JP2022059003A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device capable of certainly cooling a capacitor module.

SOLUTION: A capacitor module 10 smoothing voltage and current has a capacitor terminal 18 connected to a capacitor element 15 and connected to a power semiconductor terminal of a power semiconductor module 11 by projecting outside from a capacitor case 35. The capacitor terminal has a projection part 18a extending outside from a wall part of the capacitor case, a first bent part 18b extending along the wall part from a tip of the projection part, a second bent part 18c extending toward the wall part from the tip of the first bent part, and a terminal part 18d formed on the tip of the second bent part and connected to the power semiconductor terminal. A projection line 14a projecting toward the first bent part of the capacitor terminal and bonded to the first bent part in a surface contact state is formed on the wall part of the capacitor case.

SELECTED DRAWING: Figure 3

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a power conversion device including a power semiconductor module and a capacitor module.

As a power conversion device of this type, the power conversion device described in Patent Document 1 is known.
This power converter forms a power semiconductor module that converts DC power to AC power, a capacitor module that smoothes voltage and current, a DC input connector, an AC output connector, a cooler in which a cooling medium circulates inside, and a storage space. It is equipped with a built-in housing. A power semiconductor module to which a condenser module, a DC input connector, and an AC output connector are stored in the storage space of the housing, and an opening communicating with the storage space is formed on the outer wall of the housing to join a cooler. Is inserted through the opening and placed in the storage space, and the opening is closed and fixed with a cooler.
Then, by flowing a cooling medium through the cooling chamber of the cooler, the power semiconductor module generated by the switching operation is cooled.
Since the power conversion device of Patent Document 1 uses a cooler that is fixed by closing the opening as a part of the housing, it is possible to reduce the manufacturing cost.

JP-A-2017-60291

By the way, in the power conversion device of Patent Document 1, the heat generated by the capacitor module when smoothing the voltage and current is large, and the heat is transferred to the housing by bringing the capacitor module into contact with the inner wall of the housing, and the opening is opened. The condenser module is cooled by cooling the housing with a cooler that closes the capacitor.
However, in a structure in which the condenser module is cooled through the housing, the cooling efficiency at the time of power conversion may decrease.
Therefore, an object of the present invention is to provide a power conversion device capable of reliably cooling a capacitor module.

In order to achieve the above object, the power conversion device according to one aspect of the present invention includes a power semiconductor module that converts DC power into AC power, a capacitor module that smoothes voltage and current, and a power semiconductor module and a capacitor module. It is equipped with a housing for accommodating. The capacitor module is connected to a capacitor case made of metal material or synthetic resin, a capacitor element embedded in the capacitor case, a capacitor refrigerant flow path formed in the capacitor case located around the capacitor element, and a capacitor element. It is equipped with a capacitor terminal that protrudes outward from the capacitor case and connects to the power semiconductor terminal of the power semiconductor module. The power semiconductor module is integrally provided with a power semiconductor cooler having a power semiconductor refrigerant flow path inside, and a capacitor case and a power semiconductor cooler are joined in a surface contact state, and the condenser refrigerant flow path and power are joined. The semiconductor refrigerant flow path is directly connected and the cooling medium circulates. The capacitor terminals are a protruding portion extending outward from the wall portion of the capacitor case, a first bent portion extending along the wall portion from the tip of the protruding portion, and a wall from the tip of the first bent portion. It has a second bent part that extends toward the part and a terminal part that is formed at the tip of the second bent part and connects to the power semiconductor terminal. The wall part of the capacitor case has a capacitor terminal. A protrusion is formed so as to project toward the first bent portion of the above and join the first bent portion in a surface contact state.

According to the power conversion device according to the present invention, the capacitor module can be reliably cooled.

It is a perspective view which shows the power conversion apparatus of 1st Embodiment which concerns on this invention. It is a figure which showed the apparatus which constitutes the power conversion apparatus of 1st Embodiment by the perspective view. It is a side view of the device constituting the power conversion device of the first embodiment. It is a perspective view which shows the capacitor module which constitutes the power conversion apparatus of 1st Embodiment. It is a figure which shows the structure of the power semiconductor side supply connection port of the capacitor module which constitutes the power conversion apparatus of 1st Embodiment. It is a perspective view which shows the state which joined the power semiconductor module to the capacitor module of 1st Embodiment. It is a perspective view which showed the power semiconductor module of 1st Embodiment from the cooler side. It is a figure which shows the cross-sectional view of the main part in the state which joined the power semiconductor module to the capacitor module of 1st Embodiment. It is a figure which shows the cross-sectional view of the main part in the state which the power semiconductor module is joined to the capacitor module of the 2nd Embodiment which concerns on this invention.

Next, the first and second embodiments of the present invention will be described with reference to the drawings. In the description of the drawings below, the same or similar parts are designated by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the plane dimensions, the ratio of the thickness of each layer, etc. are different from the actual ones. Therefore, the specific thickness and dimensions should be determined in consideration of the following explanation. In addition, it goes without saying that parts having different dimensional relationships and ratios are included between the drawings.
Further, the first and second embodiments shown below exemplify devices and methods for embodying the technical idea of the present invention, and the technical idea of the present invention is based on the material of a component. The shape, structure, arrangement, etc. are not specified to the following. The technical idea of the present invention may be modified in various ways within the technical scope specified by the claims described in the claims.

[Power conversion device of the first embodiment]
Hereinafter, the power conversion device of the first embodiment according to one aspect of the present invention will be described with reference to the drawings as appropriate. In the drawings, the reference numerals X1 and X2 are one and the other in the first direction, the reference numerals Y are the second directions orthogonal to the first directions X1 and X2, and the reference numerals Z1 and Z2 are the first direction X and the second direction Y. One and the other in the third direction orthogonal to the virtual plane including.
FIG. 1 shows a power conversion device 1 of the first embodiment used as a DC / AC inverter.
The power conversion device 1 includes a rectangular parallelepiped housing 2, a cooling water supply pipe 3 and a discharge pipe 4 penetrating inward from one side wall in the long direction of the housing 2, and a long direction of the housing 2. It is provided with an input connector 5, a control connector 6, and an output connector 7 provided on the other side wall of the above.
The housing 2 is formed by die-casting, for example, aluminum having high thermal conductivity or an aluminum alloy, and has a box-shaped housing case 8 having an open top and a lid that closes the opening of the housing case 8. It is composed of 9 and.
A through hole 2a for inserting the cooling water supply pipe 3 and a through hole 2b for inserting the discharge pipe 4 are formed on one side wall of the housing 2 in the elongated direction.
As shown in FIG. 2, the capacitor module 10, the power semiconductor module 11, the control circuit board 12, and the drive circuit board 13 are housed inside the housing 2.

[Capacitor module]
The capacitor module 10 is a device for smoothing the voltage and current supplied to the power semiconductor module 11, and as shown in FIGS. 2 and 3, a rectangular capacitor case made of a metal material such as aluminum die cast. 14, the condenser element 15 embedded in the condenser case 14, the cooling water supply passage 16 and the cooling water discharge passage 17 formed in the condenser case 14 in a state of being located around the condenser element 15, and the condenser element 15. It is provided with a plurality of capacitor terminals 18 which are connected to the capacitor case 14 and are provided so as to project outward from the capacitor case 14.

As shown in FIG. 2, the capacitor terminal 18 has a protrusion 18a extending to one X1 in the first direction and a first folding extending from the tip of the protrusion 18a to one Z1 in the third direction. The curved portion 18b, the second bent portion 18c extending from the tip of the first bent portion 18b to the other X2 in the first direction, and the tip of the second bent portion 18c to one Z1 in the third direction. It is provided with an extended terminal portion 18d.
Further, as shown in FIG. 3, the surface of one X1 in the first direction of the capacitor case 14 provided with the capacitor terminal 18 projects toward the first bent portion 18b and extends in the second direction Y. A protruding protrusion 14a is formed.

A long heat dissipation sheet HD1 is attached to the end surface of one X1 of the protrusion 14a in the first direction. The protrusion 14a and the first bent portion 18b of the capacitor terminal 18 are joined to each other via the heat radiating sheet HD1 in a surface contact state.
Further, the cooling water supply passage 16 and the cooling water discharge passage 17 are formed of a metal cooling pipe, and as shown in FIG. 4, the cooling water supply passage 16 is the other X2 in the first direction of the condenser case 14. It is provided with an external supply connection port 16a that is open on the surface facing the surface, and a power semiconductor side supply connection port 16b that is open on the surface facing one Z1 of the third direction of the condenser case 14.

Further, the cooling water discharge passage 17 is opened at the external discharge connection port 17a opened on the surface facing the other X2 in the first direction of the condenser case 14 and on the surface facing one Z1 in the third direction of the condenser case 14. It is provided with a power semiconductor side discharge connection port 17b.
As shown in FIG. 5, a peripheral groove 20a is formed on the peripheral edge of the opening of the power semiconductor side supply connection port 16b, and an O-ring R1 is mounted on the peripheral groove 20a. Further, a peripheral groove (not shown) is formed on the peripheral edge of the opening of the power semiconductor side discharge connection port 17b, and the O-ring R1 is mounted on the peripheral groove.
Here, the surface of the capacitor case 14 in which the power semiconductor side supply connection port 16b and the power semiconductor side discharge connection port 17b are formed so as to face one Z1 in the third direction is referred to as a power semiconductor junction surface 20.

[Power semiconductor module]
As shown in FIGS. 6 and 7, the power semiconductor module 11 is integrally provided with the module main body 11A and the module main body 11A, and is connected to the cooling water supply passage 16 and the cooling water discharge passage 17 provided in the condenser module 10. It is equipped with a cooler 11B through which cooling water circulates.
The module main body 11A includes a rectangular parallelepiped resin package 19 and a metal base plate (not shown) arranged on the bottom surface of the resin package, and a cooler 11B is integrally provided on the metal base plate side.
The resin package 19 includes three IGBT upper arm semiconductor chips (not shown), an upper arm wiring pattern portion, an upper arm wiring conductor plate, a lower arm semiconductor chip, a lower arm wiring pattern portion, and a lower arm wiring conductor plate. The grounding wiring pattern portion and the like are embedded, and the upper arm semiconductor chip and the lower arm semiconductor chip are in contact with the metal base plate.

The resin package 19 is provided with positive electrode side terminals 21U, 21V, 21W and negative electrode side terminals 22U, 22V, 22W in a row on one side surface in the long direction, and an output terminal on the other side surface in the long direction. 23U, 23V, 23W are provided in a row.
The positive side terminals 21U, 21V, 21W are connected to the collector of the upper arm semiconductor chip via the upper arm wiring pattern part, and the negative side terminals 22U, 22V, 22W are the grounding wiring pattern part and the lower arm wiring. It is connected to the emitter of the lower arm semiconductor chip via the conductor plate for the lower arm, and the output terminals 23U, 23V, 23W are the emitter of the upper arm semiconductor chip and the emitter of the upper arm semiconductor chip via the wiring pattern portion for the lower arm and the conductor plate for the upper arm wiring. It is connected to the collector of the lower arm semiconductor chip.

Further, as shown in FIG. 6, on the upper surface of the resin package 19, a plurality of lead frames 28U, 28V, 28W for the upper arm connected to a plurality of control electrodes for the upper arm, and a plurality of controls for the lower arm are provided. A plurality of lower arm lead frames 29U, 29V, 29W connected to the electrodes are provided so as to project upward.
As shown in FIG. 7, the cooler 11B is joined to the bottom surface of the resin package 19, and the bottom wall 11a of the cooler 11B has a cooling water circulation path (not shown) provided inside the cooler 11B. A supply pipe 24, which is an inlet for supplying cooling water, and a discharge pipe 25, which is an outlet for discharging the cooling water that has passed through the cooling water circulation path, are provided.

The supply pipe 24 and the discharge pipe 25 are formed with peripheral grooves 24a and 25a on the outer periphery thereof. The O-ring R2 shown in FIG. 8 to be described later is attached to the peripheral groove 24a of the supply pipe 24 and the peripheral groove 25a of the discharge pipe 25.
The power semiconductor module 11 having the above configuration is bonded to the power semiconductor bonding surface 20 of the capacitor case 14.
At this time, as shown in FIG. 4, a heat dissipation sheet HD2 having substantially the same shape as the bottom wall 11a of the cooler 11B is laid on the power semiconductor joint surface 20 of the condenser case 14.
Then, with the bottom wall 11a in surface contact with the heat radiation sheet HD2, the supply pipe 24 provided on the bottom wall 11a of the cooler 11B is inserted into the cooling water supply path 16 from the power semiconductor side supply connection port 16b, and the discharge pipe is discharged. 25 is inserted into the cooling water discharge passage 17 from the power semiconductor side discharge connection port 17b.

Then, as shown in FIGS. 4 and 6, the screw fixing portion 26 provided on the power semiconductor joint surface 20 is associated with the screw insertion portion 11b provided on the module body 11A of the power semiconductor module 11, and the mounting screw 27 is screwed. By screwing into the fixing portion 26, the power semiconductor module 11 is bonded to the power semiconductor bonding surface 20 of the capacitor case 14 in a surface contact state via the heat dissipation sheet HD2.
Further, the positive electrode side terminals 21U, 21V, 21W and the negative electrode side terminals 22U, 22V, 22W of the power semiconductor module 11 are electrically connected to the terminal portions 18d of the plurality of capacitor terminals 18 of the capacitor module 10 with screws.

Here, in FIG. 8, when the power semiconductor module 11 is joined to the power semiconductor joint surface 20 of the condenser case 14, the supply pipe 24 provided on the bottom wall 11a of the cooler 11B is inserted into the cooling water supply path 16. It shows the state. In this state, the O-ring R1 mounted on the opening peripheral edge of the power semiconductor side supply connection port 16b is crushed by the bottom wall 11a of the cooler 11B, and is mounted on the peripheral groove 24a of the supply pipe 24 described above. The ring R2 is crushed by the inner wall of the cooling water supply path 16.
Although not shown, when the discharge pipe 25 provided on the bottom wall 11a of the cooler 11B is inserted into the cooling water discharge passage 17, although not shown, the O-ring attached to the opening peripheral edge of the power semiconductor side discharge connection port 17b is not shown. The ring R1 is crushed by the bottom wall 11a of the cooler 11B, and the O-ring R2 attached to the peripheral groove 25a of the discharge pipe 25 is crushed by the inner wall of the cooling water discharge path 17.

[Control circuit board and drive circuit board]
As shown in FIG. 4, a plurality of columnar columns for control circuit boards 30 and a plurality of columnar columns 31 for drive circuit boards having a height lower than that of the control circuit board columns 30 are formed in the capacitor case 14. It is provided so as to rise from the edge of the power semiconductor junction surface 20.
The control circuit board support column 30 and the drive circuit board support column 31 are metallic members, and screw holes are formed at the top thereof.
As shown in FIG. 3, a screw is attached to the top of a plurality of drive circuit board columns 31 at an upper position (one Z1 in the third direction) of the power semiconductor module 11 bonded to the power semiconductor bonding surface 20 of the capacitor case 14. The drive circuit board 13 is arranged in a stopped state. Here, although not shown, the upper arm lead frames 28U, 28V, 28W and the lower arm lead frames 29U, 29V, 29W of the power semiconductor module 11 are inserted into through holes (not shown) having lands of the drive circuit board 13. It is soldered between each lead frame and the through hole.

Further, as shown in FIG. 3, the tops of a plurality of control circuit board columns 30 are located above the drive circuit board 13 supported and arranged on the drive circuit board columns 31 (one Z1 in the third direction). The control circuit board 12 is arranged in a state of being screwed to.
The power semiconductor cooler described in the present invention corresponds to the cooler 11B, and the condenser refrigerant flow path described in the present invention corresponds to the cooling water supply passage 16 and the cooling water discharge passage 17. The insertion pipe described in the present invention corresponds to the supply pipe 24 and the discharge pipe 25, and the refrigerant pipe described in the present invention corresponds to the cooling water supply pipe 3 and the discharge pipe 4.

[Operation of the power conversion device of the first embodiment]
The power semiconductor module 11 is bonded to the power semiconductor bonding surface 20 of the capacitor module 10 shown in FIG. 6, and the control circuit board 12 and the drive circuit board 13 are assembled at the upper position of the power semiconductor module 11 (one Z1 in the third direction). The device is housed in the housing 2.
At this time, the side surfaces of the capacitor case 14 in which the external supply connection port 16a and the external discharge connection port 17a are formed are brought close to the inner wall of the housing 2, and the external supply connection port 16a is made to correspond to the through hole 2a formed in the housing 2. , The external discharge connection port 17a is made to correspond to the through hole 2b. Then, the cooling water supply pipe 3 is connected from the outside of the housing 2 to the external supply connection port 16a by press fitting through the through hole 2a. Further, the discharge pipe 4 is connected from the outside of the housing 2 to the external discharge connection port 17a by press-fitting through the through hole 2b.
In the power conversion device 1 having the above configuration, when a direct current is supplied from an external converter (not shown) via the input connector 5, the capacitor module 10 smoothes the voltage and the current.
A control voltage is supplied to the control circuit board 12 from the control connector 6, and when a gate signal, for example, a pulse width modulation signal, is output from the control circuit board 12 to the drive circuit board 13, the drive circuit board 13 is pressed. A drive signal is output to the power semiconductor module 11, and a U-phase, V-phase, and W-phase three-phase AC is output to the load via the output connector 7.

[Effect of the power conversion device of the first embodiment]
In the capacitor module 10 that smoothes the voltage and current, the capacitor element 15 embedded in the capacitor case 14 is in a heat generation state.
On the other hand, in the power conversion device 1 of the first embodiment, the condenser case 14 of the condenser module 10 is made of a metal material, and the condenser case 14 has a cooling water supply passage 16 and a cooling water discharge passage 17. Is formed, the condenser case 14 is immediately cooled by the circulation of the cooling water. Therefore, the capacitor element 15 embedded in the capacitor case 14 can be efficiently cooled.
When the power semiconductor module 11 is in the operating state, the upper arm semiconductor chip and the lower arm semiconductor chip embedded in the resin package 19 are in the heat generation state.

On the other hand, since the module body 11A of the power semiconductor module 11 is integrated with the cooler 11B in which the cooling water circulates, the upper arm semiconductor chip and the lower arm semiconductor chip embedded in the resin package 19 are efficiently used. Can be cooled.
Further, the cooler 11B of the power semiconductor module 11 is joined to the power semiconductor joint surface 20 of the capacitor case 14 in a surface contact state via the heat radiation sheet HD2, and the heat of the cooler 11B is immediately transferred to the capacitor case 14. Therefore, the upper arm semiconductor chip and the lower arm semiconductor chip embedded in the resin package 19 can be cooled more efficiently.

Further, the connection portion between the positive electrode side terminals 21U, 21V, 21W and the negative electrode side terminals 22U, 22V, 22W of the power semiconductor module 11 and the terminal portions 18d of the plurality of capacitor terminals 18 of the capacitor module 10 is in a heat generation state due to power loss. There is a risk of becoming.
On the other hand, the first bent portion 18b of the capacitor terminal 18 is joined to the capacitor case 14 (protrusion 14a) via the heat dissipation sheet HD1 in a surface contact state, and the capacitor case 14 cools the capacitor terminal 18. By doing so, the connection portion between the positive electrode side terminals 21U, 21V, 21W and the negative electrode side terminals 22U, 22V, 22W of the power semiconductor module 11 and the capacitor terminal 18 can also prevent the heat generation state due to the power loss.

Further, since the heat dissipation sheet HD2 is arranged between the cooler 11B and the power semiconductor junction surface 20 of the condenser case 14, for example, even if the power semiconductor junction surface 20 is deformed by thermal stress, the power semiconductor junction surface 20 Since the wall thickness of the heat dissipation sheet HD2 changes according to the uneven surface due to the deformation of the cooler 11B, the surface contact state between the cooler 11B and the power semiconductor joint surface 20 of the capacitor case 14 can be maintained.
Further, the control circuit board 12 is supported and arranged on a plurality of metal columns for control circuit boards 30 rising from the power semiconductor junction surface 20 of the capacitor case 14, and the drive circuit board 13 is also supported by the power semiconductor junction surface. It is supported and arranged on a plurality of metal drive circuit board columns 31 rising from 20, and even when heat is generated in the circuit parts of the control circuit board 12 and the drive circuit board 13, the heat is metal. The heat is immediately transferred to the capacitor case 14 via the control circuit board support column 30 and the drive circuit board support column 31. Therefore, it is possible to prevent the heat generation state generated in the circuit components of the control circuit board 12 and the drive circuit board 13.

Further, since the O-ring R1 and the O-ring R2 are arranged at the cooling water circulation path connection portion between the cooler 11B of the power semiconductor module 11 and the cooling water of the condenser case 14, the cooler 11B and the condenser case 14 are double liquid-tight. By adopting the structure, it is possible to surely prevent the leakage of the cooling water.
Furthermore, by forming the cooling water supply path 16 and the cooling water discharge path 17 inside the condenser case 14, the condenser module 10 can be made smaller and lighter.
In the first embodiment, the heat dissipation sheet HD2 is provided between the power semiconductor joint surface 20 of the capacitor case 14 and the cooler 11B of the power semiconductor module 11, but the same applies even if heat dissipation grease such as silicon grease is used. Can produce the effect of.

[Power conversion device of the second embodiment]
Next, FIG. 9 shows a main part of the power conversion device 1 of the second embodiment according to the present invention.
The capacitor module 10 of the second embodiment has a rectangular shape capacitor case 35 formed of a synthetic resin such as polyphenylene sulfide (PPS) resin as a material, and a capacitor element (not shown) embedded in the capacitor case 35. A cooling water supply path 36 and a cooling water discharge path 37 embedded in the condenser case 35 are provided.
The cooling water supply path 36 is formed of a metal pipe having a bent portion 36a bent in an arc shape.

Further, the cooling water discharge passage 37 is also formed of a metal pipe having a bent portion 37a bent in an arc shape.
On the other hand, on the control circuit board support column 30 provided on the power semiconductor junction surface 20 of the capacitor case 35, a plurality of reinforcing ribs 38 are formed so as to rise from the power semiconductor junction surface 20 at predetermined intervals in the circumferential direction of the outer circumference. There is. Further, on the drive circuit board support column 31 provided on the power semiconductor junction surface 20, a plurality of reinforcing ribs 39 are formed so as to rise from the power semiconductor junction surface 20 at predetermined intervals in the circumferential direction of the outer circumference.

In the second embodiment, a condenser case 35 is formed of a synthetic resin as a material, and the condenser case 35 has a cooling water supply path 36 made of a metal pipe provided with an arc-shaped bent portion 36a and an arc-shaped bending portion 36a. By burying the cooling water discharge passage 37 made of a metal pipe provided with the bent portion 37a, it is possible to prevent the resin of the condenser case 35 from cracking and peeling off during the power conversion operation.
Further, it is possible to reduce the pressure loss when the cooling water flows through the water discharge supply path 36 provided with the arc-shaped bent portion 36a and the cooling water discharge path 37 provided with the arc-shaped bent portion 37a, and the condenser case. The cooling efficiency of 35 can be increased.
Further, the periphery of the control circuit board support column 30 provided on the power semiconductor junction surface 20 of the capacitor case 35 is reinforced with a plurality of reinforcing ribs 38, and the periphery of the drive circuit board support column 31 is also reinforced with a plurality of reinforcing ribs 39. Therefore, the control circuit board 12 and the drive circuit board 13 arranged above the power semiconductor module 11 can be reliably supported.

1 Power converter 2 Housing 2a, 2b Through hole 3 Cooling water supply pipe 4 Discharge pipe 5 Input connector 6 Control connector 7 Output connector 8 Housing case 9 Lid 10 Capacitor module 11 Power semiconductor module 11A Module body 11B Cooler 11a Bottom wall 12 Control circuit board 13 Drive circuit board 14 Condenser case 14a Protrusions 15 Condenser element 16 Cooling water supply path 16a External supply connection port 16b Power semiconductor side supply connection port 17 Cooling water discharge path 17a External discharge connection port 17b Power semiconductor side Discharge connection port 18 Capacitor terminal 18a Protruding part 18b 1st bent part 18c 2nd bent part 18d Terminal part 19 Resin package 20 Power semiconductor joint surface 20a Circumferential groove 21U, 21V, 21W Positive side terminal 22U, 22V, 22W Negative side Terminal 23U, 23V, 23W Output terminal 24 Supply pipe 25 Discharge pipe 24a, 25a Circumferential groove 26 Thread fixing part 27 Mounting screw 28U, 28V, 28W Lead frame for upper arm 29U, 29V, 29W Lead frame for lower arm 30 Control circuit board Support column 31 Drive circuit board support column 35 Condenser case 36 Cooling water supply path 36a Bent part 37 Cooling water discharge path 37a Bending part 38, 39 Reinforcing rib HD1 Heat dissipation sheet HD2 Heat dissipation sheet R1, R2 O ring

Claims (9)

A power semiconductor module that converts DC power to AC power,
Capacitor modules that smooth voltage and current,
A housing for accommodating the power semiconductor module and the capacitor module is provided.
The condenser module includes a condenser case made of a metal material or a synthetic resin, a condenser element embedded in the condenser case, and a condenser refrigerant flow path formed in the condenser case located around the condenser element. It is provided with a capacitor terminal that is connected to the capacitor element and protrudes outward from the capacitor case to be connected to the power semiconductor terminal of the power semiconductor module.
The power semiconductor module is integrally provided with a power semiconductor cooler having a power semiconductor refrigerant flow path inside.
The condenser case and the power semiconductor cooler are joined in a surface contact state, and the condenser refrigerant flow path and the power semiconductor refrigerant flow path are directly connected to circulate the cooling medium.
The capacitor terminal includes a protrusion extending outward from the wall portion of the capacitor case, a first bent portion extending from the tip of the protrusion along the wall portion, and the first bent portion. It includes a second bent portion extending from the tip toward the wall portion, and a terminal portion formed at the tip of the second bent portion and connected to the power semiconductor terminal.
The wall portion of the capacitor case is characterized in that a protrusion is formed on the wall portion of the capacitor terminal so as to project toward the first bent portion and join the first bent portion in a surface contact state. Converter. The power conversion device according to claim 1, wherein the first bent portion and the protrusions are joined via a heat radiating sheet. A peripheral groove equipped with a first O-ring is formed on one of the peripheral edge of the connection port of the condenser refrigerant flow path and the peripheral edge of the connection port of the power semiconductor refrigerant flow path.
When the condenser case and the power semiconductor cooler are joined in a surface contact state, the other of the peripheral edge of the connection port of the condenser refrigerant flow path and the peripheral edge of the connection port of the power semiconductor refrigerant flow path is the first. The power conversion device according to claim 1 or 2, wherein the condenser refrigerant flow path and the power semiconductor refrigerant flow path are communicated with each other in a state where the O-ring is crushed. An insertion pipe is projected to the outside and connected to one of the condenser refrigerant flow path and the power semiconductor refrigerant flow path, and a second O-ring is attached to the outer periphery of the insertion pipe protruding to the outside.
The insertion pipe is inserted into the other of the condenser refrigerant flow path and the power semiconductor refrigerant flow path with the second O-ring crushed by the inner wall of the other flow path, and the condenser refrigerant flow path and the power are inserted. The power conversion device according to any one of claims 1 to 3, wherein the semiconductor refrigerant flow path is communicated with each other. The power conversion device according to any one of claims 1 to 4, wherein the condenser case and the power semiconductor cooler are joined via an elastic heat radiating sheet. The power conversion device according to any one of claims 1 to 5, wherein the condenser case and the power semiconductor cooler are joined via thermal paste. A plurality of metal columns stand up from around the joint surface to which the power semiconductor cooler of the capacitor case is joined, and the drive circuit of the power semiconductor module is mounted above the power semiconductor module. 1 to 6, wherein the drive circuit board and the control circuit board on which the control circuit of the power semiconductor module is mounted are supported and arranged by the tips of the plurality of metal columns. The power conversion device according to any one of the above items. The power conversion device according to any one of claims 1 to 7, wherein the condenser refrigerant flow path embedded in the condenser case is formed of a metal pipe having a bent portion that bends in an arc shape. .. When the condenser module is housed in the housing, the connection port of the condenser refrigerant flow path of the condenser module corresponds to the through hole formed in the housing and passes through the through hole from the outside of the housing. The power conversion device according to any one of claims 1 to 8, wherein the refrigerant pipe is connected to the connection port.

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