JP2021007277A - Housing, electric device and power converter - Google Patents

Abstract

To suppress deterioration of heat dissipation properties.SOLUTION: A housing 2 is a housing for an electric device A1. The housing 2 comprises: a body part 20 and an interruption part 21. The body part 20 stores a heat radiation part 4 and a substrate 5. The heat radiation part 4 radiates heat generated from a heat generation component B1. One or a plurality of electronic components 3 are mounted on the substrate 5. The interruption part 21 is arranged between the heat radiation part 4 and the substrate 5, and interrupts radiation heat from the heat radiation part 4 to the substrate 5.SELECTED DRAWING: Figure 1

Description

The present disclosure generally relates to a housing, an electrical device, and a power conversion device, and more specifically, a housing for an electric device including a heat radiating unit, an electric device including the housing, and a power conversion including the housing. Regarding the device.

The power conditioner (power conversion device) described in Patent Document 1 includes a power conversion unit, a control unit, and a housing for accommodating them. The power conversion unit has a power device. Power devices are integrated into IPMs (Intelligent Power Modules), and the IPMs are mounted in the center of the back surface side of the main board of the power conversion unit. A heat sink for cooling the IPM is provided on the back surface side of the IPM. A partition wall is provided in the middle of the housing. The front side of the partition wall is a sealed circuit accommodation space for accommodating the power conversion unit and the control unit, and a heat dissipation passage for accommodating the heat sink is formed on the rear surface side of the partition wall.

Japanese Unexamined Patent Publication No. 2016-046967

By the way, in the power conditioner described in Patent Document 1, the heat sink (heat dissipation portion) is outside the circuit accommodation space. On the other hand, depending on the installation environment of the power conditioner and the demand for miniaturization, the heat radiating portion may be accommodated in the same space as the circuit accommodating space (space of the main body portion). In this case, the substrate is more susceptible to the influence of radiant heat from the heat radiating portion, and the heat radiating property may be lowered.

The present disclosure has been made in view of the above reasons, and an object of the present invention is to provide a housing, an electric device, and a power conversion device capable of suppressing a decrease in heat dissipation.

The housing according to one aspect of the present disclosure is a housing for electrical equipment. The housing includes a main body portion and a blocking portion. The main body includes a heat radiating portion and a substrate. The heat radiating portion dissipates heat generated from the heat generating component. One or more electronic components are mounted on the substrate. The blocking portion is arranged between the heat radiating portion and the substrate to block radiant heat from the heat radiating portion to the substrate.

The electrical device according to one aspect of the present disclosure includes the housing, the heat radiating portion, the one or more electronic components, and the substrate on which the one or more electronic components are mounted.

The power conversion device according to one aspect of the present disclosure includes the housing, the heat dissipation unit, the one or more electronic components, and the substrate on which the one or more electronic components are mounted. The one or more electronic components include at least electronic components constituting a power conversion unit that converts DC power into AC power.

According to the present disclosure, there is an advantage that a decrease in heat dissipation can be suppressed.

FIG. 1 is an enlarged cross-sectional view of a main part of a power conversion device which is an example of an electric device provided with a housing according to an embodiment. FIG. 2A is an external perspective view of the power conversion device as seen from above. FIG. 2B is an external perspective view of the power conversion device as seen from below. FIG. 3A is a system configuration diagram of a power conversion system including the same power conversion device. FIG. 3B is a block configuration diagram of a power conversion unit in the same power conversion device. FIG. 4 is a cross-sectional perspective view of the power conversion device as seen from below. FIG. 5 is a cross-sectional view of the power conversion device of the same. FIG. 6 is an exploded perspective view of the substrate, the shielding plate, and the heat radiating portion in the same power conversion device. FIG. 7 is a cross-sectional view of the same power conversion device. FIG. 8A is a front view of the power conversion device of the same with the cover removed. FIG. 8B is an enlarged view of a main part in FIG. 8A.

(1) Outline Each figure described in the following embodiments is a schematic view, and the ratio of the size and the thickness of each component in each figure does not necessarily reflect the actual dimensional ratio. Not necessarily.

As shown in FIGS. 1, 2A and 2B, the housing 2 according to the present embodiment is a housing for the electric device A1. It is assumed that the electric device A1 is a power conversion device 1 as an example. However, the electric device A1 to which the housing 2 is applied is not limited to the power conversion device 1. Note that FIG. 1 is a cross-sectional view of the power conversion device 1 cut at the position shown by X1-X1 in FIG. FIG. 4 is a cross-sectional perspective view of the power conversion device 1 cut at the position indicated by X1-X1 in FIG. FIG. 5 is a cross-sectional view of the power conversion device 1 cut at the position shown by X3-X3 in FIG. FIG. 7 is a cross-sectional view of the power conversion device 1 cut at the position shown by X2-X2 in FIG.

As shown in FIG. 1, the housing 2 includes a main body portion 20 and a blocking portion 21 (hereinafter, may be referred to as a “first blocking portion 21”). The main body 20 accommodates the heat radiating portion 4 (here, the heat sink) and the substrate 5. One or a plurality of electronic components 3 are mounted on the substrate 5.

The heat radiating unit 4 dissipates heat generated from the heat generating component B1. Here, the heat-generating component B1 will be described on the assumption that it is an IPM (Intelligent Power Module) 60, which is one of a plurality of electronic components 3 mounted on the substrate 5, but electronic components other than the IPM 60 will be described. 3 can also correspond to the heat generating component B1.

The first blocking unit 21 is arranged between the heat radiating unit 4 and the substrate 5 to block radiant heat from the heat radiating unit 4 to the substrate 5.

According to this configuration, it is possible to suppress a decrease in heat dissipation. That is, when the first blocking unit 21 is not provided, the heat radiating unit 4 for radiating the heat generated from the heat generating component B1 conversely rises in temperature due to the heat received from the heat generating component B1 and becomes a heat source, and the substrate becomes a heat source due to radiant heat. It can cause an increase in the temperature of 5. On the other hand, since the housing 2 includes the first blocking portion 21 (blocking portion), the temperature rise of the substrate 5 due to radiant heat is suppressed.

(2) Details (2.1) Overall configuration Hereinafter, the overall configuration of the power conversion device 1 according to the present embodiment will be described in detail with reference to FIGS. 1 to 8B. In the following description, in FIG. 2A, the direction along the X-axis is defined as the left-right direction, and the positive direction of the X-axis is defined as the right side. Further, the direction along the Y-axis is defined as the front-back direction, and the positive direction of the Y-axis is defined as the front side. Further, the direction along the Z axis is defined as the vertical direction, and the positive direction of the Z axis is defined as the upper side. However, these directions are examples, and are not intended to limit the directions when the electric device A1 (power conversion device 1) including the housing 2 is used. In addition, the arrows indicating each direction in the drawing are shown only for the sake of explanation, and are not accompanied by an entity.

As shown in FIGS. 1, 2A, 2B and 4, the power conversion device 1 includes a housing 2, a heat dissipation unit 4 which is a heat sink, a substrate 5 (main substrate), and a power conversion unit 6 (FIGS. 3A and 4). See 3B). The power conversion device 1 includes a terminal block 7 (see FIG. 5), a first sub-board SB1 (see FIG. 7), a second sub-board SB2 (see FIG. 7), a functional unit 9 (see FIGS. 8A and 8B), and the like. Is further equipped.

The installation location of the housing 2 (main body 20) is, for example, a wall 300 of a facility such as a house (see FIGS. 2A and 2B). The main body 20 is attached to the wall 300, for example, via an attachment member fixed to the wall 300. Here, as an example, the wall 300 is an indoor wall.

As shown in FIG. 3A, the power conversion device 1 according to the present embodiment can be applied to, for example, a power conversion system 200. The power conversion system 200 includes a power conversion device 1, one or more photovoltaic modules S1, a storage battery unit S6, a remote controller S2, and a distribution board S3.

The power conversion device 1 converts DC power output from at least one of the photovoltaic power generation module S1 and the storage battery unit S6 into AC power, and converts the DC power into AC power via the distribution board S3 to load equipment S5 (lighting equipment, air conditioning equipment, etc.). Power the television, etc.). The power output by the power converter 1 is connected to the grid when receiving power from the commercial AC power supply S4 (system power supply) via the distribution board S3, and becomes independent when the commercial AC power supply S4 is out of power. It is output from the terminal to the load device S5. Further, the electric power derived from the commercial AC power source S4 and the photovoltaic power generation module S1 can also be used for charging the storage battery unit S6. Of the AC power output by the power conversion device 1, the AC power not used in the load device S5 is reverse-flowed to the commercial AC power supply S4.

The power conversion device 1 is electrically connected to the remote controller S2, and the remote controller S2 can be used to set the drive conditions of the power conversion device 1 and check the amount of power generated by the photovoltaic power generation module S1. it can. The power conversion device 1 is not limited to the one combined with the photovoltaic power generation module S1, and may be a device that converts DC power generated by a power generation system such as a fuel cell system or a wind power generation system into AC power.

(2.2) Power Conversion Unit and Terminal Block The power conversion unit 6 is configured to convert input power into predetermined power and output it by driving a plurality of switching elements. The power conversion unit 6 includes an inverter circuit that converts at least DC power into AC power (here, in both directions). Further, the power conversion unit 6 includes a DC-DC converter that converts DC power into DC-DC. The plurality of switching elements are IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). The plurality of switching elements are integrated into the IPM 60 described later.

Specifically, as shown in FIG. 3B, the power conversion unit 6 includes a modularized IPM 60, a DC noise filter circuit 61, an AC noise filter circuit 62, a DC (direct current) reactor 63, an AC (alternating current) reactor 64, and the like. And a control circuit 65. Further, the power conversion unit 6 further includes a relay 66 for interconnection operation, a relay 67 for independent operation, and the like. Among the plurality of electronic components 3 constituting the power conversion unit 6, the IPM 60, relays 66 and 67, and the electronic components 3 (film capacitor, common choke coil, electrolytic capacitor, etc.) constituting the filter circuits 61 and 62 and the like are included. It is mounted on the board 5. In particular, the IPM 60 is mounted on the back surface 52 of the substrate 5 facing the heat radiating unit 4 (see FIG. 1). Most of the electronic components 3 other than the IPM60 (particularly tall components such as capacitors and common choke coils) are mounted on the front surface 51 of the substrate 5. The IPM60 corresponds to the first heat generating component B11 (heat generating component B1) mounted on the substrate 5. The IPM60 is a rectangular box-shaped module that is flat in the front-rear direction.

The DC reactor 63 and the AC reactor 64 are arranged at different positions from the substrate 5. Specifically, as shown in FIG. 1, the DC reactor 63 and the AC reactor 64 are arranged on the left side of the heat radiating portion 4 in the accommodation space in the main body portion 20. On the other hand, the substrate 5 is arranged in front of the heat radiating unit 4. The DC reactor 63 and the AC reactor 64 correspond to the second heat generating component B12 which is not mounted on the substrate 5.

As shown in FIG. 5, the terminal block 7 includes a first terminal block 71 (DC terminal block), a second terminal block 72 (AC terminal block), and a terminal for a ground wire. For example, a first electric wire electrically connected to the photovoltaic power generation module S1 or the storage battery unit S6 may be connected to the terminal of the first terminal block 71. For example, a second electric wire electrically connected to the commercial AC power supply S4 (system power supply) may be connected to the terminal of the second terminal block 72. Further, a third electric wire electrically connected to the load device S5 may be connected to another terminal (self-supporting terminal) of the second terminal block 72.

For example, the DC power from the solar power generation module S1 input from the first terminal block 71 passes through the DC noise filter circuit 61 and the DC reactor 63, and is converted into AC power by the IPM 60. The converted AC power passes through the AC reactor 64 and the AC noise filter circuit 62, and is reverse power flowed from the second terminal block 72 to the commercial AC power supply S4 or to the load device S5 depending on the open / closed state of the relays 66 and 67. Be supplied.

(2.3) Main board and sub board The board 5 (main board) and the two sub boards (first sub board SB1 and second sub board SB2) are printed circuit boards on which conductor pattern wiring is applied.

A plurality of electronic components 3 constituting a power conversion unit 6 (mainly an inverter circuit) other than the control circuit 65, the DC reactor 63, and the AC reactor 64 are mounted on the substrate 5. That is, the substrate 5 is a power substrate that transmits electric power. As shown in FIG. 6, the substrate 5 has a substantially L-shaped plate shape as a whole, with the lower right region cut out so as to avoid the wiring space 26 (see FIG. 5) described later in a plan view. ing. The substrate 5 is arranged in front of the heat radiating portion 4 with its thickness direction facing the front-rear direction. The substrate 5 has a surface area large enough to cover substantially the entire front surface of the heat radiating portion 4. As described above, the IPM 60 is mounted on the back surface 52 of the substrate 5, and the electronic components 3 such as the film capacitor, the common choke coil, and the electrolytic capacitor are mounted on the front surface 51 of the substrate 5. The substrate 5 is fixed to the shielding plate H1 of the housing 2 described later.

The first sub-board SB1 is a control system board on which a plurality of electronic components 3 constituting the control circuit 65 are mounted. That is, the first sub-board SB1 can be said to be a light electric board. The first sub-board SB1 is electrically connected to the board 5 (main board). As shown in FIG. 5, the first sub-board SB1 has a rectangular plate shape that is long in the left-right direction in a plan view. The first sub-board SB1 is arranged in front of the board 5 with its thickness direction facing the front-rear direction (see FIG. 7). The first sub-board SB1 is screwed to a fixing plate 10 (see FIG. 7) whose part (upper portion) is crank-shaped when viewed along the left-right direction. The fixing plate 10 is formed by subjecting one sheet metal to bending, punching, or the like. The fixing plate 10 is screwed to the housing 2.

Here, the control circuit 65 is configured to control the IPM 60, the functional unit 9, the relays 66 and 67, and the like. The control circuit 65 is composed of, for example, a CPU (Central Processing Unit) and a microcontroller having a memory as a main configuration. In other words, the control circuit 65 is realized by a computer having a CPU and a memory, and the computer functions as the control circuit 65 when the CPU executes a program stored in the memory. Although the program is pre-recorded in the memory here, it may be provided by being recorded in a telecommunication line such as the Internet or recorded in a recording medium such as a memory card.

The second sub-board SB2 is a board on which the functional unit 9 having the setting unit 9A is mounted. The setting unit 9A receives an operation from the outside and sets the set value determined by the electric power company or the like in the control circuit 65. The functional unit 9 will be described later. The second sub-board SB2 is a light electric board. The second sub-board SB2 is electrically connected to the first sub-board SB1. As shown in FIG. 8A, the second sub-board SB2 has a rectangular plate shape that is long in the left-right direction in a plan view. The second sub-board SB2 is arranged in front of the first sub-board SB1 with its thickness direction facing the front-rear direction (see FIG. 7). Specifically, as shown in FIG. 7, the fixing plate 10 has a first portion 11 to which the first sub-board SB1 is fixed and a second portion 12 to which the second sub-board SB2 is fixed. Have. A step is provided between the first part 11 and the second part 12, and the second part 12 is located in front of the first part 11. The second sub-board SB2 is screwed to the fixing plate 10 in the same manner as the first sub-board SB1.

(2.4) Heat Dissipation Unit The heat dissipation unit 4 is a heat sink formed of, for example, a material having high thermal conductivity such as aluminum. The heat radiating unit 4 has a plate-shaped base 41 that is substantially rectangular when viewed from the front-rear direction, and a plurality of fins 42 that project rearward from the back surface of the base 41. The base 41 and the plurality of fins 42 are integrally formed.

The heat radiating portion 4 is screwed to the back wall of the housing 2 (fifth wall 205 described later). The shielding plate H1 of the housing 2 is screwed to the heat radiating portion 4. Then, the substrate 5 is screwed to the shielding plate H1. In short, the substrate 5 is stably fixed to the main body 20 of the housing 2 via the heat radiating portion 4 and the shielding plate H1.

The back surface 52 of the substrate 5 is arranged so as to face the front surface of the base 41. However, the first blocking portion 21 (described later) of the shielding plate H1 is interposed between the back surface 52 of the substrate 5 and the front surface of the base 41.

The heat radiating unit 4 mainly dissipates heat generated from the IPM 60 corresponding to the first heat generating component B11 (heat generating component B1) mounted on the substrate 5. In other words, the plurality of electronic components 3 mounted on the substrate 5 include a specific component 3A that is thermally coupled to the heat radiating section 4, and here the IPM 60 corresponds to the specific component 3A. The IPM60 (specific component 3A) is thermally coupled to the heat radiating portion 4 in a state of being inserted into the window hole 210 (see FIG. 6) of the first blocking portion 21 of the shielding plate H1. Here, the back surface of the IPM 60 is substantially in surface contact with the front surface of the base 41, whereby thermal coupling is achieved.

(2.5) Housing The housing 2 includes a main body 20 and a shielding plate H1.

The main body 20 has a rectangular box shape that is long in the left-right direction as a whole. The main body 20 is formed of, for example, an aluminum steel plate. The main body 20 accommodates a heat radiating unit 4, a substrate 5, a power conversion unit 6, a terminal block 7, a first sub-board SB1, a second sub-board SB2, a shielding plate H1, a functional unit 9, and the like.

As shown in FIGS. 2A and 2B, the main body 20 has a rectangular box-shaped case 20A having an open front surface and a cover 20B covering the front surface of the case 20A. The cover 20B is detachably attached to the case 20A.

The case 20A includes a first wall 201 (upper wall), a second wall 202 (lower wall), a third wall 203 (left wall), a fourth wall 204 (right wall), and a fifth wall 205 (back). It consists of a wall). As shown in FIG. 7, the first wall 201 and the second wall 202 are located on both sides (upper and lower sides) in a direction intersecting the alignment direction D1 (front-back direction) in which the heat radiating portion 4 and the substrate 5 are arranged.

In the lower right corner of the main body 20, a wiring space 26 through which electric wires such as the first electric wire connected to the first terminal block 71 and the second electric wire and the third electric wire connected to the second terminal block 72 pass. (See FIG. 5). The first terminal block 71 is arranged near the left edge of the wiring space 26, and the second terminal block 72 is arranged near the upper edge of the wiring space 26. An insertion port 27 (see FIG. 5) for inserting the electric wire into the wiring space 26 is provided in a region of the fifth wall 205 facing the wiring space 26.

The shielding plate H1 is made of a metal plate. The shielding plate H1 is formed of, for example, an aluminum steel plate. That is, here, as an example, the shielding plate H1 is made of the same material as the main body 20, but may be made of a material different from that of the main body 20. The shielding plate H1 has a substantially L-shaped plate shape when viewed in the vertical direction by, for example, bending and punching a single sheet metal. As shown in FIG. 6, the L-shaped shielding plate H1 is composed of a first blocking portion 21 (blocking portion), a second blocking portion 22, and a fixing piece 25.

The first blocking unit 21 is arranged between the heat radiating unit 4 and the substrate 5 to block radiant heat from the heat radiating unit 4 to the substrate 5. Like the substrate 5, the first blocking portion 21 is cut out in the lower right region so as to avoid the wiring space 26, and has a substantially L-shaped plate shape in a plan view. The first blocking portion 21 is arranged so that its thickness direction faces the front-rear direction. The first blocking portion 21 has substantially the same shape as the substrate 5 when viewed in the front-rear direction, and has an area slightly larger than that of the substrate 5. Here, when viewed from behind the first blocking portion 21, the substrate 5 is arranged so that its outer peripheral edge is hidden by the first blocking portion 21. Further, when viewed along the front-rear direction, the substantially square region 221 (see FIG. 6) in the first blocking portion 21 has substantially the same shape as the base 41 of the heat radiating portion 4. Here, when viewed from the front of the first blocking portion 21, the base 41 is arranged so that its outer peripheral edge is hidden by the first blocking portion 21. The terminal block 7 is screwed to the right corner on the front surface of the first blocking portion 21, that is, the L-shaped region 223 (see FIG. 6).

The upper end of the first blocking portion 21 is slightly folded forward, and the folded portion is arranged so as to be in contact with the first wall 201 (see FIG. 7). Similarly, the lower end of the first blocking portion 21 is slightly folded forward, and the folded portion is arranged so as to come into contact with the second wall 202 (see FIG. 7). In short, the first blocking portion 21 extends from the first wall 201 to the second wall 202.

As shown in FIG. 6, the first blocking unit 21 has a window hole 210 penetrating in the arrangement direction D1 in which the heat radiating unit 4 and the substrate 5 are aligned. The window hole 210 is arranged substantially in the center of the region 221 of the first blocking portion 21. The window hole 210 has a rectangular opening, and the IPM 60 mounted on the substrate 5 can be inserted into the window hole 210. The vertical dimension of the heat radiating portion 4 is slightly smaller than the distance between the first wall 201 and the second wall 202.

The fixing piece 25 projects rearward from the right end of the first blocking portion 21. The fixing piece 25 is arranged in the vicinity of the fourth wall 204 (right side wall) and is screwed and fixed to the fifth wall 205 (back wall) of the housing 2. The fixed piece 25 is integrated with the first blocking portion 21.

The second blocking unit 22 blocks heat generated from the DC reactor 63 and the AC reactor 64 (second heat generating component B12) arranged on the left side of the heat radiating unit 4 with respect to the substrate 5. The second blocking portion 22 has a substantially rectangular plate shape. The second blocking portion 22 projects forward from the left edge of the first blocking portion 21 so that the thickness direction thereof faces the left-right direction. The second blocking unit 22 is integrated with the first blocking unit 21. The upper end of the second blocking portion 22 is located in the vicinity of the first wall 201 (may be in contact with the first wall 201). The lower end of the second blocking portion 22 is located in the vicinity of the second wall 202 (may be in contact with the second wall 202). In short, the second blocking portion 22 generally extends from the first wall 201 to the second wall 202. The left end surface of the second blocking portion 22 is substantially flush with the left end surface of the heat radiating portion 4 when viewed along the front-rear direction.

Hereinafter, in the internal space of the main body 20 (that is, the space between the first wall 201 and the second wall 202), the side of the second blocking portion 22 and the side of the heat radiating portion 4 of the first blocking portion 21. The space in is called the first space SP1 (see FIG. 7). Further, in the internal space of the main body portion 20, the space on the right side of the second blocking portion 22 and on the side of the substrate 5 with respect to the first blocking portion 21 is referred to as a second space SP2 (see FIG. 7). That is, the internal space of the main body 20 includes the first space SP1 and the second space SP2. The internal space of the main body 20 is on the left side of the second blocking 22 and further includes a third space SP3 in which the DC reactor 63 and the AC reactor 64 are housed (see FIG. 5). The third space SP3 is a space on the left side of the second blocking portion 22 in the internal space of the main body portion 20. The third space SP3 is isolated from the first space SP1 and the second space SP2 by the second blocking unit 22. However, the second blocking unit 22 is provided with a hole through which wiring for electrically connecting each of the DC reactor 63 and the AC reactor 64 to the substrate 5 passes.

Both the first wall 201 and the second wall 202 have ventilation holes 23 (see FIGS. 2A and 2B) in which gas can pass through the first space SP1 in the vertical direction in a region facing the first space SP1. Have. Each of the ventilation holes 23 is composed of a plurality of slit-shaped through holes that are long in the front-rear direction. Since the heat radiating unit 4 is housed in the first space SP1, the heat of the heat radiating unit 4 is used as hot air from the ventilation holes 23 provided in the first wall 201 and the second wall 202 to the main body 20. Can be released to the outside.

Further, the first wall 201 has a hole 24 (see FIG. 2A) in a region facing the second space SP2. The hole portion 24 is composed of a large number of through holes. Since the substrate 5 is housed in the second space SP2, the heat of the substrate 5 and the plurality of electronic components 3 mounted on the substrate 5 is generated as hot air from the hole 24 to the outside of the main body 20. Can be released. That is, the hole portion 24 can release the heat of the second space SP2 to the outside of the main body portion 20.

Further, the first wall 201 has a ventilation hole 250 (see FIG. 2A) in a region near the right corner facing the first space SP1, and hot air in the first space SP1 also flows from the ventilation hole 250. It can be released to the outside. Further, the fourth wall 204 has a ventilation hole 251 (see FIG. 2A) in a region facing the first space SP1, and hot air in the first space SP1 can be discharged to the outside from the ventilation hole 251 as well. .. Further, the fifth wall 205 has a window hole that partially exposes the fins 42 of the heat radiating unit 4 to the outside, and hot air around the heat radiating unit 4 can be discharged to the outside from the window hole as well.

Further, the first wall 201 has a hole 252 (see FIG. 2A) in a region facing the third space SP3. Similarly, the second wall 202 also has a hole 252 (see FIG. 2B) in a region facing the third space SP3. Since the DC reactor 63 and the AC reactor 64 are housed in the third space SP3, these heats are released as hot air to the outside of the main body 20 through the first wall 201 and the second wall 202 hole 252. Can be done.

By providing the first blocking unit 21 in this way, the temperature rise of the substrate 5 due to the radiant heat from the heat radiating unit 4 is suppressed. Therefore, it is possible to suppress a decrease in heat dissipation. In particular, since the substrate 5 is a power substrate that transmits electric power, it is possible to suppress a decrease in heat dissipation with respect to the power substrate. Further, since the IPM 60 (specific component 3A) is thermally coupled to the heat radiating section 4 in a state of being inserted into the window hole 210 of the first blocking section 21, the heat radiating property for the specific component 3A is excellent even though the configuration is simple. It will be improved more. Further, since the first blocking unit 21 is a metal plate, the radiant heat from the heat radiating unit 4 can be blocked more effectively.

Further, since the second blocking portion 22 is provided, the substrate is provided even when the second heat generating component B12 (DC reactor 63 and AC reactor 64) is present separately from the first heat generating component B11 (IPM60). It is possible to suppress a decrease in heat dissipation with respect to 5.

By the way, as shown in FIG. 1, a gap G1 is provided between the heat radiating unit 4 and the first blocking unit 21. Specifically, for example, male screws of four spacers J1 (for example, hexagonal spacers) are screwed into screw holes provided near the four corners of the base 41 of the heat radiating portion 4 at the top, bottom, left and right. Further, four screws J2 are inserted from the front side into through holes provided near the four corners of the area 221 of the first blocking portion 21 at the top, bottom, left and right, and screwed into the female screws of the four spacers J1. There is. As a result, gaps G1 at regular intervals are formed in the front-rear direction according to the longitudinal dimension of each spacer J1. By providing the gap G1, the temperature rise of the substrate 5 due to the radiant heat from the heat radiating unit 4 is further suppressed, and the decrease in heat dissipation property with respect to the substrate 5 is further suppressed.

Here, the peripheral portion 222 (see FIG. 6) of the through hole of the first blocking portion 21 is curved so as to be recessed toward the heat radiating portion 4, and the head of the screw J2 fits within the peripheral portion 222. .. Therefore, the power conversion device 1 has a structure that maintains a certain level of electrical insulation between the substrate 5 and the screw J2 (in other words, the substrate 5 and the first blocking portion 21).

Further, as shown in FIG. 1, a gap G2 is also provided between the substrate 5 and the first blocking portion 21. The substrate 5 and the first blocking portion 21 are screwed together via a plurality of spacers J3 (for example, cylindrical spacers). As a result, gaps G2 at regular intervals are formed in the front-rear direction according to the longitudinal dimension of each spacer J3. The power conversion device 1 has a structure in which a gap G2 is provided to maintain a certain level of electrical insulation between the substrate 5 and the first cutoff portion 21. Further, by providing the gap G2, the temperature rise of the substrate 5 due to the radiant heat from the heat radiating unit 4 is further suppressed, and the decrease in heat dissipation property with respect to the substrate 5 is further suppressed.

(2.6) Installation location By the way, it may be desired that this type of power conversion device be installed on a wall such as a dressing room as an indoor installation location. Installation in a dressing room requires measures against steam on the power board and control system board. However, if the housing of the power conversion device is simply sealed as a measure against steam, heat dissipation is impaired.

On the other hand, in the power conversion device 1 of the present embodiment, as described above, both the first wall 201 and the second wall 202 have ventilation holes 23 in the region facing the first space SP1. Therefore, the rising steam in the dressing room enters the first space SP1 in which the heat radiating unit 4 is housed through the ventilation hole 23 of the second wall 202 (lower wall) of the power conversion device 1, and enters the first wall 201 (1st wall 201 (lower wall). It is discharged from the ventilation hole 23 of the upper wall). However, the first wall 201 has a hole 24 in the region facing the second space SP2, while the second wall 202 has a hole in the region facing the second space SP2. Absent. That is, the region of the second wall 202 facing the second space SP2 is closed. Therefore, the power conversion device 1 has a structure in which the steam in the dressing room does not easily enter the second space SP2 in which the substrate 5, the first sub-board SB1 and the second sub-board SB2 are housed.

Therefore, in the power conversion device 1 of the present embodiment, the heat dissipation to the first space SP1 and the second space SP2 is lowered while suppressing the invasion of foreign matter (for example, steam when installed in the dressing area) into the substrate 5. Is suppressed.

In particular, as shown in FIG. 7, the fixing plate 10 having a crank shape at the upper part has a flat plate portion 13 arranged so as to face the hole portion 24 of the first wall 201. The flat plate portion 13 is substantially parallel to the first wall 201. Therefore, the flow path K1 (schematically indicated by an arrow in FIG. 7) through which the heat of the second space SP2 flows toward the hole 24 is relative to the alignment direction D2 in which the first wall 201 and the second wall 202 are aligned. , It is formed in a crank shape. Therefore, while the heat of the second space SP2 is released from the hole 24, even if a foreign substance (including steam and water droplets) enters the inside from the hole 24, it hits the flat plate 13. That is, it is unlikely that the foreign matter directly hits the substrate 5. Therefore, it is possible to improve the heat dissipation while further suppressing the entry of foreign matter into the substrate 5. Since the first sub-board SB1 and the second sub-board SB2 are also arranged on the lower side of the flat plate portion 13, it is unlikely that foreign matter directly hits these substrates.

(2.7) Functional unit Hereinafter, the functional unit 9 will be described with reference to FIGS. 8A and 8B. The functional unit 9 is mounted on the second sub-board SB2.

The functional unit 9 has a setting unit 9A. The setting unit 9A is configured to be able to set a set value for the control circuit 65 by receiving an operation from, for example, an operator who installs the power conversion device 1. The setting unit 9A includes a plurality of (here, four) operation units 91 for inputting numerical values of set values. The four operation units 91 are, for example, push buttons and are mounted on the second sub-board SB2. The four operation units 91 are "ESC button", "DOWN button", "UP button" and "ENT button" in order from the left.

The set value is, for example, a value determined by an electric power company or the like. The control circuit 65 stores the settling value input in response to the operation on the setting unit 9A in its own memory. The control circuit 65 monitors the output voltage from the power converter 1 to the commercial AC power supply S4, and when it detects that the output voltage exceeds the set set value, operates so as to suppress an increase in the output voltage. In short, the setting unit 9A accepts an operation related to setting a set value for suppressing an increase in the power output from the power conversion unit 6.

The functional unit 9 includes, for example, a main body 90 of a resin molded product (corresponding to a resin cover), a display unit 92 for displaying a settling value, and an operating light 93 for displaying the operating state of the power conversion unit 6. It further has a switching unit 94 for switching between operation and stop of the power conversion device 1 and a cover 95.

The main body 90 has a plate-shaped first plate 901 that is long and rectangular in the left-right direction, and a second plate 902 that is integrally formed on the upper edge of the first plate 901. ing. Further, the main body 90 includes a frame-shaped guard portion 903 that protrudes forward along the peripheral edge of the first plate portion 901, and a frame-shaped guard portion 904 that protrudes forward along the peripheral edge of the second plate portion 902. Further has. The main body 90 has an engaging claw that projects rearward on the back side thereof. The main body 90 is fixed by hooking an engaging claw in an engaging hole formed in the second sub-board SB2.

The first plate portion 901 has four guide holes 905 for guiding the light emitted from the four light sources 930 (for example, LED: Light Emitting Diode) of the operating light 93 to the outside. The first plate portion 901 has a tubular rib projecting toward each light source 930 on the back side thereof, and a guide hole 905 is provided so as to penetrate the rib. Each light source 930 of the operation light 93 is mounted on the second sub-board SB2 and lights up according to the operating state of the power conversion device 1 (operating state of the power conversion unit 6) under the control of the control circuit 65. Further, the first plate portion 901 has a hole 906 for exposing the display portion 92 mounted on the second sub-board SB2. The display unit 92 displays the set value, the current output power (if the power conversion device 1 is operating), and the like under the control of the control circuit 65. Further, the first plate portion 901 has a hole 907 for exposing the switching portion 94 mounted on the second sub-board SB2.

The cover 95 is translucent. The cover 95 is fitted inside the guard portion 903 so as to cover the display portion 92 and the operation light 93 on the front surface of the first plate portion 901. The cover 95 has a hole for exposing the switching portion 94.

The second plate portion 902 has four button holes 908 for exposing each of the four operation portions 91 mounted on the second sub-board SB2.

As shown in FIGS. 2A and 2B, the cover 20B of the housing 2 has a window hole 255 for exposing a portion of the functional portion 9 other than the setting portion 9A to the outside. Therefore, even when the cover 20B is attached to the case 20A, the switching unit 94 can be operated, and the display unit 92 and the operation light 93 can be visually recognized. Then, the setting unit 9A is exposed by removing the cover 20B from the case 20A, and the installer can perform the setting work of the set value in this state.

While the builder is in the process of setting the set value using the setting unit 9A, the display unit 92 sets the set value that changes according to the pressing operation of the "UP button" or "DOWN button" among the four operation units 91. indicate. If the "UP button" is pressed, the set value displayed on the display unit 92 increases, and if the "DOWN button" is pressed, the set value displayed on the display unit 92 decreases. In short, the builder can set while looking at the set value displayed on the display unit 92. When the builder presses the "ENT button", the set value displayed on the display unit 92 is registered in the memory of the control circuit 65. When the builder presses the "ESC button", the setting of the set value is canceled.

Here, in the present embodiment, since the resin main body 90 is provided so as to surround the setting unit 9A, the builder uses the setting unit 9A to set the set value while the operator or the like is in the setting unit. It is possible to suppress the possibility of contacting a portion around 9A (here, the second sub-board SB2). That is, when the builder's finger or the like comes into contact with the second sub-board SB2, the second sub-board SB2 may be affected by static electricity or the like and cause a failure, but such contact can be suppressed by the main body 90. In particular, since the frame-shaped guard portion 904 is provided along the peripheral edge of the second plate portion 902 so as to surround the setting portion 9A, such contact can be further suppressed.

Further, since the main body 90 is provided so as to surround not only the setting unit 9A but also the display unit 92 and the operation light 93, the builder's fingers and the like can use the display unit 92, the operation light 93 and the second sub-board SB2. The possibility of contact with the device can also be suppressed. In particular, since the frame-shaped guard portion 903 is provided along the peripheral edge of the first plate portion 901 so as to surround the display portion 92 and the operation light 93, such contact can be further suppressed. In particular, since the main body 90 has not only a function of suppressing contact with a finger or the like but also a function of guiding the light of the operating light 93, it is possible to standardize the members.

By the way, as shown in FIG. 8A, the housing 2 of the present embodiment further has a protective plate 28 (indicated by dot hatching in FIG. 8A) arranged along at least a part of the peripheral edge of the main body 90. ing. FIG. 8A is a front view with the cover 20B removed. The protective plate 28 is a metal plate. The protective plate 28 is formed of, for example, an aluminum steel plate. The protective plate 28 is formed by subjecting one sheet metal to bending, punching, or the like. The protective plate 28 is configured to cover all of the substrate 5, the first sub-board SB1 and the second sub-board SB2 when viewed from the front. However, the protective plate 28 has a shape cut out so as to avoid at least the functional portion 9. In short, the protective plate 28 is recessed along the outer shell of the main body 90 when viewed from the front. Therefore, it is possible to further suppress the possibility that a finger or the like comes into contact with the substrate 5, the first sub-board SB1 and the second sub-board SB2 while the builder is setting the set value using the setting unit 9A. Further, if the protective plate 28 (metal plate) is grounded, it also contributes to static electricity removal in the setting unit 9A and its surroundings.

(3) Modified Example The above embodiment is only one of various embodiments of the present disclosure. The above-described embodiment can be changed in various ways depending on the design and the like as long as the object of the present disclosure can be achieved. Hereinafter, modifications of the above embodiment will be listed. The modifications described below can be applied in combination as appropriate. In the following, the above embodiment may be referred to as a "basic example".

In the basic example, the first wall 201 has a hole 24 in the region facing the second space SP2, while the second wall 202 is closed in the region facing the second space SP2. There is. However, conversely, the region of the first wall 201 facing the second space SP2 may be closed, and the second wall 202 may have a hole 24, or both of them may be closed. .. In this case, the ingress of foreign matter (including steam and water droplets) into the substrate 5 is further suppressed.

Further, for example, both the first wall 201 and the second wall 202 may have the hole portion 24. In this case, the shielding plate H1 may have a third blocking portion that closes the hole 24 of either the first wall 201 or the second wall 202. The third blocking portion may, for example, project forward from the upper end or the lower end of the first blocking portion 21.

In the basic example, the first blocking portion 21 (blocking portion) is composed of a metal plate (sheet metal). However, the first blocking unit 21 may be composed of, for example, a resin plate. Similarly, the second blocking portion 22 may also be made of a resin plate. However, in consideration of heat resistance, it is preferable that the first blocking portion 21 and the second blocking portion 22 are made of sheet metal as in the basic example.

(4) Summary As described above, the housing (2) according to the first aspect is a housing for an electric device (A1). The housing (2) includes a main body portion (20) and a blocking portion (21). The main body portion (20) accommodates the heat radiating portion (4) and the substrate (5). The heat radiating unit (4) dissipates heat generated from the heat generating component (B1). One or more electronic components (3) are mounted on the substrate (5). The blocking unit (21) is arranged between the heat radiating unit (4) and the substrate (5) to block radiant heat from the heat radiating unit (4) to the substrate (5). According to the first aspect, it is possible to suppress a decrease in heat dissipation.

Regarding the housing (2) according to the second aspect, in the first aspect, one or more electronic components (3) include electronic components (3) constituting an inverter circuit (power conversion unit 6). The substrate (5) is a power substrate. According to the second aspect, it is possible to suppress a decrease in heat dissipation with respect to the power substrate.

Regarding the housing (2) according to the third aspect, in the first aspect or the second aspect, one or a plurality of electronic components (3) are specified components (4) that are thermally coupled to the heat radiating section (4). 3A) is included. According to the third aspect, the heat dissipation property for the specific component (3A) is further improved.

Regarding the housing (2) according to the fourth aspect, in the third aspect, the blocking portion (21) is a window hole (D1) penetrating in the arrangement direction (D1) in which the heat radiating portion (4) and the substrate (5) are lined up. 210). The specific component (3A) is thermally coupled to the heat radiating portion (4) in a state of being inserted into the window hole (210). According to the fourth aspect, the heat dissipation property for the specific component (3A) is further improved in spite of the simple configuration.

Regarding the housing (2) according to the fifth aspect, in any one of the first to fourth aspects, the blocking portion (21) is made of a metal plate. According to the fifth aspect, the radiant heat from the heat radiating unit (4) can be blocked more effectively.

Regarding the housing (2) according to the sixth aspect, in any one of the first to fifth aspects, the main body portion (20) is arranged in the arrangement direction in which the heat radiating portion (4) and the substrate (5) are arranged. It has a first wall (201) and a second wall (202) on both sides in a direction intersecting with D1). The space between the first wall (201) and the second wall (202) is larger than the first space (SP1) on the heat radiating portion (4) side of the blocking portion (21) and the blocking portion (21). Includes a second space (SP2) on the side of the substrate (5). Both the first wall (201) and the second wall (202) have ventilation holes (23) in a region facing the first space (SP1) through which gas can pass through the first space (SP1). At least one of the first wall (201) and the second wall (202) is closed with a region facing the second space (SP2). According to the sixth aspect, heat dissipation to the first space (SP1) and the second space (SP2) is improved while suppressing the invasion of foreign matter (including steam and water droplets) into the substrate (5). be able to.

Regarding the housing (2) according to the seventh aspect, in the sixth aspect, either one of the first wall (201) and the second wall (202) is located in a region facing the second space (SP2). It has a hole (24). The hole portion (24) can release the heat of the second space (SP2) to the outside of the main body portion (20). The flow path through which the heat of the second space (SP2) flows toward the hole (24) is crank-shaped with respect to the alignment direction (D2) in which the first wall (201) and the second wall (202) are lined up. It is formed. According to the seventh aspect, it is possible to improve the heat dissipation while further suppressing the entry of foreign substances (including steam and water droplets) into the substrate (5).

Regarding the housing (2) according to the eighth aspect, in any one of the first to seventh aspects, the heat generating component (B1) is the first heat generating component included in one or a plurality of electronic components (3). (B11). The housing (2) further includes a second blocking portion (22) in addition to the first blocking portion (21) as the blocking portion (21). The second blocking unit (22) blocks heat generated from the second heat generating component (B12) arranged at a position different from that of the substrate (5) with respect to the substrate (5). According to the eighth aspect, heat dissipation to the substrate (5) even when the second heat generating component (B12) is present separately from the first heat generating component (B11) mounted on the substrate (5). It is possible to suppress the decrease in the amount of heat.

Regarding the housing (2) according to the ninth aspect, in any one of the first to eighth aspects, a gap (G1) is provided between the heat radiating portion (4) and the blocking portion (21). Has been done. According to the ninth aspect, the decrease in heat dissipation is further suppressed.

The electric device (A1) according to the tenth aspect includes a housing (2), a heat radiating unit (4), and one or a plurality of electronic parts (3) in any one of the first to ninth aspects. It includes a substrate (5) on which one or a plurality of electronic components (3) are mounted. According to the tenth aspect, it is possible to provide an electric device (A1) capable of suppressing a decrease in heat dissipation.

The power conversion device (1) according to the eleventh aspect includes a housing (2), a heat radiating unit (4), and one or a plurality of electronic components (3) in any one of the first to ninth aspects. And a substrate (5) on which one or more electronic components (3) are mounted. One or a plurality of electronic components (3) include at least electronic components (3) constituting a power conversion unit (6) that converts DC power into AC power. According to the eleventh aspect, it is possible to provide a power conversion device (1) capable of suppressing a decrease in heat dissipation.

The configuration according to the second to ninth aspects is not an essential configuration for the housing (2) and can be omitted as appropriate.

A1 Electrical equipment 1 Power converter 2 Housing 20 Main body 201 1st wall 202 2nd wall 21 1st cutoff (cutoff)
210 Window hole 22 Second cutoff part 23 Ventilation hole 24 Hole part 3 Electronic parts 3A Specific parts 4 Heat dissipation part 5 Board 6 Power conversion part (inverter circuit)
B1 Heat-generating parts B11 1st heat-generating parts B12 2nd heat-generating parts D1 Alignment direction D2 Alignment direction G1 Gap SP1 1st space SP2 2nd space

Claims (11)

A housing for electrical equipment
A heat radiating part that dissipates heat generated from heat generating parts, and a main body part that houses a substrate on which one or more electronic parts are mounted.
A blocking unit, which is arranged between the heat radiating portion and the substrate and blocks radiant heat from the heat radiating portion to the substrate.
To prepare
Housing. The one or more electronic components include electronic components constituting an inverter circuit.
The substrate is a power substrate.
The housing according to claim 1. The one or more electronic components include specific components that are thermally coupled to the heat radiating section.
The housing according to claim 1 or 2. The blocking portion has a window hole penetrating in the arrangement direction in which the heat radiating portion and the substrate are lined up.
The specific component is thermally coupled to the heat radiating portion in a state of being inserted into the window hole.
The housing according to claim 3. The blocking portion is made of a metal plate.
The housing according to any one of claims 1 to 4. The main body portion has first wall and second wall on both sides in a direction intersecting the arrangement direction in which the heat radiating portion and the substrate are lined up.
The space between the first wall and the second wall is
The first space on the side of the heat radiating part with respect to the blocking part,
Including a second space on the side of the substrate with respect to the blocking portion,
Both the first wall and the second wall have ventilation holes in a region facing the first space so that gas can pass through the first space.
At least one of the first wall and the second wall is closed with a region facing the second space.
The housing according to any one of claims 1 to 5. One of the first wall and the second wall has a hole in a region facing the second space so that the heat of the second space can be released to the outside of the main body.
The flow path through which the heat of the second space flows toward the hole is formed in a crank shape with respect to the alignment direction in which the first wall and the second wall are lined up.
The housing according to claim 6. The heat generating component is a first heat generating component included in the one or a plurality of electronic components.
In addition to the first blocking unit as the blocking unit, a second blocking unit that blocks heat generated from the second heat generating component arranged at a position different from the substrate is further provided.
The housing according to any one of claims 1 to 7. A gap is provided between the heat radiating portion and the blocking portion.
The housing according to any one of claims 1 to 8. The housing according to any one of claims 1 to 9,
With the heat dissipation part
With the one or more electronic components
The substrate on which the one or more electronic components are mounted and
To prepare
Electrical equipment. The housing according to any one of claims 1 to 9,
With the heat dissipation part
With the one or more electronic components
The substrate on which the one or more electronic components are mounted and
With
The one or more electronic components include at least electronic components constituting a power conversion unit that converts DC power into AC power.
Power converter.

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