JP2021047275A - Connection structure and image formation apparatus - Google Patents

Abstract

To provide a connection structure and an image formation apparatus which can suppress the influence of the noise in comparison to a case where a wire extending from a substrate is routed.SOLUTION: A connection structure comprises: a substrate which is attached to an apparatus body; a terminal which has the plate shape extending in the intersection direction intersecting the substrate, is arranged such that one surface faces the side in the attachment direction to the apparatus body, and delivers the electricity to the substrate; and a holding part which is provided in the apparatus body and holds a spring electrically connected to the one surface of the terminal from the opposite side to the attachment direction to the substrate.SELECTED DRAWING: Figure 4

Description

The present invention relates to a substrate connection structure and an image forming apparatus.

The image forming apparatus of Patent Document 1 includes a main body frame having a pair of side frame portions via a partition frame portion at the lower part of a paper passage capable of passing through the image forming portion in the process unit. On the outer surface of the left side frame portion of the main body frame, a drive transmission system frame provided with a process unit and a drive mechanism for passing paper is vertically arranged. A high-voltage power supply board, a low-voltage power supply board, and an engine control board for a drive mechanism are horizontally arranged and fixed on the lower surface side of the partition frame portion.

On the other hand, the main control board is adjacent to the drive transmission system frame and is arranged substantially vertically along the outer surface of the left side frame portion, and the board and the components are connected by a connecting line.

In the image forming apparatus of Patent Document 2, high-voltage power supply circuit boards are mounted on the front and back surfaces of a support plate having electrical insulation so that the solder surfaces of the respective boards face each other via the support plate. There is. Further, the support plate is configured to be arranged at the most rearmost portion of the entire device or to be rotatably attached to a predetermined support frame.

Japanese Unexamined Patent Publication No. 2004-1574663 JP-A-2002-189320

An object of the present invention is to provide a connection structure and an image forming apparatus capable of suppressing the influence of noise as compared with the case where a harness extending from a substrate is routed.

Aspect 1 is between a substrate to be attached to the main body of an apparatus and a plate having a plate shape extending in an intersecting direction with respect to the substrate and having one surface facing the side in the attachment direction to the main body of the apparatus. A connection structure including a terminal for transferring electricity and a holding portion for holding a spring provided on the main body of the apparatus and electrically connected to the one surface of the terminal from the side opposite to the mounting direction of the substrate. ..

Aspect 2 has a plurality of the terminals that transfer high voltage to and from the substrate, and the holding portion includes a plurality of the springs connected to the terminals and a plurality of wirings extending from the springs. The connection structure according to aspect 1, which has a positioning portion for positioning adjacent wirings so as to be separated from each other by a certain distance or more.

In the third aspect, the substrate includes a first substrate and a second substrate which are arranged so that the surfaces face each other and output a high voltage, and the terminal transfers a high voltage to and from the first substrate. The connection according to aspect 2, wherein the connection includes one terminal and a second terminal that transfers high voltage between the second substrate, and the second terminal is arranged on the side of the surface away from the first substrate. Construction.

Aspect 4 is the connection structure according to the third aspect, wherein the first substrate and the second substrate are arranged such that the solder surfaces to which the lead wires of the mounted electronic components are soldered face each other.

In the fifth aspect, the holding portion has a first holding portion having a first spring electrically connected to the first terminal and a second spring electrically connected to the second terminal. (Ii) The connection structure according to aspect 3 or aspect 4, wherein the first terminal of the first substrate and the second terminal of the second substrate are arranged so as to be offset in the mounting direction, including a holding portion.

In aspect 6, the substrate has a connection portion in which the terminals are electrically connected to at least one of a component surface on which an electronic component is arranged and a solder surface on which a lead wire of the electronic component is soldered. The connection structure according to aspect 1, further comprising a fixing portion for fixing the terminal to the substrate and maintaining a state in which one end of the terminal is electrically in contact with the connection portion.

In the seventh aspect, the substrate includes a first substrate and a second substrate in which the solder surfaces are arranged so as to face each other and output a high voltage, and the terminals are connected to each other provided on the solder surface of the first substrate. The connection structure according to aspect 6, wherein the first terminal electrically connected to the portion and the second terminal electrically connected to the connection portion provided on the component surface of the second substrate are included.

Aspect 8 is an image forming apparatus having the connection structure according to any one of Aspects 3 to 5 and Aspect 7, and is supplied from the first substrate or one of the second substrates. The photoconductor on which a toner image is formed using high pressure and the toner supplied to the photoconductor are charged using the high pressure supplied from the first substrate or the other substrate of the second substrate. An image forming apparatus equipped with a developing roll.

In the first aspect, it is possible to suppress the influence of noise as compared with the case where the wiring extending from the substrate is routed.

In the second aspect, it is possible to suppress the influence of noise that may occur when the wirings are close to each other, as compared with the case where the wirings extending from the substrate are arranged.

In the third aspect, as compared with the case where the first terminal is arranged on the second board side and the second terminal is arranged on the first board side, noise or the like given to the other terminal by the high voltage passed by one terminal is generated. It is possible to suppress the influence.

In the fourth aspect, it is possible to reduce the minimum separation between the first substrate and the second substrate as compared with the case where the component surfaces of the first substrate and the second substrate are arranged so as to face each other.

In the fifth aspect, the first terminal and the second terminal of the second substrate are arranged at the same position in the mounting direction as compared with the case where the first terminal of the first substrate and the second terminal of the second substrate are arranged so that the surfaces face each other. It is possible to separate the two terminals greatly by the facing method.

In the sixth aspect, the width of the terminal can be widened as compared with the case where the terminal extends from the substrate.

In the seventh aspect, as compared with the case where the first terminal is arranged on the second board side and the second terminal is arranged on the first board side, the influence of the high voltage passed by one terminal on the other terminal is suppressed. It becomes possible to do.

In the eighth aspect, it is possible to suppress the influence of noise as compared with the case where the wiring extending from the substrate is routed.

It is the schematic which shows the whole structure of the image forming apparatus which concerns on this embodiment. It is sectional drawing which shows the developing apparatus of the image forming apparatus which concerns on this embodiment. It is a perspective view which shows the high voltage generator of the image forming apparatus which concerns on this embodiment. It is sectional drawing which shows the main part of the image forming apparatus which concerns on this embodiment. It is an enlarged view which shows the end part of the high voltage generator of the image forming apparatus which concerns on this embodiment. It is a perspective view which shows the state which the end part of the high voltage generator of the image forming apparatus which concerns on this embodiment is seen from diagonally below. It is a perspective view of the main part which shows the state which the holding part is connected to the high voltage generator of the image forming apparatus which concerns on this embodiment. It is a partially transparent view which shows the state which the holding part is connected to the high voltage generator of the image forming apparatus which concerns on this embodiment. It is a schematic diagram which shows the wiring position of the holding part connected to the high voltage generator of the image forming apparatus which concerns on this embodiment.

Hereinafter, this embodiment will be described with reference to the drawings. FIG. 1 is a schematic view showing an image forming apparatus 10 according to the present embodiment.

The image forming apparatus 10 includes an image forming means 12 for forming an image on a sheet. The image forming means 12 includes an image forming unit 14 that forms a toner image on the supplied sheet, and a fixing unit (not shown) that fixes the toner image formed on the sheet.

The image forming unit 14 includes a roll-shaped photoconductor 16 (Y) that forms a yellow (Y) toner image and a roll-shaped photoconductor 16 (M) that forms a magenta (M) toner image. There is. Further, the image forming unit 14 comprises a roll-shaped photoconductor 16 (C) forming a cyan (C) toner image and a roll-shaped photoconductor 16 (K) forming a black (K) toner image. The toner images formed on the photoconductors 16 are superimposed on a transfer belt (not shown) and transferred to the sheet.

Explaining the formation of the toner image on the photoconductor 16, the surface of the photoconductor 16 is charged by the charging device 18, the surface of the charged photoconductor 16 is exposed by the exposure device 20, and an electrostatic latent image is formed on the photoconductor 16. Form. An example of the charging device 18 is a bias charge roll (BCR) formed in a cylindrical shape.

Then, the electrostatic latent image formed on the photoconductor 16 is developed by the developing device 22 to form a toner image (only the developing device 22 that forms the toner image on the photoconductor 16 (K) for black (K) is shown. ). Toner of the corresponding color is supplied to the developing device 22 from a toner cartridge (not shown).

As shown in FIG. 2, the developing apparatus 22 includes a casing 28 containing a developing agent G composed of a carrier 24 and a toner 26. The casing 28 includes a stirring unit 30 that stirs the developer G, a developing roll 32 that transfers the toner 26 to the photoconductor 16 to form a toner image, and a trimmer 34 that regulates the layer thickness of the toner 26 on the developing roll 32. And are provided.

The developing roll 32 is composed of a magnet roll in which a plurality of magnetic poles are arranged. A high voltage is applied to the developing roll 32, and a development bias is applied to develop and visualize the electrostatic latent image formed on the photoconductor 16 with the toner 26 of the developing agent G.

As shown in FIG. 1, a high-voltage generator 40 is provided above the image forming means 12 in the housing of the apparatus main body 36 in the image forming apparatus 10.

(High voltage generator)
As shown in FIGS. 3 and 4, the high-voltage generator 40 includes a metal box body 44 fixed to a frame 42 (see FIG. 4) constituting the housing of the device main body 36. The box body 44 includes a rectangular container-shaped lower accommodating portion 46 and a rectangular container-shaped upper accommodating portion 48 arranged on the lower accommodating portion 46.

[Lower housing]
As shown in FIG. 3, the lower accommodating portion 46 includes a rectangular lower bottom surface 46A, a lower left side surface 46B and a lower right side surface 46C extending upward from both sides of the lower bottom surface 46A in the length direction, and a lower bottom surface. It is provided with a lower rear surface 46D extending upward from the trailing edge of 46A. Further, the front surface on the inner back side of FIG. 3 facing the lower rear surface 46D is open. Both side portions of the lower rear surface 46D are fixed to the trailing edge of the lower left surface 46B and the trailing edge of the lower right surface 46C with screws N or the like, and the central portion in the width direction of the trailing edge portion of the lower bottom surface 46A and the lower rear surface 46D. A lower notch 46E is formed in the central portion in the width direction.

A rear fixing piece 52 having a rear portion 50 extending outward is formed on the upper edge of the lower rear surface 46D of the lower accommodating portion 46, and the rear fixing piece 52 is formed on both sides of the lower notch 46E. There is. Further, a side fixing piece 56 having a horizontal step portion 54 extending outward is formed on the upper edge of the lower left side surface 46B and the lower right side surface 46C, and each side fixing piece 56 has a corresponding side surface. It is formed on the front end side of 46B and 46C (only the lower right side surface 46C side is shown).

[Upper housing]
The upper accommodating portion 48 has a rectangular upper bottom surface 48A, an upper left side surface 48B and an upper right side surface 48C extending upward from both side portions in the length direction of the upper bottom surface 48A, and an upper bottom surface 48A upward from the trailing edge portion. It has an extended upper rear surface 48D. Further, the front surface on the inner back side of FIG. 3 facing the upper rear surface 48D is open.

Both sides of the upper rear surface 48D are fixed to the trailing edge of the upper left surface 48B and the trailing edge of the upper right surface 48C, and the upper opening of the upper accommodating portion 48 is closed by the rectangular top surface 58. ..

A rear flange 58A extends downward from the rear edge of the top surface 58, and the rear flange 58A is fixed to the upper rear surface by a screw or the like (not shown). A front flange 58B extends upward from the front edge of the top surface 58, and the front flange 58B is configured to be physically and electrically fixed to the frame 42 of the apparatus main body 36 by screws N. There is. An upper notch 60 is formed in the central portion in the width direction of the upper rear surface 48D and the central portion in the width direction of the trailing edge portion of the top surface 58.

The peripheral portion of the upper bottom surface 48A of the upper accommodating portion 48 is supported by the rear portion 50 of the rear fixing piece 52 of the lower accommodating portion 46 and the horizontal portion 54 of the side fixing piece 56. The upper accommodating portion 48 is fixed to the lower accommodating portion 46 by a screw N or the like through which the rear fixing piece 52 and the side fixing piece 56 are inserted.

As a result, in the box body 44, the upper accommodating space 48K is formed inside the upper accommodating portion 48, and the lower accommodating space 46K is formed inside the lower accommodating portion 46. The accommodating spaces 46K and 48K are formed of metal accommodating portions 46 and 48, a metal top surface 58 that closes the upper opening of the upper accommodating portion 48, and an upper accommodating portion 48 that separates both accommodating spaces 46K and 48K. It is electromagnetically shielded by the upper bottom surface 48A, and the emission of electromagnetic wave noise (radio wave noise) to the outside and the intrusion of electromagnetic wave noise (radio wave noise) from the outside are suppressed.

Then, as shown in FIG. 4, the high-voltage generator 40 is attached to the apparatus main body 36 so that the front surface opened in the upper accommodating portion 48 and the lower accommodating portion 46 is inserted into the inner side of the apparatus main body 36 and attached. TH is defined.

(substrate)
A substrate 62 that generates high voltage is housed in the box body 44 of the high voltage generator 40. The substrate 62 includes a first substrate 64 in which a high voltage circuit for supplying a high voltage to each developing roll 32 is formed, and a second substrate 66 in which a high voltage circuit for supplying a high voltage to the charging device 18 is formed.

Here, the "high voltage" is a voltage of more than 600 V and 7 KV or less in the case of AC, and a voltage of more than 750 V and 7 KV or less in the case of DC.
In the present embodiment, the voltage (development bias) output from the first substrate 64 to the developing roll 32 is, for example, AC (alternating current) having a frequency of 8 KHz and a PP value (peak-peak value). It is assumed that a direct current (DC) voltage of -500 V is superimposed on an AC voltage of 1 KV.
The voltage (charging bias) output from the second substrate 66 to the charging device 18 is, for example, an AC with a frequency of 2 KHz and an AC (alternating current) with a P-P value (peak-peak value) of 2 KV. It is assumed that a direct current (DC) voltage of -600V is superimposed on the voltage.

The charging device 18 to which a high voltage is supplied from the second substrate 66 charges the surface of the photoconductor 16. Then, the surface of the charged photoconductor 16 is exposed by the exposure apparatus 20 to form an electrostatic latent image, and the electrostatic latent image is developed by the developing apparatus 22 to form a toner image. As a result, a toner image is formed on the photoconductor 16 by utilizing the high pressure supplied from the second substrate 66.

Further, each developing roll 32 to which a high voltage is supplied from the first substrate 64 charges the toner 26 of the developing apparatus 22 and applies a developing bias. As a result, the development of the electrostatic latent image formed on the photoconductor 16 is promoted and the toner image is visualized.

In the present embodiment, high pressure is supplied from the first substrate 64 to each developing roll 32, and the high pressure from the second substrate 66 is used to form a toner image on the photoconductor 16, but the present invention is limited to this. is not it. For example, a high voltage may be supplied from the second substrate 66 to each developing roll 32, and a toner image may be formed on the photoconductor 16 by utilizing the high voltage from the first substrate 64.

The first substrate 64 is fixed to the upper accommodating portion 48 in a state of being accommodated in the upper accommodating space 48K of the box body 44, and the second substrate 66 is accommodated in the lower accommodating space 46K of the box body 44. It is fixed to the lower accommodating portion 46. As a result, both the substrates 64 and 66 are attached to the apparatus main body 36 via the box body 44.

In the present embodiment, the first substrate 64 and the second substrate 66 are arranged vertically, but the present invention is not limited to this. For example, the first substrate 64 and the second substrate 66 may be arranged on the left and right.

As shown in FIG. 4, in the first substrate 64, the upper surface of the first substrate 64 located on the upper side in the arranged state constitutes the first component surface 64A on which the electronic component 68 is arranged. Further, the lower surface of the first substrate 64 located on the lower side in the arranged state constitutes the first solder surface 64B to which the lead wire 68A of the electronic component 68 is soldered.

In the second substrate 66, the upper surface of the second substrate 66 located on the upper side in the arranged state constitutes the second solder surface 66B to which the lead wire 68A of the electronic component 68 is soldered, and is located on the lower side in the arranged state. The lower surface of the second substrate 66 constitutes the second component surface 66A on which the electronic component 68 is arranged.

As a result, the first substrate 64 and the second substrate 66 are arranged so that the two solder surfaces 64B and 66B to which the lead wires 68A of the mounted electronic component 68 are soldered face each other. Further, the space between the boards 64 and 66 is electromagnetically shielded by the upper bottom surface 48A of the upper accommodating portion 48 arranged between the boards 64 and 66.

The substrate 62 has a plate shape extending in an intersecting direction with respect to the surface of the substrate 62, and one surface 38 is arranged so as to face the side of the mounting direction TH to the apparatus main body 36 and with the substrate 62. A terminal is provided to transfer electricity between them.

That is, the first substrate 64 is provided with a first terminal 70 that transfers high voltage to and from the high voltage circuit formed on the first substrate 64. A number of first terminals 70 are provided corresponding to the number of developing rolls 32 that supply high voltage.

Further, the second substrate 66 is provided with a second terminal 72 that transfers high voltage to and from the high voltage circuit formed on the second substrate 66. The number of second terminals 72 corresponds to the number of charging devices 18 for supplying high voltage.

The first terminal 70 of the first substrate 64 and the second terminal 72 of the second substrate 66 are arranged so as to be offset in the mounting direction TH by a certain distance T. Specifically, the first terminal 70 of the first substrate 64 is arranged on the TH side in the mounting direction from the second terminal 72 of the second substrate 66.

Further, the second terminal 72 of the second substrate 66 is arranged on the second component surface 66A which is the side of the surface away from the first substrate 64.

In the present embodiment, the second terminal 72 of the second substrate 66 is arranged on the side of the surface away from the first substrate 64, but the present invention is not limited to this. For example, the first terminal 70 may be provided on the first component surface 64A side of the first substrate 64, and the second terminal 72 may be provided on the second component surface 66A side of the second substrate 66. In this case, both terminals 70, The 72 can be placed farther apart.

Explaining the conduction structure of the terminals 70 and 72 to the substrates 64 and 66, as shown in FIGS. 5 and 6, the first solder surface 64B of the first substrate 64 is electrically connected to the first terminal 70. The first connecting portion 74 to be connected is provided at the end portion of the first substrate 64 on the TH side in the mounting direction. The first connecting portion 74 is provided for each high-voltage circuit that supplies high voltage to each developing roll 32, and the first connecting portion 74 is composed of a land formed on the first solder surface 64B as an example.

As shown in FIG. 5, the first solder surface 64B of the first substrate 64 is provided with a first fixing portion 76 for fixing each first terminal 70 to the first substrate 64. The first fixing portion 76 is made of an insulator, and is made of a synthetic resin as an example.

The first fixing portion 76 includes a first fixing piece 76A fixed to the first substrate 64 with screws N, and a first supporting surface 76B supported by the first fixing piece 76A and extending along the first solder surface 64B. ing. Further, the first fixing portion 76 includes a first wall surface 76C that extends from the first support surface 76B to the first solder surface 64B side and supports the first terminal 70 from the opposite side of the mounting direction TH. The first wall surface 76C is formed with a first ridge 76D that suppresses lateral displacement of the first terminal 70 from both sides.

(First terminal)
The first terminal 70 is made of a metal plate, and as shown in FIG. 6, the first base 70A arranged along the first support surface 76B and the edge of the first base 70A on the TH side in the mounting direction. It is provided with a first contact portion 70B extending toward the first solder surface 64B side. Further, the first terminal 70 includes a first energizing portion 70C which is one end portion curved in the mounting direction TH from the tip of the first contact portion 70B.

The first terminal 70 is first fixed by screwing a screw (not shown) penetrating the first base 70A into the bag nut portion 76F provided on the first support surface 76B of the first fixing portion 76 (see FIG. 5). It is fixed to the part 76. The bag nut portion 76F extends downward from the round hole 78 formed in the upper bottom surface 48A of the upper accommodating portion 48.

The width of the first contact portion 70B at the tip portion on the first solder surface 64B side becomes narrower toward the first energization portion 70C. The first energizing portion 70C is pressed against the first connecting portion 74 of the first substrate 64, and the first terminal 70 is maintained in a state of being electrically connected to the high voltage circuit via the first connecting portion 74. To.

The width dimension of the first energizing portion 70C is narrower than the width dimension of the first connecting portion 74, and contact with other circuit patterns is suppressed. As a result, the first terminal 70 has a wider contact area at the first contact portion 70B while suppressing contact with other circuit patterns.

As shown in FIG. 5, on the second component surface 66A of the second substrate 66, the second connection portion 80 electrically connected to the second terminal 72 is located on the TH side in the mounting direction of the second substrate 66. The second connection portion 80 is provided at the end portion, and is provided for each high voltage circuit that supplies a high voltage to the charging device 18. As an example, the second connecting portion 80 is composed of two jumper wires provided on the second component surface 66A, in other words, a copper wire provided along the second component surface 66A.

A second fixing portion 82 for fixing each of the second terminals 72 to the second board 66 is provided on the second component surface 66A of the second board 66. The second fixing portion 82 is made of an insulator, and is made of a synthetic resin as an example.

The second fixing portion 82 includes a second fixing piece 82A fixed to the second substrate 66 with screws N, and a second supporting surface 82B supported by the second fixing piece 82A and extending along the second component surface 66A. ing. Further, the second fixing portion 82 includes a second wall surface 82C that extends from the second support surface 82B toward the second component surface 66A and supports the second terminal 72 from the opposite side of the mounting direction TH. The second wall surface 82C is formed with a second ridge 82D that suppresses lateral displacement of the second terminal 72 from both sides.

(Second terminal)
The second terminal 72 is made of a metal plate and includes a second base 72A arranged along the second support surface 82B, as shown in FIG. Further, the second terminal 72 has a second contact portion 72B extending from the edge of the second base portion 72A on the mounting direction TH side toward the second component surface 66A, and one end curved in the mounting direction TH from the tip of the second contact portion 72B. It is provided with a second energizing unit 72C, which is a unit.

The second terminal 72 is fixed to the second fixing portion 82 by screwing a screw N penetrating the second base portion 72A into a bag nut portion (not shown) provided on the second supporting surface 82B of the second fixing portion 82. ing.

The width of the tip of the second contact portion 72B on the side of the second component surface 66A becomes narrower toward the second energizing portion 72C. The second energizing unit 72C is pressed against the second connecting unit 80, and the second terminal 72 is maintained in a state of being electrically connected to the high voltage circuit via the second connecting unit 80.

The width dimension of the second energizing portion 72C is narrower than that of the base portion of the second contact portion 72B, and interference with the mounted electronic component 68 is suppressed. As a result, the second terminal 72 has a wider contact area with the second contact portion 72B while suppressing interference with the electronic component 68.

The board 62 has terminals 70 and 72 corresponding to at least one of the component surfaces 64A and 66A on which the electronic component 68 is arranged or the solder surfaces 64B and 66B to which the lead wires 68A of the electronic component 68 are soldered. It has connecting portions 74 and 80 that are electrically connected.

As shown in FIG. 4, the frames 42 of the device main body 36 on the back side of the mounting direction TH to which the high-voltage generator 40 is mounted have terminals 70 and 72 from the opposite side to the mounting direction TH of the boards 64 and 66. A holding portion (first holding portion 88, second holding portion 92) holding a spring (first spring 86, second spring 90) electrically connected to one surface 38 is fixed.

As an example, the spring is composed of a coil spring in which a metal wire is spirally wound. This spring may be composed of a plate-shaped leaf spring having elasticity.

(Holding part)
As shown in FIGS. 4 and 7, the holding portion includes the first holding portion 88 having the first spring 86 electrically connected to the first terminal 70 of the first board 64, and the second board 66. It has a second holding portion 92 having a second spring 90 electrically connected to the second terminal 72.

(First holding part)
The first holding portion 88 includes a first housing 94 as shown in FIG. The first housing 94 is made of an insulator, and the first housing 94 is made of a synthetic resin as an example.

The first housing 94 includes a plate-shaped first main body 94A facing one side 38 of the first terminal 70, and a first flange 94B extending from the peripheral edge of the first main body 94A to the opposite side of the mounting direction TH.

The first main body 94A is provided with a columnar first protrusion 94C at a position corresponding to each first terminal 70, and each first protrusion 94C extends toward the corresponding first terminal 70. A first spring 86 is attached to each first protrusion 94C, and the direction in which each first spring 86 extends is restricted by the first protrusion 94C, and the tip portion of each first protrusion 94C extends from the first protrusion 94C. There is.

As a result, each of the first springs 86 is sandwiched between the terminals 70 and 72 and the holding portions 88 and 92 in a compressed state with the substrates 64 and 66 of the high voltage generator 40 attached to the device main body 36. .. Then, each first spring 86 is electrically connected to one side 38 of the first terminal 70 of the first substrate 64 from the side opposite to the mounting direction TH.

Each first spring 86 is made of a conductor, and each first spring 86 is made of a steel wire as an example. As shown in FIGS. 8 and 9, the first wiring 96 extends from the base end of each first spring 86.

Each first wiring 96 is made of a wire rod, and an example thereof is a steel wire. Further, the first wiring 96 can be paraphrased as a steel wire or a harness.

As shown in FIG. 9, each first wiring 96 is arranged along the first main body 94A, and the adjacent first wirings 96, 96 are separated from each other by a certain distance K1 or more at the closest location. Is positioned by the first positioning unit 98.

This constant distance K1 is determined based on the energized voltage, and in the present embodiment, it is set to 20 mm as an example.
When handling the above-mentioned high voltage output from the first substrate 64 and the second substrate 66, it has been found from past results that if the constant distance K1 is 10 mm or more, problems of leakage and radio noise do not occur. There is. Therefore, the constant distance K1 may be 10 mm or more, and the constant distance K1 is preferably 20 mm or more.

The first positioning unit 98 that positions each first wiring 96 has a structure in which a groove that sandwiches the first wiring 96 is formed at the tip thereof. Further, the first positioning portion 98 may be composed of an adhesive portion for adhering each first wiring 96 to the first main body 94A.

Each first wire 96 is connected to a first connector 100, and each first connector 100 is connected to a corresponding developing roll 32, as shown in FIG.

(Second holding part)
The second holding portion 92 includes a second housing 102, as shown in FIG. The second housing 102 is made of an insulator, and the second housing 102 is made of a synthetic resin as an example.

The second housing 102 includes a plate-shaped second main body 102A facing one side 38 of the second terminal 72, and a second flange 102B extending from the peripheral edge of the second main body 102A to the opposite side of the mounting direction TH.

The second main body 102A is provided with a columnar second protrusion 102C at a position corresponding to each second terminal 72, and each second protrusion 102C extends toward the corresponding second terminal 72. A second spring 90 is attached to each of the second protrusions 102C, and the direction in which each second spring 90 extends is restricted by the second protrusion 102C, and the tip portion thereof extends from the second protrusion 102C. There is.

As a result, each of the second springs 90 has one surface 38 of the second terminal 72 of the second board 66 from the side opposite to the mounting direction TH in a state where the boards 64 and 66 of the high voltage generator 40 are mounted on the device main body 36. Is electrically connected to.

Each second spring 90 is made of a conductor, and each second spring 90 is made of a steel wire as an example. A second wiring extends from the base end of each second spring 90 as in the first spring 86 (not shown).

Each second wiring is composed of a wire rod, and an example is a steel wire. Further, the second wiring can be paraphrased as a steel wire or a harness.

Each of the second wirings is arranged along the second main body 102A, and the adjacent second wirings are positioned by a second positioning portion (not shown) so as to be separated by a certain distance or more even at the closest location.

This constant distance is determined based on the energized voltage, and in the present embodiment, it is set to 20 mm as an example.

Examples of the second positioning unit for positioning each second wiring include a structure in which a groove for sandwiching the second wiring is formed at the tip thereof, similarly to the first positioning unit 98. Further, the second positioning portion may be composed of an adhesive portion that adheres each second wiring to the second main body 102A.

As shown in FIG. 9, each second wiring is connected to the second connector 104, and each second connector 104 is connected to the corresponding charging device 18.

As shown in FIG. 4, the second holding portion 92 is arranged on the opposite side of the first holding portion 88 in the mounting direction TH, and the first wiring 96 arranged in the first holding portion 88 and the first wiring 96. The second wiring arranged in the second holding portion 92 is configured to be separated from the second wiring by the above-mentioned constant distance K1.

(Action and effect)
The operation and effect of this embodiment will be described.

In the present embodiment, the plate-shaped terminals 70 and 72 extending in the intersecting direction with respect to the substrate 62 and the one side 38 of the terminals 70 and 72 provided on the apparatus main body 36 and opposite to the mounting direction TH are electrically connected. Each holding portion 88, 92 holding each spring 86, 90 connected to is provided.

Therefore, it is possible to suppress the influence of noise as compared with the case where the wiring extending from the substrate 6 is routed.

Further, in the present embodiment, the plate-shaped terminals 70 and 72 connected to the springs 86 and 90 extend in the intersecting direction intersecting the substrate 62. Therefore, the substrate 62 can be inserted and attached in the attachment direction TH along the surface of the substrate 62.

As a result, the area required in the direction intersecting the connection direction can be suppressed as compared with the case where the connection portion formed on the solder surface of the board is brought into contact with the connection destination, and the work space for mounting the board 62 can be suppressed. Can be made smaller.

In the present embodiment, the case where the two substrates of the first substrate 64 and the second substrate 66 are attached to the apparatus main body 36 has been described, but the present invention is not limited to this. The number of the substrates 62 to be attached to the apparatus main body 36 may be one or three or more, and even in these cases, the above-mentioned effects can be obtained.

Further, each of the holding portions 88 and 92 has each positioning portion 98 for positioning the adjacent wirings 96 so as to be separated from each other by a certain distance K1 or more. Therefore, as compared with the case where the wiring extending from the substrate is arranged, it is possible to suppress a defect that may occur when the adjacent wirings 96 are close to each other, for example, a defect due to the generation of noise.

Then, for the connection from the substrates 64 and 66 to the target portion, the wiring 96 provided in the holding portions 88 and 92 can be used. As a result, it is possible to reduce the cost and the required space as compared with the case where the harness is connected to the substrate and routed.

Here, if the wiring for supplying high voltage is too long, a voltage drop may occur. In addition, if the wirings come close to each other, there is a concern that malfunction may occur due to a failure due to electromagnetic noise (radio wave noise). Therefore, it is difficult to shorten the path length while making it compact.

Further, when the apparatus main body 36 has a margin, it is desirable to arrange the substrate 62 in the vicinity of the high voltage supply unit, but for the convenience of maintenance, it is required to arrange the substrate 62 at a position where it can be easily removed.

Therefore, these solutions can be solved by configuring as in the present embodiment.

Further, the second terminal 72 for delivering high voltage is arranged on the side of the surface away from the first substrate 64. Therefore, as compared with the case where the first terminal 70 is arranged on the second board 66 side and the second terminal 72 is arranged on the first board 64 side, the high voltage transferred at one terminal is applied to the other terminal. It is possible to suppress the influence, for example, the influence of noise.

Further, the first substrate 64 and the second substrate 66 are arranged such that the solder surfaces 64B and 66B to which the lead wires 68A of the mounted electronic components 68 are soldered face each other. Therefore, the minimum separation distance between the two substrates 64 and 66 can be reduced and the minimum separation distance can be reduced as compared with the case where the component surfaces 64A and 66A of the first substrate 64 and the second substrate 66 are arranged so as to face each other. It becomes possible to facilitate the management of.

To give a specific example, electronic components 68 having different heights are arranged on the component surfaces 64A and 66A. When the component surfaces 64A and 66A of the first substrate 64 and the second substrate 66 are arranged to face each other, the minimum separation distance between the electronic components 68 of both substrates 64 and 66 is the electronic components 68 arranged to face each other. Determined by the height of. Therefore, the minimum separation distance between the two substrates 64 and 66 changes depending on where the electronic component 68 is arranged, which complicates the management.

On the other hand, in the present embodiment, the minimum separation distance can be managed by the length of the lead wire 68A protruding from the solder surfaces 64B and 66B.

Further, the first terminal 70 of the first substrate 64 and the second terminal 72 of the second substrate 66 are arranged so as to be offset in the mounting direction TH. Therefore, as compared with the case where the first terminal 70 of the first substrate 64 and the second terminal 72 of the second substrate 66 are arranged so as to face each other at the same position in the mounting direction TH, the first terminal 70 is arranged. The one terminal 70 and the second terminal 72 can be largely separated from each other in the mounting direction TH.

Then, in the present embodiment, the first holding portion 88 and the second holding portion 92 can be arranged so as to be overlapped with each other, so that the size can be reduced.

Further, each of the fixing portions 76 and 82 for fixing the terminals 70 and 72 to the substrate 62 and keeping one end of the terminals 70 and 72 in electrical contact with the connecting portions 74 and 80 is provided. .. Therefore, the width of each of the terminals 70 and 72 can be widened as compared with the case where the terminals extend from the substrate. This makes it possible to increase the contact area with the springs 86 and 90.

Each terminal is provided on the first terminal 70 electrically connected to the first connection portion 74 provided on the first solder surface 64B of the first board 64 and on the second component surface 66A of the second board 66. Includes a second terminal 72 that is electrically connected to the second connection 80.

Therefore, as compared with the case where the first terminal 70 is arranged on the second board 66 side and the second terminal 72 is arranged on the first board 64 side, the high voltage transferred at one terminal is applied to the other terminal. It is possible to suppress the influence, for example, the influence of noise.

In the present embodiment, the connection structure of the present application is applied to the image forming apparatus 10, but the present invention is not limited to this, and may be applied to other apparatus. Further, in the present embodiment, the connection structure of the present application has been described using the first substrate 64 and the second substrate 66, but the connection structure of the present application may be configured by using a single substrate. Further, the mounting direction TH of each of the substrates 64 and 66 may be the vertical direction.

10 Image forming device 16 Photoreceptor 18 Charging device 22 Developing device 32 Developing roll 36 Device main body 38 One side 40 High pressure generator 42 Frame 62 Board 64 First board 64A First component side 64B Second solder side 66 Second board 66A Second Part surface 66B Second solder surface 68 Electronic component 68A Lead wire 70 First terminal 70C First energized part (one end)
72 Second terminal 72C Second energizing part (one end)
74 1st connection 80 2nd connection 86 1st spring 88 1st holding 90 2nd spring 92 2nd holding 96 1st wiring

Claims (8)

The board attached to the main body of the device and
A plate-like terminal extending in an intersecting direction with respect to the substrate, one surface of which is arranged so as to face the side in the mounting direction to the apparatus main body, and a terminal for passing electricity to and from the substrate.
A holding portion provided on the main body of the apparatus and holding a spring electrically connected to the one surface of the terminal from the side opposite to the mounting direction of the substrate.
Connection structure with. It has a plurality of the terminals that transfer high voltage to and from the substrate.
According to claim 1, the holding portion includes a plurality of the springs connected to each terminal, a plurality of wirings extending from the springs, and a positioning portion for positioning adjacent wirings so as to be separated from each other by a certain distance or more. Described connection structure. The substrate includes a first substrate and a second substrate which are arranged so that the surfaces face each other and output a high voltage, and the terminals include a first terminal which transfers a high voltage to and from the first substrate. Includes a second terminal that transfers high voltage to and from the second substrate.
The connection structure according to claim 2, wherein the second terminal is arranged on the side of the surface away from the first substrate. The connection structure according to claim 3, wherein the first substrate and the second substrate are arranged such that the solder surfaces to which the lead wires of the mounted electronic components are soldered face each other. The holding portion includes a first holding portion having a first spring electrically connected to the first terminal and a second holding portion having a second spring electrically connected to the second terminal. Including
The connection structure according to claim 3 or 4, wherein the first terminal of the first substrate and the second terminal of the second substrate are arranged so as to be offset in the mounting direction. The substrate has a connecting portion in which the terminals are electrically connected to at least one of a component surface on which an electronic component is arranged and a solder surface on which a lead wire of the electronic component is soldered.
The connection structure according to claim 1, further comprising a fixing portion for fixing the terminal to the substrate and maintaining a state in which one end of the terminal is electrically in contact with the connection portion. The substrate includes a first substrate and a second substrate in which the solder surfaces are arranged so as to face each other and output high voltage.
The terminals are electrically connected to a first terminal that is electrically connected to a connection portion provided on the solder surface of the first substrate and a connection portion that is electrically connected to a connection portion provided on the component surface of the second substrate. The connection structure according to claim 6, which includes a second terminal. An image forming apparatus having the connection structure according to any one of claims 3 to 5, and 7.
A photoconductor on which a toner image is formed using the high pressure supplied from the first substrate or one of the second substrates.
A developing roll that charges the toner supplied to the photoconductor by utilizing the high pressure supplied from the first substrate or the other substrate of the second substrate.
An image forming apparatus equipped with.

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