JP2022029225A - Resin film for conductive element wire and method for manufacturing the same, and flat rectangular electric wire - Google Patents

Abstract

To provide a resin film for a conductive element wire which prevents interlayer peeling and can improve heat resistance and electric characteristics and a method for manufacturing the same, and a flat rectangular electric wire.SOLUTION: A flat rectangular electric wire 1 for large current includes a plurality of conductive element wires 2 having approximately rectangular cross sections, an insulating layer 3 interposed between the plurality of conductive element wires 2, and a resin film 4 for a conductive element wire that covers the plurality of conductive element wires 2 and the insulating layer 3 and is fused thereto, and is used as components of a hybrid vehicle (HV), an electric vehicle (EV) and the like, in which the resin film 4 for the conductive element wire is molded of a molding material containing 100 pts.mass of a polyarylene ether ketone resin and 1 pts.mass or more and 100 pts.mass or less of an adhesive fluorine resin. The conductive element wires 2, the insulating layer 3 and the resin film 4 for the conductive element wire are bonded to each other to be integrated with each other accompanied by melting of the resin film 4 for the conductive element wire, and accordingly an adhesive layer for bonding the conductive element wires 2 and the resin film 4 for the conductive element wire can be omitted.SELECTED DRAWING: Figure 1

Description

The present invention relates to a resin film for a conductive wire used in electric / electronic devices, a method for manufacturing the same, and a flat wire.

Conventionally, flat-angle electric wires for high frequencies have been used in AC motors, coils of high-frequency electric devices, hybrid vehicles (HVs), motors for electric vehicles (EVs), motors for high-speed railway vehicles, and the like. Although not shown, this type of flat electric wire is formed by laminating a flat metal body having a square cross section in which an enamel film or an oxide film for insulation is formed on the outer periphery thereof. Further, as a flat electric wire that does not use an enamel film, a type in which a thermosetting resin film for adhesion or a flat metal body having a rectangular cross section formed on the outer periphery is laminated is also known.

For example, a flat wire of an aggregate conductor having an adhesive layer of an insulating thermosetting resin between conductor wires is known (see Patent Document 1). Further, there is also known a flat-angle electric wire in which a flat-angle metal conductor having an oxide film formed on the outer periphery thereof is laminated and the laminated conductor portion is coated with an insulating layer (see Patent Document 2). However, since the enamel film remains as soot in the welding process at the time of assembling the motor, these flat electric wires cannot be expected to be firmly welded. In the case of the type that does not use an enamel film, good welding can be expected, but there is a problem in the adhesion between the flat metal conductors during bending.

In view of this point, conventionally, a plurality of conductive strands having a rectangular cross section are laminated and arranged with an interlayer insulating layer interposed therebetween, and an outer layer insulating layer covering the collective conductor including the interlayer insulating layer is provided. A flat wire having an adhesive layer made of a thermoplastic resin having a thickness of 3 μm or more and 10 μm or less between the collective conductor and the outer layer insulating layer has been developed and proposed (see Patent Documents 3 and 4).

Japanese Unexamined Patent Publication No. 2008-186724 Japanese Unexamined Patent Publication No. 2009-245666 WO2015 / 033821 Gazette Japanese Unexamined Patent Publication No. 2017-08030

The conventional flat wire is configured as described above, and an adhesive layer made of a thermoplastic resin is interposed between the collective conductor and the outer layer insulating layer. However, if the adhesive layer is simply interposed, the adhesive layer deteriorates. , Delamination occurs between the collective conductor, the outer layer insulating layer, and the adhesive layer, which causes a big problem in heat resistance, electrical characteristics (electrical insulating property), and the like. Further, in the case of Patent Documents 3 and 4, since the insulating layer is formed by the extrusion coating, pinholes are likely to occur, and when the pinholes are generated, there arises a problem that the insulating property of the generated portion is lowered.

The present invention has been made in view of the above, and an object of the present invention is to provide a resin film for a conductive wire, a method for manufacturing the same, and a flat wire, which can prevent delamination and improve heat resistance, electrical characteristics, and the like. ..

As a result of diligent research to solve the above problems, the present inventors have focused on the combination of the polyarylene ether ketone resin and the adhesive fluororesin, and completed the present invention. That is, in the present invention, in order to solve the above problem, it is covered with a conductive wire having a substantially rectangular cross section.
It is characterized in that it is molded by a molding material containing 100 parts by mass of a polyarylene ether ketone resin and 1 part by mass or more and 100 parts by mass or less of an adhesive fluororesin.

In addition, there are a plurality of conductive strands, and an insulating layer is interposed between the plurality of conductive strands, and the plurality of conductive strands and the insulating layer are coated with a resin film for the conductive strands and fused. Can be done.
Further, the resin film for the conductive wire can be spirally wound around the plurality of conductive wires and the insulating layer so as to be fused.
Further, it is preferable that the relative crystallinity of the resin film for the conductive wire is less than 80%.

Further, the elongation at tensile break at 23 ° C. measured according to JIS K 7127 of the resin film for conductive wire is 50% or more, and the tensile elastic modulus at 23 ° C. measured according to JIS K 7127 is It is preferably 100 N / mm ² or more and 3000 N / mm ² or less.
Further, it is preferable that the relative permittivity at 1 GHz measured by the cavity resonator perturbation method of the resin film for the conductive wire is 3.0 or less.

Further, the storage elastic modulus (E') of the resin film for conductive wire is [glass transition point (Tg) -10 ° C of polyarylene ether ketone resin] or more [glass transition point (Tg) +50 of polyarylene ether ketone resin. ℃] It is preferable to have a portion that becomes a recess that once drops to 1 × 10 ⁸ Pa or less in the temperature range of 1 × 10 8 Pa or less.
Further, the thickness of the resin film for the conductive wire is preferably 1 μm or more and 100 μm or less.

Further, in the present invention, in order to solve the above problems, the method for producing a resin film for a conductive wire according to any one of claims 1 to 6 is used.
A molding material containing 100 parts by mass of a polyarylene ether ketone resin and 1 part by mass or more and 100 parts by mass or less of an adhesive fluororesin is melt-kneaded, and this molding material is extruded into a resin film for a conductive wire by a die of a molding machine. It is characterized in that a resin film for a conductive wire that has been molded and extruded is brought into contact with a cooling roll to be cooled.
Further, in order to solve the above problems, the present invention is characterized in that it is a flat electric wire having the resin film for the conductive wire according to any one of claims 1 to 6.

Here, the substantially rectangular cross-section within the scope of the claims includes both a rectangular cross-section and a shape substantially recognized as a rectangular cross-section. Further, the number of conductive strands may be one, but in the case of a plurality of conductors, there is no particular question such as two, three, four, five, six, seven or the like. In the case of a plurality of conductive strands, the conductive strands may have the same size, shape, and thickness, or may have different sizes, shapes, and thicknesses, as long as they have a substantially rectangular cross section.

There are a plurality of types of polyarylene ether ketone resins, but they are at least one of a polyether ketone resin, a polyether ether ketone resin, a polyether ketone ketone resin, a polyether ether ketone ketone resin, and a polyether ketone ether ketone ketone resin. Is preferable. Further, the insulating layer may be a single layer or a plurality of insulating layers.

According to the present invention, the conductive wire and the resin film for conductive wire covering the conductive wire are adhered to each other by melting the resin film for conductive wire containing the polyarylene ether ketone resin and the adhesive fluororesin. The adhesive layer for adhering the conductive wire and the resin film for the conductive wire can be omitted.

According to the present invention, the resin film for a conductive wire is molded by a molding material containing 100 parts by mass of a polyarylene ether ketone resin and 1 part by mass or more and 100 parts by mass or less of an adhesive fluororesin, so that delamination can be performed. It has the effect of preventing heat resistance and improving electrical characteristics.

According to the second aspect of the present invention, since the number of conductive strands is not a single number but a plurality of conductive strands, it is possible to reduce the amount of loss at high frequencies even if the conductive strands are incorporated in a motor or the like, for example. Further, the insulating layer can prevent a plurality of conductive wires having a potential difference from coming into contact with each other, and can eliminate the possibility of partial discharge occurring between the plurality of conductive wires.

According to the third aspect of the present invention, since the resin film for the conductive wire is spirally wound around the conductive wire, the dielectric breakdown voltage and the mechanical strength can be improved. In addition, the spiral winding without gaps can prevent the occurrence of pinholes and improve the insulating property.
According to the invention of claim 4, since the relative crystallinity of the resin film for conductive wire is less than 80%, the resin film for conductive wire containing the polyarylene ether ketone resin and the adhesive fluororesin is softened. , It is possible to improve the fusion property.

According to the invention according to claim 5, since the elongation at tensile break at 23 ° C. measured according to JIS K 7127 of the resin film for conductive wire is 50% or more, the toughness is suitable for the resin film for conductive wire. It is possible to eliminate the possibility of breakage or cracking when coating the conductive wire. In addition, the tensile elastic modulus at 23 ° C. measured in accordance with JIS K 7127 of the resin film for conductive wire is in the range of 100 N / mm ² or more and 3000 N / mm ² or less, so that the rigidity is appropriate for the resin film for conductive wire. Can be granted.

According to the invention of claim 6, since the relative permittivity at 1 GHz measured by the cavity resonator perturbation method of the resin film for conductive wire is 3.0 or less, the insulation property of the resin film for conductive wire can be ensured. You can expect it.

According to the invention according to claim 7, it is possible to improve the handleability of the resin film for conductive strands containing the polyarylene ether ketone resin and the adhesive fluororesin, and to simplify the manufacturing equipment. ..
According to the invention of claim 8, the adoption of the flat wire can be expected to improve the space factor, the skin effect, the heat dissipation, and the space saving.

It is a perspective explanatory drawing schematically showing the embodiment of the resin film for a conductive wire and the flat wire which concerns on this invention. It is sectional drawing which shows schematically the embodiment of the resin film for a conductive wire and the flat wire which concerns on this invention. It is an overall explanatory view which shows typically the manufacturing apparatus in embodiment of the manufacturing method of the resin film for a conductive wire which concerns on this invention. The storage elastic modulus (E) of the resin film for conductive wire containing the polyarylene ether ketone resin having a relative crystallinity of 34.6% and the adhesive fluororesin in the embodiment of the resin film for conductive wire according to the present invention. ') Is a graph schematically showing. Storage elastic modulus (E') of the resin film for conductive wire containing the polyarylene ether ketone resin having a relative crystallinity of 100% and the adhesive fluororesin in the embodiment of the resin film for conductive wire according to the present invention. It is a graph which shows schematically. It is sectional drawing which shows typically the 2nd Embodiment of the resin film for conductive wire and the flat wire, which concerns on this invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the flat wire 1 in the present embodiment includes a plurality of conducting wires 2 facing each other and a plurality of the conductive wires 2. The insulating layer 3 interposed between the conductive wires 2 and the resin film 4 for the conductive wires, which is an insulating resin member coated and fused to the plurality of conductive wires 2 and the insulating layer 3. It is an electric wire for high current used as a part of a hybrid vehicle (HV), an electric vehicle (EV), etc., and a resin film 4 for a conductive wire is provided with at least a polyarylene ether ketone resin and an adhesive fluororesin. It is made to be molded by the contained molding material M.

The plurality of conductive strands 2 are each formed in a substantially strip shape of the same size, are laminated in pairs in the vertical direction of FIG. 2, and are adjacent to each other. It is formed into a rectangular shape and functions to improve the skin effect and contribute to the reduction of electrical resistance. The reason why the plurality of conductive strands 2 are paired is that when the flat wire 1 is incorporated in a motor or a transformer, if the number of laminated wires is a pair (two layers), a sufficient reduction in the amount of loss at high frequencies can be expected.

The material of the conductive wire 2 is not particularly limited, but for example, a flexible conductor made of low-oxygen copper or oxygen-free copper having an oxygen content of 30 ppm or less is preferable. This is because if the oxygen content of the conductive wire 2 is low, it is possible to prevent the generation of voids due to the oxygen contained in the welded portion when the conductive wire 2 is melted by heat for welding. Because it can be done. Further, it is possible to prevent the electric resistance of the welded portion from deteriorating and to maintain the strength of the welded portion.

The insulating layer 3 is sandwiched between the facing surfaces of the pair of conductive strands 2 to prevent the pair of conductive strands 2 having a potential difference from coming into contact with each other, and a partial discharge occurs between the pair of conductive strands 2. Effectively prevents insulation breakdown. The insulating layer 3 includes a thermoplastic resin having a melting point of 250 ° C. or higher and 350 ° C. or lower, specifically, a polyethylene terephthalate resin, a polyester resin such as polyethylene naphthalate resin or polybutylene terephthalate resin, a polyamide 66 resin, or a polyamide 6T. Examples thereof include a polyamide resin such as a resin and a polyamide 9T resin, a polyphenylene sulfide resin, and a polyimide resin.

The reason why the melting point of the thermoplastic resin is 250 ° C. or higher and 350 ° C. or lower is that if it is out of this range, the electrical characteristics of the insulating layer 3 are deteriorated. Such an insulating layer 3 is formed into a cross-sectional plate shape by applying and baking a resin varnish containing a thermoplastic resin for the insulating layer 3 on the conductive wire 2.

The resin film 4 for a conductive wire is formed into a long strip by a molding material M containing at least 100 parts by mass of a polyarylene ether ketone resin and 1 part by mass or more and 100 parts by mass or less of an adhesive fluororesin, and is formed into a pair of conductive wires. The strands 2 and the insulating layer 3 are wound and coated in the longitudinal direction of the peripheral surface and fused. The resin film 4 for conductive wires may be simply wound flat in the longitudinal direction of the peripheral surface of the pair of conductive wires 2 and the insulating layer 3, but is preferably spirally wound (traverse wound) diagonally without a gap. ..

This is a spiral winding without gaps, rather than a molding material M containing a polyarylene ether ketone resin and an adhesive fluororesin being extruded into a tubular shape and covering a plurality of conductive strands 2 and an insulating layer 3. This is because the problem of pinhole generation can be solved and the insulating property can be improved. In particular, it is expected that the insulating property at the corner of the conductive wire 2 where the electric field is concentrated can be improved. In addition, when the flat wire 1 is used for the transformer, good voltage conversion can be expected by spiral winding.

The polyarylene ether ketone resin contained in the molding material M is a crystalline resin composed of an arylene group, an ether group, and a carbonyl group. Research Center: Resins listed in Super Engineering Plastics / PEEK (above), which grow in advanced applications, include heat-resistant aging properties, electrical properties (electrical insulation), cold resistance, mechanical properties, chemical resistance, and chemical resistance. Improvement of solvent properties can be expected.

Specific examples of the polyarylene ether ketone resin include a polyether ether ketone (PEEK) resin having a chemical structural formula represented by the chemical formula (1) and a polyether ketone having a chemical structure represented by the chemical formula (2) (2). PEK) resin, polyether ketone ketone (PEKK) resin having a chemical structure represented by the chemical formula (3), polyether ether ketone ketone (PEEKK) resin having the chemical structure of the chemical formula (4), or the chemical formula (5). Examples thereof include polyether ketones having a chemical structure and ether ketone ketone (PEKEKK) resins.

Among these polyetheretherketone resins, the polyetheretherketone resin and the polyetherketoneketone resin are preferable from the viewpoints of easy availability, cost, and moldability of the resin film 4 for conductive strands. Examples of polyetheretherketone resin products include Victrex Powder series, Victrex Granules series, Daicel Evonik product name: Vestakeep series, and Solvay Specialty Polymers product name: Qiita Spire. The PEEK series can be mentioned. Further, as a product example of the polyetherketoneketone resin, the product name: KEPSTAN series manufactured by Arkema Co., Ltd. corresponds.

The melting point of the polyarylene ether ketone resin is 270 ° C. or higher and 420 ° C. or lower, preferably 300 ° C. or higher and 400 ° C. or lower, more preferably 330 ° C. or higher and 370 ° C. or lower, and further preferably 340 ° C. or higher and 360 ° C. or lower. The melting point of the polyarylene ether ketone resin is in the range of 270 ° C or higher and 420 ° C or lower. This is because the polyarylene ether ketone resin remains without being completely melted at the time of melting, which may lead to a decrease in fusion property. The melting point of this polyarylene ether ketone resin can be measured by a differential scanning calorimeter.

The polyarylene ether ketone resin may be used alone or in combination of two or more. Further, the polyarylene ether ketone resin may be a copolymer having two or more chemical structures represented by the chemical formulas (1) to (5). Further, the polyarylene ether ketone resin is usually used in a form suitable for molding such as powder, granule, and pellet. The method for producing the polyarylene ether ketone resin is not particularly limited, and examples thereof include the production method described in the literature [Asahi Research Center Co., Ltd .: Super engineering plastic PEEK (above) that grows in advanced applications]. ..

The adhesive fluororesin contained in the molding material M contains a repeating unit (a) based on tetrafluoroethylene (hereinafter referred to as TFE) and / or chlorotrifluoroethylene (hereinafter referred to as CTFE) and a dicarboxylic acid anhydride group. A repeating unit (b) based on a cyclic hydrocarbon monomer having a polymerizable unsaturated group in the ring, and other monomers (provided that they overlap with the repeating units (a) and (b), if they overlap with each other). Contains a repeating unit (c) based on (excluding monomers).

In the adhesive fluororesin, the repeating unit (a) is 50 to 99.89 mol% and the repeating unit (b) is 50 to 99.89 mol% with respect to the total molar amount of the repeating unit (a), the repeating unit (b), and the repeating unit (c). ) Is 0.01 to 5 mol%, and the repeating unit (c) is 0.1 to 49.99 mol%. The repeating unit (a) is preferably 50 to 99.47 mol%, the repeating unit (b) is 0.03 to 3 mol%, and the repeating unit (c) is 0.5 to 49.97 mol%, more preferably. The repeating unit (a) is 50 to 98.95 mol%, the repeating unit (b) is 0.05 to 2 mol%, and the repeating unit (c) is 1 to 49.95 mol%.

This is based on the reason that the heat resistance and chemical resistance of the adhesive fluororesin are improved if the molar% of the repeating unit (a), the repeating unit (b), and the repeating unit (c) is in the relevant range. Further, it is based on the reason that the adhesiveness of the adhesive fluororesin is improved if the molar% of the repeating unit (b) is within the relevant range. Further, it is based on the reason that if the molar% of the repeating unit unit (c) is within the relevant range, the mechanical properties such as the moldability and the stress crack resistance of the adhesive fluororesin are improved.

The above-mentioned "cyclic hydrocarbon monomer having a dicarboxylic acid anhydride group and having a polymerizable unsaturated group in the ring" (hereinafter, simply abbreviated as cyclic hydrocarbon monomer) is a one or more 5-membered ring or a ring. A cyclic hydrocarbon consisting of a 6-membered ring, and a polymerizable compound having a dicarboxylic acid anhydride group and an in-ring polymerizable unsaturated group.

As the cyclic hydrocarbon, a cyclic hydrocarbon having one or more bridged polycyclic hydrocarbons is preferable. That is, a cyclic hydrocarbon composed of Aribashi polycyclic hydrocarbons, a cyclic hydrocarbon obtained by condensing two or more of Aribashi polycyclic hydrocarbons, or a cyclic hydrocarbon obtained by condensing Aribashi polycyclic hydrocarbons with other cyclic hydrocarbons. It is preferable to have. Further, the cyclic hydrocarbon monomer has one or more polymerizable unsaturated groups in the ring, that is, one or more polymerizable unsaturated groups existing between the carbon atoms constituting the hydrocarbon ring. This cyclic hydrocarbon monomer further has a dicarboxylic acid anhydride group (-CO-O-CO-), and the dicarboxylic acid anhydride group may be bonded to two carbon atoms constituting the hydrocarbon ring, and the ring may be bonded. It may be bonded to two outer carbon atoms.

Preferably, the dicarboxylic acid anhydride group is a carbon atom constituting the ring of the cyclic hydrocarbon and is bonded to two adjacent carbon atoms. Further, a halogen atom, an alkyl group, an alkyl halide group, or another substituent may be bonded to the carbon atom constituting the ring of the cyclic hydrocarbon instead of the hydrogen atom. Specific examples include those represented by the following equations (6) to (13). Here, R in the formulas (7) and (10) to (13) is a halogen atom selected from a lower alkyl group having 1 to 6 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and the above lower grade. An alkyl halide group in which a hydrogen atom in an alkyl group is replaced with a halogen atom is shown.

The cyclic hydrocarbon monomer is preferably represented by the formula (6), 5-norbornene-2,3-dicarboxylic acid anhydride (hereinafter referred to as NAH), the formulas (8) and (9). Examples thereof include a cyclic hydrocarbon monomer which is an acid anhydride, and a cyclic hydrocarbon monomer whose substituent R is a methyl group in the formulas (7) and (10) to (13). More preferably, NAH is good.

Examples of other monomers include vinyl fluoride, vinylidene fluoride (hereinafter referred to as VdF), CTFE (excluding the case where it is used as a repeating unit (a)), trifluoroethylene, and hexafluoropropylene (hereinafter referred to as HFP). ), CF ₂ = CFOR ^{f 1} (where R ^{f 1} is a perfluoroalkyl group having 1 to 10 carbon atoms and may contain oxygen atoms between carbon atoms), CF ₂ = CFOR ^{f 2} SO ₂ X ¹ (R ^f) . ² is a perfluoroalkylene group having 1 to 10 carbon atoms and may contain an oxygen atom between carbon atoms, X ¹ is a halogen atom or a hydroxyl group), CF ₂ = CFOR ^{f 2} CO ₂ X ² (where R ^{f 2} is the above. Same as, X ² is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms), CF ₂ = CF (CF ₂ ) _p OCF = CF ₂ (where p is 1 or 2), CH ₂ = CX ³ (CF) ₂ ) _q X ⁴ (where X ³ and X ⁴ are hydrogen atoms or fluorine atoms independently of each other, q is an integer of 2 to 10), perfluoro (2-methylene-4-methyl-1,3-dioxolan). ), An olefin having 2 to 4 carbon atoms such as ethylene, propylene and isobutene, a vinyl ester such as vinyl acetate, a vinyl ether such as ethyl vinyl ether and a cyclohexyl vinyl ether, and the like. The other monomers may be used alone or in combination of two or more.

Specific examples of CF ₂ = CFOR ^{f 1} include, for example, CF ₂ = CFO CF ₂ CF ₃ , CF ₂ = CFO CF ₂ CF ₂ CF ₃ , CF ₂ = CFO CF ₂ CF ₂ CF ₂ CF ₃ , CF ₂ = CFO (CF ₂ ). ) ₈ F etc. can be mentioned. Preferably, CF ₂ = CFOCF ₂ CF ₂ CF ₃ . Specific examples of CH ₂ = CX ₃ (CF ₂ ) _q X ⁴ include CH ₂ = CH (CF ₂ ) ₂ F, CH ₂ = CH (CF ₂ ) ₃ F, and CH ₂ = CH (CF ₂ ). ) ₄ F, CH ₂ = CF (CF ₂ ) ₃ H, CH ₂ = CF (CF ₂ ) ₄ H and the like. Preferably, CH ₂ = CH (CF ₂ ) ₄ F or CH ₂ = CH (CF ₂ ) ₂ F.

Other monomers are preferably VdF, HFP, CTFE (except when used as a repeating unit (a)), CF ₂ = CFOR ^{f 1} , CH ₂ = CX ₃ (CF ₂ ) _q X ⁴ , One or more selected from the group consisting of ethylene, propylene and vinyl acetate, more preferably HFP, CTFE (except when used as the repeating unit (a)), CF ₂ = CFOR ^{f 1} , ethylene. And CH ₂ = one or more selected from the group consisting of CX ³ (CF ₂ ) _q X ⁴ . Most preferably, HFP or CF ₂ = CFOR ^{f 1} . Further, as CF ₂ = CFOR ^{f 1} , a perfluoroalkyl group having R ^{f 1} having 1 to 6 carbon atoms is preferable, a perfluoroalkyl group having 2 to 4 carbon atoms is more preferable, and a perfluoropropyl group is most suitable.

Specific examples of the adhesive fluororesin include, for example, TFE / CF ₂ = CFOCF ₂ CF ₂ CF ₃ / NAH copolymer, TFE / HFP / NAH copolymer, TFE / CF ₂ = CFOCF ₂ CF ₂ CF ₃ /. HFP / NAH copolymer, TFE / VdF / NAH copolymer, TFE / CH ₂ = CH (CF ₂ ) ₄ F / NAH / ethylene copolymer, TFE / CH ₂ = CH (CF ₂ ) ₂ F / NAH / Ethylene copolymer, CTFE / CH ₂ = CH (CF ₂ ) ₄ F / NAH / ethylene copolymer, CTFE / CH ₂ = CH (CF ₂ ) ₂ F / NAH / ethylene copolymer, CTFE / CH ₂ = CH (CF ₂ ) ₂ F / NAH / ethylene copolymer and the like can be mentioned.

The melting point of the adhesive fluororesin is preferably 150 ° C. or higher and 330 ° C. or lower, and more preferably 200 ° C. or higher and 320 ° C. or lower. The melting point can be adjusted by appropriately selecting the content ratios of the repeating unit (a), the repeating unit (b), and the repeating unit (c) within the above range.

As the polymer terminal group of the adhesive fluororesin, if it has an adhesive functional group such as an ester group, a carbonate group, a hydroxyl group, a carboxyl group, a carbonylfluoride group, or an acid anhydride residue, it is a poly other than the adhesive fluororesin. The arylene ether ketone resin is preferable because it has excellent adhesion to a crystalline thermoplastic polyimide resin. Further, the polymer terminal group having an adhesive functional group can be introduced by appropriately selecting a radical polymerization initiator, a chain transfer agent, or the like at the time of producing the adhesive fluororesin.

The method for producing the adhesive fluororesin is not particularly limited, but a radical polymerization method using a radical polymerization initiator is used. The polymerization method includes bulk polymerization, solution polymerization using an organic solvent such as fluorinated hydrocarbon, chlorinated hydrocarbon, fluorinated hydrocarbon, alcohol, and hydrocarbon, an aqueous medium, and an appropriate organic solvent if necessary. Suspension polymerization using, an aqueous medium, and emulsion polymerization using an emulsifier can be mentioned, but solution polymerization is particularly preferable.

The adhesive fluororesin is not particularly limited, but preferably the adhesive fluororesin described in Japanese Patent No. 4424246, Japanese Patent No. 5263269, Japanese Patent No. 5365939, or Japanese Patent Application Laid-Open No. 2019-43134. can give. Examples of products of this adhesive fluororesin include LH-8000 [AGC: product name], AH-5000 [AGC: product name], AH-2000 [AGC: product name] EA-2000, etc. [AGC: Product name] can be mentioned. Among these adhesive fluororesins, EA-2000, which has excellent heat resistance, is suitable.

The amount of the adhesive fluororesin added is 1 part by mass or more and 100 parts by mass or less, preferably 10 parts by mass or less and 90 parts by mass or less, and more preferably 15 parts by mass or more and 80 parts by mass or less with respect to 100 parts by mass of the polyarylene ether ketone resin. More preferably, it is 20 parts by mass or more and 60 parts by mass or less. This is because when the amount of the adhesive fluororesin added is less than 1 part by mass, the relative permittivity of the resin film 4 for conductive wire containing the polyarylene ether ketone resin and the adhesive fluororesin cannot be expected to decrease. Because. On the contrary, when the addition amount exceeds 100 parts by mass, the dispersibility between the polyarylene ether ketone resin and the adhesive fluororesin is lowered, and the elongation at break of the conductive wire resin film 4 is inferior. This is because the handleability when winding the resin film 4 for conductive wire around the wire 2 is deteriorated.

From the above, if the amount of the adhesive fluororesin added to the molding material M is within the range of 1 part by mass or more and 100 parts by mass or less, the resin film 4 for conductive wire having excellent insulation and handleability can be obtained.

In addition to the above resins, the molding material M includes polyimide resins such as polyimide (PI) resin, polyamideimide (PAI) resin, polyetherimide (PEI) resin, polyamide 4T (PA4T) resin, and polyamide 6T (PA6T) resin. Modified polyamide 6T (PA6T) resin, polyamide 9T (PA9T) resin, polyamide 10T (PA10T) resin, polyamide 11T (PA11T) resin, polyamide 6 (PA6) resin, polyamide 66 (PA66) resin, polyamide 46 (PA46) resin, etc. Polyamide resin, polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin, polyester resin such as polyethylene naphthalate (PEN) resin, polysulfone (PSU) resin, polyether sulfone (PES) resin, polyphenyl sulfone. Polysulfone resin such as (PPSU) resin, polyphenylene sulfide (PPS) resin, polyphenylene sulfide ketone resin, polyphenylene sulfide sulfone resin, polyarylene sulfide resin such as polyphenylene sulfide ketone sulfone resin, liquid crystal polymer (LCP), polycarbonate (PC) resin, Polyallylate (PAR) resin and the like are added as needed.

In the above, when the resin film 4 for a conductive wire containing a polyarylene ether ketone resin and an adhesive fluororesin is produced, for example, the polyarylene ether ketone resin and the adhesive fluororesin are kept at room temperature (0 ° C. or higher and 50 ° C. or higher). After stirring and mixing under (° C. or lower) and melting and kneading for a predetermined time to prepare a molding material M, the strip-shaped resin film 4 for a conductive wire is continuously molded by the molding material M.

As a method for preparing the molding material M, (1) a polyarylene ether ketone resin and an adhesive fluororesin are stirred and mixed at room temperature and then melt-kneaded to prepare a molding material M, and (2) a polyarylene ether. Examples thereof include a method in which an adhesive fluororesin is added to a molten polyarylene ether ketone resin without stirring and mixing the ketone resin and the adhesive fluororesin, and these are melt-kneaded to prepare a molding material M.

Both of these methods (1) and (2) can be adopted, but first, the method (1) will be described when the polyarylene ether ketone resin and the adhesive fluororesin are stirred and mixed. A tumbler mixer, a hensyl mixer, a V-type mixer, a Nauter mixer, a ribbon blender, a universal stirring mixer, or the like is used.

Polyarylene ether ketone resin and adhesive fluororesin are mixed by mixing rolls, pressure kneaders, Banbury mixers, planetary mixers, twin-screw extruders, triaxial extruders, and four-screw extruders. , It is prepared as a molding material M by being melt-kneaded and dispersed by a multi-screw extruder such as an octa-screw extruder. When the molding material M is prepared, the temperature at the time of melt-kneading by the melt-kneader is preferably 270 ° C. or higher and 400 ° C. or lower, preferably 300 ° C. or higher and 380 ° C. or lower. This is because when the temperature of the melt-kneading machine 10 at the time of melt-kneading exceeds 400 ° C., the adhesive fluororesin is violently decomposed, which is not preferable.

Next, the method (2) will be described. In the case of this method, the polyarylene ether ketone resin is mixed with a mixing roll, a pressure kneader, a Banbury mixer, a planetary mixer, a twin-screw extruder, and a triaxial extruder. , A molding material by adding an adhesive fluororesin to a polyarylene ether ketone resin that has been melted by a multi-screw extruder such as a four-screw extruder or an eight-screw extruder and then melt-kneaded and dispersed. Prepare M. When the molding material M is prepared, the temperature at the time of melt-kneading by the melt-kneader is preferably 270 ° C. or higher and 400 ° C. or lower, preferably 300 ° C. or higher and 380 ° C. or lower. This is because when the temperature of the melt extrusion molding machine 10 exceeds 400 ° C., the adhesive fluororesin decomposes violently as described above.

The molding material M is usually extruded into a lump, a strand, a sheet, or a rod, and then used in a form suitable for molding such as a powder, a granule, or a pellet by a crusher or a cutting machine. The resin film 4 for conductive strands made of the molding material M can be manufactured by a known manufacturing method such as a melt extrusion molding method, a calender molding method, or a casting method. However, from the viewpoint of handleability and simplification of equipment, continuous extrusion molding by a melt extrusion molding method is optimal.

Here, the melt extrusion method uses a melt extrusion molding machine 10 including a single-screw extrusion molding machine, a twin-screw extrusion molding machine, and the like to melt a molding material M containing a polyarylene ether ketone resin and an adhesive fluororesin. This is a method of continuously extruding a strip-shaped resin film 4 for a conductive wire from a T-die 13 at the tip of an extrusion molding machine 10.

As shown in FIG. 3, the melt extrusion molding machine 10 comprises, for example, a single-screw extruder, a twin-screw extruder, or the like, and functions to melt-knead the charged molding material M. A raw material input port 11 for the molding material M is installed behind the upper part of the melt extrusion molding machine 10, and the raw material input port 11 has helium gas, neon gas, argon gas, krypton gas, nitrogen gas, and carbon dioxide gas. An inert gas supply pipe 12 for supplying an inert gas such as the above is connected, and the inflow of the inert gas through the inert gas supply pipe 12 is effective for oxidative deterioration and oxygen cross-linking of the molding material M. Is prevented.

As the melt extruder 10 such as a single-screw extruder or a twin-screw extruder, it is preferable to use a melt extruder having a vent port. This is because by melting and kneading under reduced pressure using the vent port, it becomes easy to sufficiently degas the water contained in the molding material M and the sublimated organic matter. Further, it is not necessary to adjust the water content of the molding material M before melting and kneading.

The temperature at the time of melt kneading of the melt extrusion molding machine 10 is not particularly limited as long as it is a temperature at which the molding material M can be melted and the molding material M does not decompose, but it is thermally decomposed at a temperature equal to or higher than the melting point of the molding material M. The range below the temperature is good. Specifically, the temperature is adjusted to 270 ° C. or higher and 400 ° C. or lower, preferably 300 ° C. or higher and 380 ° C. or lower. This is because if the temperature is lower than 270 ° C, the molding material M containing the polyarylene ether ketone resin cannot be melt-extruded, and if the temperature exceeds 400 ° C, the adhesive fluororesin may be severely decomposed. Based on the reason that there is.

As shown in FIG. 3, the molding material M melt-kneaded by the melt extrusion molding machine 10 is continuously extruded into a band-shaped resin film 4 for conductive strands by a T die 13 at the tip of the melt extrusion molding machine 10. It is manufactured by being molded, and the continuous resin film 4 for conductive wires is sandwiched between a pair of lower pressure-bonding rolls 17 and a cooling roll 18 to be cooled, and then wound up by a winder 20.

The T-die 13 is attached to the tip of the melt extrusion molding machine 10 via a connecting pipe 14 and functions to continuously push down the resin film 4 for conductive strands, which is a strip-shaped insulating resin member. The temperature at the time of extrusion of the T-die 13 is in the range of the melting point of the molding material 2 or more and less than the thermal decomposition temperature. Specifically, the temperature is adjusted to 270 ° C. or higher and 400 ° C. or lower, preferably 330 ° C. or higher and 380 ° C. or lower. This is because if the temperature is lower than 270 ° C, the molding material M containing the polyarylene ether ketone resin cannot be melt-extruded, and if the temperature exceeds 400 ° C, the adhesive fluororesin may be severely decomposed. Based on the reason that there is.

It is preferable that the gear pump 15 and the filter 16 are mounted on the connecting pipe 14 upstream of the T-die 13. The gear pump 15 transfers the molding material M melt-kneaded by the melt extrusion molding machine 10 to the T-die 13 at a constant flow rate and with high accuracy via the filter 16. Further, the filter 16 separates gels, foreign substances, and the like of the molten molding material M, and transfers the molten molding material M to the T die 13.

The pair of crimping rolls 17 are rotatably supported below the T-die 13 to slidably hold the cooling roll 18, and further downstream of the crimping roll 17 on the downstream side is a resin film for conductive strands. The take-up pipe 21 of the take-up machine 20 for taking up 4 is rotatably supported, and a resin film for a conductive wire is rotatably supported between the crimp roll 17 on the downstream side and the take-up pipe 21 of the take-up machine 20. A slit blade 22 that forms a slit on the side of 4 is arranged so as to be able to move up and down, and a tension is applied to the resin film 4 for conductive wire between the slit blade 22 and the take-up pipe 21 of the take-up machine 20. A necessary number of rotatable tension rolls 19 are supported for smooth winding.

A rubber layer of at least natural rubber, isoprene rubber, butadiene rubber, silicone rubber, fluororubber, etc. is provided on the peripheral surface of each crimping roll 17 from the viewpoint of improving the adhesion between the resin film 4 for conductive wire and the cooling roll 18. Is formed as necessary, and an inorganic compound such as silica or alumina is selectively added to the rubber layer. Among these, it is preferable to use silicone rubber or fluororubber, which has excellent heat resistance.

As the crimping roll 17, a metal elastic roll having a metal surface is used as needed, and when this metal elastic roll is used, it is possible to form a resin film 4 for a conductive wire having an excellent surface smoothness. Become. Examples of product examples of metal elastic rolls include metal sleeve rolls, air rolls [manufactured by Dimco: product name], and UF rolls [manufactured by Hitachi Zosen Corporation: product name].

Such a crimping roll 17 is adjusted to a temperature of 50 ° C. or higher and 200 ° C. or lower, preferably 80 ° C. or higher and 180 ° C. or lower, more preferably 100 ° C. or higher and 160 ° C. or lower, and further preferably 120 ° C. or higher and 1600 ° C. or lower, and is conductive. It is in sliding contact with the resin film 4 for wires and is pressed against the cooling roll 18. The temperature of the crimping roll 17 is within the range because when the temperature of the crimping roll 17 exceeds 200 ° C., the relative crystallinity of the resin film 4 for the conductive wire may exceed 80%. On the contrary, when the temperature of the crimping roll 17 is less than 50 ° C., dew condensation occurs on the crimping roll 17. Examples of the temperature adjusting method and the cooling method of the crimping roll 17 include a method using air, water, oil and the like, an electric heater, dielectric heating and the like.

The cooling roll 18 is made of, for example, a metal roll having a diameter larger than that of the crimping roll 17, and a resin film 4 for a conductive wire that is rotatably supported and extruded below the T die 13 is placed between the crimping roll 17 and the resin film 4. The thickness of the resin film 4 for conductive wire is controlled within a predetermined range while being held narrowly and cooled together with the crimping roll 17. Like the crimping roll 17, the cooling roll 18 has a temperature of 50 ° C. or higher and 200 ° C. or lower, preferably 80 ° C. or higher and 180 ° C. or lower, more preferably 100 ° C. or higher and 160 ° C. or lower, and further preferably 120 ° C. or higher and 160 ° C. or lower. It is adjusted and slides into contact with the resin film 4 for conductive wires.

The reason why the cooling roll 18 is adjusted to a temperature of 50 ° C. or higher and 200 ° C. or lower is that when the temperature of the cooling roll 18 exceeds 200 ° C., the relative crystallinity of the resin film 4 for the conductive wire exceeds 80%. This is because there is a risk that it will end up. On the other hand, if the temperature of the cooling roll 18 is less than 50 ° C., dew condensation is caused on the cooling roll 18, which is not preferable. Examples of the temperature adjusting method and the cooling method of the cooling roll 18 include a method using a heat medium such as air, water, and oil, an electric heater, induction heating, and the like.

In the above configuration, when the resin film 4 for conductive strands containing the polyarylene ether ketone resin and the adhesive fluororesin is more specifically and actually manufactured, as shown in FIG. 3, first, a melt extrusion molding machine is used. The molding material M is charged into the raw material charging port 11 of 10 while supplying the inert gas indicated by the arrow in the figure, and the polyarylene ether ketone resin and the adhesive fluororesin of the molding material M are charged by the melt extrusion molding machine 10. After melt-kneading, the resin film 4 for conductive strands is continuously extruded from the T-die 13 into a strip shape.

The water content of the molding material M before melt extrusion is adjusted to 2000 ppm or less, preferably 1000 ppm or less, and more preferably 100 ppm or more and 500 ppm or less. This is because when the water content exceeds 2000 ppm, the molding material M may foam immediately after being extruded from the T die 13.

After extruding the resin film 4 for the conductive wire, the resin film 4 for the conductive wire is wound around the pair of crimping rolls 17, the cooling roll 18, the tension roll 22, and the take-up pipe 20 of the winder 19 in order, and the resin film 4 for the conductive wire is cooled. After cooling with 18, the resin film 4 for conductive wire is manufactured by cutting both sides of the resin film 4 for conductive wire with the slit blades 21 and sequentially winding the resin film 4 on the take-up tube 20 of the winder 19. can do. When the resin film 4 for conductive wire is manufactured, fine irregularities are formed on the surface of the resin film 4 for conductive wire within a range that does not lose the effect of the present invention, and the surface of the resin film 4 for conductive wire is rubbed. The coefficient can be lowered.

The thickness of the resin film 4 for the conductive wire is 1 μm or more and 100 μm or less, preferably 2 μm or more and 75 μm or less, and more preferably 3 μm or more and 50 μm from the viewpoint of preventing dielectric breakdown during operation of the motor or the like and contributing to thinning. The following is good. This is because if the thickness of the resin film 4 for the conductive wire is in the range of 1 μm or more and 100 μm or less, it is possible to prevent a decrease in the occupancy rate of the conductive wire 2 and prevent a decrease in the performance of the motor by reducing the thickness. Because it becomes.

Crystallization occurs in the resin film 4 for conductive wires, and the crystallization of the resin film 4 for conductive wires can be represented by the relative crystallization degree. The relative crystallinity of the resin film 4 for conductive strands is calculated by the following formula based on the thermal analysis results measured at a heating rate of 10 ° C./min using a differential scanning calorimeter.
Relative crystallinity (%) = {1- (ΔHc / ΔHm)} × 100
ΔHc: Calorific value (J / g) of recrystallization peak of resin film for conductive wire
ΔHm: Calorific value (J / g) of crystal melting peak of resin film for conductive wire

The relative crystallinity of the resin film 4 for the conductive wire is less than 80%, preferably 70% or less, more preferably 50% or less, still more preferably around 30%. This is based on the reason that when the relative crystallinity of the resin film 4 for conductive wire exceeds 80%, the resin film 4 for conductive wire does not soften, so that the heat fusion property is lowered. The lower limit of the relative crystallinity of the resin film 4 for the conductive wire is not particularly limited, but is preferably 5% or more.

The mechanical properties of the resin film 4 for a conductive wire can be evaluated by the elongation at tensile break at 23 ° C. and the tensile elastic modulus. The elongation at break of the resin film 4 for conductive wire is 50% or more, preferably 100% or more, more preferably 150% or more, still more preferably 200% or more by a measurement method based on JIS K 6251 or JIS K 7127. Is good. The upper limit of the elongation at tensile break is not particularly limited, but is preferably 500% or less. This is because when the elongation at break is less than 50%, the resin film 4 for conductive wire does not have sufficient toughness, so that the resin film 4 for conductive wire is broken or cracked during winding around the flat wire 1. This is because there is a possibility that troubles such as the above may occur, and the winding process becomes difficult.

The tensile modulus of the resin film 4 for conductive wire at 23 ° C. is 100 N / mm ² or more and 3000 N / mm ² or less, preferably 300 N / mm, according to a measurement method based on JIS K 6251 or JIS K 7127 (test piece type 1B). The optimum range is mm ² or more and 2750 N / mm ² or less, more preferably 1500 N / mm ² or more and 2500 N / mm ² or less, and further preferably 500 N / mm ² or more and 2000 N / mm ² or less.

This is because when the tensile elastic modulus of the conductive wire resin film 4 is less than 100 N / mm ² , the rigidity of the conductive wire resin film 4 is inferior, so that the conductive wire 2 is combined with the conductive wire resin film 4. This is because the handleability is deteriorated during the winding process, and when the conductive wire 2 is bent, the difference in the laminated state of the resin film 4 for the conductive wire becomes large. Further, when it exceeds 3000 N / mm ² , the rigidity is too high at the time of bending, and the resin film 4 for the conductive wire is peeled off from the conductive wire 2.

The relative permittivity of the resin film 4 for conductive wire at 1 GHz is 3.0 or less, preferably 2.9 or less, more preferably 2.8 or less, still more preferably 2. It is 7 or less. This is because when the relative permittivity of the resin film 3 for conductive wires exceeds 3.0, the insulating property is deteriorated. The lower limit of the relative permittivity is not particularly limited, but is 1.1 or more in practice.

The storage elastic modulus (E') of the resin film 4 for conductive strands is important, and the storage elastic modulus (E') is at least [glass transition point (Tg) -10 ° C. of polyarylene ether ketone resin] [polyarylene. It is necessary to use a resin film for a conductive wire having a recessed portion that once drops to 1.0 × ¹⁰⁸ Pa or less in a temperature range of [glass transition point (Tg) + 50 ° C.] or less of the ether ketone resin (Fig.). 4). This is because, for example, when the resin film 4 for conductive wire is softened and fused when it does not have a recessed portion that once drops to 1.0 × ¹⁰⁸ Pa or less in the temperature range (see FIG. 5). Based on the reason that it will not be done.

Although FIGS. 4 and 5 show the storage elastic modulus in the extrusion direction, the storage elastic modulus in the width direction (direction perpendicular to the extrusion direction) is also substantially the same.

The dielectric breakdown voltage of the conductive wire film 4 is preferably 0.5 kV or more in order to secure the insulating property. Specifically, it is 0.5 kV or more, preferably 1.0 kV or more, more preferably 2 kV or more, and further preferably 4 kV or less. The upper limit of the dielectric breakdown voltage is not particularly limited, but is practically 15 kV or less.

The resin film 4 for conductive wires is brought into close contact with the cooling roll 18 and cooled. Although the contact time between the resin film 4 for conductive wires and the cooling roll 18 is not particularly limited, the resin film 4 for conductive wires is used for conductive wires. From the viewpoint of instantaneously cooling the resin film 4, 0.1 seconds or more and 120 seconds or less, preferably 0.5 seconds or more and 40 seconds or less, and more preferably 1 second or more and 30 seconds or less are optimal.

Next, when manufacturing a flat wire 1 using the resin film 4 for conductive wires, first, a pair of conductive wires 2 are prepared, and one of the pair of conductive wires 2 is made of conductive wires. A resin varnish containing a thermoplastic resin for the insulating layer 3 is applied onto the insulating layer 3 and baked to form the insulating layer 3, and then a pair of conductive strands 2 are laminated and laminated, and the insulating layer 3 is provided between them. Hold it.

After the insulating layer 3 is sandwiched between the pair of conductive wires 2 in this way, the resin film 4 for conductive wires elongated in the longitudinal direction of the peripheral surface is spirally wound to prevent the occurrence of pinholes. The completely spirally wound resin film 4 for the conductive wire may be heated and heat-sealed. Then, since the resin film 4 for conductive wires melts and adheres, the pair of conductive wires 2, the insulating layer 3, and the resin film 4 for conductive wires 4 are integrated, and a flat wire 1 can be manufactured. .. The heating method of the resin film 4 for an electric wire is not particularly limited, but for example, a method using a heat medium such as air, water, superheated steam, or oil, or a method such as an electric heater or dielectric heating is applicable. ..

The manufactured flat-angle electric wire 1 is used as a component of, for example, a motor, a transformer, a generator, a reactor, etc. for a hybrid vehicle, an electric vehicle, and a high-speed railway vehicle, and energizes a large current while improving the occupancy rate and heat dissipation.

According to the above configuration, as the conductive wire resin film 4 melts, the pair of conductive wires 2, the insulating layer 3, and the conductive wire resin film 4 adhere to each other and are integrated with each other. And the adhesive layer for adhering the conductive wire resin film 4 that covers the film 4 can be reliably omitted. Therefore, it is possible to prevent delamination from occurring between the conductive wire 2 and the adhesive layer, and improve heat resistance, electrical characteristics (electrical insulation), and the like. Further, by omitting the adhesive layer, the volatile organic compounds generated during the production of the flat wire 1 can be significantly reduced, and along with this reduction, the production cost can be reduced while considering the environment. Further, by omitting the adhesive layer, the thermal conductivity can be improved and the flat wire 1 can be made thinner to improve the performance of the motor.

Further, by adopting the resin film 4 for conductive strands containing the polyarylene ether ketone resin and the adhesive fluororesin, excellent heat resistance, cold resistance, insulation resistance, chemical resistance, solvent resistance, and radiation resistance are achieved. It is possible to obtain hydrolysis resistance, low water absorption, recyclability, dimensional stability, mechanical strength and the like. Further, the addition of the adhesive fluororesin can be expected to reduce the tensile elastic modulus and the relative permittivity.

Next, FIG. 6 shows a second embodiment of the present invention. In this case, the polyarylene ether ketone resin and the adhesive fluororesin are shown in the longitudinal direction of the peripheral surface of the pair of conductive strands 2 and the insulating layer 3. The resin film 4 for a conductive wire containing a resin is spirally wound in multiple layers instead of one layer.

The resin film 4 for conductive wires may be spirally wound by stacking two or more layers (for example, two layers, three layers, four layers, five layers, etc.), but in consideration of workability and practicality, the resin film 4 may be spirally wound. It is best to spirally wind it in three layers. The total thickness of the resin film 4 for conductive wires spirally wound in multiple layers is optimally 2 μm or more and 200 μm or less, preferably 3 μm or more and 150 μm or less, and more preferably 5 μm or more and 100 μm or less. Since other parts are the same as those in the above embodiment, the description thereof will be omitted.

In this embodiment as well, the same action and effect as those in the above embodiment can be expected, and since the resin film 4 for conductive wire is wound in multiple layers to increase the total thickness, the electrical characteristics of the resin film 4 for conductive wire can be improved. That is, it is clear that the dielectric breakdown voltage can be further improved. In particular, with the concentration of the electric field, it is possible to remarkably improve the dielectric breakdown voltage at the corner of the conductive wire 2 which requires high insulation.

In the above embodiment, the resin film 4 for conductive wires containing the polyarylene ether ketone resin and the adhesive fluororesin is fused to the pair of conductive wires 2 and the insulating layer 3, but the present invention is limited to this. It's not something. For example, the insulating layer 3 is omitted with the conductive wire 2 as one, the resin film 4 for the conductive wire is spirally wound around the peripheral surface of the conductive wire 2 and fused, and the adhesive layer and the adhesive are omitted. Is also good. Further, a plurality of conductive wire resin films 4 may be spirally wound around the peripheral surface of the conductive wire 2 and fused. Further, the resin film 4 for conductive wires includes a polyarylene ether ketone resin, an adhesive fluororesin, an antioxidant, a light stabilizer, an ultraviolet absorber, a plasticizer, and the like, as long as the characteristics of the present invention are not impaired. A lubricant, a flame retardant, an antistatic agent, a heat resistance improver, an inorganic compound, an organic compound and the like may be selectively added.

Further, in the case of producing the resin film 4 for conductive strands of the above embodiment, one kind of polyarylene ether ketone resin may be used alone, but two or more kinds of polyarylene ether ketone resins may also be used. .. Further, the resin film 4 for the conductive wire can be subjected to surface treatment such as corona treatment, plasma treatment, acid treatment, flame treatment, itro treatment, and coating treatment, if necessary. Further, the opening shape of the filter 16 is not particularly limited to a circular shape, an elliptical shape, a rectangular shape, a polygonal shape, or the like.

Hereinafter, examples of the resin film for conductive wires and the method for producing the same according to the present invention will be described together with comparative examples.
[Example 1]
First, a molding material was prepared from a polyarylene ether ketone resin and an adhesive fluororesin. As the polyarylene ether ketone resin, 100 parts by mass of a commercially available polyetheretherketone resin [manufactured by Solvay Specialty Polymers, product name: KETAPIRE KT-851 NL SP (hereinafter abbreviated as "KT-851 NL SP")). The prepared polyetheretherketone resin was dried in a dehumidifying dryer heated to 160 ° C. for 12 hours or more. As the adhesive fluororesin, 5 parts by mass of a commercially available adhesive fluororesin EA-2000 [manufactured by AGC: product name, hereinafter abbreviated as "EA-2000"] was prepared.

After preparing these polyarylene ether ketone resins and adhesive fluororesin, a stirring mixture is prepared by putting two kinds of resins into a mixer and stirring and mixing, and the stirring mixture is used in a co-rotating twin-screw extruder or the like. The extruded product was melt-kneaded and extruded into strands, air-cooled and solidified, and then cut into pellets to prepare a molding material. As the co-rotating twin-screw extruder, a φ42 mm, L / D = 38 type was used. The stirring mixture was melt-kneaded under the conditions of a cylinder temperature of 370 ° C. and a die temperature of 370 ° C. to prepare a molding material. The temperature at the time of melt-kneading was determined to be the temperature of the molded material in the molten state immediately after being extruded from the die, and was measured to be 366 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 12 hours or more. After confirming that the water content of the dried molding material was 300 ppm or less, the dried molding material was placed in a T-die having a width of 900 mm. The melt-kneaded molding material was continuously extruded from the T-die to extrude the resin film for conductive strands into a strip shape. At this time, the water content of the molding material was measured by the Karl Fischer titration method using a trace moisture measuring device [product name CA-100 type manufactured by Mitsubishi Chemical Corporation].

The single-screw extruder was of the type having a diameter of 40 mm and a screw: full flight screw (L / D = 32, compression ratio: 2.5). The cylinder temperature of this single-screw extruder was adjusted to 250 to 390 ° C., the temperature of the T-die was adjusted to 390 ° C., and the temperature of the connecting pipe connecting the single-screw extruder and the T-die was adjusted to 390 ° C., respectively. Further, regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 393 ° C. Further, when the molding material was charged into the single-screw extruder, nitrogen gas 18 L / min was supplied through the inert gas supply pipe.

After the resin film for the conductive wire is extruded, the resin film for the conductive wire is used as a pair of crimping rolls made of silicone rubber, a metal roll which is a cooling roll at 150 ° C. with irregularities on the peripheral surface, and downstream thereof. The length is 100 m and the width is 650 mm by sequentially winding on the 6-inch take-up tube of the take-up machine located in, sandwiching it between the crimping roll and the metal roll, and sequentially winding it on the take-up tube of the take-up machine. A resin film for conductive wire was manufactured.

After producing the resin film for the conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulating properties of the resin film for the conductive wire were evaluated, and the results are summarized in Table 1. The mechanical properties of the resin film for conductive strands were evaluated by the elongation at tensile break and the tensile elastic modulus, and the insulating properties were evaluated by the relative permittivity at a frequency of 1 GHz.

-Thickness of resin film for conductive wire The film thickness of the resin film for conductive wire was measured using a micrometer [Product name manufactured by Mitutoyo Co., Ltd .: Coolant proof micrometer, code MDC-25PJ]. At the time of measurement, arbitrary 10 points in the width direction (direction perpendicular to the extrusion direction) of the resin film for conductive wire were measured, and the average value thereof was taken as the film thickness.

-Relative crystallinity of the resin film for conductive wire For the relative crystallinity of the resin film for conductive wire, weigh about 8 mg of the measurement sample from the resin film for conductive wire and measure it with a differential scanning calorimeter [SI Nano. Products manufactured by Technologies, Inc .: EXSTAR7000 series X-DSC7000] were used for measurement under the conditions of a temperature rise rate of 10 ° C./min and a measurement temperature range of 20 ° C. to 380 ° C. It was calculated from the calorific value of the crystal melting peak (J / g) and the calorific value of the recrystallization peak (J / g) obtained at this time using the following formula.

Relative crystallinity (%) = {1- (ΔHc / ΔHm)} × 100
Here, ΔHc represents the calorific value (J / g) of the recrystallization peak of the resin film for conductive wire under a heating condition of 10 ° C./min, and ΔHm is 10 ° C./min of the resin film for conductive wire. It represents the calorific value (J / g) of the crystal melting peak under the temperature rising condition of.

-Mechanical properties of the resin film for conductive wires The mechanical properties of the resin film for conductive wires were evaluated by the elongation at tensile break and the tensile elastic modulus. The elongation at break and the tensile elastic modulus were measured in accordance with JIS K 7127 (test piece type 1B) under the conditions of a tensile speed of 50 mm / min and a temperature of 23 ° C. The tensile elastic modulus was measured in the extrusion direction and the width direction (direction perpendicular to the extrusion direction) of the film for conductive strands.

-Relative permittivity of resin film for conductive wire [Frequency: 1 GHz]
The relative permittivity of the resin film for conductive wire at a frequency of 1 GHz was measured by a cavity resonator perturbation method using a vector network analyzer [MS46122B + 040 + 002 manufactured by Anritsu Corporation]. The measurement of the dielectric property at 1 GHz was carried out in accordance with ASTMD2520, except that the cavity resonator was changed to the cavity resonator 1 GHz [Keecom model; for near 1 GHz]. The measurement of the dielectric property was carried out in an environment of temperature: 23 ° C. ± 1 ° C. and humidity of 50% RH ± 5% RH.

[Example 2]
First, a molding material was prepared from a polyarylene ether ketone resin and an adhesive fluororesin. In Example 1, KT-851 NL SP was used as the commercially available polyetheretherketone resin, but in Example 2, the product name manufactured by Daicel Evonix was used as the commercially available polyetheretherketone resin: Vestakeep-. It was changed to J ZV7403 (hereinafter abbreviated as "ZV7403"). As a molding material, 100 parts by mass of a polyetheretherketone resin was prepared, and the polyetheretherketone resin was dried in a dehumidifying dryer heated to 160 ° C. for 12 hours or more. As the adhesive fluororesin, 15 parts by mass of the adhesive fluororesin EA-2000 used in Example 1 was prepared.

After preparing these polyarylene ether ketone resins and the adhesive fluororesin, a molding material was prepared by the same method as in Example 1. The temperature at the time of melt-kneading was determined to measure the temperature of the molded material in the molten state immediately after being extruded from the die, and was measured to be 376 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 12 hours or more, the moisture content of the molding material dried by the same method as in Example 1 was measured, and the moisture content of the dried molding material was measured. After confirming that the water content was 300 ppm or less, a resin film for a conductive wire was produced by the same method as in Example 1. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 393 ° C. The temperature of the cooling roll was changed to 160 ° C.

After manufacturing the resin film for conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of this resin film for conductive wire were evaluated according to the method of Example 1, and the results are summarized in Table 1. rice field.

[Example 3]
First, a molding material was prepared from a polyarylene ether ketone resin and an adhesive fluororesin. In Example 1, KT-851 NL SP was used as the commercially available polyetheretherketone resin, but in Example 3, the product name: Victrex Granules 381G manufactured by Victrex was used as the commercially available polyetheretherketone resin. (Hereinafter, abbreviated as "381G"). As a molding material, 100 parts by mass of a polyetheretherketone resin was prepared, and the polyetheretherketone resin was dried in a dehumidifying dryer heated to 160 ° C. for 12 hours or more. As the adhesive fluororesin, 30 parts by mass of the adhesive fluororesin EA-2000 used in Example 1 was prepared.

After preparing these polyarylene ether ketone resins and the adhesive fluororesin, a molding material was prepared by the same method as in Example 1. The temperature at the time of melt-kneading was determined to be the temperature of the molded material in the molten state immediately after being extruded from the die, and the measured temperature was 365 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 12 hours or more, the moisture content of the molding material dried by the same method as in Example 1 was measured, and the moisture content of the dried molding material was measured. After confirming that the water content was 300 ppm or less, a resin film for a conductive wire was produced by the same method as in Example 1. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 393 ° C. The temperature of the cooling roll was the same as in Example 1.

After manufacturing the resin film for conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of this resin film for conductive wire were evaluated according to the method of Example 1, and the results are summarized in Table 1. rice field.

[Example 4]
First, a molding material was prepared with a polyarylene ether ketone resin and an adhesive fluororesin. In Example 1, KT-851 NL SP was used as the commercially available polyetheretherketone resin, but in this Example 4, the product name: Victrex Granules manufactured by Victrex was used as the commercially available polyetheretherketone resin. It was changed to 450G (hereinafter abbreviated as "450G"). As the molding material, 100 parts by mass of the polyetheretherketone resin was prepared, and the polyetheretherketone resin was dried in a dehumidifying dryer heated to 160 ° C. for 12 hours or more. Further, as the adhesive fluororesin, 50 parts by mass of the adhesive fluororesin EA-2000 used in Example 1 was prepared.

After preparing these, a molding material was prepared by the same method as in Example 1. The temperature at the time of melt-kneading was determined to be the temperature of the molded material in the molten state immediately after being extruded from the die, and the measured temperature was 365 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 12 hours or more, the moisture content of the molding material dried by the same method as in Example 1 was measured, and the moisture content of the dried molding material was measured. After confirming that the water content was 300 ppm or less, a resin film for a conductive wire was produced by the same method as in Example 1. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 390 ° C. The temperature of the cooling roll was the same as in Example 1.

After producing the resin film for the conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of the resin film for the conductive wire were evaluated according to the method of Example 1, and the results are shown in Table 1. did.

[Example 5]
First, a molding material was prepared with a polyarylene ether ketone resin and an adhesive fluororesin. In Example 5, the polyetheretherketone resin used in Example 1 was used as a commercially available polyetheretherketone resin. As the molding material, 100 parts by mass of the polyetheretherketone resin was prepared, and the polyetheretherketone resin was dried in a dehumidifying dryer heated to 160 ° C. for 12 hours or more. Further, as the adhesive fluororesin, 85 parts by mass of the adhesive fluororesin EA-2000 used in Example 1 was prepared.

After preparing these, a molding material was prepared by the same method as in Example 1. The temperature at the time of melt-kneading was determined to be the temperature of the molded material in the molten state immediately after being extruded from the die, and the measured temperature was 365 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 12 hours or more, the moisture content of the molding material dried by the same method as in Example 1 was measured, and the moisture content of the dried molding material was measured. After confirming that the water content was 300 ppm or less, a resin film for a conductive wire was produced by the same method as in Example 1. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 391 ° C. The temperature of the cooling roll was the same as in Example 1.

After manufacturing the resin film for conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of this resin film for conductive wire were evaluated according to the method of Example 1, and the results are shown in Table 2. did.

[Example 6]
First, a molding material was prepared with a polyarylene ether ketone resin and an adhesive fluororesin. As the polyarylene ether ketone, a commercially available polyetherketoneketone resin [product name manufactured by Arkema: KEPSTAN 7003 (hereinafter, “KEPSTAN 7003”]] was used. As a molding material, 100 resin parts of the polyetherketoneketone resin were prepared. This polyetherketoneketone resin was allowed to dry for 12 hours or more in a dehumidifying / drying machine heated to 160 ° C. Further, as an adhesive fluororesin, an adhesive fluororesin EA-2000 [manufactured by AGC: product name, (AGC), which is commercially available. Hereinafter, it is abbreviated as “EA-2000”] by 15 parts by mass.

After preparing these, a stirring mixture is prepared by putting two kinds of resins into a mixer and stirring and mixing, and the stirring mixture is melt-kneaded by a co-rotating twin-screw extruder or the like and extruded into a strand shape. This extruded product was air-cooled and solidified, and then cut into pellets to prepare a molding material. As the co-rotating twin-screw extruder, a φ42 mm, L / D = 38 type was used. The stirring mixture was melt-kneaded under the conditions of a cylinder temperature of 360 ° C. and a die temperature of 360 ° C. to prepare a molding material. The temperature at the time of melt-kneading was determined to be the temperature of the molded material in the molten state immediately after being extruded from the die, and the measured temperature was 361 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 12 hours or more. After confirming that the water content of the dried molding material was 300 ppm or less, the dried molding material was placed in a T-die having a width of 150 mm. The melt-kneaded molding material was continuously extruded from the T-die to extrude the resin film for conductive strands into a strip shape. At this time, the water content of the molding material was measured by the Karl Fischer titration method using a trace water content measuring device [product name CA-100 type manufactured by Mitsubishi Chemical Corporation].

The single-screw extruder was of the type having a diameter of 40 mm and a screw: full flight screw (L / D = 32, compression ratio: 2.5). The cylinder temperature of the single-screw extruder was adjusted to 360 ° C to 380 ° C, the temperature of the T-die was adjusted to 380 ° C, and the temperature of the connecting pipe connecting the single-screw extruder and the T-die was adjusted to 380 ° C. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 377 ° C.

After the resin film for the conductive wire is extruded, the resin film for the conductive wire is used as a pair of crimping rolls made of silicone rubber, a metal roll which is a cooling roll at 140 ° C. with irregularities on the peripheral surface, and downstream thereof. The length is 100 m and the width is 650 mm by sequentially winding on the 6-inch take-up tube of the take-up machine located in, sandwiching it between the crimping roll and the metal roll, and sequentially winding it on the take-up tube of the take-up machine. A resin film for conductive wire was manufactured.

After manufacturing the resin film for conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of this resin film for conductive wire were evaluated according to the method of Example 1, and the results are shown in Table 2. did.

[Comparative Example 1]
First, a molding material was prepared from a polyarylene ether ketone resin and an adhesive fluororesin. The same polyetheretherketone resin as in Example 1 was used as the polyarylene ether ketone resin. As a molding material, 100 parts by mass of a polyetheretherketone resin was prepared, and the polyetheretherketone resin was dried in a dehumidifying dryer heated to 160 ° C. for 12 hours. As the adhesive fluororesin, 0.5 parts by mass of the adhesive fluororesin EA-2000 used in Example 1 was prepared, which is less than 1 part by mass.

After preparing these polyarylene ether ketone resins and the adhesive fluororesin, a molding material was prepared by the same method as in Example 1. The temperature at the time of melt-kneading was determined to measure the temperature of the molded material in the molten state immediately after being extruded from the die, and the measured temperature was 369 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 24 hours, and the moisture content of the molding material dried by the same method as in Example 1 was measured, and the moisture content of the dried molding material was measured. After confirming that the content was 300 ppm or less, a resin film for conductive wire was produced by the same method as in Example 1. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 391 ° C. The temperature of the cooling roll was set in the same manner as in Example 1.

After manufacturing the resin film for conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of this resin film for conductive wire were evaluated according to the method of Example 1, and the results are summarized in Table 3. rice field.

[Comparative Example 2]
First, a molding material was prepared from a polyarylene ether ketone resin and an adhesive fluororesin. The same polyetheretherketone resin as in Example 1 was used as the polyarylene ether ketone resin. As a molding material, 100 parts by mass of a polyetheretherketone resin was prepared, and the polyetheretherketone resin was dried in a dehumidifying dryer heated to 160 ° C. for 12 hours. As the adhesive fluororesin, 150 parts by mass of the adhesive fluororesin EA-2000 used in Example 1 was prepared, which exceeds 100 parts by mass.

After preparing these polyarylene ether ketone resins and the adhesive fluororesin, a molding material was prepared by the same method as in Example 1. The temperature at the time of melt-kneading was determined to be the temperature of the molded material in the molten state immediately after being extruded from the die, and was measured to be 366 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 24 hours, and the moisture content of the molding material dried by the same method as in Example 1 was measured, and the moisture content of the dried molding material was measured. After confirming that the content was 300 ppm or less, a resin film for conductive wire was produced by the same method as in Example 1. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 390 ° C. The temperature of the cooling roll was set in the same manner as in Example 1.

After manufacturing the resin film for conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of this resin film for conductive wire were evaluated according to the method of Example 1, and the results are summarized in Table 3. rice field.

[Comparative Example 3]
First, a molding material was prepared with a polyarylene ether ketone resin and a fluororesin tetrafluoride / perfluoroalkoxyethylene copolymer (hereinafter abbreviated as “PFA resin”) which is a fluororesin having no adhesiveness. The same KT-851NL SP as in Example 1 was used as the polyarylene ether ketone resin. As the molding material, 100 parts by mass of the polyetheretherketone resin was used, and the polyetheretherketone resin was dried for 12 hours in a dehumidifying dryer heated to 160 ° C. As the PFA resin, 15 parts by mass of commercially available NEOFLON AP-210 [manufactured by Daikin Industries, Ltd .: product name, (hereinafter abbreviated as "AP-201")] was used.

After preparing these, a molding material was prepared by the same method as in Example 1. The cylinder temperature of the co-rotating twin-screw extruder was changed to 380 ° C, and the die temperature was changed to 380 ° C. Further, the temperature at the time of melt-kneading was determined to measure the temperature of the molded material in the molten state immediately after being extruded from the die, and the measured temperature was 377 ° C.

Next, the molding material was put into a dehumidifying dryer heated to 160 ° C. and dried for 24 hours, the moisture content of the molding material dried by the same method as in Example 1 was measured, and then the moisture content of the dried molding material was measured. Was confirmed to be 300 ppm or less, and a resin film for conductive wire was produced by the same method as in Example 1. Regarding the temperature of the molten molding material, it was decided to measure the resin temperature at the inlet of the T die, and the measured temperature was 389 ° C. The temperature of the cooling roll was the same as in Example 1.

After manufacturing the resin film for conductive wire, the film thickness, relative crystallinity, mechanical properties, and insulation characteristics of this resin film for conductive wire were evaluated according to the method of Example 1, and the results are shown in Table 3. did.

〔evaluation〕
Since the resin film for conductive wire of each example has an elongation at tensile break of 86% or more as compared with the resin film for conductive wire of the comparative example, it is presumed that sufficient durability can be obtained. Further, since the tensile elastic modulus is in the range of 850 N / mm ² or more and 2260 N / mm ² or less, it is presumed that the adhesion to the conductive wire is excellent. Further, since the relative permittivity is 2.35 or more and 2.89 or less, it is presumed that good insulating properties can be obtained.

On the other hand, the resin film for conductive wire of Comparative Example 1 showed a high relative permittivity of 3.13 because the amount of the adhesive fluororesin added was 0.5 parts by mass. Therefore, doubts have arisen about the insulating property of the resin film for conductive wires.
Since 150 parts by mass of the adhesive fluororesin was added to the resin film for the conductive wire of Comparative Example 2, the elongation at tensile break was less than 50%, and the toughness was questioned. Therefore, when the resin film for the conductive wire is wound around the conductive wire, there is a risk of causing breakage.

Since the resin film for conductive wire of Comparative Example 3 was added with PFA resin, which is a fluororesin having no adhesiveness, the tensile elastic modulus exceeded 3000 N / mm ² , and the film was peeled off during bending of a flat wire. There was a risk that it would end up. Furthermore, the relative permittivity also exceeded 3.0, raising doubts about the insulating properties of the resin film for conductive wires.

From the above results, the polyarylene ketone resin film formed by adding 1 part by mass or more and 100 parts by mass or less of the adhesive fluororesin can be expected to have an appropriate tensile elastic modulus and specific dielectric property. It is presumed that excellent insulation and winding workability can be obtained when used as a resin.

The resin film for a conductive wire, a method for manufacturing the same, and a flat wire according to the present invention are used in various fields of manufacturing electric / electronic devices, electric wires, cables, and the like.

1 Flat wire 2 Conductive wire 3 Insulation layer 4 Resin film for conductive wire 10 Melt extrusion molding machine (molding machine)
13 T dice (dice)
17 Crimping roll 18 Cooling roll 20 Winder M Molding material

Claims (8)

It is a resin film for conductive wire coated with a conductive wire having a substantially rectangular cross section, and is molded by a molding material containing 100 parts by mass of a polyarylene ether ketone resin and 1 part by mass or more and 100 parts by mass or less of an adhesive fluororesin. A resin film for conductive strands, which is characterized by being made. The conductive element according to claim 1, wherein there are a plurality of conductive strands, an insulating layer is interposed between the plurality of conductive strands, and the plurality of conductive strands and the insulating layer are coated and fused. Resin film for wires. The resin film for a conductive wire according to claim 2, wherein the resin film is spirally wound around a plurality of conductive wires and an insulating layer and fused. The resin film for a conductive wire according to claim 1, 2 or 3, wherein the relative crystallinity is less than 80%. The elongation at tensile fracture at 23 ° C. measured according to JIS K 7127 is 50% or more, and the tensile modulus at 23 ° C. measured according to JIS K 7127 is 100 N / mm ² or more and 3000 N / mm ² The resin film for a conductive wire according to any one of claims 1 to 4 below. The resin film for a conductive wire according to any one of claims 1 to 5, wherein the relative permittivity at 1 GHz measured by the cavity resonator perturbation method is 3.0 or less. The method for producing a resin film for a conductive wire according to any one of claims 1 to 6, wherein 100 parts by mass of a polyarylene ether ketone resin and 1 part by mass or more and 100 parts by mass or less of an adhesive fluororesin are contained. The material is melt-kneaded, the molding material is extruded into a resin film for conductive wire by using a die of a molding machine, and the extruded resin film for conductive wire is brought into contact with a cooling roll to be cooled. A method for manufacturing a resin film for strands. A flat electric wire having the resin film for a conductive wire according to any one of claims 1 to 6.

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