JP2022071998A - Phenol resin composition for inorganic fiber composite material - Google Patents

Abstract

To provide a phenol resin composition which is reduced in a diffusion amount of aldehydes, is excellent in adhesion to an inorganic fiber base material, and as a result, enables production of an inorganic fiber composite body having excellent mechanical strength.SOLUTION: A phenol resin composition for an inorganic fiber composite material contains a phenol resin, a urea derivative, resorcinols and an epoxysilane coupling agent, in which a solid content is 60 mass% or more based on the whole phenol resin composition.SELECTED DRAWING: None

Description

The present invention relates to a phenolic resin composition for an inorganic fiber composite material.

Inorganic fiber composite materials obtained by binding inorganic fibers such as glass fibers with a binder resin are used in a wide range of fields as heat insulating materials for buildings and various devices. As such a binder resin, a water-soluble phenol resin, which is a condensate of monovalent phenol and aldehydes, is often used from the viewpoint of excellent curability, bonding strength, water resistance, moisture resistance, flame retardancy, and the like. It is used. When a phenol resin is used as a binder, the inorganic fiber composite material is produced by applying or impregnating a phenol resin composition synthesized from phenols and aldehydes to the inorganic fibers and then heat-curing the phenol resin. Will be done. In such a composite material using a phenol resin, unreacted aldehydes contained in the phenol resin may be released, which may cause a load on the environment and the human body.

As a technique for reducing the amount of aldehydes emitted, in Patent Document 1, in order to reduce the content of unreacted aldehydes contained in the phenol resin, after the completion of the phenol resin synthesis reaction, before and after the termination reaction or In both cases, a technique for adding both a urea derivative and resorcin has been proposed.

Japanese Unexamined Patent Publication No. 2020-050730

However, although the phenol resin composition described in Patent Document 1 reduces the amount of formaldehyde emitted, there is room for improvement in the adhesion to the inorganic fiber base material, which is a property desired as a binder resin for the inorganic fiber composite material. there were.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to produce an inorganic fiber composite having excellent adhesion to an inorganic fiber base material and, as a result, excellent mechanical strength while reducing the amount of aldehydes emitted to the extent that it does not adversely affect the human body. It is an object of the present invention to provide a phenolic resin composition which can be produced.

According to the present invention
Phenol formaldehyde,
Urea derivative,
A phenolic resin composition for an inorganic fiber composite material, which comprises resorcins and an epoxysilane coupling agent.
Provided is a phenol resin composition for an inorganic fiber composite material, which has a solid content of 60% by mass or more with respect to the entire phenol resin composition.

According to the present invention, the amount of aldehydes emitted is reduced, thereby reducing the environmental load and the load on the human body, and the inorganic fiber has excellent adhesion to the inorganic fiber base material, and as a result, has excellent mechanical strength. Provided is a phenolic resin composition capable of producing a composite.

Hereinafter, embodiments of the present invention will be described.
[Phenol resin composition for inorganic fiber composite material]
The phenolic resin composition for an inorganic fiber composite material of the present embodiment (sometimes referred to as a "phenolic resin composition" in the present specification) is a material used as a binder resin for an inorganic fiber composite material. Specifically, the phenolic resin composition of the present embodiment is applied or impregnated into an inorganic fiber base material, and then cured by heat treatment.

The phenolic resin composition of the present embodiment contains a phenolic resin, a urea derivative, resorcins, and an epoxysilane coupling agent. Since the phenol resin composition of the present embodiment contains a phenol resin, the cured product has excellent flame retardancy and excellent mechanical strength. By containing the urea derivative and resorcins in the phenol resin composition of the present embodiment, the amount of aldehydes emitted is reduced. The reason for this is not necessarily clear, but it is considered that the free aldehyde exists as a non-volatile substance due to the reaction or interaction between the urea derivative and resorcins and the free aldehyde in the phenol resin composition. The phenolic resin composition of the present embodiment also contains an epoxy silane coupling agent. As a result, the phenolic resin composition of the present embodiment has high adhesion to the inorganic fiber base material, and thus the mechanical strength of the obtained inorganic fiber composite is improved. Hereinafter, each component used in the phenol resin composition of the present embodiment will be described.

(Phenol resin)
The phenol resin used in the phenol resin composition of the present embodiment is a resol-type phenol resin obtained by reacting phenols and aldehydes in the presence of a basic catalyst.

Examples of the phenols used for the synthesis of the resole-type phenol resin include phenols; cresols such as o-cresol, m-cresol, p-cresol; o-ethylphenol, m-ethylphenol, p-ethylphenol and the like. Ethylphenols; butylphenols such as isopropylphenol, butylphenol, p-tert-butylphenol; alkylphenols such as p-tert-amylphenol, p-octylphenol, p-nonylphenol, p-cumylphenol; fluorophenols, chlorophenols. , Bromophenol, iodophenol and other halogenated phenols; monovalent phenol substituents such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol and trinitrophenol: monovalent such as 1-naphthol and 2-naphthol. Phenols; and polyhydric phenols such as pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, fluoroglucolcin, bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalin and the like. These can be used alone or in admixture of two or more.

Aldehydes used for the synthesis of resole-type phenolic resins include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glioxal, n-butylaldehyde, and capro. Examples thereof include aldehyde, allyl aldehyde, benzaldehyde, croton aldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde and the like. These may be used alone or in combination of two or more. Further, precursors of these aldehydes or solutions of these aldehydes can also be used. Above all, it is preferable to use an aqueous formaldehyde solution from the viewpoint of manufacturing cost.

Basic catalysts used for the synthesis of resole-type phenolic resins include, for example, hydroxides of alkali metals or alkaline earth metals such as sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide; carbonic acid. Carbonates such as sodium and calcium carbonate; Oxides such as lime; Hydrosulfates such as sodium hydroxide; Phosphates such as sodium phosphate; Ammonia, trimethylamine, triethylamine, monoethanolamine, diethanolamine, triethanolamine, hexamethylenetetramine , Amines such as pyridine and the like.

Water is generally used as the reaction solvent for synthesizing the resole-type phenol resin, but an organic solvent may be used. Specific examples of such an organic solvent include alcohols, ketones, aromatics and the like. Specific examples of alcohols include methanol, ethanol, propyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, glycerin and the like. Specific examples of the ketones include acetone, methyl ethyl ketone and the like. Specific examples of aromatics include toluene, xylene and the like.

Examples of the form of the resole-type phenol resin include solids, aqueous solutions, solvent solutions, and aqueous dispersions. Above all, a solvent solution of methanol, ethanol, methyl ethyl ketone, and acetone is preferable from the viewpoint of improving workability.

The method for reacting phenols with aldehydes is not particularly limited. For example, a method in which phenols and aldehydes and a catalyst are collectively charged and reacted, or a method in which phenols and a catalyst are charged and then at a predetermined reaction temperature. Examples thereof include a method of adding aldehydes.
The reaction between the phenols and the aldehydes is preferably carried out in the range of 30 to 100 ° C, more preferably 50 to 80 ° C. If the temperature is lower than 30 ° C., the reaction proceeds slowly and unreacted phenols remain, which is not preferable. Further, a temperature around 100 ° C. is not preferable because the production of high molecular weight components is promoted. The reaction time is not particularly limited and can be adjusted by the amount of aldehydes and catalysts and the reaction temperature. The adjustment of the molecular weight of the obtained phenol resin can be controlled by adjusting the reaction temperature and the reaction time.

(Urea derivative)
The phenolic resin composition of the present embodiment contains a urea derivative. The urea derivative reacts with aldehydes existing as unreacted raw material monomers in the phenol resin blended in the phenol resin composition, and acts to eliminate the volatileness (dissipative) of the aldehydes. Urea derivatives that can be used include urea, ethylene urea, propylene urea, butyl urea, carbohydrazide, 1,1-dimethylurea, 1,1-diethylurea, cyanoacetylurea, cyclohexylurea, acetylurea, allylurea, 1, Examples thereof include 3-diallyl urea, apronal, benzoylene urea, benzoyl urea, benzyl urea, 1,3- (hydroxymethyl) urea and the like. The urea derivative may be used alone or in combination of two or more. Among them, urea, ethylene urea, and propylene urea are preferably used as the urea derivative. The urea derivative may be solid or in the form of an aqueous solution.

The blending amount of the urea derivative is, for example, 4% by mass or more and 40% by mass or less with respect to the total solid content of the phenol resin composition. The lower limit of the blending amount of the urea derivative is preferably 8% by mass or more, more preferably 10% by mass or more, still more preferably 12% by mass, based on the total solid content of the phenol resin composition. % Or more. The upper limit of the blending amount of the urea derivative is preferably 35% by mass or less, more preferably 30% by mass or less, still more preferably 25% by mass, based on the total solid content of the phenol resin composition. % Or less. By using the urea derivative in an amount in the above range, the aldehyde emission property of the obtained phenol resin composition can be effectively suppressed. Further, by using the urea derivative in the above range, the stability over time of the obtained phenol resin composition is improved. Here, the stability with time of the resin composition means that the change in the characteristics of the resin composition with time is small. Changes in the characteristics of the resin composition with time include that the phenol resin contained in the resin composition has a high molecular weight and the resin composition has a high viscosity.

(Resorcin)
The phenolic resin composition of the present embodiment contains resorcins. Resorcins react with aldehydes existing as unreacted raw material monomers in the phenol resin blended in the phenol resin composition, and act so as to eliminate the volatileness (dissipative) of the aldehydes. By containing resorcins and the above-mentioned urea derivative in combination, the phenolic resin composition of the present embodiment is highly controlled in the emission property of aldehydes.

Resorcins that can be used include resorcin, 2-methylresorcin, 5-methylresorcin, 2,5-dimethylresorcin, 4-ethylresorcin, 4-chlororesorcin, 2-nitroresorcin, 4-bromoresorcin, 4-n-. Examples include hexyl resorcin. These may be used alone or in combination of two or more. Above all, it is preferable to use resorcin or methylresorcin from the viewpoint of manufacturing cost and handleability.

The blending amount of the resorcins is, for example, 0.6% by mass or more and 6% by mass or less with respect to the total solid content of the phenol resin composition. The lower limit of the amount of the resorcins to be blended is preferably 1.0% by mass or more, more preferably 1.5% by mass or more, still more preferably 1.5% by mass, based on the total solid content of the phenol resin composition. , 2.0% by mass or more. The upper limit of the blending amount of the resorcins is preferably 5% by mass or less, more preferably 4.5% by mass or less, still more preferably, with respect to the total solid content of the phenol resin composition. It is 4% by mass or less. By using resorcins in an amount in the above range, the aldehyde emission property of the obtained phenol resin composition can be effectively suppressed. Further, by using resorcins in the above range, the stability over time of the obtained phenol resin composition is improved.

(Epoxy silane coupling agent)
The phenolic resin composition of the present embodiment contains an epoxysilane coupling agent. The epoxy silane coupling agent can improve the adhesion of the phenolic resin composition to the inorganic fiber substrate. Therefore, the inorganic fiber composite material produced by using the phenol resin composition of the present embodiment as a binder resin can have excellent mechanical strength.

Examples of the epoxysilane coupling agent that can be used include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropylethyldiethoxysilane. , And 2- (3,4 epylcyclohexyl) ethyltrimethoxysilane and the like. These may be used alone or in combination of two or more.

The blending amount of the epoxy silane coupling agent is, for example, 0.2% by mass or more and 2% by mass or less with respect to the total solid content of the phenol resin composition. The lower limit of the blending amount of the epoxy silane coupling agent is preferably 0.3% by mass or more, more preferably 0.4% by mass or more, based on the total solid content of the phenol resin composition. Even more preferably, it is 0.5% by mass or more. The upper limit of the blending amount of the epoxy silane coupling agent is preferably 1.8% by mass or less, more preferably 1.6% by mass or less, based on the total solid content of the phenol resin composition. Even more preferably, it is 1.4% by mass or less. By using the epoxy silane coupling agent in an amount in the above range, the obtained phenol resin composition can have high adhesion to the inorganic fiber base material.

(Other ingredients)
In addition to the above components, the phenolic resin composition of the present embodiment may contain other additives such as flame retardants, antioxidants, and colorants as long as the effects of the present invention are not impaired.

[Manufacturing method of phenol resin composition]
The phenolic resin composition of the present embodiment can be produced by mixing the above components by a known means. For mixing, a method of adding the above-mentioned components to the solvent can be used, if necessary, using a solvent.

The phenolic resin composition of the present embodiment is provided as a liquid composition having a solid content of 60% by mass or more. The lower limit of the solid content of the phenolic resin composition of the present embodiment is preferably 65% by mass or more, more preferably 70% by mass or more, and the upper limit of the solid content is preferably 90% by mass. It is less than or equal to, more preferably 88% by mass or less. When the solid content is in the above range, the cured product (molded product) of this phenol resin composition has excellent mechanical strength. Further, when the solid content is in the above range, the viscosity of the phenol resin composition is in an appropriate range for coating or impregnating the inorganic fiber base material, and thus the high-strength / high-quality inorganic fiber composite material is excellent. It can be manufactured with manufacturing efficiency.

[Use of phenolic resin composition]
The phenolic resin composition of the present embodiment is used for producing an inorganic fiber composite material. The inorganic fiber composite material is, for example, a method in which an inorganic fiber base material is placed on a mold, impregnated with the phenol resin composition of the present embodiment, cured, and then demolded. The inorganic fiber base is placed on the mold. A method of spraying the material and the phenol resin composition at the same time, curing them, and then removing the mold, laying an inorganic fiber base material inside the pair of molds, and injecting the phenol resin composition from a nozzle provided in the mold in advance. It is manufactured by a method of demolding after curing.

The phenolic resin composition of the present embodiment has high adhesion to the inorganic fiber base material by containing the above components in a predetermined amount. Therefore, the inorganic fiber complex produced by using such a phenol resin composition has excellent mechanical strength. Further, in the inorganic fiber complex produced by using such a phenol resin, the amount of aldehyde emission is reduced to the extent that it does not affect the human body. Preferably, the inorganic fiber composite produced by using the phenol resin composition of the present embodiment has the formaldehyde emission amount reduced to 10 μg / m ² · h or less by the small chamber method. More preferably, the inorganic fiber composite produced by using the phenol resin composition of the present embodiment has a formaldehyde emission amount of 5 μg / m ² · h or less by the small chamber method, and is F (F) of JIS A 6909. Forster) can be obtained.

The inorganic fiber composite material obtained by using the phenol resin composition of the present embodiment is used in fields such as building materials, sports / leisure applications such as fishing rods and golf shafts, automobile applications, aircraft applications, and other industrial applications. can do.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted.

Hereinafter, the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

<Synthesis of phenolic resin>
(Synthesis Example 1)
In a 5 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1300 parts by mass of phenol and 2018 parts by mass of 37 mass% formalin 2018 (molar ratio to total phenols = 1.8) were charged, and barium hydroxide 60 was charged. The mass part was dissolved in 52 parts by mass of pure water and then added, and the internal temperature was raised to 58 to 62 ° C. When 15 minutes had passed after the temperature was reached, 60 parts by mass of barium hydroxide was dissolved again in 52 parts by mass of pure water before addition, and the reaction was carried out for an additional 15 minutes at an internal temperature of 58 to 62 ° C. Then, a reflux reaction was carried out for 45 minutes while maintaining an internal temperature of 88 to 92 ° C. After that, a reflux reaction was carried out at an internal temperature of 74 to 76 ° C., and after the water magnification became 50 to 70%, the internal temperature was maintained at 74 to 76 ° C. for 10 minutes to obtain 3000 parts by mass of the phenol resin (A). ..
The solid content of the obtained resin was 83%, and the viscosity was 352 mPas.

(Synthesis Example 2)
In a 5 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1300 parts by mass of phenol and 2018 parts by mass of 37 mass% formalin (charged molar ratio to total phenols = 1.8) were charged and 50% hydroxide was added. 40 parts by mass of sodium was added, and the internal temperature was raised to 58 to 62 ° C. After 15 minutes had passed after reaching the temperature, 40 parts by mass of 50% sodium hydroxide was added again, and the reaction was carried out for an additional 15 minutes at an internal temperature of 58 to 62 ° C. Then, a reflux reaction was carried out for 45 minutes while maintaining an internal temperature of 88 to 92 ° C. After that, a reflux reaction was carried out at an internal temperature of 74 to 76 ° C., and after the water magnification became 50 to 70%, the internal temperature was maintained at 74 to 76 ° C. for 10 minutes to obtain 3000 parts by mass of phenol resin (B). ..
The solid content of the obtained resin was 81%, and the viscosity was 336 mPas.

(Synthesis Example 3)
In a 5 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1300 parts by mass of phenol and 2018 parts by mass of 37 mass% formalin 2018 (molar ratio to total phenols = 1.8) were charged, and calcium hydroxide 25 was charged. The mass part was dissolved in 52 parts by mass of pure water and then added, and the internal temperature was raised to 58 to 62 ° C. When 15 minutes had passed after the temperature was reached, 25 parts by mass of calcium hydroxide was dissolved again in 52 parts by mass of pure water before addition, and the reaction was carried out for an additional 15 minutes at an internal temperature of 58 to 62 ° C. Then, a reflux reaction was carried out for 45 minutes while maintaining an internal temperature of 88 to 92 ° C. After that, a reflux reaction was carried out at an internal temperature of 74 to 76 ° C., and after the water magnification became 50 to 70%, the internal temperature was maintained at 74 to 76 ° C. for 10 minutes to obtain 3000 parts by mass of phenol resin (C). ..
The solid content of the obtained resin was 84%, and the viscosity was 368 mPas.

<Preparation of phenolic resin composition>
(Example 1)
In a 3 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1000 parts by mass of the phenol resin (A) obtained in Synthesis Example 1, 140 parts by mass of urea, 20 parts by mass of resorcin, and epoxysilane ( 3-Glycydoxypropyltrimethoxysilane) was charged in an amount of 0.7 parts by mass and dissolved at an internal temperature of 45 to 50 ° C. for 15 minutes to obtain a phenol resin composition A.
The obtained phenol resin composition A had a solid content of 72% and a viscosity of 300 mPas.

(Example 2)
In a 3 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1000 parts by mass of the phenol resin (B) obtained in Synthesis Example 1, 140 parts by mass of urea, 20 parts by mass of resorcin, and epoxysilane ( 3-Glycydoxypropyltrimethoxysilane) was charged in an amount of 0.7 parts by mass and dissolved at an internal temperature of 45 to 50 ° C. for 15 minutes to obtain a phenol resin composition B.
The obtained phenol resin composition B had a solid content of 70% and a viscosity of 287 mPas.

(Example 3)
In a 3 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1000 parts by mass of the phenol resin (C) obtained in Synthesis Example 1, 140 parts by mass of urea, 20 parts by mass of resorcin, and epoxysilane ( 3-Glycydoxypropyltrimethoxysilane) was charged in an amount of 0.7 parts by mass and dissolved at an internal temperature of 45 to 50 ° C. for 15 minutes to obtain a phenol resin composition C.
The obtained phenol resin composition C had a solid content of 72% and a viscosity of 313 mPas.

(Comparative Example 1)
In a 3 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1000 parts by mass of the phenol resin (A) obtained in Synthesis Example 1, 140 parts by mass of urea, 20 parts by mass of resorcin, and aminosilane (N). -2- (Aminoethyl) -3-aminopropyltrimethoxysilane) was charged in an amount of 0.7 parts by mass and dissolved at an internal temperature of 45 to 50 ° C. for 15 minutes to obtain a phenol resin composition D.
The obtained phenol resin composition D had a solid content of 72% and a viscosity of 303 mPas.

(Comparative Example 2)
In a 3 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 400 parts by mass of pure water was added to 1000 parts by mass of the phenol resin (A) obtained in Synthesis Example 1, 140 parts by mass of urea and resorcin were added. 20 parts by mass and 21 parts by mass of epoxysilane (3-glycidoxypropyltrimethoxysilane) were charged and dissolved at an internal temperature of 45 to 50 ° C. for 15 minutes to obtain a phenol resin composition E.
The obtained phenol resin composition E had a solid content of 50% and a viscosity of 233 mPas.

(Comparative Example 3)
In a 3 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1000 parts by mass of the phenol resin (A) obtained in Synthesis Example 1, 20 parts by mass of resorcin, and epoxysilane (3-glycidoxypropyl). (Trimethoxysilane) was charged in an amount of 0.7 parts by mass and dissolved at an internal temperature of 45 to 50 ° C. for 15 minutes to obtain a phenol resin composition F.
The obtained phenol resin composition F had a solid content of 75% and a viscosity of 325 mPas.

(Comparative Example 4)
1000 parts by mass of the phenol resin (A) obtained in Synthesis Example 1, 140 parts of urea, and epoxysilane (3-glycidoxypropyltrimethoxy) were placed in a 3 L four-necked flask equipped with a stirrer, a thermometer, and a heat exchanger. 0.7 parts by mass of silane) was charged and dissolved at an internal temperature of 45 to 50 ° C. for 15 minutes to obtain a phenol resin composition G.
The obtained phenol resin composition G had a solid content of 70% and a viscosity of 269 mPas.

(Comparative Example 5)
In a 3 L four-necked flask equipped with a stirrer, a thermometer and a heat exchanger, 1000 parts by mass of the phenol resin (A) obtained in Synthesis Example 1, 140 parts of urea and 20 parts by mass of resorcin are charged, and the internal temperature is 45 to 45 to The phenol resin composition H was obtained by dissolving at 50 ° C. for 15 minutes.
The obtained phenol resin composition H had a solid content of 70% and a viscosity of 294 mPas.

Table 1 shows the blending amount and solid content (parts by mass) of the components used in Examples and Comparative Examples.

The physical characteristics of the following items were measured for the phenol resin compositions obtained in each of the above Examples and Comparative Examples.
[Characteristics of resin composition]
<Stability over time (viscosity after storage)>
The temporal stability of the phenolic resin composition was evaluated by measuring the viscosity after storage for 1 month.
First, the above-mentioned phenol resin compositions A to K were placed in a constant temperature bath at 20 ° C. and allowed to stand for one month. The viscosity of the resin after standing was measured according to the 5.3.2 viscosity B method of JIS-K-6910 "Phenol resin test method". Table 1 shows the viscosity before storage and the viscosity after storage. The smaller the increase in viscosity after storage with respect to the viscosity before storage, the better the stability over time.

[Molded product characteristics]
<Preparation of test pieces>
The above-mentioned phenol resin compositions A to K were immersed in a glass cloth (SLS213B-1050-4NT manufactured by Arisawa Fiberglass Co., Ltd.), pulled up after 3 minutes, and dried at 120 ° C. for 30 minutes to prepare a prepreg. The obtained prepregs were laminated with 12 plies so that the fiber directions alternated vertically and horizontally, and pressed at a pressure of 40 kgf / cm ² to prepare GFRP. A molded product was obtained by heat-treating GFRP at 170 ° C. for 15 minutes.

<Amount of emitted formaldehyde>
The amount of formaldehyde emission was measured according to JIS-A-1901 "Method for measuring emission of volatile organic compounds (VOC), formaldehyde and other carbonyl compounds in building materials-small chamber method". The measurement results are shown in Table 1.

<Strength>
The molded product was processed to a width of 25 mm and a length of 80 mm to prepare a test piece. The bending strength of the test piece was measured using a universal material testing machine 55R-4206 manufactured by Instron. The test was carried out under the test conditions of 1.2 mm / min, a distance between branches of 45 mm, and room temperature. The measurement results are shown in Table 1.

<Flame resistance test>
The measurement was carried out according to the 5.24.3 C method of JIS-K-6911 "General test method for thermosetting plastics". Table 1 shows those that meet the requirements of the provisions as "conformity" and those that do not meet as "nonconformity".

The resin composition of the example had a good balance of stability over time, low aldehyde emission amount, and bending strength.

Claims (5)

Phenol formaldehyde,
Urea derivative,
A phenolic resin composition for an inorganic fiber composite material, which comprises resorcins and an epoxysilane coupling agent.
A phenol resin composition for an inorganic fiber composite material having a solid content of 60% by mass or more with respect to the entire phenol resin composition. The epoxysilane coupling agent includes 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylethyldiethoxysilane, and The phenolic resin composition for an inorganic fiber composite material according to claim 1, which comprises at least one selected from 2- (3,4 epylcyclohexyl) ethyltrimethoxysilane. The phenol for an inorganic fiber composite material according to claim 1 or 2, wherein the urea derivative is in an amount of 4% by mass or more and 40% by mass or less with respect to the total solid content of the phenol resin composition for the inorganic fiber composite material. Resin composition. The inorganic according to any one of claims 1 to 3, wherein the resorcins are in an amount of 0.6% by mass or more and 6% by mass or less with respect to the total solid content of the phenol resin composition for the inorganic fiber composite material. Phenol resin composition for fiber composite materials. According to any one of claims 1 to 4, the amount of the epoxy silane coupling agent is 0.2% by mass or more and 2% by mass or less with respect to the total solid content of the phenol resin composition for the inorganic fiber composite material. The phenolic resin composition for an inorganic fiber composite material according to the above.