JP2021014588A - Resin composition for underfill, electronic component device and method for producing electronic component device - Google Patents

Abstract

To provide a resin composition for underfill excellent in flowability, filling property, moldability, temperature cycle resistance and moisture resistance, a highly reliable electronic component device at least partially sealed with the resin composition for underfill and a method for producing the electronic component device.SOLUTION: A resin composition for underfill comprises (A) epoxy resin, (B) aromatic amine compound, (C) inorganic filler and (D) organic phosphorus compound.SELECTED DRAWING: None

Description

The present invention relates to an underfill resin composition, an electronic component device, and a method for manufacturing the electronic component device.

Conventionally, in the field of encapsulating semiconductor elements (hereinafter, also referred to as chips) of electronic component devices such as transistors and ICs, resin encapsulation has been the mainstream from the viewpoints of productivity and cost, and encapsulants. Various resin compositions have been applied as. Among them, a resin composition containing an epoxy resin is widely used. The reason is that epoxy resin has an excellent balance of various properties required for sealing materials such as workability, moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to insert products. Is.

As surface mounting of semiconductor elements, so-called bare chip mounting, in which bare chips are mounted directly on a wiring board, has become the mainstream as electronic component devices have become smaller and thinner. Examples of the semiconductor device by mounting the bare chip include COB (Chip on Board), COG (Chip on Glass), TCP (Tape Carrier Package), and the like. In these semiconductor devices, a liquid resin composition containing an epoxy resin is used. The material is widely used as a sealing material.
Further, a semiconductor device (flip) in which a semiconductor element is directly bump-connected on a wiring board (hereinafter, also simply referred to as “board”) having a ceramic, glass / epoxy resin, glass / imide resin, or polyimide film as a substrate. In the chip), a liquid resin composition containing an epoxy resin is used as an underfill material that fills a gap between a bump-connected semiconductor element and a wiring board.
The liquid resin composition containing these epoxy resins plays an important role in protecting electronic components from temperature and humidity and mechanical external forces.

When flip-chip mounting is performed, the coefficient of thermal expansion differs between the element and the substrate, and thermal stress is generated at the joint, so ensuring connection reliability is an important issue. Further, since the circuit forming surface of the bare chip is not sufficiently protected and moisture and ionic impurities easily infiltrate, ensuring moisture resistance reliability is also an important issue. A fillet is formed on the side surface of the chip to protect the chip, but the resin may crack due to the thermal stress caused by the difference in thermal expansion between the underfill material and the chip, and the chip may be destroyed. Depending on the selection of the underfill material, the joint may be fatigued and fractured in a low cycle due to insufficient protection of the connection when repeatedly subjected to thermal shock in a temperature cycle test or the like. Further, if voids are present in the underfill material, the bumps are not sufficiently protected, and in this case as well, the joint portion may be fatigue-fractured in a low cycle.

As described above, the demand for the underfill resin composition having good fluidity and temperature cycle property is increasing. However, when the inorganic filler is highly filled in order to improve the temperature cycle resistance and the like, the underfill resin composition There may be a problem that the viscosity of the product is remarkably increased, the fluidity is lowered, and the moldability is deteriorated.
As an invention for solving the problem, (A) one or more selected from a specific epoxy resin and a specific epoxy compound, (B) an amine-based curing agent, (C) an inorganic filler, and (D) specific silicone fine particles are used. It is known that the underfill resin composition containing a predetermined amount of each can reduce the viscosity of the resin composition and is excellent in fluidity and temperature cycle resistance (see, for example, Patent Document 1).
Further, by using silica having a specific particle size and amorphous silica having a specific particle size in combination, low viscosity can be achieved, and a resin composition for underfill having excellent fluidity and temperature cycle resistance can be obtained. It is known (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2012-144661 Japanese Unexamined Patent Publication No. 2012-149111

While the chip size has been increasing along with the increasing degree of integration and multi-functionality of semiconductor elements in recent years, the diameter of bumps has been reduced, the pitch has been narrowed, and the gap has been narrowed due to the increase in the number of pins. With the miniaturization of equipment, the chip thickness is being reduced. Due to the narrowing of the pitch and the narrowing of the gap, the particle size of the inorganic filler that can be used has become smaller, and therefore it has become difficult to highly fill the resin composition for underfill with the inorganic filler. Further, since the application of the low-viscosity resin may cause a decrease in the glass transition temperature (Tg) and a decrease in the resin strength, it has become difficult to add a large amount of the low-viscosity resin to the resin composition for underfill. There is. Therefore, it is becoming more and more difficult to achieve both high fluidity and reliability (for example, temperature cycle resistance and moisture resistance).
The present invention has been made in view of such circumstances, and is based on an underfill resin composition having excellent fluidity, filling property, moldability, temperature cycle resistance and moisture resistance, and the underfill resin composition. An object of the present invention is to provide a highly reliable electronic component device in which at least a part thereof is sealed and a method for manufacturing the electronic component device.

As a result of diligent studies to solve the above problems, the present inventors have provided an underfill resin composition containing an epoxy resin, an aromatic amine compound, an inorganic filler and an organic phosphorus compound. It has been found that low viscosity can be achieved while highly filling the inorganic filler, and as a result, fluidity, filling property, moldability, temperature cycle resistance and moisture resistance can be satisfied. It has also been found that the reliability of the electronic component device in which at least a part of the resin composition for underfill is sealed is high.

That is, the present invention relates to the following [1] to [11].
[1] An underfill resin composition containing (A) an epoxy resin, (B) an aromatic amine compound, (C) an inorganic filler, and (D) an organic phosphorus compound.
[2] (D) The organic phosphorus compound has a phosphine compound, a phosphine oxide compound, a phosphonic acid ester, a phosphite ester, a phosphoric acid ester, a phosphoran compound, a phosphalken compound, a phosphaalkin compound, and a common weight having a phosphoric acid ester group. The resin composition for underfill according to the above [1], which is one or more selected from the group consisting of coalescence.
[3] The (D) organophosphorus compound is at least one selected from the group consisting of triphenylphosphine, tris (p-methoxyphenyl) phosphine, triphenylphosphine oxide and a copolymer having a phosphate ester group. The resin composition for underfill according to the above [1] or [2].
[4] The underfill resin according to any one of the above [1] to [3], wherein the (A) epoxy resin is at least one selected from the group consisting of a bisphenol type epoxy resin and a glycidylamine type epoxy resin. Composition.
[5] The aromatic amine compound (B) is at least one selected from the group consisting of diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane and dimethylthiotoluenediamine. ] To [4]. The resin composition for underfill.
[6] The resin for underfill according to any one of the above [1] to [5], wherein the content of the inorganic filler (C) is 40 to 80% by mass with respect to the total amount of the resin composition for underfill. Composition.
[7] The underfill resin according to any one of the above [1] to [6], wherein the content of the inorganic filler (C) is 60 to 75% by mass with respect to the total amount of the resin composition for underfill. Composition.
[8] The underfill according to any one of the above [1] to [7], wherein the content of the (D) organic phosphorus compound is 0.001 to 10% by mass with respect to the (C) inorganic filler. Resin composition.
[9] Any of the above [1] to [8], wherein the viscosity measured by an E-type viscometer under the conditions of 110 ° C. and a shear rate of 32.5 s- ¹ is 0.01 to 0.25 Pa · s. The resin composition for underfill described in 1.
[10] Any of the above [1] to [9] that seals at least a part of the support member, the electronic component arranged on the support member, and the connection portion between the support member and the electronic component. An electronic component device including a cured product of the resin composition for underfill described in.
[11] A method for manufacturing an electronic component device in which a support member and an electronic component are electrically connected via a connecting portion, wherein at least a part of the connecting portion is made of any of the above [1] to [9]. A method for manufacturing an electronic component device, which comprises a step of sealing using the resin composition for underfill described in 1.

According to the present invention, an underfill resin composition having excellent fluidity, filling property, moldability, temperature cycle resistance and moisture resistance, and a reliability in which at least a part of the underfill resin composition is sealed. It is possible to provide an electronic component device having high performance and a method for manufacturing the electronic component device.

In the present specification, the term "process" is included in this term as long as the intended purpose of the process is achieved, not only in an independent process but also in the case where it cannot be clearly distinguished from other processes. .. In addition, the numerical range indicated by using "-" in the present specification indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively.
In the present specification, the content of each component in the resin composition refers to the content of each component in the resin composition when a plurality of substances corresponding to each component are present in the resin composition, unless otherwise specified. It means the total content.
Further, in the present specification, "normal temperature" means 25 ° C. Further, "liquid" means that it is liquid at room temperature unless otherwise specified, and means that the viscosity measured by an E-type viscometer at room temperature is 1000 Pa · s or less. "Solid" means solid, that is, solid at room temperature, unless otherwise noted.

[Resin composition for underfill]
The resin composition for underfill of the present invention contains (A) an epoxy resin, (B) an aromatic amine compound, (C) an inorganic filler, and (D) an organic phosphorus compound.
Hereinafter, each component and physical properties of the resin composition for underfill of the present invention will be described in order.

<(A) Epoxy resin>
As the epoxy resin (A), an epoxy resin generally used in a resin composition for underfill can be used without particular limitation. For example, an epoxy resin having two or more epoxy groups in one molecule. Is preferable.
The epoxy resin (A) may be solid or liquid at room temperature, but is preferably liquid at room temperature from the viewpoint of filling property. As the epoxy resin, in particular, as the epoxy resin liquid at room temperature (hereinafter, also referred to as “liquid epoxy resin”), a liquid epoxy resin generally used in a resin composition for underfill can be used. The liquid epoxy resin preferably has a viscosity measured by an E-type viscometer at room temperature, for example, 0.0001 to 10 Pa · s.
Examples of such (A) epoxy resin include diglycidyl ether type epoxy resins such as bisphenol A, bisphenol F, bisphenol AD, bisphenol S, and hydrogenated bisphenol A; orthocresol novolac type epoxy resin. Epoxy of novolak resin obtained from phenols and aldehydes such as; glycidyl ester type epoxy resin obtained by reaction of polybasic acids such as phthalic acid and dimer acid with epichlorohydrin; p-aminophenol, diaminodiphenylmethane , Glycidylamine type epoxy resin obtained by reacting an amine compound such as isocyanuric acid with epichlorohydrin; linear aliphatic epoxy resin and alicyclic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid. Can be mentioned. As the epoxy resin (A), one type may be used alone, or two or more types may be used in combination.
Among these, for example, a bisphenol type epoxy resin is preferable from the viewpoint of fluidity, and for example, a glycidylamine type epoxy resin is preferable from the viewpoint of heat resistance, adhesiveness and fluidity. Therefore, the epoxy resin (A) is preferably one or more selected from the group consisting of the bisphenol type epoxy resin and the glycidylamine type epoxy resin.
The bisphenol type epoxy resin is composed of a bisphenol A diglycidyl ether type epoxy resin (bisphenol A type epoxy resin) and a bisphenol F diglycidyl ether type epoxy resin (bisphenol F type epoxy resin) from the viewpoint of fluidity. One or more selected from the group is preferable. When the bisphenol A type epoxy resin and the bisphenol F type epoxy resin are used in combination, the mass ratio (bisphenol A type epoxy resin: bisphenol F type epoxy resin) is not particularly limited, but from the viewpoint of heat resistance, adhesiveness and fluidity. Therefore, for example, it is preferably 5:95 to 50:50, more preferably 10:90 to 40:60, and even more preferably 20:80 to 40:60.
Further, the bisphenol type epoxy resin and the glycidylamine type epoxy resin are preferably liquid at room temperature from the viewpoint of fluidity.

The bisphenol type epoxy resin and the glycidylamine type epoxy resin may be used alone or in combination of two or more, but from the viewpoint of heat resistance, adhesiveness and fluidity, the bisphenol type may be used. It is preferable to use an epoxy resin and a glycidylamine type epoxy resin in combination.
The total content of the bisphenol type epoxy resin and the glycidylamine type epoxy resin is not particularly limited, but from the viewpoint of heat resistance, adhesiveness and fluidity, for example, 20% by mass or more with respect to the total amount of the (A) epoxy resin. It is more preferably 30% by mass or more, further preferably 50% by mass or more, and particularly preferably 80% by mass or more. The upper limit of the total content is not particularly limited, and can be determined within a range in which desired properties and properties can be obtained from the viewpoints of viscosity, glass transition temperature, heat resistance, etc., and may be 100% by mass.
When the bisphenol type epoxy resin and the glycidylamine type epoxy are used in combination, the mass ratio (bisphenol type epoxy resin: glycidylamine type epoxy) is not particularly limited, but from the viewpoint of heat resistance, adhesiveness and fluidity. For example, it is preferably 20:80 to 95: 5, more preferably 40:60 to 90:10, and even more preferably 60:40 to 80:20.

Further, in the resin composition for underfill of the present invention, an epoxy resin solid at room temperature can also be used.
From the viewpoint of fluidity, the content of the epoxy resin solid at room temperature is preferably, for example, 0 to 20% by mass, and preferably 0 to 10% by mass, based on the total amount of the epoxy resin (A). It is more preferably 0 to 5% by mass, further preferably 0 to 5% by mass.

The epoxy equivalent of the epoxy resin (A) is not particularly limited, but is preferably 60 to 400 g / mol, more preferably 70 to 300 g / mol, and further preferably 80 to 250 g / mol from the viewpoint of heat resistance.
Here, the epoxy equivalent is the mass (g / eq) of the resin per epoxy group, and can be measured according to the method specified in JIS K 7236. Specifically, using the automatic titrator "GT-200 type" of Mitsubishi Chemical Analytech Co., Ltd., weigh 2 g of epoxy resin in a 200 ml beaker, drop 90 ml of methyl ethyl ketone, dissolve it in an ultrasonic washer, and then use glacial acetic acid. It is obtained by adding 10 ml and 1.5 g of cetyltrimethylammonium bromide and titrating with a 0.1 mol / L perchloric acid / acetic acid solution.

The purity of the epoxy resin (A) is preferably high. In particular, the amount of hydrolyzable chlorine is preferably small because it is related to corrosion of aluminum wiring on elements such as ICs (Integrated Circuits), and from the viewpoint of obtaining a resin composition for underfill having excellent moisture resistance, for example, 500 ppm or less. Is preferable.
Here, the amount of hydrolyzable chlorine was determined by dissolving 1 g of the epoxy resin of the sample in 30 ml of dioxane, adding 5 ml of a 1N-KOH (potassium hydroxide) methanol solution, refluxing for 30 minutes, and then potentiometric titration. It is based on the value.

The content of the (A) epoxy resin in the resin composition for underfill of the present invention is not particularly limited, but from the viewpoint of heat resistance, adhesiveness and fluidity, the resin composition excluding (C) the inorganic filler Of the total amount of the above, for example, it is preferably 40 to 90% by mass, more preferably 50 to 80% by mass, and further preferably 55 to 70% by mass.

<(B) Aromatic amine compound>
The aromatic amine compound (B) can be used without particular limitation as long as it is an aromatic amine compound that functions as a curing agent for the epoxy resin (A). Compared with amine-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, etc., which are known as epoxy resin curing agents, aromatic amine compounds are excellent in temperature cycle resistance, moisture resistance, etc. The reliability of the semiconductor device can be improved.
(B) The aromatic amine compound is, for example, one or more selected from the group consisting of a primary amino group and a secondary amino group in one molecule (hereinafter, also simply referred to as “amino group”). It is preferably a compound containing, more preferably a compound having 2 to 4 amino groups, and further preferably an aromatic diamine compound having 2 amino groups.
The aromatic amine compound (B) may be solid or liquid at room temperature, but is preferably liquid at room temperature from the viewpoint of fluidity of the resin composition for underfill. ..

Examples of the aromatic amine compound (also referred to as a liquid aromatic amine compound) that is liquid at room temperature include 3,5-diethyltoluene-2,4-diamine and 3,5-diethyltoluene-2,6-diamine. Diethyltoluenediamine, 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,6-diaminobenzene, 1,3,5-triethyl-2,6- Examples thereof include diaminobenzene, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,5,3', 5'-tetramethyl-4,4'-diaminodiphenylmethane and dimethylthiotoluenediamine.
As the aromatic amine compound (B), one type may be used alone, or two or more types may be used in combination.
Among these, from the viewpoint of storage stability, for example, one or more selected from the group consisting of diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane and dimethylthiotoluenediamine is preferable, and diethyl. One or more selected from the group consisting of toluenediamine and 3,3'-diethyl-4,4'-diaminodiphenylmethane is preferable.
From the viewpoint of storage stability, the content of diethyltoluenediamine in the (B) aromatic amine compound is preferably 20 to 70% by mass, more preferably 30 to 55% by mass.

As the liquid aromatic amine compound, a commercially available product may be used. Examples of commercially available liquid aromatic amine compounds include JER Cure W (manufactured by Japan Epoxy Resin Co., Ltd., trade name), Kayahard (registered trademark) AA, Kayahard (registered trademark) AB, and Kayahard (registered trademark). ) AS (manufactured by Nippon Kayaku Co., Ltd., product name), Totoamine HM-205 (manufactured by Toto Kasei Co., Ltd., product name), Adeca Hardener (registered trademark) EH-101 (manufactured by ADEKA Co., Ltd., product name) , Epomic (registered trademark) Q-640, Epomic (registered trademark) Q-643 (manufactured by Mitsui Kagaku Co., Ltd., trade name), DETDA80 (manufactured by Lonza, trade name) and the like are available.

Other known curing agents other than (B) aromatic amine compounds, such as phenol-based curing agents and acid anhydride-based curing agents, may be used in combination as long as the effects of the present invention are not impaired. The content of the curing agent is preferably, for example, 20 parts by mass or less with respect to 100 parts by mass of the (B) aromatic amine compound from the viewpoint of filling property, moldability, temperature cycle resistance and moisture resistance. It is more preferably 10 parts by mass or less, and further preferably 5 parts by mass or less.

As the (B) aromatic amine compound, the (B) aromatic amine compound which is solid at room temperature can also be used.
From the viewpoint of fluidity, the content of the (B) aromatic amine compound, which is solid at room temperature, is preferably 0 to 20% by mass, for example, 0 to 20% by mass, based on the total amount of the (B) aromatic amine compound. It is more preferably 10% by mass, further preferably 0 to 5% by mass.

The active hydrogen equivalent of the aromatic amine compound (B) is not particularly limited, but is preferably 10 to 200 g / mol, for example, from the viewpoint of filling property, moldability, temperature cycle resistance and moisture resistance. It is more preferably ~ 120 g / mol, and even more preferably 30 to 75 g / mol.

Epoxy ratio of (A) epoxy resin to (B) aromatic amine compound in the resin composition for underfill of the present invention ((A) Number of moles of epoxy group of epoxy resin / (B) Activity of aromatic amine compound The number of moles of hydrogen) is not particularly limited, but is preferably 0.7 to 1.6, preferably 0.8 to 1.4, for example, from the viewpoint of suppressing the unreacted components of each. More preferably, it is more preferably 0.9 to 1.2.

<(C) Inorganic filler>
The inorganic filler (C) is not particularly limited, but for example, silica such as molten silica and crystalline silica, alumina such as calcium carbonate, clay and alumina oxide, silicon nitride, silicon carbide, boron nitride, calcium silicate and titanium. Examples thereof include powders of potassium acid, aluminum nitride, beryllia, zirconia, zircone, forsterite, steatite, spinel, mulite, titania and the like, or spherical beads and glass fibers thereof.
(C) As the inorganic filler, an inorganic filler having a flame-retardant effect may be used. Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate, zinc molybdate and the like.
(C) As the inorganic filler, one type may be used alone, or two or more types may be used in combination.
Among these, for example, silica is preferable, and fused silica is more preferable, from the viewpoint of availability, chemical stability, and material cost. The particle shape of the inorganic filler (C) is not particularly limited and may be irregular or spherical, but from the viewpoint of fluidity and permeability into the fine gaps of the resin composition for the underfill material. Spherical silica, particularly spherical fused silica is preferably used.

Further, the inorganic filler (C) may be surface-treated. Specifically, the inorganic filler (C) may be surface-treated with a silane coupling agent. Examples of the silane coupling agent include aminosilane-based coupling agents, epoxysilane-based coupling agents, phenylsilane-based coupling agents, alkylsilane-based coupling agents, alkenylsilane-based coupling agents, and alkynylsilane-based coupling agents. Haloalkylsilane-based coupling agent, siloxane-based coupling agent, hydrosilane-based coupling agent, silazane-based coupling agent, alkoxysilane-based coupling agent, chlorosilane-based coupling agent, (meth) acrylic silane-based coupling agent, aminosilane-based Examples thereof include coupling agents, isocyanuratesilane-based coupling agents, ureidosilane-based coupling agents, mercaptosilane-based coupling agents, sulfidesilane-based coupling agents, and isocyanatesilane-based coupling agents.

The volume average particle diameter of the inorganic filler (C) is not particularly limited, but is preferably 0.1 to 10 μm, more preferably 0.3 to 5 μm, and 0.5 to 3 μm, for example. Is even more preferable. By setting the volume average particle size of the (C) inorganic filler to 0.1 μm or more, the dispersibility in the epoxy resin (A) is improved, and thixotropic properties are less likely to be imparted to the underfill resin composition, resulting in underfilling. The flow characteristics of the resin composition for filling tend to be improved. On the other hand, when the thickness is 10 μm or less, the sedimentation of the (C) inorganic filler in the underfill resin composition tends to be easily suppressed, and the penetration into the fine gaps as the underfill resin composition tends to be easy. There is a tendency that the property and fluidity are improved and the generation of voids and unfilled portions can be suppressed.
The volume average particle size is the particle size of points corresponding to 50% of the volume when the cumulative frequency distribution curve by the particle size is obtained with the total volume of the particles as 100%, and the laser diffraction scattering method is used. It can be measured with the particle size distribution measuring device or the like.

The content of the (C) inorganic filler in the resin composition for underfill of the present invention is not particularly limited, but may be, for example, 40 to 80% by mass with respect to the total amount of the resin composition for underfill. Preferably, it may be 50 to 75% by mass, or 60 to 75% by mass. (C) When the content of the inorganic filler is 40% by mass or more, the effect of reducing the coefficient of thermal expansion and the effect of improving the temperature cycle resistance tend to be easily obtained, and when it is 80% by mass or less, it tends to be obtained. The underfill resin composition tends to suppress an increase in viscosity and improve fluidity, permeability and dispensability. In particular, from the viewpoint of the effect of improving the temperature cycle resistance, the higher the lower limit of the content of the (C) inorganic filler, the more preferable. In the present invention, it is possible to maintain the underfill resin composition at a low viscosity even if the content of the (C) inorganic filler is increased as described above.

<(D) Organophosphorus compound>
(D) The organic phosphorus compound is a compound having an organic group and a phosphorus atom in the molecule. As the organic group, an aromatic hydrocarbon group having 6 to 14 carbon atoms is preferable from the viewpoint of fluidity, filling property and temperature cycle resistance. Examples of the aromatic hydrocarbon group include a phenyl group, a naphthyl group, an anthryl group and the like. The aromatic hydrocarbon group may be substituted with one or more substituents selected from the group consisting of an alkyl group having 1 to 5 carbon atoms and an alkoxyl group having 1 to 5 carbon atoms.
(D) The use of the organic phosphorus compound has the effect of lowering the viscosity of the resin composition for underfilling. The exact reason why this effect is exhibited is unknown, but it is presumed that (D) the organic phosphorus compound has the effect of adsorbing on the surface of the (C) inorganic filler and suppressing hydrogen bonds between the inorganic fillers. To do. In addition, the three-dimensional effect of the main skeleton of the organic phosphorus compound (D) improves the dispersion stabilization of the inorganic filler, thereby obtaining the effect of preventing the precipitation of the inorganic filler (C). Guess.
Examples of the organic phosphorus compound include a phosphine compound, a phosphine oxide compound, a phosphonic acid ester, a phosphite ester, a phosphoric acid ester, a phosphoran compound, a phosphalken compound, a phosphaalkin compound, and a common weight having a phosphoric acid ester group. Coalescence and the like can be mentioned. Among them, a phosphine compound, a phosphine oxide compound, and a copolymer having a phosphoric acid ester group are preferable from the viewpoint of fluidity, filling property, temperature cycle resistance, and moisture resistance of the resin composition for underfill.
As the organic phosphorus compound (D), one type may be used alone, or two or more types may be used in combination.

Examples of the phosphine compound include triphenylphosphine, diphenyl (p-tryl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkylalkoxyphenyl) phosphine, tris (dialkylphenyl) phosphine, and tris (tris). Trialkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, etc. Can be mentioned. Among these, triphenylphosphine and tris (alkoxyphenyl) phosphine are preferable from the viewpoint of fluidity, filling property, temperature cycle resistance and moisture resistance. As the tris (alkoxyphenyl) phosphine, for example, tris (p-methoxyphenyl) phosphine and the like are preferable.

Examples of the phosphine oxide compound include diphenylphosphine oxide, diphenylvinylphosphine oxide, triphenylphosphine oxide, (2,5-dihydroxyphenyl) diphenylphosphine oxide, (p-hydroxyphenyl) diphenylphosphine oxide, and bis (p-hydroxyphenyl). ) Phosphine oxide, tris (p-hydroxyphenyl) phosphine oxide and the like. Among these, triphenylphosphine oxide is preferable from the viewpoint of fluidity, filling property, temperature cycle resistance and moisture resistance.

The copolymer having a phosphoric acid ester group is not particularly limited as long as it is a copolymer having a phosphoric acid ester group in the molecule. It is convenient to use a commercially available product, and for example, BYK-W9010 (manufactured by Big Chemie Japan Co., Ltd., trade name) and the like can be used.

The content of the (D) organic phosphorus compound in the resin composition for underfill of the present invention is not particularly limited, but is, for example, 0.001 to 10% by mass with respect to the total amount of the (C) inorganic filler. It is preferable, it is more preferably 0.01 to 5% by mass, and further preferably 0.01 to 2% by mass.

<Other ingredients>
The resin composition for underfill of the present invention may contain other components in addition to the above-mentioned components (A) to (D). Examples of other components include known components that can be contained in the resin composition for underfill, and examples thereof include flexible agents, curing accelerators, coupling agents, ion trap agents, colorants, diluents, leveling agents, and the like. Examples include antifoaming agents.

(Flexible agent)
When a flexible agent is used, an effect of improving the thermal shock resistance of the resin composition for underfill and an effect of reducing stress on the semiconductor element can be obtained. The flexible agent is not particularly limited, but rubber particles are preferable. Examples of the rubber particles include rubber particles such as styrene-butadiene rubber (SBR), nitrile-butadiene rubber (NBR), butadiene rubber (BR), urethane rubber (UR), acrylic rubber (AR), and silicone rubber. ..
As the flexible agent, one type may be used alone, or two or more types may be used in combination.
Examples of the silicone rubber particles include silicone rubber particles cross-linked with polyorganosiloxane such as linear polydimethylsiloxane, polymethylphenylsiloxane, and polydiphenylsiloxane; the surface of the silicone rubber particles is coated with silicone resin; and emulsified. Examples thereof include core-shell polymer particles composed of a core of solid silicone particles obtained by polymerization and the like and a shell of an organic polymer such as an acrylic resin.
The shape of these silicone rubber particles may be amorphous or spherical, but in order to keep the viscosity of the underfill resin composition low, it is preferable to use spherical ones. Commercially available silicone rubber particles are available from Toray Dow Corning Silicone Co., Ltd., Shin-Etsu Chemical Co., Ltd., and the like.

The average primary particle diameter of the rubber particles is preferably 0.05 to 10 μm, more preferably 0.1 to 5 μm. When the average primary particle size is 0.05 μm or more, the dispersibility in the resin composition for underfill tends to be improved, and when it is 10 μm or less, the stress reduction effect tends to be improved. , The permeability and fluidity of the resin composition for underfilling into fine gaps are improved, and the generation of voids and unfilled portions tends to be easily suppressed. It is advantageous that the primary particle size of the rubber particles is small in order to uniformly modify the resin composition for underfill.

When the resin composition for underfill contains a flexible agent, the content thereof is preferably 1 to 30% by mass of the entire resin composition for underfill excluding (C) the inorganic filler. It is more preferably about 20% by mass, and even more preferably 4 to 12% by mass. When the content of the flexible agent is 1% by mass or more, the low stress effect tends to be large, and when it is 30% by mass or less, the viscosity of the resin composition for underfill is reduced, and the moldability and moldability are reduced. Liquidity tends to improve.

(Curing accelerator)
The resin composition for underfill of the present invention contains, if necessary, a curing accelerator from the viewpoint of accelerating the reaction between the (A) epoxy resin and the (B) aromatic amine compound. May be good.
The curing accelerator is not particularly limited, and conventionally known ones can be used. For example, 1,8-diazabicyclo [5.4.0] undecene-7, 1,5-diazabicyclo [4.3.0] nonen, 5,6-dibutylamino-1,8-diazabicyclo [5.4.0] ] Cycloamidine compounds such as undecene-7; tertiary amine compounds such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-ethyl-4 -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Imidazole compounds such as phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6- (2'-methylimidazolyl- (1'))-ethyl-s-triazine, 2-heptadecylimidazole; 2 Examples thereof include phenylborone salts such as −ethyl-4-methylimidazole tetraphenylborate and N-methylmorpholintetraphenylborate.
Further, as a curing accelerator having potential, core-shell particles formed by coating a core containing a compound having an amino group solid at room temperature with a shell containing an epoxy compound solid at room temperature can be mentioned. Commercially available products of the core-shell particles include Amicure (registered trademark) (manufactured by Ajinomoto Co., Ltd., trade name), Novacure in which microencapsulated amines are dispersed in bisphenol A type epoxy resin and bisphenol F type epoxy resin. Registered trademark) (manufactured by Asahi Kasei Chemicals Co., Ltd., product name), etc. can be used.
As the curing accelerator, one type may be used alone, or two or more types may be used in combination.

When the resin composition for underfill of the present invention contains a curing accelerator, the content of the curing accelerator has a curing promoting effect of (A) epoxy resin and (B) aromatic amine compound. The amount to be expressed is not particularly limited, and may be appropriately selected depending on the type of curing accelerator to be used and the like. For example, it is preferably 0.1 to 40 parts by mass, more preferably 0.5 to 20 parts by mass, and 0.5 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin (A). Is even more preferable. When the content of the curing accelerator is 0.1 part by mass or more with respect to 100 parts by mass of the epoxy resin (A), the curability at low temperature tends to be good, and when it is 40 parts by mass or less, the curing accelerator tends to be good. The curing rate tends to be easily controlled, and the storage stability of pot life, shell life, etc. tends to be improved.

(Coupling agent)
The resin composition for underfill of the present invention has a viewpoint of strengthening the interfacial adhesion between (A) epoxy resin and (C) inorganic filler and (A) interfacial adhesion between the epoxy resin and the constituent members of electronic components, and From the viewpoint of improving the filling property, a coupling agent may be contained if necessary.
The coupling agent is not particularly limited, and conventionally known ones can be used. For example, one or more kinds selected from the group consisting of a primary amino group, a secondary amino group and a tertiary amino group may be used. Examples thereof include silane compounds such as aminosilane, epoxysilane, mercaptosilane, alkylsilane, ureidosilane, and vinylsilane; titanium compounds; aluminum chelate; aluminum / zirconium compounds. Among these, from the viewpoint of reactivity with silica, for example, a silane compound is preferable, and epoxysilane is more preferable.
Examples of the epoxy silane include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, and the like. Among these, for example, γ-glycidoxypropylmethyldimethoxysilane is preferable from the viewpoint of reactivity to silica.
One type of coupling agent may be used alone, or two or more types may be used in combination.

When the resin composition for underfill of the present invention contains a coupling agent, the content of the coupling agent is not particularly limited, but the epoxy resin (A) and the inorganic filler (C) From the viewpoint of strengthening the interfacial adhesion of (A) epoxy resin and the constituent members of electronic components, and improving the filling property, for example, 0.05 with respect to the total amount of the resin composition for underfill. It is preferably 10% by mass, more preferably 0.1 to 5% by mass, and even more preferably 0.1 to 3% by mass.

<Ion trap agent>
The resin composition for underfill of the present invention may contain an ion trap agent, if necessary, from the viewpoint of improving migration resistance, moisture resistance and high temperature standing characteristics of semiconductor elements such as ICs. Good.
The ion trapping agent is not particularly limited, and examples thereof include an ion trapping agent represented by the following composition formula (I) or (II).
Mg _1-x Al _x (OH) ₂ (CO ₃ ) _{x / 2} · mH ₂ O (I)
(0 <X ≤ 0.5, m is a positive number)
BiO _x (OH) _y (NO ₃ ) _z (II)
(0.9 ≦ x ≦ 1.1, 0.6 ≦ y ≦ 0.8, 0.2 ≦ z ≦ 0.4)
(However, 2x + y + z = 3.)

The compound represented by the composition formula (I) or (II) is available as a commercially available product. As a commercially available product of the compound represented by the composition formula (I), for example, "DHT-4A" (manufactured by Kyowa Chemical Industry Co., Ltd., trade name) is available. Further, as a commercially available product of the compound represented by the above composition formula (II), for example, "IXE500" (manufactured by Toagosei Co., Ltd., trade name) is available.
One type of ion trapping agent may be used alone, or two or more types may be used in combination.
The average particle size of the ion trap agent is not particularly limited, but is preferably 0.1 to 3 μm, and the maximum particle size is, for example, 10 μm or less.
When the resin composition for underfill of the present invention contains an ion trapping agent, the content of the ion trapping agent is preferably, for example, 0.1 to 3% by mass, and 0.3 to 3% by mass. More preferably, it is 1.5% by mass.
In addition, the resin composition for underfill of the present invention may contain other anion exchangers, if necessary. The other anion exchanger is not particularly limited, and conventionally known ones can be used. For example, hydroxylation-containing one or more elements selected from the group consisting of magnesium, aluminum, titanium, zirconium, antimony and the like. Items and the like may be mentioned, and one type may be used alone, or two or more types may be used in combination.

The resin composition for underfill of the present invention may be prepared by any method as long as the above various components can be sufficiently dispersed and mixed. For example, it can be obtained by weighing each of the above-mentioned components in a predetermined blending amount, mixing and kneading with a mixer such as a grinder, a mixing roll, and a planetary mixer, and defoaming as necessary.
The mixing and kneading conditions may be appropriately determined according to the type of raw material and the like, but it is preferable to select conditions in which each of the above components is sufficiently (preferably uniformly) mixed and dispersed.

(Viscosity of resin composition for underfill)
The underfill resin composition of the present invention is preferably liquid at room temperature. That is, the viscosity of the resin composition for underfill of the present invention measured with an E-type viscometer at room temperature is preferably 1,000 Pa · s or less, for example. When the viscosity is 1,000 Pa · s or less, it is easy to secure fluidity and permeability capable of responding to recent miniaturization of electronic components, fine pitch of connection terminals of semiconductor elements, and fine wiring of wiring boards. ..
In particular, the viscosity of the underfill resin composition at the time of underfilling is also important, and the underfill resin is measured at a temperature at the time of underfilling (70 to 130 ° C.), for example, 110 ° C. according to the method described in Examples. From the same viewpoint as described above, the viscosity of the composition is, for example, preferably 500 Pa · s or less, more preferably 100 Pa · s or less, further preferably 10 Pa · s or less, and 3 Pa · s or less. It is even more preferably 0.25 Pa · s or less, and most preferably 0.20 Pa · s or less. The lower limit of the viscosity is not particularly limited, but from the viewpoint of mountability, for example, it is preferably 0.01 Pa · s or more, more preferably 0.5 Pa · s or more, and 0.1 Pa · s or more. Is more preferable. In particular, the viscosity is preferably 0.01 to 0.25 Pa · s, more preferably 0.01 to 0.20 Pa · s, and even more preferably 0.05 to 0.20 Pa · s.
The viscosity may be appropriately adjusted according to the type of electronic component and electronic component device to be sealed. The viscosity can be adjusted, for example, by controlling the type, content, etc. of each component exemplified above.

<Use of resin composition for underfill>
The resin composition for underfill of the present invention can be used for supporting members such as lead frames, pre-wired tape carriers, rigid and flexible wiring boards, glass, and silicone wafers, and active elements such as semiconductor chips, transistors, diodes, and thyristors. It can be applied to semiconductor devices equipped with electronic components such as capacitors, diodes, resistance arrays, coils, and passive elements such as switches.
In particular, the underfill resin composition of the present invention is suitable as a highly reliable underfill resin composition for flip chips. Specifically, it is suitable for semiconductor devices such as flip chip BGA / LGA and COF (Chip On Film) in which a semiconductor element is flip-chip bonded by bump connection to a rigid and flexible wiring plate or a wiring formed on glass. is there.

[Electronic component equipment]
The electronic component device of the present invention seals at least a part of a support member, an electronic component arranged on the support member, and a connection portion between the support member and the electronic component. It is an electronic component device including a cured product of a resin composition for use.
A preferred embodiment of the semiconductor device including the support member, the electronic component, etc., which constitutes the electronic component device of the present invention is the same as the semiconductor device mentioned in the description of the use of the resin composition for underfill of the present invention. is there.
In the electronic component device of the present invention, at least a part of the connection portion between the support member and the electronic component may be sealed with the cured product of the resin composition for underfill of the present invention, but all of the connection portions. Is preferably sealed.

[Manufacturing method of electronic component equipment]
The method for manufacturing an electronic component device of the present invention is a method for manufacturing an electronic component device in which a support member and an electronic component are electrically connected via a connection portion, and at least a part of the connection portion is of the present invention. This is a method for manufacturing an electronic component device, which comprises a step of sealing using the resin composition for underfilling.
A preferred embodiment of the semiconductor device including the support member, the electronic component, etc. used in the method for manufacturing the electronic component device of the present invention is the semiconductor device mentioned in the description of the use of the resin composition for underfill of the present invention. Is similar to.
In the method for manufacturing an electronic component device of the present invention, at least a part of a connection portion between a support member and an electronic component may be sealed with the resin composition for underfill of the present invention, but the entire connection portion is sealed. It is preferable to stop.
The method for sealing the connection portion between the support member and the electronic component using the resin composition for underfill of the present invention is not particularly limited, and conventionally known methods such as a dispensing method, a casting method, and a printing method can be used. Can be applied.

Next, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
The test methods of the characteristic tests performed in Examples and Comparative Examples are summarized below.

The specifications of the semiconductor device used for the evaluation of the resin composition for underfill obtained in Examples and Comparative Examples are as follows.
-Semiconductor element size: 20 mm x 20 mm x 0.55 mm thickness (Circuit: Aluminum daisy chain connection, Passivation: Polyimide film HD4000, manufactured by Hitachi Kasei DuPont Microsystems, Inc.)
-Type of bump: Solder ball (Sn-Ag-Cu, diameter 80 μm, 7,744 pin)
・ Bump pitch: 190 μm
-Type of substrate (core): FR-5 (Solder resist SR7200, manufactured by Hitachi Kasei Co., Ltd., 60 mm x 60 mm x 0.8 mm thickness)
・ Gap between substrate and chip: 50 μm

[Sealing and curing conditions]
80 mg of the resin composition for underfill obtained in Examples and Comparative Examples is applied (underfilled) to the gap between the substrate and the element of the semiconductor device by a dispense method under the condition of 110 ° C., and then 2 at 150 ° C. A semiconductor device was manufactured by sealing the gap by curing in air for a long time.

[Evaluation of the physical properties]
The resin compositions for underfill obtained in Examples and Comparative Examples were evaluated by the following tests. The evaluation results are shown in Table 1.

(1) 110 ° C viscosity (evaluation of fluidity)
The viscosity of the resin composition for underfill at 110 ° C. was measured with an E-type viscometer "AR2000" (manufactured by TA Instruments) using a 40 mm parallel plate (gap: 500 μm) at a shear rate of 32.5 s ^-1. It was measured under the conditions of. From the viewpoint of fluidity in a narrow gap, 0.25 Pa · s or less is preferable, and 0.20 Pa · s or less is more preferable.

(2) Impregnation time (evaluation of filling property)
The semiconductor device is placed on a hot plate heated to 110 ° C., 100 mg of the underfill resin composition is dropped onto the side surface (one side) of the chip by a dispense method, and the underfill resin composition permeates into the opposite side surface. Time to time was measured. It is preferably 110 seconds or less, and more preferably 100 seconds or less.

(3) Presence or absence of voids (evaluation of moldability)
The inside of 10 semiconductor devices after sealing is observed with an ultrasonic flaw detector "AT-5500" (manufactured by Hitachi Construction Machinery Co., Ltd.), the presence or absence of voids is examined, and the number of semiconductor devices having voids (there are voids). The number of semiconductor devices / 10) was measured. The smaller the number of semiconductor devices in which voids are present, the better the moldability.

(4) Evaluation of reliability (4-1) Temperature cycle resistance A semiconductor device produced by underfilling a resin composition for underfilling is processed for 2000 cycles in a heat cycle of −55 ° C. to 125 ° C. for 30 minutes each. Then, a continuity test was performed every 1000 cycles to check for disconnection defects in the aluminum wiring and pads, and evaluated by the number of defective packages / the number of evaluation packages.
(4-2) Moisture resistance A semiconductor device produced by underfilling a resin composition for underfilling is treated for 200 hours under HAST conditions of 130 ° C. and 85% RH, and then the presence or absence of disconnection of aluminum wiring and pads is conducted. It was confirmed by a test and evaluated by the number of defective packages / the number of evaluation packages.

[Examples 1 to 8 and Comparative Examples 1 to 4]
Each component shown in Table 1 is blended in the composition shown in Table 1, kneaded and dispersed by a three-roll and vacuum grinder, and then the resin compositions for underfill of Examples 1 to 8 and Comparative Examples 1 to 4 are used. Made. The unit in the compounding composition in Table 1 is a mass part unless otherwise specified, and blanks indicate no compounding.
The abbreviations and the like in Table 1 are as follows.

(Epoxy resin)
Epoxy resin 1: A liquid diepoxy resin with an epoxy equivalent of 160 g / mol obtained by epoxidizing bisphenol F (manufactured by Mitsubishi Chemical Corporation, trade name "jER806").
-Epoxy resin 2: A liquid diepoxy resin having an epoxy equivalent of 190 g / mol obtained by epoxidizing bisphenol A (manufactured by Mitsui Chemicals, Inc., trade name "Epomic (registered trademark) R140P")
-Epoxy resin 3: A trifunctional liquid epoxy resin having an epoxy equivalent of 95 g / mol obtained by epoxidizing aminophenol (manufactured by Mitsubishi Chemical Corporation, trade name "jER630").

(Aromatic amine compound)
-Aromatic amine compound 1: Diethyl toluenediamine having an active hydrogen equivalent of 45 g / mol (manufactured by Mitsubishi Chemical Corporation, trade name "jER Cure W")
-Aromatic amine compound 2: diethyldiaminodiphenylmethane having an active hydrogen equivalent of 63 g / mol (manufactured by Nippon Kayaku Co., Ltd., trade name "Kayahard (registered trademark) AA")
(Hardener)
-Curing agent 3: Liquid acid anhydride having an acid anhydride equivalent of 168 g / mol (acid anhydride; manufactured by Hitachi Kasei Co., Ltd., trade name "HN5500")
-Curing agent 4: Phenolic curing agent of 141 g / mol of active hydrogen (manufactured by Meiwa Kasei Co., Ltd., trade name "MEH8000H")

(Inorganic filler)
-Silica: Spherical fused silica with a volume average particle size of 1 μm

(Organophosphorus compound)
-Organophosphorus compound 1: Triphenylphosphine (manufactured by Hokuko Chemical Industry Co., Ltd., trade name "TPP")
-Organophosphorus compound 2: Tris (p-methoxyphenyl) phosphine (manufactured by Hokuko Chemical Industry Co., Ltd., trade name "TPTP")
-Organophosphorus compound 3: Triphenylphosphine oxide (manufactured by Hokuko Chemical Industry Co., Ltd., trade name "TPPO")
Organophosphorus compound 4: Copolymer having a phosphoric acid ester group (manufactured by Big Chemie Japan Co., Ltd., trade name "BYK-W9010", acid value: 129 mgKOH / g, non-volatile content 100%)

(Other ingredients)
Flexible agent: Spherical silicone rubber particles having a volume average particle diameter of 2 μm in which the surface of dimethyl solid silicone rubber particles is modified with an epoxy group (manufactured by Toray Dow Corning Co., Ltd., trade name “EP-2601”).
-Curing accelerator: 2-phenyl-4-methyl-5-hydroxymethylimidazole (manufactured by Shikoku Chemicals Corporation, trade name "2P4MHZ")
-Coupling agent: γ-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM-403")
-Ion trap agent: Bismuth-based ion trap agent (manufactured by Toagosei Co., Ltd., trade name "IXE-500")
-Colorant: Carbon black (manufactured by Mitsubishi Chemical Corporation, product name "MA-100")

In Comparative Example 1 and Comparative Example 2 in which an acid anhydride-based curing agent or a phenol-based curing agent was used instead of the aromatic amine compound, voids were generated and both temperature cycle resistance and moisture resistance were insufficient. Met. In Comparative Example 2, the fluidity at 110 ° C. was low, and the filling property was also poor.
Further, in Comparative Examples 3 and 4 in which the organic phosphorus compound was not used, voids were generated, and the temperature cycle resistance was inferior accordingly. Further, in both Comparative Example 3 and Comparative Example 4, the fluidity at 110 ° C. was low, and the filling property was also poor.
From the comparison of the results of Examples 2 and 6 to 8, when triphenylphosphine (organophosphorus compound 1) is used as the organic phosphorus compound, the effect of the lowest viscosity can be obtained and the filling property tends to be high. I found out.
From the results of Examples 1 to 5, it was found that by increasing the amount of the organic phosphorus compound added, the low viscosity effect was increased and the filling property was also improved. In particular, in Example 3, although the inorganic filler is highly filled (70% by mass), voids are not generated because the low viscosity can be maintained, resulting in the best temperature cycle resistance and moisture resistance. It was.

Claims (11)

A resin composition for underfill, which comprises (A) an epoxy resin, (B) an aromatic amine compound, (C) an inorganic filler, and (D) an organic phosphorus compound. (D) The organic phosphorus compound comprises a phosphine compound, a phosphine oxide compound, a phosphonic acid ester, a phosphite ester, a phosphoric acid ester, a phosphoran compound, a phosphalken compound, a phosphaalkin compound and a copolymer having a phosphoric acid ester group. The resin composition for underfill according to claim 1, which is one or more selected from the group. (D) The organic phosphorus compound is at least one selected from the group consisting of triphenylphosphine, tris (p-methoxyphenyl) phosphine, triphenylphosphine oxide and a copolymer having a phosphate ester group. Or the resin composition for underfill according to 2. The resin composition for underfill according to any one of claims 1 to 3, wherein the epoxy resin (A) is at least one selected from the group consisting of a bisphenol type epoxy resin and a glycidylamine type epoxy resin. (B) Claims 1 to 4, wherein the aromatic amine compound is at least one selected from the group consisting of diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane and dimethylthiotoluenediamine. The resin composition for underfill according to any one of the items. (C) The resin composition for underfill according to any one of claims 1 to 5, wherein the content of the inorganic filler is 40 to 80% by mass with respect to the total amount of the resin composition for underfill. (C) The resin composition for underfill according to any one of claims 1 to 6, wherein the content of the inorganic filler is 60 to 75% by mass with respect to the total amount of the resin composition for underfill. The resin composition for underfill according to any one of claims 1 to 7, wherein the content of the organic phosphorus compound (D) is 0.001 to 10% by mass with respect to the inorganic filler (C). The understatement according to any one of claims 1 to 8, wherein the viscosity measured by an E-type viscometer under the conditions of 110 ° C. and a shear rate of 32.5 s- ¹ is 0.01 to 0.25 Pa · s. Resin composition for fill. The one according to any one of claims 1 to 9, wherein at least a part of a support member, an electronic component arranged on the support member, and a connection portion between the support member and the electronic component is sealed. An electronic component device including a cured product of a resin composition for underfill. The method for manufacturing an electronic component device in which a support member and an electronic component are electrically connected via a connection portion, wherein at least a part of the connection portion is described in any one of claims 1 to 9. A method for manufacturing an electronic component device, which comprises a step of sealing with a resin composition for underfill.