JP2021057337A - Manufacturing method of light emitting module and light emitting module - Google Patents

Manufacturing method of light emitting module and light emitting module Download PDF

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JP2021057337A
JP2021057337A JP2020142552A JP2020142552A JP2021057337A JP 2021057337 A JP2021057337 A JP 2021057337A JP 2020142552 A JP2020142552 A JP 2020142552A JP 2020142552 A JP2020142552 A JP 2020142552A JP 2021057337 A JP2021057337 A JP 2021057337A
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light emitting
light
mask
emitting device
reflecting member
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JP6985630B2 (en
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晃治 田口
Koji Taguchi
晃治 田口
勝又　雅昭
Masaaki Katsumata
雅昭 勝又
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Nichia Chemical Industries Ltd
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Abstract

To provide a manufacturing method of light emitting module which has high connection reliability, and to provide a light emitting module.SOLUTION: A manufacturing method of light emitting module includes: a preparation step of preparing a light emitting device 1 in which electrodes 12a, 12c are provided on an upper surface of a light emitting element 11, a first light reflective member 42 is provided on a side surface of the light emitting element 11, and metal films 2a, 2c are formed on a surface of the electrodes 12a, 12c and the first light reflective member 42; a light emitting device placement step of placing the light emitting devices 1 on a light guide plate 7 by having an interval from each other; a mask formation step of forming a mask for covering the light emitting device 1; a second light reflective member formation step of forming a second light reflective member 6 between the light emitting devices 1, 1 on the light guide plate 7; a mask removal step of removing the mask; and a wiring formation step of forming wiring 8 for connecting with the metal films 2a, 2c on the light emitting device 1 and the second light reflective member 6.SELECTED DRAWING: Figure 1E

Description

本開示は、発光モジュールの製造方法及び発光モジュールに関する。 The present disclosure relates to a method for manufacturing a light emitting module and a light emitting module.

従来、液晶ディスプレイのバックライト等に適用される発光モジュールは、導光板上に配列した発光素子同士の間を白色樹脂で埋めて、発光素子の電極に接続する配線を金属膜で形成することにより、薄型化したものが知られている（例えば、特許文献１）。また、半導体素子の小型化に伴う実装の高密度化を緩和するために、樹脂で平面視サイズをチップよりも一回り大きくした構造の発光装置（Chip On Board：ＣＯＢ）が開発されている。例えば、特許文献２には、平面視で発光素子の電極からチップの外側まで延在する金属膜を実装用の端子とする、薄型の発光装置が記載されている。 Conventionally, a light emitting module applied to a backlight of a liquid crystal display or the like is formed by filling the space between light emitting elements arranged on a light guide plate with white resin and forming a wiring connected to an electrode of the light emitting element with a metal film. , A thinner one is known (for example, Patent Document 1). Further, in order to alleviate the increase in the density of mounting due to the miniaturization of semiconductor elements, a light emitting device (Chip On Board: COB) having a structure in which the plan view size is made of resin one size larger than that of a chip has been developed. For example, Patent Document 2 describes a thin light emitting device having a metal film extending from an electrode of a light emitting element to the outside of a chip as a mounting terminal in a plan view.

特開２０１８−１３３３０４号公報Japanese Unexamined Patent Publication No. 2018-133304 特開２０１７−１１８０９８号公報Japanese Unexamined Patent Publication No. 2017-118098

本開示に係る実施形態は、接続信頼性の高い発光モジュールの製造方法及び発光モジュールを提供することを課題とする。 An object of the present embodiment is to provide a method for manufacturing a light emitting module having high connection reliability and a light emitting module.

本開示の実施形態に係る発光モジュールの製造方法は、発光素子の上面に電極が設けられ、前記発光素子の側面に第１光反射性部材が設けられ、前記電極と前記第１光反射性部材との表面に金属膜が形成された発光装置を準備する準備工程と、前記金属膜を上に向けて、前記発光装置を互いに間隙を空けて導光板上に載置する発光装置載置工程と、前記発光装置の前記金属膜を被覆するマスクを形成するマスク形成工程と、前記導光板上の前記発光装置同士の間隙に、第２光反射性部材を形成する第２光反射性部材形成工程と、前記マスクを除去するマスク除去工程と、前記発光装置及び前記第２光反射性部材の上に、前記発光装置の前記金属膜と接続する配線を形成する配線形成工程と、を含む。 In the method for manufacturing a light emitting module according to the embodiment of the present disclosure, an electrode is provided on the upper surface of the light emitting element, a first light reflecting member is provided on the side surface of the light emitting element, and the electrode and the first light reflecting member are provided. A preparatory step of preparing a light emitting device having a metal film formed on the surface of the light emitting device, and a light emitting device mounting step of placing the light emitting device on a light guide plate with the metal film facing upward and a gap between the light emitting devices. , A mask forming step of forming a mask covering the metal film of the light emitting device, and a second light reflecting member forming step of forming a second light reflecting member in a gap between the light emitting devices on the light guide plate. A mask removing step of removing the mask, and a wiring forming step of forming a wiring connecting the metal film of the light emitting device on the light emitting device and the second light reflecting member.

本開示の実施形態に係る発光モジュールは、導光板と、上面に電極を有し、側面に第１光反射性部材を有し、互いに間隙を空けて前記導光板上に配列された複数の発光素子と、前記電極の上面を露出させて前記発光素子同士の間隙に形成された第２光反射性部材と、前記電極及び前記第１光反射性部材の上面に形成され、前記電極毎にその上面に接続する金属膜と、前記金属膜の少なくとも一部の領域に接続するように、前記金属膜及び前記第２光反射性部材の上面に形成された配線と、を備え、前記金属膜は、平面視で、接続している前記電極から前記発光素子の外側の前記第１光反射性部材の表面まで延在している。 The light emitting module according to the embodiment of the present disclosure has a light guide plate, electrodes on the upper surface, and a first light reflecting member on the side surface, and a plurality of light emitting modules arranged on the light guide plate with a gap between them. The element, the second light-reflecting member formed in the gap between the light emitting elements by exposing the upper surface of the electrode, and the electrode and the upper surface of the first light-reflecting member formed for each of the electrodes. The metal film includes a metal film connected to the upper surface and wiring formed on the upper surface of the metal film and the second light-reflecting member so as to connect to at least a part of the area of the metal film. In a plan view, it extends from the connected electrode to the surface of the first light-reflecting member outside the light emitting element.

本開示に係る実施形態によれば、接続信頼性の高い発光モジュールの製造方法及び発光モジュールを提供することができる。 According to the embodiment according to the present disclosure, it is possible to provide a method for manufacturing a light emitting module having high connection reliability and a light emitting module.

実施形態に係る発光モジュールの外観を模式的に示す平面図である。It is a top view which shows typically the appearance of the light emitting module which concerns on embodiment. 図１Ａに示す発光モジュールの外観を下方から模式的に示す斜視図である。It is a perspective view which shows typically the appearance of the light emitting module shown in FIG. 1A from the bottom. 図１Ａに示す発光モジュールを図１Ｂとは異なる形状の光反射部を有する導光板を用いて構成した場合の外観を下方から模式的に示す斜視図である。It is a perspective view which shows typically the appearance from the bottom when the light emitting module shown in FIG. 1A is configured by using the light guide plate which has the light reflecting part of the shape different from FIG. 1B. 図１Ａの発光素子近傍を拡大して模式的に示す部分拡大図である。FIG. 5 is a partially enlarged view schematically showing an enlarged vicinity of a light emitting element of FIG. 1A. 発光モジュールを図１Ｂに示す導光板を用いて構成した場合の、図１ＡのＩＥ−ＩＥ線における断面を模式的に示す部分断面図である。FIG. 5 is a partial cross-sectional view schematically showing a cross section taken along the line IE-IE of FIG. 1A when the light emitting module is configured by using the light guide plate shown in FIG. 1B. 実施形態に係る発光モジュールに搭載された発光装置の外観を下方から模式的に示す斜視図である。It is a perspective view which shows typically the appearance of the light emitting device mounted on the light emitting module which concerns on embodiment from below. 図２ＡのＩＩＢ−ＩＩＢ線における断面図である。FIG. 2 is a cross-sectional view taken along the line IIB-IIB of FIG. 2A. 実施形態に係る発光モジュールの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の準備工程において発光素子を透光性部材に配列して接合した状態を説明する部分断面図である。FIG. 5 is a partial cross-sectional view illustrating a state in which light emitting elements are arranged and joined to a translucent member in a preparatory step of a method for manufacturing a light emitting module according to an embodiment. 実施形態に係る発光モジュールの製造方法の準備工程において発光素子を第１光反射性部材で覆った状態を説明する部分断面図である。It is a partial cross-sectional view explaining the state which covered the light emitting element with the 1st light reflective member in the preparation process of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の準備工程において発光素子の電極が露出するように第１光反射性部材を研削した状態を説明する部分断面図である。FIG. 5 is a partial cross-sectional view illustrating a state in which the first light reflecting member is ground so that the electrodes of the light emitting element are exposed in the preparation step of the method for manufacturing the light emitting module according to the embodiment. 実施形態に係る発光モジュールの製造方法の準備工程において金属膜を成膜した状態を説明する部分断面図である。It is a partial cross-sectional view explaining the state which formed the metal film in the preparation process of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の準備工程において発光装置の個片化前の状態を説明する部分断面図である。It is a partial cross-sectional view explaining the state before individualization of the light emitting device in the preparation process of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の発光装置載置工程を説明する部分断面図である。It is a partial cross-sectional view explaining the light emitting device mounting process of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法のマスク形成工程を説明する部分断面図である。It is a partial cross-sectional view explaining the mask forming process of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の第２光反射性部材形成工程において発光装置を第２光反射性部材で覆った状態を説明する部分断面図である。It is a partial cross-sectional view explaining the state which covered the light emitting device with the 2nd light reflective member in the process of forming the 2nd light reflective member of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の第２光反射性部材形成工程においてマスクが露出するように第２光反射性部材を研削した状態を説明する部分断面図である。It is a partial cross-sectional view explaining the state which grounded the 2nd light reflective member so that a mask is exposed in the 2nd light reflective member forming step of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法のマスク除去工程を説明する部分断面図である。It is a partial cross-sectional view explaining the mask removal process of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の変形例のマスク形成工程を説明する部分断面図である。It is a partial cross-sectional view explaining the mask forming process of the modification of the manufacturing method of the light emitting module which concerns on embodiment. 実施形態に係る発光モジュールの製造方法の変形例のマスク除去工程を説明する部分断面図である。It is a partial cross-sectional view explaining the mask removal process of the modification of the manufacturing method of the light emitting module which concerns on embodiment.

以下、発光モジュール及び発光モジュールの製造方法について、図面を参照して説明する。以下の説明において参照する図面は、本開示の実施形態を概略的に示しているため、図面に示す部材は、大きさや位置関係等を誇張していることがあり、また、形状を単純化していることがある。また、以下の説明において、同一の名称、符号は、原則として同一の又は同質の部材や工程を示すものであり、詳細な説明を適宜省略する。 Hereinafter, the light emitting module and the manufacturing method of the light emitting module will be described with reference to the drawings. Since the drawings referred to in the following description schematically show the embodiments of the present disclosure, the members shown in the drawings may exaggerate the size, positional relationship, etc., and the shape may be simplified. There may be. Further, in the following description, the same names and reference numerals indicate members and processes of the same or the same quality in principle, and detailed description thereof will be omitted as appropriate.

〔発光モジュール〕
実施形態に係る発光モジュールの構成について、図１Ａ〜１Ｅを参照して説明する。図１Ａは、実施形態に係る発光モジュールの外観を模式的に示す平面図である。図１Ｂは、図１Ａに示す発光モジュールの外観を下方から模式的に示す斜視図である。図１Ｃは図１Ａに示す発光モジュールを図１Ｂとは異なる形状の光反射部を有する導光板を用いて構成した場合の外観を下方から模式的に示す斜視図である。図１Ｄは、図１Ａの発光素子近傍を拡大して模式的に示す部分拡大図である。図１Ｅは、発光モジュールを図１Ｂに示す導光板を用いて構成した場合の、図１ＡのＩＥ−ＩＥ線における断面を模式的に示す部分断面図である。 [Light emitting module]
The configuration of the light emitting module according to the embodiment will be described with reference to FIGS. 1A to 1E. FIG. 1A is a plan view schematically showing the appearance of the light emitting module according to the embodiment. FIG. 1B is a perspective view schematically showing the appearance of the light emitting module shown in FIG. 1A from below. FIG. 1C is a perspective view schematically showing the appearance of the light emitting module shown in FIG. 1A from below when the light emitting module is configured by using a light guide plate having a light reflecting portion having a shape different from that of FIG. 1B. FIG. 1D is a partially enlarged view schematically showing an enlarged vicinity of the light emitting element of FIG. 1A. FIG. 1E is a partial cross-sectional view schematically showing a cross section taken along the line IE-IE of FIG. 1A when the light emitting module is configured by using the light guide plate shown in FIG. 1B.

発光モジュール１０は、導光板７と、上面に電極１２ａ，１２ｃを有し、互いに間隙を空けて導光板７上に配列された複数の発光素子１１と、電極１２ａ，１２ｃの上面を露出させて発光素子１１，１１間に形成された第１光反射性部材４２及び第２光反射性部材６と、電極１２ａ，１２ｃ及び第１光反射性部材４２の上面に形成され、電極１２ａ，１２ｃ毎にその上面に接続する金属膜２ａ，２ｃと、金属膜２ａ，２ｃの少なくとも一部の領域に接続するように、金属膜２ａ，２ｃ及び第２光反射性部材６の上面に形成された配線８と、を備えている。そして、金属膜２ａ，２ｃは、平面視で、接続している電極１２ａ，１２ｃから発光素子１１の外側まで延在している。さらに、発光モジュール１０は、発光素子１１と第１光反射性部材４２との間に、発光素子１１の側面に接続する導光性部材４１を備え、発光素子１１の下側の導光板７との間に透光性部材３（図２Ｂ参照）及び接合部材５を備えている。 The light emitting module 10 has a light guide plate 7 and electrodes 12a and 12c on the upper surface thereof, and exposes a plurality of light emitting elements 11 arranged on the light guide plate 7 with a gap between them and the upper surfaces of the electrodes 12a and 12c. The first light-reflecting member 42 and the second light-reflecting member 6 formed between the light-emitting elements 11 and 11 and the electrodes 12a and 12c and the first light-reflecting member 42 are formed on the upper surfaces of the electrodes 12a and 12c. Wiring formed on the upper surfaces of the metal films 2a, 2c and the second light-reflecting member 6 so as to connect to the metal films 2a, 2c connected to the upper surface thereof and at least a part of the regions of the metal films 2a, 2c. 8 and. The metal films 2a and 2c extend from the connected electrodes 12a and 12c to the outside of the light emitting element 11 in a plan view. Further, the light emitting module 10 is provided with a light guide member 41 connected to the side surface of the light emitting element 11 between the light emitting element 11 and the first light reflecting member 42, and is provided with a light guide plate 7 below the light emitting element 11. A translucent member 3 (see FIG. 2B) and a joining member 5 are provided between the two.

発光モジュール１０は、バックライト等に適用される面状発光装置であり、間隙を空けて配列された発光素子１１が発光した光を、導光板７で面内均一化して、導光板７側（図１Ｅにおける下側）へ照射する。発光モジュール１０は、平面視における形状および寸法を、用途に応じて適宜選択することができ、ここでは、平面視形状を矩形とする。また、発光モジュール１０は、用途や発光素子１１の輝度等に応じて発光素子１１の配列ピッチを適宜選択することができ、配列ピッチと発光モジュール１０の寸法に基づいて発光素子１１の個数が決定される。例えば、発光モジュール１０は、チップサイズ１００〜２００μｍの発光素子１１を備え、その配列ピッチ、つまり隣り合う発光素子１１，１１の中心間隔が５〜１０ｍｍの範囲で設計されている。ここでは、簡潔に説明するために、発光モジュール１０は、一例として、１６個の発光素子１１を、矩形格子状に４×４に配列して備えるものとして説明する。また、発光モジュール１０の発光素子１１の１個分毎に当該発光素子１１が中心に位置するように区画した矩形領域をセルと称し、各図面において、導光板７にセルの境界線を仮想的に付す。 The light emitting module 10 is a planar light emitting device applied to a backlight or the like, and the light emitted by the light emitting elements 11 arranged with a gap is made uniform in the plane by the light guide plate 7 to be equalized on the light guide plate 7 side (light emitting module 7). Irradiate to the lower side in FIG. 1E). The shape and dimensions of the light emitting module 10 in a plan view can be appropriately selected according to the intended use, and here, the shape in a plan view is a rectangle. Further, the light emitting module 10 can appropriately select the arrangement pitch of the light emitting elements 11 according to the application, the brightness of the light emitting element 11, and the like, and the number of the light emitting elements 11 is determined based on the arrangement pitch and the dimensions of the light emitting module 10. Will be done. For example, the light emitting module 10 includes a light emitting element 11 having a chip size of 100 to 200 μm, and is designed so that the arrangement pitch thereof, that is, the center spacing of the adjacent light emitting elements 11 and 11 is in the range of 5 to 10 mm. Here, for the sake of brevity, the light emitting module 10 will be described as an example in which 16 light emitting elements 11 are arranged in a rectangular grid pattern in a 4 × 4 manner. Further, a rectangular region defined so that the light emitting element 11 is located at the center of each light emitting element 11 of the light emitting module 10 is referred to as a cell, and in each drawing, the boundary line of the cell is virtually set on the light guide plate 7. Attached to.

発光モジュール１０は、全体の寸法や配列ピッチに対して極めて小さい発光素子１１を配列して備えるために、後記製造方法で説明するように、１個の発光素子１１を、第１光反射性部材４２等で封止した発光装置１として導光板７上に配列して製造される。以下、発光装置及びこれを構成する各部材について、図２Ａ，２Ｂ及び図１Ｂ、１Ｃを参照して説明する。図２Ａは、実施形態に係る発光モジュールに搭載された発光装置の外観を下方から模式的に示す斜視図である。図２Ｂは、図２ＡのＩＩＢ−ＩＩＢ線における断面図である。なお、図２Ａにおいては、透光性部材３及び導光性部材４１を透明として輪郭線のみで表す。 In order to arrange and include light emitting elements 11 that are extremely small with respect to the overall dimensions and arrangement pitch, the light emitting module 10 includes one light emitting element 11 as a first light reflecting member, as will be described later in the manufacturing method. It is manufactured by arranging it on a light guide plate 7 as a light emitting device 1 sealed with 42 or the like. Hereinafter, the light emitting device and each member constituting the light emitting device will be described with reference to FIGS. 2A and 2B and FIGS. 1B and 1C. FIG. 2A is a perspective view schematically showing the appearance of the light emitting device mounted on the light emitting module according to the embodiment from below. FIG. 2B is a cross-sectional view taken along the line IIB-IIB of FIG. 2A. In FIG. 2A, the translucent member 3 and the light guide member 41 are transparent and are represented only by contour lines.

（発光装置）
発光装置１は、発光素子１１と、発光素子１１の一対の電極１２ａ，１２ｃが形成された面と反対側の面に接合された板状の透光性部材３と、透光性部材３と発光素子１１とを接合すると共に発光素子１１の側面を被覆する導光性部材４１と、発光素子１１及び導光性部材４１を被覆する第１光反射性部材４２と、透光性部材３と対向する面に設けられて電極１２ａ，１２ｃにそれぞれ接続する金属膜２ａ，２ｃと、を有する。発光装置１は、ファンアウト構造のＣＳＰであり、透光性部材３の側へ光を照射する。そして、発光装置１は、略直方体形状に形成され、平面視形状が、ここでは正方形で、例えば一辺の長さが発光モジュール１０における配列ピッチの１／１０程度に設計されている。なお、発光装置１は、ここでは、透光性部材３の側を下とし、金属膜２ａ，２ｃが形成された面を上面として説明する。 (Light emitting device)
The light emitting device 1 includes a light emitting element 11, a plate-shaped translucent member 3 joined to a surface opposite to the surface on which the pair of electrodes 12a and 12c of the light emitting element 11 are formed, and a translucent member 3. A light guide member 41 that joins the light emitting element 11 and covers the side surface of the light emitting element 11, a first light reflective member 42 that covers the light emitting element 11 and the light guide member 41, and a light transmitting member 3. It has metal films 2a and 2c provided on opposite surfaces and connected to the electrodes 12a and 12c, respectively. The light emitting device 1 is a CSP having a fan-out structure, and irradiates light to the side of the translucent member 3. The light emitting device 1 is formed in a substantially rectangular parallelepiped shape, and the plan view shape is square here, for example, the length of one side is designed to be about 1/10 of the arrangement pitch in the light emitting module 10. Here, the light emitting device 1 will be described with the side of the translucent member 3 facing down and the surface on which the metal films 2a and 2c are formed as the top surface.

発光素子１１は、上面に電極１２ａ，１２ｃを備え、主に下面と側面から光を照射する半導体発光素子である。発光素子１１は、フリップチップ実装される半導体発光素子を適用することが好ましい。発光素子１１は、形状や寸法等は任意のものを選択することができ、一例として、平面視形状が正方形とする。また、発光素子１１は、発光色は特に限定されず、発光モジュール１０の用途に応じて任意の波長のものを選択することができ、例えば、４３０〜４７０ｎｍに発光ピークを有する青色発光の発光素子として、ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ（０≦Ｘ≦１、０≦Ｙ≦１、Ｘ＋Ｙ≦１）等のＩｎＧａＮ系の窒化物半導体が挙げられる。また、発光モジュール１０において、発光装置１毎に発光色の異なる発光素子１１を備えていてもよい。 The light emitting element 11 is a semiconductor light emitting element having electrodes 12a and 12c on the upper surface and irradiating light mainly from the lower surface and the side surface. As the light emitting element 11, it is preferable to apply a semiconductor light emitting element mounted on a flip chip. The shape, dimensions, and the like of the light emitting element 11 can be arbitrarily selected, and as an example, the shape in a plan view is square. The light emitting color of the light emitting element 11 is not particularly limited, and an arbitrary wavelength can be selected according to the application of the light emitting module 10. For example, a blue light emitting element having a light emitting peak at 430 to 470 nm. Examples thereof include InGaN-based nitride semiconductors such as In X Al Y Ga 1-XY N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1). Further, the light emitting module 10 may be provided with a light emitting element 11 having a different light emitting color for each light emitting device 1.

電極１２ａ，１２ｃは、発光素子１１に電流を供給するためのアノードとカソードの一対の端子であり、Ｃｕ，Ａｕ等からなるパッド電極である。電極１２ａ，１２ｃは、一例として、発光素子１１の平面視形状である正方形の対角線に沿って並んで配置され、平面視形状が直角三角形に形成されている。 The electrodes 12a and 12c are a pair of terminals of an anode and a cathode for supplying an electric current to the light emitting element 11, and are pad electrodes made of Cu, Au, or the like. As an example, the electrodes 12a and 12c are arranged side by side along the diagonal line of a square which is the plan view shape of the light emitting element 11, and the plan view shape is formed into a right triangle.

透光性部材３は、発光装置１と同じ平面視形状の矩形の板状部材であり、発光装置１の下部に設けられ、発光素子１１が発光する光を透過する材料で形成されている。例えば、透光性部材３は、アクリル、ポリカーボネート、環状ポリオレフィン、ポリエチレンテレフタレート、ポリエステル等の熱可塑性樹脂、エポキシ、シリコーン等の熱硬化性樹脂、またはガラス等を適用することができる。また、透光性部材３は、発光モジュール１０の用途に応じて発光装置１が所望の光色の光を照射するように、波長変換部材として蛍光体を含有していてもよい。蛍光体は、透光性部材３の樹脂材料に分散されてもよいし、ガラス等の無機材料と共に焼結されてもよい。 The translucent member 3 is a rectangular plate-shaped member having the same plan view shape as the light emitting device 1, is provided below the light emitting device 1, and is made of a material that transmits the light emitted by the light emitting element 11. For example, as the translucent member 3, a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, or polyester, a thermosetting resin such as epoxy or silicone, glass, or the like can be applied. Further, the translucent member 3 may contain a phosphor as a wavelength conversion member so that the light emitting device 1 irradiates light of a desired light color according to the application of the light emitting module 10. The phosphor may be dispersed in the resin material of the translucent member 3, or may be sintered together with an inorganic material such as glass.

導光性部材４１は、発光素子１１を透光性部材３に接合するための接着剤であり、発光素子１１が発光する光を透過する材料で形成されている。導光性部材４１は、発光素子１１の下面の透光性部材３との間に設けられると共に、透光性部材３に向けて広がるようにフィレットを形成して発光素子１１の側面を被覆する。導光性部材４１は、絶縁性で、発光素子１１の耐熱温度以下で硬化させることができる流動性の材料で形成されることが好ましい。例えば、導光性部材４１は、エポキシ、シリコーン等の熱硬化性樹脂や半導体素子の封止用のガラス材料等を適用することができる。また、導光性部材４１は、波長変換部材として蛍光体を含有していてもよい。 The light-guiding member 41 is an adhesive for joining the light-emitting element 11 to the light-transmitting member 3, and is made of a material that transmits the light emitted by the light-emitting element 11. The light-guiding member 41 is provided between the light-emitting member 11 and the light-transmitting member 3, and forms a fillet so as to spread toward the light-transmitting member 3 to cover the side surface of the light-emitting element 11. .. The light guide member 41 is preferably formed of a fluid material that is insulating and can be cured below the heat resistant temperature of the light emitting element 11. For example, a thermosetting resin such as epoxy or silicone, a glass material for sealing a semiconductor element, or the like can be applied to the light guide member 41. Further, the light guide member 41 may contain a phosphor as a wavelength conversion member.

第１光反射性部材４２は、発光素子１１が発光する光を反射して透光性部材３から出射させる。第１光反射性部材４２は、電極１２ａ，１２ｃの上面を露出させて発光素子１１及び導光性部材４１を被覆する。第１光反射性部材４２は、絶縁性で、発光素子１１の耐熱温度以下で硬化させることができる流動性の材料で形成されることが好ましい。例えば、第１光反射性部材４２は、導光性部材４１の材料に挙げた熱硬化性樹脂やガラス材料等に、酸化チタン（ＴｉＯ２）等の光反射性物質を添加したもので形成することができる。 The first light-reflecting member 42 reflects the light emitted by the light-emitting element 11 and emits it from the light-transmitting member 3. The first light reflecting member 42 exposes the upper surfaces of the electrodes 12a and 12c to cover the light emitting element 11 and the light guide member 41. The first light-reflecting member 42 is preferably formed of a fluid material that is insulating and can be cured below the heat-resistant temperature of the light-emitting element 11. For example, the first light-reflecting member 42 is formed by adding a light-reflecting substance such as titanium oxide (TiO 2 ) to the thermosetting resin, glass material, or the like listed as the material of the light-guiding member 41. be able to.

金属膜２ａは、発光素子１１の電極１２ａを拡張した発光装置１の外部接続用端子として機能するものであり、電極１２ａの上面に接続されている。同様に、金属膜２ｃは、発光素子１１の電極１２ｃを拡張した発光装置１の外部接続用端子として機能するものであり、電極１２ｃの上面に接続されている。金属膜２ａと金属膜２ｃは、平面視で、電極１２ａ，１２ｃの相似形状である直角三角形に形成され、斜辺同士を対向させて、発光装置１の平面視形状である正方形の対角線に沿って並んで配置される。金属膜２ａ，２ｃは、このような形状及び配置とすることにより、電極１２ａ，１２ｃに短絡させることなくそれぞれ接続することができる。そして、金属膜２ａ，２ｃは、電極として、より広い面積で機能することができ、また、容易に形成することができる。金属膜２ａ，２ｃは、Ｃｕ，Ｎｉ等の配線に適用される金属が適用され、２種類以上の金属膜が積層されてもよい。 The metal film 2a functions as an external connection terminal of the light emitting device 1 in which the electrode 12a of the light emitting element 11 is expanded, and is connected to the upper surface of the electrode 12a. Similarly, the metal film 2c functions as an external connection terminal of the light emitting device 1 in which the electrode 12c of the light emitting element 11 is expanded, and is connected to the upper surface of the electrode 12c. The metal film 2a and the metal film 2c are formed in a right triangle having a similar shape to the electrodes 12a and 12c in a plan view, and the hypotenuses face each other along the diagonal line of a square which is a plan view shape of the light emitting device 1. Arranged side by side. By adopting such a shape and arrangement, the metal films 2a and 2c can be connected to the electrodes 12a and 12c, respectively, without short-circuiting. The metal films 2a and 2c can function as electrodes in a wider area and can be easily formed. Metals applied to wiring such as Cu and Ni are applied to the metal films 2a and 2c, and two or more types of metal films may be laminated.

（導光板）
導光板７は、上面に間隔を空けて配列された発光素子１１が発光した光を、下方へ効率よく、かつ面内均一に照射する光学部材である。そのために、導光板７は、図１Ｂまたは図１Ｃ，及び図１Ｅに示すように、光透過部７１、光反射部７２、及び光遮蔽部７３を備える。
光透過部７１は、発光素子１１が発光する光を透過する材料で形成され、両面のそれぞれに、発光素子１１の配置に合わせて凹部分を有する板状に形成されている。光透過部７１の上面には、セルの縦横の境界線の交点を最深部とする円錐形状又は四角錐形状の凹部（図１Ｂ参照）、もしくは、セルの縦横の境界線に沿って延び、境界線上で最深部となる断面Ｖ字形の溝状の凹部（図１Ｃ参照）が形成されている。さらに、光透過部７１の上面には、セルの中央において、発光装置１を収容するための発光素子設置穴７ｄが形成されている。発光素子設置穴７ｄは、底面が発光装置１の平面視形状を内包し、さらに、前記平面視形状に対して大き過ぎないことが好ましい。また、発光素子設置穴７ｄの深さは、発光装置１の厚さ以下であることが好ましく、透光性部材３の厚さ以下であることがさらに好ましい。一方、光透過部７１の下面には、セルの中央において、円錐台形状の凹部が形成されている。光透過部７１は、発光装置１の透光性部材３の材料として前記に挙げたもので形成することができる。 (Light guide plate)
The light guide plate 7 is an optical member that efficiently and uniformly irradiates the light emitted by the light emitting elements 11 arranged at intervals on the upper surface downward. Therefore, as shown in FIGS. 1B or 1C and 1E, the light guide plate 7 includes a light transmitting portion 71, a light reflecting portion 72, and a light shielding portion 73.
The light transmitting portion 71 is formed of a material that transmits the light emitted by the light emitting element 11, and is formed on both sides in a plate shape having recesses according to the arrangement of the light emitting element 11. The upper surface of the light transmitting portion 71 has a conical or quadrangular pyramid-shaped recess (see FIG. 1B) having the intersection of the vertical and horizontal boundaries of the cell as the deepest part, or extends along the vertical and horizontal boundaries of the cell to form a boundary. A groove-shaped recess (see FIG. 1C) having a V-shaped cross section, which is the deepest part on the line, is formed. Further, on the upper surface of the light transmitting portion 71, a light emitting element installation hole 7d for accommodating the light emitting device 1 is formed in the center of the cell. It is preferable that the bottom surface of the light emitting element installation hole 7d includes the plan view shape of the light emitting device 1 and is not too large with respect to the plan view shape. Further, the depth of the light emitting element installation hole 7d is preferably less than or equal to the thickness of the light emitting device 1, and more preferably less than or equal to the thickness of the translucent member 3. On the other hand, a truncated cone-shaped recess is formed in the center of the cell on the lower surface of the light transmitting portion 71. The light transmitting portion 71 can be formed of the material listed above as the material of the translucent member 3 of the light emitting device 1.

光反射部７２は、光透過部７１の上面を被覆して、光透過部７１を透過してその表面に到達した光を反射して光透過部７１の下面から出射させる。光反射部７２は、発光素子設置穴７ｄを除いて導光板７の上面を平坦化するように、光透過部７１の上面の円錐形状、四角錐形状、または溝状のいずれかとなる凹部に配置され、それぞれの凹部に沿った形状を有する。光透過部７１の上面の凹部を円錐形状に形成する場合、凹部に配置される光反射部７２は、光透過部７１の上面で縦横方向に隣り合う４つのセルの境界線が交差する点を最深部とする円錐形状であり（図１Ｅ参照）、光透過部７１の側端部の凹部に配置される光反射部７２はセルの境界線が側端部に垂直に交わる点を最深部とする半円錐形状であり（図１Ｂ参照）、光透過部７１の角部の凹部に配置される光反射部７２は角部の頂点を最深部とする四分の一円錐形状である（図１Ｂ参照）。また、光透過部７１の上面の凹部を四角錐形状に形成する場合、凹部に配置される光反射部７２は、光透過部７１の上面で縦横方向に隣り合う４つのセルの境界線が交差する点を最深部とする四角錐形状であり（図１Ｅ参照）、その４つの稜線は平面視で４つのセルの境界線と重なり、光透過部７１の側端部の凹部に配置される光反射部７２はセルの境界線が側端部に垂直に交わる点を最深部とし、四角錐の２つの稜線を通る面で四角錐を半分にした三角錐形状であり（図１Ｂ参照）、光透過部７１の角部の凹部に配置される光反射部７２は四角錐をその稜線を通り互いに直交する２つの面で分割して四分の一にした三角錐形状である（図１Ｂ参照）。光透過部７１の上面の凹部を溝状に形成する場合、凹部に配置される光反射部７２は、断面三角形の頂点を下に向けた三角柱を、発光素子１１の配列ピッチで配列し（図１Ｅ参照）、格子状に連結した形状に形成されている（図１Ｃ参照）。光反射部７２は、発光装置１の第１光反射性部材４２の材料として前記に挙げたもので形成することができる。 The light reflecting portion 72 covers the upper surface of the light transmitting portion 71, reflects the light that has passed through the light transmitting portion 71 and reached the surface thereof, and emits the light from the lower surface of the light transmitting portion 71. The light reflecting portion 72 is arranged in a concave portion having a conical shape, a quadrangular pyramid shape, or a groove shape on the upper surface of the light transmitting portion 71 so as to flatten the upper surface of the light guide plate 7 except for the light emitting element installation hole 7d. And have a shape along each recess. When the concave portion on the upper surface of the light transmitting portion 71 is formed in a conical shape, the light reflecting portion 72 arranged in the concave portion is formed at a point where the boundary lines of four cells adjacent to each other in the vertical and horizontal directions intersect on the upper surface of the light transmitting portion 71. It has a conical shape with the deepest part (see FIG. 1E), and the light reflecting part 72 arranged in the recess at the side end of the light transmitting part 71 has a point where the cell boundary line intersects the side end perpendicularly with the deepest part. It has a semi-conical shape (see FIG. 1B), and the light reflecting portion 72 arranged in the concave portion of the corner portion of the light transmitting portion 71 has a quarter cone shape with the apex of the corner portion as the deepest portion (FIG. 1B). reference). Further, when the concave portion on the upper surface of the light transmitting portion 71 is formed in a quadrangular pyramid shape, the light reflecting portion 72 arranged in the concave portion intersects the boundary lines of four cells adjacent to each other in the vertical and horizontal directions on the upper surface of the light transmitting portion 71. It has a quadrangular pyramid shape with the point to be the deepest part (see FIG. 1E), and its four ridges overlap the boundary lines of the four cells in a plan view, and the light is arranged in the recess at the side end of the light transmitting portion 71. The reflecting portion 72 has a triangular pyramid shape in which the point where the boundary line of the cell intersects perpendicularly to the side end portion is the deepest portion, and the quadrangular pyramid is halved on the plane passing through the two ridges of the quadrangular pyramid (see FIG. 1B). The light reflecting portion 72 arranged in the concave portion of the corner portion of the transmitting portion 71 has a triangular pyramid shape obtained by dividing a quadrangular pyramid by two planes orthogonal to each other through its ridge line to make a quarter (see FIG. 1B). .. When the concave portion on the upper surface of the light transmitting portion 71 is formed in a groove shape, the light reflecting portion 72 arranged in the concave portion arranges triangular prisms with the apex of the cross-sectional triangle facing downward at the arrangement pitch of the light emitting element 11 (FIG. (See 1E), formed in a grid-like connected shape (see FIG. 1C). The light reflecting portion 72 can be formed of the material listed above as the material of the first light reflecting member 42 of the light emitting device 1.

光遮蔽部７３は、発光素子１１毎にその直下に配置され、発光素子１１から真下へ強い光が直接に出射しないようにしている。光遮蔽部７３は、光透過部７１の下面の凹部に埋め込まれ、平面視形状が発光装置１と同程度の大きさの円錐台に形成されている。光遮蔽部７３は光を反射することが好ましく、したがって、第１光反射性部材４２の材料として前記に挙げたもので形成することができる。あるいは、光遮蔽部７３は、光の一部を反射して、残りを透過するように構成されてもよい。 The light shielding unit 73 is arranged directly under each light emitting element 11 so that strong light is not directly emitted from the light emitting element 11 directly below. The light shielding portion 73 is embedded in a recess on the lower surface of the light transmitting portion 71, and is formed in a truncated cone having a planar view shape similar to that of the light emitting device 1. The light shielding portion 73 preferably reflects light, and therefore can be formed of the material listed above as the material of the first light reflecting member 42. Alternatively, the light shielding unit 73 may be configured to reflect a part of the light and transmit the rest.

導光板７は、このような構成により、発光素子１１から側方へ出射した光が、光透過部７１を透過して光反射部７２に到達して下方へ反射するので、隣り合う発光素子１１，１１の中間の領域から照射する光の量を多くすることができる。また、導光板７は、発光装置１の直下に光遮蔽部７３が配置されていることにより、この領域に偏ってドットパターン状に強い光が出射することがない。 With such a configuration, in the light guide plate 7, the light emitted laterally from the light emitting element 11 passes through the light transmitting portion 71, reaches the light reflecting portion 72, and is reflected downward. Therefore, the light emitting elements 11 adjacent to each other. , 11 The amount of light emitted from the intermediate region can be increased. Further, since the light shielding portion 73 is arranged directly under the light emitting device 1 in the light guide plate 7, strong light is not emitted in a dot pattern biased to this region.

光透過部７１は、屈折率の異なる複数の材料を組み合わせて、レンズ等の光学機能を付与されていてもよい。また、光透過部７１は、上面及び下面の凹部内面が球面等に形成されたり、上面の凹部内面がフレネルレンズ形状に形成されたりしていてもよい。この場合には、光反射部７２及び光遮蔽部７３はそれに合わせた形状に形成される。また、光反射部７２及び光遮蔽部７３は、少なくとも光透過部７１の凹部の内面を被覆していればよく、したがって、膜状の部材でもよい。また、導光板７は、上面に発光素子設置穴７ｄが形成されていなくてもよい。 The light transmitting portion 71 may be provided with an optical function such as a lens by combining a plurality of materials having different refractive indexes. Further, in the light transmitting portion 71, the inner surfaces of the concave portions on the upper surface and the lower surface may be formed in a spherical surface or the like, or the inner surfaces of the concave portions on the upper surface may be formed in a Fresnel lens shape. In this case, the light reflecting portion 72 and the light shielding portion 73 are formed in a shape corresponding to the light reflecting portion 72 and the light shielding portion 73. Further, the light reflecting portion 72 and the light shielding portion 73 need only cover at least the inner surface of the recess of the light transmitting portion 71, and therefore may be a film-like member. Further, the light guide plate 7 does not have to have the light emitting element installation hole 7d formed on the upper surface thereof.

（接合部材）
接合部材５は、発光装置１を導光板７に接合するための接着剤であり、発光素子１１が発光する光を透過する材料で形成されている。ここでは、導光板７に発光素子設置穴７ｄが形成されているので、接合部材５は、発光装置１の下面と発光素子設置穴７ｄの底面との間に設けられるだけでなく、発光素子設置穴７ｄ内を充填するように発光装置１の下部における側面を被覆し、透光性部材３の側面の全体を被覆することが好ましい。接合部材５は、発光装置１及び導光板７の耐熱温度以下で硬化させることができる流動性の材料で形成されることが好ましく、したがって、発光装置１の導光性部材４１の材料として前記に挙げたもので形成することができる。 (Joining member)
The joining member 5 is an adhesive for joining the light emitting device 1 to the light guide plate 7, and is made of a material that transmits the light emitted by the light emitting element 11. Here, since the light emitting element installation hole 7d is formed in the light guide plate 7, the joining member 5 is not only provided between the lower surface of the light emitting device 1 and the bottom surface of the light emitting element installation hole 7d, but also the light emitting element is installed. It is preferable to cover the side surface of the lower part of the light emitting device 1 so as to fill the inside of the hole 7d, and to cover the entire side surface of the translucent member 3. The joining member 5 is preferably formed of a fluid material that can be cured below the heat resistant temperature of the light emitting device 1 and the light guide plate 7, and therefore, as the material of the light guide member 41 of the light emitting device 1, described above. It can be formed by any of the listed items.

（第２光反射性部材）
第２光反射性部材６は、導光板７上の発光装置１，１間の間隙を埋めて、配線８の形成面を平坦にすると共に、配線８，８間を絶縁する絶縁部材である。さらに、第２光反射性部材６は、接合部材５や導光板７の上面に露出した光透過部７１を被覆して、光を上方に漏らさず反射して下方へ出射させる。第２光反射性部材６は、発光装置１及び導光板７の耐熱温度以下で硬化させることができる流動性の材料で形成されることが好ましく、したがって、発光装置１の第１光反射性部材４２の材料として前記に挙げたもので形成することができる。 (Second light reflective member)
The second light-reflecting member 6 is an insulating member that fills the gap between the light emitting devices 1 and 1 on the light guide plate 7, flattens the forming surface of the wiring 8, and insulates the wiring 8 and 8. Further, the second light reflecting member 6 covers the light transmitting portion 71 exposed on the upper surface of the joining member 5 and the light guide plate 7, reflects the light without leaking upward, and emits the light downward. The second light-reflecting member 6 is preferably formed of a fluid material that can be cured below the heat-resistant temperature of the light-emitting device 1 and the light guide plate 7, and therefore the first light-reflecting member of the light-emitting device 1. The material of 42 can be formed of those listed above.

（配線）
配線８は、金属膜２ａ，２ｃ及び第２光反射性部材６の上面に形成され、発光素子１１に外部から電流を供給するために、金属膜２ａ，２ｃを経由して電気的に接続する。図１Ａに示すように、発光モジュール１０においては、配線８は、２個の発光素子１１を直列に接続し、さらにこの発光素子１１の組を並列に接続する。配線８はさらに、外部との接続パッドとして、アノード、カソードそれぞれの側に面積を拡張した部分が形成されている。配線８は、後記製造方法で説明するように印刷によってパターン形成されるために、銀や銅等の金属フィラーを熱硬化性樹脂材料に混合した導電性ペーストで形成される。配線８が厚いほど、発光モジュール１０の接続信頼性が高くなるが、一方で、製造コストが増大する。具体的には、配線８の厚さは、１μｍ以上５０μｍ以下が好ましく、３μｍ以上がより好ましく、５μｍ以上がさらに好ましい。 (wiring)
The wiring 8 is formed on the upper surfaces of the metal films 2a and 2c and the second light reflecting member 6, and is electrically connected via the metal films 2a and 2c in order to supply an electric current to the light emitting element 11 from the outside. .. As shown in FIG. 1A, in the light emitting module 10, the wiring 8 connects two light emitting elements 11 in series, and further connects a set of the light emitting elements 11 in parallel. Further, the wiring 8 is formed with a portion having an expanded area on each side of the anode and the cathode as a connection pad with the outside. The wiring 8 is formed of a conductive paste in which a metal filler such as silver or copper is mixed with a thermosetting resin material in order to form a pattern by printing as described in the manufacturing method described later. The thicker the wiring 8, the higher the connection reliability of the light emitting module 10, but on the other hand, the manufacturing cost increases. Specifically, the thickness of the wiring 8 is preferably 1 μm or more and 50 μm or less, more preferably 3 μm or more, and further preferably 5 μm or more.

配線８は、発光素子１１との接続における導電性が確保されるように、金属膜２ａ，２ｃにそれぞれ十分な面積で接続し、かつ、各発光装置１における金属膜２ａ，２ｃを短絡させないように、パターン設定される。ここで、配線８は、予め製作されたマスクによって、発光モジュール１０全体でパターン形成される。発光モジュール１０においては、配線８が、左右に対向し合い、発光装置１の金属膜２ａ，２ｃのそれぞれに接続するように、縦にずらして配置される。配線８は、このようなパターン形状に設定されることにより、発光装置１の位置にある程度誤差があっても、金属膜２ａ，２ｃに十分な面積で接続し、かつ短絡させないようにすることができる。 The wiring 8 is connected to the metal films 2a and 2c with a sufficient area so as to ensure conductivity in connection with the light emitting element 11, and the metal films 2a and 2c in each light emitting device 1 are not short-circuited. The pattern is set to. Here, the wiring 8 is patterned by the entire light emitting module 10 by a mask manufactured in advance. In the light emitting module 10, the wirings 8 are arranged so as to face each other on the left and right and vertically offset so as to be connected to the metal films 2a and 2c of the light emitting device 1. By setting the wiring 8 to such a pattern shape, even if there is a certain error in the position of the light emitting device 1, the wiring 8 can be connected to the metal films 2a and 2c with a sufficient area and not short-circuited. it can.

〔発光モジュールの製造方法〕
実施形態に係る発光モジュールの製造方法について、図３を参照して説明する。図３は、実施形態に係る発光モジュールの製造方法を示すフローチャートである。発光モジュールの製造方法は、発光素子１１の電極１２ａ，１２ｃに接続した金属膜２ａ，２ｃが表面に形成された発光装置１を準備する準備工程Ｓ１と、金属膜２ａ，２ｃを上に向けて発光装置１を互いに間隙を空けて導光板７上に載置する発光装置載置工程Ｓ３と、金属膜２ａ，２ｃを被覆するマスクを形成するマスク形成工程Ｓ４と、導光板７上の発光装置１，１同士の間隙に第２光反射性部材６を形成する第２光反射性部材形成工程Ｓ５と、前記マスクを除去するマスク除去工程Ｓ６と、発光装置１及び第２光反射性部材６の上に、金属膜２ａ，２ｃと接続する配線８を形成する配線形成工程Ｓ７と、を含む。さらに、発光装置載置工程Ｓ３よりも前に、導光板７を準備する導光板準備工程Ｓ２を行う。以下、各工程について詳細に説明する。 [Manufacturing method of light emitting module]
A method of manufacturing the light emitting module according to the embodiment will be described with reference to FIG. FIG. 3 is a flowchart showing a method of manufacturing a light emitting module according to an embodiment. The method for manufacturing the light emitting module includes a preparatory step S1 for preparing a light emitting device 1 having metal films 2a and 2c connected to electrodes 12a and 12c of the light emitting element 11 formed on the surface thereof, and the metal films 2a and 2c facing upward. A light emitting device mounting step S3 in which the light emitting devices 1 are placed on the light guide plate 7 with a gap between them, a mask forming step S4 for forming a mask covering the metal films 2a and 2c, and a light emitting device on the light guide plate 7. A second light-reflecting member forming step S5 for forming a second light-reflecting member 6 in a gap between 1, 1 and a mask removing step S6 for removing the mask, and a light emitting device 1 and a second light-reflecting member 6 A wiring forming step S7 for forming the wiring 8 to be connected to the metal films 2a and 2c is included on the top. Further, before the light emitting device mounting step S3, the light guide plate preparation step S2 for preparing the light guide plate 7 is performed. Hereinafter, each step will be described in detail.

（準備工程）
準備工程Ｓ１について、図３及び図４Ａ〜４Ｅを参照して説明する。図４Ａは、実施形態に係る発光モジュールの製造方法の準備工程において発光素子を透光性部材に配列して接合した状態を説明する部分断面図である。図４Ｂは、実施形態に係る発光モジュールの製造方法の準備工程において発光素子を第１光反射性部材で覆った状態を説明する部分断面図である。図４Ｃは、実施形態に係る発光モジュールの製造方法の準備工程において発光素子の電極が露出するように第１光反射性部材を研削した状態を説明する部分断面図である。図４Ｄは、実施形態に係る発光モジュールの製造方法の準備工程において金属膜を成膜した状態を説明する部分断面図である。図４Ｅは、実施形態に係る発光モジュールの製造方法の準備工程において発光装置の個片化前の状態を説明する部分断面図である。 (Preparation process)
The preparation step S1 will be described with reference to FIGS. 3 and 4A to 4E. FIG. 4A is a partial cross-sectional view illustrating a state in which light emitting elements are arranged and joined to a translucent member in a preparatory step of a method for manufacturing a light emitting module according to an embodiment. FIG. 4B is a partial cross-sectional view illustrating a state in which the light emitting element is covered with the first light reflecting member in the preparation step of the method for manufacturing the light emitting module according to the embodiment. FIG. 4C is a partial cross-sectional view illustrating a state in which the first light reflecting member is ground so that the electrodes of the light emitting element are exposed in the preparation step of the method for manufacturing the light emitting module according to the embodiment. FIG. 4D is a partial cross-sectional view illustrating a state in which a metal film is formed in a preparatory step of a method for manufacturing a light emitting module according to an embodiment. FIG. 4E is a partial cross-sectional view illustrating a state before individualization of the light emitting device in the preparation step of the method for manufacturing the light emitting module according to the embodiment.

準備工程Ｓ１は、図１Ｄ及び図２Ａ，２Ｂに示す発光装置１を準備する工程である。準備工程Ｓ１は、発光素子１１を透光性部材３上に配列して接合する発光素子配列工程Ｓ１１と、発光素子１１を第１光反射性部材４２で封止する封止工程Ｓ１２と、金属膜２ａ，２ｃを形成する金属膜形成工程Ｓ１３と、連結した発光装置１を切断して個片化する個片化工程Ｓ１４と、を行う。準備工程Ｓ１は、多数個の発光装置１を二次元配列して連結した状態で製造し、最後に切断して個片化する。 The preparation step S1 is a step of preparing the light emitting device 1 shown in FIGS. 1D and 2A and 2B. The preparation step S1 includes a light emitting element arranging step S11 in which the light emitting elements 11 are arranged and joined on the translucent member 3, a sealing step S12 in which the light emitting element 11 is sealed by the first light reflecting member 42, and a metal. A metal film forming step S13 for forming the films 2a and 2c and an individualizing step S14 for cutting and individualizing the connected light emitting device 1 are performed. The preparatory step S1 is manufactured in a state in which a large number of light emitting devices 1 are two-dimensionally arranged and connected, and finally cut into individual pieces.

発光素子配列工程Ｓ１１は、図４Ａに示すように、発光素子１１を透光性部材３上に所定のピッチで二次元配列し、導光性部材４１で接合する。発光素子１１の配列ピッチは、発光装置１の平面視サイズに、個片化工程Ｓ１４で切断線に沿って削られる分を加算して設定する。ここでは、発光装置１の平面視形状が正方形であるから、発光素子１１を正方格子状に配列する。また、透光性部材３は、発光素子１１の配列ピッチ及び個数に応じた大判サイズとする。まず、大判サイズの透光性部材３上の発光素子１１のそれぞれの載置箇所に、硬化前の導光性部材４１を所定量滴下する。次に、発光素子１１を、電極１２ａ，１２ｃを上に向けて導光性部材４１の上に載置する。そして、導光性部材４１をその材料に対応した条件で硬化させる。なお、大判サイズの透光性部材３の１枚あたりの発光素子１１の個数、すなわち発光装置１の個数は特に規定されない。 In the light emitting element arranging step S11, as shown in FIG. 4A, the light emitting elements 11 are two-dimensionally arranged on the translucent member 3 at a predetermined pitch and joined by the light guide member 41. The arrangement pitch of the light emitting element 11 is set by adding the amount cut along the cutting line in the individualization step S14 to the plan view size of the light emitting device 1. Here, since the light emitting device 1 has a square shape in a plan view, the light emitting elements 11 are arranged in a square grid pattern. Further, the translucent member 3 has a large size according to the arrangement pitch and the number of the light emitting elements 11. First, a predetermined amount of the light guide member 41 before curing is dropped onto each of the mounting locations of the light emitting element 11 on the large format translucent member 3. Next, the light emitting element 11 is placed on the light guide member 41 with the electrodes 12a and 12c facing upward. Then, the light guide member 41 is cured under the conditions corresponding to the material. The number of light emitting elements 11 per large-sized translucent member 3, that is, the number of light emitting devices 1 is not particularly specified.

封止工程Ｓ１２は、上面に電極１２ａ，１２ｃを露出させて発光素子１１を封止する第１光反射性部材４２を形成する。まず、図４Ｂに示すように、硬化前の第１光反射性部材４２を、透光性部材３上に、発光素子１１及び導光性部材４１を完全に覆うように充填する。そして、第１光反射性部材４２をその材料に対応した条件で硬化させる。次に、上面から第１光反射性部材４２を研削して、図４Ｃに示すように、上面に電極１２ａ，１２ｃを露出させる。このとき、電極１２ａ，１２ｃは、第１光反射性部材４２と共にある程度研削されて薄肉化してもよいが、十分な厚さで残存するようにする。 In the sealing step S12, the electrodes 12a and 12c are exposed on the upper surface to form the first light reflecting member 42 that seals the light emitting element 11. First, as shown in FIG. 4B, the first light-reflecting member 42 before curing is filled on the translucent member 3 so as to completely cover the light emitting element 11 and the light-guiding member 41. Then, the first light-reflecting member 42 is cured under the conditions corresponding to the material. Next, the first light reflecting member 42 is ground from the upper surface to expose the electrodes 12a and 12c on the upper surface as shown in FIG. 4C. At this time, the electrodes 12a and 12c may be ground together with the first light-reflecting member 42 to a certain extent to reduce the wall thickness, but the electrodes 12a and 12c may remain with a sufficient thickness.

金属膜形成工程Ｓ１３は、上面に、金属膜２ａ，２ｃを構成する金属膜２０を形成する。まず、図４Ｄに示すように、上面全体に、すなわち第１光反射性部材４２及び電極１２ａ，１２ｃの上に、金属膜２０を成膜する。金属膜２０の成膜は、スパッタリングや蒸着等の、材料および膜厚に対応した方法で行うことができる。次に、図４Ｅに示すように、金属膜２０を、各発光素子１１の電極１２ａ，１２ｃ間の間隙に沿った領域において除去して、第１光反射性部材４２を露出させる。発光素子１１が電極１２ａ，１２ｃを対角線に沿って配置しているので、前記対角線と直交する線を中心線とした、電極１２ａ，１２ｃの間隙の幅の帯状の領域から金属膜２０を除去する。金属膜２０の除去方法は、前記帯状の領域へのレーザー光の照射によるレーザーアブレーション加工を用いることができる。あるいは、フォトリソグラフィとエッチングによって、金属膜２０における電極１２ａ，１２ｃの間隙の幅の帯状の領域を除去することもできる。 In the metal film forming step S13, the metal film 20 constituting the metal films 2a and 2c is formed on the upper surface. First, as shown in FIG. 4D, the metal film 20 is formed on the entire upper surface, that is, on the first light reflecting member 42 and the electrodes 12a and 12c. The metal film 20 can be formed by a method corresponding to the material and the film thickness, such as sputtering or thin film deposition. Next, as shown in FIG. 4E, the metal film 20 is removed in a region along the gap between the electrodes 12a and 12c of each light emitting element 11 to expose the first light reflecting member 42. Since the light emitting element 11 arranges the electrodes 12a and 12c along the diagonal line, the metal film 20 is removed from the band-shaped region having the width of the gap between the electrodes 12a and 12c with the line orthogonal to the diagonal line as the center line. .. As a method for removing the metal film 20, laser ablation processing by irradiating the strip-shaped region with laser light can be used. Alternatively, the band-shaped region having the width of the gap between the electrodes 12a and 12c in the metal film 20 can be removed by photolithography and etching.

個片化工程Ｓ１４は、図４Ｅに示す切断線ＣＬに沿って、金属膜２０、第１光反射性部材４２、及び透光性部材３を切断して、個片化した発光装置１を得る。個片化工程Ｓ１４では、ブレードダイシングやレーザダイシング等の、金属膜２０、第１光反射性部材４２、及び透光性部材３の材料及び厚さに対応した方法で切断することができる。金属膜２０は、切断線ＣＬで切断されることにより、分離した金属膜２ａ，２ｃとなる。 In the individualization step S14, the metal film 20, the first light reflecting member 42, and the translucent member 3 are cut along the cutting line CL shown in FIG. 4E to obtain an individualized light emitting device 1. .. In the individualization step S14, cutting can be performed by a method corresponding to the material and thickness of the metal film 20, the first light reflecting member 42, and the translucent member 3, such as blade dicing and laser dicing. The metal film 20 becomes separated metal films 2a and 2c by being cut along the cutting line CL.

以降の工程について、図３及び図５Ａ〜５Ｅを参照して説明する。図５Ａは、実施形態に係る発光モジュールの製造方法の発光装置載置工程を説明する部分断面図である。図５Ｂは、実施形態に係る発光モジュールの製造方法のマスク形成工程を説明する部分断面図である。図５Ｃは、実施形態に係る発光モジュールの製造方法の第２光反射性部材形成工程において発光装置を第２光反射性部材で覆った状態を説明する部分断面図である。図５Ｄは、実施形態に係る発光モジュールの製造方法の第２光反射性部材形成工程においてマスクが露出するように第２光反射性部材を研削した状態を説明する部分断面図である。図５Ｅは、実施形態に係る発光モジュールの製造方法のマスク除去工程を説明する部分断面図である。 Subsequent steps will be described with reference to FIGS. 3 and 5A-5E. FIG. 5A is a partial cross-sectional view illustrating a light emitting device mounting step of the method for manufacturing a light emitting module according to an embodiment. FIG. 5B is a partial cross-sectional view illustrating a mask forming step of the method for manufacturing a light emitting module according to an embodiment. FIG. 5C is a partial cross-sectional view illustrating a state in which the light emitting device is covered with the second light reflecting member in the second light reflecting member forming step of the method for manufacturing the light emitting module according to the embodiment. FIG. 5D is a partial cross-sectional view illustrating a state in which the second light-reflecting member is ground so that the mask is exposed in the second light-reflecting member forming step of the method for manufacturing a light emitting module according to the embodiment. FIG. 5E is a partial cross-sectional view illustrating a mask removing step of the method for manufacturing a light emitting module according to an embodiment.

（導光板準備工程）
導光板準備工程Ｓ２は、導光板７を製造する。例えば、まず、光透過部７１を金型で成形したり、板状部材を機械加工したりして形成する。次に、光透過部７１に対して、上面の発光素子設置穴７ｄ以外の凹部に硬化前の光反射部７２を充填して硬化させ、下面の凹部に硬化前の光遮蔽部７３を充填して硬化させる。 (Light guide plate preparation process)
The light guide plate preparation step S2 manufactures the light guide plate 7. For example, first, the light transmitting portion 71 is formed by molding with a mold or by machining a plate-shaped member. Next, with respect to the light transmitting portion 71, the recesses other than the light emitting element installation hole 7d on the upper surface are filled with the light reflecting portion 72 before curing and cured, and the recesses on the lower surface are filled with the light shielding portion 73 before curing. To cure.

（発光装置載置工程）
発光装置載置工程Ｓ３は、図５Ａに示すように、導光板７の上面の発光素子設置穴７ｄの底面に、発光装置１の透光性部材３を接合部材５で接合する。発光素子配列工程Ｓ１１と同様に、硬化前の接合部材５を導光板７の発光素子設置穴７ｄに滴下し、その上に、発光装置１を、金属膜２ａ，２ｃを上に向けて載置する。そして、接合部材５をその材料に対応した条件で硬化させる。 (Light emitting device mounting process)
In the light emitting device mounting step S3, as shown in FIG. 5A, the translucent member 3 of the light emitting device 1 is joined by the joining member 5 to the bottom surface of the light emitting element installation hole 7d on the upper surface of the light guide plate 7. Similar to the light emitting element arranging step S11, the joining member 5 before curing is dropped into the light emitting element installation hole 7d of the light guide plate 7, and the light emitting device 1 is placed on the light emitting device 1 with the metal films 2a and 2c facing upward. To do. Then, the joining member 5 is cured under the conditions corresponding to the material.

（マスク形成工程）
マスク形成工程Ｓ４は、図５Ｂに示すように、発光装置１の上面を被覆するマスクＭを形成する。導光板７上に配列された発光装置１のそれぞれを被覆するマスクＭは、フォトリソグラフィによって形成することができ、感光性フィルム（ドライフィルムレジスト、ＤＦＲ）で形成することが好ましい。感光性フィルム（レジスト層）の厚さは、１０〜１００μｍが好ましい。発光装置１を搭載した導光板７の上面全体に、感光性フィルムを、カバーフィルムを剥離しながらラミネートする。そして、感光性フィルムをキャリアフィルム越しにパターン露光し、感光性フィルムからキャリアフィルムを剥離する。その後、アルカリ水溶液で現像して、マスクＭが形成される。なお、マスクＭは、耐熱温度が第２光反射性部材６の硬化温度以上とする。マスクＭは、発光装置１の平面視形状と同一形状でもよいし、発光装置１の外側にはみ出し難くなるように、それよりも少し小さく設定されてもよい。 (Mask forming process)
In the mask forming step S4, as shown in FIG. 5B, a mask M covering the upper surface of the light emitting device 1 is formed. The mask M that covers each of the light emitting devices 1 arranged on the light guide plate 7 can be formed by photolithography, and is preferably formed of a photosensitive film (dry film resist, DFR). The thickness of the photosensitive film (resist layer) is preferably 10 to 100 μm. A photosensitive film is laminated on the entire upper surface of the light guide plate 7 on which the light emitting device 1 is mounted while peeling off the cover film. Then, the photosensitive film is pattern-exposed through the carrier film, and the carrier film is peeled off from the photosensitive film. Then, it is developed with an alkaline aqueous solution to form a mask M. The heat-resistant temperature of the mask M is set to be equal to or higher than the curing temperature of the second light-reflecting member 6. The mask M may have the same shape as the plan view shape of the light emitting device 1, or may be set to be slightly smaller than that so that it does not easily protrude to the outside of the light emitting device 1.

（第２光反射性部材形成工程）
第２光反射性部材形成工程Ｓ５は、導光板７上の発光装置１，１間の間隙に第２光反射性部材６を形成する。封止工程Ｓ１２と同様に、まず、図５Ｃに示すように、硬化前の第２光反射性部材６を、導光板７上に、発光装置１及びその上のマスクＭ、ならびに接合部材５を完全に覆うように充填する。そして、第２光反射性部材６をその材料に対応した条件で硬化させる。次に、上面から第２光反射性部材６を研削して、図５Ｄに示すように、上面にマスクＭを完全に露出させる。このとき、第２光反射性部材６と共にマスクＭを薄肉化してもよく、ただし、その下の発光装置１の金属膜２ａ，２ｃが露出しないようにする。マスクＭの残厚は、配線８の厚さ以下であることが好ましい。 (Second light-reflecting member forming step)
In the second light reflecting member forming step S5, the second light reflecting member 6 is formed in the gap between the light emitting devices 1 and 1 on the light guide plate 7. Similar to the sealing step S12, first, as shown in FIG. 5C, the second light-reflecting member 6 before curing is placed on the light guide plate 7, the light emitting device 1 and the mask M on it, and the joining member 5 are placed. Fill to cover completely. Then, the second light-reflecting member 6 is cured under the conditions corresponding to the material. Next, the second light-reflecting member 6 is ground from the upper surface to completely expose the mask M on the upper surface as shown in FIG. 5D. At this time, the mask M may be thinned together with the second light-reflecting member 6, but the metal films 2a and 2c of the light emitting device 1 under the mask M may not be exposed. The residual thickness of the mask M is preferably equal to or less than the thickness of the wiring 8.

（マスク除去工程）
マスク除去工程Ｓ６は、発光装置１の上面を被覆するマスクＭを、剥離液で除去する。すると、図５Ｅに示すように、金属膜２ａ，２ｃが露出し、また、発光装置１上がマスクＭの残厚だけ凹んだ段差となる以外は、上面が第２光反射性部材６で平坦となる。 (Mask removal process)
In the mask removing step S6, the mask M covering the upper surface of the light emitting device 1 is removed with a stripping solution. Then, as shown in FIG. 5E, the upper surface is flat by the second light reflecting member 6 except that the metal films 2a and 2c are exposed and the light emitting device 1 has a step recessed by the remaining thickness of the mask M. It becomes.

（配線形成工程）
配線形成工程Ｓ７は、第２光反射性部材６及び金属膜２ａ，２ｃの上に、導電性ペーストで配線８を形成する（図１Ｄ，１Ｅ参照）。導電性ペーストは、スクリーン印刷で形成することが好ましく、メッシュに乳剤の膜を形成したマスク等でパターン形成する。その後、導電性ペーストをその材料に対応した条件で硬化させて配線８とする。 (Wiring formation process)
In the wiring forming step S7, the wiring 8 is formed with the conductive paste on the second light reflective member 6 and the metal films 2a and 2c (see FIGS. 1D and 1E). The conductive paste is preferably formed by screen printing, and a pattern is formed by a mask or the like having an emulsion film formed on a mesh. Then, the conductive paste is cured under the conditions corresponding to the material to obtain the wiring 8.

発光モジュール１０は、配線８及び金属膜２ａ，２ｃを保護するために、これらを被覆する絶縁膜を上面に備えてもよく、この場合、配線形成工程Ｓ７の後に絶縁膜を形成する。絶縁膜は、ポリイミド等からなるフィルムを接着剤で貼り付けてもよいし、絶縁膜を構成する塗料を塗布して乾燥させてもよい。絶縁膜は、配線８の外部との接続パッド部分を除いた上面全体に設けられていてもよいし、配線８及び金属膜２ａ，２ｃならびにその近傍を被覆するようにパターン成形されてもよい。あるいは、絶縁膜は、金属膜２ａ，２ｃ及び金属膜２ａ，２ｃと配線８との接続部分を被覆するように、発光装置１毎に、それよりも平面視で一回り大きな矩形のパターンに形成されてもよい。 In order to protect the wiring 8 and the metal films 2a and 2c, the light emitting module 10 may be provided with an insulating film covering them on the upper surface. In this case, the insulating film is formed after the wiring forming step S7. As the insulating film, a film made of polyimide or the like may be attached with an adhesive, or a paint constituting the insulating film may be applied and dried. The insulating film may be provided on the entire upper surface of the wiring 8 excluding the connection pad portion with the outside, or may be patterned so as to cover the wiring 8 and the metal films 2a and 2c and their vicinity. Alternatively, the insulating film is formed in a rectangular pattern that is one size larger in plan view for each light emitting device 1 so as to cover the connection portions between the metal films 2a and 2c and the metal films 2a and 2c and the wiring 8. May be done.

以上、本開示の実施形態に係る発光モジュールの製造方法は、接続信頼性に優れた薄型の発光モジュールを製造することができる。 As described above, the method for manufacturing a light emitting module according to the embodiment of the present disclosure can manufacture a thin light emitting module having excellent connection reliability.

（変形例）
準備工程Ｓ１の金属膜形成工程Ｓ１３において、金属膜２０を、電極１２ａ，１２ｃの間隙に沿った帯状の領域だけでなく、切断線ＣＬに沿った領域も除去してもよい。これにより、個片化工程Ｓ１４で、第１光反射性部材４２及び透光性部材３のみを切断すればよい。また、発光装置１は、発光素子１１の側面を直接に第１光反射性部材４２で被覆してもよい。この場合、準備工程Ｓ１の発光素子配列工程Ｓ１１において、導光性部材４１の滴下量を調整するか、導光性部材４１を用いず原子拡散接合等で発光素子１１を透光性部材３に接合する。さらに、発光装置１は、透光性部材３を備えなくてもよい。この場合、例えば、準備工程Ｓ１の発光素子配列工程Ｓ１１において、パッケージ製造用のチップ固定テープ等に発光素子１１を配列して固定する。そして、封止工程Ｓ１２の後、発光素子１１及び形成された第１光反射性部材４２からチップ固定テープを剥離する。 (Modification example)
In the metal film forming step S13 of the preparation step S1, not only the band-shaped region along the gap between the electrodes 12a and 12c but also the region along the cutting line CL may be removed from the metal film 20. As a result, in the individualization step S14, only the first light-reflecting member 42 and the translucent member 3 need to be cut. Further, the light emitting device 1 may directly cover the side surface of the light emitting element 11 with the first light reflecting member 42. In this case, in the light emitting element arranging step S11 of the preparation step S1, the light emitting element 11 is attached to the light emitting member 3 by adjusting the dropping amount of the light guide member 41 or by atomic diffusion bonding or the like without using the light guide member 41. Join. Further, the light emitting device 1 does not have to include the translucent member 3. In this case, for example, in the light emitting element arranging step S11 of the preparation step S1, the light emitting elements 11 are arranged and fixed on a chip fixing tape or the like for manufacturing a package. Then, after the sealing step S12, the chip fixing tape is peeled off from the light emitting element 11 and the formed first light reflective member 42.

発光装置１の上面を被覆するマスクは、発光装置載置工程Ｓ３よりも前に形成することもできる。以下、実施形態の変形例に係る発光モジュールの製造方法について、図６Ａ，６Ｂを参照して説明する。図６Ａは、実施形態に係る発光モジュールの製造方法の変形例のマスク形成工程を説明する部分断面図である。図６Ｂは、実施形態に係る発光モジュールの製造方法の変形例のマスク除去工程を説明する部分断面図である。 The mask covering the upper surface of the light emitting device 1 can also be formed before the light emitting device mounting step S3. Hereinafter, a method for manufacturing a light emitting module according to a modified example of the embodiment will be described with reference to FIGS. 6A and 6B. FIG. 6A is a partial cross-sectional view illustrating a mask forming step of a modified example of the method for manufacturing a light emitting module according to an embodiment. FIG. 6B is a partial cross-sectional view illustrating a mask removing step of a modified example of the method for manufacturing a light emitting module according to an embodiment.

本変形例においては、準備工程Ｓ１の金属膜形成工程Ｓ１３の後（図４Ｅ参照）にマスク形成工程を行い、図６Ａに示すように、二次元配列して連結した発光装置１の上面全体に、粘着フィルムからなるマスクＭＡを貼り付ける。マスクＭＡは、個片化工程Ｓ１４や発光装置載置工程Ｓ３において発光装置１から剥離しない程度の粘着力を有し、かつ、金属膜２ａ，２ｃ及び第１光反射性部材４２との剥離性が良好な粘着フィルムが好ましい。また、マスクＭＡは、基材及び粘着層（糊）の耐熱温度が、接合部材５及び第２光反射性部材６の硬化温度以上とする。また、マスクＭＡは、基材と粘着層との合計の厚さが、４０〜１００μｍであることが好ましい。このようなマスクＭＡは、例えば、半導体素子製造用の、ポリイミドフィルム等を基材とするマスキングテープを適用することができる。次に、個片化工程Ｓ１４で、図６Ａに示す切断線ＣＬに沿って、第１光反射性部材４２及び透光性部材３等と同時にマスクＭＡを切断する。これにより、上面全体にマスクＭＡが貼り付けられた発光装置１が得られる。 In this modification, a mask forming step is performed after the metal film forming step S13 of the preparation step S1 (see FIG. 4E), and as shown in FIG. 6A, the entire upper surface of the light emitting device 1 connected in a two-dimensional arrangement is covered. , A mask MA made of an adhesive film is attached. The mask MA has an adhesive force that does not peel off from the light emitting device 1 in the individualization step S14 and the light emitting device mounting step S3, and has a peelability from the metal films 2a and 2c and the first light reflecting member 42. Adhesive film with good quality is preferable. Further, in the mask MA, the heat resistant temperature of the base material and the adhesive layer (glue) is set to be equal to or higher than the curing temperature of the joining member 5 and the second light reflecting member 6. Further, the mask MA preferably has a total thickness of the base material and the adhesive layer of 40 to 100 μm. For such a mask MA, for example, a masking tape using a polyimide film or the like as a base material for manufacturing a semiconductor element can be applied. Next, in the individualization step S14, the mask MA is cut at the same time as the first light reflecting member 42, the translucent member 3, and the like along the cutting line CL shown in FIG. 6A. As a result, the light emitting device 1 in which the mask MA is attached to the entire upper surface is obtained.

発光装置載置工程Ｓ３を行い、発光装置１をマスクＭＡが貼り付けられた状態で、前記実施形態と同様に接合部材５で導光板７に固定する。これにより、図５Ｂに示す前記実施形態におけるマスク形成工程Ｓ４後の状態になる。そして、第２光反射性部材形成工程Ｓ５を、図５Ｃ，５Ｄに示す前記実施形態と同様に行う。次に、マスク除去工程Ｓ６を行う。本変形例では、以下の方法で、マスクＭＡを発光装置１から除去する。図６Ｂに示すように、上面全体に、すなわち第２光反射性部材６及びマスクＭＡに、粘着シートＡＳを貼り付ける。粘着シートＡＳは、マスクＭＡよりも強い粘着力を有するものとし、さらに、第２光反射性部材６との剥離性が良好であることが好ましい。粘着シートＡＳを剥離すると、マスクＭＡが粘着シートＡＳに付着して、発光装置１から剥離する。その後、必要に応じて、第２光反射性部材６及び発光装置１の表面を洗浄してもよい。 The light emitting device mounting step S3 is performed, and the light emitting device 1 is fixed to the light guide plate 7 with the joining member 5 in the same manner as in the above embodiment with the mask MA attached. As a result, the state after the mask forming step S4 in the embodiment shown in FIG. 5B is obtained. Then, the second light-reflecting member forming step S5 is performed in the same manner as in the above-described embodiment shown in FIGS. 5C and 5D. Next, the mask removing step S6 is performed. In this modification, the mask MA is removed from the light emitting device 1 by the following method. As shown in FIG. 6B, the adhesive sheet AS is attached to the entire upper surface, that is, to the second light reflective member 6 and the mask MA. It is preferable that the pressure-sensitive adhesive sheet AS has a stronger adhesive force than the mask MA and has good peelability from the second light-reflecting member 6. When the adhesive sheet AS is peeled off, the mask MA adheres to the adhesive sheet AS and is peeled off from the light emitting device 1. Then, if necessary, the surfaces of the second light reflecting member 6 and the light emitting device 1 may be cleaned.

マスクＭＡは、個片化工程Ｓ１４の後に形成することもできる。例えば、個片化工程Ｓ１４において、ダイシングテープを発光装置１の下面の透光性部材３に貼り付け、ダイシングテープを完全に切断しないように透光性部材３等を切断する。そして、個片化した発光装置１をダイシングテープから剥離する前に、発光装置１の上面にその形状に切断したマスクＭＡを貼り付ける。 The mask MA can also be formed after the individualization step S14. For example, in the individualization step S14, the dicing tape is attached to the translucent member 3 on the lower surface of the light emitting device 1, and the translucent member 3 and the like are cut so as not to completely cut the dicing tape. Then, before the individualized light emitting device 1 is peeled off from the dicing tape, a mask MA cut into the shape is attached to the upper surface of the light emitting device 1.

マスクＭ，ＭＡは、マスク形成工程において、発光装置１の上面全体を被覆しなくてもよく、少なくとも金属膜２ａ，２ｃのそれぞれの一部を被覆すればよい。したがって、例えば、前記変形例で、個片化前の発光装置１の上面にマスクＭＡを貼り付けた後に、金属膜２０が除去された領域にレーザー光を照射してマスクＭＡを除去して第１光反射性部材４２を露出させてもよい。または、金属膜形成工程Ｓ１３において、上面全体に金属膜２０が成膜された状態（図４Ｄ参照）で、この金属膜２０にマスクＭＡを貼り付け、その後、マスクＭＡ、金属膜２０を順次レーザー光で加工してもよい。さらに、マスクＭ，ＭＡは、金属膜２ａ，２ｃをそれぞれ被覆するパターン間の間隙を金属膜２ａ，２ｃ間の間隙よりも広く設定されて、金属膜２ａ，２ｃの一部を覆う第２光反射性部材６を形成してもよい。第２光反射性部材６から露出した金属膜２ａ，２ｃ間の間隙を発光素子１１の電極１２ａ，１２ｃ間の間隙よりも広くすることができ、配線８のパターンがずれても短絡し難い。この場合、金属膜２ａ，２ｃは、一部を第２光反射性部材６に被覆されて配線８と接続可能な面積が減少するので、発光装置１の平面視サイズを大きく設定することが好ましい。 The masks M and MA do not have to cover the entire upper surface of the light emitting device 1 in the mask forming step, and may cover at least a part of each of the metal films 2a and 2c. Therefore, for example, in the modification, after the mask MA is attached to the upper surface of the light emitting device 1 before the individualization, the area from which the metal film 20 has been removed is irradiated with laser light to remove the mask MA. 1 The light reflective member 42 may be exposed. Alternatively, in the metal film forming step S13, the mask MA is attached to the metal film 20 in a state where the metal film 20 is formed on the entire upper surface (see FIG. 4D), and then the mask MA and the metal film 20 are sequentially laser-coated. It may be processed with light. Further, in the masks M and MA, the gap between the patterns covering the metal films 2a and 2c is set wider than the gap between the metal films 2a and 2c, respectively, and the second light covering a part of the metal films 2a and 2c is set. The reflective member 6 may be formed. The gap between the metal films 2a and 2c exposed from the second light-reflecting member 6 can be made wider than the gap between the electrodes 12a and 12c of the light emitting element 11, and it is difficult to short-circuit even if the pattern of the wiring 8 is deviated. In this case, the metal films 2a and 2c are partially covered with the second light-reflecting member 6 to reduce the area that can be connected to the wiring 8, so it is preferable to set a large plan size of the light emitting device 1. ..

発光モジュール１０においては、発光素子１１の電極１２ａ，１２ｃの配置に対応して発光装置１の金属膜２ａ，２ｃの平面視形状及び配置を設定し、さらに配線８のパターン形状を設定する。例えば、平面視形状が正方形の発光素子１１の横一辺方向に並んで電極１２ａ，１２ｃが配置されている場合には、金属膜２ａ，２ｃは、正方形の中央で横に二分割した縦長の長方形に設定することができる。そして、このような発光装置１の金属膜２ａ，２ｃに接続する配線８，８は、縦方向の位置を揃えたパターン形状に設定してもよい。 In the light emitting module 10, the plan view shape and arrangement of the metal films 2a and 2c of the light emitting device 1 are set corresponding to the arrangement of the electrodes 12a and 12c of the light emitting element 11, and the pattern shape of the wiring 8 is further set. For example, when the electrodes 12a and 12c are arranged side by side in the horizontal direction of the light emitting element 11 having a square plan view, the metal films 2a and 2c are vertically elongated rectangles divided into two horizontally at the center of the square. Can be set to. Then, the wirings 8 and 8 connected to the metal films 2a and 2c of the light emitting device 1 may be set to a pattern shape in which the positions in the vertical direction are aligned.

本開示に係る発光モジュールは、液晶ディスプレイを備える各種電子機器に利用することができる。 The light emitting module according to the present disclosure can be used in various electronic devices including a liquid crystal display.

１０ 発光モジュール
１ 発光装置
１１ 発光素子
１２ａ，１２ｃ 電極
２０ 金属膜
２ａ，２ｃ 金属膜
３ 透光性部材
４１ 導光性部材
４２ 第１光反射性部材
５ 接合部材
６ 第２光反射性部材
７ 導光板
７１ 光透過部
７２ 光反射部
７３ 光遮蔽部
８ 配線
ＡＳ 粘着シート
Ｍ，ＭＡ マスク
Ｓ１ 準備工程
Ｓ２ 導光板準備工程
Ｓ３ 発光装置載置工程
Ｓ４ マスク形成工程
Ｓ５ 第２光反射性部材形成工程
Ｓ６ マスク除去工程
Ｓ７ 配線形成工程 10 Light emitting module 1 Light emitting device 11 Light emitting element 12a, 12c Electrode 20 Metal film 2a, 2c Metal film 3 Translucent member 41 Light-transmitting member 42 First light-reflecting member 5 Joint member 6 Second light-reflecting member 7 Light plate 71 Light transmitting part 72 Light reflecting part 73 Light shielding part 8 Wiring AS Adhesive sheet M, MA Mask S1 Preparation step S2 Light guide plate preparation step S3 Light emitting device mounting step S4 Mask forming step S5 Second light reflecting member forming step S6 Mask removal process S7 Wiring formation process

Claims (14)

発光素子の上面に電極が設けられ、前記発光素子の側面に第１光反射性部材が設けられ、前記電極と前記第１光反射性部材との表面に金属膜が形成された発光装置を準備する準備工程と、
前記金属膜を上に向けて、前記発光装置を互いに間隙を空けて導光板上に載置する発光装置載置工程と、
前記発光装置の前記金属膜を被覆するマスクを形成するマスク形成工程と、
前記導光板上の前記発光装置同士の間隙に、第２光反射性部材を形成する第２光反射性部材形成工程と、
前記マスクを除去するマスク除去工程と、
前記発光装置及び前記第２光反射性部材の上に、前記発光装置の前記金属膜と接続する配線を形成する配線形成工程と、を含む発光モジュールの製造方法。 A light emitting device is prepared in which an electrode is provided on the upper surface of the light emitting element, a first light reflecting member is provided on the side surface of the light emitting element, and a metal film is formed on the surface of the electrode and the first light reflecting member. Preparation process and
A light emitting device mounting step of mounting the light emitting device on a light guide plate with the metal film facing upward and a gap between the light emitting devices.
A mask forming step of forming a mask covering the metal film of the light emitting device, and
A second light-reflecting member forming step of forming a second light-reflecting member in the gap between the light-emitting devices on the light guide plate, and
A mask removing step of removing the mask and
A method for manufacturing a light emitting module, comprising a wiring forming step of forming a wiring connecting to the metal film of the light emitting device on the light emitting device and the second light reflecting member. 前記マスク形成工程は、前記準備工程よりも後かつ前記発光装置載置工程よりも前に行い、前記発光装置を間隙なく配列して、その上面に前記マスクを形成する請求項１に記載の発光モジュールの製造方法。 The light emission according to claim 1, wherein the mask forming step is performed after the preparation step and before the light emitting device mounting step, the light emitting devices are arranged without gaps, and the mask is formed on the upper surface thereof. How to make the module. 前記マスク形成工程は、前記準備工程中に行い、前記金属膜の形成後の個辺化される前の配列された前記発光装置の上面に、前記マスクを形成する請求項１に記載の発光モジュールの製造方法。 The light emitting module according to claim 1, wherein the mask forming step is performed during the preparatory step, and the mask is formed on the upper surface of the light emitting device arranged before being individualized after the formation of the metal film. Manufacturing method. 前記マスクは粘着シートからなり、
前記マスク除去工程は、前記マスクを、当該マスクよりも粘着力の強い粘着シートに付着させることにより前記発光装置から剥離する請求項１乃至請求項３のいずれか一項に記載の発光モジュールの製造方法。 The mask consists of an adhesive sheet
The production of the light emitting module according to any one of claims 1 to 3, wherein in the mask removing step, the mask is attached to an adhesive sheet having a stronger adhesive force than the mask to be peeled off from the light emitting device. Method. 前記マスク形成工程は、前記発光装置載置工程よりも後かつ前記第２光反射性部材形成工程よりも前に行い、前記マスクを感光性フィルムで形成する請求項１に記載の発光モジュールの製造方法。 The production of the light emitting module according to claim 1, wherein the mask forming step is performed after the light emitting device mounting step and before the second light reflecting member forming step to form the mask with a photosensitive film. Method. 前記第２光反射性部材形成工程は、硬化前の前記第２光反射性部材を、前記発光装置を載置した前記導光板上に前記発光装置を覆うように充填し、硬化した前記第２光反射性部材の前記発光装置の上に堆積された部分を除去して前記マスクを露出させる請求項１乃至請求項５のいずれか一項に記載の発光モジュールの製造方法。 In the second light-reflecting member forming step, the second light-reflecting member before curing is filled on the light guide plate on which the light-emitting device is placed so as to cover the light-emitting device, and the second light-reflecting member is cured. The method for manufacturing a light emitting module according to any one of claims 1 to 5, wherein a portion of the light reflecting member deposited on the light emitting device is removed to expose the mask. 前記配線形成工程は、前記配線として導電性ペーストを印刷する請求項１乃至請求項６のいずれか一項に記載の発光モジュールの製造方法。 The method for manufacturing a light emitting module according to any one of claims 1 to 6, wherein the wiring forming step prints a conductive paste as the wiring. 導光板と、
上面に電極を有し、側面に第１光反射性部材を有し、互いに間隙を空けて前記導光板上に配列された複数の発光素子と、
前記電極の上面を露出させて前記発光素子同士の間隙に形成された第２光反射性部材と、 前記電極及び前記第１光反射性部材の上面に形成され、前記電極毎にその上面に接続する金属膜と、
前記金属膜の少なくとも一部の領域に接続するように、前記金属膜及び前記第２光反射性部材の上面に形成された配線と、を備え、
前記金属膜は、平面視で、接続している前記電極から前記発光素子の外側の前記第１光反射性部材の表面まで延在している発光モジュール。 Light guide plate and
A plurality of light emitting elements having electrodes on the upper surface and first light reflecting members on the side surfaces and arranged on the light guide plate with a gap between them.
A second light-reflecting member formed in a gap between the light emitting elements by exposing the upper surface of the electrode, and an upper surface of the electrode and the first light-reflecting member are formed and connected to the upper surface of each electrode. With a metal film
The metal film and the wiring formed on the upper surface of the second light-reflecting member so as to connect to at least a part of the metal film are provided.
The metal film is a light emitting module extending from the connected electrode to the surface of the first light reflecting member outside the light emitting element in a plan view. 前記発光素子と前記第１光反射性部材との間に、前記発光素子の側面に接続する導光性部材を備える請求項８に記載の発光モジュール。 The light emitting module according to claim 8, further comprising a light guide member connected to a side surface of the light emitting element between the light emitting element and the first light reflecting member. 前記金属膜は、平面視において、前記発光素子よりも大きい矩形を、前記電極間の間隙で分割した形状である請求項８又は請求項９に記載の発光モジュール。 The light emitting module according to claim 8 or 9, wherein the metal film has a shape in which a rectangle larger than the light emitting element is divided by a gap between the electrodes in a plan view. 前記金属膜は、平面視形状が前記発光素子の電極と相似である請求項１０に記載の発光モジュール。 The light emitting module according to claim 10, wherein the metal film has a shape similar to that of an electrode of the light emitting element in a plan view. 前記金属膜は、平面視において、矩形の前記発光素子の対角線に沿って並んで配置されている請求項１０又は請求項１１に記載の発光モジュール。 The light emitting module according to claim 10 or 11, wherein the metal film is arranged side by side along a diagonal line of the rectangular light emitting element in a plan view. 前記配線は、前記金属膜に接続する領域において、互いに対向する方向と直交する方向にずれて配置されている請求項１２に記載の発光モジュール。 The light emitting module according to claim 12, wherein the wiring is arranged so as to be displaced in a direction orthogonal to a direction opposite to each other in a region connected to the metal film. 前記配線は、前記金属膜に接続する領域において、互いに対向する方向への延長線上において重複する線幅に形成され、又は、端部が前記方向と直交する方向への延長線上において重複するように形成されている請求項１３に記載の発光モジュール。 The wiring is formed in a region connected to the metal film so as to have overlapping line widths on an extension line in a direction opposite to each other, or so that the ends overlap on an extension line in a direction orthogonal to the direction. The light emitting module according to claim 13, which is formed.
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