JP2021126828A - Molded product - Google Patents

Molded product Download PDF

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Publication number
JP2021126828A
JP2021126828A JP2020023085A JP2020023085A JP2021126828A JP 2021126828 A JP2021126828 A JP 2021126828A JP 2020023085 A JP2020023085 A JP 2020023085A JP 2020023085 A JP2020023085 A JP 2020023085A JP 2021126828 A JP2021126828 A JP 2021126828A
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Prior art keywords
molded body
electronic component
coating layer
molded product
molded
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Inventor
忠壮 谷口
Tadatake Taniguchi
忠壮 谷口
潤 佐々木
Jun Sasaki
潤 佐々木
駿 田中
Shun Tanaka
駿 田中
永嗣 川島
Eiji Kawashima
永嗣 川島
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Nissha Co Ltd
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Nissha Co Ltd
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Priority to JP2020023085A priority Critical patent/JP2021126828A/en
Priority to PCT/JP2021/002824 priority patent/WO2021161786A1/en
Publication of JP2021126828A publication Critical patent/JP2021126828A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

To provide a molded product that is easy to recycle.SOLUTION: A molded product is provided with an electronic component and a molded body integrated with the electronic component such as to cover a part of the electronic component, and has a coating layer configured so that the electronic component and the molded body can be separated in an interface between the electronic component and the molded body. Alternatively, the molded product is provided with: a mounting substrate provided with the electronic component and a circuit board electrically connected to the electronic component; and a molded body integrated with the mounting substrate such as to cover a part of the mounting substrate, and has a coating layer configured so that the mounting substrate and the molded body can be separated in an interface between the mounting surface and the molded body.SELECTED DRAWING: Figure 1

Description

本発明は、成形品に関する。 The present invention relates to a molded product.

電子部品と成形体とが一体化された成形品として、たとえば特許文献１に開示された発光パネルがある（図８参照）。発光パネル１００における電子部品は光源１３０であり、発光ダイオード（ＬＥＤ）が一例として開示されている。発光パネル１００は、開口部１１１を有する成形体１１０と、開口部１１１に配置された光源１３０とを備える。開口部１１１と光源１３０との間は、樹脂１２０で埋められている。発光パネル１００の製造方法の一例として、インサート成形法が開示されている。これは、成形体１１０の開口部１１１に光源１３０を保持し、開口部１１１と光源１３０との間に溶融樹脂を射出して成形する方法である。この発光パネルでは、成形体と光源との間にエアギャップがないため、光の損失を軽減し、発光効率を向上させることができる。 As a molded product in which an electronic component and a molded product are integrated, for example, there is a light emitting panel disclosed in Patent Document 1 (see FIG. 8). The electronic component in the light emitting panel 100 is a light source 130, and a light emitting diode (LED) is disclosed as an example. The light emitting panel 100 includes a molded body 110 having an opening 111 and a light source 130 arranged in the opening 111. The space between the opening 111 and the light source 130 is filled with the resin 120. An insert molding method is disclosed as an example of a method for manufacturing the light emitting panel 100. This is a method in which the light source 130 is held in the opening 111 of the molded body 110, and the molten resin is injected between the opening 111 and the light source 130 for molding. In this light emitting panel, since there is no air gap between the molded body and the light source, the loss of light can be reduced and the luminous efficiency can be improved.

特開２００６−０５４１９６号公報Japanese Unexamined Patent Publication No. 2006-054196

しかし、特許文献１に開示されたような従来の成形品は、電子部品と成形体とが固定されているため、電子部品と成形体とを分離しにくいという問題があった。そのため、成形品を廃棄する際は、主に金属でできた電子部品と、主に樹脂からできた成形体とが一体化されたまま廃棄するしかなく、リサイクルが困難であった。 However, in the conventional molded product as disclosed in Patent Document 1, since the electronic component and the molded product are fixed, there is a problem that it is difficult to separate the electronic component and the molded product. Therefore, when disposing of the molded product, there is no choice but to dispose of the electronic component mainly made of metal and the molded body mainly made of resin in an integrated manner, which makes recycling difficult.

本発明は上記のような課題を解決するためになされたものであり、リサイクルが容易な成形品を提供することを目的とする。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a molded product that can be easily recycled.

以下に、課題を解決するための手段として複数の態様を説明する。これら態様は必要に応じて任意に組み合わせることができる。 Hereinafter, a plurality of aspects will be described as means for solving the problem. These aspects can be arbitrarily combined as needed.

本発明の成形品は、
電子部品と、
電子部品の一部を覆うようにして、電子部品と一体化された成形体とを備え、
電子部品と成形体との界面に、電子部品と成形体とを分離可能に構成された被覆層を有する。 The molded article of the present invention
With electronic components
A molded body integrated with the electronic component is provided so as to cover a part of the electronic component.
At the interface between the electronic component and the molded body, a coating layer configured so that the electronic component and the molded body can be separated is provided.

本発明の成形品は、
電子部品と、
電子部品と電気的に接続された回路基板とを備えた実装基板と、
実装基板の一部を覆うようにして、実装基板と一体化された成形体とを備え、
実装基板と成形体との界面に、実装基板と成形体とを分離可能に構成された被覆層を有する。 The molded article of the present invention
With electronic components
A mounting board with electronic components and an electrically connected circuit board,
A molded body integrated with the mounting board is provided so as to cover a part of the mounting board.
At the interface between the mounting substrate and the molded body, a coating layer configured so that the mounting substrate and the molded body can be separated is provided.

被覆層の材料は、電子部品と成形体、または実装基板と成形体とを分離可能な接着力を有していてもよい。
また、被覆層は、成形体との界面に、アンカー効果を生じる形状を有していてもよい。 The material of the coating layer may have an adhesive force capable of separating the electronic component and the molded body, or the mounting substrate and the molded body.
Further, the coating layer may have a shape that causes an anchor effect at the interface with the molded body.

成形体は表面に加飾層を有していてもよい。 The molded product may have a decorative layer on its surface.

本発明の成形品は、電子部品と成形体、または実装基板と成形体とを容易に分離できる。したがって、成形品を容易にリサイクルすることができる。 In the molded product of the present invention, the electronic component and the molded body, or the mounting substrate and the molded body can be easily separated. Therefore, the molded product can be easily recycled.

（ａ）本発明の成形品の一実施形態を示す模式的な斜視図である。（ｂ）（ａ）のＡ−Ａ断面図である。(A) It is a schematic perspective view which shows one Embodiment of the molded article of this invention. (B) is a cross-sectional view taken along the line AA of (a). （ａ）（ｂ）本発明の成形品の、被覆層の形状の一例を示す模式的な断面図である。(A) (b) is a schematic cross-sectional view showing an example of the shape of the coating layer of the molded product of the present invention. （ａ）〜（ｃ）電子部品と成形体との位置関係の一例を示す模式的な断面図である。(A)-(c) is a schematic cross-sectional view showing an example of the positional relationship between an electronic component and a molded body. （ａ）ストライプ状の被覆層が形成された電子部品を示す模式的な斜視図である。（ｂ）ドット状の被覆層が形成された電子部品を示す模式的な斜視図である。（ｃ）（ａ）または（ｂ）のＡ−Ａ断面図である。(A) It is a schematic perspective view which shows the electronic component which formed the striped coating layer. (B) It is a schematic perspective view which shows the electronic component which formed the dot-shaped coating layer. (C) is a cross-sectional view taken along the line AA of (a) or (b). （ａ）本発明の成形品の別の実施形態を示す模式的な斜視図である。（ｂ）（ａ）のＡ−Ａ断面図である。(A) It is a schematic perspective view which shows another embodiment of the molded article of this invention. (B) is a cross-sectional view taken along the line AA of (a). （ａ）〜（ｄ）実装基板と成形体との位置関係の一例を示す模式的な断面図である。(A)-(d) is a schematic cross-sectional view showing an example of the positional relationship between the mounting substrate and the molded body. 本発明の成形品の変形例の１つを示す模式的な断面図である。It is a schematic cross-sectional view which shows one of the modification of the molded article of this invention. 従来の成形品を示す模式的な斜視図である。It is a schematic perspective view which shows the conventional molded article.

以下、図面を参照しながら、実施形態の一例を説明する。 Hereinafter, an example of the embodiment will be described with reference to the drawings.

（第１実施形態）
成形品１は、電子部品２と、電子部品２の一部を覆うようにして、電子部品２と一体化された成形体３とを備え、電子部品２と成形体３との界面に、電子部品２と成形体３とを分離可能に構成された被覆層４を有する（図１（ａ）（ｂ）参照）。 (First Embodiment)
The molded product 1 includes an electronic component 2 and a molded body 3 integrated with the electronic component 2 so as to cover a part of the electronic component 2, and electrons are placed at the interface between the electronic component 2 and the molded body 3. It has a coating layer 4 that is configured so that the component 2 and the molded body 3 can be separated (see FIGS. 1A and 1B).

本実施形態において、成形品１は発光パネルである。発光パネルは、成形体３の裏側に、ＬＥＤパッケージ（電子部品２の一例）が一体化され、ＬＥＤから発せられた光を成形品の表側に反射する反射パターン３１が形成されている。ＬＥＤパッケージは、リードフレームに電気的に接続されたＬＥＤ素子が、砲弾型の樹脂製レンズで覆われた電子部品である。成形体３は、ＬＥＤパッケージの樹脂製レンズを覆うようにして、ＬＥＤパッケージと一体化されている。したがって、リードフレームは成形体３から露出している。ＬＥＤパッケージと成形体との界面には、ＬＥＤパッケージと成形体とを分離可能に構成された被覆層４が形成されている。成形体３の表側には、透光部７１と遮光部７２とを有する、加飾層７が形成されている。成形体３の側面には、ＬＥＤから発せられた光を外部に漏らさないための反射層８が形成されている。 In the present embodiment, the molded product 1 is a light emitting panel. In the light emitting panel, an LED package (an example of an electronic component 2) is integrated on the back side of the molded body 3, and a reflection pattern 31 that reflects the light emitted from the LED on the front side of the molded product is formed. The LED package is an electronic component in which an LED element electrically connected to a lead frame is covered with a bullet-shaped resin lens. The molded body 3 is integrated with the LED package so as to cover the resin lens of the LED package. Therefore, the lead frame is exposed from the molded body 3. At the interface between the LED package and the molded body, a coating layer 4 is formed so that the LED package and the molded body can be separated from each other. A decorative layer 7 having a light-transmitting portion 71 and a light-shielding portion 72 is formed on the front side of the molded body 3. A reflective layer 8 is formed on the side surface of the molded body 3 to prevent the light emitted from the LED from leaking to the outside.

成形体３の材料としては、たとえば、熱可塑性樹脂、熱硬化性樹脂、または光硬化型樹脂などを用いることができる。 As the material of the molded body 3, for example, a thermoplastic resin, a thermosetting resin, a photocurable resin, or the like can be used.

なお、電子部品２としては、たとえば、電子管、半導体素子、集積回路、液晶パネル、抵抗器、コンデンサ、変成器、音響部品、磁気ヘッド、小型モータ、コネクタ、スイッチ、リレー、電源ユニット、高周波ユニット、コントロールユニット、液晶モジュール、各種センサなどを用いることができる。これらは、単体で用いてもよく、２つ以上用いてもよい。 Examples of the electronic component 2 include an electron tube, a semiconductor element, an integrated circuit, a liquid crystal panel, a resistor, a capacitor, a metamorphic device, an acoustic component, a magnetic head, a small motor, a connector, a switch, a relay, a power supply unit, and a high frequency unit. A control unit, a liquid crystal module, various sensors, and the like can be used. These may be used alone or in combination of two or more.

被覆層４は、ＬＥＤパッケージの樹脂製レンズと成形体との界面に形成されている。言い換えると、被覆層４は、ＬＥＤパッケージ（電子部品）を被覆している。より具体的には、被覆層４は、ＬＥＤパッケージの樹脂製レンズを被覆している。被覆層４は、ＬＥＤパッケージと成形体とを分離可能に構成されている。このような被覆層の構成の一例として、次の２つを説明する。１つ目は、被覆層の材料が、ＬＥＤパッケージと成形体とを分離可能な接着力を有している構成である。２つ目は、被覆層の材料がＬＥＤパッケージと成形体とを分離可能な接着力を有するとともに、被覆層がアンカー効果を生じる形状を有している構成である。 The coating layer 4 is formed at the interface between the resin lens of the LED package and the molded product. In other words, the coating layer 4 covers the LED package (electronic component). More specifically, the coating layer 4 covers the resin lens of the LED package. The coating layer 4 is configured so that the LED package and the molded body can be separated from each other. The following two will be described as an example of the configuration of such a coating layer. The first is that the material of the coating layer has an adhesive force capable of separating the LED package and the molded product. The second configuration is such that the material of the coating layer has an adhesive force capable of separating the LED package and the molded body, and the coating layer has a shape that produces an anchor effect.

まず、１つ目の構成について説明する。この構成では、被覆層の材料が、ＬＥＤパッケージと成形体とを分離可能な接着力を有している。被覆層の材料としては、たとえば樹脂を用いることができる。被覆層の材料は、粘着剤であってもよい。また、被覆層とＬＥＤパッケージとの界面、または被覆層と成形体との界面で剥離しやすい性質を持つ樹脂であってもよい。そのような樹脂は、ＬＥＤパッケージの樹脂製レンズに用いる樹脂、および成形体に用いる樹脂に応じて、適宜決めることができる。つまり、被覆層には、樹脂製レンズに用いる樹脂および成形体に用いる樹脂の少なくとも１つと接着しにくい樹脂を用いるとよい。具体的に、被覆層の材料としては、たとえば、熱硬化性樹脂（エポキシ樹脂など）、ＵＶ硬化型樹脂（アクリル系、ウレタン系など）、シリコーン樹脂、またはオレフィン系樹脂といった樹脂を用いることができる。 First, the first configuration will be described. In this configuration, the material of the coating layer has an adhesive force capable of separating the LED package and the molded product. As the material of the coating layer, for example, resin can be used. The material of the coating layer may be an adhesive. Further, the resin may have a property of being easily peeled off at the interface between the coating layer and the LED package or the interface between the coating layer and the molded body. Such a resin can be appropriately determined depending on the resin used for the resin lens of the LED package and the resin used for the molded product. That is, it is preferable to use a resin that is difficult to adhere to at least one of the resin used for the resin lens and the resin used for the molded product as the coating layer. Specifically, as the material of the coating layer, for example, a resin such as a thermosetting resin (epoxy resin or the like), a UV curable resin (acrylic type, urethane type or the like), a silicone resin, or an olefin type resin can be used. ..

次に、２つ目の構成について説明する。この構成では、被覆層の材料がＬＥＤパッケージと成形体とを分離可能な接着力を有しているとともに、被覆層が、成形体との界面に、アンカー効果を生じる形状を有している。アンカー効果を生じる形状としては、たとえば、図２（ａ）のようなアンダーカット形状、および図２（ｂ）のような微細凹凸形状を用いることができる。ここで、アンダーカット形状と微細凹凸形状との違いは、被覆層４の凸部分の形状である。アンダーカット形状は、凸部分に勾配が付いている。言い換えると、凸部分は逆テーパを有している。一方、微細凹凸形状は、このような勾配が付いていない。微細凹凸形状の凸部分の高さはたとえば０．５ｍｍ以上、凸部分のピッチはたとえば５ｍｍ以下とすることができる。これらの形状は、被覆層４の表面（成形体３との界面）に形成される。 Next, the second configuration will be described. In this configuration, the material of the coating layer has an adhesive force capable of separating the LED package and the molded body, and the coating layer has a shape that causes an anchor effect at the interface with the molded body. As the shape that produces the anchor effect, for example, an undercut shape as shown in FIG. 2A and a fine uneven shape as shown in FIG. 2B can be used. Here, the difference between the undercut shape and the fine uneven shape is the shape of the convex portion of the coating layer 4. The undercut shape has a slope on the convex part. In other words, the convex portion has a reverse taper. On the other hand, the fine uneven shape does not have such a gradient. The height of the convex portion of the fine concavo-convex shape can be, for example, 0.5 mm or more, and the pitch of the convex portion can be, for example, 5 mm or less. These shapes are formed on the surface of the coating layer 4 (the interface with the molded body 3).

被覆層４の材料が、ＬＥＤパッケージおよび成形体３の少なくとも１つと被覆層４との界面で剥離しやすい接着力であっても、被覆層４がアンカー効果を生じる形状を有していることによって、ＬＥＤパッケージを成形体３に確実に保持することができる。ＬＥＤパッケージおよび成形体３の少なくとも１つと被覆層４との接着力、およびＬＥＤパッケージと成形体３との間の保持力のバランスは、被覆層４表面の形状を適切に設定することで実現することができる。たとえば、アンダーカット形状の高さ、幅、勾配、およびピッチなどを適切に設定することで、ＬＥＤパッケージと成形体３とを確実に保持するとともに、それらを容易に分離することができる。たとえば、凸部分の高さを０．５ｍｍ以上、凸部分の側面部分に、成形品から引きはがす方向に対して０度またはマイナスの抜き勾配を設けることで、アンカー効果により、ＬＥＤパッケージと成形体３とを確実に保持できる。また、凸部分のピッチをたとえば５ｍｍ以下とすることで、十分な保持力を得つつ、容易に分離することができる。なお、曲面形状部分などの被覆層４が剥がれやすい箇所では、高さやピッチを変更するとよい。 Even if the material of the coating layer 4 has an adhesive force that easily peels off at the interface between at least one of the LED package and the molded body 3 and the coating layer 4, the coating layer 4 has a shape that produces an anchor effect. , The LED package can be reliably held in the molded body 3. The balance between the adhesive force between at least one of the LED package and the molded body 3 and the coating layer 4 and the holding force between the LED package and the molded body 3 is realized by appropriately setting the shape of the surface of the coating layer 4. be able to. For example, by appropriately setting the height, width, gradient, pitch, and the like of the undercut shape, the LED package and the molded body 3 can be reliably held and can be easily separated from each other. For example, the height of the convex portion is 0.5 mm or more, and the side surface portion of the convex portion is provided with a draft of 0 degrees or a minus with respect to the direction of peeling from the molded product. 3 and can be reliably held. Further, by setting the pitch of the convex portion to, for example, 5 mm or less, it is possible to easily separate the convex portions while obtaining a sufficient holding force. The height and pitch may be changed in places where the covering layer 4 is easily peeled off, such as a curved surface-shaped portion.

ＬＥＤパッケージの樹脂製レンズは曲面を有するため、被覆層４もその曲面に沿って形成される。ＬＥＤパッケージと成形体とを分離しようとする場合、ＬＥＤパッケージは、図２の下方（Ｙ軸方向）へ引っ張られる。ここで、被覆層の表面すべてに同じアンダーカット形状が形成されていると、特に樹脂製レンズの側面部分で引っかかりが生じ、ＬＥＤパッケージを分離しにくくなる。そこで、被覆層４の表面のうち、樹脂製レンズの側面部分に対応する領域においては、図２（ａ）のように、ＬＥＤパッケージを抜く方向（Ｙ軸方向）に対して勾配θを付けるとよい。このようにすると、ＬＥＤパッケージを図の下方に引っ張ることにより、ＬＥＤパッケージを成形体３から抜きやすくなる。つまり、電子部品と成形体とを分離しやすくなる。 Since the resin lens of the LED package has a curved surface, the coating layer 4 is also formed along the curved surface. When trying to separate the LED package and the molded body, the LED package is pulled downward (Y-axis direction) in FIG. Here, if the same undercut shape is formed on all the surfaces of the coating layer, the LED package will be difficult to separate due to catching on the side surface portion of the resin lens in particular. Therefore, in the region of the surface of the coating layer 4 corresponding to the side surface portion of the resin lens, as shown in FIG. 2A, a gradient θ is added to the direction in which the LED package is pulled out (Y-axis direction). good. By doing so, the LED package can be easily pulled out from the molded body 3 by pulling the LED package downward in the drawing. That is, it becomes easy to separate the electronic component and the molded body.

第１実施形態の成形品１の製造方法としては、たとえば、ポッティングおよびインサート成形を用いることができる。まず、ポッティングを用いて、ＬＥＤパッケージ（電子部品）の樹脂製レンズを被覆層４の材料で被覆する。ここで、ポッティングは、電子部品２に被覆層４の材料を塗布して塗膜を形成する形態、または、電子部品２に被覆層４の材料を注入して封止する形態を含む。被覆層４の表面にアンダーカット形状を設ける場合は、たとえば、断面がアンダーカット形状の貫通穴が設けられた型を、電子部品２に設置し、貫通穴へ被覆材４の材料を注入して成形するといった方法を用いることができる。また、被覆層４の表面に微細凹凸形状を設ける場合は、たとえば、ナノインプリント、サンドブラスト、または熱エンボス加工などの方法を用いることができる。次に、インサート成形を行う。被覆層４が形成されたＬＥＤパッケージと、加飾層７を有する加飾シートとを、一対の金型の間に配置する。型締めをして、型締めによってできたキャビティ内に成形樹脂を射出する。型開きをして、成形品１を取り出す。これらの工程によって、成形品１を得ることができる。加飾シートは、基体シート上に加飾層が積層されたものであって、成形後に基体シートを剥離して加飾層７が成形体３の表面に転写される転写シートであってもよいし、基体シートを剥離しないものであってもよい。 As a method for producing the molded product 1 of the first embodiment, for example, potting and insert molding can be used. First, the resin lens of the LED package (electronic component) is coated with the material of the coating layer 4 by using potting. Here, the potting includes a form in which the material of the coating layer 4 is applied to the electronic component 2 to form a coating film, or a form in which the material of the coating layer 4 is injected into the electronic component 2 to seal the electronic component 2. When an undercut shape is provided on the surface of the coating layer 4, for example, a mold provided with a through hole having an undercut shape in cross section is installed in the electronic component 2, and the material of the coating material 4 is injected into the through hole. A method such as molding can be used. Further, when the surface of the coating layer 4 is provided with a fine uneven shape, for example, a method such as nanoimprint, sandblasting, or thermal embossing can be used. Next, insert molding is performed. The LED package on which the coating layer 4 is formed and the decorative sheet having the decorative layer 7 are arranged between the pair of molds. The mold is fastened, and the molding resin is injected into the cavity created by the mold tightening. Open the mold and take out the molded product 1. A molded product 1 can be obtained by these steps. The decorative sheet may be a transfer sheet in which a decorative layer is laminated on the base sheet, and the base sheet is peeled off after molding and the decorative layer 7 is transferred to the surface of the molded body 3. However, the substrate sheet may not be peeled off.

（変形例１）
上記の第１実施形態では、電子部品２（ＬＥＤパッケージ）の側面すべてを成形体が覆うようにして一体化されているが、本発明はこれに限定されない。つまり、図３（ａ）のように、成形体３が電子部品２の側面の一部を覆うようにして一体化されてもよい。また、図３（ｂ）のように、成形体３が電子部品２の上面（または下面）および側面のそれぞれ一部を覆うようにして一体化されてもよい。また、図３（ｃ）のように、成形体３が電子部品２の上面（または下面）のみを覆うようにして一体化されてもよい。 (Modification example 1)
In the above-mentioned first embodiment, the electronic component 2 (LED package) is integrated so as to cover all the side surfaces of the electronic component 2 (LED package), but the present invention is not limited to this. That is, as shown in FIG. 3A, the molded body 3 may be integrated so as to cover a part of the side surface of the electronic component 2. Further, as shown in FIG. 3B, the molded body 3 may be integrated so as to cover a part of the upper surface (or lower surface) and the side surface of the electronic component 2. Further, as shown in FIG. 3C, the molded body 3 may be integrated so as to cover only the upper surface (or lower surface) of the electronic component 2.

（変形例２）
上記の第１実施形態では、被覆層４が、電子部品２（ＬＥＤパッケージ）と成形体３との界面の全面に連続して形成されている。言い換えると、電子部品２と成形体３とが直接、接している部分がない。しかし、本発明はこれに限定されず、被覆層４は、電子部品２と成形体３とが直接、接する部分があるように不連続に形成されてもよい。つまり、成形品１は、電子部品２と成形体３とが接着する部分を有する。このとき、被覆層４は、電子部品２と成形体３とを分離可能な接着力を有する材料で形成される。被覆層４は、図４（ａ）のように、ストライプ状で界面に形成されてもよい。また、図４（ｂ）のように、ドット状で界面に形成されてもよい。なお、図４（ａ）および図４（ｂ）では、便宜上、成形体を省いている。隣り合う被覆層どうしの間隔ｄは、被覆層の材料が有する接着力に応じて、適宜設定するとよい。また、電子部品２と成形体３とがオフセットで一体化されている場合や、電子部品２の曲面部分に被覆層４が形成される場合には、間隔ｄを小さくすることで、被覆層４の接合力を大きくするとよい。前者の場合においては、電子部品２と成形体３との接触面積が小さいとき（たとえば、オフセットせずに一体化されている場合の電子部品２と成形体３との接触面積の１／３以下）や、電子部品２の厚さや重量が大きいときに、間隔ｄを小さくすると有効である。 (Modification 2)
In the first embodiment described above, the coating layer 4 is continuously formed on the entire surface of the interface between the electronic component 2 (LED package) and the molded body 3. In other words, there is no portion where the electronic component 2 and the molded body 3 are in direct contact with each other. However, the present invention is not limited to this, and the coating layer 4 may be formed discontinuously so that there is a portion in which the electronic component 2 and the molded body 3 are in direct contact with each other. That is, the molded product 1 has a portion where the electronic component 2 and the molded body 3 are adhered to each other. At this time, the coating layer 4 is formed of a material having an adhesive force capable of separating the electronic component 2 and the molded body 3. The coating layer 4 may be formed in a striped shape at the interface as shown in FIG. 4A. Further, as shown in FIG. 4B, it may be formed in a dot shape at the interface. In addition, in FIG. 4A and FIG. 4B, the molded body is omitted for convenience. The distance d between the adjacent coating layers may be appropriately set according to the adhesive force of the material of the coating layers. Further, when the electronic component 2 and the molded body 3 are integrated at an offset, or when the coating layer 4 is formed on the curved surface portion of the electronic component 2, the coating layer 4 is formed by reducing the interval d. It is advisable to increase the bonding force of. In the former case, when the contact area between the electronic component 2 and the molded body 3 is small (for example, 1/3 or less of the contact area between the electronic component 2 and the molded body 3 when they are integrated without offset). ) And when the thickness and weight of the electronic component 2 are large, it is effective to reduce the interval d.

被覆層４が界面全面に連続して形成されている場合は、電子部品２を成形体３に保持する力は、被覆層４の材料が有する接着力である。一方、変形例２においては、成形体３を構成する樹脂と電子部品２とが接着する面が生じる。したがって、電子部品２に接着しやすい樹脂を成形体３に用いれば、電子部品２と成形体３との間の接着力と、被覆層４の材料が有する接着力の両方によって、電子部品２を成形体３に保持することができる。このとき、被覆層４の接着力は、被覆層４を界面全面に連続して形成した場合と比べて弱くするとよい。一方、電子部品２に接着しにくい樹脂を成形体３に用いれば、被覆層４の材料が有する接着力によって、電子部品２を成形体３に保持することになる。したがって、被覆層４の接着力は、被覆層４を界面全面に連続して形成した場合と比べて強くするとよい。これらの形態の成形品１では、電子部品２を成形体３に保持することができるとともに、電子部品２と成形体３とを容易に分離することができる。 When the coating layer 4 is continuously formed on the entire interface, the force for holding the electronic component 2 on the molded body 3 is the adhesive force possessed by the material of the coating layer 4. On the other hand, in the modified example 2, a surface is formed in which the resin constituting the molded body 3 and the electronic component 2 are adhered to each other. Therefore, if a resin that easily adheres to the electronic component 2 is used for the molded body 3, the electronic component 2 is provided by both the adhesive force between the electronic component 2 and the molded body 3 and the adhesive force of the material of the coating layer 4. It can be held in the molded body 3. At this time, the adhesive strength of the coating layer 4 may be weaker than that in the case where the coating layer 4 is continuously formed on the entire interface. On the other hand, if a resin that is difficult to adhere to the electronic component 2 is used for the molded body 3, the electronic component 2 is held by the molded body 3 due to the adhesive force of the material of the coating layer 4. Therefore, the adhesive strength of the coating layer 4 may be stronger than that in the case where the coating layer 4 is continuously formed on the entire interface. In the molded product 1 of these forms, the electronic component 2 can be held by the molded body 3, and the electronic component 2 and the molded body 3 can be easily separated.

変形例２において、被覆層４の形成には、たとえばディスペンサを用いることができる。 In the second modification, for example, a dispenser can be used to form the coating layer 4.

（第２実施形態）
成形品１は、電子部品２と、電子部品２と電気的に接続された回路基板５とを備えた実装基板６と、実装基板６の一部を覆うようにして、実装基板６と一体化された成形体３とを備え、実装基板６と成形体３との界面に、実装基板６と成形体３とを分離可能に構成された被覆層４を有する（図５（ａ）（ｂ）参照）。 (Second Embodiment)
The molded product 1 is integrated with the mounting board 6 so as to cover a part of the mounting board 6 including the electronic component 2 and the circuit board 5 electrically connected to the electronic component 2. The molded body 3 is provided, and a coating layer 4 is provided at the interface between the mounting substrate 6 and the molded body 3 so that the mounting substrate 6 and the molded body 3 can be separated from each other (FIGS. 5 (a) and 5 (b)). reference).

本実施形態が第１実施形態と異なるのは、成形品１が実装基板６を備えている点である。実装基板６は、電子部品２と、電子部品２と電気的に接続された回路基板５とを備える。回路基板５は、絶縁体基材の上や内部に、導体の配線が施されたものである。プリント基板と言い換えることもできる。回路基板５としては、リジッド基板、フレキシブル基板、またはリジッドフレキシブル基板を用いることができる。リジッド基板は、柔軟性のない絶縁体基材を用いたものである。フレキシブル基板は、ＦＰＣとも呼ばれ、薄く柔軟性のある絶縁体基材を用いたものである。リジッドフレキシブル基板は、硬質な材料と薄く柔軟性のある材料とを複合した絶縁体基材を用いたものである。 This embodiment differs from the first embodiment in that the molded product 1 includes the mounting substrate 6. The mounting board 6 includes an electronic component 2 and a circuit board 5 electrically connected to the electronic component 2. The circuit board 5 is formed by wiring a conductor on or inside an insulator base material. It can also be rephrased as a printed circuit board. As the circuit board 5, a rigid substrate, a flexible substrate, or a rigid flexible substrate can be used. The rigid substrate uses an inflexible insulator base material. A flexible substrate, also called an FPC, uses a thin and flexible insulator base material. A rigid flexible substrate uses an insulator base material that is a composite of a hard material and a thin and flexible material.

成形体３は、実装基板６の一部を覆うようにして、実装基板６と一体化されている（図５（ｂ）参照）。図では、成形体３が実装基板６の上面を覆うようにして一体化されている。実装基板６の側面と下面、つまり、回路基板５の側面と下面は成形体３で覆われていない。言い換えると、実装基板６の一部が露出するようにして、成形体３と実装基板６とが一体化されている。 The molded body 3 is integrated with the mounting substrate 6 so as to cover a part of the mounting substrate 6 (see FIG. 5B). In the figure, the molded body 3 is integrated so as to cover the upper surface of the mounting substrate 6. The side surface and the lower surface of the mounting board 6, that is, the side surface and the lower surface of the circuit board 5 are not covered with the molded body 3. In other words, the molded body 3 and the mounting board 6 are integrated so that a part of the mounting board 6 is exposed.

被覆層４は、実装基板６と成形体３との界面に形成されている。成形体３は、実装基板６の一部を覆うようにして一体化されているため、実装基板６の成形体３で覆われている領域が、実装基板６と成形体３との界面である。 The coating layer 4 is formed at the interface between the mounting substrate 6 and the molded body 3. Since the molded body 3 is integrated so as to cover a part of the mounting substrate 6, the region covered by the molded body 3 of the mounting substrate 6 is the interface between the mounting substrate 6 and the molded body 3. ..

成形品１の他の形態を、図６（ａ）から図６（ｄ）に示す。図６（ａ）は、成形体３が電子部品２のみを覆う形態である。図６（ｄ）は、成形体３が回路基板５のみを覆う形態である。図６（ｂ）および図６（ｃ）は、それぞれ、成形体３が実装基板６の一部を覆う形態である。 Other forms of the molded product 1 are shown in FIGS. 6 (a) to 6 (d). FIG. 6A shows a form in which the molded body 3 covers only the electronic component 2. FIG. 6D shows a form in which the molded body 3 covers only the circuit board 5. 6 (b) and 6 (c), respectively, show a form in which the molded body 3 covers a part of the mounting substrate 6.

第２実施形態の成形品１の製造方法としては、第１実施形態と同様に、ポッティングおよびインサート成形とを用いることができる。まず、ポッティングを用いて、実装基板６を被覆層４の材料で被覆する。ここで、第１実施形態と同様、ポッティングは、実装基板６に被覆層４の材料を塗布して塗膜を形成する形態、または、実装基板６に被覆層４の材料を注入して封止する形態を含む。次に、インサート成形を行う。被覆層４が形成された実装基板６を、一対の金型の間に配置する。型締めをして、型締めによってできたキャビティ内に成形樹脂を射出する。型開きをして、成形品１を取り出す。これらの工程によって、成形品１を得ることができる。なお、必要に応じて、加飾層７を有する加飾シートを、一対の金型の間に配置してもよい。加飾シートは、基体シート上に加飾層が積層されたものであって、成形後に基体シートを剥離して加飾層７が成形体３の表面に転写される転写シートであってもよいし、基体シートを剥離しないものであってもよい。 As a method for producing the molded product 1 of the second embodiment, potting and insert molding can be used as in the first embodiment. First, the mounting substrate 6 is coated with the material of the coating layer 4 by using potting. Here, as in the first embodiment, the potting is a form in which the material of the coating layer 4 is applied to the mounting substrate 6 to form a coating film, or the material of the coating layer 4 is injected into the mounting substrate 6 and sealed. Including the form to be used. Next, insert molding is performed. The mounting substrate 6 on which the coating layer 4 is formed is arranged between the pair of molds. The mold is fastened, and the molding resin is injected into the cavity created by the mold tightening. Open the mold and take out the molded product 1. A molded product 1 can be obtained by these steps. If necessary, a decorative sheet having the decorative layer 7 may be arranged between the pair of molds. The decorative sheet may be a transfer sheet in which a decorative layer is laminated on the base sheet, and the base sheet is peeled off after molding and the decorative layer 7 is transferred to the surface of the molded body 3. However, the substrate sheet may not be peeled off.

（変形例３）
上記の実施形態２では、被覆層４が、実装基板６と成形体３との界面の全面に連続して形成されている。しかし、本発明はこれに限定されない。たとえば、成形体３と電子部品２との界面では被覆層４が全面に連続して形成されているが、成形体３と回路基板５との界面の被覆層４は不連続に形成されてもよい（図７参照）。不連続な被覆層４の例としては、ストライプ状（図４（ａ）参照）およびドット状（図４（ｂ）参照）、またはストライプ状とドット状とが混在した形態を用いることができる。 (Modification example 3)
In the second embodiment, the coating layer 4 is continuously formed on the entire surface of the interface between the mounting substrate 6 and the molded body 3. However, the present invention is not limited to this. For example, the coating layer 4 is continuously formed on the entire surface at the interface between the molded body 3 and the electronic component 2, but the coating layer 4 at the interface between the molded body 3 and the circuit board 5 is formed discontinuously. Good (see Figure 7). As an example of the discontinuous coating layer 4, a striped shape (see FIG. 4A) and a dot shape (see FIG. 4B), or a mixed form of the striped shape and the dot shape can be used.

１ ：成形品
２ ：電子部品
３ ：成形体
３１ ：反射パターン
４ ：被覆層
５ ：回路基板
６ ：実装基板
７ ：加飾層
７１ ：透光部
７２ ：遮光部
８ ：反射層
１００：発光パネル
１１０：成形体
１１１：開口部
１２０：樹脂
１３０：光源 1: Molded product 2: Electronic component 3: Molded body 31: Reflective pattern 4: Coating layer 5: Circuit board 6: Mounting board 7: Decorative layer 71: Translucent part 72: Light-shielding part 8: Reflective layer 100: Light emitting panel 110: Molded body 111: Opening 120: Resin 130: Light source

Claims (5)

電子部品と、
前記電子部品の一部を覆うようにして、前記電子部品と一体化された成形体とを備え、
前記電子部品と前記成形体との界面に、前記電子部品と前記成形体とを分離可能に構成された被覆層を有する、成形品。 With electronic components
A molded body integrated with the electronic component is provided so as to cover a part of the electronic component.
A molded product having a coating layer formed at an interface between the electronic component and the molded body so that the electronic component and the molded body can be separated. 電子部品と、
前記電子部品と電気的に接続された回路基板とを備えた実装基板と、
前記実装基板の一部を覆うようにして、前記実装基板と一体化された成形体とを備え、
前記実装基板と前記成形体との界面に、前記実装基板と前記成形体とを分離可能に構成された被覆層を有する、成形品。 With electronic components
A mounting board including the electronic component and a circuit board electrically connected to the electronic component,
A molded body integrated with the mounting substrate is provided so as to cover a part of the mounting substrate.
A molded product having a coating layer formed at an interface between the mounting substrate and the molded body so that the mounting substrate and the molded body can be separated from each other. 前記被覆層の材料は、前記電子部品と前記成形体、または前記実装基板と前記成形体とを分離可能な接着力を有する、請求項１または２に記載の成形品。 The molded product according to claim 1 or 2, wherein the material of the coating layer has an adhesive force capable of separating the electronic component and the molded body, or the mounting substrate and the molded body. 前記被覆層は、前記成形体との界面に、アンカー効果を生じる形状を有している、請求項３に記載の成形品。 The molded product according to claim 3, wherein the coating layer has a shape that causes an anchor effect at an interface with the molded product. 前記成形体は表面に加飾層を有する、請求項１から４のいずれかに記載の成形品。 The molded product according to any one of claims 1 to 4, wherein the molded product has a decorative layer on its surface.
JP2020023085A 2020-02-14 2020-02-14 Molded product Pending JP2021126828A (en)

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PCT/JP2021/002824 WO2021161786A1 (en) 2020-02-14 2021-01-27 Molded product

Applications Claiming Priority (1)

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WO (1) WO2021161786A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10119169A (en) * 1996-08-31 1998-05-12 Ricoh Co Ltd Recyclable object and sheetlike member for constituting the object
WO2004092292A1 (en) * 2003-04-14 2004-10-28 Sekisui Chemical Co., Ltd. Method for releasing adhered article

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10119169A (en) * 1996-08-31 1998-05-12 Ricoh Co Ltd Recyclable object and sheetlike member for constituting the object
WO2004092292A1 (en) * 2003-04-14 2004-10-28 Sekisui Chemical Co., Ltd. Method for releasing adhered article

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