JP2021032605A

JP2021032605A - Inspection jig and manufacturing method for electronic device

Info

Publication number: JP2021032605A
Application number: JP2019150240A
Authority: JP
Inventors: 篤司岡村; Atsushi Okamura
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2019-08-20
Filing date: 2019-08-20
Publication date: 2021-03-01
Anticipated expiration: 2039-08-20
Also published as: JP7243522B2

Abstract

To provide an inspection jig with which it is possible to reduce the space needed for installing a mechanism to supply air.SOLUTION: The inspection jig comprises: a presser member on which acts a force in order for a pressing surface that presses a semiconductor device to move in a direction toward an inspection device; a guide member for holding the presser member so as to be capable of moving; a drive mechanism for moving the guide member; a first restriction unit provided in the guide member, for restricting the presser member from moving so that the presser member does not move in a direction toward the inspection device; a release member for releasing the restriction of movement of the pressure member by the first restriction unit; and a second restriction unit provided in the guide member, for restricting the pressure member from moving upon bumping against the semiconductor device stuck to the pressing surface so that the semiconductor device does not touch the inspection device.SELECTED DRAWING: Figure 1

Description

本発明は、半導体装置を検査する際に半導体装置を検査装置に押しつける検査治具に関する。また、本発明は、半導体装置である電子デバイスの製造方法に関する。 The present invention relates to an inspection jig that presses a semiconductor device against an inspection device when inspecting the semiconductor device. The present invention also relates to a method for manufacturing an electronic device which is a semiconductor device.

半導体装置の電気特性を検査する際に、半導体装置を検査装置に押しつける検査治具がある。半導体装置を検査装置に押しつけることで、半導体装置の端子と検査装置の評価端子を接触させ、半導体装置の電気特性の検査が行われる。
一方で、半導体装置を検査装置に押しつけると、半導体装置が検査治具に張り付いてしまうことがあり、検査終了後に何等かの手段で半導体装置を検査治具から剥離する必要がある。検査治具から半導体装置を剥離する手段として、検査治具から半導体装置へエアを吹き出すことが考えられる。例えば、下記の特許文献１の検査治具は、検査治具内の空気通路から半導体装置へエアを供給可能であり、半導体装置を剥離することができる。 When inspecting the electrical characteristics of a semiconductor device, there is an inspection jig that presses the semiconductor device against the inspection device. By pressing the semiconductor device against the inspection device, the terminals of the semiconductor device and the evaluation terminals of the inspection device are brought into contact with each other, and the electrical characteristics of the semiconductor device are inspected.
On the other hand, when the semiconductor device is pressed against the inspection device, the semiconductor device may stick to the inspection jig, and it is necessary to peel the semiconductor device from the inspection jig by some means after the inspection is completed. As a means for peeling the semiconductor device from the inspection jig, it is conceivable to blow air from the inspection jig to the semiconductor device. For example, the inspection jig of Patent Document 1 below can supply air to the semiconductor device from the air passage in the inspection jig, and can peel off the semiconductor device.

特開２０００−２４９７７号公報Japanese Unexamined Patent Publication No. 2000-24977

しかし、上記の特許文献１の検査治具は、エアを供給する機構を設置するためのスペースが必要になるという問題があった。また、上記の特許文献１の検査治具を用いて半導体装置である電子デバイスを製造すると、エアを供給する機構を設置するためのスペースが必要となり、限られたスペースでは製造することができないという問題があった。 However, the inspection jig of Patent Document 1 has a problem that a space for installing a mechanism for supplying air is required. Further, when an electronic device which is a semiconductor device is manufactured by using the inspection jig of Patent Document 1 described above, a space for installing a mechanism for supplying air is required, and the manufacturing cannot be performed in a limited space. There was a problem.

本発明は、上記のような課題を解決するためになされたものであり、エアを供給する機構を設置するためのスペースを削減することができる検査治具を提供することを目的とする。また、エアを供給する機構を設置するためのスペースを削減して電子デバイスを製造することが可能な電子デバイスの製造方法を提供することを目的とする。 The present invention has been made to solve the above problems, and an object of the present invention is to provide an inspection jig capable of reducing a space for installing a mechanism for supplying air. Another object of the present invention is to provide a method for manufacturing an electronic device capable of manufacturing an electronic device by reducing the space for installing a mechanism for supplying air.

本発明に係る検査治具は、半導体装置を検査装置に押圧する押圧面を有し、押圧面が検査装置へ向かう方向へ移動するための力が作用している押さえ部材と、検査装置へ向かう方向へ押さえ部材が移動可能なように、押さえ部材を保持するガイド部材と、検査装置から離れる方向へガイド部材を移動させる駆動機構と、ガイド部材に設けられており、駆動機構がガイド部材を移動させた場合に、検査装置へ向かう方向へ押さえ部材が移動しないように、押さえ部材と接触して押さえ部材が移動することを制限する第１の制限部と、第１の制限部が押さえ部材の移動を制限している状態で駆動機構がガイド部材を移動させた場合に、押さえ部材を検査装置に向かって押圧し、第１の制限部による押さえ部材の移動の制限を解除する解除部材と、ガイド部材に設けられており、解除部材が押さえ部材の移動の制限を解除して押さえ部材が検査装置へ向かって移動した場合に、押圧面に張り付いた半導体装置が検査装置に接触しないように、押さえ部材と衝突して押さえ部材が移動することを制限する第２の制限部と、を備えたものである。 The inspection jig according to the present invention has a pressing surface that presses the semiconductor device against the inspection device, and has a pressing member on which a force for moving the pressing surface in the direction toward the inspection device is acting, and a pressing member that faces the inspection device. A guide member for holding the pressing member, a driving mechanism for moving the guide member in a direction away from the inspection device, and a driving mechanism provided on the guide member so that the pressing member can move in the direction, and the driving mechanism moves the guide member. The first limiting portion that restricts the movement of the pressing member in contact with the pressing member so that the pressing member does not move in the direction toward the inspection device when the pressing member is moved, and the first limiting portion of the pressing member When the drive mechanism moves the guide member while the movement is restricted, the pressing member is pressed toward the inspection device to release the restriction on the movement of the pressing member by the first limiting portion, and the release member. It is provided on the guide member so that when the release member releases the restriction on the movement of the pressing member and the pressing member moves toward the inspection device, the semiconductor device attached to the pressing surface does not come into contact with the inspection device. It is provided with a second limiting portion that collides with the pressing member and restricts the movement of the pressing member.

本発明に係る電子デバイスの製造方法は、ウェハを準備する準備ステップと、ウェハに回路を形成する加工ステップと、回路を形成したウェハを切断する切断ステップと、切断されたウェハをパッケージ基板に実装して電子デバイスとする実装ステップと、上記の検査治具における押圧面で、電子デバイスを検査装置に押圧し、検査を行う検査ステップと、検査治具における駆動機構によって、ガイド部材を移動させ、第１の制限部によって押さえ部材の移動を制限する移動制限ステップと、第１の制限部によって押さえ部材の移動が制限された状態で、検査治具における駆動機構によって、ガイド部材を移動させ、解除部材によって第１の制限部による押さえ部材の移動の制限を解除し、第２の制限部によって押さえ部材の移動を制限して、電子デバイスを押圧面から剥離させ、回収する回収ステップと、を備えたものである。 The method for manufacturing an electronic device according to the present invention includes a preparation step for preparing a wafer, a processing step for forming a circuit on the wafer, a cutting step for cutting the wafer on which the circuit is formed, and mounting the cut wafer on a package substrate. The guide member is moved by the mounting step of forming the electronic device, the inspection step of pressing the electronic device against the inspection device with the pressing surface of the inspection jig to perform the inspection, and the drive mechanism of the inspection jig. The guide member is moved and released by the drive mechanism in the inspection jig in a state where the movement of the pressing member is restricted by the first limiting portion and the movement limiting step in which the movement of the pressing member is restricted by the first limiting portion. A collection step is provided in which the member releases the restriction on the movement of the pressing member by the first limiting portion, the movement of the pressing member is restricted by the second limiting portion, the electronic device is peeled off from the pressing surface, and the electronic device is collected. It is a jig.

本発明に係る検査治具では、第１の制限部による移動の制限を解除された押さえ部材が、第２の制限部まで移動して衝突し第２の制限部で再度移動を制限される。第２の制限部で移動を制限された際に、衝突により押さえ部材が停止し、押さえ部材に張り付いた半導体装置には慣性力が作用し、押さえ部材と半導体装置が剥離する。よって、本発明に係る検査治具は、エアを供給する機構を設置せずに、半導体装置を剥離することができ、エアを供給する機構を設置するためのスペースを削減することができる。 In the inspection jig according to the present invention, the pressing member whose movement restriction by the first limiting portion is released moves to the second limiting portion, collides with the holding member, and the movement is restricted again by the second limiting portion. When the movement is restricted by the second limiting portion, the pressing member is stopped due to the collision, an inertial force acts on the semiconductor device attached to the pressing member, and the pressing member and the semiconductor device are separated from each other. Therefore, in the inspection jig according to the present invention, the semiconductor device can be peeled off without installing the mechanism for supplying air, and the space for installing the mechanism for supplying air can be reduced.

また、本発明に係る電子デバイスの製造方法では、上記の検査治具を用いて、電子デバイスの検査を行う。よって、エアを供給する機構を設置せずに、半導体装置を剥離することができ、エアを供給する機構を設置するためのスペースを削減することができる。 Further, in the method for manufacturing an electronic device according to the present invention, the electronic device is inspected by using the above-mentioned inspection jig. Therefore, the semiconductor device can be peeled off without installing the mechanism for supplying air, and the space for installing the mechanism for supplying air can be reduced.

本発明の実施の形態１に係る検査治具の構成を示す斜視図、および、Ｉ−Ｉ断面における断面図である。It is a perspective view which shows the structure of the inspection jig which concerns on Embodiment 1 of this invention, and is the cross-sectional view in the II cross section. 本発明の実施の形態１に係る検査治具を用いて、半導体装置を検査装置に押さえつけてから、半導体装置を検査治具から剥離するまでの様子を示した概略図である。FIG. 5 is a schematic view showing a state from pressing a semiconductor device against an inspection device to peeling the semiconductor device from the inspection jig using the inspection jig according to the first embodiment of the present invention. 本発明の実施の形態２に係る検査治具の断面図である。It is sectional drawing of the inspection jig which concerns on Embodiment 2 of this invention. 本発明の実施の形態３に係る検査治具の断面図である。It is sectional drawing of the inspection jig which concerns on Embodiment 3 of this invention. 本発明の実施の形態４に係る検査治具の断面図である。It is sectional drawing of the inspection jig which concerns on Embodiment 4 of this invention.

以下、本発明の実施の形態について、図を用いて説明する。図中の同一の符号は、同一または相当する部分を表す。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same reference numerals in the drawings represent the same or corresponding parts.

実施の形態１．
本発明の実施の形態１に係る検査治具１の構成について、図１を用いて説明する。図１（ａ）は、本発明の実施の形態１に係る検査治具１で半導体装置１００を検査装置１０１へ押さえつけている様子を示しており、図１（ｂ）は、検査治具１の一部の断面（図１（ａ）のＩ−Ｉ断面）を示している。なお、図１（ａ）では、説明の便宜上、ガイド部材２０の前面を省略してガイド部材２０の内部を示している。
図１（ａ）に示されているように、検査治具１は、半導体装置１００を検査装置１０１に押圧するための押圧面１１を有する押さえ部材１０を備えている。押さえ部材１０は、円形状の押圧面１１と、押圧面１１に接続された側面１２とを有する円筒状の部材である。押圧面１１とは反対側で側面１２は円形状の頂面１３と接続されている。この頂面１３の外周部は側面１２よりせり出しており、押さえ部材１０は、Ｔ字状の断面を有している（図１（ｂ）参照）。
押さえ部材１０の押圧面１１は、半導体装置１００を挟んで検査装置１０１と対向するように配置され、押さえ部材１０が検査装置１０１へ向かう方向へ移動した場合に、半導体装置１００と接触し、半導体装置１００を検査装置１０１に押さえつける（図１（ａ）の状態）。
また、押さえ部材１０の押圧面１１は、ゴム、ウレタン等の軟質系材料または樹脂等の硬質系材料で構成されており、半導体装置１００を強く押圧すると、半導体装置１００が押圧面１１に張り付くことがある。 Embodiment 1.
The configuration of the inspection jig 1 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1A shows a state in which the semiconductor device 100 is pressed against the inspection device 101 by the inspection jig 1 according to the first embodiment of the present invention, and FIG. 1B shows the inspection jig 1 of the inspection jig 1. A part of the cross section (the I-I cross section of FIG. 1A) is shown. In FIG. 1A, for convenience of explanation, the front surface of the guide member 20 is omitted to show the inside of the guide member 20.
As shown in FIG. 1A, the inspection jig 1 includes a pressing member 10 having a pressing surface 11 for pressing the semiconductor device 100 against the inspection device 101. The pressing member 10 is a cylindrical member having a circular pressing surface 11 and a side surface 12 connected to the pressing surface 11. The side surface 12 is connected to the circular top surface 13 on the side opposite to the pressing surface 11. The outer peripheral portion of the top surface 13 protrudes from the side surface 12, and the pressing member 10 has a T-shaped cross section (see FIG. 1 (b)).
The pressing surface 11 of the pressing member 10 is arranged so as to face the inspection device 101 with the semiconductor device 100 interposed therebetween, and when the pressing member 10 moves in the direction toward the inspection device 101, the pressing surface 11 comes into contact with the semiconductor device 100 and becomes a semiconductor. The device 100 is pressed against the inspection device 101 (state of FIG. 1A).
Further, the pressing surface 11 of the pressing member 10 is made of a soft material such as rubber or urethane or a hard material such as resin, and when the semiconductor device 100 is strongly pressed, the semiconductor device 100 sticks to the pressing surface 11. There is.

検査治具１は、図１（ａ）、（ｂ）に示されているように、押さえ部材１０を内部に保持するガイド部材２０を備えている。ガイド部材２０は、円形状の底部２１と、底部２１に接続された側部２２と、底部２１とは反対側で側部２２に接続された円形状の頂部２３とを有する中空の円筒状の部材である。
ガイド部材２０の底部２１には外部と内部とをつなぐ開口が形成され、押さえ部材１０が挿入されており、押さえ部材１０の押圧面１１がガイド部材２０の外部へ突出している。ガイド部材２０の底部２１の開口周辺の部分と押さえ部材１０の側面１２とは、スライド可能に接触している。そのため、押さえ部材１０は、ガイド部材２０の軸方向に沿ってスライド可能であり、そのほかの方向へは移動できないようにガイド部材２０に保持されている。すなわち、押さえ部材１０は、押圧面１１が検査装置１０１へ向かう方向へ移動可能なように、ガイド部材２０に保持されている。また、ガイド部材２０の側部２２の内壁面と押さえ部材１０の頂面１３の外周部もスライド可能に接触している。
また、ガイド部材２０の頂部２３には、外部と内部をつなぐ貫通孔２４が形成されている。この貫通孔２４は、後述する解除部材５０が挿入される孔である。 As shown in FIGS. 1A and 1B, the inspection jig 1 includes a guide member 20 that holds the pressing member 10 inside. The guide member 20 is a hollow cylindrical shape having a circular bottom 21, a side 22 connected to the bottom 21, and a circular top 23 connected to the side 22 on the opposite side of the bottom 21. It is a member.
An opening connecting the outside and the inside is formed in the bottom portion 21 of the guide member 20, and the pressing member 10 is inserted, and the pressing surface 11 of the pressing member 10 projects to the outside of the guide member 20. The portion around the opening of the bottom portion 21 of the guide member 20 and the side surface 12 of the pressing member 10 are in sliding contact with each other. Therefore, the pressing member 10 is slidable along the axial direction of the guide member 20 and is held by the guide member 20 so as not to move in any other direction. That is, the pressing member 10 is held by the guide member 20 so that the pressing surface 11 can move in the direction toward the inspection device 101. Further, the inner wall surface of the side portion 22 of the guide member 20 and the outer peripheral portion of the top surface 13 of the pressing member 10 are also in sliding contact with each other.
Further, a through hole 24 connecting the outside and the inside is formed in the top 23 of the guide member 20. The through hole 24 is a hole into which the release member 50 described later is inserted.

ガイド部材２０の内部において、ガイド部材２０の頂部２３と押さえ部材１０の頂面１３の間には空間が形成されている。この空間には、頂部２３の内壁面に接するように円形状の部材である板材３０が設けられている。板材３０の外周部はガイド部材２０の側部２２の内壁面とスライド可能に接触しており、板材３０は、ガイド部材２０の内部で、ガイド部材２０の軸方向に沿ってスライド可能である。この板材３０と押さえ部材１０の頂面１３の間にはバネ３１が配置されている。バネ３１は、頂面１３と板材３０の間で伸縮可能であり、押圧面１１がガイド部材２０から離れる方向へ移動するように押さえ部材１０を押圧している。すなわち、押さえ部材１０には、押圧面１１が検査装置１０１へ向かう方向へ移動するための力が作用している。図１（ａ）は、押さえ部材１０で半導体装置１００を押さえつけている状態を示しているので、バネ３１は収縮した状態である。
なお、バネ３１に代えて、ゴムなどを利用してもよい。バネ３１およびゴムなどを総称して弾性部材という。 Inside the guide member 20, a space is formed between the top portion 23 of the guide member 20 and the top surface 13 of the pressing member 10. In this space, a plate member 30 which is a circular member is provided so as to be in contact with the inner wall surface of the top portion 23. The outer peripheral portion of the plate member 30 is in sliding contact with the inner wall surface of the side portion 22 of the guide member 20, and the plate member 30 is slidable inside the guide member 20 along the axial direction of the guide member 20. A spring 31 is arranged between the plate member 30 and the top surface 13 of the pressing member 10. The spring 31 is expandable and contractible between the top surface 13 and the plate member 30, and presses the pressing member 10 so that the pressing surface 11 moves away from the guide member 20. That is, a force is applied to the pressing member 10 for the pressing surface 11 to move in the direction toward the inspection device 101. FIG. 1A shows a state in which the semiconductor device 100 is pressed by the pressing member 10, so that the spring 31 is in a contracted state.
Instead of the spring 31, rubber or the like may be used. The spring 31 and rubber are collectively referred to as an elastic member.

検査治具１は、上述のような押さえ部材１０、ガイド部材２０、板材３０およびバネ３１を移動させるための駆動機構４０を備えている。駆動機構４０は、ガイド部材２０の側部２２に接続されており、駆動源からの力をガイド部材２０の底部２１が検査装置１０１へ近接、検査装置１０１から離間する方向の力に変換するものである。すなわち、底部２１が検査装置１０１へ向かう方向へガイド部材２０を移動させ、底部２１が検査装置１０１から離れる方向へガイド部材２０を移動させるものである。ガイド部材２０が移動することに伴って、押さえ部材１０、板材３０およびバネ３１も移動する。
なお、駆動源には、モータやシリンダが用いられるが、検査者が駆動機構を直接操作してもよい。 The inspection jig 1 includes a drive mechanism 40 for moving the pressing member 10, the guide member 20, the plate member 30, and the spring 31 as described above. The drive mechanism 40 is connected to the side portion 22 of the guide member 20, and converts the force from the drive source into a force in the direction in which the bottom portion 21 of the guide member 20 approaches the inspection device 101 and separates from the inspection device 101. Is. That is, the bottom portion 21 moves the guide member 20 in the direction toward the inspection device 101, and the bottom portion 21 moves the guide member 20 in the direction away from the inspection device 101. As the guide member 20 moves, the pressing member 10, the plate member 30, and the spring 31 also move.
A motor or cylinder is used as the drive source, but the inspector may directly operate the drive mechanism.

ガイド部材２０が駆動機構４０によって検査装置１０１へ近づく方向へ移動すると、押圧面１１が半導体装置１００と接触する。接触すると、バネ３１を収縮させて、押さえ部材１０はガイド部材２０の内部へ収縮する。また、ガイド部材２０が駆動機構４０によって検査装置１０１から遠ざかる方向へ移動すると、押さえ部材１０はバネ３１の力を受けて、ガイド部材２０から突出する方向へ移動する。この際に、押さえ部材１０のガイド部材２０から突出する方向への移動は、下記に説明する構成により制限される。
押さえ部材１０の側面１２には、凹部１５が形成されている。この凹部１５は、バネ３１が収縮した状態でガイド部材２０の内部に位置し、バネ３１が完全に伸長した状態でガイド部材２０の外部に位置するように配置されている。言い換えれば、バネ３１が収縮した状態から伸長した状態に変形する際に、凹部１５がガイド部材２０の底部２１の開口を通過するように、凹部１５は配置されている。
また、ガイド部材２０の底部２１の開口周辺には、押さえ部材１０の側面１２と対向する位置に凹部２５が形成されている（図１（ｂ）参照）。そして、凹部２５の内部には、バネ２６が配置されており、バネ２６と押さえ部材１０の側面１２の間には、凹部１５に嵌まり込む大きさの球体２７が配置されている。バネ２６は球体２７を押さえ部材１０の側面１２に向かって押圧している。したがって、押さえ部材１０が移動して、押さえ部材１０の凹部１５と球体２７とが対向すると、バネ２６の押圧力によって、球体２７が凹部１５に嵌まり込み、押さえ部材１０とガイド部材２０の相対的な移動が制限される。すなわち、バネ２６および球体２７は、駆動機構４０がガイド部材２０を検査装置１０１から離れる方向へ移動させた場合に、押さえ部材１０の押圧面１１が検査装置１０１へ向かう方向へ移動しないように、押さえ部材と接触して押さえ部材が移動することを制限するものであり、これらを第１の制限部と呼ぶ。また、押さえ部材１０の凹部１５と球体２７とが対向していない場合は、押さえ部材１０とガイド部材２０の相対的な移動は妨げられない。 When the guide member 20 is moved toward the inspection device 101 by the drive mechanism 40, the pressing surface 11 comes into contact with the semiconductor device 100. Upon contact, the spring 31 contracts and the pressing member 10 contracts into the guide member 20. Further, when the guide member 20 moves away from the inspection device 101 by the drive mechanism 40, the pressing member 10 receives the force of the spring 31 and moves in the direction of protruding from the guide member 20. At this time, the movement of the pressing member 10 in the direction of projecting from the guide member 20 is restricted by the configuration described below.
A recess 15 is formed on the side surface 12 of the pressing member 10. The recess 15 is arranged so as to be located inside the guide member 20 when the spring 31 is contracted and outside the guide member 20 when the spring 31 is completely extended. In other words, the recess 15 is arranged so that the recess 15 passes through the opening of the bottom 21 of the guide member 20 when the spring 31 is deformed from the contracted state to the extended state.
Further, a recess 25 is formed around the opening of the bottom portion 21 of the guide member 20 at a position facing the side surface 12 of the pressing member 10 (see FIG. 1 (b)). A spring 26 is arranged inside the recess 25, and a sphere 27 having a size that fits into the recess 15 is arranged between the spring 26 and the side surface 12 of the pressing member 10. The spring 26 presses the sphere 27 toward the side surface 12 of the pressing member 10. Therefore, when the pressing member 10 moves and the recess 15 of the pressing member 10 and the sphere 27 face each other, the sphere 27 is fitted into the recess 15 by the pressing force of the spring 26, and the pressing member 10 and the guide member 20 are relative to each other. Movement is restricted. That is, the spring 26 and the sphere 27 are so that when the drive mechanism 40 moves the guide member 20 away from the inspection device 101, the pressing surface 11 of the pressing member 10 does not move in the direction toward the inspection device 101. It restricts the movement of the pressing member in contact with the pressing member, and these are referred to as a first limiting portion. Further, when the recess 15 of the pressing member 10 and the sphere 27 do not face each other, the relative movement of the pressing member 10 and the guide member 20 is not hindered.

上記のように押さえ部材１０の移動が制限された状態を解除するために、検査治具１は、解除部材５０を備えている（図１（ａ）参照）。解除部材５０は、押さえ部材１０およびガイド部材２０を挟んで検査装置１０１と対向する天井５１などに固定されており、軸方向が押さえ部材１０およびガイド部材２０へ向って伸びる棒状の部材である。より詳細には、解除部材５０の軸中心は、ガイド部材２０の頂部２３に形成された貫通孔２４の中心と略一致している。
そして、解除部材５０は、駆動機構４０がガイド部材２０を検査装置１０１に向かって移動させ押圧面１１で半導体装置１００を押圧している状態では、ガイド部材２０と離れた位置にあるように配置されている。また、押圧面１１で半導体装置１００を押圧した後にガイド部材２０が検査装置１０１から離れる方向へ移動して、押さえ部材１０の移動が制限された状態なった後、さらに、ガイド部材２０がさらに検査装置１０１から離れる方向へ移動すると、解除部材５０がガイド部材２０の頂部２３の貫通孔２４に挿入され、押さえ部材１０の頂面１３と接触して押さえ部材１０を検査装置１０１に向かって押圧するように、解除部材５０は配置されている。押さえ部材１０は、解除部材５０によって押圧されると、バネ２６および球体２７による移動の制限が解除される。 The inspection jig 1 includes a release member 50 in order to release the state in which the movement of the pressing member 10 is restricted as described above (see FIG. 1A). The release member 50 is a rod-shaped member that is fixed to a ceiling 51 or the like that faces the inspection device 101 with the pressing member 10 and the guide member 20 sandwiched therein, and extends in the axial direction toward the pressing member 10 and the guide member 20. More specifically, the axial center of the release member 50 substantially coincides with the center of the through hole 24 formed in the top 23 of the guide member 20.
Then, the release member 50 is arranged so as to be at a position away from the guide member 20 in a state where the drive mechanism 40 moves the guide member 20 toward the inspection device 101 and presses the semiconductor device 100 with the pressing surface 11. Has been done. Further, after the semiconductor device 100 is pressed by the pressing surface 11, the guide member 20 moves in the direction away from the inspection device 101, and the movement of the pressing member 10 is restricted, and then the guide member 20 is further inspected. When moving away from the device 101, the release member 50 is inserted into the through hole 24 of the top 23 of the guide member 20 and comes into contact with the top surface 13 of the pressing member 10 to press the pressing member 10 toward the inspection device 101. As described above, the release member 50 is arranged. When the pressing member 10 is pressed by the releasing member 50, the restriction on movement by the spring 26 and the sphere 27 is released.

ここで、検査治具１を用いて検査される半導体装置１００は、ウェハに回路を形成して切断した半導体チップに対して端子を接続した電子デバイスである。より具体的には、ＣＤＭＡ（ＣｏｄｅＤｉｖｉｓｉｏｎＭｕｏｔｉｐｌｅＡｃｃｅｓｓ）をはじめとする携帯電話基地局用電力増幅器であり、ＬＤＭＯＳ（ＬａｔｅｒａｌｌｙＤｉｆｆｕｓｅｄＭｅｔａｌＯｘｉｄｅＳｅｍｉｃｏｎｄｕｃｔｏｒ）、ＧａＮ−ＨＥＭＴ（ＧａｌｌｉｕｍＮｉｔｒｉｄｅ−ＨｉｇｈＥｌｅｃｔｒｏｎＭｏｂｉｌｉｔｙＴｒａｎｓｉｓｔｏｒ）またはＧａＡｓ−ＨＢＴ（ＧａｌｌｉｕｍＡｒｓｅｎｉｄｅ−ＨｅｔｅｒｏｊｕｎｃｔｉｏｎＢｉｐｏｌａｒＴｒａｎｓｉｓｔｏｒ）である。これらの電子デバイスは、携帯電話基地局の大きさに応じて、数ワットから数百ワットの出力電力が求められ、出力電力に比例して発熱量が増加する。
また、検査治具１によって押しつけられた半導体装置１００を検査する検査装置１０１は、半導体装置１００の電気特性を検査するための検査装置である。検査装置１０１は、評価基板１０２上に半導体装置１００の端子と接続される評価端子１０３が設置されており、さらに、評価基板１０２には放熱板１０４が設置されている（図２（ａ）参照）。
上記のとおり、半導体装置１００である電力増幅器は、発熱量が大きいため、電気特性検査を行う場合、電力増幅器を評価基板１０２に十分に密着させて、放熱板１０４から放熱しなければ、熱の影響により電力増幅器の電気特性を正しく検査できないことがある。そのため、検査治具１は、押圧面１１で半導体装置１００である電力増幅器を検査装置１０１へ押さえつけるように構成されている。また、検査治具１は、強い力で半導体装置１００を検査装置１０１へ押さえつけるため、検査後に半導体装置１００が検査治具１の押圧面１１に張り付いた状態となることがある。 Here, the semiconductor device 100 inspected using the inspection jig 1 is an electronic device in which terminals are connected to a semiconductor chip cut by forming a circuit on a wafer. More specifically, it is a power amplifier for mobile phone base stations such as CDMA (Code Division Muotype Access), LDMOS (Laterally Diffused Metal Oxide Semiconductor), GaN-HEMT (Gallium Nitride) -HBT (Gallium Arsenide-Heterojunction Bipolar Transistor). These electronic devices are required to have an output power of several watts to several hundred watts depending on the size of the mobile phone base station, and the amount of heat generated increases in proportion to the output power.
Further, the inspection device 101 for inspecting the semiconductor device 100 pressed by the inspection jig 1 is an inspection device for inspecting the electrical characteristics of the semiconductor device 100. In the inspection device 101, an evaluation terminal 103 connected to a terminal of the semiconductor device 100 is installed on the evaluation board 102, and a heat radiating plate 104 is further installed on the evaluation board 102 (see FIG. 2A). ).
As described above, since the power amplifier of the semiconductor device 100 generates a large amount of heat, when performing an electrical characteristic inspection, the power amplifier must be sufficiently brought into close contact with the evaluation board 102 to dissipate heat from the heat radiating plate 104. Due to the influence, it may not be possible to correctly inspect the electrical characteristics of the power amplifier. Therefore, the inspection jig 1 is configured to press the power amplifier, which is the semiconductor device 100, against the inspection device 101 with the pressing surface 11. Further, since the inspection jig 1 presses the semiconductor device 100 against the inspection device 101 with a strong force, the semiconductor device 100 may be stuck to the pressing surface 11 of the inspection jig 1 after the inspection.

次に、以上のように構成された検査治具１を用いて、半導体装置１００を検査する方法について、図２を用いて、説明する。
図２は、検査治具１で半導体装置１００を検査装置１０１へ押さえつけてから、検査治具１から半導体装置１００を剥離させるまでの様子を示しており、（ａ）から（ｄ）まで時系列に並んでいる。なお、図２では駆動機構４０を省略している。また、図２（ａ）、（ｂ）では、解除部材５０を省略している。また、各構成を示す符号は、図２（ａ）に付しており、図２（ｂ）、（ｃ）、（ｄ）では省略している。図２（ｃ）では、解除部材５０と天井５１の符号だけを示している。 Next, a method of inspecting the semiconductor device 100 using the inspection jig 1 configured as described above will be described with reference to FIG.
FIG. 2 shows a state in which the semiconductor device 100 is pressed against the inspection device 101 by the inspection jig 1 until the semiconductor device 100 is peeled off from the inspection jig 1, and the time series from (a) to (d) is shown. Lined up in. Note that the drive mechanism 40 is omitted in FIG. Further, in FIGS. 2A and 2B, the release member 50 is omitted. Reference numerals indicating each configuration are attached to FIG. 2A, and are omitted in FIGS. 2B, 2C, and 2D. In FIG. 2C, only the symbols of the release member 50 and the ceiling 51 are shown.

まず、図２（ａ）に示すように、駆動機構４０によってガイド部材２０を検査装置１０１へ近づく方向（黒塗の矢印の方向）へ移動させて、押さえ部材１０の押圧面１１と半導体装置１００とを接触させ、半導体装置１００を検査装置１０１へ押しつける。この際、バネ３１は、収縮している。
半導体装置１００を検査装置１０１へ押しつけることによって、半導体装置１００の端子と検査装置１０１の評価端子を接触させるとともに、評価基板１０２に半導体装置１００を強く押しつけて放熱性を確保する。そして、半導体装置１００の電気特性の検査を行う。 First, as shown in FIG. 2A, the guide member 20 is moved by the drive mechanism 40 in the direction approaching the inspection device 101 (the direction of the arrow painted in black), and the pressing surface 11 of the pressing member 10 and the semiconductor device 100 are moved. And press the semiconductor device 100 against the inspection device 101. At this time, the spring 31 is contracted.
By pressing the semiconductor device 100 against the inspection device 101, the terminals of the semiconductor device 100 and the evaluation terminal of the inspection device 101 are brought into contact with each other, and the semiconductor device 100 is strongly pressed against the evaluation substrate 102 to ensure heat dissipation. Then, the electrical characteristics of the semiconductor device 100 are inspected.

次に、図２（ｂ）に示すように、駆動機構４０によってガイド部材２０を検査装置１０１から離れる方向（黒塗の矢印の方向）へ移動させる。この際、バネ３１が伸長し、押さえ部材１０がガイド部材２０から突出する方向へ移動し、ガイド部材２０の底部２１に設けられた球体２７と押さえ部材１０の側面１２に設けられた凹部１５とが対向する。バネ２６に押圧された球体２７は、凹部１５へ嵌りこみ、押さえ部材１０とガイド部材２０の相対的な移動が制限される。押さえ部材１０の移動が制限されているため、バネ３１はこれ以上伸長しないが、バネ３１はまだ収縮した状態であり、押さえ部材１０を押圧している。 Next, as shown in FIG. 2B, the drive mechanism 40 moves the guide member 20 away from the inspection device 101 (in the direction of the black arrow). At this time, the spring 31 extends, the pressing member 10 moves in the direction of projecting from the guide member 20, and the sphere 27 provided on the bottom 21 of the guide member 20 and the recess 15 provided on the side surface 12 of the pressing member 10. Are opposed to each other. The sphere 27 pressed by the spring 26 fits into the recess 15, and the relative movement of the pressing member 10 and the guide member 20 is restricted. Since the movement of the pressing member 10 is restricted, the spring 31 does not extend any more, but the spring 31 is still in a contracted state and presses the pressing member 10.

次に、図２（ｃ）に示すように、駆動機構４０によってガイド部材２０を検査装置１０１からさらに離れる方向（黒塗の矢印の方向）へ移動させる。この際、押さえ部材１０とガイド部材２０の相対的な移動が制限されているので、押さえ部材１０は、ガイド部材２０とともに検査装置１０１から離れるが、半導体装置１００は押圧面１１へ張り付いたままである。この状態で、半導体装置１００と検査装置１０１との距離を第１の距離（図中のＡの距離）とする。
そして、ガイド部材２０と押さえ部材１０が検査装置１０１から離れる方向へ移動していくと、解除部材５０がガイド部材２０の頂部２３の貫通孔２４から挿入される。ここで、押さえ部材１０の押圧面１１に張り付いた半導体装置１００と検査装置１０１との距離は第１の距離以上となっている。そして、解除部材５０は、板材３０を検査装置１０１の方向（白抜きの矢印の方向）へ押圧して、バネ３１を収縮させる。 Next, as shown in FIG. 2C, the drive mechanism 40 moves the guide member 20 further away from the inspection device 101 (in the direction of the black arrow). At this time, since the relative movement of the pressing member 10 and the guide member 20 is restricted, the pressing member 10 is separated from the inspection device 101 together with the guide member 20, but the semiconductor device 100 remains attached to the pressing surface 11. is there. In this state, the distance between the semiconductor device 100 and the inspection device 101 is defined as the first distance (distance A in the figure).
Then, as the guide member 20 and the pressing member 10 move away from the inspection device 101, the release member 50 is inserted through the through hole 24 of the top 23 of the guide member 20. Here, the distance between the semiconductor device 100 and the inspection device 101 attached to the pressing surface 11 of the pressing member 10 is equal to or greater than the first distance. Then, the release member 50 presses the plate member 30 in the direction of the inspection device 101 (the direction of the white arrow) to contract the spring 31.

解除部材５０によるバネ３１の収縮によって、バネ３１の伸長しようとする力が大きくなると、押さえ部材１０は、バネ２６および球体２７による移動の制限が解除され、検査装置１０１へ近づく方向（白抜きの矢印の方向）へ移動する（図２（ｄ））。そして、ガイド部材２０の底部２１の開口周辺と、押さえ部材１０の頂面１３のせり出した部分とが衝突して、押さえ部材１０は、これ以上、ガイド部材２０から突出できないように移動を制限される。ここで、押さえ部材１０の検査装置１０１へ近づく方向への移動が停止するため、押圧面１１に張り付いた半導体装置１００には検査装置１０１へ近づく方向へ向かおうとする慣性力が働き、半導体装置１００は押圧面１１から剥離される。
なお、ガイド部材２０の底部２１の開口周辺は、押さえ部材１０の頂面１３の外周部と接触して押さえ部材１０の移動を制限するので、底部２１を第２の制限部と呼ぶ。 When the force to extend the spring 31 increases due to the contraction of the spring 31 by the release member 50, the movement restriction of the spring 26 and the sphere 27 is released, and the pressing member 10 approaches the inspection device 101 (white outline). It moves in the direction of the arrow (FIG. 2 (d)). Then, the periphery of the opening of the bottom portion 21 of the guide member 20 collides with the protruding portion of the top surface 13 of the pressing member 10, and the pressing member 10 is restricted from moving so as not to protrude further from the guide member 20. To. Here, since the holding member 10 stops moving in the direction approaching the inspection device 101, an inertial force acting on the semiconductor device 100 attached to the pressing surface 11 in the direction approaching the inspection device 101 acts on the semiconductor. The device 100 is peeled off from the pressing surface 11.
Since the periphery of the opening of the bottom portion 21 of the guide member 20 comes into contact with the outer peripheral portion of the top surface 13 of the pressing member 10 to limit the movement of the pressing member 10, the bottom portion 21 is referred to as a second limiting portion.

ここで、球体２７が凹部１５に嵌まり込んで押さえ部材１０の移動が制限されている状態で、押さえ部材１０の頂面１３のせり出した部分における検査装置１０１側の面とガイド部材２０の底部２１の検査装置１０１とは反対側の面の距離を第１の距離より短い第２の距離（図２（ｃ）の距離Ｂ）となるように構成しておく。このようにすることで、解除部材５０によって移動の制限を解除された押さえ部材１０は第２の距離だけ移動した時点で再び移動を制限される。第２の距離は第１の距離より短いので、押さえ部材１０がガイド部材２０から突出しようとした際に、半導体装置１００が検査装置１０１と接触することはない。 Here, in a state where the sphere 27 is fitted into the recess 15 and the movement of the pressing member 10 is restricted, the surface on the inspection device 101 side and the bottom of the guide member 20 at the protruding portion of the top surface 13 of the pressing member 10. The distance of the surface of 21 opposite to the inspection device 101 is configured to be a second distance (distance B in FIG. 2C) shorter than the first distance. By doing so, the holding member 10 whose movement restriction is released by the release member 50 is restricted in movement again when it has moved by a second distance. Since the second distance is shorter than the first distance, the semiconductor device 100 does not come into contact with the inspection device 101 when the pressing member 10 tries to protrude from the guide member 20.

本発明の実施の形態１に係る検査治具１は、以上のように構成されており、次のような効果を奏する。
検査治具１は、ガイド部材２０の底部２１に設けられたバネ２６および球体２７によって押さえ部材１０の移動が制限される。そして、解除部材５０によって移動の制限が解除されて、押さえ部材１０が移動し、ガイド部材２０の底部２１と衝突し押さえ部材の移動が再び制限される。押さえ部材１０の移動が停止することに伴い、押圧面１１に張り付いた半導体装置１００は慣性力を受けて、押圧面１１から剥離する。
よって、検査治具１は、エアを供給する機構を備えていなくても半導体装置１００を剥離することができ、エアを供給する機構を設置するスペースを削減することができる。 The inspection jig 1 according to the first embodiment of the present invention is configured as described above, and has the following effects.
In the inspection jig 1, the movement of the pressing member 10 is restricted by the spring 26 and the sphere 27 provided on the bottom 21 of the guide member 20. Then, the restriction of movement is released by the release member 50, the pressing member 10 moves, collides with the bottom portion 21 of the guide member 20, and the movement of the pressing member is restricted again. As the movement of the pressing member 10 is stopped, the semiconductor device 100 attached to the pressing surface 11 receives an inertial force and peels off from the pressing surface 11.
Therefore, the semiconductor device 100 can be peeled off even if the inspection jig 1 does not have a mechanism for supplying air, and the space for installing the mechanism for supplying air can be reduced.

また、検査治具１は、バネ２６および球体２７によって押さえ部材１０の移動が制限された際の半導体装置１００と検査装置１０１との距離である第１の距離よりも、バネ２６および球体２７によって押さえ部材１０の移動が制限された状態から押さえ部材１０の移動が再び制限されるまでに移動できる距離である第２の距離が短くなるように構成されている。
よって、半導体装置１００が検査装置１０１に衝突することなく、半導体装置１００を押圧面１１から剥離することができ、半導体装置１００が破損することを抑制することができる。 Further, the inspection jig 1 is provided by the spring 26 and the sphere 27 rather than the first distance, which is the distance between the semiconductor device 100 and the inspection device 101 when the movement of the pressing member 10 is restricted by the spring 26 and the sphere 27. The second distance, which is the distance that can be moved from the state in which the movement of the pressing member 10 is restricted until the movement of the pressing member 10 is restricted again, is shortened.
Therefore, the semiconductor device 100 can be peeled off from the pressing surface 11 without colliding with the inspection device 101, and damage to the semiconductor device 100 can be suppressed.

検査治具１は、解除部材５０が押さえ部材１０およびガイド部材２０を挟んで検査装置１０１と対向する位置に固定されており、駆動機構４０によって押さえ部材１０およびガイド部材２０が移動することで、解除部材５０によって押さえ部材１０が押圧され、押さえ部材１０の移動の制限が解除される。
よって、検査治具１は、押さえ部材１０およびガイド部材２０を移動させる駆動機構４０を用いて押さえ部材１０の移動の制限を解除できるので、解除部材５０を移動させる駆動機構を別途設ける必要がなく、低コスト、小スペースで検査を行うことができる。 The inspection jig 1 is fixed at a position where the release member 50 faces the inspection device 101 with the pressing member 10 and the guide member 20 sandwiched between them, and the pressing member 10 and the guide member 20 are moved by the drive mechanism 40. The pressing member 10 is pressed by the releasing member 50, and the restriction on the movement of the pressing member 10 is released.
Therefore, since the inspection jig 1 can release the restriction on the movement of the pressing member 10 by using the driving mechanism 40 for moving the pressing member 10 and the guide member 20, it is not necessary to separately provide a driving mechanism for moving the releasing member 50. , Low cost, small space can be inspected.

検査治具１は、第１の制限部として、バネ２６および球体２７を備えている。解除部材５０によって押さえ部材１０が押圧された際に、球体２７には角が形成されていないため、凹部１５に引っかかりにくく、スムーズに凹部１５から外れる。そのため、第１の制限部が凹部１５と引っかかり、押さえ部材１０の移動の制限が解除できないといった誤作動を抑制することができる。 The inspection jig 1 includes a spring 26 and a sphere 27 as a first limiting portion. When the pressing member 10 is pressed by the release member 50, the sphere 27 does not have an angle, so that the sphere 27 is less likely to be caught in the recess 15 and can be smoothly removed from the recess 15. Therefore, it is possible to suppress a malfunction in which the first limiting portion is caught by the recess 15 and the restriction on the movement of the pressing member 10 cannot be released.

ここで、本発明の実施の形態１の補足説明および変形例の説明を行う。
実施の形態１で説明した半導体装置１００は電子デバイスであるとしたが、電子デバイスにリードフレームや放熱板などを取り付けた半導体モジュールであってもよい。
また、検査装置１０１は評価基板１０２、評価端子１０３および放熱板１０４を備えているが、さらに、検査後の半導体装置１００を回収するための回収ボックスを備えていてもよい。この場合、解除部材５０を回収ボックスと対向する位置に配置しておく。検査治具１の駆動機構４０は、バネ２６および球体２７が押さえ部材１０の移動を制限している状態で、押さえ部材１０およびガイド部材２０を回収ボックス上まで移動させる。そして、検査治具１が回収ボックス上に到達した後で、解除部材５０が押さえ部材１０の移動の制限を解除して、半導体装置１００を押圧面１１から剥離させ、回収ボックスに半導体装置１００を落下させる。
また、上記の回収ボックスを２つ用意しておき、それらを良品用および不良品用としてもよい。検査装置１０１による検査で半導体装置１００が良品と判断された場合は、検査治具１は良品用の回収ボックス上まで移動して、半導体装置１００を剥離して落下させる。半導体装置１００が不良品と判断された場合は、検査治具１は不良品用の回収ボックス上まで移動して、半導体装置１００を剥離して落下させる。 Here, a supplementary explanation and a modification of the first embodiment of the present invention will be described.
Although the semiconductor device 100 described in the first embodiment is an electronic device, it may be a semiconductor module in which a lead frame, a heat radiating plate, or the like is attached to the electronic device.
Further, the inspection device 101 includes an evaluation substrate 102, an evaluation terminal 103, and a heat radiating plate 104, but may further include a recovery box for recovering the semiconductor device 100 after inspection. In this case, the release member 50 is arranged at a position facing the collection box. The drive mechanism 40 of the inspection jig 1 moves the pressing member 10 and the guide member 20 onto the recovery box in a state where the spring 26 and the sphere 27 restrict the movement of the pressing member 10. Then, after the inspection jig 1 reaches the recovery box, the release member 50 releases the restriction on the movement of the pressing member 10, peels the semiconductor device 100 from the pressing surface 11, and puts the semiconductor device 100 in the recovery box. Drop it.
Further, two collection boxes described above may be prepared and used for a good product and a defective product. When the inspection by the inspection device 101 determines that the semiconductor device 100 is a non-defective product, the inspection jig 1 moves to the collection box for the non-defective product, peels off the semiconductor device 100, and drops the product. When the semiconductor device 100 is determined to be a defective product, the inspection jig 1 moves to the collection box for the defective product, peels off the semiconductor device 100, and drops the semiconductor device 100.

実施の形態２．
次に、本発明の実施の形態２について説明する。実施の形態１で説明した構成および動作と同様の部分については説明を省略し、実施の形態１と異なる部分について、以下に説明する。なお。実施の形態２の検査治具２０１は実施の形態１の変形例と組み合わせて実施することができる。
実施の形態２の検査治具２０１は、第１の制限部の構成および押さえ部材１０の側面１２の構成が実施の形態１とは異なる。実施の形態２の検査治具２０１の構成は図３に示されており、図３は、図１（ｂ）と対応する検査治具２０１の断面図である。ただし、図１（ａ）とは異なり、第１の制限部によって押さえ部材１０の移動が制限された状態を示している。 Embodiment 2.
Next, Embodiment 2 of the present invention will be described. The same parts as the configuration and operation described in the first embodiment will be omitted, and the parts different from the first embodiment will be described below. In addition. The inspection jig 201 of the second embodiment can be implemented in combination with the modification of the first embodiment.
The inspection jig 201 of the second embodiment is different from the first embodiment in the configuration of the first limiting portion and the configuration of the side surface 12 of the pressing member 10. The configuration of the inspection jig 201 of the second embodiment is shown in FIG. 3, and FIG. 3 is a cross-sectional view of the inspection jig 201 corresponding to FIG. 1 (b). However, unlike FIG. 1A, the movement of the pressing member 10 is restricted by the first limiting portion.

実施の形態１の検査治具１は、図１に示されるように、押さえ部材１０の側面１２に凹部１５が形成されていたが、実施の形態２の検査治具２０１は、図３に示されるように、凹部１５に代えて、凸部２１１が形成されている。
また、実施の形態１の検査治具１は、図１に示されるように、ガイド部材２０の底部２１の開口周辺に凹部２５が形成されその内部にバネ２６および球体２７が配置されていたが、実施の形態２の検査治具２０１は、図３に示されるように、凹部２５、バネ２６および球体２７に代えて、凸部２２１が形成されている。なお、凸部２１１を第１の凸部、凸部２２１を第２の凸部と呼ぶ。 As shown in FIG. 1, the inspection jig 1 of the first embodiment has a recess 15 formed on the side surface 12 of the pressing member 10, but the inspection jig 201 of the second embodiment is shown in FIG. A convex portion 211 is formed in place of the concave portion 15.
Further, in the inspection jig 1 of the first embodiment, as shown in FIG. 1, a recess 25 is formed around the opening of the bottom 21 of the guide member 20, and the spring 26 and the sphere 27 are arranged inside the recess 25. As shown in FIG. 3, the inspection jig 201 of the second embodiment has a convex portion 221 formed in place of the concave portion 25, the spring 26, and the sphere 27. The convex portion 211 is referred to as a first convex portion, and the convex portion 221 is referred to as a second convex portion.

ガイド部材２０に設けられた凸部２２１は、その頂面が押さえ部材１０の凸部２１１の頂面と接触可能な大きさで構成されている。すなわち、押さえ部材１０が半導体装置１００を検査装置１０１へ押しつけている状態から、バネ３１が伸長して押さえ部材１０が検査装置１０１へ近づく方向へ移動して凸部２１１と凸部２２１とが対向した場合に、凸部２１１の頂面と凸部２２１の頂面とは接触可能なように構成されている。
そして、凸部２１１の頂面と凸部２２１の頂面が接触している状態では、頂面同士の摩擦によって、バネ３１の押圧を受けても押さえ部材１０の移動が制限される。また、押さえ部材１０が解除部材５０によって押圧された場合、摩擦による移動の制限が維持できなくなり、移動の制限が解除される。
なお、凸部２２１は、押さえ部材１０の移動を制限するので、第１の制限部である。 The convex portion 221 provided on the guide member 20 is configured such that the top surface thereof can come into contact with the top surface of the convex portion 211 of the pressing member 10. That is, from the state in which the pressing member 10 presses the semiconductor device 100 against the inspection device 101, the spring 31 extends and the pressing member 10 moves in the direction approaching the inspection device 101 so that the convex portion 211 and the convex portion 221 face each other. In this case, the top surface of the convex portion 211 and the top surface of the convex portion 221 are configured to be in contact with each other.
Then, in a state where the top surface of the convex portion 211 and the top surface of the convex portion 221 are in contact with each other, the movement of the pressing member 10 is restricted even if the spring 31 is pressed by the friction between the top surfaces. Further, when the pressing member 10 is pressed by the releasing member 50, the restriction on movement due to friction cannot be maintained, and the restriction on movement is released.
The convex portion 221 is the first limiting portion because it limits the movement of the pressing member 10.

本発明の実施の形態２に係る検査治具２０１は、以上のように構成されており、実施の形態１と同様の効果を奏するだけでなく、次のような効果を奏する。
検査治具２０１では、凸部２１１と凸部２２１を形成するだけで、押さえ部材１０の移動を制限することができるので、バネ２６および球体２７を必要とせず、低コストで治具を作成することができる。また、簡易な構成であるため、検査治具２０１を小型化することができる。 The inspection jig 201 according to the second embodiment of the present invention is configured as described above, and not only has the same effect as that of the first embodiment, but also has the following effects.
In the inspection jig 201, the movement of the pressing member 10 can be restricted only by forming the convex portion 211 and the convex portion 221. Therefore, the jig 26 and the sphere 27 are not required, and the jig is produced at low cost. be able to. Further, since the structure is simple, the inspection jig 201 can be miniaturized.

実施の形態３．
次に、本発明の実施の形態３について説明する。実施の形態１で説明した構成および動作と同様の部分については説明を省略し、実施の形態１と異なる部分について、以下に説明する。なお。実施の形態３の検査治具３０１は実施の形態１の変形例と組み合わせて実施することができる。
実施の形態３の検査治具３０１は、第１の制限部の構成が実施の形態１とは異なる。実施の形態３の検査治具３０１の構成は図４に示されており、図４は、図１（ｂ）と対応する検査治具３０１の断面図である。ただし、図１（ａ）とは異なり、第１の制限部によって押さえ部材１０の移動が制限された状態を示している。 Embodiment 3.
Next, Embodiment 3 of the present invention will be described. The same parts as the configuration and operation described in the first embodiment will be omitted, and the parts different from the first embodiment will be described below. In addition. The inspection jig 301 of the third embodiment can be implemented in combination with the modification of the first embodiment.
The inspection jig 301 of the third embodiment has a different configuration of the first limiting portion from the first embodiment. The configuration of the inspection jig 301 of the third embodiment is shown in FIG. 4, and FIG. 4 is a cross-sectional view of the inspection jig 301 corresponding to FIG. 1 (b). However, unlike FIG. 1A, the movement of the pressing member 10 is restricted by the first limiting portion.

実施の形態１の検査治具１は、図１に示されるように、ガイド部材２０の凹部２５内にバネ２６および球体２７が設けられていたが、実施の形態３の検査治具３０１は、図４に示されるように、バネ２６および球体２７に代えて、板バネ３２１が設けられている。
板バネ３２１は、押さえ部材１０の側面１２に向かって凸部が形成されており、押さえ部材１０の凹部１５と凸部とが対向した場合、凸部が凹部１５へ嵌りこみ、押さえ部材１０の移動を制限する。また、押さえ部材１０が解除部材５０によって押圧された場合、板バネ３２１が側面１２とは反対方向へ変形することで、押さえ部材１０の移動の制限が解除される。
なお、板バネ３２１は、押さえ部材１０の移動を制限するので、第１の制限部である。 As shown in FIG. 1, the inspection jig 1 of the first embodiment is provided with the spring 26 and the sphere 27 in the recess 25 of the guide member 20, but the inspection jig 301 of the third embodiment is As shown in FIG. 4, a leaf spring 321 is provided instead of the spring 26 and the sphere 27.
The leaf spring 321 has a convex portion formed toward the side surface 12 of the pressing member 10. When the concave portion 15 of the pressing member 10 and the convex portion face each other, the convex portion fits into the concave portion 15 and the pressing member 10 Restrict movement. Further, when the pressing member 10 is pressed by the releasing member 50, the leaf spring 321 is deformed in the direction opposite to the side surface 12, so that the restriction on the movement of the pressing member 10 is released.
Since the leaf spring 321 limits the movement of the pressing member 10, it is the first limiting portion.

本発明の実施の形態３に係る検査治具３０１は、以上のように構成されており、実施の形態１と同様の効果を奏するだけでなく、次のような効果を奏する。
検査治具３０１では、板バネ３２１を設けるだけで、押さえ部材１０の移動を制限することができるので、バネ２６および球体２７を必要とせず、低コストで治具を作成することができる。また、簡易な構成であるため、検査治具２０１を小型化することができる。 The inspection jig 301 according to the third embodiment of the present invention is configured as described above, and not only has the same effect as that of the first embodiment, but also has the following effects.
In the inspection jig 301, since the movement of the pressing member 10 can be restricted only by providing the leaf spring 321, the jig can be produced at low cost without the need for the spring 26 and the sphere 27. Further, since the structure is simple, the inspection jig 201 can be miniaturized.

実施の形態４．
次に、本発明の実施の形態４について説明する。実施の形態２で説明した構成および動作と同様の部分については説明を省略し、実施の形態２と異なる部分について、以下に説明する。なお。実施の形態４の検査治具４０１は実施の形態１、実施の形態３またはその変形例と組み合わせて実施することができる。
実施の形態４の検査治具４０１は、押さえ部材１０に設けられた凸部およびガイド部材２０に設けられた凸部の位置が実施の形態２とは異なる。また、第１の制限部および第２の制限部に加えて、複数の第３の制限部が設けられている。実施の形態４の検査治具４０１の構成は図５に示されており、図５は、図３と対応する検査治具４０１の断面図である。ただし、図３とは異なり、押さえ部材１０は、第１の制限部によって移動を制限されていない状態を示している。 Embodiment 4.
Next, Embodiment 4 of the present invention will be described. The same parts as the configuration and operation described in the second embodiment will be omitted, and the parts different from the second embodiment will be described below. In addition. The inspection jig 401 of the fourth embodiment can be implemented in combination with the first embodiment, the third embodiment, or a modification thereof.
The inspection jig 401 of the fourth embodiment is different from the second embodiment in the positions of the convex portion provided on the pressing member 10 and the convex portion provided on the guide member 20. Further, in addition to the first limiting portion and the second limiting portion, a plurality of third limiting portions are provided. The configuration of the inspection jig 401 of the fourth embodiment is shown in FIG. 5, and FIG. 5 is a cross-sectional view of the inspection jig 401 corresponding to FIG. However, unlike FIG. 3, the pressing member 10 shows a state in which the movement is not restricted by the first limiting portion.

実施の形態２の検査治具２０１は、図３に示されるように、押さえ部材１０の側面１２に凸部２１１が設けられていたが、実施の形態４の検査治具４０１は、図５に示されるように、頂面１３における側部２２と対向する位置に凸部４１１が設けられている。
また、実施の形態２の検査治具２０１は、図３に示されるように、ガイド部材２０の底部２１の開口周辺に凸部２２１が設けられていたが、実施の形態４の検査治具４０１は、図５に示されるように、ガイド部材２０の側部２２の内壁面に凸部４２１が設けられている。凸部４１１と凸部４２１は、実施の形態２と同様、頂面同士が接触することで発生する摩擦により、押さえ部材１０の移動を制限するような大きさで構成されている。
なお、凸部４２１は、押さえ部材１０の移動を制限する第１の制限部である。 As shown in FIG. 3, the inspection jig 201 of the second embodiment is provided with the convex portion 211 on the side surface 12 of the pressing member 10, but the inspection jig 401 of the fourth embodiment is shown in FIG. As shown, the convex portion 411 is provided at a position on the top surface 13 facing the side portion 22.
Further, as shown in FIG. 3, the inspection jig 201 of the second embodiment is provided with the convex portion 221 around the opening of the bottom portion 21 of the guide member 20, but the inspection jig 401 of the fourth embodiment is provided. Is provided with a convex portion 421 on the inner wall surface of the side portion 22 of the guide member 20, as shown in FIG. Similar to the second embodiment, the convex portion 411 and the convex portion 421 are configured to have a size that limits the movement of the pressing member 10 due to the friction generated by the contact between the top surfaces.
The convex portion 421 is a first limiting portion that limits the movement of the pressing member 10.

検査治具４０１は、さらに、ガイド部材２０の側部２２の内壁面に複数の凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄを備えている。凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄは順番に、側部２２の内壁面において、凸部４２１と底部２１の間に設けられている。凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄの形状は、凸部４２１と略同一であり、その頂面が凸部４１１の頂面と接触することで発生する摩擦により、押さえ部材１０の移動を制限するような大きさで構成されている。
凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄは、押さえ部材１０の移動を制限するものであり、第３の制限部と呼ぶ。 The inspection jig 401 is further provided with a plurality of convex portions 422A, 422B, 422C, and 422D on the inner wall surface of the side portion 22 of the guide member 20. The convex portions 422A, 422B, 422C, and 422D are sequentially provided between the convex portion 421 and the bottom portion 21 on the inner wall surface of the side portion 22. The shape of the convex portion 422A, 422B, 422C, 422D is substantially the same as that of the convex portion 421, and the movement of the pressing member 10 is restricted by the friction generated when the top surface thereof comes into contact with the top surface of the convex portion 411. It is composed of such a size.
The convex portions 422A, 422B, 422C, and 422D restrict the movement of the pressing member 10, and are referred to as a third limiting portion.

次に、検査治具４０１の動作について説明する。
まず、半導体装置１００を検査装置１０１へ押しつけている動作は、実施の形態１と同様である（図２（ａ）参照）。駆動機構４０によってガイド部材２０が検査装置１０１から離れる方向へ移動すると、バネ３１が伸長し、押さえ部材１０が検査装置１０１の方向へ移動し、凸部４１１と凸部４２１が接触して、押さえ部材１０の移動が制限される（図２（ｂ）参照。ただし、第１の制限部の構成、位置は異なる）。その後、さらにガイド部材２０が検査装置１０１から離れる方向へ移動すると、解除部材５０が押さえ部材１０を押圧し、凸部４２１による移動の制限が解除される（図２（ｃ）参照）。
そして、押さえ部材１０は解除部材５０に押されて、押さえ部材１０に設けられた凸部４１１は、ガイド部材２０に設けられた凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄと次々に衝突し、押圧面１１に張り付いた半導体装置１００に対して断続的に慣性力を作用させる。
最終的に、押さえ部材１０の頂面１３とガイド部材２０の底部２１が衝突し、押さえ部材１０の移動が制限される（図２（ｄ）参照）。 Next, the operation of the inspection jig 401 will be described.
First, the operation of pressing the semiconductor device 100 against the inspection device 101 is the same as that of the first embodiment (see FIG. 2A). When the guide member 20 moves away from the inspection device 101 by the drive mechanism 40, the spring 31 expands, the pressing member 10 moves in the direction of the inspection device 101, and the convex portion 411 and the convex portion 421 come into contact with each other to press the pressing member 10. The movement of the member 10 is restricted (see FIG. 2B, but the configuration and position of the first restricting portion are different). After that, when the guide member 20 further moves away from the inspection device 101, the release member 50 presses the pressing member 10, and the movement restriction by the convex portion 421 is released (see FIG. 2C).
Then, the pressing member 10 is pushed by the releasing member 50, and the convex portion 411 provided on the pressing member 10 collides with the convex portions 422A, 422B, 422C, and 422D provided on the guide member 20 one after another, and the pressing surface. An inertial force is intermittently applied to the semiconductor device 100 attached to the 11.
Finally, the top surface 13 of the pressing member 10 and the bottom portion 21 of the guide member 20 collide with each other, and the movement of the pressing member 10 is restricted (see FIG. 2D).

本発明の実施の形態４に係る検査治具４０１は、以上のように構成されており、実施の形態２と同様の効果を奏するだけでなく、次のような効果を奏する。
検査治具４０１は、第３の制限部として、凸部４２２を備えている。そのため、半導体装置１００には、第３の制限部および第２の制限部によって、少なくとも２回、慣性力が作用する。よって、半導体装置１００が押圧面１１に強く張り付いている場合でも、半導体装置１００を容易に剥離し、回収することができる。 The inspection jig 401 according to the fourth embodiment of the present invention is configured as described above, and not only has the same effect as that of the second embodiment, but also has the following effects.
The inspection jig 401 includes a convex portion 422 as a third limiting portion. Therefore, an inertial force acts on the semiconductor device 100 at least twice by the third limiting portion and the second limiting portion. Therefore, even when the semiconductor device 100 is strongly attached to the pressing surface 11, the semiconductor device 100 can be easily peeled off and recovered.

検査治具４０１は、第３の制限部として、複数の凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄを備えている。これにより、半導体装置１００には、第３の制限部によって複数回にわたって、断続的に慣性力が作用する。よって、半導体装置１００が押圧面１１に強く張り付いている場合でも、半導体装置１００を容易に剥離し、回収することができる。 The inspection jig 401 includes a plurality of convex portions 422A, 422B, 422C, and 422D as a third limiting portion. As a result, the inertial force acts intermittently on the semiconductor device 100 a plurality of times by the third limiting portion. Therefore, even when the semiconductor device 100 is strongly attached to the pressing surface 11, the semiconductor device 100 can be easily peeled off and recovered.

ここで、本発明の実施の形態４の補足説明および変形例の説明を行う。
実施の形態４では、押さえ部材１０の凸部４１１が、凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄと接触して、最終的に押さえ部材１０の頂面１３とガイド部材の底部２１とが接触する例を示した。この例においては、凸部４２２Ａ、４２２Ｂ、４２２Ｃ、４２２Ｄが第３の制限部であり、底部２１が第２の制限部である。これに代えて、押さえ部材１０が、凸部４２２Ｂ、４２２Ｃ、４２２Ｄのいずれかと接触した際に、それ以上、押さえ部材１０が検査装置１０１に近づく方向へ移動しないようにしてもよい。例えば、凸部４２２Ｂ、４２２Ｃ、４２２Ｄのいずれかの大きさを大きくすることで、移動の制限を解除できないようにすることができる。または、凸部４２２Ｂ、４２２Ｃ、４２２Ｄのいずれかと接触した後に解除部材５０で移動の制限を解除しなければよい。このようにした場合、最後に押さえ部材１０の移動を制限する凸部４２２Ｂ、４２２Ｃ、４２２Ｄは、第２の制限部となる。また、このようにすることで、押さえ部材１０のガイド部材２０からの突出量を少なくすることができ、ガイド部材２０の移動量を少なくしても、半導体装置１００が検査装置１０１と衝突しなくなる。 Here, a supplementary explanation and a modification of the fourth embodiment of the present invention will be described.
In the fourth embodiment, the convex portion 411 of the pressing member 10 comes into contact with the convex portions 422A, 422B, 422C, and 422D, and finally the top surface 13 of the pressing member 10 and the bottom portion 21 of the guide member come into contact with each other. showed that. In this example, the convex portions 422A, 422B, 422C, and 422D are the third limiting portions, and the bottom portion 21 is the second limiting portion. Instead of this, when the pressing member 10 comes into contact with any of the convex portions 422B, 422C, and 422D, the pressing member 10 may not move further in the direction approaching the inspection device 101. For example, by increasing the size of any of the convex portions 422B, 422C, and 422D, it is possible to prevent the movement restriction from being lifted. Alternatively, the movement restriction may not be released by the release member 50 after contacting any of the convex portions 422B, 422C, and 422D. In this case, the convex portions 422B, 422C, and 422D that finally restrict the movement of the pressing member 10 become the second restricting portion. Further, by doing so, the amount of protrusion of the pressing member 10 from the guide member 20 can be reduced, and even if the amount of movement of the guide member 20 is reduced, the semiconductor device 100 does not collide with the inspection device 101. ..

実施の形態５．
次に、本発明の実施の形態５について説明する。実施の形態５では、実施の形態１の検査治具１を用いて半導体装置１００である電子デバイスを製造する方法について説明する。なお、実施の形態１の検査治具１を用いた場合について説明するが、実施の形態１の変形例、実施の形態２、実施の形態３、実施の形態４またはその変形例に係る検査治具を用いてもよい。 Embodiment 5.
Next, a fifth embodiment of the present invention will be described. In the fifth embodiment, a method of manufacturing the electronic device which is the semiconductor device 100 by using the inspection jig 1 of the first embodiment will be described. The case where the inspection jig 1 of the first embodiment is used will be described, but the inspection cure according to the modified example of the first embodiment, the second embodiment, the third embodiment, the fourth embodiment or the modified example thereof. You may use a jig.

（準備ステップ）
まず、高純度のＧａＮ結晶体であるインゴットを円形状に切り出し、ウェハを準備する。
（加工ステップ）
切り出したウェハの表面に対して研磨処理、薄膜結晶成長処理を行い、予め用意したフォトマスクを用いてウェハの表面に回路を形成する。
（切断ステップ）
回路を形成したウェハを、ダイヤモンドブレードを使って切断し、複数の半導体チップを作成する。
（実装ステップ）
切断されたウェハである半導体チップを、端子などにより構成されるパッケージ基板に実装して、電子デバイスを作成する。
（検査ステップ）
作成した電子デバイスを検査装置１０１上まで搬送し、検査装置１０１の評価端子１０３と電子デバイスの端子の位置合わせを行う。そして、検査治具１の駆動機構４０によってガイド部材２０および押さえ部材１０を検査装置１０１へ向かって移動させ、押圧面１１で電子デバイスを検査装置１０１へ向かって押圧する。この状態で、評価端子１０３と電子デバイスの端子を通電させて電子デバイスの電気特性の検査を行う。
（移動制限ステップ）
検査後に、検査治具１の駆動機構４０によってガイド部材２０を、検査装置１０１から離れる方向へ移動させる。この際、押さえ部材１０は、バネ３１によって押圧されて、検査装置１０１の方向へ移動する。そして、押さえ部材１０の側面１２の凹部１５と、ガイド部材２０の球体２７とが対向した際に、球体２７は凹部１５に嵌まり込み、押さえ部材１０は検査装置１０１へ向かう方向への移動が制限される。
（回収ステップ）
押さえ部材１０の移動が制限された状態で、検査治具１の駆動機構４０は、ガイド部材２０を移動させ、ガイド部材２０の頂部２３の貫通孔２４に解除部材５０を挿入する。解除部材５０は押さえ部材１０を押圧し、移動の制限を解除する。その後、押さえ部材１０はバネ３１に押圧されて検査装置１０１へ向かう方向へ移動し、押さえ部材１０の頂面１３の外周部とガイド部材２０の底部２１とが衝突して、押さえ部材１０の移動が制限される。このとき、押圧面１１に張り付いた電子デバイスは、慣性力によって剥離され、回収される。 (Preparation step)
First, an ingot, which is a high-purity GaN crystal, is cut into a circular shape to prepare a wafer.
(Processing step)
The surface of the cut wafer is subjected to polishing treatment and thin film crystal growth treatment, and a circuit is formed on the surface of the wafer using a photomask prepared in advance.
(Cut step)
The wafer on which the circuit is formed is cut using a diamond blade to create a plurality of semiconductor chips.
(Implementation step)
A semiconductor chip, which is a cut wafer, is mounted on a package substrate composed of terminals and the like to create an electronic device.
(Inspection step)
The created electronic device is transported onto the inspection device 101, and the evaluation terminal 103 of the inspection device 101 and the terminal of the electronic device are aligned. Then, the guide member 20 and the pressing member 10 are moved toward the inspection device 101 by the drive mechanism 40 of the inspection jig 1, and the electronic device is pressed toward the inspection device 101 by the pressing surface 11. In this state, the evaluation terminal 103 and the terminal of the electronic device are energized to inspect the electrical characteristics of the electronic device.
(Movement restriction step)
After the inspection, the guide member 20 is moved away from the inspection device 101 by the drive mechanism 40 of the inspection jig 1. At this time, the pressing member 10 is pressed by the spring 31 and moves in the direction of the inspection device 101. Then, when the recess 15 on the side surface 12 of the pressing member 10 and the sphere 27 of the guide member 20 face each other, the sphere 27 fits into the recess 15, and the pressing member 10 moves in the direction toward the inspection device 101. Be restricted.
(Recovery step)
With the movement of the pressing member 10 restricted, the drive mechanism 40 of the inspection jig 1 moves the guide member 20 and inserts the release member 50 into the through hole 24 of the top 23 of the guide member 20. The release member 50 presses the pressing member 10 to release the movement restriction. After that, the pressing member 10 is pressed by the spring 31 and moves in the direction toward the inspection device 101, the outer peripheral portion of the top surface 13 of the pressing member 10 collides with the bottom portion 21 of the guide member 20, and the pressing member 10 moves. Is restricted. At this time, the electronic device attached to the pressing surface 11 is peeled off by the inertial force and recovered.

本発明の実施の形態５に係る電子デバイスの製造方法は、以上のように構成されており、次のような効果を奏する。
実施の形態５では、電子デバイスを製造する際に、実施の形態１等の検査治具を用いている。よって、エアを供給する機構を設置しなくても、電子デバイスを剥離することができ、エアを供給する機構を設置するスペースを削減することができる。 The method for manufacturing an electronic device according to the fifth embodiment of the present invention is configured as described above, and has the following effects.
In the fifth embodiment, the inspection jig of the first embodiment is used when manufacturing the electronic device. Therefore, the electronic device can be peeled off without installing the mechanism for supplying air, and the space for installing the mechanism for supplying air can be reduced.

ここで、本発明の実施の形態１から実施の形態４の補足説明および変形例の説明を行う。
実施の形態１から実施の形態３では、第１の制限部をガイド部材２０の底部２１に設けていた。また、第１の制限部と接触する凹部または凸部を押さえ部材１０の側面１２に設けていた。これらの構成については、実施の形態４と同様に、ガイド部材２０の側部２２の内壁面、押さえ部材１０の頂面１３の外周部に設けてもよい。
また、実施の形態４においても、第１の制限部または第３の制限部をガイド部材の底部２１の開口周辺に設け、第１の制限部または第３の制限部と接触する押さえ部材１０の凸部４１１を押さえ部材１０の側面１２に設けてもよい。 Here, a supplementary explanation and a modification of the first to fourth embodiments of the present invention will be described.
In the first to third embodiments, the first limiting portion is provided on the bottom portion 21 of the guide member 20. Further, a concave portion or a convex portion that comes into contact with the first limiting portion is provided on the side surface 12 of the pressing member 10. Similar to the fourth embodiment, these configurations may be provided on the inner wall surface of the side portion 22 of the guide member 20 and the outer peripheral portion of the top surface 13 of the pressing member 10.
Further, also in the fourth embodiment, the first limiting portion or the third limiting portion is provided around the opening of the bottom portion 21 of the guide member, and the pressing member 10 comes into contact with the first limiting portion or the third limiting portion. The convex portion 411 may be provided on the side surface 12 of the pressing member 10.

実施の形態１から実施の形態４の検査治具は、押さえ部材１０とガイド部材２０の間に板材３０を配置していたが、板材３０を配置しなくてもよい。この場合、解除部材５０は、押さえ部材１０の頂面１３を直接押圧し、押さえ部材１０の移動の制限を解除する。 In the inspection jigs of the first to fourth embodiments, the plate material 30 is arranged between the pressing member 10 and the guide member 20, but the plate material 30 may not be arranged. In this case, the release member 50 directly presses the top surface 13 of the pressing member 10 to release the restriction on the movement of the pressing member 10.

実施の形態１から実施の形態４の検査治具のガイド部材２０は、円筒状の部材としたが、多角形の筒状の部材であってもよい。また、ガイド部材２０の内部に多角形状の空間を形成し、押さえ部材１０および板材３０は、多角形の部材としてもよい。 The guide member 20 of the inspection jig of the first to fourth embodiments is a cylindrical member, but may be a polygonal tubular member. Further, a polygonal space may be formed inside the guide member 20, and the pressing member 10 and the plate member 30 may be polygonal members.

また、実施の形態１から実施の形態４では、検査治具のガイド部材２０の底部２１の開口周辺の部分と押さえ部材１０の側面１２とがスライド可能に接触しており、押さえ部材１０は、ガイド部材２０の軸方向以外の方向へは移動できないとしたが、ガイド部材２０の底部２１の開口周辺の部分と押さえ部材１０の側面１２の間に遊びを設けて、さらに、押さえ部材１０の頂面１３の外周部とガイド部材２０の側部２２の内壁面との間にも遊びを設けてもよい。このようにすることで、押さえ部材１０がガイド部材２０の軸方向以外にもわずかに移動可能となる。そして、このような検査治具を用いることで、半導体装置１００と押圧面１１の位置関係がずれていたとしても、押さえ部材１０がわずかに移動することで、ずれを吸収でき、半導体装置１００を均一に押圧することが可能となる。 Further, in the first to fourth embodiments, the portion around the opening of the bottom 21 of the guide member 20 of the inspection jig and the side surface 12 of the pressing member 10 are in sliding contact with each other, and the pressing member 10 is in contact with the pressing member 10. Although it is said that the guide member 20 cannot be moved in a direction other than the axial direction, a play is provided between the portion around the opening of the bottom portion 21 of the guide member 20 and the side surface 12 of the pressing member 10, and the top of the pressing member 10 is further provided. A play may also be provided between the outer peripheral portion of the surface 13 and the inner wall surface of the side portion 22 of the guide member 20. By doing so, the pressing member 10 can be slightly moved in a direction other than the axial direction of the guide member 20. Then, by using such an inspection jig, even if the positional relationship between the semiconductor device 100 and the pressing surface 11 is displaced, the displacement can be absorbed by the pressing member 10 being slightly moved, so that the semiconductor device 100 can be moved. It is possible to press evenly.

本発明の検査治具は、半導体装置の検査に利用することができる。また、本発明の電子デバイスの製造方法は、電力増幅器などの電子デバイスの製造に利用することができる。 The inspection jig of the present invention can be used for inspection of semiconductor devices. Further, the method for manufacturing an electronic device of the present invention can be used for manufacturing an electronic device such as a power amplifier.

１検査治具、１０押さえ部材、１１押圧面、１２側面、１３頂面、１５凹部、２０ガイド部材、２１底部、２２側部、２３頂部、２４貫通孔、２５凹部、２６バネ、２７球体、３０板材、３１バネ、４０駆動機構、５０解除部材、５１天井、１００半導体装置、１０１検査装置、１０２評価基板、１０３評価端子、１０４放熱板、２０１検査治具、２１１凸部、２２１凸部、３０１検査治具、３２１板バネ、４０１検査治具、４１１凸部、４２１凸部、４２２凸部 1 Inspection jig, 10 Pressing member, 11 Pressing surface, 12 Side surface, 13 Top surface, 15 Recess, 20 Guide member, 21 Bottom, 22 Side, 23 Top, 24 Through hole, 25 Recess, 26 Spring, 27 Sphere, 30 plate material, 31 spring, 40 drive mechanism, 50 release member, 51 ceiling, 100 semiconductor device, 101 inspection device, 102 evaluation board, 103 evaluation terminal, 104 heat dissipation plate, 201 inspection jig, 211 convex part, 221 convex part, 301 inspection jig, 321 leaf spring, 401 inspection jig, 411 convex part, 421 convex part, 422 convex part

Claims

A pressing member having a pressing surface that presses the semiconductor device against the inspection device and exerting a force for the pressing surface to move in the direction toward the inspection device.
A guide member that holds the pressing member so that the pressing member can move in the direction toward the inspection device, and a guide member that holds the pressing member.
A drive mechanism that moves the guide member away from the inspection device, and
The pressing member is provided in the guide member, and when the driving mechanism moves the guide member, the pressing member comes into contact with the pressing member so that the pressing member does not move in the direction toward the inspection device. The first restriction part that restricts movement and
When the drive mechanism moves the guide member while the first limiting portion restricts the movement of the pressing member, the pressing member is pressed toward the inspection device, and the first A release member that releases the restriction on the movement of the holding member by the restriction portion,
When the release member releases the restriction on the movement of the pressing member and the pressing member moves toward the inspection device, the semiconductor device attached to the pressing surface is provided on the guide member. A second limiting portion that collides with the holding member and restricts the movement of the holding member so as not to come into contact with the inspection device.
Inspection jig equipped with.

After the guide member has been moved by the drive mechanism in a state where the first limiting portion restricts the movement of the pressing member, and before the releasing member releases the restriction on the movement of the pressing member. The first limiting portion limits the movement of the pressing member so that the distance between the semiconductor device and the inspection device attached to the pressing surface is equal to or greater than the first distance.
The second limiting portion limits the movement of the pressing member when the pressing member whose movement is restricted by the releasing member moves a second distance shorter than the first distance. The inspection jig according to claim 1.

The release member is a member fixed at a position facing the inspection device with the holding member interposed therebetween, and the holding member whose movement is restricted by the first limiting portion is moved together with the guide member by the driving mechanism. The inspection jig according to claim 1 or 2, wherein when the device is moved, the pressing member is contacted and pressed.

The pressing member is a tubular member having a side surface connected to the pressing surface, and a recess is formed on the side surface.
The first limiting portion includes a sphere that is arranged at a position facing the side surface and can be fitted into the recess, and an elastic member that presses the sphere toward the side surface. The inspection jig according to any one of claims 1 to 3.

The pressing member is a tubular member having a side surface connected to the pressing surface, and a first convex portion is formed on the side surface.
A first aspect of the present invention, wherein the first limiting portion includes a second convex portion that is arranged at a position facing the side surface and has a top that can be contacted with the top of the first convex portion. The inspection jig according to any one of 3.

The pressing member is a tubular member having a side surface connected to the pressing surface, and a recess is formed on the side surface.
Any of claims 1 to 3, wherein the first limiting portion includes a leaf spring having a convex portion that is arranged at a position facing the side surface and can be fitted into the concave portion. The inspection jig described in item 1.

The guide member is provided between the first limiting portion and the second limiting portion, and the releasing member releases the restriction on the movement of the pressing member by the first limiting portion, and the pressing member is said to be the pressing member. It is further provided with a third limiting portion that restricts the movement of the holding member when it moves toward the inspection device.
The release member presses the pressing member toward the inspection device when the driving mechanism moves the guide member while the third limiting portion restricts the movement of the pressing member. The inspection jig according to any one of claims 1 to 6, wherein the restriction on the movement of the pressing member by the third limiting portion is released.

The inspection jig according to claim 7, wherein a plurality of the third limiting portions are provided between the first limiting portion and the second limiting portion of the guide member.

The first aspect of the present invention is characterized in that an elastic member provided between the guide member and the pressing member is further provided to press the pressing member so that the pressing surface moves in a direction toward the inspection device. Item 8. The inspection jig according to any one of items 8.

Preparation steps to prepare the wafer and
The processing step of forming a circuit on the wafer and
A cutting step for cutting the wafer on which the circuit is formed, and
A mounting step of mounting the cut wafer on a package substrate to make an electronic device,
An inspection step in which the electronic device is pressed against the inspection device by the pressing surface of the inspection jig according to any one of claims 1 to 9, and an inspection is performed.
A movement limiting step in which the guide member is moved by the drive mechanism in the inspection jig and the movement of the holding member is restricted by the first limiting portion,
In a state where the movement of the pressing member is restricted by the first limiting portion, the guide member is moved by the driving mechanism in the inspection jig, and the pressing member by the first limiting portion is moved by the releasing member. The recovery step of releasing the restriction on the movement of the electronic device, restricting the movement of the pressing member by the second limiting portion, peeling the electronic device from the pressing surface, and collecting the electronic device.
A method of manufacturing an electronic device equipped with.