JP2022035501A - Sheet pasting method and sheet pasting apparatus - Google Patents

Abstract

To paste a sheet to a workpiece in such a manner that adhesiveness becomes suitable for each of a device region and an outer peripheral excessive region.SOLUTION: A sheet pasting method for pasting a thermoplastic sheet to a front face side of a tabular workpiece including at the front face side a device region in which a plurality of devices are formed and an annular outer peripheral excessive region enclosing the outside of the device region, includes: a sheet preparing step of preparing a sheet which is sized so as to cover the entire front face side of the workpiece; a first heating step of heating the workpiece or the sheet disposed on a table; a sheet pasting step of pressing and pasting the sheet to the entire front face side of the workpiece being heated in the first heating step, or pressing and pasting the entire front face side of the workpiece to the sheet being heated in the first heating step; and a second heating step of heating an outer peripheral portion of the sheet corresponding to the outer peripheral excessive region of the workpiece at a higher temperature than a temperature at which the workpiece or the sheet is heated in the first heating step.SELECTED DRAWING: Figure 5

Description

The present invention is a sheet attachment method for attaching a thermoplastic sheet to the surface side of a plate-shaped workpiece, and a sheet attachment method for attaching a thermoplastic sheet to the surface side of a plate-shaped workpiece. Regarding the device.

Device chips used in various electronic devices are made by forming multiple devices on the surface side of a disk-shaped workpiece such as a semiconductor wafer, and then grinding or cutting the workpiece. Manufactured.

For example, the workpiece is thinned by grinding the back surface of the workpiece with a grinding device while the surface side of the workpiece is protected by a resin sheet (protective member). Next, a plurality of device chips are manufactured from the workpiece by dividing the workpiece into device units using a cutting device.

When the sheet is attached to the front surface side of the workpiece, for example, a circular sheet having a diameter larger than the diameter of the surface of the workpiece while the back surface side of the workpiece is sucked and held by a chuck table. Is crimped to the surface side. After that, the sheet is cut into a size corresponding to the diameter of the workpiece.

As a method of attaching the sheet to the work piece, in addition to the method of simply pressing the sheet and crimping it, the sheet is attached to the work piece while the chuck table is heated or the pressed body such as a roller is heated. There is a method of thermocompression bonding (see, for example, Patent Document 1). By thermocompression bonding, the adhesion between the sheet and the surface side can be improved as compared with the case where the sheet is simply pressed.

By the way, the device formed on the surface side of the workpiece has irregularities. Further, the device region on the surface side is located on the outer periphery of the device region and is wider than the outer peripheral surplus region on which the device is not formed, so that the surface area is large. Therefore, when the sheet is attached to the surface side, the adhesion between the sheet and the device region is higher than the adhesion between the sheet and the outer peripheral excess region.

Japanese Unexamined Patent Publication No. 2020-43117

When the sheet is attached to the entire surface side under the attachment conditions (temperature, pressing force, etc.) for appropriately attaching the sheet to the device area, the adhesion between the sheet and the outer peripheral excess area is determined. It is lower than the adhesion between the sheet and the device area. Therefore, for example, the grinding water used in the grinding process may enter the interface between the outer peripheral excess region of the surface and the sheet, resulting in a defect that the sheet is peeled off.

On the contrary, when the sheet is attached to the entire surface side under the attachment conditions for appropriately attaching the sheet to the outer peripheral surplus area, the adhesion between the sheet and the device area is improved between the sheet and the outer peripheral surplus area. It is in a high state compared to the adhesion with the area. Therefore, for example, after the grinding step, there may be a defect that the sheet cannot be peeled from the device region, or when the sheet is peeled off, a part of the sheet remains in the device region.

The present invention has been made in view of the above problems, and an object of the present invention is to attach a sheet to a work piece so as to have adhesion suitable for each of a device region and an outer peripheral surplus region.

According to one aspect of the present invention, on the surface side of a plate-shaped workpiece having a device region on which a plurality of devices are formed and an annular outer peripheral surplus region surrounding the outside of the device region on the surface side. A sheet attaching method for attaching a thermoplastic sheet, which prepares the sheet having a size capable of covering the entire surface side of the workpiece, and a sheet preparation step on the table. The sheet is pressed and attached to the entire surface side of the workpiece or the workpiece that has been arranged and heated in the first heating step and the workpiece that has been heated in the first heating step. The sheet attaching step of pressing and attaching the entire surface side of the workpiece to the sheet heated in the first heating step, and the outer peripheral excess region of the workpiece. Provided is a sheet attaching method comprising a second heating step of heating the outer peripheral portion of the sheet to a temperature higher than the temperature at which the workpiece or the sheet is heated in the first heating step.

Preferably, in the second heating step, the outer peripheral portion of the sheet is heated by applying warm air from the hot air heater to the outer peripheral portion of the sheet using a hot air heater.

According to another aspect of the present invention, the surface side of the plate-shaped workpiece having a device region on which a plurality of devices are formed and an annular outer peripheral surplus region surrounding the outside of the device region on the surface side. A sheet attaching device for attaching a thermoplastic sheet, which has a table and a first heating element provided on the table, and is processed by the heat from the first heating element. It has a first heating unit for heating an object or the sheet, and a pressing body, and the sheet is pressed and attached to the entire surface side of the workpiece heated by the first heating unit, or the sheet is attached. It has a sheet attachment mechanism that presses and attaches the entire surface side of the workpiece to the sheet heated by the first heating unit, and a second heating element, and has an outer peripheral surplus region of the workpiece. A sheet attachment comprising a second heating unit for heating the outer peripheral portion so that the outer peripheral portion of the sheet corresponding to the above is heated to a temperature higher than the temperature at which the workpiece or the sheet is heated by the first heating unit. A landing device is provided.

Preferably, the second heating unit has a hot air heater.

In the sheet attaching method according to one aspect of the present invention, after the sheet is attached to the entire surface side in the sheet attaching step through the first heating step, the sheet is attached to the outer peripheral excess region of the workpiece in the second heating step. The outer peripheral portion of the corresponding sheet is heated to a temperature higher than that in the first heating step. As a result, the outer peripheral portion of the sheet becomes more flexible than the central portion of the sheet, and the adhesion to the outer peripheral excess region is improved.

Therefore, in the second heating step, the adhesion between the outer peripheral excess region and the outer peripheral portion of the sheet can be additionally improved, so that the defect that the sheet is peeled off at the outer peripheral end portion of the workpiece can be suppressed. Further, it is possible to suppress the defect that the sheet cannot be peeled off from the device region, or when the sheet is peeled off, a part of the sheet remains in the device region. In this way, the adhesion between the device region and the outer peripheral surplus region and the sheet can be optimized.

1 (A) is a perspective view of a wafer, and FIG. 1 (B) is a sectional view taken along the line AA of FIG. 1 (A). It is a figure which shows the 1st heating process. It is a figure which shows the sheet sticking process. It is a figure which shows the sheet cutting process. It is a figure which shows the 2nd heating process. It is a flow chart of the sheet sticking method. It is a figure which shows the 1st heating process which concerns on 2nd Embodiment. It is a figure which shows the sheet sticking process which concerns on 2nd Embodiment. It is a figure which shows the sheet cutting process which concerns on 2nd Embodiment. It is a figure which shows the 2nd heating process which concerns on 2nd Embodiment. It is a partially enlarged view of the cutting mechanism which concerns on 3rd Embodiment.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a disk-shaped (plate-shaped) wafer (workpiece) to be processed will be described. 1 (A) is a perspective view of the wafer 11, and FIG. 1 (B) is a sectional view taken along the line AA of FIG. 1 (A).

The wafer 11 has a disk shape and is made of a semiconductor material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), and GaAs (gallium arsenide). There are no restrictions on the material, shape, structure, size, etc. of the wafer 11.

For example, the wafer 11 may be made of another semiconductor, a compound oxide such as LiNbO ₃ , LiTaO ₃ , or a material such as sapphire, glass, or ceramics. A plurality of scheduled division lines 13 are set in a grid pattern on the surface 11a of the wafer 11.

Devices 15 such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in each region on the surface 11a side partitioned by a plurality of scheduled division lines 13. These plurality of devices 15 are arranged in the central region on the surface 11a side.

In the present specification, the central region of the surface 11a in which a plurality of devices 15 are arranged is referred to as a device region 17a. Further, a region in which the device 15 is not formed and which surrounds the outside of the device region 17a and which is substantially annular on the surface 11a is referred to as an outer peripheral surplus region 17b.

As shown in FIG. 1 (B), the upper end of the device 15 slightly protrudes from the surface 11a. Bumps (not shown) may be further provided at the upper end of the device 15. The bump is made of a metal such as gold (Au) and has a height of, for example, about 100 μm to 200 μm.

Therefore, the device region 17a has a larger unevenness than the outer peripheral surplus region 17b. Further, the device region 17a occupies most of the surface 11a side. Therefore, the surface area of the device region 17a is larger than the surface area of the outer peripheral surplus region 17b.

When grinding the wafer 11, in order to prevent damage to the device 15, a circular or rectangular protective member (that is, a sheet 19 (see FIG. 2 and the like)) made of resin is first attached to the surface 11a side. do. Here, the sheet 19 will be described.

The sheet 19 is a polyolefin-based or polyester-based thin film having, for example, a thickness of about 50 μm to 250 μm and a size capable of covering the entire surface 11a side of the wafer 11.

As the polyolefin-based material, polyethylene (PE), polypropylene (PP), polystyrene (PS) and the like can be used. Further, as the polyester-based material, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and the like can be used.

By the way, the conventional general adhesive tape has a laminated structure of an adhesive layer (glue layer) and a base material layer. The adhesive layer adheres to the adherend by simply applying pressure at room temperature for a short time in a state where the adherend and the adhesive layer are in contact with each other without using water, a solvent, heat or the like.

On the other hand, the sheet 19 does not have an adhesive layer and has only a resin layer corresponding to the base material layer. The sheet 19 is thermoplastic and softens or melts at a predetermined temperature. However, the temperature at which it softens or melts differs depending on the material.

Depending on the material of the sheet 19, the sheet 19 can be softened or melted by heating the sheet 19 within the following exemplary temperature range.

Polyethylene sheet: 120 ° C or higher and 140 ° C or lower Polypropylene sheet: 160 ° C or higher and 180 ° C or lower Polystyrene sheet: 220 ° C or higher and 240 ° C or lower Polyethylene terephthalate sheet: 250 ° C or higher and 270 ° C or lower Made of polyethylene naphthalate Sheet: 160 ° C or more and 180 ° C or less

Next, the sheet attaching device 2 used in the sheet attaching method according to the first embodiment will be described. The sheet attaching device 2 has a disk-shaped chuck table (table) 4 (see FIG. 2). The chuck table 4 has a disk-shaped frame 6 made of metal.

An annular groove 6a having a predetermined depth that does not penetrate the frame 6 is formed on the upper surface side of the frame 6. The groove 6a functions as a relief groove for the cutting edge 20 (see FIG. 4) of the sheet cutting mechanism 18 described later.

As shown in FIG. 2, a disk-shaped recess 6b is formed in the upper part of the frame 6 inside the groove 6a. The bottom surface of the recess 6b is connected to the other end of a flow path (not shown) having one end connected to a suction source (not shown) such as an ejector.

A disk-shaped porous plate 8 made of porous ceramics is fixed to the recess 6b. When a negative pressure is generated by the suction source, the negative pressure can be transmitted to the upper surface of the porous plate 8 via the flow path. The wafer 11 and the like arranged on the upper surface of the porous plate 8 are sucked by this negative pressure.

The upper surface of the porous plate 8 is substantially flush with the upper surface of the frame body 6 inside the groove 6a. The upper surface of the frame body 6 and the upper surface of the porous plate 8 form a substantially flat holding surface 4a. The holding surface 4a has substantially the same diameter as the diameter of the wafer 11.

A heating element (first heating element) 10 is provided on the lower surface side of the chuck table 4. The heating element 10 is, for example, a resistance heating type heating element made of metal or ceramics, and is connected to a power source (not shown) via wiring (not shown).

The heating element 10, wiring, power supply, etc. constitute the first heating unit 12. However, the heating element 10 is not limited to the resistance heating type, and heat may be generated by any method such as induction heating and dielectric heating. The same applies to the other heating elements described herein.

As shown in FIG. 3, a roller 14 is provided above the holding surface 4a. The roller 14 has a columnar rotating shaft 14a arranged substantially parallel to the holding surface 4a. A bearing (not shown) is connected to the rotating shaft 14a.

A cylindrical housing (pressing body) 14b is connected to the outer peripheral portion of the bearing, and the housing 14b can rotate around the rotation shaft 14a. The length of the housing 14b (the length corresponding to the height of the cylinder) is substantially equal to or larger than the diameter of the wafer 11.

A connecting portion (not shown) extending upward is fixed to the rotating shaft 14a. A pressing mechanism (not shown) is connected to the upper part of the connecting portion. By pushing the roller 14 downward with the pressing mechanism, the housing 14b can be pushed toward the holding surface 4a.

Further, a first moving mechanism (not shown) is connected to the pressing mechanism. The first moving mechanism moves the pressing mechanism and the connecting portion along a predetermined linear direction substantially parallel to the holding surface 4a, thereby moving the roller 14 along the linear direction.

The first moving mechanism, pressing mechanism, roller 14, and the like constitute a sheet attaching mechanism 16 for pressing and attaching the sheet 19 to the wafer 11. In addition to the sheet attaching mechanism 16, a sheet cutting mechanism 18 is provided above the holding surface 4a (see FIG. 4).

As shown in FIG. 4, the sheet cutting mechanism 18 has a cutting edge 20. The flat side surface 20a inside the cutting edge 20 is urged from the outer periphery of the holding surface 4a toward the center by an urging member (not shown) such as a spring.

Normally, the cutting edge 20 is arranged substantially perpendicular to the holding surface 4a, but as shown in FIG. 4, when the tip end portion of the cutting edge 20 is pushed out from the center of the holding surface 4a to the outer periphery, the cutting edge 20 is urged. The member pushes the holding surface 4a from the outer periphery toward the center.

A second moving mechanism (not shown) for moving the cutting blade 20 along the circumferential direction of the chuck table 4 is connected to the upper portion of the cutting blade 20. If the cutting edge 20 is moved by the second moving mechanism, the sheet 19 attached to the surface 11a side can be cut along the outer peripheral end portion of the wafer 11.

In addition to the sheet cutting mechanism 18, a hot air heater 22 capable of blowing hot air 22a is provided above the holding surface 4a (see FIG. 5). As shown in FIG. 5, the hot air heater 22 includes a heating element (second heating element) 22b.

The heating element 22b is housed in, for example, an elongated cylindrical housing 22c. A ventilation mechanism (not shown) such as a fan is provided in the upper part of the housing 22c, and an opening 22d having a diameter of about 1 mm to 2 mm is formed in the lower part of the housing 22c.

A third moving mechanism (not shown) is connected to the upper part of the housing 22c. The third moving mechanism moves the hot air heater 22 along the circumferential direction of the chuck table 4. The hot air heater 22, the third moving mechanism, and the like constitute the second heating unit 24.

Next, each step of the sheet attaching method will be described with reference to FIGS. 2 to 6. FIG. 6 is a flow chart of the sheet attaching method according to the first embodiment. First, the above-mentioned sheet 19 (see FIG. 2) is prepared (sheet preparation step S10).

For example, a polyethylene sheet 19 is prepared. After the sheet preparation step S10, the back surface 11b side of the wafer 11 is sucked and held by the holding surface 4a so that the front surface 11a faces upward. Next, the wafer 11 is preliminarily heated (first heating step S20).

FIG. 2 is a diagram showing a first heating step S20. In the first heating step S20, the heating element 10 is heated to, for example, 90 ° C., and the wafer 11 is heated to about 90 ° C. by the heat from the heating element 10. After the first heating step S20, the sheet attaching step S30 is performed.

FIG. 3 is a diagram showing a sheet attaching step S30. In the sheet attaching step S30, the sheet 19 is pressed by the roller 14 against the entire surface 11a side of the heated wafer 11 while maintaining the temperatures of the heating element 10 and the wafer 11 in the first heating step S20.

As a result, the sheet 19 is attached to the surface 11a side. In the sheet attaching step S30, the roller 14 is moved in a predetermined direction so as to pass through the center of the surface 11a and cross the device region 17a. As a result, the sheet 19 is pressed against the entire surface 11a side.

In the sheet attachment step S30, the sheet 19 is appropriately attached to the device region 17a. Therefore, even if the sheet 19 is to be peeled off, the sheet 19 cannot be peeled off from the device region 17a, or if the sheet 19 is peeled off, the sheet 19 A part does not remain in the device area 17a.

In this embodiment, when the roller 14 is pressed, the roller 14 is pressed by the pressing mechanism. However, the sheet 19 may be pressed only by the weight of the roller 14 without using the pressing mechanism.

After the sheet attaching step S30, the roller 14 is moved to the outside of the holding surface 4a, and then the sheet cutting step S40 is performed. FIG. 4 is a diagram showing a sheet cutting step S40. In the sheet cutting step S40, first, the cutting blade 20 is cut into the sheet 19. At this time, the lower end of the cutting edge 20 penetrates the sheet 19 and reaches a predetermined depth in the groove 6a.

When cutting the cutting edge 20, the cutting edge 20 is cut into the sheet 19 from a position slightly inside the outer peripheral end of the wafer 11. As a result, the side surface 20a of the cutting edge 20 comes into contact with the outer peripheral end portion of the wafer 11 in a state of being slightly tilted from the vertical direction Z.

At this time, the side surface 20a and the wafer 11 are maintained in contact with each other by the above-mentioned urging member. In this state, when the cutting edge 20 is moved at least once along the outer peripheral edge of the wafer 11 by the second moving mechanism, the sheet 19 is cut along the outer peripheral end portion of the wafer 11.

In the sheet cutting step S40, the side surface 20a does not have to be in contact with the outer peripheral end portion of the wafer 11. For example, the sheet 19 can be cut with the side surface 20a separated from the outer peripheral end portion of the wafer 11 and the lower end portion of the side surface 20a pressed against the inner side surface of the groove 6a.

After the sheet cutting step S40, with the opening 22d positioned directly above the outer peripheral portion 19b of the sheet 19, the warm air heater 22 is moved at least once along the outer peripheral portion 19b by the third moving mechanism (second heating). Step S50). FIG. 5 is a diagram showing a second heating step S50.

As shown in FIG. 5, the outer peripheral portion 19b of the sheet 19 is a region corresponding to the outer peripheral surplus region 17b of the sheet 19, and the central portion 19a of the sheet 19 is the device region 17a of the sheet 19. The corresponding area.

In the second heating step S50, the outer peripheral portion 19b is heated so that the temperature becomes higher than the temperature at which the wafer 11 is heated in the first heating step S20 by applying the warm air 22a from the hot air heater 22 to the outer peripheral portion 19b. And press.

Specifically, warm air 22a is applied to the outer peripheral portion 19b so that the outer peripheral portion 19b has a temperature higher than the temperature at which the wafer 11 is heated in the first heating step S20 by 20 ° C to 30 ° C. As a result, the outer peripheral portion 19b becomes more flexible than the central portion 19a, and the adhesion with the outer peripheral excess region 17b is improved.

For example, if the temperature of the opening 22d is about 300 ° C., the temperature of the outer peripheral portion 19b can be set to about 100 ° C. In the present embodiment, the temperature of the opening 22d is set to about 360 ° C, so that the temperature of the outer peripheral portion 19b is set to about 120 ° C.

As described above, in the second heating step S50, the adhesion between the outer peripheral excess region 17b and the outer peripheral portion 19b can be additionally improved. Therefore, it is possible to suppress the defect that the sheet 19 is peeled off from the surface 11a side at the outer peripheral end portion of the wafer 11.

Further, in the second heating step S50, since the adhesion between the device region 17a and the central portion 19a is not changed, the sheet 19 cannot be peeled from the device region 17a, or when peeled, a part of the sheet 19 remains in the device region 17a. It is possible to suppress such a defect. Therefore, the adhesion between the device region 17a and the outer peripheral surplus region 17b and the sheet 19 can be optimized.

In the second heating step S50, the outer peripheral portion 19b of the sheet 19 is heated and pressed by applying warm air 22a, but the outer peripheral portion 19b may only be heated. The applicant has confirmed by experiments that the adhesion with the wafer 11 is improved according to the temperature of the sheet 19.

Specifically, a silicon bare wafer on which the device 15 is not formed is heated to a predetermined temperature, a polyethylene sheet is attached to the heated bare wafer, and then a cut is formed in the polyethylene sheet. Then, one strip was formed.

The width of the strip (length in the short side direction) was set to 25 mm. Then, using a universal testing machine, the strength when the strip was bent 180 degrees along the long side direction and peeled off (that is, the peeling adhesive strength) was measured.

When the peeling adhesive strength of each is measured at predetermined temperatures of 90 ° C, 110 ° C, 130 ° C and 150 ° C, the higher the temperature of the bare wafer when the polyethylene sheet is attached, the stronger the peeling adhesive strength of the strip. The results shown in Table 1 below were obtained.

Next, the second embodiment will be described. In the second embodiment, the sheet 19 is sucked and held by the chuck table 4 instead of the wafer 11, and the wafer 11 is pressed against the held sheet 19 to attach the wafer 11 to the sheet 19. This point is mainly different from the first embodiment.

Also in the second embodiment, first, the sheet preparation step S10 is performed. Next, the heating element 10 is heated while the sheet 19 is sucked and held by the holding surface 4a, and the sheet 19 is heated by the heat from the heating element 10 (first heating step S20). FIG. 7 is a diagram showing a first heating step S20 according to the second embodiment.

After the first heating step S20, the wafer 11 is arranged on the sheet 19 so that the sheet 19 and the surface 11a side are in contact with each other, and the back surface of the wafer 11 is formed by the roller 14 while maintaining the temperatures of the heating element 10 and the sheet 19. Press the 11b side. As a result, the entire surface 11a side of the wafer 11 is attached to the heated sheet 19 (sheet attaching step S30). FIG. 8 is a diagram showing a sheet attaching step S30 according to the second embodiment.

After the sheet attaching step S30, the cutting edge 20 is cut into the sheet 19 and the cutting edge 20 is moved along the outer periphery of the wafer 11. As a result, the sheet 19 is cut along the outer peripheral end portion of the wafer 11 (sheet cutting step S40). FIG. 9 is a diagram showing a sheet cutting step S40 according to the second embodiment.

After the sheet cutting step S40, the second heating step S50 is performed. In the second heating step S50, the outer peripheral portion 19b is heated and pressed by applying the warm air 22a from the warm air heater 22 to the region on the back surface 11b side corresponding to the outer peripheral surplus region 17b.

As a result, the outer peripheral portion 19b of the sheet 19 is set to a temperature higher than the temperature at which the wafer 11 is heated in the first heating step S20. FIG. 10 is a diagram showing a second heating step S50 according to the second embodiment.

Similar to the first embodiment, in the second heating step S50, the outer peripheral portion 19b becomes more flexible than the central portion 19a, and the adhesion with the outer peripheral excess region 17b is improved. Therefore, in the second heating step S50, the adhesion between the outer peripheral excess region 17b and the outer peripheral portion 19b can be additionally improved. Therefore, it is possible to suppress the defect that the sheet 19 is peeled off from the surface 11a side at the outer peripheral end portion of the wafer 11.

Further, in the second heating step S50, since the adhesion between the device region 17a and the central portion 19a is not changed, the sheet 19 cannot be peeled from the device region 17a, or when peeled, a part of the sheet 19 remains in the device region 17a. It is possible to suppress such a defect. Therefore, the adhesion between the device region 17a and the outer peripheral surplus region 17b and the sheet 19 can be optimized.

In the first and second embodiments described above, the second heating step S50 is performed after the sheet cutting step S40, but conversely, the sheet cutting step S40 may be performed after the second heating step S50. good. Further, the sheet cutting step S40 and the second heating step S50 may be performed at the same time.

FIG. 11 is a partially enlarged view of the cutting mechanism 28 according to the third embodiment, in which the sheet cutting step S40 and the second heating step S50 are simultaneously performed. The cutting mechanism 28 has an arm portion 30. The above-mentioned second moving mechanism (not shown) is connected to the upper part of the arm portion 30.

A rectangular parallelepiped cutting edge fixing portion 32 is fixed to the lower portion of the arm portion 30. The base end portion of the above-mentioned cutting edge 20 is fixed to the lower portion of the cutting edge fixing portion 32. The cutting edge fixing portion 32 can also move the cutting edge 20 in the vertical direction by, for example, about 5 mm.

Apart from the cutting edge fixing portion 32, the warm air heater 34 is fixed to the arm portion 30. The hot air heater 34 is arranged in front of the cutting edge 20 in the traveling direction. The hot air heater 34 has a nozzle heater 36 having a substantially cylindrical shape. The nozzle heater 36 includes an annular heating element (second heating element).

An air blow nozzle 38 is arranged above the through hole of the nozzle heater 36. If air is injected from the air blow nozzle 38 in a state where the nozzle heater 36 is heated, warm air 34a can be injected from the lower part of the nozzle heater 36.

In the third embodiment, the sheet cutting step S40 and the second heating step S50 can be performed at the same time by cutting the sheet 19 with the cutting blade 20 while blowing out the warm air 34a. Since the hot air heater 34 is arranged in front of the cutting edge 20 in the traveling direction, the cutting edge 20 can cut the outside of the outer peripheral portion 19b heated and pressed by the hot air 34a.

In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented as long as they do not deviate from the scope of the object of the present invention. For example, in the above-described embodiment, the disk-shaped wafer 11 is mentioned as an example of the workpiece, but the workpiece may be a rectangular plate-shaped resin package substrate.

Further, the shape of the sheet 19 may be circular or rectangular as long as it has a size larger than that of the workpiece. If the shape and size are the same as those of the workpiece, the sheet cutting step S40 may be omitted.

In the above-described embodiment, the roller 14 is pressed against the wafer 11 or the sheet 19, but in addition to this pressing, a heating element (not shown) built in the roller 14 may be heated. Further, instead of the roller 14, a pressing plate (not shown) having a size larger than that of the wafer 11 or the resin package substrate may be used.

By the way, the sheet attaching device 2 in the above-described embodiment has one chuck table 4, but the sheet attaching device 2 does not have a heating element 10 and has a groove 6a in addition to the chuck table 4. You may have a chuck table (not shown).

When an additional chuck table is used, the first heating step S20 and the sheet attaching step S30 are performed on the chuck table 4, and then the sheet cutting step S40 is performed using the additional chuck table that has not been heated.

As a result, the sheet 19 can be cooled as compared with the case where the sheet 19 is cut while the wafer 11 or the like is heated by the heating element 10. When the temperature of the sheet 19 is low, the sheet 19 is less likely to stick to the cutting edge 20, so that the sheet 19 can be smoothly cut in the sheet cutting step S40.

2: Sheet attaching device, 4: Chuck table, 4a: Holding surface 6: Frame body, 6a: Groove, 6b: Recessed plate, 8: Porous plate, 10: Heat generating body 11: Wafer, 11a: Front surface, 11b: Back surface, 13: Scheduled division line, 15: Device 12: First heating unit 14: Roller, 14a: Rotating shaft, 14b: Housing, 16: Sheet attachment mechanism 17a: Device area, 17b: Outer peripheral excess area 18: Sheet cutting mechanism , 20: cutting edge, 20a: side surface 19: sheet, 19a: central part, 19b: outer peripheral part 22: warm air heater, 22a: warm air, 22b: heating element, 22c: housing, 22d: opening 24: first 2 heating unit, 28: cutting mechanism, 30: arm, 32: cutting edge fixing part 34: warm air heater, 34a: warm air, 36: nozzle heater, 38: air blow nozzle Z: vertical direction

Claims (4)

A thermoplastic sheet is attached to the surface side of a plate-shaped workpiece having a device region on which a plurality of devices are formed and an annular outer peripheral surplus region surrounding the outside of the device region on the surface side. It ’s a sheet sticking method.
A sheet preparation step of preparing the sheet having a size capable of covering the entire surface side of the workpiece, and a sheet preparation step.
The first heating step of heating the workpiece or the sheet arranged on the table, and
The sheet is pressed and attached to the entire surface side of the work piece heated in the first heating step, or the work piece is attached to the sheet heated in the first heating step. The sheet pasting process, in which the entire surface side of the sheet is pressed and pasted,
A second heating step of heating the outer peripheral portion of the sheet corresponding to the outer peripheral surplus region of the workpiece to a temperature higher than the temperature at which the workpiece or the sheet was heated in the first heating step is provided. A sheet attachment method characterized by this. The sheet according to claim 1, wherein in the second heating step, the outer peripheral portion of the sheet is heated by applying warm air from the hot air heater to the outer peripheral portion of the sheet using a hot air heater. How to paste. A thermoplastic sheet is attached to the surface side of a plate-shaped workpiece having a device region on which a plurality of devices are formed and an annular outer peripheral surplus region surrounding the outside of the device region on the surface side. It is a sheet sticking device,
A first heating unit having a table and a first heating element provided on the table and heating the workpiece or the sheet with heat from the first heating element.
The sheet has a pressing body and is attached by pressing the sheet to the entire surface side of the workpiece heated by the first heating unit, or the covering is attached to the sheet heated by the first heating unit. A sheet attachment mechanism that presses and attaches the entire surface side of the work piece,
The outer peripheral portion of the sheet having the second heating element and corresponding to the outer peripheral excess region of the workpiece becomes a temperature higher than the temperature at which the workpiece or the sheet is heated by the first heating unit. A sheet attaching device comprising a second heating unit for heating the outer peripheral portion as described above. The sheet attaching device according to claim 3, wherein the second heating unit has a hot air heater.

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