JP2023011522A - Organic film forming device, and organic film forming method - Google Patents

Abstract

To provide an organic film forming device capable of reducing a cooling cost and maintaining the quality of an organic film, and an organic film forming method.SOLUTION: An organic film forming device comprises a chamber capable of maintaining a decompressed atmosphere, a heating unit disposed to face a supported workpiece, a cooling unit supplying the heating unit with cooling gas, and a controller. The cooling unit comprises a first gas supply route supplying the inside of the heating unit with first cooling gas hardly reacting with a heated workpiece, a second gas supply route supplying the heating unit with second cooling gas, a common section commonly used by the first gas supply route and the second gas supply route, and a first valve selectively supplying the common section with the first cooling gas supplied from the first supply route and the second cooling gas supplied from the second supply route. The controller supplies the heating unit with the first cooling gas when the temperature of a workpiece is higher than a threshold and supplies the heating unit with the second cooling gas when the temperature of a workpiece is not higher than a threshold.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD Embodiments of the present invention relate to an organic film forming apparatus and an organic film manufacturing method.

An organic film forming apparatus includes, for example, a chamber capable of maintaining an atmosphere pressure-reduced below atmospheric pressure, and a heater provided inside the chamber to heat a workpiece. Such an organic film forming apparatus heats a substrate coated with a solution containing an organic material and a solvent in an atmosphere whose pressure is reduced below atmospheric pressure to evaporate the solvent contained in the solution, thereby forming an organic film. is formed (see, for example, Patent Document 1).

The substrate on which the organic film is formed is taken out of the chamber or the like in which the processing has been performed, and transported to the next step or the like. When an organic film is formed by heating, the temperature of the substrate rises, and it is difficult to take out the substrate having a high temperature from the chamber or to transfer it. In addition, if taken out at a high temperature, the organic film may oxidize and fail to fulfill its function. Therefore, it is necessary to cool the substrate.

In this case, a method of cooling the substrate by supplying a cooling gas to the inside of the chamber and blowing the cooling gas onto the substrate can be considered. However, when forming an organic film, processing at a very high temperature of about 250.degree. C. to 600.degree. Therefore, the amount of cooling gas consumed until the temperature of the substrate reaches a transferable temperature is enormous. Also, the organic film at about 250° C. to 600° C. has high reactivity. Therefore, if the cooling gas contains oxygen, the organic film will be oxidized. The cost is also increased if an inert gas is used as the cooling gas throughout cooling to prevent oxidation of the organic film.

Therefore, there has been a demand for development of a technique capable of reducing the cost of cooling a workpiece on which an organic film is formed and maintaining the quality of the organic film.

JP 2019-184229 A

SUMMARY OF THE INVENTION It is an object of the present invention to provide an organic film forming apparatus and a method of manufacturing an organic film, which can reduce the cost of cooling a workpiece on which an organic film is formed and can maintain the quality of the organic film.

An organic film forming apparatus according to an embodiment includes a chamber capable of maintaining an atmosphere pressure-reduced below atmospheric pressure, an exhaust section capable of evacuating the interior of the chamber, a substrate, and an organic material applied to the upper surface of the substrate. and a solution containing a solvent, a heating unit provided to face the workpiece supported by the processing area, and supplying a cooling gas to the heating unit. a cooling unit; and a controller that controls the heating unit, the exhaust unit, and the cooling unit. The cooling unit includes a first gas supply path that supplies a first cooling gas that hardly reacts with the heated work to the inside of the heating unit, and a second cooling gas that supplies the inside of the heating unit. a second gas supply path, a shared portion shared by the first supply path and the second supply path, the first cooling gas supplied by the first supply path and the second supply and a first valve for selectively supplying the second cooling gas supplied by the path to the common area. The controller supplies a first cooling gas to the heating unit when the workpiece has a temperature higher than a threshold, and supplies a second cooling gas to the heating unit when the workpiece has a temperature equal to or lower than the threshold, After starting to carry out the processed work from the chamber, the work to be processed next is loaded into the chamber, and the work to be processed next is transferred to the first heating unit, and The first cooling gas is supplied into the chamber until it is heated by at least one of the second heating units.

According to the embodiments of the present invention, an organic film forming apparatus and a method of manufacturing an organic film are provided, which can reduce the cost of cooling a work on which an organic film is formed and can maintain the quality of the organic film. be done.

1 is a schematic perspective view for illustrating an organic film forming apparatus according to an embodiment; FIG. 5 is a graph for illustrating work processing steps and cooling gas supply timing; 1 is a schematic cross-sectional view for illustrating an organic film forming apparatus according to an embodiment; FIG. FIG. 10 is a schematic perspective view for illustrating an organic film forming apparatus according to another embodiment; FIG. 10 is a schematic perspective view for illustrating an organic film forming apparatus according to another embodiment; FIG. 3 is a schematic cross-sectional view for illustrating an organic film forming apparatus according to another embodiment; FIG. 10 is a schematic perspective view for illustrating an organic film forming apparatus according to another embodiment;

Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same reference numerals are given to the same constituent elements, and detailed description thereof will be omitted as appropriate.

FIG. 1 is a schematic perspective view for illustrating an organic film forming apparatus 1 according to this embodiment.
FIG. 3 is a schematic cross-sectional view for illustrating the organic film forming apparatus 1 according to this embodiment.
Note that the X direction, Y direction, and Z direction in FIG. 1 represent three directions orthogonal to each other. The vertical direction in this specification can be the Z direction. Also, in order to avoid complication, FIG. 3 omits elements provided inside the chamber 10 .

A workpiece 100 before forming an organic film has a substrate and a solution applied to the upper surface of the substrate.
The substrate can be, for example, a glass substrate, a semiconductor wafer, or the like. However, the substrate is not limited to those illustrated.
A solution includes, for example, an organic material and a solvent. The organic material is not particularly limited as long as it can be dissolved by a solvent. The solution can be, for example, a varnish containing polyamic acid. However, the solution is not limited to the exemplified one. It also includes a semi-cured state (a state in which the liquid does not flow) due to temporary baking.

As shown in FIG. 1, the organic film forming apparatus 1 includes, for example, a chamber 10, an exhaust section 20, a processing section 30, a cooling section 40, and a controller 60. As shown in FIG.

The controller 60 includes, for example, an arithmetic unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 60 can be, for example, a computer or the like. The controller 60 controls the operation of each element provided in the organic film forming apparatus 1 based on the control program stored in the storage unit.

For example, the controller 60 controls the exhaust section 20 and the heater 32a provided in the organic film forming apparatus 1 . The controller 60 applies electric power to the heater 32a after the internal pressure of the chamber 10 becomes equal to or less than a predetermined value by controlling the exhaust section 20 . For example, the controller 60 can apply power to the heater 32a after the internal pressure of the chamber 10 reaches a pressure at which the oxygen concentration in the chamber becomes a predetermined concentration of 100 ppm or less by controlling the exhaust section 20.

The chamber 10 has an airtight structure capable of maintaining an atmosphere pressure-reduced below atmospheric pressure. The chamber 10 has a box shape. The external shape of the chamber 10 is not particularly limited. The external shape of the chamber 10 can be, for example, a rectangular parallelepiped. The chamber 10 can be made of metal such as stainless steel, for example. Further, the chamber 10 is provided with an oxygen concentration meter 21c for detecting oxygen concentration.
Chamber 10 has main body 10 a , door 13 and lid 15 .

A flange 11 may be provided at one end of the body 10a in the Y direction. The flange 11 may be provided with a sealing material 12 such as an O-ring. The opening 11 a of the chamber 10 on the side where the flange 11 is provided can be opened and closed by a door 13 . A driving device (not shown) presses the door 13 against the flange 11 (sealing material 12) to close the opening 11a of the chamber 10 in an airtight manner. A driving device (not shown) separates the door 13 from the flange 11, thereby opening the opening 11a of the chamber 10 and allowing the workpiece 100 to be carried in or out through the opening 11a.

A flange 14 may be provided at the other end of the body 10a in the Y direction. The flange 14 may be provided with a sealing material 12 such as an O-ring. The opening of the chamber 10 on the side where the flange 14 is provided can be opened and closed with a lid 15 . For example, the lid 15 can be detachably attached to the flange 14 using fastening members such as screws. When performing maintenance or the like, the lid 15 is removed to expose the opening of the chamber 10 on the side where the flange 14 is provided.

A cooling unit 16 can be provided on the outer wall of the chamber 10 and the outer surface of the door 13 . A cooling water supply unit (not shown) is connected to the cooling unit 16 . The cooling unit 16 can be, for example, a water jacket. If the cooling unit 16 is provided, it is possible to prevent the temperature of the outer wall of the chamber 10 and the temperature of the outer surface of the door 13 from becoming higher than a predetermined temperature.

The exhaust part 20 exhausts the inside of the chamber 10 . The exhaust section 20 has, for example, a first exhaust section 21 , a second exhaust section 22 and a third exhaust section 23 .
The first exhaust part 21 is connected to, for example, an exhaust port 17 provided on the bottom surface of the chamber 10 .
The first exhaust section 21 has, for example, an exhaust pump 21a and a pressure control section 21b.
The exhaust pump 21a can be an exhaust pump that performs rough evacuation from atmospheric pressure to a predetermined pressure. Therefore, the exhaust pump 21a has a larger displacement than the later-described exhaust pump 22a. The exhaust pump 21a can be, for example, a dry vacuum pump.

The pressure controller 21b is provided, for example, between the exhaust port 17 and the exhaust pump 21a. The pressure control unit 21b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10 . The pressure control unit 21b can be, for example, an APC (Auto Pressure Controller).

A cold trap 24 for trapping the exhausted sublimate is provided between the exhaust port 17 and the pressure control section 21b. A valve 25 is provided between the exhaust port 17 and the cold trap 24 . The valve 25 is a valve for partitioning the first exhaust section 21 and the chamber 10 in a cooling step, which will be described later.

The second exhaust part 22 is connected to, for example, an exhaust port 18 provided on the bottom surface of the chamber 10 . Although two exhaust ports 18 are provided in this embodiment, one or three or more may be provided.
The second exhaust section 22 has, for example, an exhaust pump 22a and a pressure control section 22b.
After the rough evacuation by the exhaust pump 21a, the exhaust pump 22a evacuates to a predetermined lower pressure. The evacuation pump 22a has, for example, an evacuation capability capable of evacuating to a high-vacuum molecular flow region. For example, the exhaust pump 22a can be a turbo molecular pump (TMP) or the like.

The pressure control section 22b is provided, for example, between the exhaust port 18 and the exhaust pump 22a. The pressure controller 22b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10 . The pressure control unit 22b can be, for example, an APC. A cold trap 24 and a valve 25 can be provided between the exhaust port 18 and the pressure control unit 21b, like the first exhaust unit 21.

The third exhaust section 23 is connected between the exhaust port 18 and the valve 25 of the second exhaust section 22 . The third exhaust section 23 is connected to the factory exhaust system. The third exhaust part 23 can be, for example, a pipe made of stainless steel. The third exhaust section has a valve 25 between the exhaust port 18 and the factory exhaust system.

The processing section 30 has, for example, a frame 31 , a heating section 32 , a support section 33 , a soaking section 34 , a soaking plate support section 35 , and a cover 36 .
Inside the processing unit 30, a processing region 30a and a processing region 30b are provided. The processing areas 30a and 30b are spaces in which the workpiece 100 is processed. A workpiece 100 is supported inside the processing areas 30a, 30b. The processing area 30b is provided above the processing area 30a. In addition, although the case where two processing areas are provided was illustrated, it is not limited to this. Only one processing area may be provided, or more than two processing areas may be provided. In this embodiment, as an example, two processing regions are provided, but one processing region and three or more processing regions can be similarly considered.

The processing regions 30 a and 30 b are provided between the heating units 32 . The processing areas 30a and 30b are surrounded by a soaking section 34 (an upper soaking plate 34a, a lower soaking plate 34b, a side soaking plate 34c, and a side soaking plate 34d).

As will be described later, the soaking section 34 is composed of a plurality of soaking plates. Therefore, the soaking section 34 is not a closed structure. Therefore, when the pressure in the space between the inner wall of the chamber 10 and the processing section 30 is reduced, the pressure in the inner space of the processing regions 30a and 30b is also reduced.

If the pressure in the space between the inner wall of the chamber 10 and the processing section 30 is reduced, the heat released from the processing regions 30a and 30b to the outside can be suppressed. That is, heating efficiency and heat storage efficiency can be improved. Therefore, the electric power applied to the heater 32a, which will be described later, can be reduced. Further, if the power applied to the heater 32a can be reduced, the temperature of the heater 32a can be suppressed from exceeding a predetermined temperature, so the life of the heater 32a can be lengthened.

The frame 31 has a frame structure made of elongated plate material, shaped steel, or the like. The external shape of the frame 31 can be made similar to the external shape of the chamber 10 . The external shape of the frame 31 can be, for example, a rectangular parallelepiped.

A plurality of heating units 32 are provided. The heating units 32 can be provided below the processing regions 30a and 30b and above the processing regions 30a and 30b. The heating section 32 provided below the processing regions 30a and 30b serves as a lower heating section (corresponding to an example of a second heating section). The heating section 32 provided above the processing regions 30a and 30b serves as an upper heating section (corresponding to an example of a first heating section). The lower heating section faces the upper heating section. When a plurality of processing areas are vertically stacked, the upper heating section provided in the lower processing area can also serve as the lower heating section provided in the upper processing area.

The heating unit 32 is provided inside the chamber 10 and heats the workpiece 100 .
For example, the lower surface (back surface) of the workpiece 100 supported by the processing area 30a is heated by the heating unit 32 provided below the processing area 30a. The upper surface (surface) of the workpiece 100 supported by the processing area 30a is heated by the heating unit 32 shared by the processing areas 30a and 30b.

The lower surface (back surface) of the workpiece 100 supported by the processing area 30b is heated by the heating unit 32 shared by the processing areas 30a and 30b. The upper surface (surface) of the workpiece 100 supported by the processing area 30b is heated by the heating unit 32 provided above the processing area 30b.

Each of the plurality of heating units 32 has at least one heater 32a and a pair of holders 32b. In addition, below, the case where several heater 32a is provided is demonstrated.
The heater 32a has a bar shape and extends in the Y direction between the pair of holders 32b. A plurality of heaters 32a can be arranged side by side in the X direction. A plurality of heaters 32a can be provided at regular intervals, for example. The heater 32a can be, for example, a sheathed heater, a far-infrared heater, a far-infrared lamp, a ceramic heater, a cartridge heater, or the like. Also, various heaters can be covered with a quartz cover.

In this specification, the term "rod-shaped heater" includes various heaters covered with a quartz cover. Moreover, the cross-sectional shape of the “rod” is not limited, and includes, for example, a columnar shape and a prismatic shape.
Also, the heater 32a is not limited to the illustrated one. For example, the heater 32a may use heat energy by radiation.

The specifications, number, spacing, and the like of the plurality of heaters 32a in the upper heating section and the lower heating section can be appropriately determined according to the composition of the solution to be heated (solution heating temperature), the size of the workpiece 100, and the like. The specifications, number, intervals, etc. of the plurality of heaters 32a can be appropriately determined by performing simulations, experiments, and the like.

The space in which the plurality of heaters 32a are provided is surrounded by a holder 32b, an upper heat soaking plate 34a, a lower heat soaking plate 34b, a side heat soaking plate 34c, and a side heat soaking plate 34d. Therefore, by supplying the cooling gas from the cooling unit 40 to the space in which the plurality of heaters 32a are provided, the plurality of heaters 32a, the upper heat soaking plate 34a, the lower heat soaking plate 34b, the side heat soaking plate 34c, and the side heat soaking plate 34c The partial heat soaking plate 34d can be cooled. A gap is provided between the upper heat equalizing plates 34a and between the lower heat equalizing plates 34b. Therefore, part of the cooling gas supplied to the space provided with the plurality of heaters 32a from the cooling unit 40, which will be described later, flows into the processing region 30a or the processing region 30b.

A pair of holders 32b extend in the X direction (for example, the longitudinal direction of the processing regions 30a and 30b). The pair of holders 32b are opposed to each other in the Y direction. One holder 32b is fixed to the end face of the frame 31 on the door 13 side. The other holder 32b is fixed to the end surface of the frame 31 opposite to the door 13 side. The pair of holders 32b can be fixed to the frame 31 using, for example, fastening members such as screws. A pair of holders 32b hold non-heat generating portions near the ends of the heater 32a. The pair of holders 32b can be formed, for example, from an elongated metal plate or shaped steel. Materials for the pair of holders 32b are not particularly limited, but materials having heat resistance and corrosion resistance are preferable. The material of the pair of holders 32b can be, for example, stainless steel.

The support portion 33 is provided inside the chamber 10 and supports the workpiece 100 . For example, the support section 33 supports the workpiece 100 between the upper heating section and the lower heating section. A plurality of support portions 33 can be provided. A plurality of support portions 33 are provided below the processing region 30a and below the processing region 30b. The plurality of support portions 33 can be rod-shaped bodies.

One end (upper end) of the plurality of support portions 33 contacts the lower surface (back surface) of the workpiece 100 . Therefore, the shape of one end of each of the plurality of support portions 33 is preferably hemispherical.

The workpiece 100 is heated by radiant thermal energy in an atmosphere that is reduced in pressure below atmospheric pressure. Therefore, the distance from the upper heating portion to the upper surface of the work 100 and the distance from the lower heating portion to the lower surface of the work 100 are distances that allow the heat energy by radiation to reach the work 100 .

The other ends (lower ends) of the plurality of support portions 33 can be fixed to, for example, a plurality of rod-shaped members or plate-shaped members that are bridged between the pair of frames 31 .

The number, arrangement, intervals, etc., of the plurality of support portions 33 can be appropriately changed according to the size and rigidity (deflection) of the workpiece 100 .
The material of the plurality of support portions 33 is not particularly limited, but a material having heat resistance and corrosion resistance is preferable. The material of the plurality of support portions 33 can be, for example, stainless steel.

The soaking section 34 includes a plurality of upper heat soaking plates 34a (corresponding to an example of a first heat soaking plate), a plurality of lower heat soaking plates 34b (corresponding to an example of a second heat soaking plate), a plurality of It has a side soaking plate 34c and a plurality of side soaking plates 34d. The plurality of upper heat soaking plates 34a, the plurality of lower heat soaking plates 34b, the plurality of side heat soaking plates 34c, and the plurality of side heat soaking plates 34d are plate-shaped.

The plurality of upper heat soaking plates 34a are provided on the lower heating section side (workpiece 100 side) in the upper heating section. The plurality of upper heat soaking plates 34a are separated from the plurality of heaters 32a. The plurality of upper heat soaking plates 34a are arranged side by side in the X direction. A gap is provided between the plurality of upper heat equalizing plates 34a. As described above, the pressure in the space of the processing regions 30a, 30b can be reduced through this gap.

The plurality of lower heat equalizing plates 34b are provided on the upper heating section side (workpiece 100 side) in the lower heating section. The plurality of lower heat soaking plates 34b are separated from the plurality of heaters 32a. A plurality of lower heat equalizing plates 34b are arranged side by side in the X direction. A gap is provided between the plurality of lower heat equalizing plates 34b. As described above, the pressure in the space of the processing regions 30a, 30b can be reduced through this gap.

The side soaking plates 34c are provided on both sides of the processing regions 30a and 30b in the X direction. The side heat equalizing plate 34 c can be provided inside the cover 36 . Further, as described above, the side heat equalizing plate 34c is provided with a gap between it and the upper heat equalizing plate 34a or the lower heat equalizing plate 34b. Via this gap, the pressure in the space of the processing regions 30a and 30b can be reduced.

The side soaking plates 34d are provided on both sides of the processing regions 30a and 30b in the Y direction. The side heat soaking plate 34d provided on the door 13 side can be provided on the door 13 with a gap from the cover 36. As shown in FIG. The side heat equalizing plate 34 d provided on the lid 15 side can be provided inside the cover 36 . Further, as described above, the side heat equalizing plate 34d is provided with a gap between it and the upper heat equalizing plate 34a or the lower heat equalizing plate 34b. Via this gap, the pressure in the space of the processing regions 30a and 30b can be reduced.

In the present embodiment, the gaps provided between the upper heat equalizer plates 34a, between the lower heat equalizer plates 34b, etc. , and between the upper heat soaking plate 34a (lower heat soaking plate 34b) and the side heat soaking plate 34d. The reason for this will be described later.

As described above, the plurality of heaters 32a are bar-shaped and arranged side by side at predetermined intervals. When the work 100 is directly heated using the plurality of rod-shaped heaters 32a, the in-plane distribution of the temperature of the heated work 100 varies.

Variations in the in-plane temperature distribution of the workpiece 100 may degrade the quality of the formed organic film. For example, there is a possibility that bubbles will be generated in the part where the temperature is high, or the composition of the organic film will change in the part where the temperature is high.

The organic film forming apparatus 1 according to the present embodiment is provided with the plurality of upper heat soaking plates 34a and the plurality of lower heat soaking plates 34b described above. Therefore, the heat radiated from the plurality of heaters 32a is incident on the plurality of upper heat soaking plates 34a and the plurality of lower heat soaking plates 34b, and is radiated toward the workpiece 100 while propagating in the plane direction inside these. . As a result, it is possible to suppress the in-plane distribution of the temperature of the workpiece 100 from being varied, and thus to improve the quality of the formed organic film.

Since the plurality of upper heat soaking plates 34a and the plurality of lower heat soaking plates 34b propagate incident heat in the plane direction, these materials are preferably made of materials with high thermal conductivity. The plurality of upper heat soaking plates 34a and the plurality of lower heat soaking plates 34b can be made of, for example, aluminum, copper, stainless steel, or the like. Note that when a material that is easily oxidized such as aluminum or copper is used, a layer containing a material that is not easily oxidized is preferably provided on the surface.

A portion of the heat radiated from the plurality of upper heat equalizer plates 34a and the plurality of lower heat equalizer plates 34b is directed to the sides of the processing area. Therefore, the above-described side soaking plates 34c and 34d are provided on the sides of the processing area. Part of the heat incident on the side heat soaking plates 34c and 34d is radiated toward the workpiece 100 while propagating in the plane direction of the side heat soaking plates 34c and 34d. Therefore, the heating efficiency of the workpiece 100 can be improved.

The material of the side heat equalizer plates 34c, 34d can be the same as the material of the upper heat equalizer plate 34a and the lower heat equalizer plate 34b described above.

In the above description, the case where a plurality of upper heat soaking plates 34a and a plurality of lower heat soaking plates 34b are arranged side by side in the X direction is illustrated. , can also be a single plate-like member.

A plurality of heat equalizer support portions 35 are arranged side by side in the X direction. The heat equalizer support portion 35 can be provided directly below between the upper heat equalizer plates 34a. The plurality of heat equalizer support portions 35 can be fixed to the pair of holders 32b using fastening members such as screws. Adjacent heat equalizing plate support portions 35 detachably support both ends of the upper heat equalizing plate 34a. The plurality of heat equalizer support portions 35 that support the plurality of lower heat equalizer plates 34b can also have the same configuration.

The cover 36 has a plate shape and covers the top surface, bottom surface and side surfaces of the frame 31 . That is, the inside of the frame 31 is covered with the cover 36 . However, the cover 36 on the side of the door 13 can be provided on the door 13, for example.

Although the cover 36 surrounds the processing areas 30a and 30b, gaps are provided at the boundary between the top and side surfaces of the frame 31, the boundary between the side surfaces and the bottom surface of the frame 31, and near the door 13. FIG.

Also, the covers 36 provided on the top and bottom surfaces of the frame 31 are divided into a plurality of pieces. A gap is provided between the divided covers 36 . That is, the internal space of the processing section 30 (processing regions 30a and 30b) communicates with the internal space of the chamber 10 through these gaps. Therefore, the pressure in the processing regions 30a, 30b can be made to be the same as the pressure in the space between the inner wall of the chamber 10 and the cover 36. FIG. The cover 36 can be made of, for example, stainless steel.

The cooling unit 40 supplies cooling gas to the region where the heating unit 32 is provided. For example, the cooling unit 40 cools the soaking unit 34 surrounding the processing regions 30a and 30b with the cooling gas G, and indirectly cools the workpiece 100 in a high temperature state by the cooled soaking unit 34 . In addition, for example, the cooling unit 40 supplies the cooling gas to the work 100 through the gap between the upper heat soaking plates 34a or the gap between the lower heat soaking plates 34b to directly cool the work 100 in a high temperature state. You can also
That is, the cooling unit 40 can cool the workpiece 100 indirectly and directly.

The cooling unit 40 has, for example, a first gas supply path 40a and a second gas supply path 40b.
First, the first gas supply path 40a will be described. The first gas supply path 40a supplies the cooling gas G1 to the region where the heating section 32 is provided in the cooling process described later. The first gas supply path 40 a has a nozzle 41 , a gas source 42 , a gas controller 43 and a switching valve 54 .

As shown in FIG. 1, the nozzle 41 can be connected to a space provided with a plurality of heaters 32a. For example, the nozzle 41 can pass through the cover 36 and be attached to the side heat soaking plate 34c, the frame 31, or the like. A plurality of nozzles 41 can be provided in the Y direction (see FIG. 3). Note that the number and arrangement of the nozzles 41 can be changed as appropriate. For example, the nozzles 41 can be provided on one side of the processing section 30 in the X direction, or can be provided on both sides of the processing section 30 . For example, a plurality of nozzles 41 can be arranged side by side in the Y direction.

The gas source 42 supplies the nozzle 41 with a cooling gas G1 corresponding to the first cooling gas. The gas source 42 can be, for example, a high pressure gas cylinder, factory piping, or the like. Also, a plurality of gas sources 42 can be provided.

The cooling gas G1 is preferably a gas that hardly reacts with the heated workpiece 100 . The cooling gas G1 can be, for example, nitrogen gas, rare gas, or the like. The rare gas is, for example, argon gas or helium gas. If the cooling gas G1 is nitrogen gas, the running cost can be reduced. Since helium gas has a high thermal conductivity, the cooling time can be shortened by using helium gas as the cooling gas G1.
The temperature of the cooling gas G1 can be, for example, room temperature (eg, 25° C.) or lower.

A gas control unit 43 is provided between the nozzle 41 and the gas source 42 . The gas control unit 43 can, for example, control at least one of the supply and stop of the cooling gas and the flow velocity and flow rate of the cooling gas.

Moreover, the supply timing of the cooling gas G1 can be set after the heat treatment of the workpiece 100 is completed. Note that the completion of the heat treatment can be after the temperature at which the organic film is formed is maintained for a predetermined period of time.

The switching valve 54 connects the first gas supply path 40a and the second gas supply path 40b, and selects to supply either the cooling gas G1 or the cooling gas G2 to the region in which the heating unit 32 is provided. It is a valve (corresponding to an example of the first valve) for enabling. The switching valve 54 is provided outside the chamber 10 between the nozzle 41 and the gas control section 43 .

Next, the second gas supply path 40b will be explained. The second gas supply path 40b is provided to supply the cooling gas G2 different from the cooling gas G1 to the region where the heating section 32 is provided in the cooling process. As a result, the workpiece 100 that has been cooled to the threshold temperature by the supply of the cooling gas G1 is cooled instead of the cooling gas G1.

The second gas supply path 40b has, for example, a nozzle 41, a gas source 52, a gas controller 53, and a switching valve . In this case, the second gas supply path 40b is connected to the first gas supply path 40a via the switching valve 54. As shown in FIG.

The gas source 52 supplies cooling gas G2 corresponding to the second cooling gas to the multiple nozzles 41 . The gas source 52 can be, for example, a high pressure gas cylinder, factory piping, or the like. Also, a plurality of gas sources 52 can be provided.

Cooling gas G2 may be, for example, clean dry air (CDA). If the cooling gas G2 is clean dry air, the running cost can be reduced. Also, for example, the outside air in the clean room may be introduced through a filter from factory piping.
The temperature of the cooling gas G2 can be, for example, room temperature (eg, 25° C.).

The gas controller 53 is provided between the switching valve 54 and the gas source 52 . The gas control unit 53 can control, for example, the supply of the cooling gas G2 and the stoppage of the supply. The gas control unit 53 can also control at least one of the flow velocity and flow rate of the cooling gas G2, for example. The flow velocity and flow rate of the cooling gas G2 can be appropriately changed according to the size of the chamber 10 and the shape, number, arrangement, etc. of the nozzles 41 . The flow velocity and flow rate of the cooling gas G2 can be obtained as appropriate by, for example, conducting experiments and simulations.

A pipe connecting the switching valve 54 and the nozzle 41 is a portion shared by the first gas supply route 40a and the second gas supply route 40b, and is hereinafter referred to as a shared portion.

Next, the operation of the organic film forming apparatus 1 will be illustrated.
FIG. 2 is a graph for illustrating the process of processing the workpiece 100. As shown in FIG.
As shown in FIG. 2, the organic film forming process includes a work loading process, a temperature raising process, a heat treatment process, a cooling process, and a work unloading process.

First, in the work loading step, the opening/closing door 13 is separated from the flange 11 and the work 100 is loaded into the internal space of the chamber 10 . The cooling gas G1 is supplied to the internal space of the chamber 10 from the first gas supply path 40a at the same time as the workpiece loading step. When the workpiece 100 is carried into the internal space of the chamber 10, the internal space of the chamber 10 is decompressed to a predetermined pressure by the exhaust section 20. As shown in FIG.

When the internal space of the chamber 10 is depressurized to a predetermined pressure, the controller 60 applies power to the heater 32a. Then, as shown in FIG. 2, the temperature of the workpiece 100 rises. A process in which the temperature of the workpiece 100 rises is called a temperature raising process. In this embodiment, the temperature raising process is performed twice (temperature raising processes (1) and (2)). The predetermined pressure may be any pressure at which the polyamic acid in the solution is not oxidized by reacting with the oxygen remaining in the internal space of the chamber 10 . The predetermined pressure may be, for example, 1×10 ⁻² to 100 Pa. In other words, it is not always necessary to evacuate with the second exhaust unit 22. After the first exhaust unit 21 starts exhausting, if the internal space of the chamber 10 has a pressure within the range of 10 to 100 Pa, , the heating of the workpiece 100 by the heating unit 32 may be started.

After the temperature raising process, a heat treatment process is performed. The heat treatment step is a step of maintaining a predetermined temperature for a predetermined time. In this embodiment, a heat treatment step (1) and a heat treatment step (2) can be provided.
The heat treatment step (1) can be, for example, a step of heating the workpiece 100 at a first temperature for a predetermined period of time and discharging moisture, gas, and the like contained in the solution. The first temperature may be, for example, 100.degree. C. to 200.degree.

By performing the heat treatment step (1), it is possible to prevent moisture and gas contained in the solution from being contained in the finished organic film. Note that the first heat treatment step can be performed a plurality of times while changing the temperature depending on the components of the solution, or the first heat treatment step can be omitted.

The heat treatment step (2) is a step of maintaining the substrate (workpiece 100) coated with the solution at a predetermined pressure and temperature (second temperature) for a predetermined time to form an organic film. The second temperature may be a temperature at which imidation occurs, for example, 300° C. or higher. In this embodiment, the heat treatment step (2) is performed at 400° C. to 600° C. in order to obtain an organic film with a high degree of packing of molecular chains.

The cooling step is a step of lowering the temperature of the workpiece 100 on which the organic film is formed. In this embodiment, it is performed after the heat treatment step (2). In the cooling process, when the temperature of the workpiece 100 is higher than the threshold, the cooling gas G1 is supplied from the first gas supply path 40a, and when the temperature of the workpiece 100 becomes equal to or lower than the threshold, the second gas supply path Cooling gas G2 is supplied from 40b. Note that the temperature (threshold) at which the cooling gas G1 is switched to the cooling gas G2 varies depending on the material, and is appropriately set. The threshold is, for example, a temperature within the range of 150.degree. C. to 250.degree. The workpiece 100 is cooled to a temperature at which it can be carried out. For example, if the temperature of the work 100 to be carried out is normal temperature, the work 100 can be carried out easily. However, if the temperature of the work 100 is set to room temperature each time the work 100 is unloaded, the time for raising the temperature of the next work 100 becomes longer. That is, there is a possibility that productivity may decrease. The temperature of the unloaded workpiece 100 may be, for example, 50.degree. C. to 120.degree. Let this carry-out temperature be the third temperature.

The controller 60 closes the valve 25 of the first exhaust section 21 . Then, by controlling the cooling unit 40 to supply the cooling gas G1 or the cooling gas G2 to the space provided with the plurality of heaters 32a, the temperature of the workpiece 100 is lowered indirectly and directly.

Therefore, the gaps provided between the upper heat equalizer plates 34a and between the lower heat equalizer plates 34b, etc., are the gaps between the upper heat equalizer plates 34a (lower heat equalizer plates 34b) and the side heat equalizer plates 34c. , and the gap provided between the upper heat equalizer plate 34a (lower heat equalizer plate 34b) and the side heat equalizer plate 34d. By doing so, when the cooling unit 40 supplies the cooling gas G1 or the cooling gas G2, the amount of the cooling gas G1 or the cooling gas G2 toward the workpiece 100 can be increased. Also, the amount of cooling gas G1 or cooling gas G2 exhausted from the processing regions 30a and 30b can be reduced. Therefore, the workpiece 100 can be efficiently cooled.

Further, immediately after the organic film is formed, the speed at which the cooling gas G1 diffuses from the processing regions 30a and 30b into the chamber 10 is preferably slow. If the diffusion speed of the cooling gas G1 into the chamber 10 from the processing regions 30a and 30b is slow, the supplied cooling gas G1 can suppress scattering of the sublimate inside the chamber 10. FIG. Therefore, immediately after the organic film is formed, it is preferable to reduce the supply amount of the cooling gas G1 and gradually increase the supply amount.

The controller 60 closes the valve 25 of the second exhaust section 22 and opens the valve 25 of the third exhaust section 23 when the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10 becomes the same pressure as the atmospheric pressure. , the cooling gas G1 is constantly exhausted.

The controller 60 controls the switching valve 54 when the detected value of the thermometer (not shown) reaches a threshold value, and supplies the cooling gas G2 to the space provided with the plurality of heaters 32a. By doing so, the amount of _N2 and rare gas used can be reduced. Further, in the unloading process described later, the door 13 can be opened in a state where the oxygen concentration is high. Therefore, the risk of oxygen deficiency due to _N2 or rare gas is suppressed.

In the work unloading process, when the temperature of the work 100 on which the organic film is formed reaches the third temperature, the supply of the cooling gas G2 introduced into the chamber 10 is stopped. Then, the opening/closing door 13 is separated from the flange 11, and the workpiece 100 is carried out.

As described above, the workpiece 100 on which the organic film is formed is taken out from the chamber 10 or the like in which the processing has been performed, and transported to the next process or the like. When the organic film is formed by heating, the temperature of the workpiece 100 rises, so it is difficult to remove or transfer the workpiece 100 having a high temperature from the chamber 10 . In addition, if taken out at a high temperature, the organic film may oxidize and fail to fulfill its function. Therefore, it is necessary to cool the workpiece 100 by supplying the cooling gas G1 inside the chamber 10 .

However, when forming an organic film, processing at a very high temperature of about 250.degree. C. to 600.degree. Therefore, the amount of cooling gas G1 consumed until the work 100 reaches a transferable temperature becomes enormous. Also, the organic film at about 250° C. to 600° C. has high reactivity. Therefore, if the cooling gas G1 contains oxygen, the organic film will be oxidized. However, using an inert gas as the cooling gas G1 throughout the cooling to prevent oxidation of the organic film also increases costs.

As a result of intensive research, the present inventors have found that if the temperature of the organic film (workpiece 100) is around 200° C., the organic film will not be oxidized even if oxygen is contained in the cooling gas. I found

Therefore, after the temperature of the organic film (workpiece 100) reaches 200° C. or lower, the inventors perform the organic film forming step including the cooling step of switching from the cooling gas G1 to the cooling gas G2 (CDA) a plurality of times. bottom. As a result, a partially oxidized organic film was generated.
As a result of further intensive research, the inventors found that the cooling gas G2 used in the cooling process remained in the pipe (common part) connecting the nozzle 41 and the switching valve 54 .

The organic film forming apparatus 1 according to the present embodiment heats the workpiece 100 after depressurizing the internal space of the chamber 10 . It has been thought that when the internal space of the chamber 10 is decompressed, the pressure in the common area is also decompressed. However, in reality, the cooling gas G2 used in the cooling process remained in the shared space. This is probably because the diameter of the discharge port of the nozzle 41 for discharging the cooling gas G1 or the cooling gas G2 is small, so that the inside of the common area cannot be sufficiently exhausted.

Therefore, the organic film forming apparatus 1 according to the present embodiment starts unloading the processed work 100 from the chamber 10, then loads the work 100 to be processed next into the chamber 10, and heats the work 100. The cooling gas G1 is supplied to the inside of the chamber 10 until . By doing so, the cooling gas G2 remaining in the common area can be discharged.
In addition, when starting the cooling process of the work 100 that has undergone the heat treatment process (2) next to the processed work 100, the cooling gas G2 remaining in the common area is supplied into the chamber 10, and the temperature rises to 250° C. or higher. contact with the workpiece 100 can be prevented.

By the way, in the work unloading process and the work loading process, the internal space of the chamber 10 is open to the outside atmosphere. Therefore, even if the inside of the shared space is replaced with the cooling gas G1, there is a possibility that the air in the external atmosphere may enter the pipe through the nozzle 41. FIG. Therefore, it is preferable to supply the cooling gas G1 in the work loading step. In particular, it is preferable to carry out all the workpieces 100 into the chamber 10 and immediately before closing the opening 11 a with the front door 13 .

The cooling gas G1 is supplied for a period of time during which the concentration of the cooling gas G2 remaining in the pipe is diluted to such an extent that the quality of the organic film is not adversely affected. Also, the amount of supply of the cooling gas G1 may be less than the amount supplied in the cooling step. The time for diluting the concentration of the cooling gas G2 remaining in the pipe to such an extent that the quality of the organic film is not adversely affected and the supply amount of the cooling gas G1 may be appropriately determined by conducting simulations and experiments.

Further, the cooling gas G1 may be supplied at the same time as the internal space of the chamber 10 is decompressed. Also in this case, the cooling gas G1 may be supplied for a period of time during which the cooling gas is diluted to such an extent that the quality of the organic film is not adversely affected.
According to the knowledge obtained by the present inventors, the oxidation reaction can be suppressed if the oxygen concentration in the chamber 10 is lowered to about 100 ppm. In this case, the internal pressure of the chamber 10 where the oxygen concentration is 100 ppm is about 100 Pa. Therefore, after reducing the internal pressure of the chamber 10 to less than 1 Pa, it is preferable to supply the cooling gas G1 so that the internal pressure of the chamber 10 does not exceed 100 Pa. The cooling gas G1 is supplied, and the oxygen concentration in the chamber 10 is detected by the oxygen concentration meter 21c. When the oxygen concentration becomes equal to or lower than the threshold, power is applied to the heater 32a. By doing so, it is possible to reliably suppress adverse effects on the quality of the organic film. In this case, the threshold is a value within the range of 0.1 ppm to 100 ppm.

FIG. 4 is a schematic perspective view for illustrating an organic film forming apparatus 1a according to another embodiment.
The cooling unit 40 has two valves 54 a (corresponding to an example of a first valve) instead of the switching valve 54 . Having two valves allows two different gases to be supplied to the interior of the chamber 10 at the same time. Therefore, the flow rate of the cooling gas that can be supplied to the inside of the chamber 10 can be increased, and the cooling process time can be shortened. In this case, it is preferable to increase the supply amount of the cooling gas G1 than the supply amount of the cooling gas G2.

The cooling unit 40 also has one valve 54b (corresponding to an example of a second valve) for each nozzle 41 . By doing so, it becomes possible to control the supply and stop of the cooling gas G for each nozzle 41 .

In the case of the organic film forming apparatus 1a, the piping, the valve 54b and the nozzle 41 of the part A shown in FIG. 4 are common parts. In the organic film forming apparatus 1a, the cooling gas G2 used in the cooling step remains in the piping of the A portion. As described above, it is difficult to exhaust the cooling gas G2 remaining in the common area from the exhaust section 20 via the nozzle 41 . Also, if the cooling gas G2 remaining in the piping of the A part is exhausted by the exhaust part 20, there is a possibility that the airtightness in the chamber 10 will be deteriorated.

Therefore, the cooling gas G1 is supplied to the interior of the chamber 10 during the period from when the processed workpiece 100 is unloaded from the chamber 10 to when the next workpiece 100 to be processed is loaded into the chamber 10 . By doing so, the cooling gas G2 remaining in the common area can be discharged. Therefore, the organic film forming apparatus 1a can reduce the cost required for cooling the workpiece 100 on which the organic film is formed, can reliably suppress adverse effects on the quality of the organic film, and can prevent breakage of the valve 54b. can be prevented.

FIG. 5 is a schematic perspective view for illustrating an organic film forming apparatus 1b according to another embodiment.
As shown in FIG. 5, the organic film forming apparatus 1b can further include another cooling unit 140 (corresponding to an example of a second cooling unit).

The cooling unit 140 supplies cooling gas to the work 100 inside the processing areas 30a and 30b. That is, the cooling unit 140 cools the workpiece 100 directly.
Like the cooling unit 40, the cooling unit 140 has a first supply path that supplies the cooling gas G1 to the area where the heating unit 32 is provided, and a second supply path that supplies the cooling gas G2 to the area where the heating unit 32 is provided. It has a route and a common part. The cooling section 140 differs from the cooling section 40 in that it has a nozzle 141 instead of the nozzle 41 .

FIG. 6 is a schematic cross-sectional view for illustrating an organic film forming apparatus 1b according to another embodiment.
At least one nozzle 141 can be provided inside the processing regions 30a, 30b. The nozzle 141 can pass through the lid 15 and the cover 36, for example, and can be attached to the side heat equalizing plate 34d, the frame 31, or the like. In this embodiment, the nozzle 141 is attached at a position where the cooling gas can be supplied to the back surface of the workpiece 100 . Also, a plurality of nozzles 141 can be provided in the X direction. Alternatively, the nozzle 141 can be cylindrical with a closed end. A plurality of holes may be provided in the side surface of the nozzle 141 and inserted from the side surface of the chamber 10 .

In the case of indirectly and directly cooling the work 100, when the temperature of the work 100 is higher than the threshold value in the cooling process, the cooling gas G1 is supplied to the area where the heating unit 32 is provided, and the work 100 is cooled. When the temperature is equal to or lower than the threshold, the cooling gas G2 is supplied from the cooling unit 40 and the cooling unit 140 to the region where the heating unit 32 is provided. By doing so, it is possible to substantially shorten the cooling time.
That is, when the temperature of the workpiece 100 exceeds the threshold value (200° C.) and is in a state where it is likely to react with oxygen, the cooling gas G1 does not contain oxygen gas (or the oxygen concentration does not adversely affect the quality of the organic film). By cooling the work 100 by cooling the work 100, the work 100 can be cooled while preventing the work 100 from being oxidized. On the other hand, when the temperature of the work 100 is lower than the threshold value and the work 100 is in a state where it is difficult to react with oxygen, the work 100 can be cooled while reducing the cost by cooling the work 100 with the cooling gas G2 containing oxygen. , oxygen deficiency can be prevented when the workpiece 100 is carried out. The amount of oxygen gas contained in the cooling gas G2 is sufficient to suppress the risk of oxygen deficiency due to _N2 and rare gases, and is preferably such an amount that does not cause oxygen poisoning.

FIG. 7 is a schematic perspective view for illustrating an organic film forming apparatus according to another embodiment.
The switching valve 54 was provided in the organic film forming apparatus illustrated in FIG. However, as shown in FIG. 7, the switching valve 54 is not provided, and the opening/closing valve 541 is provided in the shared portion of the first gas supply path 40a and the second gas supply path 40b, and the opening/closing valve 543 is provided in the second gas supply path. may be provided in the gas supply path 40b.

In this case, the cooling gas G2 remaining in the pipe between the gas control unit 43 and the opening/closing valve 541 is also supplied together with the cooling gas G1 when the cooling gas G1 is supplied in the second and subsequent processes when the workpiece 100 is continuously processed. will be supplied. As described above, the supply of the cooling gas G1 is performed when the temperature of the workpiece 100 is high (when the temperature is higher than the threshold value). , the work 100 reacts with oxygen contained in the cooling gas G2, and the work 100 is oxidized.

In order to prevent this, the second gas supply path 40b and the first gas supply path 40a are connected by opening the exhaust valve 542 and the opening/closing valve 543 before supplying the cooling gas G1 (before opening the opening/closing valve 541). The cooling gas G2 remaining between the open/close valve 543 is exhausted from the portion. This reliably prevents the cooling gas G2 remaining in the shared portion of the first gas supply path 40a and the second gas supply path 40b from flowing into the chamber.

Further, the common portion of the first gas supply path 40a and the second gas supply path 40b and the cooling gas G2 remaining in the second gas supply path 40b are exhausted by the exhaust unit 20. Also good. That is, from the start of evacuation by the exhaust unit 20 until the internal pressure of the chamber 10 reaches a predetermined oxygen concentration of 100 ppm or less (before heating by the heater 32a, or until the work 100 reacts with oxygen and is oxidized) The gas control unit 43 and the on-off valve 541 are opened, and the gas control unit 53, the exhaust valve 542 and the on-off valve 543 are closed, and the cooling gas G1 is supplied. do. After that, the opening/closing valve 541 and the gas control unit 53 are closed, and the gas control unit 43, the opening/closing valve 543 and the exhaust valve 542 are opened to exhaust the gas. As a result, the shared portion of the first gas supply path 40a and the second gas supply path 40b and the second gas supply path 40b are purged with the cooling gas G1, so that the cooling gas G2 does not remain. state. Further, it is more preferable to exhaust the remaining cooling gas G2 more reliably by repeating the above purge a plurality of times.

As described above, in the method of manufacturing an organic film according to the present embodiment, a workpiece having a substrate and a solution containing an organic material and a solvent coated on the upper surface of the substrate is reduced below the atmospheric pressure. a work loading step of loading the work into a chamber capable of maintaining a reduced atmosphere; a step of heating the work in an atmosphere reduced below atmospheric pressure; and cooling the work on which the organic film is formed by performing the heating. and carrying out the work on which the organic film is formed, wherein in the step of heating the work, a processing area between a first heating unit and a second heating unit in the step of heating the work, and in the step of cooling the work, when the work is at a temperature higher than 200° C., the inside of at least one of the first heating unit and the second heating unit is heated When the temperature of the workpiece is 200° C. or less, the CDA is supplied to the inside of at least one of the first heating unit and the second heating unit. is supplied, and in the work loading step, the first cooling gas is supplied when the work is loaded into the chamber.

The embodiments have been illustrated above. However, the invention is not limited to these descriptions.
Appropriate design changes made by those skilled in the art with respect to the above embodiments are also included in the scope of the present invention as long as they have the features of the present invention.
For example, the shape, dimensions, arrangement, etc. of the organic film forming apparatus 1 are not limited to those illustrated and can be changed as appropriate.
Moreover, each element provided in each of the above-described embodiments can be combined as much as possible, and a combination thereof is also included in the scope of the present invention as long as it includes the features of the present invention.
For example, the switching valve 54 and the valve 54b may be used in combination.

1 Organic film forming apparatus 10 Chamber 11a Opening 20 Exhaust part 21c Oxygen concentration meter 30 Processing part 30a Processing area 30b Processing area 32 Heating part 32a Heater 40 Cooling part 52 Gas source 53 Gas Control Unit 54 Switching Valve 55 Case 60 Controller 100 Work G1 Cooling Gas G2 Cooling Gas

Claims (6)

a chamber capable of maintaining an atmosphere pressure-reduced below atmospheric pressure;
an exhaust unit capable of exhausting the interior of the chamber;
a processing area in which a workpiece having a substrate and a solution containing an organic material and a solvent applied to an upper surface of the substrate is supported;
a heating unit provided facing the work supported in the processing area;
a cooling unit that supplies cooling gas to the heating unit;
a controller that controls the heating unit, the exhaust unit, and the cooling unit;
with
The cooling unit is
a first gas supply path that supplies a first cooling gas that does not readily react with the heated work to the interior of the heating unit;
a second gas supply path for supplying a second cooling gas to the interior of the heating unit;
a shared portion shared by the first supply route and the second supply route;
a first valve that selectively supplies the first cooling gas supplied through the first supply path and the second cooling gas supplied through the second supply path to the common area;
has
The controller is
when the temperature of the workpiece is higher than the threshold, supplying a first cooling gas to the heating unit;
supplying a second cooling gas to the heating unit when the temperature of the workpiece is equal to or lower than the threshold;
After starting to carry out the processed work from the chamber, the work to be processed next is loaded into the chamber, and the work to be processed next is transferred to the first heating unit, and An organic film forming apparatus that supplies the first cooling gas into the chamber until the temperature is raised by at least one of the second heating units. Further comprising an oxygen concentration meter that detects the oxygen concentration in the chamber,
The controller is
After loading the workpiece into the chamber, reducing the pressure in the chamber,
supplying the first cooling gas into the decompressed chamber;
detecting the oxygen concentration in the chamber with the oxygen concentration meter;
2. The organic film forming apparatus according to claim 1, wherein the power is supplied to the heating unit after the detected oxygen concentration in the chamber becomes equal to or less than a threshold value. 3. The organic film forming apparatus according to claim 1, wherein the cooling section further includes a second valve for controlling supply and stop of the cooling gas supplied to the heating section in the shared section. 3. The organic film forming apparatus according to claim 1, wherein said first cooling gas is a gas containing no oxygen, and said second cooling gas is a gas containing oxygen. 4. The organic film forming apparatus according to claim 3, wherein said first cooling gas is a gas containing no oxygen, and said second cooling gas is a gas containing oxygen. a workpiece loading step of loading a workpiece having a substrate and a solution containing an organic material and a solvent coated on the upper surface of the substrate into a chamber capable of maintaining an atmosphere reduced below atmospheric pressure;
heating the workpiece in an atmosphere reduced in pressure below atmospheric pressure;
a step of cooling the work on which the organic film is formed by performing the heating;
unloading the work on which the organic film is formed;
with
In the step of heating the work, the work is heated by a heating unit provided facing the work in a processing area,
In the step of cooling the work,
when the temperature of the workpiece is higher than the threshold, supplying a first gas that hardly reacts with the heated workpiece inside the heating unit;
supplying a second cooling gas to the interior of the heating unit when the temperature of the workpiece is equal to or lower than the threshold;
A method for manufacturing an organic film, wherein the first cooling gas is supplied into the chamber from the step of unloading the work to the step of loading the work.

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