JP2021146548A - Three-dimensional molding apparatus - Google Patents

Abstract

To ensure form accuracy of a molded object.SOLUTION: A three-dimensional molding apparatus comprises: a molding unit for depositing material layers including at least a molding material in a deposition direction; a light projection unit for projecting light onto the molding unit from an intersecting direction that intersects the deposition direction; a detection unit for detecting a width in the deposition direction of the light; and a control unit for controlling the molding unit on the basis of the width.SELECTED DRAWING: Figure 3

Description

The present invention relates to a three-dimensional modeling apparatus.

Devices for forming three-dimensional objects (three-dimensional objects) are generally melt deposition (MEX; Materials Extrusion), stereolithography (VPP; Vat Photo Polymerization), and powder sintering (PBF; Powder Bed Fusion). , Material Jetting (MJT), Binder Jetting (BJT), Sheet Lamination (SHL), Directed Energy Deposition (DED), etc. It has been known.

Further, a technique is disclosed in which the height of a registration marker is measured prior to the formation of a modeled object and the shape of the modeled object is corrected based on the measurement result (see, for example, Patent Document 1).

However, the technique of Patent Document 1 may not ensure the shape accuracy of the modeled object.

An object of the present invention is to secure the shape accuracy of a modeled object.

In order to solve the above-mentioned problems, a modeling unit in which at least a material layer containing a modeling material is laminated in a stacking direction, a light projecting unit that projects light onto the modeling unit from an intersecting direction intersecting the stacking direction, and the above. A detection unit that detects the width of light in the stacking direction and a control unit that controls the modeling unit based on the width are provided.

According to the present invention, the shape accuracy of the modeled object can be ensured.

It is a figure which shows the whole structure example of the three-dimensional modeling apparatus which concerns on embodiment. It is an enlarged view which shows the structural example around the modeled object in FIG. It is a figure of the arrangement example of a light projecting part and a detection part, (a) is a figure of a state in which a modeled object is not formed, and (b) is a figure of a state in which a modeled object is being formed. It is a block diagram of the hardware configuration example of the control part which concerns on 1st Embodiment. It is a block diagram of the functional structure example of the control part which concerns on 1st Embodiment. It is a flowchart of the operation example of the three-dimensional modeling apparatus which concerns on 1st Embodiment. It is a figure which shows the structural example of the modeling part which discharges the modeling material as a liquid. It is a figure of the configuration example around the modeled object which concerns on 2nd Embodiment. It is a figure of another example of the structure around the modeled object which concerns on 2nd Embodiment. It is a figure of an example of the structure of a test sample, (a) is a perspective view, (b) is an enlarged perspective view. It is a figure of another example of the structure including a test sample, (a) is a perspective view, (b) is an enlarged perspective view. It is a figure which shows the structural example around the modeled object which concerns on 3rd Embodiment. It is a figure of an example of a method of detecting a fall and a height, (a) is a figure of the method of detecting a fall, and (b) is a figure of the method of detecting the height. It is a block diagram of the functional structure example of the control part which concerns on 3rd Embodiment. It is a flowchart of the operation example of the 3D modeling apparatus which concerns on 3rd Embodiment. It is a figure explaining the height of the support material, (a) is the figure of the height of the support material which concerns on a comparative example, and (b) is the figure of the height of the support material which concerns on this Embodiment. It is the figure of the groove part, (a) is the perspective view of the groove part, and (b) is the perspective view of the surplus modeled object formed in the groove part.

Hereinafter, modes for carrying out the invention will be described with reference to the drawings.

In the embodiment, the material layer containing at least the modeling material is laminated in the stacking direction. In addition, light is projected onto the modeling portion from the intersecting direction intersecting the stacking direction, and the modeling portion is controlled based on the width of the light in the stacking direction. As a result, the modeled object is accurately modeled, and the shape accuracy of the modeled object is ensured.

Here, the material layer means one thin layer formed from the modeling material. Further, the modeled object means a modeled object in the process of modeling by a device for modeling a three-dimensional modeled object. The modeled object is modeled by laminating material layers.

Further, the three-dimensional modeled object is a modeled object in which a plurality of material layers for which modeling has been completed are laminated. In the embodiment, in the case of a material layer, it is referred to as "forming a material layer", and in the case of a modeled object, it is referred to as "creating a modeled object".

The Y direction shown in each of the following figures indicates the moving direction of the build plate 101, the Z direction indicates the stacking direction of the material layers, and the X direction indicates a direction intersecting both the Y direction and the Z direction. Here, the X direction is an example of the "intersection direction", the Z direction is an example of the "stacking direction", and the Y direction is an example of the "predetermined direction".

[Embodiment]
<Overall configuration example of the three-dimensional modeling device 500>
First, an apparatus for modeling a three-dimensional object according to an embodiment (hereinafter referred to as a three-dimensional modeling apparatus 500) will be described with reference to FIG. FIG. 1 is a diagram illustrating an example of the overall configuration of the three-dimensional modeling apparatus 500.

As shown in FIG. 1, the three-dimensional modeling apparatus 500 includes a modeling unit 100 and a control unit 400. Further, the modeling unit 100 collects the build plate 101, the stage heater 102, the carrier 111, the modeling guide 155, the supply means 112, the flying laser 115, the melting laser 116, the cleaning blade 117, and the cleaning blade 117. It is equipped with a case 118. Based on the input slice data, the modeling unit 100 forms the modeled object 200 by laminating the material layers containing the modeling material in the Z direction.

The three-dimensional modeling apparatus 500 further includes a light projecting unit 410 and a detecting unit 420, but these are not shown in FIG. 1, and these will be described in detail in FIGS. 3 and later.

The build plate 101 as an example of the "support base" is a member that supports the modeled object 200 by laminating material layers. The build plate 101 can be reciprocated in the Y direction of the arrow, and can move up and down in the Z direction of the arrow, for example, with a molding thickness of 0.05 mm pitch.

The stage heater 102 is arranged below the build plate 101, and controls the build plate 101 to a temperature that matches the modeling material 201.

The carrier 111 is composed of an endless belt which is a rotating member that moves around. Specifically, the carrier 111 is made of, for example, a PET film (Toray's Lumirror). However, it can also be composed of a polyimide film (Kapton H manufactured by Toray Industries, Inc.).

The carrier 111 is arranged above the build plate 101 (on the + Z direction side), and is laid around the rollers 151, 152 and the modeling guide 155. The carrier 111 supports the particulate modeling material 201, and transfers the modeling material 201 to above the modeling object 200 on the build plate 101. However, the carrier 111 is not limited to the endless belt, and may be formed of a rotating drum made of a cylindrical glass member or the like that supports the modeling material 201 and rotates in the arrow direction (transfer direction).

The modeling material 201 should be appropriately selected according to the target modeled object 200, but in the case of a resin, for example, PA12 (polyamide 12), PBT (polybutylene terephthalate), PSU (polysulfone), PA66 ( Polyamide 66), PET (polyethylene terephthalate), LCP (liquid crystal polymer), PEEK (polyetheretherketone), POM (polyacetyl), PSF (polysulfone), PA6 (polyamide 6), PPS (polyphenylene sulfide) and the like. The modeling material 201 is not limited to a crystalline resin, but is an amorphous resin such as PC (polycarbonate), ABS (acrylonitrile, butadiene, styrene), PEI (polyetherimide), or crystalline and amorphous resin. It may be a mixed resin.

Further, as the modeling material 201, various materials such as metal, ceramic, and liquid can be used in addition to resin. Further, the modeling material 201 may be a material having a viscosity of 1 pa · s or more.

In this embodiment, the modeling material 201 is supported by the peripheral surface of the carrier 111 by a van der Waals force. Further, when the resistance value of the modeling material 201 is high, it can be supported only by the electrostatic adhesive force.

Around the carrier 111, a supply means 112 for supplying the modeling material 201 to the peripheral surface (surface) of the carrier 111 is arranged.

The supply means 112 includes a knurled roller 123 and a blade 122. Further, an abutting roller 124 having a rubber layer on the surface is arranged so as to face the knurled roller 123.

The supply means 112 disaggregates while rubbing and rubbing the modeling material 201 with the blade 122, and forms a thin layer of the modeling material 201 on the peripheral surface of the carrier 111 via the knurled roller 123.

However, the supply by the supply means 112 is not limited to the knurled roller 123, and the configuration using a mesh roller, contact supply by a rotating body, non-contact supply, spraying from a non-contact mesh, and powder air flow agitation. It is also possible to perform fluid immersion by means of.

Further, inside the carrier 111, a flying laser 115 is arranged as a means for flying the modeling material 201 from the peripheral surface of the carrier 111. Here, "flying" means that the modeling material 201 moves from the carrier 111 to the build plate 101 side in a non-contact manner, and unlike transfer, it can move in a non-contact manner, so that the loss of the modeling material 201 is small. It is possible to improve the modeling accuracy.

The flying laser 115 is composed of a pulse laser, and irradiates the modeling material 201 with the pulse laser light 115a from the inside of the carrier 111. This irradiation position corresponds to the modeling position. Further, the pulsed laser beam 115a can irradiate the carrier 111 through the slit portion 155a of the modeling guide 155 that supports the carrier 111. Here, the modeling guide 155 is an example of a “guide unit”.

When the modeling material 201 receives the pulsed laser beam 115a, the adhesive force of the powder is released by a force called radiation pressure, and the modeling material 201 falls downward due to gravity. The laser transfer LIFT (Laser Induced Forward Transfer) described in US006025110A or the like is a non-contact transfer of a foil-like or liquid material in close contact with a carrier by laser irradiation, and the material is vaporized by being locally heated. By doing so, it flies in the direction of the pulsed laser beam 115a from the peripheral surface of the carrier 111. Here, the flying laser 115 is an example of "means for flying".

In this embodiment, it cannot be said that the latter mechanism contributes completely, but the reason why the former is considered to be the center is as follows.

1. 1. The flight start energy is the same for black powder and transparent powder, which have high laser light absorption rates.

2. Even if the carrier is a transparent resin film, the transparent powder will fly.

3. 3. The transparent resin film on the carrier does not deteriorate even after multiple pulse laser irradiations up to 1000 times.

The gap distance between the carrier 111 and the modeled object 200 is preferably maintained at 3 to 4 times the average particle size of the modeled material 201 as a guide. As a result, it is possible to avoid contact between the upper and lower modeling materials before and after flight, and to avoid dissipation due to flight.

The laser light source of the flying laser 115 is not particularly limited, and a laser light source capable of pulse oscillation such as picoseconds to nanoseconds is preferable. Examples of the solid-state laser include a YAG laser and a titanium sapphire laser. Examples of the gas laser include an argon laser, a helium neon laser, and a carbon dioxide gas laser. Semiconductor lasers are also preferable because they are small in size. The fiber laser is the most suitable light source for commercializing the present invention in terms of its high peak energy and miniaturization.

The wavelength of the laser can be appropriately selected, but is preferably 300 nm or more and 11 μm or less. In particular, when the modeling material 201 was a resin, the area around 2460 nm was a composite absorption band of CH and CC bonds, and the absorption rate of various resins including those containing carbon was 80% or more.

Further, when the wavelength is 2300 nm to 2500 nm, the absorption rate is 65% or more, and stable flight and melting energy can be imparted even in this range.

Since the transmittance of ordinary glass is high in this wavelength range, it is easy to combine with a base material. The pulse frequency of the laser can be appropriately selected in combination with the scanning speed of the laser. If there is a lot of overlap in the beam diameter determined by the combination of the two, the laser will hit the powder (modeling material) after flight, and the powder will easily dissipate. The tendency is remarkable when the beam diameters overlap twice or more, and the powder dissipates small when the beam diameters overlap 1.2 to 1.7 times.

Further, on the outside of the carrier 111, a melting laser 116 as a means for heating the surface of the modeled object 200 is arranged. As the melting laser 116, it is not necessary to positively use a pulse, and a continuous wave laser is suitable. Here, the melting laser 116 is an example of "means for applying energy".

The melting laser 116 heats the surface of the modeled object 200 formed on the build plate 101 to bring it into a molten state. It suffices to be in a molten state by energy, and ultrasonic waves, convection, lamps, lasers, induction heating, dielectric heating, etc. can be applied in addition to heating by a laser. Further, the "surface" at this time may be one layer at one time of modeling, or may be a plurality of layers such as two or three layers. Further, it may be a part of each layer or the whole layer. In other words, it is important that a part of the outermost layer is included.

In FIG. 1, the laser beam 116a of the melting laser 116 is irradiated aiming at the irradiation position (landing position of the modeling material 201) of the pulse laser beam 115a of the flying laser 115. The positions of both can be adjusted, and it is also considered to switch the adjustment position depending on the material type and modeling speed.

As a result, the modeling material 201 that is blown by the flying laser 115 lands on the surface of the modeled object 200 that has been melted by the laser beam 116a of the melting laser 116, and is attached to the modeled object 200. The context of the flight of the modeling material 201 and the start timing of melting of the modeling object 200 is not particularly limited. That is, the surface of the modeled object 200 may be melted before the modeled material 201 flies. Alternatively, after the modeling material 201 flies, the surface of the modeling object 200 may be melted, and the flying modeling material 201 may land on the melted surface.

Variations in landing position and excess / deficiency can be adjusted between layers, and the flying laser 115 may differ from the shape of the model. It is the melting laser 116 that determines the shape of the model.

Further, around the carrier 111, a cleaning blade 117 for removing the modeling material 201 remaining on the carrier 111 is provided on the downstream side in the rotation direction of the carrier 111 from the region where the model 200 is modeled. The modeling material 201 scraped off by the cleaning blade 117 is collected in the collection case 118.

The three-dimensional modeling apparatus 500 is not limited to the configuration shown in FIG. 1, and can be modified in various ways. Also. The angle at which the modeling material 201 is flown, the angle at which the pulsed laser beam 115a is irradiated, and the angle at which the laser beam 116a is irradiated can be appropriately selected with respect to the build plate 101.

[First Embodiment]
Next, FIG. 2 is an enlarged view illustrating an example of the configuration around the modeled object 200 in FIG. The flying laser 115 of the modeling unit 100 irradiates the modeling material 201 supported on the carrier 111 with the pulse laser light 115a through the slit portion 155a of the modeling guide 155 to fly the modeling material 201 in the −Z direction. The arrow 201a shown by the broken line represents the flight direction of the modeling material 201.

The modeling unit 100 scans the pulsed laser beam 115a in the X direction to fly the modeling material 201, and moves the build plate 101 in the Y direction to form a two-dimensional material layer of the modeling material 201. This two-dimensional material layer is formed on the XY plane. The build plate 101 may be fixed and the modeling unit 100 may be moved.

The formed material layer is irradiated with the laser beam 116a of the melting laser 116 while scanning in the X direction to melt the material layer, and the material layer is formed again on the surface of the melted material layer on the + Z direction side. The material layers of the above are adhered to each other and laminated. By repeating this operation, the material layers can be laminated one by one in the + Z direction to form the modeled object 200.

Further, in the embodiment, the light projecting unit 410 irradiates the modeled object 200 with probe light as an example of light in the X direction, and the detection unit 420 detects the width of the probe light. Specifically, the height (length in the Z direction) of the model 200 can be detected based on the width of the probe light received on the side opposite to the light projecting side across the model 200 in the Z direction. There is. P shown by the alternate long and short dash line in FIG. 2 indicates the probe light. The probe light P is a linear pattern light having a longitudinal direction in the Z direction, and is emitted along the X direction toward between the modeling guide 155 and the build plate 101.

<Method of controlling the height of the modeled object>
Next, a method of controlling the height of the modeled object in the three-dimensional modeling apparatus 500 will be described.

If the distance between the modeling guide 155 and the modeling object 200 in the Z direction fluctuates, the landing position of the modeling material 201 may deviate from the target position when the modeling material 201 flies diagonally with respect to the direction of gravity. be. Further, the longer the flight distance of the modeling material 201, the more easily the flying modeling material 201 is affected by air resistance and the like, and the landing position of the modeling material 201 deviates from the target position.

Therefore, in order to ensure the shape accuracy of the modeled object, it is preferable that the distance between the modeled guide 155 and the modeled object 200 in the Z direction is kept short and constant. In the embodiment, the above-mentioned distance set to keep the distance short and constant is referred to as a "predetermined distance". The predetermined distance is 500 ± 50 μm as an example.

However, even when the predetermined distance is set short, an error occurs in the height (thickness) of the material layer to be formed due to variations in the particle size and mass of the modeling material 201, and the shape accuracy of the modeling object 200 is lowered. There is.

Therefore, in the present embodiment, the light projecting unit 410 and the detection unit 420 are used to detect the distance between the modeling guide 155 and the modeling object 200 in the Z direction, and control the height of the modeling object 200.

Here, FIG. 3 is a diagram for explaining an example of the arrangement of the light projecting unit 410 and the detection unit 420, (a) is a diagram showing a state in which the modeled object 200 is not formed, and (b) is a diagram showing the modeled object 200. It is a figure which shows the state during formation. Further, FIG. 3 is a view of the periphery of the modeled object 200 as viewed from the + Y direction.

As shown in FIG. 3, the light projecting unit 410 is arranged on the −X direction side of the modeling unit 100, and projects the probe light P toward the modeling unit 100. The light projecting unit 410 includes a laser light source such as a semiconductor laser, and can project linear laser light (pattern light) having a longitudinal direction along the Z direction as probe light P. However, the present invention is not limited to this, and a light source such as a light emitting diode may be used, or a pattern light other than linear may be used.

The probe light P is preferably a pattern light that is sufficiently long in the Z direction so as to straddle the modeling guide 155 and the build plate 101. In other words, the length of the probe light P in the Z direction is preferably longer than a predetermined distance.

The detection unit 420 is arranged on the opposite side of the light projecting unit 410 in the X direction with the modeling unit 100 interposed therebetween, and can receive the probe light P that has passed between the modeling guide 155 and the build plate 101. ..

The detection unit 420 includes line light receiving elements such as CCD (Charge Coupled Device), CMOS (Complementary MOS), and PDA (Photo Diode Array) in which pixels are arranged in the Z direction. The width of the probe light P passing between them in the Z direction is detected based on the number of pixels of the line light receiving element.

The height of the modeled object 200 can be calculated by the following equation (1) based on the width of the probe light P in the Z direction.
h = D ₀ + MD ₁ ... (1)
In equation (1), h is the height of the modeled object, D ₀ is the distance between the modeled guide 155 and the build plate 101 in the Z direction, M is the descending distance of the build plate 101, and D ₁ is the modeled object 155 and the modeled object 200. The distances from and in the Z direction are shown respectively.

The distance D ₀ is acquired when the detection unit 420 detects the width of the probe light P in the Z direction in the state of FIG. 3A. The width 421 shown in FIG. 3A corresponds to the _{distance D 0.} This distance D ₀ may be automatically acquired when the three-dimensional modeling apparatus 500 is started, or may be acquired every time modeling is performed.

Further, the distance D ₁ is acquired by the detection unit 420 detecting the width of the probe light P in the Z direction in the state of FIG. 3 (b). Width 422 shown in FIG. 3 (b) corresponds to the distance _{D 1.} This distance D ₁ is acquired each time a material layer is formed.

The detection unit 420 detects the height h of the modeled object 200 according to the equation (1) based on _{the acquired distances D 0} and D ₁ , and outputs the detected values of the _{height h and the distance D 1 to the control unit 400.} do. However, the detection unit 420 may _{output the detection values of the distances D 0} and D ₁ to the control unit 400, and the control unit 400 may calculate the height h.

<Structure of control unit 400>
Next, the control unit 400 included in the three-dimensional modeling apparatus 500 will be described.

The control unit 400 controls the modeling by the three-dimensional modeling device 500 based on the slice data generated from the three-dimensional data received from the external device. Further, the control unit 400 is a control device that controls modeling based on the width of the probe light P detected by the detection unit 420 in the Z direction.

(Hardware configuration example of control unit 400)
First, the hardware configuration of the control unit 400 will be described with reference to FIG. FIG. 4 is a block diagram illustrating an example of the hardware configuration of the control unit 400.

As shown in FIG. 4, the control unit 400 is constructed by a computer, and has a CPU (Central Processing Unit) 501, a ROM (Read Only Memory) 502, a RAM (Random Access Memory) 503, and an HD (Hard Disk) 504. And an HDD (Hard Disk Drive) controller 505. In addition, a display 506, an external device connection I / F (Interface) 508, a network I / F 509, a data bus 510, a keyboard 511, a pointing device 512, a DVD-RW (Digital Versatile Disk Rewritable) drive 514, and the like. It has a media I / F 516.

Of these, the CPU 501 controls the operation of the entire control unit 400. The ROM 502 stores a program used for driving the CPU 501 such as an IPL (Initial Program Loader). The RAM 503 is used as a work area for the CPU 501.

The HD504 stores various data such as programs. Further, the HDD controller 505 controls reading or writing of various data to the HD 504 according to the control of the CPU 501. The display 506 displays various information such as cursors, menus, windows, characters, or images.

The external device connection I / F 508 is an interface for connecting various external devices. The external device in this case is a USB (Universal Serial Bus) memory, a printer, or the like. The network I / F 509 is an interface for performing data communication using the network N. The data bus 510 is an address bus, a data bus, or the like for electrically connecting each component such as the CPU 501.

Further, the keyboard 511 is a kind of input means including a plurality of keys for inputting characters, numerical values, various instructions and the like. The pointing device 512 is a kind of input means for selecting and executing various instructions, selecting a processing target, moving a cursor, and the like.

The DVD-RW drive 514 controls reading or writing of various data to the DVD-RW 513 as an example of the removable recording medium. The DVD-RW is not limited to the DVD-RW, and a DVD-R or the like may be used. The media I / F 516 controls reading or writing (storage) of data to a recording medium 515 such as a flash memory.

(Example of functional configuration of control unit 400)
Next, the functional configuration of the control unit 400 will be described with reference to FIG. FIG. 5 is a block diagram illustrating an example of the functional configuration of the control unit 400.

As shown in FIG. 5, the control unit 400 includes a reception unit 401, a data generation unit 402, a modeling control unit 403, a light projection control unit 404, a correction control unit 405, and a notification unit 406. .. However, the control unit 400 may have a configuration other than these.

Among those shown above, the functions of the receiving unit 401 are realized by the network I / F 509 and the like shown in FIG. 4, and the functions of the data generation unit 402, the modeling control unit 403, the light projection control unit 404, and the correction control unit 405 are Each of these is realized by the CPU 501 of FIG. 4 executing a predetermined program or the like. Further, the function of the notification unit 406 is realized by a display 506 or the like.

The receiving unit 401 receives stereoscopic data from an external device such as a PC (Personal Computer) and outputs it to the data generating unit 402.

The data generation unit 402 slices the three-dimensional data in the stacking direction, and the three-dimensional modeling apparatus 500 generates slice data for forming a material layer for each layer by calculation.

The modeling control unit 403 includes a flight control unit 41, a melting control unit 42, and a movement control unit 43, and controls for laminating and modeling material layers formed based on slice data.

The flight control unit 41 controls the irradiation of the pulsed laser beam 115a by the flight laser 115 based on the slice data. This control includes intensity control of the pulsed laser beam 115a, on / off control, and the like. The flight control unit 41 can also control the drive of a scanning unit such as a galvano mirror for scanning the pulsed laser beam 115a.

The melting control unit 42 controls the irradiation of the laser beam 116a by the melting laser 116 based on the slice data. This control includes intensity control of the laser beam 116a, on / off control, and the like. Further, the melting control unit 42 can also perform drive control of a scanning unit such as a galvano mirror for scanning the laser beam 116a.

The movement control unit 43 controls the movement of the build plate 101 in the Y direction (see FIG. 1) and the Z direction based on the slice data. This control includes control of the movement amount, movement direction, movement speed, and the like of the build plate 101.

The light projection control unit 404 controls the light projection of the probe light P by the light projection unit 410. This control includes intensity control of the probe light P, on / off control, and the like.

The correction control unit 405 controls _{the modeling based on the detection values of the distance D 1} and the height h of the modeled object 200 by the detecting unit 420. As an example of control, the height of the modeled object 200 is corrected. In this control, _{the build plate 101 is lowered based on the determination result of whether or not the detected value of the distance D 1} is larger than the target value, and whether or not the detected value of the height h is equal to or less than the predetermined height. This includes control for notifying a warning based on the determination of. In addition, each means included in the three-dimensional modeling apparatus may be controlled based on the height.

The notification unit 406 notifies the operator of the three-dimensional modeling apparatus 500 (hereinafter, simply referred to as an operator) of a modeling abnormality, a warning, or the like based on the detection value of the height h of the modeled object 200 by the detecting unit 420.

<Example of modeling operation by 3D modeling device 500>
Next, the modeling operation by the three-dimensional modeling apparatus 500 will be described with reference to FIG. FIG. 6 is a flowchart showing an example of a modeling operation by the three-dimensional modeling apparatus 500. Note that FIG. 6 shows a modeling operation after the receiving unit 401 receives the three-dimensional data from the external device and the data generating unit 402 generates slice data based on the three-dimensional data.

First, in step 61, the modeling control unit 403 determines whether or not to correct the modeled object. This determination is made based on the input result of the operator using the keyboard 511 or the like shown in FIG.

If it is determined in step S61 that the correction is not performed (step S61, No), the operation proceeds to step S70. On the other hand, when it is determined to be corrected (step S61, Yes), in step S62, the modeling control unit 403 forms a material layer for one layer.

Subsequently, in step S63, the light projecting unit 410 projects the probe light P, and the detection unit 420 detects the distance D ₁ and the height h based on the width of the received probe light P in the Z direction. The detection unit 420 outputs the detection value to the correction control unit 405 and the notification unit 406.

Subsequently, in step S64, the correction control unit 405 determines whether or not the detected value of the _{distance D 1 is larger than the predetermined distance.}

If it is determined in step S64 that it is not large (step S64, No), in step S65, the correction control unit 405 lowers the build plate 101 through the modeling control unit 403 by a shortage with respect to a predetermined distance. As a result, in the formation of the next material layer, the distance D ₁ can be maintained at a predetermined distance, and as a result, the height (thickness) of the material layer 1 layer can be accurately controlled.

On the other hand, if it is determined in step S64 that it is large (step S64, Yes), the process proceeds to step S66.

Subsequently, in step S66, the correction control unit 405 determines whether or not the detected value of the height h is equal to or less than the predetermined height. This predetermined height is the height of the modeled object 200 at that time, which is specified based on the slice data.

If it is determined in step S66 that the height is not equal to or lower than the predetermined height (step S66, No), in step S67, the correction control unit 405 notifies the notification unit 406 of a warning of a molding abnormality. On the other hand, if it is determined that the height is equal to or lower than the predetermined height (step S66, Yes), the process proceeds to step S68.

The order of the operations of steps S64 and 65 and the operations of steps S66 and 67 may be changed as appropriate, or both steps may be performed in parallel.

Subsequently, in step S68, the modeling control unit 403 lowers the build plate 101 by one layer.

Subsequently, in step S69, the modeling control unit 403 determines whether or not to finish modeling. This determination is made based on whether or not there is a residue of slice data obtained from the data generation unit 402. If there is no remaining slice data, it ends.

If it is determined in step S69 to end (step S69, Yes), the modeling operation ends, and if it is determined not to end (step S69, No), the process returns to step S62, and steps S62 and subsequent steps are performed. The operation is performed again.

On the other hand, if it is determined in step S61 that the correction is not performed (steps S61, No), in step S70, the modeling control unit 403 forms a material layer for one layer.

Subsequently, in step S71, the modeling control unit 403 lowers the build plate 101 by one layer.

Subsequently, in step S72, the modeling control unit 403 determines whether or not to finish modeling.

If it is determined in step S72 to end (step S72, Yes), the modeling operation ends, and if it is determined not to end (step S72, No), the process returns to step S70, and steps S70 and subsequent steps are performed. The operation is performed again.

Step S62~S69 described above corresponds to the molding operation to correct the height h of the molded article 200, by a distance D ₁ is controlled to be constant, one layer for each of the height of the material layer (thickness ) Can be managed while modeling. Steps S70 to S72 correspond to a normal modeling operation in which the height h of the modeled object 200 is not corrected.

In this way, the three-dimensional modeling device 500 can perform the modeling operation.

<Action and effect of the three-dimensional modeling device 500>
As described above, in the present embodiment, the material layer containing at least the modeling material 201 is laminated in the Z direction to form the modeled object 200. Further, the probe light P is projected onto the modeling unit 100 from the X direction, and the modeling is controlled based on the width of the probe light P received on the opposite side of the modeling unit 100 from the projection side in the Z direction.

Based on the width in the Z direction of the probe light P, by correcting the Z-direction height of the build plate 101 can be maintained a distance D ₁ of the the shaped guide 155 and the shaped object 200 to a predetermined distance. As a result, the height of one material layer can be accurately controlled, the modeled object 200 can be accurately modeled, and the shape accuracy of the modeled object 200 can be ensured.

Further, the occurrence of a modeling abnormality is detected by detecting the height h of the modeled object 200 based on the width of the probe light P in the Z direction, and the notification unit 406 can notify the operator or the like. As a result, it is possible to urge the operator to stop or adjust the modeling.

Further, in the present embodiment, as the probe light P, a linear laser light having a longitudinal direction along the Z direction is used. As a result, a sufficient length can be secured in the Z direction to detect the height h of the modeled object 200, and light can be projected in a narrow range in the Y direction.

By projecting light in a narrow range in the Y direction, it is possible to secure a sufficient amount of light for detection while suppressing the driving power of the projecting unit 410. Further, by narrowing the range of the probe light P in the Y direction, it is possible to prevent the probe light P from being blocked by an obstacle around the modeled object 200, and to avoid a detection error caused by blocking the probe light P. Further, by using a laser beam having high directivity, it is possible to suppress the spread of the probe light P and perform detection with higher accuracy.

Further, in the present embodiment, as the probe light P, a pattern light having a length in the Z direction longer than a predetermined distance is projected. This predetermined distance is a preset distance between the build plate 101 and the modeling guide 155 in the Z direction. As a result, the height h of the modeled object 200 can be detected with reference to a predetermined distance, and the detection accuracy can be ensured. However, the present invention is not limited to this, and the length of the probe light P in the Z direction may be shorter than a predetermined distance as long as the width in the Z direction for detecting the height h of the modeled object 200 can be secured.

Further, in the present embodiment, the light projecting unit 410 and the detecting unit 420 are arranged on the side of the modeled object 200. As a result, the width of the probe light P can be detected by suppressing the influence of dirt caused by steam or gas generated in the + Z direction in the modeling process.

Further, in the present embodiment, an example is shown in which the modeling material 201 is powder and the modeling material 201 on which the modeling portion 100 is supported is flown to form a material layer, but the present invention is not limited to this. A liquid may be used as the modeling material, and the modeling unit may discharge the modeling material as a liquid to form a material layer, and stack these to form the modeled object 200.

FIG. 7 is a diagram illustrating an example of the configuration of the modeling unit 100'that discharges the modeling material 201'as a liquid. The modeling unit 100'is discharged from the modeling material 201'and landed on the modeling object 200 while changing the relative positions of the modeling unit 100'and the modeled object 200 in the XY plane, and is a two-dimensional material layer. To form. Then, the material layers are adhered to each other by irradiating the material layers with UV light or infrared light to solidify the modeling material 201'.

The above-described effects can also be obtained by applying the embodiment to an apparatus that performs modeling with such a modeling unit 100'.

[Second Embodiment]
Next, the three-dimensional modeling apparatus according to the second embodiment will be described. In each drawing, parts having the same configuration are designated by the same reference numerals, and duplicate description will be omitted as appropriate.

In the present embodiment, modeling is performed using at least one of a row of holes arranged along the X direction or an elongated hole having a longitudinal direction along the X direction. Further, the first probe light is projected in the direction along the X direction, and one or more second probe lights are projected in the direction intersecting both the X direction and the Z direction. Then, the modeling is controlled with higher accuracy based on the widths of the first probe light and the second probe light received on the side opposite to the light projecting side across the modeling portion in the Z direction.

FIG. 8 is a diagram illustrating an example of the configuration around the modeled object 200 of the three-dimensional modeling apparatus 500a according to the present embodiment, and is a view of the modeled object 200 viewed from the + Z direction.

As shown in FIG. 8, the three-dimensional modeling apparatus 500a includes a modeling unit 100a, an X-direction light projecting unit 410a, a first Y-direction light projecting unit 410b, a second Y-direction light projecting unit 410c, and an X-direction detecting unit 420a. A first Y-direction detection unit 420b and a second Y-direction detection unit 420c are provided.

Further, the modeling unit 100a includes a modeling guide 160. The modeling guide 160 includes a plurality of slit portions arranged in the X direction, and flies a row of linear modeling materials 201 along the X direction. A two-dimensional material layer can be formed in the XY plane by flying a row of modeling materials 201 while moving the build plate 101 in the Y direction.

The X-direction light projecting unit 410a projects the X-direction probe light Px in a direction along the X direction (arrangement direction of the slit portions). The X-direction detection unit 420a detects the width of the X-direction probe light Px received on the opposite side of the X-direction light projecting unit 410a with the modeling unit 100a in the Z direction. As a result, even when a plurality of modeled objects 200 are arranged side by side in the X direction for modeling, the shortest distance (narrowest gap) between the modeled object 200 and the modeling guide 160 can be detected.

The 1Y direction projecting portion 410b is a direction crossing the X direction, a direction passing through the + Z direction side of the end portion in the + X direction of the build plate 101, for projecting the first 1Y direction probe light P _y1. The 1Y direction detection unit 420b detects the width in the Z direction of the 1Y direction probe light _{P y1} that is received on the opposite side of the 1Y direction projecting portion 410b across the shaped portion 100a. As a result, as shown in FIG. 8, the distance D ₀ between the build plate 101 and the modeling guide 160 can be detected at the end of the build plate 101 in the + X direction.

The second Y-direction light projecting unit 410c intersects the X-direction, and passes through the + Z-direction side of the test sample 210 provided at the end of the build plate 101 in the −X direction in the second Y-direction probe light. _Py2 is projected. Here, the test sample 210 refers to a modeled object that is modeled in parallel with the modeled object 200 and is used to monitor the height of the modeled object 200.

The 2Y direction detection unit 420c detects the width in the Z direction of the 2Y direction probe light _{P y2} received by the opposite side of the 2Y direction projecting portion 410c across the shaped portion 100a. _{Thereby, the distance D 1} between the test sample 210 and the modeling guide 160 and the height h of the test sample 210 can be detected. The second Y-direction probe light P _y2 intersects with the first Y-direction probe light P _y1.

Here, the modeled object 200 is an example of the "first modeled object", and the test sample 210 is an example of the "second modeled object".

FIG. 9 is a diagram illustrating another example of the configuration around the modeled object 200 of the three-dimensional modeling apparatus 500a.

In the example of FIG. 9, the first Y-direction light projecting portion 410b intersects the X direction, and passes through the end portion of the build plate 101 in the + X direction and the + Z direction side of the modeled object 200 in the first Y direction. The directional probe light P _y1 is projected. The 1Y direction detection unit 420b detects the width in the Z direction of the 1Y direction probe light _{P y1} that is received on the opposite side of the 1Y direction projecting portion 410b across the shaped portion 100a. Thus, at the end of the + X direction of the build plate 101 can detect the distance _{D 1} of the between the shaped object 200 with shaped guide 160.

As described above, in the present embodiment, the distance D _{1 between the modeling guide 160 and the modeled object 200 and the distance D 0} between the modeling guide 160 and the build plate 101 are detected at an arbitrary position of the modeling guide 160. do. As a result, the height h of each of the test sample 210 and the modeled object 200 can be detected separately, and the modeling can be controlled with higher accuracy based on the detected values.

Further, the X-direction light projecting unit 410a, the first Y-direction light projecting unit 410b, the second Y-direction light projecting unit 410c, the X-direction detection unit 420a, the first Y-direction detection unit 420b, and the second Y-direction detection unit 420c are modeled objects 200. Since it is arranged on the side of the probe light, the width of the probe light can be detected without being affected by dirt caused by steam or gas generated in the molding process.

Here, the X-direction light projecting unit 410a is an example of the "first light projecting unit", the X-direction detection unit 420a is an example of the "first detection unit", and the X-direction probe light Px is an example of the "first light". be.

Further, the 1st Y direction light projecting unit 410b and the 2nd Y direction light projecting unit 410c are examples of the "second light projecting unit", respectively, and the 1st Y direction detecting unit 420b and the 2nd Y direction detecting unit 420c are "second detection", respectively. The first Y-direction probe light Py1 and the second Y-direction probe light Py2, which are examples of the “part”, are examples of the “second light”, respectively.

In the present embodiment, an example in which the number of the "second light projecting unit" is two and the number of the "second detection unit" is two is shown, but the present invention is not limited to this, and the "second light projecting unit" is not limited to this. The "unit" may be an arbitrary number of one or more, and the "second detection unit" may be an arbitrary number of one or more.

Further, although the example in which the modeling guide 160 is provided with a plurality of slit portions arranged in the X direction is shown, the modeling guide 160 may be provided with an elongated hole having a longitudinal direction in the X direction, or the modeling guide 160 may be provided with a plurality of slit portions and an elongated hole. Both may be provided in combination.

Next, FIG. 10 is a diagram illustrating an example of the configuration of the test sample 210, (a) a perspective view, and (b) an enlarged perspective view of the test sample 210.

As shown in FIG. 10, the test sample 210 is a hexagonal column having a hollow inside. The thickness of each surface (side wall) of the hexagonal column is formed to be different.

It is preferable to shape the test sample 210 so that the minimum thickness of the side wall of the test sample 210 is equal to the minimum thickness of the modeled object 200. In this way, an abnormality during modeling in the minimum thickness portion of the modeled object 200 can be detected by monitoring the modeling of the same thickness portion of the test sample 210.

When modeling this test sample 210, the first Y-direction light projecting unit 410b and the second Y-direction so that the first Y-direction _{probe light P y1} and the second Y-direction probe light P _{y2 pass through the + Z direction side of the same surface.} The light projecting unit 410c is arranged. Then, the first Y direction detection unit 420b and the second Y direction detection unit 420c detect the side wall of the same thickness in the hexagonal column of the test sample 210.

By doing so, the height h of the test sample 210 can be detected with high accuracy even when a modeled object having a complicated and thin side wall is formed, and the detected value of the height h of the test sample 210 can be used. The modeled object 200 can be corrected with high accuracy. The test sample 210 may be another polygonal column instead of the hexagonal column.

Next, FIG. 11 is a diagram for explaining another example of the configuration including the test sample, (a) is a perspective view, and (b) is an enlarged perspective view of the test sample.

The test sample 220 is a cylinder having a hollow inside. By eccentricizing the inner circumference circle with respect to the outer circumference circle of the cylinder, the thickness of the side wall of the cylinder is formed to be different in the circumferential direction. Even if such a test sample 220 is used, the same effect as when the test sample 210 is used can be obtained.

Further, the test sample is arranged so that the line segment connecting the test sample and the modeled object is parallel to the arrangement direction of the slit portion of the modeling guide 160, or is arranged with respect to the arrangement direction of the slit portion of the modeling guide 160. It is preferable to arrange them so as to be orthogonal to each other.

In the example shown in FIG. 11A, the test sample 210 is arranged so that the line segment connecting the test sample 210 and the modeled object 200 is parallel to the arrangement direction of the slit portion of the modeled guide 160. .. Further, the test sample 220 is arranged so that the line segment connecting the test sample 220 and the modeled object 200 is orthogonal to the arrangement direction of the slit portion of the modeling guide 160.

In this way, since the timing of flying the modeling material 201 and the timing of melting the material layer of the modeled object 200 and the test sample 210 are almost the same, when an abnormality occurs in the flying and melting of the modeling material 201, The modeling can be controlled and corrected by using the detected value of the height h of the test sample 210.

Further, since the modeled object 200 and the test sample 220 are modeled using the same slit portion among the plurality of slit portions arranged, the height h of the test sample 220 when a flight abnormality occurs in the same slit portion. The modeling can be controlled and corrected using the detected value of. Further, when a flight abnormality occurs and the modeling material 201 is not supplied and cannot be corrected, the operator can be notified by a warning that the modeling cannot be performed.

The present embodiment can also be applied to a case where a liquid is used as a modeling material, a modeling material as a liquid is discharged to form a material layer, and the material layer is laminated to form a modeled object 200. ..

[Third Embodiment]
Next, the three-dimensional modeling apparatus according to the third embodiment will be described. In each drawing, parts having the same configuration are designated by the same reference numerals, and duplicate description will be omitted as appropriate.

In the present embodiment, the collapse of the modeled object 200 is detected based on the amount of movement of the build plate 101 in the Y direction and the plurality of light receiving positions of the probe light P by the detection unit 420 in the Z direction. Further, the height of the modeled object 200 is detected with higher accuracy based on the amount of movement of the build plate 101 in the Z direction and the width of the probe light P in the Z direction. Using these, the modeling is controlled with higher accuracy.

FIG. 12 is an enlarged view illustrating an example of the configuration around the modeled object 200 in the three-dimensional modeling apparatus 500b according to the present embodiment.

As shown in FIG. 12, the three-dimensional modeling apparatus 500b includes a modeling unit 100b. Further, the modeling unit 100b includes a Y-direction encoder 110 that detects the amount of movement of the build plate 101 in the Y direction, and a Z-direction encoder 120 that detects the amount of movement of the build plate 101 in the Z direction. Each of the Y-direction encoder 110 and the Z-direction encoder 120 can output the detected value of the movement amount to the control unit 400.

Here, FIG. 13 is a diagram for explaining an example of a method for detecting a fall and a height, (a) is a diagram showing a method for detecting a fall, and (b) is a diagram showing a method for detecting a height.

FIG. 13A shows how the build plate 101 moves in the + Y direction, and the model 200 on the build plate 101 blocks the probe light P.

At the time t1 when the point S1 on the modeled object 200 blocks the probe light P, the detection unit 420 outputs the position data z1 indicating the position where the probe light P is blocked in the Z direction to the control unit 400. After that, at the time t2 when the build plate 101 moves in the + Y direction and then the point S2 on the modeled object 200 blocks the probe light P, the detection unit 420 indicates the position where the probe light P is blocked in the Z direction. The position data z2 is output to the control unit 400. The Y-direction encoder 110 outputs the movement amount dy of the build plate 101 between the time t1 and the time t2 to the control unit 400.

Using these data, the collapse θ can be calculated using the following equation (2).
θ = tan ^-1 {dy / Δz1}
= Tan ^-1 {dy / (z2-z1)} ・ ・ ・ (2)
If the shape of the modeled object 200 is originally inclined with an inclination of φ, the influence of the shape of the modeled object 200 is removed by setting it to θ−φ, and the collapse as a modeling error is accurately detected. can. Here, the position data z1 and z2 are examples of "plurality of light receiving positions".

Further, FIG. 13B shows how the build plate 101 moves in the + Z direction, and the modeled object 200 on the build plate 101 blocks the probe light P.

When the build plate 101 moves between the time t3 and the time t4 when the detection unit 420 detects the width of the probe light P in the Z direction, the movement amount of the build plate 101 is added to the value detected by the detection unit 420. The accompanying error is included.

In such a case, the Z-direction encoder 120 outputs the movement amount dz that the build plate 101 has moved between the time t3 and the time t4 to the control unit 400. The detection unit 420 outputs the width H of the probe light P in the Z direction at time t4 to the control unit 400. Using these data, the height h at time t3 can be calculated using the following equation (3).
h = H−dz ・ ・ ・ (3)
In this way, the error due to the movement amount of the build plate 101 can be removed, and the height h at the time t3 can be accurately detected.

Next, FIG. 14 is a block diagram illustrating an example of the functional configuration of the control unit 400b included in the three-dimensional modeling apparatus 500b.

Here, in the three-dimensional modeling apparatus 500b, similarly to the configuration shown in FIG. 8, the modeling unit 100a, the X-direction light projecting unit 410a, the first Y-direction light projecting unit 410b, the second Y-direction light projecting unit 410c, and the like. It includes an X-direction detection unit 420a, a first Y-direction detection unit 420b, and a second Y-direction detection unit 420c.

The three-dimensional modeling apparatus 500b uses the second Y-direction light projecting unit 410c and the second Y-direction detection unit 420c to detect the fall θ by utilizing the shading of the probe light P by the test sample 210, and detects the fall θ, and the X-direction light projecting unit 410a. And the X-direction detection unit 420a are used to detect the height h of the modeled object 200.

As shown in FIG. 14, the control unit 400b includes a data correction unit 407 and a fall determination unit 408.

Data correction unit 407, a movement amount data according to Y-direction encoder 110, based on the distance _{D 1} and the height h of the test sample 210 according 2Y direction detection unit 420c, determines whether molded article 200 is made shaped into plane. Then, if it is not completed, the slice data by the data generation unit 402 is corrected so as to correct the concave portion in the modeled object 200 using these data.

Fall determination unit 408, a movement amount data according to Y-direction encoder 110, based on the distance _{D 1} and the height h of the test sample 210 according 2Y direction detection unit 420c, to determine whether fallen shaped object 200 is generated When it occurs, the operator is notified of the amount of fall via the notification unit 406.

Next, FIG. 15 is a flowchart showing an example of a modeling operation by the three-dimensional modeling device 500b. The operation of steps S141 to S148 in FIG. 15 is the same as the operation of steps S61 to S68 in FIG. The operation of steps S157 to S159 in FIG. 14 is the same as the operation of steps S70 to S72. Therefore, a duplicate description will be omitted here, and only a part different from FIG. 6 will be described.

In step S149, the second Y direction detection unit 420c detects the distance D ₁ and the height h of the test sample 210 and outputs them to the data correction unit 407 and the fall determination unit 408, respectively.

Subsequently, in step S150, the data correcting unit 407, a movement amount data according to Y-direction encoder 110, based on the distance _{D 1} and the height h of the test sample 210 according 2Y direction detection unit 420c, shaped object 200 is in a plane Determine if it is modeled.

If it is determined in step S150 that it has not been completed (step S150, No), in step S151, the data correction unit 407 uses the slice data by the data generation unit 402 to correct the concave portion in the modeled object 200. to correct.

More specifically, when S150 detects a recess of one layer or more, the data correction unit 407 creates slice data of the recess. Then, the slice data created by the data correction unit 407 is added to the next modeling to correct the concave portion. In the next modeling, only the correction target portion may be modeled, or both the correction target location and the next modeling layer may be modeled at the same time.

On the other hand, if it is determined in step S150 that it is completed (step S150, Yes), the operation shifts to step S152.

Subsequently, in step S152, the data correction unit 407 determines whether or not the detected value of the _{distance D 1 is larger than the predetermined distance.}

If it is determined in step S152 that it is not large (step S152, No), in step S153, the data correction unit 407 stops forming the material layer for the next one layer. On the other hand, if it is determined in step S152 that it is large (step S152, Yes), the operation shifts to step S154.

Subsequently, in step S154, the fall determination unit 408 causes the modeled object 200 to fall based on the _{movement amount data by the Y direction encoder 110 and the distance D 1} and the height h of the test sample 210 by the second Y direction detection unit 420c. Determine if it has occurred.

If it is determined in step S154 that the occurrence has occurred (step S154, Yes), in step S155, the notification unit 406 notifies the operator of the amount of collapse. On the other hand, if it is determined in step S154 that the occurrence has not occurred (step S154, No), the operation proceeds to step S156.

Subsequently, in step S156, the modeling control unit 403 determines whether or not to finish modeling.

If it is determined in step S156 to end (step S156, Yes), the modeling operation ends, and if it is determined not to end (step S156, No), the process returns to step S142, and steps S142 and subsequent steps are performed. The operation is performed again.

In this way, the three-dimensional modeling device 500b can perform modeling and modeling.

<Action and effect of the three-dimensional modeling device 500b>
As described above, in the present embodiment, the collapse of the modeled object 200 is detected based on the amount of movement of the build plate 101 in the Y direction and the plurality of light receiving positions of the probe light P in the Z direction by the detection unit 420. do. Further, the height of the modeled object 200 is detected with higher accuracy based on the amount of movement of the build plate 101 in the Z direction and the width of the probe light P in the Z direction. By using these, modeling can be controlled with higher accuracy.

[Fourth Embodiment]
Next, the three-dimensional modeling apparatus according to the fourth embodiment will be described with reference to FIGS. 16 and 17. In each drawing, parts having the same configuration are designated by the same reference numerals, and duplicate description will be omitted as appropriate.

16A and 16B are views for explaining the height of the support material, FIG. 16A is a diagram showing the height of the surplus modeled object 230'according to the comparative example, and FIG. 16B is a diagram showing the height of the surplus modeled object 230 according to the present embodiment. It is a figure which shows the height. 17A and 17B are views for explaining the groove 130, FIG. 17A is a perspective view showing the groove 130, and FIG. 17B is a perspective view for explaining a surplus model formed in the groove 130.

Here, in the modeling method in which the modeling material 201 is used for modeling layer by layer, in the case of a supporting material or particle modeling that supports the modeling object 200 or the test sample 210 made of the same material as the modeling material 201 around the modeling object 200. Generates a surplus modeled product made of surplus material that has not been solidified by the melting laser 116.

The surplus modeled object made of the support material (including the surplus material; the same applies hereinafter) is modeled with the same material as the modeling material 201. Since the support material not melted by the melting laser 116 has gaps between the particles, the surplus model is generally higher than the test sample 210. As shown in FIG. 16A, the surface 230a'indicating the height position of the surplus model 230'is higher than that of the test sample 210. In this state, the surplus model 230'may block the probe light P, making it impossible to detect the height h of the test sample 210.

Therefore, in the present embodiment, a groove portion having a recessed surface of the build plate 101 is formed in advance around the test sample 210 of the build plate 101 so that the surplus modeled object fits into the groove portion, so that the height of the surplus modeled object is high. Is lower than the test sample 210.

As shown in FIGS. 16B and 17A, a groove 130, which is a recess, is formed in advance on the surface of the build plate 101. Further, as shown in FIGS. 16 (b) and 17 (a), the surplus modeled object 230 is modeled so as to fit into the groove 130.

Since the surface 230a indicating the height position of the surplus model 230 is lower than the test sample 210, it is possible to prevent the surplus model 230 from blocking the probe light P and detect the height h of the test sample 210. Become.

By doing so, the height h of the test sample 210 can be reliably detected, and when the height h'of the modeled object 200 is higher than the height h of the test sample 210, the surplus modeled object around the modeled object 200. It can be determined that there is 230 and this can be detected.

When the height h'of the modeled object 200 is higher than the height h of the test sample 210 and the surplus modeled object 230 is detected around the test sample 210, the upper surface of the surplus modeled object 230 is leveled with a roller or the like. Therefore, the height can be matched with the test sample 210. When the shape of the modeled object 200 is determined, it is preferable to form the groove 130 not only in the test sample 210 but also around the modeled object 200 in the build plate 101.

Although the embodiments have been described above, the present invention is not limited to the above-described embodiments specifically disclosed, and various modifications and changes can be made without departing from the scope of claims. be.

Further, each function of the embodiment described above can be realized by one or a plurality of processing circuits. Here, the "processing circuit" in the present specification is a processor programmed to execute each function by software such as a processor implemented by an electronic circuit, or a processor designed to execute each function described above. It shall include devices such as ASIC (Application Specific Integrated Circuit), DSP (digital signal processor), FPGA (field programmable gate array) and conventional circuit modules.

100 Modeling part 101 Build plate (an example of support)
102 Stage heater 110 Y-direction encoder 111 Carrier 112 Supply means 115 Flying laser (an example of flying means)
115a Pulse laser light 116 Melting laser (an example of means for applying energy)
116a Laser light 117 Cleaning blade 118 Recovery case 120 Z-direction encoder 130 Groove 155 Modeling guide (example of guide)
155a Slit part 160 Modeling guide (example of guide part)
200 modeled object (an example of the first modeled object)
201 Modeling material 210 Test sample (an example of the second modeled object)
230 Surplus modeled object 400 Control unit 401 Reception unit 402 Data generation unit 403 Modeling control unit 41 Flying control unit 42 Melting control unit 43 Movement control unit 404 Flood control unit 405 Correction control unit 406 Notification unit 407 Data correction unit 408 Fall determination unit 410 Floodlight section 410a X-direction floodlight section (an example of the first floodlight section)
410b 1st Y direction floodlight (an example of the 2nd floodlight)
410c 2nd Y direction floodlight (an example of the 2nd floodlight)
420a X-direction detection unit (an example of the first detection unit)
420b 1st Y direction detection unit (example of 2nd detection unit)
420c 2nd Y direction detection unit (example of 2nd detection unit)
420 Detection unit 421 Width 422 Width 500 Three-dimensional modeling device P probe light Px X direction probe light (an example of the first light)
Py1 1st Y direction probe light (example of 2nd light)
Py2 2nd Y direction probe light (example of 2nd light)
θ Falling dy Amount of movement in the Y direction dz Amount of movement in the Z direction

Japanese Unexamined Patent Publication No. 2017-035879

Claims (9)

A modeling part that laminates at least a material layer containing a modeling material in the stacking direction,
A light projecting unit that projects light onto the modeling unit from an intersecting direction that intersects the stacking direction.
A detection unit that detects the width of the light in the stacking direction, and
A three-dimensional modeling device including a control unit that controls the modeling unit based on the width. The three-dimensional modeling apparatus according to claim 1, wherein the light is a linear laser beam having a longitudinal direction along the stacking direction. The modeling part
A support base of a modeled object in which the material layers movable in a predetermined direction are laminated in the laminating direction,
A guide unit located at a predetermined distance from the support base and
A means for flying the modeling material supported on the carrier by the light emitted through the guide portion to the support base is provided.
The three-dimensional modeling apparatus according to claim 1 or 2, wherein the light is pattern light having a length in the stacking direction longer than the predetermined distance. The detection unit
The three-dimensional modeling apparatus according to claim 3, wherein the height of the modeled object in the stacking direction is detected based on the amount of movement of the support base in the stacking direction and the width detected by the detection unit. The detection unit
3. Claim 3, which detects the collapse of the modeled object based on the amount of movement of the support base in the stacking direction and the predetermined direction, and a plurality of light receiving positions of the light in the stacking direction by the detection unit. Or the three-dimensional modeling apparatus according to 4. The modeling portion includes at least one of a row of holes arranged along the crossing direction or an elongated hole having a longitudinal direction along the crossing direction.
The light projecting unit
A first light projecting unit that projects a first light toward the modeling unit in the intersecting direction, and a first light projecting unit.
A second light projecting unit that projects one or more second lights in a direction intersecting both the stacking direction and the crossing direction toward the modeling unit is included.
The detection unit
A first detection unit that is arranged on the opposite side of the first light projecting unit in the crossing direction with the modeling unit in between and detects the width of the first light in the stacking direction.
A second light projecting portion is arranged on the opposite side of the second light projecting portion in a direction intersecting both the stacking direction and the intersecting direction with the modeling portion interposed therebetween, and the width of the second light in the stacking direction is detected. The three-dimensional modeling apparatus according to any one of claims 3 to 5, which includes a detection unit. The second detection unit determines the heights of the first modeled object included in the modeled object in which the material layers are laminated in the stacking direction and the second modeled object different from the first modeled object in the stacking direction. The three-dimensional modeling apparatus according to claim 6 for detection. The three-dimensional modeling apparatus according to claim 7, wherein the second modeled object is modeled in parallel with the first modeled object, and is modeled so as to include the same thickness as the minimum thickness of the first modeled object in the crossing direction. .. The three-dimensional modeling apparatus according to claim 7, wherein the support base supports the second modeled object at an end portion of the support table, and a groove is formed around the second modeled object.

Images