclined portion S11 and the second inclined portion S12 are continuously arranged from the first surface 70c side of the porous portion 70 . A fixing portion may be provided between the second inclined portion S12 and the counterbored portion 53s.

The porous portion 70 includes a first ceramic portion 701 , a second ceramic portion 702 and a third ceramic portion 703 . The first ceramic portion 701 is the upper portion of the porous portion 70 and has a first surface 70c. The second ceramic portion 702 is the lower portion of the porous portion 90 and has a second surface 70d. In the Z direction, the third ceramic portion 703 is the portion located between the first ceramic portion 701 and the second ceramic portion 702 . That is, the Z-direction position of the third ceramic portion 703 is between the Z-direction position of the first ceramic portion 701 and the Z-direction position of the second ceramic portion 702 .

A length t701 of the first ceramic portion 701 along the second direction is shorter than a length t702 of the second ceramic portion 702 along the second direction. A length t701 of the first ceramic portion 701 along the second direction is shorter than a length t703 of the third ceramic portion 703 along the second direction. Note that the length t701 is, for example, the diameter of the first ceramic portion 701 and the maximum width of the planar shape of the first ceramic portion 701 . The length t702 is, for example, the diameter of the second ceramic portion 702 and the maximum width of the planar shape of the second ceramic portion 702. As shown in FIG. The length t703 is, for example, the diameter of the third ceramic portion 703 and the maximum width of the planar shape of the third ceramic portion 703. As shown in FIG.

A side surface of the first ceramic portion 701 is inclined with respect to the Z direction. In this case, the length t701 of the first ceramic portion 701 varies along the Z direction, and monotonically shortens upward. For example, the side surfaces of the second ceramic portion 702 extend along the Z direction. In this case, the length t702 of the second ceramic portion 702 is constant along the Z direction. Also, for example, the side surface of the third ceramic portion 703 is inclined with respect to the Z direction. In this case, the length t703 of the third ceramic portion 703 varies along the Z direction and monotonically shortens upward.

In this example, the first ceramic portion 701 and the third ceramic portion 703 are frusto-conical and the second ceramic portion 702 is cylindrical. For example, the center position of the first ceramic portion 701 is substantially the same as the center position of the second ceramic portion 702 in the XY plane.

The side surface of the first ceramic portion 701 is, for example, the first side portion 70s1. The side surface of the second ceramic portion 702 is, for example, the second side portion 70s2. The side surface of the third ceramic portion 703 is, for example, the third side portion 70s3.

At least part of the elastic body 30 overlaps the third ceramic portion 703 in the Z direction. In other words, at least part of the elastic body 30 is aligned with the third ceramic portion 703 in the Z direction. In this example, the inner peripheral portion of the annular elastic body 30 overlaps the first ceramic portion 701, the second ceramic portion 702 and the third ceramic portion 703 in the Z direction. The outer peripheral portion of the annular elastic body 30 does not overlap the porous portion 70 in the Z direction. However, the entire elastic body 30 may overlap the porous portion 70 in the Z direction.

The elastic body 30 contacts at least one of the first ceramic portion 701 and the third ceramic portion 903 . In this example, the elastic body 30 is in contact with the slanted side surfaces of the first ceramic portion 901 . That is, the porous portion 70 contacts the elastic body 30 at the first inclined portion S11.

As described above, at least part of the elastic body 30 overlaps the third ceramic portion 703 in the Z direction, and the elastic body 30 is in contact with at least one of the first ceramic portion 701 and the third ceramic portion 703 . As a result, deformation of the ceramic porous portion 70 due to heat is absorbed by the elastic body 30 , thereby suppressing damage to the ceramic porous portion 70 . Therefore, the effect of suppressing arc discharge can be maintained for a long period of time.
In addition, the first surface 70 c overlaps the joint portion 60 and the elastic body 30 when viewed in the second direction. That is, part of the first ceramic portion 701 is arranged in the third hole portion 53c. Thereby, arcing resistance can be improved. In addition, since the elastic body 30 is arranged in the third hole 53c so as to face the end 60e of the joint 60, the generation of particles due to plasma corrosion of the end 60e when the electrostatic chuck is used is suppressed. can.

For example, the length t702 along the second direction of the second ceramic portion 702 is substantially the same as the length ts along the second direction of the counterbored portion 53s. Specifically, one end of the second ceramic portion 702 in the second direction and the other end of the second ceramic portion 702 in the second direction are located in the counterbore portion 53s (the inside of the base plate 50 forming the counterbore portion 53s). surface). For example, the outer diameter (length t702) of the second ceramic portion 702 is substantially the same as the inner diameter (length ts) of the counterbored portion 53s. As a result, the gap between the ceramic porous portion 70 and the counterbored portion 53s can be suppressed, so that the effect of suppressing arc discharge reduction can be maintained for a long period of time.

For example, the second porous portion 71 has a cylindrical shape. The second dense portion 73 is in contact with the outer peripheral side surface of the second porous portion 71 . The second dense portion 73 is annular (tubular) surrounding the outer peripheral side surface of the second porous portion 71 . The inner peripheral side of the annular elastic body 30 may be in contact with the first inclined portion S11 over the entire annular circumference. Further, the outer peripheral side of the annular elastic body 30 may be in contact with the end portion 60e of the joint portion 60 over the entire circumference of the annular shape.

FIG. 13 is a schematic cross-sectional view illustrating an electrostatic chuck according to the embodiment;
FIG. 13 is a schematic cross-sectional view illustrating a part of the electrostatic chuck similar to FIG. 1. FIG. However, in this example, the shape of the porous portion 70 and its periphery is different from the above example. FIG. 13 is, for example, a cross section parallel to the Z direction and passing through the center of the planar shape of the porous portion 70 . Also in this example, a gas introduction path 53 having a first hole portion 53a, a second hole portion 53b, and a third hole portion 53c is provided. The second hole portion 53b has a counterbored portion 53s. A portion of the porous portion 70 is arranged within the counterbored portion 53s. The elastic body 30 faces the end portion of the joint portion 60 on the side of the third hole portion 53c. The elastic body 30 is aligned with the joint portion 60 in the second direction.

As shown in FIG. 13, the porous portion 70 has a first ceramic portion 701, a second ceramic portion 702, and a third ceramic portion 703. As shown in FIG. Also in this example, the length t701 of the first ceramic portion 701 along the second direction is shorter than the length t702 of the second ceramic portion 702 along the second direction. A length t701 of the first ceramic portion 701 along the second direction is shorter than a length t703 of the third ceramic portion 703 along the second direction.

The porous portion 70 has a side surface 70f. The side surface 70f is an outer peripheral surface that intersects the XY plane. The side 70f has a side 701f of the first ceramic portion 701, a side 702f of the second ceramic portion 702, and a side 703f of the third ceramic portion 703. The side surface 701f faces a direction intersecting the Z direction (for example, a direction perpendicular to the Z direction) and extends, for example, along the Z direction. The side surface 702f faces a direction crossing the Z direction. The side surface 703f faces a direction intersecting the Z direction (for example, a direction perpendicular to the Z direction) and extends along the Z direction, for example. Each of side 701f, side 702f, and side 703f may be parallel to the Z direction. Each of the side surface 701f, the side surface 702f, and the side surface 703f may be inclined with respect to the Z direction.

In this example, the porous portion 70 has a step provided between the side surface 701f of the first ceramic portion 701 and the side surface 703f of the third ceramic portion 703 . Specifically, the third ceramic portion 703 has an extension surface 703h extending along the second direction. The extension surface 703h is parallel to the XY plane, for example. The extension surface 703h connects the side surface 701f and the side surface 703f. The extension surface 703h is the upper surface of the third ceramic portion 703 and faces upward. The first ceramic portion 701 is a protrusion that protrudes upward from the central portion of the upper surface (extending surface 703h) of the third ceramic portion 703 . For example, each of the first ceramic portion 701, the second ceramic portion 702 and the third ceramic portion 703 are cylindrical. The second ceramic portion 702 may be frusto-conical.

The first surface 70 c of the porous portion 70 is aligned with the elastic body 30 and the joint portion 60 when viewed in the second direction. In other words, the elastic body 30 is aligned with the joint portion 60 and the first surface 70c in the second direction.

At least part of the elastic body 30 overlaps the third ceramic portion 703 in the Z direction. In this example, the entire annular elastic body 30 overlaps the third ceramic portion 703 in the Z direction.

The elastic body 30 contacts at least one of the first ceramic portion 701 and the third ceramic portion 703 . In the example of FIG. 13, the bottom surface of the elastic body 30 is in contact with the extension surface 703h of the third ceramic portion 703. In the example of FIG. A side surface (inner peripheral surface) of the elastic body 30 may be in contact with the side surface 701 f of the first ceramic portion 701 . Further, the upper surface of the elastic body 30 is in contact with the ceramic dielectric substrate 11, for example.

Thus, in the embodiment, at least a portion of the elastic body 30 overlaps the third ceramic portion 703 in the Z direction, and the elastic body 30 is in contact with at least one of the first ceramic portion 701 and the third ceramic portion 703 . As a result, deformation of the ceramic porous portion 70 due to heat is absorbed by the elastic body 30 , thereby suppressing damage to the ceramic porous portion 70 . Therefore, the effect of suppressing arc discharge can be maintained for a long period of time.
In addition, the first surface 70 c overlaps the joint portion 60 and the elastic body 30 when viewed in the second direction. That is, part of the first ceramic portion 701 is arranged in the third hole portion 53c. Thereby, arcing resistance can be improved. In addition, since the elastic body 30 is arranged in the third hole 53c so as to face the end 60e of the joint 60, the generation of particles due to plasma corrosion of the end 60e when the electrostatic chuck is used is suppressed. can.

The length 30t of the elastic body 30 along the Z direction is, for example, the same as the length h2 of the joint portion 60 along the Z direction. Length 30t may be longer than length h2. Further, for example, the elastic body 30 is subjected to Z-direction force by the extension surface 703 h of the third ceramic portion 703 and the ceramic substrate 11 . The elastic body 30 may be compressed and deformed in the Z direction. That is, the length 30t of the elastic body 30 may be shorter than the natural length of the elastic body 30 (the length in the Z direction when pressure is not applied by the ceramic substrate 11 and the porous portion). For example, even if particles are generated from the joint portion 60 , the particles can be prevented from reaching the porous portion 70 .

The porous portion 70 has a second porous portion 71 , a second dense portion 73 and a dense portion 72 . The dense portion 72 is, for example, cylindrical. The dense portion 72 is denser than the second porous portion 71 . The porosity of the second porous portion 71 is higher than that of the dense portion 72 . For example, the density of the second porous portion 71 is lower than the density of the dense portion 72 . The gas permeability of the second porous portion 71 is higher than the gas permeability of the dense portion 72 . Dense portion 72 may be substantially gas-permeable. The second porous portion 71 is in contact with the outer peripheral side surface of the dense portion 72 . The second porous portion 71 is annular (tubular) surrounding the outer peripheral side surface of the dense portion 72 . In addition, when the dense portion 72 is not provided, the second porous portion 71 has, for example, a cylindrical shape. The second dense portion 73 is in contact with the outer peripheral side surface of the second porous portion 71 . The second dense portion 73 is annular (tubular) surrounding the outer peripheral side surface of the second porous portion 71 .

The elastic body 30 is in contact with the second dense portion 73 . For example, the side surface 701f of the first ceramic portion 701 and the extension surface 703h of the third ceramic portion 703 are provided in the second dense portion 73, respectively. As a result, since the strength of at least one of the first ceramic portion 701 and the third ceramic portion 703 in contact with the elastic body is further increased, damage to the ceramic porous portion is effectively suppressed, and the effect of reducing arc discharge is maintained for a long time. It can be maintained for a period of time.

The lower surface of the annular elastic body 30 may be in contact with the extension surface 703h of the third ceramic portion 703 over the entire annular circumference. The inner peripheral side surface of the annular elastic body 30 may be in contact with the side surface 701f of the first ceramic portion 701 over the entire annular circumference.

Embodiments may include the following configurations.
(Configuration 1)
a ceramic dielectric substrate having a first main surface on which an object to be attracted is placed and a second main surface opposite to the first main surface;
a base plate that supports the ceramic dielectric substrate and has an upper surface facing the ceramic dielectric substrate and a lower surface opposite to the surface;
a joint provided between the ceramic dielectric substrate and the base plate;
a gas introduction path penetrating through the ceramic dielectric substrate, the base plate and the joint,
a first hole located in the ceramic dielectric substrate;
a second hole located in the base plate;
a gas introduction path having a third hole located at the joint;
a counterbored portion provided in the first hole;
a ceramic porous portion having a first surface on the side of the third hole portion and a second surface opposite to the first surface, the ceramic porous portion being provided in the counterbored portion;
an elastic body provided facing the end of the joint portion on the third hole side,
The ceramic porous portion further has a side surface connecting the first surface and the second surface,
The aspect is
a first side portion on the side of the first surface;
a second side portion on the second surface side;
and a third side portion between the first side portion and the second side portion, wherein a direction from the base plate toward the ceramic dielectric substrate is defined as a first direction and substantially orthogonal to the first direction. When the direction to do is the second direction,
A first inclined portion inclined with respect to the first direction is provided in a region of the first side portion that is in contact with at least the first surface,
When viewed from the second direction, the first surface overlaps the joint portion and the elastic body,
The electrostatic chuck, wherein the ceramic porous portion is configured to contact the elastic body at the first inclined portion.
(Configuration 2)
The ceramic porous portion has a porous portion having gas permeability and a dense portion denser than the porous portion, and the dense portion is arranged so as to cover the outer circumference of the porous portion, and The electrostatic chuck according to configuration 1, wherein the first inclined portion is provided in the dense portion.
(Composition 3)
3. The electrostatic chuck of configuration 1 or 2, wherein the first side comprises the first angled portion.
(Composition 4)
a second sloping portion that is at least part of the third side portion and that is continuous with the first sloping portion;
The electrostatic chuck according to configuration 3, wherein a fixing portion for fixing the ceramic porous portion to the counterbore is provided between the counterbore and the second inclined portion.
(Composition 5)
5. The electrostatic chuck according to configuration 4, wherein the length of the second side portion along the second direction is substantially the same as the length of the counterbore portion along the second direction.
(Composition 6)
any one of configurations 1 to 5, wherein a length of a portion of the elastic body in contact with the first inclined portion along the first direction is longer than a length of the joint portion along the first direction; Electrostatic chuck as described.
(Composition 7)
The electrostatic chuck according to any one of configurations 1 to 6, wherein the elastic body is annular, and the first surface is surrounded by the elastic body when viewed from the first direction.
(Composition 8)
The electrostatic chuck according to any one of configurations 1 to 7, wherein the elastic body includes at least one of polytetrafluoroethylene and polyimide.
(Composition 9)
an electrostatic chuck according to any one of configurations 1 to 8;
a supply unit capable of supplying gas to the gas introduction path provided in the electrostatic chuck;
A processing device comprising:
(Configuration 10)
a ceramic dielectric substrate having a first main surface on which an object to be attracted is placed and a second main surface opposite to the first main surface;
a base plate that supports the ceramic dielectric substrate and has an upper surface facing the ceramic dielectric substrate and a lower surface opposite to the upper surface;
a joint provided between the ceramic dielectric substrate and the base plate;
A gas introduction path penetrating through the ceramic dielectric substrate, the base plate and the joint, the gas introducing passage comprising: a first hole positioned in the ceramic dielectric substrate; a second hole positioned in the base plate; and the joint a gas introduction path having a third hole located at
a counterbored portion provided in the first hole or the second hole;
a ceramic porous portion having a first surface on the side of the third hole portion and a second surface opposite to the first surface, the ceramic porous portion being provided in the counterbored portion;
an elastic body provided facing the end of the joint portion on the third hole side;
with
When the direction from the base plate to the ceramic dielectric substrate is defined as a first direction, and the direction perpendicular to the first direction is defined as a second direction, the ceramic porous portion is a first ceramic body having the first surface. a second ceramic portion having said second face; and a third ceramic portion located between said first ceramic portion and said second ceramic portion in said first direction;
the length of the first ceramic portion along the second direction is shorter than the length of the third ceramic portion along the second direction;
When viewed from the second direction, the first surface overlaps the joint portion and the elastic body,
at least a portion of the elastic body overlaps the third ceramic portion in the first direction;
The electrostatic chuck, wherein the elastic body is in contact with at least one of the first ceramic portion and the third ceramic portion.
(Composition 11)
The ceramic porous portion has a side surface connecting the first surface and the second surface,
The side surface includes a first side portion on the first surface side, a second side portion on the second surface side, and a third side portion between the first side portion and the second side portion. have
A first inclined portion that is inclined with respect to the first direction is provided in a region of the first side portion that is in contact with at least the first surface,
11. The electrostatic chuck according to configuration 10, wherein the ceramic porous portion is in contact with the elastic body at the first inclined portion.
(Composition 12)
the third ceramic portion has an extended surface extending along the second direction;
The electrostatic chuck according to configuration 10, wherein the elastic body is in contact with the extension surface.
(Composition 13)
The ceramic porous portion has a porous portion having gas permeability and a dense portion denser than the porous portion,
The dense portion is arranged so as to cover the outer circumference of the porous portion,
13. The electrostatic chuck according to any one of configurations 10 to 12, wherein the elastic body is in contact with the dense portion.
(Composition 14)
14. The electrostatic chuck according to any one of configurations 10 to 13, wherein the length of the second ceramic portion along the second direction is substantially the same as the length of the counterbored portion along the second direction.
(Composition 15)
The electrostatic chuck according to any one of configurations 10 to 14, wherein the elastic body is compressively deformed in the first direction.
(Composition 16)
The electrostatic chuck according to any one of configurations 10 to 15, wherein the elastic body is annular, and the first surface is surrounded by the elastic body when viewed from the first direction.
(Composition 17)
17. The electrostatic chuck according to any one of configurations 10 to 16, wherein the elastic body includes at least one of polytetrafluoroethylene and polyimide.
(Composition 18)
an electrostatic chuck according to any one of configurations 10 to 17;
a supply unit capable of supplying gas to the gas introduction path provided in the electrostatic chuck;
A processing device comprising:

In the present specification, "perpendicular", "parallel" and "perpendicular" include not only strictly perpendicular, strictly parallel and strictly orthogonal, but also variations in the manufacturing process, for example, substantially perpendicular, It is sufficient if they are substantially parallel and substantially orthogonal.

The embodiments of the present invention have been described above. However, the invention is not limited to these descriptions. For example, as the electrostatic chuck 110, a configuration using Coulomb force was illustrated, but a configuration using Johnson-Rahbek force is also applicable. In addition, the above-described embodiments are also included in the scope of the present invention as long as they are provided with the features of the present invention, as long as they are appropriately modified in design by those skilled in the art. Moreover, each element provided in each of the above-described embodiments can be combined as long as it is technically possible, and a combination of these is also included in the scope of the present invention as long as it includes the features of the present invention.

11 ceramic dielectric substrate 11a first principal surface 11b second principal surface 12 electrode 13 dot 14 groove 16 pore 20 connection portion 30 elastic body 50 base plate 50a upper portion 50b lower portion 50u upper surface 50d lower surface 51 input path 52 output path 53 gas introduction path 53a first hole 53aa first portion t1a length (width) 53ab second portion 53ac intermediate portion 53b second hole 53bu third portion 53bd fourth portion 53c third hole portion tc length (width) 53s counterbored portion ts length (width) 55 communicating passage 60 junction 60e end h2 length ( height), 65 fixed portion, 70 ceramic porous portion (porous portion), 70a third surface, 70b fourth surface, 70c first surface, 70d second surface, 70f side surface, 70s side surface, 71 second porous portion , 72 Dense portion 73 Second dense portion t2 Length (width) 90 Ceramic porous portion (porous portion) 90a First surface 90b Second surface 90f Side 90s Side 90s1 First side , 90s2 second side portion 90s3 third side portion 91 first porous portion 91s outer peripheral side surface 93 first dense portion t1 length (width) 110 electrostatic chuck 200 processing device 210 power supply 211 wiring , 220 medium supply unit, 221 storage unit, 222 control valve, 223 discharge unit, 230 supply unit, 231 gas supply unit, 232 gas control unit, 240 chamber, 701 first ceramic part, 701f side surface, 702 second ceramic part, 702f side surface 703 third ceramic portion 703f side surface 703h extension surface 901 first ceramic portion 901f side surface 902 second ceramic portion 902f side surface 903 third ceramic portion 903f side surface 903h extension surface S1 First inclined portion S2 Second inclined portion S11 First inclined portion S12 Second inclined portion t4a length t701 length t702 length t703 length t901 length t902 length t903 length θ1 angle θ2 angle W object

Claims (18)

a ceramic dielectric substrate having a first main surface on which an object to be attracted is placed and a second main surface opposite to the first main surface;
a base plate that supports the ceramic dielectric substrate and has an upper surface facing the ceramic dielectric substrate and a lower surface opposite to the surface;
a joint provided between the ceramic dielectric substrate and the base plate;
a gas introduction path penetrating through the ceramic dielectric substrate, the base plate and the joint,
a first hole located in the ceramic dielectric substrate;
a second hole located in the base plate;
a gas introduction path having a third hole located at the joint;
a counterbored portion provided in the first hole;
a ceramic porous portion having a first surface on the side of the third hole portion and a second surface opposite to the first surface, the ceramic porous portion being provided in the counterbored portion;
an elastic body provided facing the end of the joint portion on the third hole side,
The ceramic porous portion further has a side surface connecting the first surface and the second surface,
The aspect is
a first side portion on the side of the first surface;
a second side portion on the second surface side;
and a third side portion between the first side portion and the second side portion, wherein a direction from the base plate toward the ceramic dielectric substrate is defined as a first direction and substantially orthogonal to the first direction. When the direction to do is the second direction,
A first inclined portion inclined with respect to the first direction is provided in a region of the first side portion that is in contact with at least the first surface,
When viewed from the second direction, the first surface overlaps the joint portion and the elastic body,
The electrostatic chuck, wherein the ceramic porous portion is configured to contact the elastic body at the first inclined portion. The ceramic porous portion has a porous portion having gas permeability and a dense portion denser than the porous portion, and the dense portion is arranged so as to cover the outer circumference of the porous portion, and 2. The electrostatic chuck of claim 1, wherein a first sloped portion is provided in said dense portion. 3. The electrostatic chuck of claim 1 or 2, wherein the first side portion comprises the first sloped portion. a second sloping portion that is at least part of the third side portion and that is continuous with the first sloping portion;
4. The electrostatic chuck according to claim 3, wherein a fixing portion for fixing said ceramic porous portion to said counterbored portion is provided between said counterbore portion and said second inclined portion. 5. The electrostatic chuck according to claim 4, wherein the length of said second side portion along said second direction is substantially the same as the length of said counterbored portion along said second direction. 3. The electrostatic according to claim 1, wherein a length of a portion of the elastic body in contact with the first inclined portion along the first direction is longer than a length of the joint portion along the first direction. Chuck. 3. The electrostatic chuck according to claim 1, wherein said elastic body is annular, and said first surface is surrounded by said elastic body when viewed in said first direction. 3. The electrostatic chuck according to claim 1, wherein said elastic body contains at least one of polytetrafluoroethylene and polyimide. an electrostatic chuck according to claim 1 or 2;
a supply unit capable of supplying gas to the gas introduction path provided in the electrostatic chuck;
A processing device comprising: a ceramic dielectric substrate having a first main surface on which an object to be attracted is placed and a second main surface opposite to the first main surface;
a base plate that supports the ceramic dielectric substrate and has an upper surface facing the ceramic dielectric substrate and a lower surface opposite to the upper surface;
a joint provided between the ceramic dielectric substrate and the base plate;
A gas introduction path penetrating through the ceramic dielectric substrate, the base plate and the joint, the gas introducing passage comprising: a first hole positioned in the ceramic dielectric substrate; a second hole positioned in the base plate; and the joint a gas introduction path having a third hole located at
a counterbored portion provided in the first hole or the second hole;
a ceramic porous portion having a first surface on the side of the third hole portion and a second surface opposite to the first surface, the ceramic porous portion being provided in the counterbored portion;
an elastic body provided facing the end of the joint portion on the third hole side;
with
When the direction from the base plate to the ceramic dielectric substrate is defined as a first direction, and the direction perpendicular to the first direction is defined as a second direction, the ceramic porous portion is a first ceramic body having the first surface. a second ceramic portion having said second face; and a third ceramic portion located between said first ceramic portion and said second ceramic portion in said first direction;
the length of the first ceramic portion along the second direction is shorter than the length of the third ceramic portion along the second direction;
When viewed from the second direction, the first surface overlaps the joint portion and the elastic body,
at least a portion of the elastic body overlaps the third ceramic portion in the first direction;
The electrostatic chuck, wherein the elastic body is in contact with at least one of the first ceramic portion and the third ceramic portion. The ceramic porous portion has a side surface connecting the first surface and the second surface,
The side surface includes a first side portion on the first surface side, a second side portion on the second surface side, and a third side portion between the first side portion and the second side portion. have
A first inclined portion that is inclined with respect to the first direction is provided in a region of the first side portion that is in contact with at least the first surface,
11. The electrostatic chuck according to claim 10, wherein said ceramic porous portion is in contact with said elastic body at said first inclined portion. the third ceramic portion has an extended surface extending along the second direction;
11. The electrostatic chuck according to claim 10, wherein said elastic body is in contact with said extension surface. The ceramic porous portion has a porous portion having gas permeability and a dense portion denser than the porous portion,
The dense portion is arranged so as to cover the outer circumference of the porous portion,
The electrostatic chuck according to any one of claims 10 to 12, wherein said elastic body is in contact with said dense portion. The electrostatic chuck according to any one of claims 10 to 12, wherein the length of said second ceramic portion along said second direction is substantially the same as the length of said counterbored portion along said second direction. The electrostatic chuck according to any one of claims 10 to 12, wherein said elastic body is compressed and deformed in said first direction. The electrostatic chuck according to any one of claims 10 to 12, wherein said elastic body is annular, and said first surface is surrounded by said elastic body when viewed in said first direction. The electrostatic chuck according to any one of claims 10 to 12, wherein said elastic body includes at least one of polytetrafluoroethylene and polyimide. an electrostatic chuck according to any one of claims 10 to 12;
a supply unit capable of supplying gas to the gas introduction path provided in the electrostatic chuck;
A processing device comprising:

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