JP2021136266A - Optical module - Google Patents

Abstract

To provide an optical module capable of securing stable operation.SOLUTION: An optical module 1A includes: a light formation part 13 that is configured to form light; and a support plate 11A that supports the light formation part 13. The light formation part 13 includes: a semiconductor light-emitting element; a base part 20A that has the semiconductor light-emitting element mounted thereon; an electronic cooling module 70 that adjusts a temperature of the semiconductor light-emitting element; a first adhesive 18 that attaches the electronic cooling module 70 and the base part 20A; and a second adhesive 19 that attaches the support plate 11A and the electronic cooling module 70. At least one of the base part 20A, the electronic cooling module 70, and the support plate 11A is provided with an adhesive holding part that holds at least one of the first adhesive 18 and the second adhesive 19. The adhesive holding part includes at least one of a convex part that projects in a thickness direction of the support plate 11A and concave parts 81A and 91A depressed in the thickness direction of the support plate 11A.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to optical modules.

An optical module in which a semiconductor light emitting element is arranged in a package is known (see, for example, Patent Document 1). Such an optical module is used as a light source for various devices such as a display device, an optical pickup device, and an optical communication device.

The optical module may be provided with an electronic cooling module (hereinafter, may be referred to as a TEC (Thermo-Electric Cooler)) in order to cool the semiconductor light emitting element. In Patent Document 1, the electronic cooling module is arranged via an adhesive between a base member on which a semiconductor light emitting element is mounted and a support base for heat dissipation.

Japanese Unexamined Patent Publication No. 2016-134416

In the optical module disclosed in Patent Document 1, the heat exhaust efficiency depends on the size and thermal conductivity of each member, the adhesive area of the adhesive, and the performance of the TEC. However, the adhesive area of the adhesive may not be completely controlled in the manufacturing process, or when the optical module is used in a situation where the environmental temperature changes, the adhesive interface is caused by the difference in the linear expansion coefficient of each member. As the peeling progresses due to the thermal stress generated in, it may change over time. Furthermore, damage to the TEC progresses due to thermal stress, and its power consumption and temperature controllability may deteriorate. Generally, the thermal stress applied to each member depends on the shape (adhesive area and thickness) of the adhesive. Therefore, when using the optical module in a wide environmental temperature range for a long period of time, in order to enable stable operation with little variation between individuals, it is necessary to control the shape of the adhesive to increase the thermal resistance and each. It is important to adjust the thermal stress applied to the member and to increase the adhesive strength at the adhesive interface. Therefore, one of the purposes is to provide an optical module capable of thermally stable operation.

An optical module according to the present disclosure includes a light forming portion configured to form light and a support plate for supporting the light forming portion. The light forming portion is supported by a semiconductor light emitting element, a base portion on which the semiconductor light emitting element is mounted, an electronic cooling module for adjusting the temperature of the semiconductor light emitting element, and a first adhesive for adhering the electronic cooling module and the base portion. Includes a second adhesive that adheres the plate to the electronic cooling module. An adhesive holding portion for holding at least one of the first adhesive and the second adhesive is formed on at least one of the base portion, the electronic cooling module, and the support plate. The adhesive holding portion includes at least one of a convex portion protruding in the thickness direction of the support plate and a concave portion recessed in the thickness direction of the support plate.

The optical module can operate in a thermally stable manner.

FIG. 1 is an external perspective view showing the structure of an optical module according to an embodiment of the present disclosure. FIG. 2 is an external perspective view showing a state in which the cap of the optical module shown in FIG. 1 is removed. FIG. 3 is a view of the optical module with the cap shown in FIG. 2 removed in the thickness direction of the support plate. FIG. 4 is a schematic cross-sectional view showing a part of the optical module in a state where the cap shown in FIG. 2 is removed. FIG. 5 is an exploded perspective view of the optical module with the cap shown in FIG. 2 removed. FIG. 6 is a schematic perspective view showing a support plate included in the optical module according to the first embodiment. FIG. 7 is a schematic perspective view showing a base plate included in the optical module according to the first embodiment. FIG. 8 is a graph showing the calculated values of the maximum principal stress generated inside the TEC when the thickness of the adhesive is different. FIG. 9 is a graph showing the results of the heat shock test. FIG. 10 is a view of the optical module according to the second embodiment, in which the optical module with the cap removed, is viewed in the thickness direction of the support plate. FIG. 11 is a view of the optical module according to the third embodiment when the optical module with the cap removed is viewed in the thickness direction of the support plate. FIG. 12 is a view of the optical module according to the fourth embodiment when the optical module with the cap removed is viewed in the thickness direction of the support plate. FIG. 13 is a schematic cross-sectional view showing a part of the optical module in a state where the cap shown in FIG. 12 is removed. FIG. 14 is a schematic perspective view showing a support plate included in the optical module according to the fourth embodiment. FIG. 15 is a schematic perspective view showing a support plate included in the optical module according to the fifth embodiment. FIG. 16 is a schematic cross-sectional view showing a part of the optical module in a state where the cap shown in FIG. 15 is removed. FIG. 17 is a schematic perspective view showing a support plate included in the optical module according to the sixth embodiment. FIG. 18 is a schematic perspective view showing a support plate included in the optical module according to the seventh embodiment. FIG. 19 is a schematic cross-sectional view showing a part of the optical module in the optical module according to the eighth embodiment with the cap removed. FIG. 20 is a schematic perspective view showing a part of a support plate included in the optical module according to the ninth embodiment. FIG. 21 is a schematic cross-sectional view showing a part of the optical module in a state where the cap shown in FIG. 20 is removed. FIG. 22 is a schematic perspective view showing a support plate included in the optical module according to the tenth embodiment. FIG. 23 is a schematic cross-sectional view showing a part of the optical module in a state where the cap shown in FIG. 22 is removed. FIG. 24 is a schematic perspective view showing a support plate included in the optical module according to the eleventh embodiment. FIG. 25 is a schematic perspective view showing a support plate included in the optical module according to the twelfth embodiment. FIG. 26 is a schematic perspective view showing the TEC included in the optical module according to the thirteenth embodiment.

[Explanation of Embodiments of the present disclosure]
First, embodiments of the present disclosure will be listed and described. The optical module according to the present disclosure includes a light forming portion configured to form light and a support plate for supporting the light forming portion. The light forming portion is supported by a semiconductor light emitting element, a base portion on which the semiconductor light emitting element is mounted, an electronic cooling module for adjusting the temperature of the semiconductor light emitting element, and a first adhesive for adhering the electronic cooling module and the base portion. Includes a second adhesive that adheres the plate to the electronic cooling module. An adhesive holding portion for holding at least one of the first adhesive and the second adhesive is formed on at least one of the base portion, the electronic cooling module, and the support plate. The adhesive holding portion includes at least one of a convex portion protruding in the thickness direction of the support plate and a concave portion recessed in the thickness direction of the support plate.

According to the optical module of the present disclosure, the base portion and the electronic cooling module include an adhesive holding portion including at least one of a convex portion protruding in the thickness direction of the support plate and a concave portion recessed in the thickness direction of the support plate. And at least one of the support plates. Therefore, the shape of the adhesive is regulated by the shape of the adhesive holding portion, and it becomes easy to control the shape of the adhesive.

Since the adhesive holding portion includes a recess recessed in the thickness direction of the support plate, the role of the adhesive as a cushioning material can be enhanced and the thermal stress applied to the TEC can be reduced. Further, the adhesive strength can be increased by increasing the contact area with the wall surface forming the recess to enhance the anchor effect. In addition, since the adhesive area of the adhesive held in the recess is stable, it is possible to suppress variations in thermal performance between individuals. Since the adhesive holding portion includes a convex portion protruding in the thickness direction of the support plate, the space on the side surface side of the convex portion can be used to discharge the gas generated when the adhesive is cured from the inside of the adhesive. It will be easier. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. From the above, the optical module can operate in a thermally stable manner.

In the above optical module, the outer shape of the adhesive holding portion may be rectangular when viewed in the thickness direction of the support plate. Such a shape is easy to process. The rectangle means a quadrangle having the same angle of all four corners, and includes a square having the same angle of four corners and the length of all four sides.

In the above optical module, the outer shape of the adhesive holding portion may be a shape in which the corners of a rectangle are rounded when viewed in the thickness direction of the support plate. Since the corners of the quadrangle serve as stress concentration points, the rounded corners can reduce the possibility of damage to the adhesive, the adhesive interface, and the TEC due to stress concentration.

In the above optical module, the outer shape of the adhesive holding portion may be a circle or an ellipse when viewed in the thickness direction of the support plate. The circular or elliptical shape has no corners and can have a shorter outer circumference than other shapes having the same area. Therefore, the possibility of damage to the adhesive, the adhesive interface and the TEC due to stress concentration can be reduced, the invasion rate of moisture in the outside air can be reduced, and deterioration of the adhesive and the adhesive interface can be prevented.

In the above optical module, a plurality of adhesive holding portions may be formed at intervals. By doing so, the total amount of the adhesive used can be reduced and the structure can be made inexpensive. In addition, the gas generated when the adhesive is cured can be easily discharged, the pores formed by the gas remaining inside can be reduced, and the adhesive area can be stabilized. Further, when the adhesive holding portion includes a recess, the contact area between the wall surface forming the recess and the adhesive is increased, and the anchor effect can be enhanced, so that the adhesive strength can be enhanced.

In the optical module, the thickness of at least one of the first adhesive and the second adhesive held by the adhesive holding portion may be 50 μm or more. By doing so, the adhesive acts as a cushioning material for thermal stress, the thermal stress applied to the TEC is reduced, and the power consumption and temperature controllability of the TEC are controlled when the optical module is used in a wide environmental temperature range for a long period of time. Can be prevented from getting worse.

In the optical module, the thickness of at least one of the first adhesive and the second adhesive held by the adhesive holding portion may be 100 μm or more. By doing so, the adhesive acts as a cushioning material for thermal stress, further reducing the thermal stress applied to the TEC, and controlling the power consumption and temperature of the TEC when the optical module is used in a wide environmental temperature range for a long period of time. It is possible to prevent the deterioration of sex.

In the above optical module, the light forming unit may further include a lens that converts the spot size of light emitted from the semiconductor light emitting element. By doing so, light having a desired spot size can be emitted from the optical module.

In the above optical module, the light forming unit may further include a plurality of semiconductor light emitting elements and a filter for combining light emitted from the plurality of semiconductor light emitting elements. By doing so, the optical module can emit light that is a combination of a plurality of lights.

The optical module may further include a cap that covers the light forming portion. By doing so, the semiconductor light emitting element constituting the optical module can be effectively protected from the external environment, and high reliability can be ensured.

[Details of Embodiments of the present disclosure]
Next, the optical module according to the embodiment of the present disclosure will be described below with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and the description thereof will not be repeated.

(Embodiment 1)
The first embodiment, which is one embodiment of the optical module according to the present disclosure, will be described with reference to FIGS. 1 to 5. FIG. 1 is an external perspective view showing the structure of an optical module according to an embodiment of the present disclosure. FIG. 2 is an external perspective view showing a state in which the cap of the optical module shown in FIG. 1 is removed. FIG. 3 is a view of the optical module with the cap shown in FIG. 2 removed in the thickness direction of the support plate. FIG. 4 is a schematic cross-sectional view showing a part of the optical module in a state where the cap shown in FIG. 2 is removed. FIG. 5 is an exploded perspective view of the optical module with the cap shown in FIG. 2 removed. In FIG. 3, the optical axis is indicated by a alternate long and short dash line. Further, except for FIG. 4, the first adhesive and the second adhesive are not shown in FIGS. 1 to 5.

With reference to FIGS. 1 to 5, the optical module 1A according to the first embodiment is arranged on a support plate 11A as a support base having a flat plate shape and one surface 12A of the support plate 11A to emit light. A light forming portion 13 as a light forming unit configured to be formed, a cap 14 arranged in contact with one surface 12A of the support plate 11A so as to cover the light forming portion 13, and a support plate 11A. It includes a plurality of lead pins 16 that penetrate from the other surface 12B side to the one surface 12A side and project to both sides of the one surface 12A side and the other surface 12B side. The support plate 11A and the cap 14 are made airtight by being welded, for example. That is, the light forming portion 13 is hermetically sealed by the support plate 11A and the cap 14. The space surrounded by the support plate 11A and the cap 14 is filled with a gas having reduced water content, such as dry air. The cap 14 is formed with an exit window 15 coated with an AR (Anti Reflection) coating made of glass that transmits light from the light forming portion 13. When viewed in the thickness direction of the support plate 11A (when viewed in the Z-axis direction), the support plate 11A is a rectangle with rounded corners. The cap 14 is also a rectangle with rounded corners when viewed in the thickness direction of the support plate 11A. The area of the support plate 11A is larger than the area of the cap 14, and when the cap 14 is placed in contact with the support plate 11A, the outer circumference of the support plate 11A is from the outer circumference of the cap 14. It protrudes like a brim. As the material of the support plate 11A, for example, iron or copper is selected. The coefficient of linear expansion of iron is, for example, 12 ppm / ° C, and the coefficient of linear expansion of copper is, for example, 17 ppm / ° C.

The light forming unit 13 includes a base plate 20A having a plate-like shape as a base member. The base plate 20A has one surface 21A having a rectangle and the other surface 21B located on the opposite side of the one surface 21A in the plate thickness direction when viewed in the thickness direction of the support plate 11A. The direction in which the long side of the base plate 20A extends is the same as the direction in which the long side of the support plate 11A extends (X-axis direction). The direction in which the short side of the base plate 20A extends is the same as the direction in which the short side of the support plate 11A extends (Y-axis direction). The surface 21A includes a base region 22 and a chip mounting region 23. The thickness of the chip mounting area 23 is larger than that of the base area 22. As the material of the base plate 20A, for example, iron or copper is selected.

On the chip mounting region 23, a flat plate-shaped first submount 31, a flat plate-shaped second submount 32, and a flat plate-shaped third submount 33 are formed in regions 24A, 24B, and 24C, respectively. A red laser diode 41, which is a first semiconductor laser as a first semiconductor light emitting element, is arranged on the first submount 31. A green laser diode 42, which is a second semiconductor laser as a second semiconductor light emitting element, is arranged on the second submount 32. A blue laser diode 43, which is a third semiconductor laser as a third semiconductor light emitting element, is arranged on the third submount 33. The red light emitted from the red laser diode 41, the green light emitted from the green laser diode 42, and the blue light emitted from the blue laser diode 43 are emitted in the Y-axis direction, respectively. It is parallel. A thermistor 17 for measuring the temperature of the light forming unit 13 is mounted on the chip mounting region 23. The thermistors 17 are attached to the region 27 at intervals beside the third submount 33.

In the base region 22, a first lens 51, a second lens 52, and a third lens 53 each having a lens surface are arranged. That is, the first lens 51, the second lens 52, and the third lens 53 are mounted on the base plate 20A. The central axes of the first lens 51, the second lens 52, and the third lens 53, that is, the optical axes of the respective lens surfaces coincide with the optical axes of the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. It has been adjusted to. The adjustment of the optical axis, that is, the step of aligning the optical axes and attaching the first lens 51, the second lens 52, and the third lens 53 to the base region 22, is adjusted at a predetermined temperature, for example, room temperature.

The first lens 51, the second lens 52, and the third lens 53 change the spot size of the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. The first lens 51, the second lens 52, and the third lens 53 are respectively bonded to the regions 25A, 25B, and 25C of the base region 22 by, for example, an ultraviolet curable adhesive.

A first filter 61, a second filter 62, and a third filter 63 are arranged in the base region 22. The first filter 61, the second filter 62, and the third filter 63 are respectively adhered to the regions 26A, 26B, and 26C of the base region 22 by, for example, an ultraviolet curable adhesive. The first filter 61, the second filter 62, and the third filter 63 are, for example, wavelength selective filters. The first filter 61, the second filter 62, and the third filter 63 are dielectric multilayer filters. Specifically, the first filter 61 reflects red light. The second filter 62 transmits red light and reflects green light. The third filter 63 transmits red light and green light, and reflects blue light. The main surfaces of the first filter 61, the second filter 62, and the third filter 63 are inclined in the emission direction of the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. Specifically, the main surfaces of the first filter 61, the second filter 62, and the third filter 63 are directed with respect to the emission directions of the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. It is tilted 45 °. As a result, the first filter 61, the second filter 62, and the third filter 63 combine the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43.

The optical module 1A includes a TEC70. The TEC 70 is arranged between the base plate 20A and the support plate 11A. The TEC 70 is a Perche module (Pelche element), and is a plurality of columnar columns arranged side by side with a space between the heat absorbing plate 71, the heat radiating plate 72, and the heat absorbing plate 71 and the heat radiating plate 72 with an electrode interposed therebetween. Includes the semiconductor column 73. As the material of the heat absorbing plate 71 and the heat radiating plate 72, for example, alumina is selected. The coefficient of linear expansion of alumina is, for example, 7 ppm / ° C. As the material of the semiconductor column 73, for example, BiTe is selected. The coefficient of linear expansion of BiTe is, for example, 15 ppm / ° C. The endothermic plate 71 is adhered to the surface 21B of the base plate 20A. The heat radiating plate 72 is adhered to a part of the surface 12A of the support plate 11A. By supplying an electric current to the TEC 70 and passing an electric current, the heat of the base plate 20A adhered to the endothermic plate 71 is transferred to the support plate 11A side, and the base plate 20A is cooled. As a result, the temperature rise of the red laser diode 41, the green laser diode 42, and the blue laser diode 43 can be suppressed. That is, by providing the TEC 70, the temperatures of the red laser diode 41, the green laser diode 42, and the blue laser diode 43 can be adjusted and the output can be stabilized.

The optical module 1A includes a first adhesive 18 that adheres the support plate 11A and the TEC 70. The support plate 11A and the TEC 70 are adhered to each other by the first adhesive 18. The first adhesive 18 is arranged between the support plate 11A and the TEC 70. As the first adhesive 18, a conductive adhesive, for example, a paste-like adhesive in which silver particles are dispersed in a resin binder is used. Such an adhesive cures by heating and functions as an adhesive. Such an adhesive has good thermal conductivity.

The optical module 1A includes a second adhesive 19 that adheres the base plate 20A and the TEC 70. The TEC 70 and the base plate 20A are adhered to each other by the second adhesive 19. The second adhesive 19 is arranged between the base plate 20A and the TEC 70. As the material of the second adhesive 19, the same material as that of the first adhesive 18 described above is used.

The support plate 11A is formed with a first recess 81A that is recessed in the thickness direction of the support plate 11A as an adhesive holding portion 80A for holding the first adhesive 18. FIG. 6 is a schematic perspective view showing a support plate 11A included in the optical module 1A according to the first embodiment. With reference to FIG. 6, the first recess 81A is formed on the surface 12A of the support plate 11A. The first recess 81A includes a bottom wall surface 82A arranged parallel to the XY plane and a side wall surface 83A rising vertically from the bottom wall surface 82A. _{The depth D 1} of the first recess 81A is 100 μm or more. When viewed in the thickness direction of the support plate 11A, the outer shape of the first recess 81A is an elliptical shape. Specifically, in FIG. 3, the extending direction of the long axis is the X-axis direction, and the extending direction of the short axis is the Y-axis direction. The first recess 81A is covered with the base plate 20A when viewed in the thickness direction of the support plate 11A. The first recess 81A is not exposed from the base plate 20A when viewed in the thickness direction of the support plate 11A. A part of the first adhesive 18 is housed in the first recess 81A. The portion of the first adhesive 18 exposed from the first recess 81A in the Z-axis direction comes into contact with the TEC 70.

The base plate 20A is formed with a second recess 91A that is recessed in the thickness direction of the base plate 20A as an adhesive holding portion 80A for holding the second adhesive 19. FIG. 7 is a schematic perspective view showing the base plate 20A included in the optical module 1A according to the first embodiment. With reference to FIG. 7, the second recess 91A is formed on the surface 21B of the base plate 20A. The second recess 91A includes a bottom wall surface 92A arranged parallel to the XY plane and a side wall surface 93A rising vertically from the bottom wall surface 92A. _{The depth D 2} of the second recess 91A is 100 μm or more. The outer shape of the second recess 91A is an elliptical shape when viewed in the thickness direction of the support plate 11A. When viewed in the thickness direction of the support plate 11A, the outer shape and the formed position of the second recess 91A are the same as those of the first recess 81A.

In the optical module 1A, an adhesive holding portion 80A including a first recess 81A recessed in the thickness direction of the support plate 11A is formed on the support plate 11A. Therefore, the shape of the first adhesive 18 is regulated by the shape of the first recess 81A included in the adhesive holding portion 80A, and it becomes easy to control the shape of the first adhesive 18. Further, in the optical module 1A, an adhesive holding portion 80A including a second recess 91A recessed in the thickness direction of the support plate 11A is formed on the base plate 20A. Therefore, the shape of the second adhesive 19 is regulated by the shape of the second recess 91A included in the adhesive holding portion 80A, and it becomes easy to control the shape of the second adhesive 19.

Since the adhesive holding portion 80A includes the first recess 81A recessed in the thickness direction of the support plate 11A, the role of the first adhesive 18 as a cushioning material can be enhanced and the thermal stress applied to the TEC 70 can be reduced. .. Further, the adhesive strength can be increased by increasing the contact area with the side wall surface 83A constituting the first recess 81A to enhance the anchor effect. Further, since the adhesive area of the first adhesive 18 held in the first recess 81A is stable, it is possible to suppress the variation in thermal performance between individuals. Further, the adhesive holding portion 80A includes the second recess 91A recessed in the thickness direction of the support plate 11A, thereby enhancing the role of the second adhesive 19 as a cushioning material and reducing the thermal stress applied to the TEC 70. Can be done. Further, the adhesive strength can be increased by increasing the contact area with the side wall surface 93A constituting the second recess 91A to enhance the anchor effect. Further, since the adhesive area of the second adhesive 19 held in the second recess 91A is stable, it is possible to suppress the variation in thermal performance between individuals. From the above, the optical module 1A can operate in a thermally stable manner.

In the optical module 1A, the outer shapes of the first recess 81A and the second recess 91A included in the adhesive holding portion 80A are elliptical when viewed in the thickness direction of the support plate 11A. The elliptical shape has no corners and can have a shorter outer peripheral length as compared with other shapes having the same area. Therefore, the possibility of damage to the first adhesive 18, the second adhesive 19, the respective adhesive interfaces and the TEC 70 due to stress concentration can be reduced, and the penetration rate of moisture in the outside air can be reduced, so that the first adhesive 18, It is possible to prevent deterioration of the second adhesive 19 and the adhesive interface. By making the outer shapes of the first recess 81A and the second recess 91A circular, the outer peripheral length can be further shortened.

In the optical module 1A, the thickness of the support plate 11A of the first adhesive 18 and the second adhesive 19 held by the adhesive holding portion 80A is 100 μm or more, respectively. Therefore, when the first adhesive 18 and the second adhesive 19 act as cushioning materials for thermal stress, the thermal stress applied to the TEC 70 is further reduced, and the optical module 1A is used in a wide environmental temperature range for a long period of time, the TEC 70 is used. It is possible to further prevent deterioration of power consumption and temperature controllability.

FIG. 8 is a graph showing the calculated values of the maximum principal stress generated inside the TEC 70 when the thickness of the adhesive is different. In FIG. 8, the vertical axis indicates the maximum principal stress (MPa), and the horizontal axis indicates the adhesion when the adhesive thickness is 20 μm and the adhesive thickness is 50 μm in order from the left (closer to the vertical axis). The case where the thickness of the agent is 100 μm is shown. Further, in the graph shown in FIG. 8, the value of the maximum principal stress at which the TEC 70 is considered to be damaged is shown by a broken line.

With reference to FIG. 8, when the thickness of the adhesive is 20 μm, the maximum principal stress shows a high value of 130 MPa. On the other hand, when the thickness of the adhesive is 50 μm, the maximum principal stress is 118 MPa, which is significantly reduced as compared with the case where the thickness of the adhesive is 20 μm. When the thickness of the adhesive is 100 μm, the maximum principal stress is 108 MPa, which is further reduced. That is, the thicker the adhesive is, the smaller the maximum principal stress generated inside the TEC 70 can be.

FIG. 9 is a graph showing the results of the heat shock test. In FIG. 9, the vertical axis represents the amount of change in electrical resistance (Ω), and the horizontal axis represents the number of heat shock cycles (times). In the heat shock test shown in FIG. 9, the environment in which the optical module is placed is set to -40 ° C to 95 ° C, and the electric resistance of the TEC 70 is measured by alternately arranging the optical modules in each environment for 30 minutes each, and the amount of change in the electric resistance. Is evaluated by deriving. In FIG. 9, a case where the thickness of the adhesive is 50 μm and a case where the thickness of the adhesive is 100 μm are shown by different lines. In FIG. 9, when the thickness of the adhesive was 20 μm, the TEC70 was damaged after 5 heat shock cycles, and the electric resistance could not be measured. Not shown because the change in electrical resistance could not be calculated.

With reference to FIG. 9, the TEC 70 did not fail even when the number of heat shock cycles was 600 or more in both the case where the thickness of the adhesive was 50 μm and the case where the thickness of the adhesive was 100 μm. , The amount of change in electrical resistance is very small.

As can be derived from the results shown in FIGS. 8 and 9, by ensuring that the thickness of the adhesive is 50 μm or more, and further 100 μm or more, the TEC70 is damaged even when used for a long period of time in an environment with a large temperature change. It is possible to greatly reduce the risk of power consumption and prevent deterioration of power consumption.

The light forming unit 13 included in the optical module 1A converts the spot size of the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43 into the first lens 51, the second lens 52, and the second lens, respectively. Includes 3 lenses 53. Therefore, the optical module 1A is an optical module capable of emitting light having a desired spot size from the optical module 1A.

In the optical module 1A, the light forming unit 13 combines the red laser diode 41, the green laser diode 42, and the blue laser diode 43 with the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43. The third filter 63 is included. Therefore, the optical module 1A is an optical module capable of emitting light obtained by combining a plurality of lights.

Since the optical module 1A includes a cap 14 that covers the light forming portion 13, the red laser diode 41, the green laser diode 42, and the blue laser diode 43, which are semiconductor light emitting elements constituting the optical module 1A, are effectively protected from the external environment. can do. Further, the cap 14 can effectively protect the first lens, the second lens, the third lens, the first filter, the second filter, and the third filter, which are optical components included in the light forming unit 13, from the external environment. .. Therefore, the optical module 1A is an optical module that can ensure high reliability.

In the above embodiment, when viewed in the thickness direction of the support plate 11A, the outer shapes of the first recess 81A and the second recess 91A included in the adhesive holding portion 80A may be formed of curved lines. good. That is, the outer shape of the adhesive holding portion 80A may be formed by a curved line. By doing so as well, when viewed in the thickness direction of the support plate 11A, the corners in the outer shape of the first recess 81A and the second recess 91A included in the adhesive holding portion 80A are eliminated, and the first It is possible to reduce the possibility of stress concentration occurring in the adhesive 18 and the second adhesive 19.

Further, in the above embodiment, the outer shapes of the first recess 81A and the second recess 91A included in the adhesive holding portion 80A may be circular when viewed in the thickness direction of the support plate 11A. .. That is, the outer shape of the adhesive holding portion 80A may be a circle or an ellipse. The circular or elliptical shape has no corners and can have a shorter outer circumference than other shapes having the same area. Therefore, the possibility of damage to the adhesive, the adhesive interface and the TEC 70 due to stress concentration can be reduced, the invasion rate of moisture in the outside air can be reduced, and deterioration of the adhesive and the adhesive interface can be prevented.

(Embodiment 2)
Next, the second embodiment, which is another embodiment, will be described. FIG. 10 is a view of the optical module 1B according to the second embodiment, in which the optical module 1B with the cap removed is viewed in the thickness direction of the support plate 11B. The optical module 1B of the second embodiment is different from the case of the first embodiment in that the size (area) of the first recess 81B formed in the support plate 11B is different when viewed in the thickness direction of the support plate 11B. Is different.

With reference to FIG. 10, a first recess 81B recessed in the thickness direction of the support plate 11B is formed as an adhesive holding portion 80B on the surface 12A of the support plate 11B included in the optical module 1B in the second embodiment. ing. The first recess 81B has an elliptical shape when the optical module 1B is viewed in the thickness direction of the support plate 11B. The long axis of the first recess 81B extending in the X-axis direction is longer than the long axis of the first recess 81A in the first embodiment. The short axis of the first recess 81B extending in the Y-axis direction is longer than the short axis of the first recess 81A in the first embodiment. When viewed in the thickness direction of the support plate 11B, the area occupied by the first recess 81B on the surface 12A of the second embodiment is larger than that of the first embodiment. A part of the first recess 81B is not covered with the base plate 20B.

Since the optical module 1B includes the first recess 81B having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recess 81B included in the adhesive holding portion 80B, and the first adhesive 18 It becomes easy to control the shape of. Further, the adhesive holding portion 80B includes the first recess 81B recessed in the thickness direction of the support plate 11A, thereby enhancing the role of the first adhesive 18 as a cushioning material and reducing the thermal stress applied to the TEC 70. Can be done. Further, the adhesive strength can be increased by increasing the contact area with the side wall surface forming the first recess 81B to enhance the anchor effect. Further, since the adhesive area of the first adhesive 18 held in the first recess 81B is stable, it is possible to suppress the variation in thermal performance between individuals. From the above, the optical module 1B can operate in a thermally stable manner.

(Embodiment 3)
Next, the third embodiment, which is still another embodiment, will be described. FIG. 11 is a view of the optical module 1C in the third embodiment in which the cap is removed and the optical module 1C is viewed in the thickness direction of the support plate 11C. The optical module 1C of the third embodiment is different from the case of the first embodiment in that the outer shape of the first recess 81C formed in the support plate 11C is rectangular. The shape of the rectangle does not have a geometrically exact rectangle. For example, the opposite sides may not be exactly parallel, and the sides may be connected by a curve.

With reference to FIG. 11, a first recess 81C recessed in the thickness direction of the support plate 11C is formed as an adhesive holding portion 80C on the surface 12A of the support plate 11C included in the optical module 1C in the third embodiment. ing. The first recess 81C is rectangular when viewed in the thickness direction of the support plate 11C. The four corners of the first recess 81C are curved (arc) when viewed in the thickness direction of the support plate 11C. The long side of the first recess 81C extends in the X-axis direction. The short side of the first recess 81C extends in the Y-axis direction. The first recess 81C is covered with the base plate 20C.

Since the optical module 1C includes the first recess 81C having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recess 81C included in the adhesive holding portion 80C, and the first adhesive 18 It becomes easy to control the shape of. Further, the adhesive holding portion 80C includes the first recess 81C recessed in the thickness direction of the support plate 11A, thereby enhancing the role of the first adhesive 18 as a cushioning material and reducing the thermal stress applied to the TEC 70. Can be done. Further, the adhesive strength can be increased by increasing the contact area with the side wall surface forming the first recess 81C to enhance the anchor effect. Further, since the adhesive area of the first adhesive 18 held in the first recess 81C is stable, it is possible to suppress the variation in thermal performance between individuals. From the above, the optical module 1C can operate in a thermally stable manner.

In the present embodiment, the outer shape of the first recess 81C, which is the adhesive holding portion 80C, is rectangular when viewed in the thickness direction of the support plate 11C. Such a shape is easy to process.

In the present embodiment, when viewed in the thickness direction of the support plate 11C, the outer shape of the first recess 81C, which is the adhesive holding portion 80C, is a shape in which the corners of the rectangle are rounded. Since the corners of the quadrangle serve as stress concentration points, the rounded corners can reduce the possibility of damage to the first adhesive 18, the bonding interface, and the TEC 70 due to stress concentration.

(Embodiment 4)
Next, the fourth embodiment, which is still another embodiment, will be described. FIG. 12 is a view of the optical module 1D in the fourth embodiment in which the cap is removed and the optical module 1D is viewed in the thickness direction of the support plate 11D. FIG. 13 is a schematic cross-sectional view showing a part of the optical module 1D in a state where the cap shown in FIG. 12 is removed. FIG. 14 is a schematic perspective view showing a support plate 11D included in the optical module 1D according to the fourth embodiment. The optical module 1D of the fourth embodiment is different in the shape and number of the first recess formed in the support plate 11D and the second recess formed in the base plate 20D when viewed in the thickness direction of the support plate 11D. In that respect, it is different from the case of the first embodiment.

With reference to FIGS. 12 to 14, four first surfaces of the support plate 11D included in the optical module 1D according to the fourth embodiment are recessed in the thickness direction of the support plate 11D as the adhesive holding portion 80D. The recesses 84A, 84B, 84C, 84D of the above are formed. The first recesses 84A, 84B, 84C, and 84D are shapes in which the recesses recessed in an elliptical shape are cut in a region including a minor axis and a region including a major axis when viewed in the thickness direction of the support plate 11D, respectively. It is formed at intervals. The outer shapes of the first recesses 84A to 84D are a part of an elliptical arc having the same outer shape as the outer shape of the first recess 81A in the first embodiment and the X-axis when viewed in the thickness direction of the support plate 11D, respectively. It is composed of a line segment extending in the direction and a line segment extending in the Y-axis direction. On the surface 21B of the base plate 20D included in the optical module 1D in the fourth embodiment, four second recesses 94A, 94B, 94C, 94D recessed in the thickness direction of the support plate 11D are provided as the adhesive holding portion 80D. include.

Since the optical module 1D includes the first recesses 84A to 84D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 84A to 84D included in the adhesive holding portion 80D. 1 It becomes easy to control the shape of the adhesive 18. Further, since the optical module 1D includes the second recesses 94A to 94D having the above configuration, the shape of the second adhesive 19 is regulated by the shape of the second recesses 94A to 94D included in the adhesive holding portion 80D. , It becomes easy to control the shape of the second adhesive 19. Further, since the adhesive holding portion 80D includes the first recesses 84A to 84D recessed in the thickness direction of the support plate 11D, the role of the first adhesive 18 as a cushioning material is enhanced and the thermal stress applied to the TEC 70 is reduced. can do. Further, the adhesive strength can be increased by increasing the contact area with the side wall surfaces forming the first recesses 84A to 84D to enhance the anchor effect. Further, since the adhesive area of the first adhesive 18 held in the first recesses 84A to 84D is stable, it is possible to suppress the variation in thermal performance between individuals. Further, since the adhesive holding portion 80D includes the second recesses 94A to 94D recessed in the thickness direction of the support plate 11D, the role of the second adhesive 19 as a cushioning material is enhanced and the thermal stress applied to the TEC 70 is reduced. can do. Further, the adhesive strength can be increased by increasing the contact area with the side wall surfaces forming the second recesses 94A to 94D to enhance the anchor effect. Further, since the adhesive area of the second adhesive 19 held in the second recesses 94A to 94D is stable, it is possible to suppress the variation in thermal performance between individuals. From the above, the optical module 1D can operate in a thermally stable manner.

In the present embodiment, the first recesses 84A to 84D included in the adhesive holding portion 80D are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the structure is inexpensive. Can be done. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap 84E between the first adhesives 18 held in the first recesses 84A to 84D, and the holes formed by the gas remaining inside can be easily discharged. Can be reduced and the adhesive area can be stabilized. Further, the second recesses 94A to 94D included in the adhesive holding portion 80D are formed at intervals, so that the total amount of the second adhesive 19 to be used can be reduced and the configuration can be made inexpensive. Further, the gas generated when the second adhesive 19 is cured can be easily discharged by the gap 94E between the second adhesives 19 held in the second recesses 94A to 94D, and the holes formed by the gas remaining inside can be easily discharged. Can be reduced and the adhesive area can be stabilized.

(Embodiment 5)
Next, the fifth embodiment, which is still another embodiment, will be described. FIG. 15 is a schematic perspective view showing a support plate 11E included in the optical module 1E according to the fifth embodiment. FIG. 16 is a schematic cross-sectional view showing a part of the optical module 1E with the cap removed. The cross section shown in FIG. 16 is a cross section when cut in a cross section parallel to the XZ plane through the center of the first recesses 85E, 85F, 85G, 85H described later. The optical module 1E of the fifth embodiment differs in the shape and number of the first recess formed in the support plate 11E and the second recess formed in the base plate 20E when viewed in the thickness direction of the support plate 11E. In that respect, it is different from the case of the first embodiment.

With reference to FIGS. 15 and 16, the surface 12A of the support plate 11E included in the optical module 1E according to the fifth embodiment has twelve dents recessed in the thickness direction of the support plate 11E as the adhesive holding portion 80E. The recesses 85A, 85B, 85C, 85D, 85E, 85F, 85G, 85H, 85I, 85J, 85K, 85L of No. 1 are formed. The outer shapes of the first recesses 85A to 85L are circular when viewed in the thickness direction of the support plate 11E, and are formed at intervals in the X-axis direction and the Y-axis direction, respectively. Further, 12 second recesses 95A to 95L are formed as the adhesive holding portion 80E on the surface 21B of the base plate 20E included in the optical module 1E in the fifth embodiment. Of the 12 second recesses 95A to 95L, in FIG. 16, the second recesses 95E, 95F, 95G, 95H provided at positions facing the first recesses 85E, 85F, 85G, 85H are shown. ing. The outer shapes of the twelve second recesses 95A to 95L are circular when viewed in the thickness direction of the support plate 11E, and are formed at intervals in the X-axis direction and the Y-axis direction, respectively.

Since the optical module 1E includes the first recesses 85A to 85L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 85A to 85L included in the adhesive holding portion 80E. 1 It becomes easy to control the shape of the adhesive 18. Further, since the optical module 1E includes the second recesses 95A to 95L having the above configuration, the shape of the second adhesive 19 is regulated by the shape of the second recesses 95A to 95L included in the adhesive holding portion 80E. , It becomes easy to control the shape of the second adhesive 19. Further, since the adhesive holding portion 80E includes the first recesses 85A to 85L recessed in the thickness direction of the support plate 11E, the role of the first adhesive 18 as a cushioning material is enhanced and the thermal stress applied to the TEC 70 is reduced. can do. Further, the adhesive strength can be increased by increasing the contact area with the side wall surfaces forming the first recesses 85A to 85L to enhance the anchor effect. Further, since the adhesive area of the first adhesive 18 held in the first recesses 85A to 85L is stable, it is possible to suppress the variation in thermal performance between individuals. Further, since the adhesive holding portion 80E includes the second recesses 95E to 95G recessed in the thickness direction of the support plate 11E, the role of the second adhesive 19 as a cushioning material is enhanced and the thermal stress applied to the TEC 70 is reduced. can do. Further, the adhesive strength can be increased by increasing the contact area with the side wall surfaces constituting the second recesses 95E to 95G to enhance the anchor effect. Further, since the adhesive area of the second adhesive 19 held in the second recesses 95E to 95G is stable, it is possible to suppress the variation in thermal performance between individuals. From the above, the optical module 1E can operate in a thermally stable manner.

In the present embodiment, the first recesses 85A to 85L included in the adhesive holding portion 80E are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the structure is inexpensive. Can be done. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap 85M between the first adhesives 18 held in the first recesses 85A to 85L, and the holes formed by the gas remaining inside can be easily discharged. Can be reduced and the bonding area can be stabilized. Further, the second recesses 95E to 95G included in the adhesive holding portion 80E are formed at intervals, so that the total amount of the second adhesive 19 to be used can be reduced and the configuration can be made inexpensive. Further, the gas generated when the second adhesive 19 is cured can be easily discharged by the gap 95M between the second adhesives 19 held in the second recesses 95E to 95G, and the holes formed by the gas remaining inside can be easily discharged. Can be reduced and the adhesive area can be stabilized.

(Embodiment 6)
Next, the sixth embodiment, which is still another embodiment, will be described. FIG. 17 is a schematic perspective view showing a support plate 11F included in the optical module according to the sixth embodiment. The optical module of the sixth embodiment is different from the case of the fifth embodiment in that the shape of the first recess formed in the support plate 11F is different when viewed in the thickness direction of the support plate 11F.

With reference to FIG. 17, the surface 12A of the support plate 11F included in the optical module according to the sixth embodiment has twelve first recesses 86A recessed in the thickness direction of the support plate 11F as the adhesive holding portion 80F. , 86B, 86C, 86D, 86E, 86F, 86G, 86H, 86I, 86J, 86K, 86L are formed. The outer shapes of the first recesses 86A to 86L are square when viewed in the thickness direction of the support plate 11F, and are formed at intervals.

Since the optical module 1F includes the first recesses 86A to 86L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 86A to 86L included in the adhesive holding portion 80F. 1 It becomes easy to control the shape of the adhesive 18. Further, since the adhesive holding portion 80F includes the first recesses 86A to 86L recessed in the thickness direction of the support plate 11F, the role of the first adhesive 18 as a cushioning material is enhanced and the thermal stress applied to the TEC 70 is reduced. can do. Further, the adhesive strength can be increased by increasing the contact area with the side wall surfaces forming the first recesses 86A to 86L to enhance the anchor effect. Further, since the adhesive area of the first adhesive 18 held in the first recesses 86A to 86L is stable, it is possible to suppress the variation in thermal performance between individuals. From the above, the optical module 1E can operate in a thermally stable manner.

In the present embodiment, the first recesses 86A to 86L included in the adhesive holding portion 80F are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the structure is inexpensive. Can be done. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap between the first adhesives 18 held in the first recesses 86A to 86L, and the holes formed by the gas remaining inside can be easily discharged. It can be reduced and the adhesive area can be stabilized.

(Embodiment 7)
Next, the seventh embodiment, which is still another embodiment, will be described. FIG. 18 is a schematic perspective view showing a support plate 11G included in the optical module according to the seventh embodiment. The optical module of the seventh embodiment is different from the case of the sixth embodiment in that the shape and number of the first recesses formed in the support plate 11G are different when viewed in the thickness direction of the support plate 11G. ..

With reference to FIG. 18, four first recesses 87A, which are recessed in the thickness direction of the support plate 11G, are formed on the surface 12A of the support plate 11G included in the optical module according to the seventh embodiment as the adhesive holding portion 80G. 87B, 87C, 87D are formed. The four first recesses 87A to 87D have a groove shape extending in the Y-axis direction, and are formed at intervals in the X-axis direction. The outer shape of the four first recesses 87A to 87D is a rectangle whose longitudinal direction is the Y-axis direction when viewed in the thickness direction of the support plate 11G.

Since the optical module includes the first recesses 87A to 87D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 87A to 87D included in the adhesive holding portion 80G, and the first It becomes easy to control the shape of the adhesive 18. Further, since the adhesive holding portion 80G includes the first recesses 87A to 87D recessed in the thickness direction of the support plate 11F, the role of the first adhesive 18 as a cushioning material is enhanced and the thermal stress applied to the TEC 70 is reduced. can do. Further, the adhesive strength can be increased by increasing the contact area with the side wall surfaces forming the first recesses 87A to 87D to enhance the anchor effect. Further, since the adhesive area of the first adhesive 18 held in the first recesses 87A to 87D is stable, it is possible to suppress the variation in thermal performance between individuals. From the above, the optical module can operate in a thermally stable manner. In the present embodiment, since the first recesses 87A to 87D are groove-shaped, the wall surface forming the first recesses 87A to 87D and the first adhesive 18 are formed in a direction perpendicular to the direction in which the groove extends and in the in-plane direction. The contact area of the is increased, and the adhesive strength in this direction can be selectively increased.

In the present embodiment, the first recesses 87A to 87D included in the adhesive holding portion 80F are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the structure is inexpensive. Can be done. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap between the first adhesives 18 held in the first recesses 87A to 87D, and the holes formed by the gas remaining inside can be easily discharged. It can be reduced and the adhesive area can be stabilized.

(Embodiment 8)
Next, the eighth embodiment, which is still another embodiment, will be described. FIG. 19 is a schematic cross-sectional view showing a part of the optical module 1H in the optical module 1H according to the eighth embodiment in a state where the cap is removed. In the optical module 1H of the eighth embodiment, instead of the first concave portion 81A formed in the support plate 11A, a first convex portion protruding in the thickness direction of the support plate is formed on the surface 12A. In the case of the first embodiment, instead of the second concave portion 91A formed in the base plate 20A, a protruding second convex portion protruding in the thickness direction of the support plate is formed on the surface 21B. Is different.

With reference to FIG. 19, the surface 12A of the support plate 11H included in the optical module 1H in the eighth embodiment has a first convex portion 101A protruding in the thickness direction of the support plate 11H as an adhesive holding portion 80H. Is formed. The first convex portion 101A includes a top surface 101B arranged parallel to the XY plane and a side wall surface 101C rising vertically from the top surface 101B. The outer shape of the first convex portion 101A when viewed in the thickness direction of the support plate 11H is an elliptical shape. Specifically, the extending direction of the long axis is the X-axis direction, and the extending direction of the short axis is the Y-axis direction. The first convex portion 101A is not exposed from the base plate 20H when viewed in the thickness direction of the support plate 11H. The first adhesive 18 is held on the top surface 101B of the first convex portion 101A. The first adhesive 18 held on the top surface 101B comes into contact with the TEC 70.

On the surface 21B of the base plate 20H included in the optical module 1H in the eighth embodiment, a second convex portion 111A protruding in the thickness direction of the support plate 11H is formed as the adhesive holding portion 80H. The second convex portion 111A includes a top surface 111B arranged parallel to the XY plane and a side wall surface 111C rising vertically from the top surface 111B. The outer shape of the second convex portion 111A when viewed in the thickness direction of the support plate 11H is an elliptical shape. Specifically, the extending direction of the long axis is the X-axis direction, and the extending direction of the short axis is the Y-axis direction. The second adhesive 19 is held on the top surface 111B of the second convex portion 111A. The second adhesive 19 held on the top surface 111B comes into contact with the TEC 70.

In the optical module 1H, an adhesive holding portion 80H including a first convex portion 101A projecting in the thickness direction of the support plate 11H is formed on the support plate 11H. Therefore, the shape of the first adhesive 18 is regulated by the shape of the first convex portion 101A included in the adhesive holding portion 80H, and it becomes easy to control the shape of the first adhesive 18. Further, in the optical module 1H, an adhesive holding portion 80H including a second convex portion 111A protruding in the thickness direction of the support plate 11H is formed on the base plate 20H. Therefore, the shape of the second adhesive 19 is regulated by the shape of the second convex portion 111A included in the adhesive holding portion 80H, and it becomes easy to control the shape of the second adhesive 19.

By including the first convex portion 101A in which the adhesive holding portion 80H projects in the thickness direction of the support plate 11H, the space on the side surface side of the first convex portion 101A is utilized to cure the first adhesive 18. It becomes easy to discharge the gas generated from time to time from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. By including the second convex portion 111A protruding in the thickness direction of the support plate 11H, the adhesive holding portion 80H cures the second adhesive 19 by utilizing the space on the side surface side of the second convex portion 111A. It becomes easy to discharge the gas generated from time to time from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. From the above, the optical module can operate in a thermally stable manner.

(Embodiment 9)
Next, a ninth embodiment, which is still another embodiment, will be described. FIG. 20 is a schematic perspective view showing a part of the support plate 11J including the optical module 1J in the ninth embodiment. FIG. 21 is a schematic cross-sectional view showing a part of the optical module 1J in a state where the cap shown in FIG. 20 is removed. In the optical module 1J of the ninth embodiment, the first convex portions 102A, 102B, 102C, 102D are formed in place of the first concave portions 84A, 84B, 84C, 84D in the fourth embodiment, and the embodiment. It differs from the case of the fourth embodiment in that the second convex portions 112A to 112D are formed in place of the second concave portions 94A to 94D in the fourth embodiment.

With reference to FIGS. 20 and 21, the surface 12A of the support plate 11J included in the optical module 1J according to the ninth embodiment has four third portions as adhesive holding portions 80J protruding in the thickness direction of the support plate 11J. The convex portions 102A, 102B, 102C, 102D of 1 are formed. The surface 21B of the base plate 20J included in the optical module 1J according to the ninth embodiment includes four second convex portions 112A to 112D that project in the thickness direction of the support plate 11J as the adhesive holding portion 80J. Of the four second convex portions 112A to 112D, FIG. 21 shows the second convex portions 112A and 112B provided at positions facing the first convex portions 102A and 102B, respectively. The outer shapes of the four second convex portions 112A to 112D are the same as the outer shapes of the four first convex portions 102A to 102D when viewed in the thickness direction of the support plate 11.

Since the optical module 1J includes the first convex portions 102A to 102D and the second convex portions 112A to 112D having the above configuration, the variation in the adhesive strength of the first adhesive 18 and the adhesive strength of the second adhesive 19 Variation can be suppressed. In the present embodiment, a gap 102E is formed between the first adhesives 18 held by the first convex portions 102A to 102D. Through the gap 102E, it is possible to easily release the gas generated when the first adhesive 18 is cured. Similarly, the gas generated when the second adhesive 19 is cured can be easily released through the gap 112E formed between the second adhesives 19 held by the second convex portions 112A to 112D. Therefore, the adhesive strength can be further increased. Therefore, the optical module 1J can ensure stable operation.

Since the optical module 1J includes the first convex portions 102A to 102D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 102A to 102D included in the adhesive holding portion 80J. , It becomes easy to control the shape of the first adhesive 18. Further, since the optical module 1J includes the second convex portions 112A to 112D having the above configuration, the shape of the second adhesive 19 depends on the shape of the second convex portions 112A to 112D included in the adhesive holding portion 80J. It is regulated and it becomes easy to control the shape of the second adhesive 19.

Further, since the adhesive holding portion 80J includes the first convex portions 102A to 102D protruding in the thickness direction of the support plate 11J, the space on the side surface side of the first convex portions 102A to 102D is utilized to make the first convex portion 102A to 102D. 1 It becomes easy to discharge the gas generated when the adhesive 18 is cured from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. By including the second convex portions 112A to 112D in which the adhesive holding portion 80J protrudes in the thickness direction of the support plate 11J, the space on the side surface side of the second convex portions 112A to 112D is utilized for the second adhesion. It becomes easy to discharge the gas generated when the agent 19 is cured from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. From the above, the optical module 1J can operate in a thermally stable manner.

In the present embodiment, the first convex portions 102A to 102D included in the adhesive holding portion 80J are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the cost is low. Can be configured. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap 102E between the first adhesives 18 held by the first convex portions 102A to 102D, and the empty space created by the gas remaining inside. The holes can be reduced and the bonding area can be stabilized. Further, the second convex portions 112A to 112D included in the adhesive holding portion 80J are formed at intervals, so that the total amount of the second adhesive 19 used can be reduced and the configuration can be made inexpensive. Further, the gas generated when the second adhesive 19 is cured can be easily discharged by the gap 112E between the second adhesives 19 held by the second convex portions 112A to 112D, and the empty space created by the gas remaining inside. The holes can be reduced and the bonding area can be stabilized.

(Embodiment 10)
Next, the tenth embodiment, which is still another embodiment, will be described. FIG. 22 is a schematic perspective view showing a support plate 11K included in the optical module 1K according to the tenth embodiment. FIG. 23 is a schematic cross-sectional view showing a part of the optical module 1K with the cap removed. The cross section shown in FIG. 23 is a cross section when cut in a cross section parallel to the XZ plane through the center of the first convex portions 103E, 103F, 103G, 103H described later. In the optical module 1K of the tenth embodiment, instead of the first concave portions 85A to 85L in the fifth embodiment, the first convex portions 103A, 103B, 103C, 103D, 103E, 103F, 103G, 103H, 103I, 103J, Unlike the case of the fifth embodiment, 103K and 103L are formed and the second convex portions 113A to 113L are formed instead of the second concave portions 95A to 95L in the fifth embodiment. There is.

With reference to FIGS. 22 and 23, on the surface 12A of the support plate 11K included in the optical module 1K in the tenth embodiment, 12 adhesive holding portions 80K are projected in the thickness direction of the support plate 11K. The first convex portions 103A to 103L are formed. The outer shape of the first convex portions 103A to 103L is a circle when viewed in the thickness direction of the support plate 11K, and is formed at intervals in the X-axis direction and the Y-axis direction, respectively. Further, 12 second convex portions 113A to 113L are formed as the adhesive holding portion 80K on the surface 21B of the base plate 20K included in the optical module 1K in the tenth embodiment. Of the 12 second convex portions 113A to 113L, in FIG. 23, the second convex portions 113E, 113F, 113G, 113H provided at positions facing the first convex portions 103E, 103F, 103G, 103H, respectively. Is illustrated. The outer shapes of the twelve second convex portions 113A to 113L are circular when viewed in the thickness direction of the support plate 11K, and are formed at intervals in the X-axis direction and the Y-axis direction, respectively.

Since the optical module 1K includes the first convex portions 103A to 103L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 103A to 103L included in the adhesive holding portion 80K. , It becomes easy to control the shape of the first adhesive 18. Further, since the optical module 1K includes the second convex portions 113A to 113L having the above configuration, the shape of the second adhesive 19 depends on the shape of the second convex portions 113A to 113L included in the adhesive holding portion 80K. It is regulated and it becomes easy to control the shape of the second adhesive 19.

Further, since the adhesive holding portion 80K includes the first convex portions 103A to 103L protruding in the thickness direction of the support plate 11K, the space on the side surface side of the first convex portions 103A to 103L is utilized to make the first convex portion 103A to 103L. 1 It becomes easy to discharge the gas generated when the adhesive 18 is cured from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. By including the second convex portions 113A to 113L in which the adhesive holding portion 80K protrudes in the thickness direction of the support plate 11K, the space on the side surface side of the second convex portions 113A to 113L is utilized for the second adhesion. It becomes easy to discharge the gas generated when the agent 19 is cured from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. From the above, the optical module 1K can operate in a thermally stable manner.

In the present embodiment, the first convex portions 103A to 103L included in the adhesive holding portion 80K are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the cost is low. Can be configured. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap 103M between the first adhesives 18 held by the first convex portions 103A to 103L, and the empty space created by the gas remaining inside. The holes can be reduced and the bonding area can be stabilized. Further, the second convex portions 113A to 113L included in the adhesive holding portion 80K are formed at intervals, so that the total amount of the second adhesive 19 used can be reduced and the configuration can be made inexpensive. Further, the gas generated when the second adhesive 19 is cured can be easily discharged by the gap 113M between the second adhesives 19 held by the second convex portions 113A to 113L, and the empty space created by the gas remaining inside. The holes can be reduced and the bonding area can be stabilized.

(Embodiment 11)
Next, the eleventh embodiment, which is still another embodiment, will be described. FIG. 24 is a schematic perspective view showing the support plate 11L included in the optical module according to the eleventh embodiment. The optical module of the eleventh embodiment has twelve first convex portions 104A, 104B, 104C, 104D, which project in the thickness direction of the support plate 11L instead of the first recesses 86A to 86L in the sixth embodiment. It differs from the case of the sixth embodiment in that 104E, 104F, 104G, 104H, 104I, 104J, 104K, and 104L are formed.

With reference to FIG. 24, the surface 12A of the support plate 11L included in the optical module according to the eleventh embodiment has twelve first protrusions protruding in the thickness direction of the support plate 11L as the adhesive holding portion 80L. Parts 104A to 104L are formed. The outer shapes of the first convex portions 104A to 104L are square when viewed in the thickness direction of the support plate 11L, and are formed at intervals.

Since the optical module includes the first convex portions 104A to 104L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 104A to 104L included in the adhesive holding portion 80L. It becomes easy to control the shape of the first adhesive 18.

Further, since the adhesive holding portion 80L includes the first convex portions 104A to 104L protruding in the thickness direction of the support plate 11L, the space on the side surface side of the first convex portions 104A to 104L is utilized to make the first convex portion 104A to 104L. 1 It becomes easy to discharge the gas generated when the adhesive 18 is cured from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. From the above, the optical module 1K can operate in a thermally stable manner.

In the present embodiment, the first convex portions 104A to 104L included in the adhesive holding portion 80L are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the cost is low. Can be configured. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap between the first adhesives 18 held by the first convex portions 104A to 104L, and the holes formed by the gas remaining inside can be easily discharged. Can be reduced and the adhesive area can be stabilized.

(Embodiment 12)
Next, the twelfth embodiment, which is still another embodiment, will be described. FIG. 25 is a schematic perspective view showing a support plate 11M included in the optical module according to the twelfth embodiment. In the optical module of the twelfth embodiment, four first convex portions 105A, 105B, 105C, 105D protruding in the thickness direction of the support plate 11M are formed instead of the first recesses 87A to 87D in the seventh embodiment. This is different from the case of the seventh embodiment.

With reference to FIG. 25, on the surface 12A of the support plate 11M included in the optical module according to the twelfth embodiment, four first convex portions projecting in the thickness direction of the support plate 11M as the adhesive holding portion 80M. 105A to 105D are formed. The four first convex portions 105A to 105D are ridge-shaped extending in the Y-axis direction, and are formed at intervals in the X-axis direction. The outer shapes of the four first convex portions 105A to 105D are rectangles whose longitudinal direction is the Y-axis direction when viewed in the thickness direction of the support plate 11M.

Since the optical module includes the first convex portions 105A to 105D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 105A to 105D included in the adhesive holding portion 80M. It becomes easy to control the shape of the first adhesive 18.

Further, since the adhesive holding portion 80M includes the first convex portions 105A to 105D protruding in the thickness direction of the support plate 11M, the space on the side surface side of the first convex portions 105A to 105D is utilized to make the first convex portion 105A to 105D. 1 It becomes easy to discharge the gas generated when the adhesive 18 is cured from the inside of the adhesive. As a result, pores are less likely to be formed in the adhesive or the adhesive interface, and the adhesive area is stabilized, so that variations in thermal performance between individuals can be suppressed. From the above, the optical module can operate in a thermally stable manner.

In the present embodiment, the first convex portions 105A to 105D included in the adhesive holding portion 80M are formed at intervals, so that the total amount of the first adhesive 18 to be used can be reduced and the cost is low. Can be configured. Further, the gas generated when the first adhesive 18 is cured can be easily discharged by the gap between the first adhesives 18 held by the first convex portions 105A to 105D, and the holes formed by the gas remaining inside can be easily discharged. Can be reduced and the adhesive area can be stabilized.

(Embodiment 13)
Next, the thirteenth embodiment, which is still another embodiment, will be described. FIG. 26 is a schematic perspective view showing the TEC 120 included in the optical module according to the thirteenth embodiment. The optical module of the thirteenth embodiment is the same as that of the first embodiment in that a recess recessed in the thickness direction of the support plate is formed in the heat absorbing plate 71 instead of the heat absorbing plate 71 included in the TEC 70 in the first embodiment. It's different from the case.

With reference to FIG. 26, a recess 123 recessed in the thickness direction of the support plate is formed as an adhesive holding portion 80N on the surface 122 of the heat absorbing plate 121 of the TEC 120 included in the optical module according to the thirteenth embodiment. .. The outer shape of the recess 123 is an elliptical shape when viewed in the thickness direction of the support plate.

Since the optical module includes the recess 123 having the above configuration, the shape of the second adhesive 19 is regulated by the shape of the recess 123 included in the adhesive holding portion 80N, and the shape of the second adhesive 19 can be controlled. It will be easier. Further, since the adhesive holding portion 80N includes the recess 123 recessed in the thickness direction of the support plate, the role of the second adhesive 19 as a cushioning material can be enhanced, and the thermal stress applied to the TEC 70 can be reduced. Further, the adhesive strength can be increased by increasing the contact area with the side wall surface forming the recess 123 to enhance the anchor effect. Further, since the adhesive area of the second adhesive 19 held in the recess 123 is stable, it is possible to suppress variations in thermal performance between individuals. From the above, the optical module can operate in a thermally stable manner.

It should be understood that the embodiments disclosed here are exemplary in all respects and are not restrictive in any way. The scope of the present invention is defined by the scope of claims, not the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

The optical modules of the present disclosure can be applied particularly advantageously when thermally stable operation is required.

1A, 1B, 1C, 1D, 1E, 1H, 1J, 1K Optical Module 11A, 11B, 11C, 11D, 11E, 11F, 11G, 11H, 11J, 11K, 11L, 11M Support Plates 12A, 12B, 21A, 21B, 122 Surface 13 Optical module 14 Cap 15 Exit window 16 Lead pin 17 Thermista 18 1st adhesive 19 2nd adhesive 20A, 20B, 20C, 20D, 20E, 20H, 20H, 20J, 20K Base plate 22 Base area 23 Chip mounted Region 24A, 24B, 24C, 25A, 25B, 25C, 26A, 26B, 26C, 27 Region 31 1st submount 32 2nd submount 33 3rd submount 41 Red laser diode 42 Green laser diode 43 Blue laser diode 51 1 Lens 52 2nd Lens 53 3rd Lens 61 1st Filter 62 2nd Filter 63 3rd Filter 70,120 TEC
71, 121 Endothermic plate 72 Heat dissipation plate 73 Semiconductor columns 80A, 80B, 80C, 80D, 80E, 80F, 80G, 80H, 80J, 80K, 80L, 80M, 80N Adhesive holding parts 81A, 81B, 81C, 84A, 84B, 84C, 84D, 85A, 85B, 85C, 85D, 85E, 85F, 85G, 85H, 85I, 85J, 85K, 85L, 86A, 86B, 86C, 86D, 86E, 86F, 86G, 86H, 86I, 86J, 86K, 86L, 87A, 87B, 87C, 87D, 91A, 94A, 94B, 94C, 94D, 95E, 95F, 95G, 95H, 123 Recess 82A, 92A Bottom wall surface 83A, 93A, 101C, 111C Side wall surface 84E, 85M, 94E, 95M, 102E, 103M, 112E, 113M Gap 101A, 102A, 102B, 102C, 102D, 103A, 103B, 103C, 103D, 103E, 103F, 103G, 103H, 103I, 103J, 103K, 103L, 104A, 104B, 104C, 104D, 104E, 104F, 104G, 104H, 104I, 104J, 104K, 104L, 105A, 105B, 105C, 105D, 111A, 112A, 112B, 113E, 113F, 113G, 113H Convex parts 101B, 111B Top surfaces D ₁ , D ₂ depth

Claims (10)

A light forming part configured to form light,
A support plate that supports the light forming portion is provided.
The light forming part is
Semiconductor light emitting element and
The base portion on which the semiconductor light emitting element is mounted and
An electronic cooling module that adjusts the temperature of the semiconductor light emitting device,
A first adhesive that adheres the electronic cooling module and the base portion,
Includes a second adhesive that adheres the support plate to the electronic cooling module.
At least one of the base portion, the electronic cooling module, and the support plate has an adhesive holding portion that holds at least one of the first adhesive and the second adhesive. Has been formed and
The adhesive holding portion is an optical module including at least one of a convex portion protruding in the thickness direction of the support plate and a concave portion recessed in the thickness direction of the support plate. The optical module according to claim 1, wherein the outer shape of the adhesive holding portion is rectangular when viewed in the thickness direction of the support plate. The optical module according to claim 1, wherein the outer shape of the adhesive holding portion is a shape in which the corners of a rectangle are rounded when viewed in the thickness direction of the support plate. The optical module according to claim 1, wherein the outer shape of the adhesive holding portion is a circle or an ellipse when viewed in the thickness direction of the support plate. The optical module according to any one of claims 1 to 4, wherein a plurality of the adhesive holding portions are formed at intervals. Any one of claims 1 to 5, wherein the thickness of the support plate of at least one of the first adhesive and the second adhesive held by the adhesive holding portion is 50 μm or more. The optical module according to item 1. The optical module according to claim 6, wherein the support plate of at least one of the first adhesive and the second adhesive held by the adhesive holding portion has a thickness of 100 μm or more. The optical module according to any one of claims 1 to 7, wherein the optical forming unit further includes a lens that converts the spot size of light emitted from the semiconductor light emitting device. The light forming part is
With the plurality of the semiconductor light emitting elements,
The optical module according to any one of claims 1 to 8, further comprising a filter for combining light emitted from the plurality of semiconductor light emitting elements. The optical module according to any one of claims 1 to 9, further comprising a cap covering the light forming portion.

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