JP2020188158A - Capacitor device - Google Patents
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Abstract
Description
本発明は、コンデンサ装置に関する。 The present invention relates to a capacitor device.
力率改善等を行うコンデンサ装置の一つとして、複数個のコンデンサ素子が収容ケース内に収容され、コンデンサ素子全部が埋没するように収容ケース内にモールド樹脂を流し込んで硬化させた構造のものがある（例えば特許文献１参照）。 As one of the capacitor devices for improving the power factor, a structure in which a plurality of capacitor elements are housed in a storage case and a mold resin is poured into the storage case and cured so that all the capacitor elements are buried is used. (See, for example, Patent Document 1).
ところで、コンデンサ素子は、コンデンサ装置の収容ケース内に存在する水分を含んだ空気に晒されることで吸湿劣化等の懸念が生じるため、コンデンサ素子が完全に浸かるまで収容ケース内にモールド樹脂が流し込まれる。そのため、コンデンサ装置の重量は増大傾向となる。一方で、コンデンサ装置の軽量化を図るべくモールド樹脂を単に少なくするとコンデンサ素子が露出することによる上記懸念が再び生じるため、これへの配慮も必要である。 By the way, since the capacitor element is exposed to the moisture-containing air existing in the accommodating case of the condenser device, there is a concern that the capacitor element absorbs moisture and deteriorates. Therefore, the mold resin is poured into the accommodating case until the capacitor element is completely immersed. .. Therefore, the weight of the capacitor device tends to increase. On the other hand, if the amount of the mold resin is simply reduced in order to reduce the weight of the capacitor device, the above-mentioned concern due to the exposure of the capacitor element reoccurs, and consideration must be given to this.
本発明は上記課題を解決するためになされたものであり、コンデンサ素子の劣化懸念を排除しつつ、軽量化が図れるコンデンサ装置を提供することを目的とする。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a capacitor device capable of reducing weight while eliminating concerns about deterioration of a capacitor element.
上記課題を解決するコンデンサ装置は、複数個のコンデンサ素子を用いて構成されてなる進相コンデンサとしての機能を含むコンデンサ装置であって、前記コンデンサ素子は個々のそれぞれが有底筒状の素子ケースに収容され、前記コンデンサ素子の端子を含む一部が前記素子ケースの開口部から臨む構造をなすコンデンサ素子封止体として構成され、複数個の前記コンデンサ素子封止体は前記進相コンデンサの収容ケース内に配置されるとともに、前記素子ケースの開口部から臨む前記コンデンサ素子の一部及び前記端子を通じて結線する接続線が埋没状態となるように前記コンデンサ素子封止体の一部がモールド樹脂にて樹脂封止されて構成される。 The capacitor device that solves the above problems is a capacitor device that includes a function as a phase-advancing capacitor composed of a plurality of capacitor elements, and each of the capacitor elements has a bottomed tubular element case. The capacitor element encapsulant is configured as a capacitor element encapsulant having a structure in which a part including the terminal of the capacitor element faces from the opening of the element case, and the plurality of the capacitor element encapsulants accommodate the phase-advancing capacitor. A part of the capacitor element encapsulant is made of a mold resin so as to be arranged in the case and a part of the capacitor element facing from the opening of the element case and a connecting wire connected through the terminal are buried. It is configured by being sealed with a resin.
上記態様によれば、複数個のコンデンサ素子のそれぞれを有底筒状の素子ケースに収容し、コンデンサ素子の端子を含む一部を素子ケースの開口部から臨む構造をなすコンデンサ素子封止体が用いられる。そして、進相コンデンサの収容ケース内において、素子ケースの開口部から臨むコンデンサ素子の一部及び端子を通じて結線する接続線が埋没状態となるようにコンデンサ素子封止体の一部が限定的にモールド樹脂にて樹脂封止される。つまり、素子ケースとモールド樹脂とで共同してコンデンサ素子が密閉状態とされることで、コンデンサ素子が進相コンデンサの収容ケース内に存在する空気に触れる機会が低減され、コンデンサ素子の吸湿劣化の懸念等の排除が図れる。しかも、使用するモールド樹脂の樹脂量が少なくて済むため、コンデンサ装置の軽量化が図れる。 According to the above aspect, the capacitor element encapsulant having a structure in which each of the plurality of capacitor elements is housed in a bottomed tubular element case and a part including the terminals of the capacitor element faces from the opening of the element case. Used. Then, in the accommodating case of the phase-advancing capacitor, a part of the capacitor element encapsulant is limitedly molded so that a part of the capacitor element facing from the opening of the element case and the connecting wire connected through the terminal are buried. It is resin-sealed with resin. In other words, by jointly sealing the capacitor element with the element case and the mold resin, the chance that the capacitor element comes into contact with the air existing in the phase-advancing capacitor housing case is reduced, and the moisture absorption deterioration of the capacitor element is reduced. Concerns can be eliminated. Moreover, since the amount of the mold resin used is small, the weight of the capacitor device can be reduced.
上記コンデンサ装置において、前記コンデンサ素子封止体は、前記素子ケースの開口部から臨む前記コンデンサ素子の一部が前記進相コンデンサの収容ケースの底面部に対向するように配置され、前記モールド樹脂は、前記進相コンデンサの収容ケースの底面部側に偏倚するようにして構成されることが好ましい。 In the capacitor device, the capacitor element encapsulant is arranged so that a part of the capacitor element facing from the opening of the element case faces the bottom surface of the accommodating case of the phase-advancing capacitor, and the mold resin is used. , It is preferable that the phase-advancing capacitor is configured so as to be biased toward the bottom surface of the accommodating case.
上記態様によれば、素子ケースの開口部から臨むコンデンサ素子の一部が進相コンデンサの収容ケースの底面部に対向する態様にてコンデンサ素子封止体が配置され、進相コンデンサの収容ケースの底面部側に偏倚する態様にてモールド樹脂の樹脂封止がなされる。つまり、進相コンデンサの収容ケースにモールド樹脂を流し込み固化させるだけの作業で済むため、容易にモールド樹脂の樹脂封止を行うことが可能である。 According to the above aspect, the capacitor element sealant is arranged so that a part of the capacitor element facing from the opening of the element case faces the bottom surface of the phase-advancing capacitor accommodating case. The mold resin is sealed in a manner that is biased toward the bottom surface. That is, since it is only necessary to pour the mold resin into the accommodating case of the phase-advancing capacitor and solidify it, it is possible to easily seal the mold resin with the resin.
上記コンデンサ装置において、前記進相コンデンサと直列リアクトルとを一体的に組み付けてユニット化されて構成されることが好ましい。
上記態様によれば、進相コンデンサと直列リアクトルとが一体的に組み付けられてユニット化されるため、コンデンサ装置の性能向上や設置容易性向上等の効果が期待できる。
In the capacitor device, it is preferable that the phase-advancing capacitor and the series reactor are integrally assembled to form a unit.
According to the above aspect, since the phase-advancing capacitor and the series reactor are integrally assembled to form a unit, effects such as improvement in the performance of the capacitor device and improvement in ease of installation can be expected.
本発明のコンデンサ装置によれば、コンデンサ素子の劣化懸念を排除しつつ、軽量化を図ることができる。 According to the capacitor device of the present invention, it is possible to reduce the weight while eliminating the concern about deterioration of the capacitor element.
以下、コンデンサ装置の一実施形態について説明する。
図１に示す本実施形態のコンデンサ装置１０は、三相電力の力率改善等を図る目的で設置されるものであり、進相コンデンサ１１と直列リアクトル１２とを備える一体形コンデンサ装置である。本実施形態のコンデンサ装置１０は、進相コンデンサ１１の上側に直列リアクトル１２を一体的に組み付けてユニット化されている。
Hereinafter, an embodiment of the capacitor device will be described.
The capacitor device 10 of the present embodiment shown in FIG. 1 is installed for the purpose of improving the power factor of three-phase electric power, and is an integrated capacitor device including a phase-advancing capacitor 11 and a series reactor 12. The capacitor device 10 of this embodiment is unitized by integrally assembling a series reactor 12 on the upper side of the phase-advancing capacitor 11.
進相コンデンサ１１は、略長方形箱状をなす収容ケース２０内に、第１相〜第３相のコンデンサ部２１ａ〜２１ｃを収容している。第１相〜第３相のコンデンサ部２１ａ〜２１ｃは、それぞれ例えば４個のコンデンサ素子封止体２２を有している。さらに、各コンデンサ素子封止体２２は、それぞれコンデンサ素子２３が素子ケース２４内に収容されてなる。 The phase-advancing capacitor 11 houses the first-phase to third-phase capacitor portions 21a to 21c in a housing case 20 having a substantially rectangular box shape. The capacitor portions 21a to 21c of the first phase to the third phase each have, for example, four capacitor element encapsulants 22. Further, each capacitor element encapsulant 22 has a capacitor element 23 housed in the element case 24.
図１及び図２に示すように、コンデンサ素子２３は、円柱状をなし、軸方向一端側に一対の端子２３ａを有している。素子ケース２４は、一端に開口部２４ａを有する有底円筒状をなし、内径がコンデンサ素子２３の外径よりも若干大きい設定としている。素子ケース２４は、絶縁樹脂製である。そして、端子２３ａを有する軸方向一端側が開口部２４ａ側となるようにコンデンサ素子２３が素子ケース２４内に収容され、端子２３ａを有する軸方向一端部以外のコンデンサ素子２３の周囲に封止樹脂２５が流し込まれる。この封止樹脂２５の固化によりコンデンサ素子２３が素子ケース２４内に収容状態にて固定され、コンデンサ素子封止体２２として構成される。 As shown in FIGS. 1 and 2, the capacitor element 23 has a columnar shape and has a pair of terminals 23a on one end side in the axial direction. The element case 24 has a bottomed cylindrical shape having an opening 24a at one end, and the inner diameter is set to be slightly larger than the outer diameter of the capacitor element 23. The element case 24 is made of an insulating resin. Then, the capacitor element 23 is housed in the element case 24 so that one end in the axial direction having the terminal 23a is on the opening 24a side, and the sealing resin 25 is surrounded around the capacitor element 23 other than the one end in the axial direction having the terminal 23a. Is poured. By solidifying the sealing resin 25, the capacitor element 23 is fixed in the element case 24 in a housed state, and is configured as the capacitor element sealing body 22.
すなわち、コンデンサ素子２３そのものにおいては、進相コンデンサ１１の収容ケース２０内に存在する空気に晒されるとその空気中の水分にて吸湿劣化等の懸念がある。そのため、コンデンサ素子２３を素子ケース２４に収容して空気に触れないようにすることで、コンデンサ素子２３の劣化懸念の排除が図られている。なお、コンデンサ素子２３の端子２３ａ側は後述のモールド樹脂２８にて閉塞されるため、端子２３ａ側についても空気に触れない構成となっている。 That is, when the capacitor element 23 itself is exposed to the air existing in the accommodating case 20 of the phase-advancing capacitor 11, there is a concern that moisture in the air may cause deterioration in moisture absorption. Therefore, by accommodating the capacitor element 23 in the element case 24 so as not to come into contact with air, the concern about deterioration of the capacitor element 23 is eliminated. Since the terminal 23a side of the capacitor element 23 is closed by the mold resin 28 described later, the terminal 23a side is also configured not to come into contact with air.
コンデンサ素子封止体２２は、収容ケース２０内において例えば長手方向に各相４個ずつ並び、短手方向に相毎の３列が並ぶように配置されている。その際、コンデンサ素子封止体２２は、自身の軸方向が底面部２０ａに対して垂直となる姿勢で配置されている。またこの場合、コンデンサ素子封止体２２は、素子ケース２４の開口部２４ａから臨むコンデンサ素子２３の端子２３ａを有する軸方向一端側が底面部２０ａに対向するように下方に向けられている。 The capacitor element encapsulant 22 is arranged in the housing case 20 so that, for example, four phases are arranged in the longitudinal direction and three rows are arranged in each phase in the lateral direction. At that time, the capacitor element encapsulant 22 is arranged so that its axial direction is perpendicular to the bottom surface portion 20a. Further, in this case, the capacitor element encapsulant 22 is directed downward so that one end side in the axial direction having the terminal 23a of the capacitor element 23 facing from the opening 24a of the element case 24 faces the bottom surface portion 20a.
なお、コンデンサ素子封止体２２の収容ケース２０内への設置前には、各相４個のコンデンサ素子２３が被覆無しの導体線（裸線）よりなる接続線２６にてそれぞれ直列に接続されている。各相一端に位置するコンデンサ素子２３の一方の端子２３ａはそれぞれ各相の被覆電線２７ａ〜２７ｃと接続され、各相他端に位置するコンデンサ素子２３の他方の端子２３ａは接続線２６にて互いに接続されて中性点とされる。すなわち、各相４個ずつのコンデンサ素子２３は、Ｙ結線となる結線態様にてそれぞれが電気的に接続されている。なお、各相の被覆電線２７ａ〜２７ｃの上端部は、収容ケース２０の上面部２０ｂから上方に導出され、直列リアクトル１２（図１参照）の各端子部１２ａ〜１２ｃとそれぞれ接続される。 Before installing the capacitor element encapsulant 22 in the housing case 20, the four capacitor elements 23 in each phase are connected in series by a connecting wire 26 made of an uncoated conductor wire (bare wire). ing. One terminal 23a of the capacitor element 23 located at one end of each phase is connected to the coated electric wires 27a to 27c of each phase, and the other terminal 23a of the capacitor element 23 located at the other end of each phase is connected to each other by a connecting wire 26. It is connected and is regarded as a neutral point. That is, each of the four capacitor elements 23 in each phase is electrically connected in a Y-connection mode. The upper ends of the covered electric wires 27a to 27c of each phase are led out upward from the upper surface portion 20b of the housing case 20 and are connected to the terminal portions 12a to 12c of the series reactor 12 (see FIG. 1), respectively.
そして、コンデンサ素子２３の結線がなされたコンデンサ素子封止体２２は、収容ケース２０内に収容されて上記姿勢及び整列状態となるように配置され、その後、コンデンサ素子封止体２２間の隙間やコンデンサ素子封止体２２と収容ケース２０との間の隙間からモールド樹脂２８が流し込まれる。その際、コンデンサ素子封止体２２の軸方向一部である下端側が埋まるように、詳しくは、素子ケース２４の開口部２４ａから臨むコンデンサ素子２３の端子２３ａを含む軸方向一端部の高さ位置よりも若干高い位置までモールド樹脂２８が流し込まれて固化される。つまり、素子ケース２４にて覆われていないコンデンサ素子２３の端子２３ａを含む軸方向一端部の密閉や接続線２６、被覆電線２７ａ〜２７ｃの下端部といったコンデンサ素子封止体２２の結線部分が十分浸かる程度の少ない樹脂量によるモールド樹脂２８の樹脂封止が行われる。使用するモールド樹脂２８の樹脂量を少なくしたため、進相コンデンサ１１の軽量化、ひいてはコンデンサ装置１０の軽量化が十分に期待できる。 Then, the capacitor element encapsulant 22 to which the capacitor element 23 is connected is housed in the accommodating case 20 and arranged so as to be in the above-mentioned posture and alignment state, and then the gap between the capacitor element encapsulants 22 and The mold resin 28 is poured from the gap between the condenser element sealing body 22 and the accommodating case 20. At that time, in detail, the height position of one end in the axial direction including the terminal 23a of the capacitor element 23 facing from the opening 24a of the element case 24 so that the lower end side which is a part in the axial direction of the capacitor element sealing body 22 is filled. The mold resin 28 is poured to a position slightly higher than that and solidified. That is, the connection portion of the capacitor element sealing body 22 such as the sealing of one end in the axial direction including the terminal 23a of the capacitor element 23 not covered by the element case 24, the connection wire 26, and the lower end of the covered electric wires 27a to 27c is sufficient. The mold resin 28 is sealed with a small amount of resin soaked. Since the amount of the mold resin 28 used is reduced, the weight of the phase-advancing capacitor 11 can be sufficiently reduced, and the weight of the capacitor device 10 can be sufficiently reduced.
本実施形態の作用効果について説明する。
（１）複数個のコンデンサ素子２３のそれぞれを有底円筒状の素子ケース２４に収容し、コンデンサ素子２３の端子２３ａを含む軸方向一端部を素子ケース２４の開口部２４ａから臨む構造をなすコンデンサ素子封止体２２が用いられる。そして、進相コンデンサ１１の収容ケース２０内において、素子ケース２４の開口部２４ａから臨むコンデンサ素子２３の軸方向一端部及び端子２３ａを通じて結線する接続線２６が埋没状態となるようにコンデンサ素子封止体２２の下端部が限定的にモールド樹脂２８にて樹脂封止される。つまり、素子ケース２４とモールド樹脂２８とで共同してコンデンサ素子２３が密閉状態とされることで、コンデンサ素子２３が進相コンデンサ１１の収容ケース２０内に存在する空気に触れる機会を低減でき、コンデンサ素子２３の吸湿劣化の懸念等の排除を図ることができる。しかも、使用するモールド樹脂２８の樹脂量が少なくて済むため、進相コンデンサ１１の軽量化、ひいてはコンデンサ装置１０の軽量化を図ることができる。
The action and effect of this embodiment will be described.
(1) A capacitor having a structure in which each of a plurality of capacitor elements 23 is housed in a bottomed cylindrical element case 24, and one end in the axial direction including the terminal 23a of the capacitor element 23 faces from the opening 24a of the element case 24. The element sealant 22 is used. Then, in the accommodating case 20 of the phase-advancing capacitor 11, the capacitor element is sealed so that the connecting wire 26 connected through the axial end portion of the capacitor element 23 facing from the opening 24a of the element case 24 and the terminal 23a is buried. The lower end of the body 22 is limitedly resin-sealed with the mold resin 28. That is, by jointly sealing the capacitor element 23 with the element case 24 and the mold resin 28, it is possible to reduce the chance that the capacitor element 23 comes into contact with the air existing in the accommodating case 20 of the phase-advancing capacitor 11. It is possible to eliminate concerns about moisture absorption deterioration of the capacitor element 23. Moreover, since the amount of the mold resin 28 used is small, the weight of the phase-advancing capacitor 11 can be reduced, and the weight of the capacitor device 10 can be reduced.
さらに、モールド樹脂２８の樹脂量を少なくすることで、上記軽量化はもとより、モールド樹脂２８の注型作業のばらつきを小さくでき、進相コンデンサ１１の収容ケース２０を介した対地絶縁品質を安定化することができる。また、モールド樹脂２８の樹脂量を少なくすることで、個々のコンデンサ素子２３に熱がこもり難い状況とすることができ、放熱性が良好な構造とすることができる。 Further, by reducing the amount of the resin of the mold resin 28, not only the weight of the mold resin 28 can be reduced, but also the variation in the casting work of the mold resin 28 can be reduced, and the quality of insulation to the ground via the accommodating case 20 of the phase advance capacitor 11 can be stabilized. can do. Further, by reducing the amount of resin in the mold resin 28, it is possible to make it difficult for heat to be trapped in each capacitor element 23, and it is possible to obtain a structure having good heat dissipation.
（２）素子ケース２４の開口部２４ａ側、すなわちコンデンサ素子２３の軸方向一端部が進相コンデンサ１１の収容ケース２０の底面部２０ａに対向する態様にてコンデンサ素子封止体２２が配置され、進相コンデンサ１１の収容ケース２０の底面部２０ａ側に偏倚する態様にてモールド樹脂２８の樹脂封止がなされる。つまり、進相コンデンサ１１の収容ケース２０にモールド樹脂２８を流し込み固化させるだけの作業で済むため、容易にモールド樹脂２８の樹脂封止を行うことができる。 (2) The capacitor element encapsulant 22 is arranged so that the opening 24a side of the element case 24, that is, one end in the axial direction of the capacitor element 23 faces the bottom surface 20a of the accommodating case 20 of the phase-advancing capacitor 11. The mold resin 28 is sealed with the mold resin 28 in a manner biased toward the bottom surface portion 20a of the accommodating case 20 of the phase-advancing capacitor 11. That is, since the work of simply pouring the mold resin 28 into the accommodating case 20 of the phase-advancing capacitor 11 and solidifying it is sufficient, the resin can be easily sealed in the mold resin 28.
（３）進相コンデンサ１１と直列リアクトル１２とが一体的に組み付けられてユニット化されるため、コンデンサ装置１０の性能向上や設置容易性向上等の効果を期待することができる。 (3) Since the phase-advancing capacitor 11 and the series reactor 12 are integrally assembled to form a unit, effects such as improvement in the performance of the capacitor device 10 and improvement in ease of installation can be expected.
本実施形態は、以下のように変更して実施することができる。本実施形態及び以下の変更例は、技術的に矛盾しない範囲で互いに組み合わせて実施することができる。
・コンデンサ素子２３を三相全体で１２個使用したが、使用するコンデンサ素子２３の数はこれに限らず、適宜変更してもよい。
This embodiment can be modified and implemented as follows. The present embodiment and the following modified examples can be implemented in combination with each other within a technically consistent range.
-Although 12 capacitor elements 23 are used in all three phases, the number of capacitor elements 23 used is not limited to this, and may be changed as appropriate.
・コンデンサ素子２３を円柱状としたが、長方形状や他の多角形状であってもよい。
・素子ケース２４を有底円筒状としたが、有底の四角筒形状や他の多角筒形状であってもよい。
-Although the capacitor element 23 is cylindrical, it may be rectangular or other polygonal shape.
-Although the element case 24 has a bottomed cylindrical shape, it may have a bottomed square cylinder shape or another polygonal cylinder shape.
・コンデンサ素子２３の軸方向一端部が進相コンデンサ１１の収容ケース２０の底面部２０ａに対向させるコンデンサ素子封止体２２の配置とし、収容ケース２０の底面部２０ａ側に偏倚するようにモールド樹脂２８の樹脂封止を行ったが、これに限らない。例えば、コンデンサ素子２３の軸方向一端部が収容ケース２０の側面部に対向するコンデンサ素子封止体２２の配置とし、その側面部と間隔を有して仕切部材を設置し、側面部と仕切部材との間にモールド樹脂２８を流し込むことで、樹脂封止する範囲を限定的としてもよい。 A mold resin is arranged so that one end of the capacitor element 23 in the axial direction faces the bottom surface 20a of the accommodating case 20 of the phase-advancing capacitor 11 and is biased toward the bottom surface 20a of the accommodating case 20. 28 resin sealing was performed, but the present invention is not limited to this. For example, the capacitor element encapsulant 22 is arranged such that one end in the axial direction of the capacitor element 23 faces the side surface portion of the housing case 20, and a partition member is installed at a distance from the side surface portion, and the side surface portion and the partition member are provided. By pouring the mold resin 28 between the and, the resin sealing range may be limited.
・進相コンデンサ１１と直列リアクトル１２とを一体的に組み付けてユニット化したコンデンサ装置１０に適用したが、進相コンデンサ１１のみを用いるコンデンサ装置１０に適用してもよい。 -Although it was applied to the capacitor device 10 in which the phase-advancing capacitor 11 and the series reactor 12 are integrally assembled to form a unit, it may be applied to the capacitor device 10 using only the phase-advancing capacitor 11.
１０…コンデンサ装置、１１…進相コンデンサ、１２…直列リアクトル、２０…収容ケース、２０ａ…底面部、２２…コンデンサ素子封止体、２３…コンデンサ素子、２３ａ…端子、２４…素子ケース、２４ａ…開口部、２６…接続線、２８…モールド樹脂。 10 ... Capacitor device, 11 ... Phase-advancing capacitor, 12 ... Series reactor, 20 ... Storage case, 20a ... Bottom part, 22 ... Capacitor element enclosure, 23 ... Capacitor element, 23a ... Terminal, 24 ... Element case, 24a ... Opening, 26 ... connecting wire, 28 ... mold resin.
Claims (3)
前記コンデンサ素子は個々のそれぞれが有底筒状の素子ケースに収容され、前記コンデンサ素子の端子を含む一部が前記素子ケースの開口部から臨む構造をなすコンデンサ素子封止体として構成され、
複数個の前記コンデンサ素子封止体は前記進相コンデンサの収容ケース内に配置されるとともに、前記素子ケースの開口部から臨む前記コンデンサ素子の一部及び前記端子を通じて結線する接続線が埋没状態となるように前記コンデンサ素子封止体の一部がモールド樹脂にて樹脂封止されて構成された、コンデンサ装置。 It is a capacitor device that includes a function as a phase-advancing capacitor composed of a plurality of capacitor elements.
Each of the capacitor elements is housed in a bottomed tubular element case, and is configured as a capacitor element encapsulant having a structure in which a part including a terminal of the capacitor element faces from an opening of the element case.
The plurality of the capacitor element sealants are arranged in the accommodating case of the phase-advancing capacitor, and a part of the capacitor element facing from the opening of the element case and the connecting wire connected through the terminal are buried. A capacitor device configured by partially resin-sealing the capacitor element encapsulant with a mold resin.
前記モールド樹脂は、前記進相コンデンサの収容ケースの底面部側に偏倚するようにして構成された、請求項１に記載のコンデンサ装置。 The capacitor element encapsulant is arranged so that a part of the capacitor element facing from the opening of the element case faces the bottom surface of the accommodating case of the phase-advancing capacitor.
The capacitor device according to claim 1, wherein the mold resin is configured to be biased toward the bottom surface side of the accommodating case of the phase-advancing capacitor.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171019U (en) * | 1988-05-20 | 1989-12-04 | ||
| JP2001060533A (en) * | 1999-08-20 | 2001-03-06 | Nichicon Corp | Dry metallized film capacitor |
| JP2007042918A (en) * | 2005-08-04 | 2007-02-15 | Matsushita Electric Ind Co Ltd | Capacitor unit |
| JP2008210838A (en) * | 2007-02-23 | 2008-09-11 | Nissin Electric Co Ltd | Metal deposition film capacitor |
| JP2015018865A (en) * | 2013-07-09 | 2015-01-29 | 日新電機株式会社 | Capacitor device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171019U (en) * | 1988-05-20 | 1989-12-04 | ||
| JP2001060533A (en) * | 1999-08-20 | 2001-03-06 | Nichicon Corp | Dry metallized film capacitor |
| JP2007042918A (en) * | 2005-08-04 | 2007-02-15 | Matsushita Electric Ind Co Ltd | Capacitor unit |
| JP2008210838A (en) * | 2007-02-23 | 2008-09-11 | Nissin Electric Co Ltd | Metal deposition film capacitor |
| JP2015018865A (en) * | 2013-07-09 | 2015-01-29 | 日新電機株式会社 | Capacitor device |
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