JP2022168927A - Manufacturing method for in-vehicle electronic devices - Google Patents

Abstract

To provide a manufacturing method for in-vehicle electronic device housings that accommodates diversity in vehicle assembly while unifying parts.SOLUTION: A process for forming an upper case module (8) by integrating an upper case (5) made of resin having at least an operation button (6) and a circuit board (1), a resin molding process for resin molding a lower case (9) to be engaged with the upper case module (8), and a process for engaging the upper case module (8) and the resin molded lower case (9). If a bracket (13) for vehicle mounting is to be provided in the lower case (9), a bracket-integrated lower case (9) is formed by inserting a nesting device for the bracket into the mold in the above resin molding process.SELECTED DRAWING: Figure 11

Description

The present application relates to a method of manufacturing an electronic device for vehicle.

In general, an electronic device for a vehicle, for example, an ETC (Electronic Toll Collection System: registered trademark) vehicle-mounted device equipped with an antenna for transmitting and receiving wireless signals to and from a roadside device is installed in the vehicle body frame or in the vehicle interior space. Equipped. With the spread of the ETC on-board device, it is required to realize installation on all types of vehicles.
However, in recent years, with the diversification of automobile models, the expansion of interior space, the improvement of fuel efficiency, the enhancement of on-board functions, and the legal response to internal collision requirements, the ETC on-board equipment to be installed has become even smaller and lighter. There is a strong demand for versatility and vehicle mounting layout versatility. In order to secure the mounting space mentioned above, and to achieve high layout performance, the ETC on-board equipment to be mounted should be made smaller and lighter, the use of common materials for multiple purposes, and global production brought about by the simplification of the assembly process. requested.

Conventionally, so-called stick-on type ETC on-board devices are well known, which are purchased from automobile dealers or commercial mass retailers, etc., and are pasted around the instrument panel or interior panels such as the glove box with double-sided adhesive. It is The stick-on type ETC on-board unit has an operation button and a prism made of a light-transmitting material engaged in advance with a case made of synthetic resin so as to protrude inside the case, and an LED (light-emitting diode) and a card holder are mounted. A structure has been proposed in which the printed circuit board is attached to the interior panel with a double-sided adhesive material or the like after the printed circuit board is assembled at a specified position in the case.

On the other hand, a built-in type in-vehicle device incorporated in an instrument panel is also preferably used in an automobile manufacturing line, an automobile sales agency, or the like because of its design property integrated with the vehicle.

Since the attachment type ETC on-board unit and the built-in type ETC on-board unit have different installation locations and mounting methods, the housing of the ETC on-board unit has a different shape depending on the vehicle or mounting method. must be designed and manufactured.

In addition to the printed circuit board, the ETC in-vehicle device is equipped with an operation button for operation, a prism that emits light from the LED to indicate the state of the ETC, an eject button for inserting and removing the ETC card, etc. Therefore, it is necessary to adjust the engagement with these parts for each housing mold. Therefore, by using the same mold, securing the stability of the shape and assembly suppresses the yield and leads to the stability of quality.

Furthermore, in the built-in type ETC on-board device, there are various mounting methods for the ETC on-board device, and it is necessary to install a dedicated mounting structure for each vehicle type, which increases the mold cost due to the increase in the number of parts, and the burden of management. increased.

Various bracket structures have been proposed for attaching the ETC on-board unit to the vehicle, and various types of brackets have been proposed, including those that are integrally formed with the case by welding, those that are screwed together, and those that are integrally formed with the synthetic resin case. Of these, the integrally molded type with the synthetic resin case minimizes the number of parts, and by using synthetic resin with a low material density, it is possible to reduce the weight of the parts and improve the fuel efficiency of the vehicle. It is also preferably used because it can be expected.

When constructing a bracket that is integrally molded with this synthetic resin case, the mounting structure is specialized for a specific vehicle, so the degree of freedom in the layout of parts in the vehicle is reduced, and there are restrictions on expansion to other vehicle models. Yes, and there were many cases where a case or bracket was required for each car model.

As this kind of bracket-equipped built-in type ETC vehicle-mounted device, there is one proposed in Patent Document 1, for example.

JP 2010-221765 A

The structure of the ETC vehicle-mounted device disclosed in Patent Document 1 separates the bracket for mounting to the vehicle from the case, so that the case can be attached to the vehicle with an adhesive tape or the like when the bracket is unnecessary. It is possible. However, since the bracket and the case are constructed separately, at least two types of molds are required for the case and the bracket, and two types of parts are required to be manufactured and assembled. In addition, the structure is designed to be laid out in the built-in space inside the instrument panel, and when affixed to the outside of the instrument panel or interior panels such as the glove box, there was a problem of lack of adhesion and design.

The present application discloses a technique for solving the above problems, and provides a method for manufacturing an in-vehicle electronic device that is compatible with the diversity of assembly to a vehicle while unifying parts. With the goal.

A method of manufacturing an in-vehicle electronic device disclosed in the present application includes steps of forming a first module by integrating a first case made of resin and having at least an operation button and a circuit board; and a step of engaging the first module and the resin-molded second case,
When the second case is provided with a bracket for attachment to a vehicle, the insert for the bracket is inserted into the mold in the resin molding step to form the bracket-integrated second case.

According to the manufacturing method of the on-vehicle electronic device disclosed in the present application, it is possible to provide an on-vehicle electronic device that can be assembled to a vehicle in a variety of ways while achieving standardization of parts.

1 is a perspective view showing an ETC vehicle-mounted device according to Embodiment 1; FIG. 2 is an exploded perspective view of the ETC vehicle-mounted device shown in FIG. 1. FIG. FIG. 2 is an exploded perspective view showing the ETC vehicle-mounted device shown in FIG. 1 during assembly. FIG. 4 is a perspective view showing another example of the ETC vehicle-mounted device according to Embodiment 1; FIG. 5 is an exploded perspective view of the ETC vehicle-mounted device shown in FIG. 4 during assembly; It is a figure which shows the state which attached the ETC vehicle-mounted device shown in FIG. 4 to the inside of an instrument panel. FIG. 4 is a perspective view showing still another example of the ETC on-board device according to Embodiment 1; It is a perspective view which shows the example which rearranged the lower case of the ETC vehicle-mounted equipment shown in FIG. FIG. 9 is a perspective view showing a state in the middle of assembling the ETC vehicle-mounted device shown in FIG. 8 ; FIG. 9 is a perspective view showing a state in which the ETC vehicle-mounted device shown in FIG. 8 is attached to an interior panel; FIG. 2 is a sectional view showing an example of a mold structure for molding an upper case and a lower case of the ETC vehicle-mounted device according to Embodiment 1; It is a sectional view explaining an insert metallic mold. FIG. 4 is a cross-sectional view showing another example of the mold structure;

DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a method for manufacturing an in-vehicle electronic device according to the present application will be described below with reference to the drawings. Here, an ETC vehicle-mounted device will be described as the vehicle-mounted electronic device. In each figure, the same or corresponding members and parts are denoted by the same reference numerals.

Embodiment 1.
FIG. 1 is a perspective view showing an ETC vehicle-mounted device according to Embodiment 1, and FIG. 2 is an exploded perspective view thereof. 3 is an exploded perspective view showing the ETC vehicle-mounted device shown in FIG. 1 during assembly.
1 to 3, an ETC vehicle-mounted device 100 according to Embodiment 1 has a circuit board 1, an LED (light emitting diode) (not shown) on the circuit board 1, an ETC card holder 3 having an eject button 2, and a wireless IC (not shown) are mounted. A connector 4 is mounted on the circuit board 1 to be connected to the wireless IC via a circuit pattern, and the connector 4 is configured to be connected to an ETC antenna via a wire harness.

A first case (hereinafter referred to as an upper case) 5 that constitutes the housing of the ETC vehicle-mounted device 100 is made of a resin material such as a synthetic resin. , is adapted to engage the circuit board 1 . In addition, the operation button 6 and the prism 7 are engaged with the engaging portion protruding from the inside of the top surface of the upper case 5, and the circuit board 1, the operation button 6, the prism 7, etc. accommodated in the upper case 5 are An upper case module 8 is formed integrally with the upper case 5 as shown in FIG.

On the other hand, like the upper case 5, a second case (hereinafter referred to as a lower case) 9, which constitutes a housing together with the upper case 5, is also molded of synthetic resin. The lower case 9 is provided with a card insertion slot 9a on the front surface thereof, and a through hole 9b at a position where the operation button 6, the eject button 2, and the prism 7 are fitted. The front portion and the lower case 9 are integrally formed, and the lower case 9 is configured as a vehicle mounting bracket. The front portion of the lower case 9 is designed to be integrated with the vehicle interior panel. An annular projecting portion 10 is provided on the outer circumference of the front surface of the lower case 9 so that the lower case 9 can be installed without a gap in a through hole for an ETC vehicle-mounted device set in the instrument panel. Furthermore, an engaging claw 11 is provided on the inner side of the peripheral wall of the lower case 9, and the engaging claw 11 and the upper case 5 are engaged with each other. has been concluded.

FIG. 4 is a perspective view showing another example of the ETC vehicle-mounted device according to Embodiment 1, and FIG. 5 is an exploded perspective view during assembly thereof.
The ETC on-board device 200 shown in FIGS. 4 and 5 is an ETC on-board device in the form of using a bracket for attachment to the vehicle. be. Other configurations are the same as those of the ETC vehicle-mounted equipment shown in FIG.

As shown in FIGS. 6(a) and 6(b), the ETC vehicle-mounted device 200 is assumed to be installed as a built-in type installed inside the instrument panel 14. FIG. FIG. 6B shows the stored state of the ETC vehicle-mounted device 200 viewed from the inside of the instrument panel 14. FIG.

FIGS. 7A and 7B are perspective views showing an ETC vehicle-mounted device 300 which is a built-in type vehicle-mounted device incorporated in an instrument panel and which is different from the ETC vehicle-mounted device 200 shown in FIGS.
The ETC vehicle-mounted device 300 has an upper perspective view in FIG. 7(a) and a lower perspective view in FIG. 7(b). The prism 7 is engaged so as to protrude inside the case, and after the printed circuit board on which the LED and card holder are mounted is assembled in a prescribed position of the upper case 5 made of synthetic resin, the upper case 5 is mounted in a post-process. , a panel P, and a base K made of synthetic resin having a bracket 13 to be attached to the vehicle. The base K corresponds to the lower case 9 of the ETC vehicle-mounted device 200 shown in FIGS. Reference numeral 2 shown in FIGS. 7A and 7B indicates an eject button, and reference numeral 7 indicates a prism. As for the bracket 13, in addition to the so-called integrated type with the upper case 5, as shown in FIG. However, there are factors that lead to increased costs due to increased processes, man-hours for management, increased mass, and increased molds.

In the ETC vehicle-mounted devices 200 and 300 that use the bracket 13 for attachment to the vehicle, a pilot hole is provided in the boss portion 15 projecting from the instrument panel 14 when the vehicle is installed. Bracket 13 is screwed. In this case, stress is likely to be applied to the weight of the ETC on-board devices 200 and 300 and the vibration during vehicle running because the mounting portion of the bracket 13 of the ETC on-board devices 200 and 300 is close to the screw fastening point due to acceleration. It is necessary to increase the cross-sectional area of the mounting portion of the bracket 13 as much as possible and provide strength against the stress. It is necessary to consider that the structure 16 is configurable.

In addition, even if the integrated bracket structure is not made of synthetic resin, it is possible to attach the bracket 13 made of sheet metal to the ETC on-board device 300, and it is possible to join the bracket 13 and the ETC on-board device 300 with an adhesive tape or the like. becomes.

FIG. 8 is a perspective view showing an ETC vehicle-mounted device 400 in a form that can be attached to an interior panel such as an instrument panel or a glove box by rearranging the lower case 9, and FIG. 9 is a perspective view showing the assembly process. .

According to the ETC vehicle-mounted device 400 shown in FIGS. 8 and 9, the upper case module 8 shown in FIG. 1 or 3 is used, and the upper case 5 side can be used without modification. On the other hand, the lower case 9 is pulled out to the position where the card insertion slot 9a, the operation button 6, the eject button 2, and the prism 7 are fitted on the front like the lower case 9 shown in FIGS. A hole 9b is provided, and an engaging claw 11 is provided on the upper case 5 inside the peripheral wall so that the engaging claw 11 and the upper case 5 are engaged. Further, the front and bottom surfaces of the lower case 9 are designed, and the upper surface of the upper case 5 is attached with adhesive tape or the like to the interior panel 17 as shown in FIG. Affixing to the interior panel 17 becomes possible without impairing the exterior design surface.

Next, a method of manufacturing the ETC vehicle-mounted device according to Embodiment 1, particularly a method of manufacturing the housing thereof, will be described.
11(a) and 11(b) are cross-sectional views showing an example of a mold structure for molding the upper case 5 and the lower case 9 of the ETC vehicle-mounted device according to the first embodiment. In FIGS. 11(a) and 11(b), the mold division directions of the cavity type and the core type are front and back.
In FIGS. 11A and 11B, reference numeral 18 denotes a cavity type, reference numeral 19 denotes an outer slide type which is a core type, and reference numerals 20a and 20b denotes nested slide types which are nested types. 11(a) and 11(b), for the sake of convenience, the cavity mold 18 is shown as being divided, but in reality it is integrally constructed and moves toward the front during molding. Here, the nested mold means that, as shown in FIG. 12(a), when the shape of the mold A has a slightly protruding portion B, the removed portion C must be removed when this is integrally processed. As a result, the efficiency of material removal deteriorates, and cutting cannot be performed at once. Therefore, as shown in FIG. 12(b), the yield and workability are improved by forming the convex portion B as a separate component D. This separate part D is said to be a nested type.

As shown in FIGS. 11(a) and 11(b), part of the outer circumference of the mold for the lower case 9 is formed into a nested structure, so that when a bracket 13 for mounting on a vehicle is required, the outside of the lower case 9 can be The bracket 13 and the lower case 9 are integrally molded by replacing the nested slide mold 20a shown in FIG. 11(a) with the nested slide mold 20b shown in FIG. 11(b). A portion indicated by reference numeral 20c of the nested slide mold 20b corresponds to the attachment portion of the bracket 13. As shown in FIG. In this case, the engagement with the upper case 5, the engagement portion with other parts such as the card insertion slot 9a, the prism 7, the operation button 6 and the eject button 2, and the cutout hole 9b of the fitting portion are determined by the presence or absence of the bracket 13. Since the cavity mold 18 or the outer slide mold 19 is configured as a common mold, there is no need to adjust the engagement of parts for each mold. realizable.

Also, the mold configuration is given as an example, and for example, as shown in FIGS. A similar effect can be obtained even with the configuration.

As described above, in the ETC vehicle-mounted devices 100 to 400 according to Embodiment 1, the housing for housing the circuit board 1 is composed of the resin upper case 5 and the resin lower case 9, and the circuit board 1, an operation button 6, a prism 7, and the like are integrated with an upper case 5 to form an upper case module 8, and the lower case 9 and the upper case 5 are engaged to form a housing. When manufacturing the housing, the lower case 9 is manufactured by using nested slide dies 20a and 20b to determine whether or not the bracket 13 is present. manufactured.
Therefore, it is possible to provide a housing for an ETC vehicle-mounted device that can be mounted on a vehicle in a variety of ways while standardizing the parts.

In the present application, the ETC vehicle-mounted device has been described as an example, but the vehicle-mounted device is not limited to the ETC vehicle-mounted device, and the present application can be applied to other vehicle-mounted electronic devices. Also, although the present application has described exemplary embodiments, the various features, aspects, and functions described in the embodiments are not limited to application of particular embodiments, but alone. , or in various combinations applicable to the embodiments.
Therefore, countless modifications not illustrated are envisioned within the scope of the technology disclosed in the present application. For example, the modification, addition, or omission of at least one component shall be included.

1 circuit board, 2 eject button, 3 ETC card holder, 4 connector,
5 upper case, 6 operation button, 7 prism, 8 upper case module,
9 lower case, 9a card insertion slot, 9b extraction hole, 10 projecting part, 11 engaging claw,
12 screw, 13 bracket, 14 instrument panel, 15 boss,
16 rib structure, 17 interior panel, 18 cavity type, 19 outer slide type,
20a, 20b nested slide type, 20c mounting part,
100, 200, 300 ETC in-vehicle device, A mold, B convex shape part, C removal part,
D Separate parts, P Panel, K Metal base

A method of manufacturing an in-vehicle electronic device disclosed in the present application includes steps of forming a first module by integrating a first case made of resin and having at least an operation button and a circuit board; and a step of engaging the first module and the resin-molded second case,
In the case where the first module and the second case are engaged with each other and attached as a built-in type, and in the case where the second case is provided with a bracket for vehicle attachment , the bracket is attached to the mold in the resin molding step. inserting a nest for forming a bracket-integrated second case ,
In the case where the first module and the second case are engaged and attached by a sticking die, and the second case is not provided with a bracket for vehicle attachment, the insert is removed from the mold in the resin molding step. The second case is formed by detaching .

A method of manufacturing an in-vehicle electronic device disclosed in the present application includes steps of forming a first module by integrating a first case made of resin and having at least an operation button and a circuit board; and a step of engaging the first module and the resin-molded second case,
In the case where the first module and the second case are engaged and attached in a built-in type, and in the case where the second case is provided with a bracket for attachment to a vehicle, in the resin molding step, an insert for the bracket is inserted into the mold. to form a bracket-integrated second case,
In the case where the first module and the second case are engaged and attached by a sticking die, and in the case where the second case is not provided with a bracket for vehicle attachment, in the resin molding step , the second module is mounted using the mold. It is characterized by forming a case.

Claims (4)

forming a first module by integrating a first case made of resin having at least an operation button and a circuit board;
a resin molding step of resin-molding a second case to be engaged with the first module using a mold;
a step of engaging the first module and the resin-molded second case;
When a bracket for vehicle attachment is provided in the second case, a nest for the bracket is inserted into the mold in the resin molding step to form the bracket-integrated second case. How the equipment is made. 2. The method of manufacturing an on-vehicle electronic device according to claim 1, wherein, in said resin molding step, said insert having a rib shape is used, and said bracket is provided with a rib structure. 3. The in-vehicle electronic device according to claim 1, wherein the second case is formed with a projecting portion along the periphery of the surface of the first case corresponding to the operation button in a resin molding process. How the equipment is made. 4. The in-vehicle device according to claim 1, wherein in the resin molding step, resin molding is performed using any one of a cavity mold, a core mold, and an outer slide mold as the mold. Methods of manufacturing electronic equipment.

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