JP2021133401A - Laser processing device, laser processing method and laser processing program - Google Patents

Abstract

To provide a laser processing device, a laser processing method and a laser processing program which can efficiently collect scattered matters generated during laser processing and improve productivity to always achieve excellent processing state.SOLUTION: A laser processing device 1 discriminates an effective region A2 where a processed matter is configured from an unnecessary region A1 other than the effective region, on the basis of information concerning a contour of the processed matter from a plate-like work-piece and determines a cutting trajectory dividing the unnecessary region A1 so that surface areas thereof are in a range of approximately 18 mm2-300 mm2. After the cutting trajectory is determined, the device cuts the unnecessary region A1 into small pieces by emitting laser beams repeatedly along the cutting trajectory, where the cut small pieces P are collected by a dust collector 72.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laser processing apparatus, a laser processing method, and a laser processing program. Specifically, the laser processing equipment, the laser processing method, and the laser processing program, which can efficiently collect the scattered matter generated during laser processing, improve the productivity, and always obtain a good processing state. It is related.

Generally, an optical film such as a polarizing film (polarizing plate) or a retardation film (phase difference plate) is attached to an optical display panel such as a liquid crystal panel or an organic EL panel. Usually, these optical films are obtained by unwinding a long film from a roll of raw fabric, cutting the unwound film to a width and length corresponding to an optical display panel, and attaching the unwound film to a glass substrate. ing.

On the other hand, in the above method, when the optical film is attached to the vicinity of the peripheral edge of the cut single optical display panel, burrs generated when the optical film is cut may protrude from the glass substrate. In this way, if the optical film is attached in a state of protruding from the optical display panel, it tends to be peeled off from the protruding portion as a base point.

Therefore, for example, Patent Document 1 discloses a manufacturing method for preventing the optical film from peeling off from the optical display panel. That is, the optical film is attached to the optical display panel so that a part of the film protrudes from the optical display panel, and the protruding portion is cut by a laser beam at a position overlapping the optical display panel. Is to remove.

However, in the laser processing method disclosed in Patent Document 1, dusty or dusty scattered matter is generated during cutting processing by a laser processing machine. The scattered material scatters in all directions above the work piece. For example, as the reflectance decreases due to adhesion to the optical mirror that propagates the laser light, the laser output obtained by the processing head decreases and the processing becomes unstable. , The machining accuracy is lowered due to premature wear due to mixing with precision drive system parts such as a ball screw that moves the machining head on the workpiece.

In order to recover such scattered matter, Patent Document 2 discloses a method of sucking by a dust collecting duct. Specifically, a plurality of shields are installed around the laser emitting device at predetermined intervals, and scattered materials in the shield space surrounded by the shields are collected by a dust collecting duct to collect the scattered materials. It is possible to increase efficiency.

Further, as a dust collecting method that does not use a dust collecting duct, Patent Document 3 discloses a dust collecting method using a film material. Specifically, the surface of the workpiece is coated with a coating material that does not easily absorb the laser beam and does not peel off even when irradiated with the laser beam. Then, the surface of the workpiece is irradiated with a laser beam through this film material. At this time, the scattered matter generated by the irradiation of the laser beam will adhere to the coating material, but the scattering matter attached to the coating material should be removed by peeling the coating material from the workpiece after processing with the laser beam. Can be done.

Japanese Unexamined Patent Publication No. 2013-228439 Japanese Unexamined Patent Publication No. 9-271980 Japanese Unexamined Patent Publication No. 2005-313196

However, in the inventions according to Patent Document 2 and Patent Document 3 described above, the following problems occur.

The size of the scattered matter cut by laser processing varies from extremely small size (for example, 3 mm or less in length) to relatively large size (for example, 3 cm or more in length). be. At this time, the extremely small size of the scattered matter cannot be sucked even if it is sucked by the dust collecting duct because the weight is too light, while the large size scattered matter can be sucked by the dust collecting duct. There is a concern that it may cause clogging inside the dust collection duct.

Further, in the invention according to Patent Document 3, since it is necessary to separately prepare a coating material for adsorbing scattered substances, the production cost increases and the coating material is attached and peeled off in the steps before and after the laser processing. Since the process is repeated, there is a concern that the production efficiency will decrease.

The present invention has been devised in view of the above points, and can efficiently recover scattered matter generated during laser processing, improve productivity, and always obtain a good processing state. It relates to a laser processing apparatus, a laser processing method, and a laser processing program capable of producing a laser.

In order to achieve the above object, the laser processing apparatus of the present invention has a processing table on which a plate-shaped workpiece is installed, and an unnecessary region other than an effective region constituting the workpiece along a predetermined contour line. A laser device that irradiates a laser beam that cuts and separates from the work, and a signal that becomes a cutting trajectory in which the unnecessary area forms a small piece having a predetermined surface area when the unnecessary area is cut and separated from the work. It includes a control device for outputting and a dust collecting device for sucking small pieces cut from the work by cutting and separating by the laser device with a predetermined air volume.

Here, by providing a processing table on which a plate-shaped work is installed, the work to be processed can be placed and cut by a laser.

Further, by providing a laser device that irradiates a laser beam that cuts and separates an unnecessary region other than the effective region constituting the workpiece from the workpiece along a predetermined contour line, the workpiece placed on the machining table is provided with the workpiece. It is possible to determine an unnecessary region that does not constitute the above and cut and separate the unnecessary region to form a workpiece.

In addition, by providing a dust collector that sucks the unnecessary area that has become the cut and separated small pieces with a predetermined air volume, the small pieces (scattered matter) generated during laser processing are sucked and the small pieces are scattered around. Can be prevented. This makes it possible to prevent, for example, small pieces from adhering to precision equipment constituting the laser device, and to keep the processing accuracy of the laser constant.

Further, when cutting and separating the unnecessary area from the work, by providing a control device for outputting a signal surface of the unnecessary area is the cutting trajectory forming a small piece of approximately 18 mm ² to 300 mm ² for the laser device, according Based on the signal, the laser can cut the unnecessary area of the work while subdividing it into small pieces having a predetermined surface area. By subdividing the unnecessary region in this way, suction by the dust collector can be efficiently performed.

Here, when the surface area of the unnecessary region to be cut ^{is less than about 18 mm 2} , the small pieces are too subdivided, and even if the dust collector sucks the small pieces, the pieces are hard to scatter while being adsorbed on the work or the like. Therefore, in order to suck all the small pieces by the dust collector, it is inevitably necessary to raise the suction air volume to a predetermined value, which increases the load on the dust collector.

On the other hand, when the surface area of the unnecessary area to be cut ^{is larger than about 300 mm 2} , the surface area of the small pieces becomes large, so that the sucked small pieces stay in the dust collector or the suction pipe connected to the dust collector. , May cause clogging.

Further, when the air volume of the dust collector is 3.5m ³ /min~11.0m ³ / min, for a small piece surface area is cut in the range of 18 mm ² to 300 mm ^2, by effectively dust collector Can be recovered.

Here, when the air volume of the dust collector ^{is less than 3.5 m 3} / min, there is a possibility that small pieces having a small surface area, for example, cannot be sucked because the air volume is weak. When the air volume of the dust collector ^{is larger than 11.0 m 3} / min, the suction air volume is increased or the diameter of the suction pipe connected to the dust collector is increased in order to realize the air volume. This may increase the load on the dust collector.

In order to achieve the above object, the laser processing method of the present invention includes a discrimination step of discriminating unnecessary regions other than the effective region constituting the workpiece based on the contour line information of the workpiece from the plate-shaped workpiece. A cutting step of cutting the work along a cutting trajectory in which the unnecessary region forms a small piece having a predetermined surface area to form an outline of the effective region, and a predetermined small piece of the unnecessary region cut in the cutting step. It is provided with a suction step of sucking with the air volume of.

Here, by providing a discrimination step for discriminating an unnecessary region other than the effective region constituting the workpiece based on the contour line information of the workpiece from the plate-shaped workpiece, the unnecessary region not constituting the workpiece is discriminated. Can be done.

Further, by providing a cutting step of cutting the work along a cutting trajectory in which the unnecessary area forms a small piece having a predetermined surface area to form the contour of the effective area, the unnecessary area of the work is subdivided into small pieces having a predetermined surface area. The work piece can be formed by cutting while forming. By subdividing the unnecessary region in this way, suction by the suction step described later can be efficiently performed.

Further, by providing a suction step of sucking the small pieces cut by the cutting step with a predetermined air volume, it is possible to prevent the small pieces generated during the cutting and separating operation by the laser from being sucked and scattered as scattered matter around. This makes it possible to prevent small pieces from adhering to precision equipment including a laser, for example, and to keep the processing accuracy of the laser constant.

Further, in the cutting step, the first cutting trajectory from the start point at a predetermined position on the edge of the work to the intermediate point at a predetermined position on the contour line, and the end point at a predetermined position on the contour line from the intermediate point. When the process of cutting the work based on the cutting trajectory consisting of the second cutting trajectory along the contour line up to is repeated n times (n is an integer of 2 or more), when cutting and separating the unnecessary region from the work, , Unnecessary areas can be subdivided into uniform sizes.

At this time, the distance between the n-1st start point and the nth start point, and the distance between the n-1st intermediate point and the nth intermediate point are equal, and the n-1th end point and the nth intermediate point are equal. By setting the cutting trajectory so that the intermediate points match, the work can be cut at the shortest distance as the cutting path.

Further, when the first cutting track and the second cutting track in the cutting step are linear, and the angle formed by the first cutting track and the second cutting track is in the range of approximately 110 to 150 degrees. Can suppress the thermal influence of the laser, which is a cutting device, and can improve the finish of the work piece.

That is, when the angle formed by the first cutting orbit and the second cutting orbit is an acute angle, when the laser changes the direction from the first cutting orbit to the second cutting orbit via the intermediate point, The surface of the work rises due to the thermal effect of the laser on the cut cross section near the intermediate point, which causes burrs. Since burrs generated by such processing affect the finished molding of the processed product, it is necessary to manually remove them in a post-process.

In this regard, by setting the angle formed by the first cutting orbit and the second cutting orbit to an obtuse angle, specifically, about 110 to 150 degrees, more preferably 130 degrees as described above, the movement of the laser along the cutting orbit can be caused. It becomes smooth and the generation of burrs at the intermediate point can be suppressed.

In order to achieve the above object, the laser processing program of the present invention includes a discrimination step of discriminating unnecessary regions other than the effective region constituting the workpiece based on the contour line information of the workpiece from the plate-shaped workpiece. The computer is instructed to perform a cutting step of cutting the work along a cutting trajectory in which the unnecessary region forms a small piece having a predetermined surface area to form the contour of the effective region.

The cutting step described above includes a step of determining a predetermined position on the edge of the work as a starting point, a step of determining a predetermined position on the contour line as an intermediate point, and a predetermined position on the contour line different from the intermediate point. Is determined as the end point, the work is cut based on the first cutting trajectory from the start point to the intermediate point, and the work is cut based on the second cutting trajectory along the contour line from the intermediate point to the end point. With the step as one cutting flow, the cutting flow is repeated n times (n is an integer of 2 or more), the distance between the n-1st start point and the nth start point, and the n-1th intermediate point and n. The computer is instructed that the distances between the midpoints of the n-1th times are equal and that the end point of the n-1th time and the midpoint of the nth time match.

Here, a step of determining a predetermined position on the edge of the work as a start point, a step of determining a predetermined position on the contour line as an intermediate point, and a step of determining a predetermined position on a contour line different from the intermediate point as an end point. It is possible to determine the cutting trajectory from the cutting start point to the end point of the laser by having each of the above.

Further, the step of cutting the work based on the first cutting trajectory from the start point to the intermediate point and the step of cutting the work based on the second cutting trajectory from the intermediate point to the end point are defined as one cutting step. By repeating the cutting step, the unnecessary region of the work to be cut and separated can be subdivided into a uniform size.

Further, the distance between the start point of the n-1st time and the start point of the nth time, and the distance between the middle point of the n-1st time and the middle point of the nth time are equal, and the distance between the end point of the n-1th time and the middle point of the nth time is intermediate. When instructing the computer to match the points, the work can be cut at the shortest distance as a cutting path.

The laser processing apparatus, laser processing method, and laser processing program according to the present invention can efficiently collect scattered matter generated during laser processing, improve productivity, and always obtain a good processing state. Can be done.

It is an overall schematic view of the laser processing apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the cutting locus of the work which is cut by the laser processing apparatus which concerns on embodiment of this invention. It is a flow chart of the laser processing method which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings for the purpose of understanding the present invention.

First, the laser processing apparatus 1 according to the embodiment of the present invention will be described with reference to FIG. The laser processing device 1 is mainly composed of a laser oscillation device 2, a pulse generator 3, a control device 4, a condensing device 5, an XY stage 6, and a dust collection device 7.

The laser oscillating device 2 is a device that oscillates a laser beam having a predetermined pulse waveform. A target pulse waveform is set by the control device 4 for the oscillation of the laser beam, and a predetermined pulse waveform and a pulse waveform composed of an output are generated by the pulse generator 3. When the laser oscillator 2 receives a predetermined timing signal transmitted from the pulse generator 3, the laser beam composed of the target pulse waveform is oscillated. The laser oscillator 2 includes an optical resonator (not shown) filled with carbon dioxide gas, and the light in the optical resonator is amplified by stimulated emission in carbon dioxide gas to oscillate the laser beam. ..

From the laser oscillator 2 using this carbon dioxide gas, laser light in the infrared region is oscillated so as to be easily absorbed by an optical film (hereinafter, referred to as “work”) which is a work piece. The laser oscillating device 2 is always in a state of oscillating the laser beam in order to oscillate the laser beam stably.

Here, it is not always necessary to use a carbon dioxide gas laser as the laser oscillator 2. A solid-state laser such as a YAG laser, a YVO laser, or a fiber laser, or any other type of laser may be used, but as described above, when an optical film is assumed as a work, a carbon dioxide gas laser is preferable from the viewpoint of energy absorption.

Further, the number of the laser oscillators 2 is not necessarily limited to one, and a plurality of laser oscillators 2 may be installed.

The condensing device 5 is a device that is installed on the optical axis of the laser light transmitted from the laser oscillating device 2 and guides the laser light to the work on the XY stage 6. The condensing device 5 has a well-known configuration, and is mainly composed of a galvano scanner 51 and an Fθ lens 52.

The laser beam transmitted from the laser oscillating device 2 is reflected by a reflecting mirror (not shown), and its irradiation diameter is adjusted by a beam expander (not shown) to a luminous flux suitable for the mirror of the galvano scanner 51. Further, by adjusting the refractive index of the laser beam with this beam expander, the focal length of the laser beam can be adjusted.

The galvano scanner 51 includes a mirror (not shown), a rotation axis attached to the mirror, and a control device for controlling the rotation axis. The galvano scanner 51 makes it possible to freely deflect the laser beam incident on the mirror in the one-dimensional direction. That is, by combining two galvano scanners 51, it is possible to deflect the laser beam to a predetermined processing point on the processing region occupying a certain region of the XY plane in the two-dimensional direction, that is, on the XY stage 6. ..

The laser beam deflected by the galvano scanner 51 is focused by the Fθ lens 52. The Fθ lens 52 has a well-known structure, has an image height Y proportional to the incident angle θ, and has a relationship of Y = Fθ when the focal length is F. By using this Fθ lens 52, the laser light can be focused so that the focal point of the laser light deflected by the galvano scanner 51 is distributed on a plane.

Here, the condensing device 5 is not necessarily limited to the above configuration. The combination and arrangement of the devices constituting the light collecting device 5 can be changed as appropriate. For example, in the embodiment of the present invention, the XY stage 6 is configured to move in the X-axis direction or the Y-axis direction and is positioned at an arbitrary position, but a part of the condensing device 5 is located on the X-axis. It may be a gantry type that moves in the direction or the Y-axis direction, and instead of the XY stage 6, a continuous sheet-like roll as a work is rewound in one direction while irradiating a laser beam at a fixed point to flow. It may be a roll slitter machine that cuts in a direction.

The dust collector 7 is a device that collects scattered matter generated when a work placed on the XY stage 6 is irradiated with a laser beam, is above the XY stage 6, and is an Fθ lens. A collection box 71 having an open end formed vertically downward in a substantially square shape arranged vertically below 52, a dust collector 72 that generates an air flow by rotating a fan, and one end on each side of the collection box 71. The other end is connected to the dust collector 72, and is mainly composed of a suction pipe 73 that guides scattered matter from the collection box 71 to the dust collector 72.

Here, the collection box 71 does not necessarily have to be a substantially quadrangle in a plan view. The shape of the collection box 71 can be appropriately selected according to the intended use.

Further, the collection box 71 does not necessarily have to be located above the XY stage 6. For example, it may be arranged so as to be located below the XY stage 6.

Further, it is not always necessary that four suction pipes 73 are arranged on each of the four sides of the collection box 71. The number of suction pipes 73 arranged is not particularly limited.

The above is the outline of the laser processing apparatus 1 according to the embodiment of the present invention. Next, the laser processing method using the laser processing apparatus 1 will be described. The laser processing apparatus 1 according to the embodiment of the present invention can handle the molding of workpieces of various shapes for workpieces of various shapes, but for convenience of explanation, it is a display that is generally widely used. A case where a rectangular workpiece, which is one size smaller than the workpiece, is formed from the rectangular workpiece, which is an application, will be described.

FIG. 2 shows a cutting trajectory by laser light when cutting an unnecessary region A1 from a work using the laser processing apparatus 1 according to the embodiment of the present invention to obtain a work piece composed of an effective region A2 which is a final product. It is an overall view schematically shown and an enlarged view of a main part.

As shown in FIG. 2, unlike the conventional method of irradiating the laser beam along the contour line BL of the workpiece, the laser processing apparatus 1 according to the embodiment of the present invention has a predetermined start point on the edge of the work. A linear first cutting track L1 connecting the intermediate point C1 which is a predetermined position on the contour line BL of the workpiece from S1, and a contour from the intermediate point C1 to the end point E1 which is a predetermined position on the contour line BL. The cutting orbit consisting of the second linear cutting orbit L2 along the line BL is defined as one cutting step.

The direction of the first cutting track L1 to the second cutting track L2 is changed to a predetermined angle via the intermediate point C1. At this time, the first cutting track L1 and the second cutting track L2 form. The angle is preferably in the range of approximately 110 degrees to 150 degrees.

Here, the angle formed by the first cutting track L1 and the second cutting track L2 does not necessarily have to be in the range of approximately 110 degrees to 150 degrees. However, when the angle formed by the first cutting track L1 to the second cutting track L2 is within the above range, the machining man-hours are not significantly affected, and the swelling of the work surface generated by laser machining is suppressed. Can be done.

For example, when the angle formed by the first cutting orbit L1 and the second cutting orbit L2 is an acute angle of less than about 90 degrees, the thermal effect of the laser beam near the midpoint becomes excessive, and the laser beam near the midpoint. The swelling that accompanies the irradiation of is likely to occur. Since the swelling becomes burrs and affects the molding of the processed product, it becomes necessary to remove the burrs in the subsequent process.

On the other hand, when the angle formed by the first cutting track L1 and the second cutting track L2 becomes large, the scanning distance of the laser beam becomes long, which causes a problem that the processing man-hours increase. Therefore, according to the results examined by the inventors, when the angle formed by the first cutting track L1 and the second cutting track L2 is in the range of approximately 110 degrees to 150 degrees, the processing man-hours do not increase extremely. It was confirmed that the work was cut without being affected by heat.

Further, the amount of heat input per unit volume of the laser beam in the embodiment of the present invention is set in the range of ^{approximately 1.1 J / mm 3 to} 4.5 J / mm ^3.

Here, the amount of heat input of the laser beam does not necessarily have to be limited to the above range. However, as a result of the examination by the inventors, it was confirmed that when the laser beam is irradiated with the input heat amount in the above range, the sublimated matter is less adhered and the processing quality is good.

When the first cutting step is completed along the cutting track, the process proceeds to the second cutting step. The second cutting step is also cut along the same cutting track as the cutting track related to the first cutting step. Specifically, the position moved along the edge of the work by a predetermined distance with respect to the start point S1 of the first cutting process is set as the start point S2 of the second cutting process, and the first cutting process is performed. The end point E1 is determined from the intermediate point C2 of the cutting trajectory in the second cutting step, and the end point E2 which is a predetermined position on the contour line BL from the intermediate point C2. The distance between the start point S1 and the start point S2 and the distance between the intermediate point C1 and the end point E1 are substantially equal lengths.

After that, as in the first cutting step, the unnecessary region A1 is cut by the laser beam along the cutting trajectory connecting the start point S2, the intermediate point C2, and the end point E2. At this time, in the second cutting step, the small piece P of the unnecessary region A1 is cut off, and a new contour line is formed continuously with the contour line of the workpiece formed in the first cutting step. By sequentially repeating this process n times (n is an integer of 2 or more) until all the contour lines of the workpiece are formed, the unnecessary region A1 that does not constitute the workpiece is cut off as small pieces P of equal size. Is done.

Here, the length of the cutting track for fragmenting the unnecessary region A1 does not necessarily have to be the same in all the cutting steps. For example, it is possible to set the cutting trajectory so that the lengths of the nth cutting trajectory and the n + 1th cutting trajectory are different. However, as will be described later, since the air volume by the dust collector 72 differs depending on the surface area of the scattered material to be fragmented, the cutting track is 1 from the viewpoint of collecting the scattered material at a constant air volume in all cutting steps. It is preferable that the orbits are the same in all the cutting steps from the first time to the nth time.

The irradiation position may be moved along the cutting trajectory of the laser beam by moving the laser oscillating device 2 along the cutting trajectory with the XY stage 6 fixed, or with the laser oscillating device 2 fixed. The XY stage 6 may be moved along the cutting trajectory.

Further, the efficiency of collecting scattered matter is improved by processing in the vicinity of the suction port of the suction pipe 73 connected to the collection box 71. Therefore, the cutting trajectory of the laser beam is set so as to pass in the vicinity of the suction port of the suction pipe 73.

The small pieces P cut and separated from the work are collected as scattered matter in the collection box 71 by the air flow from the dust collector 72, and collected from the suction pipe 73 into the dust collector 72. Table 1 shows the relationship between the size of the subdivided pieces and the air volume of the dust collector 72.

Here, the small piece length in Table 1 represents the length of the first cutting track L1, and the small piece width represents the length of the second cutting track. Further, the required wind speed is the wind speed of the air flow generated from the dust collector 72 required to collect all of the subdivided small pieces P. Since the work is generally a resin film and its thickness is as thin as about 0.01 mm to 0.5 mm, only the surface area is considered as the size of the small piece P.

[Table 1]

As shown in Table 1, as the surface area of the small piece P increases, the required air volume decreases. Therefore, since the load on the fan of the dust collector 72 is small, it is preferable that the surface area of the small piece P is as large as possible from an economical point of view. On the other hand, according to the results examined by the inventors, when the surface area of the small piece P ^{exceeds about 300 mm 2} , when a certain amount of the small piece P is sucked, the small piece P stays in the suction pipe 73 or the dust collector 72. There is a concern that clogging may occur and the suction function may deteriorate. Therefore, in order to stably suck the small pieces for a long period of time, it is preferable that the surface area of the small pieces is subdivided into a size of about ^{18 mm 2} to about 300 mm ^2.

Next, the laser processing method according to the embodiment of the present invention will be described with reference to FIG.

[STEP 1: Identification of area]
First, the control device 4 determines an unnecessary region A1 to be cut and separated from the work to be processed and an effective region A2 to form the workpiece based on the contour shape of the workpiece stored in advance.

Here, for example, a line scan camera may be used to scan the entire work to discriminate between the unnecessary area A1 and the effective area A2.

[STEP2: Determining the surface area to be fragmented]
After determining the unnecessary region A1 in STEP 1, the surface area of the unnecessary region A1 to be fragmented is determined.

[STEP3: Determination of cutting trajectory]
The cutting trajectory for cutting the unnecessary region A1 determined based on the results of STEP1 and STEP2 is determined. The cutting trajectory is automatically calculated based on, for example, the surface area of the small pieces of the unnecessary region A1 determined in STEP2, so that the surface areas of the small pieces are equal. The following is a calculation flow for determining the cutting trajectory.

First, a predetermined position on the edge of the work (in the case of a square work, one of the four corners) is determined as the starting point S.

After determining the start point S, the next predetermined position on the contour line BL of the workpiece (if the contour line BL is square, one point located at the shortest distance from the start point among the four corners) is set. Determined as the midpoint C. The virtual cutting line connecting the starting point S and the intermediate point C becomes the first cutting track L1.

Next, a predetermined position on the contour line BL, which is a position separated from the intermediate point C by a predetermined distance, is determined as the end point E. The virtual cutting line connecting the intermediate point C and the end point E becomes the second cutting track L2. Then, as described above, the first cutting track L1 and the second cutting track L2 are collectively called a cutting track.

After determining the cutting trajectory to be cut in one cutting step with the start point S as the base point, the cutting trajectory of the entire unnecessary region A1 is determined while shifting the cutting trajectory by a predetermined distance along the contour line BL of the workpiece. do.

Here, the cutting trajectory does not necessarily have to be determined based on the above-mentioned calculation flow, and can be changed as appropriate.

[STEP4: Cutting unnecessary areas]
When the cutting trajectory of the entire cutting step in the unnecessary region A1 is determined in STEP 3, the laser oscillator 2 starts cutting along the determined cutting trajectory.

[STEP5: Collection of small pieces]
The small pieces separated by cutting the unnecessary region A1 in STEP 4 are collected in the collection box 71 as scattered matter by the air flow from the dust collector 72, and are collected in the dust collector 72 from the suction pipe 73.

As described above, the laser processing apparatus, the laser processing method, and the laser processing program according to the present invention can efficiently collect the scattered matter generated during the laser processing, improve the productivity, and always maintain a good processing state. It is something that can be obtained.

1 Laser processing device 2 Laser oscillator 3 Pulse generator 4 Control device 5 Condensing device 51 Galvano scanner 52 Fθ lens 6 XY stage 7 Dust collector 71 Collection box 72 Dust collector 73 Suction pipe A1 Unnecessary area A2 Effective area BL contour line L1 1st cutting orbit L2 2nd cutting orbit P small piece

Claims (10)

A processing table for installing plate-shaped workpieces and
A laser device that irradiates a laser beam that cuts and separates unnecessary regions other than the effective region that constitutes the workpiece from the work along a predetermined contour line.
A control device that outputs a signal to the laser device that becomes a cutting trajectory in which the unnecessary region forms a small piece having a predetermined surface area when the unnecessary region is cut and separated from the work.
A laser processing apparatus including a dust collector that sucks small pieces cut from the work by cutting and separation by the laser apparatus with a predetermined air volume. The laser processing apparatus according to claim 1 surface area of the small pieces is approximately 18 mm ² to 300 mm ^2. Air volume of the dust collecting device is a laser machining apparatus according to claim 1 or claim 2 which is 3.5m ³ /min~11.0m ³ / min. Heat input per unit volume of the irradiating laser light by the laser device, any one of claims 1 to 3, which is set in the range of approximately 1.1J ^/ mm ³ ~4.5J ^/ mm 3 The laser processing apparatus according to. A discrimination process for discriminating unnecessary areas other than the effective area constituting the work piece based on the contour line information of the work piece from the plate-shaped work, and
A cutting step of repeatedly cutting the work along a cutting trajectory in which the unnecessary region forms a small piece having a predetermined surface area to form an outline of the effective region.
A laser processing method comprising a suction step of sucking a small piece of the unnecessary region cut in the cutting step with a predetermined air volume. The cutting step is
A first cutting trajectory from a start point at a predetermined position on the edge of the work to an intermediate point at a predetermined position on the contour line, and from the intermediate point to an end point at a predetermined position on the contour line. The step of cutting the work based on the cutting trajectory consisting of the second cutting trajectory along the contour line is repeated n times (n is an integer of 2 or more).
The distance between the n-1st start point and the nth start point, and the distance between the n-1st intermediate point and the nth intermediate point are equal, and the n-1th end point and the nth intermediate point are equal. The laser processing method according to claim 5, which matches. The first cutting track and the second cutting track in the cutting step are linear, respectively.
The laser processing method according to claim 6, wherein the angle formed by the first cutting track and the second cutting track is in the range of approximately 110 to 150 degrees. The suction step is
Laser processing method according to claims 5 to any one of claims 7 to suck the debris generated from the workpiece by air volume of 3.5m ³ /min~11.0m ³ / min. A discrimination step for discriminating unnecessary areas other than the effective area constituting the work piece based on the contour line information of the work piece from the plate-shaped work, and a discrimination step.
A laser processing program that instructs a computer to perform a cutting step of cutting the work along a cutting trajectory in which the unnecessary region forms a small piece having a predetermined surface area to form an outline of the effective region. The cutting step
A step of determining a predetermined position on the edge of the work as a starting point,
A step of determining a predetermined position on the contour line as an intermediate point,
A step of determining a predetermined position on the contour line different from the intermediate point as an end point,
A step of cutting the work based on the first cutting trajectory from the start point to the intermediate point.
The step of cutting the work based on the second cutting trajectory along the contour line from the intermediate point to the end point is defined as one cutting flow, and the cutting flow is performed n times (n is an integer of 2 or more). repetition,
The distance between the n-1st start point and the nth start point, and the distance between the n-1st intermediate point and the nth intermediate point are equal, and the n-1th end point and the nth intermediate point are equal. The matching laser processing program according to claim 9.

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