JP2022041869A - Power conversion device and connection structure between components - Google Patents

Abstract

To extend a geometrically allowable range of a fitting part for electrically connecting between components.SOLUTION: A power conversion device concerning the present disclosure comprises: a first component; a second component; and a plurality of pairs of fitting members each of which includes a male type fitting member and a female type fitting member. The male type fitting member comprises a substantially plate-like insertion part. The female type fitting member comprises first and second clamping parts to be arranged opposite to each other. In each of the plurality of pairs of fitting members, the male type fitting member is arranged in one of the first and second components, and the female type fitting member is arranged in the other of the first and second components. The first and second components are coupled with each other by clamping the insertion part inserted between the first and second clamping parts by the female type fitting member in each of the plurality of pairs of fitting members. Each of the first and second clamping parts bends to form a protrusion toward surfaces opposite to each other. A gap is provided at each tip part of the first and second clamping parts.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a power conversion device and a connection structure between parts.

Conventionally, a power conversion device mounted on an electric vehicle or the like is provided with a plurality of circuit boards on which circuit configurations such as a DC / DC converter and an inverter are mounted. Such a power conversion device is required to be miniaturized, for example, from the viewpoint of mountability on a vehicle.

Under such circumstances, there is known a technique for reducing the size of a power conversion device while maintaining a mounting area on a plurality of circuit boards by stacking a plurality of circuit boards. In such a power conversion device, electrical connection between the parts may be made by fitting a fitting portion such as a connector provided on each part such as a circuit board.

Japanese Unexamined Patent Publication No. 2000-14128

However, if the mounting accuracy of the fitting part on each part is lowered, the fitting part may not be properly fitted in the assembly process of the power conversion device, and the electrical connection between the parts may be defective. there were.

The present disclosure provides a power conversion device and a component-to-part connection structure capable of expanding the geometrical tolerance of a fitting portion that electrically connects the components.

The power conversion device according to the present disclosure includes a first component, a second component, and a plurality of pairs of fitting members. The plurality of pairs of fitting members include a male-type fitting member and a female-type fitting member, respectively. The male fitting member has a substantially flat plate-shaped insertion portion. The female fitting member has a first holding portion and a second holding portion arranged so as to face each other. In each of the plurality of pairs of fitting members, the male fitting member is arranged on one of the first component and the second component, and the female fitting member is the first component and the first component. It is placed on the other side of the second component. In each of the plurality of pairs of fitting members, the first part and the second part have the female fitting member inserted between the first holding portion and the second holding portion. It is connected by sandwiching the insertion portion of the male type fitting member. Each of the first pinching portion and the second pinching portion is bent so as to form a convex portion toward the surfaces facing each other. A gap is provided at the tip of each of the first holding portion and the second holding portion.

According to the power conversion device and the connection structure between parts according to the present disclosure, it is possible to expand the geometrical allowable range of the fitting portion that electrically connects the parts.

FIG. 1 is a schematic cross-sectional view showing an example of a layered structure of a plurality of circuit boards in the power conversion device according to the first embodiment. FIG. 2 is a schematic perspective view showing an example of the configuration of the male type fitting member of FIG. FIG. 3 is a schematic perspective view showing another example of the configuration of the male fitting member of FIG. 1. FIG. 4 is a schematic perspective view showing another example of the configuration of the male fitting member of FIG. 1. FIG. 5 is a schematic perspective view showing an example of the configuration of the female fitting member of FIG. FIG. 6 is a schematic perspective view showing another example of the configuration of the female fitting member of FIG. 1. FIG. 7 is a schematic perspective view showing a state in which the female fitting member of FIG. 5 is mounted on the circuit board. FIG. 8 is a schematic cross-sectional view showing an example of a fitting state between the male fitting member of FIG. 2 or 3 and the female fitting member of FIG. FIG. 9 is a schematic cross-sectional view showing an example of a fitting state between the male fitting member of FIG. 4 and the female fitting member of FIG. FIG. 10 is a diagram for explaining mounting of the male type fitting member according to the first embodiment on a circuit board. FIG. 11 is a diagram for explaining an expansion of a geometrically permissible range in fitting a male-type fitting member and a female-type fitting member according to the first embodiment. FIG. 12 is a schematic perspective view showing another example of the insulating portion according to the first embodiment. FIG. 13 is a diagram for explaining an expansion of a geometrically permissible range in fitting between a male-type fitting member and a female-type fitting member when the covering member of FIG. 12 is attached. FIG. 14 is a flowchart showing an example of the flow of connection between substrates according to the first embodiment. FIG. 15 is a schematic cross-sectional view showing an example of an inter-component connection structure in the power conversion device according to the second embodiment. FIG. 16 is a schematic cross-sectional view showing an example of a component-to-part connection structure in the power conversion device according to the third embodiment. FIG. 17 is a schematic cross-sectional view showing an example of an inter-component connection structure in the power conversion device according to the fourth embodiment. FIG. 18 is a schematic cross-sectional view showing an example of a component-to-part connection structure in the power conversion device according to the fifth embodiment. FIG. 19 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the fifth embodiment. FIG. 20 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the fifth embodiment. FIG. 21 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the fifth embodiment. FIG. 22 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the fifth embodiment. FIG. 23 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the fifth embodiment. FIG. 24 is a schematic cross-sectional view showing an example of a component-to-part connection structure in the power conversion device according to the sixth embodiment. FIG. 25 is a schematic perspective view showing an example of the configuration of the male type fitting member according to the seventh embodiment. FIG. 26 is a schematic cross-sectional view showing an example of a component-to-part connection structure in the power conversion device according to the seventh embodiment. FIG. 27 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the seventh embodiment. FIG. 28 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the seventh embodiment. FIG. 29 is a schematic perspective view showing an example of an electronic component on which the male type fitting member according to the seventh embodiment is mounted. FIG. 30 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device according to the seventh embodiment. FIG. 31 is a diagram for explaining the expansion of the geometrically permissible range in the fitting of the male-type fitting member and the female-type fitting member according to the eighth embodiment. FIG. 32 is a schematic cross-sectional view showing an example of the configuration of the power conversion device according to the embodiment.

Hereinafter, embodiments of the power conversion device, the component-to-part connection structure, and the component-to-component connection method according to the present disclosure will be described with reference to the drawings.

(First Embodiment)
The power conversion device according to the embodiment is, for example, mounted on an electric vehicle or the like, converts AC power supplied from a power source (external power source) into DC power having a predetermined voltage, and converts the converted DC power into a lithium ion battery. It is an in-vehicle charger that outputs to a battery such as. Such a power conversion device mounts a plurality of circuit boards on which circuit configurations such as a DC / DC converter and an inverter are mounted.

FIG. 1 is a schematic cross-sectional view showing an example of a layered structure of a plurality of circuit boards in the power conversion device 1 according to the embodiment. FIG. 1 illustrates a first substrate PCB1, a second substrate PCB2, and a third substrate PCB3 among a plurality of circuit boards included in the power conversion device 1.

The first substrate PCB1, the second substrate PCB2, the third substrate PCB3, and the fourth substrate PCB4 are printed circuit boards (PCBs: Printed Circuit Boards), respectively. The printed circuit board is, for example, a glass epoxy board formed of an aluminum alloy or a copper alloy as a base material. By contacting a part of the aluminum alloy or copper alloy of the printed circuit board with a water-cooled pedestal so as to be heat exchangeable, it is possible to suppress the temperature rise of the electronic components mounted on the printed circuit board. By using a printed circuit board whose base material is metal, the cooling efficiency can be improved as compared with the case where a printed circuit board whose base material is resin is used.

The first substrate PCB 1 is coupled to the second substrate PCB 2 by a plurality of pairs of fitting members B. In the following description, the plurality of pairs of fitting members B may be referred to as a plurality of pairs of fitting members B. Further, the pair of fitting members B may be expressed as a fitting portion. The first substrate PCB 1 is electrically connected to the second substrate PCB 2 and outputs electric power corresponding to the electric power supplied from the second substrate PCB 2 to a battery or the like. The first substrate PCB 1 is electrically connected to the fourth substrate PCB 4 to form the substrate unit X. A plurality of male fitting members Bm are mounted on the main surface of the first substrate PCB1 on the second substrate PCB2 side. As an example, the first substrate PCB1 mounts 24 male fitting members Bm.

The first substrate PCB 1 is also coupled to and from a transformer unit (not shown) by a pair of fitting members B. As an example, the first substrate PCB1 mounts 12 male fitting members Bm or female fitting members Bf for electrical connection with the transformer unit. Further, the first substrate PCB1 and the fourth substrate PCB4 of the substrate unit X can be connected by a plurality of pairs of fitting members B according to the embodiment. That is, the inter-board connection structure according to the embodiment may be applied to the coupling between the substrates in the substrate unit such as the substrate unit X, may be applied to the coupling between the substrate units, or may be applied to the coupling between the substrate units and the substrates. It may be applied to the coupling with the substrate outside the unit.

The second substrate PCB 2 is coupled to each of the first substrate PCB 1 and the third substrate PCB 3 by a plurality of pairs of fitting members B. The second substrate PCB 2 is electrically connected to each of the first substrate PCB 1 and the third substrate PCB 3, and outputs the electric power corresponding to the electric power supplied from the third substrate PCB 3 to the first substrate PCB 1. .. A plurality of female fitting members Bf are mounted on the main surface of the second substrate PCB2 on the first substrate PCB1 side and the main surface of the second substrate PCB2 on the third substrate PCB3 side, respectively.

The third substrate PCB 3 is coupled to the second substrate PCB 2 by a plurality of pairs of fitting members B. The third board PCB 3 is electrically connected to, for example, an external power source, and inputs power from the external power source. A plurality of male fitting members Bm are mounted on the main surface of the third substrate PCB3 on the second substrate PCB2 side. As an example, the third substrate PCB3 mounts six male fitting members Bm.

It is also possible to use only a part of the printed circuit boards of the plurality of circuit boards of the power conversion device 1 as the printed circuit boards. For example, at least one of the first substrate PCB1, the second substrate PCB2, and the third substrate PCB3 can be a printed circuit board. Further, the connection between the circuit boards by the pair of fitting members B does not necessarily have to be an electrical connection. However, the embodiment mainly illustrates a case where two circuit boards are electrically coupled by a plurality of pairs of fitting members B.

In the embodiment, a plurality of male fitting members Bm are arranged on the first substrate PCB1 and the third substrate PCB3, and a plurality of female fitting members Bf are arranged on both main surfaces of the second substrate PCB2. However, the case is not limited to this. For example, a plurality of female fitting members Bf may be arranged on the first substrate PCB1 and the third substrate PCB3, and a plurality of male fitting members Bm may be arranged on both main surfaces of the second substrate PCB2. ..

Further, for example, a plurality of male fitting members Bm are arranged on one main surface of the second substrate PCB2, and a plurality of female fitting members Bf are arranged on the other main surface of the second substrate PCB2. It can also be configured. That is, when a plurality of circuit boards of the power conversion device 1 form a layered structure of three or more layers, a male fitting member Bm or a female fitting member Bf is placed on both main surfaces of the substrate forming the intermediate layer. Be placed.

Further, for example, in each of the first substrate PCB1, the second substrate PCB2, and the third substrate PCB3, a plurality of male fitting members Bm and a plurality of female fitting members Bf are arranged on one main surface. It can also be configured.

As described above, in the power conversion device 1 according to the embodiment, two circuit boards out of at least two circuit boards to be stacked are connected by a plurality of pairs of fitting members B. Each of the plurality of pairs of fitting members B includes a male fitting member Bm and a female fitting member Bf. That is, the plurality of pairs of fitting members B are a plurality of pairs of fitting members B. Further, each of the plurality of pairs of fitting members B, that is, the pair of fitting members B is a pair of the male type fitting member Bm and the female type fitting member Bf. Here, one of a plurality of pairs of fitting members B is arranged on the main surfaces of the two laminated circuit boards facing each other. Specifically, as described above, in each of the plurality of pairs of fitting members B, the male fitting member Bm is arranged on one of the two circuit boards to be laminated, and the female fitting member Bf is a female fitting member Bf. It is placed on the other side of the two circuit boards to be stacked. Further, as described above, as an example, either the male type fitting member Bm or the female type fitting member Bf is attached to each of the two circuit boards connected by fitting a plurality of pairs of fitting members B. Only one is placed. As another example, each of the two circuit boards coupled by fitting a plurality of pairs of fitting members B has at least one male fitting member Bm and at least one female fitting member Bf. Be placed. The male fitting member Bm is a blade-shaped connector (Plug) on the insertion side. The male fitting member Bm can also be expressed as a flat plug blade. The female fitting member Bf is a connector on the side to be inserted. The female fitting member Bf can also be expressed as a blade receiving spring.

FIG. 2 is a schematic perspective view showing an example of the configuration of the male fitting member Bm of FIG. The male fitting member Bm1 in FIG. 2 is an example of the male fitting member Bm according to the embodiment.

The insertion portion 11 of the male fitting member Bm1 has a substantially flat plate shape. The tip portion 13 of the insertion portion 11 is chamfered, and the thickness becomes smaller toward the tip side. As a result, the insertion portion 11 can be easily inserted into the receiving portion 20 of the female fitting member Bf. The connection portion 15 of the insertion portion 11 is each on the rear end side of the insertion portion 11 divided into two by the gap 17. Each of the connecting portions 15, that is, the rear end sides of the divided insertion portions 11, is bent in a direction substantially perpendicular to the insertion portion 11. The connection portion 15 is solder-bonded at a predetermined position on the PCB board, and electrically connects the insertion portion 11 and the wiring on the PCB board. The insertion portion 11 and the connection portion 15 can be formed, for example, by bending a single metal plate.

FIG. 3 is a schematic perspective view showing another example of the configuration of the male fitting member Bm of FIG. The male fitting member Bm2 in FIG. 3 is an example of the male fitting member Bm according to the embodiment. Here, the differences from the male fitting member Bm1 will be mainly described.

The length from the tip portion 13 of the insertion portion 11 of the male-type fitting member Bm2 to the connection portion 15 is larger than that of the male-type fitting member Bm1. On the other hand, the width and thickness of the insertion portion 11 of the male fitting member Bm2 is about the same as that of the male fitting member Bm1. The connection portion 15 of the insertion portion 11 is each of the rear end sides of the insertion portion 11 divided into three by the gap 17.

The number of divisions on the rear end side of the insertion portion 11 of the male fitting members Bm1 and Bm2 can be arbitrarily designed by two or more divisions. As an example, the larger the length of the insertion portion 11, the larger the number of divisions.

FIG. 4 is a schematic perspective view showing another example of the configuration of the male fitting member Bm of FIG. The male fitting member Bm3 in FIG. 4 is an example of the male fitting member Bm according to the embodiment. Here, the differences from the male fitting members Bm1 and Bm2 will be mainly described.

The connection portion 15 of the insertion portion 11 is on the rear end side of the insertion portion 11 in the same manner as the male type fitting members Bm1 and Bm2 described above. On the other hand, unlike the male fitting members Bm1 and Bm2, the rear end side of the insertion portion 11 is not divided. Further, a support member 19 for supporting the insertion portion 11 is provided on the tip end side of the insertion portion 11 from the connection portion 15. The support member 19 is formed of, for example, PPA (polyphthalamide resin), but may be formed of a conductive material, for example, PA (polyamide) or the like. The support member 19 has an insertion portion 19a. The insertion portion 19a is inserted into a hole provided at a predetermined position on the PCB substrate. As a result, the position on the PCB board on which the male fitting member Bm3 is mounted can be defined, so that the mounting accuracy of the male fitting member Bm3 can be improved. Note that FIG. 4 illustrates the support member 19 in which the two insertion portions 19a are formed, but the present invention is not limited to this. The support member 19 may have a plurality of insertion portions 19a of three or more.

FIG. 5 is a schematic perspective view showing an example of the configuration of the female fitting member Bf of FIG. The female fitting member Bf1 in FIG. 5 is an example of the female fitting member Bf according to the embodiment. The female fitting member Bf1 sandwiches the insertion portion 11 of the male fitting member Bm inserted into the receiving portion 20. The female fitting member Bf1 is formed, for example, by bending a single metal plate. The female fitting member Bf1 has a substantially Y-shaped shape with the tip side open when viewed from the side surface side, that is, the side of the first base portion 26a or the second base portion 26b.

Specifically, the female fitting member Bf has a first holding portion 21 and a second holding portion 22. The first sandwiching portion 21 and the second sandwiching portion 22 are arranged so as to face each other. The surface of the first sandwiching portion 21 facing the second sandwiching portion 22 and the surface of the second sandwiching portion 22 facing the first sandwiching portion 21 form a receiving portion 20. That is, the first holding portion 21 and the second holding portion 22 face each other via the receiving portion 20. The female fitting member Bf sandwiches the insertion portion 11 of the male fitting member Bm inserted into the receiving portion 20 between the first sandwiching portion 21 and the second sandwiching portion 22. The first holding portion 21 bends in the first bending portion 23a so as to be convex toward the facing second holding portion 22. Similarly, the second holding portion 22 bends in the first bending portion 23a so as to be convex toward the facing first holding portion 21. In other words, each of the first pinching portion 21 and the second pinching portion 22 bends at the first bent portion 23a so as to form a convex portion toward the surfaces facing each other. The first bent portion 23a of the first holding portion 21 and the first bent portion 23a of the second holding portion 22 are separated from each other via the receiving portion 20. The distance between the first bent portion 23a of the first holding portion 21 and the first bent portion 23a of the second holding portion 22 is smaller than the thickness of the insertion portion 11 of the male fitting member Bm. ..

A gap 27 is provided in each of the first holding portion 21 and the second holding portion 22 from the front end side to the rear end side. That is, each of the first sandwiching portion 21 and the second sandwiching portion 22 is divided into two by the gap 27. In other words, the tip of the female fitting member Bf1 is divided into four by the gap 27. Specifically, the first sandwiching portion 21 includes a first elastic portion 21a and a second elastic portion 21b divided by the gap 27. Similarly, the second sandwiching portion 22 includes a third elastic portion 22a and a fourth elastic portion 22b divided by the gap 27. Here, it can also be expressed that the first elastic portion 21a and the second elastic portion 21b are separated from each other through the gap 27. Similarly, the third elastic portion 22a and the fourth elastic portion 22b can be expressed as being separated from each other through the gap 27.

Note that FIG. 5 illustrates, but is not limited to, the female fitting member Bf divided into four by the gap 27. The number of divisions by the gap 27 may be 5 or more. However, it is preferable that the number of divisions of the first sandwiching portion 21 and the number of divisions of the second sandwiching portion 22 are equal, and the number of divisions due to the gap 27 is, for example, an even number of 6 or more. Relative rotational misalignment between the pair of fitting members B described below can occur in either direction. Therefore, by making the number of divisions of the first sandwiching portion 21 equal to the number of divisions of the second sandwiching portion 22, the geometrical allowable range of the fitting portion can be set regardless of the direction of rotation position deviation. Can be expanded.

Each of the first elastic portion 21a and the third elastic portion 22a extends from the first base portion 26a. In other words, each of the first elastic portion 21a and the third elastic portion 22a is continuously integrally connected to the first base portion 26a via the second bending portion 23b. Further, each of the second elastic portion 21b and the fourth elastic portion 22b extends from the second base portion 26b. In other words, each of the second elastic portion 21b and the fourth elastic portion 22b is continuously integrally connected to the second base portion 26b via the second bent portion 23b. Further, each of the first base portion 26a and the second base portion 26b extends from the connection portion 25 to the printed circuit board. In other words, each of the first base 26a and the second base 26b is continuously integrally connected to the connecting portion 25 via the third bent portion 23c.

Therefore, each of the first elastic portion 21a, the second elastic portion 21b, the third elastic portion 22a, and the fourth elastic portion 22b has a shape in which the first sandwiching portion 21 or the second sandwiching portion 22 is divided. Therefore, it can be independently deformed according to the contact state with the insertion portion 11.

FIG. 6 is a schematic perspective view showing another example of the configuration of the female fitting member Bf of FIG. The female fitting member Bf2 in FIG. 6 is an example of the female fitting member Bf according to the embodiment. Here, the differences from the female fitting member Bf1 will be mainly described. The female fitting member Bf2 has a substantially M-shaped shape when viewed from the side surface side.

A gap 27 is provided at the tip of each of the first holding portion 21 and the second holding portion 22. Unlike the female fitting member Bf1, the gap 27 is provided only at the tip portion. However, the tip portions of each of the first sandwiching portion 21 and the second sandwiching portion 22 are divided into two by the gap 27, similarly to the female fitting member Bf1. In other words, the tip of the female fitting member Bf2 is also divided into four by the gap 27. Here, it can be expressed that at least a part of the first elastic portion 21a and the second elastic portion 21b are separated from each other through the gap 27. Similarly, the third elastic portion 22a and the fourth elastic portion 22b can be expressed as having at least a part separated from each other through the gap 27.

Each of the first elastic portion 21a and the second elastic portion 21b extends from the first base portion 26a. The first base 26a extends from the first connection 25a to the printed circuit board. That is, each of the first elastic portion 21a and the second elastic portion 21b extends from the first connecting portion 25a. In other words, each of the first elastic portion 21a and the second elastic portion 21b is continuously integrally connected to the first connecting portion 25a via the first base portion 26a.

Further, each of the third elastic portion 22a and the fourth elastic portion 22b extends from the second base portion 26b. The second base 26b extends from the second connection 25b to the printed circuit board. That is, each of the third elastic portion 22a and the fourth elastic portion 22b extends from the second connecting portion 25b. In other words, each of the third elastic portion 22a and the fourth elastic portion 22b is continuously integrally connected to the second connecting portion 25b via the second base portion 26b.

The first connecting portion 25a and the second connecting portion 25b are separated from each other, unlike the female fitting member Bf1. On the other hand, the first holding portion 21 and the second holding portion 22 are continuously integrally connected via the fourth bent portion 23d.

Even with this configuration, each of the first elastic portion 21a, the second elastic portion 21b, the third elastic portion 22a, and the fourth elastic portion 22b is independent according to the contact state with the insertion portion 11. Can be transformed.

The male fitting member Bm and the female fitting member Bf are each made of a metal material. As an example, the male fitting member Bm and the female fitting member Bf are formed of a copper alloy including copper and brass, aluminum, or an aluminum alloy.

Further, a part or all of the surface regions of the male fitting member Bm and the female fitting member Bf are subjected to conductor plating. As the conductor plating, for example, tin plating, silver plating or gold plating can be appropriately used.

Here, tin has a property of being easily alloyed with nickel used as a base for the male fitting member Bm and the female fitting member Bf. When the ambient temperature rises, the alloying of tin and nickel progresses, and the resistance value becomes 1 [mΩ] or more. On the other hand, silver and gold are difficult to alloy with nickel, but they are expensive to use. When the contact resistance between the male fitting member Bm and the female fitting member Bf is large, the temperature rises at the contact portion between the male fitting member Bm and the female fitting member Bf. Therefore, in the power conversion device 1 according to the embodiment, the contact resistance at the contact portion between the male fitting member Bm and the female fitting member Bf is set to 1 [mΩ] or less. In other words, in a state where the pair of fitting members B are fitted, between the insertion portion 11 of the male fitting member Bm and the convex portion of the first holding portion 21 or the second holding portion 22. The contact resistance shall be 1 [mΩ] or less.

The magnitude of contact resistance is defined by "contact pressure (contact pressure)", "material (such as tin on the surface)" and "contact area". Therefore, in the power conversion device 1 according to the embodiment, as an example, the contact resistance is adjusted to 1 [mΩ] or less by adjusting the elastic forces of the four elastic portions of the female fitting member Bf. In other words, in the female fitting member Bf according to the embodiment, the elastic forces of the four elastic portions are designed so that the contact resistance is 1 [mΩ] or less. The elastic forces of the four elastic portions depend on, for example, the material (base material) of the female fitting member Bf and its shape.

The insertion portion 11 of the male fitting member Bm according to the embodiment has a substantially flat plate shape. Further, the female fitting member Bf according to the embodiment is configured to be fitted with the male fitting member Bm by sandwiching the inserted substantially flat plate-shaped insertion portion 11. As a result, the inter-board connection structure according to the embodiment is between the pair of fitting members B as compared with the inter-board connection structure realized by using, for example, a male-type fitting member having a pin-shaped insertion portion. Since the contact area can be increased, the contact resistance can be reduced. Reducing the contact resistance between the pair of fitting members B is described below in suppressing heat generation and power loss in the pair of fitting members B, and improving the degree of freedom regarding the shape and material of the female fitting member Bf. Contributes to simplification of determination of connection status.

For example, when the diameter of the pin shape and the thickness of the flat plate shape are the same, the width of the flat plate shape can be set arbitrarily. Therefore, the male type fitting member Bm of the flat plate shape has a pin shape of the same length. The contact area with the female fitting member Bf can be made larger than that of the male fitting member. Further, for example, when the cross-sectional area of the pin shape and the flat plate shape in the cross section parallel to the substrate are the same, the area of the main surface of the flat plate shape can be reduced by appropriately setting the thickness and width of the flat plate shape. , Can be larger than the surface area of a pin shape of the same length. That is, the flat plate-shaped male fitting member Bm can have a larger contact area with the female fitting member Bf than the pin-shaped male fitting member having the same length.

Here, the thickness of the insertion portion 11 is assumed to be the size of the insertion portion 11 in the left-right direction in the state shown in FIG. Further, the length of the insertion portion 11 is assumed to be the size of the insertion portion 11 in the vertical direction in the state shown in FIG. Further, the width of the insertion portion 11 is assumed to be the size in the direction perpendicular to the paper surface of the insertion portion 11 in the state shown in FIG.

An insulating portion is provided on the outer peripheral portion of the female fitting member Bf. As an example, the insulating portion is a layer 31 of an insulator formed on the outer peripheral portion of the female fitting member Bf (see FIG. 11). The layer 31 of the insulator may be formed by applying an insulator to the outer peripheral portion of the female fitting member Bf, or an insulating film formed by the insulator may be formed on the outer peripheral portion of the female fitting member Bf. It may be formed by pasting. As an example, the insulator is a resin. Here, the outer peripheral portion of the female fitting member Bf is a region on the side of the first sandwiching portion 21 facing the second sandwiching portion 22 and the first sandwiching portion 21 of the second sandwiching portion 22. It is a surface region of the female fitting member Bf excluding the region on the opposite side and the region in contact with the printed circuit board of the connection portion 25 (see FIG. 11). As a result, when a problem occurs in the fitting of the pair of male fitting member Bm and the female fitting member Bf due to the misalignment between the insertion portion 11 and the receiving portion 20, an electrical inspection is performed. Can detect the connection failure. Here, the electrical inspection is the measurement of the resistance value through the contact portion between the male type fitting member Bm and the female type fitting member Bf.

FIG. 7 is a schematic perspective view showing a state in which the female fitting member Bf1 of FIG. 5 is mounted on the circuit board. As shown in FIG. 7, the female fitting member Bf1 is surface-mounted on the printed circuit board. Specifically, the connecting portion 25 of the female fitting member Bf1 is electrically connected to the printed circuit board by solder joining via the solder SL. Note that FIG. 7 illustrates the female fitting member Bf1, but the same applies to the male fitting members Bm1 and Bm2.

FIG. 8 is a schematic cross-sectional view showing an example of a fitting state between the male fitting member Bm of FIG. 2 or 3 and the female fitting member Bf of FIG. As shown in FIG. 8, the female fitting member Bf sandwiches the insertion portion 11 of the male fitting member Bm inserted between the first sandwiching portion 21 and the second sandwiching portion 22. The substrate PCB on which the female fitting member Bf is arranged and the substrate PCB on which the male fitting member Bm is arranged are coupled. FIG. 8A1 illustrates a combination of the male fitting member Bm1 of FIG. 2 and the female fitting member Bf1 of FIG. FIG. 8A2 illustrates a combination of the male fitting member Bm2 of FIG. 3 and the female fitting member Bf1 of FIG. As described above with reference to FIGS. 2 and 3, the male fitting member Bm1 and the male fitting member Bm2 have different lengths of, for example, the insertion portion 11. As described above, the male fitting members Bm1 and Bm2 and the female fitting member Bf1 can be appropriately combined according to the distance between the substrates to be bonded and the like. Further, (b1) of FIG. 8 exemplifies a state in which the tip of the insertion portion 11 is inserted to a position where the tip of the insertion portion 11 comes into contact with the bottom of the receiving portion 20 of the female fitting member Bf1. FIG. 8B2 illustrates a state in which the tip of the insertion portion 11 is inserted to an arbitrary position before contacting the bottom of the receiving portion 20 of the female fitting member Bf1. As described above, the length for inserting the male fitting members Bm1 and Bm2 into the female fitting member Bf1, that is, the insertion height can be appropriately set according to the distance between the substrates to be bonded and the like.

When the combination illustrated in FIG. 8 is selected as the combination of the pair of fitting members B constituting the inter-board connection structure of the power conversion device 1, the man-hours for assembling the power conversion device 1 are easy because of the ease of surface mounting. Can be reduced.

9 is a schematic cross-sectional view showing an example of a fitting state between the male fitting member Bm3 of FIG. 4 and the female fitting member Bf2 of FIG. As shown in FIG. 9, the female fitting member Bf2 sandwiches the insertion portion 11 of the male fitting member Bm3 inserted between the first sandwiching portion 21 and the second sandwiching portion 22. The substrate PCB on which the female fitting member Bf2 is arranged and the substrate PCB on which the male fitting member Bm3 is arranged are coupled. As shown in FIG. 9, in the male fitting member Bm3, the connection portion 15 is inserted into the hole portion H3 provided at a predetermined position on the printed circuit board, and the insertion portion 19a is inserted into the hole portions H4 and H5. It is mounted on the printed circuit board in the inserted state. Specifically, the connection portion 15 inserted so as to penetrate the printed circuit board is electrically connected to the printed circuit board by dip solder joining. Further, in the female fitting member Bf2, the first connecting portion 25a is inserted into the hole portion H1 provided at a predetermined position on the printed circuit board, and the second connecting portion 25b is inserted into the hole portion H2. In this state, it is mounted on the printed circuit board. Specifically, the first connecting portion 25a and the second connecting portion 25b inserted so as to penetrate the printed circuit board are electrically connected to the printed circuit board by dip solder joining.

When the combination illustrated in FIG. 9 is selected as the combination of the pair of fitting members B constituting the inter-board connection structure of the power conversion device 1, it is possible to handle a large current due to the high robustness of the DIP mounting. Power conversion device 1 can be realized.

FIG. 10 is a diagram for explaining mounting of the male type fitting member Bm according to the embodiment on the circuit board. FIG. 10A exemplifies a male fitting member Bm mounted in a predetermined arrangement. FIG. 10B exemplifies a male fitting member Bm mounted by rotating it by an angle θ from a predetermined arrangement. FIG. 11 is a diagram for explaining the expansion of the geometrically permissible range in the fitting of the male fitting member Bm and the female fitting member Bf according to the embodiment. The cross-sectional view of FIG. 11 schematically illustrates the cross-sectional view of the fitting portion according to the embodiment. The part AA'in FIG. 11 shows the contact part where the male type fitting member Bm and the female type fitting member Bf come into contact with each other in the fitting part. The view of the AA'part of FIG. 11 from above exemplifies a cross-sectional view of the AA'part. Here, the basic corresponds to the state shown in FIG. 10 (a). Further, the rotation corresponds to the state shown in FIG. 10 (b).

As shown in FIGS. 8 and 9, the male fitting member Bm mounted on the printer circuit board is inserted into the receiving portion 20 of the female fitting member Bf. Specifically, the insertion portion 11 is in contact with the first sandwiching portion 21 and the second sandwiching portion 22, while pushing the gap between the first sandwiching portion 21 and the second sandwiching portion 22. Will be inserted. However, when the male fitting member Bm is mounted on the printer circuit board, for example, as shown in FIG. 10, the arrangement of the male fitting member Bm may deviate from the intended position. Similarly, when the female fitting member Bf is mounted on the printer circuit board, the arrangement may be misaligned. In such a case, the pair of fitting members B may not be properly fitted, and a connection failure between the substrates may occur. Further, even when each of the male type fitting member Bm and the female type fitting member Bf is mounted in a predetermined arrangement, the pair of fitting members B can be appropriately fitted depending on the position accuracy at the time of assembly. However, there is a risk of poor connection between the boards.

Under such circumstances, in the power conversion device 1 according to the embodiment, each of the first sandwiching portion 21 and the second sandwiching portion 22 is bent in a convex shape toward the receiving portion 20. That is, as shown in the cross-sectional view of FIG. 11, the tip end portion of the female fitting member Bf is formed in a shape that opens toward the male fitting member Bm. As a result, the tip portion of the female fitting member Bf can guide the insertion portion 11 of the male fitting member Bm to the receiving portion 20. Specifically, even when the insertion portion 11 is in the state shown in FIG. 10B, the tip portion 13 of the insertion portion 11 is inserted along the inner wall of the tip portion of the female fitting member Bf. It can be inserted into 20. Therefore, according to the fitting portion according to the embodiment, it is possible to expand the range of the relative rotational position deviation between the pair of fitting members B that can be appropriately fitted.

Further, in the power conversion device 1 according to the embodiment, a gap 27 is provided at the tip of each of the first sandwiching portion 21 and the second sandwiching portion 22. In other words, the tip of each of the first pinching portion 21 and the second pinching portion 22 is divided into at least two by the gap 27. That is, the tip portion of the female fitting member Bf according to the embodiment is divided into at least four parts. The rotation diagram of FIG. 11 illustrates a state in which the third elastic portion 22a is displaced in the direction of the arrow D by receiving a force from the insertion portion 11 whose rotational position is displaced. Further, the rotation diagram of FIG. 11 illustrates a direction in which the first elastic portion 21a can be deformed by receiving a force from the insertion portion 11 whose rotational position is displaced. As described above, the first elastic portion 21a, the second elastic portion 21b, the third elastic portion 22a, and the fourth elastic portion 22b, that is, the four divided tip portions, exert the force from the insertion portion 11. In response, they can be displaced and / or deformed independently. Therefore, even if the insertion portion 11 is in the state shown in FIG. 10B, the four divided tip portions are inserted as shown by the white circles in the rotation diagram of FIG. The portion 11 can be appropriately contacted. Therefore, according to the fitting portion according to the embodiment, it is possible to expand the range of the relative rotational position deviation between the pair of fitting members B that can realize a good connection.

As described above, according to the inter-board connection structure realized by the pair of fitting members B according to the embodiment, the geometrical allowable range of the fitting portion can be expanded.

Further, as shown in FIG. 11, an insulator layer 31 is formed as an insulating portion on the outer peripheral portion of the female fitting member Bf. Thereby, in the flow of the board-to-board connection according to the embodiment described below, the board-to-board connection state can be determined.

The insulating portion is not limited to the layer 31 of the insulator, and can be realized by other configurations. FIG. 12 is a schematic perspective view showing another example of the insulating portion according to the embodiment. FIG. 13 is a diagram for explaining an expansion of the geometrically permissible range in fitting the male fitting member Bm and the female fitting member Bf when the covering member 32 of FIG. 12 is mounted. .. As shown in FIG. 12, the insulating portion may be formed by a covering member 32 mounted on the outer peripheral portion of the female fitting member Bf. The covering member 32 has flexibility. The covering member 32 may have elasticity. The covering member 32 is formed of an insulator. As an example, the insulator is an insulating material such as a silicon resin. The covering member 32 is formed in a substantially cylindrical shape. The diameter on the upper end side of the covering member 32, that is, the dimension L1, is smaller than the dimension L2 on the lower end side. Along with this, the dimension on the upper end side of the inner peripheral portion 321 of the covering member 32 is also smaller than the dimension on the lower end side. This is a dimension determined in accordance with the fact that the shape of the outer peripheral portion of the female fitting member Bf becomes smaller from the lower end side to the upper end side, as shown in FIGS. 5 and 6 and the like. As shown in FIG. 13, when the covering member 32 is mounted on the outer peripheral portion of the female fitting member Bf, the inner peripheral portion 321 of the covering member 32 is attached to the first holding portion 21 and the second holding portion 22. Circumscribe. Further, as shown in FIG. 13, there are gaps G at both ends of the insertion portion 11 in the width direction. As shown in the rotation diagram of FIG. 13, the covering member 32 is independently displaced and / or deformed by the insertion portion 11 whose rotational position is displaced due to the flexibility of the covering member 32 and the degree of freedom of deformation due to the gap G. It can be deformed by following each of the four divided tips. Even with this configuration, the inter-board connection state can be determined in the flow of inter-board connection according to the embodiment described below. Due to its flexibility, the covering member 32 can realize an insulating portion in a state of being fitted to the outer peripheral portion of the female fitting member Bf with almost no gap only by mounting the covering member 32 on the female fitting member Bf.

Hereinafter, an example of the flow of connection between substrates according to the embodiment will be described with reference to the drawings. FIG. 14 is a flowchart showing an example of the flow of connection between substrates according to the embodiment.

First, the male fitting member Bm is arranged on the main surface of the first substrate PCB1 on the second substrate PCB2 side (S201). Further, the female fitting member Bf is arranged on the main surface of the second substrate PCB2 on the first substrate PCB1 side (S202). After each of the pair of fitting members B is placed on the printed circuit board, the pair of fitting members B on the printed circuit board B, for example, using an optical automated visual inspection device (AOI). Inspect the mounting status of each of the above. When a defect is detected in the mounting state of each of the pair of fitting members B on the printed circuit board by this inspection, the subsequent flow is not performed for the printed circuit board in which the defect is detected.

After that, the first substrate PCB1 and the second substrate PCB2 are coupled by fitting the pair of fitting members B (S203). In this step, after the contact between the male type fitting member Bm and the female type fitting member Bf is detected by the sensor, one printed circuit board is pushed against the other printed circuit board to form a stationary state of the layered structure. do. The female fitting member Bf has an elastic force (spring force) on the side opposite to the insertion direction of the insertion portion 11 of the male fitting member Bm. Therefore, when a plurality of male fitting members Bm are pushed into a plurality of female fitting members Bf at the same time, some male fitting members Bm may be disengaged from the receiving portion 20 of the female fitting member Bf. There is. Therefore, in this step, after making a reliable mating state once, one printed circuit board is further pushed into the other printed circuit board to realize good mating. Here, the reliable fitting state means a steady state in which the insertion portion 11 is pushed into the receiving portion 20 by, for example, about 1 mm.

After that, the electric resistance is measured via the fitting portion (S204). The measurement of the electric resistance through the fitting portion is performed, for example, by electrically connecting to an arbitrary position of the circuit configuration on the first substrate PCB1 electrically connected to the male fitting member Bm and to the female fitting member Bf. It is a measurement of the electrical resistance between an arbitrary position of the circuit configuration on the second substrate PCB2 connected to the object.

When the electric resistance through the fitting portion indicates an insulating state (S205: Yes), it is determined that the fitting portion has a poor connection (S206). On the other hand, when the electric resistance through the fitting portion does not show an insulating state (S205: No), it is determined that the fitting portion has a good connection (S207). After S206 or S207, the flow of FIG. 14 ends.

As described above, according to the inter-board connection method realized by using the pair of fitting members B according to the embodiment, the geometrical allowable range of the fitting portion can be expanded.

As described above, according to the power conversion device 1 according to the first embodiment, it is possible to expand the geometrical allowable range of the fitting portion that electrically connects the circuit boards. As a result, a plurality of circuit boards can be appropriately laminated, so that the power conversion device 1 can be downsized.

(Second embodiment)
Hereinafter, embodiments of the power conversion device, the component-to-part connection structure, and the component-to-component connection method according to the second embodiment will be described with reference to the drawings. Here, the differences from the first embodiment will be mainly described, and duplicated explanations will be omitted as appropriate.

In the first embodiment, the connection structure between parts according to the present disclosure has been described by taking the connection between substrates as an example, but the present invention is not limited to this. The component-to-component connection structure according to the present disclosure can be applied to, for example, a connection between a circuit board and an electronic component. FIG. 15 is a schematic cross-sectional view showing an example of an inter-component connection structure in the power conversion device 1 according to the second embodiment. FIG. 15 illustrates a first substrate PCB 1, a plurality of pairs of fitting members B, and an electronic component 51.

The electronic component 51 is mounted on the first substrate PCB1. The electronic component 51 has a second substrate PCB 2 and a third substrate PCB 3. The electronic component 51 is mounted on the first substrate PCB1 by coupling the first substrate PCB1 and the third substrate PCB3 by fitting a plurality of pairs of fitting members B.

Note that FIG. 15 illustrates a case where the female fitting member is provided on the first substrate PCB 1 and the male fitting member is provided on the third substrate PCB 3, but the present invention is not limited to this. A male fitting member may be provided on the first substrate PCB 1, and a female fitting member may be provided on the third substrate PCB 3. Further, the number of substrates included in the electronic component 51 may be one, or may be a plurality of three or more. For example, the electronic component 51 exemplified in FIG. 15 is a magnetic component such as a transformer, a transformer, a reactor, or a choke. In the substrate of the electronic component 51, for example, a conductor pattern forms a winding. Further, the electronic component 51 has a function as a magnetic component by penetrating a magnetic core through the inside and outside of the winding formed on the substrate to form a closed magnetic path. In this case, the electronic component 51 can be expressed as a printed circuit board transformer or a transformer-integrated printed circuit board.

As described above, the component-to-component connection structure according to the present disclosure can also be applied to the electrical connection between the circuit board and the electronic component 51. As a result, it is possible to improve the mounting density of parts such as electronic parts, circuit boards and board units in the power conversion device 1, and to improve the degree of freedom in arranging the parts. Improving the mounting density of components and increasing the degree of freedom in arrangement contribute to the miniaturization of the power conversion device 1, respectively.

(Third embodiment)
Hereinafter, embodiments of the power conversion device, the inter-component connection structure, and the inter-component connection method according to the third embodiment will be described with reference to the drawings. Here, the differences from the first embodiment will be mainly described, and duplicated explanations will be omitted as appropriate.

FIG. 16 is a schematic cross-sectional view showing an example of an inter-component connection structure in the power conversion device 1 according to the third embodiment. FIG. 16 illustrates a first substrate PCB 1, a second substrate PCB 2, a third substrate PCB 3, and a plurality of pairs of fitting members B.

The first substrate PCB1 and the third substrate PCB3 are connected by fitting a plurality of pairs of fitting members B. A second substrate PCB 2 is provided between the first substrate PCB 1 and the third substrate PCB 3. The second substrate PCB 2 is provided with, for example, a plurality of holes H. Each of the plurality of male fitting members provided on the first substrate PCB 1 or the third substrate PCB 3 passes through each of the plurality of holes H in the assembled state.

As described above, according to the component-to-part connection structure according to the present disclosure, a substrate not to be connected can be interposed between the substrates to be connected. Of course, according to the component-to-component connection structure according to the present disclosure, it is possible to interpose electronic components or substrate units that are not to be connected between the substrates to be connected. As a result, it is possible to improve the mounting density of parts such as electronic parts, circuit boards and board units in the power conversion device 1, and to improve the degree of freedom in arranging the parts. Improving the mounting density of components and increasing the degree of freedom in arrangement contribute to the miniaturization of the power conversion device 1, respectively.

Note that FIG. 16 illustrates a case where the second substrate PCB2 not to be connected is interposed between the first substrate PCB1 and the third substrate PCB3 to be connected, but the present invention is not limited to this. It is also possible to interpose electronic components or board units that are not to be connected between the first board PCB1 and the third board PCB3 to be connected.

(Fourth Embodiment)
Hereinafter, embodiments of the power conversion device, the inter-component connection structure, and the inter-component connection method according to the fourth embodiment will be described with reference to the drawings. Here, the differences from the first embodiment will be mainly described, and duplicated explanations will be omitted as appropriate.

In the first embodiment, a case where a pair of circuit boards are connected substantially in parallel by a plurality of pairs of fitting members B has been described as an example, but the present invention is not limited to this. A pair of circuit boards can also be coupled substantially vertically by a plurality of pairs of fitting members B. FIG. 17 is a schematic cross-sectional view showing an example of an inter-component connection structure in the power conversion device 1 according to the fourth embodiment. FIG. 17 illustrates a connection between the first substrate PCB1 and the second substrate PCB2 and a connection between the first substrate PCB1 and the third substrate PCB3.

FIG. 17A illustrates a case where the female fitting member Bf is provided on the first substrate PCB 1 and the male fitting member Bm is provided on the second substrate PCB 2. As shown in FIG. 17, the male fitting member Bm is provided at the end of the second substrate PCB2. The support member 40 is provided at the end of the second substrate PCB 2 and sandwiches the end of the second substrate PCB 2. The support member 40 defines the angle of the male fitting member Bm with respect to the second substrate PCB2. The connection portion 15 of the male fitting member Bm is joined to the support member 40. The insertion portion 11 of the male fitting member Bm is substantially parallel to the main surface of the second substrate PCB 2.

In the configuration of FIG. 17A, the male fitting member Bm and the second substrate PCB 2 may be electrically connected via the support member 40.

FIG. 17B illustrates a case where the male fitting member Bm is provided on the first substrate PCB 1 and the female fitting member Bf is provided on the third substrate PCB 3. In this case, the support member 40 is provided at the end of the third substrate PCB 3 and sandwiches the end of the third substrate PCB 3. The support member 40 defines the angle of the female fitting member Bf with respect to the third substrate PCB3. Unlike (a) in FIG. 17, the support member 40 is joined to the connecting portion 25 of the female fitting member Bf. The receiving portion 20 of the female fitting member Bf is substantially parallel to the main surface of the third substrate PCB 3. That is, the main surface of the third substrate PCB3 provided with the female fitting member Bf and the insertion portion 11 of the male fitting member Bm to be fitted with the female fitting member Bf are substantially parallel to each other. be.

In the configuration of FIG. 17B, the female fitting member Bf and the third substrate PCB 3 may be electrically connected via the support member 40.

As described above, according to the component-to-part connection structure according to the present embodiment, the pair of components can be connected substantially vertically by at least the pair of fitting members B. In other words, according to the component-to-part connection structure according to the present embodiment, at least the pair of fitting members B can connect the pair of components at an angle defined by the support member 40. As a result, it is possible to improve the mounting density of parts such as electronic parts, circuit boards and board units in the power conversion device 1, and to improve the degree of freedom in arranging the parts. Improving the mounting density of components and increasing the degree of freedom in arrangement contribute to the miniaturization of the power conversion device 1, respectively.

The support member 40 may be integrally formed with any one of the male fitting member Bm, the female fitting member Bf, and the second substrate PCB2, or the male fitting member Bm and the female fitting member 40. It may be formed as a separate component from the fitting member Bf and the second substrate PCB2.

In the configuration of FIG. 17, the first substrate PCB1 provided with at least one of the male fitting member Bm and the female fitting member Bf is at least one of the male fitting member Bm and the female fitting member Bf. One can be replaced with the provided electronic component 51.

(Fifth Embodiment)
Hereinafter, embodiments of the power conversion device, the component-to-part connection structure, and the component-to-component connection method according to the fifth embodiment will be described with reference to the drawings. Here, the differences from the first embodiment will be mainly described, and duplicated explanations will be omitted as appropriate.

FIG. 18 is a schematic cross-sectional view showing an example of an inter-component connection structure in the power conversion device 1 according to the fifth embodiment. FIG. 18 illustrates the connection between the first substrate PCB1 provided with the male fitting member Bm and the second substrate PCB2 provided with the female fitting member Bf. The support member 41 is provided on the first substrate PCB1. The support member 41 defines the angle of the male fitting member Bm with respect to the first substrate PCB1. The support member 41 has, for example, a rectangular parallelepiped shape. The bottom surface 411 of the support member 41 is fixed to the first substrate PCB1. The connection portion 15 of the male fitting member Bm is joined to the side surface 412 of the support member 41. The insertion portion 11 of the male fitting member Bm is substantially parallel to the main surface of the first substrate PCB1.

FIG. 19 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the fifth embodiment. As shown in FIG. 19, the first substrate PCB1 provided with the male fitting member Bm of FIG. 18 can also be electrically connected to the electronic component 51 provided with the female fitting member Bf.

In the configuration of FIG. 18, not only the male fitting member Bm but also the female fitting member Bf may be joined to the support member 41 of the first substrate PCB1. FIG. 20 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the fifth embodiment. FIG. 20 illustrates a connection between a first substrate PCB 1 provided with a female fitting member Bf and a second substrate PCB 2 provided with a male fitting member Bm. In the configuration of FIG. 20, the support member 41 defines the angle of the male fitting member Bm with respect to the first substrate PCB1. The connecting portion 25 of the female fitting member Bf is joined to the side surface 412 of the support member 41. The receiving portion 20 of the female fitting member Bf is fitted with the main surface of the first substrate PCB1 provided with the female fitting member Bf which is substantially parallel to the main surface of the first substrate PCB1. It is substantially parallel to the insertion portion 11 of the male fitting member Bm provided on the second substrate PCB2 to be fitted with the member Bf.

FIG. 21 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the fifth embodiment. As shown in FIG. 21, the first substrate PCB1 provided with the female fitting member Bf of FIG. 20 can also be electrically connected to the electronic component 51 provided with the male fitting member Bm. The male fitting member Bm may be integrally formed with the electronic component 51. In this case, as shown in FIG. 21, the connection portion 15 may be provided inside the electronic component 51.

In the configuration of FIG. 20, the receiving portion 20 of the female fitting member Bf may be substantially perpendicular to the main surface of the first substrate PCB1. FIG. 22 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the fifth embodiment. FIG. 22 illustrates the connection between the first substrate PCB1 provided with the female fitting member Bf and the second substrate PCB2 provided with the male fitting member Bm. The receiving portion 20 of the female fitting member Bf is substantially perpendicular to the main surface of the first substrate PCB 1, unlike the configurations of FIGS. 20 and 21. That is, in the configuration of FIG. 22, the support member 41 defines the angle of the female fitting member Bf with respect to the first substrate PCB1. Insertion portion of the main surface of the first substrate PCB1 provided with the female fitting member Bf and the male fitting member Bm provided on the second substrate PCB2 to be fitted with the female fitting member Bf. 11 is substantially vertical.

FIG. 23 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the fifth embodiment. As shown in FIG. 23, the first substrate PCB1 provided with the female fitting member Bf of FIG. 22 can also be electrically connected to the electronic component 51 provided with the male fitting member Bm. The male fitting member Bm may be integrally formed with the electronic component 51 as in the configuration of FIG. 21.

In the configurations of FIGS. 18 and 19, similarly to the configurations of FIGS. 22 and 23, even if the insertion portion 11 of the male fitting member Bm is substantially perpendicular to the main surface of the first substrate PCB1. good.

In the configurations of FIGS. 18 and 19, the male fitting member Bm and the first substrate PCB 1 may be electrically connected via the support member 41, or may not be connected via the support member 41. It doesn't matter if it is connected. Similarly, in the configurations of FIGS. 20 to 23, the female fitting member Bf and the first substrate PCB1 may be electrically connected via the support member 41 or may not be connected via the support member 41. It may be electrically connected. In the configurations of FIGS. 20 to 23, when the female fitting member Bf and the first substrate PCB1 are electrically connected without the support member 41, the first one on the rear end side of the female fitting member Bf1. Any position on the rear end side of the female fitting member Bf, such as the base 26a, the second base 26b, and the side surface of the connecting portion 25 on the rear end side of the female fitting member Bf2, is electrically connected to the first substrate PCB1. Can be connected.

In the configurations of FIGS. 18 to 23, the first substrate PCB 1 and the support member 41 may be integrally formed or may be formed as separate parts. Further, in the configurations of FIGS. 18 and 19, the male fitting member Bm and the support member 41 may be integrally formed or may be formed as separate parts. Further, in the configurations of FIGS. 20 to 23, the female fitting member Bf and the support member 41 may be integrally formed or may be formed as separate parts.

As described above, according to the component-to-part connection structure according to the present embodiment, the pair of components can be connected substantially vertically by at least the pair of fitting members B. In other words, according to the component-to-part connection structure according to the present embodiment, at least the pair of fitting members B can connect the pair of components at an angle defined by the support member 41.

(Sixth Embodiment)
Hereinafter, embodiments of the power conversion device, the inter-component connection structure, and the inter-component connection method according to the sixth embodiment will be described with reference to the drawings. Here, the differences from the first embodiment will be mainly described, and duplicated explanations will be omitted as appropriate.

In the first embodiment, a case where a pair of circuit boards are connected substantially in parallel by a plurality of pairs of fitting members B has been described as an example, but the present invention is not limited to this. The pair of circuit boards can also be connected at any angle by a plurality of pairs of fitting members B. FIG. 24 is a schematic cross-sectional view showing an example of a component-to-part connection structure in the power conversion device according to the sixth embodiment. FIG. 24 illustrates the connection between the first substrate PCB1 provided with the female fitting member Bf and the second substrate PCB2 provided with the male fitting member Bm.

The support member 44 is provided on the second substrate PCB2. The support member 44 is provided on the main surface of the second substrate PCB2. The support member 44 defines the angle of the male fitting member Bm with respect to the second substrate PCB2. The support member 44 has, for example, a triangular columnar shape. The rectangular first side surface 441 of the support member 44 is fixed to the second substrate PCB2. The connection portion 15 of the male fitting member Bm is joined to the rectangular second side surface 442 of the support member 44. The insertion portion 11 of the male fitting member Bm is substantially parallel to the main surface of the first substrate PCB 1, and has a triangular shape on the bottom surface of the support member 44 with the main surface of the second substrate PCB 2. It has an arbitrary angle depending on the angle formed by the side surfaces 441 and 442.

As described above, according to the component-to-part connection structure according to the present embodiment, at least the pair of fitting members B can connect the pair of components at an arbitrary angle defined by the support member 44. As a result, it is possible to improve the mounting density of parts such as electronic parts, circuit boards and board units in the power conversion device 1, and to improve the degree of freedom in arranging the parts. Improving the mounting density of components and increasing the degree of freedom in arrangement contribute to the miniaturization of the power conversion device 1, respectively.

In the configuration of FIG. 24, the support member 44 may be provided between the first substrate PCB 1 and the female fitting member Bf. That is, the support member 44 may be a member that defines the angle of the female fitting member Bf with respect to the first substrate PCB1. Further, the support member 44 may be provided on both the first substrate PCB1 and the second substrate PCB2.

In the configuration of FIG. 24, the support member 44 may be integrally formed with either one of the male fitting member Bm and the second substrate PCB2, or the male fitting member Bm and the second substrate PCB2. It may be formed as a separate component from the substrate PCB2.

In the configuration of FIG. 24, at least one of the first substrate PCB1 and the second substrate PCB2 can be replaced with the electronic component 51.

(7th Embodiment)
Hereinafter, embodiments of the power conversion device, the inter-component connection structure, and the inter-component connection method according to the seventh embodiment will be described with reference to the drawings. Here, the differences from the first embodiment will be mainly described, and duplicated explanations will be omitted as appropriate.

FIG. 25 is a schematic perspective view showing an example of the configuration of the male type fitting member Bm according to the seventh embodiment. The male fitting member Bm4 in FIG. 25 is an example of the male fitting member Bm according to the embodiment. The side surface portion 14 of the male fitting member Bm4 is chamfered like the tip portion 13 of the male fitting member Bm according to the first embodiment, and the thickness becomes smaller toward the tip side. As a result, the insertion portion 11 can be easily inserted into the receiving portion 20 of the female fitting member Bf from the side surface side.

FIG. 26 is a schematic cross-sectional view showing an example of an inter-component connection structure in the power conversion device 1 according to the seventh embodiment. FIG. 26 illustrates the connection between the first substrate PCB1 provided with the male fitting member Bm4 and the second substrate PCB2 provided with the female fitting member Bf. The male fitting member Bm4 is joined to the first substrate PCB1 at the connecting portion 15. The insertion portion 11 of the male fitting member Bm4 is substantially perpendicular to both main surfaces of the first substrate PCB1 and the second substrate PCB2, respectively.

FIG. 27 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the seventh embodiment. As shown in FIG. 27, the second substrate PCB2 provided with the male fitting member Bm4 of FIG. 26 can also be electrically connected to the electronic component 51 provided with the female fitting member Bf.

FIG. 28 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the seventh embodiment. FIG. 28 illustrates the connection between the first substrate PCB1 provided with the female fitting member Bf and the second substrate PCB2 provided with the male fitting member Bm4. The insertion portion 11 of the male fitting member Bm4 is substantially perpendicular to both main surfaces of the first substrate PCB1 and the second substrate PCB2, respectively. In the configuration of FIG. 28, the moving direction of the second substrate PCB2 when assembling the second substrate PCB2 to the first substrate PCB1 is different from the configuration of FIG. 26.

The first substrate PCB1 provided with the female fitting member Bf in FIG. 28 can also be electrically connected to the electronic component 51 provided with the male fitting member Bm4. FIG. 29 is a schematic perspective view showing an example of an electronic component 51 on which the male type fitting member Bm4 according to the seventh embodiment is mounted. In the configuration of FIG. 29, the male fitting member Bm4 is integrally configured with the electronic component 51. FIG. 30 is a schematic cross-sectional view showing another example of the connection structure between parts in the power conversion device 1 according to the seventh embodiment. FIG. 30 illustrates the connection between the first substrate PCB1 provided with the female fitting member Bf and the electronic component 51 on which the male fitting member Bm4 is formed.

As described above, according to the component-to-part connection structure according to the present embodiment, the pair of components can be connected substantially vertically by at least the pair of fitting members B. Further, the assembling direction of the parts can be changed by changing which side of the parts to be connected the male type fitting member Bm4 is provided. This makes it possible to improve the degree of freedom in arranging parts in the power conversion device 1.

(8th Embodiment)
Hereinafter, embodiments of the power conversion device, the inter-component connection structure, and the inter-component connection method according to the eighth embodiment will be described with reference to the drawings. Here, the differences from the first embodiment will be mainly described, and duplicated explanations will be omitted as appropriate.

FIG. 31 is a diagram for explaining the expansion of the geometrically permissible range in the fitting of the male fitting member Bm and the female fitting member Bf according to the eighth embodiment. The cross-sectional view of FIG. 31 schematically illustrates the cross-sectional view of the fitting portion according to the embodiment. The part AA'in FIG. 31 shows the contact part where the male type fitting member Bm and the female type fitting member Bf come into contact with each other in the fitting part. The view of the AA'part of FIG. 31 as viewed from above exemplifies a cross-sectional view of the AA'part. Here, the basic corresponds to the state shown in FIG. 10 (a) as in FIG. 11. Further, the rotation corresponds to the state shown in FIG. 10 (b) as in FIG. 11.

As shown in FIG. 31, each of the first holding portion 21 and the second holding portion 22 of the female fitting member Bf according to the present embodiment is fitted in a convex shape toward the receiving portion 20. A substantially hemispherical convex portion 33a that swells toward the receiving portion 20 is provided in the portion. Each convex portion 33a can be formed by, for example, pressing. In this case, in each of the first sandwiching portion 21 and the second sandwiching portion 22, a hemispherically recessed recess 33b is provided on the opposite side of each convex portion 33a.

According to this configuration, when the four divided tip portions of the female fitting member Bf are independently displaced and / or deformed by the force from the insertion portion 11 of the male fitting member Bm. Even so, the substantially hemispherical convex portion 33a can continue to contact the insertion portion 11. That is, according to the configuration according to the present embodiment, the contact state between the male fitting member Bm and the female fitting member Bf can be maintained in the point contact mode. This makes it possible to stabilize the electrical contact between the male fitting member Bm and the female fitting member Bf.

(Application example)
FIG. 32 is a schematic cross-sectional view showing an example of the configuration of the power conversion device 1 according to the embodiment. FIG. 32 illustrates a first substrate PCB1, a second substrate PCB2, a third substrate PCB3, a fourth substrate PCB4, and a cooling plate WJ. Various electronic components 51 can be mounted on these boards by the component-to-component connection structure according to each of the above-described embodiments. In addition, in FIG. 32, in order to schematically show each member while ensuring visibility, there may be a gap between the members that are in contact with each other due to fastening, fixing, or the like. The cooling plate WJ is, for example, a metal plate-shaped member in which a flow path of a refrigerant is formed. The cooling plate WJ is not limited to a metal plate having a flow path of a refrigerant inside, and a heat sink, a heat pipe, a non-metal heat diffusion plate, a metal housing, or a combination thereof can be appropriately used. Here, the use of a metal housing is not limited to the case where a metal plate-shaped member having no refrigerant flow path inside is used as the cooling plate WJ, and the housing of the power conversion device 1 is formed of metal. However, this includes the case where a part of the housing is used as a cooling plate WJ.

For example, the electronic component 51 includes at least one of a semiconductor element, a semiconductor module, a magnetic material, a capacitor, and a circuit breaker. A semiconductor module is composed of, for example, a plurality of semiconductor elements. Here, the magnetic material is a transformer, a transformer-integrated printed circuit board, a metamorphic device, a reactor, and a choke. Circuit breakers are relays and fuses. FIG. 32 illustrates a transformer TR and a coil coil as magnetic materials. Further, FIG. 32 illustrates transistors MOSFET1 and MOSFET2 and diodes D1 and D2 as semiconductor modules or semiconductor elements. Further, FIG. 32 illustrates a plurality of capacitors Cap. Further, FIG. 32 illustrates a relay RL.

In the power conversion device 1, the semiconductor element, the semiconductor module, the magnetic material, the capacitor, and the circuit breaker exemplified as the electronic component 51 have a large loss during operation, and the component temperature tends to be high. Therefore, in order to efficiently cool the electronic components 51, it is preferable to mount each electronic component 51 close to the cooling plate WJ.

Conventionally, when assembling the power conversion device 1 having the configuration illustrated in FIG. 32, first, the electronic component 51 is fastened to the water-cooled plate WJ with a screw or the like, or is fixed to the water-cooled plate WJ with TIM (thermal interface material). After that, it was customary to solder and mount each substrate PCB2, PCB3, and PCB4 to the electronic component 51. In this case, there are problems in assembly and quality, such as the need for large-scale soldering equipment and the risk of contamination of solder balls and the like.

Under such circumstances, according to the connection structure according to the present disclosure, it is possible to freely arrange parts while achieving both assembling property and cooling property of parts. Specifically, after the electronic component 51 is fastened to the water-cooled plate WJ with a screw or the like, or the electronic component 51 is fixed to the water-cooled plate WJ with a TIM, the substrates PCB2, PCB3, PCB4 and the electronic component 51 are attached. By connecting with the fitting member B, the electronic component 51 and each substrate PCB2, PCB3, and PCB4 can be easily and surely connected.

The electronic component 51 is, for example, so that the male fitting member Bm or the female fitting member Bf is provided on the substrate via the support member 41 in the fifth embodiment, or the male type fitting member 51 is provided in the sixth embodiment. The fitting member Bm or the female fitting member Bf may be arranged on the substrate via the support member 45 so that the fitting member Bf is provided on the substrate via the support member 44. That is, the fastening of the electronic component 51 to the water-cooled plate WJ by a screw or the like and the fixing of the electronic component 51 to the water-cooled plate WJ by TIM may be connected via the support member 45, respectively.

Here, the support member 45 is a member that thermally connects the electronic component 51 and the cooling plate WJ. Therefore, the shape and material of the support member 45 can be appropriately selected so that the amount of heat transferred from the electronic component 51 to the cooling plate WJ is large. As an example, the support member 45 can be formed of metal when the electronic component 51 and the cooling plate WJ are electrically insulated from each other. Of course, other metal materials may be used as the support member 45. Further, the support member 45 may be integrally formed with the cooling plate WJ, or a flow path for the refrigerant may be provided inside the support member 45. Further, the support members 19, 40, 41, 44 according to the above-described embodiments are increased so that the amount of heat transferred from the electronic component 51 to each of the substrates PCB1, PCB2, PCB3, and PCB4 via the pair of fitting members B is large. The shape and material of the above may be appropriately selected. In this case, the heat generated by the electronic component 51 can be diffused or dissipated by using the substrate.

As described above, according to the power conversion device 1 according to the present disclosure, it is possible to expand the geometrical allowable range of the fitting portion that electrically connects the parts.

As described above, the component-to-component connection structure according to the present disclosure is a structure for connecting any component to be connected among electronic components, circuit boards, and board units. As an example, the connection structure between components is a connection structure between circuit boards. As another example, the component-to-component connection structure is a connection structure between an electronic component and a circuit board or a board unit. As another example, the component-to-component connection structure is a connection structure between a circuit board and a board unit.

The techniques according to each of the above-described embodiments can be arbitrarily combined. For example, in a plurality of pairs of fitting members B connecting a pair of circuit boards, a different inter-component connection structure may be applied to each pair of fitting members B. Further, for example, with respect to two or more circuit boards coupled to an arbitrary circuit board, the angles with respect to the arbitrary circuit board may be different.

In the description of the present disclosure, components having the same or substantially the same function as those described above with respect to the above-mentioned figures may be designated by the same reference numerals and the description thereof may be omitted as appropriate. Further, even when the same or substantially the same parts are represented, the dimensions and ratios may be different from each other depending on the drawings. Further, for example, from the viewpoint of ensuring the visibility of the drawings, reference numerals are given only to the main components in the description of each drawing, and the components have the same or substantially the same functions as those described above in the above-mentioned drawings. However, it may not have a reference code.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and variations thereof are included in the scope of the invention described in the claims and the equivalent scope thereof, as are included in the scope and gist of the invention.

1 Power converter 11 Insertion part 13 Tip part 14 Side part 15 Connection part 17 Gap 19 Support member 19a Insertion part 20 Accepting part 21 First holding part 21a First elastic part 21b Second elastic part 22 Second Holding part 22a Third elastic part 22b Fourth elastic part 23a First bending part 23b Second bending part 23c Third bending part 23d Fourth bending part 26a First base 26b Second base 25 Connection Part 25a First connection part 25b Second connection part 27 Gap 31 Insulator layer 32 Covering member 33a Convex part 33b Recessed part 40, 41, 44 Support member 51 Electronic component Bf Female type fitting member Bm Male type fitting member PCB1 1st board PCB2 2nd board PCB3 3rd board

Claims (19)

The first part and
The second part and
A male fitting member with a substantially flat plate-shaped insertion part,
It is provided with a plurality of pairs of fitting members, each of which includes a female fitting member having a first holding portion and a second holding portion arranged opposite to each other.
In each of the plurality of pairs of fitting members,
The male fitting member is arranged on one of the first component and the second component.
The female fitting member is arranged on the other side of the first component and the second component.
In each of the plurality of pairs of fitting members, the first part and the second part have the female fitting member inserted between the first holding portion and the second holding portion. It is connected by sandwiching the insertion portion of the male type fitting member.
Each of the first pinching portion and the second pinching portion is bent so as to form a convex portion toward the surfaces facing each other.
A gap is provided at the tip of each of the first pinching portion and the second pinching portion.
Power converter. The first sandwiching portion includes a first elastic portion and a second elastic portion divided by the gap.
The second sandwiching portion includes a third elastic portion and a fourth elastic portion divided by the gap.
Each of the first elastic portion and the third elastic portion extends from the first base portion.
Each of the second elastic portion and the fourth elastic portion extends from the second base portion.
Each of the first base and the second base extends from a connection to a component provided on the rear end side of the female fitting member.
The power conversion device according to claim 1. The first sandwiching portion includes a first elastic portion and a second elastic portion divided by the gap.
The second sandwiching portion includes a third elastic portion and a fourth elastic portion divided by the gap.
Each of the first elastic portion and the second elastic portion extends from a first connection portion which is a connection portion to a component provided on the rear end side of the female fitting member.
Each of the third elastic portion and the fourth elastic portion extends from a second connection portion which is a connection portion to a component provided on the rear end side of the female fitting member.
The power conversion device according to claim 1. In at least one pair of fitting members among the plurality of pairs of fitting members, between the connection portion to the component provided on the rear end side of the male fitting member or the female fitting member and the component. The power conversion according to any one of claims 1 to 3, further comprising a support member provided in the above and defining the angle of the male fitting member or the female fitting member with respect to the component. Device. The first component and the second component are substrates, respectively.
The first component is coupled to the second component at an angle defined by the support member.
The power conversion device according to claim 4. The first component and the second component are substrates, respectively.
The first component is coupled substantially perpendicular to the second component.
The power conversion device according to any one of claims 1 to 3. Further provided with a third component coupled to the second component
The plurality of pairs of fitting members are further arranged between the second component and the third component.
In each of the plurality of pairs of fitting members arranged between the second component and the third component,
The male fitting member is arranged on one of the second component and the third component.
The female fitting member is arranged on the other side of the second part and the third part.
The power conversion device according to any one of claims 1 to 3. The first component, the second component, and the third component are substrates, respectively.
The first component, the second component, and the third component form a three-layered layered structure.
In the second component forming the intermediate layer of the layered structure, at least one of the male fitting member and the female fitting member is arranged on both sides.
The power conversion device according to claim 7. The power conversion device according to claim 7, wherein at least one of the first component, the second component, and the third component is a printed circuit board. The power conversion device according to claim 9, wherein each of the male fitting member and the female fitting member is electrically connected to the printed circuit board by solder joining. The power conversion device according to claim 7, wherein the first component, the second component, and the third component are any of an electronic component, a substrate, and a substrate unit, respectively. The power conversion device according to claim 11, wherein the electronic component includes at least one of a semiconductor element, a semiconductor module, a magnetic material, a capacitor, and a circuit breaker. The electric power according to any one of claims 1 to 12, wherein the convex portion formed in each of the first holding portion and the second holding portion has a substantially hemispherical shape. Converter. The power conversion device according to any one of claims 1 to 13, wherein the male fitting member and the female fitting member are each made of a metal material. The power conversion device according to claim 14, wherein a part or all of the surface area of the metal material is subjected to conductor plating. The power conversion device according to any one of claims 1 to 15, wherein a layer of an insulator is formed on the outer peripheral portion of the female fitting member. A male fitting member with a substantially flat plate-shaped insertion part,
Insertion of the male type fitting member having a first holding portion and a second holding portion arranged to face each other and inserted between the first holding portion and the second holding portion. Equipped with a female fitting member that sandwiches the part,
The pair of male fitting members and female fitting members are arranged in different parts from each other.
Each of the first pinching portion and the second pinching portion is bent so as to form a convex portion toward the surfaces facing each other.
A gap is provided at the tip of each of the first pinching portion and the second pinching portion.
Connection structure between parts. The inter-parts connection structure according to claim 17, wherein the convex portions formed in each of the first sandwiching portion and the second sandwiching portion have a substantially hemispherical shape. The component-to-component connection structure according to claim 17, wherein the components different from each other are either an electronic component, a substrate, or a substrate unit, respectively.

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