JP2022181821A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2022181821A
JP2022181821A JP2021088992A JP2021088992A JP2022181821A JP 2022181821 A JP2022181821 A JP 2022181821A JP 2021088992 A JP2021088992 A JP 2021088992A JP 2021088992 A JP2021088992 A JP 2021088992A JP 2022181821 A JP2022181821 A JP 2022181821A
Authority
JP
Japan
Prior art keywords
wiring
substrate
metal body
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021088992A
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English (en)
Japanese (ja)
Inventor
俊介 荒井
Shunsuke Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2021088992A priority Critical patent/JP2022181821A/ja
Priority to PCT/JP2022/018372 priority patent/WO2022249812A1/fr
Publication of JP2022181821A publication Critical patent/JP2022181821A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2021088992A 2021-05-27 2021-05-27 半導体装置 Pending JP2022181821A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021088992A JP2022181821A (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018372 WO2022249812A1 (fr) 2021-05-27 2022-04-21 Dispositif à semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088992A JP2022181821A (ja) 2021-05-27 2021-05-27 半導体装置

Publications (1)

Publication Number Publication Date
JP2022181821A true JP2022181821A (ja) 2022-12-08

Family

ID=84228805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021088992A Pending JP2022181821A (ja) 2021-05-27 2021-05-27 半導体装置

Country Status (2)

Country Link
JP (1) JP2022181821A (fr)
WO (1) WO2022249812A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146760A (ja) * 2011-01-11 2012-08-02 Calsonic Kansei Corp パワー半導体モジュール
EP2858110B1 (fr) * 2012-06-01 2020-04-08 Panasonic Intellectual Property Management Co., Ltd. Dispositif semi-conducteur de puissance
JP6319137B2 (ja) * 2015-02-26 2018-05-09 株式会社デンソー 半導体装置及びその製造方法
EP3598489A1 (fr) * 2018-07-18 2020-01-22 Delta Electronics (Shanghai) Co., Ltd. Structure de module de puissance

Also Published As

Publication number Publication date
WO2022249812A1 (fr) 2022-12-01

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