JP2022049898A - Vibration device - Google Patents

Abstract

To provide a vibration device that can accurately measure an angular velocity by detecting the inclination of a vibration element.SOLUTION: In a vibration device 1, an inclination detection circuit 218 detects the inclination of a vibration element 6 based on at least one or more capacitances of the capacitances between detection electrodes 11, 12 and drive electrodes 13, 14, 15, 16 provided respectively on detection arms 33, 34 and drive arms 35, 36, 37, 38 of the vibration element 6 and substrate electrodes 431, 441, 451, 461, 471, 481 provided on a support substrate 4 and arranged at positions at least partially overlapping any of the detection electrodes 11, 12 and drive electrodes 13, 14, 15, 16 in plan view seen from a thickness direction of the vibration element 6. The vibration device 1 notifies abnormality and performs sensitivity correction according to the inclination of the vibration element 6.SELECTED DRAWING: Figure 1

Description

The present invention relates to a vibrating device.

Conventionally, as shown in Patent Document 1, an electronic device including a gyro element for detecting an angular velocity, a support portion for supporting the gyro element, and a package for accommodating the gyro element and the support portion is known.

Japanese Unexamined Patent Publication No. 2017-26336

However, in the electronic device described in Patent Document 1, the support lead that supports the gyro element is deformed due to an impact applied to the gyro element, and the holding posture of the gyro element is changed. There is a problem that the detection sensitivity of the gyro element is lowered.

The vibrating device is arranged with a vibrating element that detects and vibrates according to an angular velocity with an axis along the thickness direction as a detection axis, and the vibrating element and the vibrating element facing each other in the thickness direction to support the vibrating element. It has a support substrate and a tilt detection circuit for detecting the tilt of the vibrating element with respect to the support substrate. The vibrating element includes a first drive electrode, and a drive signal is applied to the first drive electrode. A first drive arm that drives and vibrates, a second drive electrode is provided, and a second drive arm that drives and vibrates by applying a drive signal to the second drive electrode, and a first detection electrode are provided, and the angular speed is increased. It is provided with a first detection arm that outputs a first detection signal from the first detection electrode by detecting and vibrating accordingly, and a second detection electrode, and by detecting and vibrating according to the angular velocity, the second detection electrode is used. It has a second detection arm from which a second detection signal is output, and the support substrate is provided on the base portion and the base portion, and at least the first drive electrode, the first drive electrode, in a plan view seen from the thickness direction. It has a first substrate electrode arranged at a position where at least a part overlaps with any of the second drive electrode, the first detection electrode, and the second detection electrode, and the tilt detection circuit is the same as the first substrate electrode. , The first electrostatic voltage between the first drive electrode, the second drive electrode, the first detection electrode, and any of the second detection electrodes arranged at positions overlapping with the first substrate electrode. The capacitance is detected, and the inclination of the vibrating element is detected based on the first capacitance.

The plan view which shows the schematic structure of the vibration device which concerns on Embodiment 1. FIG. FIG. 2 is a cross-sectional view taken along the line AA in FIG. FIG. 2 is a cross-sectional view taken along the line BB in FIG. The plan view of the vibrating element which concerns on Embodiment 1. FIG. The flowchart which shows an example of the method of detecting the inclination of the vibrating element which concerns on Embodiment 1. The plan view which shows the schematic structure of the vibration element and the support substrate which concerns on Embodiment 1. FIG. FIG. 6 is a schematic cross-sectional view taken along the DD line in FIG. FIG. 6 is a schematic cross-sectional view taken along the line EE in FIG. FIG. 6 is a schematic cross-sectional view taken along the line FF in FIG. FIG. 6 is a schematic cross-sectional view taken along the line GG in FIG. The functional block diagram of the circuit element which concerns on Embodiment 1. FIG. The flowchart which shows an example of the angular velocity measurement procedure of the vibration device which concerns on Embodiment 1. The functional block diagram of the circuit element which concerns on Embodiment 2. The flowchart which shows an example of the angular velocity measurement procedure of the vibration device which concerns on Embodiment 2. The plan view which shows the schematic structure of the vibration device which concerns on Embodiment 3. FIG. 5 is a schematic cross-sectional view taken along the line OH in FIG. FIG. 15 is a schematic cross-sectional view taken along the line I-I in FIG.

1. 1. Embodiment 1
The vibration device 1 according to the first embodiment will be described with reference to FIGS. 1 to 3. Note that FIG. 1 illustrates a state in which the lid 22 and the joining member 23 are removed for convenience of explaining the internal configuration of the vibration device 1. Further, for convenience of explanation in the figure, the dimensional ratio of each component is different from the actual one.

In the coordinates added to the drawings, the three axes orthogonal to each other will be described as the X-axis, the Y-axis, and the Z-axis. The direction along the X axis is the "X direction", the direction along the Y axis is the "Y direction", the direction along the Z axis is the "Z direction", and the direction of the arrow is the plus direction. Further, the Z direction will be described as "thickness direction", the plus direction in the Z direction will be described as "up" or "upward", and the minus direction in the Z direction will be described as "down" or "downward". Further, in a plan view when viewed from the Z direction, the surface on the plus side in the Z direction will be described as the upper surface, and the surface on the minus side in the Z direction opposite to this will be described as the lower surface. Further, the X-axis, the Y-axis, and the Z-axis correspond to the crystal axis of the crystal, the X-axis corresponds to the A-axis as the electric axis which is the crystal axis of the crystal, and the Y-axis corresponds to the crystal axis of the crystal, as will be described later. It corresponds to the B axis as the mechanical axis, and the Z axis corresponds to the C axis as the optical axis.

As shown in FIGS. 1 and 2, the vibration device 1 is a physical quantity sensor that detects an angular velocity ωz having a Z axis as a detection axis. The vibration device 1 includes a package 2, a support substrate 4 and a vibration element 6 housed in the package 2, and a circuit element 3 including a tilt detection circuit 218 for detecting the tilt of the vibration element 6 with respect to the support substrate 4. Have.

As shown in FIG. 1, the vibrating element 6 has a so-called double T-shaped structure. The vibrating element 6 includes a vibrating element piece 30, a first detection electrode 11, a second detection electrode 12, a first drive electrode 13, a second drive electrode 14, and a third drive electrode arranged on the surface of the vibrating element piece 30. It has 15 and a 4th drive electrode 16.

The vibrating element piece 30 is made of, for example, a Z-cut quartz substrate. The Z-cut quartz substrate has an extension in the XY plane defined by the X-axis corresponding to the A-axis as the crystal axis of the crystal and the Y-axis corresponding to the B-axis as the mechanical axis, and serves as an optical axis. It has a thickness in the direction along the Z axis corresponding to the C axis of.

Further, the vibrating element piece 30 includes an element base 31, a first detection arm 33, a second detection arm 34, a pair of connecting arms 311, 312, a first driving arm 35, and a second driving arm 36. It has a third driving arm 37 and a fourth driving arm 38. The element base 31 is located at the center of the vibrating element piece 30. The first detection arm 33 and the second detection arm 34 extend from the element base 31 to the plus side and the minus side in the Y direction, which are opposite sides in the direction along the Y axis, respectively. The pair of connecting arms 311, 312 extend from the element base 31 to the plus side and the minus side in the X direction, which are opposite sides in the direction along the X axis, respectively. The first driving arm 35 and the third driving arm 37 extend from the tip end portion of the connecting arm 311 to the plus side and the minus side in the Y direction, respectively. The second driving arm 36 and the fourth driving arm 38 extend from the tip end portion of the connecting arm 312 to the plus side and the minus side in the Y direction, respectively.

Further, the first detection arm 33, the second detection arm 34, the first drive arm 35, the second drive arm 36, the third drive arm 37, and the fourth drive arm 38 are each X at the tip thereof from the proximal end side. It has wide portions 331, 341, 351, 361, 371, 381 that are wide in the direction. The wide portions 331, 341, 351, 361, 371, 381 are also referred to as "hammer heads", respectively.

The first detection electrode 11 is arranged on the upper surface and the lower surface of the wide portion 331 of the first detection arm 33, respectively. Similarly, the upper and lower surfaces of the wide portions 341, 351, 361, 371, 381 of the second detection arm 34, the first drive arm 35, the second drive arm 36, the third drive arm 37, and the fourth drive arm 38, respectively. A second detection electrode 12, a first drive electrode 13, a second drive electrode 14, a third drive electrode 15, and a fourth drive electrode 16 are arranged in each of the above. The first detection electrode 11, the second detection electrode 12, the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the first are arranged in the wide portion 331, 341, 351, 361, 371, 381. The four drive electrodes 16 are used for frequency adjustment of the first detection arm 33, the second detection arm 34, the first drive arm 35, the second drive arm 36, the third drive arm 37, and the fourth drive arm 38, respectively.

As shown in FIG. 2, the package 2 includes a base 21 having a recess 211 that opens on the upper surface, and a lid 22 that closes the opening of the recess 211 and is joined to the upper surface of the base 21 via a joining member 23. Has. An internal space S is formed inside the package 2 by a recess 211, and the circuit element 3, the support substrate 4, and the vibration element 6 are housed in the internal space S.

The recess 211 is composed of a plurality of recesses, and opens in the recess 211a that opens on the upper surface of the base 21 and the recess 211b that opens in the bottom surface of the recess 211a and has an opening width smaller than that of the recess 211a and in the bottom surface of the recess 211b. It has a recess 211c having an opening width smaller than that of the recess 211b. The support substrate 4 is fixed to the bottom surface of the recess 211a while the vibrating element 6 is supported, and the circuit element 3 is fixed to the bottom surface of the recess 211c.

A plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, a plurality of internal terminals 242 are arranged on the bottom surface of the recess 211b, and a plurality of external terminals 243 are arranged on the lower surface of the base 21. The internal terminals 241 and 242 and the external terminals 243 are electrically connected via wiring (not shown) formed in the base 21. Further, the internal terminal 241 is electrically connected to the vibrating element 6 via the support substrate 4, and the internal terminal 242 is electrically connected to the circuit element 3 via the bonding wire BW.

The circuit element 3 has a drive circuit for driving the vibrating element 6 and detecting the angular velocity ωz applied to the vibrating element 6, and a tilt detecting circuit 218 for detecting the tilt of the vibrating element 6 with respect to the support substrate 4.

The support substrate 4 is a substrate for mounting a TAB (Tape Automated Bonding). The support substrate 4 is located between the vibrating element 6 and the circuit element 3, and is arranged so as to face the Z direction of the vibrating element 6, that is, the thickness direction of the vibrating element 6, and the vibrating element 6 is placed on the lower side, that is, in the Z direction. It supports from the minus side.

As shown in FIGS. 1 to 3, the support substrate 4 has a frame-shaped base 41 in a plan view from the Z direction, which is the thickness direction of the vibrating element 6, a plurality of leads 42 provided on the base 41, and a base 41. The first substrate electrode 431, the second substrate electrode 441, the third substrate electrode 451 and the fourth substrate electrode 461, the fifth substrate electrode 471, and the sixth substrate electrode 481 arranged on the upper surface of the base 41 are arranged on the lower surface of the base 41. It has electrode pads 51, 52, 53, 54 to be formed, and wirings 511, 521, 531, 532, 541, 542 arranged on the upper surface of the base 41.

The base 41 is fixed to the bottom surface of the recess 211a by the joining member B1, and the lead 42 and the internal terminal 241 provided on the bottom surface of the recess 211a are electrically connected via the joining member B1.

The lead 42 is a bonding lead that supports the vibrating element 6, is composed of a conductive member, and functions as a wiring that electrically connects the vibrating element 6 and the internal terminal 241. The base end portion of the lead 42 is fixed to the lower surface of the base portion 41 and is electrically connected to the internal terminal 241 via the joining member B1.

The lead 42 bends in the middle from the base end portion of the lead 42 toward the tip end portion and inclines upward, and the tip end portion of the lead 42 is located above the base portion 41, that is, on the plus side in the Z direction. .. The element base 31 of the vibrating element 6 is fixed to the tip of the lead 42 via the joining member B2. As a result, the element base 31 of the vibrating element 6 is fixed to the support substrate 4 via the bonding member B2 and the lead 42, and is electrically connected to the circuit element 3 via the support substrate 4 and the bonding member B1. ..

Further, the lead 42 has flexibility, and by supporting the vibrating element 6 so as to float upward and flexibly by the lead 42, the influence of the support structure on the vibrating characteristics of the vibrating element 6 and the external force on the vibrating element 6 It is possible to alleviate the impact caused by.

The first substrate electrode 431 is viewed in a plan view in the Z direction, which is the thickness direction of the vibrating element 6, so that at least a part thereof overlaps with the first detection electrode 11 arranged in the wide portion 331 of the first detection arm 33. It is arranged on the upper surface of the base 41. The first substrate electrode 431 and the wiring 511 are electrically connected, and the wiring 511 is electrically connected to the electrode pad 51 arranged on the lower surface of the base 41 via a through electrode (not shown). is doing. The electrode pad 51 is electrically connected to the circuit element 3 via the joining member B1 and the internal terminal 241. In this way, the first substrate electrode 431 is electrically connected to the circuit element 3 via the wiring 511 and the like.

Similarly, the second substrate electrode 441 has at least a part of the second detection electrode 12 arranged in the wide portion 341 of the second detection arm 34 in the Z direction, that is, in the plan view in the thickness direction of the vibrating element 6. They are arranged on the upper surface of the base 41 so as to overlap each other. The second substrate electrode 441 is electrically connected to the circuit element 3 via a wiring 521, a through electrode (not shown), an electrode pad 52, a joining member B1, and an internal terminal 241.

The third substrate electrode 451 and the fifth substrate electrode 471 are the first drive electrode 13 and the first drive electrode 13 arranged in the wide portion 351 of the first drive arm 35 in the Z direction, that is, in the plan view in the thickness direction of the vibrating element 6. It is arranged on the upper surface of the base 41 so that at least a part thereof overlaps with the third drive electrode 15 arranged in the wide portion 371 of the three drive arms 37. The third substrate electrode 451 is electrically connected to the electrode pad 53 via a wiring 531 and a through electrode (not shown). Similarly, the fifth substrate electrode 471 is electrically connected to the electrode pad 53 via a wiring 532 and a through electrode (not shown). The electrode pad 53 is electrically connected to the circuit element 3 via the joining member B1 and the internal terminal 241. In this way, the third substrate electrode 451 and the fifth substrate electrode 471 are electrically connected to the circuit element 3.

Similarly, the fourth substrate electrode 461 and the sixth substrate electrode 481 are the second drive electrodes arranged in the wide portion 361 of the second drive arm 36 in the Z direction, that is, in the plan view in the thickness direction of the vibrating element 6. It is arranged on the upper surface of the base 41 so that at least a part thereof overlaps with the fourth drive electrode 16 arranged in the wide portion 381 of the 14 and the fourth drive arm 38. The fourth substrate electrode 461 and the sixth substrate electrode 481 are electrically connected to the circuit element 3 via wirings 541 and 542, through electrodes (not shown), electrode pads 54, joining member B1, and internal terminals 241. It is connected to the.

The first substrate electrode 431, the second substrate electrode 441, the third substrate electrode 451 and the fourth substrate electrode 461, the fifth substrate electrode 471, and the sixth substrate electrode 481 face the first detection electrode 11 and the first, respectively. 2 The inclination of the vibrating element 6 can be detected by measuring the electrostatic capacitances of the detection electrode 12, the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the fourth drive electrode 16. can.

Further, in the present embodiment, the first substrate electrode 431, the second substrate electrode 441, the third substrate electrode 451 and the fourth substrate electrode 461, the fifth substrate electrode 471, the sixth substrate electrode 481, and the wiring 511 and 521, 531 , 532, 541, and 542 are arranged on the upper surface of the base 41, but may be arranged on the lower surface of the base 41.

Next, the vibrating element 6 will be described in detail with reference to FIG.
As shown in FIG. 4, the first detection arm 33 and the second detection arm 34 extend from the element base 31 to opposite sides along the Y direction. Similarly, the first driving arm 35 and the third driving arm 37 extend from the tip end portion of the connecting arm 311 to opposite sides along the Y direction, and the second driving arm 36 and the fourth driving arm 36 38 and 38 extend from the tip of the connecting arm 312 to opposite sides along the Y direction.

A first detection electrode 11 is provided on the surface of the first detection arm 33. The first detection electrode 11 has a first detection signal electrode 111 and a first detection ground electrode 112 as a detection constant potential electrode.

The first detection signal electrode 111 is arranged on the upper surface and the lower surface except for the wide portion 331 of the first detection arm 33, and the first detection signal electrode 111 arranged on the upper surface and the lower surface of the first detection arm 33 is not shown. Not electrically connected by wiring. The first detection ground electrode 112 is arranged on both side surfaces of the first detection arm 33 excluding the wide portion 331, and the upper surface and the lower surface of the wide portion 331, and is arranged on both side surfaces of the first detection arm 33 and the wide portion. The first detection ground electrode 112 arranged on the upper surface and the lower surface of the 331 is electrically connected by a wiring (not shown).

Similarly, on the surface of the second detection arm 34, a second detection electrode 12 having a second detection signal electrode 121 and a second detection ground electrode 122 as a detection constant potential electrode is provided. The second detection signal electrode 121 is arranged on the upper surface and the lower surface of the second detection arm 34 excluding the wide portion 341, and the second detection ground electrode 122 is wide on both side surfaces excluding the wide portion 341 of the second detection arm 34. It is arranged on the upper surface and the lower surface of the portion 341.

Further, on the surfaces of the first drive arm 35, the second drive arm 36, the third drive arm 37, and the fourth drive arm 38, the first drive electrode 13, the second drive electrode 14, and the third drive electrode 15, respectively, A fourth drive electrode 16 is provided. The first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the fourth drive electrode 16 have a drive signal electrode 131 and a drive ground electrode 132 as a drive constant potential electrode.

The drive signal electrode 131 has upper and lower surfaces excluding the wide portions 351 and 371 of the first drive arm 35 and the third drive arm 37, and the wide portions 361 and 361 of the second drive arm 36 and the fourth drive arm 38, respectively. It is arranged on both side surfaces excluding 381 and on the upper surface and the lower surface of the wide portions 361 and 381. The drive signal electrodes 131 arranged on the surfaces of the first drive arm 35, the second drive arm 36, the third drive arm 37, and the fourth drive arm 38 are electrically connected by wiring (not shown).

The drive ground electrode 132 includes both side surfaces of the first drive arm 35 and the third drive arm 37 excluding the wide portions 351 and 371, the upper and lower surfaces of the wide portions 351 and 371, and the second drive arm 36 and the fourth. It is arranged on the upper surface and the lower surface excluding the wide portions 361 and 381 of the drive arm 38. The drive ground electrode 132 arranged on the surfaces of the first drive arm 35, the second drive arm 36, the third drive arm 37, and the fourth drive arm 38 is electrically connected by wiring (not shown).

The first detection signal electrode 111, the first detection ground electrode 112, the second detection signal electrode 121, the second detection ground electrode 122, the drive signal electrode 131, the drive ground electrode 132, and terminals arranged on the lower surface of the element base 31. 67 is electrically connected by a wiring (not shown).

The vibrating element 6 configured in this way detects the angular velocity ωz with the Z axis, that is, the axis along the thickness direction as the detection axis, as follows.

First, by applying a voltage, that is, a drive signal to the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the fourth drive electrode 16, the first drive is performed in the direction indicated by the arrow a in FIG. The arm 35, the second driving arm 36, the third driving arm 37, and the fourth driving arm 38 are flexed and vibrated, that is, driven and vibrated.

At this time, if the angular velocity ωz is not applied to the vibrating element 6, the first driving arm 35 and the third driving arm 37, and the second driving arm 36 and the fourth driving arm 38 are in the YZ plane passing through the center point, that is, the center of gravity G. Since the vibration is plane-symmetrical with respect to the element base 31, the connecting arms 311, 312, the first detection arm 33, and the second detection arm 34 hardly vibrate.

In the state where the first drive arm 35, the second drive arm 36, the third drive arm 37, and the fourth drive arm 38 are driven and vibrated in this way, the vibrating element 6 is formed around the normal line passing through the center of gravity G, that is, the Z axis. When the surrounding angular velocity ωz is applied, a corioli force acts on the first driving arm 35, the second driving arm 36, the third driving arm 37, and the fourth driving arm 38, respectively, and the connecting arms 311, 312 are shown in FIG. It bends and vibrates in the direction indicated by the arrow b. Along with this, the first detection arm 33 and the second detection arm 34 bend vibration, that is, detect vibration in the direction indicated by the arrow c in FIG. 4 so as to cancel the bending vibration.

In this way, the vibrating element 6 detects and vibrates in response to the angular velocity ωz whose detection axis is the Z axis, which is the axis along the thickness direction, so that the detected vibration causes the first detection electrode 11 of the first detection arm 33 to vibrate. The generated charge is output from the first detection electrode 11 as a first detection signal, and similarly, the charge generated in the second detection electrode 12 of the second detection arm 34 by the detection vibration is from the second detection electrode 12 to the second detection electrode 12. It is output as a detection signal. Then, based on the first detection signal and the second detection signal, the angular velocity ωz applied to the vibrating element 6 can be obtained.

Next, a method of detecting the inclination of the vibrating element 6 will be described with reference to FIGS. 5 to 10. Note that FIG. 6 shows the vibration element 6 and the support substrate 4 extracted from the vibration device 1 of FIG. 1, and the same components as those of FIG. 1 are designated by the same reference numerals, and overlapping description will be omitted.

As shown in FIG. 5, the methods for detecting the inclination of the vibrating element 6 include a preparation step, a step of calculating the inclination due to rotation around the X axis in the YZ plane, and the tip of one connecting arm 311 and the support substrate 4. It includes a step of calculating the distance between the above, a step of calculating the distance between the tip of the other connecting arm 312 and the support substrate 4, and a step of calculating the inclination due to rotation around the Y axis in the XZ plane.

1.1 Preparation step In step S11, the drive of the vibrating element 6 is stopped. Specifically, the application of the drive signal to the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the fourth drive electrode 16 is stopped.

1.2 Calculation step of inclination due to rotation around the X axis in the YZ plane In step S12, the inclination θ1 due to the rotation around the X axis in the YZ plane of the vibrating element 6 is calculated. Specifically, first, a voltage is applied between the first detection ground electrode 112 and the first substrate electrode 431. As shown in FIGS. 6 and 7, the first detection ground electrode 112 provided on the upper surface and the lower surface of the wide portion 331 of the first detection arm 33 and the first substrate electrode 431 provided on the upper surface of the base 41 of the support substrate 4. And are arranged so as to overlap each other in the plan view seen from the Z direction. Therefore, a voltage is applied between the first detection ground electrode 112 and the first substrate electrode 431 to obtain the first detection ground electrode. The first capacitance C11 is formed between the 112 and the first substrate electrode 431.

Since the first capacitance C11 changes according to the distance d11 between the wide portion 331 of the first detection arm 33 and the support substrate 4, the correlation between the distance d11 and the first capacitance C11 is made in advance. By obtaining the relationship, the first capacitance C11 can be detected, and the distance d11 can be calculated based on the detected first capacitance C11.

Similarly, by applying a voltage between the second detection ground electrode 122 provided in the wide portion 341 of the second detection arm 34 and the second substrate electrode 441 provided in the support substrate 4, the second detection ground is grounded. Since the second capacitance C12 is formed between the electrode 122 and the second substrate electrode 441, the distance d12 between the wide portion 341 of the second detection arm 34 and the support substrate 4 is previously determined. By obtaining the correlation with the two capacitances C12, the second capacitance C12 can be detected and the distance d12 can be calculated based on the detected second capacitance C12.

Here, the distance between the wide portion 331 of the first detection arm 33 and the wide portion 341 of the second detection arm 34 is set as the hypotenuse of a right triangle, and the first substrate electrode 431 and the second substrate electrode 441 of the support substrate 4 are used. The distance between the two is the base of a right triangle, the distance d11 between the wide portion 331 of the first detection arm 33 and the support substrate 4, and the distance between the wide portion 341 of the second detection arm 34 and the support substrate 4. The difference between d12 and d12 can be regarded as the height of a right triangle. Since the distance between the wide portion 331 of the first detection arm 33 and the wide portion 341 of the second detection arm 34 is known in advance at the time of designing the vibration element 6, the wide portion 331 of the first detection arm 33 From the difference between the distance d11 between the support substrate 4 and the distance d12 between the wide portion 341 of the second detection arm 34 and the support substrate 4, the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane. Can be calculated.

In the present embodiment, after the distance d11 and the distance d12 are calculated from the first capacitance C11 and the second capacitance C12, respectively, the difference between the distance d11 and the distance d12 is calculated. The correlation between the difference between the first capacitance C11 and the second capacitance C12 and the difference between the distance d11 and the distance d12 is obtained, and the first capacitance C11 and the second capacitance C12 are obtained. From the difference, the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane may be calculated.

Further, in the present embodiment, in order to calculate the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane, the first detection electrode 11 and the second detection electrode 12 and the first substrate electrode 431 facing each other are used. And the electrostatic capacitances C11 and C12 between the second substrate electrode 441 and the second substrate electrode 441 are used, but the first drive electrode 13 and the third drive electrode 15 and the third substrate electrode 451 and the fifth substrate electrode facing each other are used. From the difference in electrostatic capacitance formed between 471 and 471, the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane may be calculated. Similarly, from the difference in capacitance formed between the second drive electrode 14 and the fourth drive electrode 16 and the fourth substrate electrode 461 and the sixth substrate electrode 481 facing each other, the vibrating element 6 The slope θ1 due to rotation around the X axis in the YZ plane may be calculated.

1.3 Calculation step of the distance between the tip of one connecting arm 311 and the support substrate 4 In step S13, the distance d31 between the tip of one connecting arm 311 and the support substrate 4 is calculated. Specifically, first, a voltage is applied between the drive ground electrode 132 of the first drive arm 35 and the third drive arm 37, and the third substrate electrode 451 and the fifth substrate electrode 471. As shown in FIGS. 6 and 8, the drive ground electrode 132 provided on the wide portion 351 of the first drive arm 35 and the wide portion 371 of the third drive arm 37, respectively, and the third drive ground electrode 132 provided on the base 41 of the support substrate 4. Since the substrate electrode 451 and the fifth substrate electrode 471 are arranged so as to overlap each other in a plan view seen from the Z direction, a third electrostatic voltage is provided between the drive ground electrode 132 and the third substrate electrode 451. The capacitance C13 is formed, and similarly, the fifth capacitance C15 is formed between the drive ground electrode 132 and the fifth substrate electrode 471.

In the present embodiment, the third substrate electrode 451 and the fifth substrate electrode 471 are electrically connected to the electrode pad 53 by wirings 531 and 532, and the third capacitance C13 and the fifth capacitance are connected. A seventh capacitance C13 + C15 obtained by combining C15 and C15 is obtained.

The seventh capacitance C13 + C15 changes according to the distance d31 between the tip of the connecting arm 311 and the support substrate 4 and the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane. By obtaining in advance the correlation between the distance d31, the inclination θ1 due to the rotation of the vibrating element 6 around the X-axis, and the seventh capacitance C13 + C15, the distance d31 from the seventh capacitance C13 + C15. Can be calculated.

In this embodiment, both the third capacitance C13 and the fifth capacitance C15 are formed, and further, the third capacitance C13 and the fifth capacitance C15 are added. Although the 7th capacitance C13 + C15 is synthesized, it is not necessary to synthesize the 3rd capacitance C13 and the 5th capacitance C15. The correlation between at least one of the third capacitance C13 or the fifth capacitance C15 and the distance d31 is obtained in advance, and the distance d31 is determined from one of the third capacitance C13 or the fifth capacitance C15. You may calculate it.

1.4 Calculation step of the distance between the tip of the other connecting arm 312 and the support substrate 4 In step S14, the distance d32 between the tip of the other connecting arm 312 and the support substrate 4 is calculated. Specifically, first, a voltage is applied between the drive signal electrode 131 of the second drive arm 36 and the fourth drive arm 38, and the fourth substrate electrode 461 and the sixth substrate electrode 481. As shown in FIGS. 6 and 9, a fourth capacitance C14 is formed between the drive signal electrode 131 provided in the wide portion 361 of the second drive arm 36 and the fourth substrate electrode 461, and the fourth capacitance C14 is formed. A sixth capacitance C16 is formed between the drive signal electrode 131 provided in the wide portion 381 of the fourth drive arm 38 and the sixth substrate electrode 481.

In the present embodiment, the 4th substrate electrode 461 and the 6th substrate electrode 481 are electrically connected to the electrode pad 54 by wirings 541 and 542, and the 4th capacitance C14 and the 6th capacitance are connected. The eighth capacitance C14 + C16 obtained by combining C16 and C16 is obtained.

Similar to step S13, in advance, the distance d32 between the tip of the connecting arm 312 and the support substrate 4, the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane, and the eighth capacitance C14 + C16. By obtaining the correlation of, the distance d32 can be calculated from the eighth capacitance C14 + C16.

In this embodiment, both the fourth capacitance C14 and the sixth capacitance C16 are formed, and further, the fourth capacitance C14 and the sixth capacitance C16 are added. Although it is synthesized, it is not necessary to synthesize the fourth capacitance C14 and the sixth capacitance C16. The correlation between at least one of the fourth capacitance C14 or the sixth capacitance C16 and the distance d32 is obtained in advance, and the distance d32 is determined from one of the fourth capacitance C14 or the sixth capacitance C16. You may calculate it.

1.5 Calculation step of inclination due to rotation around the Y axis in the XZ plane In step S15, the inclination θ2 due to the rotation around the Y axis in the XZ plane of the vibrating element 6 is calculated. As shown in FIG. 10, the distance between the tip of the connecting arm 311 and the tip of the connecting arm 312 is the hypotenuse of a right-angled triangle, and the distance d31 between the tip of the connecting arm 311 and the support substrate 4 is connected. The difference between the distance d32 between the tip of the arm 312 and the support substrate 4 can be regarded as the height of the right angle triangle, and further, between the tip of the connecting arm 311 and the tip of the connecting arm 312. Since the distance is known in advance at the time of designing the vibrating element 6, the distance d31 between the tip of the connecting arm 311 and the support substrate 4 and the distance d32 between the tip of the connecting arm 312 and the support substrate 4 From the difference between the two, the inclination θ2 due to the rotation of the vibrating element 6 around the Y axis in the XZ plane can be calculated.

In the present embodiment, after the distance d31 and the distance d32 are calculated, the inclination θ2 due to the rotation of the vibrating element 6 around the Y axis in the XZ plane is calculated from the difference between the distance d31 and the distance d32. The third capacitance C13, the fifth capacitance C15, or the seventh capacitance C13 + C15, which correlates with the distance d32, and the fourth capacitance C14, the sixth capacitance, which correlates with the distance d32. From the difference between C16 and any one of the eighth capacitance C14 + C16, the inclination θ2 due to the rotation of the vibrating element 6 around the Y axis in the XZ plane may be calculated.

Further, in the present embodiment, the six substrates facing the first detection electrode 11, the second detection electrode 12, the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the fourth drive electrode 16, respectively. It has electrodes, that is, a first substrate electrode 431, a second substrate electrode 441, a third substrate electrode 451 and a fourth substrate electrode 461, a fifth substrate electrode 471 and a sixth substrate electrode 481, but the substrate electrode is a substrate electrode. Any one or more of the first substrate electrode 431, the second substrate electrode 441, the third substrate electrode 451 and the fourth substrate electrode 461, the fifth substrate electrode 471, and the sixth substrate electrode 481 may be used. By having one or more substrate electrodes and detecting one or more capacitances, the inclination of the vibrating element 6 can be detected. Further, by reducing the number of substrate electrodes, wiring from the support substrate 4 or the support substrate to the circuit element 3 can be simplified, so that the vibration device 1 with reduced manufacturing cost can be obtained.

Next, the circuit element 3 including the inclination detection circuit 218 for detecting the inclination of the vibration element 6 with respect to the support substrate 4 will be described with reference to FIG.

As shown in FIG. 11, the vibration device 1 includes a vibration element 6, a support substrate 4, and a circuit element 3. The circuit element 3 includes a reference voltage circuit 202, a drive circuit 204, an angular velocity detection circuit 206, a data processing circuit 208 including a digital arithmetic circuit 281 and an interface circuit 282, a storage unit 210, an oscillation circuit 212, and a clock signal. It has a generation circuit 214, an element terminal switching circuit 216, and a tilt detection circuit 218.

The reference voltage circuit 202 generates a constant voltage or a constant current such as a reference voltage which is an analog ground voltage based on the power supply voltage and the ground voltage supplied from the VDD terminal and the VSS terminal, respectively, and the drive circuit 204 and the angular speed detection circuit. 206, supply to the tilt detection circuit 218.

The oscillation circuit 212 generates a source clock signal and outputs it to the clock signal generation circuit 214.

The clock signal generation circuit 214 generates a master clock signal MCLK based on the source clock signal generated by the oscillation circuit 212, and outputs the master clock signal MCLK to the digital arithmetic circuit 281. Further, the clock signal generation circuit 214 generates the clock signal ADCLK based on the source clock signal generated by the oscillation circuit 212, and outputs the clock signal ADCLK to the angular speed detection circuit 206.

The storage unit 210 stores various trimming data used in the drive circuit 204 and the angular velocity detection circuit 206, for example, adjustment data and correction data. Further, the storage unit 210 stores data describing the correlation between the capacitance between the electrodes used in the tilt detection circuit 218 and the tilt of the vibrating element 6, for example, a correlation table or a calculation formula. Further, the storage unit 210 stores the tilt abnormality value as a reference for determining the tilt abnormality of the vibration element 6 used in the digital arithmetic circuit 281 with respect to the support substrate 4. Further, the storage unit 210 stores an upper limit value of the angular velocity as a reference for determining the presence or absence of an impact on the vibration device 1 used in the digital arithmetic circuit 281.

The drive circuit 204 generates a drive signal DSS for driving and vibrating the vibrating element 6, and the first drive electrode 13, the second drive electrode 14, and the third drive electrode 13 of the vibrating element 6 are generated via the element terminal switching circuit 216 and the DS terminal. It is supplied to the drive electrode 15 and the fourth drive electrode 16. The oscillation current DGS generated in the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the fourth drive electrode 16 due to the drive vibration of the vibrating element 6 passes through the DG terminal and the element terminal switching circuit 216. It is input to the drive circuit 204. The drive circuit 204 feedback-controls the amplitude level of the drive signal DSS so that the amplitude of the oscillation current DGS is kept constant. Further, the drive circuit 204 generates a detection signal SDET having the same phase as the drive signal DSS and outputs it to the angular velocity detection circuit 206.

The angular velocity detection circuit 206 has a first detection signal S1S and a first detection signal output from the first detection electrode 11 and the second detection electrode 12 of the vibration element 6 via the S1 terminal, the S2 terminal, and the element terminal switching circuit 216, respectively. 2 The detection signal S2S is input, and the angular velocity detection circuit 206 detects the angular velocity component contained in the first detection signal S1S and the second detection signal S2S by using the detection signal SDET, and digitally according to the magnitude of the angular velocity component. The signal VDO is generated and output.

The data processing circuit 208 includes a digital arithmetic circuit 281 and an interface circuit 282.

The digital arithmetic circuit 281 performs a predetermined arithmetic processing on the digital signal VDO output from the angular velocity detection circuit 206, and outputs the digital data VO obtained by the arithmetic processing as the angular velocity ωz. In the present embodiment, the digital arithmetic circuit 281 performs a processing for averaging the digital signal VDO as a predetermined arithmetic processing. In addition to the process of averaging the digital signal VDO, the predetermined arithmetic process may include so-called sensitivity correction or the like, which corrects the digital signal VDO according to the inclination of the vibrating element 6.

Further, the digital arithmetic circuit 281 switches between an angular velocity detection mode for the vibration device 1 to detect the angular velocity ωz and a tilt detection mode for detecting the tilt of the vibration element 6 with respect to the support substrate 4. Specifically, the digital arithmetic circuit 281 outputs the angular velocity detection timing signal SEL1 to the angular velocity detection circuit 206 in the angular velocity detection mode, enables the angular velocity detection circuit 206 to operate, and switches the element terminal to the element terminal switching circuit 216. The signal SEL3 is output. Based on the element terminal switching signal SEL3, in the element terminal switching circuit 216, the drive signal DSS output from the drive circuit 204 is output from the DS terminal to the vibrating element 6, and the oscillation current DGS output from the vibrating element 6 is the first. The DS terminal, DG terminal, S1 terminal and so that the 1 detection signal S1S and the 2nd detection signal S2S are input to the drive circuit 204 and the angular speed detection circuit 206 via the DG terminal, the S1 terminal, and the S2 terminal, respectively. Switch the S2 terminal.

In the tilt detection mode, the digital arithmetic circuit 281 outputs the tilt detection timing signal SEL2 to the tilt detection circuit 218, enables the tilt detection circuit 218 to operate, and outputs the element terminal switching signal SEL3 to the element terminal switching circuit 216. .. Based on the element terminal switching signal SEL3, the element terminal switching circuit 216 includes the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, and the fourth drive electrode 16 of the vibrating element 6, and the tilt detection circuit 218. Is connected via the DS terminal and the DG terminal, and similarly, the first detection electrode 11 and the second detection electrode 12 of the vibration element 6 and the tilt detection circuit 218 are connected via the S1 terminal and the S2 terminal. As a result, the DS terminal, DG terminal, S1 terminal, and S2 terminal are switched.

In this way, in the tilt detection mode, the tilt detection circuit 218 has the first drive electrode 13, the second drive electrode 14, and the third drive electrode 13 of the vibrating element 6 via the DS terminal, the DG terminal, the S1 terminal, and the S2 terminal. It is connected to the drive electrode 15, the fourth drive electrode 16, the first detection electrode 11, and the second detection electrode 12. Further, the tilt detection circuit 218 has a first substrate electrode 431, a second substrate electrode 441, a third substrate electrode 451 and a third substrate electrode 431 provided on the support substrate 4 via the DST terminal, the DGT terminal, the S1T terminal, and the S2T terminal. It is connected to the 4th substrate electrode 461, the 5th substrate electrode 471, and the 6th substrate electrode 481.

The tilt detection circuit 218 is provided on the support substrate 4 so as to face the first detection electrode 11 provided on the vibrating element 6 and the first detection electrode 11 via the S1 terminal and the S1T terminal. A first detection electrode is applied by applying a voltage between the substrate electrode 431 and measuring the charge Q3 charged in the first detection electrode 11 and the charge Q7 charged in the first substrate electrode 431, respectively. The first capacitance C11 formed between the 11 and the first substrate electrode 431 can be detected.

Similarly, the tilt detection circuit 218 is provided on the support substrate 4 so as to face the second detection electrode 12 provided on the vibrating element 6 and the second detection electrode 12 via the S2 terminal and the S2T terminal. By applying a voltage between the second substrate electrode 441 and measuring the charges Q4 and Q8 charged in the second detection electrode 12 and the second substrate electrode 441, respectively, the second detection electrode 12 and the second detection electrode 12 The second capacitance C12 between the second substrate electrode 441 and the second substrate electrode 441 can be detected.

Similarly, the tilt detection circuit 218 has a first drive electrode 13, a second drive electrode 14, a third drive electrode 15, and a fourth drive via the DS terminal, the DG terminal, the DST terminal, and the DGT terminal. A voltage is applied between the electrode 16 and the third substrate electrode 451, the fourth substrate electrode 461, the fifth substrate electrode 471, and the sixth substrate electrode 481 arranged to face each drive electrode, respectively. By measuring the charges Q1, Q2, Q5 and Q6 charged in the electrodes of No. 1, the capacitances C13, C14, C15 and C16 between the opposite drive electrodes and the substrate electrodes can be detected.

The tilt detection circuit 218 is based on the data describing the correlation between the capacitance between the electrodes, the capacitance between the electrodes stored in the storage unit 210, and the tilt of the vibrating element 6. The inclination of the 6 with respect to the support substrate 4 is calculated, a digital signal VTO which is an inclination value corresponding to the magnitude of the inclination of the vibrating element 6 with respect to the support substrate 4 is generated, and is output to the digital arithmetic circuit 281.

The digital arithmetic circuit 281 detects an abnormality in the inclination of the vibrating element 6 stored in the storage unit 210 with respect to the support substrate 4 and the digital signal VTO, which is an inclination value according to the magnitude of the inclination of the vibrating element 6 with respect to the support substrate 4. It has a function as an arithmetic circuit for determining an abnormality in inclination of the vibrating element 6 with respect to the support substrate 4 based on a comparison with an abnormal inclination value for determination. When the inclination of the vibrating element 6 with respect to the support substrate 4 is abnormal, the digital arithmetic circuit 281 transmits an abnormality notification signal ERR, which is a signal indicating that the inclination of the vibrating element 6 with respect to the support substrate 4 is abnormal, to the interface circuit 282. Output.

The interface circuit 282 reads data stored in the storage unit 210 in response to a request from the MCU (Micro Control Unit) 300, which is an external device of the vibration device 1, and outputs the data to the MCU 300, or is input from the MCU 300. Performs processing such as writing data to the storage unit 210. The selection signal, clock signal, and data signal transmitted from the MCU 300 are input via the SS terminal, SCLK terminal, and SI terminal of the circuit element 3, respectively. Further, the interface circuit 282 transmits data signals such as a digital signal VDO according to the magnitude of the angular velocity component and an abnormality notification signal ERR indicating that the inclination of the vibrating element 6 is abnormal to the MCU 300 via the SO terminal of the circuit element. Output to.

Next, the procedure for measuring the angular velocity of the vibration device 1 will be described with reference to FIG.
As shown in FIG. 12, for example, when the vibration device 1 is activated, the inclination of the vibration element 6 with respect to the support substrate 4 is measured in step S101. In the present embodiment, both the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane and the inclination θ2 due to the rotation around the Y axis in the XZ plane are measured.

In step S102, the inclinations θ1 and θ2 of the vibrating element 6 are compared with the inclination abnormality value D1 which is a reference for determining the abnormality of the inclination of the vibrating element 6 with respect to the support substrate 4. The tilt abnormal value D1 is an angle indicating that the tilt of the vibrating element 6 is abnormal when the absolute value of the tilt θ1 and θ2 of the vibrating element 6 is larger than the tilt abnormal value D1. °. If the absolute values of both the inclination θ1 of the vibrating element 6 and the inclination θ2 of the vibrating element 6 are larger than the inclination abnormality value D1, the process proceeds to step S103 to notify the abnormality of the vibration device 1.

In the present embodiment, when the absolute values of both the inclinations θ1 and θ2 of the vibration element 6 are larger than the inclination abnormality value D1, it is determined that the inclination of the vibration element 6 is abnormal. When the absolute value of either the inclination θ1 or the inclination θ2 of the vibrating element 6 is larger than the inclination abnormality value D1, the abnormality of the inclination of the vibration device 1 may be notified. Further, only one of the inclinations θ1 and θ2 of the vibrating element 6 may be compared with the inclination abnormality value D1. Further, the inclination abnormality value D1 for determining the abnormality of the inclination θ1 of the vibrating element 6 or the inclination θ2 of the vibrating element 6 may be set to different angles with respect to the inclinations θ1 and θ2 of the vibrating element 6.

In step S102, if the absolute values of both the inclination θ1 of the vibrating element 6 and the inclination θ2 of the vibrating element 6 are equal to or less than the inclination abnormality value D1, the process proceeds to step S104 and the angular velocity ωz is measured.

Next, the process proceeds to step S105, and it is determined whether or not there is an impact on the vibrating device 1. The angular velocity upper limit value G1 which is a reference for determining the presence or absence of an impact on the vibrating device 1 is compared with the angular velocity ωz measured in step S102. When the angular velocity ωz measured in step S102 is larger than the angular velocity upper limit value G1, it is determined that there was an impact on the vibrating device 1, that is, the holding posture of the vibrating element 6 changes due to the impact on the vibrating device 1, and the vibrating element Since the inclination of 6 with respect to the support substrate 4 may have changed, the process proceeds to step S101 to measure the inclination of the vibrating element 6.

In step S105, if the angular velocity ωz measured in step S104 is equal to or less than the angular velocity upper limit value G1, the process proceeds to step S106, and the angular velocity ωz measured in step S104 is output.

After outputting the angular velocity ωz in step S106, the process proceeds to step S104, the angular velocity ωz is measured, and the above-mentioned procedure is repeated thereafter. By measuring the angular velocity ωz by such a procedure, the angular velocity ωz can be measured in a state where the inclination of the vibrating element 6 is small, that is, the decrease in sensitivity of the vibrating device 1 is small. Further, when the inclination of the vibrating element 6 is large, that is, when the sensitivity of the vibrating device 1 is greatly reduced, the abnormality of the vibrating device 1 can be notified, so that the vibrating device 1 which is highly convenient for the user can be obtained. ..

As described above, according to the present embodiment, the following effects can be obtained. The tilt detection circuit 218 vibrates with the detection electrodes 11, 12, and the drive electrodes 13, 14, 15, 16 provided on the detection arms 33, 34 and the drive arms 35, 36, 37, 38 of the vibrating element 6, respectively. At least one of the detection electrodes 11, 12 and the drive electrodes 13, 14, 15, 16 provided on the base 41 of the support substrate 4 in a plan view seen from the Z direction, which is the thickness direction of the element 6. At least one of the capacitances C11, C12, C13, C15, and C16 between the substrate electrodes 431,441,451,461,471,481 arranged at the overlapping positions of the portions. Based on this, the tilt of the vibrating element 6 can be detected. By detecting the inclination of the vibrating element 6 in this way, it is possible to grasp the change in the holding posture of the vibrating element 6. As a result, it is possible to avoid the measurement of the angular velocity ωz in a state where the angular velocity detection sensitivity is lowered due to the change in the holding posture of the vibrating element 6, and it is possible to obtain the vibration device 1 capable of measuring the angular velocity ωz with high accuracy.

2. 2. Embodiment 2
Next, the vibration device 1a according to the second embodiment will be described with reference to FIGS. 13 and 14. In the following description, the differences from the above-described first embodiment will be mainly described, and the same components as those in the first embodiment are designated by the same reference numerals and duplicated description will be omitted.

The vibration device 1a according to the present embodiment is different from the vibration device 1 according to the first embodiment in that the angular velocity detection sensitivity of the vibration element 6 is corrected according to the inclination of the vibration element 6 with respect to the support substrate 4. Specifically, when the inclination of the vibrating element 6 with respect to the support substrate 4 becomes large, the angular velocity detection sensitivity decreases, and the angular velocity ωz output by the vibrating device 1a is smaller than the true angular velocity ωz actually applied to the vibrating device 1a. Therefore, in the present embodiment, the digital arithmetic circuit 281a is based on the data describing the correlation between the inclination of the vibrating element 6 with respect to the support substrate 4 stored in the storage unit 210a and the angular velocity detection sensitivity of the vibrating element 6. Corrects the angular velocity detection sensitivity of the vibrating element 6.

As shown in FIG. 13, the vibration device 1a has a circuit element 3a including a data processing circuit 208a including a digital calculation circuit 281a and a storage unit 210a, and the storage unit 210a is used in the digital calculation circuit 281a. A correlation table, which is data describing the correlation between the inclination of the vibrating element 6 with respect to the support substrate 4 and the angular velocity detection sensitivity of the vibrating element 6, is stored.

In the tilt detection mode, the digital arithmetic circuit 281a is stored in the storage unit 210a and the digital signal VTO which is the tilt value according to the magnitude of the tilt of the vibrating element 6 output from the tilt detection circuit 218 with respect to the support substrate 4. The angular velocity detection sensitivity is corrected based on the correlation table which is the data describing the correlation between the inclination of the vibrating element 6 with respect to the support substrate 4 and the angular velocity detection sensitivity of the vibrating element 6.

In the present embodiment, the angular velocity detection sensitivity corresponds to a correction coefficient for amplifying the digital signal VDO, and correcting the angular velocity detection sensitivity is a correction coefficient according to the magnitude of the inclination of the vibrating element 6 with respect to the support substrate 4. Is set, and the correction coefficient is 1 when the support substrate 4 of the vibrating element 6 is not tilted. The method for correcting the angular velocity detection sensitivity is not limited to this, and other methods may be used.

Further, the digital calculation circuit 281a is a vibration element 6 with respect to the digital signal VDO corresponding to the magnitude of the angular velocity component output from the angular velocity detection circuit 206 in the angular velocity detection mode for the vibration device 1a to detect the angular velocity ωz. A predetermined arithmetic process including a sensitivity correction according to the magnitude of the inclination with respect to the support substrate 4 is performed, and the digital data VO obtained by the arithmetic process is output as an angular velocity ωz.

In the present embodiment, the sensitivity correction according to the magnitude of the inclination of the vibrating element 6 with respect to the support substrate 4 is the correction according to the magnitude of the inclination of the vibrating element 6 in the digital signal VDO output from the angular velocity detection circuit 206. Multiplying the coefficients to amplify the digital signal VDO. The method of sensitivity correction according to the magnitude of the inclination of the vibrating element 6 is not limited to this, and other methods may be used.

Further, in the present embodiment, the correlation table is used as the data describing the correlation between the inclination of the vibrating element 6 with respect to the support substrate 4 stored in the storage unit 210a and the angular velocity detection sensitivity of the vibrating element 6. , Data other than the correlation table, for example, a calculation formula describing the correlation between the inclination of the vibrating element 6 with respect to the support substrate 4 and the angular velocity detection sensitivity of the vibrating element 6 may be used.

Next, the procedure for measuring the angular velocity of the vibration device 1a will be described with reference to FIG. The angular velocity measuring procedure of the vibrating device 1a according to the present embodiment is different from the angular velocity measuring procedure of the vibrating device 1 according to the first embodiment, and further, the angular velocity of the vibrating element 6 is detected according to the inclination of the vibrating element 6 with respect to the support substrate 4. It differs in that it corrects the sensitivity.

As shown in FIG. 14, for example, when the vibration device 1a is activated, the inclination of the vibration element 6 with respect to the support substrate 4 is measured in step S201. In the present embodiment, both the inclination θ1 due to the rotation of the vibrating element 6 around the X axis in the YZ plane and the inclination θ2 due to the rotation around the Y axis in the XZ plane are measured.

In step S202, the inclinations θ1 and θ2 of the vibrating element 6 are compared with the inclination abnormality value D1 which is a reference for determining the abnormality of the inclination of the vibrating element 6 with respect to the support substrate 4. If the absolute values of both the inclination θ1 of the vibrating element 6 and the inclination θ2 of the vibrating element 6 are larger than the inclination abnormality value D1, the process proceeds to step S203 to notify the abnormality of the vibration device 1a.

In step S202, if the absolute values of both the inclination θ1 of the vibrating element 6 and the inclination θ2 of the vibrating element 6 are equal to or less than the abnormal inclination value D1, the process proceeds to step S204, and vibration is performed based on the inclinations θ1 and θ2 of the vibrating element 6. The angular velocity detection sensitivity of the element 6 is corrected. In the present embodiment, the angular velocity detection sensitivity is corrected by using both the inclination θ1 and θ2 of the vibrating element 6, but either the inclination θ1 of the vibrating element 6 or the inclination θ2 of the vibrating element 6 is used. The angular velocity detection sensitivity may be corrected.

Next, the process proceeds to step S205, and the angular velocity ωz is measured.

After measuring the angular velocity ωz, the process proceeds to step S206 to determine whether or not there is an impact on the vibrating device 1. When the angular velocity ωz is equal to or less than the angular velocity upper limit value G1, the process proceeds to step S207, and the angular velocity ωz measured in step S205 is output.

After outputting the angular velocity ωz in step S207, the process proceeds to step S205, the angular velocity ωz is measured, and the above-mentioned procedure is repeated thereafter.

As described above, according to the present embodiment, the following effects can be obtained in addition to the effects in the first embodiment. Based on the correlation table showing the correlation between the tilts θ1 and θ2 of the vibrating element 6 with respect to the support substrate 4 and the velocity detection sensitivity of the vibrating element 6, the tilts θ1 and θ2 of the vibrating element 6 detected by the tilt detection circuit 218 are met. By correcting the angular velocity detection sensitivity of the vibration element 6, it is possible to obtain a vibration device 1a capable of measuring the angular velocity ωz with high accuracy.

3. 3. Embodiment 3
Next, the vibration device 1b according to the third embodiment will be described with reference to FIGS. 15 to 17. In the following description, the differences from the above-described first embodiment will be mainly described, and the same components as those in the first embodiment are designated by the same reference numerals and duplicated description will be omitted.

The vibration device 1b according to the present embodiment is different from the vibration device 1 according to the first embodiment in that it does not have a support substrate 4 and the package 2 also serves as a support substrate 4. Specifically, the base 21 of the package 2 corresponds to the base 41 of the support substrate 4.

As shown in FIGS. 15 to 17, a plurality of internal terminals 241, a first substrate electrode 431b, a second substrate electrode 441b, and a third substrate are formed on the bottom surface of the recess 211a that opens on the upper surface of the base 21 of the package 2. Electrodes 451b, 4th substrate electrode 461b, 5th substrate electrode 471b, 6th substrate electrode 481b, electrode pads 51b, 52b, 53b, 54b, wiring 511b, 521b, 531b, 532b, 541b, 542b, Is placed.

The first substrate electrode 431b, the second substrate electrode 441b, the third substrate electrode 451b, the fourth substrate electrode 461b, the fifth substrate electrode 471b, and the sixth substrate electrode 481b are wired 511b, 521b, 531b, respectively. It is connected to the electrode pads 51b, 52b, 53b, 54b via 532b, 541b, 542b. The electrode pads 51b, 52b, 53b, 54b are electrically connected to the circuit element 3 via wiring and internal terminals 242 (not shown) formed in the base 21. In this way, the first substrate electrode 431b, the second substrate electrode 441b, the third substrate electrode 451b, the fourth substrate electrode 461b, the fifth substrate electrode 471b, and the sixth substrate electrode 481b are electrically connected to the circuit element 3. Has been done.

The plurality of leads 42 are fixed to the bottom surface of the recess 211a by the joining member B1, and the leads 42 and the internal terminal 241 are electrically connected via the joining member B1. The internal terminal 241 is electrically connected to the circuit element 3 via a wiring (not shown) formed in the base 21 and an internal terminal 242.

In this way, the vibrating element 6 is bonded and fixed to the base 21 of the package 2 via the plurality of leads 42, and further, the first substrate electrode 431b and the second substrate electrode 441b are attached to the base 21 of the package 2. , The first detection electrode 11 and the second detection provided in the vibration element 6 by providing the third substrate electrode 451b, the fourth substrate electrode 461b, the fifth substrate electrode 471b, and the sixth substrate electrode 481b. At positions facing the electrodes 12, the first drive electrode 13, the second drive electrode 14, the third drive electrode 15, the fourth drive electrode 16, the detection electrodes 11, 12 and the drive electrodes 13, 14, 15, 16 respectively. The electrostatic capacitance formed between the substrate electrodes 431b, 441b, 451b, 461b, 471b, 481b provided in the arranged package 2 is detected, and the inclination of the vibrating element 6 is detected based on the electrostatic capacitance. be able to.

As described above, according to the present embodiment, the following effects can be obtained in addition to the effects in the first embodiment. The inclination of the vibrating element 6 is detected by supporting the vibrating element 6 using the package 2 without using the supporting substrate 4, and further providing the substrate electrodes 431b, 441b, 451b, 461b, 471b, 481b on the package 2. Therefore, it is possible to obtain a vibration device 1b having a small number of parts and a reduced manufacturing cost.

The vibration devices 1 to 1b described above can be applied to control an electronic device such as a smartphone or a moving body such as an automobile as an angular velocity sensor, for example.

1,1a, 1b ... Vibration device, 2 ... Package, 3,3a ... Circuit element, 4 ... Support substrate, 6 ... Vibration element, 11 ... First detection electrode, 12 ... Second detection electrode, 13 ... First drive electrode , 14 ... 2nd drive electrode, 15 ... 3rd drive electrode, 16 ... 4th drive electrode, 21 ... base, 22 ... lid, 23 ... joining member, 30 ... vibration element piece, 31 ... element base, 33 ... 1 detection arm, 34 ... second detection arm, 35 ... first drive arm, 36 ... second drive arm, 37 ... third drive arm, 38 ... fourth drive arm, 41 ... base, 42 ... lead, 111 ... first 1 Detection signal electrode, 112 ... 1st detection ground electrode, 121 ... 2nd detection signal electrode, 122 ... 2nd detection ground electrode, 131 ... Drive signal electrode, 132 ... Drive ground electrode, 202 ... Reference voltage circuit, 204 ... Drive Circuit, 206 ... angular velocity detection circuit, 208, 208a ... data processing circuit, 210, 210a ... storage unit, 212 ... oscillation circuit, 214 ... clock signal generation circuit, 216 ... element switching circuit, 218 ... tilt detection circuit, 281,281a ... Digital arithmetic circuit, 282 ... Interface circuit, 300 ... MCU, 311, 312 ... Connecting arm, 331, 341, 351, 361, 371, 381 ... Wide part, 431, 431b ... First substrate electrode, 441, 441b ... First 2 substrate electrodes, 451 and 451b ... 3rd substrate electrodes, 461,461b ... 4th substrate electrodes, 471,471b ... 5th substrate electrodes, 481,481b ... 6th substrate electrodes, B1 ... bonding members, B2 ... bonding members, C11 ... 1st capacitance, C12 ... 2nd capacitance, C13 ... 3rd capacitance, C14 ... 4th capacitance, C15 ... 5th capacitance, C16 ... 6th capacitance, d11, d12, d31, d32 ... distance, D1 ... tilt abnormal value, G1 ... angular speed upper limit value, DSS ... drive signal, DGS ... oscillation current, S1S ... first detection signal, S2S ... second detection signal, SEL1 ... angular speed detection timing signal , SEL2 ... Tilt detection timing signal, SEL3 ... Element terminal switching signal, θ1, θ2 ... Tilt.

Claims (11)

A vibrating element that detects and vibrates according to the angular velocity with the axis along the thickness direction as the detection axis,
A support substrate which is arranged so as to face the vibrating element and the vibrating element in the thickness direction and supports the vibrating element, and a support substrate.
It has a tilt detection circuit for detecting the tilt of the vibrating element with respect to the support substrate.
The vibrating element is
A first drive arm provided with a first drive electrode and driven and vibrated by applying a drive signal to the first drive electrode,
A second drive arm provided with a second drive electrode and driven and vibrated by applying a drive signal to the second drive electrode,
A first detection arm provided with a first detection electrode, and a first detection signal is output from the first detection electrode by detecting and vibrating according to the angular velocity.
It has a second detection electrode, and has a second detection arm, which outputs a second detection signal from the second detection electrode by detecting and vibrating according to the angular velocity.
The support substrate is
At the base,
A position provided on the base portion and at least partially overlapping with any one of the first drive electrode, the second drive electrode, the first detection electrode, and the second detection electrode in a plan view from the thickness direction. Has a first substrate electrode located in
The tilt detection circuit is
The first substrate electrode and one of the first drive electrode, the second drive electrode, the first detection electrode, and the second detection electrode arranged at a position overlapping with the first substrate electrode. Detects the first capacitance between
The inclination of the vibrating element is detected based on the first capacitance.
Vibration device. When the three axes orthogonal to each other are the A axis, the B axis, and the C axis, which is the detection axis,
The vibrating element is
The element base bonded to the support substrate and
The first detection arm and the second detection arm extending from the element base to the opposite sides in the direction along the B axis, respectively.
A pair of connecting arms extending from the element base to the opposite sides in the direction along the A axis,
The first drive arm and the third drive arm extending from the tip of one of the connecting arms to the opposite sides in the direction along the B axis, respectively.
It has the second driving arm and the fourth driving arm extending from the tip end portion of the other connecting arm to the opposite sides in the direction along the B axis, respectively.
The element base is fixed to the support substrate via a joining member.
The vibration device according to claim 1. The support substrate is
The first substrate electrode arranged at a position where at least a part of the first driving electrode overlaps with the first driving electrode in a plan view from the thickness direction.
It has a second substrate electrode provided at the base portion and arranged at a position where at least a part thereof overlaps with the second drive electrode in a plan view seen from the thickness direction.
The tilt detection circuit is
The first capacitance and the second capacitance between the second drive electrode and the second substrate electrode are detected.
The inclination of the vibrating element is detected based on the difference between the first capacitance and the second capacitance.
The vibration device according to claim 1 or 2. The third drive arm has a third drive electrode and has a third drive electrode.
The support substrate is
The first substrate electrode arranged at a position where at least a part of the first driving electrode overlaps with the first driving electrode in a plan view from the thickness direction.
A second substrate electrode provided at the base portion and arranged at a position where at least a part thereof overlaps with the second drive electrode in a plan view seen from the thickness direction.
A third substrate electrode provided on the base portion, at least a part thereof is arranged at a position overlapping with the third drive electrode in a plan view from the thickness direction, and is electrically connected to the first substrate electrode. Have,
The tilt detection circuit is
The second capacitance between the second drive electrode and the second substrate electrode,
The 7th capacitance, which is a combination of the 1st capacitance and the 3rd capacitance between the 3rd drive electrode and the 3rd substrate electrode, is detected.
The inclination of the vibrating element is detected based on the difference between the seventh capacitance and the second capacitance.
The vibration device according to claim 2. The third drive arm has a third drive electrode and has a third drive electrode.
The fourth drive arm has a fourth drive electrode and has a fourth drive electrode.
The support substrate is
The first substrate electrode arranged at a position where at least a part of the first driving electrode overlaps with the first driving electrode in a plan view from the thickness direction.
A second substrate electrode provided at the base portion and arranged at a position where at least a part thereof overlaps with the second drive electrode in a plan view seen from the thickness direction.
A third substrate electrode provided on the base portion, at least a part thereof is arranged at a position overlapping with the third drive electrode in a plan view from the thickness direction, and is electrically connected to the first substrate electrode.
A fourth substrate electrode provided on the base portion, at least a part thereof is arranged at a position overlapping with the fourth drive electrode in a plan view from the thickness direction, and is electrically connected to the second substrate electrode. Have,
The tilt detection circuit is
The seventh capacitance, which is a combination of the first capacitance and the third capacitance between the third drive electrode and the third substrate electrode,
The eighth static electricity is a combination of the second capacitance between the second drive electrode and the second substrate electrode and the fourth capacitance between the fourth drive electrode and the fourth substrate electrode. Detects the capacity and
The inclination of the vibrating element is detected based on the difference between the 7th capacitance and the 8th capacitance.
The vibration device according to claim 2. The support substrate is
The first substrate electrode arranged at a position where at least a part of the first detection electrode overlaps with the first detection electrode in a plan view from the thickness direction.
It has a second substrate electrode provided at the base portion and arranged at a position where at least a part thereof overlaps with the second detection electrode in a plan view seen from the thickness direction.
The tilt detection circuit is
The first capacitance and the second capacitance between the second drive electrode and the second substrate electrode are detected.
The inclination of the vibrating element is detected based on the difference between the first capacitance and the second capacitance.
The vibration device according to claim 1 or 2. The support substrate is
A fifth substrate electrode arranged at a position where at least a part of the first detection electrode overlaps with the first detection electrode in a plan view from the thickness direction.
It has a sixth substrate electrode provided at the base portion and arranged at a position where at least a part thereof overlaps with the second detection electrode in a plan view seen from the thickness direction.
The tilt detection circuit is
The fifth capacitance between the first detection electrode and the fifth substrate electrode and the sixth capacitance between the second detection electrode and the sixth substrate electrode were detected.
The inclination of the vibrating element is detected based on the difference between the fifth capacitance and the sixth capacitance.
The vibration device according to any one of claims 3 to 5. It has a package for accommodating the vibrating element, and the support substrate is fixed to the package.
The vibration device according to any one of claims 1 to 7. It has a package for accommodating the vibrating element, and the support substrate is the package.
The vibration device according to any one of claims 1 to 7. A storage unit that stores abnormal tilt values and
An arithmetic circuit for determining an abnormality in the inclination of the vibrating element by comparing the inclination value detected by the inclination detection circuit with the inclination abnormality value.
When the inclination of the vibrating element is abnormal, an interface circuit that outputs a signal indicating that the inclination of the vibrating element is abnormal to the outside and
To prepare
The vibration device according to any one of claims 1 to 9. A storage unit that stores a correlation table showing the correlation between the inclination of the vibrating element and the angular velocity detection sensitivity of the vibrating element is provided.
The angular velocity detection sensitivity is corrected based on the correlation table according to the inclination of the vibrating element detected by the inclination detection circuit.
The vibration device according to any one of claims 1 to 9.

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