JP2022036332A - Display device - Google Patents

Abstract

To provide a display device which can suppress reduction of reliability.SOLUTION: The display device includes: a first substrate; a second substrate; an optical element; a conductive attachment layer for attaching the optical element to the second substrate; and a connection member. The first substrate has a first region, on which the second substrate is overlapped; and a second region having an electrode. The second substrate has a recessed part recessed to the first substrate and a substrate end part located at the interface between the first region and the second region. The conductive attachment layer has an end part overlapping with the recessed part. The connection member is arranged in the recessed part and is in contact with the conductive attachment layer, the substrate end part, and the electrode.SELECTED DRAWING: Figure 4

Description

Embodiments of the present invention relate to display devices.

In recent years, in a transverse electric field type liquid crystal display device, a transparent conductive film provided on the surface of one substrate and an electrode or a circuit board having a ground potential provided on the other substrate are connected to each other as a measure against static electricity. A technique of being electrically connected by a member is known. A polarizing plate is provided on the transparent conductive film. When the polarizing plate expands, the polarizing plate and the connecting member come into contact with each other, which may reduce the area of contact between the connecting member and the transparent conductive film. In particular, with the demand for a narrower frame, the polarizing plate and the connecting member tend to be arranged close to each other, and even a slight expansion of the polarizing plate is easily affected by the expansion.

Japanese Unexamined Patent Publication No. 2009-109562 Japanese Unexamined Patent Publication No. 2010-117458 Japanese Unexamined Patent Publication No. 2010-181747 Japanese Unexamined Patent Publication No. 2011-170200 Japanese Unexamined Patent Publication No. 2012-93468

An object of the present embodiment is to provide a display device capable of suppressing a decrease in reliability.

According to this embodiment
A first substrate, a second substrate, an optical element, a conductive adhesive layer for adhering the optical element to the second substrate, and a connecting member are provided, and the first substrate is superposed on the second substrate. A first region and a second region provided with electrodes are provided, and the second substrate is located at a recess recessed toward the first substrate and a boundary between the first region and the second region. The conductive adhesive layer includes an end portion that superimposes on the concave portion, and the connecting member is arranged in the concave portion and is in contact with the conductive adhesive layer, and is attached to the substrate end portion and the electrode. A display device that is in contact is provided.

FIG. 1 is a plan view showing the appearance of the display device DSP. FIG. 2 is a diagram showing a basic configuration of a pixel PX and an equivalent circuit. FIG. 3 is a cross-sectional view of a display device DSP including the pixel PX shown in FIG. FIG. 4 is a cross-sectional view of the display panel PNL along AB shown in FIG. FIG. 5 is another cross-sectional view of the display panel PNL along AB shown in FIG. FIG. 6 is a plan view showing a first configuration example of the recess CC. FIG. 7 is a plan view showing a second configuration example of the recess CC. FIG. 8 is a diagram showing another shape of the connecting member CN applicable to the second configuration example shown in FIG. 7. FIG. 9 is a plan view showing a third configuration example of the recess CC. FIG. 10 is a plan view showing a fourth configuration example of the recess CC. FIG. 11 is a plan view showing a fifth configuration example of the recess CC. FIG. 12 is a plan view showing a sixth configuration example of the recess CC.

Hereinafter, this embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate changes while maintaining the gist of the invention, which are naturally included in the scope of the present invention. Further, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but the drawings are merely examples and are merely examples of the present invention. It does not limit the interpretation. Further, in the present specification and each figure, the same reference reference numerals may be given to the components exhibiting the same or similar functions as those described above with respect to the above-mentioned figures, and the overlapping detailed description may be omitted as appropriate. ..

FIG. 1 is a plan view showing the appearance of the display device DSP. In one example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90 degrees. The first direction X and the second direction Y correspond to the directions parallel to the main surface of the substrate constituting the display device DSP, and the third direction Z corresponds to the thickness direction of the display device DSP. For example, the first direction X corresponds to the short side direction of the display device DSP, and the second direction Y corresponds to the long side direction of the display device DSP. In the present specification, it is assumed that there is an observation position for observing the display device DSP on the tip side of the arrow indicating the third direction Z, and from this observation position, XY defined in the first direction X and the second direction Y. Looking toward a plane is called plan view.

The display device DSP includes a display panel PNL, a flexible printed circuit board 1, an IC chip 2, and a circuit board 3.

The display panel PNL is a liquid crystal display panel and includes a first substrate SUB1, a second substrate SUB2, and a liquid crystal layer LC described later. The display panel PNL includes a display unit DA for displaying an image and a frame-shaped non-display unit NDA that surrounds the display unit DA. The first substrate SUB1 includes a first region A1 and a second region A2 arranged in the second direction Y. The second substrate SUB2 includes a substrate end SUBE located at the boundary between the first region A1 and the second region A2, and is superimposed on the first substrate SUB1 in the first region A1 and superimposed on the second region A2. do not have. The substrate end SUBE extends along the first direction X. The display unit DA is included in the first region A1.
The display unit DA includes a plurality of pixels PX arranged in a matrix in the first direction X and the second direction Y. The pixel PX here indicates a minimum unit that can be individually controlled according to a pixel signal, and may be referred to as a sub-pixel. The pixel PX is, for example, one of a red pixel displaying red, a green pixel displaying green, a blue pixel displaying blue, and a white pixel displaying white.

The flexible printed circuit board 1 is mounted on the second region A2 and is electrically connected to the circuit board 3. The IC chip 2 is mounted on the flexible printed circuit board 1. The IC chip 2 may be mounted in the second region A2. The IC chip 2 has a built-in display driver DD. The display driver DD outputs a signal necessary for displaying an image in an image display mode for displaying an image. In the example shown in FIG. 1, the IC chip 2 has a built-in touch controller TC. The touch controller TC controls a touch sensing mode for detecting the approach or contact of an object with the display device DSP.

The first substrate SUB1 includes an electrode EL in the second region A2. The electrode EL is grounded via, for example, the flexible printed circuit board 1, but may be set to a predetermined fixed potential. In the example shown in FIG. 1, the electrode ELs are provided at two places sandwiching the flexible printed circuit board 1, but may be provided at only one place or at three or more places. May be good.
The second substrate SUB2 includes a recess CC, which will be described in detail later, in the non-display portion NDA. The recess CC is located between the display unit DA and the substrate end portion SUBE. The optical element OD2 is superimposed on the display unit DA and extends to the non-display unit NDA. The optical element OD2 includes an end ODE located between the display DA and the substrate end SUBE. The end ODE is formed in a straight line along the first direction X and is superimposed on the recess CC. It is desirable that the optical element OD2 does not overlap the entire recess CC in a plan view. That is, it is desirable that the end portion ODE of the optical element OD2 is located between the recess CC and the substrate end portion SUBE along the second direction Y.

The connecting member CN is located in the non-display portion NDA, is superimposed on the optical element OD2 in the concave portion CC, and is also superimposed on the electrode EL via the substrate end portion SUBE. The connecting member CN is formed of, for example, a conductive resin material.

The substrate end SUBE of the second substrate SUB2 is formed linearly along the first direction X between the recess CC and the electrode EL in a plan view, and the connecting members provided at two places. It is also formed in a straight line along the first direction X between the CNs. That is, the substrate end SUBE of the second substrate SUB2 has neither a concave portion recessed in the second direction Y nor a convex portion protruding in the second direction Y. Further, the second substrate SUB2 does not have a through hole penetrating in the third direction Z.

FIG. 2 is a diagram showing a basic configuration of a pixel PX and an equivalent circuit. The plurality of scanning lines G extend along the first direction X and are electrically connected to the scanning line driving circuit GD. The plurality of signal lines S extend along the second direction Y and are electrically connected to the signal line drive circuit SD. The scanning line G and the signal line S do not necessarily have to extend linearly, and a part of them may be bent. For example, it is assumed that the signal line S extends in the second direction Y even if a part of the signal line S is bent.

The common electrode CE is arranged over a plurality of pixels PX. The common electrode CE is electrically connected to the voltage supply unit CD and the touch controller TC shown in FIG. In the image display mode, the voltage supply unit CD supplies a common voltage (Vcom) to the common electrode CE. In the touch sensing mode, the touch controller TC supplies a touch drive voltage different from the common voltage to the common electrode CE, and reads a touch signal from the common electrode CE. Such common electrodes CE are arranged in a matrix in the first direction X and the second direction Y in the display unit DA, and each function as a detection electrode Rx.

Each pixel PX includes a switching element SW, a pixel electrode PE, a common electrode CE, a liquid crystal layer LC, and the like. The switching element SW is composed of, for example, a thin film transistor (TFT), and is electrically connected to the scanning line G and the signal line S. The scanning line G is electrically connected to the switching element SW in each of the pixels PX arranged in the first direction X. The signal line S is electrically connected to the switching element SW in each of the pixels PX arranged in the second direction Y. The pixel electrode PE is electrically connected to the switching element SW. Each of the pixel electrode PEs faces the common electrode CE, and the liquid crystal layer LC is driven by the electric field generated between the pixel electrode PE and the common electrode CE. The capacitance CS is formed, for example, between an electrode having the same potential as the common electrode CE and an electrode having the same potential as the pixel electrode PE.

FIG. 3 is a cross-sectional view of a display device DSP including the pixel PX shown in FIG. Here, an example in which the transverse electric field method is applied will be described. In the present specification, the direction from the first substrate SUB1 to the second substrate SUB2 is referred to as "upper side" (or simply upper), and the direction from the second substrate SUB2 to the first substrate SUB1 is referred to as "lower side" ( Alternatively, it is simply referred to as (below). In the case of "the second member above the first member" and "the second member below the first member", the second member may be in contact with the first member or may be separated from the first member. You may.

The first substrate SUB1 includes an insulating substrate 10, insulating films 11 to 14, signal line S, metal wiring M, common electrode CE, pixel electrode PE, alignment film AL1, and the like. The second substrate SUB2 includes an insulating substrate 20, a light-shielding layer BM, a color filter layer CF, an overcoat layer OC, an alignment film AL2, and the like. The insulating substrates 10 and 20 are transparent substrates such as a glass substrate and a flexible resin substrate.

In the first substrate SUB1, the signal line S is located on the insulating film 11 and is covered with the insulating film 12. The metal wiring M is located on the insulating film 12 and is covered with the insulating film 13. The common electrode CE is located on the insulating film 13 and is covered with the insulating film 14. The pixel electrode PE is located on the insulating film 14 and is covered with the alignment film AL1. Another inorganic insulating film, the semiconductor layer of the switching element SW shown in FIG. 2, the scanning line G, and the like are arranged between the insulating substrate 10 and the insulating film 11. The metal wiring M is located directly above the signal line S and is electrically connected to the common electrode CE. Further, the metal wiring M forms a conductive path for electrically connecting the voltage supply unit CD and the common electrode CE in the image display mode described with reference to FIG. 2, and with the touch controller TC in the touch sensing mode. A conductive path that electrically connects to the common electrode CE is formed.

The insulating films 11 and 14 are inorganic insulating films formed of silicon oxide, silicon nitride, silicon oxynitride and the like. The insulating films 12 and 13 are organic insulating films formed of, for example, an acrylic resin. The insulating film 13 may be an inorganic insulating film. Further, the insulating film 13 may be omitted, and the metal wiring M and the common electrode CE may be in contact with each other. The pixel electrode PE and the common electrode CE are formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

In the second substrate SUB2, the insulating substrate 20 includes an inner surface 20A facing the first substrate SUB1 and an outer surface 20B opposite to the inner surface 20A. The light-shielding layer BM and the color filter layer CF are located on the inner surface 20A of the insulating substrate 20. The color filter layer CF includes a red color filter CFR, a green color filter CFG, and a blue color filter CFB. The overcoat layer OC covers the color filter layer CF. The overcoat layer OC is a transparent organic insulating film. The alignment film AL2 covers the overcoat layer OC.

The liquid crystal layer LC is located between the first substrate SUB1 and the second substrate SUB2, and is held between the alignment film AL1 and the alignment film AL2.

The optical element OD1 including the polarizing plate PL1 is adhered to the insulating substrate 10. The optical element OD2 including the polarizing plate PL2 is adhered to the outer surface 20B of the insulating substrate 20 by the conductive adhesive layer AD. The conductive adhesive layer AD is an adhesive layer having conductivity such as containing conductive particles, and is substantially transparent. The optical elements OD1 and OD2 may be provided with a retardation plate, a scattering layer, an antireflection layer, and the like, if necessary. The illuminating device IL irradiates the illumination light toward the display panel PNL.

FIG. 4 is a cross-sectional view of the display panel PNL along AB shown in FIG. Here, only the configuration necessary for the explanation is shown, the first substrate SUB1 is shown in a simplified manner, and the optical element OD1 and the lighting device IL are not shown.

The second substrate SUB2 is located between the first substrate SUB1 and the optical element OD2. The second substrate SUB2 includes a recess CC recessed toward the first substrate SUB1. More specifically, in the second substrate SUB2, the recess CC is formed in the insulating substrate 20 and is recessed in the direction from the outer surface 20B of the insulating substrate 20 toward the inner surface 20A. The concave portion CC does not penetrate up to the inner surface 20A. Such a recess CC is located between the display unit DA and the substrate end portion SUBE along the second direction Y. In one example, the depth DP along the third direction Z of the recess CC is 50 μm to 100 μm.

The optical element OD2 is provided over the display unit DA and the non-display unit NDA. The conductive adhesive layer AD for adhering the optical element OD2 is in contact with the outer surface 20B of the insulating substrate 20. Both the end ODE of the optical element OD2 and the end ADE of the conductive adhesive layer AD are superimposed on the recess CC.

In the second substrate SUB2, the connecting member CN is arranged in the recess CC and is in contact with the conductive adhesive layer AD superimposed on the recess CC. That is, in the region superposed on the recess CC, the conductive adhesive layer AD is located between the connecting member CN and the optical element OD2 along the third direction Z. The connecting member CN is in contact with the electrode EL in the second region A2 of the first substrate SUB1. The connecting member CN is in contact with the substrate end SUBE of the second substrate SUB2, and is continuously provided between the conductive adhesive layer AD and the electrode EL. As a result, the conductive adhesive layer AD and the electrode EL are electrically connected via the connecting member CN.

In the second substrate SUB2, the light-shielding layer LS is provided on the inner surface 20A of the insulating substrate 20 and is located in the non-display portion NDA. The light-shielding layer LS is arranged so as to surround the display unit DA. The boundary between the display unit DA and the non-display unit NDA is defined by the inner peripheral LSI of the light-shielding layer LS. Such a light-shielding layer LS is integrally formed with the light-shielding layer BM shown in FIG. The recess CC is superimposed on the light-shielding layer LS, but does not penetrate to the light-shielding layer LS.
The seal SE is located in the non-display portion NDA, adheres the first substrate SUB1 and the second substrate SUB2, and seals the liquid crystal layer LC. The seal SE is provided at a position where it overlaps with the light-shielding layer LS.

Here, an example of a method of forming the concave portion CC and a method of connecting the conductive adhesive layer AD and the electrode EL by the connecting member CN will be briefly described.
Laser light is irradiated from the outer surface 20B side of the insulating substrate 20, and the laser light is condensed inside the insulating substrate 20. As a light source at this time, a femtosecond laser that emits a laser beam having a pulse width of femtosecond is suitable because the periphery of the condensing portion of the laser light is hardly damaged both thermally and chemically. be. By irradiating with such laser light, the inside of the insulating substrate 20 is modified.
Next, the insulating substrate 20 is thinned by removing the outer surface 20B side of the insulating substrate 20 by etching or the like. The insulating substrate 20 is, for example, a glass substrate, which is dissolved by an etching solution such as an aqueous solution of hydrofluoric acid (HF) and thinned. Further, the modified portion is more easily dissolved than glass by the above etching solution. Therefore, when the modified portion is exposed to the etching solution as the thickness of the insulating substrate 20 decreases, a recess CC recessed from the outer surface 20B is formed.
After that, the optical element OD2 is adhered to the outer surface 20B of the insulating substrate 20 by the conductive adhesive layer AD. At this time, the optical element OD2 is arranged so that the optical element OD2 and the conductive adhesive layer AD do not block the concave portion CC.
After that, the conductive resin material is filled in the concave portion CC and continuously applied to the electrode EL to cure the resin material. As a result, the conductive adhesive layer AD and the electrode EL are electrically connected by the connecting member CN.

FIG. 5 is another cross-sectional view of the display panel PNL along AB shown in FIG. Here, the optical element OD2 and the conductive adhesive layer AD shown in FIG. 4 are shown in a state of being expanded along the second direction Y.

As shown by arrows YA and YB in FIG. 5, when the optical element OD2 and the conductive adhesive layer AD expand along the second direction Y, particularly on the side superposed on the concave portion CC, the conductivity is increased according to the expanded amount. The area where the adhesive layer AD overlaps the recess CC is expanded. Further, even when the optical element OD2 and the conductive adhesive layer AD expand, the connecting member CN arranged in the recess CC hardly moves. Therefore, it is possible to suppress the reduction of the contact area between the conductive adhesive layer AD and the connecting member CN in the recess CC. When the conductive adhesive layer AD expands together with the optical element OD2 in the direction indicated by the arrow YA, the contact area between the conductive adhesive layer AD and the connecting member CN increases. As a result, it is possible to suppress a connection failure due to a reduction in the contact area between the conductive adhesive layer AD and the connecting member CN. Therefore, it is possible to suppress a decrease in reliability.

Further, it is possible to form a discharge path from the conductive adhesive layer AD to the electrode EL of the ground potential via the connecting member CN, and it is possible to suppress the charging of the second substrate SUB2. As a result, deterioration of display quality due to charging can be suppressed.

Further, in order to suppress the charging of the second substrate SUB2, the cost of forming the transparent conductive film can be reduced as compared with the case where the transparent conductive film is provided on the outer surface 20B of the insulating substrate 20.

Next, some configuration examples of the recess CC will be described with reference to a plan view along the XY plane. In each configuration example, the end ODE of the optical element OD2 and the end ADE of the conductive adhesive layer AD are assumed to be the same in a plan view.

<< First configuration example of recess >>
FIG. 6 is a plan view showing a first configuration example of the recess CC. In a plan view, the recess CC is located between the display unit DA and the substrate end portion SUBE along the second direction Y. The substrate end portion SUBE is formed linearly along the first direction X between the concave portion CC and the electrode EL.

In the first configuration example shown in FIG. 6, the concave portion CC extends along the first direction X. For example, the concave portion CC is formed in a rectangular shape extending in the first direction X, but may be formed in an oval shape or an elliptical shape extending in the first direction X.
The recess CC has a first edge E1 located on the display portion DA side and a second edge E2 located on the substrate end portion SUBE side. The first edge E1 is located between the display portion DA and the end portion ADE of the conductive adhesive layer AD along the second direction Y. Further, the second edge E2 is located between the end portion ADE of the conductive adhesive layer AD and the substrate end portion SUBE along the second direction Y. That is, the first edge E1 corresponds to a portion of the edge extending over the entire circumference of the recess CC, which is superimposed on the optical element OD2 and the conductive adhesive layer AD. Further, the second edge E2 corresponds to a portion of the edge extending over the entire circumference of the concave portion CC that does not overlap with the optical element OD2 and the conductive adhesive layer AD.
The connecting member CN extends along the first direction X in the recess CC and is superimposed on the conductive adhesive layer AD in a plan view. Further, the connecting member CN extends along the second direction Y between the concave portion CC and the substrate end portion SUBE. According to such a first configuration example, the above effect can be obtained.

<< Second configuration example of recess >>
FIG. 7 is a plan view showing a second configuration example of the recess CC.
In the second configuration example shown in FIG. 7, the recess CC includes a partial CC1 and a partial CC2. The partial CC1 extends along the first direction X, similarly to the recess CC of the first configuration example shown in FIG. The partial CC2 is located between the partial CC1 and the substrate end SUBE and extends along the second direction Y. These partial CC1 and partial CC2 are connected to each other. The partial CC2 may or may not reach the substrate end SUBE.
The partial CC1 has a first edge E1 superimposed on the optical element OD2 and the conductive adhesive layer AD, and a second edge E2 not superimposed on the optical element OD2 and the conductive adhesive layer AD. The edges over the entire circumference of the partial CC2 are not superimposed on the optical element OD2 and the conductive adhesive layer AD.
The connecting member CN is arranged in the partial CC1 and the partial CC2, respectively. The connecting member CN extends along the first direction X in the partial CC1 and is superimposed on the conductive adhesive layer AD. Further, the connecting member CN extends along the second direction Y in the partial CC2. In such a second configuration example, the same effect as described above can be obtained. Further, even if the optical element OD2 and the conductive adhesive layer AD expand so as to block the partial CC1, the connecting member CN arranged in the partial CC2 can suppress poor connection between the conductive adhesive layer AD and the electrode EL. can.
In the above second configuration example, the partial CC1 corresponds to the first portion and the partial CC2 corresponds to the second portion.

FIG. 8 is a diagram showing another shape of the connecting member CN applicable to the second configuration example shown in FIG. 7. In the modification shown in FIG. 8, the connecting member CN extends along the second direction Y in the partial CC1 and the partial CC2. Of the connecting member CNs, the connecting member CN arranged in the partial CC1 is superimposed on the conductive adhesive layer AD. Even in such a modified example, the same effect as that of the second configuration example described with reference to FIG. 7 can be obtained.

<< Third configuration example of recess >>
FIG. 9 is a plan view showing a third configuration example of the recess CC.
The third configuration example shown in FIG. 9 is different from the first configuration example shown in FIG. 6 in that the concave portion CC extends along the second direction Y. For example, the concave portion CC is formed in a rectangular shape extending in the second direction Y, but may be formed in an oval shape or an elliptical shape extending in the second direction Y. Further, here, three recesses CC are arranged at intervals along the first direction X, but the number of recesses CC may be one or a plurality.
Each of the recesses CC has a first edge E1 superimposed on the optical element OD2 and the conductive adhesive layer AD, and a second edge E2 not superimposed on the optical element OD2 and the conductive adhesive layer AD.
The connecting member CN extends along the second direction Y in each of the recesses CC and is superimposed on the conductive adhesive layer AD. According to such a third configuration example, the above effect can be obtained. Further, even if the optical element OD2 and the conductive adhesive layer AD expand toward the side close to the substrate end SUBE along the second direction Y, the conductive adhesive layer AD and the electrodes are provided by the connecting member CN arranged in the recess CC. Poor connection with EL can be suppressed.

<< Fourth configuration example of recess >>
FIG. 10 is a plan view showing a fourth configuration example of the recess CC.
In the fourth configuration example shown in FIG. 10, the recess CC includes a partial CC 11, a partial CC 12, and a partial CC 13. The partial CC 11 extends along the first direction X, similarly to the recess CC of the first configuration example shown in FIG. The partial CC 12 and the partial CC 13 extend along the second direction Y, similarly to the recess CC of the third configuration example shown in FIG. The partial CC 11 is located between the partial CC 12 and the partial CC 13, and is connected to the partial CC 12 and the partial CC 13, respectively.
The connecting member CN is arranged in the partial CC11, the partial CC12, and the partial CC13, respectively. The connecting member CN extends along the first direction X in the partial CC 11. The connecting member CN extends along the second direction Y in the partial CC12 and the partial CC13. The connecting member CN is superimposed on the conductive adhesive layer AD in the partial CC11, the partial CC12, and the partial CC13. Even in such a fourth configuration example, the same effect as described above can be obtained.
In the above fourth configuration example, the partial CC 11 corresponds to the first portion, and the partial CC 12 and the partial CC 13 correspond to the second portion.

<< Fifth configuration example of recess >>
FIG. 11 is a plan view showing a fifth configuration example of the recess CC.
The fifth configuration example shown in FIG. 11 differs from the first configuration example shown in FIG. 6 in that the concave portion CC is circular. The connecting member CN extends along the second direction Y. Among the connecting member CNs, the connecting member CN arranged in the recess CC is superimposed on the conductive adhesive layer AD. Even in such a fifth configuration example, the same effect as described above can be obtained.

<< 6th configuration example of recess >>
FIG. 12 is a plan view showing a sixth configuration example of the recess CC.
In the sixth configuration example shown in FIG. 12, the recess CC includes a partial CC 21 and a partial CC 22. The partial CC 21 extends along the first direction X, similarly to the recess CC of the first configuration example shown in FIG. The partial CC 22 is formed in a semicircular shape. These partial CC21 and partial CC22 are connected to each other. The connecting member CN extends along the second direction Y. Of the connecting member CNs, the connecting member CN arranged in the partial CC 21 is superimposed on the conductive adhesive layer AD. Even in such a sixth configuration example, the same effect as described above can be obtained.

As described above, according to the present embodiment, it is possible to provide a display device capable of suppressing a decrease in reliability.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and variations thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

An example of the display device obtained from the configuration disclosed in the present specification is added below.
(1)
With the first board
With the second board
With optical elements
A conductive adhesive layer for adhering the optical element to the second substrate,
With connecting members,
The first substrate includes a first region on which the second substrate is superimposed and a second region provided with electrodes.
The second substrate includes a recess recessed toward the first substrate and a substrate end located at a boundary between the first region and the second region.
The conductive adhesive layer has an end that overlaps the recess.
A display device in which the connecting member is arranged in the recess and is in contact with the conductive adhesive layer, and is in contact with the end of the substrate and the electrodes.
(2)
The second substrate includes an insulating substrate and has an insulating substrate.
The insulating substrate includes an inner surface facing the first substrate and an outer surface opposite to the inner surface.
The conductive adhesive layer is in contact with the outer surface and is in contact with the outer surface.
The display device according to (1), wherein the recess is recessed in a direction from the outer surface to the inner surface.
(3)
The display device according to (2), wherein the recess does not penetrate to the inner surface.
(4)
The second substrate further includes a light-shielding layer.
The light-shielding layer is formed on the inner surface side.
The display device according to (2), wherein the recess is superimposed on the light-shielding layer.
(5)
Equipped with a display unit that displays images
The first region includes the display unit.
The display device according to (1), wherein the recess is located between the display unit and the end portion of the substrate in a plan view.
(6)
The display device according to (5), wherein the end portion of the substrate is formed linearly along a first direction between the recess and the electrode in a plan view.
(7)
The display device according to (6), wherein the recess extends along the first direction.
(8)
The display device according to (6), wherein the recess extends along a second direction intersecting the first direction.
(9)
The recess comprises a first portion extending along the first direction and a second portion extending along a second direction intersecting the first direction.
The display device according to (6), wherein the first portion and the second portion are connected to each other.
(10)
The display device according to (6), wherein the recess is circular.
(11)
The recess has a first edge and a second edge.
In a plan view, the first edge is located between the display and the end of the conductive adhesive layer, and the second edge is between the end of the conductive adhesive layer and the edge of the substrate. The display device according to any one of (7) to (10), which is located.

DSP ... Display device PNL ... Display panel DA ... Display unit NDA ... Non-display unit SUB1 ... 1st board A1 ... 1st area A2 ... 2nd area EL ... Electrode SUB2 ... 2nd board SUBE ... Board end CC ... Recessed E1 ... 1st edge E2 ... 2nd edge OD2 ... Optical element OD ... End AD ... Conductive adhesive layer ADE ... End CN ... Connection member 20 ... Insulation substrate 20A ... Inner surface 20B ... Outer surface LS ... Shading layer

Claims (11)

With the first board
With the second board
With optical elements
A conductive adhesive layer for adhering the optical element to the second substrate,
With connecting members,
The first substrate includes a first region on which the second substrate is superimposed and a second region provided with electrodes.
The second substrate includes a recess recessed toward the first substrate and a substrate end located at a boundary between the first region and the second region.
The conductive adhesive layer has an end that overlaps the recess.
A display device in which the connecting member is arranged in the recess and is in contact with the conductive adhesive layer, and is in contact with the end of the substrate and the electrodes. The second substrate includes an insulating substrate and has an insulating substrate.
The insulating substrate includes an inner surface facing the first substrate and an outer surface opposite to the inner surface.
The conductive adhesive layer is in contact with the outer surface and is in contact with the outer surface.
The display device according to claim 1, wherein the recess is recessed in a direction from the outer surface to the inner surface. The display device according to claim 2, wherein the recess does not penetrate to the inner surface. The second substrate further includes a light-shielding layer.
The light-shielding layer is formed on the inner surface side.
The display device according to claim 2, wherein the recess is superimposed on the light-shielding layer. Equipped with a display unit that displays images
The first region includes the display unit.
The display device according to claim 1, wherein the recess is located between the display unit and the end portion of the substrate in a plan view. The display device according to claim 5, wherein the end portion of the substrate is formed linearly along a first direction between the recess and the electrode in a plan view. The display device according to claim 6, wherein the recess extends along the first direction. The display device according to claim 6, wherein the recess extends along a second direction intersecting the first direction. The recess comprises a first portion extending along the first direction and a second portion extending along a second direction intersecting the first direction.
The display device according to claim 6, wherein the first portion and the second portion are connected to each other. The display device according to claim 6, wherein the recess is circular. The recess has a first edge and a second edge.
In a plan view, the first edge is located between the display and the end of the conductive adhesive layer, and the second edge is between the end of the conductive adhesive layer and the edge of the substrate. The display device according to any one of claims 7 to 10, which is located.

Images