JP2021037161A - Light module and endoscope - Google Patents

Abstract

To provide a light module that can meet a demand for miniaturization, and to provide an endoscope including the light module.SOLUTION: A light module 7 for irradiating an imaging region by an imaging unit 6 with light includes: an annular mount substrate 70 including a first surface 71 and a second surface 72 with a height difference in a light emission direction between them and disposed so as to surround a periphery of the imaging unit 6; multiple LED bare chips 8 mounted at the first surface 71 located in a lower position with a chip-on-board method; and a connection land 73 provided at the second surface 72 located in a higher position and connected to an upper surface electrodes 8a of the LED bare chips 8 via a wiring material 9.SELECTED DRAWING: Figure 3

Description

The present invention relates to a lighting module and an endoscope including a lighting module.

An endoscope is a medical device that enables observation and treatment of a desired portion by inserting it into the body cavity of a subject. Patent Documents 1 and 2 disclose an endoscope in which an imaging unit that images an observation point and a lighting module that illuminates an imaging area by the imaging unit are incorporated at the tip of an insertion tube inserted into a body cavity. Has been done.

The lighting module is configured by mounting a plurality of LED elements serving as light sources on an annular substrate surrounding the image pickup unit. The LED element is made into an SMD (Surface Mount Device) by packaging the LED bare chip, and is surface-mounted on the substrate.

Japanese Patent No. 5047679 Japanese Patent No. 5078468

In endoscopes, it is necessary to reduce the diameter of the intubation tube in order to reduce the burden on the subject, and it is required to reduce the size of the lighting module incorporated in the tip of the intubation tube. In the endoscopes described in Patent Documents 1 and 2, it is difficult to miniaturize the annular substrate on which the SMD-ized LED element is mounted, and the number of LED elements that can be mounted on the substrate is limited, so that the desired illuminance is obtained. May not be obtained.

An object of the present disclosure is to provide a lighting module capable of meeting the demand for miniaturization and an endoscope equipped with this lighting module.

The lighting module according to the present disclosure is a lighting module that irradiates an imaging region of an imaging unit with light, and includes a first surface and a second surface having a height difference in the light irradiation direction, and surrounds the periphery of the imaging unit. An annular mounting substrate to be arranged, a plurality of LED bare chips mounted on the first surface at a low position by a chip-on-board method, and top electrodes of the LED bare chips provided on the second surface at a high position. It is equipped with a connection land connected via a wiring material.

The second surface is located lower than the upper surface of the LED bare chip.

Further, the first surface and the second surface are annular surfaces arranged with the first surface on the outside and the second surface on the inside, and the LED bare chips and connection lands are arranged side by side in the circumferential direction.

Further, it is provided with a cable connection land located inside the parallel area of the connection land and provided on the second surface.

Further, the endoscope according to the present disclosure is an endoscope in which an imaging unit and a lighting module that irradiates an imaging region of the imaging unit with light are incorporated in a tip portion of an insertion tube. An annular mounting substrate having a first surface and a second surface having a height difference in the irradiation direction and arranged surrounding the periphery of the imaging unit and mounted on the first surface at a low position by a chip-on-board method. A plurality of LED bare chips and a connection land provided on the second surface at a high position and connected to the upper surface electrode of the LED bare chip via a wiring material are provided.

According to the present disclosure, it is possible to provide a lighting module that can meet the demand for miniaturization and an endoscope including the lighting module.

It is an external view of an endoscope. It is an enlarged view of the tip part of an intubation tube. It is a front view of the lighting module which concerns on Embodiment 1. FIG. It is an enlarged cross-sectional view which shows the mounting form of the LED bare chip. It is an enlarged cross-sectional view which shows the comparative example of the mounting form of the LED bare chip. It is explanatory drawing which illustrates the formation mode of a via and a conductive pattern. It is explanatory drawing which illustrates the formation mode of a via and a conductive pattern. It is explanatory drawing which illustrates the formation mode of a via and a conductive pattern. It is a front view of the lighting module which concerns on Embodiment 2. FIG. It is an enlarged sectional view which shows the mounting embodiment of the LED bare chip in the lighting module which concerns on Embodiment 3. FIG.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is an external view of the endoscope. As shown in the figure, the endoscope 1 includes an intubation tube 2, an operation unit 3, a universal tube 4, and a connector unit 5. The insertion tube 2 is a portion to be inserted into the body cavity, and includes a long soft portion 20 and a tip portion 22 connected to one end of the soft portion 20 via a curved portion 21. The other end of the flexible portion 20 is connected to the operating portion 3 via a cylindrical connecting portion 23. One end of the universal tube 4 is connected to the operation portion 3 and extends in a direction different from that of the insertion tube 2, and the connector portion 5 is continuously provided at the other end of the universal tube 4.

The operation unit 3 is provided for being gripped by the user to perform various operations, and includes a curved operation knob 30, a plurality of operation buttons 31, and the like. The bending operation knob 30 is connected to the bending portion 21 by a wire (not shown) passed through the inside of the connecting portion 23 and the flexible portion 20. The curved portion 21 is curved by the operation of the curved operation knob 30, and the direction of the tip portion 22 inserted into the body cavity is changed.

FIG. 2 is an enlarged view of the tip portion 22 of the intubation tube 2, and is shown by breaking the main portion. The tip portion 22 includes a tubular housing 24 that is externally fitted and fixed to one end of the curved portion 21. The other side of the housing 24 is covered with a central objective lens 25 and an annular light distribution lens 26 surrounding the objective lens 25. Inside the housing 24, the image pickup unit 6 is incorporated so as to face the inside of the objective lens 25, and the illumination module 7 is incorporated so as to face the inside of the light distribution lens 26.

The image pickup unit 6 has a known configuration including an image pickup element such as CMOS (Complementary Metal Oxide Semiconductor) and an optical system for forming an image on the image pickup surface of the image pickup element, and has an outer side of the objective lens 25. The inside of the body cavity facing the image is taken. The image pickup unit 6 is known, and in FIG. 2, the outer shape of the lens barrel holding the image pickup device and the optical system is shown in a non-cross section. The illumination module 7 has a configuration described later, and irradiates the imaging region of the imaging unit 6 with light through the light distribution lens 26. The imaging by the imaging unit 6 is performed under illumination by the illumination module 7.

The connector portion 5 includes an electric connector 50. The endoscope 1 is used by being connected to a processor device (not shown) and a power source by inserting an electric connector 50. The electric connector 50 is connected to the operation unit 3 by a cable passing through the inside of the universal tube 4, and further, the imaging unit 6 and the imaging unit 6 incorporated in the tip portion 22 by a cable passing through the inside of the universal tube 4 and the insertion tube 2. It is connected to the lighting module 7.

The imaging unit 6 and the lighting module 7 perform imaging and lighting operations in response to the operation of the operation unit 3. The image captured by the imaging unit 6 obtained under illumination by the illumination module 7 is sent to a processor device, subjected to image processing such as gamma correction and interpolation processing, and superimposition processing of various characters and images, and then a predetermined standard. It is displayed on an external monitor as an image conforming to.

FIG. 3 is a front view of the lighting module 7 according to the first embodiment. The lighting module 7 includes a mounting board 70 and a plurality of (16 in the figure) LED bare chips mounted on the mounting board 70, and surrounds the imaging unit 6 shown by a two-dot chain line in FIG. It is arranged so as to surround it. The mounting substrate 70 is a circular annular plate having a through hole 70a through which the imaging unit 6 passes in the center, and includes a first surface 71 on the outer side in the radial direction and a second surface 72 on the inner side in the radial direction.

Further, the mounting substrate 70 includes a notch portion 70b formed by notching one portion of the outer circumference in an arc shape. The notch 70b is provided to secure a space for arranging the forceps channel 10 shown by the alternate long and short dash line in FIG. One end of the forceps channel 10 is open to the end surface of the tip portion 22, and the other end extends through the inside of the curved portion 21, the flexible portion 20, and the connecting portion 23, and the forceps insertion port 28 provided in the operation portion 3 ( (See Fig. 1). The forceps channel 10 is used to project a treatment tool such as a forceps inserted into the forceps insertion port 28 from the tip portion 22 to perform various treatments. Reference numeral 29 denotes a forceps plug that seals the forceps insertion port 28 when not in use.

Further, on one side of the forceps channel 10, an air supply / water supply channel 11 is provided at a position where it does not interfere with the lighting module 7. One end of the air supply / water supply channel 11 shown by the alternate long and short dash line in FIG. 3 is connected to a nozzle that opens to the end surface of the tip portion 22. The air supply / water supply channel 11 extends through the inside of the intubation pipe 2, the operation unit 3 and the universal tube 4, and the other end is an air supply / water supply device via a connection port 51 (see FIG. 1) provided in the connector unit 5. Connected to (not shown). Water or air is sent into the air supply / water supply channel 11 from the air supply / water supply device. This water or air reaches the tip portion 22 through the air supply and water supply passages 11 and is ejected from the nozzle, and is used for cleaning the objective lens 25 and the light distribution lens 26 and the like.

In FIG. 3, the outer shape of the housing 24 of the tip portion 22 is shown by a two-dot chain line. The housing 24 has an elliptical axial cross-sectional shape that includes an imaging unit 6, a lighting module 7, a forceps channel 10, and an air supply and water supply channel 11.

The first surface 71 of the mounting board 70 is an annular surface in which the position of the notch 70b is missing, and the plurality of LED bare chips 8 are mounted on the first surface 71 in substantially equal arrangement in the circumferential direction. .. The second surface 72 is an annular surface located inside the first surface 71 and continuous in the circumferential direction, and the second surface 72 has the same number of connection lands 73 as the LED bare chips 8 of each LED bare chip 8. They are arranged side by side so as to correspond to each mounting position. These connection lands 73 are connected to the upper surface electrode 8a of the corresponding LED bare chip 8 by a wiring material 9. A cable connection land 74 is further provided on the second surface 72. A plurality of cable connection lands 74 are arranged side by side inside the parallel arrangement positions of the connection lands 73.

FIG. 4 is an enlarged cross-sectional view showing a mounting form of the LED bare chip 8. The mounting substrate 70 is composed of three annular substrates 701, 702, and 703 laminated one above the other. The outer diameter of the upper substrate 701 is smaller than the outer diameters of the other substrates 702 and 703, the upper surface of the substrate 702 protruding to the outside of the substrate 701 is the first surface 71, and the upper surface of the substrate 701 is the second surface. It becomes the surface 72. There is a height difference corresponding to the thickness of the substrate 701 between the first surface 71 and the second surface 72.

A connecting land 75 having a plane size corresponding to the LED bare chip 8 is formed on the first surface 71 at a low position. The LED bare chip 8 is mounted in a chip-on-board system in which the lower surface is overlapped with the connection land 75 and adhered by a conductive die attach material 80 to ensure electrical continuity between the connection land 75 and the lower surface electrode. Since the LED bare chip 8 is smaller than the SMD-ized LED element, the radial width of the first surface 71 as a mounting surface can be reduced. Further, as shown in FIG. 3, a large number of LED bare chips 8 can be arranged side by side on the narrow first surface 71.

The connection land 73 described above is provided on the second surface 72 at a high position, and the connection land 73 is connected to the upper surface electrode 8a of the LED bare chip 8 mounted on the first surface 71 by a wiring material 9. There is. This connection is realized, for example, by wire bonding using a gold wire. Since the upper surface electrode 8a of the LED bare chip 8 mounted on the first surface 71 is at a substantially same height position as the connection land 73 provided on the second surface 72, the upper surface electrode 8a and the connection land 73 arranged close to each other are located at substantially the same height. As shown in the figure, the connection with the wiring material 9 can be realized without excessively bending the wiring material 9.

FIG. 5 is an enlarged cross-sectional view showing a comparative example of a mounting form of the LED bare chip 8. In this figure, a connection land 73 is provided on the upper surface of the mounting substrate 70 on which the LED bare chip 8 is mounted, and is connected to the upper surface electrode 8a of the LED bare chip 8 via a wiring material 9. In order to keep the degree of bending of the wiring material 9 equivalent to that in FIG. 4 in this mounting mode, it is necessary to provide the connection land 73 at a distance from the mounting position of the LED bare chip 8 as shown in FIG. As is clear from the above, the radial width of the mounting substrate 70 is increased.

In the mounting embodiment shown in FIG. 5, when the connection land 73 is provided with the separation distance from the top electrode 8a equivalent to that in FIG. 4, the strength of the wiring material 9 is reduced due to bending stress, and the wiring is caused by contact with the corner portion of the LED bare chip 8. There is a risk of causing problems such as damage to the material 9 and short circuits.

The connection lands 75 on the first surface 71 and the connection lands 73 on the second surface 72 are formed by the vias 76 formed through the substrates 701 and 702 and the conductive pattern 77 formed on the upper surfaces of the substrates 702 and 703. It is connected to the connection land 74.

6 to 8 are explanatory views illustrating the formation mode of the via 76 and the conductive pattern 77, FIG. 6 is a plan view of the uppermost substrate 701, and FIG. 7 is a plan view of the intermediate substrate 702, FIG. Is a plan view of the bottom substrate 703, in which connection lands 73 and 75, cable connection lands 74 and conductive pattern 77 are hatched and the positions of vias 76 are indicated by small circles. Has been done.

The LED bare chip 8 mounted as described above emits light by applying a voltage between the upper surface electrode 8a connected to the connection land 73 and the lower surface electrode connected to the connection land 75. As shown by the alternate long and short dash line in FIG. 2, the light emitted from the LED bare chip 8 is emitted by spreading inward and outward through the light distribution lens 26, and can illuminate the image pickup region by the image pickup unit 6. As shown in FIG. 4, the second surface 72 provided with the connection land 73 is located lower than the upper surface of the LED bare chip 8. As a result, it is possible to reduce the degree to which the inward light emitted by the LED bare chip 8 is blocked by the presence of the second surface 72.

The mounting positions of the LED bare chips 8 are individually or collectively sealed with a fluorescent material (not shown), and the light emission of the LED bare chips 8 is emitted through the fluorescent material. The color of the illumination light by the illumination module 7 can be selected by the combination of the LED bare chip 8 and the fluorescent material. For example, the combination of the LED bare chip 8 that emits blue light and the yellow fluorescent material obtains white illumination light. Be done.

The lighting module 7 includes a large number of LED bare chips 8 (16 in the figure), and the light emission of each LED bare chip 8 enables illumination with high illuminance. Further, the LED bare chip 8 is mounted on a narrow mounting substrate 70 arranged so as to surround the periphery of the imaging unit 6, and the lighting module 7 can be compactly arranged around the imaging unit 6 and has a tip portion. It is possible to meet the miniaturization demand of 22.

(Embodiment 2)
FIG. 9 is a front view of the lighting module 7 according to the second embodiment. The illustrated lighting module 7 includes an annular mounting substrate 70 and 16 LED bare chips 8 mounted on the mounting substrate 70, similarly to the lighting module 7 according to the first embodiment shown in FIG. There is.

The mounting board 70 includes a first surface 71 on the outer side in the radial direction and a second surface 72 on the outer side in the radial direction. The LED bare chips 8 are mounted on the first surface 71 in a substantially equal arrangement in the circumferential direction, and are connected to the connection land 73 provided on the second surface 72 via the wiring material 9. In the second embodiment, a part of the 16 LED bare chips 8 (4 in the figure) has two upper surface electrodes 8a and 8a on the upper surface shown in FIG. These upper surface electrodes 8a and 8a are connected to separate connection lands 73 and 73 on the second surface 72, and the four LED bare chips 8 emit light when a voltage is applied between the upper surface electrodes 8a and 8a. It is configured as follows.

The other configuration of the lighting module 7 according to the second embodiment is the same as that of the first embodiment shown in FIG. 3, and the corresponding components are designated by the same reference numerals as those in FIG. 3 and the description thereof will be omitted. Also in the second embodiment, a large number of LED bare chips 8 can be mounted on the narrow mounting substrate 70, and it is possible to provide a lighting module 7 capable of illuminating with high illuminance while being compact. The number of LED bare chips 8 having the two top electrodes 8a and 8a is not limited to the four shown in FIG. 9, and may be appropriately set within a range in which the corresponding connection lands 73 can be arranged on the second surface 72. Can be done.

(Embodiment 3)
FIG. 10 is an enlarged cross-sectional view showing a mounting embodiment of the LED bare chip 8 in the lighting module according to the third embodiment. This figure corresponds to FIG. 4 in the first embodiment, in which the LED bare chip 8 is mounted on the first surface 71 of the mounting substrate 70, the connection land 73 is provided on the second surface 72, and the LED bare chip 8 is provided. The upper surface electrode 8a and the connection land 73 are connected via the wiring material 9.

In the third embodiment, the arrangement of the first surface 71 and the second surface 72 is different from that of the first embodiment, and the first surface 71 at a low position is on the inside (the side closer to the imaging unit 6) and is at a high position. The second surface 72 is on the outside. The other configurations in the third embodiment are the same as those in the first embodiment shown in FIG. 4, and the corresponding components are designated by the same reference numerals as those in FIG. 4 and the description thereof will be omitted.

Also in the third embodiment, a large number of LED bare chips 8 can be mounted on the narrow mounting substrate 70, and it is possible to provide a lighting module 7 capable of illuminating with high illuminance while being compact. On the other hand, since the substrate 701 forming the second surface 72 is located outside the LED bare chip 8 mounted on the first surface 71, a part of the outward light emission by the LED bare chip 8 is blocked by the substrate 701. The illumination range may be reduced.

The first surface 71 and the second surface 72 may be arranged side by side in the circumferential direction of the mounting substrate 70. In this case, the LED bare chip 8 and the connection land 73 can be arranged on the same circumference, and the radial width of the mounting substrate 70 can be further reduced, while the number of LED bare chips 8 that can be mounted is limited, and the illumination light. There is a risk that the illuminance of the LED will decrease.

It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is indicated by the scope of claims, not the above-mentioned meaning, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

1 Endoscope 2 Insert tube 6 Imaging unit 7 Lighting module 8 LED bare chip 8a Top electrode 9 Wiring material 22 Tip 70 Mounting board 71 1st surface 72 2nd surface 73 Connection land 74 Cable connection land

Claims (5)

In the lighting module that irradiates the imaging area by the imaging unit with light
An annular mounting substrate having a first surface and a second surface having a height difference in the light irradiation direction and arranged so as to surround the periphery of the imaging unit.
A plurality of LED bare chips mounted on the first surface at a low position by a chip-on-board method,
A lighting module including a connection land provided on the second surface at a high position and connected to a top electrode of the LED bare chip via a wiring material. The lighting module according to claim 1, wherein the second surface is located at a position lower than the upper surface of the LED bare chip. The first surface and the second surface are annular surfaces in which the first surface is on the outside and the second surface is on the inside, and the LED bare chip and the connecting land are arranged side by side in the circumferential direction. Or the lighting module according to claim 2. The lighting module according to claim 3, further comprising a cable connection land located inside the parallel area of the connection land and provided on the second surface. In an endoscope in which an imaging unit and an illumination module that irradiates an imaging region of the imaging unit with light are incorporated in the tip of an intubation tube.
The lighting module
An annular mounting substrate having a first surface and a second surface having a height difference in the light irradiation direction and arranged so as to surround the periphery of the imaging unit.
A plurality of LED bare chips mounted on the first surface at a low position by a chip-on-board method, and a plurality of LED bare chips provided on the second surface at a high position and connected to the upper surface electrodes of the LED bare chips via a wiring material. Endoscope with connecting lands.

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