JP2022163826A - Exposure apparatus, and method for manufacturing article - Google Patents

Abstract

To provide an exposure apparatus with improved function of suppressing temperature rise of a projection optical system during exposure while suppressing increase of size and power.SOLUTION: An exposure apparatus according to the present invention comprises: a projection optical system which projects an image of a pattern provided on an original plate onto a substrate; a first chamber which is provided with a first supply port and houses an exposure apparatus; a second chamber which is provided with a second supply port and houses the projection optical system; an air conditioner which supplies temperature-controlled gas from the first supply port into the first chamber via a first duct connected to the first supply port, and supplies temperature-controlled gas from the second supply port into the second chamber via a second duct connected to the second supply port; and a control part which reduces a supply amount of temperature-controlled gas from the air conditioner into the first duct before staring exposure, and increases a supply amount of temperature-controlled gas from the air conditioner into the second duct.SELECTED DRAWING: Figure 2(b)

Description

The present invention relates to an exposure apparatus.

Conventionally, in an exposure apparatus, in order to clean the space in the chamber in which the projection optical system is housed, a regulated gas is supplied into the space to make it a positive pressure with respect to the atmospheric pressure. There is known a technique for suppressing the inflow of pollutant gas from the inside of the space.
Moreover, in such a technique, there is a possibility that pressure changes occur in the space inside the chamber in which the projection optical system is housed in response to pressure changes in the surrounding environment. It is also required to suppress mechanical deformation of the element.

Japanese Patent Laid-Open No. 2002-200000 discloses that a chamber housing a projection optical system is provided with a gate for predetermined leakage of a conditioned gas into the surrounding environment, thereby allowing the chamber to respond to pressure changes in the surrounding environment. Disclosed is an exposure apparatus that suppresses the occurrence of pressure changes inside.

JP 2012-004598 A

On the other hand, in the exposure apparatus, the temperature of the projection optical system rises due to the incidence of the exposure light, which increases the fluctuation of the focus of the projection optical system, which may degrade the quality of the manufactured article. It is
In order to suppress such a temperature rise, there is known a technique of supplying temperature-controlled gas (hereinafter referred to as temperature-controlled gas) to the space in the chamber housing the projection optical system.

In recent years, in order to ensure high resolution in exposure apparatuses, exposure using exposure light with high illuminance has been performed. It is also necessary to increase the supply of temperature controlled gas into the chamber in which it is housed.
In that case, if the supply capacity of the air conditioner is increased to supply such a large volume of temperature control gas, it will lead to an increase in the size and utility of the exposure apparatus.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an exposure apparatus having an improved function of suppressing temperature rise of a projection optical system during exposure while suppressing an increase in size and power.

An exposure apparatus according to the present invention is an exposure apparatus that exposes a substrate so as to transfer a pattern provided on an original onto the substrate, and includes a projection optical system that projects an image of the pattern onto the substrate, and a first supply port. A first chamber provided with a first chamber for housing an exposure apparatus, and a second chamber provided with a second supply port for housing a projection optical system. , an air conditioner, supplying a temperature-controlled gas from the first supply port into the first chamber through a first duct connected to the air conditioner and the first supply port, and an air conditioner that supplies temperature-controlled gas from the second supply port into the second chamber through a second duct connected to the second supply port; Control to perform a first control to decrease a first supply amount of temperature-controlled gas into the first duct and increase a second supply amount of temperature-controlled gas from the air conditioner into the second duct and a part.

According to the present invention, it is possible to provide an exposure apparatus that has an improved function of suppressing temperature rise of the projection optical system during exposure while suppressing an increase in size and power.

1 is a schematic cross-sectional view of an exposure apparatus according to a first embodiment; FIG. FIG. 2 is a schematic configuration diagram of a temperature control system provided in the exposure apparatus according to the first embodiment; FIG. 4 is a schematic configuration diagram for explaining the control operation of the temperature control system when starting exposure of the exposure apparatus according to the first embodiment; FIG. 4 is a schematic configuration diagram for explaining the control operation of the temperature control system when the exposure of the exposure apparatus according to the first embodiment is completed; FIG. 4 is a schematic configuration diagram of a temperature control system provided in an exposure apparatus according to a second embodiment; FIG. 8 is a schematic configuration diagram of a temperature control system provided in an exposure apparatus according to a third embodiment; FIG. 11 is a schematic configuration diagram of a temperature control system provided in an exposure apparatus according to a fourth embodiment; FIG. 11 is a schematic configuration diagram of a temperature control system provided in an exposure apparatus according to a fifth embodiment; FIG. 11 is a schematic configuration diagram of a temperature control system provided in an exposure apparatus according to a sixth embodiment;

An exposure apparatus according to this embodiment will be described in detail below with reference to the accompanying drawings. It should be noted that the drawings shown below are drawn on a scale different from the actual scale in order to facilitate understanding of the present embodiment.

[First embodiment]
An exposure apparatus, which is one type of lithography apparatus used to manufacture articles such as semiconductor devices and liquid crystal displays, illuminates a pattern drawn on a master with exposure light from an illumination optical system, and a projection optical system. An image of the illuminated pattern is projected (transferred) onto the substrate.

In recent years, in order to improve productivity in exposure equipment, there is a need to mix patterns corresponding to large, medium, and small panel sizes and lay them out on a single large substrate without waste for transfer. .
Such transfer not only requires high-intensity exposure light to ensure high resolution, but also increases the number of times the exposure light passes through the master and enters the projection optical system, resulting in poor projection. The temperature of the space within the chamber in which the optical system is housed will rise significantly.

Then, when the temperature of the space in the chamber in which the projection optical system is housed rises, the fluctuation of the focus of the projection optical system increases, which may degrade the quality of the manufactured article.
Therefore, the chamber is provided with a supply port and a discharge port for supplying and discharging temperature-controlled gas (hereinafter referred to as temperature-controlled gas) to the space in the chamber, and the temperature-controlled gas is supplied to the space in the chamber. There is known a technique for suppressing the temperature rise of the projection optical system caused by the incidence of the exposure light by forming a flow of .
In particular, when performing the above-described transfer that requires high resolution and a large exposure load, the amount of temperature control gas supplied to the space in the chamber housing the projection optical system is increased to reduce the projection optical system. It is important to suppress a large temperature rise in the system.

In addition, in the projection optical system, it is important not only to maintain the temperature but also to maintain cleanliness in order to maintain the quality of the manufactured article.
Also for this, the temperature control gas is supplied as described above, and the pressure in the chamber housing the projection optical system is made positive with respect to the atmospheric pressure, thereby suppressing the inflow of pollutant gas from the surrounding environment. can be achieved by

Also, in recent years, by controlling the gap amount of the gas discharge channel from the space in the chamber where the projection optical system is housed to the surrounding environment, even if there is a sudden pressure change in the surrounding environment, the space inside the chamber can be maintained. Techniques for suppressing pressure fluctuations have been proposed.
However, in such technology, since the gap amount of the gas discharge channel is designed to be the minimum, the discharge of the temperature control gas supplied to the space in the chamber raises the temperature of the projection optical system. There is a problem that exhaust heat for suppressing is not sufficiently performed.

In addition, as described above, when performing transfer with a large exposure load, the temperature rise of the projection optical system also increases. It becomes necessary to supply a large volume of temperature-controlled gas to the space.
If the supply capacity of a temperature-controlled gas supply device (that is, an air conditioner) is increased in order to supply such a large volume of temperature-controlled gas, it will lead to an increase in the footprint and utility of the device. .

Also, when exposure is not performed, an operator may work inside the exposure apparatus for maintenance of the exposure apparatus, and at that time, the temperature inside the exposure apparatus may rise.
In order to improve productivity, it is required that after the maintenance work is completed, the temperature in the exposure apparatus, which has risen, be quickly lowered so that the exposure can be started in a short period of time.

As described above, in the exposure apparatus, the pressure in the space in the chamber housing the projection optical system can be maintained without increasing the temperature control gas supply capacity of the air conditioner, and the temperature of the space during exposure can be increased. Also, it is required to suppress temperature rise in the exposure apparatus during maintenance.

FIG. 1 shows a schematic cross-sectional view of an exposure apparatus 100 according to the first embodiment.

The exposure apparatus 100 according to the present embodiment employs a projection method in which a pattern formed on an original (reticle, mask) is projected onto a substrate (wafer) using mirrors. However, the exposure method employed in the exposure apparatus 100 according to this embodiment is not limited to this.
Also, the exposure apparatus 100 in this embodiment is a scanning projection exposure apparatus employing a step-and-repeat method or a step-and-scan method, which is used when manufacturing semiconductor devices, liquid crystal displays, and the like.

As shown in FIG. 1, at least a portion of exposure apparatus 100 is installed within exposure chamber 200 .
Specifically, a supply port 220 and an exhaust port 221 are formed in the exposure chamber 200 . Then, a predetermined amount of temperature-controlled gas (hereinafter referred to as temperature-controlled gas) is circulated from the temperature-controlled machine room 210 (air conditioner) through the supply port 220 and the exhaust port 221, so that the exposure chamber 200 is The environment around the exposure apparatus 100 inside can be kept constant.
The number of supply ports 220 and exhaust ports 221 formed in the exposure chamber 200 is not limited to the number shown in FIG.

The exposure apparatus 100 according to this embodiment includes a light source 110 , an illumination optical system 120 , an imaging optical system 130 , an original stage 140 , a projection optical system, a projection chamber 150 , a substrate stage 160 and a structure 170 .
The exposure light flux emitted from the light source 110 is shaped into a predetermined shape by the illumination optical system 120 and the imaging optical system 130, illuminates the original M held on the original stage 140, passes through the original M, and is projected onto the substrate stage by the projection optical system. The light is focused onto the substrate P held on 160 .
As a result, the pattern provided on the original M is projected (transferred, drawn) onto the photosensitive agent on the surface of the substrate P via the projection optical system.

As shown in FIG. 1, the projection optical system is composed of a plurality of reflecting members, ie trapezoidal mirror 151, convex mirror 152 and concave mirror 153, which reflect the exposure light flux that has passed through the master M. Housed in 150.
Note that the trapezoidal mirror 151, the convex mirror 152, and the concave mirror 153 are each made of a glass material having a small coefficient of linear expansion.

FIG. 2A shows a schematic configuration diagram of a temperature control system 500 provided in the exposure apparatus 100 according to this embodiment.

As shown in FIG. 2( a ), in the temperature control system 500 , the temperature control machine room 210 and each of the supply ports 220 are connected to each other via supply ducts 222 .
Further, the supply duct 222 is provided with a supply amount adjusting section 223 having a structure like a butterfly valve, for example.

Specifically, the installation locations of the supply port 220 in the temperature control system 500 are the vicinity of the driving areas of the original stage 140 and the substrate stage 160, and the ceiling of the space within the exposure apparatus 100, that is, the exposure chamber 200 (first chamber). It is roughly classified into two types: neighborhood and neighborhood.
The former is provided to ensure the positioning accuracy of each stage, and the latter is provided to suppress the floating of particles in the space inside the exposure chamber 200 and to maintain the internal temperature of the exposure apparatus 100.

Also, the temperature control machine room 210 and the exhaust port 221 are connected to each other through an exhaust duct 224 .
The exhaust duct 224 is provided with an exhaust amount adjusting section 225 having a structure like a butterfly valve, for example.

In this way, the supply port 220 and the exhaust port 221 are arranged so that air conditioning (ventilation) is effectively performed by circulating the temperature control gas in the exposure chamber 200 .
Here, it is preferable that the supply amount of the temperature control gas from the supply port 220 is maintained to be larger than the exhaust amount of the gas from the exhaust port 221 by the supply amount adjustment unit 223 and the exhaust amount adjustment unit 225 .
As a result, the pressure inside the exposure chamber 200 can be made positive with respect to the pressure of the external environment, for example, the atmospheric pressure, in order to prevent contamination.

An optical system supply port 226 (second supply port) is formed in the projection chamber 150 (second chamber), and temperature controlled gas from the temperature control machine room 210 is supplied to an optical system supply duct 227 (second chamber). duct) into the projection chamber 150 .
The optical system supply duct 227 is provided with an optical system supply amount adjusting section 228 having a structure like a butterfly valve, for example.

Further, the projection chamber 150 is formed with an optical system exhaust port 229 (exhaust port), and the gas in the projection chamber 150 is exhausted through the optical system exhaust duct 230 and the discharge duct 233 (third duct). .
Here, the optical system exhaust port 229 is formed in the vicinity of the trapezoidal mirror 151 and the concave mirror 153 which are heat sources during exposure, thereby effectively exhausting heat from the projection chamber 150 .
The optical system exhaust duct 230 is connected to the exhaust duct 224, and the optical system exhaust duct 230 is provided with an optical system exhaust amount adjusting section 231 formed with a structure like a butterfly valve, for example.

A discharge port 232 (first supply port) is formed in the vicinity of the ceiling of the space inside the exposure chamber 200 , and the gas in the projection chamber 150 can be discharged into the exposure chamber 200 through the discharge duct 233 . can.
It should be noted that the outlet 232 is preferably formed at a location within the exposure chamber 200 where the function of suppressing the floating of particles can be achieved.
Accordingly, the discharge port 232 and the supply port 220 can have a function of suppressing the floating of particles in the exposure chamber 200 and a function of suppressing an increase in the internal temperature of the exposure apparatus 100 .

The amount of gas discharged from the discharge port 232 (third supply amount) is set to be smaller than the total amount of temperature control gas supplied from the supply ports 220 provided at a plurality of locations.
Further, the discharge duct 233 is provided with a discharge amount adjusting portion 234 formed with a structure like a butterfly valve, for example.

Further, as shown in FIG. 2(a), the temperature control machine room 210 and the discharge port 232 are connected to each other via a confluence duct 235 (first duct).
Then, the temperature control gas from the temperature control machine room 210 can be supplied into the exposure chamber 200 via the confluence duct 235 and the discharge port 232 .
The discharge duct 233 is also connected to the junction duct 235 at the junction 235 a of the junction duct 235 . can be released to

In addition, the confluence duct 235 is provided with a confluence supply amount adjustment portion 236 formed with a structure like a butterfly valve, for example.
The temperature control system 500 is provided with a controller 350 that performs control operations in the temperature control system 500 as described below.

FIG. 2B shows a schematic configuration diagram for explaining the control operation of the temperature control system 500 when starting exposure of the exposure apparatus 100 according to this embodiment.

As shown in FIG. 2B, when the exposure apparatus 100 according to the present embodiment starts exposure, the temperature control system 500 fully closes the combined supply amount adjustment section 236 and the optical system The supply amount adjusting section 228 is opened more than during non-exposure (first control).
As a result, the supply amount (first supply amount) of the temperature control gas flowing through the confluence duct 235 from the temperature control machine room 210 via the confluence supply amount adjuster 236 is reduced to zero.
On the other hand, the supply amount (second supply amount) of the temperature control gas flowing through the optical system supply duct 227 from the temperature control machine room 210 via the optical system supply amount adjustment unit 228 is increased by the decreased amount.

That is, the temperature control gas flowing from the temperature control machine room 210 through the confluence duct 235 is added to the temperature control gas flowing from the temperature control machine room 210 through the optical system supply duct 227, and the combined temperature control gas is fed into the projection chamber 150 from the optics feed port 226 .
As a result, it is possible to increase the amount of temperature control gas supplied into the projection chamber 150 while maintaining the total amount of temperature control gas supplied from the temperature control machine room 210 .

In addition, by fully opening the release amount adjustment unit 234, the temperature control gas that flows from the temperature control machine room 210 through the confluence duct 235 flows through the optical system supply duct 227, the projection chamber 150, and the release duct 233. It is supplied into the exposure chamber 200 from the discharge port 232 through.
That is, the temperature control gas flowing from the temperature control machine room 210 through the confluence duct 235 is also discharged from the temperature control machine room 210 through the optical system supply duct 227 through the discharge duct 233 to the discharge port. 232 into the exposure chamber 200 .

In this way, since the amount of the temperature control gas supplied into the exposure chamber 200 from the outlet 232 does not change, the pressure inside the exposure chamber 200 can be maintained at a positive pressure with respect to the atmospheric pressure.
In the temperature control system 500, the pressure in the exposure chamber 200 needs to be kept positive with respect to the atmospheric pressure. may change.

At this time, the gas supplied into the exposure chamber 200 from the discharge port 232 via the projection chamber 150 and the discharge duct 233 is used for cooling the projection optical system provided in the projection chamber 150 .
Therefore, the temperature of the gas supplied from the outlet 232 into the exposure chamber 200 becomes relatively high during exposure.

However, since the temperature rise at this time is about 0.1 degree at most, it hardly affects the temperature control in the exposure chamber 200 .
Also, from the viewpoint of suppressing the floating of particles in the exposure chamber 200 by using the gas supplied into the exposure chamber 200 from the outlet 232, such a temperature rise affects the functions of the temperature control system 500. can be considered not to give

FIG. 2(c) shows a schematic configuration diagram for explaining the control operation of the temperature control system 500 when the exposure of the exposure apparatus 100 according to this embodiment is completed.

As shown in FIG. 2(c), when exposure is completed in the exposure apparatus 100 according to the present embodiment, the combined supply amount adjustment section 236 is fully opened, and the optical system supply amount adjustment section 228 is opened during exposure. Compare and adjust in the closing direction. In addition, the release amount adjusting section 234 is adjusted to be fully closed (second control).
As a result, the increased amount of temperature control gas flowing through the optical system supply duct 227 at the time of exposure flows again from the temperature control machine room 210 through the combined supply amount adjustment unit 236 and through the combined duct 235 .

That is, the supply amount of the temperature control gas flowing through the confluence duct 235 from the temperature control machine room 210 via the confluence supply amount adjusting section 236 increases compared to that during exposure.
On the other hand, the supply amount of the temperature control gas flowing through the optical system supply duct 227 from the temperature control machine room 210 via the optical system supply amount adjusting unit 228 is reduced by the increased amount.
In other words, the amount of temperature control gas supplied into the projection chamber 150 from the optical system supply port 226 via the optical system supply duct 227 is reduced compared to that during exposure.

As described above, in the exposure apparatus 100 according to the present embodiment, part of the temperature control gas supplied directly into the exposure chamber 200 from the temperature control machine room 210 flows through the projection chamber 150 when exposure is started. Each supply amount adjustment unit is controlled to bypass.
This makes it possible to increase the supply amount of the temperature control gas supplied into the projection chamber 150 while maintaining the total supply amount of the temperature control gas from the temperature control machine room 210 .

Further, in the exposure apparatus 100 according to the present embodiment, each supply amount adjusting unit is configured so that the temperature-controlled gas bypassing the projection chamber 150 joins the temperature-controlled gas supplied from the temperature control machine room 210 into the exposure chamber 200. Control.
As a result, the pressure inside the exposure chamber 200 can be kept positive with respect to the atmospheric pressure by suppressing the change in the amount of the temperature control gas supplied from the temperature control machine room 210 into the exposure chamber 200 . can.

[Second embodiment]
FIG. 3 shows a schematic configuration diagram of a temperature control system 510 provided in an exposure apparatus according to the second embodiment.

The temperature control system 510 provided in the exposure apparatus according to this embodiment includes at least one temperature sensor 300 (temperature detection sensor) in addition to the configuration of the temperature control system 500 provided in the exposure apparatus according to the first embodiment. part) is provided.
Specifically, as shown in FIG. 3, in the temperature control system 510, each of the supply ports 220, the optical system supply port 226, and the discharge port 232 are provided with temperature sensors 300, respectively.

The temperature control system 510 performs control operations similar to those of the temperature control system 500 provided in the exposure apparatus 100 according to the first embodiment, and also performs the following control operations.
That is, based on the detection result of each temperature sensor 300, the controller 350 controls the output of the heater 310 provided in the temperature control machine room 210 so that the temperature control gas supplied from each port reaches a predetermined temperature. .

As described above, in the exposure apparatus according to the present embodiment, when starting exposure, the temperature control gas is supplied into the projection chamber 150 while maintaining the pressure in the exposure chamber 200 positive with respect to the atmospheric pressure. can increase the supply of
Moreover, the temperature control gas supplied from each port can be maintained at a predetermined temperature.

[Third embodiment]
FIG. 4 shows a schematic configuration diagram of a temperature control system 520 provided in an exposure apparatus according to the third embodiment.

In addition to the configuration of the temperature control system 500 provided in the exposure apparatus 100 according to the first embodiment, the temperature control system 520 provided in the exposure apparatus according to the present embodiment includes a motor and a drive amount detector. At least one drive unit 330 is provided.
Specifically, the drive shafts of the supply amount adjustment unit 223, the exhaust amount adjustment unit 225, the optical system supply amount adjustment unit 228, the optical system exhaust amount adjustment unit 231, the discharge amount adjustment unit 234, and the combined supply amount adjustment unit 236 A drive unit 330 is provided therefor.

The temperature control system 520 performs control operations similar to those of the temperature control system 500 provided in the exposure apparatus 100 according to the first embodiment, and also performs the following control operations.
That is, when the exposure is started and when the exposure is finished, the opening of each adjustment unit read by the drive amount detector included in each drive unit 330 is fed back to the control unit 350 so as to obtain a predetermined opening. Controls the opening of each adjustment section.

As described above, in the exposure apparatus according to the present embodiment, when starting exposure, the temperature control gas is supplied into the projection chamber 150 while maintaining the pressure in the exposure chamber 200 positive with respect to the atmospheric pressure. can increase the supply of
In addition, each adjustment section can be controlled to have a predetermined degree of opening.

[Fourth embodiment]
FIG. 5 shows a schematic configuration diagram of a temperature control system 530 provided in an exposure apparatus according to the fourth embodiment.

In the temperature control system 530 provided in the exposure apparatus according to the present embodiment, in addition to the configuration of the temperature control system 520 provided in the exposure apparatus according to the third embodiment, at least one flow rate sensor 360 (flow detection part) is provided.
Specifically, the primary side of each of the supply amount adjustment unit 223, the exhaust amount adjustment unit 225, the optical system supply amount adjustment unit 228, the optical system exhaust amount adjustment unit 231, the release amount adjustment unit 234, and the combined supply amount adjustment unit 236, That is, the flow rate sensor 360 is provided on the temperature control machine room 210 side.

Additionally, the temperature control system 530 includes a projection chamber pressure gauge 370 in the projection chamber 150 and an exposure chamber pressure gauge 380 in the exposure chamber 200 .
The temperature control system 530 performs control operations similar to those of the temperature control system 500 provided in the exposure apparatus 100 according to the first embodiment, and also performs the following control operations.
That is, the flow rate in the duct read by each flow sensor 360 when exposure is started and when exposure is finished is fed back to the control unit 350, and based on the detection result of each flow sensor 360, the flow rate in the duct reaches a predetermined level. The opening degree of each adjustment unit is controlled so that

Further, in the temperature control system 530, when the pressure read by the projection chamber pressure gauge 370 is lower than the pressure read by the exposure chamber pressure gauge 380, the opening degree of the discharge amount adjusting section 234 is reduced until the pressure increases. Control.
Furthermore, the temperature control system 530 is provided with an environmental pressure gauge 390 in the external environment of the exposure chamber 200 .
Then, when the pressure read by the exposure chamber pressure gauge 380 is lower than the pressure read by the environmental pressure gauge 390, the opening degree of the exhaust amount adjusting section 225 is controlled to be narrowed until the pressure increases.

As described above, in the exposure apparatus according to the present embodiment, when starting exposure, the pressure inside the projection chamber 150 and the exposure chamber 200 is maintained at a positive pressure with respect to the atmospheric pressure, and the pressure is supplied into the projection chamber 150 . It is possible to increase the amount of temperature control gas supplied.
Further, the opening degree of each adjustment unit can be controlled so that the flow rate in each duct becomes a predetermined flow rate when exposure is started and when exposure is finished.

[Fifth embodiment]
FIG. 6 shows a schematic configuration diagram of a temperature control system 540 provided in an exposure apparatus according to the fifth embodiment.

As shown in FIG. 6, the temperature control system 540 provided in the exposure apparatus according to the present embodiment connects the temperature control system 500 provided in the exposure apparatus according to the first embodiment to the junction duct 235. It has a configuration excluding
That is, in the temperature control system 500 provided in the exposure apparatus according to the first embodiment, the temperature control machine room 210 and the discharge port 232 are connected to each other through the confluence duct 235, and the discharge duct 233 is connected to the confluence duct. 235.

On the other hand, in the temperature control system 540 provided in the exposure apparatus according to this embodiment, as shown in FIG. It is connected to the optical system exhaust port 229 via (first duct).
That is, in temperature control system 540 , discharge duct 233 is directly connected to discharge port 232 .

In other words, in the temperature control system 540 , of the supply port 220 and the discharge port 232 provided near the ceiling of the space inside the exposure chamber 200 , the temperature control machine room 210 enters the exposure chamber 200 only through the supply port 220 . The temperature controlled gas is directly supplied to the
Then, the gas that has passed through the projection chamber 150 is supplied to the discharge port 232 .

In the temperature control system 540, the opening degrees of the supply amount adjustment unit 223, the exhaust amount adjustment unit 225, the optical system supply amount adjustment unit 228, the optical system exhaust amount adjustment unit 231, and the release amount adjustment unit 234 are adjusted during exposure and non-exposure. It can always be constant regardless of the time of exposure.

As described above, in the exposure apparatus according to the present embodiment, while the pressure in the exposure chamber 200 is set to a positive pressure with respect to the atmospheric pressure, the supply amount of the temperature control gas supplied to the projection chamber 150 is set to can be increased by comparison.

[Sixth embodiment]
FIG. 7 shows a schematic configuration diagram of a temperature control system 550 provided in an exposure apparatus according to the sixth embodiment.
In the temperature control system 550 provided in the exposure apparatus according to the present embodiment, in addition to the structure of the temperature control system 540 provided in the exposure apparatus according to the fifth embodiment, a blower 400 is installed in the path of the discharge duct 233. is provided.
In the temperature control system 550, when the amount of gas released from the outlet 232 is less than the required amount, the air blower 400 is driven to blow air so that the amount of gas released reaches the required amount.

As described above, the exposure apparatus according to the present embodiment can adjust the pressure in the exposure chamber 200 while increasing the supply amount of the temperature control gas supplied into the projection chamber 150 .

Although preferred embodiments have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

[Product manufacturing method]
The method for manufacturing an article according to the present embodiment is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure.
A method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using an exposure apparatus according to this embodiment (an exposure step of exposing the substrate).
Further, the method for manufacturing an article according to this embodiment includes a developing step (processing step) for developing the substrate on which the latent image pattern is formed in the exposing step.
Furthermore, the method of manufacturing an article according to the present embodiment can be performed on the substrate developed in the developing step by performing other well-known manufacturing steps (oxidation, film formation, deposition, doping, planarization, etching, photosensitizer stripping, dicing, bonding, packaging, etc.).

The method for manufacturing an article according to the present embodiment is advantageous in at least one of performance, quality, productivity, and production cost of the article compared to conventional methods.

100 exposure device 150 projection chamber (second chamber)
151 trapezoidal mirror (projection optical system)
152 convex mirror (projection optical system)
153 concave mirror (projection optical system)
200 exposure chamber (first chamber)
210 temperature control machine room (air conditioner)
226 optical system supply port (second supply port)
227 optical system supply duct (second duct)
232 discharge port (first supply port)
235 confluence duct (first duct)
350 control unit M original plate P substrate

Claims (14)

An exposure apparatus that exposes a substrate so as to transfer a pattern provided on an original onto the substrate,
a projection optical system that projects an image of the pattern onto the substrate;
a first chamber that is provided with a first supply port and that accommodates the exposure apparatus;
a second chamber that is provided with a second supply port and that accommodates the projection optical system;
An air conditioner, wherein a temperature-controlled gas is supplied from the first supply port into the first chamber through a first duct connected to the air conditioner and the first supply port, an air conditioner that supplies a temperature-controlled gas from the second supply port into the second chamber through a second duct connected to the air conditioner and the second supply port;
Before starting the exposure, a first supply amount of the temperature control gas from the air conditioner into the first duct is reduced, and the temperature control gas from the air conditioner into the second duct is reduced. a control unit that performs first control to increase the second supply amount;
An exposure apparatus comprising: further comprising a third duct connected to an exhaust port through which gas inside the second chamber is exhausted and to a junction formed in the first duct;
The controller adjusts the flow rate of the gas in the third duct so that the pressure in the first chamber becomes a positive pressure with respect to the pressure of the external environment in accordance with the first control. The exposure apparatus according to claim 1, characterized by: 3. The exposure apparatus according to claim 2, wherein the controller sets the first supply amount to zero when performing the first control. When performing the first control, the controller controls the gas in the third duct so that a third supply amount of the temperature-controlled gas from the air conditioner to the first chamber does not change. 4. An exposure apparatus according to claim 2, wherein the flow rate of is adjusted. 5. The control unit according to any one of claims 2 to 4, wherein after the exposure is finished, the control unit increases the first supply amount and performs second control to decrease the second supply amount. 1. The exposure apparatus according to claim 1. The controller adjusts the flow rate of the gas in the third duct so that the pressure in the first chamber becomes a positive pressure with respect to the pressure of the external environment in accordance with the second control. 6. The exposure apparatus according to claim 5, characterized by: 7. An exposure apparatus according to claim 5, wherein said control unit sets the flow rate of gas in said third duct to zero when performing said second control. When performing the second control, the controller controls the gas in the third duct so that a third supply amount of the temperature-controlled gas from the air conditioner to the first chamber does not change. 8. The exposure apparatus according to any one of claims 5 to 7, wherein the flow rate of is adjusted. a flow rate detection unit that detects at least one flow rate of gas flowing through the first duct, the second duct, and the third duct;
9. An exposure apparatus according to any one of claims 2 to 8, wherein said control section controls said at least one flow rate based on a detection result of said flow rate detection section. A temperature detection unit that detects the temperature of at least one of the temperature-controlled gas supplied from the first supply port and the second supply port,
10. The exposure apparatus according to any one of claims 1 to 9, wherein the controller controls a heater provided in the air conditioner based on the detection result of the temperature detector. An exposure apparatus that exposes a substrate so as to transfer a pattern provided on an original onto the substrate,
a projection optical system that projects an image of the pattern onto the substrate;
a first chamber that is provided with a first supply port and that accommodates the exposure apparatus;
a second chamber that is provided with a second supply port and an exhaust port and that houses the projection optical system;
An air conditioner that supplies a temperature-controlled gas from the second supply port into the second chamber through a second duct connected to the air conditioner and the second supply port. When,
with
An exposure apparatus, wherein a temperature control gas is supplied from the first supply port into the first chamber through a first duct connected to the exhaust port and the first supply port. . 12. An exposure apparatus according to claim 11, further comprising a blower for increasing the flow rate of gas in said first duct. An illumination optical system that illuminates exposure light toward the original,
13. The exposure apparatus according to any one of claims 1 to 12, wherein the projection optical system comprises a reflecting member that reflects the exposure light that has passed through the original toward the substrate. exposing a substrate with an exposure apparatus according to any one of claims 1 to 13;
developing the exposed substrate;
A method for manufacturing an article, comprising:

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