JP2023013990A - Coil component - Google Patents

Abstract

To provide a coil component which can prevent degradation of reliability due to plating oozing in a plating step of forming an external electrode.SOLUTION: A coil component includes a body including metal magnetic particles 131 and 132 and an insulating resin 120, a coil part arranged in the body, and a first external electrode and a second external electrode which are arranged in the body so as to be separated from one another and are connected to both ends of the coil part. The surface of the body has a first region and a second region where the first external electrode and the second external electrode are arranged, and a third region where the first external electrode and the second external electrode are not arranged. A part of the metal magnetic particles is exposed to the third region of the body, and a monomolecular organic matter 10 including a hydrophobic part is provided on the exposed surface of the metal magnetic particles exposed to the third region of the body.SELECTED DRAWING: Figure 5

Description

The present invention relates to coil components.

An inductor, which is one of coil components, is a typical passive electronic component used in electronic devices along with resistors and capacitors.

As electronic devices become more sophisticated and smaller in size, the number of electronic components used in the electronic devices is increasing and the size is being reduced.

In the case of a thin-film inductor, a magnetic composite sheet containing metal magnetic particles and insulating resin is laminated and cured on an insulating substrate on which a coil portion is formed by plating to form a main body, and external electrodes are formed on the surface of the main body.

Although part of the external electrodes can be formed by plating in order to reduce the thickness of the parts, in this case, plating bleeding (solder wicking) may occur due to the metal magnetic particles exposed on the surface of the main body.

Japanese Patent Publication No. 2016-178282

An object of an example of the present invention is to provide a coil component capable of preventing deterioration in reliability due to plating bleeding in a plating process for forming external electrodes.

Another object of an example of the present invention is to provide a coil component that can reduce the number of steps.

According to one aspect of the present invention, a main body including metal magnetic particles and an insulating resin, a coil part disposed in the main body, and coil parts spaced apart from each other in the main body and connected to both ends of the coil part, respectively. The surface of the body includes first and second regions where the first and second external electrodes are arranged and a second region where the first and second external electrodes are not arranged. part of the metal magnetic particles are exposed in the third region of the main body, and the surface of the metal magnetic particles exposed in the third region of the main body has a hydrophobic portion; A coil component is provided having a monomolecular organic comprising.

According to one embodiment of the present invention, it is possible to prevent deterioration of the reliability of parts due to plating bleeding in the plating process for forming the external electrodes.

Also, according to an example of the present invention, the number of manufacturing steps of the coil component can be reduced.

It is a drawing schematically showing a coil component according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II′ of FIG. 1; FIG. FIG. 2 is a cross-sectional view taken along line II-II′ of FIG. 1; FIG. FIG. 3 is an enlarged view of A of FIG. 2; FIG. 4 is an enlarged view of B of FIG. 3; FIG. FIG. 4 is a schematic view of a coil component according to another embodiment of the present invention; FIG. FIG. 4 is a schematic view of a coil component according to still another embodiment of the present invention; FIG. FIG. 8 is a cross-sectional view taken along line III-III' of FIG. 7;

The terminology used in this application is only used to describe particular embodiments and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "including" or "having" are intended to specify the presence of the features, numbers, steps, acts, components, parts, or combinations thereof set forth in the specification. does not preclude the presence or addition of one or more other features, figures, steps, acts, components, parts or combinations thereof. In addition, "above" throughout the specification means to be positioned above or below the target portion, and does not necessarily mean to be positioned above with respect to the direction of gravity.

In addition, in the contact relationship between each component, the connection does not mean only the case where each component is in direct physical contact, but another configuration is interposed between each component, and another configuration It is used as a concept that includes the case where the components are in contact with each other.

The size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to those shown.

In the drawings, the L direction may be defined as a first direction or length direction, the W direction may be defined as a second direction or width direction, and the T direction may be defined as a third direction or thickness direction.

Hereinafter, coil components according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. Redundant explanations are omitted.

Various types of electronic components are used in electronic devices, and various types of coil components can be suitably used among such electronic components for purposes such as noise removal.

That is, coil components in electronic devices are used in power inductors, high frequency inductors (HF inductors), general beads, high frequency beads (GHz beads), common mode filters, and the like. can be

FIG. 1 is a drawing schematically showing a coil component according to an embodiment of the present invention, FIG. 2 is a drawing showing a cross section along line II′ of FIG. 1, and FIG. 4 is an enlarged view of A of FIG. 2, and FIG. 5 is an enlarged view of B of FIG. be.

1 to 5, a coil component 1000 according to an embodiment of the present invention may include a main body 100, an insulating substrate 200, a coil part 300, external electrodes 400 and 500, and an insulating film IF.

The main body 100 has the appearance of the coil component 1000 according to the present embodiment, and has an insulating substrate 200 and a coil portion 300 embedded therein, which will be described later.

The body 100 may be generally formed in a hexahedral shape.

1 to 3, the main body 100 has a first surface 101 and a second surface 102 facing each other in the length direction L, a third surface 103 and a fourth surface 104 facing each other in the width direction W, and a thickness direction T. It includes a fifth surface 105 and a sixth surface 106 facing each other. Each of the first to fourth surfaces 101 , 102 , 103 and 104 of the main body 100 corresponds to a wall surface of the main body 100 connecting the fifth surface 105 and the sixth surface 106 of the main body 100 . Hereinafter, both cross sections (one cross section and another cross section) of the body 100 refer to the first side 101 and the second side 102 of the body, and both sides (one side and the other side) of the body 100 refer to the third side 103 of the body. and fourth surface 104 . Also, the one side and the other side of the body 100 can mean the sixth side 106 and the fifth side 105 of the body 100, respectively. The sixth surface 106 of the main body 100 can be used as a mounting surface when mounting the coil component 1000 according to the present embodiment on a mounting insulating substrate such as a printed circuit insulating substrate.

The entire surface 101, 102, 103, 104, 105, 106 of the main body 100 has first and second regions where the external electrodes 400, 500 are arranged and a third region where the external electrodes 400, 500 are not arranged. and As an example, as shown in FIGS. 1 to 3, the first regions of the entire surfaces 101, 102, 103, 104, 105, and 106 of the body 100 are the regions where the first external electrodes 400 are arranged, i.e. , can mean the entire first side 101 of the body 100 and a portion of each of the third to sixth sides 103, 104, 105, 106 of the body 100. As shown in FIG. The second area of the entire surfaces 101, 102, 103, 104, 105, and 106 of the main body 100 is the area where the second external electrode 500 is arranged, that is, the entire second surface 102 of the main body 100 and the main body. A portion of each of the third to sixth faces 103, 104, 105, 106 of 100 can be meant. A third region of the entire surfaces 101, 102, 103, 104, 105, and 106 of the body 100 is a region where the first and second external electrodes 400 and 500 are not arranged, that is, the third region of the body 100. It can mean a portion of each of the third to sixth surfaces 103, 104, 105, .

The main body 100 has a length of 2.5 mm, a width of 2.0 mm, and a thickness of 1.0 mm, for example, the coil component 1000 according to the present embodiment in which external electrodes 400 and 500 are formed, which will be described later. 1.6 mm length, 0.8 mm width and 0.8 mm thickness; 1.0 mm length, 0.5 mm width and 0.5 mm thickness; It can be formed to have a length of 0.4 mm and a thickness of 0.65 mm, but is not limited thereto. On the other hand, the exemplary numerical values for the length, width, and thickness of the coil component 1000 are numerical values that do not reflect the process error. It should be said that it corresponds to a reasonable numerical value.

The length of the coil component 1000 described above is based on an optical microscope or SEM (Scanning Electron Microscope) photograph of a cross-section in the length direction L-thickness direction T at the center in the width direction W of the coil component 1000. , connecting two outermost boundary lines facing each other in the length direction L of the coil component 1000 shown in the cross-sectional photograph, and among the dimensions of each of a plurality of line segments parallel to the length direction L It can mean the maximum value. Alternatively, the dimension of each of a plurality of line segments parallel to the length direction L connecting two outermost boundary lines facing the length direction L of the coil component 1000 shown in the cross-sectional photograph can mean the minimum value of Alternatively, the dimension of each of a plurality of line segments parallel to the length direction L connecting two outermost boundary lines facing the length direction L of the coil component 1000 shown in the cross-sectional photograph can mean an arithmetic mean value of at least three or more of Here, the plurality of line segments parallel to the length direction L may be equally spaced in the thickness direction T, but the scope of the present invention is not limited thereto.

The thickness of the coil component 1000 described above is based on an optical microscope or SEM (Scanning Electron Microscope) photograph of a cross-section in the length direction L-thickness direction T at the center in the width direction W of the coil component 1000. , connecting the two outermost boundary lines facing the thickness direction T of the coil component 1000 shown in the cross-sectional photograph, and measuring the dimensions of each of a plurality of line segments parallel to the thickness direction T It can mean the maximum value among them. Alternatively, each dimension of a plurality of line segments parallel to the thickness direction T by connecting two outermost boundary lines facing the thickness direction T of the coil component 1000 shown in the cross-sectional photograph can mean the minimum value of Alternatively, each dimension of a plurality of line segments parallel to the thickness direction T by connecting two outermost boundary lines facing the thickness direction T of the coil component 1000 shown in the cross-sectional photograph can mean an arithmetic mean value of at least three or more of Here, the plurality of line segments parallel to the thickness direction T may be equidistant in the length direction L, but the scope of the present invention is not limited thereto.

The width of the coil component 1000 described above is based on an optical microscope or SEM (Scanning Electron Microscope) photograph of a cross-section in the length direction L-width direction W at the center in the thickness direction T of the coil component 1000. , connecting the two outermost boundary lines facing the width direction W of the coil component 1000 shown in the cross-sectional photograph, and the maximum dimension of each of a plurality of line segments parallel to the width direction W can represent a value. Alternatively, the two outermost boundary lines facing the width direction W of the coil component 1000 shown in the cross-sectional photograph are respectively connected, and the dimension of each of a plurality of line segments parallel to the width direction W is It can mean the minimum value. Alternatively, the two outermost boundary lines facing the width direction W of the coil component 1000 shown in the cross-sectional photograph are respectively connected, and the dimension of each of a plurality of line segments parallel to the width direction W is It can mean the arithmetic mean of at least three or more. Here, the plurality of line segments parallel to the width direction W may be equidistant from each other in the length direction L, but the scope of the present invention is not limited thereto.

Alternatively, each of the length, width and thickness of coil component 1000 can be measured by micrometer measurement. In the micrometer measurement method, the zero point is set with a Gage R&R (Repeatability and Reproducibility) micrometer, the coil component 1000 according to the present embodiment is inserted between the chips of the micrometer, and the measuring lever of the micrometer is turned to measure. can do. On the other hand, when measuring the length of the coil component 1000 using a micrometer measurement method, the length of the coil component 1000 may mean a value measured once, or may mean an arithmetic mean of values measured a plurality of times. may The same can be applied to the width and thickness of the coil component 1000 as well.

The main body 100 may have a core 110 penetrating through the central portions of the insulating substrate 200 and the coil portion 300, which will be described later. The core 110 may be formed by filling a through hole penetrating through the center of each of the coil part 300 and the insulating substrate 200 with a magnetic composite sheet, but is not limited thereto.

The body 100 includes an insulating resin 110 and metal magnetic particles 131 and 132 . For example, the main body 100 may be formed by stacking one or more magnetic composite sheets including the insulating resin 110 and the metal magnetic particles 131 and 132 dispersed in the insulating resin 110 .

The insulating resin 110 may include epoxy, polyimide, liquid crystal polymer, etc. alone or in combination, but is not limited thereto.

Each of the metal magnetic particles 131 and 132 includes iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), At least one selected from the group consisting of boron (B) and nickel (Ni) may be included. For example, the metal magnetic particles 131 and 132 are pure iron particles, Fe—Si alloy particles, Fe—Si—Al alloy particles, Fe—Ni alloy particles, Fe—Ni—Mo alloy particles, Fe—Ni— Mo—Cu alloy particles, Fe—Co alloy particles, Fe—Ni—Co alloy particles, Fe—Cr alloy particles, Fe—Cr—Si alloy particles, Fe—Si—Cu—Nb alloy particles, At least one of Fe--Ni--Cr based alloy particles and Fe--Cr--Al based alloy particles may be used.

Each of the metal magnetic particles 131, 132 can be amorphous or crystalline. For example, the metal magnetic particles 131 and 132 may be Fe--Si--B--Cr based amorphous alloy particles, but are not necessarily limited thereto. Each of the metal magnetic particles 131, 132 may have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

The metal magnetic particles 131 and 132 may include first particles 131 and second particles 132 having a smaller particle size than the first particles 131 . As used herein, particle size or average diameter can mean a particle size distribution expressed as _D90 or _D50 . In the case of the present invention, the metal magnetic particles 131 and 132 include the first particles 131 and the second particles 132 having a smaller particle size than the first particles 131, so that the second particles 132 are placed in the spaces between the first particles 131. can be arranged so that the proportion of magnetic material in the body 100 can be improved compared to the body 100 of the same volume. On the other hand, in the following description, for convenience of explanation, it is assumed that the metal magnetic particles 131 and 132 of the main body 100 are composed of the first particles 131 and the second particles 132 having different particle sizes. The scope is not limited to this. As another non-limiting example of the present invention, the metal magnetic particles may include three types of particles with different particle sizes.

An insulating coating layer may be formed on the surfaces of the metal magnetic particles 131 and 132 . Specifically, the first particle 131 may include a conductive first core particle and a first insulating coating layer covering at least a portion of the surface of the first core particle. The second particles 132 may include conductive second core particles and a second insulating coating layer covering at least a portion of the surfaces of the second core particles. The insulating coating layer is, for example, an organic film containing epoxy, polyimide, liquid crystal polymer (Liquid Crystal Polymer) alone or in combination, or silica (SiO ₂ ) or alumina (Al). ₂ O ₃ ) or a metal oxide film containing metal. Here, when the insulating coating layer is a metal oxide film, the metal oxide film may contain the metal elements of the metal magnetic particles 131 and 132, but the scope of the present invention is not limited to this. The oxide film can contain metal elements other than the metal elements of the metal magnetic particles 131 and 132 .

The metal magnetic particles 131, 132 are exposed on the first to sixth surfaces 101, 102, 103, 104, 105, 106 of the main body 100, respectively.

The exposed surfaces of the metal magnetic particles 131 and 132 exposed on the first to fourth surfaces 101, 102, 103 and 104 of the body 100 are substantially the same as the first to fourth surfaces 101, 102, 103 and 104 of the body 100. can have planes parallel to each other. Generally, in the case of a coil component, a coil substrate is formed in a form in which a plurality of coil parts are connected to each other on a large-area insulating substrate, and a magnetic composite sheet containing metal magnetic particles and an insulating resin is laminated and cured on the coil substrate. to manufacture a coil bar in which a plurality of bodies are connected to each other, and perform a dicing process along dicing lines parallel to the length direction L and the width direction W of the individual parts, respectively. The body of the part can be individualized. Among the metal magnetic particles, those arranged on the dicing line are cut by a dicing saw in the dicing process. Accordingly, in the case of the present embodiment, the exposed surfaces of the metal magnetic particles 131 and 132 exposed on the first to fourth surfaces 101, 102, 103 and 104 of the main body 100 facing each other in the length direction L and the width direction W are , can have a cutting plane substantially parallel to the first to fourth faces 101 , 102 , 103 , 104 of the body 100 . As an example, referring to FIG. 5, the first metal magnetic particles 131 exposed on the fourth surface 104 of the body 100 have cut surfaces, and the first metal magnetic particles 131 exposed on the fourth surface 104 of the body 100 are cut. The plane can be substantially parallel to the fourth side 104 of the body 100 . Also, referring to FIG. 5 , the cut surfaces of the first metal magnetic particles 131 exposed on the fourth surface 104 of the body 100 may be coplanar with the fourth surface 104 of the body 100 . The cut surfaces of the first metal magnetic particles 131 exposed on the fourth surface 104 of the body 100 may be obtained by cutting both the first core particles and the first insulating coating layer of the first metal magnetic particles 131 . As a result, the first core particles of the first metal magnetic particles 131 are exposed on the fourth surface 104 of the main body 100 on the cut surfaces of the first metal magnetic particles 131, and the metal components of the first metal magnetic particles 131 are exposed. It can be exposed on the fourth surface 104 of the body 100 . On the other hand, FIG. 5 shows that only the first metal magnetic particles 131 are exposed on the fourth surface 104 of the main body 100 and have cut surfaces, but this is only an example and the second metal magnetic particles Particles 132 may also be exposed on fourth surface 104 of body 100 and have a cut surface. In addition, the fourth surface 104 of the main body 100 and the contents of the metal magnetic particles 131 and 132 exposed on the fourth surface 104 of the main body 100 are exposed on the first surface 101 of the main body 100 and the first surface 101 of the main body 100. The metal magnetic particles 131 and 132, the second surface 102 of the main body 100 and the metal magnetic particles 131 and 132 exposed on the second surface 102 of the main body 100 and the third surface 103 of the main body 100 and exposed on the third surface 103 of the main body 100 can also be applied to the metal magnetic particles 131 and 132, respectively.

The metal magnetic particles 131 and 132 exposed on the fifth and sixth surfaces 105 and 106 of the main body 100 may be partially removed from the insulating coating layer disposed on the exposed surfaces to expose the core particles. . In general, the upper and lower surfaces of the individual bodies are exposed to external chemical and/or physical factors in subsequent processes after the dicing process. Accordingly, in the case of the present embodiment, the metal magnetic particles 131 and 132 exposed on the fifth and sixth surfaces 105 and 106 of the main body 100 facing each other in the thickness direction T are covered by the insulating coating layers disposed on the exposed surfaces. can be removed. For example, referring to FIG. 4, the first metal magnetic particles 131 exposed on the fifth surface 105 of the main body 100 may have a part of the insulating coating layer that is exposed to the outside removed. On the other hand, FIG. 4 shows that only the first metal magnetic particles 131 are exposed on the fifth surface 105 of the main body 100 and part of the insulating coating layer is removed, but this is only an example. Not only that, the second metal magnetic particles 132 may also be exposed on the fifth surface 105 of the body 100 . In addition, FIG. 4 shows that part of the insulating coating layer of all the first metal magnetic particles 131 exposed on the fifth surface 105 of the main body 100 is removed, but this is an example. Therefore, the present invention does not exclude the case where the insulating coating layer of some of the exposed first metal magnetic particles 131 is not removed. In addition, the fifth surface 105 of the main body 100 and the contents of the metal magnetic particles 131 and 132 exposed on the fifth surface 105 of the main body 100 are exposed on the sixth surface 106 of the main body 100 and the sixth surface 106 of the main body 100. It can also be applied to metal magnetic particles 131 and 132, respectively.

As a result, in the case of the present embodiment, the third to sixth surfaces 103, 104, 105, Metal magnetic particles 131 and 132 are exposed on a portion of each of 106 . As described above, the exposed surfaces of the metal magnetic particles 131 and 132 exposed on the third to sixth surfaces 103, 104, 105 and 106 of the body 100 expose the core particles of the metal magnetic particles 131 and 132. can be done.

A monomolecular organic material 10 may be disposed on the exposed surfaces of the metal magnetic particles 131 and 132 in the third region of the body 100 . The monomolecular organic material 10 has a hydrophobic portion and a hydrophilic portion disposed between the hydrophobic portion and the exposed surfaces of the metal magnetic particles 131 , 132 . That is, the unimolecular organic material 10 can be a surfactant. The hydrophilic portion of the unimolecular organic material 10 can contain negative charges to bind with the metal cations (M ⁿ⁺ ) present on the exposed surfaces of the metal magnetic particles 131,132. Therefore, the unimolecular organic material 10 can be formed using an anionic surfactant and/or an amphoteric surfactant. For example, the hydrophilic portion of the monomolecular organic material 10 may include at least one of a carboxyl group (COO-), a sulfonic acid group (SOO-) and a phosphate group (POO-). Meanwhile, in the present specification, the monomolecular organic material 10 may mean a monomer that does not undergo polymerization. In addition, the monomolecular organic substance 10 may mean an organic substance having a molecular weight of 100 or more and 500 or less. On the other hand, when the molecular weight of the monomolecular organic substance 10 is less than 100, the length of the hydrophobic part is short, and the hydrophobicity of the hydrophobic part of the monomolecular organic substance 10 may become low. Bleeding of the plating may occur. In addition, when the molecular weight of the monomolecular organic substance 10 exceeds 500, the monomolecular organic substance may be difficult to dissolve in the processing liquid used in the process for forming the monomolecular organic substance 10 on the surface of the main body 100 . In addition, when the molecular weight of the monomolecular organic substance 10 exceeds 500, the monomolecular organic substance 10 may adhere to the conductive resin layers 410, 510 of the external electrodes 400, 500, so that the second layer formed in the subsequent plating step is formed. 1 The metal layers 421 and 521 are difficult to form on the conductive resin layers 410 and 510, or are easily peeled off even if they are formed.

The step of disposing the monomolecular organic material 10 on the main body 100 includes forming conductive resin layers 410 and 510 of the external electrodes 400 and 500 described later on the first and second regions of the main body 100 and leaving only the third region of the main body 100. It can be done after exposing to the outside. Therefore, the monomolecular organic material 10 may be disposed only on the third region of the surface of the body 100 without being disposed on the first and second regions of the surface of the body 100 .

The metal cations (M ⁿ⁺ ) present on the exposed surfaces of the metal magnetic particles 131 and 132 may, for example, originate from the core particles of the metal magnetic particles 131 and 132, or may originate from sources other than the core particles. may be In the former case, for example, the surface of the main body ¹⁰⁰ is ^{pickled .} can include In the latter case, for example, the surface of the main body 100 is chemically treated using a phosphate or the like, and the metal cations (M ⁿ⁺ ) present on the exposed surfaces of the metal magnetic particles 131 and 132 are converted to phosphoric acid. Manganese ions (Mg ²⁺ ) and/or zinc ions (Zn ²⁺ ) derived from salts may be included. On the other hand, when the main body 100 is subjected to both the pickling treatment and the phosphating treatment, the exposed surfaces of the metal magnetic particles 131 and 132 have iron ions (Fe ²⁺ or Fe ³⁺ ) and manganese ions (Mg ²⁺ ). and zinc ions (Zn ²⁺ ) can each be present.

On the other hand, FIGS. 4 and 5 show that the monomolecular organic material 10 of the present embodiment combines with metal cations (M ⁿ⁺ ) to form stearate, but this is not the only limitation. not to be As another example, the unimolecular organics 10 combine with metal cations (M ⁿ⁺ ) to form alkylbenzene sulfonates, alkyl sulfonates, alkyl sulfates, and fluorides. salts of fluorinated fatty acid, fatty alcohol sulfate, α-olefin sulfonate, alkyl alcohol amide, alkyl sulfonic acid acetamide acid acetamide, alkyl succinate sulfonate salts, amino alcohol alkylbenzene sulfonate, naphthenate, alkylphenol sulfonate, naphthalene sulfonate At least one of a salt (naphthalene sulfonate) and a naphthalene carboxylate can be formed.

The fact that the monomolecular organic substance 10 is present on the third region of the surface of the body 100 or that the body 100 is present on the region where the metal magnetic particles 131 and 132 are exposed on the surface distinguishes the substances according to their mobility difference. It can be observed through a chromatographic method. Chromatography may be Liquid Chromatography (LC) or Gas Chromatography (GC). That is, when the third region of the surface of the main body is deposited in an organic solvent containing at least one of ethyl alcohol, IPA and benzene, the monomolecular organic substance 10 is dissolved and extracted in the organic solvent. Quantitative analysis and qualitative analysis of the monomolecular organic substance 10 can be carried out by the photography.

In the case of a general coil component, conductive metal magnetic particles are exposed on the surface of the individual body by the dicing process described above. When the metal magnetic particles are exposed on the surface of the main body, a plating layer is formed not only on the area of the surface of the main body intended for forming the external electrode but also on other areas in the plating process during the process of forming the external electrode. There is That is, the conductive metal magnetic particles exposed on the surface of the main body may cause metal ions contained in the plating solution to be formed on the entire surface of the main body without selectivity. In order to prevent this, in the case of conventional coil components, a surface insulating layer is selectively formed on the remaining area of the surface of the main body excluding the external electrode formation area before the plating process for forming the external electrodes. It was necessary to add a forming step. However, in order to selectively form the surface insulating layer on the surface of the main body, after the surface insulating layer is formed on the entire surface of the main body, only the regions of the surface insulating layer corresponding to the regions for forming the external electrodes are formed. However, in the former case, it is very difficult to align the individual bodies due to the reduction in the size and weight of the parts. In the latter case, the process of selectively forming the surface insulating layer needs to be individually performed for each component, which may cause problems in productivity. Furthermore, since the conventional surface insulating layer is formed by applying and curing a resin paste or by laminating and curing an insulating resin film, the thickness of the surface insulating layer is relatively thick, which makes it possible to manufacture parts of the same size. On the other hand, there is a possibility that the effective volume of the magnetic substance is reduced.

In the case of the present embodiment, by disposing the monomolecular organic material 10 including the hydrophobic portion on the exposed surfaces of the metal magnetic particles 131 and 132 exposed in the third region of the main body 100, the above-described problems of the prior art are solved. Resolve. Since the monomolecular organic substance 10 exists on the exposed surfaces of the metal magnetic particles 131 and 132 and includes a hydrophobic portion, the reactivity of the plating solution and the metal ions of the plating solution in the plating process is significantly reduced. Therefore, in the case of this embodiment, it is possible to reduce the aforementioned problem of plating bleeding that may occur along the exposed surfaces of the metal magnetic particles 131 and 132 . In addition, in the case of the present embodiment, since the above-mentioned plating bleeding can be prevented only by the monomolecular organic substance 10, unlike the conventional surface insulating layer, the thickness of the structure responsible for the plating prevention function can be significantly reduced. be able to. This can increase the effective volume of magnetic material for the same size part. In addition, in the case of the present embodiment, since plating bleeding can be prevented only by the process of forming the monomolecular organic substance 10, there is the problem of the alignment of individual main bodies due to the lightness, thinness, shortness and miniaturization of the parts of the conventional technology described above. It is possible to effectively prevent the problem of lower productivity due to the individual progress of the process for forming the insulating layer. For example, when the step of forming the monomolecular organic material 10 is performed after the conductive resin layers 410 and 510 of the external electrodes 400 and 500 are formed in the first and second regions of the main body 100, the conductive resin layers 410, The conductive particles such as silver (Ag) and/or copper (Cu) contained in 510 have relatively low reactivity with the acidic solutions used in the pickling and phosphating processes described above, which Metal cations may not exist on the exposed surfaces of the conductive resin layers 410 and 510 of the external electrodes 400 and 500 even after pickling and phosphating. As a result, the main body 100 that has undergone the pickling treatment, the phosphating treatment, etc. has positive charges only in the third region of the main body 100 in the surface of the main body 100 . Since the hydrophilic part of the monomolecular organic material 10 has an anion, the monomolecular organic material 10 can be disposed with high selectivity only on the third region of the body 100 having a positive charge among the surfaces of the body 100. . As a result, the configuration for preventing plating bleeding can be collectively arranged on a plurality of main body surfaces, and productivity can be improved.

The concentration of the treatment liquid for forming the unimolecular organics 10 can be from 0.001 g/L to 10 g/L. Preferably, it is 0.1 g/L to 2 g/L. If the concentration of the treatment liquid is less than 0.001 g/L, the monomolecular organic matter 10 may exist unevenly on the surface of the main body 100 . If the concentration of the treatment liquid exceeds 10 g/L, the monomolecular organic matter 10 may be difficult to dissolve in the solvent. 422, 522 of the external electrodes 400, 500 may be difficult to plate.

The metal magnetic particles 131 and 132 are exposed in the third region of the surface of the main body 100, that is, in the third to sixth surfaces 103, 104, 105, and 106 of the main body 100, respectively. The organic matter 10 can exist on each of the exposed surfaces of the plurality of metal magnetic particles 131 and 132 . For example, a plurality of metal magnetic particles 131 and 132 are exposed on the third surface 103 of the main body 100 while being separated from each other. An organic matter 10 can be placed. As a result, the monomolecular organic material 10 may exist in the form of islands on any one surface of the body 100, but the scope of the present invention is not limited thereto.

The monomolecular organic material 10 may further reside in at least a portion of the insulating resin 120 forming the third region of the body 100 . For example, the monomolecular organic material 10 is applied not only to the exposed surfaces of the metal magnetic particles 131 and 132 but also to the insulating resin 120 in the regions where the first and second external electrodes 400 and 500 are not formed on the fifth surface 105 of the main body 100 . can also be placed on the exposed surface of the In the surface treatment process for forming the monomolecular organic material 10, the monomolecular organic material 10 may be combined with the insulating resin 120 depending on the process time, the concentration of the surface treatment solution, and the like.

An insulating substrate 200 is embedded in the body 100 . The insulating substrate 200 is configured to support a coil section 300 which will be described later.

The insulating substrate 200 may be made of an insulating material including at least one of a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, and a photosensitive insulating resin. Alternatively, it may be formed of an insulating material in which at least one of the above resins is impregnated with a reinforcing material such as glass fiber or inorganic filler. For example, the insulating substrate 200 may be formed of an insulating material such as prepreg, Ajinomoto Build-up Film (ABF), FR-4, Bismaleimide Triazine (BT) resin, and Photo Imaginable Dielectric (PID). However, it is not limited to this.

Inorganic fillers include silica ( _SiO2 ), alumina ( _Al2O3 ), silicon carbide (SiC), barium sulfate ( _BaSO4 ), talc, mud, mica powder, aluminum hydroxide (Al(OH) ₃ ) _, magnesium hydroxide (Mg(OH) ₂ ), calcium carbonate ( _CaCO3 ), magnesium carbonate ( _MgCO3 ), magnesium oxide (MgO), boron nitride (BN), aluminum borate ( _AlBO3 ), barium titanate (BaTiO ₃ ) and calcium zirconate (CaZrO ₃ ).

If the insulating substrate 200 is made of an insulating material that includes a reinforcing material, the insulating substrate 200 can provide better rigidity. If the insulating substrate 200 is made of an insulating material that does not contain glass fiber, the insulating substrate 200 is advantageous in reducing the thickness of the entire coil part 300 . If the insulating substrate 200 is formed of an insulating material including a photosensitive insulating resin, the number of processes for forming the coil part 300 is reduced, which is advantageous in reducing production costs and in forming fine vias. .

The coil part 300 is arranged inside the main body 100 and exhibits the characteristics of the coil component. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil unit 300 stores an electric field in a magnetic field to maintain an output voltage, thereby stabilizing the power supply of an electronic device. can.

The coil part 300 includes coil patterns 311 and 312 , vias 320 and lead patterns 331 and 332 . Specifically, in the coil part 300, the first coil pattern 311 and the first lead pattern 331 are arranged on the lower surface of the insulating substrate 200 facing the sixth surface 106 of the main body 100 with reference to the direction of FIGS. A second coil pattern 312 and a second lead pattern 332 are arranged on the upper surface of the insulating substrate 200 facing the lower surface of the insulating substrate 200 . The vias 320 pass through the insulating substrate 200 and are contact-connected to inner ends of the first coil pattern 311 and the second coil pattern 312 . The first and second extraction patterns 331 and 332 are exposed on the first and second surfaces 101 and 102 of the body 100 and connected to first and second external electrodes 400 and 500, respectively, which will be described later. By doing so, the coil part 300 can function as a single coil as a whole between the first and second external electrodes 400 and 500 .

Each of the first coil pattern 311 and the second coil pattern 312 may have a planar spiral shape forming at least one turn around the core 110 . For example, the first coil pattern 311 may form at least one turn around the core 110 on the bottom surface of the insulating substrate 200 .

The lead patterns 331 and 332 are exposed on the first and second surfaces 101 and 102 of the main body 100, respectively. Specifically, the first extraction pattern 331 is exposed on the first surface 101 of the body 100 , and the second extraction pattern 332 is exposed on the second surface 102 of the body 100 .

At least one of the coil patterns 311 and 312, the via 320 and the extraction patterns 331 and 332 may include at least one conductive layer.

As an example, when the second coil pattern 312, the vias 320, and the second lead pattern 332 are formed by plating on the upper surface side of the insulating substrate 200, the second coil pattern 312, the vias 320, and the second lead pattern 332 are formed on the seed layer. and electroplated layers. Here, the electroplated layer may have a fault structure or a multi-layer structure. The multi-layer electrolytic plated layer may be formed with a conformal film structure in which another electrolytic plated layer is formed along the surface of any one electrolytic plated layer. The electroplating layer may be formed in a shape in which another electroplating layer is laminated on only one surface of the electroplating layer. The seed layer may be formed by an electroless plating method or a vapor deposition method such as sputtering. The seed layers of the second coil pattern 312, the via 320, and the second extraction pattern 332 may be integrally formed without forming a boundary therebetween, but the present invention is not limited thereto. Electroplated layers of the second coil pattern 312, the via 320, and the second extraction pattern 332 may be integrally formed without forming a boundary therebetween, but the present invention is not limited thereto.

Coil patterns 311, 312, vias 320, and lead patterns 331, 332 are respectively made of copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead ( Pb), titanium (Ti), chromium (Cr), or an alloy thereof, but not limited thereto.

The external electrodes 400 and 500 are spaced apart from each other on the main body 100 and connected to the coil part 300 . Specifically, the first external electrode 400 is disposed on the first surface 101 of the main body 100 and is contact-connected with the first extraction pattern 331 of the coil part 300 exposed on the first surface 101 of the main body 100 to form a second external electrode. 500 is disposed on the second surface 102 of the main body 100 and contacts and connects with the second extraction pattern 332 of the coil part 300 exposed on the second surface 102 of the main body 100 .

Each of the first and second external electrodes 400 and 500 includes conductive resin layers 410 and 510 in contact with the first and second regions of the main body 100, a first metal layer 421 disposed on the conductive resin layers 410 and 510, 521, a second metal layer 422, 522 disposed on the first metal layer. The conductive resin layers 410 and 510 are formed by applying a conductive paste in which conductive particles containing at least one of silver (Ag) and copper (Cu) are dispersed in a resin such as an epoxy resin. It can be formed by coating and curing the first and second regions. The first metal layers 421 and 521 may be nickel (Ni) plating layers formed by electroplating. The second metal layers 422 and 522 may be tin (Sn) plating layers formed by electroplating. On the other hand, as described above, when the monomolecular organic material 10 is formed after forming the conductive resin layers 410 and 510, the first and second metal layers 421 and 521; 422 and 522 formed by electroplating are It has relatively high selectivity and can be sequentially formed on the conductive resin layers 410 and 510 .

The insulating film IF is for insulating the coil part 300 from the main body 100, and may include a known insulating material such as parylene. Any insulating material can be used for the insulating film IF, and there is no particular limitation. The insulating film IF may be formed by a method such as vapor deposition, but is not limited thereto, and may be formed by stacking insulating films on both sides of the insulating substrate 200 .

FIG. 6 is a schematic diagram of a coil component according to another embodiment of the present invention, FIG. 7 is a schematic diagram of a coil component according to another embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along line III-III′ of FIG. 7; FIG.

Comparing FIGS. 1-5 with FIGS. 6-7, coil components 2000 and 3000 according to other embodiments and also other embodiments of the present invention are compared to coil component 1000 according to one embodiment of the present invention. The coil part 300 is different. Therefore, only the coil portion 300 that differs from one embodiment of the present invention will be described when describing other embodiments and still other embodiments of the present invention. The description of one embodiment of the present invention can be applied as it is to the description of other embodiments of the present invention and other configurations of other embodiments.

Referring to FIG. 6, each of the insulating substrate 200 and the coil part 300 applied to the coil component 2000 according to another embodiment of the present invention is arranged perpendicular to the sixth surface 106, which is the mounting surface of the main body 100. As shown in FIG. Since the coil part 300 is arranged perpendicular to the sixth surface 106 of the main body 100, which is the mounting surface, the mounting area can be reduced while maintaining the volume of the main body 100 and the coil part 300. FIG. As a result, a large number of electronic components can be mounted on a mounting board having the same area. Also, for the reason described above, the direction of the magnetic flux induced in the core 110 by the coil part 300 is arranged parallel to the sixth surface 106 of the main body 100 . As a result, noise induced on the mounting surface of the mounting substrate can be relatively reduced.

7 and 8, a coil part 300 applied to a coil component 3000 according to another embodiment of the present invention is formed by winding a metal wire MW having a coating layer CI formed on its surface. can be a thing Therefore, in the coil part 300 applied to this embodiment, the entire surface of each of the multiple turns is covered with the covering layer IF. The metal wire MW may be a rectangular wire, but is not limited to this. When the coil part 300 is formed of a rectangular wire, for example, as shown in FIG. 8, the cross section of each turn of the coil part 300 may have an overall rectangular shape. On the other hand, although FIG. 8 shows coil section 300 as being an alpha (α) winding, this is exemplary only and coil section 300 is an edge-wise winding. may

An embodiment of the present invention has been described above. The present invention can be modified and changed in various ways such as alterations or deletions, which are also included in the scope of the present invention.

100: Main Body 110: Core 200: Insulating Substrate 300: Coil Part 311, 312: Coil Pattern 320: Via 400, 500: External Electrode IF: Insulating Film 1000, 2000, 3000: Coil Parts

Claims (16)

a main body containing metal magnetic particles and an insulating resin;
a coil portion disposed within the body;
first and second external electrodes spaced apart from each other on the main body and connected to both ends of the coil part, respectively;
the surface of the body has first and second regions where the first and second external electrodes are arranged and a third region where the first and second external electrodes are not arranged;
a portion of the metal magnetic particles are exposed in a third region of the body;
A coil component, wherein the surface of the metal magnetic particles exposed in the third region of the body has a monomolecular organic material including a hydrophobic portion. The unimolecular organic substance is
2. The coil component of claim 1, further comprising a hydrophilic portion coupled to each of the metal present on the exposed surface of the metal magnetic particles and the hydrophobic portion. 3. The coil component according to claim 2, wherein said hydrophilic portion includes at least one of a carboxyl group, a sulfonic acid group and a phosphoric acid group. 4. The coil component according to claim 3, wherein said hydrophilic portion is combined with iron (Fe). 4. The coil component according to claim 3, wherein said hydrophilic portion is combined with manganese (Mn) and/or zinc (Zn). Each of the first and second external electrodes is
4. The coil component according to claim 3, comprising a conductive resin layer that is in contact with the first and second regions of the main body and contains resin and conductive particles. 7. The coil component according to claim 6, wherein said conductive particles contain at least one of silver (Ag) and copper (Cu). Each of the first and second external electrodes is
7. The coil component according to claim 6, further comprising a first metal layer arranged on said conductive resin layer and a second metal layer arranged on said first metal layer. further comprising an insulating substrate disposed within the body;
The coil part is
a coil pattern disposed on at least one surface of the insulating substrate;
are disposed on at least one surface of the insulating substrate, connected to the coil pattern, exposed to the first and second regions of the main body, and connected to the conductive resin layers of the first and second external electrodes, respectively. 8. The coil component of claim 7, comprising first and second lead patterns. 8. The coil component according to claim 7, wherein said coil portion is formed by winding a metal wire having a coating layer formed on its surface. 3. The coil component according to claim 2, wherein said unimolecular organic substance has a molecular weight of 100 or more and 500 or less. The monomolecular organic substance and the metal of the metal magnetic particles are
Alkylbenzene sulfonates, alkyl sulfonates, alkyl sulfates, salts of fluorinated fatty acids, fatty alcohol sulfates, α- α-olefin sulfonates, alkyl alcohol amides, alkyl sulfonic acid acetamides, alkyl succinate sulfonate salts, amino alcohol alkyl benzene sulfonates forming at least one of amino alcohol alkylbenzene sulfonate, naphthenate, alkylphenol sulfonate, naphthalene sulfonate, naphthalene carboxylate; The coil component according to claim 2. the metal magnetic particles are exposed in a plurality of spaced apart portions in a third region of the body;
2. The coil component according to claim 1, wherein said monomolecular organic substance exists on each of the exposed surfaces of said plurality of metal magnetic particles. 2. The coil component according to claim 1, wherein said monomolecular organic substance further exists in at least part of said insulating resin forming a third region of said main body. a main body containing metal magnetic particles and an insulating resin;
a coil portion disposed within the body;
first and second external electrodes spaced apart from each other on the main body and connected to both ends of the coil part, respectively;
the surface of the body has first and second regions where the first and second external electrodes are arranged and a third region where the first and second external electrodes are not arranged;
a portion of the metal magnetic particles are exposed in a third region of the body;
On the surface of the metal magnetic particles exposed in the third region of the main body,
there is a monomolecular organic material comprising a hydrophobic portion and bound to iron (Fe) present on the exposed surface of the metal magnetic particles;
coil parts. Each of the first and second external electrodes is
16. The coil component according to claim 15, comprising a conductive resin layer in contact with the first and second regions of the main body and containing resin and conductive particles.

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