JP2021068668A - Power storage device - Google Patents

Abstract

To provide a power storage device capable of mitigating a labor required to replace a temperature sensor.SOLUTION: A power storage device 1 includes a power storage module 4A and a power storage module 4B, a conductive plate 5 which is interposed between the power storage module 4A and the power storage module 4B to electrically connect the power storage module 4A and the power storage module 4B, a temperature sensor 53, and a connecting member 52 extending from the conductive plate 5. Each of the power storage module 4A and the power storage module 4B has an electrode laminate 11 including a plurality of bipolar electrodes, and a sealant 12 that seals the electrode laminate 11. An accommodating space W for accommodating the conductive plate 5 is formed by the sealant 12 of the power storage module 4A and the sealant 12 of the power storage module 4B between the power storage module 4A and the power storage module 4B. The connecting member 52 extends to the outside of the accommodating space W, and the temperature sensor 53 is connected to the connecting member 52 outside the accommodating space W to measure the temperature of the conductive plate 5.SELECTED DRAWING: Figure 4

Description

One aspect of the present invention relates to a power storage device.

As a conventional power storage device, a power storage device including a plurality of bipolar batteries (storage modules) stacked via a conductive layer is known (see Patent Document 1). Each power storage module includes a laminate formed by laminating a plurality of bipolar electrodes via a separator. On the side surface of the laminated body, a sealing body for sealing between the bipolar electrodes adjacent to each other in the stacking direction is provided, and the electrolytic solution is housed in the internal space formed between the bipolar electrodes.

JP-A-2007-122977

In the power storage device as described above, the state of the power storage module may be monitored by measuring the temperature of the power storage module. When the temperature of the power storage module is monitored as the state of the power storage module, the temperature of the laminate of bipolar electrodes in the power storage module is measured. In this case, the temperature sensor is generally attached directly to the laminate. On the other hand, in the power storage device, a space surrounded by the sealing body is formed, and the laminated body is exposed only in the space and not exposed to the outside. Therefore, the temperature sensor is located in the space. Therefore, for example, when the temperature sensor is replaced due to a failure of the temperature sensor or the like, it takes time and effort to disassemble a plurality of stacked power storage modules.

One aspect of the present invention is to provide a power storage device capable of reducing the time and effort required to replace the temperature sensor.

The power storage device according to one aspect of the present invention is interposed between the first power storage module and the second power storage module and the first power storage module and the second power storage module stacked along the first direction, and is the first power storage module. Along the second direction intersecting the first direction, the conductive plate for electrically connecting the second power storage module and the temperature sensor for measuring the temperature of the first power storage module and the temperature of the second power storage module. Each of the first storage module and the second storage module includes an electrode laminate including a plurality of bipolar electrodes laminated along the first direction, and an electrode laminate, which includes an extending portion extending from the conductive plate. There is a sealing body for sealing the first storage module and a second storage module, and a storage space for accommodating the conductive plate is provided between the first storage module and the second storage module to seal the first storage module and the second storage module. Formed by a stop, the extension extends outside the accommodation space, and the temperature sensor is connected to the extension outside the accommodation space.

In this power storage device, the extending portion extends from the conductive plate that electrically connects the first power storage module and the second power storage module to the outside of the accommodation space. Therefore, the heat of the first power storage module and the heat of the second power storage module are propagated to the outside of the accommodation space by the conductive plate and the extending portion. As a result, the temperature sensor can measure the temperature of the first power storage module and the temperature of the second power storage module via the conductive plate and the extending portion outside the accommodation space. Therefore, according to this power storage device, it is possible to obtain the temperature of the first power storage module and the temperature of the second power storage module from outside the accommodation space without directly attaching the temperature sensor to the electrode laminate. As a result, when it becomes necessary to replace the temperature sensor due to, for example, a failure of the temperature sensor, the temperature sensor can be attached and detached outside the accommodation space. Therefore, the temperature sensor can be replaced while maintaining the stacked state of the first power storage module and the second power storage module. As described above, it is possible to reduce the time and effort required to replace the temperature sensor.

The power storage device may further include a heat conductor that connects the extending portion and the temperature sensor. The heat conductor may be detachably provided on the extending portion. In this case, the temperature sensor can be replaced together with the heat conductor by attaching and detaching the heat conductor to the extending portion. Therefore, it is possible to prevent the temperature sensor from being damaged when the temperature sensor is replaced.

The extending portion may have a grip portion that grips the heat conductor in a detachable manner. In this case, the temperature sensor can be replaced together with the heat conductor by attaching and detaching the heat conductor by the grip portion of the extending portion. Therefore, it is possible to realize a configuration in which damage to the temperature sensor can be avoided when the temperature sensor is replaced.

The power storage device is equipped with an electronic component for monitoring the temperature of the first power storage module and the temperature of the second power storage module, a temperature sensor, a heat conductor, an electronic component, a temperature sensor, and a heat conductor. A printed circuit board having a wiring board portion including a main surface and a printed circuit board may be further provided. In this case, the electronic component for monitoring the temperature of the first power storage module and the temperature of the second power storage module and the temperature sensor can be integrated by using the wiring board portion of the printed circuit board.

The thermal conductor may have a conductive portion that contacts the extending portion and an insulating portion that contacts the temperature sensor. In this case, the insulation between the temperature sensor and the conductive plate can be improved.

The insulating portion may be an insulating member made of a resin in the printed circuit board. The conductive portion may be a conductor pattern formed on the insulating member. The conductive portion may include a portion that overlaps with the temperature sensor when viewed from a direction orthogonal to the main surface. In this case, since the heat of the first power storage module and the heat of the second power storage module are easily propagated to the temperature sensor, it is possible to improve the measurement accuracy of the temperature of the first power storage module and the temperature of the second power storage module by the temperature sensor.

The power storage device may further include a covering portion arranged on the main surface of the wiring board portion. The electronic component may include a heat-generating component that generates heat when energized. The covering portion may cover one of the heat generating component and the temperature sensor. For example, when heat from a heat generating component is transferred to the temperature sensor, the measurement result by the temperature sensor is affected by the heat, and a measurement error may occur. On the other hand, since the covering portion covers one of the heat generating component and the temperature sensor, the space where the temperature sensor is arranged and the space where the heat generating component is arranged are separated. As a result, heat transfer from the heat generating component to the temperature sensor is hindered, so that the measurement error can be reduced.

The power storage device may further include a heat insulating material that covers the heat conductor. In this case, since the measurement result by the temperature sensor is less likely to be affected by the external environment, the temperature of the first power storage module and the temperature of the second power storage module can be accurately measured by the temperature sensor.

According to one aspect of the present invention, it is possible to reduce the time and effort required to replace the temperature sensor.

FIG. 1 is a schematic perspective view showing a power storage device according to an embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. FIG. 3 is a schematic cross-sectional view showing the internal configuration of the power storage module shown in FIG. FIG. 4 is an enlarged view of a part of the cross section shown in FIG. FIG. 5 is a diagram for explaining a method of attaching the temperature sensor unit to the connecting member. FIG. 6 is a diagram showing a temperature sensor unit according to a modified example. FIG. 7 is a schematic perspective view showing a power storage device according to another embodiment. FIG. 8A is an enlarged view of the slot shown in FIG. 7. FIG. 8B is a developed view of the joining member shown in FIG. 8A. FIG. 9 is a diagram for explaining a monitoring board. FIG. 10 is a cross-sectional view taken along the line XX of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are used for the same or equivalent elements, and duplicate description is omitted.

FIG. 1 is a schematic perspective view showing a power storage device according to an embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. The power storage device 1 shown in FIGS. 1 and 2 is used as a battery for various vehicles such as forklifts, hybrid vehicles, and electric vehicles. The power storage device 1 includes a module laminate 2, a restraint member 3, and a monitoring device 50.

The module laminate 2 includes a plurality of (five in this embodiment) power storage modules 4 and a plurality of (six in this embodiment) conductive plates 5. The plurality of power storage modules 4 are stacked (arranged) along the stacking direction D1 (first direction). The power storage module 4 is a bipolar battery and has a rectangular shape when viewed from the stacking direction D1. The power storage module 4 is, for example, a secondary battery such as a nickel hydrogen secondary battery and a lithium ion secondary battery, or an electric double layer capacitor. In the following description, a nickel-metal hydride secondary battery will be illustrated.

Two power storage modules 4 adjacent to each other in the stacking direction D1 sandwich a conductive plate 5 and are electrically connected to each other via the conductive plate 5. The conductive plates 5 are arranged between two power storage modules 4 adjacent to each other in the stacking direction D1 and on the outer surface of the power storage modules 4 located at the stacking ends. The positive electrode terminal 6 is connected to the conductive plate 5 arranged on the outer surface of the power storage module 4 located at the lower end of the stack. The negative electrode terminal 7 is connected to the conductive plate 5 arranged on the outer surface of the power storage module 4 located at the upper end of the stack. The positive electrode terminal 6 and the negative electrode terminal 7 are drawn out from the edge of the conductive plate 5 in the direction D2 (second direction) intersecting (orthogonal) with the stacking direction D1. The positive electrode terminal 6 and the negative electrode terminal 7 charge and discharge the power storage device 1.

The conductive plate 5 is provided with a plurality of flow paths 5a. The flow path 5a is a through hole for passing a refrigerant such as air. The flow path 5a penetrates the conductive plate 5 in the direction D3 which intersects (orthogonally) the stacking direction D1 and the direction D2, respectively, and extends along the direction D3. The plurality of flow paths 5a are arranged along the direction D2. The conductive plate 5 at the upper end of the lamination and the conductive plate 5 at the lower end of the lamination may not be provided with the flow path 5a. The conductive plate 5 has a plurality of (two in this embodiment) convex portions 5b. The convex portions 5b project in the direction D2 at both ends of the conductive plate 5 in the direction D2. The number of the convex portions 5b may be one, and in this case, the conductive plate 5 has only the convex portion 5b at one end on the monitoring device 50 side. The convex portion 5b extends along the direction D3, for example.

The conductive plate 5 includes a wall portion 5c (see FIG. 4) and a wall portion 5d (see FIG. 4) facing each other in the stacking direction D1, and a plurality of partition walls 5e (see FIG. 4) connecting the wall portions 5c and the wall portion 5d. , Is equipped. The partition wall 5e is erected between the wall portion 5c and the wall portion 5d. A plurality of flow paths 5a are defined by the wall portion 5c, the wall portion 5d, and the plurality of partition walls 5e.

The conductive plate 5 has a function as a connecting member for electrically connecting two power storage modules 4 adjacent to each other in the stacking direction D1, and is generated in the power storage module 4 by flowing a refrigerant through these flow paths 5a. It also has a function as a heat sink that releases the generated heat. The area of the conductive plate 5 as seen from the stacking direction D1 is smaller than the area of the power storage module 4.

The restraint member 3 is a member that applies a restraint load to the module laminate 2 in the stacking direction D1. The restraint member 3 includes a pair of end plates 8 that sandwich the module laminate 2 in the stacking direction D1, and a fastening bolt 9 and a nut 10 that fasten the pair of end plates 8 to each other. The end plate 8 is a rectangular metal plate having an area one size larger than the area of the power storage module 4 and the conductive plate 5 as viewed from the stacking direction D1. An insulating plate F having electrical insulation is provided on the inner surface of the end plate 8. The insulating plate F insulates between the end plate 8 and the conductive plate 5.

An insertion hole 8a is provided at the edge of the end plate 8 at a position outside the module laminate 2 in the direction D3. The fastening bolt 9 is passed from the insertion hole 8a of one end plate 8 toward the insertion hole 8a of the other end plate 8, and is attached to the tip portion of the fastening bolt 9 protruding from the insertion hole 8a of the other end plate 8. , The nut 10 is screwed. As a result, the power storage module 4 and the conductive plate 5 are sandwiched by the pair of end plates 8 to be unitized as the module laminate 2, and a restraining load is applied to the module laminate 2 in the stacking direction D1.

The monitoring device 50 is a device that monitors the module laminate 2. For example, the monitoring device 50 monitors the status of the plurality of power storage modules 4. Details of the monitoring device 50 will be described later.

Next, the configuration of the power storage module 4 will be described in detail. FIG. 3 is a schematic cross-sectional view showing the internal configuration of the power storage module shown in FIG. As shown in FIG. 3, each of the plurality of power storage modules 4 includes an electrode laminate 11 and a sealant 12 that seals the electrode laminate 11. The electrode laminate 11 has a plurality of separators 13, a plurality of bipolar electrodes 14, a negative electrode terminal electrode 18, and a positive electrode terminal electrode 19. In the present embodiment, the stacking direction of the electrode laminated body 11 coincides with the stacking direction D1 of the module laminated body 2. The electrode laminate 11 has a side surface 11a extending in the stacking direction D1.

The separator 13 is formed in a sheet shape, for example. Examples of the separator 13 include a porous film made of a polyolefin resin such as polyethylene (PE) and polypropylene (PP), and a woven fabric or a non-woven fabric made of polypropylene and methyl cellulose. The separator 13 may be reinforced with a vinylidene fluoride resin compound. The separator 13 may have a bag shape.

The negative electrode terminal electrode 18, the plurality of bipolar electrodes 14, and the positive electrode terminal electrodes 19 (plurality of electrodes) are laminated in this order via the separator 13 along the stacking direction D1. Each of the plurality of bipolar electrodes 14 includes an electrode plate 15, a positive electrode 16, and a negative electrode 17. The electrode plate 15 is made of, for example, a metal foil made of nickel or a nickel-plated steel plate, and has a rectangular shape. The electrode plate 15 includes an upper surface 15a and a lower surface 15b opposite to the upper surface 15a. The peripheral edge portion 15c of the electrode plate 15 is an uncoated region in which the positive electrode active material and the negative electrode active material are not coated.

The positive electrode 16 is provided on the upper surface 15a of the electrode plate 15. The positive electrode 16 is a positive electrode active material layer formed by applying a positive electrode active material to the upper surface 15a. Examples of the positive electrode active material constituting the positive electrode 16 include nickel hydroxide. The negative electrode 17 is provided on the lower surface 15b of the electrode plate 15. The negative electrode 17 is a negative electrode active material layer formed by applying a negative electrode active material to the lower surface 15b. Examples of the negative electrode active material constituting the negative electrode 17 include a hydrogen storage alloy. In the present embodiment, the formation region of the negative electrode 17 on the lower surface 15b of the electrode plate 15 is one size larger than the formation region of the positive electrode 16 on the upper surface 15a of the electrode plate 15.

In the electrode laminate 11, the positive electrode 16 of one bipolar electrode 14 faces the negative electrode 17 of one of the bipolar electrodes 14 adjacent to the stacking direction D1 with the separator 13 interposed therebetween. In the electrode laminate 11, the negative electrode 17 of one bipolar electrode 14 faces the positive electrode 16 of the other bipolar electrode 14 adjacent to the stacking direction D1 with the separator 13 interposed therebetween.

The negative electrode terminal electrode 18 is arranged at one end 11b of the electrode laminate 11 in the stacking direction D1. The negative electrode terminal electrode 18 includes an electrode plate 15 and a negative electrode 17 provided on the lower surface 15b of the electrode plate 15. The negative electrode 17 of the negative electrode terminal electrode 18 faces the positive electrode 16 of the bipolar electrode 14 located at one end in the stacking direction D1 via the separator 13. One of the conductive plates 5 adjacent to the power storage module 4 is in contact with the upper surface 15a of the electrode plate 15 of the negative electrode terminal electrode 18.

The positive electrode terminal electrode 19 is arranged at the other end 11c on the side opposite to one end 11b of the electrode laminate 11 in the stacking direction D1. The positive electrode terminal electrode 19 includes an electrode plate 15 and a positive electrode 16 provided on the upper surface 15a of the electrode plate 15. The positive electrode 16 of the positive electrode terminal electrode 19 faces the negative electrode 17 of the bipolar electrode 14 located at the other end of the stacking direction D1 via the separator 13. The other conductive plate 5 adjacent to the power storage module 4 is in contact with the lower surface 15b of the electrode plate 15 of the positive electrode terminal electrode 19.

The sealing body 12 is formed in a rectangular tubular shape, for example. The sealing body 12 is formed of an insulating resin material. Examples of the resin material constituting the sealing body 12 include polypropylene (PP), polyphenylene sulfide (PPS), modified polyphenylene ether (modified PPE), and the like. The sealing body 12 is provided around the electrode laminated body 11, forms an internal space V in the electrode laminated body 11, and seals the internal space V. Specifically, the sealing body 12 is configured to hold the peripheral edge portion 15c of the electrode plate 15 on the side surface 11a of the electrode laminated body 11 extending in the stacking direction D1 and to surround the side surface 11a. The sealing body 12 seals between two bipolar electrodes 14 adjacent to each other in the stacking direction D1.

The sealing body 12 has a plurality of primary sealing bodies 21 and a secondary sealing body 22. The primary sealing body 21 is continuously provided over the entire circumference (all sides) of the electrode plate 15 at the peripheral edge portion 15c (uncoated region) of the electrode plate 15. The secondary sealing body 22 is provided so as to surround the plurality of primary sealing bodies 21 from the outside. The secondary encapsulant 22 is provided around the electrode laminate 11 and the plurality of primary encapsulants 21 and constitutes an outer wall (housing) of the power storage module 4. The secondary encapsulant 22 is formed by injection molding of a resin, and is, for example, welded (bonded) to the end face of the primary encapsulant 21 on the outer edge side by heat during injection molding.

The secondary sealing body 22 has a tubular shape (annular shape) extending in the axial direction in the stacking direction D1. The secondary sealing body 22 extends along the stacking direction D1 over the entire length of the electrode laminated body 11. The secondary encapsulant 22 projects from each of one end 11b and the other end 11c of the electrode laminate 11 in the lamination direction D1. A storage space W is formed between the two power storage modules 4 adjacent to each other in the stacking direction D1 by the secondary sealant 22 of one power storage module 4 and the secondary sealant 22 of the other power storage module 4. ing. A conductive plate 5 is accommodated in each accommodation space W.

The secondary encapsulant 22, together with the primary encapsulant 21, is between two bipolar electrodes 14 adjacent to each other in the stacking direction D1, between the negative electrode termination electrodes 18 and the bipolar electrodes 14 adjacent to each other in the stacking direction D1, and , The positive electrode terminal 19 and the bipolar electrode 14 adjacent to each other in the stacking direction D1 are sealed. As a result, an airtightly partitioned internal space V is formed between the two bipolar electrodes 14, between the negative electrode terminating electrode 18 and the bipolar electrode 14, and between the positive electrode terminating electrode 19 and the bipolar electrode 14. Has been done. Each internal space V contains an electrolytic solution (not shown) composed of an alkaline aqueous solution such as an aqueous potassium hydroxide solution. The electrolytic solution is impregnated in the separator 13, the positive electrode 16 and the negative electrode 17.

Next, the configuration of the monitoring device 50 will be described in detail with reference to FIGS. 4 and 5. FIG. 4 is an enlarged view of a part of the cross section shown in FIG. FIG. 5 is a diagram for explaining a method of attaching the temperature sensor unit to the connecting member. 4 and 5 show two power storage modules 4 adjacent to each other in the stacking direction D1 and a conductive plate 5 interposed between the two power storage modules 4. For convenience of explanation, of the two power storage modules 4, the power storage module 4 (first power storage module) located on the upper side is referred to as "power storage module 4A", and the power storage module 4 (second power storage module) located on the lower side is referred to as "power storage module 4A". It may be referred to as "storage module 4B".

The monitoring device 50 includes a plurality of temperature sensor units 51 (three in the present embodiment) and a plurality of connecting members 52 (extending portions) having the same number as the temperature sensor units 51 and three in the present embodiment. , Is equipped.

The connecting member 52 is a temperature monitoring member and is a heat transfer member extending along the direction D2. The connecting member 52 may be a conductive member. The connecting member 52 is made of a material having thermal conductivity such as metal (for example, copper). As an example, the connecting member 52 is a metal plate. Each of the plurality of connecting members 52 is provided on the conductive plate 5 adjacent to the power storage module 4 to be detected among the plurality of conductive plates 5. Each of the plurality of connecting members 52 is provided on different conductive plates 5, and the conductive plate 5 provided with the connecting members 52 and the temperature sensor unit 51 (specifically, the temperature sensor 53) are thermally connected. To do.

The connecting member 52 extends from the conductive plate 5 along the direction D2 to the outside of the accommodation space W. The connecting member 52 includes a connecting piece 52a, an extension piece 52b, and a connecting portion 52c that connects the connection piece 52a and the extension piece 52b. The connecting piece 52a is an end portion of the connecting member 52 in the direction D2, and is bonded to the upper surface of the convex portion 5b by, for example, ultrasonic welding. The extending piece 52b is an end portion of the connecting member 52 opposite to the connecting piece 52a, and is arranged outside the accommodation space W. The connecting portion 52c connects the connecting piece 52a and the extending piece 52b in the direction D2. The connecting portion 52c includes one end and the other end. One end of the connecting portion 52c is connected to the connecting piece 52a. The connecting portion 52c extends from the connecting piece 52a along the direction D2, and extends out of the accommodation space W through the gap 22h of the two secondary sealing bodies 22 adjacent to each other in the stacking direction D1. Outside the accommodation space W, the other end of the connecting portion 52c is connected to the extension piece 52b.

A temperature sensor unit 51 is attached to the extension piece 52b. For this purpose, the extension piece 52b has a grip portion 52d. The gripping portion 52d grips the temperature sensor unit 51 (specifically, the gripped portion 54a of the heat conductive member 54 described later). The grip portion 52d sandwiches the gripped portion 54a in the direction D2. The grip portion 52d includes a straight portion 52e, a curved portion 52f, and a protruding portion 52g. The straight portion 52e extends upward from the other end of the connecting portion 52c along the stacking direction D1. The protruding portion 52g protrudes from the side opposite to the connecting portion 52c toward the straight traveling portion 52e. The curved portion 52f is connected to the upper end of the straight portion 52e in the stacking direction D1, is curved so as to be folded back from the upper end, and is connected to the protruding portion 52g.

The gripped portion 52d grips the gripped portion 54a by sandwiching the gripped portion 54a between the straight traveling portion 52e and the protruding portion 52g. When the gripped portion 54a is not gripped, the distance between the straight portion 52e and the protruding portion 52g is smaller than the thickness of the gripped portion 54a. In the state where the gripped portion 54a is not gripped, the straight portion 52e and the protruding portion 52g may be in contact with each other. When the gripped portion 54a is gripped, the distance between the straight traveling portion 52e and the protruding portion 52g is widened, so that an elastic force is generated in the gripped portion 52d so that the straight traveling portion 52e and the protruding portion 52g come close to each other. The grip portion 52d functions as a clip member that sandwiches and fastens the grip portion 54a by using a force.

The temperature sensor unit 51 is a unit for detecting the temperature of the power storage module 4. In the present embodiment, the power storage module 4 to be detected is a power storage module 4 located at the upper end of the stack, a power storage module 4 located at the lower end of the stack, and a power storage module 4 located at the center of the stack, and the temperature of these power storage modules 4 Three temperature sensor units 51 are provided to detect the above. The three temperature sensor units 51 are arranged outside the accommodation space W.

The temperature sensor unit 51 includes a temperature sensor 53, a heat conductive member 54 (heat conductor), and a case 55. The temperature sensor 53 detects (measures) the temperature of the power storage module 4 to be detected. An example of the temperature sensor 53 is a thermistor. The temperature sensor 53 is provided so as to be adjacent to the conductive plate 5 adjacent to the power storage module 4 to be detected in the direction D2. The temperature sensor 53 is provided on the heat conductive member 54. The temperature sensor 53 is thermally connected to the connecting member 52 via the heat conductive member 54 outside the accommodation space W.

The heat conductive member 54 is made of a material having heat conductivity such as metal (for example, copper). As an example, the heat conductive member 54 is a metal plate. The heat conductive member 54 thermally connects the connecting member 52 and the temperature sensor 53. In the present embodiment, the heat conductive member 54 is detachably provided on the connecting member 52. Specifically, the heat conductive member 54 has a gripped portion 54a and an installation portion 54b. The gripped portion 54a is gripped by the gripped portion 52d. A temperature sensor 53 is installed (joined) in the installation portion 54b. The heat conductive member 54 is formed by bending a rectangular metal plate so as to have a J shape, for example, and the gripped portion 54a and the installation portion 54b face each other. When the gripped portion 54a is gripped by the gripped portion 52d, the length of the installation portion 54b in the stacking direction D1 is larger than the length of the gripped portion 54a in the stacking direction D1.

The case 55 is provided so as to surround the extension piece 52b, the temperature sensor 53, and the heat conductive member 54. The case 55 insulates the extension piece 52b, the temperature sensor 53, and the heat conductive member 54. The case 55 is made of a heat-insulating material such as resin. In the present embodiment, the case 55 has a box shape that opens downward. The extension piece 52b, the temperature sensor 53, and the heat conductive member 54 are housed inside the case 55. An installation portion 54b is joined to the inner wall of the case 55.

The plurality of temperature sensor units 51 may be integrated. Specifically, the monitoring device 50 includes a plurality of temperature sensor units 51, a plurality of lead wires extending from each of the plurality of temperature sensors 53, and a plurality of harnesses (not shown) connected to the plurality of lead wires. A temperature measuring module having a, may be provided.

In the example of FIG. 4, the conductive plate 5 is in contact with the positive electrode terminal 19 of the power storage module 4A and the negative electrode terminal 18 of the power storage module 4B, and the connecting member 52 is joined to the conductive plate 5. Further, the connecting member 52 is thermally connected to the temperature sensor 53 by the heat conductive member 54. As described above, the electrode laminate 11 (positive electrode terminal 19) of the power storage module 4A and the electrode stack 11 (negative electrode terminal 18) of the power storage module 4B are interposed via the conductive plate 5, the connecting member 52, and the heat conductive member 54. It is thermally connected to the temperature sensor 53. Therefore, the temperature sensor 53 can measure the temperature of each power storage module 4 to be detected via the conductive plate 5, the connecting member 52, and the heat conductive member 54.

When attaching the temperature sensor unit 51 to the extension piece 52b of the connecting member 52, first, the temperature sensor unit 51 is pushed downward with the opening of the case 55 facing downward and the case 55 covering the extension piece 52b. .. Then, with the gripped portion 54a positioned below the extension piece 52b, the temperature sensor unit 51 is moved and gripped so that the gripped portion 54a is inserted between the straight traveling portion 52e and the protruding portion 52g. The portion 52d is made to grip the gripped portion 54a. As described above, the temperature sensor unit 51 is attached to the extension piece 52b, and the attachment of the temperature sensor unit 51 to the connecting member 52 is completed.

The operation and effect of the power storage device 1 described above will be described. In the power storage device 1, the connection member 52 extends from the conductive plate 5 that electrically connects the power storage module 4A and the power storage module 4B to the outside of the accommodation space W. Therefore, the heat of the power storage module 4A and the heat of the power storage module 4B are propagated to the outside of the accommodation space W by the conductive plate 5 and the connecting member 52. As a result, the temperature sensor 53 can measure the temperature of the power storage module 4A and the temperature of the power storage module 4B via the conductive plate 5 and the connecting member 52 outside the accommodation space W. Therefore, according to the power storage device 1, by utilizing the conductive plate 5, the temperature of the power storage module 4A and the temperature of the power storage module 4B can be measured from outside the accommodation space W without directly attaching the temperature sensor 53 to the electrode laminate 11. It becomes possible to obtain. As a result, when it becomes necessary to replace the temperature sensor 53 due to, for example, a failure of the temperature sensor 53, the temperature sensor 53 can be attached and detached outside the accommodation space W. Therefore, the temperature sensor 53 can be replaced while maintaining the stacked state of the power storage module 4A and the power storage module 4B. As described above, it is possible to reduce the time and effort required to replace the temperature sensor 53.

By the way, for example, when the temperature sensor 53 is directly attached to the connecting member 52, when the temperature sensor 53 is replaced, a force for separating the temperature sensor 53 from the connecting member 52 is applied to the temperature sensor, and the temperature sensor 53 There is a risk of damage. On the other hand, in the power storage device 1, a heat conductive member 54 that thermally connects the connecting member 52 and the temperature sensor 53 is detachably provided on the connecting member 52. Therefore, the temperature sensor 53 can be replaced together with the heat conductive member 54 by attaching and detaching the heat conductive member 54 to and from the connecting member 52. Therefore, when the temperature sensor 53 is replaced, the force for separating the temperature sensor 53 is not directly applied to the temperature sensor 53, so that the temperature sensor 53 can be prevented from being damaged.

The connecting member 52 has a grip portion 52d that grips the heat conductive member 54 in a detachable manner. Therefore, the temperature sensor 53 can be replaced together with the heat conductive member 54 by attaching and detaching the heat conductive member 54 by the grip portion 52d of the connecting member 52. Further, since the heat conductive member 54 has the gripped portion 54a and the gripped portion 52d has the straight traveling portion 52e and the protruding portion 52g that sandwich the gripped portion 54a, it is easy to simply insert and remove the gripped portion 54a into and from the gripped portion 52d. The heat conductive member 54 can be attached and detached by various operations.

Although one embodiment of the present invention has been described in detail above, the present invention is not limited to the above embodiment.

For example, the number of stacks of the power storage modules 4 included in the module stack 2 can be changed as appropriate. The module laminate 2 comprises two power storage modules 4 laminated along the stacking direction D1 and a conductive plate 5 interposed between the power storage modules 4 and electrically connecting the power storage modules 4. All you have to do is prepare.

The plurality of power storage modules 4 may be connected in parallel. The conductive plate 5 may not be provided with the flow path 5a. The conductive plate 5 may not be provided with the convex portion 5b. The connecting member 52 is not limited to a configuration in which the conductive plate 5 is bonded to the conductive plate 5 by ultrasonic welding. The connecting member 52 may be thermally connected to the conductive plate 5. The conductive plate 5 and the connecting member 52 may be composed of one component.

From the viewpoint of preventing corrosion due to contact between dissimilar metals, the heat conductive member 54 may be made of a metal of the same type as the metal constituting the connecting member 52 (copper in this embodiment), but is not limited thereto. The connecting member 52 and the heat conductive member 54 may be composed of a combination of dissimilar metals that are less likely to cause corrosion.

The temperature sensor unit 51 does not have to include the case 55. FIG. 6 is a diagram showing a temperature sensor unit 51 according to a modified example. As shown in FIG. 6, the temperature sensor unit 51 may include a heat insulating material 55A instead of the case 55. The heat insulating material 55A covers the extension piece 52b, the temperature sensor 53, and the heat conductive member 54. The heat insulating material 55A is made of, for example, a resin. As an example, the heat insulating material 55A is formed by potting a resin. In this case, since the extension piece 52b, the temperature sensor 53, and the heat conductive member 54 are insulated, the measurement result by the temperature sensor 53 is less likely to be affected by the external environment. Therefore, the temperature of the power storage module 4 can be accurately measured by the temperature sensor 53.

The monitoring device 50 does not have to include the temperature sensor unit 51. The monitoring device 50 may include a temperature sensor 53 and a connecting member 52.

The monitoring device 50 may include a monitoring board having a temperature sensor 53. The monitoring board may be arranged in the vicinity of the side surface 2a of the module laminate 2 from the viewpoint of shortening the length of the extension piece 52b in the extension direction. As an example, a slot for gripping the monitoring board may be formed on the side surface 2a of the module laminate 2. Hereinafter, this example will be described in detail.

FIG. 7 is a schematic perspective view showing a power storage device according to another embodiment. FIG. 8A is an enlarged view of the slot shown in FIG. 7. The power storage device 1A shown in FIG. 7 includes a monitoring device 50A instead of the monitoring device 50, and replaces at least a part (three in the present embodiment) of the plurality of secondary sealing bodies 22 of the power storage module 4. It differs from the power storage device 1 in that it includes a plurality of (three in this embodiment) secondary sealing bodies 22A. The power storage device 1A may be configured in the same manner as the power storage device 1 in other respects. The differences will be mainly described below.

In the present embodiment, among the plurality of power storage modules 4, the power storage module 4 located at the upper end of the stack, the power storage module 4 located at the lower end of the stack, and the power storage module 4 located in the middle of the module stack 2 are two. Each of the following sealing bodies 22A is provided. The secondary sealing body 22A is different from the secondary sealing body 22 in that it further includes a projecting portion 22a, and is configured in the same manner as the secondary sealing body 22 in other respects. A groove 22b is formed in the projecting portion 22a. The projecting portion 22a projects from one side surface 22s constituting the side surface 2a of the module laminated body 2 in the secondary sealing body 22A. The one side surface 22s is a surface orthogonal to the direction D2 in the secondary sealing body 22. The projecting portion 22a may be projecting from the side surface orthogonal to the direction D3 in the secondary sealing body 22A.

The projecting portion 22a includes a wall portion 22c and a wall portion 22d facing each other in the direction D2, and a wall portion 22e connecting the wall portion 22c and the wall portion 22d. The wall portion 22c is connected to one side surface 22s of the secondary sealing body 22A and projects from the one side surface 22s in the direction D2. The wall portion 22c and the wall portion 22d extend along the direction D3. The wall portion 22e connects the end portion of the wall portion 22c in the direction D3 and the end portion of the wall portion 22d in the direction D3. The groove portion 22b is defined by the wall portion 22c, the wall portion 22d, and the wall portion 22e.

The monitoring device 50A is, for example, an ECU (Electronic Control Unit) device. The monitoring device 50A is different from the monitoring device 50 in that it includes a plurality of (three in this embodiment) connecting members 56, a monitoring board 61, and a cover 62 instead of the plurality of connecting members 52 and the plurality of temperature sensor units 51. It is different.

The connecting member 56 includes a connecting piece 56a, an extension piece 56b, and a connecting portion 56c that connects the connection piece 56a and the extension piece 56b. The connecting piece 56a is an end portion of the connecting member 56 in the direction D2, and is bonded to the upper surface of the convex portion 5b by, for example, ultrasonic welding or the like, like the connecting piece 52a (see FIG. 4). The extension piece 56b is an end portion of the connection member 56 opposite to the connection piece 56a, and is arranged outside the accommodation space W in the same manner as the extension piece 56b (see FIG. 4). The connecting portion 56c connects the connecting piece 56a and the extending piece 56b in the direction D2. The connecting portion 56c includes one end and the other end. One end of the connecting portion 56c is connected to the connecting piece 56a. The connecting portion 56c extends from the connecting piece 56a along the direction D2, and like the connecting portion 52c, passes through the gap 22h of the two secondary sealing bodies 22 adjacent to each other in the stacking direction D1 and is outside the accommodation space W. (See Fig. 4). Outside the accommodation space W, the other end of the connecting portion 56c is connected to the extension piece 56b.

The extension piece 56b has a grip portion 56d that detachably grips the monitoring substrate 61. The grip portion 56d includes a tip portion 56e, a base end portion 56f facing the tip end portion 56e, and a connecting portion 56g for connecting the tip end portion 56e and the base end portion 56f. The main surfaces of the tip portion 56e, the base end portion 56f, and the connecting portion 56g are substantially orthogonal to the main surface of the connecting portion 56c. The base end portion 56f is erected at the other end of the connecting portion 56c. The base end portion 56f extends along the direction D3. The tip portion 56e faces the base end portion 56f in the direction D2. The tip portion 56e extends along the direction D3. The connecting portion 56g connects one end of the tip portion 56e in the direction D3 and one end of the base end portion 56f in the direction D3 along the direction D2.

The grip portion 56d has a U-shape when viewed from the stacking direction D1. The grip portion 56d is fitted in the groove portion 22b. In FIG. 8A, the connecting member 56 in a state where the grip portion 56d is fitted in the groove portion 22b is shown by a virtual line. In a state where the grip portion 56d is fitted into the groove portion 22b, the tip portion 56e is along the wall portion 22d, the base end portion 56f is along the wall portion 22c, and the connecting portion 56g is along the wall portion 22e. A slot S for gripping the monitoring substrate 61 is defined by the tip portion 56e, the base end portion 56f, and the connecting portion 56g.

FIG. 8B is a developed view of the connecting member shown in FIG. 8A. In FIG. 8B, the alternate long and short dash line is shown as the alternate long and short dash line. The connecting member 56 is formed by, for example, an L-shaped metal plate bent at a substantially right angle at each bending line. The grip portion 56d is composed of a long portion of the L-shaped metal plate. Specifically, the main surfaces of the tip portion 56e, the base end portion 56f, and the connecting portion 56g are each formed by being valley-folded at a substantially right angle at the boundary between the long portion and the short portion of the L-shaped metal plate. And the main surface of the connecting portion 56c are substantially orthogonal to each other. In this state, the long portion is folded at two points at substantially right angles to form the tip portion 56e, the base end portion 56f, and the connecting portion 56g, respectively.

The configuration of the monitoring device 50A will be described in detail with reference to FIGS. 9 and 10. FIG. 9 is a diagram for explaining a monitoring board. FIG. 10 is a cross-sectional view taken along the line XX of FIG.

The monitoring board 61 is a circuit board for monitoring the state of a plurality of power storage modules 4. As an example, the monitoring board 61 is a printed circuit board having a four-layer structure, and a conductor pattern is formed mainly by two internal layers. The monitoring board 61 monitors the temperature of each power storage module 4. In the present embodiment, the monitoring board 61 has the temperature of the power storage module 4 located at the upper end of the stack, the temperature of the power storage module 4 located at the lower end of the stack, and the temperature of the power storage module 4 located in the middle of the module stack 2. To monitor. The monitoring board 61 may further monitor the terminal voltage of each power storage module 4. The terminal voltage is a voltage between the positive electrode terminal electrode 19 and the negative electrode terminal electrode 18, and is a potential difference between the potential of the positive electrode terminal electrode 19 and the potential of the negative electrode terminal electrode 18.

The monitoring board 61 is provided so as to be adjacent to the module laminate 2 in the direction D2. Specifically, the monitoring substrate 61 is provided along the side surface 2a in the vicinity of the side surface 2a of the module laminate 2. In the present embodiment, a part of the monitoring board 61 is arranged in the slot S. The monitoring board 61 is detachably gripped by the gripping portion 56d of the extension piece 56b at a portion arranged in the slot S. The monitoring board 61 includes a wiring board unit 63 and a plurality of circuit components mounted on the wiring board unit 63.

The wiring board portion 63 has a surface 61a facing the side surface 2a and a surface 61b (main surface) opposite to the surface 61a. The wiring board portion 63 is provided with a plurality of through holes 61c. The through hole 61c is a hole that penetrates the wiring board portion 63 along the direction D2. The through hole 61c is used for inserting a fixing member 61d such as a bolt. The wiring board portion 63 is fixed to the pair of end plates 8 by the fixing member 61d.

The wiring board portion 63 includes a base material 63a and a plurality of (three in this embodiment) conductive portions 63b. The base material 63a (insulating member) is made of an insulating material (for example, resin). The base material 63a includes an insulator 63c and a plurality of (three in this embodiment) insulators 63d (insulating portions). The insulator 63c has a rectangular shape and extends over the entire length of the module laminate 2 in the stacking direction D1. The insulator 63c is made of a resin material having a heat insulating property.

The plurality of insulators 63d are provided on the insulator 63c so as to be arranged along the stacking direction D1. Seen from the stacking direction D1, the insulator 63d is larger than the temperature sensor 53A described later. Each insulator 63d has a rectangular shape and penetrates the insulator 63c in the direction D2 at a position corresponding to the power storage module 4 to be detected. The plurality of insulators 63d are made of a resin material having thermal conductivity.

Each conductive portion 63b is a conductor pattern formed on the base material 63a. The conductive portion 63b is made of a material having thermal conductivity. The thermal conductivity of the material constituting the conductive portion 63b is higher than the thermal conductivity of the material constituting the insulator 63d. The conductive portion 63b is provided over the insulator 63c and the insulator 63d. The conductive portion 63b includes an exposed portion 63e and an extension portion 63f.

The exposed portion 63e penetrates the wiring board portion 63 in the direction D2. The exposed portion 63e is located at the end of the wiring board portion 63 in the direction D3. The exposed portion 63e extends from the end portion of the wiring board portion 63 in the direction D3 of the insulator 63c toward the insulator 63d. The tip of the exposed portion 63e is fitted into the insulator 63d. The exposed portion 63e is a portion of the monitoring board 61 that is arranged in the slot S described above. The exposed portion 63e is in contact with the extension piece 56b in a state of being sandwiched between the tip end portion 56e and the base end portion 56f. The extension portion 63f extends in the direction D3 from the exposed portion 63e inside the insulator 63d. The extension portion 63f extends to a position inside the insulator 63d that overlaps with the temperature sensor 53A described later when viewed from a direction orthogonal to the surface 61b.

The plurality of circuit components mounted on the wiring board unit 63 include a temperature sensor 53A for measuring the temperature of the power storage module 4 and a plurality of electronic components for monitoring the temperature of the power storage module 4. In this embodiment, the temperature sensor 53A is a chip thermistor. The temperature sensor 53A is mounted on the insulator 63d. The insulator 63d is in contact with the temperature sensor 53A. That is, the temperature sensor 53A and the connecting member 56 are thermally connected by the conductive portion 63b and the insulator 63d described above. In the power storage device 1A, the thermal conductor that thermally connects the temperature sensor 53A and the connecting member 56 may have a conductive portion 63b and an insulator 63d. The temperature sensor 53A is provided at a position overlapping the extension portion 63f when viewed from a direction orthogonal to the surface 61b of the monitoring substrate 61.

Among the plurality of circuit components mounted on the wiring board unit 63, the plurality of electronic components other than the temperature sensor 53A are respectively arranged on the insulator 63c. The plurality of electronic components include a CPU (Central Processing Unit), a capacitor, and the like. In the present embodiment, the plurality of electronic components further include a heat generating component 64 (for example, a shunt resistor) that generates heat when energized. The CPU receives a signal regarding the temperature of each power storage module 4 from the temperature sensor 53A. The CPU transmits a signal related to temperature to a higher-level ECU (Electronic Control Unit) which is an external device.

The cover 62 is a member that covers the monitoring board 61 from the direction D2. The cover 62 includes a cover member 62a, a cover member 62b (covering portion), a cover member 62c (covering portion), and a heat insulating hood 62d. The cover member 62a covers the monitoring substrate 61, the cover member 62b, the cover member 62c, and the heat insulating hood 62d from the direction D2. The cover member 62a has a top wall 62i facing the surface 61b of the monitoring substrate 61, and a tubular side wall 62h extending from the top wall 62i along the direction D2. The monitoring substrate 61, the cover member 62b, the cover member 62c, and the heat insulating hood 62d are housed in the space X defined by the top wall 62i, the side wall 62h, and the secondary sealing body 22A.

The cover member 62b covers a plurality of electronic components other than the temperature sensor 53A among the plurality of circuit components mounted on the wiring board portion 63. That is, the heat generating component 64 is covered with the cover member 62b. The cover member 62b defines an isolated space K isolated from other spaces in the space X on the monitoring substrate 61. Among the plurality of circuit components mounted on the wiring board unit 63, a plurality of electronic components other than the temperature sensor 53A are housed in the isolation space K.

The cover member 62c covers the temperature sensor 53A and the insulator 63d. The cover member 62c is bridged over the wall portion 22d and defines a region isolated from other spaces in the space X together with the wall portion 22d. The area is filled with the heat insulating material 62e. In the present embodiment, of the insulator 63d, the entire surface on which the temperature sensor 53A is mounted is covered with the cover member 62c and the wall portion 22d. The heat insulating hood 62d is provided at the end of the monitoring substrate 61 in the direction D3. The heat insulating hood 62d includes a hood portion 62f and a heat insulating material 62 g. The hood portion 62f covers the projecting portion 22a. The hood portion 62f is bridged over the cover member 62c and defines a region isolated from other spaces in the space X together with the cover member 62c. The area is filled with 62 g of a heat insulating material.

The cover member 62a, the cover member 62b, the cover member 62c, and the hood portion 62f are made of a material having heat insulating properties (for example, resin). The thermal conductor (conductive portion 63b and insulator 63d) is covered with a heat insulating material 62e and a heat insulating material 62g. Examples of the resin material constituting the cover member 62a, the cover member 62b, and the cover member 62c include polypropylene (PP), polyphenylene sulfide (PPS), modified polyphenylene ether (modified PPE), and the like. Examples of the resin material constituting the hood portion 62f include vinyl chloride and the like. Examples of the heat insulating material 62e include resin. Examples of the resin material constituting the heat insulating material 62e include urethane, epoxy, acrylic resin and the like. The heat insulating material 62e is configured by filling the cover member 62c with a resin or the like by potting or the like. Examples of the heat insulating material 62 g include urethane foam.

Also in the power storage device 1A, since the connection member 56 extends from the conductive plate 5 that electrically connects the power storage module 4A and the power storage module 4B to the outside of the accommodation space W, the power storage module 4A and the power storage module 4B are stacked. The temperature sensor 53A can be replaced while maintaining the above. Therefore, it is possible to reduce the time and effort required to replace the temperature sensor 53A.

In the power storage device 1A, the conductive portion 63b and the insulator 63d are provided so as to thermally connect the connecting member 56 and the temperature sensor 53A and to be detachably attached to the connecting member 56. Therefore, since the temperature sensor 53A can be replaced together with the conductive portion 63b and the insulator 63d, it is possible to avoid damage to the temperature sensor 53A even in the power storage device 1A.

The connecting member 56 has a grip portion 56d that grips the monitoring board 61 in a detachable manner. Therefore, the conductive portion 63b and the insulator 63d are detachably gripped by the grip portion 56d. Therefore, in the power storage device 1A, the temperature sensor 53A can be prevented from being damaged by replacing the temperature sensor 53A together with the monitoring board 61.

Further, in the power storage device 1A, the monitoring board 61 includes an electronic component for monitoring the temperature of the power storage module 4A and the temperature of the power storage module 4B, a temperature sensor 53A, a conductive portion 63b and an insulator 63d, and a wiring board portion. Since the device has 63, the electronic component for monitoring the temperature of the power storage module 4A and the temperature of the power storage module 4B and the temperature sensor 53A can be integrated by using the wiring board portion 63 of the monitoring board 61. .. Further, in the power storage device 1A, a component for mounting a printed circuit board (for example, a chip thermistor) is used as the temperature sensor 53A. Such a temperature sensor 53A includes a temperature sensor 53A having a relatively low procurement cost. Therefore, the procurement cost of the temperature sensor 53A can be reduced.

Since the power storage device 1A has a conductive portion 63b in contact with the connecting member 56 and an insulator 63d in contact with the temperature sensor 53A, the insulation between the temperature sensor 53A and the conductive plate 5 can be improved.

The conductive portion 63b extends to a position overlapping the temperature sensor 53A when viewed from a direction orthogonal to the surface 61b of the monitoring substrate 61. Therefore, the heat of the power storage module 4A and the heat of the power storage module 4B are easily propagated to the temperature sensor 53A, so that the measurement accuracy of the temperature of the power storage module 4A and the temperature of the power storage module 4B by the temperature sensor 53A can be improved.

Here, for example, when heat from the heat generating component 64 is transferred to the temperature sensor 53A, the measurement result by the temperature sensor 53A is affected by the heat, and a measurement error may occur. On the other hand, the power storage device 1A according to the present embodiment further includes a cover member 62b and a cover member 62c arranged on the surface 61b of the wiring board portion 63. The cover member 62b covers the heat generating component 64. The cover member 62c) covers the temperature sensor 53A. According to this configuration, the space where the temperature sensor 53A is arranged and the space where the heat generating component 64 is arranged are separated. As a result, the heat transfer from the heat generating component 64 to the temperature sensor 53A is hindered, so that the measurement error can be reduced.

Since the power storage device 1A further includes a heat insulating material 62e and a heat insulating material 62g that cover the conductive portion 63b and the insulator 63d, the measurement result by the temperature sensor 53A is less likely to be affected by the external environment. Therefore, the temperature of the power storage module 4A and the temperature of the power storage module 4B can be accurately measured by the temperature sensor 53A.

The power storage device 1A may include only one of the cover member 62b and the cover member 62c.

In the monitoring board 61, a plurality of electronic components for monitoring the temperature of the power storage module 4 and the temperature sensor 51A may be mounted on the surface 61a of the wiring board portion 63. In this case, the insulator 63d is covered with the heat insulating material 62e on the surface 61a side.

1,1A ... power storage device, 4A ... power storage module (first power storage module), 4B ... power storage module (second power storage module), 5 ... conductive plate, 11 ... electrode laminate, 12 ... sealant, 14 ... bipolar electrode , 52, 56 ... Connecting member (extending part), 52d, 56d ... Gripping part, 53 ... Temperature sensor, 54 ... Heat conductive member (heat conductor), 55A ... Insulating material, 61 ... Monitoring substrate, 61b ... Surface ( Main surface), 62b, 62c ... Cover member (covering part), 62e, 62g ... Insulation material, 63 ... Wiring board part, 63b ... Conductive part, 63d ... Insulator, 64 ... Heat generating part, D1 ... Laminating direction (1st Direction), D2 ... direction (second direction), W ... accommodation space.

Claims (8)

The first power storage module and the second power storage module stacked along the first direction,
A conductive plate that is interposed between the first power storage module and the second power storage module and electrically connects the first power storage module and the second power storage module.
A temperature sensor for measuring the temperature of the first power storage module and the temperature of the second power storage module, and
An extending portion extending from the conductive plate along a second direction intersecting the first direction,
With
Each of the first power storage module and the second power storage module includes an electrode laminate including a plurality of bipolar electrodes laminated along the first direction, and a sealant for sealing the electrode laminate. Have and
Between the first power storage module and the second power storage module, a storage space for accommodating the conductive plate is formed by the sealing body of the first power storage module and the sealing body of the second power storage module. And
The extending portion extends to the outside of the accommodating space,
The temperature sensor is connected to the extension outside the accommodation space.
Power storage device. Further provided with a thermal conductor connecting the extending portion and the temperature sensor,
The heat conductor is detachably provided on the extending portion.
The power storage device according to claim 1. The extending portion has a grip portion that grips the heat conductor in a detachable manner.
The power storage device according to claim 2. The electronic component for monitoring the temperature of the first storage module and the temperature of the second storage module, the temperature sensor, the heat conductor, the electronic component, the temperature sensor, and the heat conductor are mounted. A printed circuit board having a wiring board portion including the main surface and a printed circuit board having the main surface is further provided.
The power storage device according to claim 2 or 3. The thermal conductor has a conductive portion that contacts the extending portion and an insulating portion that contacts the temperature sensor.
The power storage device according to claim 4. The insulating portion is an insulating member made of a resin in the printed circuit board.
The conductive portion is a conductor pattern formed on the insulating member.
The conductive portion includes a portion that overlaps with the temperature sensor when viewed from a direction orthogonal to the main surface.
The power storage device according to claim 5. A covering portion arranged on the main surface of the wiring board portion is further provided.
The electronic component includes a heat-generating component that generates heat when energized.
The covering portion covers one of the heat generating component and the temperature sensor.
The power storage device according to any one of claims 4 to 6. Further provided with a heat insulating material covering the heat conductor.
The power storage device according to any one of claims 2 to 7.

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