JP2021084152A - Process groove detection device and cutting device - Google Patents

Abstract

To allow a user to easily grasp a chip on a rear surface side of a workpiece.SOLUTION: A process groove detection device 2 comprises: a chuck table 10 which holds a workpiece 200; an ultrasonic unit which transmits an ultrasonic wave 300 to the workpiece 200 from a surface 201 side of the workpiece 200 held by the chuck table 10 and receives a reflection wave 301 of the ultrasonic wave 300; a moving unit which relatively moves the chuck table 10 and the ultrasonic unit; a water layer formation unit 50 which forms a water layer 51 between the workpiece 200 and an ultrasonic transducer 30 of the ultrasonic unit; and an imaging unit which forms an image with the concentration difference in accordance with the intensity of the reflection wave 301. An ultrasonic wave generation unit transmits the ultrasonic wave 300 such that the ultrasonic wave 300 converges on a rear surface 204 side of the workpiece 200. The imaging unit detects the state on the rear surface 204 side of a cutting groove 207 on the basis of the intensity of the reflection wave 301 of the ultrasonic wave 300 on the rear surface 204 side of the workpiece 200.SELECTED DRAWING: Figure 2

Description

The present invention relates to a machined groove detection device and a cutting device.

In order to cut a work piece such as a semiconductor wafer along a street to form a chip, a cutting device provided with a cutting blade for cutting the work piece (see, for example, Patent Document 1) is used.

Japanese Unexamined Patent Publication No. 6-112310

In the cutting apparatus shown in Patent Document 1 and the like, when the cutting blade is clogged or chipped, chipping may occur on both sides of the cutting groove which is a processing groove formed in the workpiece. In particular, the cutting apparatus shown in Patent Document 1 has a problem that the chipping on the back surface side of the workpiece is often larger than the chipping on the front surface, and the quality of the device is significantly deteriorated.

In order to confirm the chipping that occurs in the cutting groove on the back surface side of the workpiece as described above (hereinafter, the chipping on the back surface side), the cutting groove formed in the workpiece may be imaged from the back surface side. A dicing tape is attached to the back surface side of the work piece, and since the dicing tape has minute irregularities to facilitate separation from the chuck table, the work piece is passed through the dicing tape. It is difficult to image the chip on the back side. Therefore, it is necessary to peel off the dicing tape for observation, which is a laborious task.

The present invention has been made in view of the above facts, and is to provide a machined groove detection device and a cutting device capable of easily grasping a chipping on the back surface side of a work piece.

In order to solve the above-mentioned problems and achieve the object, the machined groove detection device of the present invention is a machined groove detecting device that detects a machined groove formed on a work piece to which a dicing tape is attached on the back surface side. A holding means for holding the work piece and an ultrasonic generation unit for transmitting ultrasonic waves to the work piece from the surface side of the work piece held by the holding means via the dicing tape. , And an ultrasonic unit provided with an ultrasonic receiving unit that receives ultrasonic waves (reflected waves) reflected from the workpiece, and the holding means and the ultrasonic unit are parallel to the surface of the workpiece. Depending on the moving means for moving relative to the direction, the water layer forming means for forming an aqueous layer between the workpiece and the ultrasonic unit, and the intensity of the reflected wave received by the ultrasonic receiving unit. The ultrasonic generation unit includes an imaging unit that images as shading, and the ultrasonic generation unit transmits ultrasonic waves so that the ultrasonic waves converge on the back surface side of the processing groove formed in the work piece, and the work is processed. It is characterized in that the state of the back surface side of the machined groove is detected based on the reflected wave intensity of ultrasonic waves on the back surface side of the object.

The cutting apparatus of the present invention detects a chuck table for holding a work piece, a cutting means provided with a cutting blade for cutting the work piece held on the chuck table, and a cutting groove formed by the cutting means. A cutting device including a detecting means, wherein the detecting means is the machined groove detecting device.

In the cutting device, the chuck table may be the holding means.

The present invention has an effect that the chipping on the back surface side of the workpiece can be easily grasped.

FIG. 1 is a perspective view showing a configuration example of a cutting device according to the first embodiment. FIG. 2 is a cross-sectional view showing a state in which the machined groove detecting device of the cutting device shown in FIG. 1 detects a machined groove. FIG. 3 is a diagram schematically showing a configuration of a main part of a machining groove detection device of the cutting device shown in FIG. FIG. 4 is a diagram schematically showing a reflected wave of ultrasonic waves received by the receiving unit of the ultrasonic unit shown in FIG. FIG. 5 is a diagram showing an example of an image of the back surface of the work piece generated by the control unit of the machining groove detection device of the cutting apparatus shown in FIG. FIG. 6 is a perspective view showing a configuration example of the machined groove detection device according to the second embodiment.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The machined groove detection device and the cutting device according to the first embodiment of the present invention will be described with reference to the drawings. First, the configuration of the cutting device 1 will be described. FIG. 1 is a perspective view showing a configuration example of a cutting device according to the first embodiment. FIG. 2 is a cross-sectional view showing a state in which the machined groove detecting device of the cutting device shown in FIG. 1 detects a machined groove. FIG. 3 is a diagram schematically showing the configuration of a main part of the machined groove detection device of the cutting device shown in FIG. FIG. 4 is a diagram schematically showing a reflected wave of ultrasonic waves received by the receiving unit of the ultrasonic unit shown in FIG. FIG. 5 is a diagram showing an example of an image of the back surface of the workpiece generated by the control unit of the machining groove detection device of the cutting apparatus shown in FIG.

(Workpiece)
The workpiece 200 to be processed by the cutting apparatus 1 according to the first embodiment is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer whose base material is silicon, gallium arsenide, SiC (silicon carbide) or sapphire. Is. In the workpiece 200, the device 203 is formed in a region divided in a grid pattern by a plurality of scheduled division lines 202 formed in a grid pattern on the surface 201.

Further, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which a central portion is thinned and a thick portion is formed on an outer peripheral portion. In addition to the wafer, a device sealed with a resin is used. A resin package substrate such as a rectangular QFN (Quad Flat No leaded) package substrate having a plurality of these, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, a glass substrate and the like may be used. In the first embodiment, the back surface 204 of the workpiece 200 is attached to a dicing tape 206 having an annular frame 205 attached to the outer peripheral edge thereof, and is supported by the annular frame 205.

(Cutting equipment)
The cutting apparatus 1 shown in FIG. 1 holds the workpiece 200 on the holding surface 11 of the chuck table 10 and cuts (corresponds to machining) with the cutting blade 21 along the scheduled division line 202 to perform the scheduled division line. It is a processing apparatus for forming a cutting groove 207 (shown in FIG. 2) which is a processing groove for dividing a work piece 200 into individual devices 203 along 202. As shown in FIG. 1, the cutting device 1 is a cutting unit including a machining groove detecting device 2 which is a detecting means for detecting a cutting groove 207 formed by the cutting unit 20 and a cutting blade 21 for cutting the workpiece 200. 20 and an imaging unit (not shown) for photographing the workpiece 200.

The machining groove detection device 2 detects the cutting groove 207 formed by the cutting unit 20 on the workpiece 200 to which the dicing tape 206 is attached to the back surface 204 side. Further, the machining groove detection device 2 detects the state of both ends of the cutting groove 207 of the workpiece 200 on the back surface 204 side. As shown in FIG. 1, the machined groove detection device 2 includes a chuck table 10, an ultrasonic transducer 30, a moving unit 40, and an aqueous layer forming means, which are holding means for sucking and holding the workpiece 200 on the holding surface 11. The aqueous layer forming unit 50 and the control unit 100 which is an imaging unit are included.

The chuck table 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramic or the like. Further, the chuck table 10 extends over a machining area below the cutting unit 20 by the X-axis moving unit 41 of the moving unit 40 and a loading / unloading region where the workpiece 200 is carried in / out away from the lower part of the cutting unit 20. By being movably provided, it is movably provided in the X-axis direction parallel to the horizontal direction.

The chuck table 10 is rotatably provided around the axis parallel to the Z-axis direction by the rotational movement unit 44 of the moving unit 40. In the chuck table 10, the holding surface 11 is connected to a vacuum suction source (not shown), and the holding surface 11 is sucked by the vacuum suction source to suck and hold the workpiece 200 placed on the holding surface 11. In the first embodiment, the chuck table 10 sucks and holds the back surface 204 side of the workpiece 200 via the dicing tape 206. Further, as shown in FIG. 1, a plurality of clamp portions 12 for clamping the annular frame 205 are provided around the chuck table 10.

The cutting unit 20 is a cutting means in which a cutting blade 21 for cutting a workpiece 200 held on a chuck table 10 is rotatably mounted on the tip of a spindle 23. The cutting unit 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 42 of the moving unit 40 with respect to the workpiece 200 held on the chuck table 10, and the Z-axis moving unit of the moving unit 40 is provided. It is provided so as to be movable in the Z-axis direction by 43.

As shown in FIG. 1, the cutting unit 20 is provided on a support frame 4 erected from the apparatus main body 3 via a Y-axis moving unit 42, a Z-axis moving unit 43, and the like. The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.

The cutting unit 20 rotates about the axis of the cutting blade 21, the spindle housing 22 movably provided in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 42 and the Z-axis moving unit 43, and the spindle housing 22. It includes a spindle 23 that can be provided and is rotated by a motor (not shown) and has a cutting blade 21 mounted on the tip thereof.

The cutting blade 21 is an ultra-thin cutting grindstone having a substantially ring shape. In the first embodiment, the cutting blade 21 is a so-called hub blade including an annular circular base and an annular cutting blade disposed on the outer peripheral edge of the circular base to cut the workpiece 200. The cutting edge is composed of abrasive grains such as diamond and CBN (Cubic Boron Nitride) and a bonding material (bonding material) such as metal and resin, and is formed to have a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called washer blade composed of only the cutting blade. The spindle 23 rotates the cutting blade 21 by rotating the spindle 23 around the axis by a motor. The axes of the cutting blade 21 and the spindle 23 of the cutting unit 20 are set parallel to the Y-axis direction. The cutting unit 20 cuts the cutting blade 21 into the planned division line 202 from the surface 201 side of the workpiece 200 until it reaches the dicing tape 206, and divides the workpiece 200 into individual devices 203.

The image pickup unit includes an image pickup element that captures a region to be divided of the workpiece 200 before cutting held on the chuck table 10. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit photographs the workpiece 200 held on the chuck table 10 to obtain an image for performing alignment for aligning the workpiece 200 and the cutting blade 21, and controls the obtained image. Output to unit 100.

The ultrasonic transducer 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. In the ultrasonic transducer 30, the tip surface 31 shown in FIG. 3 faces the holding surface 11 of the chuck table 10. The ultrasonic transducer 30 has a frequency of 20 kHz or more and several GHz or less when a pulsed voltage is applied. A piezoelectric transducer for transmitting the ultrasonic wave 300 of the above from the tip surface 31 is provided.

In the ultrasonic transducer 30, the tip surface 31 is formed in a spherical shape in order to converge the ultrasonic wave 300 transmitted from the tip surface 31, but in the present invention, the sound wave that converges the ultrasonic wave 300 transmitted from the tip surface 31 A lens may be provided. Further, in the embodiment, the diameter of the spot of the ultrasonic wave 300 on which the ultrasonic transducer 30 converges is about 10 μm. Further, the ultrasonic transducer 30 receives the reflected wave 301 of the ultrasonic wave 300.

The water layer forming unit 50 has a water layer 51 (shown in FIG. 2) composed of pure water between the surface 201 of the workpiece 200 held on the chuck table 10 and the tip surface 31 of the ultrasonic transducer 30. It is what forms. In the first embodiment, the aqueous layer forming unit 50 is fixed to the cutting unit 20 together with the ultrasonic transducer 30, and the opening at the tip is aligned with the tip surface 31 of the ultrasonic transducer 30 in the X-axis direction, and a pure water supply source (not shown). A pure water supply pipe 52 to which pure water is supplied from the above is provided. The opening at the tip of the pure water supply pipe 52 is arranged next to the tip surface 31 of the ultrasonic transducer 30 in the X-axis direction. The aqueous layer forming unit 50 includes the surface 201 of the workpiece 200 and the tip surface of the ultrasonic transducer 30 held on the holding surface 11 of the chuck table 10 when the ultrasonic transducer 30 irradiates the ultrasonic wave 300 from the tip surface 31. Pure water is supplied between the 31 and the water layer 51 to form an aqueous layer 51 between them.

The moving unit 40 is relatively parallel to the surface 201 of the workpiece 200 in which the chuck table 10, the cutting unit 20, and the ultrasonic transducer 30 are held on the holding surface 11 in the X-axis direction and the Y-axis direction. It is a means of transportation to move. The moving unit 40 indexes and feeds the X-axis moving unit 41, which is a machining feed unit that processes and feeds the chuck table 10 in the X-axis direction, and the cutting unit 20 and the ultrasonic transducer 30 in the Y-axis direction orthogonal to the X-axis direction. A Y-axis moving unit 42, which is an indexing feed unit, and a cutting feed unit that cuts and feeds the cutting unit 20 and the ultrasonic transducer 30 in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction. A certain Z-axis moving unit 43 and a rotational moving unit 44 that rotates the chuck table 10 around an axis parallel to the Z-axis direction are provided at least.

The X-axis moving unit 41 moves the chuck table 10 and the rotary moving unit 44 in the X-axis direction, which is the machining feed direction, so that the chuck table 10, the cutting unit 20, and the ultrasonic transducer 30 are relative to each other in the X-axis direction. Move to. The Y-axis moving unit 42 moves the cutting unit 20 and the ultrasonic transducer 30 in the Y-axis direction, which is the indexing feed direction, so that the chuck table 10 and the cutting unit 20 and the ultrasonic transducer 30 are relative to each other in the Y-axis direction. Move to.

The Z-axis moving unit 43 moves the cutting unit 20 and the ultrasonic transducer 30 in the Z-axis direction, which is the cutting feed direction, so that the chuck table 10 and the cutting unit 20 and the ultrasonic transducer 30 are relative to each other in the Z-axis direction. Move to. The rotary movement unit 44 supports the chuck table 10 and rotates around the axis, and the X-axis movement unit 41 moves together with the chuck table 10 in the X-axis direction.

The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 include a well-known ball screw rotatably provided around the axis, a well-known motor for rotating the ball screw around the axis, and a chuck table 10. Alternatively, it is provided with a well-known guide rail that movably supports the cutting unit 20 and the ultrasonic transducer 30 in the X-axis direction, the Y-axis direction, or the Z-axis direction.

Further, the cutting device 1 has an X-axis direction position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, and an illustration for detecting the positions of the cutting unit 20 and the ultrasonic transducer 30 in the Y-axis direction. The Y-axis direction position detection unit is provided, and the Z-axis direction position detection unit for detecting the Z-axis position of the cutting unit 20 and the ultrasonic transducer 30 is provided. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulse of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit control the positions of the chuck table 10 in the X-axis direction, the cutting unit 20 and the ultrasonic transducer 30 in the Y-axis direction or the Z-axis direction. Output to unit 100. In the first embodiment, the positions of the chuck table 10, the cutting unit 20, and the ultrasonic transducer 30 of the cutting device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are based on predetermined reference positions (not shown). It is decided.

As shown in FIGS. 1 and 3, the control unit 100 includes a pulse generating unit 101, a receiving unit 102, and an imaging unit 103. The pulse generating unit 101 generates a pulsed voltage having the frequency described above, and applies the generated pulsed voltage to the piezoelectric vibrator of the ultrasonic transducer 30 to hold the workpiece 200 held on the holding surface 11. The ultrasonic wave 300 is transmitted from the tip surface 31 of the ultrasonic transducer 30 facing the surface 201 of the above. The ultrasonic waves 300 transmitted from the tip surface 31 pass through the water layer 51 formed by the water layer forming unit 50. In this way, as shown in FIG. 3, the ultrasonic transducer 30 and the pulse generating unit 101 are held from the surface 201 side of the workpiece 200 held on the chuck table 10 via the dicing tape 206 with respect to the workpiece 200. It constitutes an ultrasonic wave generation unit 32 that emits ultrasonic waves 300.

The receiving unit 102 has a voltage corresponding to the reflected wave 301 (shown in FIGS. 2 and 4) of the ultrasonic wave 300 transmitted from the tip surface 31 of the ultrasonic transducer 30 of the ultrasonic wave generating unit 32 and received from the ultrasonic transducer 30. The signal is received from the ultrasonic transducer 30, the received voltage signal is amplified, and the signal is output to the imaging unit 103. The ultrasonic wave 300 transmitted from the tip surface 31 and transmitted through the water layer 51 is reflected at the interface where the acoustic impedance changes, and the intensity of the reflected wave 301 becomes stronger at the interface where the difference in acoustic impedance is larger.

In the first embodiment, the ultrasonic wave 300 is the front surface 201 of the workpiece 200 which is the interface between the aqueous layer 51 and the workpiece 200 and the back surface 201 of the workpiece 200 which is the interface between the workpiece 200 and the dicing tape 206. Reflected from 204. As shown in FIG. 4, the ultrasonic transducer 30 includes a reflected wave 301 from the front surface 201 of the ultrasonic wave 300 (hereinafter referred to as reference numeral 301-1) and a reflected wave 301 from the back surface 204 of the ultrasonic wave 300 (hereinafter referred to as reference numeral 301-1). (Indicated by reference numeral 301-2) and. The horizontal axis of FIG. 4 indicates the time elapsed since the ultrasonic wave 300 was transmitted from the ultrasonic transducer 30, and indicates that the time elapses toward the right side in the figure. Further, the vertical axis of FIG. 4 indicates the intensity of the reflected wave 301 received by the ultrasonic transducer 30, and indicates that the intensity increases toward the upper side in the figure.

The receiving unit 102 responds to the voltage signal corresponding to the reflected wave 301-1 of the ultrasonic wave 300 from the front surface 201 of the workpiece 200 and the reflected wave 301-2 of the ultrasonic wave 300 from the back surface 204 of the workpiece 200. The voltage signal is received from the ultrasonic transducer 30. In this way, as shown in FIG. 3, the ultrasonic transducer 30 and the receiving unit 102 receive the reflected wave 301 of the ultrasonic wave 300 reflected from the workpiece 200 held on the chuck table 10 via the dicing tape 206. The ultrasonic wave receiving unit 33 is configured. Further, the ultrasonic wave generating unit 32 and the ultrasonic wave receiving unit 33 constitute an ultrasonic wave unit 34 as shown in FIG. Therefore, the machined groove detection device 2 according to the first embodiment includes an ultrasonic unit 34.

The imaging unit 103 images the reflected wave 301 of the ultrasonic wave 300 from the back surface 204 side of the workpiece 200 received by the ultrasonic wave receiving unit 33 as a shade according to the intensity. That is, the control unit 100 including the imaging unit 103 images the reflected wave 301 of the ultrasonic wave 300 from the back surface 204 side of the workpiece 200 received by the ultrasonic wave receiving unit 33 as a shade according to the intensity. It is a conversion unit. The imaging unit 103 images the reflected wave 301 as a shade according to the intensity to form the image 400 shown in FIG. The imaging unit 103 receives a voltage signal from the receiving unit 102. The voltage signal received by the imaging unit 103 from the receiving unit 102 is defined by the gradation of a plurality of stages (for example, 256 stages) of the magnitude of the voltage value. The voltage value of the voltage signal received from the receiving unit 102 to the imaging unit 103 is defined at the stage corresponding to the intensity of the reflected wave 301. The stronger the intensity of the reflected wave 301, the higher the voltage value and the higher the intensity of the reflected wave 301. The weaker it is, the lower the voltage value is specified. The imaging unit 103 determines the voltage value of the voltage signal at each position in the X-axis direction and the Y-axis direction of the workpiece 200 based on the voltage signal received from the receiving unit 102 and the detection result of each position detection unit. An image 400 showing the intensity as a shade, that is, an image 400 having a shade is formed. In the first embodiment, the image 400 displays the position where the voltage value is high lighter than the position where the voltage value is weak. In FIG. 5, the shading of the image 400 is omitted.

The machining groove detection device 2 divides the workpiece 200 and the ultrasonic transducer 30 in a state where the aqueous layer 51 is formed between the surface 201 and the tip surface 31 of the workpiece 200 on which the cutting groove 207 is formed. By irradiating the ultrasonic wave 300 from the tip surface 31 of the ultrasonic transducer 30 while relatively moving along the planned line 202 and receiving the reflected wave of the ultrasonic wave 300, the imaging unit 103 of the workpiece 200 An image 400 including each cutting groove 207 on the back surface 204 side is generated, and the state of both edges of the cutting groove 207 on the back surface 204 side is detected.

Further, the control unit 100 controls each component of the cutting device 1 and the machined groove detecting device 2 to cause the cutting device 1 to perform a machining operation on the workpiece 200, and also causes the cutting device 1 to perform a machining operation on the workpiece 200, and the back surface of the cutting groove 207. The machined groove detection device 2 is made to perform the detection operation of the state of both edges on the 204 side. The control unit 100 is an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and input / output. It is a computer having an interface device. The arithmetic processing unit of the control unit 100 executes arithmetic processing according to a computer program stored in the storage device, and transmits a control signal for controlling the cutting apparatus 1 and the machining groove detection apparatus 2 via the input / output interface apparatus. Is output to each component of the cutting device 1 and the machined groove detection device 2.

The functions of the pulse generating unit 101, the receiving unit 102, and the imaging unit 103 are realized by the arithmetic processing unit executing the computer program stored in the storage device. Further, in the present invention, the pulse generating unit 101, the receiving unit 102, and the imaging unit 103 are dedicated processing circuits (hardware) such as a single circuit, a composite circuit, a programmed processor, or a parallel programmed processor. It may be configured. In particular, the pulse generating unit 101 and the receiving unit 102 may be configured by a dedicated processing circuit (hardware) such as a single programmed processor.

The control unit 100 includes a display unit 110 composed of a liquid crystal display device that displays a processing operation status, an image, and the like, an input unit 111 that is used by the operator when registering processing content information, and a notification unit that notifies the operator. It is connected to 112. The input unit 111 is composed of at least one of a touch panel provided on the display unit 110 and an external input device such as a keyboard. The notification unit 112 emits at least one of sound and light to notify the operator.

Further, the cutting apparatus 1 according to the first embodiment includes a cleaning unit 60 for cleaning the workpiece 200 after cutting, and a transfer unit (not shown) for transporting between the chuck table 10 and the cleaning unit 60. The cleaning unit 60 is located on the surface 201 side of the spinner table 61, which is a holding means for sucking and holding the workpiece 200 via the dicing tape 206, and the workpiece 200, which is sucked and held by the spinner table 61 rotating around the axis. A cleaning liquid supply nozzle 62 for supplying and cleaning the cleaning liquid is provided.

(Machining operation of cutting equipment)
When starting the machining operation of the cutting device 1, the operator registers the machining content information in the control unit 100 and places the workpiece 200 before cutting on the holding surface 11 of the chuck table 10. After that, the cutting device 1 starts the machining operation when the operator gives an instruction to start the machining operation. When the cutting device 1 starts the machining operation, the back surface 204 side is sucked and held by the holding surface 11 of the chuck table 10 via the dicing tape 206, and the annular frame 205 is clamped by the clamp portion 12.

In the machining operation, in the cutting device 1, the X-axis moving unit 41 moves the chuck table 10 toward the machining region, the imaging unit photographs the workpiece 200, and the imaging unit captures and obtains an image. Based on this, the alignment is performed. The cutting device 1 cuts the cutting blade 21 into each planned division line 202 until it reaches the dicing tape 206 while relatively moving the workpiece 200 and the cutting unit 20 along the planned division line 202. A cutting groove 207 is formed in the workpiece 200 along the planned division line 202, and the workpiece 200 is divided into individual devices 203. When forming the cutting groove 207, as shown in FIG. 5, the cutting device 1 lacks (also referred to as chipping) 208 and both edges of the cutting groove 207 on the front surface 201 and the back surface 204 of the workpiece 200, respectively. Cracks 209 may be formed. Note that FIG. 5 shows chips 208 and cracks 209 formed on both edges of the cutting groove 207 on the back surface 204 side.

The cutting device 1 forms a cutting groove 207 on all scheduled division lines 202, and when the workpiece 200 is divided into individual devices 203, the machining groove detection device 2 causes the machining groove detection device 2 to be on the back surface 204 side of the cutting groove 207 of the workpiece 200. Detects the condition of both edges. The cutting device 1 is an ultrasonic wave above the cutting groove 207 formed on the surface 201 of the workpiece 200 whose machining groove detection device 2 is held on the chuck table 10 by the X-axis moving unit 41 and the Y-axis moving unit 42. The transducer 30 is positioned, and the ultrasonic transducer 30 is positioned at a position in the Z-axis direction in which the ultrasonic wave 300 transmitted from the front end surface 31 by the Z-axis moving unit 43 converges on the back surface 204. In the cutting device 1, the machining groove detection device 2 holds the surface 201 of the workpiece 200 and the tip surface 31 of the ultrasonic transducer 30 held on the chuck table 10 through the opening at the tip of the pure water supply pipe 52 of the water layer forming unit 50. Pure water is supplied between the two to form the aqueous layer 51.

The tip surface of the cutting device 1 is such that the machining groove detection device 2 relatively moves the workpiece 200 and the ultrasonic transducer 30 along the planned division line 202 by the X-axis moving unit 41 and the Y-axis moving unit 42. The ultrasonic wave 300 is transmitted from 31 and the reflected wave 301 is received by the ultrasonic transducer 30 to detect the state of the back surface 204 side of each scheduled division line 202. In the first embodiment, when the cutting device 1 detects the state of the back surface 204 side of one scheduled division line 202, it emits ultrasonic waves 300 and receives the reflected wave 301 along each scheduled division line 202. The work piece 200 is made by repeating moving the ultrasonic transducer 30 over the entire length in the X-axis direction and moving the ultrasonic transducer 30 in the Y-axis direction a predetermined distance with respect to each scheduled division line 202 a plurality of times. Receives the reflected wave 301 from the back surface 204 of the.

In the first embodiment, the imaging unit 103 of the machined groove detection device 2 shows an example in FIG. 5 based on the detection result of each position detection unit and the voltage signal of the reflected wave 301 received and amplified by the receiving unit 102. Generate image 400. In the first embodiment, the imaging unit 103 forms an image 400 having a shade that becomes brighter as the voltage signal of the reflected wave 301 becomes higher and becomes darker as the voltage signal becomes lower. That is, the image 400 is an image in which the shade changes according to the intensity of the reflected wave 301 of the ultrasonic wave 300 on the back surface 204 side of the workpiece 200. Further, the ultrasonic wave 300 is reflected at the interface where the acoustic impedance changes, and the intensity of the reflected wave 301 becomes stronger at the interface where the difference in acoustic impedance is larger. The reflected wave 301 from the crack 209 becomes stronger. Therefore, the image 400 formed by the imaging unit 103 displays the chipped 208 and the crack 209 brighter than the other parts.

When the machined groove detection device 2 forms an image 400 including both edges on the back surface 204 side of the cutting groove 207 of all the scheduled division lines 202 of the work piece 200, the formed image 400 is stored in the storage device and the image 400 is stored. The detection of the state of both edges on the back surface 204 side of the cutting groove 207 of the workpiece 200 is completed. In the first embodiment, the machined groove detection device 2 stores the formed image 400 in the storage device in association with the work piece 200. In this way, the machining groove detection device 2 transmits the ultrasonic wave 300 so that the ultrasonic transducer 30 of the ultrasonic wave generation unit 32 converges the ultrasonic wave 300 on the back surface 204 side of the cutting groove 207 formed in the workpiece 200. Then, the imaging unit 103 forms an image 400 whose shading changes based on the intensity of the reflected wave 301 of the ultrasonic wave 300 on the back surface 204 side of the workpiece 200, and forms both edges of the cutting groove 207 on the back surface 204 side. Detect the condition.

The control unit 100 of the machining groove detection device 2 according to the first embodiment displays the formed image 400 on the display unit 110, receives an operator's operation from the input unit 111, and displays the workpiece 200 on the display unit 110. The position of may be changed. Further, the control unit 100 of the machined groove detection device 2 according to the first embodiment extracts chips 208 and cracks 209 from the formed image 400, and determines the quality of each workpiece 200 based on their sizes and the like. You may judge. Further, when it is determined that the workpiece 200 is defective, the notification unit 112 may be operated to notify the operator.

When the cutting device 1 finishes detecting the state of both edges of the cutting groove 207 of the workpiece 200 on the back surface 204 side, the cutting apparatus 1 moves the workpiece 200 divided into the individual devices 203 toward the loading / unloading region. , The suction holding of the holding surface 11 and the clamping of the clamp portion 12 are released in the carry-in / out area. The cutting device 1 finishes the machining operation after transporting the workpiece 200 to the cleaning unit 60 by the transport unit.

As described above, the machining groove detection device 2 according to the first embodiment has transmitted ultrasonic waves 300 to the work piece 200 and the chuck table 10 for holding the work piece 200 and reflected the ultrasonic waves from the work piece 200. An ultrasonic unit 34 that receives the reflected wave 301 of the ultrasonic wave 300, a moving unit 40 that relatively moves the chuck table 10 and the ultrasonic transducer 30 in the X-axis direction and the Y-axis direction, and an aqueous layer forming unit 50. To be equipped. Therefore, the machining groove detection device 2 forms a water layer 51 between the workpiece 200 and the tip surface 31 of the ultrasonic transducer 30, and divides the chuck table 10 and the ultrasonic transducer 30 into the planned division line 202. By transmitting the ultrasonic wave 300 while moving it relatively and receiving the reflected wave 301, the intensity of the reflected wave 301 of the ultrasonic wave 300 from the back surface 204 of the workpiece 200 can be acquired.

Further, since the machined groove detection device 2 includes an imaging unit 103 that forms an image 400 having a shade corresponding to the intensity and images the intensity of the reflected wave 301 of the ultrasonic wave 300, the back surface 204 of the cutting groove 207. It is possible to grasp the chipping 208 and the crack 209 generated on both edges on the side. As a result, the machining groove detection device 2 sucks and holds the workpiece 200 on the chuck table 10 via the dicing tape 206, and the chipping that occurs on both edges of the cutting groove 207 of the workpiece 200 on the back surface 204 side. Since the 208 and the crack 209 can be grasped, the man-hours related to the observation on the back surface 204 side can be suppressed, and the chipping 208 and the crack 209 on the back surface 204 side of the workpiece 200 can be easily grasped.

Further, since the cutting device 1 according to the first embodiment includes the machined groove detecting device 2 described above, the work piece 200 is cut while the work piece 200 is sucked and held on the chuck table 10 via the dicing tape 206. It is possible to grasp the chips 208 and cracks 209 generated on both edges of the groove 207 on the back surface 204 side, and it is possible to easily grasp the chips 208 and cracks 209 on the back surface 204 side of the workpiece 200.

[Embodiment 2]
The machined groove detection device according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a perspective view showing a configuration example of the machined groove detection device according to the second embodiment. In FIG. 6, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 6, the machined groove detection device 2-2 according to the second embodiment is provided with a chuck table 10, an ultrasonic unit 34, a moving unit 40, and the chuck table 10 without being provided in a machined device such as a cutting device 1. It includes an aqueous layer forming unit 50 and an imaging unit 103. In the machined groove detection device 2-2 according to the second embodiment, the water layer forming unit 50 forms the water layer 51 between the workpiece 200 and the tip surface 31 of the ultrasonic transducer 30, and the moving unit 40 chucks. The ultrasonic unit 34 transmits the ultrasonic wave 300 and receives the reflected wave 301 while moving the table 10 and the ultrasonic transducer 30 relatively to the planned division line 202, so that the ultrasonic unit 200 is superimposed from the back surface 204 of the workpiece 200. The intensity of the reflected wave 301 of the ultrasonic wave 300 is acquired.

The machined groove detection device 2-2 according to the second embodiment sucks and holds the work piece 200 on the chuck table 10 via the dicing tape 206, and both edges of the work piece 200 on the back surface 204 side of the cutting groove 207. The chip 208 and the crack 209 generated in the above can be grasped, and the effect is that the chip 208 and the crack 209 on the back surface 204 side of the workpiece 200 can be easily grasped as in the first embodiment.

The present invention is not limited to the above embodiment. That is, it can be modified in various ways without departing from the gist of the present invention. In the above-described first embodiment, an example in which the cutting device 1 is provided with the machining groove detection device 2 is shown as the machining device, but in the present invention, the machining device provided with the machining groove detection device 2 is limited to the cutting device 1. Instead, for example, a laser processing apparatus may be used in which the workpiece 200 is irradiated with a laser beam having a wavelength having absorbency to perform laser processing (ablation processing) of the workpiece 200. That is, the machined groove detection device 2 of the present invention may detect, for example, a laser machined groove without being limited to the cutting groove 207 as the machined groove. Further, in the present invention, the machining groove detection device 2 is not limited to detecting the machining groove of the workpiece 200 which is suction-held by the chuck table 10, for example, suction-holding by the spinner table 61 of the cleaning unit 60. The machined groove of the workpiece 200 after cleaning may be detected. Further, in the present invention, the ultrasonic unit 34 arranges a plurality of ultrasonic transducers 30 in the Y-axis direction, and moves the plurality of ultrasonic transducers 30 relatively once in the X-axis direction with respect to each planned division line 202. Alternatively, chipping 208 and crack 109 on both edges on the back surface 204 side of the cutting groove 207 may be detected.

1 Cutting equipment (processing equipment)
2,2-2 Machining groove detection device (detection means)
10 Chuck table (holding means)
20 Cutting unit (cutting means)
21 Cutting blade 32 Ultrasonic wave generation unit 33 Ultrasonic wave receiving unit 34 Ultrasonic wave unit 40 Moving unit (moving means)
50 Water layer formation unit 51 Water layer 100 Control unit (imaging unit)
200 Work piece 201 Front surface 204 Back surface 206 Dicing tape 207 Cutting groove (machined groove)
300 Ultrasonic waves 301, 301-1, 301-2 Reflected waves X, Y Direction parallel to the surface

Claims (3)

A machining groove detection device that detects a machining groove formed on a work piece to which a dicing tape is attached on the back surface side.
A holding means for holding the work piece and
An ultrasonic generation unit that transmits ultrasonic waves to the work piece from the surface side of the work piece held by the holding means via the dicing tape, and ultrasonic waves reflected from the work piece ( An ultrasonic unit equipped with an ultrasonic receiving unit that receives reflected waves) and
A moving means for moving the holding means and the ultrasonic unit relatively in a direction parallel to the surface of the workpiece, and a moving means.
An aqueous layer forming means for forming an aqueous layer between the workpiece and the ultrasonic unit,
An imaging unit that images as shading according to the intensity of the reflected wave received by the ultrasonic receiving unit, and an imaging unit.
Including
The ultrasonic wave generation unit transmits ultrasonic waves so that the ultrasonic waves converge on the back surface side of the processing groove formed in the workpiece.
A machined groove detection device, characterized in that the state of the back side of the machined groove is detected based on the reflected wave intensity of ultrasonic waves on the back side of the work piece. A chuck table that holds the work piece and
A cutting means provided with a cutting blade for cutting a work piece held on the chuck table, and
A detecting means for detecting a cutting groove formed by the cutting means and
It is a cutting device equipped with
The cutting device according to claim 1, wherein the detecting means is the machined groove detecting device. The cutting apparatus according to claim 2, wherein the chuck table is the holding means according to claim 1.

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