JP2021117158A - Three-dimensional shape measuring device, three-dimensional shape measuring method, and program - Google Patents

Abstract

To provide a technique, in three-dimensional shape measurement employing a color highlight system, to accurately determine the direction of an inclination included in an object to be measured.SOLUTION: A three-dimensional shape measuring device has illumination means, photographing means, and measuring means. The photographing means acquires a plurality of images different in angle around the vertical axis with respect to the object to be measured in a photographing direction of the photographing means or an illumination direction of illumination light, the plurality of images different in mode of reflection including any one of the intensity or the wavelength of the illumination light at a predetermined part of the object to be measured. The measuring means measures the three-dimensional shape of the predetermined part based on the plurality of images acquired by the photographing means.SELECTED DRAWING: Figure 1

Description

The present invention relates to a three-dimensional shape measuring device, a three-dimensional shape measuring method and a program.

Conventionally, in the technical field of inspecting the solder joint state of parts mounted on a printed circuit board, a method of measuring a three-dimensional shape by a so-called color highlighting method has been known. The color highlight method irradiates the substrate with light of multiple colors (wavelengths) at different incident angles, and the color characteristics of the solder surface according to its normal direction (a light source in the normal reflection direction when viewed from the camera). This is a method of capturing the three-dimensional shape of the solder surface as two-dimensional hue information by performing imaging with the color) appearing.

For example, Patent Document 1 discloses a substrate inspection apparatus that combines three-dimensional shape measurement of a mirrored object by the color highlighting method and three-dimensional shape measurement of a diffused object by a so-called phase shift method. The phase shift method is one of the methods for restoring the three-dimensional shape of the object surface by analyzing the distortion of the pattern when the pattern light is projected onto the object surface.

Japanese Unexamined Patent Publication No. 2016-11857

By the way, in the measurement of the three-dimensional shape by the above color highlighting method, it is possible to measure the inclination of the surface of the measurement target with a certain degree of accuracy as two-dimensional hue information. There is a problem that the "direction" cannot be determined in two dimensions. That is, in the inspection of the printed circuit board, the inclination of the solder surface is either piled up with respect to the electrode (so-called wet state) or low with respect to the electrode (so-called non-wetting state). It is difficult to accurately determine whether or not the solder is from the two-dimensional hue information.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a technique for accurately discriminating the direction of inclination included in a measurement target in three-dimensional shape measurement.

In order to achieve the above object, the present invention adopts the following configuration.

The three-dimensional shape measuring device according to the present invention includes an illumination means for irradiating a measurement target with illumination light, a photographing means for photographing the measurement object, and the illumination light obtained from an image photographed by the photographing means. In a three-dimensional shape measuring device having a measuring means for measuring the three-dimensional shape of the measurement target based on a difference in the wavelength of the reflected light, the photographing means is the photographing direction of the photographing means or the irradiation of the illumination light. A plurality of images having different directions and angles around the vertical axis with respect to the measurement target, and different modes of reflection including either the intensity or the wavelength of the reflected light at a predetermined portion of the measurement target. An image is acquired, and the measuring means measures the three-dimensional shape of the predetermined portion based on the plurality of images acquired by the photographing means.

The term "measurement" here includes measurement by calculation (the same applies hereinafter). also,
The "illumination means" here includes a wide range of light sources capable of irradiating light that illuminates the measurement target, regardless of the original use of the means. With such a configuration, it is possible to measure the three-dimensional shape of the measurement target with higher accuracy than measuring the three-dimensional shape of the measurement target from a single image.

Further, the predetermined portion is a portion including an inclination in the measurement target, and the measurement means has a predetermined feature amount in each pixel constituting a plurality of images having different modes of reflection of the reflected light. The direction of inclination of the predetermined portion may be measured based on the difference between the respective images.

The term "slope" here means not only the slope defined by a straight line with respect to the horizontal plane but also the slope in a broad sense defined by a curve. Further, the slope including the slope is also understood to include a slope in a broad sense including not only a flat surface but also a curved surface. Hereinafter, the same meaning will be used in the present specification.

With such a configuration, it is possible to measure the direction of the inclination included in the measurement target, so that the three-dimensional shape of the inclined portion can be measured with high accuracy. As the predetermined feature amount, the brightness of each pixel and the like can be exemplified.

Further, the photographing means takes a picture of the measurement target from a plurality of different positions on one circumference centered on the measurement target, so that the angle of the vertical axis in the shooting direction with respect to the measurement target is different. It may acquire a plurality of images. With such a configuration, the reflected light is reflected at a predetermined portion of the measurement target in a state where the lighting means surrounds the measurement target and the entire measurement target is irradiated with the illumination light. It is possible to acquire a plurality of images having different aspects.

Further, if a plurality of photographing means are provided on the circumference and the measurement target irradiated with the illumination light is simultaneously photographed from a plurality of directions, the time for acquiring the plurality of images can be shortened. Can be done.

Further, the illuminating means irradiates the measuring object with the illuminating light from a plurality of different positions on one circumference centered on the measuring object, so that the photographing means can obtain the illuminating light. A plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction may be acquired. According to such a configuration, it is possible to acquire a plurality of images having different modes of reflection of the reflected light at a predetermined portion of the measurement target even if only one photographing means is provided directly above the measurement target. Therefore, the configuration related to the photographing means can be simplified.

Further, the lighting means is arranged so as to be movable in the circumferential direction centered on the measurement target, and illuminates the measurement target from a plurality of different positions on one circumference centered on the measurement target. By irradiating the light, the photographing means may acquire a plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction of the illumination light.

According to such a configuration, the measurement target can be irradiated with the illumination light from a desired position on the circumference, and the three-dimensional shape can be measured regardless of the orientation and shape of the predetermined portion of the measurement target. It is possible to irradiate the illumination light from the optimum direction.

Further, the lighting means is arranged in an annular shape around the measurement target, and is configured so that the emission intensity of the illumination light can be adjusted for each of a plurality of ranges formed by dividing the ring into a plurality of areas. The photographing means irradiates the measurement target with an image when the measurement target is irradiated with the illumination light from at least one of the plurality of ranges, and irradiates the measurement target with the illumination light from the other ranges. A plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction of the illumination light may be acquired by acquiring the images at the time of acquisition.

It should be noted that the "emission intensity" here includes the fact that the intensity is 0, that is, that it does not emit light, and the adjustment of the emission intensity also includes ON / OFF of light emission. With such a configuration, the lighting means may be arranged so as to cover the periphery of the measurement target to divide the area, so that the device configuration can be simplified as compared with arranging the lighting means so as to be movable. can.

Further, the three-dimensional shape device further has a projection means for projecting a predetermined pattern light onto the measurement target, and the photographing means projects the pattern of the measurement target on which the pattern light is projected. The image is further acquired, and the measuring means obtains a three-dimensional shape of the predetermined portion based on a plurality of images in which the mode of reflection of the reflected light at the predetermined portion of the measurement target is different and the pattern projection image. It may be the one to be measured.

With such a configuration, even when a structure other than the mirror surface structure exists in the predetermined portion, the three-dimensional shape of the structure can be measured by the phase shift method. Further, the accuracy of the measurement can be improved by combining with the measurement of the three-dimensional shape based on the plurality of images.

Further, the illuminating means irradiates the measurement target with illumination light having a different wavelength from a plurality of different angles between the vertical direction and the horizontal direction, and the measuring means is at least one acquired by the photographing means. The degree of inclination of the predetermined portion may be measured from the mode of reflection of the reflected light of the illumination light having different wavelengths in the image. With such a configuration, the degree of inclination at the predetermined portion can be measured by the so-called color highlighting method. Therefore, the degree of inclination (including the presence or absence) and the direction of inclination can be measured to obtain accuracy. High 3D measurement can be performed.

Further, the three-dimensional shape measuring device further includes an image display means for displaying a composite image created from the plurality of images acquired by the photographing means, and the composite image is the said at least in the predetermined portion. The image may be an image processed to display and separate the difference in the inclination direction according to different colors and / or patterns. In addition, the composite image may be an image that has undergone image processing to display and separate the difference in the degree and direction of the inclination in the predetermined portion according to different colors and / or patterns.

Conventionally, for example, in a three-dimensional shape measuring device using a color highlighting method, a technique for displaying the reflection mode of the illumination light as an image has been known, and the user can change the degree of inclination of the measurement target by this. , It is possible to visually recognize. However, even with this technology, the direction of inclination of the measurement target could not be identified. Therefore, for example, when teaching a measuring device or setting an inspection standard based on the image, it is safer (that is, stricter). ) Parameters were set.

On the other hand, according to the configuration of the three-dimensional shape measuring device having the image display means as described above, the user can visually identify the direction of inclination in the measurement target by referring to the image. That is, it becomes possible to identify a portion having an inclination by more elements, and it is possible to set a parameter for each of the identified elements. This also makes it possible to adjust the settings of the three-dimensional shape measuring device (for example, inspection standards) with higher accuracy.

In addition, the composite image is synthesized by comparing the values of predetermined feature amounts of pixels indicating the same location of the measurement target in each image that is the source of synthesis, and selecting the pixels from the image having the largest value. It may be the one that has been done.

Further, in the three-dimensional shape measuring method according to the present invention, the irradiation step of irradiating the measurement target with illumination light and the angle of the irradiation direction or imaging direction of the illumination light around the vertical axis with respect to the measurement target are set. A photographing step of acquiring a plurality of different images having different modes of reflection including either the intensity or the wavelength of the reflected light of the illumination light at a predetermined portion to be measured, and the photographing step. It has a measurement step of measuring the three-dimensional shape of the predetermined portion based on the plurality of images acquired in the above.

Further, the predetermined portion is a portion including an inclination in the measurement target, and in the measurement step, a predetermined feature amount in each pixel constituting a plurality of images having different modes of reflection of the reflected light. The direction of inclination of the predetermined portion may be measured based on the difference between the two.

Further, in the irradiation step, by irradiating the measurement target with the illumination light from a plurality of different positions on one circumference centered on the measurement target, the reflected light is transmitted in the photographing step. A plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction may be acquired.

Further, in the photographing step, by photographing the measurement target from a plurality of different positions on one circumference centered on the measurement target, a plurality of angles around the vertical axis in the shooting direction with respect to the measurement target are different. You may try to acquire the image of.

Further, the measurement method further includes a projection step of projecting a predetermined pattern light onto the measurement target, and in the shooting step, the pattern projection image of the measurement target on which the pattern light is projected is displayed. Further acquired, in the measurement step, the three-dimensional shape of the predetermined portion is measured based on a plurality of images in which the mode of reflection of the reflected light at the predetermined portion of the measurement target is different and the pattern projection image. You may do so.

Further, in the illumination step, illumination light having a different wavelength is irradiated to the measurement target from a plurality of different angles between the vertical direction and the horizontal direction, and in the measurement step, at least one acquired in the photographing step is applied. The degree of inclination of the predetermined portion may be measured from the mode of reflection of the reflected light of the illumination light having different wavelengths in the image.

It further includes a composite image display step of displaying a composite image created by synthesizing the plurality of images acquired in the shooting step, and the composite image is in the direction of the inclination at least in the predetermined portion. The image may be an image that has undergone image processing to display and separate the differences according to different colors and / or patterns. In addition, the composite image may be an image that has undergone image processing to display and separate the difference in the degree and direction of the inclination in the predetermined portion according to different colors and / or patterns. In addition, the composite image is synthesized by comparing the values of predetermined feature amounts of pixels indicating the same location of the measurement target in each image that is the source of synthesis, and selecting the pixels from the image having the largest value. It may be the one that has been done.

Further, the present invention can be regarded as a program for causing the three-dimensional shape measuring device to execute the above method, and as a computer-readable recording medium in which such a program is recorded non-temporarily.

Further, each of the above configurations and treatments can be combined with each other to construct the present invention as long as no technical contradiction occurs.

According to the present invention, it is possible to provide a technique for accurately discriminating the direction of inclination included in a measurement target in three-dimensional shape measurement.

FIG. 1 is a schematic view showing a configuration of a three-dimensional shape measuring device according to an application example of the present invention. FIG. 2 is a flowchart showing a flow of three-dimensional shape measurement processing of the three-dimensional shape measuring device according to the application example of the present invention. FIG. 3 is a schematic view showing a hardware configuration of the substrate inspection apparatus according to the first embodiment. FIG. 4 is a block diagram illustrating a function of the information processing apparatus according to the first embodiment. FIG. 5 is a plan view illustrating the configuration of the lighting device according to the first embodiment. FIG. 6A is a side view for explaining the soldered portion of the substrate to be measured. FIG. 6B is a first color highlight image of the soldered portion of the substrate. FIG. 6C is a second color highlight image of the soldered portion of the substrate. FIG. 6D is a third color highlight image of the soldered portion of the substrate. FIG. 6E is a color highlight composite image of the soldered portion of the substrate. FIG. 7 is a flowchart showing the flow of the substrate inspection process of the substrate inspection apparatus according to the first embodiment. FIG. 8 is a schematic diagram showing a schematic configuration of an inspection unit according to a modified example of the first embodiment. FIG. 9 is a schematic view showing a hardware configuration of the substrate inspection apparatus according to the second embodiment. FIG. 10 is a flowchart showing the flow of the substrate inspection process of the substrate inspection apparatus according to the second embodiment.

Hereinafter, examples of the present invention will be described with reference to the drawings.

<Application example>
(Configuration of application example)
The present invention can be applied to, for example, a three-dimensional shape measuring device as shown in FIG. FIG. 1 is a schematic schematic diagram of a schematic configuration of a three-dimensional shape measuring device 9 according to this application example. The three-dimensional shape measuring device 9 is a device for measuring the three-dimensional shape of the measurement target O, and as shown in FIG. 1, the main configuration is a lighting device 91 as a lighting means, a camera 92 as a photographing means, and a measuring means. It has an information processing device 93 (for example, a computer).

The lighting device 91 is configured to be capable of irradiating a measurement target with light of a plurality of different wavelengths, and in this application example, includes three different light sources of a red light source 911R, a green light source 911G, and a blue light source 911B. .. The red light source 911R, the green light source 911G, and the blue light source 911B are arranged at different heights (in the Z-axis direction in the drawing), so that the incident angles of light with respect to the measurement target O are different from each other. In the following, the light from each light source emitted from the lighting device 91 is collectively referred to as RGB illumination light. The lighting device 91 is configured to irradiate the measurement target O with RGB illumination light from different positions around the Z axis in the drawing.

The camera 92 is a photographing means that photographs the measurement target O in a state of being irradiated with RGB illumination light and outputs a digital image. In the following, the image taken by the photographing means is also referred to as an observation image. The camera 92 includes, for example, an optical system and an image sensor.

The information processing device 93 has functions such as control of a lighting device 91, a camera 92 and a transport mechanism, processing of an image captured from the camera 92, and three-dimensional shape measurement, and corresponds to the measuring means in the present invention. The information processing device 93 includes a CPU (Central Processing Unit) and R.
Consists of a computer equipped with an AM (Random Access Memory), a non-volatile storage device (eg, hard disk drive, flash memory, etc.), an input device (eg, keyboard, mouse, touch panel, etc.), and a display device (eg, liquid crystal display, etc.) can do.

The configuration of the lighting device 91 and the camera 92 can be freely arranged as long as the camera 92 can capture a plurality of images in which the reflection mode of the RGB illumination light at the inclined portion OP in the measurement target O is different. Can be configured. For example, the camera 92 is arranged directly above the measurement target O, the lighting device 91 is arranged in an annular shape around the Z axis in the figure centered on the measurement target O, and then divided into a plurality of regions, and each light source is divided into a plurality of regions. The ON / OFF of the light emission may be adjustable.

In this way, when the RGB illumination light is emitted from one region, the measurement target O is photographed by the camera 92 with the light emission of the light source in the other region turned off (or the emission intensity is weakened), and the light is emitted. If the area to be measured is switched and further photographing is performed, it is possible to acquire a plurality of images having different modes of reflection of the RGB illumination light at the portion OP having an inclination in the measurement target O.

Further, instead of making the lighting device 91 annular, it is also possible to provide a moving mechanism so that the lighting device 91 can move in the circumferential direction around the Z axis in the drawing. At this time, by moving the lighting device 91 to a desired position, irradiating the measurement target O with RGB illumination light, and taking a picture with the camera 92 at each position, the measurement target O has an inclined portion OP. It is possible to take a plurality of images having different modes of reflection of the RGB illumination light.

Further, the camera 92 is not arranged directly above the measurement target O, but is arranged with an inclination toward the center of the measurement target O, and a movement mechanism is provided so that the camera 92 can move in the circumferential direction around the Z axis in the drawing. You can also do it. Further, a plurality of cameras 92 may be arranged at different positions in the circumferential direction around the Z axis in the drawing without providing the moving mechanism.

When the three-dimensional shape measuring device 9 having the above configuration measures the three-dimensional shape of the measurement target O, the camera 92 captures an image of the measurement target O in a state of being irradiated with RGB illumination light from the lighting device 91. The three-dimensional shape of the measurement target O is measured by the information processing apparatus 93 processing the captured images by a method such as a color highlighting method.

(Function of control device)
Subsequently, the functions related to the three-dimensional shape measurement of the information processing apparatus 93 will be described. The information processing device 93 has an image acquisition unit 931, a feature amount extraction unit 932, a feature amount comparison unit 933, a composite data creation unit 934, and a three-dimensional shape measurement unit 935 as functional modules related to three-dimensional shape measurement. There is.

The image acquisition unit 931 is a function of capturing a plurality of observation images used for three-dimensional shape measurement from the camera 92. For example, the direction of the RGB illumination light applied to the measurement target O is on the circumference around the measurement target O. Two images with different aspects by 180 degrees are acquired. In this application example, one observed image is referred to as an observed image a, and the other image is referred to as an observed image b.

The feature amount extraction unit 932 extracts the feature amount (for example, the brightness value) possessed by each pixel of the observed image from each acquired observation image. In this application example, the feature amount data extracted from the observation image a will be described as the feature amount data a, and the feature amount data extracted from the observation image b will be described as the feature amount data b.

The feature amount comparison unit 933 compares the feature amount data a extracted by the feature amount extraction unit 932 with the feature amount data b. More specifically, in each observation image, the value of the feature amount of the pixels representing the same location of the measurement target O is compared, and the pixel with the larger value is either the observation image a or the observation image b. Identify if it is a pixel. Here, when the feature amount is luminance, a brighter image, that is, an image in which more light enters the camera 92 is specified. Then, when there is a portion having an inclination in the measurement target O, the pixels of the image when the RGB illumination light is irradiated from the direction facing the inclination become brighter, so that the direction of the inclination is from here. Can be identified.

The composite data creation unit 934 creates composite data for three-dimensional shape measurement from the observation image a and the observation image b. Specifically, from the observed image a and the observed image b, the pixels having the larger feature amount value specified by the feature amount comparison unit 933 are combined with the information on which image the pixel is, and synthesized. Then, create the profile data of the three-dimensional shape. As a result, it is possible to obtain profile data for three-dimensional shape measurement in which the orientation of the inclined portion of the measurement target O is specified.

The three-dimensional shape measurement unit 935 measures the three-dimensional shape of the measurement target O based on the composite data created by the composite data creation unit 934.

(Flow of 3D shape measurement processing)
Next, the procedure of three-dimensional shape measurement in this application example will be described with reference to FIG. First, the information processing device 93 controls the lighting device 91 and irradiates the measurement target O with RGB illumination light from the first direction on the circumference centered on the measurement target O (step S901). Next, the information processing device 93 controls the camera 92 to take a picture of the measurement target O in a state where the RGB illumination light is irradiated from the first direction, and acquires the first image (step S902).

Next, the information processing device 93 controls the lighting device 91, and irradiates the measurement target O with RGB illumination light from the first direction and the second direction facing the measurement target O with the measurement target O in between (step S903). ). Next, the information processing device 93 controls the camera 92 to take a picture of the measurement target O in a state where the RGB illumination light is irradiated from the second direction, and acquires a second image (step S904).

Next, the information processing apparatus 93 extracts the feature amount possessed by the pixels of each image from the acquired first image and the second image (step S905), compares the extracted feature amount, and makes a larger feature amount. Synthetic data for three-dimensional shape measurement is created using the pixels having (S906). Then, based on the created composite data, the three-dimensional shape of the measurement target O is measured (step S907), and a series of processes is completed. The measurement result may be displayed on a display device (not shown).

With the configuration of the three-dimensional shape measuring device 9 according to the present application example as described above, when there is a portion OP having an inclination in the measurement target O, in addition to the degree of the inclination, the three-dimensional shape in which the direction of the inclination is specified. Based on the shape profile data, it becomes possible to measure a three-dimensional shape with high accuracy.

<Embodiment 1>
Next, the substrate inspection apparatus 1 which is another example of the embodiment for carrying out the present invention will be described. However, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention to those.

(Hardware configuration of board inspection equipment)
The overall configuration of the substrate inspection apparatus according to the embodiment of the present invention will be described with reference to FIG. FIG. 3 is a schematic view showing the hardware configuration of the substrate inspection device. This substrate inspection device 1 is used for substrate appearance inspection (for example, inspection of solder joint state after reflow) in a surface mounting line.

The substrate inspection device 1 mainly includes a stage 10, a measurement unit 11, a control device 12, an information processing device 13, and a display device 14. The measurement unit 11 includes a camera 110, a lighting device 111, and a pattern projection device (projector) 112.

The stage 10 is a mechanism for holding the substrate K and aligning the component KB and the solder KH to be inspected at the measurement position of the camera 110. As shown in FIG. 3, when the X-axis and the Y-axis are taken parallel to the stage 10 and the Z-axis is taken perpendicular to the stage 10, the stage 10 can translate at least two axes in the X direction and the Y direction. The camera 110 is arranged so that the optical axis is parallel to the Z axis, and images the substrate K on the stage 10 from vertically above. The image data captured by the camera 110 is taken into the information processing device 13.

The illumination device 111 (111R, 111G, 111B) is an illumination means for irradiating the substrate K with illumination light of a different color (wavelength). FIG. 3 schematically shows an XZ cross section of the illuminating device 111. In reality, the illuminating device 111 is annular so that light of the same color can be illuminated from all directions (all directions around the Z axis). Or it has a dome shape. The projector 112 is a pattern projection means that projects pattern light having a predetermined pattern onto the substrate K. The projector 112 projects pattern light through an opening provided in the middle of the lighting device 111. The number of projectors 112 may be one, but a plurality of projectors 112 may be provided. In this embodiment, two projectors 112 are arranged in different directions (diagonal positions). Both the lighting device 111 and the projector 112 are lighting systems used when the substrate K is photographed by the camera 110, but the lighting device 111 is used for the purpose of measuring the surface shape of a mirror object such as solder, and the projector 112 is It is used for the purpose of measuring the surface shape of diffused objects such as parts.

The control device 12 is a control means for controlling the operation of the substrate inspection device 1, such as movement control of the stage 10, lighting and dimming control of the lighting device 111, lighting control and pattern change of the projector 112, and imaging control of the camera 110. Is responsible for.

The information processing device 13 is a device having a function of acquiring various measured values related to the component KB and the solder KH and inspecting the state of the solder joint of the component KB by using the image data captured from the camera 110. The display device 14 is a device that displays the measured values and inspection results obtained by the information processing device 13. The information processing device 13 can be composed of, for example, a general-purpose computer having a CPU, RAM, a non-volatile storage device, and an input device. Although the control device 12, the information processing device 13, and the display device 14 are shown in separate blocks in FIG. 3, they may be configured by separate devices or may be configured by a single device. good.

(Functional configuration)
FIG. 4 is a block diagram showing a configuration of a functional module related to inspection processing provided by the information processing apparatus 13. These functional modules are realized by the CPU of the information processing device 13 reading and executing a program stored in the auxiliary storage device. However, all or part of the functions may be configured by a circuit such as an ASIC or FPGA.

The image acquisition unit 131 is a function module that acquires image data from the camera 110. The solder shape measuring unit 132 is a functional module that restores the three-dimensional shape of a mirrored object part such as solder from two-dimensional image data, and the part shape measuring unit 133 is a diffused object part such as a part from two-dimensional image data. It is a functional module that restores the three-dimensional shape of. The image data and the restoration algorithm used in each restoration process will be described later.

The inspection unit 134 measures various indexes related to the shapes of the solder KH and the component KB based on the three-dimensional shape data obtained by the solder shape measurement unit 132 and the component shape measurement unit 133, and uses these measured values. It is a functional module that inspects the state of solder joints. The inspection program storage unit 135 is a functional module that stores an inspection program that defines inspection items and conditions in the inspection unit 134. In the inspection program, for example, the position and size of the land to be inspected, the size of the part, the type of the index to be measured, the judgment reference value for each index (threshold value and range for judging non-defective product and defective product), etc. are defined. ing. The output processing unit 136 is a functional module that externally outputs the measured values and inspection results obtained by the inspection unit 134, the three-dimensional shape of the parts KB and the solder KH, and the like to the display device 14 and the like.

Hereinafter, a method for restoring the three-dimensional shape of the solder KH (mirror object) and a method for restoring the three-dimensional shape of the component KB (diffusing object) will be described, and then the flow of the inspection process of the information processing apparatus 13 will be described.

(Three-dimensional shape measurement of solder)
An image obtained by the so-called color highlighting method is used to measure the three-dimensional shape of the solder KH. The color highlighting method irradiates a substrate with light of a plurality of colors (that is, wavelengths) at different incident angles, and causes the solder surface to have color characteristics according to its normal direction (that is, a normal reflection direction when viewed from a camera). This is a method of capturing the three-dimensional shape of the solder surface as two-dimensional hue information by taking a picture with the color of the light source in the above appearing. Extracting only the region where the light source colors of R, G, and B appear from the image, and restoring the three-dimensional solder shape based on the shape, width, and order of each region of R, G, and B. Can be done. Since a known method can be used for the restoration of the three-dimensional shape, detailed description thereof will be omitted here.

First, the configuration of the lighting device 111 used in the color highlighting method will be described with reference to FIG. FIG. 5 is a schematic plan view schematically showing the arrangement relationship of the light sources 111R, 111G, and 111B of the lighting device 111. The lighting device 111 has a structure in which three annular light sources, a red light source 111R, a green light source 111G, and a blue light source 111B, are arranged concentrically around the optical axis of the camera 110. The elevation angles and orientations of the light sources 111R, 111G, and 111B are adjusted so that the incident angles with respect to the substrate K increase in the order of red light, green light, and blue light. Such a lighting device 111 can be formed, for example, by arranging LEDs of each color R, G, and B in an annular shape on the outside of a dome-shaped diffuser plate.

Further, as shown in FIG. 5, the illuminating device 111 is divided into four equal parts, which are divided into four regions: a first illuminating region 111a, a second illuminating region 111b, a third illuminating region 111c, and a fourth illuminating region 111d. The intensity of light emission (including ON / OFF, the same applies hereinafter) of the red light source 111R, the green light source 111G, and the blue light source 111B can be adjusted for each region. Since the illumination device 111 is divided into four regions in this way, it is possible to irradiate the substrate K with illumination light from eight directions by combining the regions to emit light. Specifically, of the four regions, there are four directions in which only one region is lit and four directions in which two adjacent regions are lit. The number of combinations of lighting areas is 13 including the case of all lighting.

When the substrate K is photographed by the camera 110 with the lighting device 111 turned on, a color feature corresponding to the normal direction (tilt angle) appears in the portion of the solder KH which is a mirror object. For example, when the inclination of the solder KH becomes gentler as the distance from the component electrodes increases, a change in hue of B → G → R appears in the region of the solder KH. The shape, width, appearance order, etc. of the regions of each of R, G, and B change depending on the surface shape of the solder KH.

With reference to FIG. 6, an image of a solder portion that can be obtained when a substrate is photographed by the camera 110 with the lighting device 111 according to the present embodiment turned on will be described. FIG. 6A is a side view of an electrode portion of a component KB on a substrate K and a solder portion (hereinafter, referred to as a soldered portion) joined to the electrode portion. As shown in FIG. 6A, the solder KH of the case is not sufficiently familiar with the electrode extending from the component KB, and the contact area is small (that is, it is in a non-wetting state).

FIG. 6B is an image of the soldered portion when the lighting is turned on in the entire area of the lighting device 111 and the image is taken. FIG. 6B shows regions of each color of R, G, and B. From the image shown in FIG. 6B, it can be inferred that there is a slope (a slope defined by) at the joint between the solder and the electrode, but which direction this slope is facing (that is, whether it is wet). It is not possible to determine whether it is in a non-wet state). Since diffuse reflection is dominant on the surface of the component KB body and the electrode, the color of the object itself as when illuminated with white light appears instead of the light source color such as R, G, and B.

Here, since the lighting device 111 of the present embodiment can turn on / off the light source for each of the four divided regions, the region of the lighting device 111 on the solder KH end side (second) of FIG. When only the illumination area 111b and the fourth illumination area 111d) are turned on and the soldered portion is photographed, an image as shown in FIG. 6C (hereinafter referred to as a first color highlight image) can be obtained.

Further, when the soldered portion of the lighting device 111 is photographed by lighting only the area on the component KB side (first lighting area 111a and third lighting area 111c) in FIG. 6, an image as shown in FIG. 6D (hereinafter, , Second color highlight image) can be acquired.

Then, the information processing device 13 extracts the brightness value of each pixel from the data of the first color highlight image and the second color highlight image, and synthesizes the pixel having the larger brightness value to synthesize the composite data. To create. Since the properties of the composite data and the process of creating the composite data are the same as those described in the application example, detailed description thereof will be omitted. In short, by using the composite data, it is possible to determine the direction of the slope of the joint between the solder KH and the electrode.

FIG. 6E shows an example of a composite image (hereinafter, referred to as a color highlight composite image) created based on the composite data created in this way. In the color highlight composite image, the parts where the pixels in the R, G, and B regions of the first color highlight image are adopted are displayed as they are in red (R), green (G), and blue (B), and the second The portion of the color highlight image in which the pixels in the R, G, and B regions are adopted is represented by magenta (M), yellow (Y), and cyan (C). The color selection in the composite image is completely arbitrary and is not limited to these six colors, but the degree of inclination is the same by using similar colors even though they have different color systems. Then, it is possible to intuitively grasp that the original image is different (that is, the direction of inclination is different).

If such a color highlight composite image can be displayed on the display device 14, for example, the user can easily grasp the state of the soldered portion by looking at the color highlight composite image.

(Three-dimensional shape measurement of parts)
On the other hand, the phase shift method is used to measure the three-dimensional shape of the component KB, which is a diffusion object. The phase shift method is one of the methods for restoring the three-dimensional shape of the object surface by analyzing the distortion of the pattern when the pattern light is projected onto the object surface. Specifically, the projector 112 is used to project a predetermined pattern (for example, a striped pattern in which the brightness changes in a sinusoidal shape) onto a substrate, and the camera 110 takes a picture. Then, the distortion of the pattern corresponding to the unevenness appears on the surface of the substrate K (note that the pattern can hardly be observed because the specular reflection is dominant in the solder KH portion). By repeating this process a plurality of times while changing the phase of the brightness change of the pattern light, a plurality of images having different brightness characteristics (hereinafter, referred to as a pattern analysis image) can be obtained. Since the brightness of the same pixel in each image should change in the same cycle as the change in the striped pattern, the phase of each pixel can be known by applying a sine wave to the change in the brightness of each pixel. Then, by obtaining the phase difference with respect to the phase of a predetermined reference position (table surface, substrate surface, etc.), the distance (that is, height) from the reference position can be calculated.

(Flow of inspection process)
Next, the flow of the inspection process performed by the substrate inspection apparatus 1 will be described with reference to FIG. 7. FIG. 7 is a flowchart showing the flow of the inspection process.

First, the control device 12 controls the stage 10 according to the inspection program, and moves the component KB and the solder KH to be inspected to the measurement position (the field of view of the camera 110) (step S101). Then, the control device 12 lights a part of the area of the lighting device 111 (step S102), and takes a picture with the camera 110 while irradiating the red light, the green light, and the blue light (step S103). The obtained image data (first color highlight image) is taken into the information processing device 13 by the image acquisition unit 131.

After the lighting device 111 is turned off, the control device 12 further lights the area facing the light emitting region ahead of the lighting device 111 (step S104), and the camera 110 takes a picture while irradiating the highlight illumination light (step S104). Step S105). The image data (second color highlight image) obtained here is taken into the information processing device 13 by the image acquisition unit 131.

Next, the control device 12 projects the pattern light from the projector 112 (step S106), and the camera 110 takes an image (step S107). When the phase shift method is used, the processes of steps S106 and S107 are executed a plurality of times while changing the phase of the pattern light. The obtained plurality of image data are taken into the information processing device 13 by the image acquisition unit 131. In the present embodiment, the shooting with the lighting device 111 is executed first, but the shooting with the projector 112 may be executed first. Further, when another inspection target exists outside the field of view of the camera 110, the processes of steps S101 to S107 may be repeatedly executed.

After that, the processing is performed by the information processing device 13. The solder shape measuring unit 132 extracts the brightness value of each pixel from the images obtained in steps S103 and S105 to create the above-mentioned composite data, and based on the composite data, the solder KH (and the electrode of the component KB) ) Is restored (step S108). The restored three-dimensional shape data is stored, for example, in the form of image data (called a height map) in which the height (Z position) of each pixel in the solder KH region is expressed by a pixel value. On the other hand, the component shape measuring unit 133 restores the three-dimensional shape of the component KB from the pattern image obtained in step S107 by the phase shift method (step S109). The three-dimensional shape data of the part KB is also saved in the height map format. By synthesizing these height maps, it is possible to obtain an overall height map representing the height information of both the solder KH, which is a mirror object, and the component KB, which is a diffusion object.

Then, the inspection unit 134 inspects the substrate K based on the overall height map and the threshold value of the inspection program (step S110). When the inspection is completed, the display device 14 displays the result of the inspection and the color highlight composite image visually representing the composite data created in step S108 (step S111), and ends the series of processes.

According to the substrate inspection apparatus of the present embodiment described above, the three-dimensional shape of the solder, which is a mirror object, and the component electrode, which is a diffused object, are restored by a method suitable for each, so that both the solder and the component electrode are restored. It is possible to obtain highly accurate three-dimensional shape data. In addition, when restoring the three-dimensional shape of solder, by creating composite data using multiple color highlight images, the orientation of the inclined surface at the location with the inclination can be specified and the three-dimensional shape can be restored. , The shape of the solder slope can be restored accurately.

(Modification example)
In the first embodiment, the lighting device 111 is formed in an annular shape centered on the Z axis, but it does not necessarily have to have such a configuration. FIG. 8 is an explanatory diagram showing a schematic configuration of a measurement unit 21 according to a modified example of the present embodiment. The measurement unit 21 according to this modification includes a lighting device 211 and a moving mechanism 25 which is a means for moving the projector 212. In this modification, the same reference numerals are used for the same configurations as in the first embodiment, and detailed description thereof will be omitted.

The moving mechanism 25 in this modification is a hollow cylindrical rotating mechanism 251 driven by a motor (not shown) controlled by the control device 12, and a reference plate assembled to the rotating mechanism 251 to support the lighting device 211. 252 and. The rotation mechanism 251 includes a housing 251a and a rotating body 251b, and the upper portion of the housing 251a is fixed to the device frame 26. Note that FIG. 8 is a partial cross-sectional view to make it easier to grasp the internal structure of the moving mechanism 25, but the actual camera 110 is arranged in the hollow of the rotating mechanism 251 and cannot be visually recognized from the side surface.

The rotation mechanism 251 is configured such that the rotating body 251b rotates within a range of 360 degrees about a rotation axis extending in the Z-axis direction by transmitting the rotation of the motor by, for example, a gear. When the rotating body 251b rotates, the reference plate 252 assembled to the rotating mechanism 251 also rotates, whereby the lighting device 211 and the projector 212 locked to the reference plate 252 rotate the rotating shaft of the cylindrical rotating mechanism 251. It will rotate around the circumference. That is, when the substrate K is arranged coaxially with the rotation axis of the rotation mechanism 251, the lighting device 211 and the projector 212 rotate around the substrate K on a plane defined by the XY axes. Since other hardware configurations, processes, and the like of this modification are the same as those of the first embodiment, illustration and description thereof will be omitted.

With such a configuration, the illumination device 211 and the projector 212 can be arranged at arbitrary positions on the circumference centered on the substrate K to irradiate the illumination light and project the pattern, so that a plurality of color highlights can be obtained. Images and pattern projection images can be acquired. Further, regardless of the orientation of the parts of the substrate K and the solder, the illumination light and the pattern can be irradiated from the optimum direction for the measurement of the three-dimensional shape.

<Embodiment 2>
Subsequently, the second embodiment will be described. FIG. 9 is a schematic configuration diagram of the substrate inspection device 3 according to the present embodiment. As shown in FIG. 9, the substrate inspection device 3 roughly includes an inspection unit 31, a control device 32, an information processing device 33, and a display device 34. The substrate inspection device 3 is different from the substrate inspection device 1 of the first embodiment in that the number of cameras, the arrangement position, and the absence of a projector. That is, since the configurations of the other control device 32, the information processing device 33, and the display device 34 are substantially the same as those of the substrate inspection device 1 of the first embodiment, detailed description thereof will be omitted.

The inspection unit 31 includes a stage 30, cameras 310a and 310b, a lighting device 311 and a moving mechanism 35, and a device frame 36. The moving mechanism 35 has a configuration including a rotating mechanism 351 (housing 351a, rotating body 351b) and a reference plate 352, but since it has the same configuration as the moving mechanism of the modified example of the first embodiment described above, a detailed description thereof will be given. Is omitted. The same applies to the stage 30 and the device frame 36.

The cameras 310a and 310b are arranged on the reference plate 352 of the moving mechanism 35 at diagonal positions of the reference plate 352 so as to photograph the substrate K, respectively. Further, the illuminating device 311 is an illuminating means for irradiating the substrate K with illumination light having different wavelengths, and actually illuminates the substrate K so that the light having the same wavelength can be illuminated from all directions (all directions around the Z axis). The device 111 has an annular or dome shape. The lighting device 311 according to the present embodiment does not have a divided region, and the RGB illumination light is irradiated collectively as a whole.

That is, in the first embodiment, by fixing the camera vertically above the measurement target and performing multiple shootings by changing the irradiation direction of the RGB illumination light, a plurality of images having different reflection modes of the RGB illumination light are acquired. However, in the present embodiment, a plurality of images having different modes of reflection of RGB illumination light are acquired by acquiring a plurality of images having different shooting directions.

Next, the flow of the inspection process performed by the substrate inspection apparatus 3 will be described with reference to FIG. FIG. 10 is a flowchart showing the flow of the inspection process.

First, the control device 32 controls the stage 30 according to the inspection program to move the parts to be inspected and the solder to the measurement position (step S201). Then, in a state where the control device 32 lights the lighting device 311 (step S202) and irradiates the red light, the green light, and the blue light, the moving mechanism 35 is controlled to position the two cameras 310a and 310b at appropriate positions. Move (step S203). Then, shooting is performed simultaneously with the two cameras (step S204). The obtained plurality of image data (color highlight images) are taken into the information processing device 33.

Then, the information processing apparatus 33 extracts the feature amount from the plurality of color highlight images, creates composite data (step S205), and executes the inspection based on the composite data (step S206). Then, as a result of the inspection, a composite image or the like created from the composite data is displayed on the display device (step S207), and a series of processes is completed. Since the process of creating composite data from a plurality of color highlight images is the same as that of the first embodiment, the description thereof will be omitted.

According to the inspection device 3 according to the present embodiment, since the color highlight image for creating the composite data can be taken at one time, the time required for the inspection can be shortened.

Although the substrate inspection device 3 according to the present embodiment is not provided with a projector, it may be provided with a projector to acquire a pattern projection image.

<Others>
Each of the above embodiments is merely an example of the present invention, and the present invention is not limited to the above specific embodiment. The present invention can be modified in various ways within the scope of its technical idea. For example, in each of the above embodiments, it is assumed that the device measures the degree of inclination of the measurement target by the color highlight method, but in order to measure the direction of inclination, it is necessary to irradiate a plurality of illumination lights having different wavelengths. There is no. Therefore, for example, an image in which light of a desired wavelength is irradiated from only one of the directions facing each other with the measurement target as the center is acquired, and an image in which the same illumination light is irradiated from only the other is acquired, and these feature quantities are obtained. By comparing, the direction of inclination in the measurement target can be measured.

Specifically, for example, a projector may irradiate a measurement target with light that does not include a pattern, and the direction of inclination of the measurement target may be measured based on a plurality of images irradiated with the light. That is, the light that does not include the pattern emitted from the projector to the measurement target can be regarded as the "illumination light" of the present invention. In such a case, the projector can be configured to serve as both a pattern light projection means for measurement by the phase shift method and an illumination means for measuring the tilt direction of the measurement target. Of course, it is also possible to combine these with a color highlight image and measure the degree of inclination as well.

Further, in the above-described first embodiment, the three-dimensional shape of the mirrored object is measured based on the color highlight image, and the three-dimensional shape of the diffused object is measured based on the pattern projection image. It is not necessary to do so, and two profile data for measuring the shape of the entire measurement target may be created based on each image, and then these data may be combined.

Further, also in the first embodiment, the device configuration may be such that the projector is not provided. By measuring the three-dimensional shape of the measurement target only by the color highlighting method, the device configuration can be simplified and the inspection time can be shortened. Further, a device configuration may be configured in which a lighting means is further provided separately from the projector and the light source for color highlighting.

Further, as described above, the wavelength used for the light source used in the lighting device is not limited to R, G, and B, and light of any wavelength can be adopted. Further, in the above embodiment, the image displayed on the display device also has red (R), green (G), blue (B), magenta (M), yellow (Y), and cyan (C) according to the illumination light. ), But it is not limited to this. For example, the present invention can be applied to a measuring device that does not use the color highlighting method, but in that case, since the above color coding is meaningless, display classification by different colors and / or patterns is performed. You may.

<Additional notes>
One aspect of the present invention is from an illuminating means (91) that irradiates the measurement object (O) with illumination light, a photographing means (92) that photographs the measurement object, and an image captured by the photographing means. In a three-dimensional shape measuring device having a measuring means (93) for measuring the three-dimensional shape of the measurement target based on the difference in the wavelength of the reflected light of the obtained illumination light, the photographing means is the photographing means. A plurality of images having different angles around the vertical axis with respect to the measurement target in the photographing direction or the irradiation direction of the illumination light, and include either the intensity or the wavelength of the reflected light at a predetermined portion of the measurement target. The plurality of images having different modes of reflection are acquired, and the measuring means measures the three-dimensional shape of the predetermined portion based on the plurality of images acquired by the photographing means. , A three-dimensional shape measuring device.

In addition, another aspect of the present invention is an irradiation step (S901, S903) in which the measurement target is irradiated with illumination light, and a vertical axis of the illumination light irradiation direction or imaging direction with respect to the measurement target. A photographing step (S902) of acquiring a plurality of images having different angles of the above and having different modes of reflection including either the intensity or the wavelength of the reflected light of the illumination light at a predetermined portion of the measurement target. , S904), and a measurement step (S907) for measuring the three-dimensional shape of the predetermined portion based on the plurality of images acquired in the photographing step.

1, 3 ... Board inspection device 9 ... Three-dimensional shape measuring device 10, 30 ... Stage 11, 31 ... Inspection unit 110, 310, 92 ... Camera 111, 211, 311, 91 ...・ ・ Lighting device 12, 32 ・ ・ ・ Control device 13, 33, 93 ・ ・ ・ Information processing device 14, 34 ・ ・ ・ Display device 25, 35 ・ ・ ・ Movement mechanism K ・ ・ ・ Board O ・ ・ ・ Measurement target Stuff

Claims (21)

Lighting means that irradiates the measurement target with illumination light,
A shooting means for shooting the measurement target and
In a three-dimensional shape measuring device having a measuring means for measuring the three-dimensional shape of the measurement target based on the difference in wavelength of the reflected light of the illumination light obtained from the image taken by the photographing means.
The photographing means is a plurality of images having different angles around the vertical axis with respect to the measurement target in the shooting direction of the shooting means or the irradiation direction of the illumination light, and the reflected light at a predetermined portion of the measurement target. Obtaining the plurality of images having different modes of reflection, including either intensity or wavelength,
The measuring means measures the three-dimensional shape of the predetermined portion based on the plurality of images acquired by the photographing means.
A three-dimensional shape measuring device characterized by this. The predetermined portion is a portion including an inclination in the measurement target, and is
The measuring means measures the direction of inclination of the predetermined portion based on the difference between each image of a predetermined feature amount in each pixel constituting a plurality of images having different modes of reflection of the reflected light. ,
The three-dimensional shape measuring device according to claim 1, wherein the three-dimensional shape measuring device is characterized in that. By photographing the measurement object from a plurality of different positions on one circumference centered on the measurement object, the photographing means has a plurality of angles around the vertical axis in the photographing direction with respect to the measurement object. Get an image,
The three-dimensional shape measuring device according to claim 1 or 2, wherein the three-dimensional shape measuring device is characterized in that. By irradiating the measurement target with the illumination light from a plurality of different positions on one circumference centered on the measurement target, the lighting means irradiates the measurement target with the illumination light.
The photographing means acquires a plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction of the illumination light.
The three-dimensional shape measuring device according to claim 1 or 2, wherein the three-dimensional shape measuring device is characterized in that. The illuminating means is movably arranged in the circumferential direction around the measurement target, and illuminates the measurement target from a plurality of different positions on one circumference centered on the measurement target. By irradiating
The photographing means acquires a plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction of the illumination light.
The three-dimensional shape measuring device according to claim 4, wherein the three-dimensional shape measuring device is characterized in that. The lighting means is arranged in an annular shape around the measurement target, and is configured so that the emission intensity of the illumination light can be adjusted for each of a plurality of ranges formed by dividing the ring into a plurality of areas.
The photographing means irradiates the measurement target with the illumination light from at least one of the plurality of ranges, and the illumination light from the other ranges. By acquiring the image at the time, a plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction of the illumination light are acquired.
The three-dimensional shape measuring device according to claim 4, wherein the three-dimensional shape measuring device is characterized in that. It further has a projection means for projecting a predetermined pattern light onto the measurement target.
The photographing means further acquires the pattern projection image of the measurement target on which the pattern light is projected, and further obtains the pattern projection image.
The measuring means measures the three-dimensional shape of the predetermined portion based on a plurality of images in which the mode of reflection of the reflected light at the predetermined portion of the measurement target is different and the pattern projection image.
The three-dimensional shape measuring device according to any one of claims 1 to 6, wherein the three-dimensional shape measuring device is characterized in that. The illuminating means irradiates the measurement target with illumination light having a different wavelength from a plurality of different angles between the vertical direction and the horizontal direction.
The measuring means measures the degree of inclination of the predetermined portion from the mode of reflection of the reflected light of the illumination light having different wavelengths in at least one image acquired by the photographing means.
The three-dimensional shape measuring device according to claim 2, wherein the three-dimensional shape measuring device is characterized in that. It further has an image display means for displaying a composite image created from the plurality of images acquired by the photographing means.
The composite image is an image that has undergone image processing that displays and separates the difference in the direction of inclination at least in the predetermined portion by different colors and / or patterns.
The three-dimensional shape measuring device according to claim 2, wherein the three-dimensional shape measuring device is characterized in that. It further has an image display means for displaying a composite image created from the plurality of images acquired by the photographing means.
The composite image is an image that has undergone image processing to display and separate the difference in the degree and direction of the inclination in the predetermined portion by different colors and / or patterns.
The three-dimensional shape measuring device according to claim 8, wherein the three-dimensional shape measuring device is characterized in that. The composite image was synthesized by comparing the values of predetermined feature amounts of pixels indicating the same location of the measurement target in each image that is the source of synthesis, and selecting the pixels from the image having the largest value. Is a thing,
The three-dimensional shape measuring device according to claim 9 or 10, wherein the three-dimensional shape measuring device is characterized in that. An irradiation step that irradiates the measurement target with illumination light,
A plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction or the photographing direction of the illumination light, and either the intensity or the wavelength of the reflected light of the illumination light at a predetermined portion of the measurement target. A shooting step of acquiring the plurality of images having different modes of reflection including
A measurement step for measuring the three-dimensional shape of the predetermined portion based on the plurality of images acquired in the photographing step, and a measurement step.
Three-dimensional shape measurement method having. The predetermined portion is a portion including an inclination in the measurement target, and is
In the measurement step, the direction of inclination of the predetermined portion is measured based on the difference between each image of a predetermined feature amount in each pixel constituting a plurality of images having different modes of reflection of the reflected light. ,
The three-dimensional shape measuring method according to claim 12, wherein the three-dimensional shape measuring method is characterized in that. In the irradiation step, by irradiating the measurement target with the illumination light from a plurality of different positions on one circumference centered on the measurement target, the measurement target is irradiated with the illumination light.
In the shooting step, a plurality of images having different angles around the vertical axis with respect to the measurement target in the irradiation direction of the illumination light are acquired.
The three-dimensional shape measuring method according to claim 12 or 13, wherein the three-dimensional shape measuring method is characterized in that. In the shooting step, by shooting the measurement target from a plurality of different positions on one circumference centered on the measurement target, a plurality of images having different angles around the vertical axis with respect to the measurement target in the shooting direction. To get,
The three-dimensional shape measuring method according to claim 12 or 13, wherein the three-dimensional shape measuring method is characterized in that. It further has a projection step of projecting a predetermined pattern of light onto the measurement target.
In the shooting step, the pattern projection image of the measurement target on which the pattern light is projected is further acquired.
In the measurement step, the three-dimensional shape of the predetermined portion is measured based on a plurality of images in which the mode of reflection of the reflected light at the predetermined portion to be measured differs and the pattern projection image.
The three-dimensional shape measuring method according to any one of claims 12 to 15, characterized in that. In the irradiation step, the measurement target is irradiated with illumination light having a different wavelength from a plurality of different angles between the vertical direction and the horizontal direction.
In the measurement step, the degree of inclination of the predetermined portion is measured from the mode of reflection of the reflected light of the illumination light having different wavelengths in at least one image acquired in the photographing step.
The three-dimensional shape measuring method according to claim 13, wherein the three-dimensional shape measuring method is characterized in that. It further includes a composite image display step of displaying a composite image created by synthesizing the plurality of images acquired in the shooting step.
The composite image is an image that has undergone image processing that displays and separates the difference in the direction of inclination at least in the predetermined portion by different colors and / or patterns.
The three-dimensional shape measuring method according to claim 13, wherein the three-dimensional shape measuring method is characterized in that. It further includes a composite image display step of displaying a composite image created by synthesizing the plurality of images acquired in the shooting step.
The composite image is an image that has undergone image processing to display and separate the difference in the degree and direction of the inclination in the predetermined portion by different colors and / or patterns.
The three-dimensional shape measuring method according to claim 17, wherein the three-dimensional shape measuring method is characterized in that. The composite image was synthesized by comparing the values of predetermined feature amounts of pixels indicating the same location of the measurement target in each image that is the source of synthesis, and selecting the pixels from the image having the largest value. Is a thing,
The three-dimensional shape measuring method according to claim 18 or 19, wherein the three-dimensional shape measuring method is characterized in that. A program for causing a three-dimensional shape measuring device to execute each step according to any one of claims 12 to 20.

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