JP2022011433A - Wiring board, and manufacturing method and designing method for wiring board - Google Patents

Abstract

To provide a wiring board including a wire intersecting with another wire on one surface of a substrate, in which the thickness of the intersecting wires is substantially uniform, and a manufacturing method and a designing method for the wiring board.SOLUTION: A wiring board includes a substrate including a first surface and a second surface on the opposite side of the first surface, a first wire provided to the first surface of the substrate and including a first part extending in a first direction on the first surface, a second wire provided to the first surface of the substrate and including a second part extending in a second direction intersecting with the first direction on the first surface, and an insulating part covering at least the first part of the first wire. The second part of the second wire is a printed wire formed by printing on the insulating part.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a wiring board, a method for manufacturing a wiring board, and a method for designing a wiring board.

In recent years, along with the sophistication and miniaturization of electronic devices, the miniaturization of wiring boards for mounting various elements used in electronic devices and the like has been progressing. As a result, the density of wiring on the wiring board is increasing, the wiring is miniaturized, and the like, and it is becoming difficult to form all the wiring on one surface of the substrate. Under such circumstances, by arranging a plurality of wirings in a crossed manner, it is possible to cope with high density wiring, miniaturization of wirings, and the like, and to form a larger number of wirings on one surface of the substrate.

As a method of arranging a plurality of wirings in a crossed manner, for example, the wiring layers and the insulating layers are alternately laminated, and the insulating layer is laminated via vias (interlayer connectors) provided in the thickness direction of the insulating layer. A multi-layer wiring board that electrically connects the wiring layers provided above and below is known (see Patent Document 1). Further, in a thin film transistor (TFT) substrate used for an organic electroluminescence display device or the like, a method of forming a power supply line intersecting with a scanning line or a signal line formed on one surface of the substrate via an insulating layer is known. (See Patent Document 2).

Japanese Unexamined Patent Publication No. 2014-179518 Japanese Unexamined Patent Publication No. 2006-186154

By using the multilayer wiring board described in Patent Document 1, it is possible to cope with the miniaturization of the wiring board and the accompanying increase in the density and miniaturization of the wiring. However, in order to manufacture the multilayer wiring board, a via is formed in which the wiring layer and the insulating layer are laminated in order and the wiring layers provided above and below the insulating layer in the stacking direction are electrically connected to each other. It must be formed on the insulating layer. Therefore, there is a problem that the number of steps required for manufacturing the multilayer wiring board increases, and it takes a lot of time and cost to manufacture the multilayer wiring board.

The TFT substrate described in Patent Document 2 is manufactured by, for example, the following process. First, a scanning line (or signal line) and a power supply line pattern sandwiching the scanning line (or signal line) from both sides are formed on the substrate. Next, an insulating layer is formed on the scanning line (or signal line) sandwiched between the power supply line patterns. Then, a plated metal that electrically connects the power supply line pattern by electroless plating is formed on the insulating layer. This forms a scanning line (or signal line) and a power line intersecting it. The plated metal that electrically connects the power line patterns grows together from the two power line patterns that sandwich the scan line (or signal line) and joins each other on the insulating layer that covers the scan line (or signal line). It is formed. Therefore, there is a problem that the film thickness of the plated metal that electrically connects the two power line patterns becomes non-uniform.

Further, since a plurality of scanning lines (or signal lines) and a plurality of power supply lines intersecting the scanning lines are formed on the TFT substrate, a plated metal that electrically connects the power supply line patterns at a plurality of locations in the plane of the TFT substrate. Is formed. However, it is extremely difficult to uniformly control the growth rate of plating in the plane of the TFT substrate so that the film thicknesses of all the plated metals at the plurality of locations are substantially the same. In particular, when the length (intersection distance) of the plated metal intersecting the scanning line (or signal line) in the plane of the TFT substrate varies in the in-plane direction, the film of the plated metal in the plane of the TFT substrate is formed. There is a problem that the thickness varies.

In view of the above problems, the present disclosure discloses a wiring board having wirings intersecting one wiring on one surface of the substrate and having a substantially uniform film thickness of the intersecting wirings, and manufacturing of the wiring board. One purpose is to provide a method and a design method.

In order to solve the above-mentioned problems, as one embodiment of the present disclosure, a substrate having a first surface and a second surface located on the opposite side of the first surface, and a substrate provided on the first surface of the substrate are provided. A first wiring including a first portion extending in the first direction on the first surface, and a second wiring provided on the first surface of the substrate and extending in a second direction intersecting the first direction on the first surface. A wiring including a second wiring including two portions and an insulating portion covering at least the first portion, and the second portion of the second wiring is a printed wiring formed on the insulating portion by printing. A substrate is provided.

Further, as an embodiment of the present disclosure, a substrate having a first surface and a second surface located on the opposite side of the first surface, and a first surface provided on the first surface of the substrate and on the first surface. A first wiring including a plurality of first portions extending in one direction, and a second portion provided on the first surface of the substrate and extending in a second direction intersecting the first direction on the first surface. A second wiring and an insulating portion that integrally covers at least the plurality of first portions are provided, and the plurality of first portions are arranged in parallel along a direction orthogonal to the first direction, and the second portion is described. The second portion of the wiring is provided with a wiring board provided on the insulating portion.

The first wiring includes a plurality of the first portions arranged in parallel along a direction orthogonal to the first direction, and the insulating portion may integrally cover the plurality of first portions and is adjacent to each other. The distance between the first portions may be in the range of 40 μm to 10000 μm.

In a cross-sectional view along the second direction, the thickness of the central portion of the insulating portion in the second direction may be thicker than the thickness of both ends in the second direction, and the thickness of the insulating portion is It suffices to gradually increase the thickness from both ends of the insulating portion toward the central portion, and in a cross-sectional view along the second direction with the first surface positioned upward, the insulating portion is used. The portion may be curved upwardly, and the second wiring includes a plurality of the second portions arranged in parallel along a direction orthogonal to the second direction, and the second portion adjacent to the second portion. The interval may be in the range of 60 μm to 10000 μm.

The second wiring may include a plurality of the second portions, and the plurality of second portions may be formed on the insulating portion of the one, and the second portion in the second direction may be formed. The length of the two portions may be longer than the length of the insulating portion in the second direction, and the length of the second portion in the direction orthogonal to the second direction is orthogonal to the second direction. It may be shorter than the length of the insulating portion in the above.

As one embodiment of the present disclosure, a substrate having a first surface and a second surface located on the opposite side of the first surface, and first wiring and second wiring provided on the first surface of the substrate. The first wiring includes a first portion extending in a first direction on the first surface, and the second wiring is the first portion on the first surface. The method for manufacturing the wiring board includes the first wiring and the first portion of the first wiring on the first surface of the board, including a second portion extending in a second direction intersecting the directions. A step of forming at least a set of second wiring patterns sandwiched from both sides along a second direction, a step of forming an insulating portion covering at least the first portion, and the second wiring pattern on the insulating portion. The cross wiring includes a step of forming the cross wiring as the second part for electrically connecting the two to each other, and the cross wiring is a wiring substrate formed by printing with a conductive paste or a conductive ink on the insulating portion. Manufacturing method is provided.

As one embodiment of the present disclosure, a substrate having a first surface and a second surface located on the opposite side of the first surface, and first wiring and second wiring provided on the first surface of the substrate. The first wiring includes a plurality of first portions extending in a first direction on the first surface, and the second wiring is the same on the first surface. The method for manufacturing the wiring board includes a second portion extending in a second direction intersecting the first direction, and the method of manufacturing the wiring board is a direction in which the plurality of first portions are orthogonal to the first direction on the first surface of the board. At least in the step of forming the first wiring so as to be parallel to each other and sandwiching the plurality of first portions of the first wiring on the first surface of the substrate from both sides along the second direction. The step of forming a set of second wiring patterns, the step of forming an insulating portion that integrally covers at least the first portion, and the first step of electrically connecting the second wiring patterns to each other on the insulating portion. A method for manufacturing a wiring board including a step of forming cross wiring as two parts is provided.

The first wiring may be formed so that the plurality of the first portions are parallel to each other along a direction orthogonal to the first direction, and the insulating portion that integrally covers the plurality of first portions may be formed. The first wiring may be formed so that the distance between the adjacent first portions is within the range of 40 μm to 10,000 μm.

The insulating portion may be formed so that the thickness of the central portion of the insulating portion in the second direction is thicker than the thickness of both ends when the cross section along the second direction is viewed. The insulating portion may be formed so that the thickness of the insulating portion gradually increases from both ends of the insulating portion toward the central portion, and the insulating portions may be formed in parallel along a direction orthogonal to the second direction. A plurality of sets of the second wiring patterns may be formed so that the distance between the adjacent second wiring patterns is within the range of 60 μm to 10000 m.

A plurality of the cross wirings that electrically connect each of the plurality of sets of the second wiring patterns may be formed on one of the insulating portions, and the length of the cross wirings in the second direction is the first. The cross wiring may be formed so as to be longer than the length of the insulating portion in two directions, and the length of the cross wiring in the line width direction of the cross wiring may be longer than the length of the insulation portion in the line width direction of the cross wiring. The cross wiring may be formed so as to be shorter than the length of the portion.

As one embodiment of the present disclosure, there is a method of designing a wiring board manufactured by the above manufacturing method, wherein the step of determining the contact length L between the second wiring pattern and the cross wiring, and the cross wiring. Width _WM , width _WI of the insulating portion, length LM from the side surface of the first portion to the end of the cross wiring, and length _L from the side surface of the first portion to the end of the insulating portion. Including the step of calculating _I , based on the formation probability α _I of the insulating portion, the formation probability α _M of the cross wiring, and the contact length L between the second wiring pattern and the cross wiring, the following equation is used. From the width _WM of the cross wiring, the width _WI of the insulation portion, the length _LM from the side surface of the first portion to the end portion of the cross wiring, and the side surface of the first portion so as to satisfy the relationship shown. _A method for designing a wiring board for calculating the length LI to the end of the insulating portion is provided.
_WM ≧ W ₂ + 2α _M ... (1)
_{WI ≧ WM +2 (α M + α I ) ・ ・}・ (2)
L _I ≧ D + α _I・ ・ ・ (3)
LM ≧ _{LI + L + α M + α I ・ ・}・ (4)
In the above equation (1), W ₂ represents "the design value of the line width of the second wiring pattern".

According to the present disclosure, a wiring board having wiring intersecting one wiring on one surface of the substrate and having a substantially uniform film thickness of the intersecting wiring, and a method for manufacturing and designing the wiring board. Can be provided.

FIG. 1 is a perspective view showing a schematic configuration of a main part of a wiring board according to an embodiment of the present disclosure. FIG. 2 is a plan view showing a schematic configuration of a main part of a wiring board according to an embodiment of the present disclosure. FIG. 3 is a cut end view taken along line AA in FIG. 2, showing a schematic configuration of a main part of a wiring board according to an embodiment of the present disclosure. FIG. 4 is a plan view showing a schematic configuration of another aspect of the main part of the wiring board according to the embodiment of the present disclosure. FIG. 5 is a plan view showing a schematic configuration of another aspect of the main part of the wiring board according to the embodiment of the present disclosure. FIG. 6 is a partially enlarged cut end view showing a schematic configuration of a main part of a wiring board according to an embodiment of the present disclosure. FIG. 7 is a plan view showing a schematic configuration of another aspect of the main part of the wiring board according to the embodiment of the present disclosure. FIG. 8 is a plan view showing a schematic configuration of another aspect of the main part of the wiring board according to the embodiment of the present disclosure. FIG. 9 is a plan view showing a schematic configuration of another aspect of the main part of the wiring board according to the embodiment of the present disclosure. FIG. 10 is a plan view showing a schematic configuration of another aspect of the main part of the wiring board according to the embodiment of the present disclosure. FIG. 11A is a plan view for explaining one step of the method for manufacturing a wiring board according to an embodiment of the present disclosure. FIG. 11B is a plan view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 11A. FIG. 11C is a plan view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 11B. FIG. 11D is a plan view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 11C. FIG. 11E is a plan view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 11D. FIG. 12A is a cut end view for explaining one step of the method for manufacturing a wiring board according to an embodiment of the present disclosure. FIG. 12B is a cut end view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 12A. FIG. 12C is a cut end view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 12B. FIG. 12D is a cut end view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 12C. FIG. 12E is a cut end view for explaining a step of the wiring board manufacturing method according to the embodiment of the present disclosure, which follows the step of FIG. 12D. FIG. 13 is a plan view for explaining a method of designing a wiring board according to an embodiment of the present disclosure. FIG. 14 is a plan view showing a schematic configuration of another aspect of the main part of the wiring board according to the embodiment of the present disclosure.

Embodiments of the present disclosure will be described with reference to the drawings.
In the drawings, in order to facilitate understanding, the shape, scale, aspect ratio, etc. of each part may be changed or exaggerated from the actual product. The numerical range represented by using "-" in the present specification and the like means a range including each of the numerical values described before and after "-" as a lower limit value and an upper limit value. In the present specification and the like, terms such as "film", "sheet", and "board" are not distinguished from each other based on the difference in designation. For example, "board" is a concept that also includes members that may be commonly referred to as "sheets" or "films".

FIG. 1 is a perspective view showing a schematic configuration of a main part of a wiring board according to the present embodiment, and FIG. 2 is a plan view showing a schematic configuration of a main part of the wiring board according to the present embodiment. Is a cut end view of the line AA in FIG.

The wiring board 1 according to the present embodiment includes a substrate 2 having a first surface 21 and a second surface 22 located on the opposite side of the first surface 21, and a first wiring provided on the first surface 21 of the substrate 2. It has 3 and a second wiring 4. The wiring board 1 according to the present embodiment is equipped with one or a plurality of electronic components according to the type of electronic device in which the wiring board 1 is used. In the wiring board 1 according to the present embodiment, the first wiring 3 and the second wiring 4 are wirings including a portion where an insulating portion 5 is interposed between them and intersects with each other. Hereinafter, the intersecting portion in the first wiring 3 may be referred to as a “first portion”, and the intersecting portion in the second wiring 4 may be referred to as a “second portion”. In the wiring board 1 according to the present embodiment, wiring that does not intersect with other wiring may be provided on the first surface 21 of the board 2.

The substrate 2 may be any one generally used as a wiring board, for example, a polyester-based resin substrate such as a polyethylene terephthalate (PET) substrate, a polyimide-based resin substrate such as a polyimide substrate, and an acrylic-based substrate such as a polymethylmethacrylate substrate. It may be a flexible substrate such as a resin substrate, a polycarbonate resin substrate, a polyimide resin substrate such as a cycloolefin polymer substrate, a silicon substrate, a glass substrate, a glass composite substrate, a glass epoxy substrate, or a Teflon (registered trademark) substrate. It may be a rigid substrate such as an alumina substrate or a ceramics substrate. Further, the substrate 2 is a rigid flexible substrate having a flexible portion made of a flexible material (for example, the resin material such as polyimide) constituting the flexible substrate and a rigid portion made of a rigid material constituting the rigid substrate. There may be.

The shape of the substrate 2 is not particularly limited, and may be, for example, a substantially rectangular shape in a plan view. The size and thickness of the substrate 2 are not particularly limited, and may be, for example, any size and thickness required for an electronic device in which the wiring board 1 is used.

The first wiring 3 is provided on the first surface 21 of the substrate 2. The first wiring 3 may include at least a first portion extending in the first direction D1, and may include a portion extending in a direction different from the first direction D1. The first wiring 3 may include, for example, a portion extending in the second direction D2 and / or a portion extending in a direction different from both the first direction D1 and the second direction D2. In the present embodiment, a plurality (five) first portions extend in the first direction D1 on the first surface 21 of the substrate 2 (see FIGS. 1 and 2), but are limited to this embodiment. is not it. At least one first portion may extend in the first direction D1 on the first surface 21 of the substrate 2. In the embodiment shown in FIGS. 1 and 2, the plurality of first portions may be included in one first wiring 3 or may be included in each of the plurality of first wirings 3. You may.

The width W ₃ of the first portion of the first wiring 3 is not particularly limited, but may be, for example, in the range of 20 μm to 5000 μm, and preferably in the range of 100 μm to 3000 μm. Further, when a plurality of first wirings 3 are provided, the pitch P3 of the first portion of the first wiring ₃ (the interval between the first portions of the adjacent first wirings 3) is not particularly limited. However, for example, it may be in the range of 40 μm to 10000 μm, and preferably in the range of 200 μm to 6000 μm. Since the width W ₃ and the pitch P ₃ of the first portion of the first wiring 3 are within the above ranges, the cross wiring that intersects the first portion while coping with the miniaturization of the wiring board and the increase in the density of the wiring. By 42, all the first wiring 3 and the second wiring 4 can be provided on the first surface 21 of the substrate 2. The pitch P ₃ of the first portion of the first wiring 3 does not have to be uniform in the plane of the first surface 21 of the substrate 2. Further, the width of the first wiring 3 and the width W ₃ of the first portion of the first wiring 3 may not be uniform or constant in the plane of the first surface 21 of the substrate 2. For example, the first wiring ₃ of one may include portions having different widths, and the first portion of one may include portions having different widths W3. When a plurality of first wirings 3 are provided, the width of one first wiring 3 and the width of the other first wiring 3 may be different from each other, and the width W ₃ of the first portion of one may be different from each other. The width W ₃ of the other first portion may be different from each other.

The second wiring 4 is provided on the first surface 21 of the substrate 2. The second wiring 4 may include at least a second portion extending in the second direction D2, may include a portion extending in a direction different from the second direction D2, or extends only in the second direction D2. May be good. The first direction D1 and the second direction D2 are directions that intersect each other. The crossing angle thereof is not particularly limited, and for example, in the embodiment shown in FIG. 1, the crossing angle of the first direction D1 and the second direction D2 is 90 °. That is, the first wiring 3 and the second wiring 4 include a first portion and a second portion that intersect each other at right angles on the first surface 21 of the substrate 2.

In the embodiment shown in FIGS. 1 and 2, the second wiring 4 is provided on the first surface 21 of the substrate 2 so as to be sandwiched from both sides of the first portion of the first wiring 3 in the second direction D2. The second wiring patterns 41 and 41 of the above are included, and the crossed wiring 42 as a second portion for electrically connecting the second wiring patterns 41 and 41 to each other so as to intersect the first wiring 3 is included. Of the second wiring 4, at least the crossed wiring 42 may extend in the second direction D2, and the entire second wiring pattern 41 may not extend in the second direction D2. That is, in the present embodiment, the second direction D2 can be defined as the direction in which the cross wiring 42 extends. For example, as shown in FIG. 4, one second wiring pattern 41 extends in the second direction D2, and the other second wiring pattern 41 is in a direction different from the second direction D2 (for example, the first direction D1 or the first direction). It may extend in a third direction different from D1). Further, as shown in FIG. 5, both second wiring patterns 41 and 41 may extend in a direction different from that of the second direction D2, and the cross wiring 42 may extend in the second direction D2. In the embodiment shown in FIGS. 4 and 5, in the second wiring pattern 41 extending in a direction different from the second direction D2, the vicinity of the end thereof may be curved or bent toward the second direction D2. ..

In the present embodiment, the distance D between the end portion of the second wiring pattern 41 and the first portion closest to the end portion is not particularly limited. From the viewpoint of manufacturing the wiring board 1, the interval D may be, for example, a length that allows the insulating portion 5 to be filled between them, and the conductive material film is etched to form the first wiring 3 and the second wiring. Any length may be used as long as the wiring pattern 41 can be formed. Further, the interval D is a length capable of electrically insulating them by an insulating portion 5 located between the second wiring 4 (second wiring pattern 41) and the first wiring 3 depending on the use of the wiring board 1. It suffices as long as it is long enough to satisfy the dielectric strength.

The cross wiring 42 is a set of second wiring patterns 41, in which the first portion of the first wiring 3 is sandwiched from both sides on the insulating portion 5 that at least covers the first portion extending in the first direction D1 of the first wiring 3. The 41 is provided so as to be electrically connected. The cross wiring 42 is a printing wiring formed by a printing method using a conductive paste, a conductive ink, or the like, for example, screen printing. The second wiring 4 in the present embodiment may include a plurality of cross wirings 42 that electrically connect a plurality of sets of the second wiring patterns 41 and 41 and each set of the second wiring patterns 41 and 41. In this case, the plurality of sets of the second wiring patterns 41, 41 and the plurality of crossed wirings 42 may be included in one second wiring 4, or each of the plurality of second wirings 4. It may be included in. That is, one second wiring 4 may include a set of second wiring patterns 41, 41 and one cross wiring 42, or may include a plurality of sets of second wiring patterns 41, 41 and a plurality of sets. The cross wiring 42 may be included.

The cross wiring 42 has a substantially constant film thickness T ₄₂ from one second wiring pattern 41 toward the other second wiring pattern 41. Unless otherwise specified in the present embodiment, the film thickness T ₄₂ of the cross wiring 42 means the film thickness along the normal direction of the surface of the cross wiring 42 in the portion where the cross wiring 42 is in contact with the insulating portion 5. It shall be. The fact that the crossed wiring 42 has a substantially constant film thickness T ₄₂ means that the minimum value of the film thickness T ₄₂ of one crossed wiring 42 is 80% or more of the maximum value, and the minimum value is the maximum. It is preferably 85% or more of the value. The thickness T ₄₂ of the cross wiring 42 may be a value measured by using, for example, an ultra-low acceleration voltage scanning electron microscope (ULV-SEM, manufactured by ZEISS, product name: ULTRA55). Further, when the wiring board 1 according to the present embodiment includes a plurality of intersecting wirings 42, the variation in the film thickness T ₄₂ among the plurality of intersecting wirings 42 is the thickness T ₄₂ of each of the plurality of intersecting wirings 42. The average value (thickness average value A ₄₂ ) is obtained, and the difference (Avg-A ₄₂ ) between the arithmetic mean value Avg of each film thickness average value A ₄₂ and the thickness average value A ₄₂ is relative to the arithmetic mean value Avg. It may be within 15%. The average value of the film thickness T ₄₂ of the crossed wiring 42 (film thickness average value A ₄₂ ) can be obtained, for example, as follows. For example, using the above-mentioned ultra-low acceleration voltage scanning electron microscope, cross-sectional SEM images of each of a plurality of arbitrarily selected points (for example, 5 places) of the cross wiring 42 are acquired, and a film of each selected place is obtained from each cross-sectional SEM image. The thickness T ₄₂ may be measured, and the arithmetic mean value of the film thickness T ₄₂ may be set as the film thickness average value A ₄₂ of the crossed wiring 42. Further, a cross-sectional SEM image along the second direction D2 of the cross-sectional wiring 42 is acquired, and from the cross-sectional SEM image, the boundary line of the insulating portion 5 and the cross-wire 42 and the line segment indicating the upper surface of the cross-wire 42 are obtained, respectively. Smoothing (smoothing) is performed using the minimum square method or the like, and the average value of the distances between the two smoothed line segments may be the average film thickness value A ₄₂ of the cross wiring 42.

The film thickness T ₄₂ of the cross wiring 42 may be appropriately set according to the type of the conductive material included in the cross wiring 42, the resistance value of the second wiring pattern 41, the length of the second wiring 4, and the like. Since the crossed wiring 42 is a printed wiring formed by a printing method, the film thickness T ₄₂ of the crossed wiring 42 can be substantially made uniform.

The width W ₄₂ of the cross wiring 42 (the length in the first direction D1 orthogonal to the second direction D2) is the width W ₄₁ of the second wiring pattern 41 (the length in the first direction D1 orthogonal to the second direction D2). Greater than. For example, the width W ₄₁ of the second wiring pattern 41 may be in the range of 20 μm to 5000 μm, and the width W ₄₂ of the crossed wiring 42 may be in the range of 30 μm to 5500 μm. The width W 41 of the second wiring pattern ₄₁ and the width W ₄₂ of the cross wiring 42 may not be uniform or constant in the plane of the first surface 21 of the substrate 2. For example, one second wiring pattern 41 may include different portions of its width W ₄₁ , and one crossed wiring 42 may include different portions of its width W ₄₂ . When a plurality of second wiring patterns 41 and a plurality of intersecting wirings 42 are provided, the width W 41 of one second wiring pattern 41 and the width W ₄₁ of the other second wiring pattern ₄₁ are different from each other. Also, the width W 42 of one cross wiring ₄₂ and the width W ₄₂ of the other cross wiring 42 may be different from each other.

In a state where the first surface 21 of the substrate 2 is positioned upward and the second surface 22 is positioned downward, the upper surface and the side surface (substantially in the first direction D1) curved in a convex shape of the cross wiring 42. The continuous portion with the side surface parallel to and the side surface substantially parallel to the second direction D2) is shown as a corner portion (see FIG. 1), but the continuous portion between the upper surface and the side surface is rounded. It may be a corner.

The first wiring 3 and the second wiring pattern 41 may be wiring formed by processing a wiring conductive film 60 (see FIG. 12A) containing the same conductive material, or may have the same conductivity. It may be a printed wiring containing a material. Examples of the conductive film 60 for wiring include a vapor-deposited thin film of a conductive material, a metal foil of a metal material as a conductive material, a conductive polymer film, and the like, which are formed by processing the conductive film 60 for wiring. Wiring includes wiring formed by processing a vapor-deposited thin film (vapor-deposited wiring), wiring formed by processing a metal foil (metal foil wiring), wiring formed by processing a conductive polymer film, and the like. Can be mentioned. Examples of the conductive material include metal materials such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al); amorphous carbon (carbon black), graphite, silicon carbide, titanium carbide, and titanium nitride. , Non-metal conductive materials such as tungsten carbide and zirconium carbide; conductive polymers and the like. The printed wiring is formed by printing using a conductive paste or ink containing at least particles (conductive particles) made of a conductive material such as the above-mentioned metal material or non-metal conductive material, or a conductive polymer. Means the wiring that has been done. When the first wiring 3 and the second wiring pattern 41 are, for example, metal foil wiring formed by processing a copper foil, the surfaces of the first wiring 3 and the second wiring pattern 41 may be deteriorated by oxidation. be. Therefore, the first wiring 3 and the second wiring pattern 41 may be metal foil wiring formed by processing a copper foil whose surface is nickel-plated or gold-plated.

The cross wiring 42 may be a printed wiring containing a conductive material. Examples of the conductive material contained in the cross wiring 42 include metal materials such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al); amorphous carbon (carbon black), graphite, and silicon carbide. , Non-metal conductive materials such as titanium carbide, titanium nitride, tungsten carbide, zirconium carbide; conductive polymers and the like.

The insulating portion 5 is interposed between the first portion of the first wiring 3 and the intersecting wiring 42 (second portion) of the second wiring 4, and electrically insulates the first wiring 3 and the second wiring 4. ing. The material constituting the insulating portion 5 is not particularly limited, and may be, for example, an insulating resin material such as a polyurethane resin, an epoxy resin, or a polyimide resin.

When the cross section along the second direction D2 is viewed, the thickness T _5C of the central portion of the insulating portion 5 in the second direction D2 is the thickness of the insulating portion 5 located on the end side of the second wiring pattern 41. It may be thicker than T _5E , and may be gradually thickened from both ends of the second wiring patterns 41 and 41 toward the central portion of the insulating portion 5 (see FIG. 6). When the thickness T _5C and the thickness T _5E are the same, the film thickness of the cross wiring 42 on the insulating portion 5 of the thickness T _5E is larger than the film thickness of the cross wiring 42 on the insulating portion 5 of the thickness T _5C . However, since the thickness T _5C is thicker than the thickness T _5E , the film thickness T ₄₂ of the cross wiring ₄₂ is substantially reduced. Can be made uniform. The thickness of the insulating portion 5 needs to be such that the first wiring 3 and the second wiring 4 can be electrically insulated. Therefore, the thickness T _5E and the thickness T _5C of the insulating portion 5 are set to a thickness equal to or larger than the thickness at which the insulating portion 5 can maintain the dielectric strength according to the application of the wiring board 1 and the voltage design value based on the application. You just have to. The thickness of the insulating portion 5 is defined as a length along the normal direction of the upper surface of the insulating portion 5. For example, an ultra-low acceleration voltage scanning electron microscope (ULV-SEM, manufactured by ZEISS, product name: ULTRA55). ) Etc. can be measured.

In a state where the first surface 21 of the substrate 2 is positioned upward and the second surface 22 is positioned downward, the insulating portion 5 may be curved upward in a convex shape. If the corner portion is present on the surface of the insulating portion 5, the film thickness on the corner portion may be thinner than the film thickness of the other portion in the cross wiring 42 formed on the insulating portion 5, but the insulating portion 5 Is curved upward in a convex shape, so that the film thickness T ₄₂ of the cross wiring 42 can be substantially made uniform. Preferably, in a state where the first surface 21 of the substrate 2 is positioned above and the second surface 22 is positioned below, the insulating portion 5 is placed on the upper surface of the insulating portion 5 (particularly, the upper surface in contact with the cross wiring 42). It suffices to be curved upward in a convex shape without the presence of corners. This makes it easier to make the thickness of the cross wiring 42 provided on the insulating portion 5 substantially uniform. In the present embodiment, the insulating portion 5 is convex upward as a whole so that the corner portion where the film thickness of the cross wiring 42 becomes relatively thin does not exist on the surface of the insulating portion 5. It suffices if it is curved. Therefore, a part of the surface of the insulating portion 5 may be slightly recessed downward, or the surface of the insulating portion 5 may have a smooth wavy shape including peaks and valleys. For example, when the insulating portion 5 integrally covers the first portion of the plurality of first wirings 3, the portion of the insulating portion 5 located above between the adjacent first portions becomes a valley portion, and the first portion is formed. The portion located above the portion may be a mountain portion, the valley portion may be recessed downward from the mountain portion, and the surface of the insulating portion 5 may have a smooth wavy shape.

The insulating portion 5 may integrally cover the first portion of the first wiring 3 sandwiched by the set of the second wiring patterns 41 and 41, but the end portions of the second wiring patterns 41 and 41 are also integrally covered. It may be covered.

In a state where the first surface 21 of the substrate 2 is positioned upward and the second surface 22 is positioned downward, the upper surface (upper surface curved in a convex shape) and the side surface (first direction D1) of the insulating portion 5 are positioned. Although the continuous portion with the side surface substantially parallel to and the side surface substantially parallel to the second direction D2) is shown as a corner portion (see FIG. 1), the continuous portion between the upper surface and the side surface is shown. May be rounded corners.

The length L ₄₂ of the cross wiring 42 in the second direction D2 is longer than the length L ₅ of the insulating portion 5 in the second direction D2, and the cross wiring 42 in the direction orthogonal to the second direction D2 (first direction D1). The length W ₄₂ of is shorter than the length W ₅ of the insulating portion 5 in the direction orthogonal to the second direction D2 (first direction D1). As a result, the second wiring pattern 41 and the cross wiring 42 can be reliably and electrically connected, and a short circuit between the cross wiring 42 and the first wiring 3 can be reliably prevented.

In the wiring board 1 according to the present embodiment, when the intersecting wiring 42 having the plurality of first portions of the first wiring 3 as the second portion intersects, as shown in FIG. 7, each intersecting wiring 42 and the intersecting wiring thereof. An insulating portion 5 may be interposed between each first portion where the 42 intersects, or as shown in FIG. 8, a plurality of adjacent intersecting wiring 42s and a plurality of locations where the intersecting wirings 42 intersect. One insulating portion 5 may be interposed between the first portion and the first portion of the above. In the embodiment shown in FIG. 8, when the pitch P ₄₁ (interval between adjacent second wiring patterns 41) of the adjacent second wiring pattern 41 is relatively small, for example, when it is about 1000 μm or less, the insulating portion 5 is provided. The effect that the forming process can be simplified can be achieved. The pitch P ₄₁ of the adjacent second wiring pattern 41 and the pitch of the adjacent cross wiring 42 may not be uniform in the plane of the first surface 21 of the substrate 2.

Further, in the wiring board 1 according to the present embodiment, when the first wiring groups 3A and 3B including a plurality of first wirings 3 parallel to each other along the second direction D2 are arranged at predetermined intervals. The second wiring 4 includes a second wiring pattern 41A provided between the first wiring groups 3A and 3B, a second wiring pattern 41B facing the second wiring pattern 41A so as to sandwich the first wiring group 3A, and a first wiring pattern 41B. The second wiring pattern 41C facing the second wiring pattern 41A may be included so as to sandwich the wiring group 3B. In this case, the second wiring 2 includes a cross wiring 42A that electrically connects the second wiring patterns 41A and 41B that sandwich the first wiring group 3A from both sides, and a second wiring pattern that sandwiches the first wiring group 3B from both sides. It may include the cross wiring 42B that electrically connects 41A and 41C (see FIG. 9), or includes the cross wiring 42 that integrally electrically connects the second wiring patterns 41A to 41C. It may be (see FIG. 10). In the embodiment shown in FIG. 10, the second wiring pattern 41A is completely embedded in the cross wiring 42, so that a part of the second wiring pattern 41A is covered with the cross wiring 42. In comparison, since the cross-sectional area of the second wiring 4 can be increased, the effect that the resistance value of the second wiring 4 can be relatively lowered is achieved.

According to the wiring board 1 according to the present embodiment, the cross wiring 42 for electrically connecting the second wiring patterns 41 and 41 is a printed wiring formed by printing, so that the film thickness T of the cross wiring 42 is T. ₄₂ can be made substantially uniform. Since the film thickness T ₄₂ of the cross wiring 42 is substantially uniform, the variation of the film thickness T ₄₂ of the cross wiring 42 in the wiring board 1 is particularly high when the second wiring 4 includes a plurality of cross wiring 42. Is relatively small, so that the electronic device using the wiring board 1 can be operated almost as designed.

The method for manufacturing the wiring board 1 according to the present embodiment described above will be described.
11A to 11E are plan views showing each step of the manufacturing method of the wiring board 1 according to the present embodiment, and FIGS. 12A to 12E are cuts showing each step of the manufacturing method of the wiring board 1 according to the present embodiment. It is an end view.

In the method for manufacturing a wiring board 1 according to the present embodiment, a substrate 2 having a second surface 22 located on the opposite side of the first surface 21 and the first surface 21 is prepared, and the substrate 2 is placed on the first surface 21 of the substrate 2. 1 Wiring 3 and a second wiring pattern 41 are formed.

In order to form the first wiring 3 and the second wiring pattern 41 on the first surface 21 of the substrate 2, first, the conductivity constituting the first wiring 3 and the second wiring pattern 41 on the first surface 21 of the substrate 2 A wiring conductive film 60 containing a material is formed, and a resist layer 70 covering the wiring conductive film 60 is formed (see FIGS. 11A and 12A).

As a method for forming the conductive film 60 for wiring, for example, a metal material, a non-metal conductive material, or the like as a conductive material contained in the conductive film 60 for wiring is vacuum-deposited on the first surface 21 of the substrate 2. A method of forming, a method of laminating and adhering a metal foil of a metal material as the conductive material to the first surface 21 of the substrate 2 under high temperature and high pressure, and a method of laminating and adhering a conductive polymer as the conductive material to the first surface of the substrate 2. Examples thereof include a method of applying to 21.

The film thickness of the wiring conductive film 60 can be appropriately set according to the film thickness required for the first wiring 3 and the second wiring pattern 41, and may be, for example, about 5 μm to 100 μm.

The resist material constituting the resist layer 70 is not particularly limited, and for example, a negative type or positive type photosensitive material can be used, but a negative type photosensitive material is preferably used. The first wiring 3 and the second wiring pattern 41 are formed by etching the conductive film 60 for wiring via the mask pattern 71 formed by patterning the resist layer 70. Therefore, the film thickness of the resist layer 70 can be appropriately set according to the etching selection ratio or the like according to the constituent material of the conductive film 60 for wiring.

The method for forming the resist layer 70 is not particularly limited, and a conventionally known coating film forming method may be adopted. For example, a method of applying the resist material constituting the resist layer 70 onto the conductive film 60 for wiring by a die coating method, a spin coating method, or the like can be mentioned. Further, a method of laminating and forming a dry film resist made of the resist material on the conductive film 60 for wiring using a laminator or the like may be used.

Next, the etching mask 71 corresponding to the first wiring 3 and the second wiring pattern 41 is formed by patterning the resist layer 70 (see FIGS. 11B and 12B). The patterning method of the resist layer 70 may be, for example, a method of exposure / development via a photomask corresponding to the etching mask 71. Instead of forming the resist layer 70 and patterning the resist layer 70, an etching mask 71 corresponding to the first wiring 3 and the second wiring pattern 41 may be formed on the wiring conductive film 60 by printing the resist material. ..

Then, the first wiring 3 and the second wiring pattern 41 are formed on the first surface 21 of the substrate 2 by dry etching or wet etching the wiring conductive film 60 via the etching mask 71 (FIG. 11C, FIG. See 12C).

Subsequently, an insulating portion 5 that at least covers the first portion of the first wiring 3 sandwiched between the second wiring patterns 41 is formed (see FIGS. 11D and 12D), and the second wiring patterns 41 and 41 are electrically connected. Cross wiring 42 is formed on the insulating portion 5 (see FIGS. 11E and 12E). In this way, the wiring board 1 according to the present embodiment is manufactured.

In forming the insulating portion 5 and the cross wiring 42, a design method of the wiring board 1, particularly a design method of the insulating portion 5 and the cross wiring 42 will be described.
As will be described later, the insulating portion 5 may be formed by an inkjet method, a printing method such as screen printing, or the like, and the cross wiring 42 may be formed by a printing method such as screen printing. Depending on the method of forming the insulating portion 5 and the cross wiring 42, the accuracy of the device used for forming the insulating portion 5 and the cross wiring 42, and the like, a predetermined positional deviation may occur when the insulating portion 5 and the cross wiring 42 are formed. .. Therefore, the sizes of the insulating portion 5 and the cross wiring 42 (see FIG. 13) and the like are designed in consideration of the above-mentioned misalignment amount (formation likelihood α _I of the insulating portion 5 and formation likelihood α _M of the cross wiring 42). Need to be done. The formation likelihood α _I of the insulating portion 5 and the formation likelihood α _M of the cross wiring 42 include at least the amount of misalignment along the first direction D1 and the amount of misalignment along the second direction D2.

First, the contact length L between the second wiring pattern 41 and the cross wiring 42 is determined. The contact length L is the length at which the second wiring pattern 41 and the crossed wiring 42 come into contact with each other in the second direction D2 (wiring direction of the crossed wiring 42) (see FIG. 13).

Next, the width _WM of the crossed wiring 42, the width _WI of the insulating portion 5, and the first wiring 3 of the first wiring 3 which is most recent from the end portion (end portion in the second direction D2) of the crossed wiring 42 to the end portion. The length L _M to the side surface of one portion and the length L from the end portion (end portion in the second direction D2) of the insulating portion 5 to the side surface of the first portion of the first wiring 3 which is the closest to the end portion. _I is calculated based on the formation likelihood α _I of the insulating portion 5, the formation likelihood α _M of the crossed wiring 42, and the contact length L so as to satisfy the relationships shown in the following equations (1) to (4).
_WM ≧ W ₂ + 2α _M ... (1)
_{WI ≧ WM +2 (α M + α I ) ・ ・}・ (2)
L _I ≧ D + α _I・ ・ ・ (3)
LM ≧ _{LI + L + α M + α I ・ ・}・ (4)
In the above equation (1), W ₂ represents "the design value of the line width of the second wiring pattern 41".

If the wiring board 1 is designed without considering the formation likelihood α _I of the insulating portion 5 and the formation likelihood α _M of the cross wiring 42, the wiring board 1 is crossed due to the positional deviation when the insulating portion 5 and the cross wiring 42 are formed. There may be a problem that the wiring 42 and the second wiring pattern 41 are not electrically connected, or the cross wiring 42 and the first wiring 3 are electrically connected. However, by designing the insulating portion 5 and the cross wiring 42 as described above, the insulating portion is not caused by the above-mentioned problems by the process of forming the insulating portion 5 and the step of forming the cross wiring 42 described later. 5 and the cross wiring 42 can be formed.

Based on the above design, the insulating portion 5 covering the first portion of the first wiring 3 is formed (see FIGS. 11D and 12D). Examples of the method for forming the insulating portion 5 include a printing method using an insulating material (resin material) constituting the insulating portion 5, an inkjet method, and the like. In the present embodiment, when the cross section along the second direction D2, which is the wiring direction of the crossed wiring 42, is viewed, the thickness T _5C of the central portion of the insulating portion 5 in the second direction D2 is the second wiring pattern 41. The thickness of the insulating portion 5 located on the end side is thicker than that of T _5E , preferably gradually increasing from both ends of the second wiring patterns 41 and 41 toward the central portion of the insulating portion 5 ( (See FIG. 6), the insulating portion 5 is formed.

In the present embodiment, the insulating portion 5 having the above-mentioned thickness distribution can be formed by appropriately adjusting the viscosity of the resin material constituting the insulating portion 5. The viscosity (25 ° C.) of the insulating material constituting the insulating portion 5 may be, for example, about 1 Pa · s to 300 Pa · s.

After forming the insulating portion 5 as described above, the cross wiring 42 for electrically connecting the second wiring patterns 41 and 41 to each other is formed on the insulating portion 5 (FIGS. 11E and 12E). The cross wiring 42 is formed by a printing method such as a conductive paste or ink containing conductive particles constituting the cross wiring 42, or screen printing using a conductive polymer. By forming the cross wiring 42 by the printing method, it is possible to form the cross wiring 42 having a substantially uniform film thickness.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

In the above embodiment, an embodiment in which the crossed wiring 42 is a printing method using a conductive paste, a conductive ink, or the like, for example, a printed wiring formed by screen printing has been described as an example, but the present invention is limited to this embodiment. It's not a thing. For example, when the cross wiring 42 integrally covers a plurality of first portions parallel to each other along a direction orthogonal to the first direction D1 (see, for example, FIG. 1), the cross wiring 42 is the cross wiring 42. It may be sputter wiring, vapor deposition wiring, plating wiring or the like formed by sputtering, vapor deposition, plating or the like of the material (conductive material) constituting the above.

In the above embodiment, the embodiment in which the width W ₄₂ of the crossed wiring 42 is substantially the same along the second direction D2 has been described as an example, but the present invention is not limited to this embodiment. For example, as shown in FIG. 14, the cross wiring 42 is located at both ends of the narrow portion 421 having a relatively small width W ₄₂₁ and the narrow portion 421 along the second direction D2, and the narrow portion 421. It may include a wide portion 422 having a width W ₄₂₂ larger than that. The width W ₄₂₁ of the narrow portion 421 may be the same as the width W ₄₁ of the second wiring pattern 41, may be larger than the width W ₄₁ , or may be smaller than the width W ₄₁ . In the case of manufacturing the wiring board ₁ having the crossed wiring 42 in such an embodiment, the design value of the width _WM'of the wide portion 422 and the design value of the width WI of the insulating portion 5 are the following equations (5) and ( It may be calculated by 6).
_WM '≧ W ₂ + 2α _M ... (5)
WI ≧ _WM '+2 (α _M + α _I ) ・_・・ (6)
In the above equation (5), W ₂ is the “design value of the line width of the second wiring pattern 41”, α _M is the “likelihood of formation of the crossed wiring 42”, and α _I is the “likelihood of formation of the insulating portion 5”. ".

1 ... Wiring board 2 ... Board 21 ... 1st surface 22 ... 2nd surface 3 ... 1st wiring 4 ... 2nd wiring 41, 41A, 41B, 41C ... 2nd wiring pattern 42 ... Cross wiring 5 ... Insulation

Claims (23)

A substrate having a first surface and a second surface located on the opposite side of the first surface,
A first wiring provided on the first surface of the substrate and including a first portion extending in a first direction on the first surface.
A second wiring provided on the first surface of the substrate and including a second portion of the first surface that intersects the first direction and extends in a second direction.
It is provided with at least an insulating portion that covers the first portion.
The second portion of the second wiring is a wiring board which is a printed wiring formed on the insulating portion by printing. A substrate having a first surface and a second surface located on the opposite side of the first surface,
A first wiring provided on the first surface of the substrate and including a plurality of first portions extending in a first direction on the first surface.
A second wiring provided on the first surface of the substrate and including a second portion of the first surface that intersects the first direction and extends in a second direction.
It is provided with an insulating portion that integrally covers at least the plurality of first portions.
The plurality of first portions are arranged in parallel along the direction orthogonal to the first direction.
The second portion of the second wiring is a wiring board provided on the insulating portion. The first wiring includes a plurality of the first portions arranged in parallel along a direction orthogonal to the first direction.
The wiring board according to claim 1, wherein the insulating portion integrally covers the plurality of first portions. The wiring board according to claim 2 or 3, wherein the distance between the adjacent first portions is in the range of 40 μm to 10000 μm. The aspect according to any one of claims 1 to 4, wherein the thickness of the central portion of the insulating portion in the second direction is thicker than the thickness of both ends in the second direction in a cross-sectional view along the second direction. Wiring board. The wiring board according to claim 5, wherein the thickness of the insulating portion gradually increases from both ends of the insulating portion toward the central portion in a cross-sectional view along the second direction. The invention according to any one of claims 1 to 6, wherein the insulating portion is curved upward in a cross-sectional view along the second direction with the first surface positioned upward. Wiring board. The second wiring includes a plurality of the second portions parallel along a direction orthogonal to the second direction.
The wiring board according to any one of claims 1 to 7, wherein the distance between the adjacent second portions is in the range of 60 μm to 10000 μm. The wiring board according to any one of claims 1 to 8, wherein the second wiring is the wiring board including the plurality of the second portions. The wiring board according to claim 9, wherein the plurality of second portions are formed on one of the insulating portions. The wiring board according to any one of claims 1 to 10, wherein the length of the second portion in the second direction is longer than the length of the insulating portion in the second direction. The wiring substrate according to any one of claims 1 to 11, wherein the length of the second portion in the direction orthogonal to the second direction is shorter than the length of the insulating portion in the direction orthogonal to the second direction. A method for manufacturing a substrate having a first surface and a second surface located on the opposite side of the first surface, and a wiring board having a first wiring and a second wiring provided on the first surface of the substrate. And,
The first wiring includes a first portion extending in a first direction on the first surface.
The second wiring includes a second portion of the first surface extending in a second direction intersecting the first direction.
The method for manufacturing the wiring board is as follows.
A step of forming the first wiring and at least a set of second wiring patterns sandwiching the first portion of the first wiring from both sides along the second direction on the first surface of the substrate. ,
A step of forming an insulating portion that covers at least the first portion, and
A step of forming cross wiring as the second portion for electrically connecting the second wiring patterns to each other on the insulating portion is included.
The cross wiring is a method for manufacturing a wiring board formed by printing on the insulating portion using a conductive paste or a conductive ink. A method for manufacturing a substrate having a first surface and a second surface located on the opposite side of the first surface, and a wiring board having a first wiring and a second wiring provided on the first surface of the substrate. And,
The first wiring includes a plurality of first portions extending in a first direction on the first surface.
The second wiring includes a second portion of the first surface extending in a second direction intersecting the first direction.
The method for manufacturing the wiring board is as follows.
A step of forming the first wiring on the first surface of the substrate so that the plurality of first portions are arranged in parallel along a direction orthogonal to the first direction.
A step of forming at least one set of second wiring patterns on the first surface of the substrate, sandwiching the plurality of first portions of the first wiring from both sides along the second direction.
A step of forming an insulating portion that integrally covers at least the first portion, and
A method for manufacturing a wiring board, comprising a step of forming cross wiring as the second portion for electrically connecting the second wiring patterns to each other on the insulating portion. The first wiring is formed so that the plurality of the first portions are arranged in parallel along the direction orthogonal to the first direction.
The method for manufacturing a wiring board according to claim 13, wherein the insulating portion that integrally covers the plurality of first portions is formed. The method for manufacturing a wiring board according to claim 14 or 15, wherein the first wiring is formed so that the distance between the adjacent first portions is within the range of 40 μm to 10000 μm. Claims 13 to 13 for forming the insulating portion so that the thickness of the central portion of the insulating portion in the second direction becomes thicker than the thickness of both ends when the cross section along the second direction is viewed. 16. The method for manufacturing a wiring board according to any one of 16. A claim for forming the insulating portion so that the thickness of the insulating portion gradually increases from both ends of the insulating portion toward the central portion when the cross section along the second direction is viewed. 17. The method for manufacturing a wiring board according to 17. Claims 13 to 18 for forming a plurality of sets of the second wiring patterns parallel to each other along a direction orthogonal to the second direction so that the distance between adjacent second wiring patterns is within the range of 60 μm to 10000 μm. The method for manufacturing a wiring board according to any one of the above. The method for manufacturing a wiring board according to claim 19, wherein a plurality of the cross wirings for electrically connecting each of the plurality of sets of the second wiring patterns are formed on one of the insulating portions. The wiring board according to any one of claims 13 to 20, wherein the crossed wiring is formed so that the length of the crossed wiring in the second direction is longer than the length of the insulating portion in the second direction. One of claims 13 to 21 for forming the cross wiring so that the length of the cross wiring in the line width direction of the cross wiring is shorter than the length of the insulating portion in the line width direction of the cross wiring. The wiring board described. A method for designing a wiring board manufactured by the manufacturing method according to any one of claims 13 to 22.
A step of determining the contact length L between the second wiring pattern and the cross wiring, and
The width _WM of the cross wiring, the width _WI of the insulation portion, the length _LM from the side surface of the first portion to the end portion of the cross wiring, and the side surface of the first portion to the end portion of the insulation portion. Including the step of calculating the length _LI of
Relationships shown in the following equations (1) to (4) based on the formation likelihood α _I of the insulating portion, the formation likelihood α _M of the cross wiring, and the contact length L between the second wiring pattern and the cross wiring. The width _WM of the crossed wiring, the width _WI of the insulating portion, the length _LM from the side surface of the first portion to the end portion of the crossed wiring, and the insulation from the side surface of the first portion so as to satisfy the above. _A method for designing a wiring board for calculating the length LI to the end of a portion.
_WM ≧ W ₂ + 2α _M ... (1)
_{WI ≧ WM +2 (α M + α I ) ・ ・}・ (2)
L _I ≧ D + α _I・ ・ ・ (3)
LM ≧ _{LI + L + α M + α I ・ ・}・ (4)
In the above equation (1), W ₂ represents "the design value of the line width of the second wiring pattern".

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