JP2022046180A - Surface treatment device - Google Patents

Abstract

To reduce the restriction of a member conducting a power source part and a conductor layer.SOLUTION: A surface treatment device comprises: an electrode; a mounting base capable of mounting the object to be treated formed with a conductor layer on the surface; a housing arranged so as to face the mounting base and formable a liquid chamber at the inside; a solution feed part capable of feeding an electrolytic solution into the liquid chamber; an ion conductive film arranged between the liquid chamber and the mounting base; a foil-shaped member arranged between the ion conductive film and the object to be treated and having an insulator layer and an energization layer; and a power source part applying voltage to a space between the electrode and the conductive layer, and the foil-shaped member is arranged in such a manner that the energization layer is contactable to a part of the conductor layer.SELECTED DRAWING: Figure 1A

Description

The present invention relates to a surface treatment apparatus for treating the surface of an object to be treated.

When forming a circuit pattern made of a conductor on a base material made of an insulator, for example, a pattern is formed after forming a seed layer of a metal film on the surface of the base material, and the surface of the circuit pattern is plated. Is being done. The plating formed on the surface of the circuit pattern is formed by a physical vapor deposition (PVD) method such as sputtering, an electrolytic plating method, or a solid electrodeposition (SED) method. It has been known.

The formation of plating by the SED method includes, for example, an ion conductive film arranged between an anode and a resin member having a conductor pattern layer serving as a cathode with respect to the anode formed on the surface, and an anode and a conductor pattern layer. It is known that this is performed by a film forming apparatus provided with a power supply unit for applying a voltage between the two (see, for example, Patent Document 1).

In this film forming apparatus, metal ions are generated on the surface of the conductor pattern layer while the conductive member having through holes formed so as to conduct the negative electrode of the power supply unit and the conductor pattern layer in contact with a part of the conductor pattern layer. The contained ionic conductive membrane is brought into contact with the through hole. Then, by applying a voltage between the anode and the conductor pattern layer, metal ions are deposited on the surface of the conductor pattern layer to form plating on the conductor pattern layer.

Japanese Patent No. 6176234

In the conventional film forming apparatus disclosed in Patent Document 1, it is necessary to form the conductive member with a metal material that forms a passivation film in order to prevent plating from being formed on the conductive member. However, metal materials that form a passivation film, such as titanium, molybdenum, and tungsten, have high electrical resistance and make it difficult for electricity to flow, which may reduce current efficiency and cause non-uniform precipitation of metal ions. There is a problem. Further, when aluminum is used as the metal material for forming the passivation film, there is a problem that the chemical resistance may be inferior.

Further, in the conventional film forming apparatus disclosed in Patent Document 1, since it is necessary to form the conductive member in contact with the ion conductive film with a metal material for forming a passivation film, the material constituting the member is used. There is also the problem that it is difficult to expand the options.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a surface treatment apparatus capable of reducing restrictions on a member that conducts a power supply unit and a conductor layer.

In order to achieve the above object, the surface treatment apparatus according to the present invention is arranged so as to face the mounting base on which the object to be treated having the conductor layer formed on the surface can be mounted and the mounting base described above. , A housing capable of forming a liquid chamber inside, an electrode arranged in the housing, a solution supply unit capable of supplying an electrolytic solution into the liquid chamber, and between the liquid chamber and the above-mentioned pedestal. A voltage is applied between the arranged ionic conductive film, a foil-like member having an insulating layer and an energizing layer arranged between the ionic conductive film and the object to be processed, and the electrode and the conductor layer. The foil-like member includes a power supply unit, and the foil-like member is arranged so that the current-carrying layer can contact a part of the conductor layer so as to conduct the power supply unit and the conductor layer, and the insulating layer. Is arranged between the current-carrying layer and the ion-conducting film, the ion-conducting film is brought into contact with the surface of the conductor layer, and a voltage is applied between the electrode and the conductor layer connected to the current-carrying layer. Is applied, and the surface of the conductor layer is treated by electrolysis via the ion conductive film.

In the surface treatment apparatus according to the present invention, it is preferable that the electrode is arranged at a position of being immersed in the electrolytic solution in the liquid chamber.

In the surface treatment apparatus according to the present invention, the electrode is made of a metal cage-shaped member arranged in the liquid chamber, and a soluble metal may be arranged inside the cage-shaped member.

In the surface treatment apparatus according to the present invention, it is preferable that the foil-like member is formed by alternately laminating a plurality of the insulating layer and the energizing layer.

In the surface treatment apparatus according to the present invention, the foil-like member may be made of a flexible printed circuit board having the insulating layer and the energizing layer.

In the surface treatment apparatus according to the present invention, it is preferable to further include a release film material arranged between the ion conductive film and the foil-like member.

In the surface treatment apparatus according to the present invention, it is preferable that the surface of the foil-like member in contact with the ion conductive film is subjected to a mold release treatment.

In the surface treatment apparatus according to the present invention, the energizing layer of the foil-shaped member has a plurality of energizing patterns, and the power supply unit has at least one of an applied voltage, an applied current, and an applied time for each of the plurality of energizing patterns. It is preferable that one is configured to be controllable.

In the surface treatment apparatus according to the present invention, the insulating layer of the foil-like member has a through hole having a shape corresponding to the shape of the surface to be treated of the conductor layer, and the through hole is on the region to be treated. It is preferable that the portion other than the through hole is arranged so as to cover the non-treated region on the surface of the conductor layer.

In the surface treatment apparatus according to the present invention, the insulating layer of the foil-like member is formed between the current-carrying layer and the ion conductive film at least at a contact portion between the current-carrying layer and the conductor layer of the object to be treated. It is preferable that it is arranged.

In the surface treatment apparatus according to the present invention, it is preferable to further include the above-mentioned pedestal and the tilting mechanism capable of tilting the housing at a predetermined angle.

In the other surface treatment apparatus according to the present invention, a mounting base on which a material to be treated having a conductor layer formed on the surface can be placed and a mounting base on which the conductor layer is formed are arranged to face the above-mentioned mounting base, and a liquid chamber is provided inside. A housing capable of forming the above, an electrode arranged in the housing, a solution supply unit capable of supplying an electrolytic solution into the liquid chamber, and a foil-like member arranged between the liquid chamber and the object to be treated. And a power supply unit for applying a voltage between the electrode and the conductor layer, and the foil-shaped member has a through hole having a shape corresponding to the shape of the processed region on the surface of the conductor layer. The through hole is configured to be arranged on the area to be treated, and the electrolytic solution is brought into contact with the surface of the conductor layer through the through hole to be conducted with the electrode and the power supply unit. It is characterized in that a voltage is applied between the conductor layers and the surface of the conductor layer is treated by electrolysis.

In another surface treatment apparatus according to the present invention, the ion conductive film further provided between the housing and the above-mentioned pedestal and arranged on the liquid chamber side of the foil-like member is further provided. Is preferably brought into contact with the surface of the conductor layer through the through hole, and the surface of the conductor layer is treated by the electrolysis via the ion conductive film.

According to the present invention, it is possible to reduce the restriction of the member that conducts the power supply unit and the conductor layer.

It is a figure which shows the schematic structure in the mold open state of the surface treatment apparatus which concerns on one Embodiment of this invention. It is a figure which shows the schematic structure in the mold closed state of the surface treatment apparatus. It is a figure which shows the schematic structure in the inclined state of the surface treatment apparatus. It is sectional drawing for partially enlarging and roughly explaining the part near the conductor layer of the object to be processed in the surface treatment apparatus. It is a figure which shows schematic the 1st foil-like member and the object to be treated of the surface treatment apparatus. It is a figure which shows schematic the 1st foil-like member and the object to be treated of the surface treatment apparatus. It is a figure which shows schematic the 2nd foil-like member and the object to be treated of the surface treatment apparatus. It is a figure which shows schematic the 2nd foil-like member and the object to be treated of the surface treatment apparatus. It is a figure which shows typically the state in which the energizing layer of the 3rd foil-like member of the surface treatment apparatus and the 3rd foil-like member are superposed on the object to be treated. It is a figure which shows schematic the 4th foil-like member and the object to be treated of the surface treatment apparatus. It is a figure which shows roughly the surface-treated object to be treated with the top surface and the cross section. It is a top view which shows schematic the 5th foil-like member of the surface treatment apparatus. It is a figure which shows schematic the 5th foil-like member and the object to be treated of the surface treatment apparatus.

Hereinafter, the surface treatment apparatus according to the embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, the following embodiments do not limit the invention according to each claim, and not all combinations of features described in the embodiments are essential for the means for solving the invention. .. In this embodiment, the scale and dimensions of each component may be exaggerated or some components may be omitted. Further, although not given a reference numeral, the portion indicated by a white circle in the figure represents a main sealing member such as an O-ring.

1A to 1C are diagrams showing a schematic configuration of a surface treatment apparatus 1 according to an embodiment of the present invention. Further, FIG. 2 is a cross-sectional view for schematically enlarging a portion of the surface treatment apparatus 1 in the vicinity of the conductor layer D of the object C to be treated.

As shown in FIGS. 1A to 1C, in the surface treatment apparatus 1 according to the present embodiment, for example, a metal is precipitated by reducing metal ions, and a film made of metal is formed on the conductor layer D of the object to be treated C. It can be used as a plating treatment device formed on the surface E. However, the surface treatment device 1 is not limited to this, and can be applied to various devices as long as it can treat the surface E of the conductor layer D of the object to be treated C.

The surface treatment device 1 is roughly arranged so as to face the mounting base 2 on which the object to be processed C can be placed and the mounting base 2, and the liquid chamber (closed space, closed space) is inside. ) 3 is provided with a housing 4 and the like. Further, the surface treatment device 1 includes a moving mechanism 5 that moves at least one of the mounting base 2 and the housing 4 relative to the other, and a solution supply unit that supplies or discharges the electrolytic solution into the liquid chamber 3 (not shown). ) And. In this embodiment, a metal solution containing metal ions can be used as the electrolytic solution.

Further, the surface treatment apparatus 1 covers the object C to be treated, and in order to separate the electrolytic solution from the ion conductive film 6, the ion conduction film 6 arranged between the housing 4 and the mounting base 2 and the ion conduction thereof. A foil-like member 10 arranged between the film 6 and the object C to be treated is provided. Further, the surface treatment apparatus 1 has a metal cage-shaped member 20 as an electrode (anode in this embodiment) arranged in the liquid chamber 3, and a object to be treated as a cathode with respect to the cage-shaped member 20 and the anode. A power supply unit 7 for applying a voltage between the object C and the conductor layer D is provided.

The mounting base 2 is arranged between the support base 8 and the housing 4, and is configured so that the object C to be processed can be mounted on the surface thereof. In the present embodiment, the mounting base 2 has a tray 9b into which the object to be processed C can be fitted, and has a recess in which the tray 9b can be fitted. It may be a configuration in which the object to be processed C is fitted without intervention, or a configuration in which the object to be processed C is simply placed. The housing 4 is arranged to face the mounting base 2 as described above, and is placed between the housing 4 and the mounting base 2 when, for example, the housing 4 is moved to the mounting base 2 side by the moving mechanism 5. The liquid chamber 3 which is a closed space can be formed.

The mounting base 2 is, for example, an exhaust flow path 9 and an exhaust port 9a that are opened on the upper surface of the mounting base 2 and communicate with the outside through the inside of the mounting base 2, and an exhaust pump (for example, not shown). , Vacuum pump), and by operating the exhaust pump when the ion conductive film 6 is separated, the object C to be processed is placed on the mounting base 2 (tray 9b when the tray 9b is provided). It is configured to be adsorbed and held.

The housing 4 is formed with a discharge flow path 31 capable of discharging the gas in the liquid chamber 3 and a supply flow path 41 capable of supplying the electrolytic solution to the liquid chamber 3. Further, the housing 4 is formed, for example, as an on-off valve connected to the discharge flow path 31 to open and close the opening / closing valve, and when the on-off valve is closed between the mounting base 2 and the housing 4. A pressurizing mechanism 30 with an on-off valve is provided, which reduces the volume of the closed space of the liquid chamber 3 and also functions as a pressurizing mechanism for pressurizing the inside of the closed space.

Further, the housing 4 is provided with a flow path on-off valve 40 for opening and closing the supply flow path 41. The opening of the discharge flow path 31 facing the liquid chamber 3 is formed, for example, above the opening of the supply flow path 41 facing the liquid chamber 3 in the vertical direction. More specifically, the housing 4 is arranged above the mounting base 2 in the vertical direction, and has a bottomed cylindrical shape (bottomed cylindrical shape, which constitutes a liquid chamber 3 having an inner upper surface and an inner side surface). The opening facing the liquid chamber 3 of the discharge flow path 31 is formed in a bottomed square cylinder or the like) on the inner upper surface or the upper part of the inner side surface of the housing 4.

Further, the opening of the supply flow path 41 facing the liquid chamber 3 is formed at an arbitrary position such as the lower part of the inner side surface of the housing 4. Further, the inner upper surface of the housing 4 is inclined with respect to the vertical direction and is inclined along the horizontal direction so that the opening of the discharge flow path 31 is at the uppermost portion.

The pressurizing mechanism 30 with an on-off valve is configured to be able to open and close the discharge flow path 31 and to pressurize the electrolytic solution supplied into the liquid chamber 3. The pressurizing mechanism 30 with an on-off valve is mounted on the outer wall surface of the discharge flow path 31 formed through the wall surface of the housing 4, and faces the flow path on-off valve 40 at a position facing the vertical center of the housing 4. (Including diagonal positions), it is provided so as to project from the side surface of the housing 4. The pressurizing mechanism 30 with an on-off valve closes the on-off valve and then reduces the volume in the liquid chamber 3 to pressurize the electrolytic solution in the liquid chamber 3.

In this way, a supply flow path 41 having an opening is formed at the lowermost portion of the inner side surface of the housing 4, and the flow path on-off valve 40 is connected to the supply flow path 41. Further, a discharge flow path 31 having an opening is formed at the uppermost portion of the inner side surface (preferably facing inner side surface) of the housing 4, and the pressure mechanism 30 with an on-off valve is connected to the discharge flow path 31. ..

Here, "opposing" means that the supply flow path 41 is arranged at a position symmetrical with respect to the central axis of the housing 4 in the discharge flow path 31 and the housing 4. When the supply flow path 41 is configured to face the discharge flow path 31, the electrolytic solution and air can be smoothly injected and discharged into the liquid chamber 3 of the housing 4.

In the present embodiment, the opening of the discharge flow path 31 and the opening of the supply flow path 41 face each other, that is, have a positional relationship of 180 ° with respect to the central axis, but the present invention is not limited to this. It is preferable that the opening of the discharge flow path 31 is located at the uppermost portion of the inner upper surface of the liquid chamber 3 of the housing 4, and it is preferable that the opening of the supply flow path 41 is located at a position in contact with the lowermost portion of the mounting base 2. ..

Further, in the present embodiment, as the on-off valve, a pressurizing mechanism 30 with an on-off valve and a flow path on-off valve 40 are provided, and these are provided in each of the flow paths of the housing 4. In the present embodiment, as described above, the supply flow path 41 is provided at the lowermost part inside the housing 4, and the discharge flow path 31 is provided at the uppermost part inside the housing 4, so that the electrolytic solution is stored in the liquid chamber of the housing 4. It can be circulated in 3 without stagnation, and the electrolytic solution can be easily removed from the supply flow path 41.

In the present embodiment, in the housing 4 in which the inner upper surface of the liquid chamber 3 is inclined, the supply flow path 41 is provided near the place where the inner upper surface is the lowest, and the discharge flow path 31 is the place where the inner upper surface is the highest. Since it is provided in the vicinity, bubbles such as air are easily collected and exhausted in the direction of the discharge flow path 31 when the inside of the liquid chamber 3 is filled with the electrolytic solution, and the discharge flow is discharged when the electrolytic solution is discharged from the inside of the liquid chamber 3. By allowing air to flow in from the path 31, the electrolytic solution is collected in the direction of the supply flow path 41 and is easily drained.

In the present embodiment, the inlet, that is, the passage of the opening when the electrolytic solution in the liquid chamber 3 passes through the supply flow path 41 and is discharged to the outside is horizontal and narrow (for example, the supply flow path). A fan-shaped opening with a height of about 2 mm that extends toward the center of the housing 4 centered on 41). After that, the passage goes up vertically and becomes horizontal again in the flow path on-off valve 40, and then the passage goes up vertically again and is discharged to the outside from the supply / discharge port 45. According to the present embodiment, since the opening of the supply flow path 41 is provided facing the mounting base 2, it has a structure in which the electrolytic solution is unlikely to remain when the electrolytic solution is discharged.

The pressurizing mechanism 30 with an on-off valve is a hollow opening / closing adjusting chamber and pressurizing chamber, and is provided with a spool 32 that is slidable and slidable on the inner wall surface. A closing operation port 33, an opening operation port 34, and a supply / discharge port 35 are provided. Each of the ports 33, 34, and 35 is a through hole from the outside of the pressurizing mechanism 30 with an on-off valve to the internal opening / closing adjusting chamber and pressurizing chamber, and the supply / discharge port 35 is directly connected to the discharge flow path 31 of the housing 4. Is connected. The pressurizing mechanism 30 with an on-off valve is provided in the housing 4 by fitting the end portion of the supply / discharge port 35 including the tip on the flow path side into the wall surface (outer side surface) of the housing 4.

The flow path on-off valve 40 is mounted on the outer wall surface of the supply flow path 41, and is provided at a position facing the pressurizing mechanism 30 with an on-off valve so as to project from the side surface of the housing 4. The flow path on-off valve 40 is provided with a spool 42 having a solid structure that is slidable in sliding contact with the inner wall surface in a hollow opening / closing adjustment chamber, and the closing operation port 43 is opened from the outside to the inside (liquid chamber 3 side). An operation port 44 and a supply / discharge port 45 are provided. Each of the ports 43, 44, 45 is a through hole from the outside of the flow path on-off valve 40 to the internal open / close adjustment chamber, and the supply / discharge port 45 is directly connected to the supply flow path 41 of the housing 4. The flow path on-off valve 40 is provided in the housing 4 by fitting the end portion of the supply / discharge port 45 including the tip on the flow path side into the wall surface (outer side surface) of the housing 4.

In the pressurizing mechanism 30 with an on-off valve and the flow path on-off valve 40, each of the spools 32 and 42 is made of, for example, a solid piston-shaped member. When the base ends of the spools 32 and 42 are located at the positions of the closing operation ports 33 and 43, the supply / discharge port 35 is connected to the discharge flow path 31 and the supply / discharge port 45 is connected to the supply flow path 41. .. When the base end portions of the spools 32 and 42 are located at the positions of the opening operation ports 34 and 44, the discharge flow path 31 and the supply flow path 41 are in a closed state. The pressurizing mechanism 30 with an on-off valve and the flow path on-off valve 40 are installed between the housing 4 and an external liquid control system including a solution supply unit that supplies an electrolytic solution.

The opening / closing adjustment chamber and pressurizing chamber of the pressurizing mechanism 30 with an on-off valve have a larger diameter than the opening / closing adjusting chamber of the flow path on-off valve 40. Therefore, the spool 32 is made of a piston-shaped member having a diameter larger than that of the spool 42. The pressurizing mechanism 30 with an on-off valve is configured so that its operating pressure can be controlled, whereby the pressure in the liquid chamber 3 can be easily and stably changed. That is, a pressure sensor (not shown) capable of monitoring the pressure in the liquid chamber 3 is installed inside the housing 4, and is supplied to the closing operation port 33 based on the measured value of the pressure sensor. It is configured so that the pressure of the working air can be feedback controlled. With this configuration, the operating pressure of the pressurizing mechanism 30 with an on-off valve and the pressure in the liquid chamber 3 can be controlled more accurately.

As shown in FIG. 1C, the moving mechanism 5 approaches or separates at least one of the mounting base 2 and the housing 4 (housing 4 in this example) from the other (mounting base 2 in this example). Move relative to. As a result, the liquid chamber 3 formed between the mounting base 2 and the housing 4 can be opened and closed.

In the present embodiment, the moving mechanism 5 is configured to separate or approach the housing 4 by moving the housing 4 up and down with respect to the mounting base 2 by the linear motion rod 51. The moving mechanism 5 is configured to be able to execute position control and pressure control of the housing 4 with respect to the mounting base 2. Specifically, the moving mechanism 5 is a liquid between the rising end position where the housing 4 is most separated from the mounting base 2 (original position: see FIG. 1A) and the housing 4 and the mounting base 2. A decompression position for forming the chamber 3 and performing depressurization of the lower space formed by fitting the mounting base 2 and the lower clamp portion 39 under the liquid chamber 3 and the ion conductive film 6 and the decompression position. The housing 4 can be stopped at at least three positions (see FIG. 1B) where the surface treatment is performed by bringing the housing 4 closer to the mounting base 2 than the decompression position. .. Further, the moving mechanism 5 is configured to press the housing 4 against the mounting base 2 at the processing position with a force equal to or greater than canceling the internal pressure of the liquid chamber 3. However, the moving mechanism 5 is not limited to the configuration including the linear motion rod 51 described above, and any configuration can be adopted as long as the housing 4 can be separated or brought close to the mounting base 2. can do.

Further, as shown in FIG. 1C, the surface treatment device 1 according to the present embodiment is provided with an inclination mechanism 50 for inclining the mounting base 2 and the housing 4 at a predetermined angle (for example, 2 °). There is. In the present embodiment, the tilting mechanism 50 is configured to tilt the mounting base 2 and the housing 4 by raising and lowering a part of the side edge portion of the support base 8 by the linear motion rod 50a. By tilting the entire flow path system including the liquid chamber 3 of the housing 4 at a predetermined angle by the tilting mechanism 50, for example, residual air when the electrolytic solution is injected into the liquid chamber 3 is more reliably removed. Alternatively, it is possible to more reliably drain the residual solution when the electrolytic solution is discharged from the inside of the liquid chamber 3.

When the mounting base 2 and the housing 4 are tilted by the tilting mechanism 50, for example, the upper surface of the mounting base 2 is tilted with respect to the vertical direction with the side near the opening of the supply flow path 41 as the lowermost portion. It becomes a state. When the mounting base 2 is fitted with the lower clamp portion 39 of the housing 4, the portion directly below the opening of the supply flow path 41 is slightly lowered. Therefore, the electrolytic solution in the liquid chamber 3 collects in the vicinity of the opening of the supply flow path 41, and it becomes easy to drain the liquid. Therefore, the drainage capacity is enhanced, the risk of leakage of the electrolytic solution is reduced, and the risk of the object C to be treated being exposed to the electrolytic solution is reduced.

Specifically, the tilting mechanism 50 tilts the entire housing 4 and the mounting base 2 tilts in the same direction as the tilting direction of the housing 4. More specifically, with respect to the installation floor surface, the entire flow path system, that is, the support base 8, the mounting base 2, the housing 4, the pressurizing mechanism 30 with an on-off valve, the flow-off valve 40, the moving mechanism 5, etc. However, it tilts in the same direction by a predetermined angle. Since the object C to be processed is fitted in the recess (or tray 9b) of the mounting base 2, there is no problem that the position is displaced even when the object C is tilted by the tilting mechanism 50. In this way, the drainage force can be increased by tilting the tilting mechanism 50, so that the drainage capacity can be further improved.

The ion conductive film 6 is a single-wafer-shaped film material sandwiched between the inner frame film jig 36 and the outer frame film jig 37. The inner frame membrane jig 36 and the outer frame membrane jig 37 are fixed to the lower part of the housing 4, and the ion conductive film 6 is arranged directly under the cage-shaped member 20 arranged in the liquid chamber 3. There is. The ion conductive film 6 is impregnated with metal ions by being brought into contact with the electrolytic solution supplied in the liquid chamber 3, and when a voltage is applied by the power supply unit 7, the metal derived from the metal ions is the conductor of the object C to be treated. It is not particularly limited as long as it can be deposited on the surface E of the layer D.

Examples of the ion conductive film 6 include a porous film, a solid electrolyte film, and the like, and a resin such as polyethylene, polypropylene, a hydrocarbon resin, a fluororesin, or the like can be used. Therefore, since the ion conductive film 6 has sufficient flexibility and flexibility, for example, after covering the object C with the ion conductive film 6, the periphery of the object C is reduced in pressure to increase the degree of vacuum. In this case, the surface shape of the object to be treated C can be followed and adhered to each other in accordance with fine irregularities and the like.

The ion conductive film 6 is formed with a film thickness of several μm to several hundred μm (for example, 5 to 450 μm). Further, before the ion conductive film 6 comes into contact with the object C to be processed, as shown in FIG. 2, for example, the adsorption groove 36a is provided in the suction groove 36a provided on the membrane contact side end surface of the inner frame membrane jig 36. The film end side is adsorbed by being sucked through the suction passage 36b communicating with 36a. As a result, the ion conductive film 6 is held by the inner frame membrane jig 36 in a uniformly stretched state.

Further, the ion conductive film 6 is a protective plate attached to the outer frame membrane jig 37 so that a portion located below the opening of the supply flow path 41 covers and supports, for example, the lower surface side of the portion. It should be reinforced by (not shown). By attaching such a protective plate, the ionic conduction film 6 located below the opening due to the local decompression effect caused by the increase in the flow velocity when the electrolytic solution is injected / discharged through the supply flow path 41 can be lifted. This can be prevented, and problems such as tearing of the ion conductive film 6 can be prevented.

The foil-like member 10 is sandwiched between the upper clamp portion 38 provided on the outside of the outer frame film jig 37 and the lower clamp portion 39 provided below the upper clamp portion 38, and the ion conductive film 6 is sandwiched between the upper clamp portion 38 and the lower clamp portion 39 provided below the upper clamp portion 38. It is placed directly under. The foil-like member 10 is configured to have, for example, an insulating layer 11 arranged on the ion conductive film 6 side and an energizing layer 12 arranged on the object C side to be processed. That is, the insulating layer 11 is arranged between the energizing layer 12 and the ion conductive film 6. The insulating layer 11 and the energizing layer 12 may be adhered to each other or may be laminated in a non-adhesive state. In the present specification, the "foil-like" refers to a shape (thin shape) whose thickness is smaller than the width and length in a plan view, and is a concept including so-called sheet-like, film-like, flat plate-like, and the like. However, it is not intended that the material is limited to metal or the like.

The insulating layer 11 of the foil-like member 10 is a resin having insulating properties and chemical resistance such as polyimide (PI), polyamide (PA), polyethylene terephthalate (PET), polyolefin (PO), and epoxy resin containing glass woven cloth. It is composed of materials. As the insulating layer 11, for example, an insulating film having a thickness of 5 to 125 μm (for example, a 25 μm polyimide insulating film) can be used, but the insulating layer 11 is not limited thereto. The energizing layer 12 of the foil-shaped member 10 is made of a conductive metal material such as copper, gold, or silver. As the energizing layer 12, for example, a metal foil having a thickness of 1.5 to 150 μm (for example, a copper foil of 18 μm) can be used, but the method is not limited thereto.

Here, the electrolytic solution is, for example, a liquid containing a metal deposited on the surface E of the conductor layer D in an ionic state, and the contained metal is, for example, copper, gold, silver, nickel, or the like. Can be mentioned. The electrolytic solution is an ionized version of these metals, and various known electrolytic solutions can be used. The electrolytic solution is not limited to the one exemplified here.

As shown in FIG. 1C, the surface treatment apparatus 1 according to the present embodiment includes a peeling mechanism 52 for approaching or peeling the ion conductive film 6 and the foil-like member 10. Specifically, the peeling mechanism 52 includes, for example, a linear motion rod 52a connected to the upper clamp portion 38, and by advancing and retreating the linear motion rod 52a, the upper clamp portion 38 is moved to the outer frame membrane jig 37. The inner frame film jig 36 fixed to the outer frame film jig 37 is configured to move relative to the lower clamp portion 39 in the direction of approaching or separating from the lower clamp portion 39. Then, the ion conductive film 6 and the foil-like member 10 are clamped between the inner frame film jig 36 and the lower clamp portion 39.

Further, in the upper clamp portion 38, air blow is performed between the ion conductive film 6 and the foil-shaped member 10 prior to the peeling of the ion conductive film 6 and the foil-shaped member 10 by the peeling mechanism 52, and the ion conductive film 6 and the foil are blown. An air introduction flow path 38b is provided so that the state of close contact with the shaped member 10 can be released.

Further, as shown in FIG. 2, for example, a mold release film material 46 having a mold release treatment on at least the surface on the ion conductive film 6 side is arranged between the ion conductive film 6 and the foil-like member 10. You may have. Examples of the mold release treatment include, but are not limited to, a textured treatment for making unevenness and a roughening treatment for applying silica particles, and the mold release treatment is not limited to this, and the fluorine-based release treatment is performed in place of or in addition to the roughening treatment. It is possible to adopt a process of applying a mold release accelerator such as a mold. The release film material 46 can be used to more easily release the adhesion state between the ion conductive film 6 and the foil-like member 10 after the surface treatment. When the release film material 46 is not used, the above-mentioned release treatment may be applied to the surface of the insulating layer 11 on the ion conductive film 6 side (the surface in contact with the ion conductive film 6).

In the lower clamp portion 39, in a state where the lower clamp portion 39 and the mounting base 2 are fitted, the lower space between the mounting base 2 and the foil-like member 10 and the ion conductive film 6 is provided. Exhaust means for exhausting air (preferably vacuum exhaust) are provided. The exhaust means has an on-off valve 47 that is opened and closed to reduce the pressure in the lower space, and the on-off valve 47 opens in the lower space and communicates with the lower part of the lower clamp portion 39. It is provided so as to be arranged outside the road 48.

The decompression flow path 48 is connected to a decompression flow path (not shown) communicating with the liquid chamber 3 (the space above the ion conductive membrane 6) via a flow path on-off valve and a bypass flow path (neither is shown). There is. The bypass flow path is set so that the flow path length is as short as possible, and a decompression unit (not shown) having a vacuum pump for decompression or the like is connected to the bypass flow path. Such a decompression system circuit is provided as a circuit separate from the solution supply system circuit such as the pressurizing mechanism 30 with an on-off valve and the flow path on-off valve 40.

The on-off valve 47 includes a spool 49 having a solid structure that is slidable in sliding contact with the inner wall surface in a hollow opening / closing adjustment chamber, and has a closing operation port 57 provided on the outside of the lower clamp portion 39 and its closing. It is provided with an open operation port 58 provided inside the operation port 57 and below the lower clamp portion 39. Each of the ports 57 and 58 is a through hole from the outside of the on-off valve 47 to the inside on-off adjustment chamber. For example, when the on-off valve 47 uses an ion conductive film 6 through which a liquid such as an electrolytic solution easily passes, the on-off valve 47 cannot be pressurized if the liquid flows into the lower space more than the compressed volume by the pressurizing mechanism 30 with the on-off valve. It is provided to prevent it from being stored.

Further, the foil-like member 10 described above may be formed by alternately laminating a plurality of insulating layers 11 and energizing layers 12 (either adhesive or non-adhesive), and more preferably, energizing the insulating layer 11. Even if it is composed of a flexible printed circuit board on which the layer 12 is formed (for example, a flexible printed circuit board), or a multilayer flexible printed circuit board having a multilayer structure insulating layer 11 and an energizing layer 12 (for example, a multilayer flexible printed circuit board). good. When the foil-like member 10 is made of a flexible printed circuit board, the insulating layer 11 is formed with a thickness of, for example, about 12 to 25 μm, and the energizing layer 12 is formed with a thickness of, for example, about 6 to 18 μm. Is preferable, but the present invention is not limited to this.

As shown in FIGS. 1A and 1B, the foil-shaped member 10 includes a connector portion 13 for electrically connecting the current-carrying layer 12 to the negative electrode (-pole) of the power supply portion 7, and FIG. 2 (b). As shown in the above, the energizing layer 12 is arranged so as to be in contact with a part of the conductor layer D so as to conduct the negative electrode of the power supply unit 7 and the conductor layer D via the connector unit 13. At the same time, in the foil-like member 10, the insulating layer 11 has a through hole 11a having a shape corresponding to the shape of the surface E of the surface E of the conductor layer D, and the through hole 11a is arranged on the processed region. It is configured to be.

In the foil-like member 10, for example, when the through hole 11a of the insulating layer 11 is formed in a rectangular opening shape (square shape) when viewed from above, for example, the energizing layer 12 is slightly smaller than the through hole 11a. Is formed to have a large through hole 12a. As a result, as shown in FIG. 2C, the foil-like member 10 can be made into a cathode by bringing the current-carrying layer 12 into contact with the conductor layer D via the connector portion 13 at the time of surface treatment, and also as an insulating layer. The 11 can be used as a mask material in which a portion other than the through hole 11a covers the non-treated region on the surface E of the conductor layer D, and the ion conductive film 6 is brought into contact with the treated region only. The through hole 11a of the insulating layer 11 and the through hole 12a of the current-carrying layer 12 have the same size, and the through hole of the release film material 46 has a size slightly smaller than these through holes 11a and 12a. The mold film material 46 may be configured to function as a mask material. Further, when the voltage may be uniformly applied to the entire energization layer 12 (for example, when it is not necessary to selectively apply the voltage for each energization pattern 12b described later in the energization layer 12), the power supply unit 7 The negative electrode may be connected to the lower clamp portion 39 instead of the connector portion 13, and the current-carrying layer 12 may be brought into contact with the lower clamp portion 39 to apply a voltage to the current-carrying layer 12.

The ion conductive film 6 is premised on repeated use, and it is preferable that the amount of deformation thereof is as small as possible in order to deal with film damage during surface treatment. However, when the uneven shape of the surface of the object C to be treated and the pattern shape of the conductor layer D become finer or more complicated, in order to follow the shape, the film thickness of the ion conductive film 6 is made as thin as possible and then deformed. It will be necessary to reduce the amount.

In this respect, in the surface treatment apparatus 1 of the present embodiment, the conductor layer D can be used as a cathode by the foil-like member 10 having a very thin current-carrying layer 12 (and the insulating layer 11), and the conductor layer D can be used as a cathode through the through hole 11a. The ion conductive film 6 can be brought into contact with the surface E of the conductor layer D to be treated. Therefore, the amount of deformation of the ion conductive film 6 is reduced to reduce the load applied to the ion conductive film 6, and even if the conductor layer D has a finer and more complicated pattern shape, the ion conductive film 6 and its surface thereof. The surface can be treated by appropriately contacting with E.

On the other hand, the cage-shaped member 20 is arranged in the liquid chamber 3 in a state of being suspended by, for example, a plurality of support pillar portions 21 attached to the housing 4 so as to penetrate vertically through the height adjusting spacer 22. Has been done. The bottom portion 23 of the cage-shaped member 20 is formed, for example, in a mesh shape, and inside the bottom portion 23, a metal having an arbitrary shape such as a spherical shape, a columnar shape, or a plate shape having solubility in an electrolytic solution (for example, a copper ball) is formed. Etc.) are arranged multiple times.

For example, the cage-shaped member 20 is arranged after the position in the liquid chamber 3 is adjusted by the height adjusting spacer 22 so that the bottom portion 23 thereof is located directly above the ion conductive film 6. By changing the shape and number of the height adjusting spacers 22, the position of the cage-shaped member 20 in the liquid chamber 3 can be freely changed. The cage-shaped member 20 is connected to the positive electrode (+ electrode) of the power supply unit 7 via the support pillar portion 21 and the housing 4.

As a result, the cage-shaped member 20 constitutes the anode in the surface treatment device 1. The cage-shaped member 20 is not limited to the mode of being suspended from the support pillar portion 21, and various support modes may be adopted as long as it can be arranged above the ion conductive film 6. Further, the anode is not limited to the cage-shaped member 20, and can take various shapes (for example, a plate shape or the like) and an arrangement mode as long as it can be arranged at a position where the anode is immersed in the electrolytic solution in the liquid chamber 3. In the present embodiment, the cage-shaped member 20 is not only arranged directly above the cage-shaped member 20 in a state where the bottom portion 23 is not in contact with the ion conductive film 6, but also in the vertical direction between the conductor layer D of the object to be processed C serving as a cathode. It is arranged so that the distance between the poles is constant.

In the surface treatment apparatus 1 of the present embodiment, the flow paths through which the electrolytic solution flows are two, the supply flow path 41 and the discharge flow path 31, but may be three or more. Further, in the present embodiment, the support base 8, the mounting base 2, and the housing 4 have, for example, a rectangular outer shape when viewed from above, and a portion constituting the liquid chamber 3 has a rounded rectangular shape. Although they are formed, they may all be circular and are not limited to a rectangular shape or a rounded rectangular shape. Further, although the mounting base 2 is fixed to the center of the upper surface of the support base 8, the mounting base 2 may be integrally configured with the support base 8.

The housing 4 has a rectangular shape when viewed from above, and is fixed in a state where the pressure mechanism 30 with an on-off valve and the flow path on-off valve 40 are inserted and mounted at positions facing each other on the side surface, and the housing 4 has a rectangular shape on the lower part. The ion conduction film 6 and the like are fixed. In the present embodiment, the upper heater 55 and the insulating member 55a are provided on the entire upper surface of the upper portion of the housing 4, and the lower heater 56 is provided inside the mounting base 2, but the surface treatment on the object C to be treated is provided. It may not be provided depending on the type of.

In the present embodiment, the flow path on-off valve 40 and the pressurizing mechanism 30 with an on-off valve for increasing the pressure of the electrolytic solution are directly connected to and integrated with the housing 4, so that an external pipe that generates high pressure is not required. The size of the entire device can be reduced, and the region where the pressure becomes high when the electrolytic solution is pressurized can be limited to the liquid chamber 3 of the housing 4. As a result, there is no concern that the pipe will explode even if the pressurizing pressure in the surface treatment increases, and the safety is high. In addition, by using the pressurizing mechanism required for pressurization in combination with the valve mechanism, it is possible to reduce the size and minimize the volume of the electrolytic solution to be pressurized. As a result, the influence of the expansion of the piping system due to the pressure of the electrolytic solution is affected. It has a structure that does not receive it, and the overall structure is more compact and simple, and manufacturing costs and maintenance costs can be reduced.

Next, although not shown, an example of the surface treatment process by the surface treatment apparatus 1 according to the present embodiment will be described. Here, the release film material 46 will be omitted.
First, as a pre-stage of surface treatment, the object to be treated C is placed on the upper surface of the mounting base 2 in a state where the housing 4 is separated from the mounting base 2 (original position: see FIG. 1A). Next, the ionic conductive film 6 is adsorbed on the edge of the adsorption groove 36a of the inner frame film jig 36 to form a film (step S1). In this state, the ion conductive film 6 and the foil-like member 10 are peeled off by the peeling mechanism 52, and a gap is formed between them.

After that, the ion conductive film 6 and the foil-like member 10 are brought into close contact with each other by the peeling mechanism 52 (step S2). At this time, a normal pressure liquid chamber 3 is formed between the housing 4 and the ion conductive film 6 in which a portion other than the on-off valve system is closed.

After that, the lower clamp portion 39 of the housing 4 and the mounting base 2 on which the object to be processed C arranged below the clamp portion 39 is placed are fitted (step S3). That is, when the housing 4 is lowered to the above-mentioned decompression position by the moving mechanism 5 from the state of step S2, the lower clamp portion 39 is fitted to the mounting base 2.

At this time, the fitting position between the lower clamp portion 39 and the mounting base 2 is such that the ion conductive film 6 (and the foil-like member 10) is as close as possible to the surface E of the conductor layer D of the object C to be processed. It is set to the position where. The object C to be treated is sealed not in the liquid chamber 3 but in the lower space formed between the mounting base 2 and the ion conductive film 6, and is separated from the liquid chamber 3.

Therefore, in this step S3, the object C to be processed has a supply flow path 41 having an opening provided at the lowermost part of the inner wall and a discharge flow path 31 having an opening provided at the uppermost part of the inner wall, and the inner upper surface is inclined. The housing 4 and the ion conductive film 6 (and the foil-like member 10) are separated from each other and mounted on the mounting base 2.

Next, from the state of step S3, the on-off valve 47 provided in the lower clamp portion 39 is opened, and the flow path on-off valve of the decompression system described above is opened, so that the decompression flow path 48 and the depressurization not shown are shown. The flow path is communicated through the bypass flow path, and the liquid chamber 3 and the lower space are simultaneously depressurized (step S4). That is, in this step S4, the liquid chamber 3 and the lower space are made equal pressure via the ion conductive film 6.

By simultaneously depressurizing the liquid chamber 3 and the lower space in this way, the generation of the differential pressure between the liquid chamber 3 and the lower space can be reduced, and in step S7 described later, the ion conductive film 6 (and the foil-like member) can be reduced. 10) can be accurately adhered along the overall surface shape of the object to be treated C.

Then, for example, the mounting base 2 is relatively moved so as to be completely fitted to the lower clamp portion 39 while the depressurized state is maintained (in the present embodiment, the housing 4 is lowered to the above-mentioned depressurized position by the moving mechanism 5). (Step S5: see FIG. 1B), the ion conductive film 6 is brought close to the surface E of the conductor layer D, the flow path on-off valve of the pressure reducing system described above is closed, and the circuit of the pressure reducing system (bypass) of the liquid chamber 3 is closed. The flow path) is blocked (step S6) to open the liquid chamber 3 to the atmosphere (step S7).

When the circuit of the decompression system of the liquid chamber 3 is cut off, the tip of the spool of the flow path on-off valve (not shown) moves so as to be flush with the internal side surface of the liquid chamber 3 or to protrude from the internal side surface. Then, the circuit is cut off. This is because if the tip of the spool is recessed from the inner side surface, problems such as residual electrolytic solution and residual air are likely to occur in that portion. When the air is opened to the atmosphere in step S7, the ion conductive film 6 is pushed toward the lower space side by the atmospheric pressure.

At the same time as this step S7, the mounting base 2 and the housing 4 are relatively moved so that the mounting base 2 and the lower clamp portion 39 are completely fitted (descended to the processing position (see FIG. 1B)). The ion conductive film 6 is in a state of being in close contact first from the central portion of the object to be treated C. At this time, by sucking the air remaining between the ion conductive film 6 and the mounting base 2 from the decompression flow path 48, the circumference of the object to be treated C can be depressurized and the residual air can be suppressed. can. Then, after the mounting base 2 and the lower clamp portion 39 are completely fitted in this way (that is, after the mounting base 2 and the housing 4 are brought closest to each other), the on-off valve 47 is closed. Then, the circuit of the decompression system in the lower space is cut off.

As a result, the ion conductive film 6 (and the foil-shaped member 10) adheres to each other along the overall surface shape of the object C, and the current-carrying layer 12 of the foil-shaped member 10 is brought into contact with a part of the conductor layer D. It becomes a state (see FIG. 2C). By bringing the ion conductive film 6 and the foil-like member 10 into contact with the object to be treated C through each of these steps, for example, the ion conductive film 6 and the foil-like member 10 remain on the surface-treated surface (that is, the surface E of the conductor layer D of the object to be treated C). Fine bubbles can be reliably eliminated and these can be brought into close contact with each other.

Next, as shown in FIG. 1C, the tilting mechanism 50 tilts the mounting base 2 and the housing 4 at a predetermined angle so that the discharge flow path 31 side is tilted upward (step S8), and the liquid is liquid. The electrolytic solution is injected into the chamber 3 (step S9). That is, in step S9 following step S8, the electrolytic solution is supplied from the supply flow path 41 having an opening at the lowermost portion of the inner side surface of the liquid chamber 3 of the housing 4 in a state where the object to be treated C is covered with the ion conductive film 6. Inject into the liquid chamber 3.

Specifically, the electrolytic solution is injected from the supply / discharge port 45 of the flow path on-off valve 40 toward the inside of the liquid chamber 3. The electrolytic solution passes through the supply flow path 41, which is the wall surface flow path of the housing 4, and fills the inside of the liquid chamber 3 from the opening of the supply flow path 41 in the vicinity of the ion conductive film 6. When the electrolytic solution reaches the upper surface of the wall surface of the housing 4, the air remaining inside the liquid chamber 3 moves along the inclination of the inner upper wall surface and is discharged as a connection flow path of the pressurizing mechanism 30 with an on-off valve. The air is exhausted from the flow path 31 to an external solution supply unit (not shown) connected to the supply / discharge port 35. When the injection of the electrolytic solution is continued, the inside of the liquid chamber 3 is completely filled with the electrolytic solution at normal pressure.

Then, the residual air in the liquid chamber 3 is discharged from the discharge flow path 31 having an opening at the uppermost portion of the inner side surface of the housing 4 (step S10). In step S10, in a state where the residual air is removed in step S9 and the injection of the electrolytic solution from the supply / discharge port 45 is continued, the residual air in the liquid chamber 3 is separated from the supply / discharge port 35 of the pressurizing mechanism 30 with an on-off valve. Excess electrolyte is discharged.

After the residual air is discharged, the flow path on-off valve 40 and the pressurizing mechanism 30 with the on-off valve mounted on the outer side surface of the housing 4 are closed to seal the inside of the liquid chamber 3 (step S11). In step S11, working air is sent to the closing operation port 43 of the flow path on-off valve 40, and the spool 42 moves to the liquid chamber 3 side, thereby between the electrolytic solution supply flow path 41 and the supply / discharge port 45. Is shut off, and the flow path on-off valve 40 is closed.

Further, working air is sent to the closing operation port 33 of the pressurizing mechanism 30 with an on-off valve, the spool 32 moves to the liquid chamber 3, and the supply / discharge port 35 of the pressurizing mechanism 30 with an on-off valve is closed.

Next, the electrolytic solution in the liquid chamber 3 is pressurized by the pressurizing mechanism 30 with an on-off valve, which is a pressurizing mechanism and an on-off valve provided on the outer side surface of the housing 4, and the cage-shaped member 20 is formed by the power supply unit 7. A voltage is applied between the foil-shaped member 10 and the current-carrying layer 12. As a result, surface treatment is performed to form a metal film by precipitating metal ions on the surface E of the conductor layer D of the object C to be treated covered with the ion conductive film 6 (step S12). ..

When pressurizing the electrolytic solution, working air is further sent to the closing operation port 33 of the closed operation port 33 of the pressurizing mechanism 30 with an on-off valve, and the spool 32 is further moved to the liquid chamber 3 side to enter the liquid chamber 3. Compress and pressurize the electrolyte. When the pressure of the working air is increased, pressure is applied to the base end portion of the spool 32, and the spool 32 moves to the liquid chamber 3 side. The inside of the liquid chamber 3 is pressurized by the volume of the movement of the spool 32, and the pressure applied to the electrolytic solution filling the inside is increased by that amount.

If a pressure sensor capable of measuring the pressure inside the liquid chamber 3 is installed in the housing 4 and the operating air pressure supplied to the closing operation port 33 is controlled based on the measured value, the electrolytic solution can be subjected to a desired pressure. It is possible to control the pressure. When this state is maintained for a predetermined time and a predetermined voltage application time elapses, the surface treatment is completed.

During the surface treatment, the object C to be treated is separated from the liquid chamber 3 containing the electrolytic solution by the ion conductive film 6, but when the electrolytic solution is pressurized, the object C is uniformly applied. Pressure is applied. Therefore, the surfaces of the ion conductive film 6 and the conductor layer D are compared with the conventional configuration in which the cathode is pressed together with the electrolyte film by the anode of the porous body as in the conventional film forming apparatus disclosed in Patent Document 1. Adhesion with E is improved, and the quality of surface treatment is improved.

When the surface treatment is completed, the electrolytic solution is discharged from the supply flow path 41 having an opening at the lowermost portion of the inner side surface of the housing 4 (step S13). In step S13, the flow path on-off valve 40 and the pressurizing mechanism 30 with an on-off valve are opened, and low-pressure air is sent from the supply / discharge port 35 of the pressurizing mechanism 30 with an on-off valve to supply low-pressure air to the flow path on-off valve 40. The electrolytic solution is drained from the supply / discharge port 45 of the above.

Since the supply flow path 41 of the housing 4 connected to the flow path on-off valve 40 is provided with an opening at the lowermost portion in contact with the ion conductive film 6, it is possible to sufficiently eliminate the electrolytic solution. Finally, the tilted state by the tilting mechanism 50 is released, the housing 4 is raised so as to be separated from the mounting base 2, and the object to be processed C is taken out (step S14).

According to the surface treatment apparatus 1 of the present embodiment, the surface E of the conductor layer D of the object to be treated C is uniformly pressed by the ion conductive film 6 while the current-carrying layer 12 of the foil-like member 10 is brought into contact with the conductor layer D. Since a metal film can be formed on the surface E, various loads applied to the ion conductive film 6 can be reduced.

In addition to being able to efficiently surface-treat the object C to be treated, for example, the risk of leakage of the electrolytic solution when taking out the object C to be processed can be reduced, and the electrolytic solution remains around the object C to be processed. It is also possible to suppress and reduce the risk that the object C to be treated is exposed to the electrolytic solution. Since the structure is such that the electrolytic solution does not easily remain on the ion conductive film 6 including the inclination due to the inclination mechanism 50, for example, even if the ion conductive film 6 is damaged when the object C to be treated is taken out, the electrolytic solution The risk of leakage and the risk of the object C being exposed to the electrolytic solution are reduced as much as possible.

Further, since the very thin ion conductive film 6 and the foil-like member 10 are provided, even in the object C having the conductor layer D having a finely divided and complicated pattern shape, the ion conductive film 6 is formed on the surface E of the conductor layer D. Can be appropriately contacted with the surface for surface treatment, and the amount of deformation of the ion conductive film 6 can be reduced to reduce the load applied.

In the above description, an example in which pneumatic pressure is used to operate the pressurizing mechanism 30 with an on-off valve is shown, but a hydraulic pressure or an electric method can also be adopted. Further, although the valve structure of various on-off valves including the flow path on-off valve 40 and the pressurizing mechanism with on-off valve 30 is assumed to be pneumatically driven, it is driven by hydraulic pressure, a general solenoid valve, and a ball screw. It is also possible to use various means such as a mechanism and a rack and pinion mechanism. Furthermore, it is also possible to make these actuating mechanisms independent of the valve structure and use various general-purpose actuating mechanism parts.

Further, the moving mechanism 5 for moving the housing 4 up and down can arbitrarily use various configurations such as a pneumatic cylinder mechanism and an electric linear drive mechanism. It is preferable that these linear motion mechanisms are provided with a position detection sensor and a pressure detection sensor. As for the working air control system and the electrolytic solution control system, since a general fluid control system circuit can be used, detailed description thereof will be omitted.

In addition to the above-mentioned effects, according to the surface treatment device 1, a liquid chamber 3 for surface-treating the object to be treated C is formed inside the housing 4, and a pressurizing mechanism facing the liquid chamber 3 is directly attached. It is possible to reduce the size by eliminating unnecessary piping and pressure pumps. Further, by separating the mounting base 2 and the housing 4, the object C to be processed can be easily taken out.

Further, after the surface treatment, the inside of the liquid chamber 3 is drained and the mounting base 2 and the housing 4 are separated from each other, so that leakage of the electrolytic solution can be prevented. Further, since the supply flow path 41 is provided at the lowermost part of the liquid chamber 3 and the discharge flow path 31 is provided at the uppermost part of the liquid chamber 3, the electrolytic solution filled in the liquid chamber 3 is an air supply / exhaust port. By injecting air from the air pressure and gravity, the air can be efficiently discharged from the liquid supply / drainage port. As described above, if the electrolytic solution does not remain in the liquid chamber 3, the risk of leakage thereof is remarkably low.

Further, in order to reduce the size of the pressurizing mechanism (pressurizing mechanism 30 with on-off valve), it is important to eliminate residual air in the liquid chamber 3 when injecting the electrolytic solution. The surface treatment device 1 has an inclined structure in which the upper surface of the liquid chamber 3 is directed toward the air supply / exhaust port (discharge flow path 31) at the uppermost portion, so that the air in the liquid chamber 3 can be easily removed. ..

Further, by performing pressurization by the pressurizing mechanism with the air in the liquid chamber 3 removed, not only the pressurization can be performed efficiently, but also the pressurization mechanism due to the improved efficiency. It is possible to reduce the size. Although the above-mentioned surface treatment apparatus 1 has an ion conductive film 6, the ion conductive film 6 is not always provided when the surface treatment is performed by directly contacting the electrolytic solution with the object C to be treated. It does not have to be.

Next, various configurations and surface treatment examples of the foil-like member 10 corresponding to the object C to be treated in the surface treatment apparatus 1 will be described. Here, unless otherwise specified, the object C to be treated is assumed to have the conductor layer D formed on the resin base material B, and the surface treatment is performed on the surface E of the conductor layer D via the ion conductive film 6. The plating treatment is performed by depositing a metal on the surface to form a film, but the surface treatment performed by the surface treatment apparatus 1 is not limited to this.

3 and 4 are views schematically showing the first foil-shaped member 10 and the object to be processed C, and FIG. 3A is a view showing the upper surface of the current-carrying layer 12 of the first foil-shaped member 10. 3 (b) shows the upper surface of the insulating layer 11 of the first foil-shaped member 10, FIG. 3 (c) shows the surface E of the conductor layer D of the object to be treated C, and FIG. 3 (d) shows the surface E. The cross section of the object C to be processed is shown. Further, FIG. 4 (a) shows the upper surface of the first foil-shaped member 10 in a state where the energizing layer 12 and the insulating layer 11 are laminated and stacked on the object to be treated C, and FIG. 4 (b) shows the surface treatment. The upper surface of the object to be treated C is shown in FIG. 4 (c), and the cross section thereof is shown in FIG.

As described above, when the object C to be treated has a structure in which the conductor layer D is formed on the resin base material B, for example, in the plating process using the ion conductive film 6, the mounting base 2 is used as the power supply unit 7. Even if it is connected to the negative electrode of, the conductor layer D cannot be used as a cathode. Therefore, in order to deposit metal on the surface E of the conductor layer D and perform the plating treatment, it is necessary to connect the conductor layer D to the negative electrode of the power supply unit 7 to serve as a cathode.

Since the first foil-like member 10 of the surface treatment apparatus 1 of the present embodiment can be made conductive with the negative electrode of the power supply unit 7 by directly contacting the current-carrying layer 12 with the surface E of the conductor layer D, it can be used as a cathode. Even in the object C to be treated, in which an insulator such as a resin base material B is arranged on the mounting base 2, the conductor layer D can be plated with good quality and reliability.

As shown in FIG. 3C, the object to be treated C of the first example is formed, for example, in a rectangular shape in a top view. As shown in FIG. 3D, the object C to be treated has a solid pattern conductor layer D in which the conductor layer D is formed on the entire upper surface of the resin base material B. Then, when the entire surface of the conductor layer D is plated with a rectangular region slightly inside from the peripheral edge of the surface E as the region to be treated, the current-carrying layer 12 of the first foil-shaped member 10 is shown in the figure. As shown in 3 (a), a through hole 12a having an opening diameter slightly smaller than the outer diameter of the conductor layer D is formed.

Further, as shown in FIG. 3B, the insulating layer 11 of the first foil-shaped member 10 has an opening diameter corresponding to the area to be treated, which is slightly smaller than the through hole 12a. A through hole 11a is formed. The current-carrying layer 12 and the insulating layer 11 of the first foil-like member 10 are formed in a solid pattern except for the through holes 12a and 11a.

When the first foil-like member 10 configured in this way is superposed on the object C in the order of the conductive layer 12 and the insulating layer 11, the insulating layer 11 is as shown in FIG. 4A. The processed region Ep of the surface E of the conductor layer D may be exposed from the through hole 11a, and a part of the energizing layer 12 may be in contact with the surface E of the conductor layer D on the lower surface near the peripheral edge of the through hole 12a. can. In this state, the first foil-like member 10 and the ionic conductive film 6 are superposed, and the ionic conductive film 6 is brought into close contact with the surface E of the conductor layer D of the object to be treated C through the through hole 11a to perform a plating process. To apply.

In the object C to be plated after the plating treatment, as shown in FIGS. 4 (b) and 4 (c), a coating film F formed by plating is formed on the surface E of the conductor layer D on the surface E of the conductor layer D, and the current-carrying layer is formed. The coating film F is not formed on the non-treated region En including the portion where the 12 is in contact. That is, the insulating layer 11 of the first foil-like member 10 serves as a mask material that covers the portion other than the through hole 11a on the non-treated region En of the surface E of the conductor layer D so as not to come into contact with the ion conductive film 6. Also responsible. If the insulating layer 11 is configured by appropriately setting the shape, number, and type of the through holes 11a according to the design of the processed region Ep and the non-processed region En, the function as a mask material can be further improved. It will be possible.

5 and 6 are views schematically showing the second foil-shaped member 10 and the object to be processed C, and FIG. 5A is a view showing the upper surface of the current-carrying layer 12 of the second foil-shaped member 10. 5 (b) shows the upper surface of the insulating layer 11 of the second foil-shaped member 10, FIG. 5 (c) shows the upper surface of the object to be treated C, and FIG. 5 (d) shows the cross section of the object to be treated C. ing. Further, FIG. 6A shows the upper surface of the second foil-like member 10 in a state where the energizing layer 12 and the insulating layer 11 are laminated and stacked on the object to be treated C, and FIG. 6B shows the surface treatment. FIG. 6 (c) shows the upper surface of the processed object C and the cross section thereof. In the following, explanations that overlap with the contents already described will be omitted, and the illustration of the processed region Ep and the non-processed region En on the surface E of the conductor layer D will be omitted.

The object C of the first example described above had the conductor layer D of the solid pattern, but the object C of the second example is as shown in FIGS. 5 (c) and 5 (d). In addition, for example, the resin base material B is formed in a rectangular shape in a top view, and the conductor layer D is formed in a plurality of independent patterns (here, nine patterns) in a rectangular shape in a top view.

Then, when the surface E of the conductor layer D of each independent pattern is plated, the current-carrying layer 12 of the second foil-like member 10 is covered with the conductor layer D of the independent pattern as shown in FIG. 5 (a). A plurality of through holes 12a having an opening diameter slightly smaller than the outer diameter are formed corresponding to the conductor layer D of each independent pattern.

Further, as shown in FIG. 5B, the insulating layer 11 of the second foil-shaped member 10 has an opening diameter corresponding to the area to be treated of the surface E of the conductor layer D having an independent pattern, and has a through hole. A plurality of through holes 11a having an opening diameter slightly smaller than 12a are formed corresponding to the conductor layer D of each independent pattern, similarly to the through holes 12a. The current-carrying layer 12 and the insulating layer 11 of the second foil-like member 10 are formed in a solid pattern except for the through holes 12a and 11a.

When the second foil-like member 10 configured in this way is superposed on the object C in the order of the conductive layer 12 and the insulating layer 11, as shown in FIG. 6A, the insulating layer 11 The area to be treated of the surface E of the conductor layer D of each independent pattern is exposed from each through hole 11a, and a part of the energizing layer 12 comes into contact with the surface E of the conductor layer D on the lower surface near the peripheral edge of each through hole 12a. Can be in a state. In this state, the second foil-like member 10 and the ion conductive film 6 are superposed, and the ion conductive film 6 is brought into close contact with the surface E of the conductor layer D of each independent pattern of the object C to be processed through the through holes 11a. After that, the plating process is performed.

As shown in FIGS. 6 (b) and 6 (c), the object to be plated C is plated on the area to be treated defined by the through hole 11a on the surface E of the conductor layer D of each independent pattern. The film F is formed by the above. In this way, if the shape, number, type, etc. of the through holes 11a, 12a of the insulating layer 11 of the second foil-shaped member 10 and the energizing layer 12 are devised according to the conductor layer D, the conductor layer D having an independent pattern can be obtained. It is possible to mask the non-treated region of the surface E and perform a satisfactorily plating treatment on the object C to be treated.

The object C to be treated in the second example has a plurality of independent patterns of conductor layers D, and the surface E of the conductor layers D of each independent pattern is uniformly plated. By devising the configuration of the current-carrying layer 12 of the foil-shaped member 10, for example, it is possible to selectively plate the surface E of the conductor layer D of each independent pattern.

FIG. 7 is a diagram schematically showing a state in which the energizing layer 12 of the third foil-shaped member 10 and the third foil-shaped member 10 are superposed on the object C to be processed, and FIG. 7A is a diagram schematically showing the energizing layer 12. 7 (b) shows the upper surface in a state where the third foil-like member 10 is superposed on the object C to be processed. When the surface E of the conductor layer D of each independent pattern in the object C of the second example shown in FIGS. 5 (c) and 5 (d) is selectively plated, the third foil-like member 10 As the insulating layer 11 of the above, the same pattern as that shown in FIG. 5 (b) can be used, but the conductive layer 12 of the third foil-like member 10 is as shown in FIG. 7 (a). It is composed of a plurality of energization patterns 12b having each through hole 12a (here, three energization patterns 12b for each of the three through holes 12a).

In order to ensure the insulation between the circuits of each energization pattern 12b, the lower surface side of the energization layer 12 (that is, the object C side to be processed) has a through hole 11a as shown in FIG. 3B. An insulating layer (not shown) is arranged. It is preferable that the insulating layer is further formed with through holes (not shown) for electrically connecting the negative electrode of the power supply unit 7 independently to each energization pattern 12b. By separately arranging the insulating layer below the energization layer 12 in this way, a circuit system capable of selectively applying a voltage to each energization pattern 12b by the power supply unit 7 is realized, and the power supply unit can be selectively applied. It is possible to conduct the negative electrode of No. 7 through the conductor layer D to form a cathode and perform plating treatment. Such an energizing layer 12 and an insulating layer (not shown) may be arranged alternately as the number of layers increases.

Further, by appropriately changing the shape, number, type, etc. of the through holes 11a of the insulating layer arranged below the energizing layer 12, the through holes of the insulating layer 11 arranged above the energizing layer 12 are arranged. In addition to the variation due to the shape of 11a and the like, it is possible to further expand the variation of the circuit pattern for selectively energizing and the like.

Also in the third foil-shaped member 10, the relationship between the opening diameters of the through holes 11a and 12a is as described above. Further, when the energization layer 12 is composed of such a plurality of energization patterns 12b and the plating process is selectively performed, the power supply unit 7 has at least one of the applied voltage, the applied current, and the applied time for each energizing pattern 12b. Can be configured to be controllable.

That is, when the current-carrying layer 12 composed of each current-carrying pattern 12b is superposed on the object to be treated C and the insulating layer 11 is superposed on the object to be treated C to arrange the third foil-like member 10 on the object to be treated C, FIG. 7B shows. As shown in the above, the ion conductive film 6 is superposed on the third foil-like member 10 in this state and brought into close contact with the surface E of the conductor layer D, and then the power supply unit 7 is used for each of the three energization patterns 12b. Selectively different plating treatments are applied to the surface E of each of the three conductor layers D in an independent pattern by selectively passing a current or applying a voltage, or changing these values or changing the time. It can be performed. By selectively performing the plating treatment in this way, it is possible to perform the plating treatment by changing the thickness of the coating film F for each energization pattern 12b and changing the precipitation rate, precipitation time, etc. of the metal. The coating film F can be freely formed to a desired thickness and shape.

For example, the object to be treated C (see FIG. 5 (c) and the like) of the second example has a structure in which nine conductor layers D having an independent pattern having a rectangular shape in a top view are provided. When each conductor layer D of the object C is formed in a dense layout, and the corresponding through holes 12a and the current-carrying pattern 12b are independently provided for each, the current-carrying layer 12 of the foil-like member 10 is formed. For example, as shown in FIG. 8 (a).

That is, when the through holes 12a and the energization pattern 12b are made to correspond to the conductor layer D having a dense layout as described above, for example, the degree of density is relative to the conductor layer D arranged in the center of the object C to be processed. It is also assumed that a situation may occur in which neither the through hole 12a nor the energization pattern 12b can be formed.

In such a case, that is, the layout of the insulating layer 11 and the current-carrying layer 12 such as the through holes 11a and 12a and the current-carrying pattern 12b differs depending on the pattern and the density of the conductor layer D of the object to be plated C to be plated. The plating process is performed a plurality of times while exchanging the plurality of foil-like members 10, and the insulating layer 11 and the current-carrying layer 12 having through holes 11a and 12a and the current-carrying pattern 12b having different layouts correspond to the pattern of the conductor layer D and the like. It is preferable to perform a plating treatment using the foil-like members 10 configured by laminating a plurality of the foil-like members 10 as described above, or to perform a plating treatment using both foil-like members 10 in combination.

FIG. 8 is a diagram schematically showing the fourth foil-shaped member 10A and the object to be processed C, and FIG. 8 (a) shows the upper surface of the current-carrying layer 12 of the fourth foil-shaped member 10A in FIG. 8 (b). ) Is a state in which the upper surface of the insulating layer 11 of the fourth foil-shaped member 10A is laminated, and FIG. The upper surface of each is shown. Further, FIG. 9 is a diagram schematically showing a surface-treated object to be treated with an upper surface and a cross section, and FIG. 9A is a view showing the upper surface of the surface-treated object C to be treated. 9 (b) shows the cross-sectional view taken along the line MM of FIG. 9 (a), respectively.

First, the through holes 12a and the energization pattern corresponding independently to each conductor layer D excluding the conductor layer D arranged in the center of the object C provided with the nine conductor layers D as described above. When 12b is provided and the surface E of each conductor layer D is plated, the current-carrying layer 12 of the fourth foil-shaped member 10A is slightly smaller than the outer diameter of the conductor layer D, as shown in FIG. 8A. It is composed of a plurality of independent energization patterns 12b (here, one energization pattern 12b for each through hole 12a) having a through hole 12a having a small opening diameter.

Further, as shown in FIG. 8B, the insulating layer 11 of the fourth foil-shaped member 10A has an opening diameter corresponding to the area to be treated of the surface E of the conductor layer D, which is larger than the through hole 12a. A plurality of through holes 11a having a slightly smaller opening diameter are formed corresponding to each conductor layer D except for the conductor layer D arranged in the center as in the layout of the through holes 12a.

When the fourth foil-shaped member 10A configured in this way is superposed on the object C to be processed, as shown in FIG. 8C, the conductor layer D is formed from the through holes 11a of the insulating layer 11. The area to be treated on the surface E is exposed, and a part of the current-carrying layer 12 is in contact with the surface E of each conductor layer D independently on the lower surface near the peripheral edge of each through hole 12a except the center. Can be done.

An insulating layer (not shown) as described above for ensuring the insulating property between the circuits of each energizing pattern 12b is arranged on the lower surface side of the energizing layer 12. In this state, the fourth foil-like member 10A and the ionic conductive film 6 are superposed, and the ionic conductive film 6 is brought into close contact with the surface E of each conductor layer D of the object to be treated C via the through holes 11a. Then, the plating process is performed.

As shown in FIGS. 9A and 9B, the object C to be plated is in a state in which a coating film F formed by plating is formed on the surface E of each conductor layer D excluding the center. In the plating process using the fourth foil-shaped member 10A, the plating process can be performed uniformly or differently for each energization pattern 12b, but like the conductor layer D arranged in the center above, the conductor Depending on the pattern of the layer D and the degree of density, it may not be possible to perform the plating treatment at one time. In such a case, for example, the fifth foil-shaped member 10B (see FIG. 11A) may be used in one or more plating treatments, or the fourth foil-shaped member may be used. It may be used in combination with 10A.

10B is a top view schematically showing the fifth foil-like member 10B, FIG. 10A shows the current-carrying layer 12A of the first layer, and FIG. 10B shows the insulating layer 11A of the second layer. 10 (c) shows the current-carrying layer 12B of the third layer, and FIG. 10 (d) shows the insulating layer 11B of the fourth layer. Further, FIG. 11 is a diagram schematically showing the fifth foil-shaped member 10B and the object to be treated C, and FIG. 11A shows a state in which the fifth foil-like member 10B is superposed on the object to be treated C. 11 (b) shows the upper surface, FIG. 11 (b) shows the upper surface of the object to be treated C, and FIG. 11 (c) shows the cross-sectional view taken along the line NN of FIG. 11 (b).

First, the first conductor layer D arranged in the center of the object C provided with the nine conductor layers D as described above and the second conductor layer D adjacent to the first conductor layer D are independently corresponding to each other. When the surface E is plated with the holes 12a1, 12a2 and the energization patterns 12b1, 12b2, the fifth foil-like member 10B is configured to have at least a four-layer structure.

First, for example, as shown in FIG. 10A, the current-carrying layer 12A of the first layer closest to the object C is a through hole having an opening diameter slightly smaller than the outer diameter of the second conductor layer D, for example. It is composed of an independent energization pattern 12b1 having 12a1. Next, as shown in FIG. 10B, the insulating layer 11A of the second layer arranged on the current-carrying layer 12A of the first layer has, for example, a treated region of the surface E of the second conductor layer D. The through hole 11a1 having an opening diameter slightly smaller than that of the through hole 12a1 and the through hole 11b1 having an opening diameter larger than that of the through hole 11a2 of the insulating layer 11B of the fourth layer, which will be described later, have an opening diameter corresponding to the above. , Corresponding to the first and second conductor layers D, respectively.

Next, the energizing layer 12B of the third layer arranged on the insulating layer 11A of the second layer is slightly smaller than the outer diameter of the first conductor layer D, for example, as shown in FIG. 10 (c). It has a through hole 12a2 with an opening diameter, and is composed of an independent energization pattern 12b2 that is out of phase (position) with the energization pattern 12b1 of the second layer.

Then, as shown in FIG. 10D, the insulating layer 11B of the fourth layer arranged on the current-carrying layer 12B of the third layer is, for example, in the area to be treated of the surface E of the first conductor layer D. A through hole 11a2 having a corresponding opening diameter slightly smaller than that of the through hole 12a2 and a through hole 11b2 having an opening diameter larger than that of the through hole 11a1 of the insulating layer 11A of the second layer are the first through holes, respectively. It is formed corresponding to the first and second conductor layers D.

When the fifth foil-shaped member 10B configured in this way is superposed on the object to be treated C, as shown in FIG. 11A, the fifth through holes 11a1, 11a2 of the insulating layers 11A and 11B are formed. The area to be treated on the surface E of the second and first conductor layers D is exposed. At the same time, a part of the energizing layers 12A and 12B can be brought into contact with the surface E of the second and first conductor layers D independently on the lower surface near the peripheral edge of the through holes 12a1 and 12a2, respectively.

An insulating layer (not shown) as described above is arranged on the lower surface side of the current-carrying layer 12A of the first layer. In this state, the fifth foil-like member 10B and the ionic conductive film 6 are superposed, and the ionic conductive film 6 is passed through the through holes 11b2, 11a1 and the through holes 11a2, 11b1 to the second and second and second processed objects C. It is brought into close contact with the surface E of the one conductor layer D. Then, a uniform plating process as described above or a different plating process is performed for each of the energization patterns 12b1 and 12b2.

As shown in FIGS. 11 (b) and 11 (c), the object C after the plating treatment is applied only to the surface E of each of the first and second conductor layers D in the middle and adjacent to the center. The film F is selectively formed by plating. In the plating process using the fifth foil-shaped member 10B, not only the plating process can be performed uniformly or differently for each energization pattern 12b, but also the number of laminated layers and the laminated layers of each energized layer 12 and the insulating layer 11 can be applied. By changing the pattern, it becomes possible to selectively plate any part including the first conductor layer D arranged in the center as illustrated in the fourth foil-like member 10A. Therefore, it is possible to perform a plating process that appropriately corresponds to various patterns of the conductor layer D and the degree of density.

In the surface treatment apparatus 1 according to the present embodiment, each of the foil-shaped members 10 has various configurations (for example, a fourth foil-shaped member 10A, a fifth foil-shaped member 10B, etc.) as described above, and then the surface thereof is formed. By performing the treatment, the surface E of the conductor layer D can be appropriately and selectively plated even on the object C to which the conductor layer D having a fine and complicated pattern is formed as described above.

Since the ion conductive film 6 is formed very thin as described above and has excellent flexibility and flexibility, it penetrates the surface E of the conductor layer D having a fine and complicated pattern. It can be sufficiently and surely adhered to the surface E through the holes 11a, 12a and the like. Therefore, it is possible to appropriately process the surface E of the conductor layer D having a finer pattern or a complicated pattern in the object C to be processed.

Further, in order to use the conductor layer D on the resin base material B of the object C as a cathode, the foil-like member 10 having the energizing layer 12 conducting conduction with the negative electrode of the power supply unit 7 is very thin and inexpensively configured. Therefore, the amount of deformation in the thickness direction when the ion conductive film 6 comes into close contact with the surface E of the conductor layer D can be reduced, and the load applied to the ion conductive film 6 can be reduced.

Further, in the conventional film forming apparatus disclosed in Patent Document 1, the material of the conductive member is limited to a metal material in which a passive film is likely to be formed, but the foil-like member 10 according to the present embodiment is made of various materials. Since the insulating layer 11 and the current-carrying layer 12 can be formed by the combination of the above, the restriction of the member conducting with the negative electrode of the power supply unit 7 is reduced in order to use the conductor layer D as the cathode, and the material choice of the member is greatly increased. In addition to being able to expand, for example, it is possible to improve current efficiency and perform finer processing and complicated processing uniformly and appropriately.

Further, according to the foil-shaped member 10 according to the present embodiment, the insulating layer 11 can electrically separate the ion conductive film 6 and the current-carrying layer 12, so that the current-carrying layer 12 is electrolyzed (this embodiment). In the form, it is possible to prevent metal precipitation) from occurring. Further, in the foil-like member 10 according to the present embodiment, the insulating layer 11 is placed between the current-carrying layer 12 and the ion conductive film 6 at least at the contact portion between the current-carrying layer 12 and the conductor layer D of the object C to be processed. Since they are arranged, the insulating layer 11 can be electrically separated from the ion conductive film 6 even in the contact portion, and the current-carrying layer 12 and the conductor layer D are joined by a plating film or the like. Can be avoided.

Although the embodiment of the present invention has been described above, this embodiment is presented as an example and is not intended to limit the scope of the invention. This novel embodiment can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

For example, in the above embodiment, the cage-shaped member 20 in the liquid chamber 3 is used as an anode, and the conductor layer D of the object C in which the current-carrying layer 12 of the foil-shaped member 10 is in contact with the surface E is used as a cathode as an ion. A plating process in which the conductive film 6 is brought into close contact with the surface E of the conductor layer D and a voltage is applied to precipitate a metal has been described as an example, but the surface treatment is not limited to such a plating process. do not have.

That is, the surface treatment apparatus 1 is used, for example, for a type of dip plating treatment in which a plating solution is introduced into a liquid chamber 3 to immerse the object to be treated C and then plating is performed without using the ion conductive film 6. It is also possible to do.

Further, in the surface treatment device 1, the polarities of the positive electrode and the negative electrode of the power supply unit 7 are exchanged, the conductor layer D of the object to be treated C is an anode, and the electrodes are arranged in the housing 4 (the cage-shaped member 20 in the above embodiment). Can be used for etching treatment, cleaning treatment, and the like of the conductor layer D of the object to be treated C by using the cathode as a cathode. In this case, both the ion conductive film 6 and the foil-shaped member 10 may be used, or only the foil-shaped member 10 may be used.

As described above, the foil-shaped member 10 can take various shapes as long as the current-carrying layer 12 is in contact with a part of the conductor layer D. That is, in the foil-like member 10, the insulating layer 11 and the energizing layer 12 are arranged so as not to block the area to be treated on the surface E of the conductor layer D of the object C, and the energizing layer 12 is placed on the conductor layer D. Since it may be arranged so as to be in contact with a part thereof, it is not limited to the above-exemplified shape and arrangement mode. For example, when the portion of the object to be treated C other than the conductor layer D is insulating and it is not necessary to mask with the insulating layer 11 and / or the release film material 46, the through hole 11a and the separation of the insulating layer 11 The through hole of the mold film material 46 may be formed larger than the area to be treated on the surface E of the conductor layer D of the object C, and the insulating layer 11 and / or the release film material 46 may not function as a mask material. ..

Further, in the above embodiment, the insulating layer 11 and / or the release film material 46 has been described as having a through hole having a rectangular closed outer edge as shown in the figure (square shape). The insulating layer 11 is not limited to this, and the current-carrying layer 12 and the ion conductive film 6 can be electrically separated by the insulating layer 11, and the insulating layer 11 is arranged at a desired position with respect to the untreated region of the object to be treated C. The shape of the through hole can be arbitrarily changed as long as it can be configured, and the configuration may have no through hole. In addition, in this specification, a "through hole" means an opening penetrating from one surface to the other surface, and is not limited to an opening in which the entire outer edge is closed, and a part of the outer edge is opened. Shapes (eg, U-shaped notches, etc.) shall also be included.

In the object C to be treated, for example, the conductor layer D is formed on the surface of the resin base material B, and the conductor layer on the back surface side and the conductor layer D on the front surface side of the resin base material B are transferred to the resin base material B. Side plating (electroless plating applied to the entire circumference including the side surface of the resin base material) or through holes (TH) formed from the front surface to the back surface of the resin base material B are connected by means. In this case, the foil-shaped member 10 of the surface treatment device 1 may be configured to include only the insulating layer 11, and the foil-shaped member 10 can be used as a mask material for surface treatment. In this case, the negative electrode of the power supply unit 7 may be connected to the mounting base 2.

Further, for example, in the surface treatment process according to the above-described embodiment, the surface treatment process of increasing the pressure of the electrolytic solution and precipitating the metal by energization has been described. However, when it is necessary to heat the object to be treated C, FIG. The upper heater 55 and the lower heater 56 can be arranged on the upper surface of the housing 4 and the lower surface side of the mounting base 2 shown in the above, and the object C to be treated can be set to a desired temperature. Further, if the solution supply unit is provided with a heating unit and a cooling unit for the electrolytic solution, the temperature of the object to be treated C can be changed more rapidly.

Further, the surface treatment device 1 has been described by taking as an example a so-called vertical surface treatment device in which the housing 4 is provided above the mounting base 2, but the surface treatment device 1 is not limited thereto. Further, although the opening of the discharge flow path 31 facing the liquid chamber 3 has been described as being provided at the uppermost portion of the inner side surface of the housing 4, the function of discharging the gas in the liquid chamber 3 is not limited to this. The position of the opening of the discharge flow path 31 can be arbitrarily changed as long as it does not hinder. Therefore, for example, an opening may be formed on the inner upper surface of the housing 4.

Further, although the opening of the supply flow path 41 facing the liquid chamber 3 has been described as being provided at the lowermost portion of the inner side surface of the housing 4, the present invention is not limited to this, and the electrolytic solution is supplied to the liquid chamber 3. The position of the opening of the supply flow path 41 can be arbitrarily changed as long as the function of discharging is not impaired. Therefore, for example, an opening may be formed in the mounting base 2.

Further, it has been described that the inner upper surface of the housing 4 (of the liquid chamber 3) is inclined with respect to the vertical direction with the opening side of the discharge flow path 31 as the uppermost portion, but the present invention is not limited to this, and the (liquid) of the housing 4 is not limited to this. Various configurations such as a configuration in which only a part of the inner upper surface of the chamber 3 is inclined with respect to the vertical direction, and a configuration in which the inner upper surface of the housing 4 (of the liquid chamber 3) is flat without being inclined with respect to the vertical direction. Can be adopted.

Further, in the above-described embodiment, the pressurizing mechanism 30 with an on-off valve and the flow path on-off valve 40 have been described as being mounted on the outer side surface of the housing 4, but the present invention is not limited to this, and for example, the inside of the side wall of the housing 4. These installation positions can be arbitrarily changed, such as a configuration that is integrally provided in the surface treatment device 1 so as to be embedded in the surface treatment device 1, or a configuration that is completely externally provided as a separate body via a flow path system pipe or the like. be.

In addition, the description has been made assuming that the housing 4 is provided with a pressurizing mechanism 30 with an on-off valve, but the present invention is not limited to this, and the surface treatment device 1 may be configured to pressurize the electrolytic solution filled in the liquid chamber 3. For example, after the liquid chamber 3 is formed, the housing 4 is further brought closer to the mounting base 2 (or the mounting base 2 is brought closer to the housing 4) to electrolyze the liquid chamber 3. It may be configured to pressurize the liquid. Further, the installation position of the pressurizing mechanism 30 with an on-off valve can be arbitrarily changed as long as the function of pressurizing the electrolytic solution in the liquid chamber 3 is not impaired.

Further, although the moving mechanism 5 has been described as including the linear motion rod 51, the present invention is not limited to this, and at least one of the mounting base 2 and the housing 4 is relatively moved in a direction of approaching or separating from the other. As long as it is possible, various mechanisms such as a pneumatic or hydraulic cylinder mechanism, a ball screw mechanism, a rack and pinion mechanism, and a toggle mechanism can be adopted.

The moving mechanism 5 has a configuration in which the mounting base 2 and the housing 4 can be held (locked) in a position so as to be relatively immovable, for example, the mounting base 5 has a pressure equal to or higher than the pressure (internal pressure) in the liquid chamber 3. It is possible to further include a configuration for restricting the relative movement of the mounting base 2 and the housing 4 by pressing at least one of the mounting base 2 and the housing 4, and a configuration such as a physical locking mechanism.

Surface treatment is used in many fields including an object C such as an electronic component, and the present invention has a wide range of applications and applications. Further, in the case of surface treatment in which the electrolytic solution can be brought into direct contact with the object to be treated C, the above-mentioned ion conductive film 6 can be eliminated to form the surface treatment device 1, so that the device configuration is simpler. It is possible to perform various surface treatments.

1 Surface treatment device 2 Mounting base 3 Liquid chamber 4 Housing 5 Moving mechanism 6 Ion conduction film 7 Power supply part 8 Support base 9 Exhaust flow path 9a Exhaust port 9b Tray 10 Foil-like member 11 Insulation layer 12 Energizing layer 13 Connector part 20 Cage-shaped member 21 Support pillar 22 Height adjustment spacer 23 Bottom 30 Pressurizing mechanism with on-off valve 31 Discharge flow path 32,42,49 Spool 33,43,57 Closing operation port 34,44,58 Opening operation port 35, 45 Supply / discharge port 36 Inner frame membrane jig 37 Outer frame membrane jig 38 Upper clamp part 39 Lower clamp part 40 Flow path on-off valve 41 Supply flow path 46 Release film material 47 On-off valve 48 Decompression flow path 50 Tilt mechanism 50a Straight Dynamic rod 51 Linear rod 52 Peeling mechanism 52a Linear rod 55 Upper heater 55a Insulation member 56 Lower heater B Resin base material C Material to be treated D Conductor layer E Surface F coating

Claims (13)

A mounting base on which a material to be processed with a conductor layer formed on the surface can be placed,
A housing that is placed opposite to the above-mentioned pedestal and can form a liquid chamber inside,
The electrodes arranged in the housing and
A solution supply unit capable of supplying the electrolytic solution into the liquid chamber,
An ionic conductive membrane arranged between the liquid chamber and the above-mentioned pedestal,
A foil-like member having an insulating layer and an energizing layer arranged between the ion conductive film and the object to be treated,
A power supply unit for applying a voltage between the electrode and the conductor layer is provided.
The foil-like member is
The energizing layer is arranged so as to be in contact with a part of the conductor layer so as to conduct the power supply unit and the conductor layer, and the insulating layer is placed between the energizing layer and the ion conductive film. Placed in
The ionic conductive film is brought into contact with the surface of the conductor layer, a voltage is applied between the electrode and the conductor layer connected to the current-carrying layer, and the conductor layer is electrolyzed via the ionic conductive film. A surface treatment device characterized by treating the surface of a material. The surface treatment apparatus according to claim 1, wherein the electrode is arranged at a position of being immersed in the electrolytic solution in the liquid chamber. The electrode is composed of a metal cage-shaped member arranged in the liquid chamber.
The surface treatment apparatus according to claim 1 or 2, wherein a soluble metal is arranged inside the cage-shaped member. The surface treatment apparatus according to any one of claims 1 to 3, wherein the foil-like member is formed by alternately laminating a plurality of the insulating layer and the energizing layer. The surface treatment apparatus according to any one of claims 1 to 4, wherein the foil-like member is composed of a flexible printed circuit board having the insulating layer and the energizing layer. The surface treatment apparatus according to any one of claims 1 to 5, further comprising a release film material arranged between the ion conductive film and the foil-like member. The surface treatment apparatus according to any one of claims 1 to 5, wherein the foil-like member is subjected to a mold release treatment on a surface in contact with the ion conductive film. The energizing layer of the foil-like member has a plurality of energizing patterns.
The surface according to any one of claims 1 to 7, wherein the power supply unit is configured to be able to control at least one of an applied voltage, an applied current, and an applied time for each of the plurality of energization patterns. Processing equipment. The insulating layer of the foil-like member has a through hole having a shape corresponding to the shape of the surface of the conductor layer to be treated, and the through hole is arranged on the processed region and the through hole is arranged. The surface treatment apparatus according to any one of claims 1 to 8, wherein a portion other than the above is arranged so as to cover the non-treated region on the surface of the conductor layer. The insulating layer of the foil-like member is characterized in that it is arranged between the current-carrying layer and the ion conductive film at least at a contact portion between the current-carrying layer and the conductor layer of the object to be treated. The surface treatment apparatus according to any one of claims 1 to 9. The surface treatment apparatus according to any one of claims 1 to 10, further comprising a tilting mechanism capable of tilting the base and the housing at a predetermined angle. A mounting base on which a material to be processed with a conductor layer formed on the surface can be placed,
A housing that is placed opposite to the above-mentioned pedestal and can form a liquid chamber inside,
The electrodes arranged in the housing and
A solution supply unit capable of supplying the electrolytic solution into the liquid chamber,
A foil-like member arranged between the liquid chamber and the object to be treated,
A power supply unit for applying a voltage between the electrode and the conductor layer is provided.
The foil-like member is
It has a through hole having a shape corresponding to the shape of the area to be processed on the surface of the conductor layer, and the through hole is configured to be arranged on the area to be processed.
The electrolytic solution is brought into contact with the surface of the conductor layer through the through hole, a voltage is applied between the electrode and the conductor layer conducted with the power supply unit, and the surface of the conductor layer is electrolyzed. A surface treatment device characterized by processing. Further, an ion conductive film arranged between the liquid chamber and the above-mentioned pedestal on the liquid chamber side of the foil-like member is further provided.
The twelfth aspect of claim 12, wherein the ion conductive film is brought into contact with the surface of the conductor layer through the through hole, and the surface of the conductor layer is treated by the electrolysis through the ion conductive film. Surface treatment equipment.

Images