JP2022553302A5 - - Google Patents

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Publication number
JP2022553302A5
JP2022553302A5 JP2022523396A JP2022523396A JP2022553302A5 JP 2022553302 A5 JP2022553302 A5 JP 2022553302A5 JP 2022523396 A JP2022523396 A JP 2022523396A JP 2022523396 A JP2022523396 A JP 2022523396A JP 2022553302 A5 JP2022553302 A5 JP 2022553302A5
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JP
Japan
Prior art keywords
layer
intermediate layer
substrate support
different
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022523396A
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English (en)
Japanese (ja)
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JP2022553302A (ja
JP7702392B2 (ja
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Priority claimed from PCT/US2020/056436 external-priority patent/WO2021080953A1/en
Publication of JP2022553302A publication Critical patent/JP2022553302A/ja
Publication of JP2022553302A5 publication Critical patent/JP2022553302A5/ja
Application granted granted Critical
Publication of JP7702392B2 publication Critical patent/JP7702392B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022523396A 2019-10-21 2020-10-20 モノリシック異方性基板支持体 Active JP7702392B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962923912P 2019-10-21 2019-10-21
US62/923,912 2019-10-21
PCT/US2020/056436 WO2021080953A1 (en) 2019-10-21 2020-10-20 Monolithic anisotropic substrate supports

Publications (3)

Publication Number Publication Date
JP2022553302A JP2022553302A (ja) 2022-12-22
JP2022553302A5 true JP2022553302A5 (https=) 2025-03-07
JP7702392B2 JP7702392B2 (ja) 2025-07-03

Family

ID=75620030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022523396A Active JP7702392B2 (ja) 2019-10-21 2020-10-20 モノリシック異方性基板支持体

Country Status (5)

Country Link
US (1) US20240128062A1 (https=)
JP (1) JP7702392B2 (https=)
KR (1) KR102900427B1 (https=)
CN (1) CN114846597A (https=)
WO (1) WO2021080953A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102901061B1 (ko) * 2020-03-13 2025-12-16 램 리써치 코포레이션 기판 프로세싱 시스템들을 위한 스터드 어레이들을 갖는 본딩 층들을 포함하는 기판 지지부들
US12094748B2 (en) * 2021-08-18 2024-09-17 Applied Materials, Inc. Bipolar esc with balanced RF impedance
JP7677862B2 (ja) * 2021-09-17 2025-05-15 東京エレクトロン株式会社 プラズマ処理装置
US12581880B2 (en) 2022-11-02 2026-03-17 Applied Materials, Inc. Faraday faceplate
US20240412957A1 (en) * 2023-06-07 2024-12-12 Applied Materials, Inc. High temperature biasable heater with advanced far edge electrode, electrostatic chuck, and embedded ground electrode
US20250357073A1 (en) * 2024-05-20 2025-11-20 Applied Materials, Inc. Electrically conductive ceramic electric field blocking plate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800618A (en) * 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
GB2329515B (en) * 1997-09-18 2002-03-13 Trikon Equip Ltd Platen for semiconductor workpieces
JPH11260534A (ja) * 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
US7544251B2 (en) * 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
JP4394667B2 (ja) * 2006-08-22 2010-01-06 日本碍子株式会社 ヒータ付き静電チャックの製造方法
KR101120599B1 (ko) * 2008-08-20 2012-03-09 주식회사 코미코 세라믹 히터, 이의 제조 방법 및 이를 포함하는 박막 증착 장치
US10049948B2 (en) * 2012-11-30 2018-08-14 Lam Research Corporation Power switching system for ESC with array of thermal control elements
JP5819895B2 (ja) * 2013-09-05 2015-11-24 日本碍子株式会社 静電チャック
KR101994006B1 (ko) * 2014-06-23 2019-06-27 니혼도꾸슈도교 가부시키가이샤 정전 척
US10690414B2 (en) * 2015-12-11 2020-06-23 Lam Research Corporation Multi-plane heater for semiconductor substrate support
KR101814554B1 (ko) * 2017-09-13 2018-01-03 주식회사 티에스시 에지전극이 내장된 정전척 및 그 제조방법

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