JP2021061430A - Device and method for joining substrates - Google Patents

Abstract

To provide a device and method for joining two substrates that can improve the joining accuracy, especially at the edges of the substrates.SOLUTION: The method includes the steps of holding a first substrate 4o with a first holding device 1o and a second substrate 4u with a second holding surface 1s of a second holding device 1u, and a step of curving mutually facing contact surfaces 4k of the substrates before contacting the contact surfaces. A change in the curvature of the contact surface of the first substrate and/or a change in the curvature of the contact surface of the second substrate are controlled during joining.SELECTED DRAWING: Figure 4c

Description

The present invention relates to a method of joining the first substrate according to claim 1 to a second substrate, and the corresponding apparatus according to claim 9.

For several years, in the semiconductor industry, substrates have been joined together by a so-called joining process. Prior to joining, these substrates must be aligned with each other as accurately as possible, in which case the nanometer range deviations that occur between them become a problem. In this case, the alignment of the substrate is mainly performed through the alignment mark. In addition to the alignment marks, there are yet other, especially functional elements on the substrate that must be aligned with each other as well during the joining process. Such alignment accuracy between individual functional elements is required for the entire substrate surface. Therefore, for example, the alignment accuracy is extremely good at the center of the substrate, but it cannot be said that it is sufficient when the alignment accuracy decreases toward the edge.

Prior art, such as the literature, European Patent No. 2656378 (EP2656378B 1) or WO 2014/191033 (WO2014191033A1), has multiple methods in which attempts can be made to influence the joining process. The device is present.

The biggest problem in joining is in the joining process itself, that is, in the initial stage of joining until the contact surfaces of the substrates are completely contacted with each other. In this case, the mutual alignment of the two substrates may still change significantly as compared with the previous alignment. Once the surfaces of both substrates are joined to each other, they can theoretically be separated again, but this is costly, low in processing, and susceptible to error.

An object of the present invention is to provide an apparatus and a method for joining two substrates, which can improve the joining accuracy particularly at the edge of the substrate.

This problem is solved by an apparatus and method having the features according to claims 1 and 9. Another suitable configuration of the present invention is described in the dependent claims. All combinations of at least two features described in the specification, claims, and / or drawings are also within the scope of the invention. Within the stated numerical range, values within the above range are also considered to be disclosed as limit values, and patents can be claimed in any combination.

The underlying idea of the present invention is to bend both substrates before contact or before joining, and this curvature of at least one of the two substrates is preferably melt-joined during joining, especially during the course of the joining wave. At that time, it is changed by controlling the curvature. The curvature of the other (preferably the upper) substrate is also preferably controlled and altered.

The curvature also changes due to the automatic contact of the substrate. Automatic contact is particularly provided by gravity acting on the substrates and / or other attractive forces between the substrates. The control of the curvature change of one (particularly the lower) substrate, particularly as well as the curvature change of the other (particularly the upper) substrate, preferably depends on the curvature change (preferably by measurement and control). Is done.

The curvature change means, in particular, a state deviating from the starting state of the substrate (particularly the curvature existing before contact). According to the present invention, the joining of the contact surfaces after contact is controlled particularly by the controlled control of fixing the substrate. Corresponding fixing means are specifically provided as a device.

Another particularly independent aspect of the invention is the use of particularly individually switchable fixed elements that control the junctional wave traveling between the contact surfaces for closed-loop or open-loop control. be able to.

Another idea according to the invention, particularly independently or in combination with those described above, lies in the use of deforming elements, especially as bending means and / or bending changing means, which are formed as gas outflow openings. This avoids mechanical contact with the substrate. The control of curvature is performed more accurately by the combination of the above features.

The present invention specifically describes methods and devices capable of optimally joining two substrates that are aligned with each other. In this case, the underlying idea, among other things, is to control, close-loop, or open-loop the bending, fixation, and / or release of at least one of the substrates, depending on the purpose. Control, closed-loop control, or open-loop control is used to ensure continuous, optimal contact of both substrates, especially from the inside to the outside, along the contact surface. Optimal contact means, in particular, that the "runout" error at each point of the contact surface between the two substrates is minimal or, in the best case, eliminated.

According to one configuration, the fixation of the substrate is performed by a plurality of fixing elements particularly divided into a plurality of areas.

According to another configuration, bending of at least one substrate is performed by positive pressure.

In the starting state, the substrate is usually particularly contact surface, except for structures that sometimes protrude from the contact surface (microchips, functional components) and substrate tolerances such as bending and / or thickness variation. It is almost flat. However, the substrate often has a different curvature than zero in the starting state. For a 300 mm wafer, a curvature of less than 100 μm is common. Mathematically, curvature can be regarded as a measure of the local deviation of a curve from its planar state. Specifically, a substrate whose thickness is smaller than its diameter is considered. Therefore, when approximated well, it can be called the curvature of the plane. In the case of a plane, the first mentioned plane state is the tangential plane of the curve at the point where the curvature is observed. In general, curvature is an explicit function of position, as objects, especially substrates, do not have a uniform curvature. Therefore, as an example, the non-planar substrate has a concave curve in the center, but has a convex curve in another place. According to the present invention, bending or bending change means macroscopic, that is, bending or bending change with respect to the entire substrate or the contact surface, unless otherwise specified.

According to the present invention, convex curvature is preferable when viewed from the opposing substrates. It is more preferable if the curvatures of both substrates are mirror-symmetrical to each other.

Another possibility of showing curvature at a given point is to show the radius of curvature. The radius of curvature is the radius of a circle that is in contact with the surface and includes points on the surface.

Therefore, the center of the independent idea in the main embodiment of the present invention is that the radii of curvature of the two substrates to be joined to each other are mainly in the contact region of the substrates, that is, at the joining front of the joining wave or at the joining line. They are the same, or at least slightly different from each other. The difference between the two radii of curvature at the bonding front / bonding line of the substrate is less than 10 m, preferably less than 1 m, more preferably less than 1 cm, still more preferably less than 1 mm, and even more preferably. It is less than 0.01 mm, most preferably less than 1 μm. In general, all embodiments according to the invention that minimize the difference between the radii of curvature R1 and R2 are advantageous.

In other words: the present invention relates to methods and devices capable of joining two substrates together so that local alignment errors, called "runout" errors, are minimized. The various "runout" errors are described in detail in WO 2014/191033 (WO2014191033A1), which can be referred to. The description of the runout error in WO 2014/191033 (WO2014191033A1) is thereby expressly included in the disclosure of this specification. Therefore, the detailed explanation is omitted here.

In this case, more particularly, the idea underlying the present invention is that the influence factors on the joining wave caused by the bending / bending change of both substrates to be joined to each other, especially by fixing, especially by controlling over a wide surface portion, are both. The object is to control the substrates so that they do not locally slide against each other during bonding, that is, they are selected to remain precisely aligned. Further, the present invention describes an article consisting of two substrates joined together with a "runout" error reduced by the present invention.

A characteristic process according to the invention for joining, especially permanent joining, preferably melt joining, is that both contact surfaces of the substrate are in contact as centrally as possible and / or in dots. In general, the contact between the two substrates does not have to be central. The junction wave propagating from the non-central contact point reaches different points on the board edge at different times. Therefore, the complete mathematical and physical explanation of the junction wave characteristics and the compensation for the resulting "runout" error is complex. Preferably, the contact points are not significantly far from the center of the substrate, so the effects that can occur, especially at the edges of the substrate, can be ignored. The distance between the possible non-centered contact points of the substrate and the center is particularly less than 100 m, preferably less than 10 mm, more preferably less than 1 mm, and even more preferably less than 1 mm according to the present invention. It is less than 0.1 mm, most preferably less than 0.01 mm. In the following description, contact usually means central contact. The center, in a broad sense, preferably means the geometric center point of the underlying ideal object, compensated for asymmetry as needed. That is, in an industrially general-purpose wafer having a notch, the center is the center point of a circle surrounding the virtual wafer having no notch. In an industrially general-purpose wafer having a flat portion (flat chamfered surface), the center is the circular center point of a circle surrounding the virtual wafer having no flat portion. A similar idea applies to arbitrarily molded substrates. However, in special embodiments, it may be beneficial for the center to mean the center of gravity of the substrate.

To ensure accurate and central point contact, according to embodiments of the present invention, a central hole and a pin capable of translating within this hole are provided as bending and / or bending changing means. In particular, the upper holding device (board holder) is provided with a fixing member that is particularly symmetrical in the radial direction as a fixing means. As the bending means and / or the bending changing means, it is also conceivable to use a nozzle used to pressurize a fluid, preferably a gas, particularly directly to the substrate instead of a pin (fluid pressurizing means). .. A device that allows both substrates to be brought closer to each other by translational motion, with another assumption that both substrates have a curvature that is pushed towards the other substrate, especially based on gravity and / or preload. If provided, the use of elements of this type can even be completely eliminated. The substrate automatically contacts the corresponding second substrate at a sufficiently small distance during translational motion.

The fixing element is, according to an embodiment of the invention, an exhaust hole provided, one or more circular exhaust lips, or a comparable exhaust element capable of fixing a wafer. The use of a plurality of electrostatic fixing elements (fixing means) is also conceivable. Pins in the central hole or conduit that can generate positive pressure from the introduced gas between the board holder and the board are used for controllable bending of the fixed board (curving means and / Or bending changing means).

After the centers of both substrates are in contact, the retaining device fixing means is driven and controlled, in particular, to make a controlled deformation / curvature change of at least one of the substrates. The upper substrate is pulled downward, controlled by gravity on the one hand and by the bonding force acting between the two substrates along the bonding wave on the other. Therefore, the upper substrate is joined to the lower substrate in the radial direction from the center toward the side edge. In this way, a radialally symmetric junctional wave extending particularly from the center to the side edges is formed according to the present invention. During the bonding process, both substrates push the gas, especially air, present between the substrates in front of the bonding wave, thereby creating a bonding interface without gas inclusions. The upper substrate is actually located on a kind of gas cushion when completely dropped. After the specified time point, all the fixing elements of the board holder can be switched off, leaving the upper board under the influence of gravity and / or the attractive force between the boards themselves. At this point, the curvature change of the upper substrate is no longer open-loop or closed-loop controlled, but remains controlled as the surrounding conditions are known or empirically determined. Based on such controlled curvature changes and the progress of the junction wave, the curvature changes of the lower substrate are open loop controlled or closed loop controlled. However, in a preferred configuration according to the invention, the upper substrate is not completely dropped, but the junction wave extends over at least 10% or more of the substrate area, preferably over 20%, more preferably over 30%. Further preferably, both substrates are to be completely controlled until they are spread over 50% or more, and most preferably over 75%.

No special additional fixing is required after the above time point when all the fixing elements of the upper holding device have been switched off. That is, the upper substrate can move freely except for fixing at the joining start point, and may be distorted. Due to the joining wave progressing according to the present invention, the stress state generated at the joining wave front, and the existing geometric edge conditions, each circular segment that is infinitely smaller than the thickness in the hemidirectional direction is distorted. However, since the substrate is a rigid object, the strains are added up as a function of the distance from the center. This leads to a "runout" error that is eliminated by the method according to the invention and the apparatus according to the invention. The upper substrate is fixed and held during the entire time period in which the junction wave travels, and the junction wave progression starts with the continuous switch-off of the fixed elements, especially from the fixed element inside the substrate holder. It is possible that progress can be made. The progress of the joining wave can also be favorably promoted by the two substrate holders approaching each other, especially during the progress of the joining wave.

Therefore, the present invention particularly reduces, or even completely eliminates, the "runout" error between two substrates to be joined during joining, especially by thermodynamic and / or mechanical compensation mechanisms. With respect to methods and devices for doing so.

Furthermore, the present invention relates to a device according to the invention and a corresponding article manufactured using the method according to the invention.

Holding Device / Board Holder The board holder according to the present invention has fixing means, particularly a plurality of fixing elements. Fixed elements may be grouped by area. Grouping of fixed elements by area also meets geometric, optical, and preferably functional challenges. A functional challenge means, for example, that all fixed elements in one area can be switched at the same time. It is also conceivable that all fixed elements in one area can be switched individually. Therefore, a plurality of fixing elements can be driven and controlled inside the area to fix or release the board at the same time, or can be individually driven and controlled, but within the area, the board is very unique. Deformation characteristics occur. The area may have the following geometry in particular.
・ One side,
・ Circle segment,
• Areas such as tiled areas, especially as triangles, squares, or hexagons. In particular, there may be surfaces between the areas that do not have fixed elements. The spacing between such areas is particularly less than 50 mm, preferably less than 25 mm, more preferably less than 20 mm, even more preferably less than 10 mm, and most preferably less than 5 mm. When the area is formed as a circular segment, such spacing is the distance between the inner annulus of the outer circular segment and the outer annulus of the inner circular segment.

The number of fixed elements in one area is arbitrary. In particular, at least one fixed element, preferably at least two fixed elements, preferably 10 or more, more preferably 50 or more, still more preferably 100 or more, more preferably in one area. There are more than 200, most preferably more than 500 fixed elements.

According to a preferred embodiment of the present invention, the first holding device and / or the second holding device is around the holding surface of the first holding device and / or the second holding device for holding the substrate. It has fixing means arranged particularly in a ring shape, preferably in an annular shape, particularly exclusively in a region of a side edge of a substrate.

The fixing means are formed as particularly uniformly distributed, preferably concentrically arranged, divided into a plurality of areas, particularly individually controllable fixing elements. Preferably, the fixing means is exclusively arranged, especially in the edge region of the holding surface. The edge region extends, in particular, to half the radius of the holding surface, preferably to one-fourth of the radius.

If the fixed elements are arranged radially symmetrically in one area, the number of fixed elements per given cross section can also be considered. The number of fixed elements in the cross section is less than 20, preferably less than 10, more preferably less than 5, more preferably less than 3, and most preferably 1.

The fixing element can supply a negative pressure for fixing and can also apply a positive pressure for releasing the substrate.

In the first embodiment according to the invention, the fixation element consists of simple holes formed specifically by perforation or spark erosion. In a special configuration, the fixing element is a slit formed in a ring shape, especially in an annular shape, especially by milling. In another configuration, the fixed element may be provided with an exhaust lip. When the fixed element is provided as an exhaust element, the fixed element is less than 1 bar, preferably less than 0.1 mbar, more preferably less than 0.01 mbar, even more preferably less than 0.001 mbar. Most preferably, a pressure of less than 0.0001 mbar can be generated.

In the second embodiment according to the present invention, it is composed of a fixing element and a conductive plate used for static electricity fixing. The conductive plate can be connected to a single pole, preferably a bipolar. In a bipolar circuit, the two plates are placed at opposite potentials. Therefore, the substrate holder according to the present invention functions within the area as an electrostatic substrate holder having high resolution electrostatic fixation characteristics depending on the number of plates.

As the number of fixed elements per unit area increases, the control of the fixing characteristics of the board holder for the board becomes better.

Preferably, the first holding surface and / or the second holding surface is a raised portion that forms, in particular, a first holding plane of the first holding surface and a second holding plane of the second holding surface. Consists of.

According to two other embodiments, a holding device with a ridge, particularly a protruding substrate holder, is described. Such a substrate holder means a substrate holder having a plurality of supports (pillars in English) arranged particularly symmetrically. These supports are specifically formed as protrusions. The protrusion may have any shape. In particular, the protrusions are provided in the following shapes.
Pyramids, especially triangular or quadrangular pyramids, cylinders, especially cylinders with flat or rounded heads, rectangular parallelepipeds, cones, and spherical shells.

Sphere shell protrusions, conical protrusions, and cylindrical protrusions are laborious to manufacture, whereas pyramidal or rectangular parallelepiped protrusions can be relatively easily manufactured by etching and / or milling, and thus in the present invention. According to it is suitable.

Since the above-mentioned protrusion substrate sample holder may be closed at its peripheral region via an edge element, the spatial region between the protrusions may be interpreted as a recess. However, the protrusions may form only one ridge with respect to the protrusion plane where all the protrusions are located on the plane.

In a third preferred embodiment of the present invention, the substrate holder is configured as a protruding substrate holder with a web. In this case, the individual areas are interrupted by the web. Inside each area, at least one conduit for exhausting the space between the protrusions is terminated. In particular, by using a plurality of passages that can be individually driven and controlled, it is possible to exhaust a space having different intensities depending on the location.

In a more preferred fourth embodiment, the substrate holder is configured as a fully protruding substrate holder, i.e. without a web.

The width or diameter of the ridges, especially the protrusions, is particularly less than 5 mm, preferably less than 1 mm, more preferably less than 500 μm, most preferably less than 200 μm.

The height of the ridges, especially the protrusions, is particularly less than 2 mm, preferably less than 1 mm, more preferably less than 500 μm, most preferably less than 200 μm.

In particular, the ratio between the width or diameter of the ridge to the height of the ridge is greater than 0.01, preferably greater than 1, more preferably greater than 2, and even more preferably greater than 10. Is also large, most preferably greater than 20.

All the embodiments of the present invention described above may be arbitrarily combined with each other. Therefore, it is conceivable that the first area consists of an electrostatically functioning fixed element and the second area has a vacuum fixation.

The substrate holder according to the present invention may have a hole particularly described as a measurement hole in the following specification, and the surface of the substrate fixed by this hole is observed from the back surface of the substrate holder. be able to. This makes it possible to measure the surface of the substrate fixed in this region. The measurement hole can also be closed by a cover. In a particularly preferred embodiment, the measuring hole can be opened and closed fully automatically by the cover.

According to the preferred configuration of the present invention, the holding device has a curvature measuring means for measuring the curvature.

The substrate holder according to the invention may optionally or additionally have a sensor capable of measuring the physical and / or chemical properties between the fixed substrate and the substrate sample holder. These sensors are preferably
-Temperature sensor and / or-Pressure sensor and / or-Distance sensor.

A particularly suitable distance sensor can be used as a curvature measuring means. In this case, the distance between the substrate and the holding device determines, interpolates, and / or calculates the curvature of the substrate, especially between the support points.

According to the present invention, distance sensors particularly distributed along the holding surface are preferably used to allow good closed-loop or open-loop control of curvature and / or curvature modification.

In a particularly preferred configuration, the plurality of sensors are formed as distance sensors, among other things, to measure the distance of the substrate with respect to one plane before and / or during the joining process. This plane is preferably a holding surface and / or a holding surface of a plane formed in particular by the ridges.

It is also possible that the plurality of sensors are located on different planes. The relationship to one and / or multiple planes is not important, as the sensor preferably measures the change in lateral distance with respect to the contact surface particularly exclusively. In this case, it is only necessary to detect relative distance changes of the substrate, especially in different locations.

Distance measurement is especially useful for process control. By knowing the exact bending state of one or more substrates, the drive control / adjustment of the fixing members according to the present invention is particularly efficient for optimal, particularly gradual release of the substrates.

It is possible that multiple sensors of different types will be incorporated. In a particularly preferred embodiment, the sensors for distance measurement and pressure measurement are particularly symmetrically and uniformly distributed and incorporated in the substrate holder. This makes it possible to measure the distance and pressure covering the surface, albeit discretely. Pressure measurements are particularly advantageous when the deforming element is a fluid, especially a gas, or a gas mixture brought through the pipeline.

If one or both holding devices are formed without curvature measuring means and / or sensors, adjustment and / or control of curvature and / or curvature modification is performed based on empirically determined parameters. It's okay.

The first and second substrate holders according to the present invention preferably have at least one, particularly centrally configured, deforming means (curving means and / or bending changing means) for changing the curvature / curvature of the substrate. doing.

According to the first embodiment of the present invention, the curved element is a pin. The pin has at least one, preferably just one degree of freedom, of translational motion along the normal to the holding plane or plane. It is also possible that the pins have degrees of freedom along the holding surface for calibration in the x and / or y directions. Preferably the pins can be fixed in the x and / or y directions. The pin can apply a force of 0.01N to 1000N, preferably 0.1N to 500N, more preferably 0.25 to 100N, most preferably 0.5 to 10N.

In a second embodiment of the invention, the deforming element for curvature and / or curvature modification is a fluid outflow opening (fluid addition) capable of supplying fluid, particularly gas or gas mixture, between the substrate and the holding surface. Pressure means). In a highly preferred embodiment of the invention, the fluid outflow opening is incorporated into a unique, particularly x-direction and / or y-directionally movable partial element, so that the fluid outflow opening is positioned in the x-direction and / or Positioning in the y direction can be performed. This accurately defines the location of the fluid outflow opening, which can also affect the optimal bonding results according to the invention. A fluid outflow opening is, in the simplest case, an opening forming the end of a pipeline. In a very particularly preferred embodiment, the fluid outflow opening is a nozzle. Preferably, the nozzle can be electronically controlled, which allows open-loop control and / or closed-loop control of the fluid pressure and / or outflow rate of the outflow fluid at each time point. The use of multiple nozzles to change the pressure formation at multiple locations between the substrate sample holder and the substrate is also conceivable. All statements about one nozzle apply to multiple nozzles as well. 1 mbar or more, preferably 10 mbar or more, more preferably 100 mbar or more, still more preferably 200 mbar or more, most preferably 1 mbar or more, preferably 10 mbar or more, more preferably 200 mbar or more, between the substrate and the substrate holder via a fluid outflow opening, particularly a nozzle. A pressure of 500 mbar or more can be formed. All substrate holders according to the invention may have loading pins. The loading pin is used to load the substrate into the substrate holder according to the present invention. The loading pin is specifically guided through a hole provided in the holding device. In this case, the holes are preferably formed densely with respect to the loading pin.

In the first process step, the loading pin is exposed. In the second process step, the substrate is placed on the loading pins, especially fully automatically. In the third process step, the loading pins are returned inward to bring the substrate into contact with the holding surface. In the fourth process step, the substrate is fixed by a fixing element. Loading pins are also used for unloading bonded substrate laminates. In this case, the order of the process steps is correspondingly reversed. The loading pin may form a decompressor, in particular if it is not sealed to the hole in which the loading pin moves. In this case, it is not possible to statically maintain the negative pressure through the vacuum fixing element and / or the positive pressure through the gas outflow opening. Correspondingly, continuous exhaust through a vacuum fixing element and / or formation of continuous positive pressure through a gas outflow opening characterized by a preferably static, particularly layered flow is disclosed. However, the use of seals is also conceivable, which allows the formation of static pressure without forming a flow.

Basically, the substrate holder can be manufactured from any material. One or more of the following materials are particularly suitable.
・ Metals, especially ・ Pure metals, especially ・ Aluminum ・ Alloys, especially ・ Steels, especially ・ Low alloy steels,
・ Ceramic, especially ・ Glass ceramic, especially ・ Zerodur,
・ Nitride ceramics, especially ・ Silicon nitride,
・ Carbide ceramics, especially ・ Silicon carbide,
・ Polymer, especially ・ High temperature polymer, especially ・ Teflon,
-Polyetheretherketone (PEEK).

In a highly preferred embodiment, the protruding substrate sample holder according to the present invention is manufactured by a method known from the patent document, European Patent No. 2655006 (EP2655006B 1). In this case, the preferred material is silicon carbide or silicon nitride. In this case, a suitable protrusion structure is a quadrangular pyramid.

The holding device is preferably formed to be heatable and / or coolable according to embodiments of the present invention. In this case, depending on the temperature control mechanism, the substrate of -50 ° C to 500 ° C, preferably -25 ° C to 300 ° C, more preferably 0 ° C to 200 ° C, and most preferably 10 ° C to 100 ° C. Heat treatment is possible.

In another embodiment of the invention, the substrate holder is formed as follows. That is, the "runout" that occurs when the substrate is deliberately deformed by heating and / or cooling means, especially laterally compressed or stretched, and during subsequent contact, before it is still in contact. It is formed so that the error is deformed as well as possible, ideally completely, by the amount required to compensate. In this embodiment, the coefficient of thermal expansion of the lower / first substrate or the lower / first holding device is performed only after the corresponding deformation, so that the lower / first substrate is fixed. Does not need to be given special importance. In a particularly preferred embodiment of the protruding substrate holder according to the invention, the substrate can be brought into contact with the heating gas through the spatial region between the protrusions. To maintain the fixability of the fixing element, the pressure of the heating gas must be lower than the ambient gas that presses the substrate against the substrate holder in the area of the area.

Joining Machine The device according to the invention comprises two holding devices and / or a substrate holder according to the invention. Preferably, at least the upper substrate holder has a measuring hole. The measuring holes are particularly closed and / or gastightly formed.

Embodiments according to the invention operate in a preferably defined, particularly controllable atmosphere, especially at normal pressure.

All embodiments of the invention described above can be performed in a special variation embodiment in a low vacuum, more advantageously in a high vacuum, and even more advantageously in an ultra-high vacuum, in particular. Pressures lower than 100 mbar, preferably lower than 0.1 mbar, more preferably lower than 0.001 mbar, even more preferably lower than 10e-5 mbar, most preferably lower than 10e-8 mbar It can be performed with low pressure. The higher the vacuum or the lower the ambient pressure, the more difficult it is to fix the substrate through the exhaust holes.

Process The first process according to the invention In the first process step according to the invention, the first substrate is loaded into the first substrate holder and the second substrate is loaded into the second substrate holder, especially in the surrounding compartments. Fix it.

In the second process step according to the invention of the first process according to the invention, both substrates are aligned with each other. Substrate alignment is not described in detail herein. Reference is made to the literature, US Pat. No. 6,214,692 (US6214692B1), WO 2015/082020 (WO2015082020A1), WO 2014/202106 (WO2014202106A1). The substrates are specifically aligned with each other prior to the joining process, whereby the overlap of the corresponding structures on their surface (especially less than 2 μm, preferably less than 250 nm, more preferably less than 150 nm). Accurate alignment with an accuracy of less than 100 nm, most preferably less than 50 nm) is guaranteed.

In the third additional process step according to the invention of the first process according to the invention, the substrates are brought closer by the relative motion of the substrate holders facing each other. This forms a well-defined gap (English: gap) between the substrate surfaces. It is also conceivable to adjust such intervals before or during the alignment process. This interval is particularly less than 1000 μm, preferably less than 500 μm, more preferably less than 250 μm, and most preferably less than 100 μm.

According to the present invention, the deviation of the radii of curvature of both substrates is less than 15%, preferably less than 10%, and more preferably less than 5%, particularly preferably at the joint front portion. More preferably, it is less than 2%, and most preferably, both substrates have the same radius of curvature.

In the fourth process step according to the invention of the first process according to the invention, the first and / or second substrate is curved. At the same time, the curvature of the first and / or second substrate is measured and monitored by the sensor. The adjustment loop can automatically adjust the particularly desired curvature on the lower and / or upper substrate. The target value is set. The adjustment loop controls the fixed and / or deformed elements until the desired curvature profile is adjusted. In this case, it is stated that gravity acts in one direction and therefore can have various effects on the deformation of the substrate. This gravity acts in opposition to the curvature of the lower substrate while the upper fixed substrate is further deformed by gravity in the direction of the desired contact point. However, the effect of gravity is so small that it does not need to be considered. According to the present invention, by using bending means or bending changing means, fixing elements, and sensors that are automatically open-loop controlled or closed-loop controlled, for each of both substrates, especially part of the adjusting loop. The desired curvature profile can be adjusted. When both substrates are brought close enough to each other, the two substrates come into contact with each other. The contact may be made by an ever-increasing curvature and / or by the relative proximity of both substrate holders. That is, in the joining method according to the present invention, the substrates are not overlapped flatly, but are first brought into contact with each other at the center M (joining start point). This is done by one of the curved substrates being lightly pressed against the second substrate or being deformed accordingly in the direction of the substrates located opposite each other. After the deformed and bent substrate was released (in the direction of the opposing substrates), the advance of the junction wave was accompanied by minimal force, and thus mainly horizontal minimal strain. In particular, at least partial, preferably most, automatic, continuous and uniform joining along the joining front is performed.

The First Process According to the Invention In the fifth process step according to the invention, the progress, monitoring and control of the junction wave is performed. When the joining start point is arranged in the center of the contact surface of the substrate, a uniform, particularly concentric course of the joining wave can be realized.

It is particularly advantageous that the first and / or second substrate is deformed, preferably curved, laterally and / or convexly and / or concavely, more preferably mirror-symmetrically. Will be done. In other words, according to the present invention, the deformation is carried out specifically by stretching and / or compressing and / or bending the first substrate and / or the second substrate.

Preferably, the substrates have substantially the same diameters D1 and D2, and the deviation of these diameters from each other is particularly less than 5 mm, preferably less than 3 mm, and more preferably less than 1 mm.

According to another aspect of the invention, which is particularly independent, the deformation, preferably the curvature, is by the transforming means or the bending means and / or the bending changing means and / or of the first and / or second holding device. It is performed by temperature control.

The first substrate and / or the second substrate is fixed exclusively in the area around or around the first substrate holder and / or the second substrate holder, or the first and / or second substrate. Thereby, the deformation / curvature / curvature change according to the present invention can be realized relatively easily.

Control of the above-mentioned steps and / or movements and / or course of, in particular the deforming means, or bending means and / or bending changing means, and / or fixing means, mutual proximity of substrates, temperature control, pressure control, and gas. The control of the composition is advantageously carried out via a central control unit, especially via a computer equipped with control software. The sensors described above are used for open-loop control and / or closed-loop control.

In order to give the substrate as much flexibility and stretch freedom as possible within the fixation, it is advantageous for the substrate to be anchored only in the area of the side edges, only in the outer circular segments as far apart as possible.

The first substrate and / or the second substrate are advantageously radial symmetric. The substrate can have any diameter, but the substrate diameter is particularly 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, 18 inches, or 18 inches. Greater than. The thickness of the first substrate and / or the second substrate is 1 μm to 2000 μm, preferably 10 μm to 1500 μm, and more preferably 100 μm to 1000 μm.

In a particular embodiment, the substrate may have a shape different from the square shape or at least a circular shape. A wafer is preferably used as the substrate.

Particularly advantageous, all variable parameters are selected so that the junction wave propagates at the optimum rate possible with respect to the initial and peripheral conditions present. Especially in the present atmosphere, especially at normal pressure, the slowest possible speed of the junction wave is advantageous. The average velocity of the junction wave is particularly slower than 200 cm / s, more preferably slower than 100 cm / s, more preferably slower than 50 cm / s, and extremely preferably slower than 10 cm / s, most advantageous. Is slower than 1 cm / s. In particular, the speed of the junction wave is faster than 0.1 cm / s. In particular, the velocity of the junction wave is constant along the junction front. In a vacuum atmosphere, the speed of the junction wave will automatically increase. This is because the substrates that are bonded along the junction line do not have to overcome the resistance due to the gas.

Another, particularly independent aspect of the invention is to apply a preload to at least one of the substrates, particularly concentrically with respect to the center M of the contact surface of the substrate, extending outward in the radial direction prior to contact. Then, only affecting the initiation of contact, the substrate is released after the contact of one section of the substrate, especially the center M, and is automatically controlled based on its preload and joined to the opposing substrate. As much as possible, the contact is made almost automatically at the same time. The preload is obtained by the deformation of the first substrate by the deforming means, particularly the bending means and / or the bending changing means, especially the bending. In this case, the deforming means acts on the side opposite to the joining side, especially based on its shape, and the deformation can be controlled by the use of various (particularly replaceable) deforming means accordingly. Control is also performed by the pressure or force that causes the deformation element to act on the substrate. In this case, the effective holding area of the substrate holding with the substrate is reduced, which is advantageous in that the substrate is only partially supported by the holding device. In this way, the small contact surface reduces adhesion between the substrate and the substrate holder. According to the present invention, since the fixing is performed in the entire circumference region of the substrate, effective fixing is performed, and at the same time, as little effective holding area as possible between the holding contour of the board holder and the board is generated. .. Therefore, since the releasing force required for peeling the substrate is minimal, clean and reliable peeling of the substrate is possible. Delamination is particularly controllable, especially by reducing the negative pressure on the holding surface. Controllable means that after the substrate comes into contact with the second substrate, the substrate remains fixed to the sample holder and only by reducing the negative pressure on the desired (controlled) holding surface is the sample holder (holding). It means that the release of the substrate (wafer) from the device) is performed especially from the inside to the outside. Embodiments according to the present invention, in particular, lead to the ability to perform peeling with very little force. In particular, a plurality of various methods of liberation are disclosed.
-Sudden complete release of the board while the deformation means is stopped,
-Sudden complete release of the substrate when the transforming means is naturally placed in the starting state and thus immediately ceases to act on the substrate.
-Sudden complete release of the substrate, when the transforming means ceases to act on the substrate in stages, but continuously.
-Release of the substrate, preferably from the inside to the outside, in stages, especially for each area, by a fixed, gradual switch-off, performed while the transforming means is acting on the substrate.
-A combination of the above methods.

Embodiments according to the invention disclose, in optimal form, a joining process in which both substrates are curved. However, in general, at least one of the substrates does not have to be deformed. The following table is shown in combination with the above release mechanism.

The features disclosed for the device are similarly applicable as disclosed for the method, and the features disclosed for the method are similarly applicable as disclosed for the device.

Other advantages, features, and details of the present invention will be apparent from the description and drawings of the preferred examples below.

FIG. 1a is a schematic partial view of the first embodiment of the holding device according to the present invention that is not an actual scale, and FIG. 1b is a schematic view that is not an actual scale of the second embodiment of the holding device according to the present invention. 1c is a schematic partial view which is not an actual scale of the third embodiment of the holding device according to the present invention, and FIG. 1d is an actual fourth embodiment of the holding device according to the present invention. 1e is a non-scale partial view of the above, FIG. 1e is a non-actual partial view of the first embodiment of the bending (modification) means by the holding device according to the present invention, and FIG. 1f is a book. It is a schematic partial view which is not the actual scale of the 2nd Embodiment of the bending (modification) means by the holding device by invention. FIG. 5 is a schematic plan view of the fifth embodiment of the holding device according to the present invention, which is not an actual scale. It is a schematic plan view which is not the actual scale of the 6th Embodiment of the holding device according to this invention. FIG. 5 is a schematic plan view of the seventh embodiment of the holding device according to the present invention, which is not an actual scale. It is a schematic plan view which is not the actual scale of the 8th Embodiment of the holding device according to this invention. 9 is a schematic plan view of the holding device according to the present invention, which is not an actual scale. 3a to 3e are schematic side views and plan views which are not the actual scale of the embodiment of the raised portion according to the present invention. It is a figure which shows the schematic cross-sectional view which is not the actual scale of the embodiment of the joining machine by this invention in the 1st method step of the method by this invention, together with a pressure graph and a distance graph. It is a schematic cross-sectional view which is not the actual scale of the embodiment of FIG. 4a in another method step. It is a schematic cross-sectional view which is not the actual scale of the embodiment of FIG. 4a in another method step. It is a schematic cross-sectional view which is not the actual scale of the embodiment of FIG. 4a in another method step. It is a schematic cross-sectional view which is not the actual scale of the embodiment of FIG. 4a in another method step.

In the drawings, the same components and components having the same function are given the same reference numerals.

FIG. 1a shows a schematic partial view of the cross section of the first configuration of the holding device 1 (optionally also referred to as a substrate holder) according to the present invention, which is not at the correct scale. In this case, only the edge region R provided with the fixing element 2 (fixing means) is shown.

The holding device 1 is preferably composed of a plurality of areas Zi existing in the edge region R. Each area Zi has a plurality of fixed elements 2. FIG. 1a shows, for example, two areas Z1 and Z2. The first area Z1 shows four fixing elements 2 in cross section, and the second area Z2 shows two fixing elements 2. In particular, the area Zi may be restricted to the edge region R of the substrate holder 1 or may be distributed over the entire substrate holder 1.

The fixing element 2 is used to fix the substrate holding surface 4a of the first, particularly upper substrate 4o, or the second, particularly lower substrate 4u.

Preferably, a plurality of sensors 3, 3', particularly distance sensors, are located on the holding surface 1s. The sensor is used to measure the physical and / or chemical properties between the fixed substrate 4 and the holding surface 1s. Sensors 3 and 3'are, in particular, distance sensors that measure the distance between the holding surface 1s and the substrate holding surface 4a.

The substrate holder 1 is preferably configured such that the bending elements 5, 5'(curving means) are present at the center C (see FIGS. 1e and 1f). With this bending element, the boards 4o and 4u fixed to the board holder 1 can be bent. Particularly preferably, the curved element 5 is a fluid outflow opening, through which gas, particularly compressed gas, can be discharged between the substrate holder 1 and the substrate 4. The positive pressure causes the substrate 4 to be curved and at the same time fixed or controlled and released by the fixing element 2.

In the selective configuration according to the invention shown in FIG. 1f, the curved element 5'is a pin, which extends through the holding device 1 and is perpendicular to the holding device. It is formed so as to be movable (curving means or bending changing means).

The description of FIGS. 1e and 1f applies similarly to the configuration according to FIGS. 1a-1d.

FIG. 1b shows a substrate holder 1'with a second configuration according to the present invention. The substrate holder 1'consists of a plurality of regions Zi preferably located in the edge region R'. Each area Zi can generally have a plurality of fixed elements 2'. The fixing element 2'is an electrode for static electricity fixing. FIG. 1b shows, for example, two areas Z1 and Z2. Two fixed elements 2'are shown in cross section in the first area Z1 and three fixed elements 2'are shown in cross section in the second area Z2. In particular, the area Zi may be restricted to the outer edge of the substrate holder 1'or may be distributed throughout the substrate holder 1'.

Preferably, a plurality of sensors 3, 3', particularly distance sensors, are located on the holding surface 1s'. Sensors 3, 3'are used to measure the physical and / or chemical properties between the fixed substrate 4 and the holding surface 1s'. Sensors 3 and 3'are, in particular, distance sensors that measure the distance between the holding surface 1s' and the substrate holding surface 4a.

FIG. 1c discloses a substrate holder 1 ″ having a third configuration according to the present invention. The substrate holder 1 ″ preferably comprises a plurality of regions Zi located exclusively in the edge region R ″. Each area Zi particularly has a plurality of fixed elements 2 ″.

The fixing element 2 ″ is a spatial region 9 between the web 8 or the edge element 10 adjacent to the substrate holding surface 4a, the web 8 and the bottom surface penetrated by the conduit 6. In the pipeline 6, the substrates 4o and 4u are sucked, and the pressure for fixing the substrates 4o and 4u is adjusted by this.

A plurality of protrusions 7 are particularly located in the space region 9, and the substrates 4o and 4u are placed on these protrusions. The protrusions 7 work in particular to avoid excessive contamination. The protrusions 7 are shown larger than average in FIG. 1c for clarity. In reality, the protrusion 7 is significantly smaller than the thickness of the substrate holder 1 ″.

FIG. 1c shows, for example, two areas Z1 and Z2. The first area Z1 shows three fixed elements 2 ″ in cross section, and the second area Z2 also shows three fixed elements 2 ″ in cross section. In particular, the area Zi may be confined to the outer edge of the substrate holder 1 ″ or may be distributed throughout the substrate holder 1 ″.

Preferably, the plurality of sensors 3, 3'are located on the protrusion 7, in particular the distance sensor, on the protrusion surface 7o of the protrusion 7 which comes into contact with the substrate holding surface 4a in a non-curved state. The sensor is used to measure the physical and / or chemical properties between the fixed substrate 4 and the holding surface 1s ″ defined by the protrusion surface 7o and the surrounding edge element 10. Sensors 3 and 3'are, in particular, distance sensors that measure the distance between the protrusion surface 7o and the substrate surface 4o.

FIG. 1d shows a substrate holder 1 ″ ″ having a fourth configuration according to the present invention. The substrate holder 1 ″ is particularly composed of a plurality of regions Zi preferably located in the edge region R ″ ″. Each area Zi has a plurality of fixed elements 2 ″ ″.

The fixed element 2 ″ is a spatial region 9 between two adjacent pipelines 6 capable of forming pressure inside. The demarcation of the spatial region 9 is performed only around the holding device 1 ″ by the surrounding edge element 10. Substrates 4o and 4u are placed in an annular shape on the edge element, and the edge element forms a holding surface 1s ″ together with the protrusion surface 7o.

A plurality of protrusions 7 are particularly located in the space region 9, and the substrates 4o and 4u can be held on the protrusion surface 7o of these protrusions. The protrusions 7 work in particular to avoid excessive contamination. The protrusions 7 are shown larger than average in FIG. 1d for clarity. In reality, the protrusions are significantly smaller than the thickness of the substrate holder 1 ″.

FIG. 1d shows, for example, two areas Z1 and Z2. One fixed element 2 "" is shown in cross section in the first area Z1, and one fixed element 2 "" is also shown in cross section in the second area Z2. In particular, the area Zi may be confined to the outer edge of the substrate holder 1 ″ or may be distributed throughout the substrate holder 1 ″ ″.

Preferably, a plurality of sensors 3, 3', particularly distance sensors, are located on the bottom surface of the spatial region 9 between the protrusions 7. Sensors 3, 3'are used to measure the physical and / or chemical properties between the fixed substrate 4 and the bottom surface. Sensors 3 and 3'are, in particular, distance sensors that measure the distance between the bottom surface and the substrate holding surface 4a. Thereby, the distance between the substrate holding surface 1a and the protrusion surface 7o can be calculated based on the known height of the protrusion 7.

In the holding device 1 ^IV shown in FIG. 2a, the fixing elements 2 are arranged in four concentric areas Z1 to Z4. Curved elements 5, 5'(see FIG. 1e or FIG. 1f) are located at the center C of the holding device 1 ^IV. The corresponding fixing elements 2 in the plurality of areas are arranged along a straight line L extending in the radial direction, respectively.

In the holding device ^{1 V} shown in FIG. 2b, the fixed element 2 is arranged in four sections Z1-Z4. The center C of the holding device ^{1 V} curved elements 5,5 '(see FIG. 1e or FIG. 1f) is located. Corresponding fixed elements 2 in the plurality of areas are arranged along a line L'extending, respectively, without passing through the curved element 5, especially the center C. The line L'does not have to be a straight line. The corresponding fixed elements 2 facing each other are arranged symmetrically with respect to the center C.

^{FIG. 2c shows a holding device 1 VI} with a plurality of protrusions 7 surrounded by an edge element 10 as in the configuration according to FIG. 1c. A space region 9 that functions as a ^{fixed element 2 IV} during exhaust is located between the protrusions 7. Exhaust is performed through the pipeline 6. In such a configuration of the present invention, there is no web 8 separating the spatial regions 9 from each other, so that the fluid brought in through the curved element 5 (see FIG. 1e) is sucked back directly through the passage 6. Is issued. Therefore, such a configuration according to the present invention is an example of a substrate holder in which a static laminar flow is formed between ^{the substrate holder 1 VI and the substrates 4o and 4u.}

In the configuration of the present invention shown in FIG. 2d, a plurality of areas Z each having three fixing elements 2 are provided. Area Z is configured as a hexagon and at least almost covers the holding surface. The center C and the periphery are not covered.

In the configuration of the present invention shown in FIG. 2e, the fixing elements 2 are arranged along one spiral. In this case, the entire holding surface 1s is only one area Z. It is conceivable to drive and control the fixed elements individually or in groups. Curved elements 5, 5'are arranged at the end and center C of the spiral.

All configurations according to FIGS. 2a-2e are holding devices in which fixation is performed as negative pressure fixation or vacuum fixation. Similarly, a suitable substrate holder for static electricity fixing can also be realized. Sensors 3 and 3'are not shown for clarity, but may be configured accordingly as configured according to FIGS. 1a-1d.

3a to 3e show examples of the shapes of the raised portions 7, 7 ″, 7 ″, 7 ″ ″, and 7 ″ ″. The shape of FIG. 3a consists of a cylindrical substrate with a rounded head. The shape of FIG. 3b consists of a cylindrical substrate with a flat head. The shape of FIG. 3c consists of a hemispherical substrate. The shape of FIG. 3d is composed of a triangular pyramid. The shape of FIG. 3e is composed of a quadrangular pyramid.

FIG. 4a shows a joining machine 13 according to the present invention in which the contact surfaces 4k of the first / upper substrate 4o and the second / lower substrate 4u are brought into contact with each other and joined. The joining machine 13 includes a lower substrate holder 1u and an upper substrate holder 1o. The substrate holders 1u and 1o particularly hold the above-mentioned holding devices 1, 1', 1 ", 1"", 1 ^{IV for holding the first / upper substrate 4o and the second / lower substrate 4u.} , 1 ^V , 1 ^VI , in which case the lower substrate holder 1u may be configured or equipped to be different from the upper substrate holder 1o.

The upper substrate holder 1o preferably has a measurement hole 12, and the substrate 4o can be measured from the back surface of the substrate holder 1o through the measurement hole 12. Sensors may be selectively placed in the measurement holes. The measuring hole 12 is particularly arranged between the curvature changing means and the fixing element. Alternatively or additionally, the lower substrate holder 1u may have a corresponding measurement hole 12. The measurement hole penetrates the holding device 1 and extends perpendicularly to the holding surface 1s in particular. The measuring holes 12 are arranged at equal intervals with respect to the center of the holding surface 1s. Preferably, the measuring holes 12 are arranged at a distance of 180 ° or 120 ° from each other.

The substrate holders 1u and 1o have a holding surface 1s provided with a plurality of fixing elements 2 and sensors 3, 3'. The fixing element 2 is exhausted through the pipeline 6 to fix the substrates 4u and 4o. Graphs are drawn above and below the board holders 1u and 1o, and in each of these graphs, the distance d between the sensor 3 configured as a distance sensor and the boards 4u and 4o is in the x direction (board). Shown for each x position along the diameter). The distance sensor 3 is distributed and arranged from the bending changing means 5 to the fixing means. Therefore, the distance sensor extends over a partial surface of the holding surface 1s.

A sensor 3'configured as a pressure sensor is arranged in the region of the fixing means 2, and the sensor 3'between the substrate 4u and 4o and the substrate holder 1u and 1o along the x position of the sensor 3'. The pressure p1 is measured at.

In the distance graph, the target curves 15u and 15o set by the software and the actual curves 14u and 14o measured by the distance sensor are displayed. In particular, the upper substrate 4o has an actual curvature 14o that exists based on gravity, and the lower substrate 4u is placed flat, so that in the case of the present invention, the actual curvature 14u is present. Not (actually it has very little). However, it is possible that the actual curvature 14o caused by gravity is negligibly small. The bicurves 15u, 15o to be achieved are mirror-symmetrical in the examples. Any curvature 15u, 15o can be set. The pressure distributions 16u and 16o indicate a pressure drop in the working region of the fixed element 2. This indicates that the substrates 4u and 4o are fixed.

The process steps for aligning the two substrates 4u and 4o with each other are not shown.

FIG. 4b shows the joining machine 13 in another process step. Both substrates 4u and 4o are brought closer to each other by the relative movement of both substrate holders 1u and 1o. Other points are unchanged from the state shown in FIG. 4a.

FIG. 4c shows the joining machine 13 in another process step. In the illustrated example, the use of the curved element 5, which is the gas outflow opening through which the gas at pressure p2 flows, brings both substrates 4u, 4o to the target curvature, in which case the pressure adjustment is preferably a distance sensor. It is done by 3. For closed-loop / open-loop control, the pressure of the fixed element 2 can also be used so that the fixed element can also assume the role of bending means 5,5'or bending changing means 5,5'. Therefore, in the present invention, the fixed element 2 is also regarded as a bending means.

In the illustrated example, for this reason, one pressure of the fixing element 2 is increased from pressure p1 to pressure p0 in order to achieve the desired curvature prior to contact of the substrates 4o, 4u. In the illustrated example, only three pressure values p0, p1 and p2 are shown for simplicity. The pressure value is particularly continuous and / or always closed loop controllable / open loop controllable.

FIG. 4d shows the joining machine 13 in another process step. Both substrates 4u and 4o form a junction wave that spreads outward in the radial direction due to the proximity of the substrates 4u and 4o. In this case, the curvature of the substrates 4u and 4o changes continuously (curvature changing means). In this case, the curvature change of the lower substrate 4u and the upper substrate 4o is continuously monitored by the distance sensor, and if necessary, desired or set by the bending element 5 and / or the fixing element 2 each time. The curvature is modified so that the desired curvature is achieved (curvature changing means). The important parameters are the radius of curvature R1 of the upper substrate 4o and the radius of curvature R2 of the lower substrate 4u at the point of the junction wave.

The pressure in the rows of the four inner fixed elements 2 arranged in the circumferential direction is simultaneously increased to p0 in the upper holding device 1o and the lower holding device 1u. As a result, the substrates 4u and 4o lose their continuous adhesion to the holding surface 1s, especially from the inside to the outside, whereby the pressure p2 from the curved element 5 can be further expanded.

By controlling, the runout error is minimized by considering the curvature and curvature change of the substrates 4o and 4u.

FIG. 4e shows the joining machine 13 in another process step. Both substrates 4u and 4o are controlled and joined to each other by increasing the pressure in the outermost row of the fixing element 2 of the upper holding device 1o to p0.

1,1', 1'', 1'''Holding device / board holder 1 ^IV , 1 ^V , 1 ^VI holding device / board holder 1o 1st holding device / upper board holder 1u 2nd holding device / bottom Side board holder 1s, 1s', 1s'', 1s''' Holding surface 2,2', 2'', 2'''Fixed element 2o'''Fixed element surface 3,3' Sensor 4o 1st / Upper substrate 4u Second / Lower substrate 4a Substrate holding surface 5,5'Curved element 6 Pipeline 7,7', 7'', 7''', 7'''' Raised part / protrusion 7o Projection surface 8 Web 9 Spatial area 10 Edge element 11 Projection plane 12 Measuring hole 13 Joiner 14u, 14o Actual curvature 15u, 15o Target curvature 16u, 16o Pressure passage L, L'line x Position d Distance p Pressure R1, R2 Curvature radius

Claims (14)

A method of joining a first substrate (4o) to a second substrate (4u) at contact surfaces (4k) of the substrates (4o, 4u) facing each other in the following steps, particularly the following sequence. ,
The first substrate (4o) is held on the first holding surface (1s, 1s', of the first holding device (1, 1', 1'', 1''', 1 ^IV , 1 ^V , 1 ^VI). 1s'', 1s''''), and the second substrate (4u) is held by the second holding device (1,1', 1'', 1'''', 1 ^IV , 1 ^V , 1 ^VI. ) On the second holding surface (1s, 1s', 1s'', 1s'''),
In a method having a step of bending the contact surfaces (4k) before contacting the contact surfaces (4k) with each other.
It is characterized in that the curvature change of the contact surface (4k) of the first substrate (4o) and / or the curvature change of the contact surface (4k) of the second substrate (4u) is controlled during joining. A method of joining the first substrate (4o) to the second substrate (4u). The first aspect of claim 1, wherein the curvature and / or curvature modification is mirror-symmetrically and / or concentrically adjusted and / or controlled with respect to the contact surfaces (4k) prior to contact between the contact surfaces (4k). Method. The method of claim 1 or 2, wherein at least one of the curvatures and / or curvature changes is performed by a particularly mechanical, bending means (5'), particularly a pin. The method according to any one of claims 1 to 3, wherein at least one of the curvature and / or the curvature change is adjusted and / or controlled by fluid pressurization by a fluid that directly applies a load to the substrate. .. The holding surface (1s, 1s', 1s'', 1s'''' of the first substrate (4o) and / or the second substrate (4u), particularly in a ring shape, preferably in an annular shape. ), In particular, any one of claims 1 to 4, which is fixed by a fixing means arranged exclusively within the range of the side edges (4os, 4us) of the substrate (4o, 4u). The method described. The fixing means is particularly uniformly distributed over the holding surfaces (1s, 1s', 1s'', 1s''') and is preferably divided into a plurality of areas concentrically arranged, in particular. The method of claim 5, wherein the individually controllable fixed element (2) is provided. The first holding surface (1s, 1s', 1s'', 1s''') and / or the second holding surface (1s, 1s', 1s'', 1s'''), particularly the first The first holding plane of the holding surface (1s, 1s', 1s'', 1s''') and the second holding surface (1s, 1s', 1s'', 1s''') of 1. The method according to any one of claims 1 to 6, which is formed from a raised portion (7,7', 7'', 7''', 7'''') forming a holding plane of the above. The curvature and / or curvature modification is performed by a curvature measuring means, particularly a sensor (1s, 1s', 1s'', 1s''') arranged particularly along the first and / or second holding surface (1s, 1s', 1s'', 1s'''' 3) The method according to any one of claims 1 to 7, preferably detected by a distance sensor. A device for joining a first substrate (4o) to a second substrate (4u) at contact surfaces (4k) of the substrates (4o, 4u) facing each other.
A first holding device (1,1', 1'', 1''' that holds the first substrate (4o) on the first holding surface (1s, 1s', 1s'', 1s'''). , 1 ^IV , 1 ^V , 1 ^VI ) and the second substrate (4u) on the second holding surface (1s, 1s', 1s'', 1s'''). 1', 1'', 1''', 1 ^IV , 1 ^V , 1 ^VI ),
In a device having a bending means for bending the contact surfaces (4k) before contacting the contact surfaces (4k) with each other.
The curvature changing means for changing the curvature of the first substrate (4o) and / or the bending changing means for changing the curvature of the second substrate (4u) are controllable during joining. A device for joining the first substrate (4o) to the second substrate (4u). The first holding device (1, 1', 1'', 1''', 1 ^IV , 1 ^V , 1 ^VI ) and / or the second holding device (1, 1', 1'', 1 ''', 1 ^IV , 1 ^V , 1 ^VI ) have particularly mechanical bending and / or fluid pressurizing means to adjust and / or control said bending and / or bending changes. The device according to claim 9. The first holding device (1, 1', 1'', 1''', 1 ^IV , 1 ^V , 1 ^VI ) and / or the second holding device (1, 1', 1'', 1 ''', 1 ^IV , 1 ^V , 1 ^VI ) are particularly ring-shaped, preferably annular, all around the holding surface (1s, 1s', 1s'', 1s'''). The apparatus according to claim 9 or 10, particularly comprising fixing means arranged exclusively within the range of the side edges (4os, 4us) of the substrate (4o, 4u). The fixing means is particularly uniformly distributed over the holding surfaces (1s, 1s', 1s'', 1s''') and is preferably divided into a plurality of areas concentrically arranged, in particular. 11. The apparatus of claim 11, further comprising a individually controllable fixed element (2). The first holding surface (1s, 1s', 1s'', 1s''') and / or the second holding surface (1s, 1s', 1s'', 1s''') are particularly the first holding surface. The first holding plane of the holding surface (1s, 1s', 1s'', 1s'') of 1 and the second holding surface (1s, 1s', 1s'', 1s'''). The apparatus according to any one of claims 9 to 12, which is formed by a raised portion (7,7', 7'', 7''', 7'''') forming a holding plane of 2. .. The curvature and / or curvature modification is particularly performed by a curvature measuring means, particularly a sensor, arranged along the first and / or second holding surface (1s, 1s', 1s'', 1s'''). The device according to any one of claims 9 to 13, which is preferably detectable by a distance sensor.

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