JP2021051523A - Flame sensor - Google Patents

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JP2021051523A
JP2021051523A JP2019173650A JP2019173650A JP2021051523A JP 2021051523 A JP2021051523 A JP 2021051523A JP 2019173650 A JP2019173650 A JP 2019173650A JP 2019173650 A JP2019173650 A JP 2019173650A JP 2021051523 A JP2021051523 A JP 2021051523A
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JP7341819B2 (en
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淳 小町
Atsushi Komachi
淳 小町
俊介 中嶋
Shunsuke Nakajima
俊介 中嶋
浩平 西川
Kohei Nishikawa
浩平 西川
悠馬 石田
Yuma Ishida
悠馬 石田
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Nittan Co Ltd
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Abstract

To provide a flame sensor which prevents flame detection accuracy from being reduced even in the case where a light transmissive protective cover is stained.SOLUTION: In a flame sensor comprising a light guide member 40 including an annular light-emitting part, a plurality of main detection light-receiving elements 50A and 50B each for receiving a predetermined wavelength light emitted by a flame, a light transmissive protective cover 12 and a plurality of test light sources 13A and 13B, and including a function for detecting the flame on the basis of received light quantities of the plurality of main detection light-receiving elements, an incident part 416 of test light is provided in the light-emitting part 410 of the light guide member, and the plurality of test light sources are disposed in such a manner that the emitted test light is transmitted through a portion of the light transmissive protective cover opposed to light-receiving planes of the plurality of main detection light-receiving elements and incident to the incident part. The test light which is incident to the incident part is guided through the light guide member to an emission part 444 and incident to a test light-receiving element 14. A circuit board 30 corrects the received light quantities of the plurality of main detection light-receiving elements on the basis of a received light quantity of the test light-receiving element and detects the flame on the basis of the corrected received light quantities.SELECTED DRAWING: Figure 3

Description

本発明は、炎に固有の波長光を捉えて感知を行う炎感知器に関し、特に炎を検知する受光素子の前方の受光窓を覆う保護用ガラスの汚損検出機能を備えた炎感知器に関する。 The present invention relates to a flame detector that captures and detects wavelength light peculiar to a flame, and more particularly to a flame detector having a function of detecting stains on a protective glass covering a light receiving window in front of a light receiving element that detects a flame.

従来の炎感知器には、筐体の正面開口部から赤外線を受光して炎を検知する主検出受光素子と、主検出受光素子の正面の受光窓に対向して配置され汚損検出用の試験光を発光する試験用光源と、受光窓を介して試験光を受光して汚損を検出する試験用受光素子と、筐体の正面側において発光する動作確認灯とを備えているものがある（例えば、特許文献１参照）。
特許文献１の炎感知器は、汚損検出機能を有するものの、動作確認灯の視認性が悪いという問題点があった。そこで、作動表示灯として、環状の光放出部材と該光放出部材へ回路基板上の光源からの光を誘導する導光部材とを備えた光ガイド部材を設けた炎感知器に関する発明が提案されている（例えば、特許文献２参照）。 In the conventional flame detector, a main detection light receiving element that receives infrared rays from the front opening of the housing to detect the flame and a main detection light receiving element that is arranged facing the light receiving window in front of the main detection light receiving element and is used for a stain detection test. Some are equipped with a test light source that emits light, a test light receiving element that receives test light through a light receiving window to detect stains, and an operation confirmation light that emits light on the front side of the housing (). For example, see Patent Document 1).
Although the flame detector of Patent Document 1 has a stain detection function, it has a problem that the visibility of the operation confirmation lamp is poor. Therefore, an invention relating to a flame detector provided with an annular light emitting member and a light guiding member for guiding light from a light source on a circuit board to the light emitting member as an operation indicator has been proposed. (See, for example, Patent Document 2).

特開２００５−１２２４３７号公報Japanese Unexamined Patent Publication No. 2005-122437 特開２０１０−７３０１９号公報JP-A-2010-73019

炎を検知する受光素子を備えその前方の受光窓に受光素子への埃の付着を防ぐ光透過性保護カバー（例えばサファイアガラス）を設けている炎感知器においては、光透過性保護カバーが汚損すると検知精度が低下するという問題がある。特許文献２に記載されている炎感知器においては、受光素子前方の光透過性保護カバーの汚損を検出するため、光透過性保護カバーに向けて光を照射する試験用光源を設けるとともに、試験用光源と対向する側の光ガイド部材の光放出部材に導光部材を配置し、導光部材の端部に対向するように試験用受光素子を設けて、試験用受光素子の受光量に基づいて光透過性保護カバーの汚損の程度を検出するようにしている。 In a flame detector equipped with a light receiving element for detecting a flame and a light transmitting protective cover (for example, sapphire glass) for preventing dust from adhering to the light receiving window in front of the light receiving element, the light transmitting protective cover is contaminated. Then, there is a problem that the detection accuracy is lowered. In the flame detector described in Patent Document 2, in order to detect stains on the light transmissive protective cover in front of the light receiving element, a test light source for irradiating light toward the light transmissive protective cover is provided and a test is performed. A light guide member is placed on the light emitting member of the light guide member on the side facing the light source for use, and a light receiving element for testing is provided so as to face the end of the light guide member, based on the amount of light received by the light receiving element for testing. The degree of contamination of the light transmissive protective cover is detected.

しかしながら、炎を検知する受光素子（赤外線センサ）の前方の光透過性保護カバーは均一に汚れるとは限らないにもかかわらず、特許文献２に記載されている炎感知器の汚れ検出機構は、図１１に示すように、２つの受光素子５０Ａ，５０Ｂに対してその中間に１つの試験用光源１３を配置し、光ガイド部材４０の反対側に導光部４４０を設けた構成であるため、光透過性保護カバー１２が不均一に汚損されると、２つの受光素子の受光量に差が生じてしまい、炎の検出精度が低下して誤報や失報を招くおそれがあると課題がある。 However, although the light transmissive protective cover in front of the light receiving element (infrared sensor) that detects the flame is not always uniformly soiled, the stain detection mechanism of the flame detector described in Patent Document 2 is. As shown in FIG. 11, one test light source 13 is arranged between the two light receiving elements 50A and 50B, and the light guide portion 440 is provided on the opposite side of the optical guide member 40. If the light transmissive protective cover 12 is unevenly soiled, there is a problem that there is a difference in the amount of light received between the two light receiving elements, which reduces the flame detection accuracy and may lead to false or false reports. ..

本発明は上記のような課題に着目してなされたもので、その目的とするところは、受光素子の前方の受光窓を覆う光透過性保護カバーが不均一に汚れて複数の受光素子の受光量に差が生じてしまった場合にも、炎の検知精度が低下することのない炎感知器を提供することにある。
本発明の他の目的は、光透過性保護カバーが不均一に汚れていずれかの受光素子の受光量が所定以上低下しまった場合に、汚れ警報を発することができる炎感知器を提供することにある。 The present invention has been made by paying attention to the above-mentioned problems, and an object of the present invention is that the light transmissive protective cover covering the light receiving window in front of the light receiving element is unevenly soiled to receive light from a plurality of light receiving elements. An object of the present invention is to provide a flame detector that does not reduce the flame detection accuracy even when there is a difference in the amount.
Another object of the present invention is to provide a flame detector capable of issuing a dirt alarm when the light transmissive protective cover is unevenly soiled and the amount of light received by any of the light receiving elements drops by a predetermined value or more. It is in.

上記課題を解決するために、この発明は、
炎の検出機能を有する回路が形成された回路基板を内蔵した筐体と、
前記回路基板に実装された主光源と、
前記筐体の正面において発光する光放出部と透光素材からなり前記主光源からの光を前記光放出部まで導く導光部とを有する光ガイド部材と、
筐体の正面側に設けられた開口部から炎が発する所定波長光を受光する複数の主検出受光素子と、
前記開口部と前記複数の主検出受光素子との間に設けられた光透過性保護カバーと、
前記光透過性保護カバー試験光を投光する複数の試験用光源と、
前記回路基板に実装され前記光透過性保護カバーを透過した試験光を受光する試験用受光素子と、を備え、前記回路基板は、前記複数の主検出受光素子の受光量に基づいて炎を検知する機能を有する炎感知器であって、
前記光ガイド部材の光放出部は、前記筐体の正面側において前記主検出受光素子を取り囲む略環状に形成され、
前記光放出部には前記試験光の入射部が設けられ、
前記複数の試験用光源は、出射した試験光が前記光透過性保護カバーの前記複数の主検出受光素子の受光面に対向する部位を透過して前記入射部へ入射されるように配設され、
前記入射部へ入射された試験光は前記光ガイド部材を経由して出射部へ誘導されて前記試験用受光素子へ入射され、
前記回路基板は、前記試験用受光素子の受光量に基づいて前記複数の主検出受光素子の受光量を補正し、補正した受光量に基づいて炎を検知するように構成したものである。 In order to solve the above problems, the present invention
A housing with a built-in circuit board on which a circuit with a flame detection function is formed,
The main light source mounted on the circuit board and
An optical guide member having a light emitting portion that emits light on the front surface of the housing and a light emitting portion that is made of a translucent material and that guides light from the main light source to the light emitting portion.
A plurality of main detection light receiving elements that receive light of a predetermined wavelength emitted by a flame from an opening provided on the front side of the housing, and
A light transmissive protective cover provided between the opening and the plurality of main detection light receiving elements,
A plurality of test light sources that emit light for the light transmissive protective cover test light,
A test light receiving element mounted on the circuit board and receiving test light transmitted through the light transmissive protective cover is provided, and the circuit board detects a flame based on the light receiving amount of the plurality of main detection light receiving elements. It is a flame detector that has the function of
The light emitting portion of the light guide member is formed on the front side of the housing in a substantially annular shape surrounding the main detection light receiving element.
The light emitting portion is provided with an incident portion of the test light.
The plurality of test light sources are arranged so that the emitted test light passes through a portion of the light transmissive protective cover facing the light receiving surface of the plurality of main detection light receiving elements and is incident on the incident portion. ,
The test light incident on the incident portion is guided to the exit portion via the optical guide member and is incident on the test light receiving element.
The circuit board is configured to correct the light receiving amount of the plurality of main detection light receiving elements based on the light receiving amount of the test light receiving element, and detect the flame based on the corrected light receiving amount.

上記のような構成を有する炎感知器によれば、回路基板は、試験用受光素子の受光量に基づいて主検出受光素子の受光量を補正し、補正した受光量に基づいて炎検知を行うため、光透過性保護カバーが不均一に汚れて複数の受光素子の受光量が設置当初の値から低下してしまった場合にも、炎の検知精度が低下するのを抑制することができる。
また、光透過性保護カバーに試験光を投光する複数の試験用光源と、回路基板に実装され光透過性保護カバーを透過し光ガイド部材を経由して出射部へ誘導された試験光を受光する試験用受光素子とを備えるため、光透過性保護カバーが不均一に汚れていずれかの受光素子の受光量が所定以上低下しまった場合に、汚れ警報を発することができる。 According to the flame detector having the above configuration, the circuit board corrects the light receiving amount of the main detection light receiving element based on the light receiving amount of the test light receiving element, and performs flame detection based on the corrected light receiving amount. Therefore, even when the light transmissive protective cover is unevenly soiled and the light receiving amount of the plurality of light receiving elements is reduced from the value at the time of installation, it is possible to suppress the deterioration of the flame detection accuracy.
In addition, a plurality of test light sources that project test light onto the light transmissive protective cover, and test light that is mounted on the circuit board, passes through the light transmissive protective cover, and is guided to the exit portion via the light guide member. Since a test light receiving element that receives light is provided, a dirt alarm can be issued when the light transmissive protective cover is unevenly soiled and the light receiving amount of any of the light receiving elements drops by a predetermined value or more.

ここで、望ましくは、前記入射部は１つであり、前記複数の試験用光源はそれぞれの光軸が前記入射部を通るように配設されているようにする。
かかる構成によれば、入射部が１つであるため、試験用受光素子を、複数の試験用光源に対して共用することができ、部品点数の増加を抑制しつつ、誤報や失報を抑制することができる。 Here, preferably, the incident portion is one, and the plurality of test light sources are arranged so that their respective optical axes pass through the incident portion.
According to this configuration, since there is only one incident portion, the test light receiving element can be shared with a plurality of test light sources, and false alarms and false alarms can be suppressed while suppressing an increase in the number of parts. can do.

また、望ましくは、前記光ガイド部材には、前記光放出部の前記入射部へ入射した光を前記試験用受光素子まで導く試験光誘導部が設けられているように構成する。
かかる構成によれば、入射部から試験用受光素子までの距離が比較的長い場合にも、入射した試験光を確実に試験用受光素子へ導くことができ、炎の検知精度を向上させることができる。 Further, preferably, the light guide member is configured to be provided with a test light guiding portion that guides the light incident on the incident portion of the light emitting portion to the test light receiving element.
According to such a configuration, even when the distance from the incident portion to the test light receiving element is relatively long, the incident test light can be reliably guided to the test light receiving element, and the flame detection accuracy can be improved. it can.

さらに、望ましくは、前記入射部は前記複数の試験用光源と同一の数だけ設けられ、前記複数の試験用光源はそれぞれの光軸が対応する前記入射部を通るように配設され、
前記光ガイド部材には、前記複数の入射部に入射した光を前記試験用受光素子まで導く導光部を有する複数の試験光誘導部が設けられ、
前記回路基板には、前記複数の試験光誘導部の導光部の端部に対応してそれぞれ試験用受光素子が実装されているようにする。
かかる構成によれば、入射部から試験用受光素子までの距離が比較的長い場合にも、試験光を確実に複数の試験用受光素子へそれぞれ入射させることができるとともに、複数の試験用光源を同時に発光させて、光透過性保護カバーの複数個所の透過率を算出することができるため、短時間に光透過性保護カバーの汚れ具合を検出することができる。 Further, preferably, the number of the incident portions is the same as that of the plurality of test light sources, and the plurality of test light sources are arranged so that their respective optical axes pass through the corresponding incident portions.
The optical guide member is provided with a plurality of test light guiding portions having a light guide portion that guides light incident on the plurality of incident portions to the test light receiving element.
A test light receiving element is mounted on the circuit board corresponding to each end of the light guide portion of the plurality of test light guiding portions.
According to such a configuration, even when the distance from the incident portion to the test light receiving element is relatively long, the test light can be surely incident on each of the plurality of test light receiving elements, and a plurality of test light sources can be used. Since the light is emitted at the same time and the transmittance of the light transmissive protective cover at a plurality of locations can be calculated, it is possible to detect the degree of contamination of the light transmissive protective cover in a short time.

さらに、望ましくは、前記光ガイド部材には、前記光放出部から前記回路基板へ向かって延出された複数の導光部が設けられ、
前記複数の導光部のうちいずれか一つの導光部の端部は、前記回路基板に実装された前記主光源に対向され、前記複数の導光部のうち他の一つの導光部の端部は、前記回路基板に実装された前記試験用受光素子に対向されるように構成する。
かかる構成によれば、光ガイド部材に設ける導光部の数を少なくすることができ、それによって光ガイド部材の形状が複雑になるのを回避し、コストアップを抑制することができる。 Further, preferably, the light guide member is provided with a plurality of light guide portions extending from the light emitting portion toward the circuit board.
The end of any one of the plurality of light guides is opposed to the main light source mounted on the circuit board, and the end of the other one of the plurality of light guides is opposed to the main light source. The end portion is configured to face the test light receiving element mounted on the circuit board.
According to such a configuration, the number of light guide portions provided on the optical guide member can be reduced, thereby avoiding the complicated shape of the optical guide member and suppressing the cost increase.

さらに、望ましくは、前記入射部は、前記光放出部の、前記複数の導光部のうち端部が前記主検出受光素子に対向する前記導光部よりも前記複数の導光部のうち端部が前記試験用受光素子に対向する前記導光部に近い部位に設けられているようにする。
かかる構成によれば、試験用受光素子に入射する試験光の量を多くすることができ、光透過性保護カバーの汚れ具合を精度よく検出することができる。 Further, preferably, the incident portion is the end of the plurality of light guide portions of the light emitting portion, rather than the end portion of the plurality of light guide portions facing the main detection light receiving element. The portion is provided at a portion close to the light guide portion facing the test light receiving element.
According to such a configuration, the amount of test light incident on the test light receiving element can be increased, and the degree of contamination of the light transmissive protective cover can be detected with high accuracy.

本発明に係る炎感知器によれば、受光素子の前方の受光窓を覆う光透過性保護カバーが不均一に汚れて複数の受光素子の受光量に差が生じてしまった場合にも、炎の検知精度が低下することがないようにすることができる。また、光透過性保護カバーが不均一に汚れていずれかの受光素子の受光量が所定以上低下しまった場合に、汚れ警報を発することができるという効果がある。 According to the flame detector according to the present invention, even when the light transmissive protective cover covering the light receiving window in front of the light receiving element is unevenly soiled and the light receiving amount of the plurality of light receiving elements is different, the flame is generated. It is possible to prevent the detection accuracy of the above from being lowered. Further, when the light transmissive protective cover is unevenly soiled and the light receiving amount of any of the light receiving elements is reduced by a predetermined value or more, there is an effect that a dirt alarm can be issued.

本発明に係る炎感知器の一実施形態を示す斜視図である。It is a perspective view which shows one Embodiment of the flame detector which concerns on this invention. 実施形態の炎感知器の内部構造を示す分解斜視図である。It is an exploded perspective view which shows the internal structure of the flame detector of an embodiment. 実施形態の炎感知器の内部構造を示す正面断面図である。It is a front sectional view which shows the internal structure of the flame detector of an embodiment. 光ガイド部材の全体を示す斜視図である。It is a perspective view which shows the whole of an optical guide member. 実施形態の炎感知器における試験用光源と試験用受光素子の配置例を示す平面図である。It is a top view which shows the arrangement example of the test light source and the test light receiving element in the flame detector of embodiment. 実施形態の炎感知器における試験用光源の発光タイミングと試験用受光素子の受光レベルを示すタイミングチャートである。It is a timing chart which shows the light emission timing of the test light source and the light receiving level of the test light receiving element in the flame detector of embodiment. 試験用光源と試験用受光素子の配置の変形例を示す平面図である。It is a top view which shows the modification of the arrangement of the test light source and the test light receiving element. 試験用光源と試験用受光素子の配置の他の変形例を示す平面図である。It is a top view which shows the other modification of the arrangement of the test light source and the test light receiving element. 試験用光源と試験用受光素子の配置のさらに他の変形例を示す平面図である。It is a top view which shows the further modification of the arrangement of the test light source and the test light receiving element. 炎から発せられる光の波長分布および実施形態の炎感知器におけるセンサ受光量の補正処理のイメージを示す図である。It is a figure which shows the image of the wavelength distribution of the light emitted from a flame, and the correction processing of the sensor light receiving amount in the flame detector of an embodiment. 従来（特許文献２）の炎感知器における試験用光源と試験用受光素子の配置を示す平面図である。It is a top view which shows the arrangement of the test light source and the test light receiving element in the conventional (Patent Document 2) flame detector.

以下、本発明に係る炎感知器の実施形態について図面を参照しながら説明する。図１は本実施形態の炎感知器１０の斜視図、図２はその内部構造を示す分解斜視図である。
炎感知器は、一般に背面側を上方に向けて固定設置され、正面側を下方に向けた状態で正面前方（設置状態における下方）の領域の炎を検出するためのものである。かかる炎感知器は、検知対象のエリア内の複数の炎感知器を集中的に管理する図示しない受信機に接続され、炎を検出すると、検出信号を受信機へ送信する。 Hereinafter, embodiments of the flame detector according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of the flame detector 10 of the present embodiment, and FIG. 2 is an exploded perspective view showing the internal structure thereof.
The flame detector is generally fixedly installed with the back side facing upward, and is for detecting a flame in the area in front of the front (lower side in the installed state) with the front side facing downward. Such a flame detector is connected to a receiver (not shown) that centrally manages a plurality of flame detectors in the detection target area, and when a flame is detected, a detection signal is transmitted to the receiver.

なお、以下の説明では、説明の便宜上、炎感知器を建造物の天井面に設置した状態で上になる側を下側、下になる側を上側とする。また、本実施形態の炎感知器１０では、筐体２０内に二つの赤外線センサ（例えば焦電素子）などからなる主検出受光素子５０Ａ，５０Ｂが横並びで配設されており、場合によっては、炎感知器１０の主検出受光素子５０Ａ，５０Ｂが向く方向を正面側、反対側を背面側と呼ぶ。 In the following description, for convenience of explanation, the upper side is the lower side and the lower side is the upper side when the flame detector is installed on the ceiling surface of the building. Further, in the flame detector 10 of the present embodiment, the main detection light receiving elements 50A and 50B composed of two infrared sensors (for example, a pyroelectric element) are arranged side by side in the housing 20, and in some cases, they may be arranged side by side. The direction in which the main detection light receiving elements 50A and 50B of the flame detector 10 face is called the front side, and the opposite side is called the back side.

（炎感知器全体の構成）
本実施形態の炎感知器１０は、図１に示すように、円筒状をなすケース本体２２０とその正面側を覆うカバー体２１０とケース本体２２０と、背面側に接合されて設置箇所に固定されるベース体２３０とからなる筐体２０を備える。
このうち、上記ベース体２３０は、円形の皿状に形成され、その背面側が設置場所（天井面）に固定され、背部から引き出された配線が伝送線を介して受信機に接続される。 (Overall composition of flame detector)
As shown in FIG. 1, the flame detector 10 of the present embodiment is joined to the cylindrical case body 220, the cover body 210 and the case body 220 that cover the front side thereof, and the case body 220, and is fixed to the installation location. A housing 20 including a base body 230 is provided.
Of these, the base body 230 is formed in a circular dish shape, the back side thereof is fixed to the installation location (ceiling surface), and the wiring drawn from the back portion is connected to the receiver via a transmission line.

ケース本体２２０は、上記ベース体２３０よりも幾分外径が小さい有底円筒体であり、その底板の背面側をベース体２３０に対向させた状態で当該ベース体２３０の内側にはめ込まれるようにして装着される。本体２２０の底板の背面側には、図示しない接続端子が複数設けられ、当該各接続端子の先端部が鈎状に形成されている。つまり、各接続端子は、ベース体２３０側に設けられた被係合凹部に対して鈎状部が係合し、本体２２０をベース体２３０に固定する機能を有している。また、各接続端子は、ケース本体２２０内の回路基板と電気的に接続されており、ベース体２３０との係合により、ベース体２３０側からの電源供給や受信機との信号の送受信が可能となっている。 The case body 220 is a bottomed cylindrical body having a slightly smaller outer diameter than the base body 230, and is fitted inside the base body 230 with the back surface side of the bottom plate facing the base body 230. Is installed. A plurality of connection terminals (not shown) are provided on the back side of the bottom plate of the main body 220, and the tip portions of the connection terminals are formed in a hook shape. That is, each connection terminal has a function of engaging the hook-shaped portion with the engaged recess provided on the base body 230 side and fixing the main body 220 to the base body 230. In addition, each connection terminal is electrically connected to the circuit board inside the case body 220, and by engaging with the base body 230, it is possible to supply power from the base body 230 side and send and receive signals to and from the receiver. It has become.

カバー体２１０は、円筒形状部２１１と当該円筒形状部２１１の正面側の端部に連なる円錐台形状部２１２と当該円錐台形状部の正面側端部に連なる正面端面部２１３とを備え、全体としてドーム状をなすように、合成樹脂により一体的に成形されている。
円筒形状部２１１は、その外径がベース体２３０の外径と等しく設定されており、背面側端部は大きく開口され、当該開口端部の内側にケース本体２２０をはめ込み、ネジ止めにより連結されるようになっている。
正面端面部２１３は、その中央部に大きく長円形状の開口部２１４が形成されており、当該開口部２１４の内側であって後方奥側に、炎が発する所定波長光を検知する主検出受光素子５０Ａ，５０Ｂが配置されている。 The cover body 210 includes a cylindrical portion 211, a truncated cone-shaped portion 212 connected to the front end of the cylindrical portion 211, and a front end surface portion 213 connected to the front end of the truncated cone-shaped portion. It is integrally molded with synthetic resin so as to form a dome shape.
The outer diameter of the cylindrical portion 211 is set to be equal to the outer diameter of the base body 230, the rear end portion is greatly opened, the case body 220 is fitted inside the opening end portion, and the cylindrical portion 211 is connected by screwing. It has become so.
The front end face portion 213 has a large oval-shaped opening 214 formed in the center thereof, and is inside the opening 214 and on the rear rear side, and is a main detection light receiver that detects light of a predetermined wavelength emitted by a flame. Elements 50A and 50B are arranged.

また、炎感知器１０の筐体２０の内部には、図２に示すように、主光源１１が実装されるとともに炎を検出する回路が形成された回路基板３０と、回路基板３０を覆う基板カバー３３，主検出受光素子５０Ａ，５０Ｂを保持する素子サポート６０，主検出受光素子５０Ａ，５０Ｂの上方を覆う光透過性保護カバー（センサ保護用ガラス）１２，ガイドサポート７０，光ガイド部材４０が収納されている。
主光源１１は、正面前方に向けて発光を行うように回路基板３０に実装されたＬＥＤであり、本実施例では、２つ設けられている。主光源１１は、複数の用途に用いられる。例えば、平時には消灯状態とされ、炎感知時には点灯状態となり、周囲に報知を行ったり、複数の炎感知器１０が受信機に接続されている場合において、その一つを対象とする応答要求があった場合に、当該応答の対象となる炎感知器１０の主光源が点滅状態に切り替わって応答を行ったりするのに使用される。 Further, as shown in FIG. 2, inside the housing 20 of the flame detector 10, a circuit board 30 on which a main light source 11 is mounted and a circuit for detecting a flame is formed, and a substrate that covers the circuit board 30. The cover 33, the element support 60 for holding the main detection light receiving elements 50A and 50B, the light transmissive protective cover (sensor protection glass) 12, the guide support 70, and the optical guide member 40 covering the upper part of the main detection light receiving elements 50A and 50B. It is stored.
The main light source 11 is an LED mounted on the circuit board 30 so as to emit light toward the front front, and in this embodiment, two are provided. The main light source 11 is used for a plurality of purposes. For example, it is turned off in normal times and turned on when a flame is detected, and when a notification is given to the surroundings or when a plurality of flame detectors 10 are connected to a receiver, a response request for one of them is made. If there is, it is used to switch the main light source of the flame detector 10 that is the target of the response to the blinking state and perform a response.

また、火災時に炎から発せられる赤外線は、図１０に示すように、ＣＯ2共鳴放射と呼ばれる現象により4.4[μm]の赤外線域の波長で特徴的なピークを示す特性を有する。そこで、本実施例では、当該4.4[μm]の波長光を透過するフィルタを装備した赤外線センサからなる主検出受光素子５０Ａと、4.4[μm]の前後の波長光（例えば、4.0[μm]）を参照波長として透過するフィルタを装備した赤外線センサからなる主検出受光素子５０Ｂの２つを用いて赤外線を検出することにより炎の検出を行う。各主検出受光素子５０Ａ，５０Ｂは、素子のリード端子が回路基板３０にハンダ付けで固定される。 Further, as shown in FIG. 10, infrared rays emitted from a flame at the time of a fire have a characteristic of showing a characteristic peak at a wavelength in the infrared region of 4.4 [μm] due to a phenomenon called CO2 resonance radiation. Therefore, in this embodiment, the main detection light receiving element 50A composed of an infrared sensor equipped with a filter that transmits the wavelength light of 4.4 [μm] and the wavelength light before and after 4.4 [μm] (for example, 4.0 [μm]). The flame is detected by detecting infrared rays using two main detection light receiving elements 50B composed of an infrared sensor equipped with a filter that transmits the above as a reference wavelength. In each of the main detection light receiving elements 50A and 50B, the lead terminals of the elements are fixed to the circuit board 30 by soldering.

光透過性保護カバー１２は、赤外線光を透過する透明なサファイアガラスからなる長方形の平板であり、２つの主検出受光素子５０Ａ，５０Ｂの受光面や光学フィルタが外部に直接露出して汚れたり破損したりしないように保護する。
素子サポート６０は、正面視で長円形の台座６１と、台座６１の背面から下方に延出された四本の支柱６２とを備えている。四本の支柱６２は、台座６１の四隅に設けられている。そして、各支柱６２の先端面からは当該支柱６２よりも小径のボス６２ａがさらに延出され、回路基板３０には、各ボス６２ａの受け穴３１が形成されている。
台座６１は、その中央部には凹部が形成され、凹部のさらに中央には２つの素子格納凹部６３が形成されている。各素子格納凹部６３は、正面側が開放され、素子形状に対応して円柱体が嵌合可能な形状に形成されている。また、その底部には主検出受光素子５０Ａ，５０Ｂのリード端子を挿通させる４つの貫通穴が形成されている。 The light transmissive protective cover 12 is a rectangular flat plate made of transparent sapphire glass that transmits infrared light, and the light receiving surfaces and optical filters of the two main detection light receiving elements 50A and 50B are directly exposed to the outside and become dirty or damaged. Protect it from dripping.
The element support 60 includes an oval pedestal 61 when viewed from the front, and four columns 62 extending downward from the back surface of the pedestal 61. The four columns 62 are provided at the four corners of the pedestal 61. A boss 62a having a diameter smaller than that of the support column 62 is further extended from the tip surface of each support column 62, and a receiving hole 31 for each boss 62a is formed in the circuit board 30.
The pedestal 61 has a recess formed in the center thereof, and two element storage recesses 63 are formed further in the center of the recess. The front side of each element storage recess 63 is open, and a cylindrical body is formed in a shape corresponding to the element shape. Further, four through holes through which the lead terminals of the main detection light receiving elements 50A and 50B are inserted are formed at the bottom thereof.

また、台座６１の背面側には、２つの素子格納凹部６３に隣接して、光透過性保護カバー１２の汚損を検出するための試験用光源１３Ａ，１３Ｂを保持する光源保持部６５が２つ形成されている。各光源保持部６５は、図３に示すように、回路基板３０に近接して斜め上方を向いて開口しており、回路基板３０に実装された試験用光源１３Ａ，１３Ｂは、そのリード端子を曲げるようにした状態で光源保持部６５の開口から挿入され、内部に嵌合して向きを固定された状態で保持される。２つの試験用光源１３Ａ，１３Ｂは、試験光が環状の光ガイド部材４０の反対側の中央部の入射部ＬＩを照射するように斜めに配設されている。 Further, on the back side of the pedestal 61, two light source holding portions 65 for holding the test light sources 13A and 13B for detecting the contamination of the light transmissive protective cover 12 are adjacent to the two element storage recesses 63. It is formed. As shown in FIG. 3, each light source holding portion 65 is opened diagonally upward in the vicinity of the circuit board 30, and the test light sources 13A and 13B mounted on the circuit board 30 have lead terminals thereof. It is inserted through the opening of the light source holding portion 65 in a bent state, fitted inside, and held in a fixed orientation. The two test light sources 13A and 13B are obliquely arranged so that the test light irradiates the incident portion LI at the central portion on the opposite side of the annular light guide member 40.

光源保持部６５は、その開口部から素子格納凹部６３の内側（背面側）となる空間内まで貫通しており、試験用光源１３Ａ，１３Ｂは光透過性保護カバー１２を透過させて投光可能としている。試験用光源１３Ａ，１３Ｂから出射され光透過性保護カバー１２を透過した試験光は、光ガイド部材４０内を通過し、反対側の中央部に設けられている試験光誘導部４４０を介して回路基板３０上に実装されている試験用受光素子１４により受光される。試験用受光素子１４の数は本実施例では１つである。 The light source holding portion 65 penetrates from the opening to the inside (back side) of the element storage recess 63, and the test light sources 13A and 13B can transmit light through the light transmissive protective cover 12. It is supposed to be. The test light emitted from the test light sources 13A and 13B and transmitted through the light transmissive protective cover 12 passes through the light guide member 40 and is circuited via the test light guiding unit 440 provided in the central portion on the opposite side. The light is received by the test light receiving element 14 mounted on the substrate 30. The number of test light receiving elements 14 is one in this embodiment.

なお、試験用光源１３Ａ，１３ＢはＬＥＤ、試験用受光素子１４はフォトダイオードであり、試験用光源１３の発する波長光を受光帯域としている。
さらに、上記台座６１には、下方へ向かって突出する一対の係止片６６が設けられており、係止片６６の先端の爪６６ａが回路基板３０に形成されている一対の係合穴３２に係合されることで、台座６１と回路基板３０とが結合される。 The test light sources 13A and 13B are LEDs, and the test light receiving element 14 is a photodiode, and the wavelength light emitted by the test light source 13 is used as the light receiving band.
Further, the pedestal 61 is provided with a pair of locking pieces 66 projecting downward, and a pair of engaging holes 32 in which a claw 66a at the tip of the locking piece 66 is formed in the circuit board 30. The pedestal 61 and the circuit board 30 are coupled to each other by being engaged with.

回路基板３０には、前述した主光源１１及び試験用受光素子１４が上面に直接実装され、主検出受光素子５０Ａ，５０Ｂ及び試験用光源１３Ａ，１３Ｂは素子サポート６０を介して実装されている。
さらに、回路基板３０には、炎感知器１０に所定の作動を実行させるための各種の電子部品及びマイコン（ＣＰＵ）やメモリからなる制御手段が実装されており、炎検出の処理および光透過性保護カバー１２の汚れ検出のための透過性試験処理を実行する。炎検出処理では、各主検出受光素子５０Ａ，５０Ｂにより二波長の赤外線検出を周期的に行い、各受光素子５０Ａ，５０Ｂの検出強度（受光レベル）が求められる。そして、各波長の検出強度が炎の燃焼に固有の強度である設定値の範囲内と判定した場合に、受信機に対して検出信号を出力する。また、回路基板３０は、それまで消灯させていた二つの主光源１１を点灯状態に切り替え、炎感知器１０の周囲に炎の検出を報知する。 The main light source 11 and the test light receiving element 14 described above are directly mounted on the upper surface of the circuit board 30, and the main detection light receiving elements 50A and 50B and the test light sources 13A and 13B are mounted via the element support 60.
Further, the circuit board 30 is equipped with various electronic components for causing the flame detector 10 to execute a predetermined operation, and a control means including a microcomputer (CPU) and a memory, and performs flame detection processing and light transmission. A permeability test process for detecting stains on the protective cover 12 is performed. In the flame detection process, infrared rays of two wavelengths are periodically detected by the main detection light receiving elements 50A and 50B, and the detection intensity (light receiving level) of each light receiving element 50A and 50B is obtained. Then, when it is determined that the detection intensity of each wavelength is within the range of the set value which is the intensity peculiar to the combustion of the flame, the detection signal is output to the receiver. Further, the circuit board 30 switches the two main light sources 11 that have been turned off until then to the lit state, and notifies the flame detector 10 of the detection of the flame.

また、回路基板３０は、光透過性保護カバー１２の透過性試験処理では、例えば、定期的に、試験用光源１３を発光させ、試験用受光素子１４による試験光の検出強度が、汚れ判定のために設定された閾値以上であるか判定を行う。そして、閾値未満の場合には、光透過性保護カバー１２の汚れの検出信号を受信機に出力する。
さらに、回路基板３０は、例えば主検出受光素子５０Ａ，５０Ｂに内蔵された発熱素子を定期的に加熱させて、各主検出受光素子５０Ａ，５０Ｂが正常か否かの自己診断の処理を実行する。そして、いずれかの主検出受光素子について閾値未満となった場合には、主検出受光素子の異常発生信号を受信機に出力する。 Further, in the transmissivity test process of the light transmissive protective cover 12, the circuit board 30 periodically causes the test light source 13 to emit light, and the detection intensity of the test light by the test light receiving element 14 determines that the test light is dirty. It is determined whether or not the threshold value is set for the purpose. If it is less than the threshold value, a dirt detection signal of the light transmissive protective cover 12 is output to the receiver.
Further, the circuit board 30 periodically heats, for example, the heat generating elements built in the main detection light receiving elements 50A and 50B, and executes a self-diagnosis process of whether or not each of the main detection light receiving elements 50A and 50B is normal. .. Then, when any of the main detection light receiving elements becomes less than the threshold value, the abnormality generation signal of the main detection light receiving element is output to the receiver.

ガイドサポート７０は、図２及び図３に示すように、筐体２０の内部において水平面に沿って配置される略円板状の台座７１と、台座７１の外周縁部から背面側に向かって立ち上げられた周壁部７２とを備えている。そして、周壁部７２は筒状をなすと共にその内径は素子サポート６０の台座６１の外径よりも若干大きく設定されており、ガイドサポート７０は素子サポート６０を内部に収容した状態で連結することが可能となっている。 As shown in FIGS. 2 and 3, the guide support 70 has a substantially disk-shaped pedestal 71 arranged along a horizontal plane inside the housing 20, and stands from the outer peripheral edge of the pedestal 71 toward the back side. It is provided with a raised peripheral wall portion 72. The peripheral wall portion 72 has a tubular shape, and its inner diameter is set to be slightly larger than the outer diameter of the pedestal 61 of the element support 60, and the guide support 70 can be connected with the element support 60 housed inside. It is possible.

また、台座７１の上面中央部には、長円状の凹部７１１が形成されており、凹部７１１の中央部には主検出受光素子５０Ａ，５０Ｂの頭部が臨むための長円状の開口部７１２が形成されている。
さらに、台座７１の上面外縁部には、光ガイド部材４０の嵌合部７１３が形成されている。この嵌合部７１３は、台座７１の正面上に立設された突条により形成されており、当該突条の嵌合部７１３で囲まれた領域に光ガイド部材４０を嵌合させることで固定することができる。 An oval recess 711 is formed in the center of the upper surface of the pedestal 71, and an oval opening for the heads of the main detection light receiving elements 50A and 50B to face the center of the recess 711. 712 is formed.
Further, a fitting portion 713 of the optical guide member 40 is formed on the outer edge portion of the upper surface of the pedestal 71. The fitting portion 713 is formed by a ridge erected on the front surface of the pedestal 71, and is fixed by fitting the optical guide member 40 into the area surrounded by the fitting portion 713 of the ridge. can do.

また、嵌合部７１３に光ガイド部材４０が固定された状態において、凹部７１１は、光ガイド部材４０の二つの内側斜面４１１，４１２と共に全体的に略すり鉢形状を形成する内側斜面７１１ａ，７１１ｂを備えており、光ガイド部材４０の内側斜面により規定される視野角に干渉しないようになっている。
さらに、台座７１の開口部７１２を挟んだ対角位置には、素子サポート６０の３つの突出片６７の先端部が挿入されるスリット状の係合穴７１４が穿設されており、各突出片６７を係合穴７１４に挿入し係止させることで、素子サポート６０とガイドサポート７０とを結合させることが可能にされている。 Further, in a state where the optical guide member 40 is fixed to the fitting portion 713, the recess 711 together with the two inner slopes 411 and 412 of the optical guide member 40 together with the inner slopes 711a and 711b forming a substantially mortar shape as a whole. It is provided so as not to interfere with the viewing angle defined by the inner slope of the optical guide member 40.
Further, at diagonal positions sandwiching the opening 712 of the pedestal 71, slit-shaped engaging holes 714 into which the tips of the three projecting pieces 67 of the element support 60 are inserted are bored, and each projecting piece is formed. By inserting the 67 into the engaging hole 714 and locking the element support 60, the element support 60 and the guide support 70 can be coupled to each other.

台座７１の背面には、図３に示すように、光ガイド部材４０の試験光誘導部４４０の垂直導光部４４３が挿通される筒状部７１６が回路基板３０側に向かって延設されている。そして、この垂直導光部４４３の延出先端部は、試験用受光素子１４の光軸と直交する平坦面に形成されており、この平坦面が試験光の出射部４４４となっている。図示しないが、台座７１の背面には、光ガイド部材４０の垂直方向導光部４３０が挿通される筒状部も設けられている。
周壁部７２の背面側端部には、図２に示すように、半径方向外側に向かって四方に延出された張り出し部７２１が形成されており、各張り出し部７２１は、筐体２０のカバー体２１０の背面側に形成された図示しない凹部に嵌合するようになっている。 On the back surface of the pedestal 71, as shown in FIG. 3, a tubular portion 716 through which the vertical light guide portion 443 of the test light guiding portion 440 of the optical guide member 40 is inserted is extended toward the circuit board 30 side. There is. The extending tip portion of the vertical light guide portion 443 is formed on a flat surface orthogonal to the optical axis of the test light receiving element 14, and this flat surface serves as a test light emitting portion 444. Although not shown, a tubular portion through which the vertical light guide portion 430 of the optical guide member 40 is inserted is also provided on the back surface of the pedestal 71.
As shown in FIG. 2, an overhanging portion 721 extending in all directions toward the outside in the radial direction is formed at the rear end of the peripheral wall portion 72, and each overhanging portion 721 covers the housing 20. It is adapted to fit into a recess (not shown) formed on the back side of the body 210.

光ガイド部材４０は、光放出部４１０と２つの水平方向導光部４２０と２つの垂直方向導光部４３０と、試験用光源１３から出射された試験光を試験用受光素子１４へ導くための試験光誘導部４４０とを備えており、ガイドサポート７０により筐体２０の内部に固定保持されている。図４には、光ガイド部材４０の詳細な構成例が示されている。
図４に示すように、光ガイド部材４０は、上面視で略円環状であって筐体２０の正面において発光する発光面として機能する内側斜面４１１，４１２を有する光放出部４１０と、当該光放出部４１０からその外側に向かって延出された２つの水平方向導光部４２０と、各水平方向導光部４２０から下方の回路基板３０へ向かって垂下された２つの垂直方向導光部４３０と、前記試験用光源１３から出射された試験光を試験用受光素子１４に導くための試験光誘導部４４０とを備えており、これらは透光性のある樹脂により一体的に成形されている。 The optical guide member 40 is for guiding the test light emitted from the light emitting unit 410, the two horizontal light guide units 420, the two vertical light guide units 430, and the test light source 13 to the test light receiving element 14. It is provided with a test light guiding unit 440, and is fixedly held inside the housing 20 by a guide support 70. FIG. 4 shows a detailed configuration example of the optical guide member 40.
As shown in FIG. 4, the light guide member 40 has a light emitting portion 410 having inner slopes 411 and 412 that are substantially annular in top view and function as light emitting surfaces that emit light in front of the housing 20, and the light. Two horizontal light guides 420 extending outward from the emission unit 410, and two vertical light guides 430 hanging from each horizontal light guide 420 toward the circuit board 30 below. And a test light guiding unit 440 for guiding the test light emitted from the test light source 13 to the test light receiving element 14, and these are integrally molded with a translucent resin. ..

光放出部４１０は、その正面視形状が、前述した筐体２０のカバー体２１１の開口部２１４と相似形の長円状に形成されており、当該開口部２１４からは光放出部４１０の内側斜面４１１，４１２が外部に臨むように配置される。
また、水平方向導光部４２０は、均一な厚さの板状に形成されており、その背面側には円柱状の垂直方向導光部４３０が形成されている。
垂直方向導光部４３０は、その端面が平滑な面であり、図２に示すように、回路基板３０上に実装された主光源１１に近接対向した状態で配設される。つまり、この端面が主光源１１からの出射光の入射面となる。試験光を誘導する試験光誘導部４４０を構成する垂直導光部４４３も同様に、その端面が平滑な面であり、回路基板３０上に実装された試験用受光素子１４に近接対向した状態で配設される。つまり、その端面が、試験光の試験用受光素子１４への出射面となる。 The front view shape of the light emitting portion 410 is formed in an oval shape similar to the opening 214 of the cover body 211 of the housing 20 described above, and the inside of the light emitting portion 410 is formed from the opening 214. The slopes 411 and 412 are arranged so as to face the outside.
Further, the horizontal light guide portion 420 is formed in a plate shape having a uniform thickness, and a columnar vertical light guide portion 430 is formed on the back surface side thereof.
The end surface of the vertical light guide unit 430 is a smooth surface, and as shown in FIG. 2, the vertical light guide unit 430 is arranged in a state of being close to the main light source 11 mounted on the circuit board 30. That is, this end face becomes an incident surface of the light emitted from the main light source 11. Similarly, the vertical light guide unit 443 constituting the test light guiding unit 440 that guides the test light also has a smooth end surface thereof, and is in a state of being close to the test light receiving element 14 mounted on the circuit board 30. Arranged. That is, the end surface serves as an emission surface of the test light to the test light receiving element 14.

さらに、水平方向導光部４２０は、正面視において、切り欠き部４２１により二方向に反射される光をそれぞれ光放出部４１０の長円形の接線方向に沿うように反射させる２つの反射面４２２，４２３を備えている。かかる反射面４２２，４２３により、反射光は正面視で光放出部４１０の長円形に沿って進行し、より遠方まで光が届くこととなり、光放出部４１０全体を効果的に発光させることが可能となっている。 Further, the horizontal light guide unit 420 has two reflecting surfaces 422, which reflect light reflected in two directions by the notch portion 421 along the oval tangential direction of the light emitting unit 410, respectively, in the front view. It is equipped with 423. Due to the reflecting surfaces 422 and 423, the reflected light travels along the oval shape of the light emitting unit 410 in front view, and the light reaches farther, so that the entire light emitting unit 410 can be effectively emitted. It has become.

光放出部４１０は、中央部が大きく開口してなる円環状であり、円環の断面形状は、正面前方に凸となる山型となっている。つまり、光放出部４１０は、当該山型の尾根に相当する部分４１３が長円に沿って連なっている。そして、尾根部４１３のすぐ内側に、内側斜面４１１が全周に渡って形成され、さらにその内側に内側斜面４１２が全周に渡って形成されている。また、尾根部４１３の外側には、全周に渡って外側斜面４１４が形成されている。また、試験光誘導部４４０が設けられている光放出部４１０の部位は、試験光の入射部４１６として機能する。 The light emitting portion 410 is an annular shape having a large opening in the central portion, and the cross-sectional shape of the annular shape is a mountain shape that is convex in the front front. That is, in the light emitting portion 410, the portion 413 corresponding to the mountain-shaped ridge is continuous along an oval. An inner slope 411 is formed over the entire circumference immediately inside the ridge portion 413, and an inner slope 412 is further formed inside the inner slope 412 over the entire circumference. Further, on the outside of the ridge portion 413, an outer slope 414 is formed over the entire circumference. Further, the portion of the light emitting portion 410 provided with the test light guiding portion 440 functions as an incident portion 416 of the test light.

上記のように、光放出部４１０は、その尾根部４１３がカバー体２１０の開口部２１４の内縁部と一致するように配置されるので、内側斜面４１１，４１２のみが開口部２１４から外部に発光を行うこととなる。また、内側斜面４１１，４１２は、その表面に反射を抑止するための加工としてシボ加工が施されている。
一方、試験光の入射部４１６については、その部分だけシボ加工を施さずに透明な状態を維持して、試験の検出精度を確保している。 As described above, since the ridge portion 413 of the light emitting portion 410 is arranged so as to coincide with the inner edge portion of the opening 214 of the cover body 210, only the inner slopes 411 and 412 emit light to the outside from the opening 214. Will be done. Further, the inner slopes 411 and 412 are textured as a process for suppressing reflection on the surface thereof.
On the other hand, with respect to the incident portion 416 of the test light, only that portion is maintained in a transparent state without being textured to ensure the detection accuracy of the test.

試験光誘導部４４０は、前述した試験光の入射部４１６から入射した試験光を回路基板３０上の試験用受光素子１４まで案内するためのものであり、光放出部４１０から外側に延出された水平導光部４４１と、水平導光部４４１内を水平方向へ進行する光を垂直方向へ反射する反射面４４２と、反射面４４２で反射された試験光を基板方向へ誘導するように回路基板３０側に延出された垂直導光部４４３とを備えている。反射面４４２は、水平導光部４４１と垂直導光部４４３との交差位置において、４５°に傾斜した平滑面により形成されている。 The test light guiding unit 440 is for guiding the test light incident from the above-mentioned incident unit 416 of the test light to the test light receiving element 14 on the circuit board 30, and extends outward from the light emitting unit 410. A circuit that guides the horizontal light guide unit 441, the reflection surface 442 that vertically reflects the light traveling in the horizontal light guide unit 441 in the horizontal direction, and the test light reflected by the reflection surface 442 toward the substrate. It is provided with a vertical light guide unit 443 extending to the substrate 30 side. The reflection surface 442 is formed by a smooth surface inclined at 45 ° at the intersection of the horizontal light guide portion 441 and the vertical light guide portion 443.

（試験用光源及び試験用受光素子）
図５には、本実施形態の炎感知器１０を正面側から見た場合における試験用光源１３Ａ，１３Ｂと試験用受光素子１４の配置関係が示されている。
図５に示すように、本実施形態においては、２つの試験用光源１３Ａ，１３Ｂが環状の光ガイド部材４０の内側に並設されているとともに、光源１３Ａと１３Ｂの光軸が、それぞれ上面視で主検出受光素子５０Ａ，５０Ｂのほぼ中心を通り、光ガイド部材４０の反対側の中央部にて交差するように斜めに配設されている。 (Test light source and test light receiving element)
FIG. 5 shows the arrangement relationship between the test light sources 13A and 13B and the test light receiving element 14 when the flame detector 10 of the present embodiment is viewed from the front side.
As shown in FIG. 5, in the present embodiment, the two test light sources 13A and 13B are arranged side by side inside the annular optical guide member 40, and the optical axes of the light sources 13A and 13B are viewed from above, respectively. It is arranged diagonally so as to pass through substantially the center of the main detection light receiving elements 50A and 50B and intersect at the central portion on the opposite side of the optical guide member 40.

そして、光源１３Ａと１３Ｂの光軸が交差する光ガイド部材４０の中央部が試験光入射部ＬＩとなり、入射部ＬＩに接するように、試験用受光素子１４へ入射した試験光を誘導する試験光誘導部４４０が設けられている。
なお、試験用光源１３Ａ，１３Ｂは、紙面に対しても斜めに配設されており、試験用光源１３Ａ，１３Ｂと光ガイド部材４０の試験光入射部ＬＩとの間に、紙面と平行に保護ガラス１２が介在されている。つまり、試験用光源１３Ａ，１３Ｂは保護ガラス１２の背部にある。また、試験用光源１３Ａ，１３Ｂ（光源１，２）は、回路基板３０上の制御手段（ＣＰＵ）によって、図６（Ａ），（Ｂ）に示すように、同一周期かつ異なるタイミングで発光駆動される。試験用光源１３Ａ，１３Ｂの発光波長には、主検出受光素子（赤外線センサ）５０Ａと５０Ｂの検出波長帯またはその近傍の波長帯を使用するのが良い。試験用光源１３Ａ，１３Ｂが発光される際、主光源１１は消灯状態にされる。 Then, the central portion of the optical guide member 40 at which the optical axes of the light sources 13A and 13B intersect becomes the test light incident portion LI, and the test light that guides the test light incident on the test light receiving element 14 so as to be in contact with the incident portion LI. An induction unit 440 is provided.
The test light sources 13A and 13B are arranged diagonally with respect to the paper surface, and are protected in parallel with the paper surface between the test light sources 13A and 13B and the test light incident portion LI of the optical guide member 40. Glass 12 is interposed. That is, the test light sources 13A and 13B are on the back of the protective glass 12. Further, the test light sources 13A and 13B (light sources 1 and 2) are driven by the control means (CPU) on the circuit board 30 to emit light at the same cycle and at different timings as shown in FIGS. Will be done. For the emission wavelengths of the test light sources 13A and 13B, it is preferable to use the detection wavelength bands of the main detection light receiving elements (infrared sensor) 50A and 50B or the wavelength bands in the vicinity thereof. When the test light sources 13A and 13B emit light, the main light source 11 is turned off.

図５に示す構成においては、センサ保護ガラス（光透過性保護カバー１２）が不均一に汚損されていると、試験用光源１３Ａから出射された試験光を試験用受光素子１４が受けた時の受光量と、試験用光源１３Ｂから出射された試験光を試験用受光素子１４が受けた時の受光量は、設置当初は図６（Ｃ）に示すように、レベルが高かったものが、汚損された後は図６（Ｄ）に示すように、レベルが低くなる。なお、図６（Ｄ）においては、主検出受光素子５０Ａの配置側の方が主検出受光素子５０Ｂの配置側より光透過率が低いつまり汚損度が高い場合を示しているが、逆の場合もあるし、両方のレベルが低下する場合もある。 In the configuration shown in FIG. 5, when the sensor protective glass (light transmissive protective cover 12) is unevenly soiled, the test light receiving element 14 receives the test light emitted from the test light source 13A. As shown in FIG. 6C, the amount of light received and the amount of light received when the test light receiving element 14 receives the test light emitted from the test light source 13B were high in level at the beginning of installation, but were contaminated. After that, the level becomes low as shown in FIG. 6 (D). Note that FIG. 6D shows a case where the arrangement side of the main detection light receiving element 50A has a lower light transmittance than the arrangement side of the main detection light receiving element 50B, that is, a higher degree of fouling, but the opposite case. In some cases, both levels may drop.

本実施形態の炎感知器１０の回路基板３０は、試験用光源１３Ａからの試験光を試験用受光素子１４が受けた時の受光量と試験用光源１３Ｂからの試験光を試験用受光素子１４が受けた時の受光量の低下量から保護ガラスの透過率を算出し、メモリに記憶する。そして、主検出受光素子５０Ａの受光量と主検出受光素子５０Ｂの受光量に基づいて炎検出を行う場合に、各透過率に基づいて、主検出受光素子５０Ａの受光量や主検出受光素子５０Ｂの受光量を補正し、補正値により判定を行うように構成されている。
また、回路基板３０は、試験用受光素子１４の受光レベルが所定のしきい値以下になると、受信機へ汚れ検出情報（汚れ側を示す情報を含んでも良い）を出力して知らせるように構成されている。なお、汚れ検出信号を生成して光ガイド部材４０を点灯もしくは点滅させたりするように構成しても良い。また、汚れ警報は、試験用受光素子１４の受光量の低下が所定時間以上経過した場合に発するようにしても良い。 The circuit board 30 of the flame detector 10 of the present embodiment receives the amount of received light when the test light receiving element 14 receives the test light from the test light source 13A and the test light from the test light source 13B. The transmittance of the protective glass is calculated from the amount of decrease in the amount of light received when the light source is received, and stored in the memory. When flame detection is performed based on the amount of light received by the main detection light receiving element 50A and the amount of light received by the main detection light receiving element 50B, the amount of light received by the main detection light receiving element 50A and the amount of light received by the main detection light receiving element 50B are based on each transmittance. It is configured to correct the amount of light received and make a judgment based on the corrected value.
Further, the circuit board 30 is configured to output dirt detection information (which may include information indicating the dirt side) to the receiver when the light receiving level of the test light receiving element 14 becomes equal to or lower than a predetermined threshold value. Has been done. The light guide member 40 may be configured to light or blink by generating a dirt detection signal. Further, the dirt alarm may be issued when the amount of light received by the test light receiving element 14 decreases for a predetermined time or longer.

上記のような構成を有する炎感知器１０では、保護ガラス（光透過性保護カバー１２）が不均一に汚れた場合に、保護ガラスの各センサ（５０Ａ，５０Ｂ）に対応する部分の光透過率に応じて、センサの受光量を補正するので、炎検出判定の際の誤報や失報を抑制することができる。また、保護ガラスの汚れ警報も的確に行える。
なお、回路基板３０は、主検出受光素子５０Ａの受光量と主検出受光素子５０Ｂの受光量との比を算出し、受光量の比に基づいて炎検出を行うように構成することも可能であり、その場合には、試験用光源１３Ａからの試験光を試験用受光素子１４が受けた時の受光量と試験用光源１３Ｂからの試験光を試験用受光素子１４が受けた時の受光量との比を算出し、その受光量の比に基づいて炎検出のための受光量比の演算の際に、補正を行うように構成しても良い。 In the flame detector 10 having the above configuration, when the protective glass (light transmissive protective cover 12) is unevenly soiled, the light transmittance of the portion corresponding to each sensor (50A, 50B) of the protective glass Since the light receiving amount of the sensor is corrected according to the above, it is possible to suppress false reports and false reports at the time of flame detection determination. In addition, the dirt alarm of the protective glass can be accurately performed.
The circuit board 30 can also be configured to calculate the ratio of the light receiving amount of the main detection light receiving element 50A to the light receiving amount of the main detection light receiving element 50B and detect the flame based on the ratio of the light receiving amount. In that case, the amount of light received when the test light receiving element 14 receives the test light from the test light source 13A and the amount of light received when the test light receiving element 14 receives the test light from the test light source 13B. It may be configured to calculate the ratio with and to make a correction when calculating the light receiving amount ratio for flame detection based on the light receiving amount ratio.

次に、試験用光源１３と試験用受光素子１４の配置の変形例を、図７〜図９を用いて説明する。
第１の変形例は、図７に示すように、２つの試験用光源１３Ａ，１３Ｂを、互いの光軸が平行であって、主検出受光素子５０Ａと５０Ｂの並び方向と直交し主検出受光素子５０Ａと５０Ｂの中心を通るように配置するとともに、光ガイド部材４０の試験用光源１３Ａ，１３Ｂに対向する試験光入射部ＬＩ１，ＬＩ２にそれぞれ試験光誘導部４４０Ａ，４４０Ｂを設けたものである。また、図示しないが、試験光誘導部４４０Ａと４４０Ｂを構成する垂直導光部４４３の下端面に対向するように、回路基板３０上に試験用受光素子（１４Ａ，１４Ｂ）が実装される。 Next, a modified example of the arrangement of the test light source 13 and the test light receiving element 14 will be described with reference to FIGS. 7 to 9.
In the first modification, as shown in FIG. 7, the two test light sources 13A and 13B have their optical axes parallel to each other and are orthogonal to the alignment direction of the main detection light receiving elements 50A and 50B. The elements are arranged so as to pass through the centers of the elements 50A and 50B, and the test light incident portions LI1 and LI2 facing the test light sources 13A and 13B of the optical guide member 40 are provided with the test light guiding portions 440A and 440B, respectively. .. Although not shown, test light receiving elements (14A, 14B) are mounted on the circuit board 30 so as to face the lower end surfaces of the vertical light guide portions 443 constituting the test light guiding portions 440A and 440B.

この変形例においては、試験用光源１３Ａから出射された試験光は保護ガラス（１２）の主検出受光素子５０Ａ上方部位を通過して試験光入射部ＬＩ１に入射し、試験光誘導部４４０Ａによって誘導されて試験用受光素子（１４Ａ）へ照射され、受光される。また、試験用光源１３Ｂから出射された試験光は保護ガラス（１２）の主検出受光素子５０Ｂ上方部位を通過して試験光入射部ＬＩ２に入射し、試験光誘導部４４０Ｂによって誘導されて試験用受光素子（１４Ｂ）へ照射され、受光される。２つの試験用光源１３Ａ，１３Ｂは同時に発光させることができる。
保護ガラス１２が汚損されている場合の回路基板３０による主検出受光素子５０Ａと５０Ｂの受光量に基づく炎検出判定時の補正処理および保護ガラスの汚れ警報処理は、前記実施形態の場合と同じである。 In this modification, the test light emitted from the test light source 13A passes through the portion above the main detection light receiving element 50A of the protective glass (12), enters the test light incident portion LI1, and is guided by the test light guiding portion 440A. Then, the test light receiving element (14A) is irradiated and received light. Further, the test light emitted from the test light source 13B passes through a portion above the main detection light receiving element 50B of the protective glass (12), enters the test light incident portion LI2, and is guided by the test light guiding portion 440B for testing. The light receiving element (14B) is irradiated and received light. The two test light sources 13A and 13B can emit light at the same time.
When the protective glass 12 is contaminated, the correction processing at the time of flame detection determination based on the light receiving amount of the main detection light receiving elements 50A and 50B by the circuit board 30, and the contamination alarm processing of the protective glass are the same as in the case of the above embodiment. is there.

第２の変形例は、図８に示すように、第１の変形例と同様に、２つの試験用光源１３Ａ，１３Ｂを、互いの光軸が平行であって、主検出受光素子５０Ａと５０Ｂの並び方向と直交し主検出受光素子５０Ａと５０Ｂの中心を通るように配置している。ただし、光ガイド部材４０の試験用光源１３Ａ，１３Ｂに対向する試験光入射部ＬＩ１，ＬＩ２には、試験光誘導部４４０Ａ，４４０Ｂが設けられていない。また、光ガイド部材４０を構成する一対の垂直方向導光部４３０Ａ，４３０Ｂのうち一方（４３０Ａ）の端部に対応して主光源１１が回路基板３０上に配設され、他方（４３０Ｂの下端面に対向するように、回路基板３０上に試験用受光素子１４が実装される。 In the second modification, as shown in FIG. 8, the two test light sources 13A and 13B have their optical axes parallel to each other, and the main detection light receiving elements 50A and 50B are the same as in the first modification. It is arranged so as to be orthogonal to the arrangement direction of the main detection light receiving elements 50A and 50B and pass through the center of the main detection light receiving elements 50A and 50B. However, the test light incident portions LI1 and LI2 facing the test light sources 13A and 13B of the optical guide member 40 are not provided with the test light guiding portions 440A and 440B. Further, the main light source 11 is arranged on the circuit board 30 corresponding to the end of one (430A) of the pair of vertical light guide portions 430A and 430B constituting the optical guide member 40, and the other (below 430B). The test light receiving element 14 is mounted on the circuit board 30 so as to face the end face.

この変形例においては、試験用光源１３Ａから出射された試験光は保護ガラス（１２）の主検出受光素子５０Ａ上方部位を通過して試験光入射部ＬＩ１に入射し、光ガイド部材４０の水平方向導光部４２０内を進んで垂直方向導光部４３０Ｂによって誘導されて試験用受光素子（１４）へ照射され、受光される。また、試験用光源１３Ｂから出射された試験光は保護ガラス（１２）の主検出受光素子５０Ｂ上方部位を通過して試験光入射部ＬＩ２に入射し、水平方向導光部４２０内を進んで垂直方向導光部４３０Ｂによって誘導されて試験用受光素子（１４）へ照射され、受光される。２つの試験用光源１３Ａ，１３Ｂは、第１の変形例と同様に、異なるタイミングで発光させる必要がある。炎検出判定時の補正処理および保護ガラスの汚れ警報処理は、第１の変形例と同じである。 In this modification, the test light emitted from the test light source 13A passes through the portion above the main detection light receiving element 50A of the protective glass (12) and is incident on the test light incident portion LI1 in the horizontal direction of the optical guide member 40. It travels through the light guide unit 420, is guided by the vertical light guide unit 430B, irradiates the test light receiving element (14), and receives light. Further, the test light emitted from the test light source 13B passes through the portion above the main detection light receiving element 50B of the protective glass (12), enters the test light incident portion LI2, and travels vertically in the horizontal light guide portion 420. Guided by the directional light guide unit 430B, the test light receiving element (14) is irradiated and received light. The two test light sources 13A and 13B need to emit light at different timings as in the first modification. The correction process at the time of flame detection determination and the dirt alarm process of the protective glass are the same as those of the first modification.

第３の変形例の構成は、図９に示すように、第２の変形例とほぼ同じ構成であり、試験光入射部ＬＩ１，ＬＩ２に試験光誘導部４４０Ａ，４４０Ｂを設けずに、２つの試験用光源１３Ａ，１３Ｂを、互いの光軸が平行であって主検出受光素子５０Ａと５０Ｂの中心を通るように配置している。第２の変形例との差異は、試験用光源１３Ａ，１３Ｂを、それぞれの光軸が主検出受光素子５０Ａと５０Ｂの並び方向に対して斜めになるように配置している点のみである。 As shown in FIG. 9, the configuration of the third modification is almost the same as that of the second modification. The test light sources 13A and 13B are arranged so that their optical axes are parallel to each other and pass through the centers of the main detection light receiving elements 50A and 50B. The only difference from the second modification is that the test light sources 13A and 13B are arranged so that their respective optical axes are oblique with respect to the alignment direction of the main detection light receiving elements 50A and 50B.

この変形例においても、光ガイド部材４０を構成する一対の垂直方向導光部４３０Ａ，４３０Ｂのうち一方（４３０Ａ）の端部に対応して主光源１１が回路基板３０上に配設され、他方（４３０Ｂ）の下端面に対向するように、回路基板３０上に試験用受光素子１４が実装される。２つの試験用光源１３Ａ，１３Ｂは、異なるタイミングで発光される。炎検出判定時の補正処理および保護ガラスの汚れ警報処理は、第２の変形例と同じである。
また、第３の変形例においては、試験光入射部ＬＩ１，ＬＩ２の位置が、試験用受光素子へ試験を誘導する垂直方向導光部４３０Ｂに近くなるとともに、ＬＩ１，ＬＩ２への入射角度も大きくなり、入射時の反射ロス分と入射後の導光効率向上分が最適化され、第２の変形例に比べて、受光素子への入射光量を多くして検出精度を高めることができる。 Also in this modification, the main light source 11 is arranged on the circuit board 30 corresponding to the end of one (430A) of the pair of vertical light guides 430A and 430B constituting the optical guide member 40, and the other. The test light receiving element 14 is mounted on the circuit board 30 so as to face the lower end surface of (430B). The two test light sources 13A and 13B emit light at different timings. The correction process at the time of flame detection determination and the dirt alarm process of the protective glass are the same as those of the second modification.
Further, in the third modification, the positions of the test light incident portions LI1 and LI2 are close to the vertical light guide portion 430B that guides the test to the test light receiving element, and the incident angle to the LI1 and LI2 is also large. Therefore, the reflection loss at the time of incident and the light guide efficiency improvement after the incident are optimized, and the amount of incident light to the light receiving element can be increased to improve the detection accuracy as compared with the second modification.

以上、本発明を実施形態に基づいて説明したが、本発明は上記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で適宜変更可能である。例えば、上記実施形態では、主検出受光素子を回路基板３０上に２個実装したものを示したが、主検出受光素子の数は２個に限定されず、３個以上であっても良い。
また、上記実施形態では、光透過性保護カバー１２としてサファイアガラスを使用しているが、サファイアガラスに限定されるものではなく、使用する受光素子の波長帯の光を透過し易い素材であれば良い。 Although the present invention has been described above based on the embodiments, the present invention is not limited to the above embodiments and can be appropriately modified without departing from the gist thereof. For example, in the above embodiment, two main detection light receiving elements are mounted on the circuit board 30, but the number of main detection light receiving elements is not limited to two and may be three or more.
Further, in the above embodiment, sapphire glass is used as the light transmissive protective cover 12, but the material is not limited to sapphire glass and can easily transmit light in the wavelength band of the light receiving element to be used. good.

１０ 炎感知器
１１ 主光源
１２ 光透過性保護カバー（保護ガラス）
１３Ａ，１３Ｂ 試験用光源
１４ 試験用受光素子
２０ 筐体
３０ 回路基板
４０ 光ガイド部材
４１０ 光放出部
４２０ 水平方向導光部
４３０ 垂直方向導光部
４４０ 試験光誘導部
４４３ 垂直導光部
５０Ａ，５０Ｂ 主検出受光素子
６０ 素子サポート
７０ ガイドサポート
ＬＩ 入射部 10 Flame detector 11 Main light source 12 Light transmissive protective cover (protective glass)
13A, 13B Test light source 14 Test light receiving element 20 Housing 30 Circuit board 40 Light guide member 410 Light emission unit 420 Horizontal light guide 430 Vertical light guide 440 Test light guide 443 Vertical light guide 50A, 50B Main detection light receiving element 60 Element support 70 Guide support LI Incident part

Claims (6)

炎の検出機能を有する回路が形成された回路基板を内蔵した筐体と、
前記回路基板に実装された主光源と、
前記筐体の正面において発光する光放出部と透光素材からなり前記主光源からの光を前記光放出部まで導く導光部とを有する光ガイド部材と、
筐体の正面側に設けられた開口部から炎が発する所定波長光を受光する複数の主検出受光素子と、
前記開口部と前記複数の主検出受光素子との間に設けられた光透過性保護カバーと、
前記光透過性保護カバー試験光を投光する複数の試験用光源と、
前記回路基板に実装され前記光透過性保護カバーを透過した試験光を受光する試験用受光素子と、を備え、前記回路基板は、前記複数の主検出受光素子の受光量に基づいて炎を検知する機能を有する炎感知器であって、
前記光ガイド部材の光放出部は、前記筐体の正面側において前記主検出受光素子を取り囲む略環状に形成され、
前記光放出部には前記試験光の入射部が設けられ、
前記複数の試験用光源は、出射した試験光が前記光透過性保護カバーの前記複数の主検出受光素子の受光面に対向する部位を透過して前記入射部へ入射されるように配設され、
前記入射部へ入射された試験光は前記光ガイド部材を経由して出射部へ誘導されて前記試験用受光素子へ入射され、
前記回路基板は、前記試験用受光素子の受光量に基づいて前記複数の主検出受光素子の受光量を補正し、補正した受光量に基づいて炎を検知するように構成されていることを特徴とする炎感知器。 A housing with a built-in circuit board on which a circuit with a flame detection function is formed,
The main light source mounted on the circuit board and
An optical guide member having a light emitting portion that emits light on the front surface of the housing and a light emitting portion that is made of a translucent material and that guides light from the main light source to the light emitting portion.
A plurality of main detection light receiving elements that receive light of a predetermined wavelength emitted by a flame from an opening provided on the front side of the housing, and
A light transmissive protective cover provided between the opening and the plurality of main detection light receiving elements,
A plurality of test light sources that emit light for the light transmissive protective cover test light,
A test light receiving element mounted on the circuit board and receiving test light transmitted through the light transmissive protective cover is provided, and the circuit board detects a flame based on the light receiving amount of the plurality of main detection light receiving elements. It is a flame detector that has the function of
The light emitting portion of the light guide member is formed on the front side of the housing in a substantially annular shape surrounding the main detection light receiving element.
The light emitting portion is provided with an incident portion of the test light.
The plurality of test light sources are arranged so that the emitted test light passes through a portion of the light transmissive protective cover facing the light receiving surface of the plurality of main detection light receiving elements and is incident on the incident portion. ,
The test light incident on the incident portion is guided to the exit portion via the optical guide member and is incident on the test light receiving element.
The circuit board is characterized in that the light receiving amount of the plurality of main detection light receiving elements is corrected based on the light receiving amount of the test light receiving element, and the flame is detected based on the corrected light receiving amount. Flame detector. 前記入射部は１つであり、前記複数の試験用光源はそれぞれの光軸が前記入射部を通るように配設されていることを特徴とする請求項１に記載の炎感知器。 The flame detector according to claim 1, wherein the incident portion is one, and the plurality of test light sources are arranged so that their respective optical axes pass through the incident portion. 前記光ガイド部材には、前記光放出部の前記入射部へ入射した光を前記試験用受光素子まで導く試験光誘導部が設けられていることを特徴とする請求項２に記載の炎感知器。 The flame detector according to claim 2, wherein the light guide member is provided with a test light guiding portion that guides light incident on the incident portion of the light emitting portion to the test light receiving element. .. 前記入射部は前記複数の試験用光源と同一の数だけ設けられ、前記複数の試験用光源はそれぞれの光軸が対応する前記入射部を通るように配設され、
前記光ガイド部材には、前記複数の入射部に入射した光を前記試験用受光素子まで導く導光部を有する複数の試験光誘導部が設けられ、
前記回路基板には、前記複数の試験光誘導部の導光部の端部に対応してそれぞれ試験用受光素子が実装されていることを特徴とする請求項１に記載の炎感知器。 The same number of incident portions as the plurality of test light sources are provided, and the plurality of test light sources are arranged so that their respective optical axes pass through the corresponding incident portions.
The optical guide member is provided with a plurality of test light guiding portions having a light guide portion that guides light incident on the plurality of incident portions to the test light receiving element.
The flame detector according to claim 1, wherein a test light receiving element is mounted on the circuit board corresponding to each end of a light guide portion of the plurality of test light guiding portions. 前記光ガイド部材には、前記光放出部から前記回路基板へ向かって延出された複数の導光部が設けられ、
前記複数の導光部のうちいずれか一つの導光部の端部は、前記回路基板に実装された前記主光源に対向され、前記複数の導光部のうち他の一つの導光部の端部は、前記回路基板に実装された前記試験用受光素子に対向されるように構成されていることを特徴とする請求項３に記載の炎感知器。 The optical guide member is provided with a plurality of light guide portions extending from the light emitting portion toward the circuit board.
The end of any one of the plurality of light guides is opposed to the main light source mounted on the circuit board, and the end of the other one of the plurality of light guides is opposed to the main light source. The flame detector according to claim 3, wherein the end portion is configured to face the test light receiving element mounted on the circuit board. 前記入射部は、前記光放出部の、前記複数の導光部のうち端部が前記主検出受光素子に対向する前記導光部よりも前記複数の導光部のうち端部が前記試験用受光素子に対向する前記導光部に近い部位に設けられていることを特徴とする請求項５に記載の炎感知器。 The incident portion is such that the end portion of the plurality of light guide portions of the light emitting portion faces the main detection light receiving element, and the end portion of the plurality of light guide portions is for the test. The flame detector according to claim 5, wherein the flame detector is provided at a portion close to the light guide portion facing the light receiving element.
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