JP2020188453A - Antenna device and electronic apparatus - Google Patents

Abstract

To constitute an antenna device of high radiation efficiency by improving bond of a coil conductor for connection with a feeder circuit and a coil conductor for booster, and to provide an electronic apparatus including the same.SOLUTION: An antenna device 101 includes: a first backing material 10; first coil conductors 11L, 12L formed along the principal surface of the first backing material 10; a second backing material 20; and a second coil conductor 21, a first feeding terminal 21T1 and a second feeding terminal 21T2 formed along the principal surface of the second backing material 20. When viewing in the vertical direction for the principal surface of the first backing material 10, the first regions of the first coil conductors 11L, 12L and the second region of the second coil conductor 21 are overlapping each other, and the current path of the first coil conductors 11L, 12L in the first region and the current path of the second coil conductor 21 in the second region are arranged in parallel. The first coil conductors 11L, 12L are aluminum pattern, and the second coil conductor 21 is copper pattern.SELECTED DRAWING: Figure 1

Description

The present invention relates to an antenna device including a coil conductor and an electronic device including the antenna device.

Patent Document 1 describes a base material sheet, a booster antenna composed of a first coil conductor and a second coil conductor formed on both sides of the base material sheet, and a shape wound around a winding axis. An antenna device comprising a coil antenna having a coil conductor and arranged such that the coil antenna is coupled to a part of the coil conductor of the booster antenna is shown.

International Publication No. 2012/033031

In the device shown in Patent Document 1, in particular, as shown in FIGS. 26 and 27, the coil antenna is brought close to a part of the coil conductor of the booster antenna, and the booster antenna and the coil antenna are used. In an antenna device configured to magnetically couple the coils, the coupling coefficient varies greatly depending on the placement position of the coil antenna. Therefore, it is necessary to optimally design the configuration of each part according to the placement position. There was a problem such as.

Therefore, an object of the present invention is to provide an antenna device having stable communication characteristics by enhancing the coupling between the coil conductor to which the power feeding circuit is connected and the coil conductor for the booster, and an electronic device provided with the antenna device. is there.

An antenna device as an example of the present disclosure includes a first base material composed of an insulator having a main surface, a first coil conductor formed along the main surface of the first base material, and having a first region. A second base material composed of an insulator having a main surface and a second coil conductor formed along the main surface of the second base material and having a second region and formed on the main surface of the second base material. , A first feeding terminal connected to the first end of the second coil conductor, and a second feeding terminal formed on the main surface of the second base material and connected to the second end of the second coil conductor. .. Further, when viewed in a direction perpendicular to the main surface of the first base material, the first region and the second region all overlap each other, and the current path of the first coil conductor in the first region and the second region It is arranged so as to be parallel to the current path of the second coil conductor. The main material of the first coil conductor is aluminum, and the main material of the second coil conductor is copper.

An electronic device as an example of the present disclosure includes the above-mentioned antenna device, a circuit board provided with a communication circuit and a circuit board provided with a pin conducting to the antenna connection portion of the communication circuit, and the pin corresponds to a first power supply terminal and a second power supply terminal. A housing for accommodating an antenna device and a circuit board in contact with the antenna device is provided.

According to the present invention, the coupling between the coil conductor to which the power feeding circuit is connected and the coil conductor for the booster can be enhanced, and an antenna device having high radiation efficiency can be obtained. Further, an electronic device including the antenna device can be obtained.

1 (A) and 1 (B) are views showing the configuration of a main part of the antenna device 101 according to the first embodiment. FIG. 2 is a plan view of the first substrate 1 and the second substrate 2, which are components of the antenna device 101, in a separated state. FIG. 3A is a plan view of the first substrate 1, and FIG. 3B is a plan view showing a conductor pattern formed on the lower surface of the first substrate 1. FIG. 3C is an equivalent circuit diagram of a resonance circuit composed of the inductance of the first coil conductors 11L and 12L and the capacitance of the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2. FIG. 4 is a cross-sectional view showing the widths of the first region CA1 and the second region CA2. FIG. 5A is a diagram showing the positional relationship between the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2 and the first region CA1. FIG. 5B is a diagram showing the relationship between the current flowing through the first coil conductors 11L and 12L, the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2, the high magnetic field region MA, and the high electric field region EA. FIG. 6 is a cross-sectional view of a main part of the electronic device 201 according to the second embodiment. 7 (A) and 7 (B) are views showing the configuration of the main part of the antenna device 103 according to the third embodiment. FIG. 8 is a cross-sectional view of positions passing through the protrusions 6P1 and 6P2 in a state where the first substrate 1 and the second substrate 2, which are the constituent elements of the antenna device 103, are overlapped with each other. 9 (A) is a cross-sectional view of the main part of the antenna device 104A according to the fourth embodiment, and FIG. 9 (B) is a cross-sectional view of the main part of the antenna device 104B according to the fourth embodiment. 9 (C) is a cross-sectional view of a main part of the antenna device 104C according to the fourth embodiment. FIG. 10 is a diagram showing stray capacitance generated in the antenna device 101 and the like according to the fifth embodiment. FIG. 11 is a diagram showing stray capacitance generated in the antenna device and the like according to the comparative example. 12 (A) and 12 (B) are cross-sectional views showing a configuration of a main part of the antenna device 106A according to the sixth embodiment. 13 (A), 13 (B), 13 (C), and 13 (D) are cross-sectional views showing some examples of the antenna device according to the sixth embodiment. 14 (A) and 14 (B) are cross-sectional views showing a configuration of a main part of the antenna device 107A according to the seventh embodiment. FIG. 15 is a cross-sectional view of the antenna device 107B according to the seventh embodiment. FIG. 16 is a cross-sectional view of the antenna device 107C according to the seventh embodiment. FIG. 17A is a plan view of the antenna device 108 according to the eighth embodiment, and FIG. 17B is a plan view of the capacitance forming conductor pattern 12C formed on the lower surface of the first base material 10. is there. FIG. 17C is a cross-sectional view taken along the line XX in FIG. 17A. 18 (A) is a plan view of the antenna device 109 according to the ninth embodiment, and FIG. 18 (B) is a cross-sectional view taken along the line XX of FIG. 18 (A). FIG. 19 is a plan view of the antenna device 110 according to the tenth embodiment. FIG. 20 is a plan view of the antenna device 111 according to the eleventh embodiment. FIG. 21 is a plan view of the antenna device 112 according to the twelfth embodiment.

The "antenna device" according to each embodiment is an antenna device used in the "wireless transmission system". Here, the "wireless transmission system" is a system that performs wireless transmission by magnetic field coupling with a transmission partner (antenna of an external device). "Transmission" includes both the transmission and reception of signals and the transmission and reception of electric power. Further, "wireless transmission system" includes the meanings of both a short-range wireless communication system and a wireless power supply system. Since the antenna device performs wireless transmission by magnetic field coupling, the length of the current path of the antenna device, that is, the line length of the coil conductor described later, is sufficiently smaller than the wavelength λ at the frequency used in wireless transmission, and is λ / 10. It is as follows. Therefore, the radiation efficiency of electromagnetic waves is low in the frequency band used for wireless transmission. The wavelength λ referred to here is an effective wavelength in consideration of the wavelength shortening effect due to the dielectric property and magnetic permeability of the base material provided with the coil conductor. Both ends of the coil conductor are connected to a power feeding circuit, and a current of substantially uniform magnitude flows through the current path of the antenna device, that is, the coil conductor.

Further, as a short-range wireless communication used in the "antenna device" according to each embodiment, there is, for example, NFC (Near Field Communication). The frequency band used in short-range wireless communication is, for example, the HF band, particularly 13.56 MHz and its vicinity.

Further, as the wireless power feeding method used in the "antenna device" according to each embodiment, there are, for example, a magnetic field coupling method such as an electromagnetic induction method and a magnetic field resonance method. As an electromagnetic induction type wireless power supply standard, for example, there is a standard "Qi (registered trademark)" established by WPC (Wireless Power Consortium). The frequency band used in the electromagnetic induction method is included in, for example, a range of 110 kHz or more and 205 kHz or less and a frequency band in the vicinity of the above range. As a magnetic field resonance type wireless power supply standard, for example, there is a standard "AirFuel Resonant" established by Alliance (registered trademark) Alliance. The frequency band used in the magnetic field resonance method is, for example, the 6.78 MHz band or the 100 kHz band.

Hereinafter, a plurality of embodiments for carrying out the present invention will be shown with reference to the drawings with reference to some specific examples. The same reference numerals are given to the same parts in each figure. Although the embodiments are divided into a plurality of embodiments for convenience of explanation in consideration of the explanation of the main points or the ease of understanding, partial replacement or combination of the configurations shown in the different embodiments is possible. In the second and subsequent embodiments, the description of matters common to those of the first embodiment will be omitted, and only the differences will be described. In particular, similar actions and effects with the same configuration will not be mentioned sequentially for each embodiment.

<< First Embodiment >>
1 (A) and 1 (B) are views showing the configuration of a main part of the antenna device 101 according to the first embodiment. 1 (A) is a plan view of the antenna device 101, and FIG. 1 (B) is a cross-sectional view taken along the line XX in FIG. 1 (A). FIG. 2 is a plan view of the first substrate 1 and the second substrate 2, which are components of the antenna device 101, in a separated state.

The antenna device 101 according to the first embodiment includes a first substrate 1 and a second substrate 2. The first substrate 1 is a first base material 10 composed of a sheet-like insulator having main surfaces MS11 and MS12, and a first coil formed along the main surfaces MS11 and MS12 of the first base material 10. It has conductors 11L and 12L. Further, in this example, the conductor patterns 11C1, 11C2, 12C1, 12C2 for forming the capacitance are formed along the main surfaces MS11 and MS12 of the first base material 10. The second substrate 2 is a second base material 20 composed of a sheet-like insulator having main surfaces MS21 and MS22, and a second coil conductor 21 formed along the main surface MS21 of the second base material 20. , Has a first power supply terminal 21T1 and a second power supply terminal 21T2. Here, the first base material 10 and the second base material 20 are not limited to the sheet shape, and may be a film shape or a plate shape as long as they have a shape having a main surface.

FIG. 3A is a plan view of the first substrate 1, and FIG. 3B is a plan view showing a conductor pattern formed on the lower surface of the first substrate 1. FIG. 3C is an equivalent circuit diagram of a resonance circuit composed of the inductance of the first coil conductors 11L and 12L and the capacitance of the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2.

As shown in FIGS. 1B and 3A, the first coil conductor 11L and the capacitance forming conductor patterns 11C1 and 11C2 are formed on the first main surface MS11 of the first base material 10. There is. Further, as shown in FIGS. 1B and 3B, the first coil conductor 12L and the capacitance forming conductor patterns 12C1 and 12C2 are formed on the second main surface MS12 of the first base material 10. Has been done.

The first coil conductor 11L is a rectangular spiral conductor pattern, and the capacitance forming conductor patterns 11C1 and 11C2 are rectangular conductor patterns having a predetermined area. The capacitance forming conductor patterns 11C1 and 11C2 are connected to both ends of the first coil conductor 11L.

The first coil conductor 12L is a rectangular spiral conductor pattern similar to the first coil conductor 11L, and the capacitance forming conductor patterns 12C1 and 12C2 are rectangular conductors having a predetermined area similar to the capacitance forming conductor patterns 11C1 and 11C2. It is a pattern. The capacitance forming conductor patterns 12C1 and 12C2 are connected to both ends of the first coil conductor 12L.

The first coil conductor 11L has a spiral shape that is wound counterclockwise from the outer circumference to the inner circumference, and the first coil conductor 12L has a spiral shape that is wound counterclockwise from the inner circumference to the outer circumference. With this configuration, the LC resonance circuit shown in FIG. 3C is configured. The resonance frequency of this resonance circuit is a frequency in the communication frequency band, for example, 13.56 MHz or the like.

As shown in FIGS. 2, 3 (A) and 3 (B), the first coil conductors 11L and 12L partially have CA1. Further, the second coil conductor 21 has a second region CA2 in a part thereof. When viewed in the direction perpendicular to the main surface of the first base material, the first region CA1 and the second region CA2 are all overlapping portions. In the first region CA1 and the second region CA2, the first coil conductors 11L and 12L and the second coil conductor 21 are magnetically coupled.

As shown in FIGS. 1 (A) and 1 (B), in a plan view of the main surfaces MS11 and MS12 of the first base material 10, the first region CA1 and the second region CA2 overlap each other and , The current paths of the first coil conductors 11L and 12L in the first region CA1 and the current paths of the second coil conductors 21 in the second region CA2 are arranged so as to be parallel to each other.

The first base material 10 is, for example, a sheet mainly made of polyethylene terephthalate (PET), and the first coil conductors 11L, 12L and the conductor patterns 11C1, 11C2, 12C1, 12C2 for capacity formation are patterned using aluminum as the main material. It is a metal foil. An insulating film (resist film) may be coated on both surfaces of the first substrate 1 (main surfaces MS11 and MS12 of the first substrate 10 after each conductor pattern is formed). Here, "used as the main material" means that it is the main component, and allows some impurities and the like. For example, if the mass% is 50% or more, it is the main material.

The second base material 20 is, for example, a sheet whose main material is polyimide (PI), and the second coil conductor 21, the first power supply terminal 21T1 and the second power supply terminal 21T2 are metal patterns made mainly of copper. It is a foil. The main surface MS21 of the second substrate 2 (the main surface MS21 of the second base material 20 after each conductor pattern is formed) is covered with an insulating film except for the first power supply terminal 21T1 and the second power supply terminal 21T2. It may have been. The surfaces of the first feeding terminal 21T1 and the second feeding terminal 21T2 may be nickel-plated or gold-plated.

In the example shown in FIG. 1B, the first substrate 1 and the second substrate 2 are joined via a joining material 3. The bonding material 3 is, for example, an adhesive or a double-sided adhesive tape (sheet).

A communication circuit (that is, a power supply circuit for the antenna device 101) is connected to the first power supply terminal 21T1 and the second power supply terminal 21T2.

With the configuration shown above, the first coil conductors 11L and 12L and the second coil conductor 21 are magnetically coupled. In FIG. 1B, the broken line loop conceptually represents the magnetic flux that contributes to this magnetic field coupling. Therefore, the power feeding circuit is connected to the LC resonance circuit by the first coil conductors 11L, 12L and the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2 via the second coil conductor 21.

FIG. 4 is a cross-sectional view showing the widths of the first region CA1 and the second region CA2. In FIG. 4, the direction perpendicular to the current path direction (Y direction) of the second region CA2 when viewed in the direction perpendicular to the main surfaces MS11 and MS12 of the first base material 10 (hereinafter, “in a plan view”) (hereinafter referred to as “planar view”). The width W2 in the (X direction) is larger than the width W1 in the direction (X direction) perpendicular to the current path direction (Y direction) of the first region CA1.

With such a configuration, fluctuations in the electrical characteristics of the antenna device with respect to the positional deviation between the second region CA2 of the second coil conductor 21 and the first region CA1 of the first coil conductors 11L and 12L can be suppressed. That is, the facing area between the second region CA2 of the second coil conductor 21 and the first region CA1 of the first coil conductors 11L and 12L due to an error (variation) in the bonding position between the first substrate 1 and the second substrate 2. Changes in the electrical characteristics of the antenna device 101. However, according to the structure shown in FIG. 4, the second region CA2 of the second coil conductor 21 and the first region CA1 of the first coil conductors 11L and 12L Even if the relative position shifts in the width direction (X direction), there is a range in which the facing area between the second region CA2 of the second coil conductor 21 and the first region CA1 of the first coil conductors 11L and 12L does not change. If there is a deviation in the range, the change in electrical characteristics can be suppressed.

Further, since the first coil conductors 11L and 12L contribute more to the radiation of electromagnetic waves than the second coil conductor 21, it is better to increase the width W2 of the second region CA2 of the second coil conductor 21. The area of the coil openings of 1 coil conductors 11L and 12L can be expanded. As a result, the Q value of the antenna device 101 becomes high, and higher radiation efficiency can be obtained.

As shown in FIGS. 1 (A), 1 (B), and 2 in the present embodiment, the path length in the first region CA1 of the first coil conductors 11L and 12L (the line included in the first region CA1). The total length) is less than half of the total path length of the first coil conductors 11L and 12L. Further, the path length of the second coil conductor 21 in the second region CA2 (total length of the lines included in the second region CA2) is less than half of the total path length of the second coil conductor 21. With such a structure, the area ratio of the first coil conductors 11L and 12L to be shielded by the second coil conductor 21 in an electromagnetic field is small, and the first coil conductors 11L and 12L effectively act as booster coils.

Further, in the present embodiment, the coil opening of the second coil conductor 21 is smaller than the coil openings of the first coil conductors 11L and 12L, and does not overlap with the coil openings of the first coil conductors 11L and 12L. With such a structure, the relative size of the coil openings of the first coil conductors 11L and 12L with respect to the entire antenna device becomes large, and the action of the first coil conductors 11L and 12L as a booster coil is enhanced.

FIG. 5A is a diagram showing the positional relationship between the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2 and the first region CA1. FIG. 5B is a diagram showing the relationship between the current flowing through the first coil conductors 11L and 12L, the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2, the high magnetic field region MA, and the high electric field region EA. FIG. 5B is an example in which the number of turns of the first coil conductor is reduced as compared with FIG. 5A.

In FIG. 5B, the region in which the capacitance forming conductor patterns 11C1, 11C2, 12C1, 12C2 are formed is a high electric field region EA because the capacitance forming conductor patterns face each other. The opposite electrode position is a region where the current density is high, that is, a high magnetic field region MA. As shown in FIG. 5A, even if the number of turns of the first coil conductors 11L and 12L is large, the high magnetic field region MA is similarly generated at the counter electrode position of the high electric field region EA. By providing the first region CA1 in the high magnetic field region MA, magnetic field coupling can be performed with high efficiency in a region with high current intensity. In other words, the capacitance forming conductor pattern, which is the high electric field region EA, is arranged at a position facing the first region CA1 with the coil openings of the first coil conductors 11L and 12L interposed therebetween.

In addition to the above-mentioned effects, according to the present embodiment, the following effects are exhibited.

-Both the first base material 10 and the second base material 20 are FPCs (Flexible Printed Circuits), but only the second substrate 2 provided with the first power supply terminal 21T1 and the second power supply terminal 21T2 needs to be plated. is there. That is, since the plating treatment is performed only on the second substrate having a small area and the plating treatment is not required on the first substrate having a large area, the manufacturing cost can be suppressed.

The first base material 10 of the large-area first substrate 1 can be composed of low-cost PET, and the large-area first coil conductors 11L and 12L and the capacitance-forming conductor patterns 11C1, 11C2, 12C1, 12C2 are low-cost. Since it can be composed of aluminum foil, the overall cost can be reduced.

-Since the first coil conductors 11L and 12L and the second coil conductor 21 are magnetically coupled (because the coils do not come into direct contact with each other) only by arranging the first region CA1 and the second region CA2 in close proximity, the first substrate The 1 and the 2nd substrate 2 can be easily incorporated into an electronic device.

The characteristics of the antenna device 101 can be easily changed by changing the configuration of the second board 2 without changing the first board 1.

A resonance circuit can be configured by connecting a resonance capacitor to the second coil conductor 21, whereby the resonance on the first coil conductors 11L and 12L side and the resonance on the second coil conductor 21 side are duplicated. It can be resonated. As a result, deterioration of communication performance due to a deviation between the resonance frequency on the first coil conductors 11L and 12L side and the resonance frequency on the second coil conductor 21 side is suppressed.

<< Second Embodiment >>
In the second embodiment, a configuration example of an electronic device is shown.

FIG. 6 is a cross-sectional view of a main part of the electronic device 201 according to the second embodiment. The electronic device 201 includes an antenna device 101, a circuit board 4 on which a communication circuit is formed, and a housing 6 that accommodates the circuit board 4. (Hatching and the like are omitted from the housing 6.) The circuit board 4 is provided with a pin 5 that conducts to the antenna connection portion of the communication circuit. The pin 5 is, for example, a spring probe (pogo pin). The configuration of the antenna device 101 is as shown in the first embodiment. The pin 5 is electrically connected to the first feeding terminal 21T1 and the second feeding terminal 21T2 of the antenna device 101.

The antenna device 101 is fixed at a predetermined position in the housing 6. With the housing 6 closed, the circuit board 4 is also fixed at a predetermined position in the housing 6. In that state, the pin 5 comes into contact with the first feeding terminal 21T1 and the second feeding terminal 21T2 of the antenna device 101.

<< Third Embodiment >>
In the third embodiment, an antenna device having a positioning structure for the first substrate 1 and the second substrate 2 will be described.

7 (A) and 7 (B) are views showing the configuration of the main part of the antenna device 103 according to the third embodiment. 7 (A) is a plan view of the antenna device 103, and FIG. 7 (B) is a cross-sectional view taken along the line XX in FIG. 7 (A).

The antenna device 103 according to the third embodiment also includes the first substrate 1 and the second substrate 2 in the same manner as the antenna device 101 shown in the first embodiment. The first substrate 1 has a first substrate 10, first coil conductors 11L and 12L formed on the first substrate 10, and conductor patterns 11C1, 11C2, 12C1, 12C2 for forming capacitance. The second substrate 2 has a second substrate 20, a second coil conductor 21, a first feeding terminal 21T1 and a second feeding terminal 21T2 formed on the second substrate 20.

Through holes 10H1 and 10H2 are formed in the first base material 10. Further, through holes 20H1 and 20H2 are formed in the second base material 20. In a plan view of the main surfaces MS11 and MS12 of the first base material 10, the through holes 10H1 of the first base material 10 and the through holes 20H1 of the second base material 20 overlap each other, and the through holes 10H2 of the first base material 10 It overlaps with the through hole 20H2 of the second base material 20. The through hole 20H1 of the second base material 20 is located at the coil opening of the second coil conductor 21.

Projections 6P1 and 6P2 are formed on the housing 6. The housing 6 houses a circuit board in which a communication circuit or the like is configured, an antenna device 103, or the like.

FIG. 8 is a cross-sectional view at a position passing through the protrusions 6P1 and 6P2 in a state where the first substrate 1 and the second substrate 2 which are the constituent elements of the antenna device 103 are overlapped with each other. As shown in FIG. 7B, the first substrate 1 is inserted into the housing 6 so that the protrusions 6P1 and 6P2 formed in the housing 6 are inserted into the through holes 10H1 and 10H2 of the first base material 10. Is installed. Similarly, the second substrate 2 is mounted on the housing 6 so that the protrusions 6P1 and 6P2 are inserted into the through holes 20H1 and 20H2 of the second substrate 20. As a result, the first region CA1 of the first coil conductors 11L and 12L and the second region CA2 of the second coil conductor 21 overlap at a predetermined position.

For example, in FIG. 8, the housing 6 is the upper housing of the electronic device, and the housing 6 in which the first substrate 1 and the second substrate 2 are mounted on the inner surface is fitted into the lower housing of the electronic device. By matching, the pin protruding from the circuit board (see pin 5 in FIG. 6) comes into contact with the power supply terminal (one power supply terminal 21T1 appears in FIG. 8).

According to this embodiment, the first substrate 1 and the second substrate 2 are positioned with each other via the protrusions 6P1 and 6P2 of the housing 6. In particular, since the through hole 20H1 formed in the second base material 20 is located in the coil opening of the second coil conductor 21, that is, in the vicinity of the regions CA1 and CA2, the misalignment of the regions CA1 and CA2 is effective. The variation in electrical characteristics is effectively suppressed.

Further, according to the present embodiment, the first substrate 1 and the second substrate 2 are not only relatively positioned via the protrusions 6P1 and 6P2 of the housing 6, but also are absolutely positioned in the electronic device. The position is also positioned. Since the first substrate 1 and the second substrate 2 are fixed by being fitted to the protrusions 6P1 and 6P2 of the housing 6, this structure is also a fixing structure between the first substrate 1 and the second substrate 2. ..

As shown in FIG. 7B, the protrusions 6P1, 6P2 have a tapered shape, and the diameters of the through holes 10H1, 10H2, 20H1, 20H2 correspond to the heights of the protrusions 6P1, 6P2. It is the size. Therefore, the diameter of the through holes 10H1 and 10H2 is larger than the diameter of the through holes 20H1 and 20H2. With this structure, the first substrate 1 and the second substrate 2 are stably and tightly fixed to the protrusions 6P1 and 6P2.

<< Fourth Embodiment >>
In the fourth embodiment, an antenna device including a magnetic member will be illustrated.

9 (A) is a cross-sectional view of the main part of the antenna device 104A according to the fourth embodiment, and FIG. 9 (B) is a cross-sectional view of the main part of the antenna device 104B according to the fourth embodiment. 9 (C) is a cross-sectional view of a main part of the antenna device 104C according to the fourth embodiment. Both cross-sectional positions are the same as the cross-sectional positions shown in FIG. 1 (B). 9 (A), 9 (B), and 9 (C) show the coil opening 11A of the first coil conductor 11L and the coil opening 12A of the first coil conductor 12L, respectively. Each of the antenna devices 104A, 104B, and 104C includes a magnetic material sheet 7 that covers the coil openings 11A, 12A of the first coil conductors 11L, 12L in a plan view of the main surface of the first base material 10.

In the antenna device 104A shown in FIG. 9A, the magnetic sheet 7 does not overlap the second coil conductor 21. In the antenna device 104B shown in FIG. 9B, a part of the magnetic sheet 7 extends to a position where it overlaps with the second region CA2. In the antenna device 104C shown in FIG. 9C, a part of the magnetic material sheet 7 extends to a position covering the coil opening 21A of the second coil conductor 21.

In these antenna devices 104A, 104B, 104C, a magnetic material sheet is used as a part of a magnetic path of magnetic flux φA interlinking between the coil openings 11A and 12A of the first coil conductors 11L and 12L and the coil openings 21A of the second coil conductor 21. 7 works. As a result, the degree of coupling between the first coil conductors 11L and 12L and the communication partner antenna is increased. Further, the degree of coupling between the first coil conductors 11L and 12L and the second coil conductor 21 is increased. However, as shown in FIG. 9C, when the magnetic sheet 7 covers most of the coil openings 21A of the second coil conductor 21, the coil openings 11A, 12A and the second of the first coil conductors 11L, 12L Since the magnetic flux φB interlinking with the coil opening 21A of the coil conductor 21 in opposite phase increases, there is an adverse effect in increasing the degree of coupling between the first coil conductors 11L and 12L and the second coil conductor 21. Therefore, in order to avoid this state, it is preferable that a part of the magnetic sheet 7 is appropriately extended to a position where it overlaps with the second region CA2.

In FIGS. 9 (A), 9 (B), and 9 (C), when a planar conductor such as a circuit board or a battery is arranged below the antenna devices 104A, 104B, 104C, the magnetic sheet 7 Also acts as a magnetic shield. That is, the magnetic material sheet 7 is arranged between the first coil conductors 11L and 12L, the coil openings 11A and 12A thereof, and the planar conductor, and the magnetic field between the first coil conductors 11L and 12L and the planar conductor. Coupling is suppressed and unnecessary eddy currents generated in the planar conductor are suppressed.

<< Fifth Embodiment >>
In the fifth embodiment, the stray capacitance reduction structure is shown.

FIG. 10 is a diagram showing stray capacitance generated in the antenna device 101 and the like according to the fifth embodiment. FIG. 11 is a diagram showing stray capacitance generated in the antenna device and the like according to the comparative example.

In FIG. 10, the antenna device 101 is composed of a first substrate 1 and a second substrate 2. The configuration of the antenna device 101 is as shown in the first embodiment and the like. The antenna device 101 is arranged parallel to the planar conductor 4G. The planar conductor 4G is, for example, a ground conductor pattern formed on the circuit board 4 shown in FIG. In the comparative example shown in FIG. 11, the second substrate 2 does not exist.

In FIG. 10, the capacitance generated between the first coil conductors 11L and 12L is C1, the capacitance generated between the first coil conductor 12L and the second coil conductor 21 is C2, and the capacitance generated between the second coil conductor 21 and the planar conductor 4G The capacitance generated between them is represented by C3, and the combined capacitance of these is represented by C01. Further, in FIG. 11, the capacitance generated between the first coil conductors 11L and 12L is represented by C1, the capacitance generated between the first coil conductor 12L and the planar conductor 4G is represented by C4, and the combined capacitance thereof is represented by C02.

In the electronic device shown in FIG. 10, the region CA1 of the first coil conductors 11L and 12L and the region CA2 of the second coil conductor 21 (see FIG. 2) overlap, and the region CA1 of the first coil conductors 11L and 12L is a planar conductor. It does not directly face 4G. The distance between the first substrate 1 and the second substrate 2 is much smaller than the distance between the second substrate 2 and the planar conductor 4G. For example, the distance between the first substrate 1 and the second substrate 2 is 0.01 mm to 0.1 mm, and the distance between the second substrate 2 and the planar conductor 4G is 1.0 mm to 3.0 mm.

Therefore, it can be regarded as C3≈C4. In addition, the relationship of C1> C2> C3≈C4 also holds in the order of narrower intervals.

On the above premise, the relationship of C01 <C02 is established.

Specifically, the following relationship holds for these capacities.

Let α = C2 / C1 and β = C3 / C1.

However, since C1> C2> C3, 0 <α <1, 0 <β <1 and α> β.

When 1 / C01 and 1 / C02 are calculated,

Substituting the above equation for C01 / C02,

Here, since α and β are positive numbers, C01 / C02 <1 and the relationship of C01 <C02 is established.

In this way, by arranging the first coil conductors 11L and 12L, the second coil conductor 21, and the planar conductor 4G in this order when viewed from the communication partner side, the first coil conductors 11L and 12L and the planar conductor 4G The stray capacitance generated between and is reduced. Therefore, the influence of the fluctuation of the resonance frequency due to the planar conductor 4G is smaller than that of the case where the first coil conductors 11L and 12L and the second coil conductor 21 are used alone. Further, by reducing the stray capacitance between the first coil conductors 11L and 12L and the planar conductor 4G, the reduction of the radiation Q of the first coil conductors 11L and 12L is suppressed, and the communication distance becomes longer.

<< 6th Embodiment >>
In the sixth embodiment, an antenna device including a planar conductor that controls the path of the magnetic flux that contributes to the coupling between the coil by the first coil conductor and the coil by the second coil conductor will be illustrated.

12 (A) and 12 (B) are cross-sectional views showing a configuration of a main part of the antenna device 106A according to the sixth embodiment.

The antenna device 106A includes a first substrate 1 and a second substrate 2. The first substrate 1 includes a first substrate 10, first coil conductors 11L and 12L formed on the first substrate 10, and capacitance forming conductor patterns 11C1, 11C2 formed on the first substrate 10. It has 12C1 and 12C2. The second substrate 2 has a second substrate 20, a second coil conductor 21 formed on the second substrate 20, a power feeding terminal 21T1, and the like. The first substrate 1 and the second substrate 2 are joined via a bonding material 3. The Z-axis direction (upward direction in the figure) in FIGS. 12 (A) and 12 (B) is the communication surface direction. The above configuration is the same as that of the antenna device 101 shown in the first embodiment.

The antenna device 106A of the sixth embodiment further includes a flat conductor 8. The planar conductor 8 is vertically separated from the overlapping portions of the first region CA1 and the second region CA2 shown in FIG. 2 with respect to the main surface of the first base material 10. Further, it is arranged at a position overlapping at least the first region CA1 and the second region CA2 when viewed in the vertical direction (hereinafter, referred to as "planar view").

FIG. 12B shows a schematic path of magnetic flux passing through the coil openings of the first coil conductors 11L and 12L of the antenna device 106A and the coil openings of the second coil conductor 21. In FIG. 12B, the alternate long and short dash line is the path of the magnetic flux φ0 when the flat conductor 8 is absent, and the broken line is the path of the magnetic flux φ1 when the flat conductor 8 is present.

In FIG. 12B, the magnetic flux generated from the current flowing through the second coil conductor 21 passes through the opening of the coil by the first coil conductors 11L and 12L and returns to the coil by the second coil conductor 21 again. Due to the presence of, the path of the magnetic flux passing through the coil openings of the first coil conductors 11L and 12L and the coil openings of the second coil conductor 21 is shortened as shown by the magnetic flux φ1. Therefore, the coupling between the first coil conductors 11L and 12L and the second coil conductor 21 becomes stronger. As a result, the following effects are obtained.

(1) The electric power transmitted from the second coil conductor 21 to the first coil conductors 11L and 12L becomes large.

(2) Due to the action of (1) above, the magnetic field radiated from the first coil conductors 11L and 12L becomes stronger.

13 (A), 13 (B), 13 (C), and 13 (D) are cross-sectional views showing some examples of the antenna device according to the sixth embodiment. The antenna device 106A shown in FIG. 13 (A) is the same as the antenna device 106A shown in FIGS. 12 (A) and 12 (B). In this example, the position where the first coil conductors 11L and 12L and the second coil conductor 21 overlap with the plane conductor 8 overlaps with the plane conductor 8 in a plan view.

In the antenna device 106B shown in FIG. 13B, the second substrate 2 exists on the communication surface direction (Z-axis direction) side of the first substrate 1. Even with such a configuration, the same effect as that of the antenna device 106A can be obtained.

In the antenna device 106C shown in FIG. 13C, the planar conductor 8 is not only the position where the first coil conductors 11L and 12L and the second coil conductor 21 overlap in a plan view, but also the entire surface of the first coil conductors 11L and 12L. It spreads in an overlapping relationship.

In the antenna device 106D shown in FIG. 13D, the planar conductor 8 overlaps the entire surface of the second coil conductor 21 and the entire surfaces of the first coil conductors 11L and 12L in a plan view.

The above-mentioned effects are exhibited in any of the structures shown in FIGS. 13 (A), 13 (B), 13 (C), and 13 {D}. The flat conductor 8 includes a circuit board, a metal chassis, a battery, and the like.

<< Seventh Embodiment >>
In the seventh embodiment, an antenna device including a conductor member that controls the path of the magnetic flux that contributes to the coupling between the coil by the first coil conductor and the coil by the second coil conductor will be illustrated.

14 (A) and 14 (B) are cross-sectional views showing a configuration of a main part of the antenna device 107A according to the seventh embodiment.

The configurations of the first substrate 1, the second substrate 2, and the bonding material 3 of the antenna device 107A are as shown in the first embodiment. The antenna device 107A of the seventh embodiment includes a conductor member 9. The conductor member 9 is arranged at a position where the side surface SS of the conductor member 9 overlaps the coil opening of the second coil conductor 21 in a plan view.

FIG. 14B shows a schematic path of magnetic flux passing through the coil openings of the first coil conductors 11L and 12L of the antenna device 107A and the coil openings of the second coil conductor 21. In FIG. 14B, the alternate long and short dash line is the path of the magnetic flux φ0 when the conductor member 9 is absent, and the broken line is the path of the magnetic flux φ1 when the conductor member 9 is present.

In FIG. 14B, the magnetic flux generated from the current flowing through the second coil conductor 21 passes through the opening of the coil by the first coil conductors 11L and 12L and returns to the coil by the second coil conductor 21 again, but the conductor member 9 Due to the presence of, the path of the magnetic flux passing through the coil openings of the first coil conductors 11L and 12L and the coil openings of the second coil conductor 21 is shortened as shown by the magnetic flux φ1. Therefore, the coupling between the first coil conductors 11L and 12L and the second coil conductor 21 becomes stronger. As a result, the following effects are exhibited as in the example shown in the sixth embodiment.

(1) The electric power transmitted from the second coil conductor 21 to the first coil conductors 11L and 12L becomes large.

(2) Due to the action of (1) above, the magnetic field radiated from the first coil conductors 11L and 12L becomes stronger.

FIG. 15 is a cross-sectional view of the antenna device 107B according to the seventh embodiment. In the antenna device 107B, the second substrate 2 exists on the communication surface direction (Z-axis direction) side of the first substrate 1. Even with such a configuration, the same operation and effect as that of the antenna device 107A can be obtained.

FIG. 16 is a cross-sectional view of the antenna device 107C according to the seventh embodiment. The antenna device 107C includes a flat conductor 8 together with the conductor member 9. The configuration of the planar conductor 8 is as shown in the sixth embodiment. By providing both the conductor member 9 and the flat conductor 8 in this way, the effect of shortening the path of the magnetic flux passing through the coil openings of the first coil conductors 11L and 12L and the coil openings of the second coil conductor 21 becomes stronger.

<< Eighth Embodiment >>
In the eighth embodiment, an antenna device having a different configuration of the capacitance forming conductor pattern from the examples shown so far is shown.

FIG. 17A is a plan view of the antenna device 108 according to the eighth embodiment, and FIG. 17B is a plan view of the capacitance forming conductor pattern 12C formed on the lower surface of the first base material 10. is there. FIG. 17C is a cross-sectional view taken along the line XX in FIG. 17A.

The first coil conductor 11L and the capacitance forming conductor patterns 11C1 and 11C2 are formed on the first main surface (upper surface in FIGS. 17A and 17B) of the first base material 10. A capacity-forming conductor pattern 12C is formed on the second main surface (lower surface in FIGS. 17A and 17B) of the first base material 10. The capacitance forming conductor patterns 11C1 and 11C2 are connected to both ends of the first coil conductor 11L, respectively. Here, the conductor patterns 11C1 and 11C2 for forming capacitance correspond to the "conductor pattern for forming capacitance on the first main surface side" according to the present invention. Further, the conductor pattern 12C for forming a capacitance corresponds to the "conductor pattern for forming a capacitance on the second main surface side" according to the present invention.

The capacitance forming conductor pattern 12C and the capacitance forming conductor patterns 11C1 and 11C2 face each other via the first base material 10 to form a capacitance. As a result, the LC resonance circuit is formed by the inductance of the first coil conductor 11L and the capacitance of the capacitance forming conductor patterns 11C1, 11C2, 12C.

The thickness of the first coil conductor 11L and the capacitance forming conductor patterns 11C1 and 11C2 is thicker than the thickness of the capacitance forming conductor pattern 12C. Since the strength of the current flowing through the capacitance forming conductor patterns 11C1, 11C2, 12C is smaller than the strength of the current flowing through the first coil conductor 11L, the resistance loss increases even if the capacitance forming conductor pattern 12C is relatively thin. Is small. On the other hand, by increasing the thickness of the first coil conductor 11L, the resistance component of the first coil conductor can be effectively reduced. That is, it is possible to reduce the loss while suppressing the total thickness of the first base material 10 and the conductor patterns formed on both surfaces thereof.

<< Ninth Embodiment >>
In the ninth embodiment, the antenna device having a different shape of the first base material 10 from the examples shown so far is shown.

18 (A) is a plan view of the antenna device 109 according to the ninth embodiment, and FIG. 18 (B) is a cross-sectional view taken along the line XX of FIG. 18 (A). However, FIG. 18A is a plan view in a state before the bonding material 30 shown later is attached, and FIG. 18B is a cross-sectional view in a state where the bonding material 30 is attached.

The antenna device 109 includes a first substrate 1 and a second substrate 2. The first substrate 1 has a first substrate 10, a first coil conductor 11L formed on the first substrate 10, and capacitance forming conductor patterns 11C1 and 11C2 formed on the first substrate 10. The second substrate 2 has a second substrate 20, a second coil conductor 21 formed on the second substrate 20, and power feeding terminals 21T1,21T2. The first substrate 1 and the second substrate 2 are joined via a bonding material 3. The Z-axis direction (upward direction in the figure) in FIGS. 18 (A) and 18 (B) is the communication surface direction.

The second base material 20 of the antenna device 109 does not protrude from the edge of the first base material 10 in a plan view. The second base material 20 is bonded to the first base material 10 via the bonding material 3 on substantially the entire surface thereof. Then, the bonding material 30 is provided on substantially the entire surface of the first main surface (communication surface) of the first base material 10. The joining material 30 is a double-sided adhesive sheet or an adhesive layer. Further, in this example, the magnetic material sheet 7 made of ferrite or the like is provided at a position where it does not overlap with the second base material 20. Other configurations are the same as those of the antenna device 101 shown in the first embodiment.

According to the present embodiment, the bonding material 30 can be provided on the entire surface of the first base material 10, which facilitates the manufacture of the antenna device. Further, since the entire surface of the second base material 20 is joined to the first base material 10 via a bonding material 3 such as an adhesive sheet or an adhesive, the antenna device can be easily manufactured.

<< 10th Embodiment >>
In the tenth embodiment, an antenna device having a different shape of the magnetic sheet from the examples shown so far will be shown.

FIG. 19 is a plan view of the antenna device 110 according to the tenth embodiment. The front surface shown in FIG. 19 is the communication surface, and the magnetic sheet 7 is provided on the surface of the first base material 10 opposite to the communication surface. The antenna device 110 includes a magnetic sheet 7 having a shape that overlaps one side of the coil formed by the first coil conductor 11L and has a limited overlapping range with respect to the other side. That is, in the orientation shown in FIG. 19, the magnetic sheet 7 overlaps the right side of the coil formed by the first coil conductor 11L and does not overlap the left side. In addition, the overlapping range is limited for the upper side and the lower side. Other configurations are the same as those of the antenna device 109 shown in the ninth embodiment.

According to the present embodiment, even when the metal plate is close to the side opposite to the communication surface of the antenna device 110, the metal plate is magnetically shielded by the magnetic material sheet 7, so that high permeability can be obtained. Further, it becomes easy to introduce and derive the magnetic flux passing through the coil opening by the first coil conductor 11L, and the magnetic field coupling with the coil on the communication partner side can be enhanced.

In the antenna device 110 of the present embodiment, the arrangement pitch of the first coil conductors on the sides overlapping the magnetic sheet 7 is wider than the arrangement pitch on the sides not overlapping the magnetic sheet 7. With this structure, the magnetic flux radiated by the first coil conductor 11L spreads more widely, so that the degree of coupling with the communication partner antenna is increased. As a result, better communication performance can be obtained.

The magnetic sheet 7 may have a shape that overlaps one side of the coil formed by the first coil conductor 11L and does not overlap the other side.

<< 11th Embodiment >>
In the eleventh embodiment, an antenna device having a different configuration of a coupling portion between the first coil conductor and the second coil conductor is shown from the examples shown so far.

FIG. 20 is a plan view of the antenna device 111 according to the eleventh embodiment. In this antenna device 111, the coil formed by the first coil conductor 11L in the first region CA1 and the coil formed by the second coil conductor 21 in the second region CA2 shown in FIG. 2 are formed on three sides in a plan view. Overlap with. Other configurations are the same as those of the antenna device 110 shown in the tenth embodiment.

According to the present embodiment, since the first coil conductor 11L and the second coil conductor 21 face each other over a long distance, the degree of coupling between the coil by the first coil conductor 11L and the coil by the second coil conductor 21 is easy. Can be enhanced to.

The coil formed by the first coil conductor 11L in the first region CA1 and the coil formed by the second coil conductor 21 in the second region CA2 may overlap on two sides.

<< 12th Embodiment >>
In the twelfth embodiment, an antenna device having a different shape of the second base material from the examples shown so far will be shown.

FIG. 21 is a plan view of the antenna device 112 according to the twelfth embodiment. The antenna device 112 is electrically connected to the second base material 20 with terminals 22T1, 22,T2, 22T3, 22T4 for signals or power other than the first feeding terminal 21T1 and the second feeding terminal 21T2, and these terminals. Wiring is formed. Other configurations are the same as those of the antenna device shown in each of the embodiments shown so far.

As shown in this embodiment, the second base material 20 on which the second coil conductor 21 is formed may be integrated with a wiring conductor pattern or a terminal for another function. As a result, the number of members of the entire device can be reduced.

Finally, the description of the embodiments described above is exemplary in all respects and not restrictive. Modifications and changes can be made as appropriate for those skilled in the art. The scope of the present invention is indicated by the scope of claims, not by the above-described embodiment. Further, the scope of the present invention includes modifications from the embodiment within the scope of the claims and within the scope of the claims.

CA1 ... 1st region CA2 ... 2nd region EA ... High electric field region MA ... High magnetic field region MS11 ... 1st main surface MS12 ... 2nd main surface MS21, MS22 ... Main surface SS ... Side surface 1 ... 1st substrate 2 ... Second Substrate 3 ... Bonding material 4 ... Circuit board 4G ... Planar conductor 5 ... Pin 6 ... Housing 6P1, 6P2 ... Protrusion 7 ... Magnetic sheet 8 ... Flat conductor 9 ... Conductor member 10 ... First base material 10H1, 10H2, 20H1 , 20H2 ... Through holes 11A, 12A ... Coil openings 11C1, 11C2, 12C1, 12C2, 12C ... Capacitive forming conductor patterns 11L, 12L ... First coil conductor 20 ... Second base material 20H1, 20H2 ... Through holes 21 ... Second Coil conductor 21A ... Coil opening 21T1 ... 1st power supply terminal 21T2 ... 2nd power supply terminal 22T1,22T2, 22T3, 22T4 ... Terminal 30 ... Bonding material 101, 103, 104A, 104B, 104C, 106A, 106B, 106C, 106D, 107A , 107B, 107C, 108, 109, 110, 111, 112 ... Antenna device 201 ... Electronic equipment

Claims (21)

A first base material composed of an insulator having a main surface and
A first coil conductor formed along the main surface of the first base material and having a first region,
A second base material composed of an insulator having a main surface,
A second coil conductor formed along the main surface of the second base material and having a second region,
A first power feeding terminal formed on the main surface of the second base material and connected to the first end of the second coil conductor.
A second feeding terminal formed on the main surface of the second base material and connected to the second end of the second coil conductor.
With
When viewed in a direction perpendicular to the main surface of the first base material, the first region and the second region all overlap each other, and the current path of the first coil conductor in the first region and the said. Arranged so as to be parallel to the current path of the second coil conductor in the second region.
The main material of the first coil conductor is aluminum.
The main material of the second coil conductor is copper.
Antenna device. The main material of the first base material is polyethylene terephthalate.
The main material of the second base material is polyimide.
The antenna device according to claim 1. When viewed in the vertical direction, the width in the direction perpendicular to the current path direction of the second region is larger than the width perpendicular to the current path direction in the first region.
The antenna device according to claim 1 or 2. The path length of the first coil conductor in the first region is less than half of the total path length of the first coil conductor.
The path length of the second coil conductor in the second region is less than half of the total path length of the second coil conductor.
The antenna device according to any one of claims 1 to 3. The coil opening of the second coil conductor is smaller than the coil opening of the first coil conductor and does not overlap the coil opening of the first coil conductor when viewed in the vertical direction.
The antenna device according to any one of claims 1 to 4. A capacitance forming conductor pattern formed along the main surface of the first base material and connected to the first coil conductor is provided.
A resonance circuit is composed of the inductance of the first coil conductor and the capacitance of the capacitance forming conductor pattern.
The antenna device according to any one of claims 1 to 5. When viewed in the vertical direction, the capacitance forming conductor pattern is arranged at a position facing the first region with the coil opening of the first coil conductor interposed therebetween.
The antenna device according to claim 6. The first base material has a first main surface and a second main surface facing each other.
The first coil conductor is formed along the first main surface of the first base material.
The capacitance forming conductor pattern includes a first main surface side capacitance forming conductor pattern formed on the first main surface of the first base material and a second main surface formed on the second main surface of the first base material. Consists of a conductor pattern for forming surface capacitance,
The conductor pattern for forming the capacitance on the first main surface side is connected to both ends of the first coil conductor, respectively.
The second main surface side capacitance forming conductor pattern faces the first main surface side capacitance forming conductor pattern via the first base material, and is in contact with the first main surface side capacitance forming conductor pattern. Forming a capacity between
The thickness of the first coil conductor and the conductor pattern for forming the capacitance on the first main surface side is thicker than the thickness of the conductor pattern for forming the capacitance on the second main surface side.
The antenna device according to claim 6 or 7. A planar conductor that overlaps the first region when viewed in the vertical direction is provided.
The second coil conductor is sandwiched between the first coil conductor and the planar conductor in a direction perpendicular to the main surface of the first base material.
The antenna device according to any one of claims 1 to 8. A magnetic sheet that covers the coil opening of the first coil conductor when viewed in the vertical direction is provided.
The antenna device according to any one of claims 1 to 9. The magnetic sheet has a shape that overlaps with one side of the coil formed by the first coil conductor and does not overlap with the other side or the overlapping range is limited.
The antenna device according to claim 10. When viewed in the vertical direction, through holes overlapping each other are formed in the first base material and the second base material.
The antenna device according to any one of claims 1 to 11. The through hole formed in the second base material is located at the coil opening of the second coil conductor.
The antenna device according to claim 12. The through holes formed in the first base material and the through holes formed in the second base material have different diameters.
The antenna device according to claim 12 or 13. The first coil conductor is vertically separated from the overlapping portions of the first region and the second region, and is arranged at a position where it overlaps at least the first region and the second region when viewed in the vertical direction. A plane conductor that shortens the path of magnetic flux through the coil opening of the second coil conductor and the coil opening of the second coil conductor.
The antenna device according to any one of claims 1 to 14. With a conductor member with sides
When viewed in the vertical direction, the conductor member is arranged at a position where the side surface overlaps the coil opening of the second coil conductor, and the magnetic flux passes through the coil opening of the first coil conductor and the coil opening of the second coil conductor. Route has been shortened,
The antenna device according to any one of claims 1 to 15. When viewed in the vertical direction, the second base material does not protrude from the edge of the first base material.
The antenna device according to any one of claims 1 to 16. The coil formed by the first coil conductor in the first region and the coil formed by the second coil conductor in the second region overlap on two or more sides when viewed in the vertical direction.
The antenna device according to any one of claims 1 to 17. A wiring conductor pattern other than the wiring conductor pattern connected to the first feeding terminal and the second feeding terminal was formed on the second base material.
The antenna device according to any one of claims 1 to 18. The antenna device according to any one of claims 1 to 19.
A circuit board provided with a conducting pin for the communication circuit and the antenna connection of the communication circuit,
A housing for accommodating the antenna device and the circuit board in a state where the pin is in contact with the first power supply terminal and the second power supply terminal.
Electronic equipment equipped with. The antenna device according to claim 12, claim 13 or claim 14,
A circuit board with a communication circuit and
A housing for accommodating the antenna device and the circuit board in a state where a protrusion to be inserted into the through hole is formed and the protrusion is inserted into the through hole.
Electronic equipment equipped with.

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