JP2022121971A - Laser power supply device and laser processing device - Google Patents

Abstract

To provide a laser power supply device capable of appropriately generating simmer discharge to stabilize output from a laser oscillator.SOLUTION: A high frequency power supply supplies high frequency power to a laser oscillator. A control device controls a high frequency power source so as to excite the laser oscillator when an excitation request is received and to cause the laser oscillator to perform simmer discharge when a simmer request is received. Upon receipt of the simmer request during a period in which simmer discharge should be avoided, the controller causes the laser oscillator to delay from time when the simmer request is received and perform simmer discharge.SELECTED DRAWING: Figure 3

Description

The present invention relates to a laser power supply device and a laser processing apparatus.

In order to stably output a pulsed laser beam in a gas laser oscillator having a discharge electrode, a technique is known in which a high-frequency short pulse is applied to the discharge electrode to generate a simmer discharge (see Patent Document 1, etc.). The simmer discharge ionizes the laser medium gas before excitation, thereby stabilizing the output of the pulsed laser beam. The simmer discharge time is sufficiently shorter than the time from the start of discharge to the output of the laser beam. Therefore, no laser beam is output by simmer discharge. Shimmer discharges are usually repeated at a constant frequency.

Japanese Patent Publication No. 2013-507791

A high-frequency power source supplies a laser oscillator with high-frequency power for excitation and high-frequency power for simmer discharge. DC power is supplied from the DC power supply to the high frequency power supply. The DC link voltage is measured in order to maintain the voltage of the DC power supplied to the high frequency power supply (hereinafter referred to as the DC link voltage) within a predetermined target range. During the excitation period of the laser oscillator and the simmer discharge period, it is difficult to stably measure the DC link voltage due to the influence of high frequency noise from the high frequency power supply. Therefore, it is not preferable to measure the DC link voltage during simmer discharge. When the simmer discharge ends and the DC link voltage is measured, a delay may occur in the control of the DC power supply.

If the DC link voltage is out of the predetermined target range, excitation of the laser oscillator must be put on hold until the DC link voltage is within the predetermined target range. If there is a delay in controlling the DC link voltage to fall within the target range, the waiting time until the start of excitation of the laser oscillator may become longer.

Further, when the timing for generating the simmer discharge overlaps with the period for exciting the laser oscillator, the process for generating the simmer discharge is not executed. In this case, the frequency of occurrence of simmer discharge decreases. An increase or decrease in the frequency of occurrence of simmer discharge affects the stability of the output from the laser oscillator.

SUMMARY OF THE INVENTION An object of the present invention is to provide a laser power supply device and a laser processing apparatus capable of appropriately generating a simmer discharge and stabilizing the output from a laser oscillator.

According to one aspect of the invention,
a high-frequency power supply that supplies high-frequency power to a laser oscillator;
a control device for controlling the high-frequency power supply to excite the laser oscillator when an excitation request is received and to simmer discharge the laser oscillator when a simmer request is received;
A laser power supply device is provided in which, when the control device receives the simmer request during a period during which simmer discharge should be avoided, the control device causes the laser oscillator to perform simmer discharge with a delay from the time when the simmer request is received.

According to another aspect of the invention,
a laser oscillator;
a high-frequency power source that supplies high-frequency power to the laser oscillator;
a control device that controls the high-frequency power supply;
a processing machine that holds an object to be processed, causes the laser beam output from the laser oscillator to enter the object to be processed, and gives an excitation request and a simmer request to the control device;
The control device is
upon receiving the excitation request from the processing machine, controlling the high-frequency power supply to excite the laser oscillator;
when receiving the simmer request from the processing machine, controlling the high-frequency power supply to cause the laser oscillator to discharge simmer;
A laser processing apparatus is provided in which, when the simmer request is received during a period during which simmer discharge should be avoided, the laser oscillator causes the laser oscillator to perform simmer discharge with a delay from the time when the simmer request is received.

If a simmer request is received during a period during which simmer discharge should be avoided, the simmer discharge is delayed, thus avoiding various inconveniences caused by the occurrence of simmer discharge during the period during which simmer discharge should be avoided. In addition, since simmer discharge is delayed in response to a simmer request received during a period in which simmer discharge should be avoided, rather than not performed, a decrease in the number of simmer discharges can be avoided. Therefore, the number of simmer discharges in a certain period of time can be maintained at a predetermined number.

FIG. 1 is a block diagram of a laser processing apparatus according to one embodiment. FIG. 2 is an equivalent circuit diagram of a DC power supply. FIG. 3 is a timing chart of excitation simmer request RQ, high-frequency power RF, laser beam LB, on/off of low-side switching element Q1, input current IL, charging current IC of capacitor C, voltage measurement period PV, and DC link voltage VC. FIG. 4 is a timing chart of excitation simmer request RQ, high frequency power RF, laser beam LB, input current IL, voltage measurement period PV, and DC link voltage VC. FIG. 5 is a block diagram of a laser processing apparatus according to another embodiment. 6A and 6B are block diagrams showing one configuration example of the detection section of the laser processing apparatus shown in FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A laser power supply device and a laser processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG.

FIG. 1 is a block diagram of a laser processing apparatus according to this embodiment. The laser processing apparatus according to this embodiment includes a laser power supply device 10 , a laser oscillator 40 and a processing machine 50 . High-frequency power RF is supplied from the laser power supply 10 to the laser oscillator 40 .

The laser oscillator 40 is a gas laser oscillator such as a carbon dioxide gas laser oscillator, and includes a pair of discharge electrodes 41 . When the high-frequency power RF is supplied to the laser oscillator 40, a discharge occurs between the pair of discharge electrodes 41 and a laser beam LB is output. A laser beam LB output from the laser oscillator 40 is input to the processing machine 50 .

The processing machine 50 includes a folding mirror 51 , a beam scanner 52 , a condenser lens 53 , a movable stage 54 and a processing machine control circuit 55 . A workpiece 60 is held on the movable stage 54 . The laser beam LB input to the processing machine 50 is reflected downward by the folding mirror 51 and enters the workpiece 60 via the beam scanner 52 and the condenser lens 53 . The object 60 to be processed is, for example, a printed circuit board, and is subjected to perforation processing by the incidence of the laser beam LB. Note that an attenuator, a beam expander, an aperture, or the like may be arranged on the path of the laser beam LB, if necessary.

The beam scanner 52 moves the incident position of the laser beam LB on the surface of the workpiece 60 by scanning the laser beam LB. As the beam scanner 52, for example, a galvanometer scanner including a pair of oscillating mirrors is used. An fθ lens, for example, is used as the condenser lens 53 . The condensing lens 53 converges the laser beam LB on the surface of the object 60 to be processed.

By moving the incident position of the laser beam LB by the beam scanner 52, processing within the scannable range is performed. By operating the movable stage 54 and sequentially arranging the areas to be processed on the surface of the object 60 within the scannable range of the beam scanner 52, the entire surface of the object 60 is processed. . A processing machine control circuit 55 controls the beam scanner 52 and the movable stage 54 . Further, the processing machine control circuit 55 sends an excitation simmer request RQ to the laser power supply 10 . The excitation simmer request RQ includes a request to excite the laser oscillator 40 to output the laser beam LB and a request to cause the laser oscillator 40 to discharge simmer.

Next, the laser power supply device 10 will be described. The laser power supply 10 includes a rectifier 30 , a DC power supply 20 , a high frequency power supply 31 , a control power supply 32 and a control device 33 .

A three-phase AC current is supplied to the rectifier 30 from an external AC power supply 70 . A DC current rectified by the rectifier 30 is supplied to the DC power supply 20 . The DC power supply 20 converts the input DC voltage into a predetermined DC voltage and supplies DC power to the high frequency power supply 31 . Assume that the output voltage of the DC power supply 20 is referred to as a DC link voltage VC. The high-frequency power supply 31 converts the DC power supplied from the DC power supply 20 into high-frequency power RF, and supplies the laser oscillator 40 with the high-frequency power RF. An inverter, for example, is used for the high-frequency power supply 31 .

The controller 33 receives the excitation simmer request RQ from the processing machine control circuit 55 . The control device 33 controls the DC power supply 20 based on the excitation simmer request RQ, and controls the high frequency power supply 31 by giving an operation command OC to the high frequency power supply 31 . The control power supply 32 converts the AC power supplied from the AC power supply 70 into DC power and supplies the DC power to the control device 33 .

FIG. 2 is an equivalent circuit diagram of the DC power supply 20. As shown in FIG. DC power supply 20 includes a switching converter 21 and a converter controller 22 . The switching converter 21 includes a low side switching element Q1, a high side switching element Q2, freewheel diodes D1 and D2, and an inductor L. These elements constitute a boost converter.

A closed circuit is configured by the rectifier 30, the inductor L, and the low-side switching element Q1. A freewheel diode D1 is connected to the low-side switching element Q1. Furthermore, the rectifier 30, the inductor L, the high-side switching element Q2, and the capacitor C form another closed circuit. A freewheel diode D2 is connected to the high-side switching element Q2.

The switching converter 21 boosts the voltage Vin applied from the rectifier 30 (FIG. 1) and charges the capacitor C with the voltage Vin. A voltage across the terminals of the capacitor C is equal to the DC link voltage VC applied to the high frequency power supply 31 . The capacitor C functions as an electricity storage device that stores power to be supplied to the high frequency power supply 31 . Such capacitors are sometimes called bank capacitors.

The high-frequency power supply 31 intermittently operates based on an operation command OC from the control device 33 . The capacitor C is discharged in accordance with the intermittent operation of the high frequency power supply 31 and the high frequency power RF is supplied to the discharge electrode 41 of the laser oscillator 40 . Capacitor C has a large electrostatic capacity capable of supplying sufficient power during the discharging process of one operating cycle of high-frequency power supply 31 .

The converter controller 22 controls on/off of the low-side switching element Q1 and the high-side switching element Q2 according to commands from the control device 33 . When the low-side switching element Q1 is switched, the voltage Vin is boosted, the capacitor C is charged, and the DC link voltage VC rises. Switching high-side switching element Q2 returns power from capacitor C to rectifier 30, reducing DC link voltage VC.

A current sensor 23 measures the input current IL through the inductor L. A measured value of the input current IL is input to the controller 33 . A voltage sensor 24 measures a DC link voltage VC, which is the voltage across capacitor C. A measurement of the DC link voltage VC is input to the controller 33 .

FIG. 3 shows excitation simmer request RQ, high-frequency power RF, laser beam LB, on/off of low-side switching element Q1, input current IL, charging current IC of capacitor C, voltage measurement period PV by voltage sensor 24, and DC link voltage VC. It is a timing chart. It should be noted that the waveforms of the laser beam LB, current, voltage, etc. shown in FIG. 3 schematically show increasing and decreasing trends, and do not represent exact waveform shapes.

The rise of the waveform of the excitation simmer request RQ corresponds to a request to start supply of the high frequency power RF, and the fall of the waveform corresponds to a request to stop the supply of the high frequency power RF. The excitation simmer request RQ is classified into an excitation request RQe having a relatively long pulse width from rising to falling and a simmer request RQs having a relatively short pulse width. The excitation request RQe is a signal requesting that the laser oscillator 40 be excited to output the laser beam LB. The simmer request RQs is a signal requesting simmer discharge from the laser oscillator 40 .

The processing machine control circuit 55 (FIG. 1) repeatedly generates the excitation request RQe at a frequency of about 1 kHz to 5 kHz, for example, and generates the simmer request RQs at a constant frequency of about 10 kHz, for example.

When the excitation request RQe rises (time t0), the controller 33 controls the high-frequency power supply 31 to start excitation of the laser oscillator 40 . Specifically, an operation command OC is given to the high-frequency power supply 31 so that the high-frequency power supply RFe for excitation is supplied from the high-frequency power supply 31 to the laser oscillator 40 . When the high-frequency power RFe for excitation is supplied to the laser oscillator 40, the output of the laser beam LB is started. When the excitation request RQe falls (time t1), the control device 33 stops excitation of the laser oscillator 40 . Specifically, the high-frequency power supply 31 is controlled to stop supplying the high-frequency power RFe for excitation. As a result, the output of the laser beam LB is stopped.

The controller 33 starts the excitation of the laser oscillator 40 and at the same time turns on the low-side switching element Q1. As a result, the input current IL flows through the inductor L and the low-side switching element Q1. The input current IL increases over time.

After stopping the excitation of the laser oscillator 40, the control device 33 turns off the low-side switching element Q1 at time t2 after a certain period of time has passed. This causes input current IL to flow through inductor L, freewheeling diode D2, and capacitor C. FIG. The input current IL decreases over time and becomes almost zero at time t3. A charging current IC flows through the capacitor C during the period from time t2 to time t3.

During the period (time t0 to t1) in which the high frequency power supply 31 supplies the excitation high frequency power RFe to the laser oscillator 40, the DC link voltage VC decreases with time. When the supply of the high-frequency power RFe for excitation is stopped (time t1), the DC link voltage VC keeps a constant value. During the period in which the charging current IC flows through the capacitor C (time t2 to t3), the DC link voltage VC gradually rises with the lapse of time and recovers to almost the original voltage value.

The control device 33 measures the DC link voltage VC at a predetermined timing and performs feedback control. For example, when the measured value of the DC link voltage VC becomes less than the lower limit of the target range, the capacitor C is charged by turning on and off the low-side switching element Q1. Note that the DC link voltage VC is not measured during the period from time t0 to t3 because the DC link voltage VC fluctuates. The DC link voltage VC is measured for a certain period (time t3 to t4) from time t3 when the charging current IC becomes zero and the DC link voltage VC is stabilized. The controller 33 measures the voltage value a plurality of times during this period, and adopts the average value of the obtained measured values as the measured value of the DC link voltage VC.

FIG. 3 shows an example in which the controller 33 receives a simmer request RQs during the voltage measurement period PV (time t3-t4). When the laser oscillator 40 is simmer discharged during the voltage measurement period PV, high frequency noise is superimposed on the DC link voltage VC due to the operation of the high frequency power supply 31 . Therefore, the DC link voltage VC cannot be measured accurately.

The control device 33 does not cause the laser oscillator 40 to perform simmer discharge during the voltage measurement period PV, but causes the laser oscillator 40 to perform simmer discharge after the voltage measurement period PV ends. That is, as indicated by arrow D, the simmer discharge is delayed from the time when the simmer request RQs is received. Specifically, after confirming the end of the voltage measurement period PV (time t4), the control device 33 causes the high-frequency power supply 31 to supply the laser oscillator 40 with the high-frequency power RFs for simmer (time t5). An operation command OC is given to the high frequency power supply 31 .

Since the simmer discharge period of the laser oscillator 40 is short, the laser medium gas between the pair of discharge electrodes 41 (FIG. 2) is ionized, but laser oscillation does not occur. While the high-frequency power supply 31 is supplying the high-frequency power RFs for simmering to the laser oscillator 40, the DC link voltage VC gradually decreases.

The control device 33 controls the switching converter 21 during the simmer discharge period as well as during the excitation period. As a result, the charging current IC flows, and the DC link voltage VC recovers to approximately the original voltage value. Note that it is not necessary to control the switching converter 21 during the simmer discharge period. The energy consumed in simmer discharge is much less than that consumed in excitation, and the voltage drop due to simmer discharge is much smaller than the voltage drop due to excitation. Therefore, even if the DC link voltage VC drops due to simmer discharge, the DC link voltage VC after the drop falls within the allowable range. The power equivalent to the energy consumed by the simmer discharge is recovered by operating the switching converter 21 during the next excitation period.

FIG. 4 is a timing chart of excitation simmer request RQ, high frequency power RF, laser beam LB, input current IL, voltage measurement period PV, and DC link voltage VC.

A simmer request RQs is input to the control device 33 (FIG. 1) at a constant cycle Ps. When receiving the simmer request RQs, the controller 33 causes the laser oscillator 40 to discharge simmer. Specifically, the control device 33 controls the high frequency power supply 31 to output high frequency power RFs for simmer discharge from the high frequency power supply 31 . At this time, since laser oscillation does not occur in the laser oscillator 40, the laser beam LB is not output.

While the high-frequency power supply 31 supplies the laser oscillator 40 with the high-frequency power RFs for simmer discharge, the DC link voltage VC decreases. In response to the drop in DC link voltage VC, controller 33 operates switching converter 21 to restore DC link voltage VC, as described with reference to FIG. Note that it is not necessary to control the switching converter 21 during the period of simmer discharge, similarly to the operation during simmer discharge described with reference to FIG. The power equivalent to the energy consumed by the simmer discharge is recovered by operating the switching converter 21 during the next excitation period.

In the example shown in FIG. 4, one simmer request RQs overlaps the excitation request RQe. A dashed line represents the simmer request RQs that overlaps the excitation request RQe. A simmer discharge cannot be generated in the laser oscillator 40 for the simmer request RQs that overlaps the excitation request RQe.

The controller 33 excites the laser oscillator 40 upon receiving the excitation request RQe. Specifically, the high-frequency power supply 31 is controlled to output high-frequency power RFe for excitation from the high-frequency power supply 31 . As a result, the laser beam LB is output. At this time, as described with reference to FIG. 3, the input current IL flows and the DC link voltage VC fluctuates.

The control device 33 has a function of detecting that the simmer request RQs overlaps with the excitation request RQe. For example, it is possible to determine whether or not the simmer request RQs overlaps the excitation request RQe from the elapsed time from the simmer request RQs immediately before the excitation request RQe and the period Ps of the simmer request RQs.

When the controller 33 receives the simmer request RQs during the excitation period of the laser oscillator 40, the controller 33 causes the laser oscillator 40 to emit simmer discharge with a certain time delay from the time of receiving the simmer request RQs as indicated by arrow D. For example, the control device 33 causes the high-frequency power supply 31 to supply the high-frequency power RFs for simmer discharge while the input current IL for restoring the DC link voltage VC is flowing. The simmer discharge of the laser oscillator 40 temporarily lowers the DC link voltage VC.

During the voltage measurement period PV after the input current IL becomes zero, the controller 33 measures the DC link voltage VC as described with reference to FIG.

Next, the excellent effects of the above embodiment will be described.
In the above embodiment, as described with reference to FIG. 3, when the control device 33 receives the simmer request RQs during the voltage measurement period PV, the simmer discharge is not generated until the end of the voltage measurement period PV. After the PV ends, a simmer discharge is generated. Since the voltage measurement period PV does not overlap with the simmer discharge period, the DC link voltage VC can be measured without being affected by noise caused by the simmer discharge. Therefore, it is possible to improve the measurement accuracy of the DC link voltage VC.

By delaying the voltage measurement period PV instead of delaying the start of the simmer discharge, it is possible to measure the DC link voltage VC without being affected by noise. However, in this case, the timing of obtaining the measured value of the DC link voltage VC is delayed. As a result, a delay also occurs in control of the switching converter 21 based on the DC link voltage VC. Due to the delay in controlling the switching converter 21, the elapsed time until the DC link voltage VC recovers becomes longer.

In order to improve the stability of laser oscillation, the laser oscillator 40 cannot be excited until the DC link voltage VC recovers. In the above embodiment, since there is no delay in the recovery of the DC link voltage VC, the laser oscillator 40 can be excited in response to the excitation request RQe in a short period.

Furthermore, in the above embodiment, as shown in FIG. 4, even when the simmer request RQs of one cycle overlaps with the excitation request RQe, the control device 33 delays the timing to cause the laser oscillator 40 to discharge the simmer. Therefore, the number of simmer discharges per unit time is maintained substantially constant. As a result, the degree of ionization of the laser medium gas during excitation of the laser oscillator 40 is made uniform, and the pulse energy of the laser beam LB can be stabilized.

Next, a modification of the above embodiment will be described.
In the above embodiment, as described with reference to FIG. 3, when the control device 33 receives the simmer request RQs during the voltage measurement period PV, the simmer discharge is started after the voltage measurement period PV ends. As a modification, the simmer discharge may be started with a certain delay time after the simmer request RQs is given. This delay time should be long enough so that the simmer discharge starts after the voltage measurement period PV ends.

Further, in the above embodiment, when the control device 33 receives the simmer request RQs during the voltage measurement period PV and when the simmer request RQs is received during the excitation period of the laser oscillator 40, the start of the simmer discharge is delayed. there is That is, the voltage measurement period PV and the excitation period of the laser oscillator 40 are treated as periods in which simmer discharge should be avoided. In addition, a period during which a process that is not preferable to be executed in parallel with the simmer discharge may be included in the period during which the simmer discharge should be avoided. If the control device receives the simmer request RQs during a period during which such simmer discharge should be avoided, it is preferable to delay the start of the simmer discharge.

Next, a laser processing apparatus and a laser power supply according to another embodiment will be described with reference to FIGS. 5, 6A, and 6B. Hereinafter, explanations of configurations common to the embodiments shown in FIGS. 1 to 4 will be omitted.

FIG. 5 is a block diagram of a laser processing apparatus according to another embodiment. A laser processing apparatus according to the embodiment shown in FIG. 5 includes a partially reflective mirror 45 and a photodetector 46 . A part of the laser beam LB output from the laser oscillator 40 is reflected by the partially reflecting mirror 45 and enters the photodetector 46 . The photodetector 46 outputs a detection result SL when detecting the incidence of the laser beam LB. This detection result SL is input to the detection section 33A of the control device 33 . The detection unit 33A can detect the timing of starting and stopping the output of the laser beam LB from the detection result SL.

FIG. 6A is a block diagram showing a configuration example of the detector 33A. The detection unit 33A includes a filter circuit 35 and a comparator 36 using operational amplifiers. An electrical signal output from the photodetector 46 (FIG. 5) is input to the inverting input terminal or non-inverting input terminal of the operational amplifier of the filter circuit 35 . A reference voltage is applied to the other input terminal of the operational amplifier. Alternatively, differential signals are input to two input terminals of the operational amplifier. The output of the filter circuit 35 is input to the non-inverting input terminal of the comparator 36 . A predetermined threshold voltage is applied to the inverting input terminal. By comparing the output of the filter circuit 35 and the threshold voltage, it is possible to detect the start and stop of output of the pulse laser beam. In this way, the detection timing delay can be reduced by configuring the detection function with an analog circuit.

FIG. 6B is a block diagram showing another configuration example of the detector 33A. An electrical signal output from the photodetector 46 (FIG. 5) is input to the A/D converter 37 and converted into a digital signal. This digital signal is filtered by the digital filter processor 38A. The filtered digital signal is input to the determination processing section 38B. The determination processing unit 38B detects the start and stop of output of the pulse laser beam by comparing the value of the digital signal and the determination threshold. The functions of the digital filter processing section 38A and the determination processing section 38B are realized by the CPU or FPGA 38. FIG. In this manner, by converting the output signal of the photodetector 46 into a digital signal and performing determination based on the digital signal, the determination threshold can be set with high accuracy. Moreover, it is possible to appropriately adjust the determination threshold depending on the state of the laser oscillator.

In the embodiment shown in FIG. 4, as indicated by arrow D, a delay time for delaying the start of simmer discharge is predetermined. On the other hand, in the embodiments shown in FIGS. 5, 6A, and 6B, when the controller 33 receives the simmer request RQs during the excitation period of the laser oscillator 40, the output of the laser beam LB is stopped until the output of the laser beam LB is stopped. , to delay the onset of the shimmer discharge.

Next, the excellent effects of the embodiment shown in FIGS. 5, 6A, and 6B will be described.
When the supply of the high-frequency power RFe for excitation to the laser oscillator 40 is stopped, the laser output sharply drops, but the output of the laser beam LB continues for a very short time after the supply of the high-frequency power RFe is stopped. In the embodiment shown in FIG. 4, it is necessary to give some margin to the delay time for starting the simmer discharge in consideration of the duration of the output of the laser beam LB. On the other hand, in the embodiment shown in FIG. 5, since the simmer discharge is started upon detection of the stoppage of the output of the laser beam LB, the simmer discharge can be started immediately after the stoppage of the output of the laser beam LB.

It goes without saying that each of the above-described embodiments is an example, and partial substitutions or combinations of configurations shown in different embodiments are possible. Similar actions and effects due to similar configurations of multiple embodiments will not be sequentially referred to for each embodiment. Furthermore, the invention is not limited to the embodiments described above. For example, it will be obvious to those skilled in the art that various changes, improvements, combinations, etc. are possible.

10 Power supply device for laser 20 DC power supply 21 Switching converter 22 Converter controller 23 Current sensor 24 Voltage sensor 30 Rectifier 31 High frequency power supply 32 Control power supply 33 Control device 33A Detector 35 Amplification filter circuit 36 Comparator 37 A/D converter 38A Digital filtering Unit 38B Judgment processing unit 38 CPU/FPGA
40 laser oscillator 41 discharge electrode 45 partial reflection mirror 46 photodetector 50 processing machine 51 folding mirror 52 beam scanner 53 condenser lens 54 movable stage 55 processing machine control circuit 60 processing object 70 AC power supply

Claims (9)

a high-frequency power supply that supplies high-frequency power to a laser oscillator;
a control device for controlling the high-frequency power supply to excite the laser oscillator when an excitation request is received and to simmer discharge the laser oscillator when a simmer request is received;
The laser power supply device, when receiving the simmer request during a period during which simmer discharge should be avoided, causes the laser oscillator to perform simmer discharge with a delay from the time when the simmer request is received. 2. The laser power supply according to claim 1, wherein the period during which the simmer discharge should be avoided includes a period during which the laser oscillator is excited. The control device is
3. The power supply device for a laser according to claim 2, wherein when said simmer request is received during a period for exciting said laser oscillator, said laser oscillator is delayed by a predetermined time from the time when said simmer request is received, and simmer discharge is caused in said laser oscillator. . A detection result from a photodetector that detects a laser beam output from the laser oscillator is input to the control device,
The control device is
3. The method according to claim 2, wherein when the simmer request is received during the period of excitation of the laser oscillator, the laser oscillator is caused to emit simmer discharge after output of the laser beam from the laser oscillator is completed based on the detection result from the photodetector. A power supply for the described laser. further comprising a DC power supply that supplies DC power to the high-frequency power supply,
The control device is
feedback control by measuring the output voltage of the DC power supply,
5. The laser power supply according to claim 1, wherein the period during which the simmer discharge should be avoided includes a period during which the output voltage of the DC power supply is measured. The control device is
6. The laser according to claim 5, wherein when the simmer request is received during the period of measuring the output voltage of the DC power supply, the laser oscillator causes the laser oscillator to perform simmer discharge with a delay of a predetermined time from the time when the simmer request is received. power supply. The control device is
6. The power supply device for a laser according to claim 5, wherein when the simmer request is received during the period for measuring the output voltage of the DC power supply, the laser oscillator causes simmer discharge after the period for measuring the output voltage of the DC power supply is over. . a laser oscillator;
a high-frequency power source that supplies high-frequency power to the laser oscillator;
a control device that controls the high-frequency power supply;
a processing machine that holds an object to be processed, causes a laser beam output from the laser oscillator to enter the object to be processed, and gives an excitation request and a simmer request to the control device;
The control device is
upon receiving the excitation request from the processing machine, controlling the high-frequency power supply to excite the laser oscillator;
when receiving the simmer request from the processing machine, controlling the high-frequency power supply to cause the laser oscillator to discharge simmer;
A laser processing apparatus that, when receiving the simmer request during a period during which simmer discharge should be avoided, causes the laser oscillator to perform simmer discharge with a delay from the time of receiving the simmer request. further comprising a photodetector that detects a laser beam output from the laser oscillator and outputs a detection result to the control device;
The period for avoiding the simmer discharge includes a period for exciting the laser oscillator,
Upon receiving the simmer request during the period of excitation of the laser oscillator, the control device causes the laser oscillator to emit simmer discharge after outputting the laser beam from the laser oscillator based on the detection result from the photodetector. The laser processing apparatus according to claim 8, wherein

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