JP2021049693A - Method for manufacturing component with film - Google Patents

Abstract

To provide a method for manufacturing a component with a film capable of easily manufacturing the component with the film having a plurality of holes.SOLUTION: A method for manufacturing a component 1 with a film having a substrate 2 having a plurality of holes 29, and a film 3 bonded on an area that avoids the holes 29 at a front surface 2f of the substrate 2, includes: a bonding step, which uses a masking tool 4 for collectively covering the respective holes 29 and their periphery 29p from the front surface 2f side of the substrate 2, for bonding the film 3 onto the substrate 2 while disposing the film 3 onto the front surface 2f of the substrate 2 mounted with the masking tool 4 via an adhesive layer 5, and bringing the film 3 into close contact with the substrate 2; and a mask removal step for cutting off the film 3 at an outer edge 41e of the masking tool 4, and removing the masking tool 4 and the film 3 which has been cut off.SELECTED DRAWING: Figure 3

Description

The present invention relates to a method for manufacturing a film-attached part having a substrate and a film.

A film-attached component in which a film is adhered to the surface of a substrate is known. By adhering the film to the surface of the substrate, it is possible to impart a design or function derived from the film to the component.

Some parts with a film have holes. If the pores are covered with a film adhered to the surface of the substrate, the function of the pores is impaired. Therefore, in the film-attached parts having such pores, the film is once adhered to the entire surface of the substrate. After that, it is common to cut off the film covering the hole at the peripheral edge of the hole (see, for example, Patent Document 1).
In the film-attached part thus obtained, the film is adhered only to the region of the surface of the substrate avoiding the pores.

Japanese Patent No. 4307236

By the way, for example, when the hole is used as a mounting hole for attaching another member to the film-attached part, the film-attached part is provided with a plurality of holes. When manufacturing a film-attached part having a plurality of holes as described above, a step of cutting a film covering the holes at the peripheral edge of the holes is required for each hole. However, since the process is very complicated, a manufacturing method capable of easily manufacturing a film-attached part having a plurality of holes is desired.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a film-attached part capable of easily producing a film-attached part having a plurality of holes.

The method for manufacturing a film-attached part of the present invention that solves the above problems is
A method for manufacturing a film-attached part having a substrate having a plurality of holes and a film adhered to a region of the surface of the substrate avoiding the holes.
Using a mask jig that collectively covers each of the holes and the peripheral edge thereof from the surface side of the substrate.
An adhesive step of arranging the film on the surface of the substrate on which the mask jig is attached via an adhesive layer, and adhering the film to the substrate while adhering the film to the substrate.
A method for manufacturing a part with a film, comprising a mask removing step of cutting the film at the outer edge of the mask jig and removing the mask jig and the cut film.

According to the method for manufacturing a film-attached part of the present invention, it is possible to easily manufacture a film-attached part having a plurality of holes.

It is explanatory drawing which shows typically the state that the table member was attached to the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the substrate and the mask jig in the manufacturing method of the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the mask jig used in the manufacturing method of the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the manufacturing method of the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the manufacturing method of the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the manufacturing method of the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the manufacturing method of the part with a film of Example 1. FIG. It is explanatory drawing which shows typically the manufacturing method of the part with a film of Example 2.

Hereinafter, the method for manufacturing the film-attached parts of the present invention will be specifically described.
Unless otherwise specified, the numerical range "x to y" described in the present specification includes the lower limit x and the upper limit y. Then, a numerical range can be constructed by arbitrarily combining these upper and lower limit values and the numerical values listed in the embodiment. Further, the numerical value arbitrarily selected from the numerical range can be set as the upper limit value and the lower limit value.

The method for manufacturing a film-attached part of the present invention uses a mask jig to be mounted on a substrate, and includes a bonding step and a mask removing step.

The substrate has a plurality of pores. The mask jig collectively covers each hole in the substrate and its peripheral edge from the surface side of the substrate. Therefore, when the mask jig is attached to the substrate, the hole portion of the substrate and the peripheral portion thereof are collectively covered with the mask jig.

In the bonding step, a film is placed on the surface of the substrate on which the mask jig is attached via an adhesive layer, and the film is brought into close contact with the substrate. In the bonding step, the film is bonded to the substrate. At this time, the film is adhered not to the surface of the substrate but to the surface of the mask jig at the holes in the substrate and the peripheral edge thereof.

In the mask removing step, the film is cut at the outer edge of the mask jig, and the mask jig and the cut film are removed. By removing the mask jig and the cut film, a film-attached part having a substrate having a plurality of holes and a film adhered to a region on the surface of the substrate avoiding the pores can be obtained.

In the film-attached part obtained by the method for manufacturing a film-attached part of the present invention, the film is not adhered not only to the hole but also to the peripheral edge of the hole. Therefore, it can be said that the film-attached part of the present invention obtained by the method for manufacturing a film-attached part of the present invention has a film adhered to a region on the surface of the substrate avoiding the pores and the peripheral edge of the pores. ..

According to the method for manufacturing a film-attached part of the present invention, a plurality of holes and their peripheral edges are collectively covered with a mask jig. By cutting the film at the outer edge of the mask jig using such a mask jig, it is possible to collectively cut and remove the film covering the plurality of holes. That is, according to the method for manufacturing a part with a film of the present invention, the number of steps for manufacturing a part with a film can be significantly reduced as compared with the method for cutting and removing a film covering a plurality of holes for each hole, and a plurality of holes can be manufactured. It is possible to easily manufacture a film-attached part having a portion.

Hereinafter, if necessary, the method for manufacturing the film-attached part of the present invention is referred to as the manufacturing method of the present invention, and the film-attached part manufactured by the manufacturing method of the present invention is referred to as the film-attached part of the present invention. The mask jig used in the manufacturing method may be referred to as the mask jig of the present invention.

Hereinafter, the manufacturing method, the parts with a film, and the mask jig of the present invention will be described for each component.

The substrate used in the production method of the present invention has a plurality of pores.
The shape of each hole may be the same or different. Further, each hole may be a through hole or a dead end hole. Further, a through hole and a dead end hole may be combined to form a plurality of holes.

The substrate used in the production method of the present invention may have holes that are not covered by the mask jig even in the bonding step, that is, other holes that do not belong to the plurality of holes described above. Even if the substrate has the other holes, the man-hours for manufacturing the film-attached parts can be reduced and the film-attached parts can be easily manufactured by adhering the film while covering the plurality of holes with the mask jig. ..

The material of the substrate and its shape are not particularly limited, but it is preferable that the substrate has a certain degree of rigidity because it has holes and is covered with a film.
Specifically, the substrate material is a resin material typified by polycarbonate (PC), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer synthetic resin (ABS), etc., and the resin material is glass fiber or carbon. It is preferable to select a fiber reinforced resin containing fibers or the like, a metal typified by aluminum, stainless steel or the like. As the material of the substrate, it is preferable to use a thermoplastic resin. The shape of the substrate is preferably 2.0 mm or more, more preferably 3.5 mm or more, and particularly preferably 5.0 mm or more.

The material of the film and its shape are also not particularly limited, but are flexible enough to be deformed along the surface shape of the substrate and can be cut because they are adhered to the surface of the substrate. There is a need. As the material of such a film, a thermoplastic polymer such as acrylic resin, polyethylene, polyvinyl chloride, or thermoplastic polyurethane may be used, or a polymer having no thermoplasticity or low thermoplasticity may be used. good.

Examples of other film materials include natural rubber or synthetic rubber, metal, leather, natural fiber or synthetic fiber woven fabric, non-woven fabric, and knit.
The thickness of the film is not particularly limited, but it is preferably thinner than the thickness of the substrate. Specific examples of the preferred range of film thickness include 5 mm or less, 2 mm or less, and 1 mm or less.

As described above, the mask jig collectively covers each hole in the substrate and its peripheral edge from the surface side of the substrate. As such a mask jig, one having a plurality of portions corresponding to the plurality of holes and a portion covering the peripheral edge of each hole on the surface of the substrate may be used. Of the mask jigs, a plurality of portions corresponding to the plurality of holes are referred to as hole mask portions. Further, a portion of the surface of the substrate that collectively covers the peripheral edge of each hole is referred to as a peripheral mask portion. It can also be said that the mask jig of the present invention is one in which a plurality of hole mask portions are connected and integrated by a peripheral mask portion.

The hole mask portion may simply cover the surface side of the hole portion, and may have a flat plate shape without unevenness, for example. However, in consideration of facilitating the positioning of the mask jig with respect to the substrate, it is preferable that the hole mask portion has a convex shape so that the mask jig can be inserted into the hole portion when the mask jig is mounted on the substrate. According to the convex hole mask portion, it is possible not only to cover the hole portion from the surface side of the substrate but also to cover the hole portion from the inside thereof. In the present specification, the hole mask portion having such a convex shape is referred to as an intrahole mask portion.
In order to precisely position the mask jig with respect to the substrate, it is preferable that each in-hole mask portion has a shape corresponding to the corresponding hole portion.

The adhesive for adhering the film to the substrate is not particularly limited, and may be appropriately and appropriately selected depending on the material of the substrate and the film.
Specific examples of the adhesive include reactive adhesives such as epoxy resin adhesives, polyurethane adhesives, and acrylic resin adhesives, vinyl resin adhesives, styrene resin adhesives, epoxy resin adhesives, and cyano. Examples thereof include solvent-based adhesives such as acrylate-based adhesives, synthetic rubber-based adhesives, silicone-based adhesives, and modified silicone-based adhesives.

The manufacturing method of the present invention includes an bonding step and a mask removing step.
Of these, in the bonding step, the film is placed on the surface of the substrate on which the mask jig is attached via the adhesive layer, and the film is adhered to the substrate while adhering the film to the substrate.

As the adhesive layer, a layer obtained by forming the above-mentioned adhesive on a substrate and / or a film can be used. As a method for forming the adhesive in layers, a method such as coating or spraying may be used, or another method may be used. For example, if the adhesive is thermoplastic, the adhesive is molded into a sheet or granules in advance and cured, and then the cured adhesive is placed on a substrate and / or a film and heated to soften it. The adhesive layer may be formed on the substrate and / or the film.
The thickness of the adhesive layer may be appropriately set according to the shape of the substrate, the material of the substrate and the film, and the like.

In the bonding step, by adhering the film to the substrate, the film can be made to follow the shape of the substrate, and the film can be firmly adhered to the substrate. As a result, the film-attached part of the present invention obtained by the manufacturing method of the present invention has excellent integralness between the film and the substrate, and can have both excellent designability and excellent durability.
The bonding step may be performed at any temperature, but it is also effective to heat and soften the film in order to make the shape of the film more in line with the substrate.

As a method of adhering the film to the substrate in the bonding step, a method called a vacuum compressed air molding method may be adopted, and among these, a method called three-dimensional surface decoration molding (Three dimension Overlay Method: TOM molding) is particularly preferable. Used. TOM molding will be described in detail in the column of Examples.

In the mask removing step, after the above-mentioned bonding step, the film is cut at the outer edge of the mask jig, and the mask jig and the cut film are removed.
The film may be cut by a known method. For example, the film may be cut manually by an operator using a cutter, or by an automatic cutter programmed to move the blade along the outer edge of the mask jig. Alternatively, the film may be die-cut using a mold having a blade having a shape along the outer edge of the mask jig.

The film-attached component of the present invention obtained by the above-mentioned production method of the present invention has a substrate having a plurality of pores and a film adhered to a region on the surface of the substrate avoiding the pores.
More specifically, the surface of the substrate is roughly divided into a region in which the peripheral portions of the respective pores are grouped around the pores and a region outside the region. Hereinafter, if necessary, a region on the surface of the substrate in which the peripheral portions of the respective pore portions are grouped together with the pore portions as the center is referred to as a peripheral masked region. Further, a region of the surface of the substrate located outside the peripheral masked region is referred to as a general region. Further, among the film-attached parts of the present invention, a portion having a peripheral masked region is referred to as a masked portion, and a portion having a general region is referred to as a general portion.
The film is adhered to the general region of the surface of the substrate, but the film is not adhered to the peripheral masked region and remains exposed. Therefore, the film is exposed on the surface of the general portion of the film-attached part of the present invention, and the substrate is exposed on the surface of the masked portion.

In the film-attached part of the present invention, the masked portion is a portion where the substrate may be left exposed, for example, when another member is attached to the film-attached part of the present invention, it is hidden by the other member. However, the general part of the film-attached part of the present invention is required to have a certain degree of excellent design. Therefore, it is preferable that the film is firmly adhered to the general portion up to the boundary portion with the masked portion.

By the way, in the bonding step of the manufacturing method of the present invention described above, the film is continuously bonded to the general region of the substrate and the mask jig. Therefore, when a step is generated between the surface of the mask jig opposite to the substrate (hereinafter referred to as the surface of the mask jig) and the general region, the film needs to be significantly deformed at the step portion. is there. Unless the film is significantly deformed at the step portion, the film does not follow the step side portion in the general region, that is, the boundary portion with the peripheral masked region in the general region, and therefore the film adherence particularly on the surface of the substrate. There is a risk that the design and durability of the film-attached parts will deteriorate.

In order to suppress such deformation defects of the film, a method of adhering a film that has been preheated and softened as described above may be adopted, but the number of man-hours required for the production method of the present invention is reduced, and the present invention In order to easily manufacture the film-attached part of the present invention, it is preferable to adopt another method. As the other method, there is a method of forming the mask jig or the substrate into a shape capable of reducing the above-mentioned step.

In order to reduce the above-mentioned step, it is preferable to arrange the surface of the mask jig and the surface of the substrate at the same positions in the thickness direction of the film-attached component, at least in the parting portion between the mask jig and the substrate. ..
Therefore, for the mask jig, it is preferable to reduce the thickness of the outer peripheral end portion of the peripheral mask portion. By reducing the thickness of the outer peripheral end portion, the step between the surface of the mask jig and the general area can be reduced even if the thickness of the substrate is constant. The thickness of the outer peripheral end portion of the mask jig is preferably 0.5 mm or less, and more preferably 0.3 mm or less.

When the peripheral mask portion is thick, it is also effective to gradually reduce the thickness of the outer peripheral portion of the peripheral mask portion toward the end portion, that is, the outer peripheral end portion. Also in this case, the thickness of the outer peripheral end portion of the peripheral mask portion is preferably 0.5 mm or less, and more preferably 0.3 mm or less.

It is better that the thickness of the outer peripheral portion changes slowly rather than suddenly changes toward the outer peripheral end portion. The change in thickness can be defined by the inclination angle of the surface of the outer peripheral portion in the peripheral mask portion. Specifically, as a preferable range of the inclination angle, each range of 25 ° or less, 20 ° or less, 10 ° or less, 8 ° or less, and 6 ° or less can be exemplified.
This aspect is effective when the maximum thickness of the peripheral mask portion is 1.0 mm or more, and is particularly effective when the maximum thickness is 1.5 mm or more.

The material of the mask jig is not particularly limited, but the mask jig is required to have a rigidity sufficient to maintain its shape even in the above-mentioned vacuum compressed air forming. Materials for such mask jigs include resin materials such as PC, PET, ABS, polyamide (PA), aromatic polyamide (PPA), and polyamide-imide (PAI), and glass fibers, carbon fibers, and the like as the resin materials. It is preferable to select a fiber reinforced resin containing the above, a metal typified by aluminum, stainless steel, or the like.

Further, in order to reduce the above-mentioned step, it is also effective to make the peripheral masked region of the substrate concave by the thickness of the mask jig. The peripheral masked area in this case is referred to as a concave peripheral masked area.
Even when the substrate of the present invention has a concave peripheral masked region, the surface of the mask jig and the surface of the substrate are positioned at the same level in the thickness direction of the film-attached component in the parting portion between the mask jig and the substrate. Placed in.

In this case, the concave peripheral masked region may be smoothly continuous with the general region of the substrate, but is preferably continuous with the general region of the substrate in a stepped manner.

A peripheral mask portion of the mask jig is arranged in the concave peripheral edge masked region of the substrate. By making the concave peripheral masked region and the general region of the substrate continuous in a stepped manner, a peripheral edge is formed between the outer peripheral end portion of the peripheral mask portion arranged in the concave peripheral masked region and the general region of the substrate. A deep parting line is formed in the thickness direction of the mask portion. If such a deep parting line is formed, the film falls into the parting line when the film is adhered to the peripheral mask portion of the mask jig and the general area of the substrate. Therefore, the operator can easily identify the position of the parting off, and by extension, the step of cutting the film adhered to the upper surface of the substrate and the mask jig at the outer edge of the mask jig becomes easy.

In order to easily distinguish the parting between the outer peripheral end of the peripheral mask portion and the general region of the substrate, it is preferable that the parting is large. The parting between the outer peripheral end of the peripheral mask portion and the general region of the substrate, that is, the gap between the two is preferably in the range of 0.5 mm or more and 3.0 mm or less, and 1.0 mm or more and 3.0 mm or less. It is particularly preferable that it is within the range of.

Hereinafter, the manufacturing method, the mask jig, and the parts with a film of the present invention will be described with reference to specific examples.

(Example 1)
The film-attached part of the first embodiment is an instrument panel for a vehicle. A table member as a mating material is attached to the film-attached part of the first embodiment.
FIG. 1 shows an explanatory diagram schematically showing a state in which the table member is attached to the film-attached part of the first embodiment. An explanatory diagram schematically showing the film-attached component of the first embodiment is shown in FIG. FIG. 3 shows an explanatory diagram schematically showing the substrate and the mask jig in the method for manufacturing the film-attached part of the first embodiment, and FIG. 4 shows an explanatory diagram schematically showing the mask jig used in the manufacturing method of the first embodiment. Shown in. Explanatory drawings schematically showing the manufacturing method of the film-attached parts of the first embodiment are shown in FIGS. 5 to 8. Note that FIG. 3 schematically shows the substrate before the bonding process on which the mask jig is attached, FIGS. 5 to 7 schematically represent the bonding process, and FIG. 8 schematically represents the cutting process.
Hereinafter, in the first embodiment, the upper, lower, left, right, back, and front mean the upper, lower, left, right, back, and front shown in FIG.

As shown in FIG. 2, the film-attached component 1 of the first embodiment has a substrate 2 and a film 3, and also has a plurality of holes 29.
Specifically, the substrate 2 is made of a thermoplastic resin, and as shown in FIG. 2, the substrate 2 is provided with three holes 29 having a through-hole shape. The surface 2f of the substrate 2 is composed of a peripheral masked region 21 in which the peripheral peripheral portion 29p of the hole 29 is grouped together, and a general region 22 located outside the peripheral masked region 21. The peripheral masked region 21 and the general region 22 are continuously flatly continuous without a step, and the thickness of the substrate 2 in the peripheral masked region 21 and the thickness of the substrate 2 in the general region 22 are substantially the same. In other words, in the film-attached component 1 of the first embodiment, the surface 2f of the substrate 2 has a substantially flat shape. The hole 29 of the substrate 2 and the peripheral masked region 21 are exposed in the portion of the film-attached component 1 of the first embodiment that has the peripheral masked region 21, that is, the masked portion 11. On the other hand, the film 3 is exposed on the portion of the film-attached component 1 of Example 1 having the general region 22, that is, the general portion 12.

A film 3 is adhered to the surface 2f of the substrate 2 while avoiding the peripheral masked region 21. In the film-attached component 1 of the first embodiment, the film 3 is made of an acrylic resin, and the adhesive used for adhering the film 3 and the substrate 2 is an acrylic resin-based adhesive.

The hole 29 of the substrate 2 is exposed on the surface 1f of the film-attached component 1 of the first embodiment. The hole 29 functions as a mounting hole for mounting a clip (not shown) of the mating material 90.
By attaching the mating material 90 to the surface 2f side of the base 2 via the clip shown in the drawing, the parting portion between the film 3 and the base 2 is hidden by the mating material 90 as shown in FIG. ..

Hereinafter, a method for manufacturing the film-attached component 1 of the first embodiment will be described.

The method for manufacturing the film-attached part 1 of the first embodiment uses a mask jig 4, and includes a bonding step and a mask removing step.

In the mask jig 4 used in the method for manufacturing the film-attached component 1 of the first embodiment, as shown in FIG. 3, the hole 29 and the peripheral masked region 21 of the substrate 2 are grouped together from the surface 2f side of the substrate 2. It covers. In FIG. 3, the front side of the paper surface is the front surface side of the substrate 2, and the back side of the paper surface is the back surface side of the substrate 2.

More specifically, as shown in FIG. 4, the mask jig 4 has three protrusion-shaped in-hole mask portions 40 and a substantially plate-shaped peripheral mask portion 41. Each in-hole mask portion 40 is provided at a position corresponding to each of the hole portions 29 in the substrate 2, and projects from the back surface of the peripheral mask portion 41 toward the back side. Each in-hole mask portion 40 is inserted into the corresponding hole portion 29.

The thickness of the peripheral mask portion 41 gradually decreases toward the outer peripheral end portion 41o in the outer peripheral portion 43. More specifically, the peripheral mask portion 41 has a central portion 42 and an outer peripheral portion 43 located outside the central portion 42, of which the central portion 42 has a flat plate shape having a substantially constant thickness. It can be said that the outer peripheral portion 43 has a tapered plate shape in which the thickness gradually decreases toward the outer peripheral end portion 41o, which is the end portion thereof.

As shown in FIG. 8, in the method of manufacturing the film-attached part 1 of the first embodiment, the thickness t1 of the outer peripheral end portion 41o of the peripheral mask portion 41 of the mask jig 4 is 0.5 mm, and the peripheral mask portion 41 has a thickness t1 of 0.5 mm. The maximum thickness, that is, the thickness t2 in the central portion 42 of the peripheral mask portion 41 is 1.5 mm, and the length of the outer peripheral portion 43 in the peripheral mask portion 41, that is, the length t3 of the inclined portion in the peripheral mask portion 41. Is 1.0 cm, and the inclination angle θ of the surface 43f of the outer peripheral portion 43 is 5.7 °.

In the bonding step in the method for manufacturing the film-attached component 1 of the first embodiment, first, the mask jig 4 is attached to the surface 2f of the substrate 2 from the front side. Then, the in-hole mask portion 40 of the mask jig 4 is inserted into the hole portion 29 of the substrate 2. The peripheral mask portion 41 of the mask jig 4 is exposed on the surface 2f of the substrate 2 and collectively covers the hole portion 29 of the substrate 2 and the peripheral masked region 21.

In the bonding step in the method for manufacturing the film-attached component 1 of the first embodiment, the film 3 is bonded together with the mask jig 4 to the surface 2f of the substrate 2 on which the mask jig 4 is mounted.

More specifically, as shown in FIG. 5, the substrate 2 equipped with the mask jig 4 is attached to the molding apparatus 8 for TOM molding. The molding device 8 includes a hollow chamber 80 in which two box-shaped chamber bodies 81 and 82 are combined, a pedestal 83 arranged inside the chamber 80, an elevating device 84 for raising and lowering the pedestal 83, and a pressurizing pump. It has P1 and a decompression pump P2 and a heater (not shown). One of the chamber divisions is referred to as a first division 81 and the other is referred to as a second division 82.

The first division 81 is arranged above the second division 82, and the inside of the box 81i faces downward. The second body 82 faces the inside of the box 82i upward. Therefore, in the chamber 80 in which the first body 81 and the second body 82 are combined, a hollow portion 8i composed of the box inside 81i of the first body 81 and the box inside 82i of the second body 82 is formed. Will be done. The elevating device 84 is attached to the second body 82, and elevates and elevates the pedestal 83 arranged inside the chamber 80, that is, in the hollow portion 8i. A molding jig 86 for mounting the substrate 2 is mounted on the pedestal 83.

As shown in FIG. 5, the film 3 is arranged between the first division 81 and the second division 82. An adhesive layer 5 is formed in advance on the lower surface of the film 3, that is, the back surface 3b. The adhesive layer 5 is formed by applying the above-mentioned adhesive.

By arranging an integral product of the film 3 and the adhesive layer 5 between the first division 81 and the second division 82, the hollow portion 8i is divided into two upper and lower portions. Of the two hollow portions 8i, the one located on the upper side is referred to as a first hollow portion 8f, and the one located on the lower side is referred to as a second hollow portion 8s.

The substrate 2 and the mask jig 4 mounted on the substrate 2 are placed on the molding jig 86 on the pedestal 83 with their surfaces 2f and 4f facing upward, and in the initial stage of the bonding process, the film 3 and the mask jig 4 are placed. It is arranged below the integrated product with the adhesive layer 5. In this state, the first hollow portion 8f and the second hollow portion 8s are heated by the heater (not shown), and the pressure reducing pump P2 is driven to bring the first hollow portion 8f and the second hollow portion 8s into a substantially equivalent depressurized state. To do. By heating the first hollow portion 8f and the second hollow portion 8s, the film 3 and the adhesive layer 5 are softened.

Next, in the middle stage of the bonding process shown in FIG. 6, the pedestal 83 is raised by the elevating device 84. The substrate 2 and the mask jig 4 mounted on the molding jig 86 rise together with the pedestal 83 and the molding jig 86, and are pressed against the integral product of the film 3 and the adhesive layer 5 from the lower side, that is, the back surface side. Be done. As a result, the substrate 2 and the mask jig 4 are pressed against the adhesive layer 5 formed on the back surface 3b of the film 3.

Next, in the latter stage of the bonding step shown in FIG. 7, the first hollow portion 8f is put into a pressurized state by the pressurizing pump P1 and the second hollow portion 8s is put into a depressurized state by the depressurizing pump P2. Then, the integral product of the film 3 and the adhesive layer 5 is brought into close contact with the substrate 2, and the film 3 is formed into a shape along the surface 2f of the substrate 2 and the surface 4f of the mask jig 4 mounted on the substrate 2. Be shaped. Therefore, the film 3 is adhered to the substrate 2 and the mask jig 4, and the adhesive layer 5 is arranged between the film 3 and the substrate 2 and between the film 3 and the mask jig 4.

After that, the chamber 80 is opened, and the integrated product of the film 3, the substrate 2, and the mask jig 4 is taken out. The integrated product is subjected to a mask removing step.

In the mask removing step, as shown in FIG. 8, the film 3 is cut at the outer edge 41e of the peripheral edge mask portion 41 of the mask jig 4, that is, at the edge of the outer peripheral end portion 41o of the peripheral edge mask portion 41. The peripheral mask portion 41 has a continuous shape that can collectively cover the peripheral portion 29p of the hole 29 in the substrate 2. Therefore, in the mask removing step, it is only necessary to cut the outer edge 41e of the peripheral edge mask portion 41 in a single stroke shape with the cutter 85, and it is not necessary to perform a plurality of cuttings corresponding to the plurality of holes 29.

By such a mask removing step, the mask jig 4 and the film 3 adhered to the mask jig 4 are removed, and the film 3 is formed in a region on the surface 2f of the substrate 2 avoiding the holes 29 and the peripheral masked region 21. The film-attached part 1 of Example 1 to which the above is adhered is obtained.

According to the manufacturing method of the film-attached part 1 of the first embodiment and the mask jig 4 of the first embodiment used in the manufacturing method, three holes are formed by only one operation of cutting the film 3 at the outer edge 41e of the mask jig 4. The film-attached part 1 of Example 1 having 29 can be easily manufactured.

Further, the mask jig 4 of the first embodiment has the in-hole mask portion 40 to be inserted into the hole portion 29 of the substrate 2, so that the positioning with respect to the substrate 2 can be easily and precisely performed. Also by this, according to the mask jig 4 of the first embodiment, the film-attached part 1 of the first embodiment can be easily manufactured.

(Example 2)
The method for manufacturing the film-attached part of Example 2 is substantially the same as the manufacturing method for the film-attached part of Example 1 except for the shape of the peripheral masked region on the substrate and the shape of the peripheral mask portion on the mask jig. The film-attached part of Example 2 is substantially the same as the film-attached part of Example 1 except for the shape of the peripheral masked region on the substrate, and the mask jig of Example 2 is the same except for the shape of the peripheral mask portion. It is substantially the same as the mask jig of 1. Hereinafter, the method for manufacturing the film-attached parts of the second embodiment, the film-attached parts of the second embodiment, and the mask jig of the second embodiment will be described with a focus on the differences from the first embodiment.
FIG. 9 shows an explanatory diagram schematically showing the manufacturing method of the film-attached part of the second embodiment.

The mask jig 4 of the second embodiment has the in-hole mask portion 40 and the peripheral mask portion 41 like the mask jig 4 of the first embodiment, but as shown in FIG. 9, the thickness of the peripheral mask portion 41 is thick. It differs from the mask jig 4 of the first embodiment in that it is substantially constant from the central portion 42 toward the outer peripheral end portion 41o.

The thickness of the outer peripheral end portion 41o of the peripheral edge mask portion 41 in the mask jig 4 of the second embodiment is about 0.5 mm, the thickness of the peripheral edge mask portion 41 in the central portion 42 is 0.5 mm, and the outer peripheral portion 43. The inclination angle of the surface 43f of the surface is 0 °.

The film-attached component 1 of the second embodiment includes a general portion 12 having a general region 22 on the substrate 2 and a masked portion 11 having a peripheral masked region 21 on the substrate 2, similarly to the film-attached component 1 of the first embodiment. However, it differs from the film-attached component 1 of the first embodiment in that the peripheral masked region 21 is a concave peripheral masked region 21c having a concave shape.

Specifically, the peripheral masked region 21 on the surface 2f of the substrate 2 is one step lower than the general region 22, and the peripheral masked region 21 and the general region 22 are continuous in a stepped manner. In other words, the edge of the general region 22 on the peripheral masked region 21 side is angular. In other words, the thickness of the substrate 2 is thinner in the masked portion 11 than in the general portion 12, and the difference in thickness is about 0.5 mm.

Further, in the method of manufacturing the film-attached component 1 of the second embodiment, when the mask jig 4 is mounted on the substrate 2, there is a gap between the outer peripheral end portion 41o of the peripheral mask portion 41 and the general region 22 of the substrate 2. There is g. The width of the gap g is about 0.5 mm to 3.0 mm.

In the method for manufacturing the film-attached component 1 of the second embodiment, the mask jig 4 collectively covers the peripheral edge portion 29p of the hole portion 29 in the substrate 2. As a result, even in the method for manufacturing the film-attached part 1 of the second embodiment, although the film-attached part 1 having a plurality of holes 29 is manufactured, the outer edge 41e of the peripheral mask portion 41 is provided in the mask removing step. It suffices to cut in a single stroke, and it is not necessary to cut a plurality of times corresponding to the plurality of holes 29. Therefore, even by the method for manufacturing the film-attached component 1 of the second embodiment, the film-attached component 1 having a plurality of holes 29 and the film 3 being adhered to the region avoiding the holes 29 can be easily manufactured.

In the method for manufacturing the film-attached component 1 of the second embodiment, instead of thinning the outer peripheral end portion 41o of the peripheral edge mask portion 41 in the mask jig 4, the peripheral masked region 21 is made thicker than the peripheral edge mask portion 41 in the mask jig 4. It was recessed by a small amount to form a concave peripheral masked region 21c. As a result, even when the mask jig 4 is thick or the film 3 which is hard to be deformed is used, it is possible to suppress the deformation defect of the film 3 and the film has excellent designability. The part 1 can be easily manufactured.

Further, in the method for manufacturing the film-attached component 1 of the second embodiment, a gap g is provided between the outer peripheral end portion 41o of the peripheral mask portion 41 and the general region 22 of the substrate 2, so that the film 3 after the bonding step is formed. , It sinks along the gap g. Since the depressed portion 39 of the film 3 is formed linearly along the outer edge 41e of the peripheral mask portion 41 to cut the film 3, there is an advantage that the film 3 can be easily cut in the mask removing step.

The present invention is not limited to the embodiment described above and shown in the drawings, and can be appropriately modified and implemented without departing from the gist. In addition, each component shown in the present specification including the embodiment can be arbitrarily extracted and combined.

1: Parts with film 2: Base 2f: Surface of base 21c: Concave peripheral masked area 22: General area 29: Hole 29p: Peripheral part of hole 3: Film 4: Mask jig 40: Mask part in hole 41 : Peripheral mask portion 41e: Outer edge 41o of mask jig: Outer peripheral end portion of peripheral mask portion 43: Outer peripheral portion 43f of peripheral mask portion: Surface of outer peripheral portion 5: Adhesive layer

Claims (6)

A method for manufacturing a film-attached part having a substrate having a plurality of holes and a film adhered to a region of the surface of the substrate avoiding the holes.
Using a mask jig that collectively covers each of the holes and the peripheral edge thereof from the surface side of the substrate.
An adhesive step of arranging the film on the surface of the substrate on which the mask jig is attached via an adhesive layer, and adhering the film to the substrate while adhering the film to the substrate.
A method for manufacturing a part with a film, comprising a mask removing step of cutting the film at the outer edge of the mask jig and removing the mask jig and the cut film. The mask jig
A plurality of in-hole mask portions each having a convex shape and corresponding to the plurality of holes,
It has a peripheral mask portion that collectively covers the peripheral edge portion of each of the pore portions on the surface of the substrate.
The method for manufacturing a film-attached part according to claim 1, wherein in the bonding step, the mask jig is attached to the substrate by inserting each of the in-hole mask portions into the respective holes. The method for manufacturing a film-attached part according to claim 2, wherein the thickness of the outer peripheral end portion of the peripheral edge mask portion is 0.5 mm or less. The surface of the outer peripheral portion of the peripheral mask portion is inclined so that the thickness of the peripheral mask portion gradually decreases toward the outer peripheral end portion.
The maximum thickness of the peripheral mask portion is 1.0 mm or more.
The method for manufacturing a film-attached part according to claim 3, wherein the inclination angle of the surface of the outer peripheral portion is 10 ° or less. A mask jig for manufacturing a film-attached part having a substrate having a plurality of holes and a film adhered to a region of the surface of the substrate avoiding the holes.
A plurality of in-hole mask portions each having a convex shape and corresponding to the plurality of holes,
A mask jig for parts with a film, comprising a peripheral mask portion that collectively covers the peripheral edges of the holes on the surface of the substrate. It has a substrate with multiple holes and
On the surface of the substrate, the peripheral edge of each of the holes forms a concave peripheral edge masked region forming a group of concave shapes.
The general region located outside the concave peripheral masked region and the concave peripheral masked region are continuous in a stepped manner.
A film-attached component in which a film is adhered to a region on the surface of the substrate that avoids the pore portion and the concave peripheral edge masked region.

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