JP2021044343A - Condenser and electronic apparatus - Google Patents

Abstract

To provide an electronic apparatus or the like cooling heat of an electrical heating element more efficiently.SOLUTION: In an electronic apparatus 100, an electrical heating element 20 is attached to an enclosure 31. The enclosure 31 seals a cooling medium COO capable of performing phase change to liquid phase coolant and gas phase coolant. Multiple heat radiation surfaces 33a, 33b, 33c are provided on an opposite side to a heating element clamp face 32 so as not to overlap each other. The heating element clamp face 32 is a face where the first electrical heating element external surface 21 of the electrical heating element 20 is attached. Multiple coolant housing chambers 34a, 34b, 34c are formed, respectively, between multiple heat radiation surfaces and the heating element clamp face 32 in a cavity shape in the enclosure 31, for the multiple heat radiation surfaces. The multiple coolant housing chambers are supplied with gaseous phase coolant. Multiple gaseous phase coolant supply ports 35a, 35b, 35c are formed in the enclosure 31 so as to be connected with the multiple coolant housing chambers, and supply the gaseous phase refrigerant on the electrical heating element 20 side to the multiple coolant housing chambers.SELECTED DRAWING: Figure 1

Description

The present invention relates to a cooler or the like, for example, a technique of a cooler or the like for cooling a heating element.

In recent years, the amount of information processing has been increasing with the development of technologies such as cloud services. In order to process this enormous amount of information, the amount of calculation of a heating element such as a central processing unit (CPU) or an integrated circuit (Multi-chip Module: MCM) tends to increase. Therefore, the calorific value of these heating elements also tends to increase. Along with this tendency, daily attempts are being made to cool the heating element more efficiently.

As a cooling technique for the heating element, an electronic device for cooling the heating element using a refrigerant is known (for example, Patent Document 1).

In the technique described in Patent Document 1, a heating element (electronic element) is cooled by using a housing (heat diffusion plate). The upper or lower plate of the housing is arranged in close contact with the heating element. The heating element is smaller than the heat diffuser. The housing is configured by joining a rectangular upper plate and a lower plate so as to be in a sealed state. A plurality of grooves are formed in a mesh shape between the upper plate and the lower plate. Inside this groove, a refrigerant (working fluid) is sealed in a state in which a non-condensable gas such as air is degassed. The working fluid is phase-changing and evaporates and condenses. A wick is arranged inside the groove. The wick is a member having fine voids that generates capillary force by permeation of a liquid phase refrigerant (liquid phase working fluid). The wick is composed of a porous body.

As mentioned above, the heating element is smaller than the housing. Therefore, the heat of the heating element is transferred to a part of the housing. The refrigerant in the vicinity of the heating element is heated by the heat input of the heating element and evaporates, and the phase changes to the refrigerant in the vapor phase state.

Here, the portion of the housing that is not in contact with the heating element is cooled by the surrounding air. Therefore, in the housing, the temperature of the portion away from the heating element is lower than the temperature of the position where the heating element is arranged. Further, the pressure inside the groove in the vicinity of the portion away from the heating element is lower than the pressure at the position where the heating element is arranged.

Therefore, the gas phase refrigerant flows through the inside of each groove toward a place where the temperature and pressure are low. That is, the refrigerant in the vapor phase state passes through the inside of each groove and flows in a direction away from the heating element. Then, in the process of flow of the refrigerant in the gas phase state, the refrigerant in the gas phase state is cooled and condensed at a place where the temperature is low, and the phase changes to the refrigerant in the liquid phase state. The liquid-phase state refrigerant permeates the wicks in each groove, and at the same time, due to the capillary force of the wicks, the liquid-phase state refrigerant recirculates to the place where evaporation occurs. In the housing, the grooves communicate with each other and there is no closed end. Therefore, the flow of the refrigerant in the liquid phase state can be smoothly recirculated without stagnation. In this way, the liquid-phase refrigerant is returned to the heating element side by capillary force through the wick, and evaporates and condenses again in the closed space of the heat diffusion plate.

The techniques related to the present invention are also disclosed in Patent Documents 2 to 4.

Japanese Unexamined Patent Publication No. 2016-156584 (particularly, paragraphs 0017, 0019-0020, 0024) Japanese Unexamined Patent Publication No. 2009-076650 Japanese Patent Application Laid-Open No. 2012-531056 Japanese Unexamined Patent Publication No. 10-256445

However, in the technique described in Patent Document 1, when the heating element is not arranged in the center of the housing but is unevenly provided on the end side, the refrigerant in the vapor phase state does not spread over the entire housing. There was something. That is, the amount of the refrigerant supplied in the vapor phase state may differ between the end side of the housing that is farthest from the heating element and the end of the housing that is closest to the heating element. In this case, there is a problem that the cooling amount of the heat of the heating element is different in each part of the housing, and the heat of the heating element cannot be cooled uniformly.

The present invention has been made in view of such circumstances, and an object of the present invention is an electronic device capable of more uniformly cooling the heat of a heating element on each of a plurality of heat radiating surfaces of a housing. Etc. are to be provided.

The cooler of the present invention has a housing that seals a refrigerant that can be phase-changed into a liquid-phase refrigerant and a gas-phase refrigerant, and a side opposite to a heating element mounting surface that is provided in the housing and is a surface on which a heating element is mounted. A plurality of heat-dissipating surfaces provided so as not to overlap each other, and the plurality of heat-dissipating surfaces provided in the housing in a hollow shape between each of the plurality of heat-dissipating surfaces and the heating element mounting surface. A plurality of refrigerant accommodating chambers formed for each heat radiating surface and to which the vapor phase refrigerant is supplied, and a plurality of refrigerant accommodating chambers provided in the housing and formed in the housing so as to be connected to the plurality of refrigerant accommodating chambers, and the heating element side It is provided with a plurality of vapor-phase refrigerant supply ports for supplying the vapor-phase refrigerant of the above to the plurality of refrigerant accommodating chambers.

According to the present invention, it is possible to provide a cooler or the like capable of more uniformly cooling the heat of the heating element on each of the plurality of heat radiating surfaces of the housing.

It is sectional drawing which shows the structure of the electronic device in 1st Embodiment of this invention, and is the figure which shows the sectional view in the A1-A1 cut plane of FIG. It is a front view which shows the structure of the electronic device in 1st Embodiment of this invention. It is a top view which shows the structure of the electronic device in 1st Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in 1st Embodiment of this invention, and is the figure which shows the sectional view in the B1-B1 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 1st Embodiment of this invention, and is the figure which shows the sectional view in the C1-C1 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 1st Embodiment of this invention, and is the figure which shows the sectional view in the D1-D1 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 1st Embodiment of this invention, and is the figure which shows the sectional view in the E1-E1 cut plane of FIG. It is sectional drawing which shows the structure of the electronic apparatus in 1st Embodiment of this invention, and is the figure which shows the sectional view in the AA-AA cut plane of FIG. It is a side view which shows the structure of the electronic device in 1st Embodiment of this invention. It is a front view which shows the structure of the electronic device in 1st Embodiment of this invention. FIG. 11 is a cross-sectional view showing the configuration of the accommodating rack, and is a view showing a cross section of the BB-BB cut surface of FIG. It is a front view which shows the structure of the accommodation rack. It is a front view which shows the structure of the electronic device in 2nd Embodiment of this invention. It is a top view which shows the structure of the electronic device in 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in 3rd Embodiment of this invention, and is the figure which shows the sectional view in the A2-A2 cut plane of FIG. It is a front view which shows the structure of the electronic device in 3rd Embodiment of this invention. It is a top view which shows the structure of the electronic device in 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in 3rd Embodiment of this invention, and is the figure which shows the sectional view in the B2-B2 cut surface of FIG. It is sectional drawing which shows the structure of the electronic device in 3rd Embodiment of this invention, and is the figure which shows the sectional view in the C2-C2 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 3rd Embodiment of this invention, and is the figure which shows the sectional view in the D2-D2 cut surface of FIG. It is sectional drawing which shows the structure of the electronic device in 3rd Embodiment of this invention, and is the figure which shows the sectional view in the E2-E2 cut surface of FIG. It is sectional drawing which shows the structure of the electronic device in 3rd Embodiment of this invention, and is the figure which shows the sectional view in the F2-F2 cut surface of FIG. It is sectional drawing which shows the structure of the electronic device in 4th Embodiment of this invention, and is the figure which shows the sectional view in the A3-A3 cut plane of FIG. It is a front view which shows the structure of the electronic device in 4th Embodiment of this invention. It is a top view which shows the structure of the electronic device in 4th Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in 4th Embodiment of this invention, and is the figure which shows the sectional view in the cut surface of B3-B3 of FIG. It is sectional drawing which shows the structure of the electronic device in 4th Embodiment of this invention, and is the figure which shows the sectional view in the C3-C3 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 4th Embodiment of this invention, and is the figure which shows the sectional view in the cut surface of D3-D3 of FIG. It is sectional drawing which shows the structure of the electronic device in 4th Embodiment of this invention, and is the figure which shows the sectional view in the E3-E3 cut surface of FIG. It is sectional drawing which shows the structure of the electronic device in 5th Embodiment of this invention, and is the figure which shows the sectional view in the A4-A4 cut plane of FIG. 32. It is a front view which shows the structure of the electronic device in 5th Embodiment of this invention. It is a top view which shows the structure of the electronic device in 5th Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in 5th Embodiment of this invention, and is the figure which shows the sectional view in the cut surface of B4-B4 of FIG. It is sectional drawing which shows the structure of the electronic device in 5th Embodiment of this invention, and is the figure which shows the sectional view in the C4-C4 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 5th Embodiment of this invention, and is the figure which shows the sectional view in the cut plane of D4-D4 of FIG. It is sectional drawing which shows the structure of the electronic device in 5th Embodiment of this invention, and is the figure which shows the sectional view in the E4-E4 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 5th Embodiment of this invention, and is the figure which shows the sectional view in the F4-F4 cut plane of FIG. 32. It is sectional drawing which shows the structure of the 1st housing, and is the figure which shows the sectional view in the G1-G1 cut surface of FIG. 40. It is a front view which shows the structure of the 1st housing. It is a top view which shows the structure of the 1st housing. It is a bottom view which shows the structure of the 1st housing, and is the figure which shows the arrow J1 of FIG. It is a cross-sectional view which shows the structure of the 1st housing, and is the figure which shows the cross section in the H1-H1 cut plane of FIG. It is sectional drawing which shows the structure of the 1st housing, and is the figure which shows the sectional view in the I1-I1 cut surface of FIG. 40. It is sectional drawing which shows the structure of the 2nd housing, and is the figure which shows the sectional view in the K1-K1 cut plane of FIG. It is a front view which shows the structure of the 2nd housing. It is a top view which shows the structure of the 2nd housing. It is a bottom view which shows the structure of the 2nd housing, and is the figure which shows the arrow view O1 of FIG. 45. It is sectional drawing which shows the structure of the 2nd housing, and is the figure which shows the sectional view in the L1-L1 cut surface of FIG. 45. It is sectional drawing which shows the structure of the 2nd housing, and is the figure which shows the sectional view in the M1-M1 cut surface of FIG. It is a cross-sectional view which shows the structure of the 3rd housing, and is the figure which shows the cross section in the P1-P1 cut plane of FIG. It is a front view which shows the structure of the 3rd housing. It is a top view which shows the structure of the 3rd housing. It is a bottom view which shows the structure of the 3rd housing, and is the figure which shows the arrow view S1 of FIG. It is a cross-sectional view which shows the structure of the 3rd housing, and is the figure which shows the cross section in the Q1-Q1 cut plane of FIG. It is a cross-sectional view which shows the structure of the 3rd housing, and is the figure which shows the cross section in the R1-R1 cut plane of FIG. It is sectional drawing which shows the structure of the modification of the electronic device in 5th Embodiment. It is sectional drawing which shows the structure of the electronic device in 6th Embodiment of this invention, and is the figure which shows the sectional view in the A5-A5 cut plane of FIG. 59. It is a front view which shows the structure of the electronic device in 6th Embodiment of this invention. It is a top view which shows the structure of the electronic device in 6th Embodiment of this invention. It is sectional drawing which shows the structure of the electronic device in 6th Embodiment of this invention, and is the figure which shows the sectional view in the cut surface of B5-B5 of FIG. It is sectional drawing which shows the structure of the electronic device in 6th Embodiment of this invention, and is the figure which shows the sectional view in the C5-C5 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 6th Embodiment of this invention, and is the figure which shows the sectional view at the cut surface of D5-D5 of FIG. It is sectional drawing which shows the structure of the electronic device in 6th Embodiment of this invention, and is the figure which shows the sectional view in the E5-E5 cut plane of FIG. It is sectional drawing which shows the structure of the electronic device in 6th Embodiment of this invention, and is the figure which shows the sectional view in the F5-F5 cut surface of FIG. 59. It is sectional drawing which shows the structure of the electronic device in 6th Embodiment of this invention, and is the figure which shows the sectional view in the Z5-Z5 cut plane of FIG. It is sectional drawing which shows the structure of the 1st housing, and is the figure which shows the sectional view in the G5-G5 cut surface of FIG. It is a front view which shows the structure of the 1st housing. It is a top view which shows the structure of the 1st housing. It is a bottom view which shows the structure of the 1st housing, and is the figure which shows the arrow J5 of FIG. It is sectional drawing which shows the structure of the 1st housing, and is the figure which shows the sectional view in the H5-H5 cut surface of FIG. It is a cross-sectional view which shows the structure of the 1st housing, and is the figure which shows the cross section in the I5-I5 cut plane of FIG. It is a cross-sectional view which shows the structure of the 2nd housing, and is the figure which shows the cross section in the K5-K5 cut surface of FIG. 74. It is a front view which shows the structure of the 2nd housing. It is a top view which shows the structure of the 2nd housing. It is a bottom view which shows the structure of the 2nd housing, and is the figure which shows the arrow view O5 of FIG. 73. It is sectional drawing which shows the structure of the 2nd housing, and is the figure which shows the sectional view in the cut surface of L5-L5 of FIG. 73. It is sectional drawing which shows the structure of the 2nd housing, and is the figure which shows the sectional view in the M5-M5 cut surface of FIG. 74. It is a cross-sectional view which shows the structure of the 3rd housing, and is the figure which shows the cross section at the cut surface of P5-P5 of FIG. It is a front view which shows the structure of the 3rd housing. It is a top view which shows the structure of the 3rd housing. It is a cross-sectional view which shows the structure of the 3rd housing, and is the figure which shows the cross section in the Q5-Q5 cut plane of FIG. 79. It is a cross-sectional view which shows the structure of the 3rd housing, and is the figure which shows the cross section in the R5-R5 cut surface of FIG. It is sectional drawing which shows the structure of the 1st modification of the electronic device in 6th Embodiment of this invention. It is sectional drawing which shows the structure of the 2nd modification of the electronic device in 6th Embodiment of this invention.

<First Embodiment>
The electronic device 100 according to the first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a cross-sectional view showing the configuration of the electronic device 100, and is a view showing a cross section of the A1-A1 cut surface of FIG. FIG. 2 is a front view showing the configuration of the electronic device 100. FIG. 3 is a top view showing the configuration of the electronic device 100. FIG. 4 is a cross-sectional view showing the configuration of the electronic device 100, and is a view showing a cross section of the cut surface of B1-B1 of FIG. FIG. 5 is a cross-sectional view showing the configuration of the electronic device 100, and is a view showing a cross section of the C1-C1 cut surface of FIG. FIG. 6 is a cross-sectional view showing the configuration of the electronic device 100, and is a view showing a cross section of the D1-D1 cut surface of FIG. FIG. 7 is a cross-sectional view showing the configuration of the electronic device 100, and is a view showing a cross section of the E1-E1 cut surface of FIG. Note that the vertical direction G is shown in FIGS. 1, 2 and 7.

With reference to FIGS. 1 to 7, the electronic device 100 includes a circuit board 10, a heating element 20, and a cooler 30. The electronic device 100 can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100 can be configured by omitting the circuit board 10.

The circuit board 10 is formed in a flat plate shape. The circuit board 10 has a first main surface 11, a second main surface 12, and a connector portion 13. Here, the main surface of the circuit board 10 means the main surface of the circuit board 10, for example, the surface on which electronic components are mounted. The first main surface 11 may be referred to as the front surface (front surface) of the circuit board, and the second main surface 12 may also be referred to as the back surface of the circuit board. A heating element 20 is attached on the first main surface 11 of the circuit board 10 by soldering or crimping.

The circuit board 10 is, for example, a printed wiring board. The printed wiring board is configured by laminating a plurality of insulator boards and conductor wiring. Further, conductive pads for mounting electronic components are formed on the first main surface 11 and the second main surface 12 of the circuit board 10. For example, a phenol resin or a glass epoxy resin is used as the material of the substrate of the insulator. Conductor wiring and pads are made of, for example, copper foil.

Further, the connector portion 13 is formed on the first main surface 11 of the circuit board 10 in order to connect with other electronic components (not shown). The connector portion 13 is composed of, for example, a plurality of terminals (not shown) formed on the first main surface 11 of the circuit board 10. The connector portion 13 may also be formed on the second main surface 12. In this case, the connector portion 13 is formed in the region of the second main surface 12 corresponding to the formation region of the connector portion 13 formed on the first main surface 11. The connector portion 13 is not an essential configuration in the present embodiment.

The heating element 20 is attached to the first main surface 11 of the circuit board 10. The heating element 20 has a first heating element outer surface 21. The first heating element outer surface 21 is one of the outer surfaces of the heating element 20, and is a surface of the heating element 20 opposite to the surface on the circuit board 10 side. The outer surface 21 of the first heating element is generally formed of a flat surface, but may be formed of a curved surface. The heating element 20 is a component that generates heat when operated, and is, for example, a central processing unit CPU, an integrated circuit MCM, or the like.

As shown in FIGS. 1 and 2, the cooler 30 is formed in a box shape having a step on the upper side in the vertical direction G. The housing 30 houses the Coolant COO. The inside of the housing 30 is hollow. A refrigerant COO is provided in this cavity.

Refrigerant COO includes liquid-phase refrigerant (Liquid-Phase Coolant: hereinafter referred to as LP-COO) and vapor-phase refrigerant (Gas-Phase Coolant: GP-. A refrigerant that changes phase between (referred to as COO))) is used.

As the refrigerant COO, for example, hydrofluorocarbon (HFC: Hydro Fluorocarbon), hydrofluoroether (HFE: Hydro Fluoroether), or the like can be used.

The refrigerant COO is confined in the internal space of the cooler 30 in a sealed state. Therefore, by injecting the liquid phase refrigerant LP-COO into the closed space between the inside of the cooler 30 and the heating element 20 and then evacuating the space, the inside of the closed space is always maintained at the saturated vapor pressure of the refrigerant. can do. The method of filling the refrigerant COO in the enclosed space between the inside of the cooler 30 and the heating element 20 will be described in detail in the description of the manufacturing method of the electronic device 100 described later.

The cooler 30 includes a housing 31, a heating element mounting surface 32, a first heat radiation surface 33a, a second heat radiation surface 33b, a third heat radiation surface 33c, a first refrigerant storage chamber 34a, and the like. A second refrigerant accommodating chamber 34b, a third refrigerant accommodating chamber 34c, a first gas phase refrigerant supply port 35a, a second gas phase refrigerant supply port 35b, and a third gas phase refrigerant supply port 35c. It has.

Here, when each of the first heat radiating surface 33a, the second heat radiating surface 33b, and the third heat radiating surface 33c is not distinguished, these are collectively referred to as the heat radiating surface 33. Further, when each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c is not distinguished, these are collectively referred to as the refrigerant accommodating chamber 34. When each of the first gas phase refrigerant supply port 35a, the second gas phase refrigerant supply port 35b, and the third gas phase refrigerant supply port 35c is not distinguished, these are collectively referred to as the gas phase refrigerant supply port 35. .. That is, the first heat radiating surface 33a, the second heat radiating surface 33b, and the third heat radiating surface 33c correspond to a plurality of heat radiating surfaces 33. The first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c correspond to a plurality of refrigerant accommodating chambers 34. The first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c correspond to a plurality of gas-phase refrigerant supply ports 35.

The housing 31 is attached to the heating element 20 with an adhesive or the like. The housing 31 has a cavity as described above, and the refrigerant COO is hermetically housed in the cavity. Further, a heat conductive member is used as the material of the housing 31, and for example, aluminum, an aluminum alloy, copper, a copper alloy, or the like is used. The plate thickness of the housing 31 can be, for example, 1 mm to 2 mm in consideration of manufacturing efficiency, weight, and the like, but is not limited thereto.

In the above description, it has been explained that the cooler 30 is attached to the heating element 20 by an adhesive. However, the cooler 30 only needs to be fixed to the heating element 20, and this fixing method is not limited to fixing with an adhesive.

That is, for example, a plurality of holes are provided in advance in the circuit board 10, and pins that fit into the plurality of holes are formed in the cooler 30. Then, by fitting the pin of the cooler 30 into the hole of the circuit board 10, the cooler 30 is attached to the circuit board 10 so as to sandwich the heating element 20 between the cooler 30 and the circuit board 10. As a result, the cooler 30 is fixed to the heating element 20. In this case, the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. Therefore, the heating element 20 does not need to be fixed on the first main surface 11 of the circuit board 10 by soldering.

Alternatively, the cooler 30 may be screwed to the circuit board 10. In this case, the cooler 30 is screwed to the circuit board 10 so that the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. As a result, the cooler 30 is fixed to the heating element 20. Even in this case, the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. Therefore, since the heating element 20 is crimped to the circuit board 10 by tightening the screws, it is not necessary to fix the heating element 20 on the first main surface 11 of the circuit board 10 by soldering.

At this time, the screw hole may be provided in the cooler 30, or the screw hole may be provided in a holding member different from the cooler 30. When a holding member is used, a heating element 20 and a cooler 30 are arranged between the holding member and the circuit board 10. Then, the heating element 20 and the cooler 30 are screwed so as to be sandwiched between the holding member and the circuit board 10. As a result, the cooler 30 is fixed to the heating element 20. Even in this case, the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. Therefore, since the heating element 20 is crimped to the circuit board 10 by tightening the screws, it is not necessary to fix the heating element 20 on the first main surface 11 of the circuit board 10 by soldering.

Further, the claws formed in advance in the cooler 30 may be hooked in the holes formed in advance in the circuit board 10. In this case, the claws of the cooler 30 are hooked in the holes of the circuit board 10 so that the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. As a result, the cooler 30 is fixed to the heating element 20. Even in this case, the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. Therefore, since the heating element 20 is crimped to the circuit board 10 by tightening the screws, it is not necessary to fix the heating element 20 on the first main surface 11 of the circuit board 10 by soldering.

The heating element mounting surface 32 is a surface on which the heating element 20 is mounted among the surfaces constituting the housing 31. The heating element mounting surface 32 is arranged so as to face the first main surface 11 of the circuit board 10.

As a plurality of heat radiation surfaces, a first heat radiation surface 33a, a second heat radiation surface 33b, and a third heat radiation surface 33c are formed in the housing 31. The first heat radiating surface 33a, the second heat radiating surface 33b, and the third heat radiating surface 33c are provided on the opposite sides of the heating element mounting surface 32 so as not to overlap each other. The first heat radiating surface 33a, the second heat radiating surface 33b, and the third heat radiating surface 33c are outer surfaces of the housing 31. As will be described later, a heat radiating portion such as a heat sink can be mounted on the first heat radiating surface 33a, the second radiating surface 33b, and the third radiating surface 33c. In addition, referring to FIG. 1, the first heat radiation surface 33a, the second heat radiation surface 33b, and the third heat radiation surface 33c are formed on separate surfaces, but they are on the same surface. It may be formed. For example, the first heat radiating surface 33a, the second heat radiating surface 33b, and the third heat radiating surface 33c may all be formed on the same surface. Further, the first heat radiating surface 33a and the second heat radiating surface 33b are formed on the same surface, and the third heat radiating surface 33c is on a surface different from the first heat radiating surface 33a and the second heat radiating surface 33b. It may be formed. Further, the first heat radiating surface 33a and the third heat radiating surface 33c are formed on the same surface, and the second heat radiating surface 33b is on a surface different from the first heat radiating surface 33a and the third heat radiating surface 33c. It may be formed.

As a plurality of refrigerant accommodating chambers, a first refrigerant accommodating chamber 34a, a second refrigerant accommodating chamber 34b, and a third refrigerant accommodating chamber 34c are provided in the housing 31. The vapor phase refrigerant GP-COO is supplied to the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c. The first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c are hollowed between each of the plurality of heat radiating surfaces 33a, 33b, 33c and the heating element mounting surface 32. A plurality of heat radiating surfaces 33a, 33b, and 33c are formed in the body 31. More specifically, the first refrigerant accommodating chamber 34a is formed in the housing 31 in a hollow shape between the first heat radiating surface 33a and the heating element mounting surface 32. Further, the second refrigerant accommodating chamber 34b is formed in the housing 31 in a hollow shape between the second heat radiating surface 33b and the heating element mounting surface 32. Further, the third refrigerant accommodating chamber 34c is formed in the housing 31 in a hollow shape between the third heat radiating surface 33c and the heating element mounting surface 32.

It should be noted that preferably, the lower inner surfaces of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c (the inner surface of the lower surface of the paper in FIG. 1) are used. The distance between the circuit board 10 and the first main surface 11 is set to decrease as it approaches the heating element 20 side. That is, an inclination is provided on the lower inner surfaces of each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c. As a result, the liquid-phase refrigerant LP-COO inside each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c flows toward the heating element 20 due to its own weight. Can be done.

As a plurality of gas-phase refrigerant supply ports, a first gas-phase refrigerant supply port 35a, a second gas-phase refrigerant supply port 35b, and a third gas-phase refrigerant supply port 35c are formed in the housing 31. The housing 31 is connected to the first vapor phase refrigerant supply port 35a, the second vapor phase refrigerant supply port 35b, and the third vapor phase refrigerant supply port 35c so as to be connected to a plurality of refrigerant storage chambers 34a, 34b, 34c. It is formed inside. The first vapor phase refrigerant supply port 35a, the second vapor phase refrigerant supply port 35b, and the third vapor phase refrigerant supply port 35c are provided in a plurality of refrigerant storage chambers 34a, 34b, 34c, and the gas phase refrigerant GP on the heating element side. -Supply COO. More specifically, with reference to FIGS. 1 and 4, the first gas phase refrigerant supply port 35a is formed in the housing 31 so as to be connected to the first refrigerant accommodating chamber 34a, and the first gas phase refrigerant supply port 35a is formed in the housing 31. The gas phase refrigerant GP-COO on the heating element side is supplied to the refrigerant accommodating chamber 34a. With reference to FIGS. 1 and 5, the second vapor phase refrigerant supply port 35b is formed in the housing 31 so as to be connected to the second refrigerant storage chamber 34b, and heat is generated in the second refrigerant storage chamber 34b. Supply the gas phase refrigerant GP-COO on the body side. With reference to FIGS. 1 and 7, the third gas phase refrigerant supply port 35c is formed in the housing 31 so as to be connected to the third refrigerant storage chamber 34c, and heat is generated in the third refrigerant storage chamber 34c. Supply the gas phase refrigerant GP-COO on the body side.

In the present embodiment, the first gas phase refrigerant supply port 35a, the second gas phase refrigerant supply port 35b, and the third gas phase refrigerant supply port 35c also have a function as a liquid phase refrigerant storage port. That is, the gas-phase refrigerant GP-COO on the heating element side passes through the first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c, and the first refrigerant. After flowing into the accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c, the refrigerant is cooled and undergoes a phase change to the liquid-phase refrigerant LP-COO. Then, the liquid phase refrigerant LP-COO again passes around the heating element 20 via the first gas phase refrigerant supply port 35a, the second gas phase refrigerant supply port 35b, and the third gas phase refrigerant supply port 35c. Return to.

The configuration of the electronic device 100 has been described above.

Next, a method of manufacturing the electronic device 100 will be described.

First, the heating element 20 and the circuit board 10 are prepared. Next, the cooler 30 is attached to the heating element 20 so that the heating element 20 is sandwiched between the cooling element 30 and the circuit board 10. The method of attaching the heating element 20 to the circuit board 10 and the method of attaching the cooler 30 to the heating element 20 are as described in the above-described configuration description.

Next, the refrigerant COO is filled in the internal space of the housing 31 of the cooler 30.

The method of filling the internal space of the housing 31 of the cooler 30 with the refrigerant COO is as follows.

Refrigerant COO is injected into the internal space of the housing 31 of the cooler 30 from a refrigerant injection hole (not shown) provided in advance on the upper surface of the housing 31 (the surface on the upper side of the paper in FIG. 1). Then, the refrigerant injection hole is closed. Further, the cooler 30 is provided by using a vacuum pump (not shown) or the like through an air exhaust hole (not shown) provided in advance on the upper surface of the housing 31 (the surface on the upper side of the paper surface in FIG. 1). Air is removed from the internal space of the housing 31. Then, the air exhaust hole is closed. In this way, the refrigerant COO is sealed in the internal space of the housing 31 of the cooler 30. As a result, the pressure in the internal space of the housing 31 of the cooler 30 becomes equal to the saturated vapor pressure of the refrigerant COO, and the refrigerant COO sealed in the internal space of the housing 31 of the cooler 30 is in a gas-liquid equilibrium state. Become. The refrigerant injection hole may be shared as an air exclusion hole.

As described above, the manufacturing method of the electronic device 100 has been described. Next, the configuration of the electronic device 1000 according to the first embodiment of the present invention will be described. FIG. 8 is a cross-sectional view showing the configuration of the electronic device 1000, and is a view showing a cross section of the AA-AA cut surface of FIG. FIG. 9 is a side view showing the configuration of the electronic device 1000. In FIGS. 8 and 9, the left side is the front side of the electronic device 1000, and the right side is the back side of the electronic device 1000. The vertical direction G is shown in FIGS. 8 to 10.

With reference to FIGS. 8-10, the electronic device 1000 includes an electronic device 100 and a storage rack 200. The electronic device 1000 is, for example, a communication device or a server. One or more electronic devices 100 (electronic modules, etc.) are incorporated in the electronic device 1000.

As shown in FIG. 8, the accommodation rack 200 accommodates a plurality of electronic devices 100. In FIG. 8, three electronic devices 100 are housed in a storage rack 200. However, not limited to three, one or more electronic devices 100 may be accommodated in the accommodating rack 200.

Here, as shown in FIGS. 8 and 10, a front cover 110 is attached to an end portion of the circuit board 10 of the electronic device 100 opposite to the connector portion 13. The front cover 110 is not an essential component of the present embodiment.

The configuration of the storage rack 200 will be specifically described. FIG. 11 is a cross-sectional view showing the configuration of the accommodating rack 200, and is a view showing a cross section of the BB-BB cut surface of FIG. FIG. 12 is a front view showing the configuration of the accommodation rack 200. The vertical direction G is shown in FIGS. 11 and 12.

With reference to FIGS. 11 and 12, the accommodation rack 200 includes a housing 210 and a circuit board 220.

The housing 210 is formed in a box shape with a hollow inside. The housing 210 houses the circuit board 220. The housing 210 has an opening 211. The opening 211 is formed on the front side of the accommodation rack 200. The circuit board 220 and the electronic device 100 are housed in the housing 210 via the opening 211. As the material of the housing 210, for example, aluminum, an aluminum alloy, a stainless alloy, or the like is used.

The circuit board 220 is fixed to the inside of the back surface side of the housing 210 by screwing or the like. The circuit board 220 is arranged along the vertical direction G. Further, referring to FIG. 11, the accommodating rack side connector portion 223 is mounted on the circuit board 220. The accommodating rack side connector portion 223 is provided so as to fit with the connector portion 13. That is, the thickness of the circuit board 10 at the position where the connector portion 13 is arranged and the width of the portion of the accommodating rack-side connector portion 223 accommodating the connector portion 13 are set to be substantially the same. Further, the pitch distance between the terminals (not shown) provided in the connector portion 13 and the distance between the terminals (not shown) of the accommodating rack side connector portion 223 are set to be substantially the same.

The configuration of the accommodation rack 200 has been described above.

Next, the operation of the electronic device 100 and the electronic device 1000 will be described. As shown in FIG. 8, the electronic device 100 is housed in the housing 210 of the housing rack 200. At this time, the connector portion 13 of the electronic device 100 is inserted into the accommodating rack side connector portion 223 of the accommodating rack 200. As a result, the connector portion 13 fits into the accommodating rack side connector portion 223. As a result, the connector portion 13 and the accommodating rack side connector portion 223 are electrically connected. Then, the circuit board 220 of the accommodating rack 200 and the circuit board 10 of the electronic device 100 are electrically connected via the connector portion 13 and the accommodating rack side connector portion 223.

Next, when the electronic device 1000 is started, power is supplied from the circuit board 220 to the electronic device 100 via the accommodating rack side connector portion 223 and the connector portion 13. As a result, the electronic device 100 is activated.

Here, the liquid-phase refrigerant LP-COO is accumulated on the lower side in the vertical direction G inside the housing 31 due to its own weight. More specifically, the liquid phase refrigerant LP-COO is accumulated inside the housing 31 on the heating element mounting surface 32 side due to its own weight.

When the electronic device 100 is activated, power is supplied to the heating element 20 on the circuit board 10. As a result, the heating element 20 generates heat. As described above, the heating element 20 is smaller than the housing 31 of the cooler 30. Therefore, the heat of the heating element 20 is transferred to a part of the housing 31. More specifically, the heat of the heating element 20 is transferred to a part of the heating element mounting surface 32 of the housing 31. Then, the liquid phase refrigerant LP-COO in the vicinity of the heating element 20 is heated and evaporated by the heat input of the heating element 20, and the phase changes to the vapor phase refrigerant GP-COO. As a result, bubbles of the gas phase refrigerant GP-COO are generated in the liquid phase refrigerant LP-COO in the vicinity of the heating element 20. The heating element 20 is cooled by the heat of vaporization (latent heat) generated by this phase change.

Further, the first heating element outer surface 21 of the heating element 20 is thermally connected to the heating element mounting surface 32 of the cooling element 30. Therefore, the heat of the heating element 20 is transferred to the housing 31 via the heating element mounting surface 32. As a result, the heating element 20 is cooled.

The gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to.

Here, the portion of the housing 31 that is not in contact with the heating element 20 is cooled by the surrounding air. Therefore, in the housing 31, the temperature of the portion away from the heating element 20 is lower than the temperature around the heating element 20. Further, the pressure inside the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c at a location away from the heating element 20 is lower than the pressure around the heating element 20.

Therefore, the gas phase refrigerant GP-COO around the heating element 20 flows from the side of the heating element 20 toward the side where the temperature and pressure are low. That is, the gas-phase refrigerant GP-COO around the heating element 20 passes through the first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c. It flows into the refrigerant accommodating chamber 34a of No. 1, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c. More specifically, the vapor phase refrigerant GP-COO around the heating element 20 flows into the first refrigerant accommodating chamber 34a through the first vapor phase refrigerant supply port 35a. Further, the vapor phase refrigerant GP-COO around the heating element 20 flows into the second refrigerant accommodating chamber 34b via the second vapor phase refrigerant supply port 35b. Further, the gas phase refrigerant GP-COO around the heating element 20 flows into the third refrigerant accommodating chamber 34c through the third vapor phase refrigerant supply port 35c.

The vapor phase refrigerant GP-COO that has flowed into each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c is the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34a. It is cooled by contacting the inner wall surface of each of the 34b and the third refrigerant accommodating chamber 34c. The heat of the heating element 20 is transferred to the inner wall surfaces of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31 via the vapor phase refrigerant GP-COO. After being transmitted, heat is dissipated to the outside of the housing 31.

Then, the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20 is the inner wall surface of each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. When cooled by contacting with, the phase changes to the liquid phase refrigerant LP-COO again. This liquid phase refrigerant LP-COO descends downward in the vertical direction G inside each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. , Flows around the heating element 20 through the first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c, and is used again for cooling the heating element 20. Be done.

The operations of the electronic device 100 and the electronic device 1000 have been described above.

Here, specific setting conditions for thermal design will be described.

The temperature difference ΔT (° C.) between the temperature of each of the plurality of heat dissipation surfaces 33 and the temperature of the surrounding air is the thermal resistance Rt (° C./W) of each of the plurality of heat dissipation surfaces 33 and the heat dissipation amount Q (W). Is expressed by Equation 1.
ΔT = Rt × Q ・ ・ ・ ・ (Equation 1)

The heat radiation amount Q (W) is the supply amount q (m ³ / s) of the gas phase refrigerant GP-COO to ^{each refrigerant storage chamber 34 and the density δ (kg / m 3} ) of the gas phase refrigerant GP-COO. , Evaporation latent heat h (kJ / kg) of the gas phase refrigerant GP-COO is expressed by the formula 2.
Q = q × δ × h ・ ・ ・ ・ (Equation 2)

Therefore, the temperature difference ΔT (° C.) between the temperature of each of the plurality of heat radiation surfaces 33 and the temperature of the surrounding air is expressed by Equations 1 and 2 as in Equation 3. Further, since the density δ (kg / m ³ ) of the gas phase refrigerant GP-COO and the latent heat of vaporization h (kJ / kg) of the gas phase refrigerant GP-COO are constants determined by the gas phase refrigerant GP-COO, q × Assuming that δ = Z (Z is a constant), the temperature difference ΔT (° C.) between the temperature of each of the plurality of heat-dissipating surfaces 33 and the temperature of the surrounding air is expressed by Equation 4.
ΔT = Rt × q × δ × h ・ ・ ・ (Equation 3)
ΔT = Z × Rt × q ・ ・ ・ (Equation 4)

More specifically, the temperature difference between the temperature of each heat radiating surface 33 and the temperature of the surrounding air will be examined. The temperature difference ΔT1 between the temperature of the first heat radiating surface 33a and the temperature of the surrounding air is determined by using the heat radiating resistance Rt1 of the heat radiating surface 33a and the supply amount q1 of the vapor phase refrigerant GP-COO to the refrigerant accommodating chamber 34a. , Represented by Equation 5. Similarly, the temperature difference ΔT2 between the temperature of the second heat radiating surface 33b and the temperature of the surrounding air is the heat radiating resistance Rt2 of the heat radiating surface 33b and the supply amount q2 of the vapor phase refrigerant GP-COO to the refrigerant accommodating chamber 34b. Is expressed by Equation 6. Further, the temperature difference ΔT3 between the temperature of the third heat radiating surface 33c and the temperature of the surrounding air is the heat radiating resistance Rt3 of the heat radiating surface 33c and the supply amount q3 of the vapor phase refrigerant GP-COO to the refrigerant accommodating chamber 34c. In use, it is represented by Equation 7.
ΔT1 = Z × Rt1 × q1 ・ ・ ・ ・ (Equation 5)
ΔT2 = Z × Rt2 × q2 ・ ・ ・ ・ (Equation 6)
ΔT3 = Z × Rt3 × q3 ・ ・ ・ ・ (Equation 7)

Here, as shown in Equation 8, the temperature difference between the temperatures of the heat radiating surfaces 33a, 33b, 33c and the temperature of the surrounding air is adjusted so that the temperature differences ΔT1, ΔT2, and ΔT3 are constant. As a result, the heat of the heating element 20 can be uniformly radiated from the heat radiating surfaces 33a, 33b, 33c. As a result, the heat of the heating element 20 can be cooled more uniformly on the heat radiating surfaces 33a, 33b, 33c. For example, when a blower (cooling fan) is provided near a specific heat dissipation surface or a heat dissipation fin (heat sink) is attached to a specific heat dissipation surface, depending on the cooling capacity of the blower or the heat dissipation fin. , Each heat dissipation resistance Rt1, Rt2, Rt3 and the supply amounts q1, q2, q3 of the gas phase refrigerant GP-COO to the refrigerant accommodating chamber 34 can be adjusted.
ΔT1 = ΔT2 = ΔT3
= Z x Rt1 x q1 = Z x Rt2 x q2 = Z x Rt3 x q3 ... (Equation 8)

When the heat radiation resistors Rt1, Rt2, and Rt3 of the heat radiation surfaces 33a, 33b, and 33c are predetermined from the arrangement relationship of the heating element 20 and the first to third heat radiation surfaces 33a, 33b, and 33c, the first to third heat radiation surfaces 33a, 33b, and 33c are arranged. The supply amounts q1, q2, and q3 of the vapor phase refrigerant GP-COO to the plurality of refrigerant accommodating chambers 34a, 34b, and 34c are adjusted according to the heat dissipation resistors Rt1, Rt2, and Rt3 of 33a, 33b, and 33c.

That is, according to Equation 8, for example, when the ratio of Rt1, Rt2, and Rt3 is 1: 2: 3, the ratio of q1, q2, and q3 is adjusted to 6: 3: 2.

Next, a method of adjusting the supply amounts q1, q2, and q3 of the gas phase refrigerant GP-COO to the plurality of refrigerant storage chambers 34a, 34b, and 34c will be described.

Here, as shown in Equation 9, the square of the supply amount q of the gas phase refrigerant GP-COO to each refrigerant storage chamber 34 is a flow in the flow path between the heating element 20 side and each heat radiation surface 33 side. It is known that it is inversely proportional to the road resistance Rf.
q ² ∝ (1 / Rf) ・ ・ ・ ・ (Equation 9)

Therefore, the supply amount q of the gas phase refrigerant GP-COO to each refrigerant accommodating chamber 34 is set according to the flow path resistance Rf in the flow path between the heating element 20 side and the heat radiation surface 33 side.

Further, the flow path resistance Rf in the flow path between the heating element 20 side and the heat radiation surface 33 side is the distance L between the heating element 20 side and the heat radiation surface 33 side (L is also called the flow path length) and the gas phase. Using the cross-sectional area S when the housing 31 is cut on a plane perpendicular to the direction of the flow path in which the refrigerant GP-COO flows from the heating element 20 side toward each heat radiation surface 33 side, as in Equation 10. Shown in. That is, Rf is proportional to ^{L × S-2.} The direction of the flow path through which the gas phase refrigerant GP-COO flows from the heating element 20 side toward each heat radiation surface 33 side is as shown in FIG. 1, in which the vapor phase refrigerant GP-COO flows upward in the vertical direction G. If so, it coincides with the vertical direction G, and if the vapor phase refrigerant GP-COO is flowing along the first main surface 11 of the circuit board 10, it is relative to the first main surface 11 of the circuit board 10. It is in the vertical direction.
Rf∝L × S ^-2 ... (Equation 10)

Further, when the distance L is determined in advance when Rf is considered to be constant, the cross-sectional area S can be determined according to the equation 10. That is, for example, in FIG. 1, the distance L1 between the heating element 20 side and the first heat radiating surface 33a side is shorter than the distance L3 between the heating element 20 side and the third heat radiating surface 33c side. In this case, basically, when the housing 31 is cut on a surface perpendicular to the direction of the flow path in which the vapor phase refrigerant GP-COO flows from the heating element 20 side toward the first heat radiation surface 33a side. The cross-sectional area S1 is the cross-sectional area S3 when the housing 31 is cut on a plane perpendicular to the direction of the flow path through which the vapor phase refrigerant GP-COO flows from the heating element 20 side toward the first heat radiation surface 33c side. Must be set smaller than.

With respect to the cross-sectional area S, depending on one or both of the width and height of the inner walls of the plurality of refrigerant accommodating chambers 34 when the housing 31 is cut along the direction perpendicular to the heating element mounting surface 32. You may adjust. Further, the cross-sectional area S may be adjusted by the areas of a plurality of gas phase refrigerant supply ports 35.

So far, the specific setting conditions for thermal design have been described.

As described above, the electronic device 100 according to the first embodiment of the present invention includes a heating element 20, a housing 31, a heating element mounting surface 32, a plurality of heat radiating surfaces 33, and a plurality of refrigerant accommodating chambers 34. , A plurality of vapor phase refrigerant supply ports 35 are provided. A heating element 20 is attached to the housing 31. Further, the housing 31 seals the liquid phase refrigerant LP-COO and the refrigerant COO capable of changing the phase between the gas phase refrigerant GP-COO. The heating element mounting surface 32 is provided on the housing 31. The heating element mounting surface 32 is a surface on which the heating element is mounted. The plurality of heat radiating surfaces 33 are provided in the housing 31. The plurality of heat radiating surfaces 33 are provided on the opposite sides of the heating element mounting surface 32 so as not to overlap each other. Each of the plurality of refrigerant accommodating chambers 34 is provided in the housing 31. Each of the plurality of refrigerant accommodating chambers 34 is formed in the housing 31 in a hollow shape between each of the plurality of heat radiating surfaces 33 and the heating element mounting surface 32 for each of the plurality of heat radiating surfaces 33. The vapor phase refrigerant GP-COO is supplied to the plurality of refrigerant accommodating chambers 34. The plurality of gas phase refrigerant supply ports 35 are provided in the housing 31. The plurality of gas phase refrigerant supply ports 35 are formed in the housing 31 so as to be connected to the plurality of refrigerant storage chambers 34, and supply the gas phase refrigerant GP-COO on the heating element 20 side to the plurality of refrigerant storage chambers 34. ..

As described above, in the electronic device 100 according to the first embodiment of the present invention, a plurality of heat radiation surfaces 33 are provided so as not to overlap each other, and a plurality of refrigerant storage chambers 34 are provided corresponding to each of the plurality of heat radiation surfaces 33. It is provided so that the vapor phase refrigerant GP-COO can be individually supplied to each of the plurality of refrigerant accommodating chambers 34. As a result, in the electronic device 100, the supply amount of the gas phase refrigerant GP-COO supplied to each of the plurality of refrigerant storage chambers 34 can be individually adjusted. Therefore, in the electronic device 100, the amount of heat radiated from the plurality of heat radiating surfaces 33 can be adjusted more uniformly.

Therefore, according to the electronic device 100 according to the first embodiment of the present invention, the heat of the heating element 20 can be cooled more uniformly on each of the plurality of heat radiating surfaces 33 of the housing 31.

Further, the cooler 30 according to the first embodiment of the present invention includes a housing 31, a heating element mounting surface 32, a plurality of heat radiating surfaces 33, a plurality of refrigerant accommodating chambers 34, and a plurality of vapor phase refrigerant supplies. It has a mouth 35. A heating element 20 is attached to the housing 31. Further, the housing 31 seals the liquid phase refrigerant LP-COO and the refrigerant COO capable of changing the phase between the gas phase refrigerant GP-COO. The heating element mounting surface 32 is provided on the housing 31. The heating element mounting surface 32 is a surface on which the heating element is mounted. The plurality of heat radiating surfaces 33 are provided in the housing 31. The plurality of heat radiating surfaces 33 are provided on the opposite sides of the heating element mounting surface 32 so as not to overlap each other. Each of the plurality of refrigerant accommodating chambers 34 is provided in the housing 31. Each of the plurality of refrigerant accommodating chambers 34 is formed in the housing 31 in a hollow shape between each of the plurality of heat radiating surfaces 33 and the heating element mounting surface 32 for each of the plurality of heat radiating surfaces 33. The vapor phase refrigerant GP-COO is supplied to the plurality of refrigerant accommodating chambers 34. The plurality of gas phase refrigerant supply ports 35 are provided in the housing 31. The plurality of gas phase refrigerant supply ports 35 are formed in the housing 31 so as to be connected to the plurality of refrigerant storage chambers 34, and supply the gas phase refrigerant GP-COO on the heating element 20 side to the plurality of refrigerant storage chambers 34. ..

Even with such a cooler 30, the same effect as that of the electronic device 100 can be obtained.

Further, in the cooler 30 and the electronic device 100 according to the first embodiment of the present invention, the vapor phase refrigerant GP-COO is supplied to the plurality of refrigerant accommodating chambers 34 according to the heat radiation resistance Rt of the plurality of heat radiation surfaces 33. The amount has been adjusted. Thereby, the supply amount of the gas phase refrigerant GP-COO to the plurality of refrigerant accommodating chambers 34 can be adjusted according to the heat radiation resistance Rt of the plurality of heat radiation surfaces 33.

Further, in the cooler 30 and the electronic device 100 according to the first embodiment of the present invention, the supply amount of the gas phase refrigerant GP-COO to the plurality of refrigerant storage chambers 34 is determined by the plurality of heat radiation surfaces 33 and the heating element 20. The cross-sectional area S when the housing 31 is cut on a plane perpendicular to the direction of the flow path between the distance L and the flow path in which the vapor phase refrigerant GP-COO flows from the heating element 20 side toward the plurality of heat radiation surfaces 33. It is adjusted based on. Thereby, the supply amount of the gas phase refrigerant GP-COO to the plurality of refrigerant accommodating chambers 34 can be easily adjusted by the internal structure of the housing 31.

Further, in the cooler 30 and the electronic device 100 according to the first embodiment of the present invention, the cross-sectional area S is a plurality when the housing 31 is cut along the direction perpendicular to the heating element mounting surface 32. The width and height of the inner wall of the refrigerant accommodating chamber 34 of the above may be adjusted by either one or both. As a result, the flow path through which the vapor phase refrigerant GP-COO flows from the heating element 20 side toward the plurality of heat radiation surfaces 33 by simply adjusting one or both of the width and height of the inner wall of the refrigerant storage chamber 34. The cross-sectional area S when the housing 31 is cut on a plane perpendicular to the direction of the above can be easily adjusted.

Further, in the cooler 30 and the electronic device 100 according to the first embodiment of the present invention, the cross-sectional area S may be adjusted by the areas of a plurality of gas phase refrigerant supply ports 35. As a result, only by adjusting the area of the plurality of gas phase refrigerant supply ports 35, the vapor phase refrigerant GP-COO is perpendicular to the direction of the flow path in which the gas phase refrigerant GP-COO flows from the heating element 20 side toward the plurality of heat radiation surfaces 33. The cross-sectional area S when the housing 31 is cut on the surface can be easily adjusted.

<Second embodiment>
The electronic device 100A according to the second embodiment of the present invention will be described with reference to the drawings.

FIG. 13 is a front view showing the configuration of the electronic device 100A. FIG. 14 is a top view showing the configuration of the electronic device 100. Note that FIG. 13 shows the vertical direction G. Further, in FIGS. 13 and 14, the components equivalent to the components shown in FIGS. 1 to 12 are designated by the same reference numerals as those shown in FIGS. 1 to 12.

With reference to FIGS. 13 to 14, the electronic device 100A includes a circuit board 10, a heating element 20, a cooler 30, a first heat radiating unit 36a, a second heat radiating unit 36b, and a third heat radiating unit. A portion 36c and a blower portion F are provided. The blower is also called a cooling fan. Here, when each of the first heat radiating unit 36a, the second heat radiating unit 36b, and the third heat radiating unit 36c is not distinguished, these are collectively referred to as a plurality of heat radiating units 36.

The electronic device 100A can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100A can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 and the blower portion F are not essential configurations in the present embodiment. That is, the electronic device 100A can be configured by omitting the circuit board 10 and the blower portion F.

Here, the electronic device 100A and the electronic device 100 are compared. As shown in FIGS. 13 and 14, the electronic device 100A includes a first heat radiating unit 36a, a second heat radiating unit 36b, a third heat radiating unit 36c, and a blower unit F. It is different from the device 100.

The first heat radiating unit 36a, the second heat radiating part 36b, and the third heat radiating part 36c each have a plurality of fins 37. Each fin 37 is formed so as to extend upward in the vertical direction G from the housing 31 side.

Further, each heat radiating portion 36 is provided on each heat radiating surface 33 of the housing 31. That is, the first heat radiating portion 36a is mounted on the first heat radiating surface 33a. Further, the second heat radiating portion 36b is mounted on the second heat radiating surface 33b. Further, the third heat radiating portion 36c is mounted on the third heat radiating surface 33c. The heat radiating portions 36 are attached to the heat radiating surfaces 33 by, for example, bonding with an adhesive. Further, a heat conductive member is used as the material of the first heat radiating portion 36a, the second heat radiating portion 36b, and the third heat radiating portion 36c, and for example, aluminum, an aluminum alloy, copper, a copper alloy, or the like is used.

In the above description, it has been explained that the heat radiating portion 36 is attached to the housing 31 by an adhesive. However, the heat radiating portion 36 may be fixed to the housing 31, and this fixing method is not limited to fixing with an adhesive.

That is, for example, a plurality of holes are provided in advance in the heat radiating portion 36, and pins fitted in the plurality of holes are formed in the housing 31 of the cooler 30. Then, the heat radiating portion 36 is fixed to the housing 31 by fitting the pin of the cooler 30 into the hole of the heat radiating portion 36.

Alternatively, the heat radiating portion 36 may be screwed to the housing 31. As a result, the heat radiating portion 36 is fixed to the housing 31. Further, the heat radiating portion 36 may be screwed to the circuit board 10. In this case, the heat radiating unit 36 is screwed to the circuit board 10 so as to sandwich the heating element 20 and the housing 36 between the heat radiating unit 36 and the circuit board 10. As a result, the heat radiating unit 36 is fixed to the housing 31 of the cooler 30. In this case, the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. Therefore, since the heating element 20 is crimped to the circuit board 10 by tightening the screws, it is not necessary to fix the heating element 20 on the first main surface 11 of the circuit board 10 by soldering.

At this time, the screw hole may be provided in the heat radiating portion 36, or the screw hole may be provided in a holding member different from the heat radiating portion 36. When a holding member is used, a heating element 20, a cooler 30, and a heat radiating portion 36 are arranged between the holding member and the circuit board 10. Then, the heating element 20, the cooler 30, and the heat radiating portion 36 are screwed so as to be sandwiched between the holding member and the circuit board 10. As a result, the cooler 30 is fixed to the heating element 20, and the heat radiating portion 36 is fixed to the housing 31 of the cooler 30. In this case, the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. Therefore, since the heating element 20 is crimped to the circuit board 10 by tightening the screws, it is not necessary to fix the heating element 20 on the first main surface 11 of the circuit board 10 by soldering.

Further, a claw formed in advance in the heat radiating portion 36 may be hooked in a hole formed in advance in the circuit board 10. In this case, the claws of the heat radiating unit 36 are hooked in the holes of the circuit board 10 so as to sandwich the heating element 20 and the cooler 30 between the heat radiating unit 36 and the circuit board 10. As a result, the cooler 30 is fixed to the heating element 20, and the heat radiating portion 36 is fixed to the housing 31 of the cooler 30. In this case, the heating element 20 is sandwiched between the cooler 30 and the circuit board 10. Therefore, since the heating element 20 is crimped to the circuit board 10 by tightening the screws, it is not necessary to fix the heating element 20 on the first main surface 11 of the circuit board 10 by soldering.

The blower portion F is provided on one end side (left side of the paper surface of FIGS. 13 and 14) of the housing 31 of the cooler 30. The blower unit F sends wind to a plurality of heat dissipation units 36. As a result, the plurality of heat radiating portions 36 are cooled by the wind sent by the blower portion F.

Here, with reference to FIGS. 13 and 14, the plurality of heat radiating surfaces 33 are arranged along a direction parallel to the heating element mounting surface 32. That is, the first heat radiating surface 33a, the second heat radiating surface 33b, and the third heat radiating surface 33c are arranged along the direction parallel to the heating element mounting surface 32. The distance between the heating element mounting surface 32 and the plurality of heat radiating surfaces 33 is set to be smaller from the windward side to the leeward side of the blower portion F that sends wind to the plurality of heat radiating portions 36.

Here, the thermal design of the electronic device 100B will be described. In the electronic device 100A, as described above, each heat radiating portion 36 is mounted on each heat radiating surface 33. Therefore, the heat dissipation resistance Rt of each of the plurality of heat dissipation surfaces 33 can be set smaller by the amount of the heat dissipation resistance of each of the plurality of heat radiation units 36.

Further, the temperature of the wind sent by the blower portion F is lower on the windward side than on the leeward side. That is, the temperature of the wind sent by the blower portion F is lower on the side of the first heat radiating surface 33a than on the side of the second heat radiating surface 33b. Further, the temperature of the wind sent by the blower portion F is lower on the side of the second heat radiating surface 33b than on the side of the third heat radiating surface 33c. From this, it can be said that the heat radiation resistance Rt of the heat radiation surface 33 on the leeward side is larger than the heat radiation resistance Rt of the heat radiation surface 33 on the leeward side. That is, the heat dissipation resistance Rt increases in the order of the first heat dissipation surface 33a, the second heat dissipation surface 33b, and the third heat dissipation surface 33c from the windward side to the leeward side. The heat radiation resistance Rt1 of the first heat radiation surface 33a is larger than the heat radiation resistance Rt2 of the second heat radiation surface 33b. The heat radiation resistance Rt2 of the second heat radiation surface 33b is larger than the heat radiation resistance Rt3 of the third heat radiation surface 33c.

Therefore, the supply amounts q1, q2, and q3 of the gas phase refrigerant GP-COO to each refrigerant accommodating chamber 34 can be adjusted according to the equation 8.

In this example, the heat dissipation resistance Rt decreases in the order of the heat dissipation resistance Rt1 of the first heat dissipation surface 33a, the heat dissipation resistance Rt2 of the second heat dissipation surface 33b, and the heat dissipation resistance Rt3 of the third heat dissipation surface 33c.

According to Equation 8, for example, when the ratio of Rt1, Rt2, and Rt3 is 3: 2: 1, the ratio of q1, q2, and q3 is adjusted to 2: 3: 6.

In the above description, it has been explained that each of the plurality of heat radiating portions 36 is provided on each of the plurality of heat radiating surfaces 33. On the other hand, the heat radiating portion 36 does not need to be provided on all of the plurality of heat radiating surfaces 33. That is, the heat radiating portion 36 may be provided on at least one of the plurality of heat radiating surfaces 33.

As described above, the cooler 30A and the electronic device 100A according to the second embodiment of the present invention further include one or more heat radiating portions 36. One or more heat radiating portions 36 are provided on at least one of the plurality of heat radiating surfaces 33. Further, one or more heat radiating portions 36 dissipate heat from the heating element 20. In this way, by providing one or more heat radiating portions 36 on at least one of the plurality of heat radiating surfaces 33, the heat of the heating element 20 can be radiated more efficiently.

Further, in the cooler 30A and the electronic device 100A according to the second embodiment of the present invention, the plurality of heat radiating surfaces 33 are arranged along a direction parallel to the heating element mounting surface 32. That is, the first heat radiating surface 33a, the second heat radiating surface 33b, and the third heat radiating surface 33c are arranged along the direction parallel to the heating element mounting surface 32. The distance between the heating element mounting surface 32 and the plurality of heat radiating surfaces 33 is set to be smaller from the windward side to the leeward side of the blower portion F that sends wind to the plurality of heat radiating portions 36. That is, the distance between the second heat radiation surface 33b and the heating element mounting surface 32 is smaller than the distance between the first heat radiation surface 33a and the heating element mounting surface 32. Further, the distance between the third heat radiating surface 33c and the heating element mounting surface 32 is smaller than the distance between the second heat radiating surface 33b and the heating element mounting surface 32.

In this way, by providing a step between the heat radiating surfaces 33 and changing the distance between the heating element mounting surface 32 and the heat radiating surfaces 33, the wind of the blower portion F is leeward to the third heat radiating surface. Due to the difference in heat dissipation resistance between the windward side and the leeward side, the supply amounts q1, q2 and q3 of the gas phase refrigerant GP-COO to each refrigerant storage chamber 34 can be expressed in Equation 8. Therefore, it can be adjusted. When adjusting the supply amounts q1, q2 and q3 of the vapor phase refrigerant GP-COO to each of the refrigerant accommodating chambers 34, for example, the distance between each heat radiation surface 33 and the heating element mounting surface 32 and between each heat radiation surface 33. The height of the step can be adjusted.

<Third embodiment>
The electronic device 100B according to the third embodiment of the present invention will be described with reference to the drawings.

FIG. 15 is a cross-sectional view showing the configuration of the electronic device 100B, and is a view showing a cross section of the A2-A2 cut surface of FIG. FIG. 16 is a front view showing the configuration of the electronic device 100B. FIG. 17 is a top view showing the configuration of the electronic device 100B. FIG. 18 is a cross-sectional view showing the configuration of the electronic device 100B, and is a view showing a cross section of the B2-B2 cut surface of FIG. FIG. 19 is a cross-sectional view showing the configuration of the electronic device 100B, and is a view showing a cross section of the C2-C2 cut surface of FIG. FIG. 20 is a cross-sectional view showing the configuration of the electronic device 100B, and is a view showing a cross section of the D2-D2 cut surface of FIG. FIG. 21 is a cross-sectional view showing the configuration of the electronic device 100B, and is a view showing a cross section of the E2-E2 cut surface of FIG. FIG. 22 is a cross-sectional view showing the configuration of the electronic device 100B, and is a view showing a cross section of the F2-F2 cut surface of FIG. The vertical direction G is shown in FIGS. 15, 16, 21, and 22. Further, in FIGS. 15 to 22, the components equivalent to the components shown in FIGS. 1 to 14 are designated by the same reference numerals as those shown in FIGS. 1 to 14.

With reference to FIGS. 15 to 22, the electronic device 100B includes a circuit board 10, a heating element 20, and a cooler 30B.

The electronic device 100B can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100B can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100B can be configured by omitting the circuit board 10.

Here, the electronic device 100B and the electronic device 100 are compared. The electronic device 100B differs from the electronic device 100 in that the cooler 30B includes a first liquid pipe 38a and a second liquid pipe 38b with reference to FIGS. 15 to 22.

When each of the first liquid pipe 38a and the second liquid pipe 38b is not distinguished, these are collectively referred to as the liquid pipe 38.

Further, in the electronic device 100, one gas phase refrigerant supply port 34 is provided for each of the plurality of refrigerant storage chambers 34. On the other hand, in the electronic device 100B, the gas phase refrigerant supply port that shares the first gas phase refrigerant supply port 35a and the second gas phase refrigerant supply port 35b in addition to the first gas phase refrigerant supply port 35a. As a result, a common gas phase refrigerant supply port 35M is provided. Also in this respect, the electronic device 100B and the electronic device 100 are different from each other.

The first liquid pipe 38a connects the first refrigerant accommodating chamber 34a and the periphery of the heating element 20 of the housing 31. The first liquid pipe 38a causes the liquid phase refrigerant LP-COO accumulated in the bottom portion (the lower surface of the paper surface in FIG. 15) of the first refrigerant storage chamber 34a to flow out to the periphery of the heating element 20 of the housing 31. ..

The second liquid pipe 38b connects the second refrigerant accommodating chamber 34b and the periphery of the heating element 20 of the housing 31. The second liquid pipe 38b causes the liquid phase refrigerant LP-COO accumulated in the bottom portion (the lower surface of the paper surface in FIG. 15) of the second refrigerant storage chamber 34b to flow out to the periphery of the heating element 20 of the housing 31. ..

The shared gas phase refrigerant supply port 35M shares the first gas phase refrigerant supply port 35a and the second gas phase refrigerant supply port 35b. That is, the common vapor phase refrigerant supply port 35M is formed in the housing 31 so as to be connected to both the first refrigerant accommodating chamber 34a and the second refrigerant accommodating chamber 34b, and the gas phase refrigerant on the heating element 20 side. The GP-COO is supplied to both the first refrigerant accommodating chamber 34a and the second refrigerant accommodating chamber 34b.

The configuration of the electronic device 100B has been described above.

Next, the operation of the electronic device 100B will be described.

When the electronic device 100B is activated, power is supplied to the heating element 20 on the circuit board 10. As a result, the heating element 20 generates heat. As described in the first embodiment, the heating element 20 is smaller than the housing 31 of the cooler 30. Therefore, the heat of the heating element 20 is transferred to a part of the housing 31. More specifically, the heat of the heating element 20 is transferred to a part of the heating element mounting surface 32 of the housing 31. As a result, the liquid phase refrigerant LP-COO in the vicinity of the heating element 20 is heated and evaporated by the heat input of the heating element 20, and the phase changes to the gas phase refrigerant GP-COO. Then, bubbles of the gas phase refrigerant GP-COO are generated in the liquid phase refrigerant LP-COO in the vicinity of the heating element 20. The heating element 20 is cooled by the heat of vaporization (latent heat) generated by this phase change.

Further, the first heating element outer surface 21 of the heating element 20 is thermally connected to the heating element mounting surface 32 of the cooling element 30. Therefore, the heat of the heating element 20 is transferred to the housing 31 via the heating element mounting surface 32. As a result, the heating element 20 is cooled.

The gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to.

Here, the portion of the housing 31 that is not in contact with the heating element 20 is cooled by the surrounding air. Therefore, in the housing 31, the temperature of the portion away from the heating element 20 is lower than the temperature around the heating element 20. Further, the pressure inside the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c at a location away from the heating element 20 is lower than the pressure around the heating element 20.

Therefore, the gas phase refrigerant GP-COO around the heating element 20 flows from the side of the heating element 20 toward the side where the temperature and pressure are low. That is, the gas-phase refrigerant GP-COO around the heating element 20 passes through the first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c. It flows into the refrigerant accommodating chamber 34a of No. 1, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c. More specifically, the gas phase refrigerant GP-COO around the heating element 20 enters the first refrigerant accommodating chamber 34a via the common vapor phase refrigerant supply port 35M and the first gas phase refrigerant supply port 35a. Inflow. Further, the vapor phase refrigerant GP-COO around the heating element 20 flows into the second refrigerant accommodating chamber 34b through the common vapor phase refrigerant supply port 35M. Further, the gas phase refrigerant GP-COO around the heating element 20 flows into the third refrigerant accommodating chamber 34c through the third vapor phase refrigerant supply port 35c.

The vapor phase refrigerant GP-COO that has flowed into each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c is the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34a. It is cooled by contacting the inner wall surface of each of the 34b and the third refrigerant accommodating chamber 34c. The heat of the heating element 20 is transferred to the inner wall surfaces of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31 via the vapor phase refrigerant GP-COO. After being transmitted, heat is dissipated to the outside of the housing 31.

Then, the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20 is the inner wall surface of each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. When cooled by contacting with, the phase changes to the liquid phase refrigerant LP-COO again.

The liquid-phase refrigerant LP-COO descends downward in the vertical direction G inside each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. .. The liquid-phase refrigerant LP-COO accumulated at the bottom of the first refrigerant accommodating chamber 34a flows to the periphery of the heating element 20 via the first liquid pipe 38a and is used again for cooling the heating element 20. Similarly, the liquid phase refrigerant LP-COO accumulated at the bottom of the second refrigerant accommodating chamber 34b flows to the periphery of the heating element 20 via the second liquid pipe 38b and is used again for cooling the heating element 20. Further, the liquid phase refrigerant LP-COO accumulated at the bottom of the third refrigerant accommodating chamber 34c flows to the periphery of the heating element 20 via the third vapor phase refrigerant supply port 35c and is used again for cooling the heating element 20. Be done.

As described above, the shared gas phase refrigerant supply port 35M shares the first gas phase refrigerant supply port 35a and the second gas phase refrigerant supply port 35b. At this time, the area of the second vapor phase refrigerant supply port 35b is calculated by subtracting the area of the first refrigerant supply port 35a from the area of the common gas phase refrigerant supply port 35M.

The operation of the electronic device 100B has been described above.

As described above, the cooler 30B and the electronic device 100B according to the third embodiment of the present invention further include a liquid pipe 38. The liquid pipe 38 connects at least one of the plurality of refrigerant storage chambers 34 to the periphery of the heating element 20 in the housing 31. Further, the liquid pipe 38 causes the liquid phase refrigerant LP-COO accumulated in at least one of the plurality of refrigerant accommodating chambers 34 to flow out to the periphery of the heating element 20 in the housing 31.

By providing the liquid pipe 38 in this way, the liquid phase refrigerant LP-COO in each refrigerant accommodating chamber 34 can flow out to the periphery of the heating element 20 more smoothly.

Further, the electronic device 100B according to the second embodiment of the present invention further includes a common gas phase refrigerant supply port 35M. The shared gas phase refrigerant supply port 35M shares a plurality of gas phase refrigerant supply ports 35a and 35b. Thereby, the structure can be simplified as compared with the cooler 30 and the electronic device 100 in the first embodiment.

<Fourth Embodiment>
The electronic device 100C according to the fourth embodiment of the present invention will be described with reference to the drawings.

FIG. 23 is a cross-sectional view showing the configuration of the electronic device 100C, and is a view showing a cross section of the A3-A3 cut surface of FIG. 25. FIG. 24 is a front view showing the configuration of the electronic device 100C. FIG. 25 is a top view showing the configuration of the electronic device 100C. FIG. 26 is a cross-sectional view showing the configuration of the electronic device 100C, and is a view showing a cross section of the B3-B3 cut surface of FIG. 24. FIG. 27 is a cross-sectional view showing the configuration of the electronic device 100C, and is a view showing a cross section of the C3-C3 cut surface of FIG. 24. FIG. 28 is a cross-sectional view showing the configuration of the electronic device 100C, and is a view showing a cross section of the D3-D3 cut surface of FIG. 24. FIG. 29 is a cross-sectional view showing the configuration of the electronic device 100C, and is a view showing a cross section of the E3-E3 cut surface of FIG. 24.

In addition, in FIG. 23, FIG. 24 and FIG. 29, the vertical direction G is shown. Further, in FIGS. 23 to 29, the components equivalent to the components shown in FIGS. 1 to 22 are designated by the same reference numerals as those shown in FIGS. 1 to 22.

With reference to FIGS. 23 to 29, the electronic device 100C includes a circuit board 10, a heating element 20, and a cooler 30C.

The electronic device 100C can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100C can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100C can be configured by omitting the circuit board 10.

Here, the electronic device 100C and the electronic device 100 are compared. With reference to FIGS. 23 to 29, the electronic device 100C differs from the electronic device 100 in that the housing 31C of the cooler 30C includes an opening 39.

Further, in the electronic device 100, one gas phase refrigerant supply port 34 is provided for each of the plurality of refrigerant storage chambers 34. On the other hand, in the electronic device 100B, the gas phase refrigerant supply port that shares the first gas phase refrigerant supply port 35a and the second gas phase refrigerant supply port 35b in addition to the first gas phase refrigerant supply port 35a. As a result, a common gas phase refrigerant supply port 35M is provided. Also in this respect, the electronic device 100B and the electronic device 100 are different from each other. The configuration of the common gas phase refrigerant supply port 35M is the same as that described in the third embodiment.

With reference to FIGS. 23, 28 and 29, the opening 39 is formed in the housing 31C on the side of the heating element mounting surface 32. Further, the opening 39 is attached to the outer peripheral portion of the first heating element outer surface 21 of the heating element 20 so as to seal the refrigerant COO in the housing 31C.

Similar to the contents described in the third embodiment, the shared gas phase refrigerant supply port 35M shares the first gas phase refrigerant supply port 35a and the second gas phase refrigerant supply port 35b. That is, the common vapor phase refrigerant supply port 35M is formed in the housing 31 so as to be connected to both the first refrigerant accommodating chamber 34a and the second refrigerant accommodating chamber 34b, and the gas phase refrigerant on the heating element 20 side. The GP-COO is supplied to both the first refrigerant accommodating chamber 34a and the second refrigerant accommodating chamber 34b.

The configuration of the electronic device 100C has been described above.

Next, the operation of the electronic device 100C will be described.

When the electronic device 100C is activated, power is supplied to the heating element 20 on the circuit board 10. As a result, the heating element 20 generates heat. The heat of the heating element 20 is transferred to the refrigerant COO inside the housing 31C. As a result, the liquid phase refrigerant LP-COO in the vicinity of the heating element 20 is heated and evaporated by the heat input of the heating element 20, and the phase changes to the gas phase refrigerant GP-COO. Then, bubbles of the gas phase refrigerant GP-COO are generated in the liquid phase refrigerant LP-COO in the vicinity of the heating element 20. The heating element 20 is cooled by the heat of vaporization (latent heat) generated by this phase change.

Further, the first heating element outer surface 21 of the heating element 20 is thermally connected to the heating element mounting surface 32 of the cooling element 30. Therefore, the heat of the heating element 20 is transferred to the housing 31 via the heating element mounting surface 32. As a result, the heating element 20 is cooled.

The gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to.

Here, the portion of the housing 31 that is not in contact with the heating element 20 is cooled by the surrounding air. Therefore, in the housing 31, the temperature of the portion away from the heating element 20 is lower than the temperature around the heating element 20. Further, the pressure inside the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c at a location away from the heating element 20 is lower than the pressure around the heating element 20.

Therefore, the gas phase refrigerant GP-COO around the heating element 20 flows from the side of the heating element 20 toward the side where the temperature and pressure are low. That is, the gas-phase refrigerant GP-COO around the heating element 20 passes through the first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c. It flows into the refrigerant accommodating chamber 34a of No. 1, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c. More specifically, the gas phase refrigerant GP-COO around the heating element 20 enters the first refrigerant accommodating chamber 34a via the common vapor phase refrigerant supply port 35M and the first gas phase refrigerant supply port 35a. Inflow. Further, the vapor phase refrigerant GP-COO around the heating element 20 flows into the second refrigerant accommodating chamber 34b through the common vapor phase refrigerant supply port 35M. Further, the gas phase refrigerant GP-COO around the heating element 20 flows into the third refrigerant accommodating chamber 34c through the third vapor phase refrigerant supply port 35c.

The vapor phase refrigerant GP-COO that has flowed into each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c is the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34a. It is cooled by contacting the inner wall surface of each of the 34b and the third refrigerant accommodating chamber 34c. The heat of the heating element 20 is transferred to the inner wall surfaces of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31 via the vapor phase refrigerant GP-COO. After being transmitted, heat is dissipated to the outside of the housing 31.

Then, the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20 is the inner wall surface of each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. When cooled by contacting with, the phase changes to the liquid phase refrigerant LP-COO again.

The liquid-phase refrigerant LP-COO descends downward in the vertical direction G inside each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. .. The liquid-phase refrigerant LP-COO accumulated at the bottom of the first refrigerant accommodating chamber 34a flows to the periphery of the heating element 20 via the first liquid pipe 38a and is used again for cooling the heating element 20. Similarly, the liquid phase refrigerant LP-COO accumulated at the bottom of the second refrigerant accommodating chamber 34b flows to the periphery of the heating element 20 via the second liquid pipe 38b and is used again for cooling the heating element 20. Further, the liquid phase refrigerant LP-COO accumulated at the bottom of the third refrigerant accommodating chamber 34c flows to the periphery of the heating element 20 via the third vapor phase refrigerant supply port 35c and is used again for cooling the heating element 20. Be done.

As described above, the shared gas phase refrigerant supply port 35M shares the first gas phase refrigerant supply port 35a and the second gas phase refrigerant supply port 35b. At this time, the area of the second vapor phase refrigerant supply port 35b is calculated by subtracting the area of the first refrigerant supply port 35a from the area of the common gas phase refrigerant supply port 35M.

The operation of the electronic device 100C has been described above.

As described above, the cooler 30C and the electronic device 100C according to the fourth embodiment of the present invention further include an opening 39. The opening 39 is formed on the side of the heating element mounting surface 32 in the housing 31C. Further, the opening 39 is attached to the outer peripheral portion of the first heating element outer surface 21 of the heating element 20 so as to seal the refrigerant COO in the housing 31C.

By providing the opening 39 in this way, the heat of the heating element 20 can be directly transferred to the refrigerant COO inside the housing 31C. As a result, as compared with the case of the electronic device 100 in the first embodiment, the heat of the heating element 20 is transferred to the refrigerant COO inside the housing 31 via the heating element mounting surface 32 of the housing 31. Therefore, the heat of the heating element 20 can be transferred to the refrigerant COO more efficiently. As a result, the heat of the heating element 20 can be cooled more efficiently.

<Fifth Embodiment>
The electronic device 100D according to the fifth embodiment of the present invention will be described with reference to the drawings.

FIG. 30 is a cross-sectional view showing the configuration of the electronic device 100D, and is a view showing a cross section of the A4-A4 cut surface of FIG. 32. FIG. 31 is a front view showing the configuration of the electronic device 100D. FIG. 32 is a top view showing the configuration of the electronic device 100D. FIG. 33 is a cross-sectional view showing the configuration of the electronic device 100D, and is a view showing a cross section of the B4-B4 cut surface of FIG. 31. FIG. 34 is a cross-sectional view showing the configuration of the electronic device 100D, and is a view showing a cross section of the C4-C4 cut surface of FIG. 31. FIG. 35 is a cross-sectional view showing the configuration of the electronic device 100D, and is a view showing a cross section of the D4-D4 cut surface of FIG. 31. FIG. 36 is a cross-sectional view showing the configuration of the electronic device 100D, and is a view showing a cross section of the E4-E4 cut surface of FIG. 31. FIG. 37 is a cross-sectional view showing the configuration of the electronic device 100D, and is a view showing a cross section of the F4-F4 cut surface of FIG. 32.

The vertical direction G is shown in FIGS. 30, 31 and 37. Further, in FIGS. 30 to 37, the components equivalent to the components shown in FIGS. 1 to 29 are designated by the same reference numerals as those shown in FIGS. 1 to 29.

With reference to FIGS. 30 to 37, the electronic device 100D includes a circuit board 10, a heating element 20, and a cooler 30D.

The electronic device 100D can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100D can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100D can be configured by omitting the circuit board 10.

Here, the electronic device 100D and the electronic device 100B are compared. With reference to FIGS. 15 to 22, in the electronic device 100B, the housing 31B of the cooler 30B is integrally formed. On the other hand, with reference to FIGS. 30 to 37, in the electronic device 100D, the housing 31C of the cooler 30D is composed of a plurality of housings. In this respect they differ from each other.

With reference to FIGS. 30 to 37, the housing 31C is composed of a first housing 31Da, a second housing 31Db, and a third housing 31Dc. More specifically, the first housing 31Da, the second housing 31Db, and the third housing 31Dc are provided so as to be laminated along the vertical direction G. The first housing 31Da is mounted on the second housing 31Db. Further, the second housing 31Db is mounted on the third housing 31Dc. The first housing 31Da, the second housing 31Db, and the third housing 31Dc are attached, for example, by adhesion with an adhesive or screwing.

Here, the configurations of the first housing 31Da, the second housing 31Db, and the third housing 31Dc will be described.

First, the configuration of the first housing 31Da will be described.

FIG. 38 is a cross-sectional view showing the configuration of the first housing 31Da, and is a view showing a cross section of the G1-G1 cut surface of FIG. 40. FIG. 39 is a front view showing the configuration of the first housing 31Da. FIG. 40 is a top view showing the configuration of the first housing 31Da. FIG. 41 is a bottom view showing the configuration of the first housing 31Da, and is a view showing the arrow J1 of FIG. 39. FIG. 42 is a cross-sectional view showing the configuration of the first housing 31Da, and is a view showing a cross section of the H1-H1 cut surface of FIG. 39. FIG. 43 is a cross-sectional view showing the configuration of the first housing 31Da, and is a view showing a cross section of the I1-I1 cut surface of FIG. 40.

With reference to FIGS. 38 to 43, the first housing 31Da has a first heat radiation surface 33a, a first cold refrigerant accommodating chamber 34a, a first gas phase refrigerant supply port 35a, and a first. It is provided with a liquid pipe 38a.

The first heat radiating surface 33a is provided on the upper surface of the first housing 31Da. The first refrigerant accommodating chamber 34a is formed in a hollow shape inside the first housing 31Da. The first gas phase refrigerant supply port 35a is formed so as to open on the lower surface of the first housing 31Da. The first liquid pipe 38a is formed so as to open on the lower surface of the first housing 31Da.

The configuration of the first housing 31Da has been described above.

Next, the configuration of the second housing 31Db will be described.

FIG. 44 is a cross-sectional view showing the configuration of the second housing 31Db, and is a view showing a cross section of the K1-K1 cut surface of FIG. 46. FIG. 45 is a front view showing the configuration of the second housing 31Db. FIG. 46 is a top view showing the configuration of the second housing 31Db. FIG. 47 is a bottom view showing the configuration of the second housing 31Db, and is a view showing the arrow O1 of FIG. 45. FIG. 48 is a cross-sectional view showing the configuration of the second housing 31Db, and is a view showing a cross section of the L1-L1 cut surface of FIG. 45. FIG. 49 is a cross-sectional view showing the configuration of the second housing 31Db, and is a view showing a cross section of the M1-M1 cut surface of FIG. 46.

With reference to FIGS. 44 to 49, the second housing 31Db includes a second heat radiation surface 33b, a second cold refrigerant accommodating chamber 34b, a first gas phase refrigerant supply port 35a, and a second. It includes a gas-phase refrigerant supply port 35b, a common gas-phase refrigerant supply port 35M, a first liquid pipe 38a, and a second liquid pipe 38b.

The second heat radiating surface 33b is provided on the upper surface of the second housing 31Db. The second refrigerant accommodating chamber 34b is formed in a hollow shape inside the second housing 31Db. The first gas phase refrigerant supply port 35a is formed so as to open on the upper surface of the second housing 31Db. The first gas phase refrigerant supply port 35a constitutes a part of the common gas phase refrigerant supply port 35M. The first gas-phase refrigerant supply port 35a is connected to the first gas-phase refrigerant supply port 35a of the first housing 31Da. The second gas phase refrigerant supply port 35b constitutes a part of the common gas phase refrigerant supply port 35M. The common gas phase refrigerant supply port 35M is formed so as to open on the lower surface of the second housing 31Db. The shared gas phase refrigerant supply port 35M is connected to the common gas phase refrigerant supply port 35M of the third housing 31Dc. The first liquid pipe 38a is formed so as to penetrate between the upper surface and the lower surface of the second housing 31Db. The second liquid pipe 38b is formed so as to open the lower surface of the second housing 31Db.

The configuration of the second housing 31Db has been described above.

Next, the configuration of the third housing 31Dc will be described.

FIG. 50 is a cross-sectional view showing the configuration of the third housing 31Dc, and is a view showing a cross section of the P1-P1 cut surface of FIG. 52. FIG. 51 is a front view showing the configuration of the third housing 31Dc. FIG. 52 is a top view showing the configuration of the third housing 31Dc. FIG. 53 is a bottom view showing the configuration of the third housing 31Dc, and is a view showing the arrow S1 of FIG. 51. FIG. 54 is a cross-sectional view showing the configuration of the third housing 31Dc, and is a view showing a cross section of the Q1-Q1 cut surface of FIG. 51. FIG. 55 is a cross-sectional view showing the configuration of the third housing 31Dc, and is a view showing a cross section of the R1-R1 cut surface of FIG. 52.

With reference to FIGS. 50 to 55, the third housing 31Dc includes a third heat radiation surface 33c, a third cold refrigerant accommodating chamber 34c, a shared gas phase refrigerant supply port 35M, and a first liquid. A pipe 38a and a second liquid pipe 38b are provided.

The third heat radiating surface 33c is provided on the upper surface of the third housing 31Dc. The third refrigerant accommodating chamber 34c is formed in a hollow shape inside the third housing 31Dc. The common gas phase refrigerant supply port 35M is formed so as to open on the upper surface of the third housing 31Dc. The shared gas phase refrigerant supply port 35M is connected to the common gas phase refrigerant supply port 35M of the second housing 31Db. The first liquid pipe 38a is formed so as to open the upper surface of the third housing 31Dc. The second liquid pipe 38b is formed so as to open the upper surface of the third housing 31Dc.

The configuration of the third housing 31Dc has been described above.

The configuration of the electronic device 100D has been described above.

Next, the operation of the electronic device 100D will be described. The operation of the electronic device 100D is the same as that of the electronic device 100B.

In the electronic device 100D, the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the second refrigerant accommodating chamber 34a provided in each of the first housing 31Da, the second housing 31Db, and the third housing 31Dc. The cross-sectional area can be adjusted by one or both of the width and height of the inner wall of the refrigerant storage chamber 34c of 3. Then, by adjusting this cross-sectional area, the flow path resistance can be adjusted.

As described above, in the cooler 30D and the electronic device 100D according to the fifth embodiment of the present invention, each of the plurality of refrigerant storage chambers 34 has a plurality of members (first housing 31Da, second housing 31Db, It is formed in a third housing 31Dc). The housing 31D is configured by laminating a plurality of members (first housing 31Da, second housing 31Db, third housing 31Dc).

In this way, by forming the housing 31D with a plurality of members (first housing 31Da, second housing 31Db, third housing 31Dc), the housing 31D having a complicated shape can be cast. It can be easily manufactured without using it.

<Modified example of the fifth embodiment>
The electronic device 100DA of the modified example according to the fifth embodiment of the present invention will be described with reference to the drawings.

FIG. 56 is a cross-sectional view showing the configuration of the electronic device 100DA. FIG. 56 corresponds to FIG. 37, which illustrates the electronic device 100D in the fifth embodiment.

Note that FIG. 56 shows the vertical direction G. Further, in FIG. 56, the components equivalent to the components shown in FIGS. 1 to 55 are designated by the same reference numerals as those shown in FIGS. 1 to 55.

With reference to FIG. 56, the electronic device 100DA includes a circuit board 10, a heating element 20, and a cooler 30DA.

The electronic device 100DA can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100DA can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100DA can be configured by omitting the circuit board 10.

Here, the electronic device 100DA and the electronic device 100D are compared. With reference to FIGS. 37 and 56, the electronic device 100DA differs from the electronic device 100D in that the cooler 30DA further includes a liquid phase refrigerant flow promoter 40.

With reference to FIG. 56, the liquid phase refrigerant flow promoting unit 40 is provided inside the first liquid pipe 38a and the second liquid pipe 38b. The liquid-phase refrigerant flow promoting unit 40 promotes the flow of the liquid-phase refrigerant LP-COO accumulated in at least one of the plurality of refrigerant accommodating chambers 34 to flow out to the periphery of the heating element 20 in the housing 31D. The liquid-phase refrigerant flow promoting unit 40 guides the liquid-phase refrigerant LP-COO accumulated in at least one of the plurality of refrigerant accommodating chambers 34 to the periphery of the heating element 20 in the housing 31D by the capillary phenomenon. The capillary phenomenon is a physical phenomenon in which the liquid inside a thin tubular object (capillary tube) descends in the tube. The porous body is one in which a plurality of fine pores are formed.

The porous body may be composed of, for example, a sintered body or a mesh. A sintered body is an object in which an aggregate of solid powder is solidified, and a plurality of fine pores are formed between the solid powder by bonding the particles of the solid powder. This sintered body is formed by sintering a solid powder inside the first liquid pipe 38a and the second liquid pipe 38b. Sintering refers to heating an aggregate of solid powders at a temperature lower than the melting point of the solid powders to solidify the solid powders. The mesh is formed, for example, by a metal sheet having a mesh.

The configuration of the electronic device 100DA has been described above.

Next, the operation of the electronic device 100DA will be described. The operation of the electronic device 100DA is basically the same as that of the electronic device 100B and the electronic device 100D.

However, it is different from the electronic device 100B and the electronic device 100D in the process in which the liquid phase refrigerant LP-COO accumulated at the bottom of the first refrigerant containing chamber 34a and the second refrigerant containing chamber 34b flows to the periphery of the heating element 20.

That is, the liquid-phase refrigerant LP-COO accumulated at the bottom of the first refrigerant accommodating chamber 34a flows to the periphery of the heating element 20 through the liquid-phase refrigerant flow promoting unit 40 inside the first liquid pipe 38a, and generates heat. It is used again to cool the body 20. Similarly, the liquid-phase refrigerant LP-COO accumulated at the bottom of the second refrigerant accommodating chamber 34b flows to the periphery of the heating element 20 through the liquid-phase refrigerant flow promoting unit 40 inside the second liquid pipe 38b. It will be used again to cool the heating element 20. Further, the liquid phase refrigerant LP-COO accumulated at the bottom of the third refrigerant accommodating chamber 34c flows to the periphery of the heating element 20 via the third vapor phase refrigerant supply port 35c and is used again for cooling the heating element 20. Be done.

The operations other than the above are the same as those of the electronic device 100B and the electronic device 100D.

The operation of the electronic device 100DA has been described above.

As described above, the cooler 30DA and the electronic device 100DA according to the fifth embodiment of the present invention further include the liquid phase refrigerant flow promoting unit 40. The liquid phase refrigerant flow promoting unit 40 is provided inside the liquid pipes (first liquid pipe 38a and second liquid pipe 38b). The liquid-phase refrigerant flow promoting unit 40 promotes the flow of the liquid-phase refrigerant LP-COO accumulated in at least one of the plurality of refrigerant accommodating chambers 34 to flow out to the periphery of the heating element 20 in the housing 31D.

As a result, in the cooler 30DA and the electronic device 100DA, the liquid phase refrigerant LP-COO can be more smoothly discharged to the periphery of the heating element 20 in the housing 31D. As a result, according to the cooler 30DA and the electronic device 100DA, the heating element 20 can be cooled more efficiently.

<Sixth Embodiment>
The electronic device 100E according to the sixth embodiment of the present invention will be described with reference to the drawings.

FIG. 57 is a cross-sectional view showing the configuration of the electronic device 100E, and is a view showing a cross section of the A5-A5 cut surface of FIG. 59. FIG. 58 is a front view showing the configuration of the electronic device 100E. FIG. 59 is a top view showing the configuration of the electronic device 100E. FIG. 60 is a cross-sectional view showing the configuration of the electronic device 100E, and is a view showing a cross section of the B5-B5 cut surface of FIG. 58. FIG. 61 is a cross-sectional view showing the configuration of the electronic device 100E, and is a view showing a cross section of the C5-C5 cut surface of FIG. 58. FIG. 62 is a cross-sectional view showing the configuration of the electronic device 100E, and is a view showing a cross section of the D5-D5 cut surface of FIG. 58. FIG. 63 is a cross-sectional view showing the configuration of the electronic device 100E, and is a view showing a cross section of the E5-E5 cut surface of FIG. 58. FIG. 64 is a cross-sectional view showing the configuration of the electronic device 100E, and is a view showing a cross section of the F5-F5 cut surface of FIG. 59. FIG. 65 is a cross-sectional view showing the configuration of the electronic device 100E, and is a view showing a cross section of the Z5-Z5 cut surface of FIG. 58.

In addition, in FIG. 57, FIG. 58, FIG. 63 and FIG. 64, the vertical direction G is shown. Further, in FIGS. 57 to 65, the components equivalent to the components shown in FIGS. 1 to 57 are designated by the same reference numerals as those shown in FIGS. 1 to 57.

With reference to FIGS. 57 to 65, the electronic device 100E includes a circuit board 10, a heating element 20, and a cooler 30E.

The electronic device 100E can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100E can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100E can be configured by omitting the circuit board 10.

Here, the electronic device 100E and the electronic device 100D are compared. With reference to FIGS. 30 to 37, in the electronic device 100D, the two gas-phase refrigerant supply ports (first gas-phase refrigerant supply port 35a and common gas-phase refrigerant supply port 35M) of the housing 31D of the cooler 30D are provided. Not arranged radially. On the other hand, with reference to FIGS. 57 to 65, in the electronic device 100E, the two gas phase refrigerant supply ports (first gas phase refrigerant supply port 35a, shared gas phase) of the housing 31E of the cooler 30E are used. Refrigerant supply ports 35M) are arranged radially. In this respect, the electronic device 100E and the electronic device 100D are different from each other.

In particular, with reference to FIGS. 57, 63 and 65, the center line CL is common to the first gas phase refrigerant supply port 35a and the common gas phase refrigerant supply port 35M. The common gas-phase refrigerant supply port 35M is arranged outside the first gas-phase refrigerant supply port 35a so as to surround the first gas-phase refrigerant supply port 35a. Here, the common gas-phase refrigerant supply port 35M shares the first gas-phase refrigerant supply port 35a and the second gas-phase refrigerant supply port 35b. With reference to FIGS. 57 and 63, a second gas phase refrigerant supply port 35b is configured between the inside of the common gas phase refrigerant supply port 35M and the first gas phase refrigerant supply port 35a.

The housing 31E is composed of a first housing 31Ea, a second housing 31Eb, and a third housing 31Ec. More specifically, the first housing 31Ea, the second housing 31Eb, and the third housing 31Ec are provided so as to be laminated along the vertical direction G. The first housing 31Ea is mounted on the second housing 31Eb. Further, the second housing 31Eb is mounted on the third housing 31Ec. The first housing 31Ea, the second housing 31Eb, and the third housing 31Ec are attached by, for example, bonding with an adhesive or screwing.

Here, the configurations of the first housing 31Ea, the second housing 31Eb, and the third housing 31Ec will be described.

First, the configuration of the first housing 31Ea will be described.

FIG. 66 is a cross-sectional view showing the configuration of the first housing 31Ea, and is a view showing a cross section of the G5-G5 cut surface of FIG. 68. FIG. 67 is a front view showing the configuration of the first housing 31Ea. FIG. 68 is a top view showing the configuration of the first housing 31Ea. FIG. 69 is a bottom view showing the configuration of the first housing 31Ea, and is a view showing the arrow J5 of FIG. 67. FIG. 70 is a cross-sectional view showing the configuration of the first housing 31Ea, and is a view showing a cross section of the H5-H5 cut surface of FIG. 67. FIG. 71 is a cross-sectional view showing the configuration of the first housing 31Ea, and is a view showing a cross section of the I5-I5 cut surface of FIG. 68.

With reference to FIGS. 66 to 71, the first housing 31Ea includes a first heat radiation surface 33a, a first cold refrigerant accommodating chamber 34a, a first gas phase refrigerant supply port 35a, and a first. It is provided with a liquid pipe 38a.

The first heat radiating surface 33a is provided on the upper surface of the first housing 31Ea. The first refrigerant accommodating chamber 34a is formed in a hollow shape inside the first housing 31Ea. The first gas phase refrigerant supply port 35a is formed so as to open on the lower surface of the first housing 31Ea. The first liquid pipe 38a is formed so as to open on the lower surface of the first housing 31Ea.

The configuration of the first housing 31Ea has been described above.

Next, the configuration of the second housing 31Eb will be described.

FIG. 72 is a cross-sectional view showing the configuration of the second housing 31Eb, and is a view showing a cross section of the K5-K5 cut surface of FIG. 74. FIG. 73 is a front view showing the configuration of the second housing 31Eb. FIG. 74 is a top view showing the configuration of the second housing 31Eb. FIG. 75 is a bottom view showing the configuration of the second housing 31Eb, and is a view showing the arrow O5 of FIG. 73. FIG. 76 is a cross-sectional view showing the configuration of the second housing 31Eb, and is a view showing a cross section of the L5-L5 cut surface of FIG. 73. FIG. 77 is a cross-sectional view showing the configuration of the second housing 31Eb, and is a view showing a cross section of the M5-M5 cut surface of FIG. 74.

With reference to FIGS. 72 to 77, the second housing 31Eb includes a second heat radiating surface 33b, a second cold refrigerant accommodating chamber 34b, a shared gas phase refrigerant supply port 35M, and a first liquid. It includes a pipe 38a, a second liquid pipe 38b, and an opening 41.

The second heat radiating surface 33b is provided on the upper surface of the second housing 31Eb. The second refrigerant accommodating chamber 34b is formed in a hollow shape inside the second housing 31Eb. The common gas phase refrigerant supply port 35M is formed so as to open on the lower surface of the second housing 31Eb. A first gas phase refrigerant supply port 35a is inserted inside the opening 41. With reference to FIG. 57, a first gas phase refrigerant supply port 35a formed in the third housing 31Dc is arranged inside the common gas phase refrigerant supply port 35M. The first liquid pipe 38a is formed so as to penetrate between the upper surface and the lower surface of the second housing 31Eb. The second liquid pipe 38b is formed so as to open the lower surface of the second housing 31Eb.

The configuration of the second housing 31Eb has been described above.

Next, the configuration of the third housing 31Ec will be described.

FIG. 78 is a cross-sectional view showing the configuration of the third housing 31Ec, and is a view showing a cross section of the P5-P5 cut surface of FIG. 80. FIG. 79 is a front view showing the configuration of the third housing 31Ec. FIG. 80 is a top view showing the configuration of the third housing 31Ec. FIG. 81 is a cross-sectional view showing the configuration of the third housing 31Ec, and is a view showing a cross section of the Q5-Q5 cut surface of FIG. 79. FIG. 82 is a cross-sectional view showing the configuration of the third housing 31Ec, and is a view showing a cross section of the R5-R5 cut surface of FIG. 80.

With reference to FIGS. 78 to 82, the third housing 31Ec has a third heat radiation surface 33c, a third cold refrigerant accommodating chamber 34c, a third gas phase refrigerant supply port 35c, and a first. It includes a liquid pipe 38a, a second liquid pipe 38b, and an opening 42.

The third heat radiating surface 33c is provided on the upper surface of the third housing 31Ec. The third refrigerant accommodating chamber 34c is formed in a hollow shape inside the third housing 31Ec. A common gas phase refrigerant supply port 35M is inserted inside the opening 42. The first liquid pipe 38a is formed so as to open the upper surface of the third housing 31Ec. The second liquid pipe 38b is formed so as to open the upper surface of the third housing 31Ec.

The configuration of the third housing 31Ec has been described above.

The configuration of the electronic device 100E has been described above.

Next, the operation of the electronic device 100E will be described.

When the electronic device 100E is activated, power is supplied to the heating element 20 on the circuit board 10. As a result, the heating element 20 generates heat. As described in the first embodiment, the heating element 20 is smaller than the housing 31 of the cooler 30. Therefore, the heat of the heating element 20 is transferred to a part of the housing 31. More specifically, the heat of the heating element 20 is transferred to a part of the heating element mounting surface 32 of the housing 31. As a result, the liquid phase refrigerant LP-COO in the vicinity of the heating element 20 is heated and evaporated by the heat input of the heating element 20, and the phase changes to the gas phase refrigerant GP-COO. Then, bubbles of the gas phase refrigerant GP-COO are generated in the liquid phase refrigerant LP-COO in the vicinity of the heating element 20. The heating element 20 is cooled by the heat of vaporization (latent heat) generated by this phase change.

Further, the first heating element outer surface 21 of the heating element 20 is thermally connected to the heating element mounting surface 32 of the cooling element 30. Therefore, the heat of the heating element 20 is transferred to the housing 31 via the heating element mounting surface 32. As a result, the heating element 20 is cooled.

The gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to.

Here, the portion of the housing 31 that is not in contact with the heating element 20 is cooled by the surrounding air. Therefore, in the housing 31, the temperature of the portion away from the heating element 20 is lower than the temperature around the heating element 20. Further, the pressure inside the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c at a location away from the heating element 20 is lower than the pressure around the heating element 20.

Therefore, the gas phase refrigerant GP-COO around the heating element 20 flows from the side of the heating element 20 toward the side where the temperature and pressure are low. That is, the gas-phase refrigerant GP-COO around the heating element 20 passes through the first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c. It flows into the refrigerant accommodating chamber 34a of No. 1, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c.

More specifically, the vapor phase refrigerant GP-COO around the heating element 20 flows into the first refrigerant accommodating chamber 34a through the first vapor phase refrigerant supply port 35a. Further, the gas phase refrigerant GP-COO around the heating element 20 is provided between the inner wall of the common gas phase refrigerant supply port 35M and the outer wall of the first gas phase refrigerant supply port 35a. It flows into the second refrigerant accommodating chamber 34b through the refrigerant supply port 35b. Further, the gas phase refrigerant GP-COO around the heating element 20 flows into the third refrigerant accommodating chamber 34c through the third vapor phase refrigerant supply port 35c.

The vapor phase refrigerant GP-COO that has flowed into each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c is the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34a. It is cooled by contacting the inner wall surface of each of the 34b and the third refrigerant accommodating chamber 34c. The heat of the heating element 20 is transferred to the inner wall surfaces of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31 via the vapor phase refrigerant GP-COO. After being transmitted, heat is dissipated to the outside of the housing 31.

Then, the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20 is the inner wall surface of each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. When cooled by contacting with, the phase changes to the liquid phase refrigerant LP-COO again.

The liquid-phase refrigerant LP-COO descends downward in the vertical direction G inside each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. .. The liquid-phase refrigerant LP-COO accumulated at the bottom of the first refrigerant accommodating chamber 34a flows to the periphery of the heating element 20 via the first liquid pipe 38a and is used again for cooling the heating element 20. Similarly, the liquid phase refrigerant LP-COO accumulated at the bottom of the second refrigerant accommodating chamber 34b flows to the periphery of the heating element 20 via the second liquid pipe 38b and is used again for cooling the heating element 20. Further, the liquid phase refrigerant LP-COO accumulated at the bottom of the third refrigerant accommodating chamber 34c flows to the periphery of the heating element 20 via the third vapor phase refrigerant supply port 35c and is used again for cooling the heating element 20. Be done.

As described above, the shared gas phase refrigerant supply port 35M shares the first gas phase refrigerant supply port 35a and the second gas phase refrigerant supply port 35b. At this time, the area of the second vapor phase refrigerant supply port 35b is calculated by subtracting the area of the first refrigerant supply port 35a from the area of the common gas phase refrigerant supply port 35M.

The operation of the electronic device 100E has been described above.

In the electronic device 100E, the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the second refrigerant accommodating chamber 34a provided in each of the first housing 31Ea, the second housing 31Eb, and the third housing 31Ec. The cross-sectional area can be adjusted by one or both of the width and height of the inner wall of the refrigerant storage chamber 34c of 3. Then, by adjusting this cross-sectional area, the flow path resistance can be adjusted.

As described above, in the cooler 30E and the electronic device 100E according to the sixth embodiment of the present invention, each of the plurality of refrigerant storage chambers 34 has a plurality of members (first housing 31Ea, second housing 31Eb, It is formed in the third housing 31Ec). The housing 31E is configured by laminating a plurality of members (first housing 31Ea, second housing 31Eb, third housing 31Ec).

In this way, by forming the housing 31E with a plurality of members (first housing 31Ea, second housing 31Eb, third housing 31Ec), the housing 31E having a complicated shape can be cast. It can be easily manufactured without using it.

Further, in the cooler 30E and the electronic device 100E according to the sixth embodiment of the present invention, when viewed in the direction perpendicular to the heating element mounting surface 32, the plurality of gas phase refrigerant supply ports 35 sequentially radiate. It is arranged so that it spreads out.

As a result, at the time of manufacturing the cooler 30E and the electronic device 100E, the gas phase refrigerant supply port 35 having a smaller mouth size is simply assembled in accordance with the gas phase refrigerant supply port 35 having a larger mouth size. Therefore, the cooler 30E and the electronic device 100E can be manufactured more easily.

<First modification of the sixth embodiment>
The electronic device 100F, which is a first modification of the electronic device according to the sixth embodiment of the present invention, will be described with reference to the drawings.

FIG. 83 is a cross-sectional view showing the configuration of the electronic device 100F. FIG. 83 is a cross-sectional view corresponding to FIG. 63.

Note that FIG. 83 shows the vertical direction G. Further, in FIG. 83, the components equivalent to the components shown in FIGS. 1 to 82 are designated by the same reference numerals as those shown in FIGS. 1 to 82.

With reference to FIG. 83, the electronic device 100F includes a circuit board 10, a heating element 20, and a cooler 30F.

The electronic device 100F can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100F can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100F can be configured by omitting the circuit board 10.

Here, the electronic device 100F and the electronic device 100E are compared. With reference to FIG. 63, in the electronic device 100E, the first gas phase refrigerant supply port 35a and the common gas phase refrigerant supply port 35M are formed in a tubular shape. On the other hand, with reference to FIG. 83, in the electronic device 100F, the first gas phase refrigerant supply port 35a and the common gas phase refrigerant supply port 35M are not formed in a tubular shape. In this respect, the electronic device 100F and the electronic device 100E are different from each other.

The housing 31F is composed of a first housing 31Fa, a second housing 31Fb, and a third housing 31Fc. More specifically, the first housing 31Fa, the second housing 31Fb, and the third housing 31Fc are provided so as to be laminated along the vertical direction G. The first housing 31Fa is mounted on the second housing 31Fb. Further, the second housing 31Fb is mounted on the third housing 31Fc. The first housing 31Fa, the second housing 31Fb, and the third housing 31Fc are attached to each other by, for example, bonding with an adhesive or screwing.

The configuration of the electronic device 100F has been described above.

Next, the operation of the electronic device 100F will be described. The operation of the electronic device 100F is the same as that of the electronic device E. The operation of the electronic device 100F has been described above.

In the electronic device 100F, the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the second refrigerant accommodating chamber 34a provided in each of the first housing 31Fa, the second housing 31Fb, and the third housing 31Fc are provided. The cross-sectional area can be adjusted by one or both of the width and height of the inner wall of the refrigerant storage chamber 34c of 3. Then, by adjusting this cross-sectional area, the flow path resistance can be adjusted.

As described above, in the electronic device 100F which is the first modification of the electronic device according to the sixth embodiment of the present invention, each of the plurality of refrigerant storage chambers 34 has a plurality of members (first housing 31Fa, first housing 31Fa, first). It is formed in the second housing 31Fb and the third housing 31Fc). The housing 31F is configured by laminating a plurality of members (first housing 31Fa, second housing 31Fb, third housing 31Fc).

In this way, by forming the housing 31F with a plurality of members (first housing 31Fa, second housing 31Fb, third housing 31Fc), the housing 31F having a complicated shape can be cast. It can be easily manufactured without using it. Similarly, as for the cooler 30F, the housing 31F having a complicated shape can be easily manufactured without using casting.

Further, in the electronic device 100F which is the first modification of the electronic device according to the sixth embodiment of the present invention, when viewed in the direction perpendicular to the heating element mounting surface 32, a plurality of gas phase refrigerant supply ports 35 However, they are arranged so as to spread radially.

As a result, at the time of manufacturing the electronic device 100F, the gas phase refrigerant supply port 35 having a smaller mouth size can be simply assembled in accordance with the gas phase refrigerant supply port 35 having a larger mouth size. The electronic device 100F can be manufactured more easily. Similarly, as for the cooler 30F, the housing 31F having a complicated shape can be easily manufactured without using casting.

Further, in the cooler 30E and the electronic device 100F, the gas phase refrigerant supply port 35 is not formed in a tubular shape unlike the electronic device 100E, so that the configuration of the gas phase refrigerant supply port 35 can be further simplified.

<Second variant of the sixth embodiment>
The electronic device 100G, which is a second modification of the electronic device according to the sixth embodiment of the present invention, will be described with reference to the drawings.

FIG. 84 is a cross-sectional view showing the configuration of the electronic device 100G. FIG. 84 is a cross-sectional view corresponding to FIG. 63.

Note that FIG. 84 shows the vertical direction G. Further, in FIG. 84, the components equivalent to the components shown in FIGS. 1 to 83 are designated by the same reference numerals as those shown in FIGS. 1 to 83.

With reference to FIG. 83, the electronic device 100G includes a circuit board 10, a heating element 20, and a cooler 30G.

The electronic device 100G can be attached to the storage rack 200 in the same manner as the electronic device 100. The electronic device 100G can be used, for example, in an electronic module incorporated in a communication device, a server, or the like. Here, the circuit board 10 is not an essential configuration in the present embodiment. That is, the electronic device 100G can be configured by omitting the circuit board 10.

Here, the electronic device 100G and the electronic device 100F are compared. With reference to FIG. 83, in the electronic device 100F, the first main surface 11 of the circuit board 10 is provided so as to extend in the direction perpendicular to the vertical direction G. On the other hand, with reference to FIG. 84, in the electronic device 100G, the first main surface 11 of the circuit board 10 is provided so as to extend along the vertical direction G. In this respect, the electronic device 100G and the electronic device 100F are different from each other.

Further, referring to FIG. 83, in the electronic device 100F, the heating element mounting surface 32 is provided so as to extend in the direction perpendicular to the vertical direction G. On the other hand, referring to FIG. 84, in the electronic device 100G, the heating element mounting surface 32 is provided so as to extend along the vertical direction G. In this respect, the electronic device 100G and the electronic device 100F are different from each other.

Further, referring to FIG. 83, in the electronic device 100F, the center lines of the first gas phase refrigerant supply port 35a and the common gas phase refrigerant supply port 35M are set so as to overlap each other. On the other hand, with reference to FIG. 84, in the electronic device 100F, the center lines of the first gas phase refrigerant supply port 35a and the common gas phase refrigerant supply port 35M are set to be different from each other. That is, in the electronic device 100F, when the heating element mounting surface 32 is arranged along the vertical direction G, the centers of the plurality of gas phase refrigerant supply ports 35 move in the vertical direction G as the distance from the heating element mounting surface 32 increases. It is set sequentially so that it is located above. Specifically, in the electronic device 100F, the distance between the first gas phase refrigerant supply port 35a and the heating element mounting surface 32 is larger than the distance between the common gas phase refrigerant supply port 35M and the heating element mounting surface 32. Is also big. Further, in the electronic device 100F, the center line CLa of the first gas phase refrigerant supply port 35a is provided above the center line CLM of the common gas phase refrigerant supply port 35M in the vertical direction G. In this respect, the electronic device 100F and the electronic device 100E are different from each other.

Further, referring to FIG. 84, the electronic device 100G is different from the electronic device 100F in that the liquid phase refrigerant flow promoting unit 40A is provided in the housing 31G of the cooler 30F.

With reference to FIG. 84, the liquid phase refrigerant flow promoting unit 40A generates heat due to adhesion of, for example, an adhesive among the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c. It is attached to the side surface of the body 20. The attachment of the liquid phase refrigerant flow promoting portion 40A is not limited to adhesion by an adhesive or the like, and may be screwed or crimped, for example.

The liquid-phase refrigerant flow promoting unit 40A promotes the flow of the liquid-phase refrigerant LP-COO accumulated in at least one of the plurality of refrigerant accommodating chambers 34 to flow out to the periphery of the heating element 20 in the housing 31D. The liquid-phase refrigerant flow promoting unit 40A guides the liquid-phase refrigerant LP-COO accumulated in at least one of the plurality of refrigerant accommodating chambers 34 to the periphery of the heating element 20 in the housing 31G by the capillary phenomenon. The capillary phenomenon and the porous body are as described above.

The housing 31G is composed of a first housing 31Ga, a second housing 31Gb, and a third housing 31Gc. More specifically, the first housing 31Ga, the second housing 31Gb, and the third housing 31Gc are provided so as to be laminated along the vertical direction G. The first housing 31Ga is mounted on the second housing 31Gb. Further, the second housing 31Gb is mounted on the third housing 31Gc. The first housing 31Ga, the second housing 31Gb, and the third housing 31Gc are attached, for example, by adhesion with an adhesive or screwing.

The configuration of the electronic device 100G has been described above.

Next, the operation of the electronic device 100G will be described.

When the electronic device 100G is activated, power is supplied to the heating element 20 on the circuit board 10. As a result, the heating element 20 generates heat. As described in the first embodiment, the heating element 20 is smaller than the housing 31 of the cooler 30. Therefore, the heat of the heating element 20 is transferred to a part of the housing 31. More specifically, the heat of the heating element 20 is transferred to a part of the heating element mounting surface 32 of the housing 31. As a result, the liquid phase refrigerant LP-COO in the vicinity of the heating element 20 is heated and evaporated by the heat input of the heating element 20, and the phase changes to the gas phase refrigerant GP-COO. Then, bubbles of the gas phase refrigerant GP-COO are generated in the liquid phase refrigerant LP-COO in the vicinity of the heating element 20. The heating element 20 is cooled by the heat of vaporization (latent heat) generated by this phase change.

Further, the first heating element outer surface 21 of the heating element 20 is thermally connected to the heating element mounting surface 32 of the cooling element 30. Therefore, the heat of the heating element 20 is transferred to the housing 31 via the heating element mounting surface 32. As a result, the heating element 20 is cooled.

The gas-phase refrigerant GP-COO rises in the liquid-phase refrigerant LP-COO in the housing 30 upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further above the vertical direction G. Ascend to.

Here, the portion of the housing 31 that is not in contact with the heating element 20 is cooled by the surrounding air. Therefore, in the housing 31, the temperature of the portion away from the heating element 20 is lower than the temperature around the heating element 20. Further, the pressure inside the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c at a location away from the heating element 20 is lower than the pressure around the heating element 20.

Therefore, the gas phase refrigerant GP-COO around the heating element 20 flows from the side of the heating element 20 toward the side where the temperature and pressure are low. That is, the gas-phase refrigerant GP-COO around the heating element 20 passes through the first gas-phase refrigerant supply port 35a, the second gas-phase refrigerant supply port 35b, and the third gas-phase refrigerant supply port 35c. It flows into the refrigerant accommodating chamber 34a of No. 1, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c.

More specifically, the gas phase refrigerant GP-COO around the heating element 20 enters the first refrigerant accommodating chamber 34a via the common vapor phase refrigerant supply port 35M and the first gas phase refrigerant supply port 35a. Inflow. Further, the vapor phase refrigerant GP-COO around the heating element 20 flows into the second refrigerant accommodating chamber 34b through the common vapor phase refrigerant supply port 35M. Further, the gas phase refrigerant GP-COO around the heating element 20 flows into the third refrigerant accommodating chamber 34c through the third vapor phase refrigerant supply port 35c.

At this time, referring to FIG. 84, in the electronic device 100F, the center line CLa of the first gas phase refrigerant supply port 35a is in the vertical direction G from the center line CLM of the common gas phase refrigerant supply port 35M. It is provided above. Therefore, a common gas-phase refrigerant supply is compared with the case where the center line CLA of the first gas-phase refrigerant supply port 35a and the center line CLM of the common gas-phase refrigerant supply port 35M are set to overlap each other. The gas-phase refrigerant GP-COO that has passed through the port 35M can be smoothly flowed into the first gas-phase refrigerant supply port 35a.

The vapor phase refrigerant GP-COO that has flowed into each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c is the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34a. It is cooled by contacting the inner wall surface of each of the 34b and the third refrigerant accommodating chamber 34c. The heat of the heating element 20 is transferred to the inner wall surfaces of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31 via the vapor phase refrigerant GP-COO. After being transmitted, heat is dissipated to the outside of the housing 31.

Then, the vapor phase refrigerant GP-COO boiled by the heat of the heating element 20 is the inner wall surface of each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. When cooled by contacting with, the phase changes to the liquid phase refrigerant LP-COO again.

The liquid-phase refrigerant LP-COO descends downward in the vertical direction G inside each of the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the third refrigerant accommodating chamber 34c of the housing 31. .. The liquid-phase refrigerant LP-COO accumulated at the bottom of the first refrigerant accommodating chamber 34a flows to the periphery of the heating element 20 via the liquid-phase refrigerant flow promoting unit 40A, and is used again for cooling the heating element 20. Similarly, the liquid-phase refrigerant LP-COO accumulated at the bottom of the second refrigerant accommodating chamber 34b flows to the periphery of the heating element 20 via the liquid-phase refrigerant flow promoting unit 40A, and is used again for cooling the heating element 20. .. Further, the liquid-phase refrigerant LP-COO accumulated in the bottom of the third refrigerant accommodating chamber 34c flows to the periphery of the heating element 20 via the liquid-phase refrigerant flow promoting unit 40A, and is used again for cooling the heating element 20.

The operation of the electronic device 100G has been described above.

In the electronic device 100G, the first refrigerant accommodating chamber 34a, the second refrigerant accommodating chamber 34b, and the second refrigerant accommodating chamber 34a provided in each of the first housing 31Ga, the second housing 31Gb, and the third housing 31Gc. The cross-sectional area can be adjusted by one or both of the width and height of the inner wall of the refrigerant storage chamber 34c of 3. Then, by adjusting this cross-sectional area, the flow path resistance can be adjusted.

Further, attaching the liquid phase refrigerant flow promoting unit 40A to any of the refrigerant accommodating chambers 34 is not limited to this embodiment, and can be applied to all other embodiments.

As described above, in the electronic device 100G which is the second modification of the electronic device according to the sixth embodiment of the present invention, when the heating element mounting surface 32 is arranged along the vertical direction G, a plurality of vapor phases. The center of the refrigerant supply port 35 is sequentially set so as to be located above the vertical direction G as the distance from the heating element mounting surface 32 increases. Specifically, in the electronic device 100F, the distance between the first gas phase refrigerant supply port 35a and the heating element mounting surface 32 is larger than the distance between the common gas phase refrigerant supply port 35M and the heating element mounting surface 32. Is also big. Further, in the electronic device 100F, the center line CLa of the first gas phase refrigerant supply port 35a is provided above the center line CLM of the common gas phase refrigerant supply port 35M in the vertical direction G.

As a result, in the electronic device 100G, the gas phase refrigerant GP-COO is directed upward in the vertical direction G, as compared with the case where the center lines of the plurality of gas phase refrigerant supply ports 35 are set to overlap each other. It is possible to pass through each gas phase refrigerant supply port 35 more smoothly. More specifically, as compared with the case where the center line CLa of the first gas phase refrigerant supply port 35a and the center line CLM of the common gas phase refrigerant supply port 35M are set to overlap each other, a common air is used. The gas phase refrigerant GP-COO that has passed through the phase refrigerant supply port 35M can be smoothly flowed into the first gas phase refrigerant supply port 35a. Similarly, the cooler 30G can smoothly flow the gas phase refrigerant GP-COO that has passed through the common gas phase refrigerant supply port 35M into the first gas phase refrigerant supply port 35a.

Further, in the electronic device 100GF which is a second modification of the electronic device according to the sixth embodiment of the present invention, each of the plurality of refrigerant storage chambers 34 has a plurality of members (first housing 31Ga, second housing 31Ga, second). It is formed in the housing 31Gb and the third housing 31Gc). The housing 31G is configured by laminating a plurality of members (first housing 31Ga, second housing 31Gb, third housing 31Gc).

In this way, by forming the housing 31G with a plurality of members (first housing 31Ga, second housing 31Gb, third housing 31Gc), a housing 31G having a complicated shape can be cast. It can be easily manufactured without using it. Similarly, the cooler 30G can easily manufacture a housing 31G having a complicated shape without using casting.

Further, in the electronic device 100G which is a second modification of the electronic device according to the sixth embodiment of the present invention, when viewed in the direction perpendicular to the heating element mounting surface 32, a plurality of gas phase refrigerant supply ports 35 However, they are arranged so as to spread radially.

As a result, at the time of manufacturing the electronic device 100G, the gas phase refrigerant supply port 35 having a smaller mouth size can be simply assembled in accordance with the gas phase refrigerant supply port 35 having a larger mouth size. The electronic device 100G can be manufactured more easily. Similarly, at the time of manufacturing the cooler 30G, the gas phase refrigerant supply port 35 having a smaller mouth size can be simply assembled in accordance with the gas phase refrigerant supply port 35 having a larger mouth size. The cooler 30G can be manufactured more easily.

Further, in the electronic device 100G, unlike the electronic device 100E, the gas phase refrigerant supply port 35 is not formed in a tubular shape, so that the configuration of the gas phase refrigerant supply port 35 can be further simplified.

In addition, some or all of the above-described embodiments may be described as follows, but are not limited to the following.

Further, the electronic device 100G, which is a second modification of the electronic device according to the sixth embodiment of the present invention, further includes a liquid phase refrigerant flow promoting unit 40A. The liquid-phase refrigerant flow promoting unit 40A promotes the flow of the liquid-phase refrigerant LP-COO accumulated in at least one of the plurality of refrigerant accommodating chambers 34 to flow out to the periphery of the heating element 20 in the housing 31G.

As a result, in the electronic device 100G, the liquid phase refrigerant LP-COO can be more smoothly discharged to the periphery of the heating element 20 in the housing 31G. Similarly, in the cooler 30G, the liquid phase refrigerant LP-COO can be more smoothly discharged to the periphery of the heating element 20 in the housing 31G. As a result, according to the cooler 30G and the electronic device 100G, the heating element 20 can be cooled more efficiently.
(Appendix 1)
A housing that seals a refrigerant that can change phase between a liquid-phase refrigerant and a gas-phase refrigerant,
A heating element mounting surface, which is provided on the housing and is a surface on which the heating element is mounted,
A plurality of heat radiating surfaces provided on the housing and opposite to the heating element mounting surface so as not to overlap each other.
A plurality of heat-dissipating surfaces provided in the housing, formed in a hollow shape between each of the plurality of heat-dissipating surfaces and the heating element mounting surface, for each of the plurality of heat-dissipating surfaces, and to which the vapor-phase refrigerant is supplied. Refrigerant storage room and
A plurality of gas phase refrigerant supply ports provided in the housing, formed in the housing so as to connect to the plurality of refrigerant storage chambers, and supplying the gas phase refrigerant on the heating element side to the plurality of refrigerant storage chambers. ,
Cooler with.
(Appendix 2)
The cooler according to Appendix 1, wherein the supply amount of the gas phase refrigerant to the plurality of refrigerant accommodating chambers is adjusted according to the heat radiation resistance of the plurality of heat radiation surfaces.
(Appendix 3)
The amount of the gas phase refrigerant supplied to the plurality of refrigerant accommodating chambers is the distance between the plurality of heat radiating surfaces and the heating element, and the gas phase refrigerant directed from the heating element side to the plurality of heat radiating surfaces. The cooler according to Appendix 2, which is adjusted based on the cross-sectional area when the housing is cut in a plane perpendicular to the direction of the flow path.
(Appendix 4)
The cross-sectional area is adjusted by either or both of the width and height of the inner walls of the plurality of refrigerant accommodating chambers when the housing is cut along a direction perpendicular to the heating element mounting surface. The cooler according to Appendix 3.
(Appendix 5)
The cooler according to Appendix 3, wherein the cross-sectional area is adjusted by the areas of a plurality of gas phase refrigerant supply ports.
(Appendix 6)
An opening formed in the housing on the side of the heating element mounting surface and attached to the outer peripheral portion of the first heating element outer surface, which is the outer surface of the heating element, so as to seal the refrigerant in the housing. The cooler according to any one of Appendix 1 to 5, further comprising.
(Appendix 7)
Each of the plurality of refrigerant storage chambers is formed into a plurality of members.
The cooler according to any one of Items 1 to 6, wherein the housing is formed by laminating the plurality of members.
(Appendix 8)
The cooler according to any one of Supplementary note 1 to 7, wherein the plurality of gas phase refrigerant supply ports are sequentially arranged so as to spread radially when viewed in a direction perpendicular to the heating element mounting surface. ..
(Appendix 9)
When the heating element mounting surface is arranged along the vertical direction,
The cooler according to Appendix 8, wherein the centers of the plurality of vapor-phase refrigerant supply ports are sequentially set to be located above in the vertical direction as the distance from the heating element mounting surface increases.
(Appendix 10)
The cooler according to any one of Supplementary note 1 to 9, which is provided on at least one of the plurality of heat radiating surfaces and further includes one or more heat radiating portions for radiating heat from the heating element.
(Appendix 11)
The liquid-phase refrigerant that connects at least one of the plurality of refrigerant accommodating chambers and the periphery of the heating element in the housing and collects in at least one of the plurality of refrigerant accommodating chambers is used in the housing. The cooler according to any one of Supplementary note 1 to 10, further comprising a liquid pipe for flowing out to the periphery of the heating element.
(Appendix 12)
Addendums 1 to 11 further include a liquid-phase refrigerant flow promoting unit that promotes the flow of the liquid-phase refrigerant accumulated in at least one of the plurality of refrigerant accommodating chambers to the periphery of the heating element in the housing. Described cooler.
(Appendix 13)
The plurality of heat radiating surfaces are provided along a direction parallel to the heating element mounting surface.
The distance between the heating element mounting surface and the plurality of heat radiating portions is set to be smaller from the windward side to the leeward side of the blower portion that sends wind to the plurality of heat radiating portions. Cooler.
(Appendix 14)
An electronic device including a heating element and a cooler according to any one of Items 1 to 13.

Although the invention of the present application has been described above with reference to the embodiment, the invention of the present application is not limited to the above embodiment. Various changes that can be understood by those skilled in the art can be made within the scope of the present invention in terms of the structure and details of the present invention.

10 Circuit board 11 First main surface 12 Second main surface 13 Connector part 20 Heat generator 21 First heat generator outer surface 30, 30B, 30C, 30D, 30E, 30F, 30G Cooler 31, 31B, 31C, 31D , 31E, 31F, 31G housing 31Da, 31Ea, 31Fa, 31Ga First housing 31Db, 31Eb, 31Fb, 31Gb Second housing 31Dc, 31Ec, 31Fc, 31Gc Third housing 32 Heating element mounting surface 33a 1st heat radiation surface 33b 2nd heat radiation surface 33c 3rd heat radiation surface 34a 1st refrigerant storage room 34b 2nd refrigerant storage room 34c 3rd refrigerant storage room 35a 1st gas phase refrigerant supply port 35b 2nd Gas phase refrigerant supply port 35c Third gas phase refrigerant supply port 35M Shared gas phase refrigerant supply port 36a First heat dissipation part 36b Second heat dissipation part 36c Third heat dissipation part 37 Fin 38a First liquid pipe 38b Second liquid pipe 39 Opening 40, 40A Liquid phase refrigerant flow promoting part 41, 42 Opening 100, 100A, 100B, 100C, 100D, 100E Electronic equipment 100F, 100G Electronic equipment 110 Front cover 200 Storage rack 210 Housing 211 Opening 220 Circuit board 223 Storage rack side connector 1000 Electronic device F Blower

Claims (10)

A housing that seals a refrigerant that can change phase between a liquid-phase refrigerant and a gas-phase refrigerant,
A heating element mounting surface, which is provided on the housing and is a surface on which the heating element is mounted,
A plurality of heat radiating surfaces provided on the housing and opposite to the heating element mounting surface so as not to overlap each other.
A plurality of heat-dissipating surfaces provided in the housing, formed in a hollow shape between each of the plurality of heat-dissipating surfaces and the heating element mounting surface, for each of the plurality of heat-dissipating surfaces, and to which the vapor-phase refrigerant is supplied. Refrigerant storage room and
A plurality of gas phase refrigerant supply ports provided in the housing, formed in the housing so as to connect to the plurality of refrigerant storage chambers, and supplying the gas phase refrigerant on the heating element side to the plurality of refrigerant storage chambers. ,
Cooler with. The cooler according to claim 1, wherein the supply amount of the gas phase refrigerant to the plurality of refrigerant accommodating chambers is adjusted according to the heat radiation resistance of the plurality of heat radiation surfaces. The amount of the gas phase refrigerant supplied to the plurality of refrigerant accommodating chambers is the distance between the plurality of heat radiating surfaces and the heating element, and the gas phase refrigerant directed from the heating element side to the plurality of heat radiating surfaces. The cooler according to claim 2, which is adjusted based on the cross-sectional area when the housing is cut in a plane perpendicular to the direction of the flow path. The cross-sectional area is adjusted by either or both of the width and height of the inner walls of the plurality of refrigerant accommodating chambers when the housing is cut along a direction perpendicular to the heating element mounting surface. The cooler according to claim 3. The cooler according to claim 3, wherein the cross-sectional area is adjusted by the areas of a plurality of gas phase refrigerant supply ports. An opening formed in the housing on the side of the heating element mounting surface and attached to the outer peripheral portion of the first heating element outer surface, which is the outer surface of the heating element, so as to seal the refrigerant in the housing. The cooler according to any one of claims 1 to 5, further comprising. Each of the plurality of refrigerant storage chambers is formed into a plurality of members.
The cooler according to any one of claims 1 to 6, wherein the housing is formed by laminating the plurality of members. The cooling according to any one of claims 1 to 7, wherein the plurality of gas phase refrigerant supply ports are sequentially arranged so as to spread radially when viewed in a direction perpendicular to the heating element mounting surface. vessel. When the heating element mounting surface is arranged along the vertical direction,
The cooler according to claim 8, wherein the centers of the plurality of vapor-phase refrigerant supply ports are sequentially set to be located above in the vertical direction as the distance from the heating element mounting surface increases. An electronic device including a heating element and a cooler according to any one of claims 1 to 9.

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