JP2022183337A - 複合材 - Google Patents
複合材 Download PDFInfo
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- JP2022183337A JP2022183337A JP2022168644A JP2022168644A JP2022183337A JP 2022183337 A JP2022183337 A JP 2022183337A JP 2022168644 A JP2022168644 A JP 2022168644A JP 2022168644 A JP2022168644 A JP 2022168644A JP 2022183337 A JP2022183337 A JP 2022183337A
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- metal foam
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- thermal conductivity
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- 239000002131 composite material Substances 0.000 title claims abstract description 70
- 239000006262 metallic foam Substances 0.000 claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000002344 surface layer Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229920003180 amino resin Polymers 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 15
- 230000035699 permeability Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/04—Inorganic
- B32B2266/045—Metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
金属フォームとしては、銅金属フォームであって、厚さが約70μm程度であり、気孔度が約70%であるフィルム形状の銅フォームを使用した。前記銅金属フォームを熱硬化性エポキシ化合物(KUKDO CHEMICAL社、YD128)と硬化剤(KUKDO CHEMICAL社、G640)を含む熱硬化性エポキシ樹脂組成物に含浸させ、アプリケーターを用いて最終複合材の厚さが約120μm程度になるように、過量の組成物を除去した。次に、前記材料を約80℃のオーブンに約1時間程度維持して硬化させることによって、複合材を製造した。適用された高分子成分(エポキシ樹脂)と金属フォーム(銅金属フォーム)それぞれの密度および適用重量を基準として計算した結果、高分子成分の体積PVと金属フォームの体積MVの比率MV/PVは、約0.2程度であった。図1は、前記製造された複合材の写真であり、この複合材の熱伝導度は、約0.411W/mK程度であった。
高分子組成物として、熱硬化性シリコン組成物(PDMS,Sylgard 183 kit)を使用し、硬化工程を230℃のオーブンで約10分間行ったことを除いて、実施例1のような方法で複合材を製造した(最終複合材の厚さ:約120μm程度)。適用された高分子成分(シリコン樹脂)と金属フォーム(銅金属フォーム)それぞれの密度および適用重量を基準として計算した結果、高分子成分の体積PVと金属フォームの体積MVの比率MV/PVは、約0.2程度であった。図2は、前記製造された複合材の写真であり、この複合材の熱伝導度を前記に言及された方法で測定した結果、約0.673W/mK程度であった。
実施例2のような方法で複合材を製造するものの、最終複合材の厚さが約100μm程度になるようにし、硬化工程を約120℃で約10分間行った。適用された高分子成分(シリコン樹脂)と金属フォーム(銅金属フォーム)それぞれの密度および適用重量を基準として計算した結果高分子成分の体積PVと金属フォームの体積MVの比率MV/PVは、約0.25程度であった。この複合材の熱伝導度を前記に言及された方法で測定した結果、約2.633W/mK程度であった。
実施例2のような方法で複合材を製造するものの、最終複合材の厚さが約80μm程度になるようにし、硬化工程を約120℃で約10分間行った。適用された高分子成分(シリコン樹脂)と金属フォーム(銅金属フォーム)それぞれの密度および適用重量を基準として計算した結果、高分子成分の体積PVと金属フォームの体積MVの比率MV/PVは、約0.34程度であった。この複合材の熱伝導度を前記に言及された方法で測定した結果、約3.065W/mK程度であった。
実施例2のような方法で複合材を製造するものの、高分子組成物を熱硬化性シリコン組成物(PDMS,Sylgard 527 kit)に変更し、硬化工程を約120℃で約90分間行った。適用された高分子成分(シリコン樹脂)と金属フォーム(銅金属フォーム)それぞれの密度および適用重量を基準として計算した結果、高分子成分の体積PVと金属フォームの体積MVの比率MV/PVは、約0.25程度であった。この複合材の熱伝導度を前記に言及された方法で測定した結果、約3.403W/mK程度であった。
実施例5のような方法で複合材を製造するものの、最終複合材の厚さが約80μm程度になるようにした。適用された高分子成分(シリコン樹脂)と金属フォーム(銅金属フォーム)それぞれの密度および適用重量を基準として計算した結果、高分子成分の体積PVと金属フォームの体積MVの比率MV/PVは、約0.34程度であった。この複合材の熱伝導度を前記に言及された方法で測定した結果、約5.474W/mK程度であった。
実施例1で適用した高分子組成物のみを硬化させて、厚さが約120μm程度であるフィルムを形成した。形成されたフィルムの熱伝導度は、約0.199W/mKであった。
実施例2で適用した高分子組成物のみを硬化させて、厚さが約120μm程度であるフィルムを形成した。形成されたフィルムの熱伝導度は、約0.270W/mKであった。
最終複合材の厚さが約200μm程度になるようにしたことを除いて、実施例1と同一に複合材を形成した。形成された複合材の熱伝導度は、約0.367W/mK程度であった。
Claims (11)
- フィルム形態の金属フォームと、前記金属フォームの表面または金属フォームの内部に存在する高分子成分とを含み、前記金属フォームの厚さMTおよび全体厚さTの比率T/MTが2.5以下であり、熱伝導度が0.4W/mK以上である複合材。
- 金属フォームの厚さMTおよび全体厚さTの比率T/MTが、1.01以上である、請求項1に記載の複合材。
- 金属フォームの厚さMTおよび全体厚さTの比率T/MTが、2以下である、請求項1または2に記載の複合材。
- 金属フォームは、熱伝導度が8W/mK以上の金属または金属合金を含む、請求項1から3のいずれか一項に記載の複合材。
- 金属フォームは、厚さが10μm以上である、請求項1から4のいずれか一項に記載の複合材。
- 金属フォームは、気孔度が10~99%の範囲内にある、請求項1から5のいずれか一項に記載の複合材。
- 金属フォームは、銅、金、銀、アルミニウム、ニッケル、鉄、コバルト、マグネシウム、モリブデン、タングステンおよび亜鉛よりなる群から選ばれるいずれか一つの金属または前記のうち2種以上を含む骨格を有する、請求項1から6のいずれか一項に記載の複合材。
- 高分子成分は、金属フォームの表面で表面層を形成している、請求項1から7のいずれか一項に記載の複合材。
- 高分子成分は、アクリル樹脂、シリコン樹脂、エポキシ樹脂、ウレタン樹脂、アミノ樹脂およびフェノール樹脂よりなる群から選ばれる一つ以上を含む、請求項1から8のいずれか一項に記載の複合材。
- 高分子成分の体積PVと金属フォームの体積MVの比率MV/PVが、10以下である、請求項1から9のいずれか一項に記載の複合材。
- 熱伝導度が8W/mK以上の金属または金属合金を含み、フィルム形態である金属フォームの表面または内部に硬化性高分子組成物が存在する状態で前記高分子組成物を硬化させる段階を含む、請求項1に記載の複合材の製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170118735A KR102191613B1 (ko) | 2017-09-15 | 2017-09-15 | 복합재 |
KR10-2017-0118735 | 2017-09-15 | ||
JP2020515222A JP2020533488A (ja) | 2017-09-15 | 2018-09-17 | 複合材 |
PCT/KR2018/010901 WO2019054818A1 (ko) | 2017-09-15 | 2018-09-17 | 복합재 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020515222A Division JP2020533488A (ja) | 2017-09-15 | 2018-09-17 | 複合材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022183337A true JP2022183337A (ja) | 2022-12-08 |
JP7493828B2 JP7493828B2 (ja) | 2024-06-03 |
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Also Published As
Publication number | Publication date |
---|---|
US20200270409A1 (en) | 2020-08-27 |
KR20190030980A (ko) | 2019-03-25 |
CN111093970A (zh) | 2020-05-01 |
JP2020533488A (ja) | 2020-11-19 |
WO2019054818A1 (ko) | 2019-03-21 |
EP3683046A1 (en) | 2020-07-22 |
EP3683046A4 (en) | 2020-09-30 |
KR102191613B1 (ko) | 2020-12-15 |
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