JP2023034723A

JP2023034723A - 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス、並びに、化合物

樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス、並びに、化合物 Download PDF

Info

Publication number: JP2023034723A
Authority: JP; Japan
Prior art keywords: group; formula; acid; resin composition; carbon atoms
Prior art date: 2021-08-31
Legal status : Pending

Application number

JP2021141081A

Other languages

English (en)

Japanese (ja)

Inventor

倫弘小川

Tsunehiro Ogawa

俊栄青島

Toshie Aoshima

Current Assignee

Fujifilm Corp

Original Assignee

Fujifilm Corp

Priority date

2021-08-31

Filing date

2021-08-31

Publication date

2023-03-13

2021-08-31 Application filed by Fujifilm Corp filed Critical Fujifilm Corp

2021-08-31 Priority to JP2021141081A priority Critical patent/JP2023034723A/ja

2022-08-29 Priority to KR1020220108138A priority patent/KR20230032961A/ko

2022-08-29 Priority to TW111132534A priority patent/TW202311240A/zh

2022-08-30 Priority to CN202211051414.8A priority patent/CN115729037A/zh

2023-03-13 Publication of JP2023034723A publication Critical patent/JP2023034723A/ja

Status Pending legal-status Critical Current

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150000001875 compounds Chemical class 0.000 title claims abstract description 338
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238000004519 manufacturing process Methods 0.000 title claims abstract description 86
239000004065 semiconductor Substances 0.000 title claims abstract description 26
238000000034 method Methods 0.000 title abstract description 130
229920005989 resin Polymers 0.000 claims abstract description 145
239000011347 resin Substances 0.000 claims abstract description 145
239000002243 precursor Substances 0.000 claims abstract description 138
239000004642 Polyimide Substances 0.000 claims description 154
239000010410 layer Substances 0.000 claims description 154
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125000003118 aryl group Chemical group 0.000 claims description 95
238000010438 heat treatment Methods 0.000 claims description 90
125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 83
125000000962 organic group Chemical group 0.000 claims description 79
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239000002184 metal Substances 0.000 claims description 77
239000000758 substrate Substances 0.000 claims description 43
125000005647 linker group Chemical group 0.000 claims description 42
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230000009471 action Effects 0.000 claims description 21
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229910052720 vanadium Inorganic materials 0.000 description 1
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ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical class OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
238000009736 wetting Methods 0.000 description 1