JP2021154438A - MEMS device - Google Patents

Abstract

To provide an MEMS device that can be reduced in size and can achieve reduced cost of manufacture.SOLUTION: An MEMS device has a substrate 10 composed of glass, one or more MEMS elements 11 provided on the substrate 10, and an integrated circuit 12 that is provided on the substrate 10 and controls the MEMS element 11.SELECTED DRAWING: Figure 4

Description

The present invention relates to MEMS devices.

Acoustic transducers manufactured using MEMS (Micro Electro Mechanical Systems) technology are known. An acoustic transducer composed of a MEMS element includes a fixed electrode having a plurality of through holes through which sound pressure is passed, and a vibrating electrode arranged opposite to the fixed electrode and vibrating in response to sound pressure. The configuration is such that the displacement of the electrodes is detected as a change in capacitance between the electrodes. When a microphone is configured using such an acoustic transducer, an integrated circuit (IC chip) having a signal processing function is required to process the output signal of the acoustic transducer.

A general microphone has a structure in which an acoustic transducer and an IC chip are mounted on a mounting substrate, and the acoustic transducer and the IC chip are covered with a metal can. The electric signal detected by the acoustic transducer is input to the IC chip via the metal wire. The IC chip performs desired signal processing, and the output signal of the IC chip is output to the outside from a connection terminal provided on the mounting board via wiring. The metal can is provided to protect the acoustic transducer and the IC chip from external noise and physical contact, and an opening is partially formed in order to allow sound waves from the outside to reach the acoustic transducer. Has been done.

By the way, it is known that noise canceling is performed by arranging two or more of these microphones side by side to form an array to complement the SN ratio of the microphones.

Further, it is known that the direction of a sound source is identified by arranging a plurality of microphones at a certain distance and processing an electric signal detected by the plurality of microphones. In this case, for example, it is common practice to arrange two or more microphones individually, and there is a space problem in a device having a limited space such as a mobile device.

Further, when a plurality of microphones are arranged on the same mounting board, there is a problem that the area occupied by the plurality of IC chips included in each of the plurality of microphones becomes large, and the external dimensions of the entire device become large.

Japanese Unexamined Patent Publication No. 2011-254267

The present invention provides a MEMS device that can be miniaturized and can reduce manufacturing costs.

The MEMS device according to the first aspect of the present invention includes a substrate made of glass, one or a plurality of MEMS elements provided on the substrate, and an integrated device provided on the substrate to control the MEMS element. It is equipped with a circuit.

The MEMS device according to the second aspect of the present invention is the MEMS device according to the first aspect, in which the plurality of MEMS elements are arranged in at least one direction.

The MEMS device according to the third aspect of the present invention is the MEMS device according to the first aspect, in which the plurality of MEMS elements are arranged in at least two orthogonal directions.

The MEMS device according to the fourth aspect of the present invention is the MEMS device according to the first aspect, in which the plurality of MEMS elements are arranged in an arc shape.

The MEMS device according to the fifth aspect of the present invention is the MEMS device according to the first aspect, the plurality of first wirings provided on the substrate and electrically connected to the MEMS element, and the plurality of first wirings. It further includes a plurality of first bumps that electrically connect the wiring and the integrated circuit, respectively.

The MEMS device according to the sixth aspect of the present invention is the MEMS device according to the fifth aspect, in which the plurality of first terminals provided on the substrate and the plurality of first terminals provided on the substrate are electrically connected. It further includes a plurality of second wirings that are specifically connected to each other, and a plurality of second bumps that electrically connect the plurality of second wirings and the integrated circuit, respectively.

The MEMS device according to a seventh aspect of the present invention is the MEMS device according to the first aspect, which includes a plurality of first wirings provided on the substrate and electrically connected to the MEMS element, and the plurality of first wirings. A plurality of first bonding wires for electrically connecting the wiring and the integrated circuit are further provided.

The MEMS device according to the eighth aspect of the present invention is the MEMS device according to the sixth aspect, in which the plurality of first terminals provided on the substrate and the plurality of first terminals provided on the substrate are electrically connected. It further includes a plurality of second wirings that are specifically connected to each other, and a plurality of second bonding wires that electrically connect the plurality of second wirings and the integrated circuit, respectively.

The MEMS device according to the ninth aspect of the present invention is the MEMS device according to the first aspect, the plurality of first wirings provided on the substrate and electrically connected to the integrated circuit, and the plurality of first wirings. It further comprises a plurality of penetrating vias electrically connected to the wiring and penetrating the substrate, and a plurality of terminals provided on the bottom surface of the substrate and electrically connected to the plurality of penetrating vias.

The MEMS device according to the tenth aspect of the present invention is the MEMS device according to the sixth or eighth aspect, via the plurality of second terminals provided on the bottom surface of the substrate and the side surfaces of the substrate. A plurality of third wirings for electrically connecting the first terminal of the above and the plurality of second terminals are further provided.

The MEMS device according to the eleventh aspect of the present invention is a plurality of third wirings provided on the side surface of the substrate and electrically connected to the plurality of first terminals in the MEMS device according to the sixth or eighth aspect. Further equipped.

The MEMS device according to the twelfth aspect of the present invention is the MEMS device according to the first aspect, in which the MEMS element is an acoustic transducer.

The MEMS device according to the thirteenth aspect of the present invention further includes an image pickup device provided on the substrate in the MEMS device according to the first aspect.

The MEMS device according to the 14th aspect of the present invention is the MEMS device according to the 13th aspect, in which the image pickup device is an infrared sensor.

The MEMS device according to the fifteenth aspect of the present invention is the MEMS device according to the thirteenth aspect, in which the image pickup device is a TOF (time of flight) sensor.

According to the present invention, it is possible to provide a MEMS device that can be miniaturized and can reduce the manufacturing cost.

FIG. 1 is a plan view of the MEMS device according to the first embodiment of the present invention. FIG. 2 is a plan view of the MEMS device without the lid. FIG. 3 is a bottom view of the MEMS device shown in FIG. FIG. 4 is a cross-sectional view of the MEMS device along the AA'line shown in FIG. FIG. 5 is a cross-sectional view of the MEMS element. FIG. 6 is a plan view of the MEMS device connected to the external device. FIG. 7 is a plan view of the MEMS device according to the first modification. FIG. 8 is a front view of the MEMS device shown in FIG. FIG. 9 is a bottom view of the MEMS device shown in FIG. FIG. 10 is a front view of the MEMS device according to the second modification. FIG. 11 is a plan view of the MEMS device according to the second embodiment of the present invention. FIG. 12 is a plan view of the MEMS device without the lid. FIG. 13 is a bottom view of the MEMS device shown in FIG. FIG. 14 is a front view of the MEMS device shown in FIG. FIG. 15 is a plan view of the MEMS device according to the third embodiment of the present invention. FIG. 16 is a plan view of the MEMS device without the lid. FIG. 17 is a bottom view of the MEMS device shown in FIG. FIG. 18 is a cross-sectional view of the MEMS device along the AA'line shown in FIG. FIG. 19 is a plan view of the MEMS device according to the fourth embodiment of the present invention. FIG. 20 is a bottom view of the MEMS device shown in FIG. FIG. 21 is a cross-sectional view of the MEMS device along the AA'line shown in FIG. FIG. 22 is a plan view of the MEMS device according to the fifth embodiment of the present invention. FIG. 23 is a plan view of the MEMS device without the lid. It is sectional drawing of the MEMS device along the AA'line shown in FIG. FIG. 25 is a schematic plan view of the MEMS device according to the first embodiment. FIG. 26 is a schematic plan view of the MEMS device according to the second embodiment. FIG. 27 is a schematic plan view of the MEMS device according to the third embodiment. FIG. 28 is a schematic plan view of the MEMS device according to the fourth embodiment. FIG. 29 is a schematic plan view of the MEMS device according to the fifth embodiment. FIG. 30 is a schematic plan view of the MEMS device according to the sixth embodiment. FIG. 31 is a schematic plan view of the MEMS device according to the seventh embodiment. FIG. 32 is a schematic plan view of the MEMS device according to the eighth embodiment. FIG. 33 is a schematic plan view of the MEMS device according to the ninth embodiment. FIG. 34 is a schematic plan view of the MEMS device according to the tenth embodiment. FIG. 35 is a schematic plan view of the MEMS device according to the eleventh embodiment. FIG. 36 is a schematic plan view of the MEMS device according to the twelfth embodiment. FIG. 37 is a schematic plan view of the MEMS device according to the thirteenth embodiment. FIG. 38 is a schematic plan view of the MEMS device according to the 14th embodiment. FIG. 39 is a schematic plan view of the MEMS device according to the fifteenth embodiment. FIG. 40 is a schematic plan view of the MEMS device according to the 16th embodiment. FIG. 41 is a schematic plan view of the MEMS device according to the 17th embodiment. FIG. 42 is a schematic plan view of the MEMS device according to the eighteenth embodiment. FIG. 43 is a schematic plan view of the MEMS device according to the 19th embodiment. FIG. 44 is a schematic plan view of the MEMS device according to the twentieth embodiment. FIG. 45 is a schematic plan view of the MEMS device according to the 21st embodiment. FIG. 46 is a schematic plan view of the MEMS device according to the 22nd embodiment. FIG. 47 is a schematic plan view of the MEMS device according to the 23rd embodiment. FIG. 48 is a schematic plan view of the MEMS device according to the 24th embodiment. FIG. 49 is a plan view of the MEMS device according to the seventh embodiment of the present invention. FIG. 50 is a plan view of the MEMS device without the lid. FIG. 51 is a bottom view of the MEMS device shown in FIG. 49. FIG. 52 is a cross-sectional view of the MEMS device along the AA'line shown in FIG.

Hereinafter, embodiments will be described with reference to the drawings. However, the drawings are schematic or conceptual, and the dimensions and ratios of each drawing are not necessarily the same as the actual ones. Further, even when the same part is represented between the drawings, the relationship and ratio of the dimensions of each other may be represented differently. In the following description, elements having the same function and configuration are designated by the same reference numerals, and duplicate description will be omitted.

The following embodiments relate to the configuration of MEMS devices. The MEMS device referred to in the present embodiment is an electronic device including a plurality of MEMS elements (also referred to as a MEMS element array) and an integrated circuit for controlling the plurality of MEMS elements. MEMS (Micro Electro Mechanical Systems) is an element in which an electric circuit and a fine mechanical structure are integrated on one substrate.

[1] First Embodiment [1-1] Configuration of MEMS Device 1 FIG. 1 is a plan view of the MEMS device 1 according to the first embodiment of the present invention. FIG. 2 is a plan view of the MEMS device 1 in which the lid 13 is omitted. FIG. 3 is a bottom view of the MEMS device 1 shown in FIG. FIG. 4 is a cross-sectional view of the MEMS device 1 along the AA'line shown in FIG. The X direction shown in FIG. 1 is a direction along a certain side of the MEMS device 1, and the Y direction shown in FIG. 1 is a direction orthogonal to the X direction.

The MEMS device 1 according to the present embodiment constitutes a microphone device. The MEMS device 1 includes a glass substrate 10, a plurality of MEMS elements 11, an integrated circuit (IC) 12, a lid (cover) 13, and terminals 24. In this embodiment, as an example, the MEMS device 1 is shown to include two MEMS elements 11.

The lid 13 is configured to cover the element mounted on the glass substrate 10, and its peripheral portion is fixed to the glass substrate 10. The lid 13 functions as an electrical shield and is provided to protect the MEMS element 11 and the integrated circuit 12 from physical contact from the outside. The lid 13 is made of a metal material. As a method of fixing the lid 13 to the glass substrate 10, for example, a solder reflow step is used.

The material of the glass substrate 10 is not particularly limited, and any glass can be used. For example, as the glass substrate 10, non-alkali glass, alumino-silicate glass, or the like can be used. The non-alkali glass is a glass in which the content of an alkaline component such as sodium or potassium is, for example, 0.1% by mass or less.

The glass substrate 10 is a substrate for mounting the MEMS element 11 and the integrated circuit 12. The glass substrate 10 has a quadrangle. The glass substrate 10 has two through holes 20 corresponding to the two MEMS elements 11. The through hole 20 penetrates the glass substrate 10. The through hole 20 has a circular shape. Further, the through hole 20 has a tapered shape, for example, due to an opening process such as wet etching. The through hole 20 functions as a sound hole through which sound waves pass.

A plurality of MEMS elements 11 are provided on the glass substrate 10. The planar shape of each MEMS element 11 is, for example, a circle. The MEMS element 11 is arranged so as to cover the through hole 20.

The MEMS element 11 of the present embodiment comprises an acoustic transducer. The acoustic transducer of the present embodiment is a conversion element that converts sound into an electric signal or an electric signal into sound, and the acoustic transducer of this embodiment is an acoustic element that transmits and receives sound waves, and is a microphone. And speakers included. In the present embodiment, a case where the MEMS element 11 is composed of a microphone (also referred to as a MEMS microphone) will be described as an example. The specific configuration of the MEMS element 11 will be described later.

On the glass substrate 10, a wiring 21 electrically connected to the vibration electrode of the MEMS element 11 and a wiring 22 electrically connected to the fixed electrode of the MEMS element 11 are provided. The other end of the wiring 21 is electrically connected to the integrated circuit 12 via the bump 23. The other end of the wiring 22 is electrically connected to the integrated circuit 12 via the bump 23. A plurality of terminals electrically connected to the plurality of bumps 23 are provided on the bottom surface of the integrated circuit 12.

The integrated circuit 12 is mounted on the glass substrate 10. The integrated circuit 12 is arranged between the two MEMS elements 11 and is arranged in the center between the two MEMS elements 11. The integrated circuit 12 is configured as an IC chip, for example, an ASIC (Application Specific Integrated Circuit). An ASIC is an integrated circuit designed and manufactured by integrating a plurality of functional circuits into one for a specific application. The integrated circuit 12 controls a plurality of MEMS elements 11 and processes signals of the plurality of MEMS elements 11.

A plurality of terminals 24 and a plurality of wirings 25 are provided on the glass substrate 10. In this embodiment, three terminals 24 are shown as an example. The plurality of terminals 24 are arranged outside the lid 13. One end of the wiring 25 is electrically connected to the terminal 24, and the other end of the wiring 25 is electrically connected to the integrated circuit 12 via the bump 23. The upper surface of the plurality of wirings 25 is covered with an insulating film, and the plurality of wirings 25 are electrically insulated from the lid 13. The plurality of terminals 24 are electrically connected to an external device (not shown).

[1-2] Configuration of MEMS Element 11 Next, an example of the configuration of the MEMS element 11 will be described. FIG. 5 is a cross-sectional view of the MEMS element 11. The MEMS element 11 is arranged so as to cover the through hole 20 formed in the glass substrate 10.

A membrane (also referred to as a diaphragm) 30 is provided on the glass substrate 10 so as to cover the through hole 20. The planar shape of the membrane 30 is, for example, a circle. The size of the membrane 30 is larger than the size of the through hole 20. The membrane 30 is composed of an insulating layer 30A, a conductive layer 30B, and an insulating layer 30C laminated in this order. The conductive layer 30B functions as an electrode (vibration electrode) of the membrane 30. The conductive layer 30B is made of metal, for example, molybdenum (Mo). The insulating layer 30A and the insulating layer 30C are each composed of, for example, silicon nitride (SiNx). The "x" described in the chemical formula means that the composition ratio is arbitrary.

The membrane 30 has at least one through hole 31. The through hole 31 is circular and penetrates the membrane 30. The through hole 31 has a function of releasing the differential pressure generated on both sides of the membrane 30 due to the change in the external air pressure.

Above the membrane 30, a back plate 33 is provided via a cavity 32. The planar shape of the back plate 33 is, for example, a circle. The back plate 33 is configured by laminating a conductive layer 33A, an insulating layer 33B, and a protective film 33C in this order. The conductive layer 33A functions as an electrode (fixed electrode) of the back plate 33. The conductive layer 33A is made of metal, and is made of molybdenum (Mo), aluminum (Al), an aluminum alloy, or the like. The insulating layer 33B is made of, for example, silicon nitride (SiNx). The protective film 33C is made of, for example, amorphous silicon. The protective film 33C has a function of protecting the insulating layer 33B of the back plate 33 when the sacrificial layer (for example, silicon oxide (SiOx)) for forming the cavity 32 is removed by wet etching.

The above-mentioned cavity 32 is provided between the membrane 30 and the back plate 33. The cavity 32 is surrounded by an insulating layer 34. The insulating layer 34 and the insulating layer 33B of the back plate 33 are continuous layers and are formed in the same film forming process.

The back plate 33 has a plurality of through holes 35. The through hole 35 is circular and penetrates the back plate 33. The plurality of through holes 35 are uniformly arranged over the entire surface of the back plate 33. The plurality of through holes 35 have a function of reducing the viscoelasticity of the air existing in the cavity 32 from hindering the vibration of the membrane 30 due to the sound pressure (or sound wave).

The terminal 37 is provided on the extending portion where the conductive layer 30B is pulled out in an arbitrary direction, and is electrically connected to the conductive layer 30B. The terminal 37 is exposed from the insulating layer 30C. The terminal 37 is electrically connected to the wiring 21 connected to the integrated circuit 12.

The terminal 38 is configured by the conductive layer 33A being pulled out in an arbitrary direction. The terminal 38 is exposed from the insulating layer 33B and the protective film 33C. An insulating layer 36 is provided between the terminal 38 and the glass substrate 10. The insulating layer 36 is made of, for example, silicon oxide (SiOx). The terminal 38 is electrically connected to the wiring 22 connected to the integrated circuit 12.

Although the terminal 37 and the terminal 38 are shown in the same cross section in FIG. 5, the positions for pulling out the terminal 37 and the terminal 38 can be arbitrarily set.

[1-3] Operation In the present embodiment, the MEMS element 11 is composed of an acoustic transducer. When sound waves are input to the acoustic transducer 11, the membrane 30 vibrates due to sound pressure, and the distance between the vibrating electrode 30B of the membrane 30 and the fixed electrode 33A of the back plate 33 changes. When the distance between the vibrating electrode 30B and the fixed electrode 33A changes, the capacitance between the vibrating electrode 30B and the fixed electrode 33A changes. The integrated circuit 12 applies a bias voltage between the terminal 37 electrically connected to the vibration electrode 30B and the terminal 38 electrically connected to the fixed electrode 33A, and is generated by a change in capacitance due to vibration. Take out the electrical signal to do. As a result, the sound pressure is converted into an electric signal.

The MEMS device 1 includes a plurality of acoustic transducers 11. The integrated circuit 12 controls the plurality of acoustic transducers 11 and processes the electric signals of the plurality of acoustic transducers 11. The integrated circuit 12 outputs a signal to the outside via the terminal 24 of the glass substrate 10.

Further, the integrated circuit 12 can detect or estimate the sound source direction by processing the electric signals detected by each of the plurality of acoustic transducers 11. Specifically, the integrated circuit 12 calculates the time difference between the electric signal detected by the first acoustic transducer and the electric signal detected by the second acoustic transducer arranged at a position different from that of the first acoustic transducer. , The sound source direction is detected using this time difference.

Further, the integrated circuit 12 can cancel noise by processing the electric signals detected by each of the plurality of acoustic transducers 11. Specifically, the integrated circuit 12 detects and identifies noise, and cancels the noise by adding a signal having a phase opposite to the noise to the source signal.

The acoustic transducer 11 can adjust the detectable sound wave according to the application. When the acoustic transducer 11 is used to detect the sound in the audible range, the frequency characteristic of the acoustic transducer 11 is adjusted to 20 Hz or more and 20 kHz or less, which is the audible range. When the acoustic transducer 11 is used to detect ultrasonic waves, the frequency characteristics of the acoustic transducer 11 are adjusted to 20 kHz or more and 30 MHz or less. The frequency characteristics of the acoustic transducer 11 can be adjusted by changing the size of the acoustic transducer 11, the thickness of each layer constituting the acoustic transducer 11, the tension, the distance between the vibration electrode 30B and the fixed electrode 33A, and the like.

[1-4] Example of Connection with External Device Next, an example of connection between the MEMS device 1 and the external device will be described. FIG. 6 is a plan view of the MEMS device 1 connected to the external device.

The MEMS device 1 can be connected to an external device by using a flexible printed wiring board (FPC) 40. The flexible printed wiring board 40 is a kind of printed circuit board, and is also called a flexible printed circuit board. The flexible printed wiring board 40 is a film-shaped printed circuit board in which an electric circuit is formed on a base film obtained by laminating a thin and soft insulating base film and a conductive metal.

The flexible printed wiring board 40 includes a plurality of wirings 41. Each of the plurality of wires 41 is electrically connected to the plurality of terminals 24.

The other end of the flexible printed wiring board 40 is electrically connected to an external device. The MEMS device 1 is electrically connected to an external device via the flexible printed wiring board 40.

[1-5] Modification Example Next, a modification of the terminal for connecting to an external device will be described.

FIG. 7 is a plan view of the MEMS device 1 according to the first modification. FIG. 8 is a front view of the MEMS device 1 shown in FIG. FIG. 9 is a bottom view of the MEMS device 1 shown in FIG.

A plurality of terminals 43 are provided on the bottom surface of the glass substrate 10. The terminal 24 provided on the upper surface of the glass substrate 10 and the terminal 43 provided on the bottom surface of the glass substrate 10 are electrically connected by the wiring 42. The wiring 42 extends from the terminal 24 through the side surface of the glass substrate 10 to the terminal 43.

According to the first modification, the terminal can be pulled out from the bottom surface of the glass substrate 10. Then, the MEMS device 1 and the external device can be connected to each other by using the terminal 43 provided on the bottom surface of the glass substrate 10.

FIG. 10 is a front view of the MEMS device 1 according to the second modification. The plan view of the MEMS device 1 according to the second modification is the same as that in FIG.

The terminal 24 provided on the upper surface of the glass substrate 10 is electrically connected to the wiring 42. The wiring 42 is provided on the side surface of the glass substrate 10 and extends halfway on the side surface of the glass substrate 10. The wiring 42 is also used as a terminal.

According to the second modification, wiring or terminals can be pulled out from the side surface of the glass substrate 10. Then, the MEMS device 1 and the external device can be connected by using wiring or terminals on the side surface of the glass substrate 10.

[1-6] Effects of First Embodiment As described in detail above, in the first embodiment, the MEMS device 1 includes a glass substrate 10, a plurality of MEMS elements 11, and an integrated circuit 12. The plurality of MEMS elements 11 and the integrated circuit 12 are mounted on the glass substrate 10. The integrated circuit 12 controls a plurality of MEMS elements 11. The two MEMS elements 11 are arranged on both sides of the integrated circuit 12.

Therefore, according to the first embodiment, the plurality of MEMS elements 11 and the integrated circuit 12 can be mounted on the same glass substrate 10, and the plurality of MEMS elements 11 and the integrated circuit 12 can be integrally configured. In addition, the MEMS device 1 can be miniaturized.

Further, a plurality of MEMS elements 11 are arranged around the integrated circuit 12 around the integrated circuit 12. Therefore, since the distance between the integrated circuit 12 and the MEMS element 11 can be shortened, the wiring connecting the integrated circuit 12 and the MEMS element 11 can be shortened. Thereby, the signal delay between the integrated circuit 12 and the MEMS element 11 can be reduced. As a result, the performance of the MEMS device 1 can be improved.

Further, the distance between the integrated circuit 12 and the plurality of MEMS elements 11 can be made substantially the same. As a result, the delay time difference between the electrical signals of the plurality of MEMS elements 11 can be reduced. As a result, the detection accuracy of the sound source direction by the MEMS device 1 can be improved.

Further, by shortening the wiring connecting the integrated circuit 12 and the MEMS element 11, the influence of noise can be reduced. Thereby, the SN ratio (signal-to-noise ratio) can be improved.

Further, the plurality of MEMS elements 11 provided on the same glass substrate 10 can be formed by the same manufacturing process. Thereby, individual differences in the characteristics of the plurality of MEMS elements 11 can be reduced.

Further, the MEMS device 1 can be configured by using the glass substrate 10. As a result, the manufacturing cost can be reduced as compared with the case where the MEMS device is configured by using a semiconductor substrate or the like.

[2] Second Embodiment In the second embodiment, a plurality of penetrating vias are provided on the glass substrate 10. Then, the terminal for connecting the MEMS device 1 and the external device is pulled out to the bottom surface of the glass substrate 10.

FIG. 11 is a plan view of the MEMS device 1 according to the second embodiment of the present invention. FIG. 12 is a plan view of the MEMS device 1 in which the lid 13 is omitted. FIG. 13 is a bottom view of the MEMS device 1 shown in FIG. FIG. 14 is a front view of the MEMS device 1 shown in FIG. The cross-sectional view of the MEMS device 1 along the AA'line of FIG. 11 is the same as that of FIG.

A plurality of penetrating vias 44 are provided on the glass substrate 10. The penetrating via 44 penetrates the glass substrate 10. In this embodiment, three penetrating vias 44 are shown as an example. The plurality of penetrating vias 44 are arranged inside the lid 13. The through via 44 is formed of a metal film provided on the side surface of the through hole formed in the glass substrate 10 and is formed in a cylindrical shape. As the penetrating via 44, for example, copper (Cu) is used.

The upper portion of the penetrating via 44 is electrically connected to the wiring 25. Further, the upper portion of the penetrating via 44 is electrically connected to the integrated circuit 12 via the wiring 25 and the bump 23. The lower portion of the penetrating via 44 is electrically connected to a terminal 43 provided on the bottom surface of the glass substrate 10.

According to the second embodiment, the terminal 43 can be pulled out from the bottom surface of the glass substrate 10. Then, the MEMS device 1 and the external device can be connected to each other by using the terminal 43 provided on the bottom surface of the glass substrate 10.

[3] Third Embodiment The third embodiment is a configuration example in which the MEMS element 11 and the integrated circuit 12 are connected by a bonding wire.

FIG. 15 is a plan view of the MEMS device 1 according to the third embodiment of the present invention. FIG. 16 is a plan view of the MEMS device 1 in which the lid 13 is omitted. FIG. 17 is a bottom view of the MEMS device 1 shown in FIG. FIG. 18 is a cross-sectional view of the MEMS device 1 along the AA'line shown in FIG.

An integrated circuit 12 is provided on the glass substrate 10. The integrated circuit 12 is adhered to the glass substrate 10 by the adhesive 50.

On the glass substrate 10, a wiring 21 electrically connected to the vibration electrode of the MEMS element 11 and a terminal 26 electrically connected to the wiring 21 are provided. Further, on the glass substrate 10, a wiring 22 electrically connected to the fixed electrode of the MEMS element 11 and a terminal 27 electrically connected to the wiring 22 are provided. The terminals 26 and 27 are each electrically connected to the integrated circuit 12 via two bonding wires 51. A plurality of terminals electrically connected to the plurality of bonding wires 51 are provided on the upper surface of the integrated circuit 12.

A plurality of terminals 24, a plurality of wirings 25, and a plurality of terminals 28 are provided on the glass substrate 10. In this embodiment, three terminals 24 are shown as an example. The plurality of terminals 24 are arranged outside the lid 13. Each of the plurality of terminals 24 is electrically connected to the plurality of terminals 28 via the plurality of wirings 25. The upper surface of the plurality of wirings 25 is covered with an insulating film, and the plurality of wirings 25 are electrically insulated from the lid 13. Each of the plurality of terminals 28 is electrically connected to the integrated circuit 12 via the plurality of bonding wires 51. The plurality of terminals 24 are electrically connected to an external device (not shown).

According to the third embodiment, the MEMS device 1 can be formed by using the die bonding step and the wire bonding step. It is also possible to apply the second embodiment to the third embodiment.

[4] Fourth Embodiment In the fourth embodiment, the MEMS element 11 is arranged on the upper surface of the glass substrate 10, and the integrated circuit 12 is arranged on the bottom surface of the glass substrate 10.

FIG. 19 is a plan view of the MEMS device 1 according to the fourth embodiment of the present invention. FIG. 20 is a bottom view of the MEMS device 1 shown in FIG. FIG. 21 is a cross-sectional view of the MEMS device 1 along the AA'line shown in FIG.

A plurality of MEMS elements 11 are provided on the upper surface of the glass substrate 10. Penetration vias 52 and 53 are provided on the glass substrate 10 corresponding to each MEMS element 11. The penetrating vias 52 and 53 penetrate the glass substrate 10. The upper portion of the penetrating via 52 is electrically connected to the wiring 21 electrically connected to the vibration electrode of the MEMS element 11. The upper portion of the penetrating via 53 is electrically connected to the wiring 22 electrically connected to the fixed electrode of the MEMS element 11. As the penetrating vias 52 and 53, for example, copper (Cu) is used.

The integrated circuit 12 is arranged on the bottom surface side of the glass substrate 10. Wiring 54 and wiring 55 are provided on the bottom surface of the glass substrate 10. One end of the wiring 54 is electrically connected to the lower portion of the through via 52, and the other end of the wiring 54 is electrically connected to the integrated circuit 12 via the bump 23. One end of the wiring 55 is electrically connected to the lower part of the through via 53, and the other end of the wiring 55 is electrically connected to the integrated circuit 12 via the bump 23.

A plurality of terminals 24 and a plurality of wirings 25 are provided on the bottom surface of the glass substrate 10. In this embodiment, three terminals 24 are shown as an example. One end of the wiring 25 is electrically connected to the terminal 24, and the other end of the wiring 25 is electrically connected to the integrated circuit 12 via the bump 23. The plurality of terminals 24 are electrically connected to an external device (not shown).

The MEMS element 11 is composed of a sensor, an actuator, a transducer, or the like. When the MEMS element 11 is composed of an acoustic transducer, the glass substrate 10 is provided with a through hole corresponding to the MEMS element 11. A lid that covers the plurality of MEMS elements 11 may be appropriately provided on the upper surface of the glass substrate 10. Further, a lid covering the integrated circuit 12 may be appropriately provided on the bottom surface of the glass substrate 10.

According to the fourth embodiment, the MEMS element 11 can be arranged on the upper surface of the glass substrate 10, and the integrated circuit 12 can be arranged on the bottom surface of the glass substrate 10. Further, the MEMS element 11 and the integrated circuit 12 can be electrically connected by using the penetrating via.

[5] Fifth Embodiment In the fifth embodiment, an opening is provided in the glass substrate 10, and the integrated circuit 12 is arranged in the opening.

FIG. 22 is a plan view of the MEMS device 1 according to the fifth embodiment of the present invention. FIG. 23 is a plan view of the MEMS device 1 in which the lid 13 is omitted. FIG. 24 is a cross-sectional view of the MEMS device 1 along the AA'line shown in FIG. The bottom view of the MEMS device 1 shown in FIG. 22 is the same as that shown in FIG. 17 in the third embodiment.

The glass substrate 10 has an opening 56. The opening 56 is arranged between the two MEMS elements 11. The size of the opening 56 is set to be slightly larger than the size of the integrated circuit 12. The depth of the opening 56 is set to be substantially the same as the height of the integrated circuit 12.

The integrated circuit 12 is arranged in the opening 56 of the glass substrate 10. The integrated circuit 12 is adhered to the glass substrate 10 by the adhesive 50.

On the glass substrate 10, a wiring 21 electrically connected to the vibration electrode of the MEMS element 11 and a terminal 26 electrically connected to the wiring 21 are provided. Further, on the glass substrate 10, a wiring 22 electrically connected to the fixed electrode of the MEMS element 11 and a terminal 27 electrically connected to the wiring 22 are provided. The terminals 26 and 27 are each electrically connected to the integrated circuit 12 via two bonding wires 51.

A plurality of terminals 24, a plurality of wirings 25, and a plurality of terminals 28 are provided on the glass substrate 10. In this embodiment, three terminals 24 are shown as an example. The plurality of terminals 24 are arranged outside the lid 13. Each of the plurality of terminals 24 is electrically connected to the plurality of terminals 28 via the plurality of wirings 25. The upper surface of the plurality of wirings 25 is covered with an insulating film, and the plurality of wirings 25 are electrically insulated from the lid 13. Each of the plurality of terminals 28 is electrically connected to the integrated circuit 12 via the plurality of bonding wires 51. The plurality of terminals 24 are electrically connected to an external device (not shown).

According to the fifth embodiment, the integrated circuit 12 can be embedded in the glass substrate 10. Further, the MEMS device 1 can be formed by using the die bonding step and the wire bonding step.

[6] Sixth Embodiment The sixth embodiment is a configuration example relating to the arrangement of one or a plurality of MEMS elements 11.

(First Example)
FIG. 25 is a schematic plan view of the MEMS device 1 according to the first embodiment. FIG. 25 shows a glass substrate 10, a MEMS element 11, an integrated circuit 12, and wirings 21 and 22. The components other than the illustrated components have the same configuration as that of the above embodiment, and the shapes of the other components are appropriately set according to the embodiment. The same applies to the other examples described below.

The MEMS device 1 includes one MEMS element 11. The MEMS element 11 is electrically connected to the integrated circuit 12 via the wirings 21 and 22. The wiring 21 is electrically connected to the vibration electrode of the MEMS element 11. The wiring 22 is electrically connected to the fixed electrode of the MEMS element 11.

(Second Example)
FIG. 26 is a schematic plan view of the MEMS device 1 according to the second embodiment. The MEMS device 1 includes three MEMS elements 11. The three MEMS elements 11 are arranged in an L shape. Each of the three MEMS elements 11 is electrically connected to the integrated circuit 12 via the three wires 21. Further, the wiring 22 is commonly connected to the three MEMS elements 11 and electrically connected to the integrated circuit 12. The wiring connection method can be set arbitrarily. The same applies to the other examples described below.

(Third Example)
FIG. 27 is a schematic plan view of the MEMS device 1 according to the third embodiment. The outer shape of the glass substrate 10 is, for example, a square, and the outer shape of the integrated circuit 12 is also, for example, a square. The integrated circuit 12 is arranged in the center of the glass substrate 10. One diagonal of the glass substrate 10 is arranged so as to form an angle of 45 degrees with one diagonal of the integrated circuit 12. In other words, one side of the glass substrate 10 is arranged so as to form an angle of 45 degrees with one side of the integrated circuit 12. That is, the outer shape of the integrated circuit 12 is arranged so as to form an angle of 45 degrees with respect to the outer shape of the glass substrate 10.

The MEMS device 1 includes four MEMS elements 11. The four MEMS elements 11 are arranged adjacent to each of the four sides of the integrated circuit 12. Further, the four MEMS elements 11 are arranged at the four corners of the glass substrate 10, respectively. Each MEMS element 11 is electrically connected to the integrated circuit 12 via the wirings 21 and 22.

(Fourth Example)
FIG. 28 is a schematic plan view of the MEMS device 1 according to the fourth embodiment. The outer shape of the glass substrate 10 is, for example, a square, and the outer shape of the integrated circuit 12 is also, for example, a square. The integrated circuit 12 is arranged in the center of the glass substrate 10. The diagonal line of the glass substrate 10 is arranged so as to overlap the diagonal line of the integrated circuit 12. In other words, one side of the glass substrate 10 is arranged parallel to one side of the integrated circuit 12.

The MEMS device 1 includes eight MEMS elements 11. The eight circles in FIG. 28 correspond to the MEMS element 11. The eight MEMS elements 11 are evenly arranged around the integrated circuit 12. Specifically, four MEMS elements 11 are arranged at each of the four corners of the glass substrate 10, and four MEMS elements 11 are arranged at the central portions of the four sides of the glass substrate 10.

Each of the eight MEMS elements 11 is electrically connected to the integrated circuit 12 via the eight wires 21. Further, the wiring 22 is commonly connected to the eight MEMS elements 11 and electrically connected to the integrated circuit 12.

(Fifth Example)
FIG. 29 is a schematic plan view of the MEMS device 1 according to the fifth embodiment. The MEMS device 1 includes four MEMS elements 11. The four MEMS elements 11 are arranged along one direction. Each of the four MEMS elements 11 is electrically connected to the integrated circuit 12 via the four wires 21. Further, the wiring 22 is commonly connected to the four MEMS elements 11 and electrically connected to the integrated circuit 12.

(6th Example)
FIG. 30 is a schematic plan view of the MEMS device 1 according to the sixth embodiment. FIG. 30 shows the layout of the glass substrate 10, the MEMS element 11, and the integrated circuit 12. The components other than the glass substrate 10, the MEMS element 11, and the integrated circuit 12 are the same as those in the first embodiment, and can be appropriately designed according to the shape of the MEMS device 1. The same applies to the following examples.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged on the center of the glass substrate 10. The "upper", "lower", and "right" used when explaining the position of the integrated circuit 12 are the directions when the drawing is viewed from the front.

The MEMS device 1 includes two MEMS elements 11. The two MEMS elements 11 are arranged in one direction. The auxiliary line (dashed line) shown in FIG. 30 represents the arrangement direction of the MEMS element 11. The same applies to the following examples.

(7th Example)
FIG. 31 is a schematic plan view of the MEMS device 1 according to the seventh embodiment.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged on the center of the glass substrate 10.

The MEMS device 1 includes three MEMS elements 11. The three MEMS elements 11 are arranged in one direction.

(8th Example)
FIG. 32 is a schematic plan view of the MEMS device 1 according to the eighth embodiment.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged in the center of the glass substrate 10.

The MEMS device 1 includes six MEMS elements 11. The six MEMS elements 11 are arranged in two rows along one direction.

(9th Example)
FIG. 33 is a schematic plan view of the MEMS device 1 according to the ninth embodiment.

The glass substrate 10 has a trapezoidal shape. The integrated circuit 12 is arranged on the center of the glass substrate 10.

The MEMS device 1 includes three MEMS elements 11. The three MEMS elements 11 are arranged in one direction along the bottom of the trapezoid.

(10th Example)
FIG. 34 is a schematic plan view of the MEMS device 1 according to the tenth embodiment.

The glass substrate 10 has a trapezoidal shape. The integrated circuit 12 is arranged on the right side of the center of the glass substrate 10.

The MEMS device 1 includes six MEMS elements 11. The three MEMS elements 11 are arranged in one direction along one side of the trapezoidal glass substrate 10. The remaining three MEMS elements 11 are arranged in one direction along the other side of the trapezoidal glass substrate 10.

(11th Example)
FIG. 35 is a schematic plan view of the MEMS device 1 according to the eleventh embodiment.

The glass substrate 10 has a trapezoidal shape. The integrated circuit 12 is arranged below the center of the glass substrate 10.

The MEMS device 1 includes six MEMS elements 11. The three MEMS elements 11 are arranged in the first direction. The remaining three MEMS elements 11 are arranged in a second direction that intersects the first direction.

(12th Example)
FIG. 36 is a schematic plan view of the MEMS device 1 according to the twelfth embodiment.

The glass substrate 10 has a hexagonal shape. The integrated circuit 12 is arranged in the center of the glass substrate 10.

The MEMS device 1 includes six MEMS elements 11. Each of the six MEMS elements 11 is arranged at the six corners of the hexagonal glass substrate 10. Two adjacent MEMS elements 11 are arranged in one direction.

(13th Example)
FIG. 37 is a schematic plan view of the MEMS device 1 according to the thirteenth embodiment.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged in the center of the glass substrate 10.

The MEMS device 1 includes four MEMS elements 11. The four MEMS elements 11 are arranged at the four corners of the rectangular glass substrate 10. In other words, the four MEMS elements 11 are arranged in two directions, a first direction along a certain side of the glass substrate 10 and a second direction orthogonal to the first direction.

(14th Example)
FIG. 38 is a schematic plan view of the MEMS device 1 according to the 14th embodiment.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged at the upper right of the glass substrate 10.

The MEMS device 1 includes five MEMS elements 11. The five MEMS elements 11 are arranged in two directions, a first direction along a certain side of the glass substrate 10 and a second direction orthogonal to the first direction.

(15th Example)
FIG. 39 is a schematic plan view of the MEMS device 1 according to the fifteenth embodiment.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged at the upper right of the glass substrate 10.

The MEMS device 1 includes seven MEMS elements 11. The seven MEMS elements 11 are arranged in two directions, a first direction along a certain side of the glass substrate 10 and a second direction orthogonal to the first direction.

(16th Example)
FIG. 40 is a schematic plan view of the MEMS device 1 according to the 16th embodiment.

The glass substrate 10 has a quadrangle. The glass substrate 10 has two integrated circuits 12.

The MEMS device 1 includes 16 MEMS elements 11. The eight MEMS elements 11 are arranged in a quadrangle around one of the integrated circuits 12. The remaining eight MEMS elements 11 are arranged in a quadrangle around the other integrated circuit 12.

(17th Example)
FIG. 41 is a schematic plan view of the MEMS device 1 according to the 17th embodiment.

The glass substrate 10 has a quadrangle with rounded corners.

The MEMS device 1 includes four MEMS elements 11. Each of the four MEMS elements 11 is arranged at the four corners of the glass substrate 10.

(18th Example)
FIG. 42 is a schematic plan view of the MEMS device 1 according to the eighteenth embodiment.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged at the upper right of the glass substrate 10.

The MEMS device 1 includes three MEMS elements 11. The three MEMS elements 11 are arranged in an arc shape around the integrated circuit 12.

(19th Example)
FIG. 43 is a schematic plan view of the MEMS device 1 according to the 19th embodiment.

The glass substrate 10 has a quadrangle. The integrated circuit 12 is arranged below the center of the glass substrate 10.

The MEMS device 1 includes seven MEMS elements 11. The seven MEMS elements 11 are arranged in an arc shape around the integrated circuit 12.

(20th Example)
FIG. 44 is a schematic plan view of the MEMS device 1 according to the twentieth embodiment.

The glass substrate 10 has a hexagonal shape. The integrated circuit 12 is arranged in the center of the glass substrate 10.

The MEMS device 1 includes six MEMS elements 11. The six MEMS elements 11 are arranged in a circle around the integrated circuit 12.

(21st Example)
FIG. 45 is a schematic plan view of the MEMS device 1 according to the 21st embodiment.

The glass substrate 10 has a circular shape. The integrated circuit 12 is arranged in the center of the glass substrate 10.

The MEMS device 1 includes six MEMS elements 11. The six MEMS elements 11 are arranged in a circle around the integrated circuit 12.

(22nd Example)
FIG. 46 is a schematic plan view of the MEMS device 1 according to the 22nd embodiment.

The glass substrate 10 has a fan shape. The integrated circuit 12 is arranged at the upper right of the glass substrate 10.

The MEMS device 1 includes three MEMS elements 11. The three MEMS elements 11 are arranged in an arc shape around the integrated circuit 12.

(23rd Example)
FIG. 47 is a schematic plan view of the MEMS device 1 according to the 23rd embodiment.

The glass substrate 10 has a semi-cylindrical shape. In other words, the glass substrate 10 has a shape in which one side of a quadrangle protrudes in an arc shape. The integrated circuit 12 is arranged below the center of the glass substrate 10.

The MEMS device 1 includes seven MEMS elements 11. The seven MEMS elements 11 are arranged in an arc shape around the integrated circuit 12.

Not limited to the above-mentioned plurality of embodiments, the number of MEMS elements 11 included in the MEMS device 1 can be arbitrarily set.

(24th Example)
FIG. 48 is a schematic plan view of the MEMS device 1 according to the 24th embodiment.

The glass substrate 10 has a triangle. The integrated circuit 12 is arranged on the center of the glass substrate 10.

The MEMS device 1 includes three MEMS elements 11. The three MEMS elements 11 are arranged in one direction.

[7] Seventh Embodiment In the seventh embodiment, the MEMS device 1 includes an image pickup device. The MEMS device 1 according to the seventh embodiment constitutes an image sensor module.

[7-1] Configuration of MEMS Device 1 FIG. 49 is a plan view of the MEMS device 1 according to the seventh embodiment of the present invention. FIG. 50 is a plan view of the MEMS device 1 in which the lid 13 is omitted. FIG. 51 is a bottom view of the MEMS device 1 shown in FIG. 49. FIG. 52 is a cross-sectional view of the MEMS device 1 along the AA'line shown in FIG. 49.

The MEMS device 1 includes an image pickup device 60 and an integrated circuit 12. The image sensor 60 and the integrated circuit 12 are arranged in the center of the glass substrate 10.

The image sensor 60 converts an optical image of a subject into an electric signal (image data). The image sensor 60 is also called an image sensor. The image sensor 60 is mounted on the glass substrate 10 via a plurality of bumps 61. The method of mounting the image sensor 60 on the glass substrate 10 can be arbitrarily designed.

The integrated circuit 12 is mounted on the glass substrate 10 via a plurality of bumps. The integrated circuit 12 is arranged adjacent to the image sensor 60 in the Y direction, for example. The integrated circuit 12 is electrically connected to the image pickup device 60 and the plurality of MEMS elements 11 via a plurality of wirings 62 formed on the glass substrate 10. The integrated circuit 12 controls the image pickup element 60 and the plurality of MEMS elements 11 and processes the signals of the image pickup element 60 and the plurality of MEMS elements 11.

A plurality of MEMS elements 11 are provided around the image sensor 60 and the integrated circuit 12. In this embodiment, eight MEMS elements 11 are illustrated. The glass substrate 10 has a through hole 20 corresponding to the MEMS element 11.

The integrated circuit 12 and the image sensor 60 electrically connect to a plurality of terminals 63 provided on the bottom surface of the glass substrate 10 via a plurality of wirings formed on the glass substrate 10 and a plurality of through vias (not shown). Be connected.

The lid 13 has an opening 13A and a plurality of through holes 13B. The size of the opening 13A is substantially the same as the size of the image sensor 60, and is provided to expose the image sensor 60. The plurality of through holes 13B are provided corresponding to the plurality of MEMS elements 11 and function as sound holes through which sound waves pass.

On the glass substrate 10, a plurality of shielding members 64 provided corresponding to the plurality of MEMS elements 11 are provided. An example of the structural arrangement of the shielding member 64 has a cylindrical shape so as to surround the MEMS element 11. The shielding member 64 is arranged so as to surround the through hole 13B. The shielding member 64 is in contact with the lid 13, is integrally formed with the lid 13, and is made of the same material as the lid 13. The shielding member 64 shields sound waves. The shielding member 64 is insulated from the MEMS element 11.

[7-2] Operation The image sensor 60 images a subject through the opening 13A of the lid 13 and converts an optical image of the subject into an electric signal. The interface signal of the image sensor 60 and the like are sent to the integrated circuit 12. Alternatively, the interface signal or the like of the image sensor 60 is output to the outside via the terminal 63.

Each of the plurality of MEMS elements 11 is composed of an acoustic transducer. The acoustic transducer 11 receives sound waves through the through hole 13B of the lid 13. The acoustic transducer 11 detects a sound wave and converts the sound wave into an electric signal. The output signals of the plurality of acoustic transducers 11 are sent to the integrated circuit 12.

The integrated circuit 12 controls the image pickup element 60 and the plurality of MEMS elements 11 and processes the signals of the image pickup element 60 and the plurality of MEMS elements 11. The integrated circuit 12 outputs a signal to the outside via the terminal 63.

[7-3] Effect of the 7th Embodiment According to the 7th embodiment, the plurality of MEMS elements 11 and the image pickup device 60 can be mounted on the same glass substrate 10, and the plurality of MEMS elements 11 and the image pickup element can be mounted on the same glass substrate 10. 60 can be integrally configured. In addition, the MEMS device 1 including the image sensor module can be miniaturized.

Further, the user can identify an object from the image captured by the image sensor 60 and detect the sound from the object (sound source) by using a plurality of MEMS elements (acoustic transducers) 11. Further, the sound source direction can be detected by using a plurality of MEMS elements 11. For example, the MEMS device 1 can be combined with a security camera.

Further, the sound detected by the plurality of MEMS elements 11 is recorded by the external device, and the image captured by the image pickup device 60 is recorded by the external device. Then, after recording the video and sound, it is possible to realize a usage method such as acquiring the sound from a specific sound source while checking the video.

The image sensor 60 according to the seventh embodiment may be an infrared sensor. The infrared sensor receives infrared rays emitted from an object and converts them into an electric signal. The plurality of MEMS elements 11 are composed of acoustic transducers, and detect the direction of the object by detecting the sound from the object. That is, in this embodiment, a device that detects an optical image of an object that emits infrared rays and a device that detects the direction of the object can be integrally configured as the MEMS device 1.

Further, the image sensor 60 according to the seventh embodiment may be a TOF (time of flight) sensor. The TOF sensor is used in a device that detects the reflected light emitted from a light source and reflected by an object and measures the distance to the object. The plurality of MEMS elements 11 are composed of acoustic transducers, and detect the direction of the object by detecting the sound from the object. That is, in this embodiment, the device for measuring the distance to the object and the device for detecting the direction of the object can be integrally configured as the MEMS device 1.

[8] Other Examples In the above embodiment, an acoustic transducer has been described as an example of the MEMS element, but the present invention is not limited to this. The MEMS element according to the present embodiment can be applied to various sensors having a MEMS mechanism such as an acceleration sensor, a gyro sensor, an inclination sensor, and a pressure sensor. Further, the MEMS element according to the present embodiment can be applied to various sensors, actuators, transducers and the like using a glass substrate.

Further, the plurality of MEMS elements 11 provided in the MEMS device 1 may be different types of sensors. For example, the MEMS device 1 may include an acoustic transducer, a pressure sensor, and the like.

Further, the MEMS device 1 may include various sensors having no MEMS mechanism in addition to the plurality of MEMS elements 11.

The present invention is not limited to the above-described embodiment, and can be variously modified at the implementation stage without departing from the gist thereof. In addition, each embodiment may be carried out in combination as appropriate, and in that case, the combined effect can be obtained. Further, the above-described embodiment includes various inventions, and various inventions can be extracted by a combination selected from a plurality of disclosed constituent requirements. For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, if the problem can be solved and the effect is obtained, the configuration in which the constituent requirements are deleted can be extracted as an invention.

1 ... MEMS device, 10 ... glass substrate, 11 ... MEMS element, 12 ... integrated circuit, 13 ... lid, 20 ... through hole, 21,22 ... wiring, 23 ... bump, 24 ... terminal, 25 ... wiring, 26-28 ... Terminal, 30 ... Membrane, 30A ... Insulation layer, 30B ... Vibration electrode, 30C ... Insulation layer, 31 ... Through hole, 32 ... Cavity, 33 ... Back plate, 33A ... Fixed electrode, 33B ... Insulation layer, 33C ... Protective film , 34 ... Insulation layer, 35 ... Through hole, 36 ... Insulation layer, 37, 38 ... Terminal, 40 ... Flexible printed wiring board, 41 ... Wiring, 42 ... Wiring, 43 ... Terminal, 44 ... Through via, 50 ... Adhesive , 51 ... Bonding wire, 52, 53 ... Through via, 54, 55 ... Wiring, 56 ... Opening, Imaging element 60.

Claims (15)

A substrate made of glass and
With one or more MEMS elements provided on the substrate,
An integrated circuit provided on the substrate and controlling the MEMS element,
A MEMS device comprising. The MEMS device according to claim 1, wherein the plurality of MEMS elements are arranged in at least one direction. The MEMS device according to claim 1, wherein the plurality of MEMS elements are arranged in at least two orthogonal directions. The MEMS device according to claim 1, wherein the plurality of MEMS elements are arranged in an arc shape. A plurality of first wirings provided on the substrate and electrically connected to the MEMS element, and
A plurality of first bumps that electrically connect the plurality of first wirings and the integrated circuit, respectively.
The MEMS device according to any one of claims 1 to 4, further comprising. A plurality of first terminals provided on the substrate,
A plurality of second wirings provided on the substrate and electrically connected to the plurality of first terminals, and a plurality of second wirings.
A plurality of second bumps that electrically connect the plurality of second wirings and the integrated circuit, respectively.
The MEMS device according to claim 5, further comprising. A plurality of first wirings provided on the substrate and electrically connected to the MEMS element, and
A plurality of first bonding wires for electrically connecting the plurality of first wires and the integrated circuit, respectively.
The MEMS device according to any one of claims 1 to 4, further comprising. A plurality of first terminals provided on the substrate,
A plurality of second wirings provided on the substrate and electrically connected to the plurality of first terminals, and a plurality of second wirings.
A plurality of second bonding wires for electrically connecting the plurality of second wirings and the integrated circuit, respectively.
7. The MEMS device according to claim 7. A plurality of first wirings provided on the substrate and electrically connected to the integrated circuit,
A plurality of penetrating vias electrically connected to the plurality of first wirings and penetrating the substrate,
A plurality of terminals provided on the bottom surface of the substrate and electrically connected to the plurality of penetrating vias,
The MEMS device according to any one of claims 1 to 4, further comprising. A plurality of second terminals provided on the bottom surface of the substrate,
A plurality of third wirings that electrically connect the plurality of first terminals and the plurality of second terminals via the side surfaces of the substrate.
The MEMS device according to claim 6 or 8, further comprising. The MEMS device according to claim 6 or 8, further comprising a plurality of third wirings provided on the side surface of the substrate and electrically connected to the plurality of first terminals. The MEMS device according to any one of claims 1 to 11, wherein the MEMS element is an acoustic transducer. The MEMS device according to any one of claims 1 to 12, further comprising an image pickup device provided on the substrate. The MEMS device according to claim 13, wherein the image sensor is an infrared sensor. The MEMS device according to claim 13, wherein the image sensor is a TOF (time of flight) sensor.

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