JP2022028460A - RF tag - Google Patents

Abstract

To maintain or improve communication characteristics by the design freedom of an antenna including a sub antenna while effectively protecting an RF tag from external force, impact, or temperature change, for example.SOLUTION: The present invention includes: an IC chip 10; a loop circuit antenna 11; a radiation antenna 12; a sub antenna 13; and an insulating substrate 20. The IP chip 10, the loop circuit antenna 11, and the radiation antenna 12 are equipped in the substrate 20, and at least a part of the loop circuit antenna 11 and the sub antenna 13 are arranged in a surface different from the surface of the substrate 20 where the IC chip 10 is equipped.SELECTED DRAWING: Figure 1

Description

The present invention relates to an RF tag used by being attached to an arbitrary article or object such as a metal article, and particularly protects a loop circuit antenna or a radiating antenna connected to an IC chip from external force, impact, or the like. Regarding RF tags with environmental resistance.

In general, a so-called RF tag containing an IC chip that readable and writably stores predetermined information about an arbitrary article or object is widely used.
RF tags are also called RFID (Radio Frequency Identification) tags, IC tags, non-contact tags, etc., and so-called inlays (inlays) in which an electronic circuit equipped with an IC chip and a wireless antenna is sealed and coated with a base material such as a resin film. The inlet) is an ultra-small communication terminal formed in the shape of a tag (tag), and a read / write device (reader / writer) wirelessly reads, writes, and reads / writes predetermined information on the IC chip inside the tag. (Read-only, write-once, read-write) can be performed.

Then, by writing predetermined information in such an RF tag and attaching it to an arbitrary article, object, etc., the information recorded in the RF tag is picked up by the reader / writer, and the information recorded in the tag is used in the article. It can be recognized, output, displayed, updated, etc. as predetermined information about.
Such an RF tag can record data of several hundred bits to several kilobits in the memory of the IC chip, can record a sufficient amount of information as information about articles, etc., and is on the reading / writing device side. Since communication can be performed without contact, there is no concern about wear, scratches, dirt, etc. of the contacts, and since the tag itself can be turned off, it is possible to process it according to the object, and to make it smaller and thinner.

By using such an RF tag, various information about the article to which the tag is attached, for example, various information such as the name and identification symbol of the article, contents, components, manager, user, usage status, usage status, etc. can be obtained. It is possible to record and read and write a wide variety of information that was not possible with characters and barcodes printed on the label surface, simply by attaching a miniaturized and thinned tag to the article. It becomes.
Here, in such an RF tag, an RF tag called a general-purpose inlay (inlet), which is simply a film-coated IC chip and an antenna, is widely used. This type of inlay has become widespread in recent years because it is small and thin, can be easily attached to any object without taking up space, and can be immediately used as an RF tag.

However, since such a general-purpose inlay is simply a film-coated IC chip and antenna, if it is left as it is, it may cause a failure, malfunction, damage, or the like due to an impact applied from the outside. For example, cargo pallets and containers are constantly subject to physical and mechanical external forces and impacts, and in the case of RF tags that are attached to such objects and used, in the state of inlays. There was a risk that it would easily break down or be damaged.
In addition, in a film-coated general-purpose inlay, if the inlay expands and contracts repeatedly due to changes in environmental temperature, the aluminum antenna may break or the adhesive at the antenna contact with the IC chip may peel off. There was sex.

For this reason, for RF tags used in situations where external force is likely to be applied or in environments with temperature changes, the inlay can be physically and mechanically stored by storing the general-purpose inlay in a predetermined cover, case, or housing. An RF tag with environmental resistance that protects against shocks and temperature changes has been proposed.
For example, Patent Document 1 proposes to improve the environmental resistance of an RF tag by mounting and storing the IC chip and coil conductor constituting the RF tag on a heat-resistant glass epoxy substrate. ..
By storing and mounting the IC chip and coil conductor in the glass epoxy board in this way, the coil conductor that functions as the IC chip and antenna is protected from the surrounding environment, and in particular, due to external force, impact, temperature change, etc. applied from the outside. However, it is possible to prevent the RF tag from being easily broken or damaged.

International Publication No. 2018/193988

However, in the technique proposed in Patent Document 1, no consideration has been given to the basic components provided in the general-purpose inlay.
In general, an inlay has three components as a basic configuration: an IC chip, a loop circuit antenna arranged near the periphery of the IC chip, and a radiation antenna extending in both sides (left and right) directions of the IC chip. The antenna constitutes a dipole antenna composed of conductors extending in both the left and right directions of the IC chip (loop circuit antenna).
Such a dipole antenna is formed so as to be symmetrical on both sides of the IC chip so that the conductors constituting the antenna have a predetermined length, for example, a length of 1/2 wavelength.

However, in the RF tag proposed in Patent Document 1, the coil conductor housed inside the glass epoxy board only functions as an antenna, and even if it corresponds to a loop circuit antenna of a general-purpose inlay, it can be used as a dipole antenna. It was not equipped with a working radiation antenna.
Therefore, it is considered that the RF tag of Patent Document 1 can hardly communicate by itself, and in reality, it is necessary to separately adjust the loop axis by a non-contact antenna.
Therefore, it has been difficult to obtain good communication characteristics while improving environmental resistance, at least for a configuration (radiation antenna / loop circuit antenna) equivalent to that of a general-purpose inlay.

Further, in Patent Document 1, in addition to the radiation antenna and the loop circuit antenna provided in the inlay, there is no consideration of further providing an auxiliary antenna.
Generally, for general-purpose inlays, in order to maintain and improve communication identification by the radiating antenna / loop circuit antenna, a third antenna different from the radiating antenna / loop circuit antenna is placed near, for example, an IC chip or a loop circuit antenna. A flat auxiliary antenna may be provided.
By additionally mounting such an auxiliary antenna, the radio communication distance of the RF tag can be lengthened or the frequency band can be widened.

However, in the RF tag as proposed in Patent Document 1, such an auxiliary antenna is not considered.
In addition, Patent Document 1 discloses that a large booster antenna on which the RF tag itself can be mounted can be used. However, the booster antenna described in Patent Document 1 has an RF tag mounted on the surface of an antenna element that is much longer than the RF tag, and is no longer an "auxiliary antenna" that assists a loop circuit antenna or a radiation antenna. It was not an RF tag with a booster antenna.
For this reason, the dimensions of the booster antenna are such that the length of the antenna that extends to both sides with the RF tag mounted in the center is extremely long (see Fig. 9), which is a factor that hinders the miniaturization of the RF tag and the degree of freedom in design. There was a risk of becoming.

As a result of diligent research, the applicant and the inventor of the present application have made the RF tag effective from the surrounding environment without impairing the miniaturization of the RF tag, the degree of freedom in design, etc. by using only the components similar to the general-purpose inlay. We have come up with an invention that can make wireless communication good by protecting it and making it possible to utilize the function of the auxiliary antenna.

That is, the present invention has been proposed to solve the problems of the conventional techniques as described above, and the IC chip, the radiation antenna, and the loop circuit antenna constituting the RF tag are mounted on an insulating substrate. By doing so, the IC chip, the loop circuit antenna, and the radiation antenna can be effectively protected by the three-dimensional regions in the plane direction and the thickness direction of the substrate having a certain thickness, and the three-dimensional region of the substrate can be used. It is possible to improve the degree of freedom in designing the antenna of the RF tag including the auxiliary antenna and the communication characteristics, and the purpose is to provide the RF tag having excellent both environmental resistance and communication characteristics.

In order to achieve the above object, the RF tag of the present invention includes an IC chip, a radiation antenna, a loop circuit antenna, and an insulating substrate, and the IC chip, the loop circuit, and the radiation antenna are provided with the IC chip, the loop circuit, and the radiation antenna. It is mounted on the board, and at least a part of the loop circuit is arranged on a surface different from the mounting surface of the board on which the IC chip is mounted.

According to the present invention, by mounting the IC chip, the radiation antenna, and the loop circuit antenna constituting the RF tag on the insulating substrate, the three-dimensional regions in the plane direction and the thickness direction of the substrate having a certain thickness can be obtained. IC chips, loop circuit antennas, and radiation antennas can be effectively protected.
Further, by utilizing the three-dimensional regions in the plane direction and the thickness direction of the substrate, it is possible to improve the design freedom and communication characteristics of the antenna of the RF tag including the auxiliary antenna.
Therefore, according to the present invention, it is suitable as an RF tag used in an environment where physical force, impact, temperature change, etc. are often applied from the outside while ensuring the miniaturization of the RF tag and the degree of freedom in design. It is possible to realize an RF tag that can be used and has excellent both environmental resistance and communication characteristics.

It is an external perspective view which shows the RF tag which concerns on one Embodiment of this invention, (a) is the completed state of RF tag, (b) is an IC chip mounted on the substrate by removing the substrate which constitutes RF tag. Only the loop circuit antenna, the radiation antenna, and the auxiliary antenna are shown, and (c) shows the state in which each component shown in (b) is disassembled and separated. It is a perspective view which shows the specific example of the arrangement relation of each component which removed the substrate of the RF tag which concerns on one Embodiment of this invention. It is a figure which shows the specific example of the arrangement relation of the substrate, the IC chip, and each antenna of the RF tag which concerns on one Embodiment of this invention schematically, (A) is the case where the substrate is two layers, (B) is a substrate. In the case of three layers, (a) is a cross-sectional view, and (b)-(d) is a plan view of each layer of the substrate. It is a figure which shows the specific example of the arrangement relation of the substrate, the IC chip, and each antenna of the RF tag which concerns on one Embodiment of this invention schematically, and is the case where the loop circuit antenna has a three-dimensional three-dimensional structure, respectively. (A) is a cross-sectional view, (b)-(d) is a plan view of each layer of the substrate, and (e)-(f) is a perspective view of a loop circuit antenna. It is a figure which shows the specific example of the arrangement relation of the substrate, the IC chip, and each antenna of the RF tag which concerns on one Embodiment of this invention schematically, (A) is the case of the configuration other than this invention, (B) is When the substrate has two layers, (C) is a case where the substrate has three layers, (a) is a cross-sectional view, and (b)-(d) is a plan view of each layer of the substrate. It is a figure which shows the specific example of the arrangement relation of each antenna except a substrate, an IC chip, and a loop circuit antenna of the RF tag which concerns on one Embodiment of this invention, and (A) is the structure which only the radiating antenna is folded back. In this case, (B) is a case where only the auxiliary antenna is folded back, (C) is a case where both the radiation antenna and the auxiliary antenna are folded back, and (a)-(d) are cross-sectional views, respectively. It is sectional drawing schematically showing the specific example of the structure which protects the IC chip mounted on the substrate of the RF tag which concerns on one Embodiment of this invention, and (A) coats only the IC chip mounting surface of a substrate. If (B) is the case where the entire substrate is molded, (C) is the case where only the IC chip is potted, (D) is the case where the entire substrate is casing, and (E) is the recess (E) in which the IC chip is formed on the substrate. This is the case when it is buried in a groove / hole). It is a line graph which shows the relationship between the frequency and the communication distance which shows the communication characteristic of the RF tag which concerns on one Embodiment of this invention.

Hereinafter, embodiments of the RF tag according to the present invention will be described with reference to the drawings.
FIG. 1 is an external perspective view showing an RF tag 1 according to an embodiment of the present invention.
FIG. 2 is a perspective view schematically showing the arrangement relationship between the IC chip 10 from which the substrate 20 is removed and the components of the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 of the RF tag 1 according to the present embodiment. be.
FIG. 3-7 is a cross-sectional view and a plan view schematically showing a specific example of the arrangement relationship between the substrate 20, the IC chip 10, and the antennas 11, 12, and 13 of the RF tag 1 according to the present embodiment.

As shown in these figures, in the RF tag 1 according to the present embodiment, each component of the IC chip 10, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 constituting the RF tag for wireless communication is composed of. It is mounted on a substrate 20 as a base material to form one RF tag.
The substrate 20 functions as a fixing means for mounting and fixing the IC chip 10, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13, which are the components of the RF tag 1, and further, each of these components is removed. It is designed to function as a protective measure to protect the environment.

Specifically, in the present embodiment, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 that function as the antenna of the IC chip 10 are respectively in the plane direction of the mounting surface on which the IC chip 10 of the substrate 20 is mounted. By mounting and arranging in the three-dimensional regions of the horizontal direction and the intersecting thickness direction (vertical direction), the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 are external to each other depending on the resin or the like constituting the substrate 20. It is designed to be isolated and sealed from the antenna.
As a result, the durability, impact resistance, pressure resistance, heat resistance, etc. against physical forces such as external impact, pressure, and temperature change applied to the RF tag 1 are improved, and the loop circuit antenna is affected by external force, impact, and environmental changes. 11. It is possible to effectively prevent the failure / damage of the radiation antenna 12 and the auxiliary antenna 13.

Further, by arranging the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 three-dimensionally in the three-dimensional region extending in the plane direction and the thickness direction of the substrate 20, the arrangement and design of the antennas are designed. By maximizing the design of the loop circuit antenna 11 and the radiation antenna 12, for example, the RF tag 1 can be made smaller and thinner, and the antenna can be set according to the communication characteristics. Changes can be made arbitrarily.
Then, along with the loop circuit antenna 11 and the radiation antenna 12, the auxiliary antenna 13 to be the third antenna is also configured into an optimum shape and size and arranged at an appropriate position, so that the auxiliary antenna 13 can be attached to the RF tag. It can be effectively functioned as the antenna of No. 1, and the communication characteristics of the RF tag 1 can be maintained and improved in a good state.
Hereinafter, each part of the RF tag 1 according to the present embodiment will be described in detail.

[RF tag]
The RF tag 1 constitutes a wireless communication device for wirelessly reading, writing, and reading / writing predetermined information with a reader / writer (read / write device) (not shown), for example, read-only type, write. There are types such as once type and read / write type.
Specifically, the RF tag 1 has an IC chip 10, a loop circuit antenna 11 electrically conducted and connected to the IC chip 10, and a radiation antenna 12, and the IC chip 10 and the loop circuit antenna 11 ... The radiation antenna 12 is fixed and protected by being mounted and mounted on the substrate 20 as a base material.

In the example shown in FIG. 1, the IC chip 10 is mounted and mounted on the plane (upper surface) of the substrate 20, and the loop circuit antenna 11 is below the IC chip 10 in a three-dimensional region extending in the thickness direction of the substrate 20. A pair of U-shaped radiation antennas 12 are arranged so as to surround the loop circuit antenna 11 from the left and right.
Further, in the example shown in FIG. 1, a thin plate-shaped auxiliary antenna 13 is arranged below the loop circuit antenna 11 in the space surrounded by the radiation antenna 12.

[IC chip]
The IC chip 10 is made of a semiconductor chip such as a memory, and can record data of, for example, several hundred bits to several kilobits.
As the data recorded on the IC chip 10, for example, arbitrary data such as a product identification code, name, weight, content, manufacturer / seller name, manufacturing location, date of manufacture, expiration date, etc. can be recorded. Yes, and rewriting is also possible.

Here, as the communication frequency band used for the communication of the IC chip 10 (RF tag 1), in the present embodiment, the 900 MHz band belonging to the so-called UHF band is targeted.
The frequency band generally used in the RF tag includes, for example, several types of frequency bands such as a band of 135 kHz or less, a band of 13.56 MHz, a band of 860 M to 960 MHz belonging to the UHF band, and a band of 2.45 GHz. The communication distance at which wireless communication is possible differs depending on the frequency band used, and the optimum antenna length and wiring pattern also differ depending on the frequency band.

In the present embodiment, the RF tag 1 can be miniaturized, and the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13, which will be described later, can be formed into a predetermined three-dimensional size. Therefore, the wavelength is short and the antenna can be miniaturized. The UHF band that can be used is targeted, and specifically, the 900 MHz band is targeted so that good communication characteristics can be obtained in this 900 MHz band (see FIG. 8 described later).
However, by changing the size and shape of the RF tag 1, the loop circuit antenna 11, the radiation antenna 12, the auxiliary antenna 13, etc., the technical idea itself according to the present invention is a specific frequency band (UHF band including the 900 MHz band). Of course, it can be applied to frequency bands other than the above.

[Loop circuit antenna]
The loop circuit antenna 11 is an antenna composed of conductors formed in a loop shape (annular shape) arranged and connected in the vicinity of the IC chip 10.
By providing the loop circuit antenna 11, the impedance of the IC chip 10 is matched and communication can be performed by the magnetic field component.

[Radiation antenna]
The radiation antenna 12 is an antenna composed of conductors arranged and connected to both the left and right sides of the IC chip 10. By connecting the radiating antenna 12 directly or indirectly to the IC chip 10 via the loop circuit antenna 11, dipole antennas are configured on both the left and right sides of the IC chip 10, and wireless communication with the outside can be performed. It has become like.
Then, reading / writing (data recall / registration / deletion / update, etc.) is performed by wireless communication between the IC chip 10 and a reader / writer (not shown) via the radiation antenna 12 and the auxiliary antenna 13 described later, and the IC chip is used. The data recorded in 10 is recognized.
Further, the loop circuit antenna 11 and the radiating antenna 12 are not conducted or connected to each other, but are arranged close to each other so that impedance matching is achieved.

Here, the length (total length) of the portion of the radiation antenna 12 that functions as a dipole antenna extending on both the left and right sides of the IC chip 10 is one fraction of the wavelength of the radio frequency of the RF tag 1, for example, the wavelength of the radio frequency. It is preferably formed so as to have a length of about 1/2 (see the arrow in FIG. 3A).
In the present embodiment, the radiation antenna 12 can be set to an arbitrary shape, size, and length in the three-dimensional region formed by the substrate 20 in the plane direction and the thickness direction, and can be mounted and arranged. The total length of the antenna 12 in the longitudinal direction can be set to a length preferable for maintaining / improving the communication characteristics of the RF tag 1.

Therefore, by configuring the radiation antenna 12 as an antenna having a length of approximately ½ of the wavelength of the radio frequency of the RF tag 1, good communication characteristics can be obtained.
Specifically, for example, in the case of the communication frequency of the target RF tag 1 of 920 MHz, the wavelengths are λ≈326 mm and λ / 2≈163 mm. Therefore, it is preferable that the radiation antenna 12 is formed so that the total length in the longitudinal direction extending to both the left and right sides of the IC chip 10 is about 163 mm.
However, the total length of the radiating antenna 12 is not limited to half the length of the wavelength of the radio frequency of the RF tag 1, and the characteristics of the IC chip 10, the loop circuit antenna 11, the radiating antenna 12, and the auxiliary antenna 13. Needless to say, the optimum length can be selected and set according to the communication function and the like.

[Auxiliary antenna]
The auxiliary antenna 13 functions as an extra antenna for improving and adjusting the communication characteristics of the RF tag 1, and is mounted and mounted on the substrate 20 as shown in FIGS. 1 and 2, for example, a loop circuit. It is composed of a planar conductive member arranged in the vicinity of the antenna 11, and is arranged so as to be insulated from other antennas (loop circuit antenna 11 / radiation antenna 12) by a dielectric layer constituting the substrate 20. To.
That is, the auxiliary antenna 13 is entirely sealed with resin by the substrate 20, and is physically insulated from the loop circuit antenna 11 and the radiation antenna 12 (and the IC chip 10) made of the same conductive member. ing.

By arranging such an auxiliary antenna 13 in the vicinity of the loop circuit antenna 11, the auxiliary antenna 13 and the loop circuit antenna 11 (IC chip 10) are arranged so as to face each other via the substrate 20, so-called capacitors. The coupling makes an electromagnetic connection.
Specifically, as shown in FIG. 1, the auxiliary antenna 13 is arranged and fixed in the lower vicinity of the loop circuit antenna 11 so that the auxiliary antenna 13 can be attached to the loop circuit antenna 11 (IC chip 10). , In the three-dimensional region in the thickness direction (height direction) of the substrate 20, the substrate 20 is laminated and arranged at a predetermined position. Due to such a laminated arrangement configuration, the auxiliary antenna 13 and the loop circuit antenna 11 (IC chip 10) are arranged so as to face each other via the dielectric layer constituting the substrate 20 (see FIG. 2), so-called capacitors. It will be connected and coupled electromagnetically by coupling.

As a result, the auxiliary antenna 13 functions as a third antenna (extra antenna) of the IC chip 10.
That is, the auxiliary antenna 13 functions as an antenna for improving and adjusting the communication characteristics of the RF tag 1 together with the radiating antenna 12 connected to the IC chip 10 (or instead of the radiating antenna 12). The loop circuit antenna 11 (IC chip 10) is composed of a planar or plate-shaped conductive member laminated in the vicinity (lower side) of the loop circuit antenna 11 connected to the chip 10. The loop circuit antenna 11 (IC chip 10) is a substrate 20. It is arranged in an insulated state by the forming dielectric.

Then, such an auxiliary antenna 13 and the loop circuit antenna 11 (IC chip 10) are electromagnetically connected by so-called capacitor coupling.
As a result, the RF tag 1 is provided with the loop circuit antenna 11 and the radiating antenna 12 (or instead of the radiating antenna 12) conducting the IC chip 10 by stacking the auxiliary antennas 13 in the vertical direction (height direction). The auxiliary antenna 13 constitutes a three-dimensional antenna, and the auxiliary antenna 13 functions as a booster for communication radio waves, so that the communication characteristics of the RF tag 1 can be adjusted and improved.

Here, it is preferable that the auxiliary antenna 13 is also formed so that the length (total length) in the longitudinal direction is approximately ½ of the wavelength (half wavelength) of the radio frequency of the RF tag 1.
Similar to the radiation antenna 12 described above, the auxiliary antenna 13 can be configured to have an arbitrary shape, size, and length in the three-dimensional region in the plane direction and the thickness direction formed by the substrate 20, and the auxiliary antenna 13 can also be configured. The total length in the longitudinal direction of the RF tag 1 can also be set to a length preferable for maintaining / improving the communication characteristics of the RF tag 1.
Therefore, the auxiliary antenna 13 can also be configured to have a length of, for example, approximately ½ of the wavelength of the radio frequency of the RF tag 1, so that the RF tag 1 can obtain good communication characteristics. ..

In the radiation antenna 12 and the auxiliary antenna 13 as described above, the planar portion of the metal thin film spreading in two dimensions / three dimensions is formed on the metal thin film along the longitudinal direction from the vicinity of the IC chip 10 to both ends in the longitudinal direction. It can be formed in a hollow or punched shape in which there is no such thing, or the planar portion can be formed in a mesh shape, a grid shape, or the like.
Most of the current flowing through the radiating antenna 12 and the auxiliary antenna 13 when reading and writing data to and from the IC chip 10 flows through the peripheral portion of the planar antenna (skin effect). Therefore, if the radiation antenna 12 and the auxiliary antenna 13 have a predetermined size and shape, the planar portion can be formed into, for example, a punched shape or a mesh shape.
By forming the radiating antenna 12 and the auxiliary antenna 13 in a hollow or mesh shape in this way, the function as an antenna is not impaired by the skin effect, and the area of the conductor portion of the entire planar antenna can be reduced. , Conductor materials such as copper foil and conductive paste forming an antenna can be reduced, and the cost of the RF tag 1 can be further reduced.

Further, the radiation antenna 12 and the auxiliary antenna 13 are not limited to dipole antennas extending to both the left and right sides of the IC chip 10, and may be configured as, for example, a monopole antenna extending to only one of the left and right sides of the IC chip 10.
It is also possible to configure the antenna as an antenna consisting of only a loop circuit antenna 11 that does not have a dipole antenna or a monopole antenna.
By doing so, it becomes possible to further reduce the size and cost of the RF tag 1.

[Antenna formation method]
The loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 according to the present embodiment as described above have a conductive paste such as gold, silver, or copper or conductivity on the surface of the substrate 20 as a base material. It is formed in the plane direction by forming a metal thin film such as copper into a predetermined shape and size (length, area) by etching or plating. In addition, a circuit can be formed in the thickness direction by a through hole or a build-up method.
In the present embodiment, at least a part of the loop circuit antenna 11 among the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 is a substrate on which the IC chip 10 is mounted by such etching or plating. It is formed and arranged on a surface different from the mounting surface of 20 (see FIG. 1A).

Specifically, for example, as shown in FIG. 2, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 are three-dimensionally formed within the range of the three-dimensional region formed in the plane direction and the thickness direction of the substrate 20. It can be configured and arranged.
In the example shown in FIG. 2A, the loop circuit antenna 11 is arranged and conducted on the lower side of the IC chip 10 and is paired so as to surround the loop circuit antenna 11 from the left and right, as in the configuration shown in FIG. A U-shaped radiating antenna 12 is arranged so as to be conductive and connected to the IC chip 10.

Further, a thin plate-shaped auxiliary antenna 13 is arranged below the loop circuit antenna 11 in the space surrounded by the radiation antenna 12, is not in contact with the loop circuit antenna 11 (IC chip 10), and is electrically operated by capacitor coupling. It is designed to be connected.
With such a configuration, the radiation antenna 12 is configured to be folded into a plurality of different layers or surfaces of the substrate 20, and the auxiliary antenna 13 that does not conduct to the conductor portion connected to the IC chip 10 is connected to the loop circuit antenna 11. The impedance can be adjusted by arranging it close to the antenna.

In the example shown in FIG. 2B, the loop circuit antenna 11 is arranged under the IC chip 10 as in FIG. 2A described above, and a pair of loop circuit antennas 11 are surrounded from the left and right. A U-shaped radiating antenna 12 is arranged.
Then, in the example shown in FIG. 2 (b), unlike the case of FIG. 2 (a), the auxiliary antenna 13 is not provided, and the inverted L is taken from the tip of the pair of U-shaped radiating antennas 12, respectively. The radiation antenna 12 is bent and stretched in a character shape.
Here, even if the auxiliary antenna 13 is not provided, the effect of the auxiliary antenna can be integrated into the radiating antenna 12, and in FIG. 2A, the auxiliary antenna 13 is laminated in the vicinity of the loop circuit antenna 11. By arranging a part (tip portion) of the radiating antenna 12 in the vicinity of the loop circuit antenna 11, the same effect as that of the auxiliary antenna 13 can be obtained. ..

With such a configuration, the radiating antenna 12 can be configured to be folded into a plurality of different layers or surfaces of the substrate 20, and the loop circuit antenna 11 and a part of the radiating antenna 12 can be formed on the same plane of the substrate 20 or. They can be placed alongside each other on different upper and lower layers, which allows the impedance to be adjusted.
Further, the radiating antenna 12 can be made to function in the same manner as the auxiliary antenna.
A more specific arrangement configuration pattern of the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 as described above will be described later with reference to FIG. 3-7.

[substrate]
The substrate 20 serves as a base material layer on which the IC chip 10, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 constituting the RF tag 1 are mounted and fixed, and the mounted components are subjected to external force and environmental changes. It is a protective layer that protects the antenna.
In the present embodiment, the substrate 20 is formed by laminating a plurality of (two or more) dielectric layers of the same shape and size to form a single substrate 20 (RF tag 1).

Specifically, the substrate 20 is a predetermined tertiary so that the IC chip 10, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 constituting the RF tag 1 can be arranged and mounted in the same plane without protruding. It is formed into a planar or plate shape with an area and thickness (other height) that is one size larger than the maximum outer shape of the originally arranged IC chip 10, loop circuit antenna 11, radiation antenna 12, and auxiliary antenna 13. (See FIG. 1 (a)).
The size of the outer shape of the RF tag 1 is defined by the substrate 20.

Such a substrate 20 can be manufactured by a method for manufacturing a printed circuit board (multilayer board).
Specifically, an antenna pattern is formed in which the RF tag 1 is laminated from the lower layer side (bottom side) to the upper layer side (plane side), and a loop circuit antenna 11, a radiation antenna 12, and an auxiliary antenna 13 are formed on the surface of each layer. And through holes are sequentially formed by etching, plating, etc., and finally, the loop circuit antenna 11 and the radiation antenna 12 are arranged in a predetermined shape and a predetermined position in a three-dimensional region formed by a plurality of resin layers. -The auxiliary antenna 13 is formed, and finally the IC chip 10 is mounted and fixed on the uppermost surface (mounting surface) of the substrate 20 so as to be conducted and connected to the loop circuit antenna 11 and the radiation antenna 12.

In this way, the IC chip 10 is fixed to the mounting surface of the substrate 20, and the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 are sealed in a state of being sandwiched by the substrate 20 having a plurality of layers. It will be protected from the outside.
As described above, in the present embodiment, the substrate 20 composed of a plurality of layers is formed into a thick three-dimensional shape that covers the entire component of the mounted RF tag 1, whereby the IC chip 10 and the substrate 20 are formed by the substrate 20. By protecting each of the antennas 11, 12, and 13, the weather resistance, heat resistance, and waterproofness of the RF tag 1 can be enhanced.

Here, the substrate 20 according to the present embodiment as described above includes, for example, glass epoxy, paper phenol, paper epoxy, glass polyimide, Teflon (registered trademark), glass composite substrate, polycarbonate resin, acrylonitrile-ethylene, and the like. -Styrene copolymer (AES) resin, polypropylene resin, polyethylene resin, polystyrene resin, acrylic resin, polyester resin, polyferrenin sulfide resin, acrylonitrile-butadiene-styrene copolymer (ABS) resin, polyvinyl chloride resin, polyurethane resin It can be formed from a thermoplastic resin such as a fluororesin or a silicone resin, a resin material such as a thermoplastic elastomer, or a crosslinked polyolefin foam such as foamed polyethylene, acrylic foam, or foamed polypropylene.
Then, the substrate 20 can form one substrate 20 (RF tag 1) by laminating a plurality of plate-shaped members / strip-shaped members each formed of the above-mentioned dielectric material.

Further, the substrate 20 according to the present embodiment as described above is formed so as to have a predetermined relative permittivity for adjusting the communication characteristics of the RF tag 1 (IC chip 10), so that the substrate 20 is used as a base material. It can function as a dielectric constant adjusting layer for the RF tag 1 provided.
For example, the substrate 20 can be formed as a dielectric constant adjusting layer having a relative permittivity suitable for specifying communication of the RF tag 1 by being formed by a predetermined member with a predetermined thickness.

As described above, since the substrate 20 has a predetermined relative permittivity and thickness, the influence of the metal to which the RF tag 1 is attached can be reduced and absorbed by the substrate 20, and the RF tag 1 can be attached to a metal plate or the like. Even when the RF tag 1 is attached to the RF tag 1, a good communication distance as described later can be obtained as a communication characteristic of the RF tag 1 (see FIG. 8).
Therefore, the RF tag 1 according to the present embodiment is suitable as the substrate 20 in consideration of various conditions such as the type and communication characteristics of the RF tag 1 to be used, the article in which the RF tag 1 is used, the environment in which it is used, and the frequency band in which it is used. By selecting and exchanging only the substrate 20 by selecting the appropriate material and thickness, it is possible to use the RF tag 1 for different articles or to correspond to different communication frequencies.
Further, although it is common to apply or affix a resist for protecting / insulating the conductive pattern on the front surface or the back surface of the substrate, the RF tag may be formed by using this as one layer of the substrate.

[Arrangement pattern]
Next, refer to FIG. 3-7 for a specific example of the arrangement pattern of the IC chip 10, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna in the three-dimensional region formed by the substrate 20 of the RF tag 1 of the present embodiment. I will explain while doing it.

[Vertical loop]
FIG. 3 shows an example of a pattern in which the loop circuit antenna 11 is arranged vertically.
FIG. 3A shows a case where the substrate 20 has two upper and lower layers, and the loop circuit antenna 11 and the radiation antenna 12 are configured and arranged in the same manner as in the case shown in FIG. 2A.
In addition, in FIG. 3A, the auxiliary antenna 13 is not provided.
Specifically, as shown in (a)-(c), the loop circuit antenna 11 and the radiation antenna 12 first conduct and connect to the IC chip 10 on the mounting surface of the IC chip 10 on the upper surface of the substrate 20, respectively. It is arranged and mounted so as to be.

The loop circuit antenna 11 extends and is arranged vertically from the upper surface of the substrate 20 toward the thickness direction (vertical direction) of the first layer, penetrates the first layer, and is an annular loop on the upper surface of the second layer. Will be formed and fixed.
The radiation antenna 12 is stretched in a plane on both sides of the IC chip 10 on the upper surface of the substrate 20, and is bent and stretched vertically in the thickness direction (vertical direction) of the first layer in the vicinity of both ends in the longitudinal direction of the substrate 20. The loop circuit antenna 11 is formed so as to pass through the first layer and be bent toward the inside of the substrate 20 on the upper surface of the second layer so as to surround the loop circuit antenna 11 mounted on the second layer from the left and right in a non-contact manner. It is designed to be fixed.

FIG. 3B shows a case where the substrate 20 has three upper, middle, and lower layers, and the loop circuit antenna 11 and the radiation antenna 12 are configured and arranged in the same manner as in the case shown in FIG. 2B. be.
Specifically, as shown in (a)-(d), the loop circuit antenna 11 and the radiation antenna 12 are mounted on the IC chip 10 on the upper surface of the substrate 20 as in the case of FIG. 3 (A) described above. On the surface, they are arranged and mounted so as to be conductive and connected to the IC chip 10 respectively.
The loop circuit antenna 11 is stretched and arranged vertically from the upper surface of the substrate 20 toward the thickness direction (vertical direction) of the first layer and the second layer, also in the same manner as in the case of FIG. 3A. Then, an annular loop is formed and fixed on the upper surface of the third layer through the first layer and the second layer.

On the other hand, the radiation antenna 12 is extended in a planar manner on both sides of the IC chip 10 on the upper surface of the substrate 20 in substantially the same manner as in the case of FIG. 3A, and the first layer is formed in the vicinity of both ends in the longitudinal direction of the substrate 20. It is bent and stretched vertically in the thickness direction (vertical direction) of the stitches and the second layer, penetrates the first layer and the second layer, and is bent toward the inside of the substrate 20 on the upper surface of the third layer. , The loop circuit antenna 11 mounted on the third layer is formed and fixed so as to surround the loop circuit antenna 11 from the left and right in a non-contact manner.
Further, in the radiation antenna 12, in the vicinity of the central portion of the substrate 20 of the third layer, a part (half) of each of the pair of opposite tips is perpendicular to the thickness direction (vertical direction) of the second layer. The loop circuit antenna 11 is bent and stretched toward the outside of the substrate 20 on the upper surface of the second layer (bottom surface of the first layer), and penetrates and stretches through the second layer. It is designed to be formed and fixed up to the contact position.

As described above, the loop circuit antenna 11 and the radiation antenna 12 (and the auxiliary antenna 13) have an arbitrary shape within the range of the three-dimensional region formed in the plane direction and the thickness direction of the substrate 20 composed of any plurality of layers. -It can be formed and stretched to a size, direction, and length, and can be formed as a desired antenna pattern.
As a result, the radiating antenna 12 can be placed close to the loop circuit antenna 11 in a non-contact manner to achieve impedance matching, and the loop circuit antenna 11 and the radiating antenna 12 can be maximized and designed to reduce the size of the RF tag. It will be possible.

[Three-dimensional loop]
FIG. 4 shows an example of a pattern in which the loop circuit antenna 11 is three-dimensionally configured and arranged.
As described above, when the loop circuit antenna 11 shown in FIG. 3 is vertically arranged, if the thickness of the substrate 20 is thin, the loop becomes small, and sufficient impedance adjustment and communication characteristics may not be obtained. ..
Therefore, as shown in FIG. 4, the three-dimensional region formed by the substrate 20 is used more widely, and the loop circuit antenna 11 is made into a three-dimensional shape, and the loop area is increased and the antenna length is adjusted to be long. be able to.
As a result, better communication characteristics can be obtained, and the substrate 20 (RF tag 1) can be made as thin and small as possible.

Specifically, in the example shown in FIGS. 4A to 4E, the loop circuit antenna 11 is vertically extended and arranged from the upper surface of the substrate 20 in the thickness direction (vertical direction) to form the first layer. Is bent and stretched at a substantially right angle in the plane direction (horizontal direction) of the substrate 20 on the upper surface of the second layer, and an annular loop is formed and fixed on the inner side of the upper surface of the second layer surface. (See FIG. 4 (e)).
With such a configuration, the loop circuit antenna 11 can have a three-dimensional configuration in which the three-dimensional region formed by the substrate 20 extends in both the vertical direction and the horizontal direction, the loop area is larger, and the antenna length is longer. Can be lengthened.

The three-dimensional configuration of the loop circuit antenna 11 is not limited to the above case, and may be configured as shown in FIG. 4 (f), for example.
In the example of FIG. 4 (f), in the case of FIG. 4 (e), the loop fixed at the back side of the upper surface of the second layer of the substrate 20 is further bent and stretched toward the first layer to form the first layer. An annular loop is formed and fixed on the upper surface of the.
By doing so, it is possible to further increase the loop area of the loop circuit antenna 11 and further increase the antenna length.
As described above, the three-dimensional configuration of the loop circuit antenna 11 has an arbitrary shape, size, direction, and within the range of the three-dimensional region formed in the plane direction and the thickness direction of the substrate 20 composed of any plurality of layers. It can be formed and stretched to a length and formed as a desired antenna pattern.

[Antenna configuration / stacking]
FIG. 5 shows an example of a pattern in which each antenna is arranged on a substrate 20 composed of a plurality of layers.
FIG. 5A shows a conventional RF tag in which an IC chip 10, a loop circuit antenna 11, and a radiation antenna 12 are arranged two-dimensionally on the upper surface of a substrate 20 as a configuration other than the present invention.
FIG. 5B shows a case where the substrate 20 is composed of two dielectric layers or the like as the RF tag 1 according to the present embodiment.
FIG. 5C shows a case where the substrate 20 of the RF tag 1 according to the present embodiment is similarly composed of three layers.

In FIGS. 5 (B) to 5 (C), the arrangement patterns of the IC chip 10, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 are the same as those shown in FIGS. 4 and 5 described above. ..
As described above, in the RF tag 1 according to the present embodiment, the substrate 20 can be configured by any plurality of layers, and the number and shape of the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 mounted on the substrate 20. -The number of layers constituting the substrate 20 can be appropriately selected and set according to the size, structure, and the like.

[Antenna configuration / folding]
FIG. 6 shows an example of a pattern in which the radiation antenna 12 and the auxiliary antenna 13 are folded back and arranged with respect to the substrate 20.
As described above, in the RF tag 1 according to the present embodiment, the substrate 20 is composed of an arbitrary plurality of layers, and the antenna pattern is folded back for each layer to obtain the area of the radiation antenna 12 and the auxiliary antenna 13 and the antenna. The length can be set and changed.
Specifically, it is possible to adopt a folding pattern as shown in FIGS. 6A-B.

FIG. 6A shows a case where only the radiation antenna 12 is folded back.
FIG. 2A shows the radiation antenna 12 extending on both sides of the IC chip 10, and when only one side of the radiation antenna 12 is folded back in a U shape on the back surface side of the one-layer substrate 20, FIG. This is a case where both sides of the above are folded back in a U shape facing each other.
Further, FIG. 3C shows a case where only one side of the radiation antenna 12 is folded back in an S shape on the two-layer substrate 20.
Further, FIG. 3D shows a case where both sides of the radiation antenna 12 are extended toward the center side of each of the two layers of the substrate 20.

FIG. 6B shows a case where only the auxiliary antenna 13 is folded back.
FIG. 3A shows a case where only one side of the auxiliary antenna 13 arranged on the lower layer side of the two-layer substrate 20 is folded back in a U shape on the back surface side of the second layer substrate 20.
Further, FIG. 3B shows a case where both sides of the auxiliary antenna 13 are folded back in a U-shape facing each other on the lower layer side of the two-layer substrate 20.

FIG. 6C shows a case where both the radiation antenna and the auxiliary antenna are folded back.
In the figure (a), only one side of the radiation antenna 12 is folded back in a U shape on the back surface side (upper surface side of the second layer) of the first layer of the two-layer substrate 20, and the auxiliary antenna 13 is formed on the second layer surface. This is a case where the antenna is folded back in a U shape from the upper surface side (the back surface side of the one-layer surface) to the back surface side. In this case, the radiation antenna 12 and the auxiliary antenna 13 are prevented from directly contacting or conducting on the back surface side of the first layer (upper surface side of the second layer) of the substrate 20.
In the figure (b), only one side of the radiation antenna 12 is folded back in a U shape on the back surface side (upper surface side of the second layer) of the first layer of the two-layer substrate 20, and the auxiliary antenna 13 is formed on the first layer surface. This is a case where the second layer is folded back in a U shape from the upper surface side to the back surface side of the second layer. Also in this case, the radiating antenna 12 and the auxiliary antenna 13 are prevented from directly contacting / conducting in the first layer of the substrate 20.

It is needless to say that the folding pattern of the radiation antenna 12 and the auxiliary antenna 13 is not limited to the above case, and various folding patterns can be adopted according to any antenna pattern.
As described above, in the RF tag 1 according to the present embodiment, the radiation antenna 12 and the auxiliary antenna 13 are folded back in an arbitrary folding pattern on the substrate 20 having one layer or two or more layers, and stretched / mounted. This makes it possible to select and set the optimum antenna pattern for maintaining / improving the communication characteristics of the RF tag 1 to be applied and for reducing the size / thickness.

[Protection of IC chip]
Next, a method for strengthening the protection of the IC chip 10 in the RF tag 1 according to the present embodiment as described above will be described.
As described above, the IC chip 10 of the RF tag 1 is mounted and mounted on the mounting surface (upper surface) of the substrate 20 as a base material, and although it is fixed by the substrate 20, it is fixed on the surface of the substrate 20. Since it is exposed (protruding), it is susceptible to external impacts.
Further, since the IC chip 10 is a precision component, there is a high possibility that damage or failure will occur even with a slight impact, and it can be said that it is the most vulnerable part to external force among the components of the RF tag 1.
Therefore, in the present embodiment, the IC chip 10 can be more effectively protected by providing a further protection structure for the IC chip 10 arranged on the mounting surface of the substrate 20.

FIG. 7 shows a specific example of the configuration / structure for protecting the IC chip 10 mounted on the substrate 20.
First, as shown in FIG. 7A, the mounting surface of the IC chip 10 of the substrate 20 can be coated with a coating material 31 such as a resin material or an adhesive. By doing so, at least the mounting surface of the IC chip 10 of the substrate 20 can be protected, and the coating material can be saved.
Further, as shown in FIG. 7B, the entire substrate 20 including the mounting surface of the IC chip 10 can be coated (molded) with a resin material or the like 32. By doing so, not only the IC chip 10 but also the entire substrate 20 can be covered with a resin material or the like, and the entire RF tag 1 can be protected more firmly.

Further, as shown in FIG. 7C, only the portion of the IC chip 10 of the mounting surface of the substrate 20 can be coated (potted) with a resin material, an adhesive or the like. By doing so, by coating only the IC chip 10, the IC chip 10 can be efficiently protected by the minimum necessary coating material 33.
Further, as shown in FIG. 7D, the entire substrate 20 can be housed (casing) in the housing 34 to protect it. By doing so, for example, by storing and sealing the RF tag 1 in a resin or metal housing, the RF tag 1 can be more easily, reliably and firmly protected from external force and environmental changes. ..

Further, as shown in FIG. 7 (E), a recess (groove / hole) 35 capable of accommodating the IC chip 10 is formed on the mounting surface of the substrate 20, and the IC chip 10 is arranged in the recess. It can also be sealed and embedded with a resin material or the like. By doing so, the IC chip 10 itself is embedded inside the mounting surface of the substrate 20 to more reliably protect it from external forces and the like, and the amount of coating material used can be suppressed to the minimum necessary amount. ..
The example shown in FIG. 7 as described above is an example of the protection structure of the IC chip 10, and other configurations as long as the IC chip 10 can be protected from external impacts, environmental changes, and the like.・ Of course, the structure can be adopted.
In this way, even if an external force, impact, etc. is applied to the RF tag 1 from the outside, it is possible to avoid applying an external force directly to at least the IC chip 10 due to the coating material, the casing, or the like, resulting in damage or the like. The IC chip 10, which is an easy-to-use precision component, can be effectively protected.

[Communication characteristics]
Next, the communication characteristics of the RF tag 1 according to the present embodiment having the above configuration will be described with reference to FIG.
FIG. 8 is a line graph showing the relationship between the frequency and the communication distance (communication distance) showing the communication characteristics of the RF tag 1 according to the present embodiment.
A known evaluation method / evaluation system can be used for the evaluation of the communication characteristics of the RF tag 1, and the evaluation of the present embodiment shown below is carried out using the Tagformance system of Voyantic Co., Ltd. as the evaluation system.
In addition, the evaluation was performed not by directly measuring the communication distance, but by a value converted from the radio field strength when placed at a certain distance.
Further, the measurement was performed by arranging the entire surface conductor layer 50 on the lower layer side opposite to the mounting surface of the IC chip 10 of the RF tag 1. The entire surface conductor layer 50 is made of a stainless steel plate (150 * 100 * t2 mm), assuming a metal plate or the like to be attached to the RF tag 1.

The graph shown in FIG. 8 shows a conventional RF tag in which an IC chip 10, a loop circuit antenna 11, and a radiation antenna 12 are arranged and mounted two-dimensionally on the upper surface of a substrate 20, an RF tag 1 according to the present embodiment, and an RF tag 1. Is the case of contrasting.
In the figure, the light solid line is the case of the conventional RF tag, and the dark solid line is the case of the RF tag 1 according to the present embodiment.

As shown in this graph, first, it can be seen that the conventional RF tag has a long communication distance in the high frequency band, particularly in the 860 to 940 MHz band.
In particular, in the 860 to 900 MHz band, a communication distance of 6 m or more is obtained, and in the 880 MHz band, a peak (about 8 m) of the communication distance is obtained.
On the other hand, in the RF tag 1 according to the present embodiment, the communication distance is slightly shorter than that of the conventional RF tag in the frequency band over 900 MHz, but in the frequency band of 800 to 880 MHz, the conventional RF tag is always used. It can be seen that a longer communication distance is obtained.
In particular, in the 850 to 880 MHz band, a communication distance of 8 m or more is obtained, and in the 860 MHz band, a peak (about 11 m) of the communication distance is obtained.

From the results of FIG. 8 above, in the RF tag 1 according to the present embodiment, the communication characteristics are not impaired even when the RF tag 1 is mounted and mounted on the entire surface conductor layer 50 such as a metal plate, and the conventional RF tag 1 is used in a specific frequency band. It can be seen that a communication distance of about 1 to 4 m longer can be obtained as compared with the RF tag in which the antenna pattern is arranged in two dimensions.
Therefore, as shown in FIG. 3-7, various frequency bands can be supported by adjusting / changing the arrangement pattern of the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 in the three-dimensional region of the substrate 20. You will be able to make settings and adjustments to obtain a sufficient communication distance.

As described above, according to the RF tag 1 of the present embodiment, each component of the IC chip 10, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 constituting the RF tag for wireless communication is respectively. , The substrate 20 can be mounted and arranged in a three-dimensional region extending in the plane direction (horizontal direction) and the thickness direction (vertical direction) intersecting the plane direction (horizontal direction).
As a result, the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 are isolated and sealed from the outside by the substrate 20, and the physical force such as impact, pressure, and temperature change applied to the RF tag 1 from the outside is resisted. It is possible to improve durability, impact resistance, pressure resistance, heat resistance, and the like, and prevent the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 from being damaged or damaged due to external force, impact, or environmental changes.

Further, by arranging the loop circuit antenna 11, the radiation antenna 12, and the auxiliary antenna 13 three-dimensionally in the three-dimensional region extending in the plane direction and the thickness direction of the substrate 20, the degree of freedom in design such as the arrangement and design of the antenna is achieved. The antenna pattern can be maximized, the RF tag 1 can be made smaller and thinner, and the antenna can be set / changed according to the communication characteristics.
Further, the auxiliary antenna 13 to be the third antenna can be configured into an optimum shape and size together with the loop circuit antenna 11 and the radiation antenna 12 and arranged at an appropriate position, and the auxiliary antenna 13 can be arranged at an appropriate position. By effectively functioning as the antenna of the tag 1, the communication characteristics of the RF tag 1 can be maintained and improved.

In this way, according to the present invention, the RF tag is used in an environment where physical force, impact, temperature change, etc. are often applied from the outside while ensuring the miniaturization of the RF tag and the degree of freedom in design. It is possible to realize an RF tag having excellent both environmental resistance and communication characteristics, which can be suitably used as a tag.

Although the RF tag of the present invention has been described above by showing a preferred embodiment, the RF tag according to the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention. It goes without saying that it is possible.

For example, in the above-described embodiment, for example, a metal container or a metal housing is assumed as an article / object to be used by attaching the RF tag according to the present invention, but the RF tag of the present invention can be used. Articles and objects are not limited to metal containers and metal housings.
That is, the RF tag according to the present invention is applied to any article or object as long as the RF tag is used and predetermined information / data is read / written via a reader / writer. can do. For example, other than metal containers and metal housings, metal heaters, electric appliances, tableware, cooking utensils, furniture, furniture, containers, automobiles, and any other metal items / objects, as well as resin items. It can also be suitably used for such as.

The present invention is an RF tag having a structure for protecting an inlay to enhance durability, impact resistance, etc., which is used by being attached to an arbitrary article or object such as a pallet or a container for cargo. It can be suitably used.

1 RF tag 10 IC chip 11 Loop circuit antenna 12 Radiation antenna 13 Auxiliary antenna 20 Board

Claims (9)

It is equipped with an IC chip, a loop circuit antenna, a radiation antenna, and a dielectric substrate.
The IC chip, the loop circuit antenna, and the radiation antenna are mounted on the substrate and are mounted on the substrate.
An RF tag characterized in that at least a part of the loop circuit antenna is arranged on a surface different from the mounting surface of the substrate on which the IC chip is mounted. The RF tag according to claim 1, further comprising an auxiliary antenna that does not conduct with the radiating antenna. The RF tag according to claim 2, wherein the radiating antenna and the auxiliary antenna are arranged on the same plane of the substrate or on a plurality of different laminated surfaces so as to be electromagnetically coupled in a non-conducting manner. The RF tag according to any one of claims 1 to 3, wherein the substrate includes a plurality of layers. The RF tag according to any one of claims 1 to 4, wherein the long side of the radiation antenna has a length of a half wavelength of the communication frequency of the IC chip. The RF tag according to any one of claims 1 to 5, further comprising a resin sealing portion for sealing the IC chip. The RF tag according to any one of claims 1 to 6, further comprising a coating layer or a molding layer that covers the mounting surface of the IC chip of the substrate or the entire surface including the mounting surface. The RF tag according to any one of claims 1 to 7, wherein the entire surface conductor layer is provided on the lower layer side of the mounting surface of the IC chip of the substrate. The RF tag according to any one of claims 1 to 8, further comprising a case capable of accommodating the entire substrate on which the radiation antenna, the loop circuit antenna, and the IC chip are mounted.

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