JP2021015296A5 - - Google Patents
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- Publication number
- JP2021015296A5 JP2021015296A5 JP2020182659A JP2020182659A JP2021015296A5 JP 2021015296 A5 JP2021015296 A5 JP 2021015296A5 JP 2020182659 A JP2020182659 A JP 2020182659A JP 2020182659 A JP2020182659 A JP 2020182659A JP 2021015296 A5 JP2021015296 A5 JP 2021015296A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- layer
- support film
- photosensitive layer
- element according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000728 polyester Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000010030 laminating Methods 0.000 claims 2
- 239000000314 lubricant Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 230000001678 irradiating Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
Claims (6)
前記感光層が、バインダーポリマーと、エチレン性不飽和結合を有する光重合性化合物と、光重合開始剤と、を含有し、
前記支持フィルムの前記感光層側の表面における最大径２μｍ以上の欠陥の数が、２ｍｍ２あたり３０個以下であると共に、前記支持フィルムの前記感光層とは反対側の表面における最大径２μｍ以上の欠陥の数よりも少ない、感光性エレメント。 A photosensitive element including a support film and a photosensitive layer arranged on the support film.
The photosensitive layer contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator.
The number of defects having a maximum diameter of 2 μm or more on the surface of the support film on the photosensitive layer side is 30 or less per 2 mm 2 , and the maximum diameter of the support film on the surface opposite to the photosensitive layer is 2 μm or more. Photosensitive elements with fewer defects.
前記樹脂層が、前記感光層とポリエステルフィルムとの間に配置され、The resin layer is arranged between the photosensitive layer and the polyester film, and the resin layer is arranged between the photosensitive layer and the polyester film.
前記滑剤層が、前記ポリエステルフィルムの前記樹脂層とは反対側に配置されている、請求項１に記載の感光性エレメント。The photosensitive element according to claim 1, wherein the lubricant layer is arranged on the side opposite to the resin layer of the polyester film.
活性光線を前記感光層の所定部分に照射して光硬化部を形成する露光工程と、An exposure step of irradiating a predetermined portion of the photosensitive layer with an active ray to form a photocurable portion,
前記感光層における前記光硬化部以外の領域を除去する現像工程と、を備える、レジストパターンの形成方法。A method for forming a resist pattern, comprising a developing step of removing a region other than the photocurable portion of the photosensitive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020182659A JP2021015296A (en) | 2020-10-30 | 2020-10-30 | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020182659A JP2021015296A (en) | 2020-10-30 | 2020-10-30 | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018553617A Division JPWO2018100730A1 (en) | 2016-12-02 | 2016-12-02 | Photosensitive element, resist pattern forming method, and printed wiring board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021015296A JP2021015296A (en) | 2021-02-12 |
| JP2021015296A5 true JP2021015296A5 (en) | 2021-10-14 |
Family
ID=74531417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020182659A Pending JP2021015296A (en) | 2020-10-30 | 2020-10-30 | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2021015296A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024070808A1 (en) * | 2022-09-29 | 2024-04-04 | 味の素株式会社 | Photosensitive film and photosensitive resin composition |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5412039B2 (en) * | 2008-02-06 | 2014-02-12 | 日立化成株式会社 | Photosensitive element, resist pattern forming method using the same, and printed wiring board manufacturing method |
-
2020
- 2020-10-30 JP JP2020182659A patent/JP2021015296A/en active Pending
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