JP2021196720A

JP2021196720A - Electronic device

Info

Publication number: JP2021196720A
Application number: JP2020101273A
Authority: JP
Inventors: 一哉梅島; Kazuya Umeshima; 憲司渡村; Kenji Tomura
Original assignee: Lenovo Singapore Pte Ltd
Current assignee: Lenovo Singapore Pte Ltd
Priority date: 2020-06-10
Filing date: 2020-06-10
Publication date: 2021-12-27
Anticipated expiration: 2040-06-10
Also published as: JP6922037B1

Abstract

To provide an electronic device that can make a housing smaller and thinner and improve the appearance quality.SOLUTION: An electronic device includes a first housing, a second housing relatively rotatably connected to the first housing, a display provided in the first housing, a printed circuit board provided in the second housing, and a flexible substrate for connecting the display and the printed circuit board. In the second housing, the flexible substrate has first and second folded portions that are arranged in order and curved in opposite directions to each other. The flexible substrate has a connection to the printed circuit board on a surface located on the outer peripheral side of the first folded portion and located on the inner peripheral side of the second folded portion.SELECTED DRAWING: Figure 4C

Description

本発明は、ディスプレイを備える電子機器に関する。 The present invention relates to an electronic device including a display.

ノート型ＰＣのような電子機器は、ディスプレイを搭載した第１筐体と、マザーボードを搭載した第２筐体とがヒンジで連結されている（例えば特許文献１参照）。 In an electronic device such as a notebook PC, a first housing on which a display is mounted and a second housing on which a motherboard is mounted are connected by a hinge (see, for example, Patent Document 1).

特許第６６９８１４４号公報Japanese Patent No. 6698144

ところで、上記特許文献１の構成は、ディスプレイの制御用の基板（ディスプレイ基板）を第１筐体のベゼル部材の内側に収納している。このため、ベゼル部材は、ディスプレイ基板の分だけ幅広になり、外観品質が低下する。 By the way, in the configuration of Patent Document 1, the substrate for controlling the display (display substrate) is housed inside the bezel member of the first housing. Therefore, the bezel member becomes wider by the amount of the display board, and the appearance quality deteriorates.

そこで、ディスプレイ基板を第２筐体内に収納し、ディスプレイとディスプレイ基板との間を第１筐体から第２筐体に亘るフレキシブル基板で接続することが考えられる。ところが、この構成では、ディスプレイ基板の分だけ第２筐体の薄型化や前後寸法が増大してしまう。特に、フレキシブル基板は、筐体間の回動動作に追従して柔軟に移動できる必要がある。このため、第２筐体内にはフレキシブル基板の移動スペースが必要となるため、ディスプレイ基板の配置スペースは最小限に抑えたい。 Therefore, it is conceivable to store the display board in the second housing and connect the display and the display board with a flexible board extending from the first housing to the second housing. However, in this configuration, the thickness of the second housing and the front-rear dimensions increase by the amount of the display board. In particular, the flexible substrate needs to be able to flexibly move following the rotational movement between the housings. For this reason, a space for moving the flexible substrate is required in the second housing, and the space for arranging the display board should be minimized.

本発明は、上記従来技術の課題を考慮してなされたものであり、筐体の小型薄型化を可能とし、外観品質を向上させることができる電子機器を提供することを目的とする。 The present invention has been made in consideration of the above-mentioned problems of the prior art, and an object of the present invention is to provide an electronic device capable of making the housing smaller and thinner and improving the appearance quality.

本発明の第１態様に係る電子機器は、電子機器であって、第１筐体と、前記第１筐体に対して相対的に回動可能に連結された第２筐体と、前記第１筐体に設けられたディスプレイと、前記第２筐体に設けられたプリント基板と、前記ディスプレイと前記プリント基板とを接続するフレキシブル基板と、を備え、前記第２筐体内において、前記フレキシブル基板は、順に並んで互いに逆向きに湾曲した第１及び第２の折返し部を有し、前記フレキシブル基板は、前記第１の折返し部では外周側に位置し、前記第２の折返し部では内周側に位置する表面に、前記プリント基板に対する接続部を有する。 The electronic device according to the first aspect of the present invention is an electronic device, which is a first housing, a second housing rotatably connected to the first housing, and the first housing. A display provided in one housing, a printed circuit board provided in the second housing, and a flexible substrate for connecting the display and the printed circuit board are provided, and the flexible substrate is provided in the second housing. Has first and second folded portions that are arranged in order and curved in opposite directions, the flexible substrate is located on the outer peripheral side in the first folded portion, and the inner circumference in the second folded portion. The surface located on the side has a connection portion to the printed circuit board.

さらに、前記第２筐体に相対的に固定され、前記第２の折返し部と前記接続部との間で前記フレキシブル基板を保持するホルダ部材を備える構成としてもよい。 Further, a holder member that is relatively fixed to the second housing and holds the flexible substrate between the second folded-back portion and the connecting portion may be provided.

前記第２筐体は、上面にキーボードを有し、後側面に前記第１筐体がヒンジを介して連結されたものであり、前記フレキシブル基板は、前記第２筐体の前記後側面に形成された開口部から前記第２筐体内へと前方に向かって挿入された後、下方且つ後方に向かって円弧状に折り返されることで前記第１の折返し部が形成され、さらに下方且つ前方に向かって円弧状に折り返されることで前記第２の折返し部が形成されており、前記プリント基板は、前記第２筐体の前記上面を形成する上カバー材に対して相対的に固定されると共に、前記フレキシブル基板の前記接続部が接続される被接続部が下向きに設けられ、前記フレキシブル基板は、前記接続部が上向きに設けられた構成としてもよい。 The second housing has a keyboard on the upper surface, the first housing is connected to the rear side surface via a hinge, and the flexible substrate is formed on the rear side surface of the second housing. After being inserted forward into the second housing through the opened opening, the first folded portion is formed by folding back in an arc shape downward and backward, and further downward and forward. The second folded portion is formed by folding back in an arc shape, and the printed circuit board is relatively fixed to the upper cover material forming the upper surface of the second housing, and is also fixed. The connected portion to which the connecting portion of the flexible substrate is connected may be provided downward, and the flexible substrate may be configured such that the connecting portion is provided upward.

前記ディスプレイとして、前記第１筐体の背面に臨んで映像を表示する第１のディスプレイ部が設けられた第１のディスプレイと、前記第１筐体の正面に臨んで映像を表示する第２のディスプレイ部が設けられた第２のディスプレイと、を有し、前記プリント基板として、前記第１のディスプレイ部の制御用の第１のディスプレイ基板と、前記第２のディスプレイ部の制御用の第２のディスプレイ基板と、を有し、前記フレキシブル基板として、前記第１のディスプレイ部と前記第１のディスプレイ基板とを接続する第１のディスプレイ用フレキシブル基板と、前記第２のディスプレイ部と前記第２のディスプレイ基板とを接続する第２のディスプレイ用フレキシブル基板と、を有する構成としてもよい。 As the display, a first display provided with a first display unit facing the back surface of the first housing and displaying an image facing the front of the first housing. It has a second display provided with a display unit, and as the printed substrate, a first display board for controlling the first display unit and a second display for controlling the second display unit. As the flexible board, a first display flexible board for connecting the first display unit and the first display board, the second display unit, and the second display board. A second display flexible board for connecting to the display board of the above may be provided.

前記第１のディスプレイは、さらに、タッチ操作を受け付ける第１のタッチパネル部を有し、前記プリント基板として、さらに、前記第１のタッチパネル部の制御用の第１のタッチパネル基板を有し、前記フレキシブル基板として、さらに、前記第１のタッチパネル部と前記第１のタッチパネル基板とを接続する第１のタッチパネル用フレキシブル基板を有する構成としてもよい。 The first display further has a first touch panel unit that accepts a touch operation, and further has a first touch panel board for controlling the first touch panel unit as the printed circuit board, and is flexible. The substrate may further include a first touch panel flexible substrate that connects the first touch panel unit and the first touch panel substrate.

前記第２のディスプレイは、さらに、タッチ操作を受け付ける第２のタッチパネル部を有し、前記プリント基板として、さらに、前記第２のタッチパネル部の制御用の第２のタッチパネル基板を有し、前記フレキシブル基板として、さらに、前記第２のタッチパネル部と前記第２のタッチパネル基板とを接続する第２のタッチパネル用フレキシブル基板を有する構成としてもよい。 The second display further has a second touch panel unit that accepts a touch operation, and further has a second touch panel board for controlling the second touch panel unit as the printed circuit board, and is flexible. The substrate may further include a second touch panel flexible substrate that connects the second touch panel unit and the second touch panel substrate.

前記第１及び第２のタッチパネル基板は、前記第２筐体内で互いに前後に並んで配置されることで、前記第２のタッチパネル基板が前記第１のタッチパネル基板よりも前記第２の折返し部から遠位側に配置され、前記第１及び第２のタッチパネル用フレキシブル基板は、互いに重ねられた状態で前記第１及び第２の折返し部を形成しており、前記第２のタッチパネル用フレキシブル基板は、前記第１のタッチパネル基板を越えて延在した延出部を有し、該延出部が前記第２のタッチパネル基板に接続された構成としてもよい。 The first and second touch panel substrates are arranged side by side in front of and behind each other in the second housing, so that the second touch panel substrate is more from the second folded portion than the first touch panel substrate. The flexible substrates for the first and second touch panels, which are arranged on the distal side, form the first and second folded portions in a state of being overlapped with each other, and the flexible substrates for the second touch panel are The configuration may be such that the extension portion extends beyond the first touch panel substrate, and the extension portion is connected to the second touch panel substrate.

前記第１及び第２のディスプレイ基板は、前記第２筐体内で互いに前後に並んで配置されることで、前記第２のディスプレイ基板が前記第１のディスプレイ基板よりも前記第２の折返し部から遠位側に配置され、前記第１及び第２のディスプレイ用フレキシブル基板は、互いに重ねられた状態で前記第１及び第２の折返し部を形成しており、前記第２のディスプレイ用フレキシブル基板は、前記第１のディスプレイ基板を越えて延在した延出部を有し、該延出部が前記第２のディスプレイ基板に接続された構成としてもよい。 By arranging the first and second display boards side by side in front of and behind each other in the second housing, the second display board is more from the second folded portion than the first display board. The first and second flexible substrates for displays, which are arranged on the distal side, form the first and second folded portions in a state of being overlapped with each other, and the flexible substrates for second displays are The configuration may be such that the extension portion extends beyond the first display substrate, and the extension portion is connected to the second display substrate.

前記プリント基板は、第１及び第２のプリント基板の２枚が前記第２筐体の内部で互いに前後に並んで配置され、前記フレキシブル基板は、第１及び第２のフレキシブル基板の２枚が重ねられた状態で前記第１及び第２の折返し部を形成しており、前記第１のフレキシブル基板は、前記第１のプリント基板に接続され、前記第２のフレキシブル基板は、前記第１のプリント基板を越えて延在した延出部を有し、該延出部が前記第２のプリント基板に接続された構成としてもよい。 In the printed circuit board, two printed circuit boards, a first and a second printed circuit board, are arranged side by side in front of and behind each other inside the second housing, and in the flexible board, two sheets of the first and second flexible boards are arranged. The first and second folded portions are formed in a stacked state, the first flexible substrate is connected to the first printed circuit board, and the second flexible substrate is the first flexible substrate. It may have an extension portion extending beyond the printed circuit board, and the extension portion may be connected to the second printed circuit board.

本発明の上記態様によれば、電子機器の筐体の小型薄型化を可能とし、外観品質を向上させることができる。 According to the above aspect of the present invention, it is possible to reduce the size and thickness of the housing of the electronic device and improve the appearance quality.

図１は、第１の実施形態に係る電子機器を上から見下ろした模式的な平面図である。FIG. 1 is a schematic plan view of the electronic device according to the first embodiment, looking down from above. 図２は、下カバー材を取り外した状態での電子機器の底面図である。FIG. 2 is a bottom view of the electronic device with the lower cover material removed. 図３は、図２中のＩＩＩ−ＩＩＩ線に沿う第２筐体の模式的な断面斜視図である。FIG. 3 is a schematic cross-sectional perspective view of the second housing along the line III-III in FIG. 図４Ａは、筐体間の角度姿勢を０度に設定した状態での電子機器の後部を拡大した模式的な側面断面図である。FIG. 4A is a schematic side sectional view of an enlarged rear portion of an electronic device in a state where the angular posture between the housings is set to 0 degrees. 図４Ｂは、筐体間の角度姿勢を６５度に設定した状態での電子機器の後部を拡大した模式的な側面断面図である。FIG. 4B is a schematic side sectional view of the rear part of the electronic device in a state where the angular posture between the housings is set to 65 degrees. 図４Ｃは、筐体間の角度姿勢を１３０度に設定した状態での電子機器の後部を拡大した模式的な側面断面図である。FIG. 4C is a schematic side sectional view of the rear part of the electronic device in a state where the angular posture between the housings is set to 130 degrees. 図５は、第２の実施形態の電子機器を上から見下ろした模式的な平面図である。FIG. 5 is a schematic plan view of the electronic device of the second embodiment as viewed from above. 図６は、図５に示す電子機器の下カバー材を取り外した状態での底面図である。FIG. 6 is a bottom view of the electronic device shown in FIG. 5 with the lower cover material removed. 図７は、図６中のＶＩＩ−ＶＩＩ線に沿う第２筐体の模式的な断面斜視図である。FIG. 7 is a schematic cross-sectional perspective view of the second housing along the line VII-VII in FIG. 図８は、筐体間の角度姿勢を６５度に設定した状態での電子機器の後部を拡大した模式的な側面断面図である。FIG. 8 is a schematic side sectional view of the rear part of the electronic device in a state where the angular posture between the housings is set to 65 degrees.

以下、本発明に係る電子機器について好適な実施の形態を挙げ、添付の図面を参照しながら詳細に説明する。 Hereinafter, a suitable embodiment of the electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

図１は、第１の実施形態に係る電子機器１０を上から見下ろした模式的な平面図である。図１に示すように、電子機器１０は、第１筐体１２と第２筐体１４とをヒンジ１６で相対的に回動可能に連結したクラムシェル型のノート型ＰＣである。電子機器１０は、筐体１２，１４間が０度姿勢（図４Ａ参照）と１３０度姿勢（図４Ｃ）との間で回動可能である。筐体１２，１４間の回動範囲は、１３０度以上でもよい。本発明に係る電子機器は、ノート型ＰＣ以外、携帯電話、スマートフォン、又は携帯用ゲーム機等でもよい。 FIG. 1 is a schematic plan view of the electronic device 10 according to the first embodiment, looking down from above. As shown in FIG. 1, the electronic device 10 is a clamshell type notebook PC in which a first housing 12 and a second housing 14 are relatively rotatably connected by a hinge 16. The electronic device 10 is rotatable between the housings 12 and 14 between the 0-degree posture (see FIG. 4A) and the 130-degree posture (FIG. 4C). The rotation range between the housings 12 and 14 may be 130 degrees or more. The electronic device according to the present invention may be a mobile phone, a smartphone, a portable game machine, or the like, in addition to the notebook PC.

以下、電子機器１０について、第１筐体１２を第２筐体１４に対して閉じて０度姿勢とした状態（図４Ａ参照）を基準とし、手前側を前、奥側を後、幅方向を左右、厚み方向を上下、と呼んで説明する。第１筐体１２については、図１のように開いてディスプレイ１８を視認する状態を基準とし、ディスプレイ１８の表示面側を正面、ディスプレイ１８の裏側を背面、ヒンジ１６側を下、ヒンジ１６側と逆側を上、と呼ぶこともある。 Hereinafter, with respect to the electronic device 10, the front side is the front side, the back side is the rear side, and the width direction is based on the state where the first housing 12 is closed with respect to the second housing 14 and is in the 0 degree posture (see FIG. 4A). Is referred to as left and right, and the thickness direction is referred to as up and down. Regarding the first housing 12, the display surface side of the display 18 is the front side, the back side of the display 18 is the back side, the hinge 16 side is the lower side, and the hinge 16 side is based on the state where the display 18 is visually recognized by opening as shown in FIG. The opposite side is sometimes called the top.

先ず、電子機器１０の全体構成を説明する。 First, the overall configuration of the electronic device 10 will be described.

第２筐体１４は、扁平な箱体である。第２筐体１４は、上面１４ａを形成する上カバー材２０と、下面（底面）１４ｂを形成する下カバー材２１（図４Ａ参照）と、を有する。第２筐体１４の前後左右の側面１４ｃは、上カバー材の四周縁部から起立した壁部によって形成されている。上面１４ａには、キーボード２４及びタッチパッド２５が設けられている。第２筐体１４の内部には、マザーボード２６やバッテリ装置２７（図２参照）の他、ＳＳＤ（Solid State Drive）、メモリ、アンテナ装置等の各種電子部品が収容されている。第２筐体１４の後側面１４ｃには、左右方向に延在した切欠き状の凹状部１４ｄが設けられている。凹状部１４ｄには、ヒンジ１６が配置される。 The second housing 14 is a flat box body. The second housing 14 has an upper cover material 20 forming the upper surface 14a and a lower cover material 21 (see FIG. 4A) forming the lower surface (bottom surface) 14b. The front, rear, left and right side surfaces 14c of the second housing 14 are formed by wall portions that stand up from the four peripheral edges of the upper cover material. A keyboard 24 and a touch pad 25 are provided on the upper surface 14a. Inside the second housing 14, various electronic components such as an SSD (Solid State Drive), a memory, and an antenna device are housed in addition to the motherboard 26 and the battery device 27 (see FIG. 2). The rear side surface 14c of the second housing 14 is provided with a notched concave portion 14d extending in the left-right direction. A hinge 16 is arranged in the concave portion 14d.

第１筐体１２は、第２筐体１４よりも薄い扁平な箱体である。ディスプレイ１８は、第１筐体１２の正面１２ａに設けられている。第１筐体１２は、背面１２ｂを形成する背面カバー材２８と、正面１２ａを形成する枠状のベゼル部材２９と、を有する。第１筐体１２の前後左右の側面１２ｃは、背面カバー材２８の四周縁部から起立した壁部によって形成されている。ディスプレイ１８は、正面１２ａに臨んで映像を表示するディスプレイ部１８ａと、タッチ操作のためのタッチパネル部１８ｂと、を有する。ディスプレイ部１８ａは、例えば有機ＥＬ（ＯＬＥＤ：Organic Light Emitting Diode）や液晶で構成される。タッチパネル部１８ｂは、省略されてもよい。第１筐体１２は、図１中の下側面１４ｃにヒンジ１６が取り付けられている。 The first housing 12 is a flat box body thinner than the second housing 14. The display 18 is provided on the front surface 12a of the first housing 12. The first housing 12 has a back cover material 28 forming the back surface 12b and a frame-shaped bezel member 29 forming the front surface 12a. The front, rear, left and right side surfaces 12c of the first housing 12 are formed by wall portions that stand up from the four peripheral edges of the back cover material 28. The display 18 has a display unit 18a that faces the front surface 12a and displays an image, and a touch panel unit 18b for touch operation. The display unit 18a is composed of, for example, an organic EL (OLED: Organic Light Emitting Diode) or a liquid crystal display. The touch panel unit 18b may be omitted. In the first housing 12, a hinge 16 is attached to the lower side surface 14c in FIG. 1.

ヒンジ１６は、筐体１２，１４の後側面１２ｃ，１４ｃ間を連結している。本実施形態のヒンジ１６は、左右方向に延在した１本の長尺な構造である。ヒンジ１６は、例えば左右一対設けられてもよい。 The hinge 16 connects the rear side surfaces 12c and 14c of the housings 12 and 14. The hinge 16 of the present embodiment has a long structure extending in the left-right direction. A pair of left and right hinges 16 may be provided, for example.

次に、筐体１２，１４間の電気的な接続構造について説明する。図２は、下カバー材２１を取り外した状態での電子機器１０の底面図である。図３は、図２中のＩＩＩ−ＩＩＩ線に沿う第２筐体１４の模式的な断面斜視図である。図４Ａ、図４Ｂ、図４Ｃは、それぞれ筐体１２，１４間の角度姿勢を０度、６５度、１３０度に設定した状態での電子機器１０の後部を拡大した模式的な側面断面図である。図３では、第２筐体１４の上下を反転して図示すると共に、第１筐体１２の図示を省略している。 Next, the electrical connection structure between the housings 12 and 14 will be described. FIG. 2 is a bottom view of the electronic device 10 with the lower cover material 21 removed. FIG. 3 is a schematic cross-sectional perspective view of the second housing 14 along the line III-III in FIG. 4A, 4B, and 4C are schematic side sectional views of the rear part of the electronic device 10 in a state where the angular postures between the housings 12 and 14 are set to 0 degrees, 65 degrees, and 130 degrees, respectively. be. In FIG. 3, the second housing 14 is shown upside down, and the first housing 12 is not shown.

図２〜図４Ｃに示すように、電子機器１０は、ディスプレイ１８の制御用のプリント基板（ＰＣＢ：printed circuit board）として、ディスプレイ基板３０及びタッチパネル基板３１を第２筐体１４内に収容している。 As shown in FIGS. 2 to 4C, the electronic device 10 accommodates the display board 30 and the touch panel board 31 as a printed circuit board (PCB) for controlling the display 18 in the second housing 14. There is.

ディスプレイ基板３０は、ディスプレイ部１８ａでの映像表示を制御するためのサブボードである。ディスプレイ基板３０はマザーボード２６と接続されており、後述する他のサブボードも同様にマザーボード２６と接続されている。ディスプレイ基板３０は、筐体１２，１４間に亘るフレキシブル基板３２を介してディスプレイ部１８ａと電気的に接続されている。フレキシブル基板３２は、例えば左右に並んだ２枚１組で用いられている。 The display board 30 is a sub-board for controlling the image display on the display unit 18a. The display board 30 is connected to the motherboard 26, and other subboards described later are also connected to the motherboard 26. The display board 30 is electrically connected to the display unit 18a via a flexible board 32 extending between the housings 12 and 14. The flexible substrate 32 is used, for example, in a set of two arranged side by side.

タッチパネル基板３１は、タッチパネル部１８ｂの制御用のサブボードである。タッチパネル基板３１は、タッチパネル部１８ｂで検出されたタッチ操作に基づくアナログ信号を所定のデジタル信号に変換してマザーボード２６に送信する。タッチパネル基板３１は、筐体１２，１４間に亘るフレキシブル基板３３を介してタッチパネル部１８ｂと電気的に接続されている。フレキシブル基板３３は、例えば左右に並んだ２枚１組で用いられている。 The touch panel board 31 is a sub-board for controlling the touch panel unit 18b. The touch panel board 31 converts an analog signal based on the touch operation detected by the touch panel unit 18b into a predetermined digital signal and transmits the analog signal to the motherboard 26. The touch panel substrate 31 is electrically connected to the touch panel portion 18b via a flexible substrate 33 extending between the housings 12 and 14. The flexible substrate 33 is used, for example, in a set of two arranged side by side.

基板３０，３１は、第２筐体１４の後部で上カバー材２０の内面に対して所定のブラケット等を介して固定され、下カバー材２１の内面に近い位置で水平に設置されている（図４Ａ参照）。フレキシブル基板３２，３３は、例えば可撓性を持った絶縁性フィルムを用い、薄く且つ柔軟に形成したフレキシブルプリント基板（ＦＰＣ：Flexible printed circuit）である。 The boards 30 and 31 are fixed to the inner surface of the upper cover material 20 at the rear portion of the second housing 14 via a predetermined bracket or the like, and are horizontally installed at a position close to the inner surface of the lower cover material 21 (. See FIG. 4A). The flexible substrates 32 and 33 are flexible printed circuits (FPCs) formed thinly and flexibly by using, for example, a flexible insulating film.

図４Ａ〜図４Ｃに示すように、第１筐体１２の下側面（後側面）１４ｃには、ヒンジ取付部３４が設けられている。ヒンジ取付部３４は、正面１２ａから垂直に突出した部分である。ヒンジ取付部３４は、背面カバー材２８の下側面１２ｃを形成する部分と、ベゼル部材２９の下縁部から突出した部分とで顎状に形成され、左右方向に延在している。ヒンジ取付部３４は、先端側が第２筐体１４の凹状部１４ｄ内に配置され、凹状部１４ｄ内で回動可能である。フレキシブル基板３２，３３は、ヒンジ取付部３４を貫通するスリット状の開口溝３４ａを通って第１筐体１２外へと引き出された後、凹状部１４ｄを通して第２筐体１４内に引き込まれている。 As shown in FIGS. 4A to 4C, a hinge mounting portion 34 is provided on the lower side surface (rear side surface) 14c of the first housing 12. The hinge mounting portion 34 is a portion that projects vertically from the front surface 12a. The hinge mounting portion 34 is formed in a jaw shape by a portion forming the lower side surface 12c of the back cover material 28 and a portion protruding from the lower edge portion of the bezel member 29, and extends in the left-right direction. The tip side of the hinge mounting portion 34 is arranged in the concave portion 14d of the second housing 14, and is rotatable in the concave portion 14d. The flexible substrates 32 and 33 are pulled out of the first housing 12 through the slit-shaped opening groove 34a penetrating the hinge mounting portion 34, and then pulled into the second housing 14 through the concave portion 14d. There is.

第２筐体１４内において、フレキシブル基板３２（３３）は、先ず、下カバー材２１の内面付近から上カバー材２０の内面付近へと斜め上方に延在しつつ前方に延びている。続いて、フレキシブル基板３２（３３）は、上から下に向かって２回折り返されることでＳ字形状部３６を描いた後、再び下カバー材２１の内面に沿って前方に延びている。 In the second housing 14, the flexible substrate 32 (33) first extends forward from the vicinity of the inner surface of the lower cover material 21 to the vicinity of the inner surface of the upper cover material 20 while extending diagonally upward. Subsequently, the flexible substrate 32 (33) is folded back twice from the top to the bottom to draw an S-shaped portion 36, and then extends forward again along the inner surface of the lower cover material 21.

Ｓ字形状部３６は、フレキシブル基板３２（３３）がディスプレイ１８から基板３０（３１）に向かう延在方向、つまりフレキシブル基板３２（３３）のディスプレイ１８側から基板３０（３１）側までの軌跡上で順に並んで設けられ、互いに逆向きに湾曲した２つの折返し部３６ａ，３６ｂで形成されている。ディスプレイ１８に近い側の折返し部３６ａは、前方に向かう方向から下方且つ後方に向かう方向に略半円を描いて折り返されている。基板３０（３１）に近い側の折返し部３６ｂは、折返し部３６ａの出口で後方に向かう方向から下方且つ前方に向かう方向に略半円を描いて折り返されている。 The S-shaped portion 36 is on a trajectory in which the flexible substrate 32 (33) extends from the display 18 toward the substrate 30 (31), that is, from the display 18 side to the substrate 30 (31) side of the flexible substrate 32 (33). It is formed by two folded portions 36a and 36b which are provided side by side in order and curved in opposite directions. The folded-back portion 36a on the side closer to the display 18 is folded back in a substantially semicircle from the forward direction to the downward and backward directions. The folded-back portion 36b on the side closer to the substrate 30 (31) is folded back in a substantially semicircle from the direction toward the rear to the downward and forward directions at the exit of the folded-back portion 36a.

第２筐体１４は、凹状部１４ｄを形成する前壁が波形板１４ｅで形成されている。波形板１４ｅは、下カバー材２１の内面から上カバー材２０の内面付近へと斜め上方に延在しつつ前方に延びた波形状の板部である。波形板１４ｅは、その上端と上カバー材２０の内面との間にフレキシブル基板３２（３３）が通過する隙間を形成している。波形板１４ｅは、Ｓ字形状部３６の形状に沿った断面形状を有し、フレキシブル基板３２（３３）の移動を阻害することなく、Ｓ字形状部３６の形状を保持することができる。 In the second housing 14, the front wall forming the concave portion 14d is formed of the corrugated plate 14e. The corrugated plate 14e is a corrugated plate portion extending diagonally upward from the inner surface of the lower cover material 21 to the vicinity of the inner surface of the upper cover material 20 and extending forward. The corrugated plate 14e forms a gap through which the flexible substrate 32 (33) passes between the upper end thereof and the inner surface of the upper cover material 20. The corrugated plate 14e has a cross-sectional shape that follows the shape of the S-shaped portion 36, and can maintain the shape of the S-shaped portion 36 without hindering the movement of the flexible substrate 32 (33).

フレキシブル基板３２（３３）は、折返し部３６ａでは円弧の外周側に位置し、折返し部３６ｂでは円弧の内周側に位置する表面３８に、基板３０（３１）に対する接続部３２ａ（３３ａ）を有する。つまり表面３８は、接続部３２ａ（３３ａ）が設けられた部分では上面である。接続部３２ａ（３３ａ）は、基板３０（３１）の下面に設けられた被接続部３０ａ（３１ａ）に接続されるコネクタ端子である。接続部３２ａ（３３ａ）は、表面３８から上向きに設置されている。図２及び図３中の参照符号３２ｂ（３３ｂ）は、フレキシブル基板３２（３３）に接続部３２ａ（３３ａ）を固定するための支持板である。 The flexible substrate 32 (33) has a connection portion 32a (33a) to the substrate 30 (31) on the surface 38 located on the outer peripheral side of the arc in the folded portion 36a and located on the inner peripheral side of the arc in the folded portion 36b. .. That is, the surface 38 is the upper surface in the portion where the connecting portion 32a (33a) is provided. The connecting portion 32a (33a) is a connector terminal connected to the connected portion 30a (31a) provided on the lower surface of the substrate 30 (31). The connecting portion 32a (33a) is installed facing upward from the surface 38. Reference numeral 32b (33b) in FIGS. 2 and 3 is a support plate for fixing the connection portion 32a (33a) to the flexible substrate 32 (33).

図２〜図４Ｃに示すように、第２筐体１４内には、ホルダ部材４０が設けられている。ホルダ部材４０は、アルミニウム等で形成された金属棒体であり、矩形の断面形状を有する。ホルダ部材４０は、ある程度の剛性が確保できれば樹脂製でもよい。ホルダ部材４０は、上カバー材２０の内面側にねじ４０ａで固定され、第２筐体１４と固定されている。ホルダ部材４０は、フレキシブル基板３２（３３）の折返し部３６ｂの内側に内包される位置に設けられている。ホルダ部材４０は、例えば２枚１組のフレキシブル基板３２に対して１本が横切るように設置され、２枚１組のフレキシブル基板３３に対して１本が横切るように設置されている（図２参照）。 As shown in FIGS. 2 to 4C, a holder member 40 is provided in the second housing 14. The holder member 40 is a metal rod body made of aluminum or the like, and has a rectangular cross-sectional shape. The holder member 40 may be made of resin as long as a certain degree of rigidity can be secured. The holder member 40 is fixed to the inner surface side of the upper cover material 20 with screws 40a, and is fixed to the second housing 14. The holder member 40 is provided at a position included inside the folded-back portion 36b of the flexible substrate 32 (33). For example, the holder member 40 is installed so as to cross one set of two flexible boards 32, and one holder member 40 is installed so as to cross one set of two flexible boards 33 (FIG. 2). reference).

ホルダ部材４０は、その下面４０ｂが両面テープ等の粘着剤４２を用いてフレキシブル基板３２（３３）の表面３８と固定されている。フレキシブル基板３２（３３）は、内部に金属線が配線されているため、弾性変形されたＳ字形状部３６では、常に各折返し部３６ａ，３６ｂが開いてしまう方向の反発力を発生している。つまりフレキシブル基板３２（３３）は、折返し部３６ｂから接続部３２ａ（３３ａ）までの前後方向に沿った部分が折返し部３６ｂを中心として、図４Ａ〜図４Ｃ中で下側に首振りする方向の反発力を生じている。ホルダ部材４０は、この部分と固定されることで、この首振り力を押さえ、接続部３２ａ（３３ａ）が被接続部３０ａ（３１ａ）から脱落することを防止している。 The lower surface 40b of the holder member 40 is fixed to the surface 38 of the flexible substrate 32 (33) using an adhesive 42 such as double-sided tape. Since the flexible substrate 32 (33) has a metal wire wired inside, the elastically deformed S-shaped portion 36 always generates a repulsive force in the direction in which the folded portions 36a and 36b are opened. .. That is, in the flexible substrate 32 (33), the portion along the front-rear direction from the folded-back portion 36b to the connecting portion 32a (33a) is in the direction of swinging downward in FIGS. 4A to 4C with the folded-back portion 36b as the center. Repulsive force is generated. By fixing the holder member 40 to this portion, the swinging force is suppressed and the connecting portion 32a (33a) is prevented from falling off from the connected portion 30a (31a).

次に、本実施形態の電子機器１０での筐体１２，１４間の回動動作と作用効果を説明する。 Next, the rotation operation and the action effect between the housings 12 and 14 in the electronic device 10 of the present embodiment will be described.

図４Ａに示す０度姿勢では、電子機器１０は、第２筐体１４の上面１４ａに第１筐体１２の正面１２ａが対向した状態で互いに積層された収納形態となっている。この状態では、フレキシブル基板３２（３３）は、下向きに配置されたヒンジ取付部３４の開口溝３４ａによって後方に引き寄せられ、Ｓ字形状部３６が波形板１４ｅに沿って配置されている。図４Ａ〜図４Ｃ中の参照符号Ｃは、ヒンジ１６による筐体１２，１４間の回動中心を示している。また、図４Ａ〜図４Ｃ中の参照符号４３は、第２筐体１４の下面１４ｂに取り付けられたゴム脚である。 In the 0-degree posture shown in FIG. 4A, the electronic devices 10 are stacked with each other in a state where the front surface 12a of the first housing 12 faces the upper surface 14a of the second housing 14. In this state, the flexible substrate 32 (33) is pulled backward by the opening groove 34a of the hinge mounting portion 34 arranged downward, and the S-shaped portion 36 is arranged along the corrugated plate 14e. Reference numeral C in FIGS. 4A to 4C indicates a center of rotation between the housings 12 and 14 by the hinge 16. Further, reference numeral 43 in FIGS. 4A to 4C is a rubber leg attached to the lower surface 14b of the second housing 14.

電子機器１０を使用する際には、第１筐体１２を開いて例えば９０度〜１３０度の間の角度姿勢に設定する。図４Ａに示す０度姿勢から第１筐体１２が開かれると、例えば図４Ｂに示す６５度姿勢までの間は、ヒンジ取付部３４の開口溝３４ａの出口の前後位置が次第に前方に移動し、フレキシブル基板３２（３３）が前方に押し込まれる。このため、フレキシブル基板３２（３３）は、第２筐体１４内でＳ字形状部３６が変形しつつ、折返し部３６ａが前方に移動する（図４Ｂ参照）。これによりフレキシブル基板３２（３３）は、筐体１２，１４間の回動動作時にディスプレイ１８と基板３０（３１）との相対距離が変化した場合であっても、この変化に柔軟に追従でき、断線等の不具合を生じることが抑制される。 When using the electronic device 10, the first housing 12 is opened and set to an angular posture between, for example, 90 degrees and 130 degrees. When the first housing 12 is opened from the 0-degree posture shown in FIG. 4A, the front-rear position of the exit of the opening groove 34a of the hinge mounting portion 34 gradually moves forward from the 0-degree posture shown in FIG. 4B to the 65-degree posture shown in FIG. 4B, for example. , The flexible substrate 32 (33) is pushed forward. Therefore, in the flexible substrate 32 (33), the folded-back portion 36a moves forward while the S-shaped portion 36 is deformed in the second housing 14 (see FIG. 4B). As a result, the flexible substrate 32 (33) can flexibly follow the change even when the relative distance between the display 18 and the substrate 30 (31) changes during the rotational operation between the housings 12 and 14. It is possible to prevent problems such as disconnection from occurring.

図４Ｂに示す６５度姿勢から図４Ｃに示す１３０度姿勢までの間は、ヒンジ取付部３４の開口溝３４ａの出口の前後位置がほとんど変化せず、フレキシブル基板３２（３３）の形状もほとんど変化しない。このため、この間の角度変化時にもフレキシブル基板３２（３３）が不具合を生じることが抑制されている。なお、図４Ｃに示す１３０度姿勢から図４Ａに示す０度姿勢までの回動時の動作は、上記した開き動作と逆に動作するだけであるため、説明は省略する。 From the 65-degree posture shown in FIG. 4B to the 130-degree posture shown in FIG. 4C, the front-rear position of the outlet of the opening groove 34a of the hinge mounting portion 34 hardly changes, and the shape of the flexible substrate 32 (33) also hardly changes. do not do. Therefore, it is suppressed that the flexible substrate 32 (33) causes a defect even when the angle changes during this period. Since the operation during rotation from the 130-degree posture shown in FIG. 4C to the 0-degree posture shown in FIG. 4A only operates in the opposite direction to the above-mentioned opening operation, the description thereof will be omitted.

以上のように、本実施形態の電子機器１０は、第１筐体１２に設けられたディスプレイ１８と、第２筐体１４に設けられたプリント基板である基板３０（３１）と、ディスプレイ１８と基板３０（３１）とを接続するフレキシブル基板３２（３３）と、を備える。第２筐体１４内において、フレキシブル基板３２（３３）は、ディスプレイ１８から基板３０（３１）に向かう延在方向で順に並んで設けられ、互いに逆向きに湾曲した第１及び第２の折返し部３６ａ，３６ｂを有する。そして、フレキシブル基板３２（３３）は、折返し部３６ａでは外周側に位置し、折返し部３６ｂでは内周側に位置する表面３８に、基板３０（３１）に対する接続部３２ａ（３３ａ）を有する。 As described above, the electronic device 10 of the present embodiment includes the display 18 provided in the first housing 12, the substrate 30 (31) which is the printed circuit board provided in the second housing 14, and the display 18. A flexible substrate 32 (33) for connecting to the substrate 30 (31) is provided. In the second housing 14, the flexible substrates 32 (33) are provided side by side in the extending direction from the display 18 to the substrate 30 (31), and the first and second folded portions curved in opposite directions to each other. It has 36a and 36b. The flexible substrate 32 (33) has a connection portion 32a (33a) to the substrate 30 (31) on the surface 38 located on the outer peripheral side of the folded portion 36a and located on the inner peripheral side of the folded portion 36b.

このように当該電子機器１０は、ディスプレイ１８と接続される基板３０（３１）をディスプレイ１８側の第１筐体１２ではなく、第２筐体１４に搭載している。このため、第１筐体１２は、可及的に小型薄型化でき、ベゼル部材２９を幅狭に構成できる。この際、電子機器１０は、２つの筐体１２，１４間に亘るフレキシブル基板３２（３３）が基板３０（３１）側の第２筐体１４内で２つの折返し部３６ａ，３６ｂによってＳ字形状部３６を形成している。これによりフレキシブル基板３２（３３）は、筐体１２，１４間の回動動作時のディスプレイ１８と基板３０（３１）との間の相対距離の変化に柔軟に追従できる。 As described above, the electronic device 10 mounts the substrate 30 (31) connected to the display 18 not in the first housing 12 on the display 18 side but in the second housing 14. Therefore, the first housing 12 can be made as small and thin as possible, and the bezel member 29 can be configured to be narrow. At this time, in the electronic device 10, the flexible substrate 32 (33) extending between the two housings 12 and 14 has an S-shape in the second housing 14 on the substrate 30 (31) side due to the two folded portions 36a and 36b. The portion 36 is formed. As a result, the flexible substrate 32 (33) can flexibly follow the change in the relative distance between the display 18 and the substrate 30 (31) during the rotational operation between the housings 12 and 14.

さらに基板３０（３１）は、２つの折返し部３６ａ，３６ｂのうち、基板３０（３１）に近い側の折返し部３６ｂの内周側に位置する表面３８に接続部３２ａ（３３ａ）を有する。このため、基板３０（３１）は、第２筐体１４の厚み方向（上下方向）でＳ字形状部３６の内周側となる位置、つまりフレキシブル基板３２（３３）に形成されたＳ字形状部３６の高さ寸法の範囲に少なくとも一部を収めることができる。その結果、基板３０（３１）が、フレキシブル基板３２（３３）の高さ寸法を大きく越えて上下方向に突出し、第２筐体１４の薄型化を阻害することが抑制される。しかも基板３０（３１）は、これと近い側の折返し部３６ｂの円弧の内周を向いて配置されるため、基板３０（３１）は、第２筐体１４内での前後方向位置をＳ字形状部３６（折返し部３６ｂ）に可及的に近づけて配置することができる。これにより第２筐体１４の前後方向寸法が基板３０（３１）によって増大することも抑制できる。従って、電子機器１０は、各筐体１２，１４の小型薄型化が可能となり、外観品質が向上する。 Further, the substrate 30 (31) has a connection portion 32a (33a) on the surface 38 located on the inner peripheral side of the folded portion 36b on the side closer to the substrate 30 (31) among the two folded portions 36a and 36b. Therefore, the substrate 30 (31) has an S-shape formed on the flexible substrate 32 (33) at a position on the inner peripheral side of the S-shaped portion 36 in the thickness direction (vertical direction) of the second housing 14. At least a part of the height dimension of the portion 36 can be accommodated. As a result, it is suppressed that the substrate 30 (31) greatly exceeds the height dimension of the flexible substrate 32 (33) and protrudes in the vertical direction, which hinders the thinning of the second housing 14. Moreover, since the substrate 30 (31) is arranged so as to face the inner circumference of the arc of the folded-back portion 36b on the side close to the substrate 30 (31), the substrate 30 (31) has an S-shaped position in the front-rear direction in the second housing 14. It can be arranged as close as possible to the shape portion 36 (folded portion 36b). As a result, it is possible to prevent the dimension in the front-rear direction of the second housing 14 from being increased by the substrate 30 (31). Therefore, in the electronic device 10, each of the housings 12 and 14 can be made smaller and thinner, and the appearance quality is improved.

当該電子機器１０は、第２筐体１４に相対的に固定され、折返し部３６ｂと接続部３２ａ（３３ａ）との間でフレキシブル基板３２（３３）を保持するホルダ部材４０を備える。これによりフレキシブル基板３２（３３）の折返し部３６ａ，３６ｂによって生じる反発力をホルダ部材４０で抑えることができ、フレキシブル基板３２（３３）の位置ずれや接続部３２ａ（３３ａ）の被接続部３０ａ（３１ａ）からの脱落を抑制できる。また、ホルダ部材４０は、筐体１２，１４間の回動時のフレキシブル基板３２（３３）の移動もサポートするため、接続部３２ａ（３３ａ）の脱落を一層抑制できる。 The electronic device 10 is relatively fixed to the second housing 14, and includes a holder member 40 that holds the flexible substrate 32 (33) between the folded-back portion 36b and the connecting portion 32a (33a). As a result, the repulsive force generated by the folded portions 36a and 36b of the flexible substrate 32 (33) can be suppressed by the holder member 40, and the misalignment of the flexible substrate 32 (33) and the connected portion 30a of the connecting portion 32a (33a) ( It is possible to suppress the dropout from 31a). Further, since the holder member 40 also supports the movement of the flexible substrate 32 (33) when rotating between the housings 12 and 14, it is possible to further suppress the disconnection of the connecting portion 32a (33a).

なお、ホルダ部材４０は、接続部３２ａ（３３ａ）が設置される表面３８の裏面に設けられてもよいが、この場合はフレキシブル基板３２（３３）の下側にホルダ部材４０の高さ分のスペースが必要となり、第２筐体１４の薄型化の障壁となってしまう。そこで、本実施形態では、ホルダ部材４０を表面３８側に設置することで、ホルダ部材４０が折返し部３６ｂの内周側のデッドスペースに収容できる。その結果、ホルダ部材４０が、第２筐体１４の薄型化を阻害することが抑制されている。また、ホルダ部材４０は、折返し部３６ｂと接続部３２ａ（３３ａ）との間に設けられることで、フレキシブル基板３２（３３）の伸縮性を阻害することもない。ホルダ部材４０の形状やフレキシブル基板３２（３３）の保持構造は変更してもよい。ホルダ部材４０は、省略してもよい。 The holder member 40 may be provided on the back surface of the front surface 38 on which the connection portion 32a (33a) is installed. In this case, the holder member 40 may be provided on the lower side of the flexible substrate 32 (33) by the height of the holder member 40. Space is required, which becomes a barrier to thinning the second housing 14. Therefore, in the present embodiment, by installing the holder member 40 on the surface 38 side, the holder member 40 can be accommodated in the dead space on the inner peripheral side of the folded-back portion 36b. As a result, it is suppressed that the holder member 40 hinders the thinning of the second housing 14. Further, since the holder member 40 is provided between the folded-back portion 36b and the connecting portion 32a (33a), the elasticity of the flexible substrate 32 (33) is not hindered. The shape of the holder member 40 and the holding structure of the flexible substrate 32 (33) may be changed. The holder member 40 may be omitted.

当該電子機器１０は、基板３０（３１）の被接続部３０ａ（３１ａ）が下向きに設けられ、フレキシブル基板３２（３３）の接続部３２ａ（３３ａ）が上向きに設けられている。これにより第２筐体１４では、マザーボード２６等と共に基板３０（３１）等も上カバー材２０側に固定される。このため、第２筐体１４は、下カバー材２１を取り外すことで容易に内部のメンテナンスが可能である。この際、第２筐体１４では、接続部３２ａ（３３ａ）が上向きであることで、下カバー材２１を取り外すだけで引っ張るだけで、接続部３２ａ（３３ａ）を被接続部３０ａ（３１ａ）から容易に取り外すことができる。従って、電子機器１０は、基板３０（３１）が第２筐体１４に搭載されているにもかかわらずディスプレイ１８の交換も容易である。 In the electronic device 10, the connected portion 30a (31a) of the substrate 30 (31) is provided downward, and the connecting portion 32a (33a) of the flexible substrate 32 (33) is provided upward. As a result, in the second housing 14, the substrate 30 (31) and the like are fixed to the upper cover material 20 side together with the motherboard 26 and the like. Therefore, the internal maintenance of the second housing 14 can be easily performed by removing the lower cover material 21. At this time, in the second housing 14, since the connecting portion 32a (33a) faces upward, the connecting portion 32a (33a) can be pulled from the connected portion 30a (31a) simply by removing the lower cover material 21 and pulling it. Can be easily removed. Therefore, in the electronic device 10, the display 18 can be easily replaced even though the substrate 30 (31) is mounted on the second housing 14.

図５は、第２の実施形態の電子機器１０Ａを上から見下ろした模式的な平面図である。第２の実施形態に係る電子機器１０Ａにおいて、上記第１の実施形態に係る電子機器１０と同一又は同様な機能及び効果を奏する要素には同一の参照符号を付し、詳細な説明を省略する。 FIG. 5 is a schematic plan view of the electronic device 10A of the second embodiment as viewed from above. In the electronic device 10A according to the second embodiment, the same reference numerals are given to elements having the same or similar functions and effects as the electronic device 10 according to the first embodiment, and detailed description thereof will be omitted. ..

図５に示すように、本実施形態の電子機器１０Ａは、第１筐体１２の正面１２ａに第１ディスプレイ４４を備え、さらに背面１２ｂにも第２ディスプレイ４５を備える（図７及び図８も参照）。第１ディスプレイ４４は、上記第１の実施形態のディスプレイ１８と同様な構成であり、正面１２ａに臨んで映像を表示するディスプレイ部１８ａ及びタッチパネル部１８ｂを備える。第２ディスプレイ４５は、ディスプレイ部１８ａ及びタッチパネル部４５ｂと同様に構成され、背面１２ｂに臨んで映像を表示するディスプレイ部４５ａ及びタッチパネル部４５ｂを備える。このように、電子機器１０Ａは、第１筐体１２の正面１２ａ及び背面１２ｂの両面にディスプレイ４４，４５を備えたデュアルディスプレイ構造である。 As shown in FIG. 5, the electronic device 10A of the present embodiment includes a first display 44 on the front surface 12a of the first housing 12, and further includes a second display 45 on the back surface 12b (also FIGS. 7 and 8). reference). The first display 44 has the same configuration as the display 18 of the first embodiment, and includes a display unit 18a and a touch panel unit 18b that face the front surface 12a and display an image. The second display 45 is configured in the same manner as the display unit 18a and the touch panel unit 45b, and includes a display unit 45a and a touch panel unit 45b that face the back surface 12b and display an image. As described above, the electronic device 10A has a dual display structure in which the displays 44 and 45 are provided on both sides of the front surface 12a and the back surface 12b of the first housing 12.

次に、電子機器１０Ａの筐体１２，１４間の電気的な接続構造について説明する図６は、図５に示す電子機器１０Ａの下カバー材２１を取り外した状態での底面図である。図７は、図６中のＶＩＩ−ＶＩＩ線に沿う第２筐体１４の模式的な断面斜視図である。図８は、筐体１２，１４間の角度姿勢を６５度に設定した状態での電子機器１０Ａの後部を拡大した模式的な側面断面図である。図７では、電子機器１０Ａの上下を反転して図示すると共に、第１筐体１２のタッチパネル部１８ｂ等の図示を省略している。 Next, FIG. 6 illustrating the electrical connection structure between the housings 12 and 14 of the electronic device 10A is a bottom view of the electronic device 10A shown in FIG. 5 with the lower cover material 21 removed. FIG. 7 is a schematic cross-sectional perspective view of the second housing 14 along the line VII-VII in FIG. FIG. 8 is a schematic side sectional view of the rear portion of the electronic device 10A in a state where the angular posture between the housings 12 and 14 is set to 65 degrees. In FIG. 7, the electronic device 10A is shown upside down, and the touch panel portion 18b and the like of the first housing 12 are not shown.

図６〜図８に示すように、電子機器１０Ａは、第１ディスプレイ４４の制御用のプリント基板（ＰＣＢ）としてディスプレイ基板３０及びタッチパネル基板３１を有し、第２ディスプレイ４５の制御用のプリント基板（ＰＣＢ）としてディスプレイ基板４６及びタッチパネル基板４７を有する。これら基板３０，３１，４６，４７は、全て第２筐体１４内に収容されている。 As shown in FIGS. 6 to 8, the electronic device 10A has a display board 30 and a touch panel board 31 as a printed circuit board (PCB) for controlling the first display 44, and is a printed circuit board for controlling the second display 45. It has a display board 46 and a touch panel board 47 as (PCB). All of these substrates 30, 31, 46, 47 are housed in the second housing 14.

ディスプレイ基板４６は、第１ディスプレイ４４のディスプレイ基板３０と左右に並んで配置されている。ディスプレイ基板４６は、第２ディスプレイ４５のディスプレイ部４５ａでの映像表示を制御するためのサブボードである。ディスプレイ基板４６は、第１ディスプレイ４４のディスプレイ部１８ａと同様、筐体１２，１４間に亘るフレキシブル基板３２を介してディスプレイ部４５ａと電気的に接続されている。ディスプレイ部４５ａから延びたフレキシブル基板３２についても、第２筐体１４内でＳ字形状部３６が形成された後、その表面３８に設けられた接続部３２ａがディスプレイ基板４６の被接続部３０ａと接続される。 The display board 46 is arranged side by side with the display board 30 of the first display 44. The display board 46 is a sub-board for controlling the image display on the display unit 45a of the second display 45. Similar to the display unit 18a of the first display 44, the display board 46 is electrically connected to the display unit 45a via the flexible substrate 32 extending between the housings 12 and 14. Regarding the flexible substrate 32 extending from the display portion 45a, after the S-shaped portion 36 is formed in the second housing 14, the connecting portion 32a provided on the surface 38 thereof is connected to the connected portion 30a of the display substrate 46. Be connected.

タッチパネル基板４７は、第１ディスプレイ４４のタッチパネル基板３１と前後方向に並んで配置されている。タッチパネル基板４７は、第２ディスプレイ４５のタッチパネル部４５ｂの制御用のサブボードである。タッチパネル基板４７は、タッチパネル部４５ｂで検出されたタッチ操作に基づくアナログ信号を所定のデジタル信号に変換してマザーボード２６に送信する。タッチパネル基板４７は、筐体１２，１４間に亘るフレキシブル基板４８を介してタッチパネル部４５ｂと電気的に接続されている。フレキシブル基板４８は、フレキシブル基板３３と同様、例えば左右の２枚１組で用いられている。 The touch panel board 47 is arranged side by side with the touch panel board 31 of the first display 44 in the front-rear direction. The touch panel board 47 is a sub-board for controlling the touch panel unit 45b of the second display 45. The touch panel board 47 converts an analog signal based on the touch operation detected by the touch panel unit 45b into a predetermined digital signal and transmits the analog signal to the motherboard 26. The touch panel substrate 47 is electrically connected to the touch panel portion 45b via a flexible substrate 48 extending between the housings 12 and 14. Like the flexible substrate 33, the flexible substrate 48 is used as a set of two left and right, for example.

基板４６，４７についても、他の基板３０，３１と同様、第２筐体１４の後部で上カバー材２０の内面に対して所定のブラケット等を介して固定され、下カバー材２１の内面に近い位置で水平に設置されている（図８参照）。フレキシブル基板４８は、フレキシブル基板３３と同様、絶縁性フィルムを材料に使った薄く且つ柔軟なプリント基板（ＦＰＣ）である。 Similar to the other boards 30 and 31, the boards 46 and 47 are also fixed to the inner surface of the upper cover material 20 at the rear portion of the second housing 14 via a predetermined bracket or the like, and are fixed to the inner surface of the lower cover material 21. It is installed horizontally at a close position (see FIG. 8). Like the flexible substrate 33, the flexible substrate 48 is a thin and flexible printed circuit board (FPC) using an insulating film as a material.

図８に示すように、前後に並んで配置された基板３１，４７に接続されるフレキシブル基板３３，４８は、互いに重ねて接着固定された状態で、ヒンジ取付部３４の開口溝３４ａを通って第１筐体１２外へと引き出された後、第２筐体１４内に引き込まれている。第２筐体１４内において、フレキシブル基板３３，４８は、互いに積層された状態のまま波形板１４ｅに沿って延在し、折返し部３６ａ，３６ｂからなるＳ字形状部３６を形成している。 As shown in FIG. 8, the flexible boards 33 and 48 connected to the boards 31 and 47 arranged side by side in the front-rear direction pass through the opening groove 34a of the hinge mounting portion 34 in a state of being overlapped and adhesively fixed to each other. After being pulled out of the first housing 12, it is pulled into the second housing 14. In the second housing 14, the flexible substrates 33 and 48 extend along the corrugated plate 14e in a state of being laminated with each other, and form an S-shaped portion 36 composed of folded portions 36a and 36b.

このように積層されたフレキシブル基板３３，４８のうち、フレキシブル基板３３が折返し部３６ｂから近位側のタッチパネル基板３１に接続され、フレキシブル基板４８が折返し部３６ｂから遠位側のタッチパネル基板４７に接続される。そこで、図７及び図８に示すように、フレキシブル基板３３，４８は、折返し部３６ａではフレキシブル基板３３が円弧の外周側に配置され、フレキシブル基板４８が円弧の内周側に配置されるように積層されている。これによりフレキシブル基板３３，４８は、折返し部３６ｂではフレキシブル基板３３が円弧の内周側に配置され、フレキシブル基板４８が円弧の外周側に配置される。 Of the flexible substrates 33 and 48 laminated in this way, the flexible substrate 33 is connected to the touch panel substrate 31 on the proximal side from the folded portion 36b, and the flexible substrate 48 is connected to the touch panel substrate 47 on the distal side from the folded portion 36b. Will be done. Therefore, as shown in FIGS. 7 and 8, in the flexible substrate 33, 48, the flexible substrate 33 is arranged on the outer peripheral side of the arc in the folded portion 36a, and the flexible substrate 48 is arranged on the inner peripheral side of the arc. It is laminated. As a result, in the flexible substrates 33 and 48, the flexible substrate 33 is arranged on the inner peripheral side of the arc at the folded portion 36b, and the flexible substrate 48 is arranged on the outer peripheral side of the arc.

従って、フレキシブル基板３３，４８は、Ｓ字形状部３６の基板３１，４７側の部分では、後側のタッチパネル基板３１に接続されるフレキシブル基板３３が上側に積層され、前側のタッチパネル基板４７に接続されるフレキシブル基板４８が下側に積層されている。 Therefore, in the flexible substrates 33 and 48, the flexible substrate 33 connected to the rear touch panel substrate 31 is laminated on the upper side and connected to the front touch panel substrate 47 at the portion of the S-shaped portion 36 on the substrate 31, 47 side. The flexible substrate 48 to be formed is laminated on the lower side.

一方のフレキシブル基板３３は、上記第１の実施形態の場合と同様、上向きの表面３８に接続部３３ａを有し、接続部３３ａがタッチパネル基板３１の被接続部３１ａに接続される。 On the other hand, the flexible substrate 33 has a connecting portion 33a on the upward surface 38 as in the case of the first embodiment, and the connecting portion 33a is connected to the connected portion 31a of the touch panel substrate 31.

他方のフレキシブル基板４８は、一方のフレキシブル基板３３よりも長尺である。フレキシブル基板４８は、その先端側にフレキシブル基板３３が接続されるタッチパネル基板３１を越えて前方に延びた延出部４８ａを有する。フレキシブル基板４８は、延出部４８ａの表面５０に設けた上向きの接続部４８ｂがタッチパネル基板４７の下面に設けた下向きの被接続部４７ａに接続される。図６及び図７中の参照符号４８ｃは、フレキシブル基板４８に接続部４８ｂを固定するための支持板である。図示はしていないが、フレキシブル基板３３についても支持板３３ｂが設けられている。 The other flexible substrate 48 is longer than the one flexible substrate 33. The flexible substrate 48 has an extending portion 48a extending forward beyond the touch panel substrate 31 to which the flexible substrate 33 is connected on the tip end side thereof. In the flexible substrate 48, the upward connecting portion 48b provided on the surface 50 of the extending portion 48a is connected to the downward connected portion 47a provided on the lower surface of the touch panel substrate 47. Reference numeral 48c in FIGS. 6 and 7 is a support plate for fixing the connection portion 48b to the flexible substrate 48. Although not shown, the flexible substrate 33 is also provided with a support plate 33b.

電子機器１０Ａにおいてもホルダ部材４０を備えることが好ましい。積層されたフレキシブル基板３３，４８においても、ホルダ部材４０は、折返し部３６ｂの内側に内包される位置に設けられるとよい（図７及び図８参照）。このホルダ部材４０は、その下面４０ｂが粘着剤４２を用いて上層のフレキシブル基板３３の表面３８と固定されている。下層のフレキシブル基板４８は、上層のフレキシブル基板３３と固定されている。つまり下層のフレキシブル基板４８は、上層のフレキシブル基板３３を介してホルダ部材４０に保持されている。 It is preferable that the electronic device 10A also includes the holder member 40. Even in the laminated flexible substrates 33 and 48, the holder member 40 may be provided at a position included inside the folded-back portion 36b (see FIGS. 7 and 8). The lower surface 40b of the holder member 40 is fixed to the surface 38 of the upper flexible substrate 33 by using the adhesive 42. The lower flexible substrate 48 is fixed to the upper flexible substrate 33. That is, the lower flexible substrate 48 is held by the holder member 40 via the upper flexible substrate 33.

本実施形態の電子機器１０Ａは、タッチパネル基板３１，４７と同様に、ディスプレイ基板３０，４６を前後に並べて配置した構成としてもよい（図８中にかっこ書きで示した「ディスプレイ基板３０，４６」、「フレキシブル基板３２，３２」、「接続部３２ａ，３２ａ」、「被接続部３０ａ，３０ａ」参照）。この場合にも、第１ディスプレイ４４のディスプレイ部１８ａに接続されたフレキシブル基板３２と、第２ディスプレイ４５のディスプレイ部４５ａに接続されたフレキシブル基板３２とは積層される。この構成では、ディスプレイ部１８ａに接続されたフレキシブル基板３２は、折返し部３６ｂから近位側のディスプレイ基板３０に接続される。ディスプレイ部４５ａに接続されたフレキシブル基板３２は、ディスプレイ基板３０を越えて前方に突出した延出部４８ａが折返し部３６ｂから遠位側のディスプレイ基板４６に接続される。なお、ディスプレイ基板３０，４６のみが前後並びで配置され、タッチパネル基板３１，４７が左右並びで配置された構成としてもよい。 Similar to the touch panel boards 31 and 47, the electronic device 10A of the present embodiment may have a configuration in which the display boards 30 and 46 are arranged side by side in front and back (“display boards 30 and 46” shown in parentheses in FIG. 8”. , "Flexible substrates 32, 32", "Connecting portions 32a, 32a", "Connected portions 30a, 30a"). Also in this case, the flexible substrate 32 connected to the display unit 18a of the first display 44 and the flexible substrate 32 connected to the display unit 45a of the second display 45 are laminated. In this configuration, the flexible substrate 32 connected to the display portion 18a is connected to the display substrate 30 on the proximal side from the folded portion 36b. In the flexible substrate 32 connected to the display portion 45a, the extending portion 48a projecting forward beyond the display substrate 30 is connected to the display substrate 46 on the distal side from the folded portion 36b. It should be noted that only the display boards 30 and 46 may be arranged side by side, and the touch panel boards 31 and 47 may be arranged side by side.

当該電子機器１０Ａでは、２枚のディスプレイ４４，４５を備える。このため、電子機器１０Ａは、第２筐体１４内に各ディスプレイ４４，４５に対するディスプレイ基板３０，４６及びタッチパネル基板３１，４７を備える。このため、電子機器１０Ａでは、例えばタッチパネル基板３１，４７を前後並びで配置し、筐体１２，１４の左右方向寸法の増大している。また、前後に並んだタッチパネル基板３１，４７に接続されるフレキシブル基板３３，４８は、それぞれの同一方向（上方）を向いた表面３８，５０に接続部３３ａ，４８ｂを設けている。これにより電子機器１０Ａでは、タッチパネル基板３１，４７の影響で第２筐体１４の薄型化が阻害されない。また電子機器１０Ａでは、タッチパネル基板３１，４７を前後に密接して並べることができ、第２筐体１４の前後寸法に対する影響も最小限となっている。 The electronic device 10A includes two displays 44 and 45. Therefore, the electronic device 10A includes the display boards 30, 46 and the touch panel boards 31, 47 for the displays 44, 45, respectively, in the second housing 14. Therefore, in the electronic device 10A, for example, the touch panel boards 31 and 47 are arranged side by side, and the dimensions of the housings 12 and 14 in the left-right direction are increased. Further, the flexible boards 33 and 48 connected to the touch panel boards 31 and 47 arranged in the front-rear direction are provided with connection portions 33a and 48b on the surfaces 38 and 50 facing the same direction (upward), respectively. As a result, in the electronic device 10A, the thinning of the second housing 14 is not hindered by the influence of the touch panel substrates 31 and 47. Further, in the electronic device 10A, the touch panel substrates 31 and 47 can be arranged closely in the front-rear direction, and the influence on the front-rear dimension of the second housing 14 is minimized.

なお、本発明は、上記した実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲で自由に変更できることは勿論である。 It should be noted that the present invention is not limited to the above-described embodiment, and of course, the present invention can be freely changed without departing from the gist of the present invention.

上記では、第２筐体１４内に形成されるＳ字形状部３６が上から下に向かう姿勢で配置された構成を例示したが、Ｓ字形状部３６は下から上に向かう姿勢で配置されてもよい。この場合、例えばタッチパネル基板３１では、被接続部３１ａが上向きに設置され、フレキシブル基板３３の接続部３３ａが下向きに設置されればよい。 In the above, the configuration in which the S-shaped portion 36 formed in the second housing 14 is arranged in a posture from top to bottom is illustrated, but the S-shaped portion 36 is arranged in a posture from bottom to top. You may. In this case, for example, in the touch panel substrate 31, the connected portion 31a may be installed facing upward, and the connecting portion 33a of the flexible substrate 33 may be installed facing downward.

１０，１０Ａ電子機器
１２第１筐体
１４第２筐体
１６ヒンジ
１８ディスプレイ
１８ａ，４５ａディスプレイ部
１８ｂ，４５ｂタッチパネル部
２４キーボード
３０，４６ディスプレイ基板
３０ａ，３１ａ，４７ａ被接続部
３１，４７タッチパネル基板
３２，３３，４８フレキシブル基板
３２ａ，３３ａ，４８ｂ接続部
３６Ｓ字形状部
３６ａ，３６ｂ折返し部
４０ホルダ部材
４４第１ディスプレイ
４５第２ディスプレイ
４８ａ延出部
10, 10A Electronic equipment 12 1st housing 14 2nd housing 16 Hinge 18 Display 18a, 45a Display unit 18b, 45b Touch panel unit 24 Keyboard 30, 46 Display board 30a, 31a, 47a Connected unit 31, 47 Touch panel board 32 , 33, 48 Flexible substrate 32a, 33a, 48b Connection part 36 S-shaped part 36a, 36b Folded part 40 Holder member 44 1st display 45 2nd display 48a Extension part

Claims

It ’s an electronic device,
With the first housing
The second housing, which is rotatably connected to the first housing,
The display provided in the first housing and
The printed circuit board provided in the second housing and
A flexible board that connects the display and the printed circuit board,
Equipped with
In the second housing, the flexible substrate has first and second folded portions that are arranged in order and curved in opposite directions to each other.
The flexible substrate is an electronic device having a connection portion to the printed circuit board on a surface located on the outer peripheral side of the first folded portion and located on the inner peripheral side of the second folded portion.

The electronic device according to claim 1.
Further, an electronic device comprising a holder member that is relatively fixed to the second housing and holds the flexible substrate between the second folded-back portion and the connecting portion.

The electronic device according to claim 1 or 2.
The second housing has a keyboard on the upper surface, and the first housing is connected to the rear side surface via a hinge.
The flexible substrate is inserted forward into the second housing through an opening formed in the rear side surface of the second housing, and then folded downward and rearward in an arc shape. The first folded portion is formed, and the second folded portion is formed by further folding downward and forward in an arc shape.
The printed circuit board is relatively fixed to the upper cover material forming the upper surface of the second housing, and the connected portion to which the connecting portion of the flexible substrate is connected is provided downward.
The flexible substrate is an electronic device characterized in that the connection portion is provided upward.

The electronic device according to any one of claims 1 to 3.
As the display
A first display provided with a first display unit that faces the back surface of the first housing and displays an image, and a first display.
A second display provided with a second display unit that faces the front of the first housing and displays an image, and a second display.
Have,
As the printed circuit board
The first display board for controlling the first display unit and
The second display board for controlling the second display unit and
Have,
As the flexible substrate,
A first display flexible board that connects the first display unit and the first display board, and
A second display flexible board that connects the second display unit and the second display board, and
An electronic device characterized by having.

The electronic device according to claim 4.
The first display further has a first touch panel unit that accepts a touch operation.
The printed circuit board further includes a first touch panel board for controlling the first touch panel unit.
As the flexible substrate, an electronic device further comprising a first flexible substrate for a touch panel that connects the first touch panel unit and the first touch panel substrate.

The electronic device according to claim 5.
The second display further has a second touch panel unit that accepts a touch operation.
As the printed circuit board, a second touch panel board for controlling the second touch panel unit is further provided.
As the flexible substrate, an electronic device further comprising a second touch panel flexible substrate for connecting the second touch panel unit and the second touch panel substrate.

The electronic device according to claim 6.
The first and second touch panel boards are arranged side by side in front of and behind each other in the second housing, so that the second touch panel board is more from the second folded portion than the first touch panel board. Located on the distal side,
The first and second flexible substrates for a touch panel form the first and second folded portions in a state of being overlapped with each other.
The second touch panel flexible substrate has an extension portion extending beyond the first touch panel substrate, and the extension portion is connected to the second touch panel substrate. Electronics.

The electronic device according to any one of claims 4 to 7.
By arranging the first and second display boards side by side in front of and behind each other in the second housing, the second display board is more from the second folded portion than the first display board. Located on the distal side,
The first and second flexible substrates for displays form the first and second folded portions in a state of being overlapped with each other.
The second display flexible substrate has an extension portion extending beyond the first display substrate, and the extension portion is connected to the second display substrate. Electronics.

The electronic device according to claim 1 or 2.
In the printed circuit board, two printed circuit boards, a first printed circuit board and a second printed circuit board, are arranged side by side in front of and behind each other inside the second housing.
The flexible substrate forms the first and second folded portions in a state where two of the first and second flexible substrates are stacked.
The first flexible substrate is connected to the first printed circuit board.
The second flexible substrate has an extension portion extending beyond the first printed circuit board, and the extension portion is connected to the second printed circuit board. ..