JP2020198346A - Printed wiring board for surface light-emitting device and surface light-emitting device - Google Patents

Abstract

To provide a printed wiring board for a surface light-emitting device and the surface light-emitting device, capable of preventing occurrence of lighting failure even if unnecessary parts are separated, and capable of emitting light from an LED with same lightness even if shaping variously.SOLUTION: A printed wiring board 3 for a surface light-emitting device has a power supply pattern P1 and an earth pattern P2, and a component mounting area A1 formed on a flexible insulation quality board 4. A first power supply pattern P11 and a first earth pattern P21 are parallel with a first direction F1, and a second power supply pattern P12 and a second earth pattern P22 are parallel with a second direction F2. When viewed in the thickness direction, the power supply pattern P1 and the earth pattern P2 are formed at a deviated position other than the component mounting area A1, and the component mounting area A1 is formed in a range including a first intersection position C1 of the first power supply pattern P11 and the second earth pattern P22, and a second intersection position C2 of the second power supply pattern P12 and the first earth pattern P21.SELECTED DRAWING: Figure 3

Description

The present invention relates to a printed wiring board for a surface light emitting device and a surface light emitting device in which a plurality of LEDs are arranged and can be formed into an arbitrary shape by cutting.

By separating unnecessary parts from the large-format printed wiring board on which multiple LEDs are arranged, the surface light emitting device that makes the remaining light emitting part into an arbitrary shape can be used as letters, symbols, or characters for signboards, advertisements, etc. Can be used for decoration.
As such a surface light emitting device, for example, those described in Patent Documents 1 to 3 are known.

The lighting sheet described in Patent Document 1 is formed by forming a lighting sheet in which a plurality of rows of lighting lines are provided in parallel with printed wiring and a large number of LED elements for lighting on one surface of a flexible substrate having a certain size. By providing two sub-printed wires between each LED element of multiple rows of lighting lines, it is possible to cut and divide between the lighting lines and between the two sub-printed wires while keeping the circuit between all the LED elements open. ,.

In the planar light source device described in Patent Document 2, a plurality of unit substrates include a substrate and a light source, and the light source substrates are arranged adjacent to each other in one direction and integrated via a connecting portion. , Each of the backbone wirings extends between adjacent unit boards via a connection and is connected to each other so as to connect all the unit substrates, and the branch wiring branches off from the backbone wiring within each unit substrate. , Supplying drive power to the light source.

The LED wiring substrate described in Patent Document 3 has a laminated cathode layer, a first insulating layer, an LED element electrode layer, and a second insulating layer, and the LED element electrode layer has a lattice-shaped anode portion. It has a strip-shaped cathode portion arranged in a closed region surrounded by the anode portion, the second insulating layer fills the gap between the anode portion and the cathode portion, and the LED element is bonded by solder for bonding the LED element. A surface is provided on the surfaces of the cathode portion and the anode portion by exposing from the second insulating layer, and a through hole penetrating the first insulating layer and the cathode layer is provided on the LED element adhesive surface of the cathode portion to provide the LED element. The solder used by applying it to the bonding surface of the LED element at the time of bonding flows into the through hole to fill it, so that the cathode portion and the cathode layer can be energized.

JP-A-2007-115550 Japanese Unexamined Patent Publication No. 2006-221966 Japanese Unexamined Patent Publication No. 2014-56855

In the lighting sheet described in Patent Document 1, since each LED is connected in series, depending on the number of LEDs mounted on the substrate after separating unnecessary parts, if the voltage from the power supply is the same, The brightness of the LED changes.

In the planar light source device described in Patent Document 2, a detailed circuit configuration diagram of a unit substrate (see FIG. 6 of Patent Document 2) is posted, and according to this circuit configuration diagram, three wires for three-color LEDs are provided. Since the power supply line of the above is wired together with the ground wire, it can be estimated that the three power supply lines and the ground wire are wired to at least each layer of the three-layer board.
Further, according to a partially enlarged plan view and a cross-sectional view thereof (see FIGS. 2 and 3 of Patent Document 1) of the planar light source device published in Patent Document 2, the upper substrate and the lower substrate are notched at the connection portion. Is provided, and the main wiring is wired by one wire.

Therefore, the three power lines and the ground line may be wired so as to overlap each other, so if you try to disconnect by cutting the position of the connection part, the power line or the ground line will be burred. May occur.
In the planar light source device described in Patent Document 2, since a hard substrate is assumed, there may be no problem, but in a soft flexible substrate, the thickness of the substrate itself is thin, so that the frequency of burrs is high. Become.

In the LED wiring board described in Patent Document 3, the cathode layer (earth pattern) on the back surface is formed of a copper plate, and a grid-like anode portion (power supply pattern) is formed on the front surface side of the first insulating layer. ing. Therefore, when the LED wiring board is cut, burrs may occur in either the cathode layer or the lattice-shaped anode portion, resulting in a short circuit.

If burrs occur and the power supply and the ground are short-circuited, lighting failure will occur, which is an important problem for a surface light emitting device that can cut off unnecessary parts to form an arbitrary shape.

Therefore, according to the present invention, a printed wiring board for a surface light emitting device and a surface light emitting device capable of preventing the occurrence of lighting defects even if unnecessary parts are separated and emitting LEDs with the same brightness even in various shapes The purpose is to provide the device.

In the printed wiring board for a surface light emitting device of the present invention, a first power supply pattern and a second power supply pattern for supplying power to an LED, and an electric component including the LED are mounted on a flexible insulating substrate. The component mounting region is formed, and the first feeding pattern is formed by a first parallel feeding pattern parallel to the first direction and a first cross feeding pattern parallel to the second direction intersecting the first direction. The second power supply pattern is formed by a second parallel power supply pattern parallel to the first direction and a second cross power supply pattern parallel to the second direction, and the first power supply pattern and the second power supply pattern are formed. The pattern is formed at a position shifted from the component mounting region when the insulating substrate is viewed in the thickness direction, and the component mounting region is formed at an intersecting portion of the first feeding pattern and the second feeding region. The component mounting area is formed for each pair of intersections formed by the intersections of the patterns, and the component mounting area includes a component mounting pad on which the electrical component is mounted and the first parallel feeding pattern adjacent to the component mounting pad. It is characterized in that it is formed in a range including a first crossing position with the second cross feeding pattern and a second crossing position between the first cross feeding pattern and the second parallel feeding pattern.

Further, the surface light emitting device of the present invention is characterized by including a printed wiring board for the surface light emitting device of the present invention and an LED mounted on the printed wiring board for the surface light emitting device.

According to the printed wiring board for the surface light emitting device and the surface light emitting device of the present invention, the first power feeding pattern is a first parallel power feeding pattern parallel to the first direction and a second parallel to the second direction intersecting the first direction. It is formed by one cross feed pattern. Further, the second feeding pattern is formed by a second parallel feeding pattern parallel to the first direction and a second cross feeding pattern parallel to the second direction intersecting the first direction. Therefore, the first power supply pattern and the second power supply pattern overlap at any position.
However, the component mounting area on which the electric component including the LED is mounted is the first intersection position between the first parallel feeding pattern and the second cross feeding pattern and the second crossing between the first cross feeding pattern and the second parallel feeding pattern. It is formed in a range including the position, and the first feeding pattern and the second feeding pattern are formed at positions shifted from each other when the insulating substrate is viewed in the thickness direction, except for the component mounting area. .. Therefore, if the printed wiring board for the surface light emitting device of the present invention is cut by removing the component mounting area, the first feeding pattern and the second feeding pattern are formed at positions other than the component mounting area. , Even if a burr occurs in either the first feeding pattern or the second feeding pattern, it is possible to prevent a short circuit.

Power supply pads are provided between the intersection positions of the first parallel power supply pattern and the first cross power supply pattern and between the intersection positions of the second parallel power supply pattern and the second cross power supply pattern. Conductive connection is possible.
By doing so, even if the unnecessary part is separated and has an arbitrary shape, by connecting a lead wire to one of the power supply pads, power is supplied to the first power supply pattern and the second power supply pattern via this lead wire. can do.

A range other than the component mounting area and the power feeding pad can be covered with an insulating film. The insulating film can prevent metal from coming into contact with the first feeding pattern and the second feeding pattern to cause malfunction.

Either the wiring pattern of either the first parallel feeding pattern or the second cross feeding pattern at the first crossing position, or the first cross feeding pattern or the second parallel feeding pattern at the second crossing position. By forming one of the wiring patterns with jumper wires instead of the wiring pattern, the first feeding pattern and the second feeding pattern can be formed on one side of the insulating substrate.

According to the present invention, if each LED is connected in parallel between the first power supply pattern and the second power supply pattern and cuts other than the component mounting area, the first power supply pattern and the second power supply pattern are burrs. Since it is possible to prevent a short circuit, it is possible to prevent the occurrence of lighting defects even if an unnecessary portion is separated, and it is possible to make the LED emit light with the same brightness even if it has various shapes.

FIG. 5 is a view of the front surface of a printed wiring board for a surface light emitting device in the surface light emitting device according to the first embodiment of the present invention, and is an enlarged view of the whole and a part thereof. It is a figure which looked at the back surface of the printed wiring board for a surface light emitting device shown in FIG. 1 from the front side, and is the enlarged view of the whole and a part thereof. It is a partially enlarged view which superposed the wiring pattern on the front surface side and the wiring pattern on the back surface side of the printed wiring board for a surface light emitting device shown in FIG. 1. It is sectional drawing of the surface light emitting device shown in FIG. It is a figure for demonstrating the connection state of the surface light emitting device shown in FIG. It is a figure for demonstrating that the unnecessary part is separated from the surface light emitting device shown in FIG. It is a figure which shows the front surface of the printed wiring board for a surface light emitting device which concerns on Embodiment 2 of this invention. It is a figure which shows the front surface of the printed wiring board for a surface light emitting device which concerns on Embodiment 3 of this invention.

(Embodiment 1)
The surface light emitting device according to the first embodiment of the present invention will be described with reference to the drawings.
The surface light emitting device 1 shown in FIGS. 1 to 3 can be formed into an arbitrary shape by separating an unnecessary portion from the printed wiring board 3 for the surface light emitting device on which the resistors 21 and LED 22 which are electrical components are mounted. Is. The printed wiring board 3 for the surface light emitting device is hereinafter simply abbreviated as the printed wiring board 3.
In FIG. 3, the resistor 21 and the LED 22 are shown as rectangles.

In the printed wiring board 3, a power supply pattern P1 (first power supply pattern) and a ground pattern P2 (second power supply pattern) for supplying power to the LED 22 and an LED 22 are mounted on a flexible insulating substrate 4. A component mounting area A1 is formed.

The LEDs 22 are surface mount type light emitting diodes, and are arranged in columns and rows by being mounted one by one in the component mounting area A1. The resistor 21 is a surface mount type resistor and is a limiting resistor that adjusts the current flowing through the LED 22.
The printed wiring board 3 is a film-like flexible substrate.

The printed wiring board 3 has a wiring pattern P including a power supply pattern P1 and a ground pattern P2 formed on both sides (front surface S1 and back surface S2) of the insulating substrate 4.
As shown in FIGS. 1 and 3, the power supply pattern P1 is formed on the front surface S1. The power supply pattern P1 includes a first power supply pattern P11 (first parallel power supply pattern) parallel to the first direction F1 and a second power supply pattern P12 (first cross power supply pattern) parallel to the second direction F2 intersecting the first direction F1. It is formed by (pattern) and.
The power supply pattern P1 in the first embodiment is formed in a grid pattern by orthogonalizing the first power supply pattern P11 and the second power supply pattern P12.

As shown in FIGS. 2 and 3, the ground pattern P2 is formed on the back surface S2 which is a layer different from the power supply pattern P1 shown in FIG.
The ground pattern P2 includes a first ground pattern P21 (second parallel power supply pattern) parallel to the first direction F1 and a second ground pattern P22 (second cross power supply pattern) parallel to the second direction F2 intersecting the first direction F1. It is formed by (pattern) and. The earth pattern P2 in the first embodiment is formed in a grid pattern by the first earth pattern P21 and the second earth pattern P22 being orthogonal to each other.
The power supply pattern P1 and the ground pattern P2 are formed at positions other than the component mounting area A1 when the insulating substrate 4 is viewed in the thickness direction F3 (see FIG. 4).

The component mounting area A1 is formed at each pair of intersections including the cross portion X1 which is the intersection portion of the power supply pattern P1 and the cross portion X2 which is the intersection portion of the earth pattern P2.
In the component mounting area A1, a component mounting pad 5 for mounting the LED 22 and the resistor 21 connected in series with the LED 22 is formed on the front surface S1.
Further, a connection pattern 6 is formed in the component mounting area A1 on the back surface S2.
The component mounting area A1 is the intersection position C1 of the component mounting pad 5 on which the electric component is mounted, the first power supply pattern P11 and the second ground pattern P22, and the intersection position of the second power supply pattern P12 and the first ground pattern P21. Including C2.

The component mounting pad 5 shown in FIGS. 1 and 3 includes a resistance pad 51 and an LED pad 52.
The resistor pad 51 includes a branch line from the power supply pattern P1 extending from the first power supply pattern P11 in the second direction F2, and one end of the resistor 21 is soldered to the first resistor pad 51a and the first resistor. It is formed by a second resistor pad 51b which is arranged from the pad 51a to the second direction F2 through a gap, forms a pair with the first resistor pad 51a, and the other end of the resistor 21 is soldered.

The LED pad 52 is formed on the opposite side of the second resistance pad 51b with the second power supply pattern P12, and one end of the LED 22 is soldered to the first LED pad 52a and the first LED pad 52a to the first. It is arranged in two directions F2 with a gap, is paired with the first LED pad 52a, and is formed of a second LED pad 52b to which the other end of the LED 22 is soldered.

The resistance pad 51 and the LED pad 52 are a through hole 53a (see FIG. 4) leading from the front surface S1 of the second resistance pad 51b to the back surface S2, and the front surface of the first LED pad 52a. The through holes 53b leading from S2 to the back surface S2 and the connection pattern 6 (see FIGS. 2 and 3) formed in the back surface S2 and conducting the through holes 53a and 53b conduct the conduction.
Further, the LED pad 52 (second LED pad 52b) and the ground pattern P2 (second ground pattern P22) are electrically connected by a through hole 53c (see FIGS. 1 to 4) which is a branch line from the ground pattern P2. ing.

Further, the wiring pattern P includes a power supply pad 7 for supplying power to the LED 22. In the first embodiment, the power feeding pad 7 is formed in a rectangular shape.
In the power feeding pad 7, the first power feeding pad 71 serving as an anode is formed on the front surface S1 shown in FIG. 1, and the second power feeding pad 72 serving as a cathode is electrically connected to the back surface S2.

The first power supply pad 71 is formed so as to overlap the second power supply pattern P12 between the intersection positions of the first power supply pattern P11 and the second power supply pattern P12, but is formed so as to overlap the first power supply pattern P11. It may have been.
Further, the second power feeding pad 72 is formed so as to be overlapped with the first earth pattern P21 between the intersecting positions of the first earth pattern P21 and the second earth pattern P22, but is overlapped with the first earth pattern P21. May be formed.

If the printed wiring board 3 has the front surface S1, the insulating film 81 (see FIG. 1) covers a range other than the component mounting area A1 and the first power feeding pad 71, and the printed wiring board 3 may be the back surface S2. For example, the insulating film 82 (see FIG. 2) covers a range other than the second power feeding pad 72.
Therefore, the first feeding pad 71 is exposed from the opening 81a of the insulating film 81, and the second feeding pad 72 is exposed from the opening 82a of the insulating film 82.

Since the surface light emitting device 1 according to the first embodiment of the present invention is configured as described above, when the resistor 21 is mounted on the resistor pad 51 and the LED 22 is mounted on the LED pad 52, the power supply pattern P1 ( From the first power supply pattern P11), the resistor pad 51, the through hole 53a, the connection pattern 6, the through hole 53b, the LED pad 52, the through hole 53c, and the earth pattern P2 (second earth pattern P22) are connected in series. And becomes a conductive state.
Therefore, as shown in FIG. 5, each LED 22 is connected between the power supply pattern P1 and the ground pattern P2, and each LED 22 is connected in parallel.

Since they are connected in this way, as shown in FIG. 6, the large-format surface light emitting device 1 is placed along the cut-out line L (indicated by the alternate long and short dash line in FIG. 6), avoiding the component mounting area A1. By cutting and separating the unnecessary portion A2, the remaining required range A3 is obtained. The LED 22 of the component mounting area A1 located in the required range A2 of the residual is in a state of being connected in parallel between the grid-shaped power supply pattern P1 and the grid-shaped ground pattern P2.
Therefore, it is necessary to connect the lead wire L1 for the positive power supply to the first power supply pad 71 included in the required range A3 and to connect the lead wire L2 for the negative power supply to the second power supply pad 72. The LED 22 in the range A3 can be lit with the same brightness regardless of the required range A3.

Further, as shown in FIG. 3, the cutting for separating the unnecessary portion is set to a range other than the component mounting area A1. The component mounting area A1 is adjacent to the component mounting pad 5, the first intersection position C1 between the first power supply pattern P11 and the second ground pattern P22, and the second of the second power supply pattern P12 and the first ground pattern P21. It is formed in a range including the intersection position C2. In addition to the component mounting area A1, the power supply pattern P1 and the ground pattern P2 are positioned so as to be displaced when viewed in the thickness direction F3 (see FIG. 4).
Therefore, even if a range other than the component mounting area A1 is cut and burrs occur in either or both of the power supply pattern P1 and the ground pattern P2, the power supply pattern P1 and the ground pattern P2 are short-circuited. It can be avoided.

Therefore, the surface light emitting device 1 can avoid a short circuit between the power supply pattern P1 and the ground pattern P2 even if an unnecessary portion is separated, and can make the LED 22 emit light with the same brightness even if it has various shapes.

Further, the power supply pads 7 (first power supply pad 71, second power supply pad 72) have a second power supply pattern P12 between the intersection positions of the first power supply pattern P11 and the second power supply pattern P12, and a second power supply pattern P12. It is formed in the first ground pattern P21 between the intersecting positions of the first ground pattern P21 and the second ground pattern P22.
Therefore, even if the unnecessary portion is separated to have an arbitrary shape, by connecting a lead wire to any of the power feeding pads 7, power can be supplied to the power supply pattern P1 and the ground pattern P2 via the lead wire. ..

Since the area other than the component mounting area A1 and the power supply pad 7 is covered with the insulating films 81 and 82, it is possible to prevent metal from coming into contact with the power supply pattern P1 and the ground pattern P2 to cause malfunction. ..

In the first embodiment, the first power supply pattern is the power supply pattern P1, the first parallel power supply pattern is the first power supply pattern P11, the first cross power supply pattern is the second power supply pattern P12, and the second power supply pattern is the ground pattern P2. The second parallel feeding pattern has been described as the first ground pattern P21, and the second cross feeding pattern has been described as the second ground pattern P22.
However, the power supply pattern P1 (first power supply pattern P11, second power supply pattern P12) may be used as the second power supply pattern, and the ground pattern P2 (first ground pattern P21, second power supply pattern P22) may be used as the first power supply pattern.

(Embodiment 2)
The surface light emitting device according to the second embodiment of the present invention will be described with reference to the drawings. In FIG. 7, those having the same configurations as those in FIGS. 1 to 3 are designated by the same reference numerals and the description thereof will be omitted.

In the second embodiment, the connection pattern 6 formed on the back surface S2 shown in FIG. 2 is formed on the front surface S1 of the printed wiring board 30 shown in FIG. 7, and is shown in FIGS. 1 to 3. Through holes 53a and 53b are omitted.
Further, in FIG. 1, the LED pad 52 formed on the opposite side of the resistance pad 51 by sandwiching the second power supply pattern P12 on the front surface S1 is in the first direction in the printed wiring board 30 shown in FIG. It is arranged side by side with the resistance pad 51 along F1.
The second ground pattern P22 is arranged at the position of the through hole 53c connected to the second LED pad 52b.

Even if the wiring pattern P of the printed wiring board 30 according to the second embodiment is formed in this way, the same effect as that of the printed wiring board 3 (see FIG. 1) according to the first embodiment can be obtained.

(Embodiment 3)
The surface light emitting device according to the third embodiment of the present invention will be described with reference to the drawings. In FIG. 8, those having the same configuration as that in FIG. 7 are designated by the same reference numerals, and the description thereof will be omitted.
In the third embodiment, the power supply pattern P1 and the ground pattern P2 are formed on the front surface S1.
When the power supply pattern P1 and the ground pattern P2 are to be formed on one side of the insulating substrate 4, in the printed wiring board 31 shown in FIG. 7, the intersection position C1 between the first power supply pattern P11 and the second ground pattern P22 and A short circuit occurs between the power supply pattern P1 and the ground pattern P2 at the intersection position C2 between the second power supply pattern P12 and the first ground pattern P21.

Therefore, in the printed wiring board 31 according to the third embodiment, the wiring pattern of either the first power supply pattern P11 or the second ground pattern P22 at the first intersection position C1 is replaced by the jumper wire 91 instead of the wiring pattern. It is formed.
Further, the wiring pattern of either the second power supply pattern P12 or the first ground pattern P21 at the second intersection position C2 is formed by the jumper wire 92 instead of the wiring pattern.
For example, the jumper wires 91 and 92 can be 0Ω surface mount resistors.

By doing so, the printed wiring board 31 can form a wiring pattern without short-circuiting at the intersection positions C1 and C2.
Therefore, since the wiring pattern formed on the printed wiring board 31 can be made on only one side, the cost of the printed wiring board 31 can be significantly reduced even if the number of electrical components by the jumper wires 91 and 92 increases. Therefore, the cost of the surface light emitting device can be suppressed.

The printed wiring board for a surface light emitting device and the surface light emitting device of the present invention are suitable for signboards, advertisements, decorations, and the like.

1-sided light emitting device 21 resistance 22 LED
Printed circuit board for 3, 30, 31 surface light emitting device (printed wiring board)
4 Insulating board 5 Parts mounting pad 51 Resistance pad 51a 1st resistance pad 51b 2nd resistance pad 52 LED pad 52a 1st LED pad 52b 2nd LED pad 53a, 53b, 53c Through hole 6 Connection pattern 7 Power supply pad 71 1st power supply pad 72 2nd power supply pad 81,82 Insulation film 91,92 Jumper wire A1 Parts mounting area A2 Unnecessary part A3 Required range S1 Front surface S2 Back surface P Wiring pattern P1 Power supply pattern P11 1st power supply pattern P12 2nd power supply pattern P2 Earth pattern P21 1st earth pattern P22 2nd earth pattern F1 1st direction F2 2nd direction F3 Thickness direction C1, C2 Crossing position L1, L2 Lead wire L Cut wire X1 , X2 cross

Claims (5)

A first power supply pattern and a second power supply pattern for supplying power to the LED and a component mounting area on which the electric component including the LED is mounted are formed on the flexible insulating substrate.
The first feeding pattern is formed by a first parallel feeding pattern parallel to the first direction and a first cross feeding pattern parallel to the second direction intersecting the first direction.
The second feeding pattern is formed by a second parallel feeding pattern parallel to the first direction and a second cross feeding pattern parallel to the second direction.
The first power supply pattern and the second power supply pattern are formed at positions shifted from each other outside the component mounting region when the insulating substrate is viewed in the thickness direction.
The component mounting region is formed at each pair of intersections including the intersection portion of the first power supply pattern and the intersection portion of the second power supply pattern.
The component mounting region includes a component mounting pad on which the electrical component is mounted, a first intersection position between the first parallel feeding pattern and the second cross feeding pattern adjacent to the component mounting pad, and the first cross feeding pattern. A printed wiring board for a surface light emitting device formed in a range including a second crossing position of one cross feeding pattern and the second parallel feeding pattern. Power supply pads are provided between the intersection positions of the first parallel power supply pattern and the first cross power supply pattern and between the intersection positions of the second parallel power supply pattern and the second cross power supply pattern, respectively. The printed wiring board for a surface light emitting device according to claim 1, which is electrically connected. The printed wiring board for a surface light emitting device according to claim 2, wherein a range other than the component mounting pad and the power feeding pad in the component mounting area is covered with an insulating film. Either the wiring pattern of either the first parallel feeding pattern or the second cross feeding pattern at the first crossing position, or the first cross feeding pattern or the second parallel feeding pattern at the second crossing position. One wiring pattern is formed by jumper wires instead of the wiring pattern,
The printed wiring board for a surface light emitting device according to any one of claims 1 to 3, wherein the first power supply pattern and the second power supply pattern are formed on one surface of the insulating substrate. A surface light emitting device including the printed wiring board for a surface light emitting device according to any one of claims 1 to 4 and an LED mounted on the printed wiring board for a surface light emitting device.

Images