JP2021141182A - Laminated circuit board - Google Patents

Abstract

To suppress unnecessary capacitive coupling of a plurality of conductor patterns formed in the same layer in a laminated body.SOLUTION: A laminated circuit board 10 includes a laminated body 20, a conductor pattern 31, a conductor pattern 32, an adhesive portion 40, a cavity portion 51, and a cavity portion 52. The laminated body 20 is formed by laminating an insulating base material 21 and an insulating base material 22. The conductor pattern 31 and the conductor pattern 32 are arranged between the insulating base material 21 and the insulating base material 22. The adhesive portion 40 is a portion that is located between the conductor pattern 31 and the conductor pattern 32, and in which the insulating base material 21 and the insulating base material 22 are adhered to each other. A cavity 51 is between the adhesive portion 40 and the conductor pattern 31, and a cavity 52 is between the adhesive portion 40 and the conductor pattern 32.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laminated circuit board in which a conductor pattern is formed inside a laminated body composed of a plurality of insulator layers.

Patent Document 1 describes a composite transmission line. The composite transmission line described in Patent Document 1 includes a laminated insulator and a plurality of conductor patterns.

Some of the plurality of conductor patterns formed on the laminated insulator as described above are formed on the same layer in the laminated insulator.

Patent No. 6048633

However, a plurality of conductor patterns formed in the same layer may cause unnecessary capacitive coupling. When such an unnecessary capacitive coupling occurs, the composite transmission line cannot achieve the desired transmission characteristics.

Therefore, an object of the present invention is to suppress unnecessary capacitive coupling of a plurality of conductor patterns formed in the same layer in the laminated body.

The laminated circuit board of the present invention includes a laminated body, a first conductor pattern, a second conductor pattern, an adhesive portion, and a cavity portion. The laminated body is formed by laminating a first insulating base material and a second insulating base material. The first conductor pattern and the second conductor pattern are arranged between the first insulating base material and the second insulating base material, and are arranged apart from each other in a direction orthogonal to the stacking direction. The adhesive portion is located between the first conductor pattern and the second conductor pattern, and is a portion where the first insulating base material and the second insulating base material are adhered to each other. The hollow portion is a portion between the adhesive portion and the first conductor pattern or between the adhesive portion and the second conductor pattern, and the first insulating base material and the second insulating base material are separated from each other. The length of the first conductor pattern and the second conductor pattern of the hollow portion in the arrangement direction is equal to or larger than the thickness of the bonded portion.

In this configuration, there is a cavity between the first conductor pattern and the second conductor pattern, which has a lower dielectric constant than the first insulating base material and the second insulating base material. As a result, the capacitive coupling between the first conductor pattern and the second conductor pattern is suppressed. Further, since the adhesive portion exists between the first conductor pattern and the second conductor pattern, the reliability of the adhesion between the first insulating base material and the second insulating base material, that is, the reliability of the laminated circuit board is improved. ,improves.

According to the present invention, unnecessary capacitive coupling of a plurality of conductor patterns formed in the same layer in the laminated body can be suppressed.

FIG. 1 is a cross-sectional view showing the configuration of a laminated circuit board according to the first embodiment. FIG. 2 is a partial perspective view of the laminated circuit board according to the first embodiment. FIG. 3 is a cross-sectional view showing the configuration of the laminated circuit board according to the second embodiment. FIG. 4 is a cross-sectional view showing the configuration of the laminated circuit board according to the third embodiment. FIG. 5 is a cross-sectional view showing the configuration of the laminated circuit board according to the fourth embodiment. FIG. 6 is a cross-sectional view showing the configuration of the laminated circuit board according to the fifth embodiment.

(First Embodiment)
The laminated circuit board according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing the configuration of a laminated circuit board according to the first embodiment. FIG. 2 is a partial perspective view of the laminated circuit board according to the first embodiment.

Note that FIG. 1 is a cross-sectional view of a surface orthogonal to the stretching direction of the conductor pattern. Further, in FIGS. 1 and 2, the dimensions are exaggerated in order to make the features of the invention easy to understand. Actually, the laminated circuit board has a thickness direction (a stacking direction of a plurality of insulating base materials) with respect to a size in a stretching direction and a size in a width direction (a direction in which a plurality of conductor patterns described later are arranged). The size of is significantly smaller. That is, the laminated circuit board is in the form of a thin film or a plate. It should be noted that such an illustrated method is the same in other embodiments.

As shown in FIGS. 1 and 2, the laminated circuit board 10 includes a laminated body 20, a conductor pattern 31, a conductor pattern 32, an adhesive portion 40, a cavity portion 51, and a cavity portion 52. The conductor pattern 31 corresponds to the "first conductor pattern" of the present invention, and the conductor pattern 32 corresponds to the "second conductor pattern" of the present invention.

The laminate 20 includes an insulating base material (first insulating base material) 21 and an insulating base material (second insulating base material) 22. The insulating base material 21 and the insulating base material 22 are flat films. The insulating base material 21 and the insulating base material 22 are made of, for example, a thermoplastic resin. The insulating base material 21 and the insulating base material 22 are laminated so that their main surfaces overlap. The laminated body 20 is formed by laminating the insulating base material 21 and the insulating base material 22.

When the insulating base material 21 and the insulating base material 22 are thermoplastic resins, the laminated body 20 may be formed by collectively heating and pressing the insulating base materials having a conductor pattern formed on the main surface. In such a case, insulating substrates having different dielectric loss tangents and dielectric constants may be mixed.

The conductor pattern 31 and the conductor pattern 32 are linear conductor patterns having a predetermined width. The conductor pattern 31 and the conductor pattern 32 are made of a highly conductive material such as copper. The conductor pattern 31 and the conductor pattern 32 are arranged between the insulating base material 21 and the insulating base material 22. That is, the conductor pattern 31 and the conductor pattern 32 are arranged at substantially the same position in the thickness direction of the laminated body 20. The conductor pattern 31 and the conductor pattern 32 are arranged at intervals in the width direction of the laminated body 20. At this time, the width direction of the conductor pattern 31 and the width direction of the conductor pattern 32 are the same (parallel) as the width direction of the laminated body 20.

The adhesive portion 40 is located between the conductor pattern 31 and the conductor pattern 32 in the width direction of the laminated body 20. That is, the adhesive portion 40 is located at substantially the same position in the laminated body 20 in the thickness direction. The adhesive portion 40 is a portion where the insulating base material 21 and the insulating base material 22 are adhered to each other. As shown in FIGS. 1 and 2, a portion of the laminated body 20 opposite to the conductor pattern 32 side with reference to the conductor pattern 31 and a portion opposite to the conductor pattern 31 side with reference to the conductor pattern 32 are also formed. , The insulating base material 21 and the insulating base material 22 are adhered to each other.

The adhesive portion 40 may be formed by a portion where the insulating base material 21 and the insulating base material 22 are modified by thermocompression bonding, or may be formed of an adhesive material different from the insulating base material 21 and the insulating base material 22. good. That is, the adhesive portion 40 is made of a different material from the insulating base material 21 and the insulating base material 22, and the composition ratio and the bonding state of the constituent molecules and the like are different. As a detection method for such a difference, for example, a method of irradiating an object to be inspected with inspection light and analyzing the spectrum may be used (infrared spectroscopy or the like). Further, the adhesive portion may be defined by the hollow portion. That is, the region where the surface of the cavity 51 on the conductor pattern 32 side and the surface of the cavity 52 on the conductor pattern 31 side face each other is the adhesive portion. The shape of the adhesive portion 40 can be realized by adjusting, for example, the temperature condition and the pressure condition when the insulating base material 21 made of a thermoplastic resin and the insulating base material 22 are heat-bonded.

The cavity 51 is between the adhesive portion 40 and the conductor pattern 31. The cavity 52 is between the adhesive 40 and the conductor pattern 32. The hollow portion 51 and the hollow portion 52 are portions where the insulating base material 21 and the insulating base material 22 are not adhered to each other, that is, a portion where the insulating base material 21 and the insulating base material 22 are separated from each other. As shown in FIG. 2, the cavity 51 and the cavity 52 have a shape that spreads along the extending direction of the conductor pattern 31 and the conductor pattern 32. The cavity 51 and the cavity 52 may be divided in the middle in the stretching direction. In other words, the cavity 51 and the cavity 52 may be partially present in the stretching direction. However, it is preferable that the dielectric constant of the adhesive portion 40 is lower than that of the insulating base material 21 and the insulating base material 22 in the portion without the hollow portion. More preferably, the cavity 51 and the cavity 52 are continuously present in the stretching direction, at least in the region where the adjacent conductor pattern 31 and the conductor pattern 32 run in parallel. Thereby, the variation of the capacitive coupling at the position in the stretching direction can be suppressed. The cavity 51 corresponds to the "first cavity" of the present invention, and the cavity 52 corresponds to the "second cavity" of the present invention. Further, since the portion between the conductor pattern 31 and the conductor pattern 32 in the laminated body 20 has a low dielectric constant, the region between them may be defined as the "low dielectric constant portion" of the present invention. .. The length of the "low dielectric constant portion" in the arrangement direction is equal to or larger than the thickness of the "low dielectric constant portion". In this embodiment, the "low dielectric constant portion" includes a cavity portion 51, an adhesive portion 40, and a cavity portion 52. When the adhesive portion 40 has only a portion, the dielectric constant of the adhesive portion 40 is preferably lower than that of the insulating base material as described above.

One end of the cavity 51 in the width direction reaches the side surface of the conductor pattern 31 on the adhesive portion 40 side. The other end of the cavity 51 in the width direction reaches the side surface of the adhesive portion 40 on the conductor pattern 31 side. One end of the cavity 52 in the width direction reaches the side surface of the conductor pattern 32 on the adhesive portion 40 side. The other end of the cavity 52 in the width direction reaches the side surface of the adhesive portion 40 on the conductor pattern 32 side.

As described above, the presence of the cavity 51 and the cavity 52 between the conductor pattern 31 and the conductor pattern 32 lowers the substantial dielectric constant between the conductor pattern 31 and the conductor pattern 32. Therefore, unnecessary capacitive coupling between the conductor pattern 31 and the conductor pattern 32 can be suppressed.

At this time, since the adhesive portion 40 is provided between the conductor pattern 31 and the conductor pattern 32, the peeling between the insulating base material 21 and the insulating base material 22 is suppressed. That is, the decrease in reliability of the laminated circuit board 10 is suppressed.

Here, the width W51 of the cavity 51 and the width W52 of the cavity 52 are larger than the thickness D40 of the adhesive portion 40. As a result, the laminated circuit board 10 has a dielectric of the portion between the conductor pattern 31 and the conductor pattern 32, as compared with the case where the width W51 of the cavity 51 and the width W52 of the cavity 52 are smaller than the thickness D40 of the adhesive portion 40. The rate can be kept low. Therefore, unnecessary capacitive coupling between the conductor pattern 31 and the conductor pattern 32 is suppressed more effectively.

The dielectric constant of the adhesive portion 40 is preferably lower than the dielectric constant of the insulating base material 21 and the dielectric constant of the insulating base material 22, but may be higher. When the dielectric constant of the bonded portion 40 is lower than the dielectric constant of the insulating base material 21 and the dielectric constant of the insulating base material 22, the capacitive coupling between the conductor pattern 31 and the conductor pattern 32 is further suppressed. The adhesive portion 40 may be, for example, an adhesive containing a fluororesin. On the other hand, even if the dielectric constant of the adhesive portion 40 is higher than the dielectric constant of the insulating base material 21 and the dielectric constant of the insulating base material 22, the dielectric constant of the adhesive portion 40 is high due to the presence of the hollow portion 51 and the hollow portion 52. This can be offset, and the capacitive coupling between the conductor pattern 31 and the conductor pattern 32 can be suppressed.

Further, the hollow portion 51 gradually becomes higher (thicker) from the end portion on the adhesive portion 40 side toward the end portion on the conductor pattern 31 side. Similarly, the hollow portion 52 gradually becomes higher (thicker) from the end portion on the adhesive portion 40 side toward the end portion on the conductor pattern 32 side. As a result, a sudden change in the characteristic impedance of the laminated body 20 in the width direction is suppressed.

Further, the hollow portion 51 does not reach the corner portion connecting the side surface of the conductor pattern 31 on the adhesive portion 40 side with the main surface 311 and the main surface 312. That is, the height (maximum height) of the cavity 51 is lower than the height of the conductor pattern 31. Similarly, the hollow portion 52 does not reach the corner portion connecting the side surface of the conductor pattern 32 on the adhesive portion 40 side with the main surface 321 and the main surface 322. That is, the height (maximum height) of the cavity 52 is lower than the height of the conductor pattern 32. Thereby, the decrease in the bonding strength between the conductor pattern 31 and the conductor pattern 32 and the insulating base material 21 and the insulating base material 22 can be suppressed.

Further, the thickness D40 of the adhesive portion 40 is smaller than the thickness D31 of the conductor pattern 31 and the thickness D32 of the conductor pattern 32. As a result, the heat and pressure for forming the adhesive portion 40 can be reduced, and when the insulating base material 21 and the insulating base material 22 are thermoplastic resins, unnecessary flow of the insulating base material 21 and the insulating base material 22 is suppressed. Will be done. Further, when the insulating base material 21 and the insulating base material 22 are bonded with an adhesive, the thickness of the bonded portion 40 is smaller than the thickness of the conductor pattern 31 and the thickness of the conductor pattern 32, so that the hollow portion 51 and the hollow portion are formed. It is possible to suppress the generation of delamination between the conductor patterns 31 and 32 around the 52 and the insulating base materials 21 and 22.

The conductor pattern 31 and the conductor pattern 32 may be a combination of signal conductors or a combination of a signal conductor and a ground conductor.

Further, at least one of the cavity portion 51 and the cavity portion 52 may be present. Further, the hollow portion 51 and the hollow portion 52 may have different shapes.

Further, in FIGS. 1 and 2, the adhesive portion 40 is arranged at the center between the conductor pattern 31 and the conductor pattern 32 in the width direction of the laminated body 20, but is formed in the conductor pattern 31 rather than the conductor pattern 32. It may be closer or closer to the conductor pattern 32 than to the conductor pattern 31. In this case, it is preferable that the width of the conductor pattern 31 and the width of the conductor pattern 32 are shorter than the thickness of the adhesive portion 40.

(Second Embodiment)
The laminated circuit board according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a cross-sectional view showing the configuration of the laminated circuit board according to the second embodiment.

As shown in FIG. 3, the laminated circuit board 10A according to the second embodiment is different from the laminated circuit board 10 according to the first embodiment in the shapes of the cavity 51A and the cavity 52A. Other configurations of the laminated circuit board 10A are the same as those of the laminated circuit board 10, and the description of the same parts will be omitted.

The cavity portion 51A reaches the corner portion connecting the side surface of the conductor pattern 31 with the main surface 311 and the main surface 312. The cavity portion 52A reaches the corner portion connecting the side surface of the conductor pattern 32 with the main surface 321 and the main surface 322.

With such a configuration, the laminated circuit board 10A can further suppress the capacitive coupling between the conductor pattern 31 and the conductor pattern 32.

The cavity 51A may reach a part of the main surface 311 or the main surface 312 of the conductor pattern 31. Similarly, the cavity 52A may reach a part of the main surface 321 or the main surface 322 of the conductor pattern 32. However, it is preferable that the cavity does not reach the main surface of the conductor pattern in consideration of reliability. On the other hand, if the volumes of the hollow portions 51A and 52A are large, it is easy to form a bent portion on the laminated circuit board 10A.

(Third Embodiment)
The laminated circuit board according to the third embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a cross-sectional view showing the configuration of the laminated circuit board according to the third embodiment.

As shown in FIG. 4, the laminated circuit board 10B according to the third embodiment is different from the laminated circuit board 10 according to the first embodiment in the shapes of the cavity 51B and the cavity 52B. Other configurations of the laminated circuit board 10B are the same as those of the laminated circuit board 10, and the description of the same parts will be omitted.

The hollow portion 51B reaches the adhesive portion 40, but does not reach the conductor pattern 31. The hollow portion 52B reaches the adhesive portion 40, but does not reach the conductor pattern 32. In this case, the contact portion between the insulating base material 21 and the insulating base material 22 between the cavity portion 51B and the conductor pattern 31 is also adhered. Further, the contact portion between the insulating base material 21 and the insulating base material 22 between the cavity portion 52B and the conductor pattern 32 is also adhered.

Even with such a configuration, the laminated circuit board 10B can suppress the capacitive coupling between the conductor pattern 31 and the conductor pattern 32. Further, in the laminated circuit board 10B, the area in contact between the insulating base material 21 and the insulating base material 22 is larger than that in the laminated circuit board 10. Therefore, the reliability of the laminated circuit board 10B is improved.

(Fourth Embodiment)
The laminated circuit board according to the fourth embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a cross-sectional view showing the configuration of the laminated circuit board according to the fourth embodiment.

As shown in FIG. 5, the laminated circuit board 10C according to the fourth embodiment is different from the laminated circuit board 10 according to the first embodiment in the configuration of the transmission line. Other configurations of the laminated circuit board 10C are the same as those of the laminated circuit board 10, and the description of the same parts will be omitted.

The laminated circuit board 10C includes a laminated body 20, a conductor pattern 31, a conductor pattern 32C, an adhesive portion 40, a cavity portion 51, a cavity portion 52, a conductor pattern 61, a conductor pattern 62, an interlayer connection conductor 71, and an interlayer connection conductor 72. Be prepared.

The conductor pattern 31 and the conductor pattern 32C are arranged between the insulating base material 21 and the insulating base material 22. Although not shown, for example, a plurality of conductor patterns 32C are arranged in the stretching direction of the conductor pattern 31. The plurality of conductor patterns 32C are arranged at intervals.

The adhesive portion 40 is between the conductor pattern 31 and the conductor pattern 32C in the width direction of the laminated body 20. The cavity 51 is between the adhesive portion 40 and the conductor pattern 31, and the cavity 52 is between the adhesive portion 40 and the conductor pattern 32C.

The conductor pattern 61 is arranged on the surface of the insulating base material 21 opposite to the contact surface with the insulating base material 22. The conductor pattern 61 overlaps the conductor pattern 31 and the conductor pattern 32C when the laminate 20 is viewed in the thickness direction.

The conductor pattern 62 is arranged on the surface of the insulating base material 22 opposite to the contact surface with the insulating base material 21. The conductor pattern 61 overlaps the conductor pattern 61, the conductor pattern 31, and the conductor pattern 32C when the laminate 20 is viewed in the thickness direction.

The interlayer connection conductor 71 is formed on the insulating base material 21, and connects the conductor pattern 61 and the conductor pattern 32C. The interlayer connection conductor 72 is formed on the insulating base material 22, and connects the conductor pattern 62 and the conductor pattern 32C.

With this configuration, the laminated circuit board 10C realizes a strip line in which the conductor pattern 31 is a signal conductor and the conductor pattern 61 and the conductor pattern 62 are ground conductors (ground conductor patterns). At this time, the conductor pattern 32 functions as an auxiliary conductor for grounding.

Even with such a configuration, the laminated circuit board 10C can exert the same effect as that of the laminated circuit board 10.

In the laminated circuit board 10C, the case where there is one signal conductor is shown, but when there are a plurality of signal conductors, the above-mentioned adhesive portion 40 and the cavity portion 51 are sandwiched between the plurality of signal conductors (plurality of conductor patterns). And the structure with the cavity 52 may be adopted.

(Fifth Embodiment)
The laminated circuit board according to the fifth embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a cross-sectional view showing the configuration of the laminated circuit board according to the fifth embodiment.

As shown in FIG. 6, the laminated circuit board 10D according to the fifth embodiment is different from the laminated circuit board 10 according to the first embodiment in the configuration of the transmission line. Other configurations of the laminated circuit board 10D are the same as those of the laminated circuit board 10, and the description of the same parts will be omitted.

The laminated circuit board 10D includes a laminated body 20, a conductor pattern 31, a conductor pattern 32, a conductor pattern 33, an adhesive portion 401, an adhesive portion 402, a cavity portion 511, a cavity portion 512, a cavity portion 521, and a cavity portion 522.

The conductor pattern 31, the conductor pattern 32, and the conductor pattern 33 are arranged between the insulating base material 21 and the insulating base material 22.

The adhesive portion 401 is between the conductor pattern 31 and the conductor pattern 32 in the width direction of the laminated body 20. The cavity 511 is between the adhesive portion 401 and the conductor pattern 31, and the cavity 521 is between the adhesive portion 401 and the conductor pattern 32.

The adhesive portion 402 is between the conductor pattern 31 and the conductor pattern 33 in the width direction of the laminated body 20. The cavity 512 is between the adhesive portion 402 and the conductor pattern 31, and the cavity 522 is between the adhesive portion 402 and the conductor pattern 33.

With this configuration, the laminated circuit board 10D realizes a coplanar line in which the conductor pattern 31 is a signal conductor and the conductor pattern 32 and the conductor pattern 33 are ground conductors.

Even with such a configuration, the laminated circuit board 10D can exert the same effect as that of the laminated circuit board 10.

Further, in the case of a coplanar line, a cavity portion (the cavity portion on the signal conductor side) that is in contact with or close to the conductor pattern 31 that is a signal conductor, and a cavity portion (ground) that is in contact with or is close to the conductor pattern 32 and the conductor pattern 33 that are ground conductors. By appropriately adjusting the volume with the cavity on the conductor side), the following effects can be obtained. By increasing the volume of the cavity on the signal conductor side, the dielectric constant around the conductor pattern 31 which is the signal conductor can be further reduced, and the transmission loss can be further reduced. Further, the volume of the hollow portion on the ground conductor side is increased, and the outer surfaces of the conductor pattern 32 and the conductor pattern 33, which are ground conductors having a relatively large area, are roughened as compared with the conductor pattern 31 which is a signal conductor. It is possible to improve the adhesion between the conductor pattern 32 and the conductor pattern 33 and the insulating base material 21 and the insulating base material 22 while ensuring the size of the portion.

The configurations of the above-described embodiments can be combined as appropriate, and the effects can be exerted according to the combination.

10, 10A, 10B, 10C, 10D: Laminated circuit board 20: Laminated body 21, 22: Insulating base material 31, 32, 33, 32C, 61, 62: Conductor pattern 40, 401, 402: Adhesive portion 51, 51A, 51B, 52, 52A, 52B, 511, 512, 521, 522: Cavity 71, 72: Interlayer connecting conductors 311, 312, 321 and 322: Main surface

Claims (14)

A laminate in which the first insulating base material and the second insulating base material are laminated, and
A first conductor pattern and a second conductor pattern arranged between the first insulating base material and the second insulating base material and spaced apart from each other in an arrangement direction orthogonal to the stacking direction.
An adhesive portion between the first insulating base material and the second insulating base material, which is between the first conductor pattern and the second conductor pattern,
A cavity portion located between the adhesive portion and the first conductor pattern or between the adhesive portion and the second conductor pattern and in which the first insulating base material and the second insulating base material are separated from each other. ,
With
The length of the cavity portion in the arrangement direction between the first conductor pattern and the second conductor pattern is equal to or greater than the thickness of the adhesive portion.
Laminated circuit board. The cavity includes a first cavity between the adhesive and the first conductor pattern, and a second cavity between the adhesive and the second conductor pattern.
The laminated circuit board according to claim 1. The material of the adhesive portion is different from the material of the first insulating base material and the material of the second insulating base material.
The laminated circuit board according to claim 1 or 2. The dielectric constant of the adhesive portion is lower than the dielectric constant of the first insulating base material and the dielectric constant of the second insulating base material.
The laminated circuit board according to claim 3. The dielectric constant of the adhesive portion is higher than the dielectric constant of the first insulating base material and the dielectric constant of the second insulating base material.
The laminated circuit board according to claim 3. The maximum height of the cavity is smaller than the thickness of the first conductor pattern and the thickness of the second conductor pattern.
The laminated circuit board according to any one of claims 1 to 5. One end of the first conductor pattern and the second conductor pattern in the arrangement direction in the cavity reaches the side surface of the first conductor pattern or the side surface of the second conductor pattern.
The laminated circuit board according to any one of claims 1 to 6. One end of the first conductor pattern and the second conductor pattern in the arrangement direction in the cavity does not reach the main surface of the first conductor pattern and the main surface of the second conductor pattern.
The laminated circuit board according to any one of claims 1 to 7. The thickness of the adhesive portion is smaller than the thickness of the first conductor pattern and the thickness of the second conductor pattern.
The laminated circuit board according to any one of claims 1 to 8. A ground conductor pattern that overlaps the first conductor pattern and the second conductor pattern when viewed in the stacking direction is provided.
The first conductor pattern is a signal conductor that is not connected to the ground conductor pattern.
The second conductor pattern is a ground auxiliary conductor connected to the ground conductor pattern.
The laminated circuit board according to any one of claims 1 to 9. The first conductor pattern is a signal conductor and
The second conductor pattern is a ground conductor.
The laminated circuit board according to any one of claims 1 to 9. A laminate in which the first insulating base material and the second insulating base material are laminated, and
A first conductor pattern and a second conductor pattern arranged between the first insulating base material and the second insulating base material, orthogonal to the stacking direction, and spaced apart from each other in the arrangement direction,
Between the first conductor pattern and the second conductor pattern, the first insulating base material and a low dielectric constant portion having a dielectric constant lower than that of the second insulating base material are provided.
The length of the low dielectric constant portion in the arrangement direction is equal to or greater than the thickness.
Laminated circuit board. The low dielectric constant portion includes an adhesive portion between the first insulating base material and the second insulating base material.
The dielectric constant of the adhesive portion is lower than the dielectric constant of the first insulating base material and the dielectric constant of the second insulating base material.
The laminated circuit board according to claim 12. The low dielectric constant portion
At least the adhesive portion between the first insulating base material and the second insulating base material,
A hollow portion located between the adhesive portion and the first conductor pattern and at least one of the adhesive portion and the second conductor pattern is provided.
The laminated circuit board according to claim 12 or 13.

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