JP2021091166A - Resin-joined metal component and method for manufacturing the same - Google Patents

Abstract

To provide a method for manufacturing a resin-joined metal component that can be manufactured in a short processing time and inexpensively.SOLUTION: A method for manufacturing a resin-joined metal component has steps of: forming a resin-joined portion on a metal component using a progressive press apparatus provided with a convex stripe extending in a direction crossing a conveyance direction, on either one of an upper mold and a lower mold; and flowing a resin into an area including the resin-joined portion by injection molding, and curing it. When a length along a conveyance direction of a base portion of the convex stripe is L [mm], and a forwarding length for forwarding the metal component in a single conveyance using the press apparatus is P [mm], the forwarding length P is 0<P<L/2. When an upper mold is moved down at the n-th time, by deforming a top portion of a mountain portion toward a valley portion side formed by the convex stripe at the (n-1)-th time, the mountain portion being between a valley portion formed at the (n-1)-th time and a valley portion formed at the n-th time, the resin-joined portion comprising a plurality of mountain portions in which the top portions uniformly are inclined toward a direction crossing a longitudinal direction of the mountain portions, is formed into the metal component.SELECTED DRAWING: Figure 2

Description

The present invention relates to a resin-bonded metal part and a method for manufacturing the same.

According to Patent Document 1 and the like, a method for manufacturing a resin-bonded metal part in which a metal part and a resin part are bonded is known.

JP-A-2019-081191

Although a manufacturing method as in Patent Document 1 is known, it takes time to irradiate the laser beam, or the equipment for irradiating the laser beam is expensive.
Therefore, the present invention provides a method for manufacturing a resin-bonded metal part and a resin-bonded metal part that can be manufactured in a short processing time and at low cost.

The method for manufacturing a resin-bonded metal part according to one aspect of the present invention is
A method for manufacturing a resin-bonded metal part in which a resin part is bonded to a metal part without using an adhesive.
A step of forming a resin joint on the metal part with a progressive press device provided with ridges extending in a direction intersecting the transport direction on either the upper die or the lower die.
It has a step of pouring a resin into a region including the resin joint and curing the resin by injection molding.
The length of the base of the ridge along the transport direction is L [mm].
When the feed length of feeding the metal part in one transfer by the press device is P [mm],
The feed length P is 0 <P <L / 2,
When the upper mold was lowered at the nth time, the top of the mountain portion between the valley part formed at the n-1th time and the valley part formed at the nth time was formed by the convex stripe at the n-1th time. By deforming to the valley side formed in, the resin joint portion composed of a plurality of mountain portions in which the top portion is uniformly inclined in the direction intersecting the longitudinal direction of the mountain portion is formed in the metal part.

The resin-bonded metal component according to one aspect of the present invention is
A metal part used for a resin-bonded metal part in which resin parts are joined without using an adhesive.
The metal part has a plurality of ridges extending in the longitudinal direction and has a plurality of peaks.
The tops of the mountainous portions of the plurality of rows are all uniformly inclined in the direction intersecting the longitudinal direction.

According to the present invention, there is provided a method for manufacturing a resin-bonded metal part and a resin-bonded metal part that can be manufactured in a short processing time and at low cost.

It is a figure which shows the electronic device to which the resin bonded metal part which concerns on embodiment of this invention is applied. It is sectional drawing of the heat dissipation board and a circuit board including a resin joint part. A progressive press for processing a heat radiating substrate is shown. The state immediately after the upper mold is raised from the work after the work is processed by lowering the upper mold for the first time is shown. From the state shown in FIG. 4, the work is fed by the feed mechanism by the feed length P in the transport direction. The state when the upper mold is lowered from the state shown in FIG. 5 is shown.

Hereinafter, the present invention will be described with reference to the drawings based on the embodiments. The same or equivalent components, members, and processes shown in the drawings shall be designated by the same reference numerals, and redundant description will be omitted as appropriate. Further, the embodiment is not limited to the invention but is an example, and all the features and combinations thereof described in the embodiment are not necessarily essential to the invention.

FIG. 1 shows an electronic device 1 in which a resin-bonded metal component according to an embodiment of the present invention is used. FIG. 1 illustrates an electronic device 1 provided with a metal heat-dissipating substrate 2 (an example of a metal component), a resin circuit board 3 (an example of a resin component), and an electronic circuit 4 mounted on the circuit board 3. Has been done. A resin circuit board 3 is fixed to the heat radiating board 2.

A resin joint 5 is provided on the upper surface of the heat radiating substrate 2. The resin joint portion 5 is a portion where the joint strength with the resin is increased. The heat radiating board 2 and the circuit board 3 are integrally molded, and the heat radiating board 2 and the circuit board 3 are joined via the resin joint portion 5. That is, the heat radiating board 2 and the circuit board 3 are joined and integrated without using an adhesive or the like.
Note that FIG. 1 shows a state in which the circuit board 3 and the heat radiating board 2 are separated in order to show the resin joint portion 5 provided on the heat radiating board 2, but the circuit board 3 and the heat radiating board 2 are actually separated from each other. It is one.

FIG. 2 is a cross-sectional view of the heat radiating substrate 2 and the circuit board 3 including the resin joint portion 5. As shown in FIG. 2, the resin joint portion 5 is provided with a plurality of mountain portions 6. A valley portion 7 is formed between the mountain portions 6. The mountain portion 6 extends in the longitudinal direction (see FIG. 1). All the tops 8 of the mountain portion 6 are uniformly inclined in the direction intersecting the longitudinal direction (the direction perpendicular to the paper surface in FIG. 2).

More specifically, the top 8 of the mountain portion 6 is uniformly crushed in a specific direction. Further, the crushed tip extends in substantially the same direction as the surface of the heat radiating substrate 2. Therefore, even if a force for separating the resin circuit board 3 from the metal heat dissipation board 2 (a force pushing it upward in the figure) acts on the resin circuit board 3, the crushed tip enters the valley portion 7. The resin is received, and the resin that has entered the valley portion 7 is prevented from coming out of the valley portion 7.

Next, a processing method of the heat radiating substrate 2 including such a resin joint portion 5 will be described with reference to FIG. FIG. 3 shows a progressive press device 10 for processing the heat radiating substrate 2.
The progressive press device 10 includes an upper die 11, a lower die 12, and a feed mechanism 13. The feed mechanism 13 moves the work W (heat dissipation substrate 2) arranged between the upper die 11 and the lower die 12 at regular intervals. In the present embodiment, the upper die 11 is provided with a protrusion extending in a direction intersecting the transport direction H of the work W. The upper mold 11 is provided with a ridge 20.

Although FIG. 3 shows an example in which one upper mold 11 is provided with three ridges 20, one upper mold 11 may be provided with one ridge 20 or two. The above-mentioned plurality of ridges 20 may be provided. Further, FIG. 3 shows an example in which only the ridge 20 for processing the resin joint portion 5 is provided on the upper mold 11, but in addition to the ridge 20, other processing parts such as bending and cutting are provided. May be. Further, although FIG. 3 shows an example in which the ridge 20 is provided on the upper mold 11, the ridge 20 may be provided on the lower mold 12.

4 to 6 show the work W and the upper die 11 machined by the progressive press device 10.
FIG. 4 shows a state immediately after the upper die 11 is raised from the work W after the upper die 11 is lowered for the first time to process the work W. As shown in FIG. 4, the shape of the ridge 20 provided on the upper mold 11 is transferred to the surface of the work W. Here, the length of the base of the ridge 20 in the transport direction H is referred to as L. The length L of the base of the ridge 20 along the transport direction H is preferably 0.1 mm or more and 0.7 mm or less.

Further, it is preferable that the height h of the ridge 20 from the reference surface of the upper die 11 is 0.1 mm or more and 0.7 mm or less. It is preferable that the angle θ of the top 8 of the ridge 20 in the cross section along the transport direction H of the press device is 45 degrees or more and less than 135 degrees.

FIG. 5 shows a state in which the work W is fed by the feed mechanism 13 in the transport direction H by the feed length P from the state shown in FIG. The feed length P is set so as to satisfy the relationship of 0 <P <L / 2. That is, when the upper mold 11 is lowered for the second time, the base of the ridge 20 of the upper mold 11 comes into contact with the valley portion 7 formed in the work W when the upper mold 11 is lowered for the first time. , P size is set. The feed length P of the progressive press device 10 is preferably 0.1 mm or more and 0.5 mm or less.

FIG. 6 shows a state when the upper die 11 is lowered from the state shown in FIG. As shown in FIG. 6, when the upper mold 11 is lowered for the second time, the valley portion 7 of the work W formed when the upper mold 11 is processed for the first time at the base of the ridge 20 of the upper mold 11. And crush the contacted portion toward the valley portion 7 formed for the first time.
In other words, when the upper die 11 descends for the second time, a portion on the downstream side (left side in FIG. 6) of the ridge 20 of the upper die 11 in the transport direction H is formed for the first time. The portion on the upstream side (right side in FIG. 6) of the transport direction H forming the valley portion 7 is crushed toward the downstream side of the transport direction H.
As a result, a crushed shape is formed so that the top 8 of the mountain portion 6 extends toward the downstream side in the transport direction H.

In this way, when the upper mold 11 descends at the nth time, the work W is fed by the feed length P (0 <P> L / 2) from the position where the upper mold 11 descends at the n-1th time. .. When the upper mold 11 descends at the nth time, the portion of the valley portion 7 formed by the upper mold 11 on the upstream side in the transport direction H is crushed by the ridge 20 at the n-1nth time, and the top portion 8 of the mountain portion 6 is crushed. The tip is crushed toward the downstream side in the transport direction H. When such processing is repeated, as shown in FIG. 1, it has a plurality of ridges 6 extending in the longitudinal direction, and all the tops 8 of the ridges 6 are uniformly inclined in the direction of intersecting in the longitudinal direction. , The resin joint portion 5 is formed.

When forming the resin joint 5, it is preferable to perform various processes such as cutting and bending that can be processed by the progressive press device 10.
In this way, the heat radiating substrate 2 having the resin joint portion 5 is obtained.

Next, the electronic device 1 in which the heat radiating substrate 2 and the circuit board 3 are integrated is formed by resin molding. The heat radiating substrate 2 on which the resin joint portion 5 is formed is placed in the cavity of the resin molding mold. The resin to be the circuit board 3 is poured into this cavity. At this time, the resin is wrapped around to the valley portion 7 of the resin joint portion 5 of the heat radiating substrate 2. When the resin is cured, a member in which the heat radiating substrate 2 and the circuit board 3 are integrated is obtained.
Further, when the electronic circuit 4 is mounted on the circuit board 3, the electronic device 1 shown in FIG. 1 can be obtained.

According to the resin-bonded metal component according to the present embodiment, the tip of the top 8 of the mountain portion 6 of the resin-bonded portion 5 is in a direction different from the direction away from the metal heat-dissipating substrate 2 of the resin circuit board 3. It is extending. Therefore, when the circuit board 3 tries to separate from the heat radiating board 2, the top portion 8 of the peak portion 6 of the resin joint portion 5 is pulled out from the resin portion embedded in the valley portion 7 of the resin joint portion 5. Stop. Therefore, a resin-bonded metal component having high adhesive strength between the circuit board 3 and the heat radiating board 2 can be obtained.

Further, according to the method for manufacturing a resin-bonded metal part according to the present embodiment, the resin-bonded portion 5 having improved adhesiveness to the resin can be formed by press working. The resin joint portion 5 can be formed by using a general press device in the processing of metal parts, and the introduction of manufacturing equipment does not require a large cost. Further, since the resin joint portion 5 can be formed only by press working, the joint portion can be formed in a short time.

The present invention is not limited to the above-described embodiment, and can be freely modified, improved, and the like as appropriate. In addition, the material, shape, size, numerical value, form, number, arrangement location, etc. of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

In the above-described embodiment, an example in which the present invention is applied to an electronic device has been described, but the present invention is not limited to this. The present invention can be generally applied to products including components of vehicle lamps in which metal parts and resin parts are joined.

1 Electronic equipment 2 Heat dissipation board 3 Circuit board 4 Electronic circuit 5 Resin joint 6 Peak 7 Valley 8 Top 10 Progressive press device 11 Upper 12 Lower 13 Mechanism 20 Convex H Transport direction

Claims (2)

A method for manufacturing a resin-bonded metal part in which a resin part is bonded to a metal part without using an adhesive.
A step of forming a resin joint on the metal part with a progressive press device provided with ridges extending in a direction intersecting the transport direction on either the upper die or the lower die.
It has a step of pouring a resin into a region including the resin joint and curing the resin by injection molding.
The length of the base of the ridge along the transport direction is L [mm].
When the feed length of feeding the metal part in one transfer by the press device is P [mm],
The feed length P is 0 <P <L / 2,
When the upper mold was lowered at the nth time, the top of the mountain portion between the valley part formed at the n-1th time and the valley part formed at the nth time was formed by the ridges at the n-1th time. A resin that forms the resin joint portion composed of a plurality of mountain portions uniformly inclined in a direction in which the top portion intersects the longitudinal direction of the mountain portion in the metal part by deforming to the valley portion side formed in the metal component. Manufacturing method of bonded metal parts. A metal part used for a resin-bonded metal part in which resin parts are joined without using an adhesive.
The metal part has a plurality of ridges extending in the longitudinal direction and has a plurality of peaks.
A resin-bonded metal part in which the tops of a plurality of strips of the mountain portion are all uniformly inclined in a direction intersecting the longitudinal direction.

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