JP2022031758A5 - - Google Patents

Claims (6)

A photosensitive resin composition comprising (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerizable monomer having an ethylenically unsaturated bond, (C) a photopolymerization initiator, and (D) an inorganic filler and the acid-modified vinyl group-containing epoxy resin of the component (A) is an epoxy resin (a) which is a novolac epoxy resin represented by the following general formula (1), and a vinyl group-containing monocarboxylic acid (b) Resin (A'') obtained by reacting saturated or unsaturated group-containing polybasic acid anhydride with resin (A') obtained by reacting (however, Mw / Mn (weight average molecular weight / number average molecular weight ) and a resin obtained by reacting an o-cresol novolac resin with acrylic acid and then with tetrahydrophthalic anhydride, and o-cresol. ), and (A) an acid A photosensitive resin composition in which the content of the modified vinyl group-containing epoxy resin is 15 to 60% by mass relative to the total solid content, and (D) the content of the inorganic filler is 30 to 70% by mass relative to the total solid content. thing.

[In general formula (1), R ¹¹ represents a hydrogen atom or a methyl group, Y ¹ represents a hydrogen atom or a glycidyl group, and n1 represents an integer of 1 or more. Plural R ¹¹ and Y ¹ may be the same or different. However, at least ^one Y1 represents a glycidyl group . ] 2. The photosensitive resin composition according to claim 1, wherein (B) a photopolymerizable monomer having an ethylenically unsaturated bond is a polyfunctional photopolymerizable monomer having 3 or more ethylenically unsaturated bonds in one molecule. 3. The photosensitive resin composition according to claim 1, further comprising (E) a pigment. A photosensitive film comprising a support and a photosensitive layer formed from the photosensitive resin composition according to any one of claims 1 to 3. The photosensitive material according to any one of claims 1 to 3, on the insulating substrate of a laminated substrate comprising an insulating substrate and a conductive layer having a circuit pattern formed on the insulating substrate, so as to cover the conductive layer. A photosensitive layer is laminated using a flexible resin composition, a predetermined portion of the photosensitive layer is irradiated with an actinic ray to form an exposed portion, and then portions of the photosensitive layer other than the exposed portion are removed. and a method of forming a resist pattern. An insulating substrate, a conductor layer having a circuit pattern formed on the insulating substrate, and the photosensitive resin composition according to any one of claims 1 to 3 so as to cover the conductor layer. and a permanent resist layer.