JP2021180447A - Article with ic chip and manufacturing method thereof - Google Patents

Abstract

To provide an article with an IC chip, in which the resistance of a looped conductor for impedance matching can be reduced, and a manufacturing method of the article with the IC chip.SOLUTION: An article with an IC chip 30 comprises: a first substrate 41; an antenna 42 on the first substrate 41; a looped conductor 20 connected to or capacitively coupled to the antenna 42; and an IC chip 12 connected to or capacitively coupled to the looped conductor 20. The looped conductor 20 includes a material having a volume resistivity lower than that of the material of the antenna 42.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to an article with an IC chip and a method for manufacturing the same.

Conventionally, a non-contact RFID (Radio Frequency Identification) tag on which an IC chip is mounted on a product or the like has been used for the purpose of managing and identifying product information. Information about products and the like is written in the IC chips of RFID tags, and when managing and selling products and the like, the reader / writer can wirelessly read and use the information of these IC chips. Such RFID tags bring great merits such as improvement of convenience and safety of product management and elimination of human error.

RFID tags include active tags that have a built-in battery and can transmit radio waves by themselves, and passive tags that receive electric power wirelessly and activate IC chips. In recent years, many passive tags that are easy to configure and can be produced at low cost have begun to be adopted. A passive tag is known to have a linear antenna that receives electric power and a loop-shaped conductor that is impedance-matched with an IC and efficiently transmits electric power (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2009-71869

In conventional RFID tags, a linear antenna and a loop-shaped conductor for impedance matching are often formed by an etching method, and the production cost tends to be high. On the other hand, it is also conceivable to use conductive ink to form a linear antenna or both a linear antenna and a loop-shaped conductor by printing. However, conductive ink requires a certain amount of resin to be mixed in order to retain the coating film, and the sheet resistance value of the coating film is higher than that of a metal film formed by a vacuum process as used in the etching method. There is a problem that it becomes expensive. When a high-resistance conductive ink is used, the resistance value of the loop-shaped conductor becomes high, and impedance matching may be insufficient. In order to reduce the resistance value of the loop-shaped conductor, it is possible to increase the width of the loop-shaped conductor in a plan view, but in a high-frequency circuit such as an RFID tag, electrons selectively pass through a short-distance path. Therefore, a sufficient effect cannot be obtained.

The present disclosure provides an article with an IC chip and a method for manufacturing the same, which can reduce the resistance value of a loop-shaped conductor for impedance matching.

The article with an IC chip according to the present embodiment includes a first base material, an antenna on the first base material, a loop-shaped conductor connected or capacitively coupled to the antenna, and a loop-shaped conductor connected or capacitively coupled to the loop-shaped conductor. The loop-shaped conductor includes a material having a lower volume resistivity than the material of the antenna.

The article with an IC chip according to the present embodiment includes a first base material, an antenna on the first base material, a loop-shaped conductor connected or capacitively coupled to the antenna, and a loop-shaped conductor connected or capacitively coupled to the loop-shaped conductor. The loop-shaped conductor is thicker than the thickness of the antenna.

In the article with an IC chip according to the present embodiment, the antenna is composed of a first printing layer, and the loop-shaped conductor is located above or below the first printing layer and the first printing layer. It may include a print layer.

In the article with an IC chip according to the present embodiment, the antenna and the loop-shaped conductor may be made of the same material.

In the article with an IC chip according to the present embodiment, the electrode pair composed of the electrode pair to which the IC chip is connected or capacitively coupled and the base material with the antenna and the IC chip to which the IC chip is connected or capacitively coupled is the second element. The material, the IC chip, and the base material with an antenna may have the first base material, the antenna, and the loop-shaped conductor.

In the article with an IC chip according to the present embodiment, the electrode pair to which the IC chip is connected or capacitively coupled is located on the opposite surface of the loop-shaped conductor and the antenna with respect to the first substrate. May be good.

In the article with an IC chip according to the present embodiment, the loop-shaped conductor to which the IC chip is connected or capacitively coupled is composed of a base material with an antenna and the IC chip is connected or capacitively coupled is the first. It has 3 base materials, the loop-shaped conductor, and the IC chip, and the base material with an antenna may have the first base material and the antenna.

In the article with an IC chip according to the present embodiment, the loop-shaped conductor to which the IC chip is connected or capacitively coupled may be located on the surface opposite to the antenna with respect to the first substrate.

In the article with an IC chip according to the present embodiment, the IC chip is composed of an electrode pair to which the IC chip is connected or capacitively coupled, a loop-shaped conductor to which the IC chip is connected or capacitively coupled, and a base material with an antenna. The electrode pair connected or capacitively coupled has the fourth base material and the IC chip, and the loop-shaped conductor to which the IC chip is connected or capacitively coupled has the fifth base material and the loop-shaped conductor. The base material with an antenna may have the first base material and the antenna.

In the article with an IC chip according to the present embodiment, the electrode pair to which the IC chip is connected or capacitively coupled and the loop-shaped conductor are located on the surface opposite to the antenna with respect to the first substrate. May be good.

In the article with an IC chip according to the present embodiment, the loop-shaped conductor and the IC chip may be located on the surface opposite to the antenna with respect to the first substrate.

In the article with an IC chip according to the present embodiment, the loop-shaped conductor and the electrode pair to which the IC chip is connected or capacitively coupled are located on the surface opposite to the antenna with respect to the first substrate. May be good.

In the article with an IC chip according to this embodiment, an RFID tag may be used.

In the article with an IC chip according to this embodiment, it may be a packaging material.

The method for manufacturing an article with an IC chip according to the present embodiment includes a step of preparing a first base material, a step of forming an antenna on the first base material, and connecting or capacitively coupling a loop-shaped conductor to the antenna. The loop-shaped conductor comprises a step of connecting an IC chip to the loop-shaped conductor or capacitively coupling the IC chip, and the loop-shaped conductor includes a material having a volume resistance lower than that of the material of the antenna.

The method for manufacturing an article with an IC chip according to the present embodiment includes a step of preparing a first base material, a step of forming an antenna on the first base material, and connecting or capacitively coupling a loop-shaped conductor to the antenna. A step of connecting an IC chip to the loop-shaped conductor or a step of capacitively coupling the IC chip is provided, and the thickness of the loop-shaped conductor is thicker than the thickness of the antenna.

In the method for manufacturing an article with an IC chip according to the present embodiment, the antenna may be formed by printing.

In the method for manufacturing an article with an IC chip according to the present embodiment, the antenna and the loop-shaped conductor may be formed by printing, respectively.

According to this embodiment, the resistance value of the loop-shaped conductor can be lowered.

FIG. 1 is a plan view showing an article with an IC chip according to the first embodiment. 2 (a) and 2 (b) are cross-sectional views showing an article with an IC chip according to the first embodiment (a sectional view taken along line IIA-IIA of FIG. 1 and a sectional view taken along line IIB-IIB of FIG. 1, respectively). FIG. 3 is a cross-sectional view showing an article with an IC chip according to a modified example. FIG. 4 is a cross-sectional view showing an article with an IC chip according to a modified example. FIG. 5 is a plan view showing an article with an IC chip which is an RFID tag. FIG. 6 is a perspective view showing an article with an IC chip, which is a packaging material. 7 (a)-(d) are cross-sectional views showing a method of manufacturing an article with an IC chip according to the first embodiment. FIG. 8 is a plan view showing an article with an IC chip according to the second embodiment. 9 (a) and 9 (b) are cross-sectional views showing an article with an IC chip according to the second embodiment (IXA-IXA line cross-sectional view and IXB-IXB line cross-sectional view of FIG. 8, respectively). FIG. 10 is a plan view showing an article with an IC chip according to the third embodiment. 11 (a) and 11 (b) are cross-sectional views showing an article with an IC chip according to a third embodiment (XIA-XIA line cross-sectional view and XIB-XIB line cross-sectional view of FIG. 10, respectively). FIG. 12 is a plan view showing an article with an IC chip according to the fourth embodiment. 13 (a) and 13 (b) are cross-sectional views showing an article with an IC chip according to the fourth embodiment (XIIIA-XIIIA line cross-sectional view and XIIIB-XIIIB line cross-sectional view of FIG. 12, respectively). FIG. 14 is a partially enlarged plan view showing a modified example of the fourth embodiment. FIG. 15 is a plan view showing an article with an IC chip according to the fifth embodiment. 16 (a) and 16 (b) are cross-sectional views showing an article with an IC chip according to a fifth embodiment (XVIA-XVIA line cross-sectional view and XVIB-XVIB line cross-sectional view of FIG. 15, respectively). FIG. 17 is a plan view showing an article with an IC chip according to the sixth embodiment. 18 (a) and 18 (b) are cross-sectional views showing an article with an IC chip according to a sixth embodiment (XVIIIA-XVIIIA line cross-sectional view and XVIIIB-XVIIIB line cross-sectional view of FIG. 17, respectively). FIG. 19 is a plan view showing an article with an IC chip according to the seventh embodiment. 20 (a) and 20 (b) are cross-sectional views showing an article with an IC chip according to a seventh embodiment (XXA-XXA line cross-sectional view and XXB-XXB line cross-sectional view of FIG. 19, respectively). FIG. 21 is a plan view showing an article with an IC chip according to the eighth embodiment. 22 (a) and 22 (b) are cross-sectional views showing an article with an IC chip according to the eighth embodiment (XXIIA-XXIIA line cross-sectional view and XXIIB-XXIIB line cross-sectional view of FIG. 21, respectively). FIG. 23 is a plan view showing an article with an IC chip according to the ninth embodiment. 24 (a) and 24 (b) are cross-sectional views showing an article with an IC chip according to a ninth embodiment (XXIVA-XXIVA line cross-sectional view and XXIVB-XXIVB line cross-sectional view of FIG. 23, respectively). FIG. 25 is a plan view showing an article with an IC chip according to the tenth embodiment. 26 (a) and 26 (b) are cross-sectional views showing an article with an IC chip according to the tenth embodiment (XXVIA-XXVIA line cross-sectional view and XXVIB-XXVIB line cross-sectional view of FIG. 25, respectively). FIG. 27 is a plan view showing a modified example of the tenth embodiment. FIG. 28 is a plan view showing an article with an IC chip according to the eleventh embodiment. 29 (a) and 29 (b) are cross-sectional views showing an article with an IC chip according to the eleventh embodiment (XXIXA-XXIXA line cross-sectional view and XXIXB-XXIXB line cross-sectional view of FIG. 28, respectively). FIG. 30 is a plan view showing a modified example of the eleventh embodiment. FIG. 31 is a plan view showing an article with an IC chip according to the twelfth embodiment. 32 (a) and 32 (b) are cross-sectional views showing an article with an IC chip according to the twelfth embodiment (XXXIIA-XXXIIA line cross-sectional view and XXXIIB-XXXIIB line cross-sectional view of FIG. 31, respectively). FIG. 33 is a plan view showing an article with an IC chip according to the thirteenth embodiment. 34 (a) and 34 (b) are cross-sectional views showing an article with an IC chip according to the thirteenth embodiment (XXXIVA-XXXIVA line cross-sectional view and XXXIVB-XXXIVB line cross-sectional view of FIG. 33, respectively). FIG. 35 is a plan view showing an article with an IC chip according to the fourteenth embodiment. 36 (a) and 36 (b) are cross-sectional views showing an article with an IC chip according to the fourteenth embodiment (XXXVIA-XXXVIA line cross-sectional view and XXXVIB-XXXVIB line cross-sectional view of FIG. 35, respectively). FIG. 37 is a plan view showing an article with an IC chip according to the fifteenth embodiment. 38 (a) and 38 (b) are cross-sectional views showing an article with an IC chip according to the fifteenth embodiment (cross-sectional views taken along the line XXXVIIIA-XXXVIIIA and XXXVIIIB-XXXVIIIB of FIG. 37, respectively).

Hereinafter, one embodiment will be specifically described with reference to the drawings. Each figure shown below is schematically shown. Therefore, the size and shape of each part are exaggerated as appropriate to facilitate understanding. In addition, it is possible to change and implement as appropriate within the range that does not deviate from the technical idea. In each of the figures shown below, the same parts are designated by the same reference numerals, and some detailed description may be omitted. Further, the numerical values and material names such as the dimensions of each member described in the present specification are examples of the embodiment, and are not limited to these, and can be appropriately selected and used. In the present specification, terms that specify a shape or a geometric condition, such as parallel, orthogonal, and vertical, are used to include substantially the same state in addition to the exact meaning.

(First Embodiment)
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 7.

[Article with IC chip]
First, with reference to FIGS. 1 and 2, the configuration of the article with an IC chip according to the present embodiment will be described. FIG. 1 is a plan view showing an article with an IC chip according to the present embodiment, and FIG. 2 is a cross-sectional view showing an article with an IC chip according to the present embodiment.

As shown in FIGS. 1 and 2, the article 30 with an IC chip according to the present embodiment includes a first base material (base material for articles) 41, a pair of antennas 42 on the first base material 41, and a pair. It includes a loop-shaped conductor 20 connected to the antenna 42 and an IC chip 12 connected to the loop-shaped conductor 20. The article 30 with an IC chip performs non-contact wireless communication with a reader / writer (not shown).

The first base material 41 serves as a support for supporting the article 30 with an IC chip. As the first base material 41, a resin sheet (film) or a paper base material can be used. Examples of the resin sheet include polyethylene terephthalate, polyethylene naphthalate, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, polypropylene, polyethylene, polycarbonate, polyamide, polyimide, polyphenylene sulfide, polyvinyl chloride, vinyl chloride-vinyl acetate. Materials such as copolymers, cellulose diacetates, cellulose triacetates, polystyrenes, acrylonitrile-butadiene-styrene copolymers, polyacrylic acid esters, polymethacrylic acid esters, polyurethanes and the like are used. Further, as the paper base material, for example, high-quality paper, coated paper, kraft paper, glassin paper, synthetic paper, latex, melamine-impregnated paper and the like can be used. The thickness T1 of the first base material 41 can be, for example, 5 μm or more and 3 mm or less.

The antenna 42 is laminated on the first base material 41. Each antenna 42 has an inner end portion 43 which is inside and is provided on the loop-shaped conductor 20 side, and an antenna wiring portion 44 which is connected to the outside of the inner end portion 43 and is bent in a zigzag shape in a plan view. Have. The antenna 42 can have various planar shapes, and may have a bent mianda shape, a patch shape, or another shape.

The loop-shaped conductor 20 is laminated on the first base material 41. Further, the loop-shaped conductor 20 is directly connected to the pair of antennas 42 or is capacitively coupled. The loop-shaped conductor 20 is an element for adjusting the resonance frequency of the antenna 42 in a state of being connected to the IC chip 12 having a capacitance between the input terminals to the vicinity of a predetermined frequency. Specifically, the loop-shaped conductor 20 is configured in an elongated loop shape, and is formed in an annular shape except for a part covered with the IC chip 12. In this case, the loop-shaped conductor 20 has a quadrangular shape in a plan view except for the notched portion (void portion 24). One side of the quadrangle constituting the loop-shaped conductor 20 is located parallel to the first direction DL, and the other side of the quadrangle is located parallel to the second direction DS.

Further, the loop-shaped conductor 20 has a pair of first-direction portions 21 extending along the first-direction DL and a pair of second-direction portions 22 extending along the second-direction DS. The pair of first-direction portions 21 are arranged parallel to each other, and the pair of second-direction portions 22 are arranged parallel to each other. Further, each first direction portion 21 and each second direction portion 22 are arranged so as to be orthogonal to each other. Of the pair of first-direction portions 21, one of the first-direction portions 21 located on the IC chip 12 side is interrupted at the central portion, and a pair of connecting portions 23 are formed in the first-direction portions 21. Has been done. A gap portion 24 is formed between the pair of connection portions 23, and the pair of connection portions 23 face each other via the gap portion 24. Each of the pair of connecting portions 23 is electrically connected to the IC chip 12.

The IC chip 12 is laminated on the loop-shaped conductor 20. The IC chip 12 is directly connected to the loop conductor 20 or is capacitively coupled. As the IC chip 12, a normal one having a data storage area (memory) and having an input / output function, a control function, signal modulation, and demodulation can be used. The IC chip 12 receives the electric power and the signal obtained from the antenna 42, and writes and reads the memory. The IC chip 12 may have an interface for wireless communication, a memory for storing data used for managing the article 30 with the IC chip, and the like. The IC chip 12 is electrically connected to a pair of connecting portions 23 of the loop-shaped conductor 20 via a connecting layer (not shown). As the connecting layer, for example, an anisotropic conductive film (ACP or ACF: Anisotropic Conductive Film) may be used. The anisotropic conductive film has a structure in which resin particles coated with a conductor such as nickel, silver, and gold and conductor particles such as nickel, silver, and gold are dispersed in a polymer, and is anisotropic conductive. By arranging the film between the loop-shaped conductor 20 and the IC chip 12 and applying pressure while heating, these metals electrically connect the loop-shaped conductor 20 and the IC chip 12.

In the present embodiment, the loop-shaped conductor 20 and the antenna 42 are both made of a conductive material. In this case, since the loop-shaped conductor 20 can be regarded as a thin film having a substantially uniform thickness, the loop-shaped conductor 20 may be configured to have a lower sheet resistance than the antenna 42. Specifically, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42, whereby the loop-shaped conductor 20 may have a lower sheet resistance than the antenna 42. good.

Specifically, the sheet resistance of the loop-shaped conductor 20 may be 5Ω / □ or less. Further, the sheet resistance of the antenna 42 may be 50Ω / □ or less. Desirably, the sheet resistance of the loop-shaped conductor 20 is 1 Ω / □ or less, the sheet resistance of the antenna 42 is 10 Ω / □ or less, and more preferably, the sheet resistance of the loop-shaped conductor 20 is 0.3 Ω / □ or less. Further, the sheet resistance of the loop-shaped conductor 20 may be 1/10 or less of the sheet resistance of the antenna 42, and preferably 1/20 or less. For the sheet resistance, for example, a uniform film having the same material as that used in the present embodiment and having an area of at least 150 mm × 150 mm having the same film thickness is formed by the same method, and has a low resistivity manufactured by Mitsubishi Chemical Analytical Co., Ltd. It can be measured by using a meter and a four-terminal probe.

In this case, the loop-shaped conductor 20 may be a print layer formed by a method of printing conductive ink. As the conductive ink, for example, a conductive ink containing aluminum powder, copper powder, silver powder, gold powder, or particles whose surface is coated with a dissimilar metal or chemically modified can be used. As described above, when the loop-shaped conductor 20 is composed of, for example, a printing layer of a conductive ink containing metal powder, the production cost can be suppressed at a low cost as compared with the case where the loop-shaped conductor 20 is formed by, for example, etching. .. Alternatively, the loop-shaped conductor 20 may be formed, for example, by a method of chemically etching a metal foil. As the metal foil, for example, aluminum, copper, or the like can be used. The metal foil can be formed on the first base material 41 by plating, vapor deposition, dry laminating, adhesion using an adhesive, or the like.

Further, each antenna 42 may be, for example, a printing layer formed by a method of printing conductive ink. As the conductive ink, for example, a conductive ink containing particles such as carbon, aluminum powder, copper powder, silver powder, gold powder, or particles whose surface is coated with a dissimilar metal or chemically modified can be used. As described above, when each antenna 42 is composed of, for example, a printing layer of conductive ink containing carbon, when the antenna 42 is formed by, for example, etching, or when the antenna 42 is formed by, for example, conductivity containing metal powder such as aluminum powder, copper powder, and silver powder. The production cost can be reduced as compared with the case of forming from ink. Further, when the loop-shaped conductor 20 and the antenna 42 are both formed by a method of printing conductive ink, for example, a multicolor printing machine is used, and the ink for the loop-shaped conductor 20 and the ink for the antenna 42 are used. You may print each. In this case, the loop-shaped conductor 20 and the antenna 42 can be formed at low cost. The composition of the ink, the ratio of the metal to the resin, the film thickness, the printing method, and the like may be changed between the loop-shaped conductor 20 and the antenna 42.

As shown in FIGS. 2A and 2B, the thickness T2 of the loop-shaped conductor 20 may be the same as the thickness T5 of the antenna 42. The thickness T2 of the loop-shaped conductor 20 can be appropriately adjusted according to the required sheet resistance of the loop-shaped conductor 20, and the appropriate thickness T2 of the loop-shaped conductor 20 can be determined by a material, a printing method, or the like. .. As an example, the thickness T2 of the loop-shaped conductor 20 may be 0.1 μm or more and 50 μm or less, and the thickness T5 of the antenna 42 may be, for example, 0.04 μm or more and 50 μm or less. The thickness T2 of the loop conductor 20 and the thickness T5 of the antenna 42 are the maximum thicknesses of the loop conductor 20 and the antenna 42 when measured in the normal direction of the main surfaces of the loop conductor 20 and the antenna 42, respectively. say.

Further, the loop-shaped conductor 20 and the antenna 42 are both printed layers formed by a method of printing conductive ink, and the loop-shaped conductor 20 may be formed thicker than the antenna 42. As the conductive ink, for example, particles such as aluminum powder, copper powder, and silver powder, or conductive ink containing particles such as carbon can be used. In this way, when the loop-shaped conductor 20 and the antenna 42 are composed of a printed layer of conductive ink, the production cost can be reduced as compared with the case where the loop-shaped conductor 20 and the antenna 42 are formed by, for example, etching. can. In this case, the thickness T2 of the loop-shaped conductor 20 may be made thicker than the thickness T5 of the antenna 42 by printing the loop-shaped conductor 20 thicker than the antenna 42. The thickness T2 of the loop-shaped conductor 20 may be, for example, 1.5 times or more and 3 times or less the thickness T5 of the antenna 42. Further, when the loop-shaped conductor 20 and the antenna 42 are both formed by a method of printing conductive ink, for example, a multicolor printing machine may be used. That is, the conductive ink for the loop-shaped conductor 20 and the conductive ink for the antenna 42 may be used for printing so that the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42, respectively. In this case, since the thickness T5 of the antenna 42 can be formed thin, the antenna 42 can be formed at low cost. Further, since the conductive ink of the antenna 42 can increase the resin concentration, the strength of the coating film can be improved, and the scratch resistance and bending resistance of the antenna 42 can be improved.

3 and 4 are views showing modified examples of the article 30 with an IC chip, respectively, and are cross-sectional views corresponding to FIG. 2 (a). As shown in FIG. 3, a pair of antennas 42 may be connected to each other by a connecting portion 42a, and the loop-shaped conductor 20 may be arranged on the connecting portion 42a. Alternatively, as shown in FIG. 4, a part of the loop-shaped conductor 20 may be arranged so as to overlap a part of each antenna 42.

In the present embodiment, (i) the loop-shaped conductor 20 includes a material having a lower volume resistivity than the material of the antenna 42, and (ii) the thickness T2 of the loop-shaped conductor 20 is the thickness T5 of the antenna 42. It has the same thickness as. However, the present invention is not limited to this, for example, (i) the loop-shaped conductor 20 contains a material having a lower volume resistivity than the material of the antenna 42, and (ii) the thickness T2 of the loop-shaped conductor 20 is the thickness of the antenna 42. It may be thicker than T5 or thinner than the thickness T5 of the antenna 42.

Further, as shown in FIG. 2, the total thickness T4 of the article 30 with an IC chip may be 200 μm or more and 3600 μm or less.

As shown in FIG. 5, the article 30 with an IC chip may be, for example, an RFID tag 35. Such an RFID tag 35 is itself independently distributable. When the RFID tag 35 is used for product management, for example, the RFID tag 35 may be attached to the product by using an adhesive layer (not shown) formed on the first base material 41.

Further, as shown in FIG. 6, the article 30 with an IC chip may be, for example, a packaging material 36. A printing layer (not shown) may be formed on the packaging material 36. Such packaging material 36 may include a container having an accommodating portion for accommodating the contents. In this case, the first base material 41 constitutes the main base material of the container. Alternatively, the packaging material 36 may be attached to a container having an accommodating portion. In this case, the first base material 41 constitutes a base material different from the main base material of the container.

When the article 30 with an IC chip is a packaging material 36, the packaging material 36 may be a flexible packaging material, a paper container, a resin molded product, or the like. Among these, examples of the flexible packaging material include pouches, pillows, shrink labels, in-mold label containers, lid materials and the like. Examples of the paper container include a general paper container such as a box, a paper container, a paper cup, a paper tray, a mount, and the like. Examples of the resin molded product include a blister container, a vacuum molded container, a deep drawing container, an injection molded container, a blow molded container, a plastic bottle and the like. Note that FIG. 6 shows a case where the packaging material 36 is a paper container.

When the article 30 with the IC chip is the packaging material 36, the antenna 42 may be located on the outer surface side (opposite side of the accommodating portion) of the container. In this case, the IC chip 12, the loop-shaped conductor 20, and the antenna 42 may be located on the outer surface side of the first base material 41, respectively. Alternatively, the antenna 42 may be located on the inner surface side (accommodation portion side) of the container. In this case, the IC chip 12 and the loop-shaped conductor 20 may be located on the inner surface side (containment portion side) of the container or on the outer surface side (opposite side of the accommodating portion) of the container.

Further, when the article 30 with an IC chip is the packaging material 36, a normal printing layer for the packaging material 36 may be formed so as to cover the antenna 42.

[Manufacturing method of articles with IC chips]
Next, a method of manufacturing the article 30 with an IC chip according to the present embodiment will be described with reference to FIGS. 7 (a) and 7 (d).

In this case, first, as shown in FIG. 7A, a first base material 41 made of a resin sheet (film), a paper base material, or the like is prepared.

Next, as shown in FIG. 7B, an antenna 42 having a predetermined pattern is formed on the first base material 41. Each antenna 42 may be formed, for example, by printing conductive ink. As the conductive ink, for example, a conductive ink containing particles such as carbon can be used. When printing the conductive ink, a gravure printing method, a screen printing method, or an inkjet method may be used.

Subsequently, as shown in FIG. 7 (c), a loop-shaped conductor 20 having a predetermined pattern is formed on the first base material 41. The loop conductor 20 is coupled to the antenna 42. The loop-shaped conductor 20 may be formed, for example, by printing a conductive ink. As the conductive ink, for example, a conductive ink containing particles such as aluminum powder, copper powder, and silver powder can be used. When printing the conductive ink, a gravure printing method, a screen printing method, or an inkjet method may be used. Alternatively, the loop-shaped conductor 20 may be formed by, for example, a method of chemically etching a metal foil or a method of punching out a metal foil. At this time, the loop-shaped conductor 20 contains a material having a volume resistivity lower than that of the material of the antenna 42. The thickness T2 of the loop-shaped conductor 20 may be the same as the thickness T5 of the antenna 42, or may be different from the thickness T5 of the antenna 42.

When the conductive ink is formed by printing, the antenna 42 and the loop-shaped conductor 20 may be formed by using the same printing machine. Further, a normal printing layer (for example, a printing layer for the packaging material 36) may be formed together with the antenna 42 and the loop-shaped conductor 20 by using the same printing machine as the printing machine for applying the conductive ink.

Not limited to the above, the antenna 42 may be formed at the same time as the loop-shaped conductor 20. Alternatively, the antenna 42 may be formed after the loop-shaped conductor 20 is formed.

Then, as shown in FIG. 7D, the IC chip 12 is mounted on the loop-shaped conductor 20 via a connection layer (not shown). As the connecting layer, for example, an anisotropic conductive film may be used. In this case, the anisotropic conductive film can be electrically connected to the loop conductor 20 and the IC chip 12 by arranging the anisotropic conductive film between the loop conductor 20 and the IC chip 12 and applying pressure while heating. can. In this way, on the first base material 41, the pair of antennas 42 on the first base material 41, the loop-shaped conductor 20 coupled to the antenna 42 on the first base material 41, and the loop-shaped conductor 20. An article 30 with an IC chip provided with the IC chip 12 can be obtained.

As described above, according to the present embodiment, the loop-shaped conductor 20 includes a material having a lower volume resistivity than the material of the antenna 42. As a result, the sheet resistance of the loop-shaped conductor 20, which is required to have a lower resistance than that of the antenna 42, can be made lower than that of the antenna 42. By lowering the sheet resistance of the loop-shaped conductor 20 in this way, it is possible to suppress insufficient resonance of the loop-shaped conductor 20 and extend the propagation distance of wireless communication using the article 30 with an IC chip.

Further, according to the present embodiment, the antenna 42 and the loop-shaped conductor 20 are print layers, respectively. As a result, the antenna 42 and the loop-shaped conductor 20 can be formed at low cost. Further, especially when the antenna 42 is formed by printing, the sheet resistance of the loop-shaped conductor 20 tends to be higher than the required value even if the sheet resistance of the antenna 42 satisfies the required value. On the other hand, in the present embodiment, the loop-shaped conductor 20 includes a material having a lower volume resistivity than the material of the antenna 42. As a result, the sheet resistance of the loop-shaped conductor 20 can be reduced.

Further, according to the present embodiment, the antenna 42 may contain carbon. As a result, the antenna 42 can be manufactured at low cost. Further, according to the present embodiment, the loop-shaped conductor 20 may contain silver. As a result, the loop-shaped conductor 20 can have a low resistance. In this case, the antenna 42, which does not necessarily have to have low resistance, is made of inexpensive conductive ink containing carbon, and the loop-shaped conductor 20, which is required to have low resistance, is made of low resistance conductive ink containing silver. can do. As a result, the sheet resistance of the loop-shaped conductor 20 can be reduced without significantly increasing the production cost.

(Second embodiment)
Next, a second embodiment will be described with reference to FIGS. 8 and 9. 8 and 9 are views showing an article with an IC chip according to the present embodiment. The second embodiment shown in FIGS. 8 and 9 is different in that the loop-shaped conductor 20 is composed of the first print layer 32 and the second print layer 33, and the other configurations are described above. It is substantially the same as the first embodiment shown in FIGS. 1 to 7. In FIGS. 8 and 9, the same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 8 and 9, the article 30 with an IC chip is arranged on a first base material 41, a pair of antennas 42 on the first base material 41, and a pair of antennas. It includes a loop-shaped conductor 20 directly connected to the 42 and an IC chip 12 connected to the loop-shaped conductor 20.

In the present embodiment, the antenna 42 is composed of a single first print layer 32, and the loop-shaped conductor 20 includes the first print layer 32 and the second print layer 33 located above the first print layer 32. It is composed of. As a result, the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42. In this case, the first printing layer 32 may be formed by printing a conductive ink containing particles such as carbon. Further, the second print layer 33 may use a material having a volume resistivity lower than that of the first print layer 32, and the first print layer 32 and the second print layer 33 are made of the same material. Is also good. The second printing layer 33 may be printed and formed so as to be overlapped on the first printing layer 32 by using, for example, a multicolor printing machine, and is conductive including metal powders such as aluminum powder, copper powder, and silver powder. It may be formed by printing the conductive ink on the first printing layer 32. As described above, since the loop-shaped conductor 20 is composed of the first print layer 32 and the second print layer 33, the loop-shaped conductor 20 and the antenna 42 can be formed at low cost, and the loop-shaped conductor 20 can be formed. The resistance can be made lower than that of the antenna 42. Although not shown, the loop-shaped conductor 20 may include three or more print layers, and the antenna 42 may include two or more print layers. Further, the second print layer 33 may be located below the first print layer 32.

(Third embodiment)
Next, a third embodiment will be described with reference to FIGS. 10 and 11. 10 and 11 are views showing an article with an IC chip according to the present embodiment. The third embodiment shown in FIGS. 10 and 11 is different in that the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42, and the other configurations are the above-mentioned FIGS. 1 to 1 to 11. It is substantially the same as the first embodiment shown in FIG. 7. In FIGS. 10 and 11, the same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 10 and 11, the article 30 with an IC chip is arranged on a first base material 41, a pair of antennas 42 on the first base material 41, and a pair of antennas. It includes a loop-shaped conductor 20 directly connected to the 42 and an IC chip 12 connected to the loop-shaped conductor 20.

In the present embodiment, the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42. The thickness T2 of the loop-shaped conductor 20 can be appropriately adjusted according to the required sheet resistance of the loop-shaped conductor 20, and the appropriate thickness T2 of the loop-shaped conductor 20 can be determined by a material, a printing method, or the like. .. As an example, the thickness T2 of the loop-shaped conductor 20 may be 0.1 μm or more and 50 μm or less, and the thickness T5 of the antenna 42 may be, for example, 0.1 μm or more and 50 μm or less. In this case, the thickness T2 of the loop-shaped conductor 20 may be, for example, 1.5 times or more and 3 times or less the thickness T5 of the antenna 42.

Both the loop-shaped conductor 20 and the antenna 42 are print layers formed by a method of printing conductive ink, and the loop-shaped conductor 20 may be formed thicker by printing than the antenna 42. As the conductive ink, for example, particles such as aluminum powder, copper powder, and silver powder, or conductive ink containing particles such as carbon can be used. In this way, when the loop-shaped conductor 20 and the antenna 42 are composed of a printed layer of conductive ink, the production cost can be reduced as compared with the case where the loop-shaped conductor 20 and the antenna 42 are formed by, for example, etching. can. In this case, the loop-shaped conductor 20 and the antenna 42 are made of the same material, and the loop-shaped conductor 20 may be overcoated to print thicker than the antenna 42. Further, when the loop-shaped conductor 20 and the antenna 42 are both formed by a method of printing conductive ink, for example, a multicolor printing machine may be used. That is, the conductive ink for the loop-shaped conductor 20 and the conductive ink for the antenna 42 may be used for printing so that the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42, respectively. In this case, since the thickness T5 of the antenna 42 can be formed thin, the antenna 42 can be formed at low cost.

(Fourth Embodiment)
Next, a fourth embodiment will be described with reference to FIGS. 12 to 14. 12 to 14 are views showing an article with an IC chip according to the present embodiment. The fourth embodiment shown in FIGS. 12 to 14 is different in that the article 30 with an IC chip is composed of an electrode pair 60 to which the IC chip is connected or capacitively coupled and a base material 40 with an antenna. Yes, the other configuration is substantially the same as the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 12 to 14, the same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 12 and 13, the article 30 with an IC chip according to the present embodiment has a base material 40 with an antenna and an electrode pair connected to the base material 40 with an antenna to which the IC chip is connected or capacitively coupled. It is equipped with 60. The electrode pair 60 to which the IC chip is connected or capacitively coupled and the base material 40 with the antenna are configured separately from each other, and the article 30 with the IC chip is configured by adhering them to each other.

The electrode pair 60 to which the IC chip is connected or capacitively coupled includes a second base material 61, a connection terminal 62 on the second base material 61, and an IC chip 12 on the connection terminal 62. The electrode pair 60 to which the IC chip is connected or capacitively coupled constitutes an article 30 with an IC chip that, together with the base material 40 with an antenna, performs non-contact wireless communication with a reader / writer (not shown).

The second base material 61 has a substantially rectangular shape in a plan view. The second base material 61 supports the IC chip 12, and a resin sheet (film) or a paper base material can be used. As the resin sheet and the paper base material, for example, the same materials as those used for the first base material 41 described above can be used.

The connection terminal 62 is formed on the second base material 61, and may be made of a metal foil conductive layer such as copper. Further, the IC chip 12 is mounted on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62.

The base material 40 with an antenna is a loop-shaped conductor 20 arranged on a first base material 41, a pair of antennas 42 on the first base material 41, and directly connected to the pair of antennas 42. And have. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

The base material 40 with an antenna and the electrode pair 60 to which the IC chip is connected or capacitively coupled are manufactured separately from each other and then connected via the adhesive layer 63. As the adhesive layer 63, for example, an adhesive such as a urethane adhesive, an acrylic adhesive, a styrene butadiene copolymer adhesive, a vinyl chloride adhesive, an epoxy adhesive, or a hot melt adhesive can be used. ..

According to the present embodiment, the base material 40 with an antenna and the electrode pair 60 to which the IC chip is connected or capacitively coupled are configured separately from each other, and the article 30 with the IC chip is produced by adhering them. .. As a result, when the IC chip 12 is mounted on the antenna 42, high positional accuracy is not required between the IC chip 12 and the antenna 42, and the article 30 with the IC chip can be easily manufactured.

As shown in FIG. 14, the portion 62a of the connection terminal 62 that overlaps with the loop-shaped conductor 20 is preferably thicker than the other portion of the connection terminal 62. Similarly, the portion of the loop-shaped conductor 20 that overlaps with the connection terminal 62 (connection portion 23) is preferably thicker than the other portion of the loop-shaped conductor 20. As a result, the capacitive coupling between the connection terminal 62 and the connection portion 23 can be increased.

(Fifth Embodiment)
Next, a fifth embodiment will be described with reference to FIGS. 15 and 16. 15 and 16 are views showing an article with an IC chip according to the present embodiment. The fifth embodiment shown in FIGS. 15 and 16 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite side of the loop conductor 20, and has another configuration. Is substantially the same as the fourth embodiment shown in FIGS. 12 to 14 described above. In FIGS. 15 and 16, the same parts as those shown in FIGS. 12 to 14 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 15 and 16, the article 30 with an IC chip includes a base material 40 with an antenna and an electrode pair 60 to which the IC chip is connected or capacitively coupled, which is connected to the base material 40 with an antenna. There is. Of these, the base material 40 with an antenna is a loop shape arranged on the first base material 41, a pair of antennas 42 on the first base material 41, and the first base material 41 and directly connected to the pair of antennas 42. It has a conductor 20 and. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second base material 61, a connection terminal 62 on the second base material 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62.

In the present embodiment, the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite surface of the loop-shaped conductor 20 and the antenna 42 with respect to the first base material 41. That is, the first base material 41 is interposed between the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 20. In this case, the electrode pair 60 to which the IC chip is connected or capacitively coupled is bonded to the first base material 41 by the adhesive layer 63 with the IC chip 12 facing the first base material 41 side. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

(Sixth Embodiment)
Next, a sixth embodiment will be described with reference to FIGS. 17 and 18. 17 and 18 are views showing an article with an IC chip according to the present embodiment. The sixth embodiment shown in FIGS. 17 and 18 is different in that the loop-shaped conductor 20 is composed of the first print layer 32 and the second print layer 33, and the other configurations are described above. It is substantially the same as the fourth embodiment shown in FIGS. 12 to 14. In FIGS. 17 and 18, the same parts as those shown in FIGS. 12 to 14 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 17 and 18, the article 30 with an IC chip includes a base material 40 with an antenna and an electrode pair 60 to which an IC chip connected to the base material 40 with an antenna is connected or capacitively coupled. .. Of these, the base material 40 with an antenna is a loop shape arranged on the first base material 41, a pair of antennas 42 on the first base material 41, and the first base material 41 and directly connected to the pair of antennas 42. It has a conductor 20 and. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second base material 61, a connection terminal 62 on the second base material 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62.

In the present embodiment, the antenna 42 is composed of a single first print layer 32, and the loop-shaped conductor 20 includes the first print layer 32 and the second print layer 33 located above the first print layer 32. Includes. As a result, the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42. In this case, the first printing layer 32 may be formed by printing a conductive ink containing particles such as carbon. Further, the second print layer 33 may be made of a material having a lower volume resistivity than that of the first print layer 32. As described above, since the loop-shaped conductor 20 is composed of the first print layer 32 and the second print layer 33, the loop-shaped conductor 20 and the antenna 42 can be formed at low cost, and the loop-shaped conductor 20 can be formed. The resistance can be made lower than that of the antenna 42. In FIG. 18, the planar shape of the adhesive layer 63 is smaller than the planar shape of the second base material 61, but the present invention is not limited to this, and the planar shape of the adhesive layer 63 may be the same as the planar shape of the second base material 61. good. Further, the second print layer 33 may be located below the first print layer 32.

(7th embodiment)
Next, a seventh embodiment will be described with reference to FIGS. 19 and 20. 19 and 20 are views showing an article with an IC chip according to the present embodiment. The seventh embodiment shown in FIGS. 19 and 20 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite side of the loop conductor 20, and has another configuration. Is substantially the same as the sixth embodiment shown in FIGS. 17 and 18 described above. In FIGS. 19 and 20, the same parts as those shown in FIGS. 17 and 18 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 19 and 20, the article 30 with an IC chip comprises a base material 40 with an antenna and an electrode pair 60 to which the IC chip is connected or capacitively coupled to the base material 40 with an antenna. There is. Of these, the base material 40 with an antenna is a loop shape arranged on the first base material 41, a pair of antennas 42 on the first base material 41, and the first base material 41 and directly connected to the pair of antennas 42. It has a conductor 20 and. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second base material 61, a connection terminal 62 on the second base material 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62.

In the present embodiment, the antenna 42 is composed of a single first print layer 32, and the loop-shaped conductor 20 includes the first print layer 32 and the second print layer 33 located above the first print layer 32. Includes. Further, the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite surface of the loop-shaped conductor 20 and the antenna 42 with respect to the first base material 41. That is, the first base material 41 is interposed between the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 20. In this case, the electrode pair 60 to which the IC chip is connected or capacitively coupled is bonded to the first base material 41 by the adhesive layer 63 with the IC chip 12 facing the first base material 41 side. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42. Further, the second print layer 33 may be located below the first print layer 32.

(8th embodiment)
Next, an eighth embodiment will be described with reference to FIGS. 21 and 22. 21 and 22 are views showing an article with an IC chip according to the present embodiment. The eighth embodiment shown in FIGS. 21 and 22 is different in that the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42, and the other configurations are the above-mentioned FIGS. 12 to 12 to 2. It is substantially the same as the fourth embodiment shown in FIG. In FIGS. 21 and 22, the same parts as those shown in FIGS. 12 to 14 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 21 and 22, the article 30 with an IC chip includes a base material 40 with an antenna and an electrode pair 60 to which the IC chip is connected or capacitively coupled, which is connected to the base material 40 with an antenna. There is. Of these, the base material 40 with an antenna is a loop shape arranged on the first base material 41, a pair of antennas 42 on the first base material 41, and the first base material 41 and directly connected to the pair of antennas 42. It has a conductor 20 and. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second base material 61, a connection terminal 62 on the second base material 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62.

In the present embodiment, the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42. The thickness T2 of the loop-shaped conductor 20 can be appropriately adjusted according to the required sheet resistance of the loop-shaped conductor 20, and the appropriate thickness T2 of the loop-shaped conductor 20 can be determined by a material, a printing method, or the like. .. As an example, the thickness T2 of the loop-shaped conductor 20 may be 0.1 μm or more and 50 μm or less, and the thickness T5 of the antenna 42 may be, for example, 0.1 μm or more and 50 μm or less. In this case, the thickness T2 of the loop-shaped conductor 20 may be, for example, 1.5 times or more and 3 times or less the thickness T5 of the antenna 42. Both the loop-shaped conductor 20 and the antenna 42 are print layers formed by a method of printing conductive ink, and the loop-shaped conductor 20 may be formed thicker by printing than the antenna 42. For example, in this case, the loop-shaped conductor 20 and the antenna 42 may be made of the same material, and may be thicker than the antenna 42 by overcoating the loop-shaped conductor 20. In this case, since the thickness T5 of the antenna 42 can be formed thin, the antenna 42 can be formed at low cost.

(9th embodiment)
Next, a ninth embodiment will be described with reference to FIGS. 23 and 24. 23 and 24 are views showing an article with an IC chip according to the present embodiment. The ninth embodiment shown in FIGS. 23 and 24 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite side of the loop conductor 20, and has another configuration. Is substantially the same as the eighth embodiment shown in FIGS. 21 and 22 described above. In FIGS. 23 and 24, the same parts as those shown in FIGS. 21 and 22 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 23 and 24, the article 30 with an IC chip includes a base material 40 with an antenna and an electrode pair 60 to which the IC chip is connected or capacitively coupled, which is connected to the base material 40 with an antenna. There is. Of these, the base material 40 with an antenna is a loop shape arranged on the first base material 41, a pair of antennas 42 on the first base material 41, and the first base material 41 and directly connected to the pair of antennas 42. It has a conductor 20 and. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second base material 61, a connection terminal 62 on the second base material 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62.

In the present embodiment, the thickness T2 of the loop-shaped conductor 20 is thicker than the thickness T5 of the antenna 42. Further, the electrode pair 60 to which the IC chip is connected or capacitively coupled is located on the opposite surface of the loop-shaped conductor 20 and the antenna 42 with respect to the first base material 41. That is, the first base material 41 is interposed between the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 20. In this case, the electrode pair 60 to which the IC chip is connected or capacitively coupled is bonded to the first base material 41 by the adhesive layer 63 with the IC chip 12 facing the first base material 41 side. In the present embodiment, the loop-shaped conductor 20 is a printing layer formed by a method in which both the loop-shaped conductor 20 and the antenna 42 are printed with conductive ink, and the loop-shaped conductor 20 is thicker than the antenna 42 by printing. It may be formed. For example, in this case, the loop-shaped conductor 20 and the antenna 42 may be made of the same material, and may be thicker than the antenna 42 by overcoating the loop-shaped conductor 20.

(10th Embodiment)
Next, a tenth embodiment will be described with reference to FIGS. 25 to 27. 25 to 27 are views showing an article with an IC chip according to the present embodiment. In the tenth embodiment shown in FIGS. 25 to 27, the article 30 with an IC chip is composed of a loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled and a base material 50 with an antenna, and the IC chip is connected. Alternatively, the capacitively coupled loop-shaped conductor 10 is different in that it includes both the loop-shaped conductor 20 and the IC chip 12, and the other configurations are different from those of the first embodiment shown in FIGS. 1 to 7 described above. It is almost the same. In FIGS. 25 to 27, the same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 25 and 26, the article 30 with an IC chip according to the present embodiment has a loop shape in which the base material 50 with an antenna and the base material 50 with an antenna are connected or capacitively coupled with each other. It is provided with a conductor 10. The loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled and the base material 50 with the antenna are configured separately from each other, and the article 30 with the IC chip is configured by adhering them to each other.

The loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled has a third base material 11, a loop-shaped conductor 20 on the third base material 11, and an IC chip 12 connected to the loop-shaped conductor 20. ing. The loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled constitutes an article 30 with an IC chip that integrally performs the base material 50 with an antenna and performs non-contact wireless communication with a reader / writer (not shown).

The third base material 11 has a substantially rectangular shape in a plan view. The third base material 11 supports the loop-shaped conductor 20 and the IC chip 12, and a resin sheet (film) or a paper base material can be used. As the resin sheet and the paper base material, for example, the same materials as those used for the first base material 41 described above can be used.

The loop-shaped conductor 20 is laminated on the third base material 11. Further, the IC chip 12 is laminated on the loop-shaped conductor 20.

The base material 50 with an antenna has a first base material 41 and a pair of antennas 42 on the first base material 41. The pair of antennas 42 are coupled (capacitively coupled) to the loop-shaped conductor 20 via the adhesive layer 31. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

The base material 50 with an antenna and the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled are manufactured separately from each other and then connected via the adhesive layer 31. As the adhesive layer 31, for example, an adhesive such as a urethane adhesive, an acrylic adhesive, a styrene butadiene copolymer adhesive, a vinyl chloride adhesive, an epoxy adhesive, or a hot melt adhesive can be used. ..

According to the present embodiment, the base material 50 with an antenna and the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled are configured separately from each other, and the article 30 with the IC chip is manufactured by adhering them. NS. As a result, when the IC chip 12 is mounted on the antenna 42, high positional accuracy is not required between the IC chip 12 and the antenna 42, and the article 30 with the IC chip can be easily manufactured.

As shown in FIG. 27, a protrusion 26 protruding outward in the plane direction may be provided at a portion of the loop-shaped conductor 20 that overlaps with the inner end portion 43 of the antenna 42. This makes it possible to increase the capacitive coupling between the protrusion 26 of the loop conductor 20 and the inner end 43 of the antenna 42.

(11th embodiment)
Next, the eleventh embodiment will be described with reference to FIGS. 28 to 30. 28 to 30 are views showing an article with an IC chip according to the present embodiment. The eleventh embodiment shown in FIGS. 28 to 30 is different in that the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled is located on the opposite side of the antenna 42, and the other configurations are different. It is substantially the same as the tenth embodiment shown in FIGS. 25 to 27 described above. In FIGS. 28 to 30, the same parts as those shown in FIGS. 25 to 27 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 28 and 29, the article 30 with an IC chip includes a base material 50 with an antenna and a loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled, which is connected to the base material 50 with an antenna. ing. Of these, the base material 50 with an antenna has a first base material 41 and a pair of antennas 42 on the first base material 41. Further, the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled includes the third base material 11, the loop-shaped conductor 20 on the third base material 11, and the IC chip 12 connected to the loop-shaped conductor 20. doing.

In the present embodiment, the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled is located on the opposite surface of the antenna 42 with respect to the first base material 41. That is, the first base material 41 is interposed between the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled and the antenna 42. In this case, the loop-shaped conductor 10 to which the IC chip is connected or capacitively coupled is bonded to the first base material 41 by the adhesive layer 31 with the IC chip 12 facing the first base material 41 side. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

As shown in FIG. 30, a protrusion 26 protruding outward in the plane direction may be provided at a portion of the loop-shaped conductor 20 that overlaps with the inner end 43 of the antenna 42. This makes it possible to increase the capacitive coupling between the protrusion 26 of the loop conductor 20 and the inner end 43 of the antenna 42.

(12th embodiment)
Next, a twelfth embodiment will be described with reference to FIGS. 31 and 32. 31 and 32 are views showing an article with an IC chip according to the present embodiment. In the twelfth embodiment shown in FIGS. 31 and 32, the article 30 with an IC chip has an IC having a base material 50 with an antenna, an electrode pair 70 to which the IC chip is connected or capacitively coupled, and a loop-shaped conductor 20. The difference is that the chip is composed of a loop-shaped conductor 80 connected or capacitively coupled, and the other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7 described above. In FIGS. 31 and 32, the same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 31 and 32, the article 30 with an IC chip according to the present embodiment has an antenna-equipped base material 50 and an electrode pair bonded to the antenna-equipped base material 50 to which the IC chip is connected or capacitively coupled. The 70 is provided with a loop conductor 80 to which the IC chip is connected or capacitively coupled to the electrode pair 70 to which the IC chip is connected or capacitively coupled. The base material 50 with an antenna, the electrode pair 70 to which the IC chip is connected or capacitively coupled, and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are configured separately from each other, and these are adhered to each other. The article 30 with an IC chip is configured. That is, the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are integrated with the base material 50 with an antenna and are not in contact with a reader / writer (not shown). It constitutes an article 30 with an IC chip that performs wireless communication.

The electrode pair 70 to which the IC chip is connected or capacitively coupled has a fourth base material 71, a connection terminal 72 on the fourth base material 71, and an IC chip 12 on the connection terminal 72. The fourth base material 71 has a substantially rectangular shape in a plan view. The fourth base material 71 supports the IC chip 12, and a resin sheet (film) or a paper base material can be used. As the resin sheet and the paper base material, for example, the same materials as those used for the first base material 41 described above can be used. The connection terminal 72 is formed on the fourth base material 71, and may be made of a metal foil conductive layer such as copper. Further, the IC chip 12 is mounted on the connection terminal 72.

The loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled has a fifth base material 81 and a loop-shaped conductor 20 on the fifth base material 81. The fifth base material 81 has a substantially rectangular shape in a plan view. The fifth base material 81 supports the loop-shaped conductor 20, and a resin sheet (film) or a paper base material can be used. As the resin sheet and the paper base material, for example, the same materials as those used for the first base material 41 described above can be used. The loop-shaped conductor 20 is laminated on the fifth base material 81. The IC chip 12 of the electrode pair 70 to which the IC chip is connected or capacitively coupled is capacitively coupled to the loop-shaped conductor 20 via the connection terminal 72.

The base material 50 with an antenna has a first base material 41 and a pair of antennas 42 on the first base material 41. The pair of antennas 42 are coupled (capacitively coupled) to the loop-shaped conductor 20 via the adhesive layer 73. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

The electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are manufactured separately from each other and then connected via the adhesive layer 83. Further, the base material 50 with an antenna, the electrode pair 70 to which the IC chip is connected or capacitively coupled, and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are connected via the adhesive layer 73. As the adhesive layers 73 and 83, for example, an adhesive such as a urethane adhesive, an acrylic adhesive, a styrene butadiene copolymer adhesive, a vinyl chloride adhesive, an epoxy adhesive, or a hot melt adhesive is used. Can be done.

According to the present embodiment, the base material 50 with an antenna, the electrode pair 70 to which the IC chip is connected or capacitively coupled, and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are configured separately from each other. The article 30 with an IC chip is manufactured by adhering the above. As a result, when the IC chip 12 is mounted on the antenna 42, high positional accuracy is not required between the IC chip 12 and the antenna 42, and the article 30 with the IC chip can be easily manufactured.

Also in this embodiment, the loop-shaped conductor 20 may be provided with a protrusion 26 projecting outward in the plane direction at a portion overlapping the inner end 43 of the antenna 42 (see FIGS. 27 and 30). ..

(Thirteenth embodiment)
Next, a thirteenth embodiment will be described with reference to FIGS. 33 and 34. 33 and 34 are views showing an article with an IC chip according to the present embodiment. In the thirteenth embodiment shown in FIGS. 33 and 34, the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop conductor 80 to which the IC chip is connected or capacitively coupled are located on the opposite side of the antenna 42. The other configurations are substantially the same as those of the twelfth embodiment shown in FIGS. 31 and 32 described above. In FIGS. 33 and 34, the same parts as those shown in FIGS. 31 and 32 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 33 and 34, the article 30 with an IC chip includes an antenna-equipped base material 50, an electrode pair 70 to which an IC chip bonded to the antenna-equipped base material 50 is connected or capacitively coupled, and an IC chip. An IC chip bonded to a connected or capacitively coupled electrode pair 70 comprises a connected or capacitively coupled loop conductor 80. Of these, the base material 50 with an antenna has a first base material 41 and a pair of antennas 42 on the first base material 41. Further, the electrode pair 70 to which the IC chip is connected or capacitively coupled has a fourth base material 71, a connection terminal 72 on the fourth base material 71, and an IC chip 12 on the connection terminal 72. The loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled has a fifth base material 81 and a loop-shaped conductor 20 on the fifth base material 81.

In the present embodiment, the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are on the opposite surface of the antenna 42 with respect to the first base material 41. positioned. That is, the first base material 41 is interposed between the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled to the antenna 42. In this case, the electrode pair 70 to which the IC chip is connected or capacitively coupled and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are connected via the adhesive layer 83. Further, the base material 50 with an antenna, the electrode pair 70 to which the IC chip is connected or capacitively coupled, and the loop-shaped conductor 80 to which the IC chip is connected or capacitively coupled are connected via the adhesive layer 73. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

(14th embodiment)
Next, a fourteenth embodiment will be described with reference to FIGS. 35 and 36. 35 and 36 are views showing an article with an IC chip according to the present embodiment. The fourteenth embodiment shown in FIGS. 35 and 36 is different in that the loop-shaped conductor 20 and the IC chip 12 are located on opposite sides of the antenna 42, and the other configurations are the above-mentioned FIGS. 1 to 1 to 36. It is substantially the same as the first embodiment shown in FIG. 7. In FIGS. 35 and 36, the same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 35 and 36, the article 30 with an IC chip includes a first base material 41, a pair of antennas 42 on the first base material 41, and a loop-shaped conductor arranged on the first base material 41. 20 and an IC chip 12 connected to the loop-shaped conductor 20 are provided.

In the present embodiment, the loop-shaped conductor 20 and the IC chip 12 are located on the opposite surface of the antenna 42 with respect to the first base material 41. That is, the first base material 41 is interposed between the loop-shaped conductor 20 and the IC chip 12 and the antenna 42. In this case, the pair of antennas 42 are capacitively coupled to the loop-shaped conductor 20. The pair of antennas 42 are connected to each other, but the present invention is not limited to this, and the pair of antennas 42 may be separated from each other. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

(Fifteenth Embodiment)
Next, a fifteenth embodiment will be described with reference to FIGS. 37 and 38. 37 and 38 are views showing an article with an IC chip according to the present embodiment. The fifteenth embodiment shown in FIGS. 37 and 38 is different in that the electrode pair 60 to which the IC chip is connected or capacitively coupled and the loop conductor 20 are located on the opposite side of the antenna 42. Other configurations are substantially the same as those of the fourth embodiment shown in FIGS. 12 to 14 described above. In FIGS. 37 and 38, the same parts as those shown in FIGS. 12 to 14 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 37 and 38, the article 30 with an IC chip comprises a base material 40 with an antenna and an electrode pair 60 to which the IC chip is connected or capacitively coupled to the base material 40 with an antenna. There is. Of these, the base material 40 with an antenna has a first base material 41, a pair of antennas 42 on the first base material 41, and a loop-shaped conductor 20 arranged on the first base material 41. The electrode pair 60 to which the IC chip is connected or capacitively coupled has a second base material 61, a connection terminal 62 on the second base material 61, and an IC chip 12 on the connection terminal 62. The IC chip 12 is capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna via the connection terminal 62. Further, the pair of antennas 42 are capacitively coupled to the loop-shaped conductor 20 of the base material 40 with an antenna.

In the present embodiment, the electrode pair 60 and the loop-shaped conductor 20 to which the IC chip is connected or capacitively coupled are located on the opposite surface of the antenna 42 with respect to the first base material 41. That is, the first base material 41 is interposed between the electrode pair 60 and the loop-shaped conductor 20 to which the IC chip is connected or capacitively coupled and the antenna 42. In this case, the electrode pair 60 to which the IC chip is connected or capacitively coupled is joined to the first base material 41 and the loop-shaped conductor 20 by the adhesive layer 63 with the IC chip 12 facing the first base material 41 side. ing. In the present embodiment, the loop-shaped conductor 20 may contain a material having a lower volume resistivity than the material of the antenna 42. Further, the thickness of the loop-shaped conductor 20 may be thicker than the thickness of the antenna 42.

It is also possible to appropriately combine a plurality of components disclosed in each of the above embodiments and modifications. Alternatively, some components may be deleted from all the components shown in each of the above embodiments and modifications.

12 IC chip 20 Loop-shaped conductor 30 Article with IC chip 41 First base material 42 Antenna 43 Inner end 44 Antenna wiring

Claims (18)

With the first base material
The antenna on the first substrate and
A loop-shaped conductor connected to or capacitively coupled to the antenna,
An IC chip connected to or capacitively coupled to the loop-shaped conductor is provided.
The loop-shaped conductor is an article with an IC chip containing a material having a lower volume resistivity than the material of the antenna. With the first base material
The antenna on the first substrate and
A loop-shaped conductor connected to or capacitively coupled to the antenna,
An IC chip connected to or capacitively coupled to the loop-shaped conductor is provided.
The thickness of the loop-shaped conductor is thicker than the thickness of the antenna, and the article has an IC chip. The antenna is composed of a first print layer, and the loop-shaped conductor includes the first print layer and a second print layer located above or below the first print layer, claim 1 or 2. Article with IC chip described in. The article with an IC chip according to claim 2, wherein the antenna and the loop-shaped conductor are made of the same material. It is composed of an electrode pair to which an IC chip is connected or capacitively coupled and a base material with an antenna.
The electrode pair to which the IC chip is connected or capacitively coupled has a second base material and the IC chip.
The article with an IC chip according to any one of claims 1 to 4, wherein the base material with an antenna has the first base material, the antenna, and the loop-shaped conductor. The article with an IC chip according to claim 5, wherein the electrode pair to which the IC chip is connected or capacitively coupled is located on the surface opposite to the loop-shaped conductor and the antenna with respect to the first substrate. .. It is composed of a loop-shaped conductor to which an IC chip is connected or capacitively coupled, and a base material with an antenna.
The loop-shaped conductor to which the IC chip is connected or capacitively coupled has a third base material, the loop-shaped conductor, and the IC chip.
The article with an IC chip according to claim 1 or 2, wherein the base material with an antenna has the first base material and the antenna. The article with an IC chip according to claim 7, wherein the loop-shaped conductor to which the IC chip is connected or capacitively coupled is located on the surface opposite to the antenna with respect to the first substrate. It is composed of an electrode pair to which an IC chip is connected or capacitively coupled, a loop-shaped conductor to which an IC chip is connected or capacitively coupled, and a base material with an antenna.
The electrode pair to which the IC chip is connected or capacitively coupled has a fourth base material and the IC chip.
The loop-shaped conductor to which the IC chip is connected or capacitively coupled has a fifth base material and the loop-shaped conductor.
The article with an IC chip according to any one of claims 1 to 4, wherein the base material with an antenna has the first base material and the antenna. The article with an IC chip according to claim 9, wherein the electrode pair to which the IC chip is connected or capacitively coupled and the loop-shaped conductor are located on the surface opposite to the antenna with respect to the first substrate. .. The article with an IC chip according to claim 1 or 2, wherein the loop-shaped conductor and the IC chip are located on a surface opposite to the first base material of the antenna. The article with an IC chip according to claim 5, wherein the loop-shaped conductor and the electrode pair to which the IC chip is connected or capacitively coupled are located on the surface opposite to the antenna with respect to the first substrate. .. The article with an IC chip according to any one of claims 1 to 12, which is an RFID tag. The article with an IC chip according to any one of claims 1 to 12, which is a packaging material. The process of preparing the first base material and
The step of forming the antenna on the first base material and
The process of connecting or capacitively coupling a loop-shaped conductor to the antenna,
A step of connecting an IC chip to the loop-shaped conductor or capacitively coupling the IC chip is provided.
A method for manufacturing an article with an IC chip, wherein the loop-shaped conductor includes a material having a volume resistivity lower than that of the antenna material. The process of preparing the first base material and
The step of forming the antenna on the first base material and
The process of connecting or capacitively coupling a loop-shaped conductor to the antenna,
A step of connecting an IC chip to the loop-shaped conductor or capacitively coupling the IC chip is provided.
A method for manufacturing an article with an IC chip, wherein the thickness of the loop-shaped conductor is thicker than the thickness of the antenna. The method for manufacturing an article with an IC chip according to claim 15 or 16, wherein the antenna is formed by printing. The method for manufacturing an article with an IC chip according to claim 15, wherein the antenna and the loop-shaped conductor are formed by printing, respectively.

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